Rohm BD7345GUL-TR Compact 1ch clock generators for digital camera Datasheet

High-performance Clock Generator Series
Compact 1ch
Clock Generators for Digital Cameras
BU7344HFV,BU7345HFV,BU7346GUL
No.11005EAT06
●Description
These Clock Generators incorporates compact package compared to oscillators, which provides the generation of
high-frequency CCD clocks necessary for digital still cameras and digital video cameras.
●Features
1) SEL pin allowing for the selection of frequencies
2) Selection of OE (PDB) pin enabling Power-down function
3) Crystal-oscillator-level clock precision with high C/N characteristics and low jitter
4) Micro miniature Package incorporated
5) Single power supply of 3.3 V
●Applications
Digital Still Camera, Digital Video Camera, and others
●Line up matrix
Parameter
BU7344HFV
BU7345HFV
BU7346GUL
Supply voltage
2.7V～3.6V
2.7V～3.6V
2.7V～3.6V
Operating temperature range
-5 ℃～75 ℃
-5 ℃～75 ℃
-5 ℃～75 ℃
Reference input clock
27.0000MHz
27.0000MHz
27.0000MHz
40.5000MHz
38.0000MHz
38.0000MHz
36.0000MHz
36.0000MHz
36.0000MHz
Standby current(MAX.)
1.0μA
1.0μA
1.0μA
Operating current (TYP)
4.0mA
3.5mA
3.5mA
HVSOF6
HVSOF6
VCSP50L1
1.5mm×1.0mm
Output clock
Package
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© 2011 ROHM Co., Ltd. All rights reserved.
1/13
2011.01 - Rev.A
Technical Note
BU7344HFV,BU7345HFV,BU7346GUL
●Absolute maximum ratings (Ta=25 ℃)
Parameter
Symbol
Ratings
Unit
Supply voltage
VDD
-0.3 ~ 4.0
V
Input voltage
VIN
-0.3 ~ VDD+0.3
V
Storage temperature range
Tstg
-55 ~ 125
℃
410(BU7344HFV,BU7345HFV)
Power dissipation
*1
*2
*
*
Pd
*1
460(BU7346GUL)*2
mW
Mounted on 70mm * 70mm * 1.6mm Glass-epoxy PCB. Derating: 4.1mW / ℃ at Ta > 25°C
Mounted on 50mm * 58mm * 1.75mm Glass-epoxy PCB. Derating: 4.6mW / ℃ at Ta > 25°C
Operating is not guaranteed.
The radiation-resistance design is not carried out.
●Operating conditions
Parameter
Symbol
Ratings
Unit
Supply voltage
VDD
2.7 ~ 3.6
V
Input H voltage
VINH
0.8VDD ~ VDD
V
Input L voltage
VINL
0.0 ~ 0.2VDD
V
Operating temperature
Topr
-5 ~ 75
℃
CL
15(MAX.)
pF
Output load
●Electrical characteristics
○BU7344HFV (Ta=25 ℃, VDD=3.3V, Crystal frequency=27.0000MHz, unless otherwise specified.)
Parameter
Symbol
Limits
Min.
Typ.
Max.
Unit
Conditions
Output H voltage
VOH
2.8
-
VDD
V
IOH = -3.0mA
Output L voltage
VOL
0.0
-
0.5
V
IOL = 3.0mA
Standby current
IDDst
-
-
1.0
μA
OE = L
Consumption current 1
IDD1
-
4.0
5.2
mA
Consumption current 2
IDD2
-
3.5
4.6
mA
Pull-down load
Rpd
50
100
200
kΩ
40.5000MHz output
SEL = L
36.0000MHz output
SEL = H
input PIN, pull-down load value
Output frequency
OUT1
CLK40.5
40.5000
MHz
IN*12/4/2, SEL = L
OUT2
CLK36
36.0000
MHz
IN*8/3/2, SEL = H
*
The output frequency is determined by the arithmetic (frequency division) expression of a frequency input to IN.
If the input frequency is set to 27.0000MHz, the output frequency will be as listed above.
