Renesas H2268 Renesas 16-bit single-chip microcomputer h8s family/h8s/2200 sery Datasheet

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User’s Manual
16
The revision list can be viewed directly by clicking the title page.
The revision list summarizes the locations of revisions and
additions. Details should always be checked by referring to the
relevant text.
H8S/2268 Group,
H8S/2264 Group
Hardware Manual
Renesas 16-Bit Single-Chip Microcomputer
H8S Family/H8S/2200 Series
H8S/2268
H8S/2266
H8S/2265
H8S/2264
H8S/2262
HD64F2268
HD64F2266
HD64F2265
HD6432264
HD6432264W
HD6432262
HD6432262W
Rev.5.00 2009.09
Notes regarding these materials
1. This document is provided for reference purposes only so that Renesas customers may select the appropriate
Renesas products for their use. Renesas neither makes warranties or representations with respect to the
accuracy or completeness of the information contained in this document nor grants any license to any
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this document.
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out of the use of any information in this document, including, but not limited to, product data, diagrams, charts,
programs, algorithms, and application circuit examples.
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applications such as the development of weapons of mass destruction or for the purpose of any other military
use. When exporting the products or technology described herein, you should follow the applicable export
control laws and regulations, and procedures required by such laws and regulations.
4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and
application circuit examples, is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas products listed in this
document, please confirm the latest product information with a Renesas sales office. Also, please pay regular
and careful attention to additional and different information to be disclosed by Renesas such as that disclosed
through our website. (http://www.renesas.com )
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assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information
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to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation
characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or
damages arising out of the use of Renesas products beyond such specified ranges.
10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific
characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use
conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and
injury or damage caused by fire in the event of the failure of a Renesas product, such as safety design for
hardware and software including but not limited to redundancy, fire control and malfunction prevention,
appropriate treatment for aging degradation or any other applicable measures. Among others, since the
evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or
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Rev. 5.00 Sep. 01, 2009 Page ii of l
REJ09B0071-0500
General Precautions in the Handling of MPU/MCU Products
The following usage notes are applicable to all MPU/MCU products from Renesas. For detailed usage notes
on the products covered by this manual, refer to the relevant sections of the manual. If the descriptions under
General Precautions in the Handling of MPU/MCU Products and in the body of the manual differ from each
other, the description in the body of the manual takes precedence.
1. Handling of Unused Pins
Handle unused pins in accord with the directions given under Handling of Unused Pins in
the manual.
⎯ The input pins of CMOS products are generally in the high-impedance state. In
operation with an unused pin in the open-circuit state, extra electromagnetic noise is
induced in the vicinity of LSI, an associated shoot-through current flows internally, and
malfunctions may occur due to the false recognition of the pin state as an input signal.
Unused pins should be handled as described under Handling of Unused Pins in the
manual.
2. Processing at Power-on
The state of the product is undefined at the moment when power is supplied.
⎯ The states of internal circuits in the LSI are indeterminate and the states of register
settings and pins are undefined at the moment when power is supplied.
In a finished product where the reset signal is applied to the external reset pin, the
states of pins are not guaranteed from the moment when power is supplied until the
reset process is completed.
In a similar way, the states of pins in a product that is reset by an on-chip power-on
reset function are not guaranteed from the moment when power is supplied until the
power reaches the level at which resetting has been specified.
3. Prohibition of Access to Reserved Addresses
Access to reserved addresses is prohibited.
⎯ The reserved addresses are provided for the possible future expansion of functions. Do
not access these addresses; the correct operation of LSI is not guaranteed if they are
accessed.
4. Clock Signals
After applying a reset, only release the reset line after the operating clock signal has
become stable. When switching the clock signal during program execution, wait until the
target clock signal has stabilized.
⎯ When the clock signal is generated with an external resonator (or from an external
oscillator) during a reset, ensure that the reset line is only released after full stabilization
of the clock signal. Moreover, when switching to a clock signal produced with an
external resonator (or by an external oscillator) while program execution is in progress,
wait until the target clock signal is stable.
5. Differences between Products
Before changing from one product to another, i.e. to one with a different type number,
confirm that the change will not lead to problems.
⎯ The characteristics of MPU/MCU in the same group but having different type numbers
may differ because of the differences in internal memory capacity and layout pattern.
When changing to products of different type numbers, implement a system-evaluation
test for each of the products.
Rev. 5.00 Sep. 01, 2009 Page iii of l
REJ09B0071-0500
Configuration of This Manual
This manual comprises the following items:
1. General Precautions in the Handling of MPU/MCU Products
2. Configuration of This Manual
3. Preface
4. Main Revisions for This Edition
The list of revisions is a summary of points that have been revised or added to earlier versions.
This does not include all of the revised contents. For details, see the actual locations in this
manual.
5. Contents
6. Overview
7. Description of Functional Modules
•
CPU and System-Control Modules
•
On-Chip Peripheral Modules
The configuration of the functional description of each module differs according to the
module. However, the generic style includes the following items:
i) Feature
ii) Input/Output Pin
iii) Register Description
iv) Operation
v) Usage Note
When designing an application system that includes this LSI, take notes into account. Each section
includes notes in relation to the descriptions given, and usage notes are given, as required, as the
final part of each section.
8. List of Registers
9. Electrical Characteristics
10. Appendix
11. Index
Rev. 5.00 Sep. 01, 2009 Page iv of l
REJ09B0071-0500
Preface
This LSI is a high-performance microcontroller (MCU) made up of the H8S/2000 CPU with an
internal 32-bit configuration as its core, and the peripheral functions required to configure a
system.
A single-power flash memory (F-ZTAT )* version and a masked-ROM version are available for
this LSI's ROM. The F-ZTAT version provides flexibility as it can be reprogrammed in no time to
cope with all situations from the early stages of mass production to full-scale mass production.
This is particularly applicable to application devices with specifications that will most probably
change.
TM
Note: * F-ZTAT is a trademark of Renesas Technology Corp.
Target Users: This manual was written for users who will be using the H8S/2268 Group and
H8S/2264 Group in the design of application systems. Target users are expected to
understand the fundamentals of electrical circuits, logical circuits, and
microcomputers.
Objective:
This manual was written to explain the hardware functions and electrical
characteristics of the H8S/2268 Group and H8S/2264 Group to the target users.
Refer to the H8S/2600 Series, H8S/2000 Series Programming Manual for a
detailed description of the instruction set.
Notes on Reading This Manual:
• In order to understand the overall functions of the chip
Read the manual according to the contents. This manual can be roughly categorized into parts
on the CPU, system control functions, peripheral functions and electrical characteristics.
• In order to understand the details of the CPU's functions
Read the H8S/2600 Series, H8S/2000 Series Programming Manual.
• In order to understand the details of a register when its name is known
Read the index that is the final part of the manual to find the page number of the entry on the
register. The addresses, bits, and initial values of the registers are summarized in section 24,
List of Registers.
Examples:
Register name:
The following notation is used for cases when the same or a
similar function, e.g. 16-bit timer pulse unit or serial
communication, is implemented on more than one channel:
XXX_N (XXX is the register name and N is the channel
number)
Bit order:
The MSB is on the left and the LSB is on the right.
Rev. 5.00 Sep. 01, 2009 Page v of l
REJ09B0071-0500
Number notation: Binary is B'xxxx, hexadecimal is H'xxxx, decimal is xxxx
Signal notation:
An overbar is added to a low-active signal: xxxx
List of On-Chip Peripheral Functions:
Group Name
H8S/2268 Group
H8S/2264 Group
Product Name
H8S/2268, H8S/2266,
H8S/2265
H8S/2264, H8S/2262
PC break controller (PBC)
×2
⎯
Data transfer controller (DTC)
×1
⎯
16-bit timer pulse unit (TPU)
×3
×2
8-bit timer (TMR_0 to TMR_3)
×4
×2
8-bit reload timer (TMR_4)
×4
⎯
Watch dog timer (WDT)
×2
×2
Serial communication interface (SCI)
×3
×3
I C bus interface (IIC)
×2
×1 (option)
A/D converter
×10
×10
D/A converter
×2
⎯
LCD controller/driver
40 SEG/4 COM
40 SEG/4 COM
DTMF generation circuit
×1
⎯
Ports
1, 3, 4, 7, 9, F, H, J to N
1, 3, 4, 7, 9, F, H, J to L
External interrupts
14
13
Interrupt priorities
8 levels
⎯
2
Related Manuals: The latest versions of all related manuals are available from our web site.
Please ensure you have the latest versions of all documents you require.
http://www.renesas.com/eng/
H8S/2268 Group, H8S/2264 Group manuals:
Document Title
Document No.
H8S/2268 Group, H8S/2264 Group Hardware Manual
This manual
H8S/2600 Series, H8S/2000 Series Programming Manual
REJ09B0139
Rev. 5.00 Sep. 01, 2009 Page vi of l
REJ09B0071-0500
User's Manuals for Development Tools:
Document Title
Document No.
H8S, H8/300 Series C/C++ Compiler, Assembler, Optimized Linkage Editor REJ10B0161
Compiler Package Ver. 6.01 User's Manual
High-performance Embedded Workshop User's Manual
REJ10J2000
Application Notes:
Document Title
Document No.
H8S, H8/300 Series C/C++ Compiler Package Application Note
REJ05B0464
Rev. 5.00 Sep. 01, 2009 Page vii of l
REJ09B0071-0500
Rev. 5.00 Sep. 01, 2009 Page viii of l
REJ09B0071-0500
Main Revisions for This Edition
Item
Page
Revision (See Manual for Details)
1.4 Pin Functions
9
Table amended
Table 1.1 Pin
Functions
2.6 Instruction Set
29
Table 2.1 Instruction
Classification
Type
Symbol
Pin NO.
I/O
Function
A/D
converter,
D/A
converter*1
AVcc
54
Input
Power supply pin for the A/D converter, D/A
converter*1 and DTMF generation circuit*1. If
none of the A/D converter, D/A converter*1 and
DTMF generation circuit*1 is used, connect this
pin to the system power supply (Vcc level).
Vref
53
Input
Reference voltage input pin for the A/D converter
and D/A converter*1. If neither the A/D converter
nor D/A converter*1 is used, connect this pin to
the system power supply (Vcc level).
Table amended
Function
Instructions
Size
Types
Data transfer
MOV
POP*1, PUSH*1
B/W/L
5
W/L
LDM*5, STM*5
MOVFPE*3, MOVTPE*3
L
B
Note added
Notes: 5. Only register ER0 to ER6 should be used when using
the STM/LDM instruction.
2.6.1 Table of
31
Instructions Classified
by Function
Table 2.3 Data
Transfer Instructions
Table amended
Instruction
LDM*2
Size*
Function
L
@SP+
Rn (register list)
Pops two or more general registers from the stack.
STM*2
L
Rn (register list)
@–SP
Pushes two or more general registers onto the stack.
1
Note added
Notes: 2. Only register ER0 to ER6 should be used when using
the STM/LDM instruction.
4.8 Usage Note
66
Figure amended
Figure 4.3 Operation
when SP Value Is Odd
CCR
SP
R1L
SP
H'FFFEFA
H'FFFEFB
PC
PC
H'FFFEFC
H'FFFEFD
SP
SP set to H'FFFEFF
H'FFFEFF
TRAPA instruction executed
MOV.B R1L, @-ER7 executed
Data saved above SP
Contents of CCR lost
Rev. 5.00 Sep. 01, 2009 Page ix of l
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Item
Page
Revision (See Manual for Details)
5.6.5 IRQ Interrupt
102
5.6.5 added
5.6.6 NMI Interrupt
Usage Notes
102
5.6.6 added
6.3.4 Operation in
Transitions to PowerDown Modes
107
8.2.5 DTC Transfer
Count Register A
(CRA)
119
8.5 Operation
127
Description deleted
• When the SLEEP instruction causes a transition from high
speed
mode to subactive mode (figure 6.2 (B)).
Description amended
In repeat mode or block transfer mode, the CRA is divided into
two parts: the upper 8 bits (CRAH) and the lower 8 bits (CRAL).
In repeat mode, CRAH holds the number of transfers while
CRAL functions as an 8-bit transfer counter (1 to 256). In block
transfer mode, CRAH holds the block size while CRAL functions
as an 8-bit block size counter (1 to 256). CRAL is decremented
by 1 every time data is transferred, and the contents of CRAH
are sent when the count reaches H'00. This operation is
repeated.
Figure amended
Figure 8.5 Flowchart
of DTC Operation
Transfer Counter = 0
or DISEL = 1
Yes
No
Clear an activeation flag
Clear DTCER
End
Interupt exception
handling
*
Note: * For details, see section related to each peripheral module.
9.1.1 Port 1 Data
Direction Register
(P1DDR)
145
Description added
P1DDR specifies input or output of the port 1 pins using the
individual bits. P1DDR cannot be read; if it is, an undefined
value will be read.
The value of this register when read is undefined after a bit
manipulation instruction is executed. To prevent undefined read
values, do not use bit manipulation instructions to write to this
register. For details, see section 2.9.4, Access Methods for
Registers with Write-Only Bits.
Rev. 5.00 Sep. 01, 2009 Page x of l
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Item
Page
Revision (See Manual for Details)
9.2.1 Port 3 Data
Direction Register
(P3DDR)
151
Description added
9.2.5 Pin Functions
155
•
P3DDR cannot be read; if it is, an undefined value will be read.
The value of this register when read is undefined after a bit
manipulation instruction is executed. To prevent undefined read
values, do not use bit manipulation instructions to write to this
register. For details, see section 2.9.4, Access Methods for
Registers with Write-Only Bits.
Description deleted
The pin function is switched as shown below according to the
combination of the ICE bit in ICCR_0 of IIC_0,
RE bit in SCR
of SCI_1 and the P34DDR bit.
P34/RxD1/SDA0
Table amended
ICE
0
RE
P34DDR
Pin functions
9.4.1 Port 7 Data
Direction Register
(P7DDR)
158
0
1
1
0
1
P34 input pin
P34 output pin
RxD1 input pin
SDAO I/O pin
Description added
P7DDR specifies input or output of the port 7 pins using the
individual bits. P7DDR cannot be read; if it is, an undefined
value will be read.
The value of this register when read is undefined after a bit
manipulation instruction is executed. To prevent undefined read
values, do not use bit manipulation instructions to write to this
register. For details, see section 2.9.4, Access Methods for
Registers with Write-Only Bits.
9.6.1 Port F Data
Direction Register
(PFDDR)
163
Description added
PFDDR specifies input or output the port F pins using the
individual bits. PFDDR cannot be read; if it is, an undefined
value will be read.
The value of this register when read is undefined after a bit
manipulation instruction is executed. To prevent undefined read
values, do not use bit manipulation instructions to write to this
register. For details, see section 2.9.4, Access Methods for
Registers with Write-Only Bits.
Rev. 5.00 Sep. 01, 2009 Page xi of l
REJ09B0071-0500
Item
Page
Revision (See Manual for Details)
9.7.1 Port H Data
Direction Register
(PHDDR)
165
Description added
PHDDR specifies input or output the port H pins using the
individual bits. PHDDR cannot be read; if it is, an undefined
value will be read.
The value of this register when read is undefined after a bit
manipulation instruction is executed. To prevent undefined read
values, do not use bit manipulation instructions to write to this
register. For details, see section 2.9.4, Access Methods for
Registers with Write-Only Bits.
9.8.1 Port J Data
Direction Register
(PJDDR)
170
Description added
PJDDR specifies input or output the port J pins using the
individual bits. PJDDR cannot be read; if it is, an undefined
value will be read.
The value of this register when read is undefined after a bit
manipulation instruction is executed. To prevent undefined read
values, do not use bit manipulation instructions to write to this
register. For details, see section 2.9.4, Access Methods for
Registers with Write-Only Bits.
9.9.1 Port K Data
Direction Register
(PKDDR)
174
Description added
PKDDR specifies input or output the port K pins using the
individual bits. PKDDR cannot be read; if it is, an undefined
value will be read.
The value of this register when read is undefined after a bit
manipulation instruction is executed. To prevent undefined read
values, do not use bit manipulation instructions to write to this
register. For details, see section 2.9.4, Access Methods for
Registers with Write-Only Bits.
9.10.1 Port L Data
Direction Register
(PLDDR)
176
Description added
PLDDR specifies input or output of the port L pins using the
individual bits. PLDDR cannot be read; if it is, an undefined
value will be read.
The value of this register when read is undefined after a bit
manipulation instruction is executed. To prevent undefined read
values, do not use bit manipulation instructions to write to this
register. For details, see section 2.9.4, Access Methods for
Registers with Write-Only Bits.
Rev. 5.00 Sep. 01, 2009 Page xii of l
REJ09B0071-0500
Item
Page
Revision (See Manual for Details)
9.11.1 Port M Data
Direction Register
(PMDDR)
178
Description added
PMDDR specifies input or output of the port M pins using the
individual bits. PMDDR cannot be read; if it is, an undefined
value will be read.
The value of this register when read is undefined after a bit
manipulation instruction is executed. To prevent undefined read
values, do not use bit manipulation instructions to write to this
register. For details, see section 2.9.4, Access Methods for
Registers with Write-Only Bits.
9.12.1 Port N Data
Direction Register
(PNDDR)
181
Description added
PNDDR specifies input or output of the port N pins using the
individual bits. PNDDR cannot be read; if it is, an undefined
value will be read.
The value of this register when read is undefined after a bit
manipulation instruction is executed. To prevent undefined read
values, do not use bit manipulation instructions to write to this
register. For details, see section 2.9.4, Access Methods for
Registers with Write-Only Bits.
9.13 Handling of
Unused Pins
183
9.13 added
Table 9.3 Examples
of Ways to Handle
Unused Input Pins
Table added
10.3.1 Timer Control 192
Register (TCR)
Table amended
Bit
Bit Name
Initial
value
R/W
Description
4
CKEG1
0
R/W
Clock Edge 0 and 1
3
CKEG0
0
R/W
These bits select the input clock edge. When the input
clock is counted using both edges, the input clock period
is halved (e.g. φ/4 both edges = φ/2 rising edge). Internal
clock edge selection is valid when the input clock is φ/4 or
slower. If the input clock is φ/1, this setting is ignored and
count at falling edge of φ is selected. In the H8S/2268
Group, if phase counting mode is used on channels 1 and
2, this setting is ignored and the phase counting mode
setting has priority.
00: Count at rising edge
01: Count at falling edge
1X: Count at both edges
Legend:
11.8.1 Setting
Module Stop Mode
275
X: Don’t care
11.8.1 added
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12.2.1 Timer
Counter (TCNT)
291
Description added
TCNT is an 8-bit readable/writable up-counter. TCNT is
initialized to H'00 when the TME bit in TCSR is cleared to 0.
To initialize TCNT to H’00 while the timer is operating, write H’00
to TCNT directly. See 12.5.7, Notes on Initializing TCNT by
Using the TME Bit.
12.5.7 Notes on
Initializing TCNT by
Using the TME Bit
302
12.5.7 added
13.3.7 Serial Status
Register (SSR)
320
Table amended
Bit
Bit Name
Initial
Value
R/W
2
TEND
1
R
Description
Transmit End
Indicates that transmission has been ended.
[Setting conditions]
• When the TE bit in SCR is 0
• When TDRE = 1 at transmission of the last bit of a
1-byte serial transmit character
[Clearing conditions]
• When 0 is written to TDRE after reading TDRE = 1
2
• When the DTC* is activated by a TXI interrupt
request and transfer transmission data to TDR
(H8S/2268 Group only)
13.3.7 Serial Status
Register (SSR)
321
Table amended
Bit
Bit Name
Initial
Value
R/W
7
TDRE
1
R/(W)*1 Transmit Data Register Empty
Description
Indicates whether TDR contains transmit data.
[Setting conditions]
• When the TE bit in SCR is 0
• When data is transferred from TDR to TSR and data
can be written to TDR
[Clearing conditions]
• When 0 is written to TDRE after reading TDRE = 1
2
• When the DTC* is activated by a TXI interrupt
request and writes data to TDR (H8S/2268 Group
only)
6
RDRF
0
R/(W)*1 Receive Data Register Full
Indicates that the received data is stored in RDR.
[Setting condition]
When serial reception ends normally and receive data is
transferred from RSR to RDR
[Clearing conditions]
• When 0 is written to RDRF after reading RDRF = 1
2
• When the DTC* is activated by an RXI interrupt and
transferred data from RDR (H8S/2268 Group only)
The RDRF flag is not affected and retains their previous
values when the RE bit in SCR is cleared to 0.
If reception of the next data is completed while the RDRF
flag is still set to 1, an overrun error will occur and the
receive data will be lost.
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13.3.7 Serial Status
Register (SSR)
322
Table amended
Bit
Bit Name
Initial
Value
R/W
5
ORER
0
R/(W)*1 Overrun Error
Description
Indicates that an overrun error occurred during reception,
causing abnormal termination.
[Setting condition]
When the next serial reception is completed while RDRF
=1
The receive data prior to the overrun error is retained in
RDR, and the data received subsequently is lost. Also,
subsequent serial cannot be continued while the ORER
flag is set to 1. In clocked synchronous mode, serial
transmission cannot be continued, either.
[Clearing condition]
When 0 is written to ORER after reading ORER = 1
The ORER flag is not affected and retains its previous
state when the RE bit in SCR is cleared to 0.
4
ERS
0
R/(W)*1 Error Signal Status
Indicates that the status of an error, signal 1 returned from
the reception side at reception
[Setting condition]
When the low level of the error signal is sampled
[Clearing condition]
When 0 is written to ERS after reading ERS = 1
The ERS flag is not affected and retains its previous state
when the RE bit in SCR is cleared to 0.
323
Table amended
Bit
Bit Name
Initial
Value
R/W
3
PER
0
R/(W)*1 Parity Error
Description
Indicates that a parity error occurred during reception
using parity addition in asynchronous mode, causing
abnormal termination.
[Setting condition]
When a parity error is detected during reception
If a parity error occurs, the receive data is transferred to
RDR but the RDRF flag is not set. Also, subsequent serial
reception cannot be continued while the PER flag is set to
1. In clocked synchronous mode, serial transmission
cannot be continued, either.
[Clearing condition]
When 0 is written to PER after reading PER = 1
The PER flag is not affected and retains its previous state
when the RE bit in SCR is cleared to 0.
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13.3.7 Serial Status
Register (SSR)
324
Table amended
Bit
Bit Name
Initial
Value
R/W
2
TEND
1
R
Description
Transmit End
This bit is set to 1 when no error signal has been sent
back from the receiving end and the next transmit data is
ready to be transferred to TDR.
[Setting conditions]
• When the TE bit in SCR is 0 and the ERS bit is also 0
• When the ERS bit is 0 and the TDRE bit is 1 after the
specified interval following transmission of 1-byte
data.
The timing of bit setting differs according to the register
setting as follows:
When GM = 0 and BLK = 0, 12.5 etu after transmission
starts
When GM = 0 and BLK = 1, 11.5 etu after transmission
starts
When GM = 1 and BLK = 0, 11.0 etu after transmission
starts
When GM = 1 and BLK = 1, 11.0 etu after transmission
starts
[Clearing conditions]
• When 0 is written to TDRE after reading TDRE = 1
2
• When the DTC* is activated by a TXI interrupt and
transfers transmission data to TDR (H8S/2268 Group
only)
Note added
Notes: 2. This bit is cleared by DTC only when DISEL = 0 with
the transfer counter other than 0.
14.4.6 Slave
Transmit Operation
423
Description added
1. Initialize slave receive mode and wait for slave address
reception.
When making initial settings for slave receive mode, set the
ACKE bit in ICCR to 1. This is necessary in order to enable
reception of the acknowledge bit after entering slave transmit
mode.
Description amended
4. The master device drives SDA low at the 9th clock pulse, and
returns an acknowledge signal.
