LM1971 www.ti.com SNAS104B – FEBRUARY 1995 – REVISED APRIL 2013 LM1971 Overture™ Audio Attenuator Series Digitally Controlled 62 dB Audio Attenuator with/Mute Check for Samples: LM1971 FEATURES DESCRIPTION • • • • The LM1971 is a digitally controlled single channel audio attenuator fabricated on a CMOS process. Attenuation is variable in 1 dB steps from 0 dB to −62 dB. A mute function disconnects the input from the output, providing over 100 dB of attenuation. 1 23 3-Wire Serial Interface Mute Function Click and Pop Free Attenuation Changes 8-Pin Plastic PDIP and SOIC Packages Available APPLICATIONS • • • • • • Communication Systems Cellular Phones and Pagers Personal Computer Audio Control Electronic Music (MIDI) Sound Reinforcement Systems Audio Mixing Automation KEY SPECIFICATIONS • • • • • Total Harmonic Distortion 0.0008 % (Typ) Frequency Response > 200 kHz (−3 dB) (Typ) Attenuation Range (Excluding Mute) 62 dB (Typ) Dynamic Range 115 dB (Typ) Mute Attenuation 102 dB (Typ) The performance of the device is exhibited by its ability to change attenuation levels without audible clicks or pops. In addition, the LM1971 features a low Total Harmonic Distortion (THD) of 0.0008%, and a Dynamic Range of 115 dB, making it suitable for digital audio needs. The LM1971 is available in both 8-pin plastic PDIP or SOIC packages. The LM1971 is controlled by a TTL/CMOS compatible 3-wire serial digital interface. The active low LOAD line enables the data input registers while the CLOCK line provides system timing. Its DATA pin receives serial data on the rising edge of each CLOCK pulse, allowing the desired attenuation setting to be selected. Typical Application Figure 1. Typical Audio Attenuator Application Circuit 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Overture is a trademark of dcl_owner. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1995–2013, Texas Instruments Incorporated LM1971 SNAS104B – FEBRUARY 1995 – REVISED APRIL 2013 www.ti.com Connection Diagram Figure 2. Dual-In-Line Plastic or Surface Mount Package- Top View These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) (3) Supply Voltage, VDD 15V (GND −0.2V) to (VDD +0.2V) Voltage at any pin ESD Susceptibility (4) Soldering Information 3000V P Package (10s) 260°C D Package Vapor Phase (60s) Infrared (15s) Power Dissipation (5) 215°C 220°C 150 mW Junction Temperature 150°C Storage Temperature −65°C to +150°C (1) (2) (3) (4) (5) All voltages are measured with respect to the GND pin (pin 3), unless otherwise specified. Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not specify specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication of device performance. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. Human body model, 100 pF discharged through a 1.5 kΩ resistor. The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature TA. The maximum allowable power dissipation is PD = (TJMAX – TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM1971N and LM1971M, TJMAX = +150°C, and the typical junction-to-ambient thermal resistance, θJA, when board mounted is 102° C/W and 167° C/W, respectively. Operating Ratings (1) (2) Temperature Range Thermal Resistance TMIN ≤ TA ≤ TMAX 167°C/W P0008E Package, θJA 102°C/W Supply Voltage (1) (2) 2 −40°C ≤ TA ≤ +85°C D0008A Package, θJA 4.5V to 12V Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not specify specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication of device performance. All voltages are measured with respect to the GND pin (pin 3), unless otherwise specified. Submit Documentation Feedback Copyright © 1995–2013, Texas Instruments Incorporated Product Folder Links: LM1971 LM1971 www.ti.com SNAS104B – FEBRUARY 1995 – REVISED APRIL 2013 Electrical Characteristics (1) (2) The following specifications apply for VDD = +12V (VREFIN = +6V), VIN = 5.5 Vpk, and f = 1 kHz, unless otherwse specified. Limits apply for TA = 25°C. Digital inputs are TTL and CMOS compatible. Symbol Parameter Conditions LM1971 Typical (3) Limit (4) Units (Limits) IS Supply Current Digital Inputs Tied to 6V 1.8 3 mA (max) THD Total Harmonic Distortion VIN = 0.5Vpk@ 0 dB Attenuation 0.0008 0.003 % (max) eIN Noise Input is AC Grounded @ −12 dB Attenuation A-Weighted (5) 4.0 DR Dynamic Range Referenced to Full Scale = +6 