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2/13
2011.01 - Rev.A
Technical Note
BU7344HFV,BU7345HFV,BU7346GUL
○BU7345HFV (Ta=25 ℃, VDD=3.3V, Crystal frequency=27.0000MHz, unless otherwise specified.)
Parameter
Symbol
Limits
Min.
Typ.
Max.
Unit
Conditions
Output H voltage
VOH
2.8
-
VDD
V
IOH = -3.0mA
Output L voltage
VOL
0.0
-
0.5
V
IOL = 3.0mA
Standby current
IDDst
-
-
1.0
μA
OE = L
Consumption current 1
IDD1
-
3.5
4.6
mA
Consumption current 2
IDD2
-
3.5
4.6
mA
Pull-down load
Rpd
50
100
200
kΩ
38.0000MHz output
SEL = L
36.0000MHz output
SEL = H
input PIN, pull-down load value
Output frequency
OUT1
CLK38
38.0000
MHz
IN*76/27/2, SEL = L
OUT2
CLK36
36.0000
MHz
IN*8/3/2, SEL = H
*
The output frequency is determined by the arithmetic (frequency division) expression of a frequency input to IN.
If the input frequency is set to 27.0000MHz, the output frequency will be as listed above.
○BU7346GUL (Ta=25 ℃, VDD=3.3V, Crystal frequency=27.0000MHz, unless otherwise specified.)
Parameter
Symbol
Limits
Min.
Typ.
Max.
Unit
Conditions
Output H voltage
VOH
2.8
-
VDD
V
IOH = -3.0mA
Output L voltage
VOL
0.0
-
0.5
V
IOL = 3.0mA
Standby current
IDDst
-
-
1.0
μA
PDB = L
Consumption current 1
IDD1
-
3.5
4.6
mA
Consumption current 2
IDD2
-
3.5
4.6
mA
Pull-down load
Rpd
50
100
200
kΩ
38.0000MHz output
SEL = L
36.0000MHz output
SEL = H
input PIN, pull-down load value
Output frequency
OUT1
CLK38
38.0000
MHz
XIN*76/27/2, SEL = L
OUT2
CLK36
36.0000
MHz
XIN*8/3/2, SEL = H
*
The output frequency is determined by the arithmetic (frequency division) expression of a frequency input to XIN.
If the input frequency is set to 27.0000MHz, the output frequency will be as listed above.
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3/13
2011.01 - Rev.A
Technical Note
BU7344HFV,BU7345HFV,BU7346GUL
●Reference data (BU7344HFV basic data)
10dB/div
1V/div
1V/div
RBW:1kHz
RBW:1kH
VBW:100Hz
VBW:100Hz
5nsec/div
500psec/div
Fig.1 40.5MHz output waveform
(CL=15pF,Ta=25 ℃)
Fig.2 40.5MHz Period-Jitter
(CL=15pF,Ta=25 ℃)
10kHz/div
Fig.3 40.5MHz spectrum
(CL=15pF,Ta=25 ℃)
10dB/div
1V/div
1V/div
RBW:1kHz
VBW:100Hz
5nsec/div
500psec/div
10kHz/div
Fig.5 36MHz Period-Jitter
(CL=15pF,Ta=25 ℃)
Fig.4 36MHz output waveform
(CL=15pF,Ta=25 ℃)
Fig.6 36MHz spectrum
(CL=15pF,Ta=25 ℃)
●Reference data (BU7345HFV basic data)
10dB/div
1V/div
1V/div
RBW:1kHz
VBW:100Hz
5nsec/div
500psec/div
Fig.7 38MHz output waveform
(CL=15pF,Ta=25 ℃)
Fig.8 38MHz Period-Jitter
(CL=15pF,Ta=25 ℃)
10kHz/div
Fig.9 38MHz spectrum
(CL=15pF,Ta=25 ℃)
1V/div
1V/div
10dB/div
RBW:1kHz
VBW:100Hz
5nsec/div
Fig.10 36MHz output waveform
(CL=15pF,Ta=25 ℃)
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© 2011 ROHM Co., Ltd. All rights reserved.