The master device drives SDA low at the 9th clock pulse, and
returns an acknowledge signal. This acknowledge signal is
stored in the ACKB bit in ICSR if the ACKE bit in has been
set to 1, so the ACKB bit can be used to determine whether
the transfer operation was performed successfully.
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14.4.6 Slave
Transmit Operation
424
Description added
10. When the stop condition is detected, that is, when SDA is
changed from low to high when SCL is high, the BBSY flag
in ICCR is cleared to 0 and the STOP flag in ICSR is set to
1. At the same time, the IRIC flag is set to 1. If the IRIC flag
has been set, it is cleared to 0.
To restart slave transmit mode operation, make the initial
settings once again.
15.2 Input/Output Pins 445
Table amended
Table 15.1 Pin
Configuration
Pin Name
Symbol
I/O
Function
Analog input pin 0
AN0*
Input
Group 0 analog input pins
Analog input pin 1
AN1*
Input
Analog input pin 2
AN2
Input
Analog input pin 3
AN3
Input
Note added
Note: * AN0 and AN1 can be used only when Vcc = AVcc.
15.8.4 Range of
460
Analog Power Supply
and Other Pin
Settings
Description added
•
20.6.1 Boot Mode
520
Table replaced
600
Table amended
Relationship between AVcc, AVss and Vcc, Vss.
Set AVss = Vss as the relationship between AVcc, AVss and
Vcc, Vss. If the A/D converter is not used, the AVcc and
AVss pins must not be left open. In addition, analog input
pins AN0 and AN1 can be used only when Vcc = AVcc.
Table 20.4 Boot
Mode Operation
25.2.2 DC
Characteristics
Table 25.2 DC
Characteristics (1)
Item
Input high
voltage
Symbol
Min.
Max.
Unit
VIH
VCC × 0.9
VCC + 0.3
V
EXTAL, Ports 1, 3,
7, F, J to N,
PH0 to PH3
VCC × 0.8
VCC + 0.3
V
Ports 4* , 9, PH7
VCC × 0.8
AVCC + 0.3* V
RES, STBY, NMI,
FWE, MD2, MD1
4
Typ.
Test Conditions
4
Note added
Notes: 4. When Vcc < AVcc, the maximum value for P40 and
P41 is Vcc + 0.3 V.
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25.2.2 DC
Characteristics
602
Table amended
Item
Input high
voltage
Table 25.2 DC
Characteristics (2)
Symbol
Min.
Max.
Unit
VIH
VCC × 0.9
VCC + 0.3
V
EXTAL, Ports 1, 3,
7, F, J to N, PH0 to
PH3
VCC × 0.8
VCC + 0.3
V
Ports 4* , 9, PH7
VCC × 0.8
VCC + 0.3*
RES, STBY,NMI,
FWE, MD2, MD1
4
603
Typ.
4
Test Conditions
V
Note added
Notes: 4. When Vcc < AVcc, the maximum value for P40 and
P41 is Vcc + 0.3 V.
25.2.4 A/D
Conversion
Characteristics
615
Table condition amended
Condition A (F-ZTAT version): VCC = 3.0 V to 5.5 V*, AVCC = 2.7
V to 5.5 V*, Vref = 2.7 V to AVCC, VSS = AVSS = 0 V, φ = 2 to 13.5
MHz, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to
+85°C (wide-range specifications)
Condition C (F-ZTAT version): VCC = 4.0 V to 5.5 V*, AVCC = 4.0
V to 5.5 V*, Vref = 4.0 V to AVCC, VSS = AVSS = 0 V, φ = 10 to 20.5
MHz, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to
+85°C (wide-range specifications)
Table 25.9 A/D
Conversion
Characteristics
Note added
Note: * AN0 and AN1 can be used only when Vcc = AVcc.
25.3.2 DC
Characteristics
622
Table amended
Item
Input high
voltage
Table 25.15 DC
Characteristics (1)
RES, STBY, NMI,
FWE, MD2, MD1
Symbol
Min.
Max.
Unit
VIH
VCC × 0.9
VCC + 0.3
V
VCC × 0.8
VCC + 0.3
V
VCC × 0.8
4
AVCC + 0.3* V
EXTAL, Ports 1, 3,
7, F, H, J to L
4
Ports 4* , 9
623
Typ.
Test Conditions
Note added
Notes: 4. When Vcc < AVcc, the maximum value for P40 and
P41 is Vcc + 0.3 V.
25.3.2 DC
Characteristics
624
Table amended
Item
Input high
voltage
Table 25.15 DC
Characteristics (2)
Symbol
Min.
Max.
Unit
VIH
VCC × 0.9
VCC + 0.3
V
EXTAL, Ports 1, 3,
7, F, H, J to L
VCC × 0.8
VCC + 0.3
Ports 4* , 9
VCC × 0.8
AVCC + 0.3* V
RES, STBY, NMI,
FWE, MD2, MD1
4
625
Typ.
Test Conditions
V
4
Note added
Notes: 4. When Vcc < AVcc, the maximum value for P40 and
P41 is Vcc + 0.3 V.
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25.3.4 A/D
Conversion
Characteristics
636
Table condition amended
Table 25.22 A/D
Conversion
Characteristics
Condition B (Masked-ROM version): VCC = 2.7 V to 5.5 V*, AVCC
= 2.7 V to 5.5 V*, Vref = 2.7 V to AVCC, VSS = AVSS = 0 V, φ = 2 to
13.5 MHz, Ta = –20°C to +75°C (regular specifications), Ta = –
40°C to +85°C (wide-range specifications)
Condition D (Masked-ROM version): VCC = 4.0 V to 5.5 V*, AVCC
= 4.0 V to 5.5 V*, Vref = 4.0 V to AVCC, VSS = AVSS = 0 V, φ = 10 to
20.5 MHz, Ta = –20°C to +75°C (regular specifications), Ta = –
40°C to +85°C (wide-range specifications)
Note added
Note: * AN0 and AN1 can be used only when Vcc = AVcc.
Appendix B Product
Codes
646 to 649Packages amended
(Before) FP-100B → (After) FP-100B, FP-100BV
(Before) TFP-100B → (After) TFP-100B, TFP-100BV
(Before) TFP-100G → (After) TFP-100G, TFP-100GV
Rev. 5.00 Sep. 01, 2009 Page xix of l
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All trademarks and registered trademarks are the property of their respective owners.
Rev. 5.00 Sep. 01, 2009 Page xx of l
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Contents
Section 1 Overview...............................................................................................1
1.1
1.2
1.3
1.4
Features .................................................................................................................................1
Internal Block Diagram.........................................................................................................3
Pin Arrangement ...................................................................................................................5
Pin Functions ........................................................................................................................7
Section 2 CPU..................................................................................................... 13
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
Features ...............................................................................................................................13
2.1.1 Differences between H8S/2600 CPU and H8S/2000 CPU ....................................14
2.1.2 Differences from H8/300 CPU ..............................................................................15
2.1.3 Differences from H8/300H CPU............................................................................15
CPU Operating Modes ........................................................................................................16
2.2.1 Normal Mode.........................................................................................................16
2.2.2 Advanced Mode.....................................................................................................18
Address Space.....................................................................................................................20
Register Configuration........................................................................................................21
2.4.1 General Registers ...................................................................................................22
2.4.2 Program Counter (PC) ...........................................................................................23
2.4.3 Extended Control Register (EXR) (H8S/2268 Group Only)..................................23
2.4.4 Condition-Code Register (CCR) ............................................................................24
2.4.5 Initial Values of CPU Registers .............................................................................25
Data Formats.......................................................................................................................26
2.5.1 General Register Data Formats ..............................................................................26
2.5.2 Memory Data Formats ...........................................................................................28
Instruction Set .....................................................................................................................29
2.6.1 Table of Instructions Classified by Function .........................................................30
2.6.2 Basic Instruction Formats ......................................................................................39
Addressing Modes and Effective Address Calculation .......................................................40
2.7.1 Register Direct⎯Rn...............................................................................................41
2.7.2 Register Indirect⎯@ERn ......................................................................................41
2.7.3 Register Indirect with Displacement⎯@(d:16, ERn) or @(d:32, ERn)................41
2.7.4 Register Indirect with Post-Increment or Pre-Decrement⎯@ERn+ or @-ERn ....42
2.7.5 Absolute Address⎯@aa:8, @aa:16, @aa:24, or @aa:32......................................42
2.7.6 Immediate⎯#xx:8, #xx:16, or #xx:32 ...................................................................43
2.7.7 Program-Counter Relative⎯@(d:8, PC) or @(d:16, PC)......................................43
2.7.8 Memory Indirect⎯@@aa:8 ..................................................................................43
2.7.9 Effective Address Calculation ...............................................................................44
Processing States.................................................................................................................47
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2.9
Usage Notes ........................................................................................................................49
2.9.1 TAS Instruction......................................................................................................49
2.9.2 STM/LDM Instruction ...........................................................................................49
2.9.3 Bit Manipulation Instructions ................................................................................49
2.9.4 Access Method for Registers with Write-Only Bits...............................................51
Section 3 MCU Operating Modes ...................................................................... 55
3.1
3.2
3.3
3.4
Operating Mode Selection ..................................................................................................55
Register Description............................................................................................................56
3.2.1 Mode Control Register (MDCR) ...........................................................................56
Operating Mode ..................................................................................................................56
Address Map .......................................................................................................................57
Section 4 Exception Handling ............................................................................ 59
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
Exception Handling Types and Priority ..............................................................................59
Exception Sources and Exception Vector Table .................................................................60
Reset....................................................................................................................................61
4.3.1 Reset Exception Handling......................................................................................61
4.3.2 Interrupts after Reset..............................................................................................62
4.3.3 State of On-Chip Peripheral Modules after Reset Release.....................................62
Traces (Supported Only by the H8S/2268 Group)..............................................................63
Interrupts .............................................................................................................................63
Trap Instruction...................................................................................................................64
Stack Status after Exception Handling................................................................................65
Usage Note..........................................................................................................................65
Section 5 Interrupt Controller............................................................................. 67
5.1
5.2
5.3
5.4
Features ...............................................................................................................................67
Input/Output Pins ................................................................................................................70
Register Descriptions ..........................................................................................................71
5.3.1 System Control Register (SYSCR) ........................................................................71
5.3.2 Interrupt Priority Registers A to G, I to M, and O (IPRA to IPRG, IPRI to
IPRM, IPRO) (H8S/2268 Group Only) .................................................................73
5.3.3 IRQ Enable Register (IER) ....................................................................................74
5.3.4 IRQ Sense Control Registers H and L (ISCRH and ISCRL) .................................75
5.3.5 IRQ Status Register (ISR)......................................................................................77
5.3.6 Wakeup Interrupt Request Register (IWPR)..........................................................80
5.3.7 Interrupt Enable Register 1 (IENR1) .....................................................................80
Interrupt Sources.................................................................................................................81
5.4.1 External Interrupts .................................................................................................81
5.4.2 Internal Interrupts...................................................................................................84
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5.5
5.6
5.4.3 Interrupt Exception Handling Vector Table...........................................................84
Operation.............................................................................................................................88
5.5.1 Interrupt Control Modes and Interrupt Operation ..................................................88
5.5.2 Interrupt Control Mode 0 .......................................................................................92
5.5.3 Interrupt Control Mode 2 (H8S/2268 Group Only) ...............................................94
5.5.4 Interrupt Exception Handling Sequence ................................................................95
5.5.5 Interrupt Response Times ......................................................................................97
5.5.6 DTC Activation by Interrupt (H8S/2268 Group Only) ..........................................98
Usage Notes ...................................................................................................................... 100
5.6.1 Contention between Interrupt Generation and Disabling..................................... 100
5.6.2 Instructions that Disable Interrupts ...................................................................... 101
5.6.3 When Interrupts Are Disabled ............................................................................. 101
5.6.4 Interrupts during Execution of EEPMOV Instruction.......................................... 102
5.6.5 IRQ Interrupt........................................................................................................ 102
5.6.6 NMI Interrupt Usage Notes.................................................................................. 102
Section 6 PC Break Controller (PBC) ...............................................................103
6.1
6.2
6.3
6.4
Features ............................................................................................................................. 103
Register Descriptions ........................................................................................................ 104
6.2.1 Break Address Register A (BARA) ..................................................................... 104
6.2.2 Break Address Register B (BARB)...................................................................... 105
6.2.3 Break Control Register A (BCRA) ...................................................................... 105
6.2.4 Break Control Register B (BCRB)....................................................................... 106
Operation........................................................................................................................... 106
6.3.1 PC Break Interrupt Due to Instruction Fetch ....................................................... 106
6.3.2 PC Break Interrupt Due to Data Access............................................................... 107
6.3.3 Notes on PC Break Interrupt Handling ................................................................ 107
6.3.4 Operation in Transitions to Power-Down Modes ................................................ 107
6.3.5 When Instruction Execution Is Delayed by One State ......................................... 108
Usage Notes ...................................................................................................................... 109
6.4.1 Module Stop Mode Setting .................................................................................. 109
6.4.2 PC Break Interrupts.............................................................................................. 109
6.4.3 CMFA and CMFB ............................................................................................... 109
6.4.4 PC Break Interrupt when DTC Is Bus Master...................................................... 109
6.4.5 PC Break Set for Instruction Fetch at Address Following BSR, JSR, JMP,
TRAPA, RTE, or RTS Instruction ....................................................................... 109
6.4.6 I Bit Set by LDC, ANDC, ORC, or XORC Instruction ....................................... 110
6.4.7 PC Break Set for Instruction Fetch at Address Following Bcc Instruction.......... 110
6.4.8 PC Break Set for Instruction Fetch at Branch Destination Address of
Bcc Instruction ..................................................................................................... 110
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Section 7 Bus Controller....................................................................................111
7.1
7.2
Basic Timing ..................................................................................................................... 111
7.1.1 On-Chip Memory Access Timing (ROM, RAM) ................................................ 111
7.1.2 On-Chip Peripheral Module Access Timing (H'FFFDAC to H'FFFFBF) ........... 112
7.1.3 On-Chip Peripheral Module Access Timing (H'FFFC30 to H'FFFCA3)............. 112
Bus Arbitration (H8S/2268 Group Only).......................................................................... 113
7.2.1 Order of Priority of the Bus Masters.................................................................... 113
7.2.2 Bus Transfer Timing ............................................................................................ 114
7.2.3 Resets and the Bus Controller.............................................................................. 114
Section 8 Data Transfer Controller (DTC) ........................................................115
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
Features ............................................................................................................................. 115
Register Descriptions ........................................................................................................ 116
8.2.1 DTC Mode Register A (MRA) ............................................................................ 117
8.2.2 DTC Mode Register B (MRB)............................................................................. 118
8.2.3 DTC Source Address Register (SAR).................................................................. 119
8.2.4 DTC Destination Address Register (DAR).......................................................... 119
8.2.5 DTC Transfer Count Register A (CRA) .............................................................. 119
8.2.6 DTC Transfer Count Register B (CRB)............................................................... 119
8.2.7 DTC Enable Register (DTCER) .......................................................................... 120
8.2.8 DTC Vector Register (DTVECR)........................................................................ 121
Activation Sources ............................................................................................................ 122
Location of Register Information and DTC Vector Table ................................................ 123
Operation........................................................................................................................... 126
8.5.1 Normal Mode....................................................................................................... 127
8.5.2 Repeat Mode ........................................................................................................ 128
8.5.3 Block Transfer Mode ........................................................................................... 129
8.5.4 Chain Transfer ..................................................................................................... 131
8.5.5 Interrupts.............................................................................................................. 132
8.5.6 Operation Timing................................................................................................. 132
8.5.7 Number of DTC Execution States ....................................................................... 134
Procedures for Using DTC................................................................................................ 135
8.6.1 Activation by Interrupt......................................................................................... 135
8.6.2 Activation by Software ........................................................................................ 135
Examples of Use of DTC .................................................................................................. 136
8.7.1 Normal Mode....................................................................................................... 136
8.7.2 Software Activation ............................................................................................. 136
Usage Notes ...................................................................................................................... 137
8.8.1 Module Stop Mode Setting .................................................................................. 137
8.8.2 On-Chip RAM ..................................................................................................... 137
8.8.3 DTCE Bit Setting................................................................................................. 137
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Section 9 I/O Ports .............................................................................................139
9.1
9.2
9.3
9.4
9.5
9.6
9.7
9.8
Port 1................................................................................................................................. 145
9.1.1 Port 1 Data Direction Register (P1DDR)............................................................. 145
9.1.2 Port 1 Data Register (P1DR)................................................................................ 146
9.1.3 Port 1 Register (PORT1)...................................................................................... 146
9.1.4 Pin Functions ....................................................................................................... 147
Port 3................................................................................................................................. 151
9.2.1 Port 3 Data Direction Register (P3DDR)............................................................. 151
9.2.2 Port 3 Data Register (P3DR)................................................................................ 152
9.2.3 Port 3 Register (PORT3)...................................................................................... 153
9.2.4 Port 3 Open Drain Control Register (P3ODR)..................................................... 153
9.2.5 Pin Functions ....................................................................................................... 154
Port 4................................................................................................................................. 157
9.3.1 Port 4 Register (PORT4)...................................................................................... 157
9.3.2 Pin Functions ....................................................................................................... 157
Port 7................................................................................................................................. 157
9.4.1 Port 7 Data Direction Register (P7DDR)............................................................. 158
9.4.2 Port 7 Data Register (P7DR)................................................................................ 158
9.4.3 Port 7 Register (PORT7)...................................................................................... 159
9.4.4 Pin Functions ....................................................................................................... 159
Port 9................................................................................................................................. 162
9.5.1 Port 9 Register (PORT9)...................................................................................... 162
9.5.2 Pin Functions ....................................................................................................... 162
Port F................................................................................................................................. 162
9.6.1 Port F Data Direction Register (PFDDR) ............................................................ 163
9.6.2 Port F Data Register (PFDR) ............................................................................... 163
9.6.3 Port F Register (PORTF) ..................................................................................... 164
9.6.4 Pin Functions ....................................................................................................... 164
Port H................................................................................................................................ 165
9.7.1 Port H Data Direction Register (PHDDR) ........................................................... 165
9.7.2 Port H Data Register (PHDR) .............................................................................. 166
9.7.3 Port H Register (PORTH) .................................................................................... 166
9.7.4 Pin Functions ....................................................................................................... 166
Port J ................................................................................................................................. 169
9.8.1 Port J Data Direction Register (PJDDR).............................................................. 170
9.8.2 Port J Data Register (PJDR)................................................................................. 170
9.8.3 Port J Register (PORTJ)....................................................................................... 171
9.8.4 Port J Pull-Up MOS Control Register (PJPCR)................................................... 171
9.8.5 Wakeup Control Register (WPCR)...................................................................... 172
9.8.6 Pin Functions ....................................................................................................... 172
9.8.7 Input Pull-Up MOS Function............................................................................... 173
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9.9
9.10
9.11
9.12
9.13
Port K................................................................................................................................ 173
9.9.1 Port K Data Direction Register (PKDDR) ........................................................... 174
9.9.2 Port K Data Register (PKDR) .............................................................................. 174
9.9.3 Port K Register (PORTK) .................................................................................... 175
9.9.4 Pin Functions ....................................................................................................... 175
Port L ................................................................................................................................ 176
9.10.1 Port L Data Direction Register (PLDDR) ............................................................ 176
9.10.2 Port L Data Register (PLDR)............................................................................... 177
9.10.3 Port L Register (PORTL)..................................................................................... 177
9.10.4 Pin Functions ....................................................................................................... 178
Port M (H8S/2268 Group Only) ....................................................................................... 178
9.11.1 Port M Data Direction Register (PMDDR).......................................................... 178
9.11.2 Port M Data Register (PMDR)............................................................................. 179
9.11.3 Port M Register (PORTM)................................................................................... 180
9.11.4 Pin Functions ....................................................................................................... 180
Port N (H8S/2268 Group Only) ........................................................................................ 181
9.12.1 Port N Data Direction Register (PNDDR) ........................................................... 181
9.12.2 Port N Data Register (PNDR) .............................................................................. 182
9.12.3 Port N Register (PORTN) .................................................................................... 182
9.12.4 Pin Functions ....................................................................................................... 183
Handling of Unused Pins .................................................................................................. 183
Section 10 16-Bit Timer Pulse Unit (TPU) .......................................................185
10.1 Features ............................................................................................................................. 185
10.2 Input/Output Pins .............................................................................................................. 190
10.3 Register Descriptions ........................................................................................................ 191
10.3.1 Timer Control Register (TCR) ............................................................................. 192
10.3.2 Timer Mode Register (TMDR) ............................................................................ 195
10.3.3 Timer I/O Control Register (TIOR) ..................................................................... 197
10.3.4 Timer Interrupt Enable Register (TIER) .............................................................. 207
10.3.5 Timer Status Register (TSR)................................................................................ 209
10.3.6 Timer Counter (TCNT)........................................................................................ 213
10.3.7 Timer General Register (TGR) ............................................................................ 213
10.3.8 Timer Start Register (TSTR)................................................................................ 214
10.3.9 Timer Synchro Register (TSYR) ......................................................................... 215
10.4 Interface to Bus Master ..................................................................................................... 216
10.4.1 16-Bit Registers ................................................................................................... 216
10.4.2 8-Bit Registers ..................................................................................................... 216
10.5 Operation........................................................................................................................... 218
10.5.1 Basic Functions.................................................................................................... 218
10.5.2 Synchronous Operation........................................................................................ 223
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10.6
10.7
10.8
10.9
10.10
10.5.3 Buffer Operation (H8S/2268 Group Only) .......................................................... 225
10.5.4 PWM Modes ........................................................................................................ 228
10.5.5 Phase Counting Mode (H8S/2268 Group Only) .................................................. 233
Interrupt Sources............................................................................................................... 238
DTC Activation (H8S/2268 Group Only)......................................................................... 239
A/D Converter Activation ................................................................................................. 239
Operation Timing.............................................................................................................. 240
10.9.1 Input/Output Timing ............................................................................................ 240
