NXP BC849 Npn general purpose transistor Datasheet

DISCRETE SEMICONDUCTORS
DATA SHEET
BC849; BC850
NPN general purpose transistors
Product data sheet
Supersedes data of 1999 Apr 08
2004 Jan 16
NXP Semiconductors
Product data sheet
NPN general purpose transistors
BC849; BC850
FEATURES
PINNING
• Low current (max. 100 mA)
PIN
• Low voltage (max. 45 V).
APPLICATIONS
DESCRIPTION
1
base
2
emitter
3
collector
• General purpose switching and amplification.
DESCRIPTION
NPN transistor in a SOT23 plastic package.
PNP complements: BC859 and BC860.
handbook, halfpage
3
3
MARKING
1
TYPE
NUMBER
MARKING
CODE(1)
TYPE
NUMBER
MARKING
CODE(1)
BC849B
2B*
BC850B
2F*
BC849C
2C*
BC850C
2G*
1
Top view
2
2
MAM255
Note
1. * = p : Made in Hong Kong.
* = t : Made in Malaysia.
* = W : Made in China.
Fig.1 Simplified outline (SOT23) and symbol.
ORDERING INFORMATION
TYPE
NUMBER
BC849B
PACKAGE
NAME
−
DESCRIPTION
plastic surface mounted package; 3 leads
BC849C
BC850B
BC850C
2004 Jan 16
2
VERSION
SOT23
NXP Semiconductors
Product data sheet
NPN general purpose transistors
BC849; BC850
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
VCBO
PARAMETER
CONDITIONS
collector-base voltage
MAX.
UNIT
open emitter
−
30
V
−
50
V
BC849
−
30
V
BC850
−
45
V
BC849
BC850
VCEO
MIN.
collector-emitter voltage
open base
VEBO
emitter-base voltage
−
5
V
IC
collector current (DC)
−
100
mA
ICM
peak collector current
−
200
mA
IBM
peak base current
−
200
mA
Ptot
total power dissipation
−
250
mW
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
−
150
°C
Tamb
operating ambient temperature
−65
+150
°C
open collector
Tamb ≤ 25 °C; note 1
Note
1. Transistor mounted on an FR4 printed-circuit board.
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
PARAMETER
CONDITIONS
thermal resistance from junction to ambient
note 1
Note
1. Transistor mounted on an FR4 printed-circuit board.
2004 Jan 16
3
VALUE
UNIT
500
K/W
NXP Semiconductors
Product data sheet
NPN general purpose transistors
BC849; BC850
CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
SYMBOL
ICBO
PARAMETER
collector cut-off current
CONDITIONS
MIN.
TYP.
MAX.
UNIT
IE = 0; VCB = 30 V
−
−
15
nA
IE = 0; VCB = 30 V; Tj = 150 °C
−
−
5
μA
nA
IEBO
emitter cut-off current
IC = 0; VEB = 5 V
−
−
100
hFE
DC current gain
IC = 10 μA; VCE = 5 V;
see Figs 2 and 3
−
240
−
−
450
−
200
290
450
420
520
800
BC849B; BC850B
BC849C; BC850C
DC current gain
BC849B; BC850B
IC = 2 mA; VCE = 5 V;
see Figs 2 and 3
BC849C; BC850C
VCEsat
VBEsat
VBE
collector-emitter saturation
voltage
IC = 10 mA; IB = 0.5 mA
−
90
250
mV
IC = 100 mA; IB = 5 mA
−
200
600
mV
base-emitter saturation voltage
IC = 10 mA; IB = 0.5 mA; note 1
−
700
−
mV
IC = 100 mA; IB = 5 mA; note 1
−
900
−
mV
IC = 2 mA; VCE = 5 V; note 2
580
660
700
mV
IC = 10 mA; VCE = 5 V; note 2
−
−
770
mV
−
2.5
−
pF
base-emitter voltage
Cc
collector capacitance
IE = ie = 0; VCB = 10 V; f = 1 MHz
Ce
emitter capacitance
IC = ic = 0; VEB = 500 mV; f = 1 MHz −
11
−
pF
fT
transition frequency
IC = 10 mA; VCE = 5 V; f = 100 MHz
100
−
−
MHz
F
noise figure
IC = 200 μA; VCE = 5 V; RS = 2 kΩ;
f = 10 Hz to 15.7 kHz
−
−
4
dB
IC = 200 μA; VCE = 5 V; RS = 2 kΩ;
f = 1 kHz; B = 200 Hz
−
−
4
dB
Notes
1. VBEsat decreases by about 1.7 mV/K with increasing temperature.
2. VBE decreases by about 2 mV/K with increasing temperature.
2004 Jan 16
4
NXP Semiconductors
Product data sheet
NPN general purpose transistors
BC849; BC850
MBH724
300
handbook, full pagewidth
VCE = 5 V
hFE
200
100
0
10−2
10−1
1
102
10
IC (mA)
103
BC849B; BC850B.
Fig.2 DC current gain; typical values.
MBH725
600
handbook, full pagewidth
VCE = 5 V
hFE
400
200
0
10−2
10−1
1
10
BC849C; BC850C.
Fig.3 DC current gain; typical values.
2004 Jan 16
5
102
IC (mA)
103
NXP Semiconductors
Product data sheet
NPN general purpose transistors
BC849; BC850
PACKAGE OUTLINE
Plastic surface-mounted package; 3 leads
SOT23
D
E
B
A
X
HE
v M A
3
Q
A
A1
1
2
e1
bp
c
w M B
Lp
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max.
bp
c
D
E
e
e1
HE
Lp
Q
v
w
mm
1.1
0.9
0.1
0.48
0.38
0.15
0.09
3.0
2.8
1.4
1.2
1.9
0.95
2.5
2.1
0.45
0.15
0.55
0.45
0.2
0.1
OUTLINE
VERSION
SOT23
2004 Jan 16
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
04-11-04
06-03-16
TO-236AB
6
NXP Semiconductors
Product data sheet
NPN general purpose transistors
BC849; BC850
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Qualification
This document contains data from the preliminary specification.
Product data sheet
Production
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
above those given in the Characteristics sections of this
document is not implied. Exposure to limiting values for
extended periods may affect device reliability.
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Quick reference data ⎯ The Quick reference data is an
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Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) may cause permanent damage to
the device. Limiting values are stress ratings only and
operation of the device at these or any other conditions
2004 Jan 16
7
NXP Semiconductors
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
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Printed in The Netherlands
R75/06/pp8
Date of release: 2004 Jan 16
Document order number: 9397 750 12396
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