HVL397CM Variable Capacitance Diode for VCO REJ03G0014-0200 Rev.2.00 Mar 16, 2006 Features • High capacitance ratio. (n = 2.9 min) • Good C-V linearity • Thin Extremely small Flat Lead Package (TEFP) is suitable for surface mount design. Ordering Information Type No. HVL397CM Laser Mark A Package Name TEFP Pin Arrangement Cathode mark Mark • A 1 2 1. Cathode 2. Anode Rev.2.00 Mar 16, 2006 page 1 of 4 Package Code PUSF0002ZA-A HVL397CM Absolute Maximum Ratings (Ta = 25°C) Item Reverse voltage Junction temperature Storage temperature Symbol Value 15 125 −55 to +125 VR Tj Tstg Unit V °C °C Electrical Characteristics (Ta = 25°C) Item Reverse current Capacitance Capacitance ratio Series resistance Symbol IR1 IR2 C1 C2 C4 n1 n2 rS Min 27.0 18.0 6.80 1.3 2.9 Typ Max 10 50 28.5 20.0 8.50 1.2 Unit nA pF — — Ω Test Condition VR = 10 V VR = 10 V, Ta = 60°C VR = 1 V, f = 1 MHz VR = 2 V, f = 1 MHz VR = 4 V, f = 1 MHz C1 / C2 C1 / C4 VR = 1 V, f = 470 MHz Note: For TEFP package, the material of lead is exposed for cutting plane. There for, soldering nature of lead tip part is considered as unquestioned. Please kindly consider soldering nature. Rev.2.00 Mar 16, 2006 page 2 of 4 HVL397CM Main Characteristic 10–9 60 f = 1MHz 10–10 Capacitance C (pF) Reverse current IR (A) 50 10–11 10 40 30 20 –12 10 10–13 0 4 8 12 16 20 0 1 2 3 4 5 Reverse voltage VR (V) Reverse voltage VR (V) Fig.1 Reverse current vs. Reverse voltage Fig.2 Capacitance vs. Reverse voltage 1.0 f = 470MHz 0.9 Series resistance rS (Ω) 0 0.8 0.7 0.6 0.5 0.4 0 1.0 2.0 3.0 4.0 5.0 Reverse voltage VR (V) Fig.3 Series resistance vs. Reverse voltage Rev.2.00 Mar 16, 2006 page 3 of 4 HVL397CM Package Dimensions Package Name TEFP JEITA Package Code RENESAS Code PUSF0002ZA-A Previous Code TEFP / TEFPV MASS[Typ.] 0.0006g D b E HE c φb e1 A Pattern of terminal position areas Rev.2.00 Mar 16, 2006 page 4 of 4 Reference Symbol A b c D E HE φb e1 Dimension in Millimeters Min 0.25 0.08 0.55 0.75 0.95 - Nom 0.30 0.13 0.60 0.80 1.00 0.40 1.00 Max 0.40 0.35 0.18 0.65 0.90 1.05 - Sales Strategic Planning Div. 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