10.9.2 Interrupt Signal Timing........................................................................................ 244
Usage Notes ...................................................................................................................... 247
10.10.1 Module Stop Mode Setting .................................................................................. 247
10.10.2 Input Clock Restrictions ...................................................................................... 247
10.10.3 Caution on Period Setting .................................................................................... 248
10.10.4 Contention between TCNT Write and Clear Operations..................................... 248
10.10.5 Contention between TCNT Write and Increment Operations.............................. 249
10.10.6 Contention between TGR Write and Compare Match ......................................... 250
10.10.7 Contention between Buffer Register Write and Compare Match
(H8S/2268 Group Only) ...................................................................................... 251
10.10.8 Contention between TGR Read and Input Capture.............................................. 252
10.10.9 Contention between TGR Write and Input Capture............................................. 253
10.10.10 Contention between Buffer Register Write and Input Capture
(H8S/2268 Group Only)..................................................................................... 254
10.10.11 Contention between Overflow/Underflow and Counter Clearing ...................... 255
10.10.12 Contention between TCNT Write and Overflow/Underflow ............................. 256
10.10.13 Multiplexing of I/O Pins .................................................................................... 256
10.10.14 Interrupts in Module Stop Mode ........................................................................ 256
Section 11 8-Bit Timers .....................................................................................257
11.1 8-Bit Timer Module (TMR_0, TMR_1, TMR_2, and TMR_3)........................................ 257
11.1.1 Features................................................................................................................ 257
11.2 Input/Output Pins .............................................................................................................. 259
11.3 Register Descriptions ........................................................................................................ 259
11.3.1 Timer Counter (TCNT)........................................................................................ 260
11.3.2 Time Constant Register A (TCORA)................................................................... 260
11.3.3 Time Constant Register B (TCORB) ................................................................... 260
11.3.4 Timer Control Register (TCR) ............................................................................. 261
11.3.5 Timer Control/Status Register (TCSR) ................................................................ 263
11.4 Operation........................................................................................................................... 268
11.4.1 Pulse Output......................................................................................................... 268
11.5 Operation Timing.............................................................................................................. 269
11.5.1 TCNT Incrementation Timing ............................................................................. 269
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11.6
11.7
11.8
11.9
11.10
11.11
11.12
11.5.2 Timing of CMFA and CMFB Setting When a Compare-Match Occurs.............. 270
11.5.3 Timing of Timer Output When a Compare-Match Occurs .................................. 270
11.5.4 Timing of Compare-Match Clear When a Compare-Match Occurs .................... 271
11.5.5 TCNT External Reset Timing .............................................................................. 271
11.5.6 Timing of Overflow Flag (OVF) Setting ............................................................. 272
Operation with Cascaded Connection ............................................................................... 273
11.6.1 16-Bit Count Mode .............................................................................................. 273
11.6.2 Compare-Match Count Mode .............................................................................. 273
Interrupt Sources............................................................................................................... 274
11.7.1 Interrupt Sources and DTC Activation ................................................................ 274
11.7.2 A/D Converter Activation.................................................................................... 274
Usage Notes ...................................................................................................................... 275
11.8.1 Setting Module Stop Mode .................................................................................. 275
11.8.2 Contention between TCNT Write and Clear........................................................ 275
11.8.3 Contention between TCNT Write and Increment ................................................ 276
11.8.4 Contention between TCOR Write and Compare-Match ...................................... 277
11.8.5 Contention between Compare-Matches A and B................................................. 277
11.8.6 Switching of Internal Clocks and TCNT Operation............................................. 278
11.8.7 Contention between Interrupts and Module Stop Mode ...................................... 279
8-Bit Reload Timer (TMR_4) (H8S/2268 Group Only) ................................................... 280
11.9.1 Features................................................................................................................ 280
11.9.2 Input/Output Pins ................................................................................................. 281
Register Descriptions ........................................................................................................ 282
11.10.1 Timer Control Registers 4 to 7 (TCR_4 to TCR_7)............................................. 282
11.10.2 Timer Counters 4 to 7 (TCNT4 to TCNT7)......................................................... 283
11.10.3 Time Reload Registers 4 to 7 (TLR_4 to TLR_7) ............................................... 283
Operation........................................................................................................................... 284
11.11.1 Interval Timer Operation ..................................................................................... 284
11.11.2 Automatic Reload Timer Operation..................................................................... 285
11.11.3 Cascaded Connection........................................................................................... 285
Usage Notes ...................................................................................................................... 287
11.12.1 Conflict between Write to TLR and Count Up/Automatic Reload ...................... 287
11.12.2 Switchover of Internal Clock and TCNT Operation ............................................ 287
11.12.3 Interrupt during Module Stop .............................................................................. 287
Section 12 Watchdog Timer (WDT) .................................................................289
12.1 Features ............................................................................................................................. 289
12.2 Register Descriptions ........................................................................................................ 291
12.2.1 Timer Counter (TCNT)........................................................................................ 291
12.2.2 Timer Control/Status Register (TCSR) ................................................................ 291
12.2.3 Reset Control/Status Register (RSTCSR) (Only WDT_0) .................................. 295
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12.3 Operation........................................................................................................................... 296
12.3.1 Watchdog Timer Mode ........................................................................................ 296
12.3.2 Interval Timer Mode ............................................................................................ 297
12.3.3 Timing of Setting Overflow Flag (OVF) ............................................................. 298
12.3.4 Timing of Setting Watchdog Timer Overflow Flag (WOVF) ............................. 298
12.4 Interrupt Sources............................................................................................................... 299
12.5 Usage Notes ...................................................................................................................... 299
12.5.1 Notes on Register Access..................................................................................... 299
12.5.2 Contention between Timer Counter (TCNT) Write and Increment ..................... 301
12.5.3 Changing Value of CKS2 to CKS0...................................................................... 301
12.5.4 Switching between Watchdog Timer Mode and Interval Timer Mode................ 301
12.5.5 Internal Reset in Watchdog Timer Mode............................................................. 302
12.5.6 OVF Flag Clearing in Interval Timer Mode ........................................................ 302
12.5.7 Notes on Initializing TCNT by Using the TME Bit............................................. 302
Section 13 Serial Communication Interface (SCI) ............................................303
13.1 Features ............................................................................................................................. 303
13.2 Input/Output Pins .............................................................................................................. 307
13.3 Register Descriptions ........................................................................................................ 307
13.3.1 Receive Shift Register (RSR) .............................................................................. 308
13.3.2 Receive Data Register (RDR) .............................................................................. 308
13.3.3 Transmit Data Register (TDR)............................................................................. 308
13.3.4 Transmit Shift Register (TSR) ............................................................................. 309
13.3.5 Serial Mode Register (SMR)................................................................................ 309
13.3.6 Serial Control Register (SCR).............................................................................. 313
13.3.7 Serial Status Register (SSR) ................................................................................ 318
13.3.8 Smart Card Mode Register (SCMR) .................................................................... 325
13.3.9 Bit Rate Register (BRR) ...................................................................................... 326
13.3.10 Serial Expansion Mode Register (SEMR_0) ....................................................... 334
13.4 Operation in Asynchronous Mode .................................................................................... 338
13.4.1 Data Transfer Format........................................................................................... 338
13.4.2 Receive Data Sampling Timing and Reception Margin in Asynchronous
Mode .................................................................................................................... 340
13.4.3 Clock.................................................................................................................... 341
13.4.4 SCI Initialization (Asynchronous Mode) ............................................................. 342
13.4.5 Serial Data Transmission (Asynchronous Mode) ................................................ 343
13.4.6 Serial Data Reception (Asynchronous Mode)...................................................... 345
13.5 Multiprocessor Communication Function......................................................................... 349
13.5.1 Multiprocessor Serial Data Transmission ............................................................ 351
13.5.2 Multiprocessor Serial Data Reception ................................................................. 352
13.6 Operation in Clocked Synchronous Mode ........................................................................ 355
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13.6.1
13.6.2
13.6.3
13.6.4
13.6.5
Clock.................................................................................................................... 355
SCI Initialization (Clocked Synchronous Mode) ................................................. 355
Serial Data Transmission (Clocked Synchronous Mode) .................................... 356
Serial Data Reception (Clocked Synchronous Mode).......................................... 359
Simultaneous Serial Data Transmission and Reception (Clocked Synchronous
Mode)................................................................................................................... 361
13.7 Operation in Smart Card Interface .................................................................................... 363
13.7.1 Pin Connection Example...................................................................................... 363
13.7.2 Data Format (Except for Block Transfer Mode).................................................. 363
13.7.3 Block Transfer Mode ........................................................................................... 365
13.7.4 Receive Data Sampling Timing and Reception Margin....................................... 366
13.7.5 Initialization ......................................................................................................... 367
13.7.6 Serial Data Transmission (Except for Block Transfer Mode).............................. 367
13.7.7 Serial Data Reception (Except for Block Transfer Mode) ................................... 371
13.7.8 Clock Output Control........................................................................................... 372
13.8 Interrupt Sources............................................................................................................... 374
13.8.1 Interrupts in Normal Serial Communication Interface Mode............................... 374
13.8.2 Interrupts in Smart Card Interface Mode ............................................................. 375
13.9 Usage Notes ...................................................................................................................... 376
13.9.1 Module Stop Mode Setting .................................................................................. 376
13.9.2 Break Detection and Processing (Asynchronous Mode Only)............................. 376
13.9.3 Mark State and Break Detection (Asynchronous Mode Only) ............................ 376
13.9.4 Receive Error Flags and Transmit Operations (Clocked Synchronous
Mode Only).......................................................................................................... 377
13.9.5 Restrictions on Use of DTC (H8S/2268 Group Only) ......................................... 377
13.9.6 Operation in Case of Mode Transition................................................................. 378
13.9.7 Switching from SCK Pin Function to Port Pin Function: .................................... 381
13.9.8 Assignment and Selection of Registers................................................................ 382
Section 14 I2C Bus Interface (IIC)
(Supported as an Option by H8S/2264 Group) ...............................383
14.1 Features ............................................................................................................................. 383
14.2 Input/Output Pins .............................................................................................................. 386
14.3 Register Descriptions ........................................................................................................ 387
2
14.3.1 I C Bus Data Register (ICDR) ............................................................................. 388
14.3.2 Slave Address Register (SAR) ............................................................................. 390
14.3.3 Second Slave Address Register (SARX) ............................................................. 390
2
14.3.4 I C Bus Mode Register (ICMR) ........................................................................... 391
14.3.5 Serial Control Register X (SCRX)....................................................................... 394
2
14.3.6 I C Bus Control Register (ICCR) ......................................................................... 395
2
14.3.7 I C Bus Status Register (ICSR)............................................................................ 401
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14.3.8 DDC Switch Register (DDCSWR) ...................................................................... 405
14.4 Operation........................................................................................................................... 406
2
14.4.1 I C Bus Data Format ............................................................................................ 406
14.4.2 Initial Setting........................................................................................................ 408
14.4.3 Master Transmit Operation .................................................................................. 408
14.4.4 Master Receive Operation.................................................................................... 412
14.4.5 Slave Receive Operation...................................................................................... 417
14.4.6 Slave Transmit Operation .................................................................................... 422
14.4.7 IRIC Setting Timing and SCL Control ................................................................ 425
14.4.8 Operation Using the DTC (H8S/2268 Group Only) ............................................ 426
14.4.9 Noise Canceler ..................................................................................................... 427
14.4.10 Initialization of Internal State .............................................................................. 427
14.5 Interrupt Source ................................................................................................................ 429
14.6 Usage Notes ...................................................................................................................... 429
Section 15 A/D Converter..................................................................................443
15.1 Features ............................................................................................................................. 443
15.2 Input/Output Pins .............................................................................................................. 445
15.3 Register Descriptions ........................................................................................................ 446
15.3.1 A/D Data Registers A to D (ADDRA to ADDRD) ............................................. 446
15.3.2 A/D Control/Status Register (ADCSR) ............................................................... 447
15.3.3 A/D Control Register (ADCR) ............................................................................ 449
15.4 Interface to Bus Master ..................................................................................................... 450
15.5 Operation........................................................................................................................... 451
15.5.1 Single Mode......................................................................................................... 451
15.5.2 Scan Mode ........................................................................................................... 453
15.5.3 Input Sampling and A/D Conversion Time.......................................................... 454
15.5.4 External Trigger Input Timing............................................................................. 456
15.6 Interrupt Source ................................................................................................................ 456
15.7 A/D Conversion Accuracy Definitions ............................................................................. 457
15.8 Usage Notes ...................................................................................................................... 459
15.8.1 Module Stop Mode Setting .................................................................................. 459
15.8.2 Permissible Signal Source Impedance ................................................................. 459
15.8.3 Influences on Absolute Accuracy ........................................................................ 459
15.8.4 Range of Analog Power Supply and Other Pin Settings ...................................... 460
15.8.5 Notes on Board Design ........................................................................................ 460
15.8.6 Notes on Noise Countermeasures ........................................................................ 460
Section 16 D/A Converter..................................................................................463
16.1 Features ............................................................................................................................. 463
16.2 Input/Output Pins .............................................................................................................. 464
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16.3 Register Description.......................................................................................................... 464
16.3.1 D/A Data Registers 0 and 1 (DADR0 and DADR1)............................................ 464
16.3.2 D/A Control Register (DACR) ............................................................................ 465
16.4 Operation........................................................................................................................... 466
16.5 Usage Notes ...................................................................................................................... 467
16.5.1 Analog Power Supply Current in Power-Down Mode......................................... 467
16.5.2 Setting for Module Stop Mode............................................................................. 467
Section 17 LCD Controller/Driver ....................................................................469
17.1 Features ............................................................................................................................. 469
17.2 Input/Output Pins .............................................................................................................. 471
17.3 Register Descriptions ........................................................................................................ 472
17.3.1 LCD Port Control Register (LPCR)..................................................................... 472
17.3.2 LCD Control Register (LCR)............................................................................... 476
17.3.3 LCD Control Register 2 (LCR2).......................................................................... 478
17.4 Operation........................................................................................................................... 482
17.4.1 Settings up to LCD Display ................................................................................. 482
17.4.2 Relationship between LCD RAM and Display .................................................... 483
17.4.3 Triple Step-Up Voltage Circuit (Supported Only by the H8S/2268 Group)........ 488
17.4.4 Operation in Power-Down Modes ....................................................................... 489
17.4.5 Low-Power LCD Drive........................................................................................ 490
17.4.6 Boosting the LCD Drive Power Supply............................................................... 492
Section 18 DTMF Generation Circuit ...............................................................493
18.1 Features ............................................................................................................................. 493
18.2 Input/Output Pins .............................................................................................................. 494
18.3 Register Descriptions ........................................................................................................ 495
18.3.1 DTMF Control Register (DTCR)......................................................................... 495
18.3.2 DTMF Load Register (DTLR) ............................................................................. 496
18.4 Operation........................................................................................................................... 497
18.4.1 Output Waveform ................................................................................................ 497
18.4.2 Operation Flow .................................................................................................... 498
18.5 Application Circuit Example............................................................................................. 499
18.6 Usage Notes ...................................................................................................................... 499
Section 19 RAM ................................................................................................501
Section 20 ROM ................................................................................................503
20.1 Features ............................................................................................................................. 503
20.2 Mode Transitions .............................................................................................................. 504
20.3 Block Configuration.......................................................................................................... 508
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20.4 Input/Output Pins .............................................................................................................. 511
20.5 Register Descriptions ........................................................................................................ 511
20.5.1 Flash Memory Control Register 1 (FLMCR1)..................................................... 512
20.5.2 Flash Memory Control Register 2 (FLMCR2)..................................................... 513
20.5.3 Erase Block Register 1 (EBR1) ........................................................................... 514
20.5.4 Erase Block Register 2 (EBR2) ........................................................................... 515
20.5.5 RAM Emulation Register (RAMER)................................................................... 515
20.5.6 Flash Memory Power Control Register (FLPWCR) ............................................ 516
20.5.7 Serial Control Register X (SCRX)....................................................................... 517
20.6 On-Board Programming Modes........................................................................................ 518
20.6.1 Boot Mode ........................................................................................................... 518
20.6.2 Programming/Erasing in User Program Mode..................................................... 521
20.7 Flash Memory Emulation in RAM ................................................................................... 522
20.8 Flash Memory Programming/Erasing ............................................................................... 524
20.8.1 Program/Program-Verify ..................................................................................... 525
20.8.2 Erase/Erase-Verify............................................................................................... 527
20.8.3 Interrupt Handling when Programming/Erasing Flash Memory.......................... 527
20.9 Program/Erase Protection ................................................................................................. 529
20.9.1 Hardware Protection ............................................................................................ 529
20.9.2 Software Protection.............................................................................................. 529
20.9.3 Error Protection.................................................................................................... 529
20.10 Interrupt Handling when Programming/Erasing Flash Memory....................................... 530
20.11 Programmer Mode ............................................................................................................ 530
20.12 Power-Down States for Flash Memory............................................................................. 532
20.13 Flash Memory Programming and Erasing Precautions ..................................................... 533
20.14 Note on Switching from F-ZTAT Version to Masked ROM Version .............................. 538
Section 21 Clock Pulse Generator .....................................................................539
21.1 Register Descriptions ........................................................................................................ 540
21.1.1 System Clock Control Register (SCKCR) ........................................................... 540
21.1.2 Low-Power Control Register (LPWRCR) ........................................................... 541
21.2 System Clock Oscillator.................................................................................................... 543
21.2.1 Connecting a Crystal Resonator........................................................................... 543
21.2.2 External Clock Input ............................................................................................ 544
21.2.3 Notes on Switching External Clock ..................................................................... 546
21.3 Duty Adjustment Circuit................................................................................................... 547
21.4 Medium-Speed Clock Divider .......................................................................................... 547
21.5 Bus Master Clock Selection Circuit .................................................................................. 547
21.6 Subclock Oscillator ........................................................................................................... 548
21.6.1 Connecting 32.768-kHz Crystal Resonator.......................................................... 548
21.6.2 Handling Pins when Subclock not Required........................................................ 549
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21.7 Subclock Waveform Generation Circuit ........................................................................... 549
21.8 Usage Notes ...................................................................................................................... 549
21.8.1 Note on Crystal Resonator ................................................................................... 549
21.8.2 Note on Board Design.......................................................................................... 550
21.8.3 Note on Using a Crystal Resonator...................................................................... 550
Section 22 Power-Down Modes ........................................................................551
22.1 Register Description.......................................................................................................... 556
22.1.1 Standby Control Register (SBYCR) .................................................................... 556
22.1.2 Module Stop Control Registers A to D (MSTPCRA to MSTPCRD) .................. 558
22.2 Medium-Speed Mode........................................................................................................ 560
22.3 Sleep Mode ....................................................................................................................... 561
22.3.1 Sleep Mode .......................................................................................................... 561
22.3.2 Exiting Sleep Mode.............................................................................................. 561
22.4 Software Standby Mode.................................................................................................... 562
22.4.1 Software Standby Mode....................................................................................... 562
22.4.2 Clearing Software Standby Mode ........................................................................ 562
22.4.3 Oscillation Settling Time after Clearing Software Standby Mode....................... 563
22.4.4 Software Standby Mode Application Example.................................................... 563
22.5 Hardware Standby Mode .................................................................................................. 564
22.5.1 Hardware Standby Mode ..................................................................................... 564
22.5.2 Clearing Hardware Standby Mode....................................................................... 564
22.5.3 Hardware Standby Mode Timing......................................................................... 565