500psec/div
Fig.11 36MHz Period-Jitter
(CL=15pF,Ta=25 ℃)
4/13
10kHz/div
Fig.12 36MHz spectrum
(CL=15pF,Ta=25 ℃)
2011.01 - Rev.A
Technical Note
BU7344HFV,BU7345HFV,BU7346GUL
●Reference data (BU7346GUL basic data)
0.5V/div
0.5V/div
10dB/div
RBW:1kHz
VBW:100Hz
10kHz/div
500psec/div
5nsec/div
Fig.13 38MHz output waveform
(CL=15pF,Ta=25 ℃)
Fig.15 38MHz spectrum
(CL=15pF,Ta=25 ℃)
Fig.14 38MHz Period-Jitter
(CL=15pF,Ta=25 ℃)
0.5V/div
0.5V/div
10dB/div
RBW:1kHz
VBW:100Hz
5nsec/div
Fig.16 36MHz output waveform
(CL=15pF,Ta=25 ℃)
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© 2011 ROHM Co., Ltd. All rights reserved.
500psec/div
Fig.17 36MHz Period-Jitter
(CL=15pF,Ta=25 ℃)
5/13
10kHz/div
Fig.18 36MHz spectrum
(CL=15pF,Ta=25 ℃)
2011.01 - Rev.A
Technical Note
BU7344HFV,BU7345HFV,BU7346GUL
●Reference data (BU7344HFV Temperature and Supply voltage variations data)
55
5
5
54
4
Rise time:tr [nsec]
Duty:Duty [%]
52
VDD=3.6
51
50
49
48
VDD=3.3V
3
2
VDD=3.3V
VDD=2.7V
3
2
1
VDD=3.3V
VDD=3.6V
VDD=3.6V
VDD=2.7V
47
4
VDD=2.7V
Fall time:tf [nsec]
53
1
46
45
0
-25
0
25
50
75
100
0
-25
0
temperature:T [℃]
100
-25
Fig.20 40.5MHz
Temperature－Rise-time
Fig.19 40.5MHz
Temperature－Duty
0
25
50
temperature:T [℃]
75
100
Fig.21 40.5MHz
Temperature－Fall-time
600
100
Period-Jitter MIN-MAX:JsABS [psec]
90
80
Period-Jitter 1s :JsSD [psec]
25
50
75
temperature:T [℃]
70
60
50
VDD=3.3V
40
VDD=2.7V
30
20
10
VDD=3.6V
500
400
300
VDD=2.7V
VDD=3.3V
200
100
0
VDD=3.6V
0
-25
0
25
50
temperature:T [℃]
75
100
-25
Fig.22 40.5MHz
Temperature－Period-Jitter 1σ
0
25
50
temperature:T [℃]
75
100
Fig.23 40.5MHz
Temperature－Period-Jitter MIN-MAX
5
55
5
54
VDD=3.6V
50
49
48
VDD=3.3V
VDD=2.7V
47
4
Fall time:tf [nsec]
51
Rise time:tr [nsec]
52
Duty:Duty [%]
VDD=2.7V
4
53
3
2
VDD=3.6V
VDD=3.3V
VDD=2.7V
3
2
VDD=3.6V
VDD=3.3V
1
1
46
45
0
-25
0
25
50
temperature:T [℃]
75
100
0
-25
25
50
75
temperature:T [℃]
100
Fig.25 36MHz
Temperature－Rise-time
Fig.24 36MHz
Temperature－Duty
100
-25
0
25
50
temperature:T [℃]
75
100
Fig.26 36MHz
Temperature－Fall-time
80
70
60
50
VDD=2.7V
40
VDD=3.3V
30
20
10
VDD=3.6V
Period-Jitter MIN-MAX:JsABS [psec]
600
90
Period-Jitter 1s :JsSD [psec]
0
500
400
300
VDD=2.7V
VDD=3.3V
200
100
VDD=3.6V
0
0
-25
0
25
50
temperature:T [℃]
75
100
Fig.27 36MHz
Temperature－Period-Jitter 1σ
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© 2011 ROHM Co., Ltd. All rights reserved.