Vpk 115 AM Mute Attenuation μV dB 102 96 dB (min) Attenuation Step Size Error 0 dB to −62 dB 0.009 0.2 dB (max) Absolute Attenuation Attenuation @ 0 dB Attenuation @ −20 dB Attenuation @ −40 dB Attenuation @ −60 dB Attenuation @ −62 dB 0.1 −20.3 −40.5 −60.6 −62.6 0.5 −19.0 −38.0 −57.0 −59.0 dB (min) dB (min) dB (min) dB (min) dB (min) Analog Input Leakage Current Input is AC Grounded 5.8 100 nA (max) Frequency Response 20 Hz–100 kHz ±0.1 RIN AC Input Impedance Pin 8, VIN = 1.0 Vpk, f = 1 kHz 40 20 60 kΩ (min) kΩ (max) IIN Input Current @ Pins 4, 5, 6 @ 0V < VIN < 5V 1.0 100 nA (max) fCLK Clock Frequency 2 MHz (max) VIH High-Level Input Voltage @ Pins 4, 5, 6 2.0 V (min) VIL Low-Level Input Voltage @ Pins 4, 5, 6 0.8 V (max) ILEAK (1) (2) (3) (4) (5) 3 dB Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not specify specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication of device performance. All voltages are measured with respect to the GND pin (pin 3), unless otherwise specified. Typicals are measured at 25°C and represent the parametric norm. Limits are specifications that all parts are tested in production to meet the stated values. Due to production test limitations, there is no limit for the Noise test. Please refer to Figure 5 and Figure 8 in Typical Performance Characteristics. Submit Documentation Feedback Copyright © 1995–2013, Texas Instruments Incorporated Product Folder Links: LM1971 3 LM1971 SNAS104B – FEBRUARY 1995 – REVISED APRIL 2013 www.ti.com Pin Descriptions VREFIN (1): The VREFIN pin provides the reference for the analog input signal. This pin should be biased at half of the supply voltage, VDD, as shown in Figure 1 and Figure 19. OUT (2): The attenuated analog output signal comes from this pin. GND (3): The GND pin references the digital input signals and is the lower voltage reference for the IC. Typically this pin would be labeled “VSS” but the ground reference for the digital logic input control is tied to this same point. With a higher pin-count there would generally be separate pins for these functions; VSS and Logic Ground. It is intended that the LM1971 always be operated using a single voltage supply configuration, for which pin 3 (GND) should always be at system ground. If a bipolar or split-supply configuration are desired, level shifting circuitry is needed for the digital logic control pins as they would be referenced through pin 3 which would be at the negative supply. It is highly recommended, however, that the LM1971 be used in a unipolar or single-supply configuration. LOAD (4): The LOAD input accepts a TTL or CMOS level signal. This is the enable pin of the device, allowing data to be clocked in while this input is low (0V). The GND pin is the reference for this signal. DATA (5): The DATA input accepts a TTL or CMOS level signal. This pin is used to accept serial data from a microcontroller that will be latched and decoded to change the channel's attenuation level. The GND pin is the reference for this signal. CLOCK (6): The CLOCK input accepts a TTL or CMOS level signal. The clock input is used to load data into the internal shift register on the rising edge of the input clock waveform. The GND pin is the reference for this signal. VDD (7): The positive voltage supply should be placed to this pin. IN (8): The analog input signal should be placed to this pin. 4 Submit Documentation Feedback Copyright © 1995–2013, Texas Instruments Incorporated Product Folder Links: LM1971 LM1971 www.ti.com SNAS104B – FEBRUARY 1995 – REVISED APRIL 2013 Typical Performance Characteristics Supply Current vs Supply Voltage Supply Current vs Temperature Figure 3. Figure 4. Noise Floor Analog Measurement THD + N vs Freq and Amp Figure 5. Figure 6. THD + N vs Freq and Amp Noise Floor Spectrum by FFT Figure 7. Figure 8. Submit Documentation Feedback Copyright © 1995–2013, Texas Instruments Incorporated Product Folder Links: LM1971 5 LM1971 SNAS104B – FEBRUARY 1995 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) 6 THD + N vs Amplitude THD + N vs Amplitude Figure 9. Figure 10. Mute Attenuation vs Frequency THD vs Freq by FFT Figure 11. Figure 12. THD vs Freq by FFT Output Impedance vs Attenuation Level Figure 13. Figure 14. Submit Documentation Feedback Copyright © 1995–2013, Texas Instruments