22.6 Module Stop Mode............................................................................................................ 565
22.7 Watch Mode...................................................................................................................... 566
22.7.1 Transition to Watch Mode ................................................................................... 566
22.7.2 Exiting Watch Mode ............................................................................................ 566
22.8 Sub-Sleep Mode................................................................................................................ 567
22.8.1 Transition to Sub-Sleep Mode ............................................................................. 567
22.8.2 Exiting Sub-Sleep Mode ...................................................................................... 567
22.9 Sub-Active Mode .............................................................................................................. 568
22.9.1 Transition to Sub-Active Mode............................................................................ 568
22.9.2 Exiting Sub-Active Mode .................................................................................... 568
22.10 Direct Transitions.............................................................................................................. 569
22.10.1 Direct Transitions from High-Speed Mode to Sub-Active Mode ........................ 569
22.10.2 Direct Transitions from Sub-Active Mode to High-Speed Mode ........................ 569
22.11 Usage Notes ...................................................................................................................... 569
22.11.1 I/O Port Status...................................................................................................... 569
22.11.2 Current Dissipation during Oscillation Settling Wait Period ............................... 569
22.11.3 DTC Module Stop (Supported Only by the H8S/2268 Group)............................ 569
22.11.4 On-Chip Peripheral Module Interrupt.................................................................. 570
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22.11.5 Writing to MSTPCR ............................................................................................ 570
22.11.6 Entering Subactive/Watch Mode and DTC Module Stop
(Supported Only by H8S/2268 Group) ................................................................ 570
Section 23 Power Supply Circuit.......................................................................571
23.1 When Internal Power Step-Down Circuit Is Used ............................................................ 571
Section 24 List of Registers ...............................................................................573
24.1 Register Addresses (by Function Module, in Address Order) .......................................... 574
24.2 Register Bits...................................................................................................................... 582
24.3 Register States in Each Operating Mode........................................................................... 590
Section 25 Electrical Characteristics .................................................................597
25.1 Power Supply Voltage and Operating Frequency Range .................................................. 597
25.2 Electrical Characteristics of H8S/2268 Group .................................................................. 599
25.2.1 Absolute Maximum Ratings ................................................................................ 599
25.2.2 DC Characteristics ............................................................................................... 600
25.2.3 AC Characteristics ............................................................................................... 610
25.2.4 A/D Conversion Characteristics........................................................................... 615
25.2.5 D/A Conversion Characteristics........................................................................... 616
25.2.6 LCD Characteristics............................................................................................. 617
25.2.7 DTMF Characteristics.......................................................................................... 618
25.2.8 Flash Memory Characteristics ............................................................................. 619
25.3 Electrical Characteristics of H8S/2264 Group .................................................................. 621
25.3.1 Absolute Maximum Ratings ................................................................................ 621
25.3.2 DC Characteristics ............................................................................................... 622
25.3.3 AC Characteristics ............................................................................................... 631
25.3.4 A/D Conversion Characteristics........................................................................... 636
25.3.5 LCD Characteristics............................................................................................. 637
25.4 Operation Timing.............................................................................................................. 638
25.4.1 Oscillator Settling Timing.................................................................................... 638
25.4.2 Control Signal Timings........................................................................................ 638
25.4.3 Timing of On-Chip Peripheral Modules .............................................................. 639
25.5 Usage Note........................................................................................................................ 641
Appendix A I/O Port States in Each Pin State...................................................643
A.1
A.2
I/O Port State in Each Pin State of H8S/2268 Group........................................................ 643
I/O Port State in Each Pin State of H8S/2264 Group........................................................ 644
Appendix B Product Codes................................................................................646
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Appendix C Package Dimensions .....................................................................650
Index
.........................................................................................................653
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Figures
Section 1 Overview
Figure 1.1
Figure 1.2
Figure 1.3
Figure 1.4
Internal Block Diagram of H8S/2268 Group ......................................................... 3
Internal Block Diagram of H8S/2264 Group ......................................................... 4
Pin Arrangement of H8S/2268 Group.................................................................... 5
Pin Arrangement of H8S/2264 Group.................................................................... 6
Section 2 CPU
Figure 2.1
Figure 2.2
Figure 2.3
Figure 2.4
Figure 2.5
Figure 2.6
Figure 2.7
Figure 2.8
Figure 2.9
Figure 2.9
Figure 2.10
Figure 2.11
Figure 2.12
Figure 2.13
Figure 2.14
Exception Vector Table (Normal Mode)................................................................ 17
Stack Structure in Normal Mode............................................................................ 17
Exception Vector Table (Advanced Mode)............................................................ 18
Stack Structure in Advanced Mode........................................................................ 19
Memory Map.......................................................................................................... 20
CPU Registers ........................................................................................................ 21
Usage of General Registers .................................................................................... 22
Stack Status ............................................................................................................ 23
General Register Data Formats (1)......................................................................... 26
General Register Data Formats (2)......................................................................... 27
Memory Data Formats............................................................................................ 28
Instruction Formats (Examples) ............................................................................. 40
Branch Address Specification in Memory Indirect Mode...................................... 44
State Transitions..................................................................................................... 48
Flowchart of Access Method for Registers with Write-Only Bits.......................... 52
Section 3 MCU Operating Modes
Figure 3.1
Figure 3.1
Address Map (1)..................................................................................................... 57
Address Map (2)..................................................................................................... 58
Section 4 Exception Handling
Figure 4.1
Figure 4.2
Figure 4.3
Reset Sequence (Advanced Mode with On-chip ROM Enabled)........................... 62
Stack Status after Exception Handling (Advanced Mode) ..................................... 65
Operation when SP Value Is Odd........................................................................... 66
Section 5 Interrupt Controller
Figure 5.1
Figure 5.2
Figure 5.3
Figure 5.4
Figure 5.5
Block Diagram of Interrupt Controller for H8S/2268 Group ................................. 68
Block Diagram of Interrupt Controller for H8S/2264 Group ................................. 69
Block Diagram of IRQn Interrupts......................................................................... 81
Set Timing for IRQnF ............................................................................................ 82
Block Diagram of Interrupts WKP7 to WKP0 ....................................................... 83
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REJ09B0071-0500
Figure 5.6
Figure 5.7
Figure 5.8
Figure 5.9
Figure 5.10
Figure 5.11
Figure 5.12
Figure 5.13
IWPFn Setting Timing ........................................................................................... 83
Block Diagram of Interrupt Control Operation for H8S/2268 Group .................... 89
Block Diagram of Interrupt Control Operation for H8S/2264 Group .................... 90
Flowchart of Procedure Up to Interrupt Acceptance in Interrupt Control
Mode 0 ................................................................................................................... 93
Flowchart of Procedure Up to Interrupt Acceptance in Control Mode 2 ............... 95
Interrupt Exception Handling ................................................................................. 96
DTC and Interrupt Controller................................................................................. 99
Contention between Interrupt Generation and Disabling ....................................... 101
Section 6 PC Break Controller (PBC)
Figure 6.1
Figure 6.2
Block Diagram of PC Break Controller ................................................................. 104
Operation in Power-Down Mode Transitions ........................................................ 108
Section 7 Bus Controller
Figure 7.1
Figure 7.2
Figure 7.3
On-Chip Memory Access Cycle............................................................................. 111
On-Chip Peripheral Module Access Cycle (H'FFFDAC to H'FFFFBF) ................ 112
On-Chip Peripheral Module Access Cycle (H'FFFC30 to H'FFFCA3) ................. 113
Section 8 Data Transfer Controller (DTC)
Figure 8.1
Figure 8.2
Figure 8.3
Figure 8.4
Figure 8.5
Figure 8.6
Figure 8.7
Figure 8.8
Figure 8.9
Figure 8.10
Figure 8.11
Block Diagram of DTC .......................................................................................... 116
Block Diagram of DTC Activation Source Control ............................................... 123
The Location of DTC Register Information in Address Space .............................. 124
Correspondence between DTC Vector Address and Register Information ............ 124
Flowchart of DTC Operation ................................................................................. 127
Memory Mapping in Normal Mode ....................................................................... 128
Memory Mapping in Repeat Mode ........................................................................ 129
Memory Mapping in Block Transfer Mode ........................................................... 130
Chain Transfer Operation....................................................................................... 131
DTC Operation Timing (Example in Normal Mode or Repeat Mode) .................. 132
DTC Operation Timing (Example of Block Transfer Mode, with Block
Size of 2) ................................................................................................................ 133
Figure 8.12 DTC Operation Timing (Example of Chain Transfer) ........................................... 133
Section 9 I/O Ports
Figure 9.1
Types of Open Drain Outputs ................................................................................ 154
Section 10 16-Bit Timer Pulse Unit (TPU)
Figure 10.1 Block Diagram of TPU for H8S/2268 Group......................................................... 188
Figure 10.2 Block Diagram of TPU for H8S/2264 Group......................................................... 189
Figure 10.3 16-Bit Register Access Operation [Bus Master ↔ TCNT (16 Bits)] ..................... 216
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Figure 10.4 8-Bit Register Access Operation [Bus Master ↔ TCR (Upper 8 Bits)]................. 216
Figure 10.5 8-Bit Register Access Operation [Bus Master ↔ TMDR (Lower 8 Bits)]............. 217
Figure 10.6 8-Bit Register Access Operation [Bus Master ↔ TCR and TMDR (16 Bits)]....... 217
Figure 10.7 Example of Counter Operation Setting Procedure ................................................. 218
Figure 10.8 Free-Running Counter Operation ........................................................................... 219
Figure 10.9 Periodic Counter Operation.................................................................................... 220
Figure 10.10 Example of Setting Procedure for Waveform Output by Compare Match............. 220
Figure 10.11 Example of 0 Output/1 Output Operation .............................................................. 221
Figure 10.12 Example of Toggle Output Operation .................................................................... 221
Figure 10.13 Example of Input Capture Operation Setting Procedure ........................................ 222
Figure 10.14 Example of Input Capture Operation ..................................................................... 222
Figure 10.15 Example of Synchronous Operation Setting Procedure ......................................... 223
Figure 10.16 Example of Synchronous Operation....................................................................... 224
Figure 10.17 Compare Match Buffer Operation.......................................................................... 225
Figure 10.18 Input Capture Buffer Operation.............................................................................. 225
Figure 10.19 Example of Buffer Operation Setting Procedure.................................................... 226
Figure 10.20 Example of Buffer Operation (1) ........................................................................... 227
Figure 10.21 Example of Buffer Operation (2) ........................................................................... 228
Figure 10.22 Example of PWM Mode Setting Procedure ........................................................... 230
Figure 10.23 Example of PWM Mode Operation (1) .................................................................. 231
Figure 10.24 Example of PWM Mode Operation (2) .................................................................. 231
Figure 10.25 Example of PWM Mode Operation (3) .................................................................. 232
Figure 10.26 Example of Phase Counting Mode Setting Procedure............................................ 233
Figure 10.27 Example of Phase Counting Mode 1 Operation ..................................................... 234
Figure 10.28 Example of Phase Counting Mode 2 Operation ..................................................... 235
Figure 10.29 Example of Phase Counting Mode 3 Operation ..................................................... 236
Figure 10.30 Example of Phase Counting Mode 4 Operation ..................................................... 237
Figure 10.31 Count Timing in Internal Clock Operation............................................................. 240
Figure 10.32 Count Timing in External Clock Operation ........................................................... 240
Figure 10.33 Output Compare Output Timing ............................................................................ 241
Figure 10.34 Input Capture Input Signal Timing......................................................................... 241
Figure 10.35 Counter Clear Timing (Compare Match) ............................................................... 242
Figure 10.36 Counter Clear Timing (Input Capture) ................................................................... 242
Figure 10.37 Buffer Operation Timing (Compare Match) .......................................................... 243
Figure 10.38 Buffer Operation Timing (Input Capture) .............................................................. 243
Figure 10.39 TGI Interrupt Timing (Compare Match) ................................................................ 244
Figure 10.40 TGI Interrupt Timing (Input Capture) .................................................................... 245
Figure 10.41 TCIV Interrupt Setting Timing............................................................................... 245
Figure 10.42 TCIU Interrupt Setting Timing (H8S/2268 Group Only)....................................... 246
Figure 10.43 Timing for Status Flag Clearing by CPU ............................................................... 246
Figure 10.44 Timing for Status Flag Clearing by DTC Activation (H8S/2268 Group Only)...... 247
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Figure 10.45 Phase Difference, Overlap, and Pulse Width in Phase Counting Mode
(H8S/2268 Group Only)......................................................................................... 248
Figure 10.46 Contention between TCNT Write and Clear Operations........................................ 249
Figure 10.47 Contention between TCNT Write and Increment Operations ................................ 249
Figure 10.48 Contention between TGR Write and Compare Match ........................................... 250
Figure 10.49 Contention between Buffer Register Write and Compare Match........................... 251
Figure 10.50 Contention between TGR Read and Input Capture ................................................ 252
Figure 10.51 Contention between TGR Write and Input Capture ............................................... 253
Figure 10.52 Contention between Buffer Register Write and Input Capture............................... 254
Figure 10.53 Contention between Overflow and Counter Clearing ............................................ 255
Figure 10.54 Contention between TCNT Write and Overflow.................................................... 256
Section 11 8-Bit Timers
Figure 11.1 Block Diagram of 8-Bit Timer Module.................................................................. 258
Figure 11.2 Example of Pulse Output........................................................................................ 268
Figure 11.3 Count Timing for Internal Clock Input................................................................... 269
Figure 11.4 Count Timing for External Clock Input ................................................................. 269
Figure 11.5 Timing of CMF Setting .......................................................................................... 270
Figure 11.6 Timing of Timer Output ......................................................................................... 270
Figure 11.7 Timing of Compare-Match Clear ........................................................................... 271
Figure 11.8 Timing of Clearing by External Reset Input .......................................................... 271
Figure 11.9 Timing of OVF Setting........................................................................................... 272
Figure 11.10 Contention between TCNT Write and Clear .......................................................... 275
Figure 11.11 Contention between TCNT Write and Increment................................................... 276
Figure 11.12 Contention between TCOR Write and Compare-Match ........................................ 277
Figure 11.13 Block Diagram of 8-Bit Reload Timer ................................................................... 281
Figure 11.14 Operation in Interval Timer Mode ......................................................................... 284
Figure 11.15 Operation in Automatic Reload Timer Mode......................................................... 285
Figure 11.16 Channel Relationship of Cascaded Connection...................................................... 286
Section 12 Watchdog Timer (WDT)
Figure 12.1
Figure 12.2
Figure 12.3
Figure 12.4
Figure 12.5
Figure 12.6
Figure 12.7
Figure 12.8
Figure 12.9
Block Diagram of WDT_0 ..................................................................................... 290
Block Diagram of WDT_1 ..................................................................................... 290
Watchdog Timer Mode Operation.......................................................................... 297
Interval Timer Mode Operation.............................................................................. 297
Timing of OVF Setting........................................................................................... 298
Timing of WOVF Setting....................................................................................... 298
Writing to TCNT, TCSR (WDT_0) ....................................................................... 299
Writing to RSTCSR ............................................................................................... 300
Contention between TCNT Write and Increment................................................... 301
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Section 13 Serial Communication Interface (SCI)
Figure 13.1
Figure 13.2
Figure 13.3
Figure 13.4
Figure 13.5
Block Diagram of SCI_0........................................................................................ 305
Block Diagram of SCI_1 or SCI_2 ........................................................................ 306
Example of Internal Base Clock when Average Transfer Rate Is Selected (1) ...... 336
Example of Internal Base Clock when Average Transfer Rate Is Selected (2) ...... 337
Data Format in Asynchronous Communication (Example with 8-Bit Data,
Parity, Two Stop Bits) ............................................................................................ 338
Figure 13.6 Receive Data Sampling Timing in Asynchronous Mode ....................................... 340
Figure 13.7 Relationship between Output Clock and Transfer Data Phase
(Asynchronous Mode)............................................................................................ 341
Figure 13.8 Sample SCI Initialization Flowchart ...................................................................... 342
Figure 13.9 Example of Operation in Transmission in Asynchronous Mode (Example
with 8-Bit Data, Parity, One Stop Bit) ................................................................... 343
Figure 13.10 Sample Serial Transmission Flowchart .................................................................. 344
Figure 13.11 Example of SCI Operation in Reception (Example with 8-Bit Data, Parity,
One Stop Bit).......................................................................................................... 345
Figure 13.12 Sample Serial Reception Data Flowchart (1) ......................................................... 347
Figure 13.12 Sample Serial Reception Data Flowchart (2) ......................................................... 348
Figure 13.13 Example of Communication Using Multiprocessor Format (Transmission of
Data H'AA to Receiving Station A) ....................................................................... 350
Figure 13.14 Sample Multiprocessor Serial Transmission Flowchart ......................................... 351
Figure 13.15 Example of SCI Operation in Reception (Example with 8-Bit Data,
Multiprocessor Bit, One Stop Bit).......................................................................... 352
Figure 13.16 Sample Multiprocessor Serial Reception Flowchart (1)......................................... 353
Figure 13.16 Sample Multiprocessor Serial Reception Flowchart (2)......................................... 354
Figure 13.17 Data Format in Synchronous Communication (For LSB-First) ............................. 355
Figure 13.18 Sample SCI Initialization Flowchart ...................................................................... 356
Figure 13.19 Sample SCI Transmission Operation in Clocked Synchronous Mode ................... 357
Figure 13.20 Sample Serial Transmission Flowchart .................................................................. 358
Figure 13.21 Example of SCI Operation in Reception ................................................................ 359
Figure 13.22 Sample Serial Reception Flowchart ....................................................................... 360
Figure 13.23 Sample Flowchart of Simultaneous Serial Transmit and Receive Operations ....... 362
Figure 13.24 Schematic Diagram of Smart Card Interface Pin Connections............................... 363
Figure 13.25 Normal Smart Card Interface Data Format ............................................................ 364
Figure 13.26 Direct Convention (SDIR = SINV = O/E = 0) ....................................................... 364
Figure 13.27 Inverse Convention (SDIR = SINV = O/E = 1)...................................................... 364
Figure 13.28 Receive Data Sampling Timing in Smart Card Mode (Using Clock of 372
Times the Transfer Rate)........................................................................................ 366
Figure 13.29 Retransfer Operation in SCI Transmit Mode ......................................................... 368
Figure 13.30 TEND Flag Generation Timing in Transmission Operation .................................. 369
Figure 13.31 Example of Transmission Processing Flow............................................................ 370
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Figure 13.32 Retransfer Operation in SCI Receive Mode ........................................................... 372
Figure 13.33 Example of Reception Processing Flow................................................................. 372
Figure 13.34 Timing for Fixing Clock Output Level................................................................... 373
Figure 13.35 Clock Halt and Restart Procedure .......................................................................... 374
Figure 13.36 Example of Clocked Synchronous Transmission by DTC ..................................... 377
Figure 13.37 Sample Flowchart for Mode Transition during Transmission................................ 379
Figure 13.38 Asynchronous Transmission Using Internal Clock ................................................ 379
Figure 13.39 Synchronous Transmission Using Internal Clock .................................................. 380
Figure 13.40 Sample Flowchart for Mode Transition during Reception ..................................... 380
Figure 13.41 Operation when Switching from SCK Pin Function to Port Pin Function ............. 381
Figure 13.42 Operation when Switching from SCK Pin Function to Port Pin Function
(Example of Preventing Low-Level Output).......................................................... 382
Section 14 I2C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
Figure 14.1
Figure 14.2
Figure 14.3
Figure 14.4
Figure 14.5
Figure 14.6
Figure 14.7
Figure 14.8
Figure 14.9
2
Block Diagram of I C Bus Interface....................................................................... 385
2
I C Bus Interface Connections (Example: This LSI as Master) ............................. 386
2
2
I C Bus Data Formats (I C Bus Formats) ............................................................... 406
2
I C Bus Data Format (Clocked Synchronous Serial Format) ................................. 406
2
I C Bus Timing....................................................................................................... 407
Flowchart for IIC Initialization (Example)............................................................. 408
Flowchart for Master Transmit Mode (Example)................................................... 409
Example of Master Transmit Mode Operation Timing (MLS = WAIT = 0).......... 411
Example of Master Transmit Mode Stop Condition Generation Timing
(MLS = WAIT = 0) ................................................................................................ 412
Figure 14.10 Flowchart for Master Receive Mode (Receiving Multiple Bytes) (WAIT = 1)
(Example)............................................................................................................... 413
Figure 14.11 Flowchart for Master Receive Mode (Receiving 1 Byte) (WAIT = 1)
(Example)............................................................................................................... 414
Figure 14.12 Example of Master Receive Mode Operation Timing (MLS = ACKB = 0,
WAIT = 1).............................................................................................................. 416
Figure 14.13 Example of Master Receive Mode Stop Condition Generation Timing
(MLS = ACKB = 0, WAIT = 1)............................................................................. 417
Figure 14.14 Flowchart for Slave Transmit Mode (Example)..................................................... 418
Figure 14.15 Example of Slave Receive Mode Operation Timing (1) (MLS = ACKB = 0) ....... 420
Figure 14.16 Example of Slave Receive Mode Operation Timing (2) (MLS = ACKB = 0) ....... 421
Figure 14.17 Sample Flowchart for Slave Transmit Mode.......................................................... 422
Figure 14.18 Example of Slave Transmit Mode Operation Timing (MLS = 0) .......................... 424
Figure 14.19 IRIC Setting Timing and SCL Control................................................................... 425
Figure 14.20 Block Diagram of Noise Cancellor ........................................................................ 427
Figure 14.21 Points for Attention Concerning Reading of Master Receive Data........................ 433
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Figure 14.22 Flowchart and Timing of Start Condition Instruction Issuance for
Retransmission ....................................................................................................... 435
Figure 14.23 Timing of Stop Condition Issuance........................................................................ 436
Figure 14.24 IRIC Flag Clearance in WAIT = 1 Status .............................................................. 436
Figure 14.25 ICDR Read and ICCR Access Timing in Slave Transmit Mode............................ 437
Figure 14.26 TRS Bit Setting Timing in Slave Mode ................................................................. 438
Figure 14.27 Diagram of Erroneous Operation when Arbitration Is Lost ................................... 440
Figure 14.28 Timing of IRIC Flag Clearing during Wait Operation ........................................... 441
Section 15 A/D Converter
Figure 15.1
Figure 15.2
Figure 15.3
Figure 15.4
Block Diagram of A/D Converter .......................................................................... 444
Access to ADDR (When Reading H'AA40)........................................................... 450
Example of A/D Converter Operation (Single Mode, Channel 1 Selected) ........... 452
Example of A/D Converter Operation (Scan Mode, Channels AN0 to AN2
Selected) ................................................................................................................. 453
Figure 15.5 A/D Conversion Timing......................................................................................... 454
Figure 15.6 External Trigger Input Timing ............................................................................... 456
Figure 15.7 A/D Conversion Accuracy Definitions (1)............................................................. 458
Figure 15.8 A/D Conversion Accuracy Definitions (2)............................................................. 458
Figure 15.9 Example of Analog Input Circuit ........................................................................... 459
Figure 15.10 Example of Analog Input Protection Circuit.......................................................... 461
Figure 15.11 Analog Input Pin Equivalent Circuit ...................................................................... 461
Section 16 D/A Converter
Figure 16.1 Block Diagram of D/A Converter .......................................................................... 463
Figure 16.2 D/A Converter Operation Example ........................................................................ 467
Section 17 LCD Controller/Driver.....................................................................469
Figure 17.1 Block Diagram of LCD Controller/Driver ............................................................. 470
Figure 17.2 A Waveform 1/2 Duty 1/2 Vias.............................................................................. 480