-25
0
25
50
temperature:T [℃]
75
100
Fig.28 36MHz
Temperature－Period-Jitter MIN-MAX
6/13
2011.01 - Rev.A
Technical Note
BU7344HFV,BU7345HFV,BU7346GUL
●Reference data (BU7345HFV Temperature and Supply voltage variations data)
55
5
5
54
50
49
48
VDD=3.3V
3
2
VDD=3.3V
VDD=2.7V
VDD=3.3V
3
2
VDD=3.6V
VDD=3.6V
1
VDD=2.7V
47
4
Fall time:tf [nsec]
VDD=3.6V
51
Rise time:tr [nsec]
52
Duty: Duty [%]
VDD=2.7V
4
53
1
46
0
0
45
-25
0
25
50
75
temperature:T [℃]
-25
100
50
75
-25
100
Fig.30 38MHz
Temperature－Rise-time
0
25
50
temperature:T [℃]
75
100
Fig.31 38MHz
Temperature－Fall-time
600
90
80
70
60
50
VDD=3.3V
VDD=2.7V
40
30
20
10
VDD=3.6V
Period-Jitter MIN-MAX:JsABS [psec]
100
500
400
300
VDD=2.7V
VDD=3.3V
200
100
VDD=3.6V
0
0
-25
0
25
50
temperature:T [℃]
75
-25
100
Fig.32 38MHz
Temperature－Period-Jitter 1σ
0
25
50
temperature:T [℃]
75
100
Fig.33 38MHz
Temperature－Period-Jitter MIN-MAX
5
5
55
54
VDD=2.7V
4
52
VDD=3.6V
51
50
49
48
VDD=3.3V
47
Rise time:tr [nsec]
53
4
VDD=2.7V
Fall time:tf [nsec]
Period-Jitter 1s:JsSD [psec]
25
temperature:T [℃]
Fig.29 38MHz
Temperature－Duty
Duty: Duty [%]
0
3
2
VDD=3.6V
VDD=3.3V
1
VDD=2.7V
3
2
VDD=3.6V
VDD=3.3V
1
46
0
45
-25
0
25
50
75
temperature:T [℃]
0
-25
100
Fig.34 36MHz
Temperature－Duty
25
50
75
temperature:T [℃]
100
Fig.35 36MHz
Temperature－Rise-time
-25
0
25
50
temperature:T [℃]
75
100
Fig.36 36MHz
Temperature－Fall-time
600
100
Period-Jitter MIN-MAX:JsABS [psec]
90
Period-Jitter 1s :JsSD [psec]
0
80
70
60
50
VDD=3.3V
VDD=2.7V
40
30
20
10
VDD=3.6V
500
400
300
VDD=2.7V
VDD=3.3V
200
100
VDD=3.6V
0
0
-25
0
25
50
temperature:T [℃]
75
100
Fig.37 36MHz
Temperature－Period-Jitter 1σ
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-25
0
25
50
75
temperature:T [℃]
100
Fig.38 36MHz
Temperature－Period-Jitter MIN-MAX
7/13
2011.01 - Rev.A
Technical Note
BU7344HFV,BU7345HFV,BU7346GUL
●Reference data (BU7346GUL Temperature and Supply voltage variations data)
5
5
55
54
VDD=2.7V
VDD=3.6V
51
50
49
48
VDD=3.3V
VDD=2.7V
47
3
2
VDD=3.3V
VDD=3.6V
Fall time:tf [nsec]
Ris e t ime:t r [ns ec]
52
Duty:Duty [%]
4
4
53
VDD=2.7V
3
2
VDD=3.6V
1
VDD=3.3V
1
46
0
45
-25
0
25
50
75
temperature:T [℃]
0
-25
100
Fig.39 38MHz
Temperature－Duty
-25
100
0
25
50
temperature:T [℃]
75
100
Fig.41 38MHz
Temperature－Fall-time
600
Period-Jitter MIN-MAX:JsABS [psec]
90
Period-Jitter 1s :JsSD [psec]