Incorporated Product Folder Links: LM1971 LM1971 www.ti.com SNAS104B – FEBRUARY 1995 – REVISED APRIL 2013 APPLICATION INFORMATION SERIAL DATA FORMAT The LM1971 uses a 3-wire serial communication format that is easily controlled by a microcontroller. The timing for the 3-wire set, comprised of DATA, CLOCK, and LOAD is shown in Figure 15. As depicted in Figure 15, the LOAD line is to go low at least 150 ns before the rising edge of the first clock pulse and is to remain low throughout the transmission of the 16 data bits. The serial data is composed of an 8-bit address, which must always be set to 0000 0000 to select the single audio channel, and 8 bits for attenuation setting. For both address data and attenuation setting data, the MSB is sent first with the address data preceding the attenuation data. Please refer to Figure 16 to confirm the serial data format transfer process. Table 1 shows the various Address and Data byte values for different attenuation settings. Note that Address bytes other than 0000 0000 are ignored. μPOT SYSTEM ARCHITECTURE The μPot's digital interface is essentially a shift register where serial data is shifted in, latched, and then decoded. Once new data is shifted in, the LOAD line goes high, latching in the new data. The data is then decoded and the appropriate switch is activated to set the desired attenuation level. This process is continued each and every time an attenuation change is made. When the µPot is powered up, it is placed into the Mute mode. μPOT DIGITAL COMPATIBILITY The μPot's digital interface section is compatible with TTL or CMOS logic. The shift register inputs act upon a threshold of two diode drops above the ground level (Pin 3) or approximately 1.4V. Table 1. Attenuator Register Set Description Address Register (Byte 0) MSB LSB A7–A0 0000 0000 Channel 1 0000 0001 Ignored 0000 0010 Ignored Data Register (Byte 1) Contents Attenuation (dB) MSB LSB D7–D0 0000 0000 0.0 0000 0001 1.0 0000 0010 2.0 0000 0011 3.0 ::::: :: 0001 0000 16.0 0001 0001 17.0 0001 0010 18.0 0001 0011 19.0 ::::: :: 0011 1101 61.0 0011 1110 62.0 0011 1111 96 (Mute) 0100 0000 96 (Mute) ::::: :: 1111 1110 96 (Mute) 1111 1111 96 (Mute) Submit Documentation Feedback Copyright © 1995–2013, Texas Instruments Incorporated Product Folder Links: LM1971 7 LM1971 SNAS104B – FEBRUARY 1995 – REVISED APRIL 2013 www.ti.com *Note: Load and clock falling edges can be coincident, however, the clock falling edge cannot be delayed more than 20 ns from the falling edge of load. It is preferrable that the falling edge of clock occurs before the falling edge of load. Figure 15. Timing Diagram Figure 16. Serial Data Format Transfer Process μPOT LADDER ARCHITECTURE The μPot contains a chain of R1/R2 resistor dividers in a ladder form, as shown in Figure 17. Each R1 is actually a series of 8 resistors, with a CMOS switch that taps into the resistor chain according to the attenuation level chosen. For any given attenuation setting, there is only one CMOS switch closed (no paralleling of ladders). The input impedance therefore remains constant, while the output impedance changes as the attenuation level changes. It is important to note that the architecture is a series of resistor dividers, and not a straight, tapped resistor, so the μPot is not a variable resistor; it is a variable voltage divider. Figure 17. Resistor Ladder Architecture 8 Submit Documentation Feedback Copyright © 1995–2013, Texas Instruments Incorporated Product Folder Links: LM1971 LM1971 www.ti.com SNAS104B – FEBRUARY 1995 – REVISED APRIL 2013 ATTENUATION STEP SCHEME The fundamental attenuation step scheme for the LM1971 is shown in Figure 18. It is also possible to obtain any integer value attenuation step through programming, in addition to the 2 dB and 4 dB steps shown in Figure 18. All higher attenuation step schemes can have clickless and popless performance. Although it is possible to “skip” attenuation points by not sending all of the data, clickless and popless performance will suffer. It is highly recommended that all of the data points should be sent for each attenuation level. This ensures flawless operation and performance when making steps larger than 1 dB. Figure 18. LM 1971 Channel Attenuation vs Digital Step Value (1 dB, 2 dB, and 4 dB Steps) INPUT