Figure 17.3 Handling of LCD Drive Power Supply when Using 1/2 Duty ............................... 482
Figure 17.4 LCD RAM Map (1/4 Duty).................................................................................... 484
Figure 17.5 LCD RAM Map (1/3 Duty).................................................................................... 484
Figure 17.6 LCD RAM Map (1/2 Duty).................................................................................... 485
Figure 17.7 LCD RAM Map (Static Mode) .............................................................................. 485
Figure 17.8 Output Waveforms for Each Duty Cycle (A Waveform) ....................................... 486
Figure 17.9 Output Waveforms for Each Duty Cycle (B Waveform) ....................................... 487
Figure 17.10 Connection when Triple Step-Up Voltage Circuit Used (Supported Only by
the H8S/2268 Group) ............................................................................................. 489
Figure 17.11 Example of Low-Power-Consumption LCD Drive Operation ............................... 491
Figure 17.12 Connection of External Split-Resistance................................................................ 492
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Section 18 DTMF Generation Circuit
Figure 18.1
Figure 18.2
Figure 18.3
Figure 18.4
Figure 18.5
DTMF Frequencies ................................................................................................ 493
DTMF Generation Circuit Diagram ....................................................................... 494
TONED Pin Output Equivalent Circuit.................................................................. 497
TONED Pin Output Waveform (Row or Column Group Alone) ........................... 497
Example of HA16808ANT Connection ................................................................. 499
Section 20 ROM ................................................................................................503
Figure 20.1 Block Diagram of Flash Memory........................................................................... 504
Figure 20.2 Flash Memory State Transitions............................................................................. 505
Figure 20.3 Boot Mode.............................................................................................................. 506
Figure 20.4 User Program Mode (Example).............................................................................. 507
Figure 20.5 Flash Memory Block Configuration (H8S/2268) ................................................... 509
Figure 20.6 Flash Memory Block Configuration (H8S/2266 and H8S/2265) ........................... 510
Figure 20.7 Programming/Erasing Flowchart Example in User Program Mode....................... 521
Figure 20.8 Flowchart for Flash Memory Emulation in RAM .................................................. 522
Figure 20.9 Example of RAM Overlap Operation..................................................................... 524
Figure 20.10 Program/Program-Verify Flowchart ...................................................................... 526
Figure 20.11 Erase/Erase-Verify Flowchart ................................................................................ 528
Figure 20.12 Socket Adapter Pin Correspondence Diagram ....................................................... 531
Figure 20.13 Power-On/Off Timing (Boot Mode) ...................................................................... 535
Figure 20.14 Power-On/Off Timing (User Program Mode) ........................................................ 536
Figure 20.15 Mode Transition Timing (Example: Boot Mode → User Mode ↔ User
Program Mode) ...................................................................................................... 537
Section 21 Clock Pulse Generator
Figure 21.1 Block Diagram of Clock Pulse Generator .............................................................. 539
Figure 21.2 Connection of Crystal Resonator (Example).......................................................... 543
Figure 21.3 Crystal Resonator Equivalent Circuit ..................................................................... 544
Figure 21.4 External Clock Input (Examples) ........................................................................... 544
Figure 21.5 External Clock Input Timing.................................................................................. 546
Figure 21.6 External Clock Switching Circuit (Examples) ....................................................... 546
Figure 21.7 External Clock Switching Timing (Examples)....................................................... 547
Figure 21.8 Example Connection of 32.768-kHz Crystal Resonator......................................... 548
Figure 21.9 Equivalence Circuit for 32.768-kHz Crystal Resonator ......................................... 548
Figure 21.10 Pin Handling When Subclock Not Required.......................................................... 549
Figure 21.11 Note on Board Design of Oscillator Circuit ........................................................... 550
Section 22 Power-Down Modes
Figure 22.1 Mode Transition Diagram ...................................................................................... 554
Figure 22.2 Medium-Speed Mode Transition and Clearance Timing ....................................... 561
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Figure 22.3 Software Standby Mode Application Example ...................................................... 564
Figure 22.4 Hardware Standby Mode Timing ........................................................................... 565
Section 23 Power Supply Circuit
Figure 23.1 Power Supply Connections When Internal Power Supply Step-Down Circuit Is
Used........................................................................................................................ 571
Section 25 Electrical Characteristics
Figure 25.1 Power Supply Voltage and Operating Ranges (1).................................................. 597
Figure 25.1 Power Supply Voltage and Operating Ranges (2).................................................. 598
Figure 25.2 Output Load Circuit ............................................................................................... 610
Figure 25.3 Output Load Circuit ............................................................................................... 631
Figure 25.4 Oscillator Settling Timing ...................................................................................... 638
Figure 25.5 Reset Input Timing................................................................................................. 638
Figure 25.6 Interrupt Input Timing............................................................................................ 639
Figure 25.7 TPU Clock Input Timing........................................................................................ 639
Figure 25.8 8-Bit Timer Clock Input Timing ............................................................................ 639
Figure 25.9 SCK Clock Input Timing ....................................................................................... 639
Figure 25.10 SCI Input/Output Timing (Clock Synchronous Mode) .......................................... 640
2
Figure 25.11 I C Bus Interface Input/Output Timing (Option).................................................... 640
Figure 25.12 TONED Load Circuit (Supported Only by the H8S/2268 Group) ......................... 641
Appendix C Package Dimensions......................................................................650
Figure C.1
Figure C.2
Figure C.3
TFP-100B and TFP-100BV Package Dimensions (H8S/2268 Group Only).......... 650
TFP-100G and TFP-100GV Package Dimensions ................................................. 651
FP-100B and FP-100BV Package Dimensions ...................................................... 652
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Tables
Section 1 Overview
Table 1.1
Pin Functions..............................................................................................................7
Section 2 CPU
Table 2.1
Table 2.2
Table 2.3
Table 2.4
Table 2.4
Table 2.5
Table 2.6
Table 2.7
Table 2.7
Table 2.8
Table 2.9
Table 2.10
Table 2.11
Table 2.12
Table 2.13
Table 2.13
Instruction Classification..........................................................................................29
Operation Notation...................................................................................................30
Data Transfer Instructions ........................................................................................31
Arithmetic Operations Instructions (1).....................................................................32
Arithmetic Operations Instructions (2).....................................................................33
Logic Operations Instructions ..................................................................................34
Shift Instructions ......................................................................................................34
Bit Manipulation Instructions (1) .............................................................................35
Bit Manipulation Instructions (2) .............................................................................36
Branch Instructions ..................................................................................................37
System Control Instructions .....................................................................................38
Block Data Transfer Instructions..............................................................................39
Addressing Modes....................................................................................................41
Absolute Address Access Ranges ............................................................................42
Effective Address Calculation (1) ............................................................................45
Effective Address Calculation (2) ............................................................................46
Section 3 MCU Operating Modes
Table 3.1
MCU Operating Mode Selection..............................................................................55
Section 4 Exception Handling
Table 4.1
Table 4.2
Table 4.3
Table 4.4
Exception Types and Priority ...................................................................................59
Exception Handling Vector Table ............................................................................60
Status of CCR and EXR after Trace Exception Handling ........................................63
Status of CCR and EXR after Trap Instruction Exception Handling .......................64
Section 5 Interrupt Controller
Table 5.1
Table 5.2
Table 5.3
Table 5.4
Table 5.5
Table 5.6
Table 5.7
Pin Configuration .....................................................................................................70
Interrupt Sources, Vector Addresses, and Interrupt Priorities ..................................85
Interrupt Control Modes...........................................................................................89
Interrupts Selected in Each Interrupt Control Mode (1)...........................................90
Interrupts Selected in Each Interrupt Control Mode (2)...........................................90
Operations and Control Signal Functions in Each Interrupt Control Mode .............91
Interrupt Response Times (States)............................................................................97
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Table 5.8
Table 5.9
Number of States in Interrupt Handling Routine Execution Status..........................98
Interrupt Source Selection and Clear Control......................................................... 100
Section 8 Data Transfer Controller (DTC)
Table 8.1
Table 8.2
Table 8.3
Table 8.4
Table 8.5
Table 8.6
Table 8.7
Activation Source and DTCER Clearing................................................................ 122
Interrupt Sources, DTC Vector Addresses, and Corresponding DTCEs ................ 125
Register Information in Normal Mode ................................................................... 128
Register Information in Repeat Mode .................................................................... 129
Register Information in Block Transfer Mode ....................................................... 130
DTC Execution Status ............................................................................................ 134
Number of States Required for Each Execution Status .......................................... 134
Section 9 I/O Ports
Table 9.1
Table 9.1
Table 9.2
Table 9.3
H8S/2268 Group Port Functions (1)....................................................................... 140
H8S/2264 Group Port Functions (2)....................................................................... 143
Input Pull-Up MOS States (Port J)......................................................................... 173
Examples of Ways to Handle Unused Input Pins................................................... 184
Section 10 16-Bit Timer Pulse Unit (TPU)
Table 10.1
Table 10.2
Table 10.3
Table 10.4
Table 10.5
Table 10.6
Table 10.7
Table 10.8
Table 10.9
Table 10.10
Table 10.11
Table 10.12
Table 10.13
Table 10.14
Table 10.15
Table 10.16
Table 10.17
Table 10.18
Table 10.19
Table 10.20
Table 10.21
Table 10.22
TPU Functions........................................................................................................ 186
TPU Pins ................................................................................................................ 190
CCLR0 to CCLR2 (Channel 0) (H8S/2268 Group Only) ...................................... 193
CCLR0 to CCLR2 (Channels 1 and 2)................................................................... 193
TPSC0 to TPSC2 (Channel 0) (H8S/2268 Group Only) ........................................ 194
TPSC0 to TPSC2 (Channel 1)................................................................................ 194
TPSC0 to TPSC2 (Channel 2)................................................................................ 195
MD0 to MD3.......................................................................................................... 197
TIORH_0 (Channel 0) (H8S/2268 Group Only) .................................................... 199
TIORL_0 (Channel 0) (H8S/2268 Group Only) .................................................... 200
TIOR_1 (Channel 1)............................................................................................... 201
TIOR_2 (Channel 2)............................................................................................... 202
TIORH_0 (Channel 0) (H8S/2268 Group Only) .................................................... 203
TIORL_0 (Channel 0) (H8S/2268 Group Only) .................................................... 204
TIOR_1 (Channel 1)............................................................................................... 205
TIOR_2 (Channel 2)............................................................................................... 206
Register Combinations in Buffer Operation........................................................... 225
PWM Output Registers and Output Pins................................................................ 229
Phase Counting Mode Clock Input Pins................................................................. 233
Up/Down-Count Conditions in Phase Counting Mode 1 ....................................... 234
Up/Down-Count Conditions in Phase Counting Mode 2 ....................................... 235
Up/Down-Count Conditions in Phase Counting Mode 3 ....................................... 236
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Table 10.23 Up/Down-Count Conditions in Phase Counting Mode 4 ....................................... 237
Table 10.24 TPU Interrupts........................................................................................................ 238
Section 11 8-Bit Timers
Table 11.1
Table 11.2
Table 11.3
Table 11.4
Pin Configuration ................................................................................................... 259
8-Bit Timer Interrupt Sources ................................................................................ 274
Timer Output Priorities .......................................................................................... 277
Switching of Internal Clock and TCNT Operation................................................. 278
Section 12 Watchdog Timer (WDT)
Table 12.1
WDT Interrupt Source............................................................................................ 299
Section 13 Serial Communication Interface (SCI)
Table 13.1
Table 13.2
Table 13.3
Table 13.3
Table 13.3
Table 13.3
Table 13.4
Table 13.5
Table 13.6
Table 13.7
Table 13.8
Table 13.9
Table 13.10
Table 13.11
Table 13.12
Table 13.13
Pin Configuration ................................................................................................... 307
The Relationships between the N Setting in BRR and Bit Rate B ......................... 326
BRR Settings for Various Bit Rates (Asynchronous Mode) (1)............................. 327
BRR Settings for Various Bit Rates (Asynchronous Mode) (2)............................. 328
BRR Settings for Various Bit Rates (Asynchronous Mode) (3)............................. 329
BRR Settings for Various Bit Rates (Asynchronous Mode) (4)............................. 330
Maximum Bit Rate for Each Frequency (Asynchronous Mode) ............................ 330
Maximum Bit Rate with External Clock Input (Asynchronous Mode).................. 331
BRR Settings for Various Bit Rates (Clocked Synchronous Mode) ...................... 332
Maximum Bit Rate with External Clock Input (Clocked Synchronous Mode)...... 332
Examples of Bit Rate for Various BRR Settings (Smart Card Interface Mode)
(When n = 0 and S = 372) ...................................................................................... 333
Maximum Bit Rate at Various Frequencies (Smart Card Interface Mode)
(When S = 372) ...................................................................................................... 333
Serial Transfer Formats (Asynchronous Mode) ..................................................... 339
SSR Status Flags and Receive Data Handling........................................................ 346
Interrupt Sources of Serial Communication Interface Mode.................................. 375
Interrupt Sources in Smart Card Interface Mode.................................................... 376
Section 14 I2C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
Table 14.1
Table 14.2
Table 14.3
Table 14.4
Table 14.5
Table 14.6
Table 14.7
Table 14.8
Pin Configuration ................................................................................................... 386
Transfer Format...................................................................................................... 391
2
I C Transfer Rate .................................................................................................... 393
Flags and Transfer States ....................................................................................... 400
Flags and Transfer States ....................................................................................... 426
IIC Interrupt Source ............................................................................................... 429
2
I C Bus Timing (SCL and SDA Output) ................................................................ 430
Permissible SCL Rise Time (tsr) Values ................................................................. 431
Rev. 5.00 Sep. 01, 2009 Page xlviii of l
REJ09B0071-0500
Table 14.9
2
I C Bus Timing (with Maximum Influence of tSr/tSf)............................................... 432
Section 15 A/D Converter
Table 15.1
Table 15.2
Table 15.3
Table 15.4
Table 15.5
Table 15.6
Pin Configuration ................................................................................................... 445
Analog Input Channels and Corresponding ADDR Registers................................ 446
A/D Conversion Time (Single Mode) .................................................................... 455
A/D Conversion Time (Scan Mode)....................................................................... 455
A/D Converter Interrupt Source ............................................................................. 456
Analog Pin Specifications ...................................................................................... 461
Section 16 D/A Converter
Table 16.1
Table 16.2
Pin Configuration ................................................................................................... 464
D/A Conversion Control ........................................................................................ 466
Section 17 LCD Controller/Driver
Table 17.1
Table 17.2
Table 17.3
Table 17.4
Table 17.5
Table 17.6
Table 17.7
Pin Configuration ................................................................................................... 471
Duty Cycle and Common Function Selection ........................................................ 473
Segment Driver Selection (1) (H8S/2268 Group) .................................................. 474
Segment Driver Selection (2) (H8S/2264 Group) .................................................. 475
Frame Frequency Selection .................................................................................... 477
Output Levels ......................................................................................................... 488
Power-Down Modes and Display Operation.......................................................... 490
Section 18 DTMF Generation Circuit
Table 18.1
Table 18.2
Pin Configuration ................................................................................................... 494
Frequency Deviation between DTMF Output Signals and Typical Signals........... 498
Section 20 ROM
Table 20.1
Table 20.2
Table 20.3
Table 20.4
Table 20.5
Table 20.6
Table 20.7
Differences between Boot Mode and User Program Mode.................................... 505
Pin Configuration ................................................................................................... 511
Setting On-Board Programming Modes................................................................. 518
Boot Mode Operation............................................................................................. 520
System Clock Frequencies for which Automatic Adjustment of LSI Bit Rate Is
Possible .................................................................................................................. 520
Flash Memory Operating States ............................................................................. 532
Registers Present in F-ZTAT Version but Absent in Masked ROM Version ........ 538
Section 21 Clock Pulse Generator
Table 21.1
Table 21.2
Table 21.3
Damping Resistance Value .................................................................................... 544
Crystal Resonator Characteristics........................................................................... 544
External Clock Input Conditions ............................................................................ 545
Rev. 5.00 Sep. 01, 2009 Page xlix of l
REJ09B0071-0500
Table 21.4
External Clock Input Conditions (Duty Adjustment Circuit Not Used)................. 545
Section 22 Power-Down Modes
Table 22.1
Table 22.2
Table 22.3
LSI Internal States in Each Mode........................................................................... 552
Low Power Dissipation Mode Transition Conditions ............................................ 555
Oscillation Settling Time Settings.......................................................................... 563
Section 25 Electrical Characteristics
Table 25.1
Table 25.2
Table 25.2
Table 25.2
Table 25.2
Table 25.3
Table 25.4
Table 25.4
Table 25.5
Table 25.6
Table 25.7
Table 25.8
Table 25.9
Table 25.10
Table 25.11
Table 25.12
Table 25.13
Table 25.14
Table 25.15
Table 25.15
Table 25.15
Table 25.15
Table 25.16
Table 25.17
Table 25.17
Table 25.18
Table 25.19
Table 25.20
Table 25.21
Table 25.22
Table 25.23
Absolute Maximum Ratings................................................................................... 599
DC Characteristics (1) ............................................................................................ 600
DC Characteristics (2) ............................................................................................ 602
DC Characteristics (3) ............................................................................................ 604
DC Characteristics (4) ............................................................................................ 606
Permissible Output Currents .................................................................................. 608
Bus Drive Characteristics (1) ................................................................................. 609
Bus Drive Characteristics (2) ................................................................................. 610
Clock Timing.......................................................................................................... 611
Control Signal Timing............................................................................................ 612
Timing of On-Chip Peripheral Modules................................................................. 613
2
I C Bus Timing....................................................................................................... 614
A/D Conversion Characteristics ............................................................................. 615
D/A Conversion Characteristics ............................................................................. 616
LCD Characteristics ............................................................................................... 617
DTMF Characteristics ............................................................................................ 618
Flash Memory Characteristics................................................................................ 619
Absolute Maximum Ratings................................................................................... 621
DC Characteristics (1) ............................................................................................ 622
DC Characteristics (2) ............................................................................................ 624
DC Characteristics (3) ............................................................................................ 625
DC Characteristics (4) ............................................................................................ 627
Permissible Output Currents .................................................................................. 629
Bus Drive Characteristics (1) ................................................................................. 630
Bus Drive Characteristics (2) ................................................................................. 631
Clock Timing.......................................................................................................... 632
Control Signal Timing............................................................................................ 633
Timing of On-Chip Peripheral Modules................................................................. 634
2
I C Bus Timing....................................................................................................... 635
A/D Conversion Characteristics ............................................................................. 636
LCD Characteristics ............................................................................................... 637
Rev. 5.00 Sep. 01, 2009 Page l of l
REJ09B0071-0500
Section 1 Overview
Section 1 Overview
1.1
Features
• High-speed H8S/2000 central processing unit with an internal 16-bit architecture
⎯ Upward-compatible with H8/300 and H8/300H CPUs on an object level
⎯ Sixteen 16-bit general registers
⎯ 65 basic instructions
• Various peripheral functions
⎯ Interrupt controller
⎯ PC break controller (supported only by the H8S/2268 Group)
⎯ Data transfer controller (DTC) (supported only by the H8S/2268 Group)
⎯ 16-bit timer-pulse unit (TPU)
⎯ 8-bit timer (TMR)
⎯ Watchdog timer (WDT)
⎯ Serial communication interface (SCI)
⎯ I C bus interface (IIC) (supported as an option by H8S/2264 Group)
2
⎯ A/D converter
⎯ D/A converter (supported only by the H8S/2268 Group)
⎯ LCD controller/driver
⎯ DTMF generation circuit (supported only by the H8S/2268 Group)
• On-chip memory
H8S/2268 Group:
ROM
Model
ROM
RAM
Flash memory
version
HD64F2268
256 kbytes
16 kbytes
HD64F2266
128 kbytes
8 kbytes
HD64F2265
128 kbytes
4 kbytes
Remarks
H8S/2264 Group:
ROM
Model
ROM
RAM
Masked ROM
version
HD6432264
128 kbytes
4 kbytes
HD6432264W
128 kbytes
4 kbytes
HD6432262
64 kbytes
2 kbytes
HD6432262W
64 kbytes
2 kbytes
Remarks
Rev. 5.00 Sep. 01, 2009 Page 1 of 656
REJ09B0071-0500
Section 1 Overview
• General I/O ports
⎯ I/O pins: 67 (supported only by the H8S/2268 Group)
51 (supported only by the H8S/2264 Group)
⎯ Input-only pins: 11
• Supports various power-down states
• Compact package
Package
Code*
1
TQFP-100*
TQFP-100
QFP-100
2
Body Size
Pin Pitch
TFP-100B, TFP-100BV
14.0 × 14.0 mm
0.5 mm
TFP-100G, TFP-100GV
12.0 × 12.0 mm
0.4 mm
FP-100B, FP-100BV
14.0 × 14.0 mm
0.5 mm
Notes: 1. Supported only by the H8S/2268 Group.
2. Package codes ending in the letter V designate Pb-free product.
Rev. 5.00 Sep. 01, 2009 Page 2 of 656
REJ09B0071-0500
Section 1 Overview
1.2
Internal Block Diagram
PN7 / SEG40
PN6 / SEG39
PN5 / SEG38
PN4 / SEG37
PN3 / SEG36
PN2 / SEG35
PN1 / SEG34
PN0 / SEG33
V1
V2
V3
C1
C2
CVcc
Vcc
Vss
Vss
Figure 1.1 shows the internal block diagram of the H8S/2268 Group and figure 1.2 shows that of
the H8S/2264 Group.
DTMF
8 bit timer
(4 channels+4 channels)
A/D converter(10 channels)
WDT0
WDT1
(sub clock)
Peripheral address bus
Port M
Port 3
TPU (3 channels)
Port L
LCD (40SEG/4COM)
Port K
RAM
PL7/SEG24
PL6/SEG23
PL5/SEG22
PL4/SEG21
PL3/SEG20
PL2/SEG19
PL1/SEG18
PL0/SEG17
PK7/SEG16
PK6/SEG15
PK5/SEG14
PK4/SEG13
PK3/SEG12
PK2/SEG11
PK1/SEG10
PK0/SEG9
Port J
IIC (2 channels)
PM7/SEG32
PM6/SEG31
PM5/SEG30
PM4/SEG29
PM3/SEG28
PM2/SEG27
PM1/SEG26
PM0/SEG25
PJ7/WKP7/SEG8
PJ6/WKP6/SEG7
PJ5/WKP5/SEG6
PJ4/WKP4/SEG5
PJ3/WKP3/SEG4
PJ2/WKP2/SEG3
PJ1/WKP1/SEG2
PJ0/WKP0/SEG1
Port H
ROM
Port 7
SCI (3 channels)
PH7/TONED/TMCI4
PH3/COM4
PH2/COM3
PH1/COM2
PH0/COM1
D/A converter(2 channels)
Port 4
Port 9
P47 / AN7
P46 / AN6
P45 / AN5
P44 / AN4
P43 / AN3
P42 / AN2
P41 / AN1
P40 / AN0
P96/AN8/DA0
P97/AN9/DA1
Vref
AVcc
AVss
Port 1
P10 / TIOCA0
P11 / TIOCB0
P12 / TIOCC0 / TCLKA
P13 / TIOCD0 / TCLKB
P14 / TIOCA1/IRQ0
P15 / TIOCB1 / TCLKC
P16 / TIOCA2/IRQ1
P17 / TIOCB2/ TCLKD
PF3/ADTRG/IRQ3
PC break controller
(2 channels)
Peripheral data bus
DTC
Port F
P35/SCK1/SCL0/IRQ5
P34/RxD1/SDA0
P33/TxD1/SCL1
P32/SCK0/SDA1/IRQ4
P31/RxD0
P30/TxD0
Bus controller
Sub
Clock pulse
generator
H8S/2000 CPU
Interrupt controller
P70/TMRI01/TMCI01
P71/TMRI23/TMCI23
P72/TMO0
P73/TMO1
P74/TMO2
P75/TMO3/SCK2
P76/RxD2
P77/TxD2
Internal data bus
System
clock pulse
generator
MD2
MD1
EXTAL
XTAL
OSC1
OSC2
STBY
RES
NMI
FWE
Internal address bus
Port N
Figure 1.1 Internal Block Diagram of H8S/2268 Group
Rev. 5.00 Sep. 01, 2009 Page 3 of 656
REJ09B0071-0500
SEG40
SEG3 9
SEG38
SEG37
SEG36
SEG35
SEG34
SEG33
Port L
PL7/SEG24
PL6/SEG23
PL5/SEG22
PL4/SEG21
PL3/SEG20
PL2/SEG19
PL1/SEG18
PL0/SEG17
Port K
PK7/SEG16
PK6/SEG15
PK5/SEG14
PK4/SEG13
PK3/SEG12
PK2/SEG11
PK1/SEG10
PK0/SEG9
Port J
PJ7/WKP7/SEG8
PJ6/WKP6/SEG7
PJ5/WKP5/SEG6
PJ4/WKP4/SEG5
PJ3/WKP3/SEG4
PJ2/WKP2/SEG3
PJ1/WKP1/SEG2
PJ0/WKP0/SEG1
Port H
Peripheral address bus
Interrupt controller
Peripheral data bus
SEG32
SEG31
SEG30
SEG29
SEG28
SEG27
SEG26
SEG25
Bus controller
Internal data bus
Sub
Clock pulse
generator
H8S/2000 CPU
Internal address bus
System
clock pulse
generator
MD2
MD1
EXTAL
XTAL
OSC1
OSC2
STBY
RES
NMI
FWE
V1
V2
V3
CVcc
Vcc
Vss
Vss
Section 1 Overview
PH7
PH3/COM4
PH2/COM3
PH1/COM2
PH0/COM1
P70/TMRI01/TMCI01
P71
P72/TMO0
P73/TMO1
P74
P75/SCK2
P76/RxD2
P77/TxD2
Port 7
SCI (3 channels)
ROM
IIC (1 channel)
(option)
RAM
LCD (40SEG/4COM)
TPU (2 channels)
Port 3
WDT0
A/D converter (10 channels)
WDT1
(sub clock)
Port 4
Port 9
P96/AN8
P97/AN9
Vref
AVcc
AVss
P10
P11
P12/TCLKA
P13/TCLKB
P14/TIOCA1/IRQ0
P15/TIOCB1/TCLKC
P16/TIOCA2/IRQ1
P17/TIOCB2
Port 1
P47/AN7
P46/AN6
P45/AN5
P44/AN4
P43/AN3
P42/AN2
P41/AN1
P40/AN0
PF3/ADTRG/IRQ3
8 bit timer
(2 channels)
Port F
P35/SCK1/SCL0
P34/RxD1/SDA0
P33/TxD1
P32/SCK0/IRQ4
P31/RxD0
P30/TxD0
Figure 1.2 Internal Block Diagram of H8S/2264 Group
Rev. 5.00 Sep. 01, 2009 Page 4 of 656
REJ09B0071-0500
Section 1 Overview
1.3
Pin Arrangement
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
FP-100B
FP-100BV
TFP-100B
TFP-100BV
TFP-100G
TFP-100GV
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
P42/AN2
P43/AN3
P44/AN4
P45/AN5
P46/AN6
P47/AN7
P96/AN8/DA0
P97/AN9/DA1
AVss
P17/TIOCB2/TCLKD
P16/TIOCA2/IRQ1
P15/TIOCB1/TCLKC
P14/TIOCA1/IRQ0
P13/TIOCD0/TCLKB
P12/TIOCC0/TCLKA
P11/TIOCB0
P10/TIOCA0
PJ0/WKP0/SEG1
PJ1/WKP1/SEG2
PJ2/WKP2/SEG3
PJ3/WKP3/SEG4
PJ4/WKP4/SEG5
PJ5/WKP5/SEG6
PJ6/WKP6/SEG7
PJ7/WKP7/SEG8
PM6/SEG31
PM5/SEG30
PM4/SEG29
PM3/SEG28
PM2/SEG27
PM1/SEG26
PM0/SEG25
PL7/SEG24
PL6/SEG23
PL5/SEG22
PL4/SEG21
CVcc
PL3/SEG20
Vss
PL2/SEG19
PL1/SEG18
PL0/SEG17
PK7/SEG16
PK6/SEG15
PK5/SEG14
PK4/SEG13
PK3/SEG12
PK2/SEG11
PK1/SEG10
PK0/SEG9
P30/TxD0
P31/RxD0
P32/SCK0/SDA1/IRQ4
P33/TxD1/SCL1
P34/RxD1/SDA0
P35/SCK1/SCL0/IRQ5
PF3/ADTRG/IRQ3
C2
C1
V3
V2
V1
PH3/COM4
PH2/COM3
PH1/COM2
PH0/COM1
PN7/SEG40
PN6/SEG39
PN5/SEG38
PN4/SEG37
PN3/SEG36
PN2/SEG35
PN1/SEG34
PN0/SEG33
PM7/SEG32
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
P70/TMRI01/TMCI01
P71/TMRI23/TMCI23
P72/TMO0
P73/TMO1
P74/TMO2
P75/TMO3/SCK2
P76/RxD2
P77/TxD2
MD2
FWE
EXTAL
Vss
XTAL
Vcc
STBY
NMI
RES
OSC1
OSC2
MD1
PH7/TONED/TMCI4
AVcc
Vref
P40/AN0
P41/AN1
Figure 1.3 shows the pin arrangement of the H8S/2268 Group and figure 1.4 shows that of the
H8S/2264 Group.