25
50
75
temperature:T [℃]
Fig.40 38MHz
Temperature－Rise-time
100
80
70
60
50
40
0
VDD=2.7V
VDD=3.6V
30
20
10
VDD=3.3V
500
400
VDD=3.6V
300
VDD=2.7V
200
100
VDD=3.3V
0
0
-25
0
25
50
75
temperature:T [℃]
-25
100
Fig.42 38MHz
Temperature－Period-Jitter 1σ
0
25
50
temperature:T [℃]
75
100
Fig.43 38MHz
Temperature－Period-Jitter MIN-MAX
55
5
5
54
51
Rise time:tr [nsec]
52
Duty:Duty [%]
VDD=2.7V
4
VDD=3.6V
50
49
48
VDD=3.3V
VDD=2.7V
47
4
VDD=2.7V
Fall time:tf [ns ec]
53
3
2
VDD=3.3V
VDD=3.6V
3
2
VDD=3.6V
VDD=3.3V
1
1
46
45
0
0
-25
0
25
50
75
100
-25
0
temperature:T [℃]
75
100
Fig.45 36MHz
Temperature－Rise-time
Fig.44 36MHz
Temperature－Duty
100
-25
0
25
50
75
temperature: T [℃]
100
Fig.46 36MHz
Temperature－Fall-time
80
70
60
50
VDD=2.7V
VDD=3.6V
40
30
20
10
VDD=3.3V
0
-25
0
25
50
temperature:T [℃]
75
100
Fig.47 36MHz
Temperature－Period-Jitter 1σ
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© 2011 ROHM Co., Ltd. All rights reserved.
Period-Jitter MIN-MAX:JsABS [psec]
600
90
Period-Jitter 1s :JsSD [psec]
25
50
temperature:T [℃]
500
400
300
VDD=2.7V
VDD=3.3V
200
100
VDD=3.6V
0
-25
0
25
50
75
temperature:T [℃]
100
Fig.48 36MHz
Temperature－Period-Jitter MIN-MAX
8/13
2011.01 - Rev.A
Technical Note
BU7344HFV,BU7345HFV,BU7346GUL
●Block diagram, pin assignment/functions
○BU7344HFV
PLL
6pin:IN
1:VDD
6:IN
2:VSS
5：SEL
3:OUT
4：OE
DATA1
DATA2
1/2
3pin:OUT
5pin:SEL
4pin:OE
Fig.49 Pin assignment
PIN No.
1
2
3
PIN Name
VDD
VSS
OUT
4
OE
5
6
SEL
IN
Fig.50 Block diagram
Function
Power supply
GND
Clock output terminal (SEL=L:40.5000MHz, SEL=H:36.0000MHz)
Power-down pin (L:disable, H:enable), equipped with Pull-down function, output set to L
at disable
Output selection (L:40.5000MHz, H:36.0000MHz)
Clock input pin (27.0000MHz input)
○BU7345HFV
PLL
1:VDD
6:IN
2:VSS
5：SEL
3:OUT
4：OE
6pin:IN
DATA1
DATA2
1/2
3pin:OUT
5pin:SEL
4pin:OE
Fig.51 Pin assignment
Fig.52 Block diagram
PIN No.
1
2
3
PIN Name
VDD
VSS
OUT
Function
4
OE
5
6
SEL
IN
Power supply
GND
Clock output terminal (SEL=L:38.0000MHz, SEL=H:36.0000MHz)
Power-down pin (L:disable, H:enable), equipped with Pull-down function, output set to L
at disable
Output selection (L:38.0000MHz, H:36.0000MHz)
Clock input pin (27.0000MHz input)
○BU7346GUL
PLL
A1:XIN
B
VDD
VSS
OUT
A
XIN
SEL
PDB
A2:SEL
1
2
3
A3:PDB
Bottom view
Fig.53 Pin assignment
PIN No.
