AP04N60I-A-HF Halogen-Free Product Advanced Power Electronics Corp. N-CHANNEL ENHANCEMENT MODE POWER MOSFET ▼ 100% Avalanche Test D ▼ Fast Switching Characteristic ▼ Simple Drive Requirement 650V RDS(ON) 2.5Ω ID G ▼ RoHS Compliant & Halogen-Free BVDSS 4 4A S Description AP04N60 series are from Advanced Power innovated design and silicon process technology to achieve the lowest possible onresistance and fast switching performance. It provides the designer with an extreme efficient device for use in a wide range of power applications. The TO-220CFM package is widely preferred for all commercialindustrial through hole applications. The mold compound provides a high isolation voltage capability and low thermal resistance between the tab and the external heat-sink. G D S TO-220CFM(I) Absolute Maximum Ratings@Tj=25o.C(unless otherwise specified) Symbol Parameter VDS Drain-Source Voltage VGS Gate-Source Voltage ID@TC=25℃ ID@TC=100℃ Rating Units 650 V +30 V Drain Current, VGS @ 10V 4 4 A Drain Current, VGS @ 10V 4 2.2 A 15 A 36.8 W 1.92 W 8 mJ 4 A 1 IDM Pulsed Drain Current PD@TC=25℃ Total Power Dissipation PD@TA=25℃ Total Power Dissipation 3 EAS Single Pulse Avalanche Energy IAR Avalanche Current TSTG Storage Temperature Range -55 to 150 ℃ TJ Operating Junction Temperature Range -55 to 150 ℃ Thermal Data Symbol Parameter Value Units Rthj-c Maximum Thermal Resistance, Junction-case 3.4 ℃/W Rthj-a Maximum Thermal Resistance, Junction-ambient 65 ℃/W Data & specifications subject to change without notice 1 201501082 AP04N60I-A-HF o Electrical Characteristics@Tj=25 C(unless otherwise specified) Symbol BVDSS Parameter Test Conditions Drain-Source Breakdown Voltage Min. Typ. 650 - - V VGS=10V, ID=2A - - 2.5 Ω VGS=0V, ID=250uA 2 Max. Units RDS(ON) Static Drain-Source On-Resistance VGS(th) Gate Threshold Voltage VDS=VGS, ID=250uA 2 - 4 V gfs Forward Transconductance VDS=10V, ID=2A - 3.4 - S IDSS Drain-Source Leakage Current VDS=480V, VGS=0V - - 100 uA IGSS Gate-Source Leakage VGS=+30V, VDS=0V - - +100 nA Qg Total Gate Charge ID=1A - 19.5 31 nC Qgs Gate-Source Charge VDS=480V - 3.5 - nC Qgd Gate-Drain ("Miller") Charge VGS=10V - 8.5 - nC td(on) Turn-on Delay Time VDD=300V - 21 - ns tr Rise Time ID=2A - 20 - ns td(off) Turn-off Delay Time RG=50Ω - 105 - ns tf Fall Time VGS=10V - 27 - ns Ciss Input Capacitance VGS=0V - 740 1200 pF Coss Output Capacitance VDS=25V - 70 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 10 - pF Min. Typ. IS=2A, VGS=0V - - 1.5 V . Source-Drain Diode Symbol Parameter 2 Test Conditions Max. Units VSD Forward On Voltage trr Reverse Recovery Time IS=2A, VGS=0V - 280 - ns Qrr Reverse Recovery Charge dI/dt=100A/µs - 2.94 - µC Notes: 1.Pulse width limited by max. junction temperature. 2.Pulse test o 3.Starting Tj=25 C , VDD=50V , L=1mH , RG=25Ω 4.Ensure that the junction temperature does not exceed T Jmax.. THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. 2 AP04N60I-A-HF 8 5 o o T C =150 C 10V 8.0V 7.0V 6.0V 6 10V 8.0V 7.0V 6.0V V G =5.0V 4 ID , Drain Current (A) ID , Drain Current (A) T C =25 C 4 3 2 V G =5.0V 2 1 0 0 0 4 8 12 16 20 24 28 0 V DS , Drain-to-Source Voltage (V) 4 8 12 16 20 24 28 V DS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 1.2 3 I D =2A V G =10V 1 . Normalized RDS(ON) Normalized BVDSS 1.1 2 1 0.9 0.8 0 -50 0 50 100 150 -50 o 0 50 100 150 o T j , Junction Temperature ( C) T j , Junction Temperature ( C ) Fig 3. Normalized BVDSS v.s. Junction Fig 4. Normalized On-Resistance Temperature v.s. Junction Temperature 1.6 8 1.4 Normalized VGS(th) IS (A) 6 T j = 25 o C o T j = 150 C 4 1.2 1 0.8 2 0.6 0 0.4 0.1 0.3 0.5 0.7 0.9 1.1 1.3 V SD , Source-to-Drain Voltage (V) Fig 5. Forward Characteristic of Reverse Diode 1.5 -50 0 50 100 150 o T j , Junction Temperature ( C) Fig 6. Gate Threshold Voltage v.s. Junction Temperature 3 AP04N60I-A-HF 12 f=1.0MHz 1200 1000 V DS =480V 8 800 C (pF) VGS , Gate to Source Voltage (V) I D =1A 10 6 C iss 600 4 400 2 200 0 0 0 4 8 12 16 20 24 C oss C rss 1 5 9 Q G , Total Gate Charge (nC) Fig 7. Gate Charge Characteristics 17 21 25 29 Fig 8. Typical Capacitance Characteristics 1 10 Operation in this area limited by RDS(ON) 100us 1 1ms 10ms 100ms 1s DC 0.1 o T c =25 C Single Pulse . Normalized Thermal Response (Rthjc) 100 ID (A) 13 V DS , Drain-to-Source Voltage (V) Duty factor=0.5 0.2 0.1 0.1 0.05 PDM 0.02 t 0.01 T Single Pulse Duty factor = t/T Peak Tj = PDM x Rthjc + T C 0.01 0.01 1 10 100 1000 0.0001 0.001 V DS , Drain-to-Source Voltage (V) Fig 9. Maximum Safe Operating Area 0.01 0.1 1 10 t , Pulse Width (s) Fig 10. Effective Transient Thermal Impedance VG VDS 90% QG 10V QGS QGD 10% VGS td(on) tr td(off) t f Fig 11. Switching Time Waveform Charge Q Fig 12. Gate Charge Waveform 4 AP04N60I-A-HF MARKING INFORMATION Part Number Option A 04N60I Package Code YWWSSS Date Code (YWWSSS) Y:Last Digit Of The Year WW:Week SSS:Sequence . 5