Figure 1.3 Pin Arrangement of H8S/2268 Group
Rev. 5.00 Sep. 01, 2009 Page 5 of 656
REJ09B0071-0500
FP-100B
FP-100BV
TFP-100G
TFP-100GV
(TOP VIEW)
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
SEG31
SEG30
SEG29
SEG28
SEG27
SEG26
SEG25
PL7/SEG24
PL6/SEG23
PL5/SEG22
PL4/SEG21
CVcc
PL3/SEG20
Vss
PL2/SEG19
PL1/SEG18
PL0/SEG17
PK7/SEG16
PK6/SEG15
PK5/SEG14
PK4/SEG13
PK3/SEG12
PK2/SEG11
PK1/SEG10
PK0/SEG9
P30/TxD0
P31/RxD0
P32/SCK0/IRQ4
P33/TxD1
P34/RxD1/SDA0
P35/SCK1/SCL0
PF3/ADTRG/IRQ3
NC*
NC*
V3
V2
V1
PH3/COM4
PH2/COM3
PH1/COM2
PH0/COM1
SEG40
SEG39
SEG38
SEG37
SEG36
SEG35
SEG34
SEG33
SEG32
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
P70/TMRI01/TMCI01
P71
P72/TMO0
P73/TMO1
P74
P75/SCK2
P76/RxD2
P77/TxD2
MD2
FWE
EXTAL
Vss
XTAL
Vcc
STBY
NMI
RES
OSC1
OSC2
MD1
PH7
AVcc
Vref
P40/AN0
P41/AN1
Section 1 Overview
Note: * The NC pin should be open.
Figure 1.4 Pin Arrangement of H8S/2264 Group
Rev. 5.00 Sep. 01, 2009 Page 6 of 656
REJ09B0071-0500
P42/AN2
P43/AN3
P44/AN4
P45/AN5
P46/AN6
P47/AN7
P96/AN8
P97/AN9
AVss
P17/TIOCB2
P16/TIOCA2/IRQ1
P15/TIOCB1/TCLKC
P14/TIOCA1/IRQ0
P13/TCLKB
P12/TCLKA
P11
P10
PJ0/WKP0/SEG1
PJ1/WKP1/SEG2
PJ2/WKP2/SEG3
PJ3/WKP3/SEG4
PJ4/WKP4/SEG5
PJ5/WKP5/SEG6
PJ6/WKP6/SEG7
PJ7/WKP7/SEG8
Section 1 Overview
1.4
Pin Functions
Table 1.1 lists the pins functions.
Table 1.1
Pin Functions
Type
Symbol
Pin NO.
I/O
Function
Power
supply
Vcc
62
Input
Power supply pin. Connect this pin to the system
power supply.
CVcc
12
Input
Connect this pin to Vss via a capacitor
(H8S/2268 Group: 0.1 μF/0.2 μF and H8S/2264
Group: 0.2 μF) for voltage stabilization. Note that
applying a voltage exceeding 4.3 V, the absolute
maximum rating, to the CVcc pin may cause fatal
damages on this LSI. Do not connect the power
supply to the CVcc pin. See section 23, Power
Supply Circuit, for connecting examples.
V3
V2
V1
85
86
87
Input
Power supply pins for the LCD controller/driver.
With an internal power supply division resistor,
these pins are normally left open. Power supply
should be within the range of Vcc ≥ V1 ≥ V2 ≥ V3
1
≥ Vss. When the triple step-up voltage circuit* is
used, the V3 pin is used for the LCD input
reference power supply.
Vss
14
64
Input
Ground pins. Connect this pin to the system
power supply (0 V).
XTAL
63
Input
EXTAL
65
Input
For connection to a crystal resonator. This pin
can be also used for external clock input. For
examples of crystal resonator connection and
external clock input, see section 21, Clock Pulse
Generator.
OSC1
58
Input
OSC2
57
Input
Operating
MD2, MD1 67
mode control
56
Input
Clock
Connects to a 32.768 kHz crystal resonator. See
section 21, Clock Pulse Generator, for typical
connection diagrams for a crystal resonator.
Sets the operating mode. Inputs at these pins
should not be changed during operation. Be sure
to fix the levels of the mode pins (MD2, MD1) by
pull-down or pull-up, except for mode changing.
Rev. 5.00 Sep. 01, 2009 Page 7 of 656
REJ09B0071-0500
Section 1 Overview
Type
Symbol
Pin NO.
I/O
Function
System
control
RES*
59
Input
Reset input pin. When this pin is low, the chip
enters in the power-on reset state.
2
STBY*
61
Input
When this pin is low, a transition is made to
hardware standby mode.
FWE
66
Input
Enables/disables programming the flash
memory.
60
Input
Nonmaskable interrupt pin. If this pin is not used,
it should be fixed-high.
81
78
82
40
38
Input
These pins request a maskable interrupt.
26 to 33
Input
These pins request a wakeup interrupt. This
interrupt is maskable.
41
39
37
36
Input
These pins input an external clock.
TIOCA0*
1
TIOCB0*
1
*
TIOCC0
1
TIOCD0*
34
35
36
37
Input/
Output
Pins for the TGRA_0 to TGRD_0 input capture
input or output compare output, or PWM output.
TIOCA1
TIOCB1
38
39
Input/
Output
Pins for the TGRA_1 and TGRB_1 input capture
input or output compare output, or PWM output.
TIOCA2
TIOCB2
40
41
Input/
Output
Pins for the TGRA_2 and TGRB_2 input capture
input or output compare output, or PWM output.
TMO3*
1
TMO2*
TMO1
TMO0
70
71
72
73
Output
Compare-match output pins
Interrupts
NMI*
2
2
IRQ5*
IRQ4
IRQ3
IRQ1
IRQ0
1
WKP7 to
WKP0
1
16-bit timer- TCLKD*
pulse unit
TCLKC
(TPU)
TCLKB
TCLKA
1
8-bit timer
1
TMCI23*
TMCI01
1
TMCI4*
1
74
75
55
Input
Pins for external clock input to the counter
TMRI23*
TMRI01
1
74
75
Input
Counter reset input pins.
Rev. 5.00 Sep. 01, 2009 Page 8 of 656
REJ09B0071-0500
Section 1 Overview
Type
Symbol
Pin NO.
I/O
Function
Serial
communication
Interface
(SCI)/smart
card
interface
TxD2
TxD1
TxD0
68
79
76
Output
Data output pins
RxD2
RxD1
RxD0
69
80
77
Input
Data input pins
SCK2
SCK1
SCK0
1
SCL1*
SCL0
70
81
78
Input/
Output
Clock input/output pins.
79
81
Input/
Output
I C clock input/output pins.
SDA1*
SDA0
78
80
Input/
Output
I C data input/output pins.
AN9 to
AN0
43 to 52
Input
Analog input pins
ADTRG
82
Input
Pin for input of an external trigger to start A/D
conversion
D/A
1
converter*
DA1
DA0
43
44
Output
Analog output pins for the D/A converter* .
A/D
converter,
D/A
1
converter*
AVcc
54
Input
Power supply pin for the A/D converter, D/A
1
1
converter* and DTMF generation circuit* . If
1
none of the A/D converter, D/A converter* and
1
*
DTMF generation circuit is used, connect this
pin to the system power supply (Vcc level).
AVss
42
Input
Ground pin for the A/D converter, D/A
1
1
converter* , and DTMF generator* . Connect this
pin to the system power supply (0 V).
Vref
53
Input
Reference voltage input pin for the A/D converter
1
and D/A converter* . If neither the A/D converter
1
*
nor D/A converter is used, connect this pin to
the system power supply (Vcc level).
2
I C bus
3
interface*
A/D
converter
1
SCK1 outputs NMOS push-pull.
2
These pins drive bus. The output of SCL0 is
NMOS open drain.
2
These pins drive bus. The output of SDA0 is
NMOS open drain.
1
Rev. 5.00 Sep. 01, 2009 Page 9 of 656
REJ09B0071-0500
Section 1 Overview
Type
Symbol
LCD
controller/
driver
SEG40 to 92 to 100, Output
SEG 1
1 to 11,
13, 15 to
33
LCD segment output pins
COM4 to
COM1
88 to 91
Output
LCD common output pins
C2*
1
C1*
83
84
—
Pins for the step-up voltage capacitor of the LCD
drive power supply.
DTMF
generation
1
circuit*
TONED
55
Output
DTMF signal output pin.
I/O ports
P17 to
P10
41 to 34
Input/
Output
8-bit I/O pins
P35 to
P30
81 to 76
Input/
Output
6-bit I/O pins
P47 to
P40
45 to 52
Input
8-bit input pins
P77 to
P70
68 to 75
Input/
Output
8-bit I/O pins
P97
P96
43
44
Input
2-bit input pins
PF3
82
Input/
Output
1-bit I/O pin
1
Pin NO.
I/O
Function
P34 and P35 output NMOS push-pull.
PH7
55
Input
1-bit input pin
PH3 to
PH0
88 to 91
Input/
Output
4-bit I/O pins
PJ7 to PJ0 26 to 33
Input/
Output
8-bit I/O pins
PK7 to
PK0
18 to 25
Input/
Output
8-bit I/O pins
PL7
PL6
PL5
PL4
PL3
PL2
PL1
PL0
8
9
10
11
13
15
16
17
Input/
Output
8-bit I/O pins
Rev. 5.00 Sep. 01, 2009 Page 10 of 656
REJ09B0071-0500
Section 1 Overview
Type
Symbol
Pin NO.
I/O
Function
I/O ports
PM7*
1
PM6*
1
PM5*
1
PM4*
1
*
PM3
1
*
PM2
1
PM1*
1
PM0*
100
1
2
3
4
5
6
7
Input/
Output
8-bit I/O pins
PN7 to
1
PN0*
92 to 99
Input/
Output
8-bit I/O pins
1
Notes: 1. Supported only by the H8S/2268 Group.
2. Countermeasure against noise should be executed or may result in malfunction.
3. Supported as an option by H8S/2264 Group.
Rev. 5.00 Sep. 01, 2009 Page 11 of 656
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Section 1 Overview
Rev. 5.00 Sep. 01, 2009 Page 12 of 656
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Section 2 CPU
Section 2 CPU
The H8S/2000 CPU is a high-speed central processing unit with an internal 32-bit architecture that
is upward-compatible with the H8/300 and H8/300H CPUs. The H8S/2000 CPU has sixteen 16-bit
general registers, can address a 16-Mbyte linear address space, and is ideal for realtime control.
This section describes the H8S/2000 CPU. The usable modes and address spaces differ depending
on the product. For details on each product, refer to section 3, MCU Operating Modes.
2.1
Features
• Upward-compatible with H8/300 and H8/300H CPU
⎯ Can execute H8/300 and H8/300H CPU object programs
• General-register architecture
⎯ Sixteen 16-bit general registers also usable as sixteen 8-bit registers or eight 32-bit registers
• Sixty-five basic instructions
⎯ 8/16/32-bit arithmetic and logic instructions
⎯ Multiply and divide instructions
⎯ Powerful bit-manipulation instructions
• Eight addressing modes
⎯ Register direct [Rn]
⎯ Register indirect [@ERn]
⎯ Register indirect with displacement [@(d:16,ERn) or @(d:32,ERn)]
⎯ Register indirect with post-increment or pre-decrement [@ERn+ or @–ERn]
⎯ Absolute address [@aa:8, @aa:16, @aa:24, or @aa:32]
⎯ Immediate [#xx:8, #xx:16, or #xx:32]
⎯ Program-counter relative [@(d:8,PC) or @(d:16,PC)]
⎯ Memory indirect [@@aa:8]
• 16-Mbyte address space
⎯ Program: 16 Mbytes
⎯ Data:
16 Mbytes
• High-speed operation
⎯ All frequently-used instructions execute in one or two states
⎯ 8/16/32-bit register-register add/subtract: 1 state
⎯ 8 × 8-bit register-register multiply:
12 states
⎯ 16 ÷ 8-bit register-register divide:
12 states
CPUS213A_000020020700
Rev. 5.00 Sep. 01, 2009 Page 13 of 656
REJ09B0071-0500
Section 2 CPU
⎯ 16 × 16-bit register-register multiply:
20 states
⎯ 32 ÷ 16-bit register-register divide:
20 states
• Two CPU operating modes
⎯ Normal mode*
⎯ Advanced mode
• Power-down state
⎯ Transition to power-down state by a SLEEP instruction
⎯ CPU clock speed selection
Note: * Normal mode is not available in this LSI.
2.1.1
Differences between H8S/2600 CPU and H8S/2000 CPU
The differences between the H8S/2600 CPU and the H8S/2000 CPU are shown below.
• Register configuration
⎯ The MAC register is supported by the H8S/2600 CPU only.
• Basic instructions
⎯ The four instructions MAC, CLRMAC, LDMAC, and STMAC are supported by the
H8S/2600 CPU only.
• The number of execution states of the MULXU and MULXS instructions;
Execution States
Instruction
Mnemonic
H8S/2600
H8S/2000
MULXU
MULXU.B Rs, Rd
3
12
MULXU.W Rs, ERd
4
20
MULXS.B Rs, Rd
4
13
MULXS.W Rs, ERd
5
21
MULXS
In addition, there are differences in address space, CCR and EXR* register functions, and powerdown modes, etc., depending on the model.
Note: * Supported only by the H8S/2268 Group.
Rev. 5.00 Sep. 01, 2009 Page 14 of 656
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Section 2 CPU
2.1.2
Differences from H8/300 CPU
In comparison to the H8/300 CPU, the H8S/2000 CPU has the following enhancements:
• More general registers and control registers
⎯ Eight 16-bit expanded registers, and one 8-bit and two 32-bit control registers, have been
added.
• Expanded address space
⎯ Normal mode supports the same 64-kbyte address space as the H8/300 CPU.
⎯ Advanced mode supports a maximum 16-Mbyte address space.
• Enhanced addressing
⎯ The addressing modes have been enhanced to make effective use of the 16-Mbyte address
space.
• Enhanced instructions
⎯ Addressing modes of bit-manipulation instructions have been enhanced.
⎯ Signed multiply and divide instructions have been added.
⎯ Two-bit shift instructions have been added.
⎯ Instructions for saving and restoring multiple registers have been added.
⎯ A test and set instruction has been added.
• Higher speed
⎯ Basic instructions execute twice as fast.
2.1.3
Differences from H8/300H CPU
In comparison to the H8/300H CPU, the H8S/2000 CPU has the following enhancements:
• Additional control register
⎯ One 8-bit control registers have been added.
• Enhanced instructions
⎯ Addressing modes of bit-manipulation instructions have been enhanced.
⎯ Two-bit shift instructions have been added.
⎯ Instructions for saving and restoring multiple registers have been added.
⎯ A test and set instruction has been added.
• Higher speed
⎯ Basic instructions execute twice as fast.
Rev. 5.00 Sep. 01, 2009 Page 15 of 656
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Section 2 CPU
2.2
CPU Operating Modes
The H8S/2000 CPU has two operating modes: normal and advanced. Normal mode supports a
maximum 64-kbyte address space. Advanced mode supports a maximum 16-Mbyte total address
space. The mode is selected by the mode pins.
2.2.1
Normal Mode
The exception vector table and stack have the same structure as in the H8/300 CPU.
• Address Space
Linear access is provided to a maximum address space of 64 kbytes.
• Extended Registers (En)
The extended registers (E0 to E7) can be used as 16-bit registers, or as the upper 16-bit
segments of 32-bit registers. When En is used as a 16-bit register it can contain any value, even
when the corresponding general register (Rn) is used as an address register. If the general
register is referenced in the register indirect addressing mode with pre-decrement (@–Rn) or
post-increment (@Rn+) and a carry or borrow occurs, however, the value in the corresponding
extended register (En) will be affected.
• Instruction Set
All instructions and addressing modes can be used. Only the lower 16 bits of effective
addresses (EA) are valid.
• Exception Vector Table and Memory Indirect Branch Addresses
In normal mode the top area starting at H'0000 is allocated to the exception vector table. One
branch address is stored per 16 bits. Figure 2.1 shows the structure of the exception vector
table in normal mode. For details of the exception vector table, see section 4, Exception
Handling.
The memory indirect addressing mode (@@aa:8) employed in the JMP and JSR instructions
uses an 8-bit absolute address included in the instruction code to specify a memory operand
that contains a branch address. In normal mode the operand is a 16-bit word operand,
providing a 16-bit branch address. Branch addresses can be stored in the top area from H'0000
to H'00FF. Note that this area is also used for the exception vector table.
• Stack Structure
When the program counter (PC) is pushed onto the stack in a subroutine call, and the PC,
condition-code register (CCR) and extended control register (EXR) are pushed onto the stack
in exception handling, they are stored as shown in figure 2.2. EXR is not pushed onto the stack
in interrupt control mode 0. For details, see section 4, Exception Handling.
Note: * Normal mode is not available in this LSI.
Rev. 5.00 Sep. 01, 2009 Page 16 of 656
REJ09B0071-0500
Section 2 CPU
H'0000
H'0001
H'0002
H'0003
H'0004
H'0005
H'0006
H'0007
H'0008
H'0009
H'000A
H'000B
Reset exception vector
(Reserved for system use)
Exception
vector table
Exception vector 1
Exception vector 2
Figure 2.1 Exception Vector Table (Normal Mode)
SP
PC
(16 bits)
EXR*1
SP
(SP
*2
Reserved*1 *3
)
CCR
CCR*3
PC
(16 bits)
(a) Subroutine Branch
(b) Exception Handling
Notes: 1. When EXR is not used it is not stored on the stack.
2. SP when EXR is not used.
3. lgnored when returning.
Figure 2.2 Stack Structure in Normal Mode
Rev. 5.00 Sep. 01, 2009 Page 17 of 656
REJ09B0071-0500
Section 2 CPU
2.2.2
Advanced Mode
• Address Space
Linear access is provided to a maximum 16-Mbyte address space.
• Extended Registers (En)
The extended registers (E0 to E7) can be used as 16-bit registers, or as the upper 16-bit
segments of 32-bit registers or address registers.
• Instruction Set
All instructions and addressing modes can be used.
• Exception Vector Table and Memory Indirect Branch Addresses
In advanced mode, the top area starting at H'00000000 is allocated to the exception vector
table in units of 32 bits. In each 32 bits, the upper 8 bits are ignored and a branch address is
stored in the lower 24 bits (figure 2.3). For details of the exception vector table, see section 4,
Exception Handling.
H'00000000
Reserved
Reset exception vector
H'00000003
H'00000004
H'00000007
H'00000008
Exception vector table
Exception vector 3
H'0000000B
H'0000000C
H'00000010
Reserved
Exception vector 1
Figure 2.3 Exception Vector Table (Advanced Mode)
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Section 2 CPU
The memory indirect addressing mode (@@aa:8) employed in the JMP and JSR instructions
uses an 8-bit absolute address included in the instruction code to specify a memory operand
that contains a branch address. In advanced mode, the operand is a 32-bit longword operand,
providing a 32-bit branch address. The upper 8 bits of these 32 bits is a reserved area that is
regarded as H'00. Branch addresses can be stored in the area from H'00000000 to H'000000FF.
Note that the first part of this range is also the exception vector table.
• Stack Structure
In advanced mode, when the program counter (PC) is pushed onto the stack in a subroutine
call, and the PC, condition-code register (CCR), and extended control register (EXR*) are
pushed onto the stack in exception handling, they are stored as shown in figure 2.4. When
EXR* is invalid, it is not pushed onto the stack. For details, see section 4, Exception Handling.
Note: * Supported only by the H8S/2268 Group.
EXR*1 *4
SP
SP
Reserved
PC
(24 bits)
(a) Subroutine Branch
Reserved*1 *3 *4
*2
(SP
)
CCR
PC
(24 bits)
(b) Exception Handling
Notes: 1. When EXR is not used it is not stored on the stack.
2. SP when EXR is not used (The H8S/2264 Group SP always points here).
3. Ignored when returning.
4. Supported only by the H8S/2268 Group.
Figure 2.4 Stack Structure in Advanced Mode
Rev. 5.00 Sep. 01, 2009 Page 19 of 656
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Section 2 CPU
2.3
Address Space
Figure 2.5 shows a memory map of the H8S/2000 CPU. The H8S/2000 CPU provides linear
access to a maximum 64-kbyte address space in normal mode, and a maximum 16-Mbyte
(architecturally 4-Gbyte) address space in advanced mode. The usable modes and address spaces
differ depending on the product. For details on each product, refer to section 3, MCU Operating
Modes.
H'0000
H'00000000
64 kbytes
H'FFFF
16 Mbytes
H'00FFFFFF
Data area
H'FFFFFFFF
(a) Normal Mode
(b) Advanced Mode
Note: Normal mode is not available in this LSI
Figure 2.5 Memory Map
Rev. 5.00 Sep. 01, 2009 Page 20 of 656
REJ09B0071-0500
Program area
Section 2 CPU
2.4
Register Configuration
The H8S/2000 CPU has the internal registers shown in figure 2.6. There are two types of registers:
general registers and control registers. Control registers are a 24-bit program counter (PC), an 8bit extended control register (EXR*), and an 8-bit condition code register (CCR).
Note: * Supported only by the H8S/2268 Group.
General Registers (Rn) and Extended Registers (En)
15
0 7
0 7
0
ER0
E0
R0H
R0L
ER1
E1
R1H
R1L
ER2
E2
R2H
R2L
ER3
E3
R3H
R3L
ER4
E4
R4H
R4L
ER5
E5
R5H
R5L
ER6
E6
R6H
R6L
ER7 (SP)
E7
R7H
R7L
Control Registers (CR)
23
0
PC
7 6 5 4 3 2 1 0
- - - - I2 I1 I0
EXR*1 T
7 6 5 4 3 2 1 0
CCR I UI H U N Z V C
Legend:
SP
PC
EXR
T
I2 to I0
CCR
I
UI
: Stack pointer
: Program counter
: Extended control register*1
: Trace bit*1
: Interrupt mask bits*1
: Condition-code register*1
H
U
N
Z
V
C
: Half-carry flag
: User bit
: Negative flag
: Zero flag
: Overflow flag
: Carry flag
: Interrupt mask bit
: User bit or interrupt mask bit*2
Notes: 1. Supported only by the H8S/2268 Group.
2. The interrupt mask bit is not available in this LSI.
Figure 2.6 CPU Registers
Rev. 5.00 Sep. 01, 2009 Page 21 of 656
REJ09B0071-0500
Section 2 CPU
2.4.1
General Registers
The H8S/2000 CPU has eight 32-bit general registers. These general registers are all functionally
alike and can be used as both address registers and data registers. When a general register is used
as a data register, it can be accessed as a 32-bit, 16-bit, or 8-bit register. Figure 2.7 illustrates the
usage of the general registers.
When the general registers are used as 32-bit registers or address registers, they are designated by
the letters ER (ER0 to ER7).
The ER registers divide into 16-bit general registers designated by the letters E (E0 to E7) and R
(R0 to R7). These registers are functionally equivalent, providing a maximum sixteen 16-bit
registers. The E registers (E0 to E7) are also referred to as extended registers.
The R registers divide into 8-bit general registers designated by the letters RH (R0H to R7H) and
RL (R0L to R7L). These registers are functionally equivalent, providing a maximum sixteen 8-bit
2egisters.
The usage of each register can be selected independently.
General register ER7 has the function of stack pointer (SP) in addition to its general-register
function, and is used implicitly in exception handling and subroutine calls. Figure 2.8 shows the
stack.
• Address registers
• 32-bit registers
• 16-bit registers
• 8-bit registers
E registers (extended registers)
(E0 to E7)
ER registers
(ER0 to ER7)
RH registers
(R0H to R7H)
R registers
(R0 to R7)
RL registers
(R0L to R7L)
Figure 2.7 Usage of General Registers
Rev. 5.00 Sep. 01, 2009 Page 22 of 656
REJ09B0071-0500
Section 2 CPU
Free area
SP (ER7)
Stack area
Figure 2.8 Stack Status
2.4.2
Program Counter (PC)
This 24-bit counter indicates the address of the next instruction the CPU will execute. The length
of all CPU instructions is 2 bytes (one word), so the least significant PC bit is ignored. (When an
instruction is fetched, the least significant PC bit is regarded as 0.)
2.4.3
Extended Control Register (EXR) (H8S/2268 Group Only)
EXR is an 8-bit register that manipulates the LDC, STC, ANDC, ORC, and XORC instructions.
When these instructions except for the STC instruction is executed, all interrupts including NMI
will be masked for three states after execution is completed.
