LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SURFACE MOUNT LED TAPE AND REEL Pb Lead-Free Parts LVIR9033/TR2 DATA SHEET QW0905-L VIR9033/TR2 DOC. NO : REV. : C DATE : 04 - Aug - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/7 PART NO. LVIR9033/TR2 Package Dimensions Cathode 2.5 0.4±0.1 2.0 0.5±0.1 5.8±0.5 ψ1.9 3.05±0.5 1.4 2.8 0.7 4.3± 0.5 Note : 1.All dimension are in millimeter tolerance is ±0.2mm unless otherwise noted. 2.Specifications are subject to change without notice. Carrier Type Dimensions 4.0 0.3 6.43 9.3 12±0.3 5.5 Polarity 1.75 2.0 4.0 Note : The tolerances unless mentioned is ±0.2mm,Angle ± 0.5. Unit=mm. ψ1.55 3.05 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/7 PART NO. LVIR9033/TR2 Reel Dimensions 16.0±1.0 ψ178±2.0 14.2±1.0 74.0±1.5 Description Quantity/Reel 12.0mm tape,7"reel 1500 devices Features: 1. High radiant intensity. 2. Suitable for pulsed applications. 3. Low average degradation. Descriptions: The LVIR9033/TR2 series are super-high efficiency Gallium Aluminum Arsenide infrared emitting diodes encapsulated in water clear plastic T-1 3/4 package individually Device Selection Guide: PART NO MATERIAL LENS COLOR LVIR9033/TR2 GaAIAs Water Clear LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LVIR9033/TR2 Page 3/7 Absolute Maximum Ratings at Ta=25 ℃ Ratings Parameter Symbol UNIT VIR Power Dissipation PD 100 mW Peak Forward Current (300PPS,1 μs Pulse) IFP 3 A Forward Current IF 50 mA Reverse Voltage Vr 5 V Electrostatic Discharge ESD 2000 V Operating Temperature Topr -55 ~ +100 ℃ Storage Temperature Tstg -55 ~ +100 ℃ Soldering Temperature Tsol Max 260 ℃ for 5 sec Max (2mm from body) Electrical Optical Characteristics (Aa=25℃) SYMBOL Min. Typ. Radiant Intensity Le 1.6 Aperture Radiant Incidence Ee 0.2 Peak Emission Wavelength Max. UNIT TEST CONDITION 2.7 mW/sr IF=20mA 0.4 mW/cm IF=20mA λpeak 940 nm IF=20mA △λ 50 nm IF=20mA Forward Voltage VF 1.2 1.6 V IF=20mA Reverse Current IR 100 μA VR=5V PARAMETER Spectral Line Half Width Viewing Angle 2θ1/2 2 20 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The radiant intensity data did not including ±15% testing tolerance. deg LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/7 PART NO. LVIR9033/TR2 Typical Electro-Optical Characteristics Curve Relative Radiant Intensity Normalize @20mA VIR CHIP Forward Current [mA] 1000 100 10 1.0 0.1 0.5 1.0 1.5 2.0 2.5 3.0 3.5 1.0 0.5 0.0 4.0 800 850 1100 Fig.4 Relative Radiant Power vs. Forward Peak Current 10.0 10.0 Relative Radiant Power Normalized @ 100 mA Fig 3. Relative Radiant Power vs. Forward Peak Current 1.0 0.1 1.0 10 1.0 0.1 100 10 100 Fig.6 Relative Radiant Power vs. Temperature 1.2 1.1 1.0 0.9 0.8 -20 0 20 40 60 80 Ambient Temperature [ ℃] 100 Relative Radiant Power @ 20mA, Normalize @ 25 ℃ Fig.5 Forward DC Voltage vs. Temperature -40 1000 IFPK [mA] IFDC [mA] Forw ard DC Voltage @ 20 mA Normalize @ 25 ℃ 1000 1050 Wavelength[nm] Forward Voltage[V] Relative Radiant Power Normalized @ 20mA 900 950 3.0 2.5 2.0 1.5 1.0 0.5 0 -40 -20 0 20 40 60 80 Ambient Temperature [ ℃] 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LVIR9033/TR2 Page 5/7 Recommended Soldering Conditions 1. Hand Solder Basic spec is ≦ 280℃ 3 sec one time only. 2. Wave Solder Soldering heat Max. 260 ℃ 245±5℃ within 5 sec Preheat 120 ~ 150℃ 120 ~ 180 sec 3-1. LEAD Reflow Solder Temp. (℃) 240 Cooling -5 ℃/sec Rising +5℃ /sec Preheat 150 120 60 ~ 120 sec Time 5sec 3-2 PB-Free Reflow Solder 1~5° C/sec Preheat 180~200° C 1~5° C/sec 260° C MaX. 10sec.Max Above 220° C 60 sec.Max. 120 sec.Max. Reflow Soldering should not be done more than two times. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LVIR9033/TR2 Page 6/7 Precautions For Use: Storage time: 1.The operation of Temperatures and RH are : 5 ℃~35℃,RH60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH60%, they should be treated at 60 ℃± 5 ℃fo r 15hrs. Drive Method: LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40 % of its desired value. Circuit model A Circuit model B LED LED (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LVIR9033/TR2 Page 7/7 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95 % 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. 1.Ta=105 ℃±5 ℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11