IMPEDANCE The input impedance of a μPot is constant at a nominal 40 kΩ. Since the LM1971 is a single-supply operating device, it is necessary to have both input and output coupling caps as shown in Figure 1. To ensure full lowfrequency response, a 1 μF coupling cap should be used. OUTPUT IMPEDANCE The output impedance of a μPot varies typically between 25 kΩ and 35 kΩ and changes nonlinearly with step changes. Since a μPot is made up of a resistor ladder network with logarithmic attenuation, the output impedance is nonlinear. Due to this configuration, a μPot cannot be considered as a linear potentiometer; it is a logarithmic attenuator. The linearity of a μPot cannot be measured directly without a buffer because the input impedance of most measurement systems is not high enough to provide the required accuracy. The lower impedance of the measurement system would load down the output and an incorrect reading would result. To prevent loading, a JFET input op amp should be used as the buffer/amplifier. OUTPUT BUFFERING There are two performance issues to be aware of that are related to a μPot's output stage. The first concern is to prevent audible clicks with attenuation changes, while the second is to prevent loading and subsequent linearity errors. The output stage of a μPot needs to be buffered with a low input bias current op amp to keep DC shifts inaudible. Additionally, the output of μPot needs to see a high impedance to keep linearity errors low. Submit Documentation Feedback Copyright © 1995–2013, Texas Instruments Incorporated Product Folder Links: LM1971 9 LM1971 SNAS104B – FEBRUARY 1995 – REVISED APRIL 2013 www.ti.com Attenuation level changes cause changes in the output impedance of a μPot. Output impedance changes in the presence of a large input bias current for a buffer/amplifier will cause a DC shift to occur. Neglecting amplifier gains and speaker sensitivities, the audibility of a DC shift is dependent upon the output impedance change times the required input bias current. As an example, a 5 kΩ impedance change times a 1 μA bias current results in a 5 mV DC shift; a level that is barely audible without any music material in the system. An op amp with a bias current of 200 pA for the same 5 kΩ change results in an inaudible 1 μV DC shift. Since the worst case output impedance changes are on the order of several kΩ, a bias current much less than 1 μA is required for highest performance. In order to further quantify DC shifts, please refer to Figure 14 in Typical Performance Characteristics and relate worst case impedance changes to the selected buffer/amplifier input bias current. Without the use of a high input impedance (> 1 MΩ) op amp for the buffer/amplifier, loading will occur that causes linearity errors in the signal. To ensure the highest level of performance, a JFET or CMOS input high input impedance op amp is required. One common application that requires gain at the output of a μPot is input signal volume control. Depending upon the input source material, the LM1971 provides a means of controlling the input signal level. With a supply voltage range of 4.5V to 12V, the LM1971 has the ability of controlling fairly inconsistent input source signal levels. Using an op amp with gain at the μPot's output, as shown in Figure 20, will also allow the system dynamic range to be increased. JFET op amps like the LF351 and the LF411 are well suited for this application. If active half-supply buffering is also desired, dual op amps like the LF353 and the LF412 could be used. For low voltage supply applications, op amps like the CMOS LMC6041 are preferred. This part has a supply operating range from 4.5V–15.5V and also comes in a surface mount package. μPOT HALF-SUPPLY REFERENCING The LM1971 operates off of a single supply, with half-supply biasing supplied at the VREFIN terminal (Pin 1). The easiest and most cost effective method of providing this half-supply is a simple resistor divider and bypass capacitor network shown in Figure 1. The capacitor not only stabilizes the half-supply node by “holding” the voltage nearly constant, but also decouples high frequency signals on the supply to ground. Signal feedthrough, power supply ripple and fluctuations that are not properly filtered could cause the performance