Bit
Bit Name
Initial
Value
R/W
Description
7
T
0
R/W
Trace Bit
When this bit is set to 1, a trace exception is generated
each time an instruction is executed. When this bit is
cleared to 0, instructions are executed in sequence.
6 to 3
⎯
1
⎯
Reserved
These bits are always read as 1.
2
I2
1
R/W
1
I1
1
R/W
0
I0
1
R/W
These bits designate the interrupt mask level (0 to 7). For
details, refer to section 5, Interrupt Controller.
Rev. 5.00 Sep. 01, 2009 Page 23 of 656
REJ09B0071-0500
Section 2 CPU
2.4.4
Condition-Code Register (CCR)
This 8-bit register contains internal CPU status information, including an interrupt mask bit (I) and
half-carry (H), negative (N), zero (Z), overflow (V), and carry (C) flags.
Operations can be performed on the CCR bits by the LDC, STC, ANDC, ORC, and XORC
instructions. The N, Z, V, and C flags are used as branching conditions for conditional branch
(Bcc) instructions.
Bit
Bit Name
Initial
Value
R/W
Description
7
I
1
R/W
Interrupt Mask Bit
Masks interrupts other than NMI when set to 1. NMI is
accepted regardless of the I bit setting. The I bit is set
to 1 by hardware at the start of an exception-handling
sequence. For details, refer to section 5, Interrupt
Controller.
6
UI
Undefined R/W
User Bit or Interrupt Mask Bit
Can be written and read by software using the LDC,
STC, ANDC, ORC, and XORC instructions. This bit
cannot be used as an interrupt mask bit in this LSI.
5
H
Undefined R/W
Half-Carry Flag
When the ADD.B, ADDX.B, SUB.B, SUBX.B, CMP.B,
or NEG.B instruction is executed, this flag is set to 1 if
there is a carry or borrow at bit 3, and cleared to 0
otherwise. When the ADD.W, SUB.W, CMP.W, or
NEG.W instruction is executed, the H flag is set to 1 if
there is a carry or borrow at bit 11, and cleared to 0
otherwise. When the ADD.L, SUB.L, CMP.L, or NEG.L
instruction is executed, the H flag is set to 1 if there is a
carry or borrow at bit 27, and cleared to 0 otherwise.
4
U
Undefined R/W
User Bit
Can be written and read by software using the LDC,
STC, ANDC, ORC, and XORC instructions.
3
N
Undefined R/W
Negative Flag
Stores the value of the most significant bit of data as a
sign bit.
2
Z
Undefined R/W
Zero Flag
Set to 1 to indicate zero data, and cleared to 0 to
indicate non-zero data.
Rev. 5.00 Sep. 01, 2009 Page 24 of 656
REJ09B0071-0500
Section 2 CPU
Bit
Bit Name
Initial
Value
1
V
Undefined R/W
R/W
Description
Overflow Flag
Set to 1 when an arithmetic overflow occurs, and
cleared to 0 at other times.
0
C
Undefined R/W
Carry Flag
Set to 1 when a carry occurs, and cleared to 0
otherwise. Used by:
•
Add instructions, to indicate a carry
•
Subtract instructions, to indicate a borrow
•
Shift and rotate instructions, to indicate a carry
The carry flag is also used as a bit accumulator by bit
manipulation instructions.
2.4.5
Initial Values of CPU Registers
Reset exception handling loads the CPU's program counter (PC) from the vector table, clears the
trace bit in EXR* to 0, and sets the interrupt mask bits in CCR and EXR* to 1. The other CCR bits
and the general registers are not initialized. In particular, the stack pointer (ER7) is not initialized.
The stack pointer should therefore be initialized by an MOV.L instruction executed immediately
after a reset.
Note: * Supported only by the H8S/2268 Group.
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Section 2 CPU
2.5
Data Formats
The H8S/2000 CPU can process 1-bit, 4-bit (BCD), 8-bit (byte), 16-bit (word), and 32-bit
(longword) data. Bit-manipulation instructions operate on 1-bit data by accessing bit n (n = 0, 1, 2,
…, 7) of byte operand data. The DAA and DAS decimal-adjust instructions treat byte data as two
digits of 4-bit BCD data.
2.5.1
General Register Data Formats
Figure 2.9 shows the data formats in general registers.
Data Type
Register Number
Data Format
7
1-bit data
RnH
1-bit data
RnL
4-bit BCD data
RnH
4-bit BCD data
RnL
Byte data
RnH
0
Don't care
7 6 5 4 3 2 1 0
7
Don't care
7
4 3
Upper
0
7 6 5 4 3 2 1 0
0
Lower
Don't care
7
Don't care
7
4 3
Upper
0
Don't care
MSB
LSB
7
Byte data
RnL
0
Don't care
MSB
Figure 2.9 General Register Data Formats (1)
Rev. 5.00 Sep. 01, 2009 Page 26 of 656
REJ09B0071-0500
0
Lower
LSB
Section 2 CPU
Data Type
Register Number
Word data
Rn
Data Format
15
0
MSB
Word data
15
0
MSB
Longword data
LSB
En
LSB
ERn
31
16 15
MSB
En
0
Rn
LSB
Legend:
ERn:
En:
Rn:
RnH:
RnL:
MSB:
LSB:
General register ER
General register E
General register R
General register RH
General register RL
Most significant bit
Least significant bit
Figure 2.9 General Register Data Formats (2)
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Section 2 CPU
2.5.2
Memory Data Formats
Figure 2.10 shows the data formats in memory. The H8S/2000 CPU can access word data and
longword data in memory, but word or longword data must begin at an even address. If an attempt
is made to access word or longword data at an odd address, no address error occurs but the least
significant bit of the address is regarded as 0, so the access starts at the preceding address. This
also applies to instruction fetches.
When ER7 is used as an address register to access the stack, the operand size should be word or
longword.
Data Type
Address
Data Format
1-bit data
Address L
7
Byte data
Address L
MSB
Word data
Address 2M
MSB
7
0
6
5
4
3
2
Address 2N
0
LSB
LSB
Address 2M + 1
Longword data
1
MSB
Address 2N + 1
Address 2N + 2
Address 2N + 3
Figure 2.10 Memory Data Formats
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LSB
Section 2 CPU
2.6
Instruction Set
The H8S/2000 CPU has 65 types of instructions. The instructions are classified by function in
table 2.1.
Table 2.1
Instruction Classification
Function
Instructions
Size
Types
Data transfer
MOV
1
1
POP* , PUSH*
B/W/L
5
Arithmetic
operations
W/L
5
5
LDM* , STM*
3
3
MOVFPE* , MOVTPE*
B
ADD, SUB, CMP, NEG
B/W/L
ADDX, SUBX, DAA, DAS
B
INC, DEC
B/W/L
L
19
ADDS, SUBS
L
MULXU, DIVXU, MULXS, DIVXS
B/W
EXTU, EXTS
4
TAS*
W/L
B
Logic operations
AND, OR, XOR, NOT
B/W/L
4
Shift
SHAL, SHAR, SHLL, SHLR, ROTL, ROTR, ROTXL, ROTXR B/W/L
8
Bit manipulation
BSET, BCLR, BNOT, BTST, BLD, BILD, BST, BIST, BAND, B
BIAND, BOR, BIOR, BXOR, BIXOR
2
Bcc* , JMP, BSR, JSR, RTS
⎯
14
5
⎯
9
⎯
1
Branch
System control
TRAPA, RTE, SLEEP, LDC, STC, ANDC, ORC, XORC,
NOP
Block data transfer EEPMOV
Total: 65
Legend:
B: Byte
W: Word
L: Longword
Notes: 1. POP.W Rn and PUSH.W Rn are identical to MOV.W @SP+, Rn and MOV.W Rn,
@-SP. POP.L ERn and PUSH.L ERn are identical to MOV.L @SP+, ERn and MOV.L
ERn, @-SP.
2. Bcc is the general name for conditional branch instructions.
3. Cannot be used in this LSI.
4. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction.
5. Only register ER0 to ER6 should be used when using the STM/LDM instruction.
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Section 2 CPU
2.6.1
Table of Instructions Classified by Function
Tables 2.3 to 2.10 summarize the instructions in each functional category. The notation used in
tables 2.3 to 2.10 is defined below.
Table 2.2
Operation Notation
Symbol
Description
Rd
Rs
General register (destination) *
1
General register (source) *
Rn
1
General register*
ERn
General register (32-bit register)
(EAd)
Destination operand
(EAs)
Source operand
EXR
2
Extended control register*
CCR
Condition-code register
N
N (negative) flag in CCR
Z
Z (zero) flag in CCR
V
V (overflow) flag in CCR
C
C (carry) flag in CCR
PC
Program counter
SP
Stack pointer
#IMM
Immediate data
disp
Displacement
+
Addition
–
Subtraction
×
Multiplication
÷
Division
∧
Logical AND
∨
Logical OR
⊕
Logical XOR
→
Move
¬
NOT (logical complement)
:8/:16/:24/:32
8-, 16-, 24-, or 32-bit length
1
Notes: 1. General registers include 8-bit registers (R0H to R7H, R0L to R7L), 16-bit registers (R0
to R7, E0 to E7), and 32-bit registers (ER0 to ER7).
2. Supported only by the H8S/2268 Group.
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Section 2 CPU
Table 2.3
Data Transfer Instructions
Instruction
Size*
Function
MOV
B/W/L
(EAs) → Rd, Rs → (EAd)
Moves data between two general registers or between a general register
and memory, or moves immediate data to a general register.
MOVFPE
B
Cannot be used in this LSI.
1
MOVTPE
B
Cannot be used in this LSI.
POP
W/L
@SP+ → Rn
Pops a general register from the stack. POP.W Rn is identical to MOV.W
@SP+, Rn. POP.L ERn is identical to MOV.L @SP+, ERn.
PUSH
W/L
Rn → @–SP
Pushes a general register onto the stack. PUSH.W Rn is identical to
MOV.W Rn, @–SP. PUSH.L ERn is identical to MOV.L ERn, @–SP.
2
LDM*
L
@SP+ → Rn (register list)
Pops two or more general registers from the stack.
2
STM*
L
Rn (register list) → @–SP
Pushes two or more general registers onto the stack.
Notes: 1. Refers to the operand size.
B: Byte
W: Word
L: Longword
2. Only register ER0 to ER6 should be used when using the STM/LDM instruction.
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Section 2 CPU
Table 2.4
Arithmetic Operations Instructions (1)
Instruction
Size*
Function
ADD
B/W/L
Rd ± Rs → Rd, Rd ± #IMM → Rd
Performs addition or subtraction on data in two general registers, or on
immediate data and data in a general register (immediate byte data
cannot be subtracted from byte data in a general register. Use the SUBX
or ADD instruction.)
B
Rd ± Rs ± C → Rd, Rd ± #IMM ± C → Rd
Performs addition or subtraction with carry on byte data in two general
registers, or on immediate data and data in a general register.
B/W/L
Rd ± 1 → Rd, Rd ± 2 → Rd
Increments or decrements a general register by 1 or 2. (Byte operands
can be incremented or decremented by 1 only.)
L
Rd ± 1 → Rd, Rd ± 2 → Rd, Rd ± 4 → Rd
Adds or subtracts the value 1, 2, or 4 to or from data in a 32-bit register.
B
Rd decimal adjust → Rd
Decimal-adjusts an addition or subtraction result in a general register by
referring to the CCR to produce 4-bit BCD data.
MULXU
B/W
Rd × Rs → Rd
Performs unsigned multiplication on data in two general registers: either
8 bits × 8 bits → 16 bits or 16 bits ×
16 bits → 32 bits.
MULXS
B/W
Rd × Rs → Rd
Performs signed multiplication on data in two general registers: either 8
bits × 8 bits → 16 bits or 16 bits ×
16 bits → 32 bits.
DIVXU
B/W
Rd ÷ Rs → Rd
Performs unsigned division on data in two general registers: either 16
bits ÷ 8 bits → 8-bit quotient and 8-bit remainder or 32 bits ÷ 16 bits →
16-bit quotient and 16-bit remainder.
SUB
ADDX
SUBX
INC
DEC
ADDS
SUBS
DAA
DAS
Note: * Refers to the operand size.
B: Byte
W: Word
L: Longword
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Section 2 CPU
Table 2.4
Arithmetic Operations Instructions (2)
Instruction
Size*
Function
DIVXS
B/W
Rd ÷ Rs → Rd
Performs signed division on data in two general registers: either 16 bits ÷
8 bits → 8-bit quotient and 8-bit remainder or 32 bits ÷ 16 bits → 16-bit
quotient and 16-bit remainder.
CMP
B/W/L
Rd – Rs, Rd – #IMM
Compares data in a general register with data in another general register
or with immediate data, and sets CCR bits according to the result.
NEG
B/W/L
0 – Rd → Rd
Takes the two's complement (arithmetic complement) of data in a
general register.
EXTU
W/L
Rd (zero extension) → Rd
Extends the lower 8 bits of a 16-bit register to word size, or the lower 16
bits of a 32-bit register to longword size, by padding with zeros on the
left.
EXTS
W/L
Rd (sign extension) → Rd
Extends the lower 8 bits of a 16-bit register to word size, or the lower 16
bits of a 32-bit register to longword size, by extending the sign bit.
TAS*
B
@ERd – 0, 1 → (<bit 7> of @ERd)
Tests memory contents, and sets the most significant bit (bit 7) to 1.
2
1
Notes: 1. Refers to the operand size.
B: Byte
W: Word
L: Longword
2. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction.
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Section 2 CPU
Table 2.5
Logic Operations Instructions
Instruction
Size*
Function
AND
B/W/L
Rd ∧ Rs → Rd, Rd ∧ #IMM → Rd
Performs a logical AND operation on a general register and another
general register or immediate data.
OR
B/W/L
Rd ∨ Rs → Rd, Rd ∨ #IMM → Rd
Performs a logical OR operation on a general register and another
general register or immediate data.
XOR
B/W/L
Rd ⊕ Rs → Rd, Rd ⊕ #IMM → Rd
Performs a logical exclusive OR operation on a general register and
another general register or immediate data.
NOT
B/W/L
¬ (Rd) → (Rd)
Takes the one's complement of general register contents.
Note: * Refers to the operand size.
B: Byte
W: Word
L: Longword
Table 2.6
Shift Instructions
Instruction
Size*
Function
SHAL
B/W/L
Rd (shift) → Rd
Performs an arithmetic shift on general register contents.
1-bit or 2-bit shifts are possible.
B/W/L
Rd (shift) → Rd
Performs a logical shift on general register contents.
1-bit or 2-bit shifts are possible.
B/W/L
Rd (rotate) → Rd
Rotates general register contents.
1-bit or 2-bit rotations are possible.
B/W/L
Rd (rotate) → Rd
Rotates general register contents through the carry flag.
1-bit or 2-bit rotations are possible.
SHAR
SHLL
SHLR
ROTL
ROTR
ROTXL
ROTXR
Note: * Refers to the operand size.
B: Byte
W: Word
L: Longword
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Section 2 CPU
Table 2.7
Bit Manipulation Instructions (1)
Instruction
Size*
Function
BSET
B
1 → (<bit-No.> of <EAd>)
Sets a specified bit in a general register or memory operand to 1. The bit
number is specified by 3-bit immediate data or the lower three bits of a
general register.
BCLR
B
0 → (<bit-No.> of <EAd>)
Clears a specified bit in a general register or memory operand to 0. The
bit number is specified by 3-bit immediate data or the lower three bits of
a general register.
BNOT
B
¬ (<bit-No.> of <EAd>) → (<bit-No.> of <EAd>)
Inverts a specified bit in a general register or memory operand. The bit
number is specified by 3-bit immediate data or the lower three bits of a
general register.
BTST
B
¬ (<bit-No.> of <EAd>) → Z
Tests a specified bit in a general register or memory operand and sets or
clears the Z flag accordingly. The bit number is specified by 3-bit
immediate data or the lower three bits of a general register.
BAND
B
C ∧ (<bit-No.> of <EAd>) → C
ANDs the carry flag with a specified bit in a general register or memory
operand and stores the result in the carry flag.
BIAND
B
C ∧ ¬ (<bit-No.> of <EAd>) → C
ANDs the carry flag with the inverse of a specified bit in a general
register or memory operand and stores the result in the carry flag.
The bit number is specified by 3-bit immediate data.
BOR
B
C ∨ (<bit-No.> of <EAd>) → C
ORs the carry flag with a specified bit in a general register or memory
operand and stores the result in the carry flag.
BIOR
B
C ∨ ¬ (<bit-No.> of <EAd>) → C
ORs the carry flag with the inverse of a specified bit in a general register
or memory operand and stores the result in the carry flag.
The bit number is specified by 3-bit immediate data.
Note: * Refers to the operand size.
B: Byte
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Table 2.7
Bit Manipulation Instructions (2)
Instruction
Size*
Function
BXOR
B
C ⊕ (<bit-No.> of <EAd>) → C
XORs the carry flag with a specified bit in a general register or memory
operand and stores the result in the carry flag.
BIXOR
B
C ⊕ ¬ (<bit-No.> of <EAd>) → C
XORs the carry flag with the inverse of a specified bit in a general
register or memory operand and stores the result in the carry flag.
The bit number is specified by 3-bit immediate data.
BLD
B
(<bit-No.> of <EAd>) → C
Transfers a specified bit in a general register or memory operand to the
carry flag.
BILD
B
¬ (<bit-No.> of <EAd>) → C
Transfers the inverse of a specified bit in a general register or memory
operand to the carry flag.
The bit number is specified by 3-bit immediate data.
BST
B
C → (<bit-No.> of <EAd>)
Transfers the carry flag value to a specified bit in a general register or
memory operand.
BIST
B
¬ C → (<bit-No.> of <EAd>)
Transfers the inverse of the carry flag value to a specified bit in a general
register or memory operand.
The bit number is specified by 3-bit immediate data.
Note: * Refers to the operand size.
B: Byte
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Section 2 CPU
Table 2.8
Branch Instructions
Instruction
Size
Function
Bcc
⎯
Branches to a specified address if a specified condition is true. The
branching conditions are listed below.
Mnemonic
Description
Condition
BRA(BT)
Always (true)
Always
BRN(BF)
Never (false)
Never
BHI
High
C∨Z=0
BLS
Low or same
C∨Z=1
BCC(BHS)
Carry clear
(high or same)
C=0
BCS(BLO)
Carry set (low)
C=1
BNE
Not equal
Z=0
BEQ
Equal
Z=1
BVC
Overflow clear
V=0
BVS
Overflow set
V=1
BPL
Plus
N=0
BMI
Minus
N=1
BGE
Greater or equal
N⊕V=0
BLT
Less than
N⊕V=1
BGT
Greater than
Z∨(N ⊕ V) = 0
BLE
Less or equal
Z∨(N ⊕ V) = 1
JMP
⎯
Branches unconditionally to a specified address.
BSR
⎯
Branches to a subroutine at a specified address.
JSR
⎯
Branches to a subroutine at a specified address.
RTS
⎯
Returns from a subroutine
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Section 2 CPU
Table 2.9
System Control Instructions
Instruction
Size*
Function
TRAPA
⎯
Starts trap-instruction exception handling.
RTE
⎯
Returns from an exception-handling routine.
SLEEP
⎯
LDC
B/W
Causes a transition to a power-down state.
2
(EAs) → CCR, (EAs) → EXR*
2
Moves the source operand contents or immediate data to CCR or EXR* .
2
Although CCR and EXR* are 8-bit registers, word-size transfers are
performed between them and memory. The upper 8 bits are valid.
STC
B/W
CCR → (EAd), EXR* → (EAd)
2
Transfers CCR or EXR* contents to a general register or memory.
2
Although CCR and EXR* are 8-bit registers, word-size transfers are
performed between them and memory. The upper 8 bits are valid.
ANDC
B
CCR ∧ #IMM → CCR, EXR ∧ #IMM → EXR*
2
Logically ANDs the CCR or EXR* contents with immediate data.
ORC
B
XORC
B
NOP
⎯
1
2
2
2
CCR ∨ #IMM → CCR, EXR ∨ #IMM → EXR*
2
*
Logically ORs the CCR or EXR contents with immediate data.
2
CCR ⊕ #IMM → CCR, EXR ⊕ #IMM → EXR*
2
Logically XORs the CCR or EXR* contents with immediate data.
PC + 2 → PC
Only increments the program counter.
Notes: 1. Refers to the operand size.
B: Byte
W: Word
2. Supported only by the H8S/2268 Group.
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Section 2 CPU
Table 2.10 Block Data Transfer Instructions
Instruction
Size
Function
EEPMOV.B
⎯
if R4L ≠ 0 then
Repeat @ER5+ → @ER6+
R4L – 1 → R4L
Until R4L = 0
else next;
EEPMOV.W
⎯
if R4 ≠ 0 then
Repeat @ER5+ → @ER6+
R4 – 1 → R4
Until R4 = 0
else next;
Transfers a data block. Starting from the address set in ER5, transfers
data for the number of bytes set in R4L or R4 to the address location set
in ER6.
Execution of the next instruction begins as soon as the transfer is
completed.
2.6.2
Basic Instruction Formats
This LSI instructions consist of 2-byte (1-word) units. An instruction consists of an operation field
(op field), a register field (r field), an effective address extension (EA field), and a condition field
(cc).
Figure 2.11 shows examples of instruction formats.
• Operation Field
Indicates the function of the instruction, the addressing mode, and the operation to be carried
out on the operand. The operation field always includes the first four bits of the instruction.
Some instructions have two operation fields.
• Register Field
Specifies a general register. Address registers are specified by 3 bits, and data registers by 3
bits or 4 bits. Some instructions have two register fields. Some have no register field.
• Effective Address Extension
8, 16, or 32 bits specifying immediate data, an absolute address, or a displacement.
• Condition Field
Specifies the branching condition of Bcc instructions.
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Section 2 CPU
(1) Operation field only
op
NOP, RTS, etc.
(2) Operation field and register fields
op
rm
rn
ADD.B Rn, Rm, etc.
(3) Operation field, register fields, and effective address extension
op
rn
rm
MOV.B @(d:16, Rn), Rm, etc.
EA(disp)
(4) Operation field, effective address extension, and condition field
op
cc
EA(disp)
BRA d:16, etc.
Figure 2.11 Instruction Formats (Examples)
2.7
Addressing Modes and Effective Address Calculation
The H8S/2000 CPU supports the eight addressing modes listed in table 2.11. Each instruction uses
a subset of these addressing modes. Arithmetic and logic instructions can use the register direct
and immediate modes. Data transfer instructions can use all addressing modes except programcounter relative and memory indirect. Bit manipulation instructions use register direct, register
indirect, or the absolute addressing mode to specify an operand, and register direct (BSET, BCLR,
BNOT, and BTST instructions) or immediate (3-bit) addressing mode to specify a bit number in
the operand.
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Section 2 CPU
Table 2.11 Addressing Modes
No.
Addressing Mode
Symbol
1
Register direct
Rn
2
Register indirect
@ERn
3
Register indirect with displacement
@(d:16,ERn)/@(d:32,ERn)
4
Register indirect with post-increment
Register indirect with pre-decrement
@ERn+
@–ERn
5
Absolute address
@aa:8/@aa:16/@aa:24/@aa:32
6
Immediate
#xx:8/#xx:16/#xx:32
7
Program-counter relative
@(d:8,PC)/@(d:16,PC)
8
Memory indirect
@@aa:8
2.7.1
Register Direct⎯Rn
The register field of the instruction specifies an 8-, 16-, or 32-bit general register containing the
operand. R0H to R7H and R0L to R7L can be specified as 8-bit registers. R0 to R7 and E0 to E7
can be specified as 16-bit registers. ER0 to ER7 can be specified as 32-bit registers.
2.7.2
Register Indirect⎯@ERn
The register field of the instruction code specifies an address register (ERn) which contains the
address of the operand on memory. If the address is a program instruction address, the lower 24
bits are valid and the upper 8 bits are all assumed to be 0 (H'00).