A1
A2
PIN Name
XIN
SEL
A3
PDB
B1
B2
B3
VDD
VSS
OUT
DATA1
DATA2
1/2
B3:OUT
Fig.54 Block diagram
Function
Clock input pin (27.0000MHz input)
Output selection (L:38.0000MHz, H:36.0000MHz)
Power-down pin (L:disable, H:enable), equipped with
Pull-down function, output set to L at disable
Power supply
GND
Clock output terminal (SEL=L:38.0000MHz, SEL=H:36.0000MHz)
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9/13
2011.01 - Rev.A
Technical Note
BU7344HFV,BU7345HFV,BU7346GUL
●Application circuit example
VDD
27.0000MHz
IN
L : 40.5000MHz
H : 36.0000MHz
VSS
L : 40.5000MHz
H : 36.0000MHz
SEL
OUT
L : disable
H : enable
OE
Fig.55 Application circuit example(BU7344HFV)
* For VDD and VSS, insert a bypass capacitor of approx. 0.1μF as close as possible to the pin.Bypass capacitors with
good high-frequency characteristics are recommended. Even though we believe that the typical application circuit is
worth of a recommendation, please be sure to thoroughly recheck the characteristics before use.
●Equivalent circuit
Pin name
Pin number
OUT
3, B3
OE(PDB)
4, A2
SEL
5, A3
Equivalent circuit
From the inside of IC
IC内部から
To
the inside of IC
IC内部へ
From
the
IC内部から
inside of IC
IN(XIN)
6, A1
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© 2011 ROHM Co., Ltd. All rights reserved.
To
the inside of IC
IC内部へ
From
the
IC内部から
inside of IC
10/13
2011.01 - Rev.A
Technical Note
BU7344HFV,BU7345HFV,BU7346GUL
●Appearance of Marker
(Dimension including burr: Max. 1.8)
1.6±0.1
(0.45)
○○
(1.2)
(1.4)
(0.15)
(1.5)
(Dimension including
burr: Max. 2.8)
3.0±0.1
2.6±0.1
Marker
0.145±0.05
0.75MAX
LOT No.
0.5
0.22±0.05
(Unit：mm)
Fig.56 HVSOF6 Appearance of Marker
Marker lists
product name
BU7344HFV
BU7345HFV
marker
AN
AP
Marker
○○○
LOT No.
Marker lists
(Unit：mm)
product name
BU7346GUL
marker
AA8
Fig.57 VCSP50L1 Appearance of Marker
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© 2011 ROHM Co., Ltd. All rights reserved.
11/13
2011.01 - Rev.A
Technical Note
BU7344HFV,BU7345HFV,BU7346GUL
●Notes for use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as applied voltage (VDD or VIN), operating temperature range (Topr),
etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit.
If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical
safety measures including the use of fuses, etc.
(2) Recommended operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the
breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s
power supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines.
In this regard, for the digital block power supply and the analog block power supply, even though these power supplies
has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus
suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the
wiring patterns. For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At
the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to
be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the
constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the
jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention
to the transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals
a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage
to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
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© 2011 ROHM Co., Ltd. All rights reserved.
12/13
2011.01 - Rev.A
Technical Note
BU7344HFV,BU7345HFV,BU7346GUL
●Ordering part number
B
D
7
Part No
3
4
4
Part No
7344 7345
7346
H
F
V
-
Package
HFV: HVSOF6
GUL: VCSP50L1
T
R
Packaging and forming specification
TR: Embossed tape and reel
(HVSOF6)
E2: Embossed tape and reel
(VCSP50L1)
HVSOF6
<Tape and Reel information>
(1.5)
(0.45)
6 5 4
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
(0.15)
(1.2)
(1.4)
1 2 3
)
1pin
0.145±0.05
0.75Max.
3.0±0.1
2.6±0.1
(MAX 2.8 include BURR)
1.6±0.1
(MAX 1.8 include BURR)
S
0.1 S
0.22±0.05
Direction of feed
0.5
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
VCSP50L1(BU7346GUL)
<Tape and Reel information>
1.50±0.05
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
0.55MAX
0.10±0.05
1.00±0.05
1PIN MARK
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
0.06 S
(φ0.15)INDEX POST
6-φ0.25±0.05
0.05 A B
A
0.5
B B
A
1
0.25±0.05
0.25±0.05
S
2
3
P=0.5×2
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© 2011 ROHM Co., Ltd. All rights reserved.
1pin
Reel
13/13
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2011.01 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
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The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
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of the Products for the above special purposes. If a Product is intended to be used for any
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R1120A