of the LM1971 to be degraded. A more stable half-supply node can be obtained by actively buffering the resistor divider network with a voltage follower as shown in Figure 19. Supply fluctuations are then isolated by the high input impedance/low output impedance mismatch associated with effective filtering. Since the LM1971 is a single channel device, using a dual JFET input op amp is optimum for both output buffering and half-supply biasing. A 10 μF capacitor or larger is recommended for better half-supply stabilization. For added rejection of higher frequency power supply fluctuations, a smaller capacitor (0.01 μF–0.1 μF) could be added in parallel to the 10 μF capacitor. Figure 19. Higher Performance Active Half-Supply Buffering 10 Submit Documentation Feedback Copyright © 1995–2013, Texas Instruments Incorporated Product Folder Links: LM1971 LM1971 www.ti.com SNAS104B – FEBRUARY 1995 – REVISED APRIL 2013 Figure 20. Active Reference with Active Gain Buffering LOGARITHMIC GAIN AMPLIFIER The μPot is capable of being used in the feedback loop of an op amp to create a gain controlled amplifier as shown in Figure 21. In this configuration the attenuation levels from Table 1 become gain levels with the largest possible gain value being 62 dB. For most applications, 62 dB of gain will cause signal clipping to occur. However, this can be controlled through programming. It is important to note that when in mute mode the input is disconnected from the output, thus placing the amplifier in open-loop gain state. In this mode, the amplifier will behave as a comparator. Care should be taken with the programming and design of this type of circuit. To provide the best overall performance, a high input impedance, low input bias current op amp should be used. Figure 21. Logarithmic Gain Amplifier Circuit MUTE FUNCTION A major feature of the LM1971 is its ability to mute the input signal to an attenuation level of 102 dB. This is accomplished internally by physically disconnecting the output from the input while also grounding the output pin through approximately 2 kΩ. The mute function is obtained during power-up of the device or by sending any binary data of 0011 1111 and above serially to the device. The device may be placed into mute at any time during operation, allowing the designer to make the mute command accessible to the end-user. Submit Documentation Feedback Copyright © 1995–2013, Texas Instruments Incorporated Product Folder Links: LM1971 11 LM1971 SNAS104B – FEBRUARY 1995 – REVISED APRIL 2013 www.ti.com DC INPUTS Although the μPot was designed to be used as an attenuator for signals within the audio spectrum, it is also capable of tracking and attenuating an input DC voltage. The device will track voltages to either supply rail. One point to remember about DC tracking is that with a buffer at the output of the μPot, the resolution of DC tracking will depend upon the gain configuration of that output buffer and its supply voltage. Also, the output buffer's supply voltage does not have to be the same as the μPot's supply voltage. Giving the buffer some gain can provide more resolution when tracking small DC voltages. 12 Submit Documentation Feedback Copyright © 1995–2013, Texas Instruments Incorporated Product Folder Links: LM1971 LM1971 www.ti.com SNAS104B – FEBRUARY 1995 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision A (April 2013) to Revision B • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 12 Submit Documentation Feedback Copyright © 1995–2013, Texas Instruments Incorporated Product Folder Links: LM1971 13 PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM1971M ACTIVE SOIC D 8 95 TBD Call TI Call TI -40 to 85 LM19 71M LM1971M/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM19 71M LM1971MX ACTIVE SOIC D 8 2500 TBD Call TI Call TI -40 to 85 LM19 71M LM1971MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 85 LM19 71M (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 23-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM1971MX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM1971MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM1971MX SOIC D 8 2500 367.0 367.0 35.0 LM1971MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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