2.7.3
Register Indirect with Displacement⎯@(d:16, ERn) or @(d:32, ERn)
A 16-bit or 32-bit displacement contained in the instruction is added to an address register (ERn)
specified by the register field of the instruction, and the sum gives the address of a memory
operand. A 16-bit displacement is sign-extended when added.
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Section 2 CPU
2.7.4
Register Indirect with Post-Increment or Pre-Decrement⎯@ERn+ or @-ERn
Register indirect with post-increment⎯@ERn+: The register field of the instruction code
specifies an address register (ERn) which contains the address of a memory operand. After the
operand is accessed, 1, 2, or 4 is added to the address register contents and the sum is stored in the
address register. The value added is 1 for byte access, 2 for word transfer instruction, or 4 for
longword transfer instruction. For the word or longword transfer instructions, the register value
should be even.
Register indirect with pre-decrement⎯@-ERn: The value 1, 2, or 4 is subtracted from an
address register (ERn) specified by the register field in the instruction code, and the result is the
address of a memory operand. The result is also stored in the address register. The value
subtracted is 1 for byte access, 2 for word transfer instruction, or 4 for longword transfer
instruction. For the word or longword transfer instructions, the register value should be even.
2.7.5
Absolute Address⎯@aa:8, @aa:16, @aa:24, or @aa:32
The instruction code contains the absolute address of a memory operand. The absolute address
may be 8 bits long (@aa:8), 16 bits long (@aa:16), 24 bits long (@aa:24), or 32 bits long
(@aa:32). Table 2.12 indicates the accessible absolute address ranges.
To access data, the absolute address should be 8 bits (@aa:8), 16 bits (@aa:16), or 32 bits
(@aa:32) long. For an 8-bit absolute address, the upper 24 bits are all assumed to be 1 (H'FFFF).
For a 16-bit absolute address the upper 16 bits are a sign extension. A 32-bit absolute address can
access the entire address space.
A 24-bit absolute address (@aa:24) indicates the address of a program instruction. The upper 8
bits are all assumed to be 0 (H'00).
Table 2.12 Absolute Address Access Ranges
Normal Mode*
Advanced Mode
8 bits (@aa:8)
H'FF00 to H'FFFF
H'FFFF00 to H'FFFFFF
16 bits (@aa:16)
H'0000 to H'FFFF
H'000000 to H'007FFF,
H'FF8000 to H'FFFFFF
Absolute Address
Data address
32 bits (@aa:32)
Program instruction address
24 bits (@aa:24)
Note: * Normal mode is not available in this LSI.
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H'000000 to H'FFFFFF
Section 2 CPU
2.7.6
Immediate⎯#xx:8, #xx:16, or #xx:32
The instruction contains 8-bit (#xx:8), 16-bit (#xx:16), or 32-bit (#xx:32) immediate data as an
operand.
The ADDS, SUBS, INC and DEC instructions contain immediate data implicitly. Some bit
manipulation instructions contain 3-bit immediate data in the instruction code, specifying a bit
number. The TRAPA instruction contains 2-bit immediate data in its instruction code, specifying a
vector address.
2.7.7
Program-Counter Relative⎯@(d:8, PC) or @(d:16, PC)
This mode is used in the Bcc and BSR instructions. An 8-bit or 16-bit displacement contained in
the instruction is sign-extended and added to the 24-bit PC contents to generate a branch address.
Only the lower 24 bits of this branch address are valid; the upper 8 bits are all assumed to be 0
(H'00). The PC value to which the displacement is added is the address of the first byte of the next
instruction, so the possible branching range is –126 to +128 bytes (–63 to +64 words) or –32766 to
+32768 bytes (–16383 to +16384 words) from the branch instruction. The resulting value should
be an even number.
2.7.8
Memory Indirect⎯@@aa:8
This mode can be used by the JMP and JSR instructions. The instruction code contains an 8-bit
absolute address specifying a memory operand. This memory operand contains a branch address.
The upper bits of the absolute address are all assumed to be 0, so the address range is 0 to 255
(H'0000 to H'00FF in normal mode*, H'000000 to H'0000FF in advanced mode). In normal mode,
the memory operand is a word operand and the branch address is 16 bits long. In advanced mode,
the memory operand is a longword operand, the first byte of which is assumed to be 0 (H'00).
Note that the first part of the address range is also the exception vector area. For further details,
refer to section 4, Exception Handling.
If an odd address is specified in word or longword memory access, or as a branch address, the
least significant bit is regarded as 0, causing data to be accessed or instruction code to be fetched
at the address preceding the specified address. (For further information, see section 2.5.2, Memory
Data Formats.)
Note: * Normal mode is not available in this LSI.
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Section 2 CPU
Specified
by @aa:8
Branch address
Specified
by @aa:8
Reserved
Branch address
(a) Normal Mode*
(a) Advanced Mode
Note: * Normal mode is not available in this LSI.
Figure 2.12 Branch Address Specification in Memory Indirect Mode
2.7.9
Effective Address Calculation
Table 2.13 indicates how effective addresses are calculated in each addressing mode. In normal
mode the upper 8 bits of the effective address are ignored in order to generate a 16-bit address.
Rev. 5.00 Sep. 01, 2009 Page 44 of 656
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Section 2 CPU
Table 2.13 Effective Address Calculation (1)
No
1
Addressing Mode and Instruction Format
op
2
Effective Address Calculation
Effective Address (EA)
Register direct(Rn)
rm
Operand is general register contents.
rn
Register indirect(@ERn)
31
0
op
3
31
24 23
0
Don't care
General register contents
r
Register indirect with displacement
@(d:16,ERn) or @(d:32,ERn)
31
0
General register contents
op
r
31
disp
31
Register indirect with post-increment or
pre-decrement
• Register indirect with post-increment @ERn+
op
disp
31
0
31
24 23
0
Don't care
General register contents
r
• Register indirect with pre-decrement @-ERn
0
0
Sign extension
4
24 23
Don't care
1, 2, or 4
31
0
General register contents
31
24 23
0
Don't care
op
r
1, 2, or 4
Operand Size
Byte
Word
Longword
Offset
1
2
4
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Section 2 CPU
Table 2.13 Effective Address Calculation (2)
No
5
Addressing Mode and Instruction Format
Effective Address Calculation
Effective Address (EA)
Absolute address
@aa:8
31
op
@aa:16
31
op
0
H'FFFF
24 23
16 15
0
Don't care Sign extension
abs
@aa:24
31
op
8 7
24 23
Don't care
abs
24 23
0
Don't care
abs
@aa:32
op
31
6
Immediate
#xx:8/#xx:16/#xx:32
op
7
0
24 23
Don't care
abs
Operand is immediate data.
IMM
23
Program-counter relative
0
PC contents
@(d:8,PC)/@(d:16,PC)
op
disp
0
23
Sign
extension
disp
31
24 23
0
Don't care
8
Memory indirect @@aa:8
• Normal mode*
31
op
abs
0
8 7
abs
H'000000
15
0
31
24 23
Don't care
Memory contents
16 15
0
H'00
• Advanced mode
31
op
abs
8 7
H'000000
31
0
Memory contents
Note: * Normal mode is not available in this LSI.
Rev. 5.00 Sep. 01, 2009 Page 46 of 656
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0
abs
31
24 23
Don't care
0
Section 2 CPU
2.8
Processing States
The H8S/2000 CPU has five main processing states: the reset state, exception handling state,
program execution state, bus-released state, and power-down state. Figure 2.13 indicates the state
transitions.
• Reset State
In this state, the CPU and all on-chip peripheral modules are initialized and not operating.
When the RES input goes low, all current processing stops and the CPU enters the reset state.
All interrupts are masked in the reset state. Reset exception handling starts when the RES
signal changes from low to high. For details, refer to section 4, Exception Handling.
The reset state can also be entered by a watchdog timer overflow.
• Exception-Handling State
The exception-handling state is a transient state that occurs when the CPU alters the normal
processing flow due to an exception source, such as a reset, trace, interrupt, or trap instruction.
The CPU fetches a start address (vector) from the exception vector table and branches to that
address. For further details, refer to section 4, Exception Handling.
• Program Execution State
In this state, the CPU executes program instructions in sequence.
• Bus-Released State (H8S/2268 Group only)
In a product which has a bus master other than the CPU, such as a data transfer controller
(DTC), the bus-released state occurs when the bus has been released in response to a bus
request from a bus master other than the CPU.
While the bus is released, the CPU halts operations.
• Power-down State
This is a power-down state in which the CPU stops operating. The program stop state occurs
when a SLEEP instruction is executed or the CPU enters hardware standby mode. For further
details, refer to section 22, Power-Down Modes.
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Section 2 CPU
End of bus request*4
Bus request*4
tio
n
ha
nd
lin
g
Program execution state
s
bu *4
4
f
*
SLEEP instruction,
o
t
d est
es
SSBY = 0
En qu
qu
e
e
r
r
s
Bu
Sleep mode
eq
pt r
rru
Inte
t
ues
SLEEP instruction,
SSBY = 1
En
d
o
ha f ex
nd ce
lin pti
g on
Re
qu
es
tf
or
ex
c
ep
Bus-released state*4
Exception handling state
External interrupt request
Software standby mode
RES = High
STBY = High, RES = Low
Reset state*1
Hardware standby mode*2
Power-down state*3
Notes: 1. From any state except hardware standby mode, a transition to the reset state occurs whenever RES
goes low. A transition can also be made to the reset state when the
watchdog timer overflows.
2. From any state, a transition to hardware standby mode occurs when STBY goes low.
3. Apart from these states, there are also the watch mode, subactive mode, and the subsleep mode.
See section 22, Power-Down Modes.
4. Supported only by the H8S/2268 Group.
Figure 2.13 State Transitions
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Section 2 CPU
2.9
Usage Notes
2.9.1
TAS Instruction
Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction. The TAS
instruction is not generated by the Renesas H8S and H8/300 Series C/C++ compilers. If the TAS
instruction is used as a user-defined intrinsic function, ensure that only register ER0, ER1, ER4, or
ER5 is used.
2.9.2
STM/LDM Instruction
With the STM or LDM instruction, the ER7 register is used as the stack pointer, and thus cannot
be used as a register that allows save (STM) or restore (LDM) operation.
With a single STM or LDM instruction, two to four registers can be saved or restored. The
available registers are as follows:
For two registers: ER0 and ER1, ER2 and ER3, or ER4 and ER5
For three registers: ER0 to ER2, or ER4 to ER6
For four registers: ER0 to ER3
For the Renesas Technology H8S or H8/300 Series C/C++ Compiler, the STM/LDM instruction
including ER7 is not created.
2.9.3
Bit Manipulation Instructions
When bit-manipulation is used with registers that include write-only bits, bits to be manipulated
may not be manipulated properly or bits unrelated to the bit-manipulation may be changed.
Some values read from write-only bits are fixed and some are undefined. When such bits are the
operands of bit-manipulation instructions that use read values in arithmetic operations (BNOT,
BTST, BAND, BIAND, BOR, BIOR, BXOR, BIXOR, BLD, BILD), the desired bit-manipulation
will not be executed.
Also, bit-manipulation instructions that write back data according to the results of arithmetic
operations (BSET, BCLR, BNOT, BST, BIST) may change bits that are not related to the bitmanipulation. Therefore, special care is necessary when using these instructions with registers that
include write-only bits.
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Section 2 CPU
The BSET, BCLR, BNOT, BST and BIST instructions are executed as follows:
1. Data is read in bytes.
2. The operation corresponding to the instruction is applied to the specified bit of the data.
3. The byte produced by the bit-manipulation is written back.
• Consider this example, where the BCLR instruction is executed to clear only bit 4 in P1DDR
of Port 1.
P1DDR is an 8-bit register that consists of write-only bits and specifies input or output for
each pin of port 1. Reading of these bits is not valid, since values read are specified as
undefined.
In the following example, the BCLR instruction specifies P14 as an input. Before the
operation, P17 to P14 are set as output pins and P13 to P10 are set as input pins. The value of
P1DDR is H'F0.
I/O
P1DDR
P17
P16
P15
P14
P13
P12
P11
P10
Output
Output
Output
Output
Input
Input
Input
Input
1
1
1
1
0
0
0
0
To switch P14 from an output to an input, the value of bit 4 in P1DDR has to be changed from
1 to 0 (H'F0 to H'E0). The BCLR instruction used to clear bit 4 in P1DDR is as follows.
BCLR
#4, @P1DDR
However, the above bit-manipulation of the write-only P1DDR register may cause the
following problem.
The data in P1DDR is read in bytes. Data read from P1DDR is undefined. Thus, regardless of
whether the value in the register is 0 or 1, it is impossible to tell which value will be read. All
bits in P1DDR are write-only, thus read as undefined. The actual value in P1DDR is H'F0. Let
us assume that the value read is H'F8, where the value of bit 3 is read as 1 rather than its actual
value of 0.
P17
P16
P15
P14
P13
P12
P11
P10
Output
Output
Output
Output
Input
Input
Input
Input
P1DDR
1
1
1
1
0
0
0
0
Read value
1
1
1
1
1
0
0
0
I/O
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Section 2 CPU
The target bit of the data read out is then manipulated. In this example, clearing bit 4 of H'F8
leaves us with H'E8.
P17
P16
P15
P14
P13
P12
P11
P10
Output
Output
Output
Output
Input
Input
Input
Input
P1DDR
1
1
1
1
0
0
0
0
After bitmanipulation
1
1
1
0
1
0
0
0
I/O
After the bit-manipulation, The data is then written back to P1DDR, and execution of the
BCLR instruction is complete.
P17
P16
P15
P14
P13
P12
P11
P10
Output
Output
Output
Input
Output
Input
Input
Input
P1DDR
1
1
1
0
1
0
0
0
Write value
1
1
1
0
1
0
0
0
I/O
This instruction was meant to change the value of P1DDR to H'E0, but H'E8 was written back
instead. P13, which should be an input pin, has been turned into an output pin. Note that while
the error in this case occurred because bit 3 in P1DDR was read as 1, the values read from bits
7 to 0 in P1DDR are undefined. Bit-manipulation instructions that write back values might
change any bit from 0 to 1 or 1 to 0. Section 2.9.4, Access Method for Registers with WriteOnly Bits, describes a way to avoid this possibility when changing the values of registers that
include write-only bits.
The BCLR instruction can be used to clear flags in the internal I/O registers to 0. In this case,
if it is obvious that a given flag has been set to 1 because an interrupt handler has been entered,
there is no need to read the flag .
2.9.4
Access Method for Registers with Write-Only Bits
A read value from a write-only bit using a data-transfer or a bit-manipulation instruction is
undefined. To avoid using the read value for subsequent operations, follow the procedure shown
below to access registers that include write-only bits.
When writing to registers that include write-only bits, set up a work area in memory such as onchip RAM, write the data to the work area, read the data back from the memory, and then write
the data to the registers that include write-only bits.
Rev. 5.00 Sep. 01, 2009 Page 51 of 656
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Section 2 CPU
Write initial data to work area
Writing initial value
Copy data from work area to
register including write-only bit
Access data in work area
(data-transfer and bit-manipulation
instructions can be used)
Changing value of register
including write-only bit
Copy data from work area to
register including write-only bit
Figure 2.14 Flowchart of Access Method for Registers with Write-Only Bits
• Consider the following example, where only bit 4 in P1DDR of port 1 is cleared.
P1DDR is an 8-bit register that consists of write-only bits and specifies input or output for
each pin of port 1. Reading of these bits is not valid, since values read are specified as
undefined.
In the following example, the BCLR instruction specifies P14 as an input. Start by writing the
initial value H'F0, which will be written to P1DDR, to the work area (RAM0) in memory.
MOV.B
#H'F0, R0L
MOV.B
R0L, @RAM0
MOV.B
R0L, @P1DDR
P17
P16
P15
P14
P13
P12
P11
P10
Output
Output
Output
Output
Input
Input
Input
Input
P1DDR
1
1
1
1
0
0
0
0
RAM0
1
1
1
1
0
0
0
0
I/O
P14 is now an output. To switch P14 from an output to an input, the value of bit 4 in P1DDR
has to be changed from 1 to 0 (H'F0 to H'E0). Clear bit 4 of RAM0 using the BCLR
instruction.
BCLR
#4, @RAM0
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Section 2 CPU
P17
P16
P15
P14
P13
P12
P11
P10
Output
Output
Output
Output
Input
Input
Input
Input
P1DDR
1
1
1
1
0
0
0
0
RAM0
1
1
1
0
0
0
0
0
I/O
RAM locations are readable and writable, so there is no possibility of a problem if a bitmanipulation instruction is used to clear only bit 4 of RAM0. Read the value from RAM0 and
then write it back to P1DDR.
MOV.B
@RAM0,
R0L
MOV.B
R0L,
@P1DDR
P17
P16
P15
P14
P13
P12
P11
P10
Output
Output
Output
Input
Input
Input
Input
Input
P1DDR
1
1
1
0
0
0
0
0
RAM0
1
1
1
0
0
0
0
0
I/O
Following this procedure in access to registers that include write-only bits makes the behavior
of the program independent of the type of instruction.
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Section 2 CPU
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Section 3 MCU Operating Modes
Section 3 MCU Operating Modes
3.1
Operating Mode Selection
This LSI supports the advanced single-chip mode. The operating mode is determined by the
setting of the mode pins (MD2 and MD1). Only mode 7 can be used in this LSI. Therefore, all
mode pins must be fixed high. Do not change the mode pin settings during operation.
Table 3.1
MCU Operating Mode Selection
External Data Bus
MCU
Operating
Mode
MD2
MD1
CPU Operating
Mode
Description
On-Chip
ROM
Initial
Width
Max.
Width
7
1
Advanced mode
Single-chip mode
Enabled
⎯
⎯
1
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Section 3 MCU Operating Modes
3.2
Register Description
The following register is related to the operating mode.
• Mode control register (MDCR)
3.2.1
Mode Control Register (MDCR)
MDCR monitors the current operating mode.
Bit
Bit Name
Initial
Value
R/W
7
⎯
1
R/W
Descriptions
Reserved
This bit is always read as 1 and cannot be modified.
6 to 3
⎯
All 0
⎯
Reserved
These bits are always read as 0 and cannot be modified.
2
MDS2
⎯
R
Mode Select 2 and 1
1
MDS1
⎯
R
These bits indicate the input levels at pins MD2 and MD1
(the current operating mode). Bits MDS2 and MDS1
correspond to MD2 and MD1, respectively. MDS2 and
MDS1 are read-only bits and they cannot be written to.
The mode pin (MD2 and MD1) input levels are latched
into these bits when MDCR is read. These latches are
canceled by a reset. These latches are canceled by a
reset.
0
⎯
1
⎯
Reserved
This bit is always read as 1 and cannot be modified.
3.3
Operating Mode
The CPU can access a 16-Mbyte address space in advanced mode. On-chip ROM is valid and the
external address cannot be used.
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Section 3 MCU Operating Modes
3.4
Address Map
Figure 3.1 shows the address map in each operating mode.
H8S/2268
H8S/2266
ROM: 256 kbytes,
RAM: 16 kbytes
Mode 7
Advanced single-chip mode
H'000000
ROM: 128 kbytes,
RAM: 8 kbytes
Mode 7
Advanced single-chip mode
H'000000
On-chip RAM
On-chip RAM
H'01FFFF
H'03FFFF
H'FFB000
On-chip RAM
H'FFEFBF
H'FFF800
H'FFFF3F
H'FFFF60
Internal I/O registers
Internal I/O registers
H'FFFFC0
H'FFFFFF
H'FFD000
H'FFEFBF
H'FFF800
H'FFFF3F
H'FFFF60
On-chip RAM
Internal I/O registers
Internal I/O registers
H'FFFFC0
On-chip RAM
H'FFFFFF
On-chip RAM
Figure 3.1 Address Map (1)
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Section 3 MCU Operating Modes
H8S/2265 and H8S/2264
H8S/2262
ROM: 128 kbytes,
RAM: 4 kbytes
Mode 7
Advanced single-chip mode
H'000000
ROM: 64 kbytes,
RAM: 2 kbytes
Mode 7
Advanced single-chip mode
H'000000
On-chip RAM
On-chip RAM
H'00FFFF
H'01FFFF
H'FFE000
H'FFEFBF
H'FFF800
H'FFFF3F
H'FFFF60
On-chip RAM
Internal I/O registers
Internal I/O registers
H'FFFFC0
H'FFFFFF
H'FFE800
H'FFEFBF
H'FFF800
H'FFFF3F
H'FFFF60
On-chip RAM
Internal I/O registers
Internal I/O registers
H'FFFFC0
On-chip RAM
H'FFFFFF
On-chip RAM
Figure 3.1 Address Map (2)
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Section 4 Exception Handling
Section 4 Exception Handling
4.1
Exception Handling Types and Priority
As table 4.1 indicates, exception handling may be caused by a reset, trace*, trap instruction, or
interrupt. Exception handling is prioritized as shown in table 4.1. If two or more exceptions occur
simultaneously, they are accepted and processed in order of priority. Trap instruction exception
handling requests are accepted at all times in program execution state.
Exception sources, the stack structure, and operation of the CPU vary depending on the interrupt
control mode set by the INTM0 and INTM1 bits in SYSCR.
Table 4.1
Exception Types and Priority
Priority
Exception Type
Start of Exception Handling
High
Reset
Starts immediately after a low-to-high transition at the RES pin,
or when the watchdog timer overflows. The CPU enters the
reset state when the RES pin is low.
Trace*
Starts when execution of the current instruction or exception
handling ends, if the trace (T) bit in the EXR is set to 1. Traces
are enabled only in interrupt control mode 2. Trace exception
handling is not executed after execution of an RTE instruction.
Interrupt
Starts when execution of the current instruction or exception
handling ends, if an interrupt request has been issued. Interrupt
detection is not performed on completion of ANDC, ORC,
XORC, or LDC instruction execution, or on completion of reset
exception handling.
Trap instruction
Started by execution of a trap instruction (TRAPA). Trap
instruction exception handling requests are accepted at all times
in program execution state.
Low
Note: * Supported only by the H8S/2268 Group.
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Section 4 Exception Handling
4.2
Exception Sources and Exception Vector Table
Different vector addresses are assigned to different exception sources. Table 4.2 lists the exception
sources and their vector addresses.
Table 4.2
Exception Handling Vector Table
Exception Source
Vector Number
Vector Address Advanced Mode*
Reset
0
H'0000 to H'0003
Reserved for system use
1
H'0004 to H'0007
2
H'0008 to H'000B
3
H'000C to H'000F
4
H'0010 to H'0013
4
Trace*
5
H'0014 to H'0017
3
Direct transitions*
6
H'0018 to H'001B
External interrupt (NMI)
7
H'001C to H'001F
Trap instruction (four sources)
Reserved for system use
External interrupt
8
H'0020 to H'0023
9
H'0024 to H'0027
10
H'0028 to H'002B
11
H'002C to H'002F
12
H'0030 to H'0033
13
H'0034 to H'0037
14
H'0038 to H'003B
15
H'003C to H'003F
IRQ0
16
H'0040 to H'0043
IRQ1
17
H'0044 to H'0047
Reserved for system use
18
H'0048 to H'004B
External interrupt
IRQ3
19
H'004C to H'004F
IRQ4
20
H'0050 to H'0053
4
IRQ5*
21
H'0054 to H'0057
22
H'0058 to H'005B
23
H'005C to H'005F
Reserved for system use
Rev. 5.00 Sep. 01, 2009 Page 60 of 656
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1
Section 4 Exception Handling
Exception Source
Vector Number
Vector Address Advanced Mode*
Internal interrupt*
24
⎜
107
H'0060 to H'0063
⎜
H'01AC to H'01AF
External interrupt WKP0 to WKP7
108
H'01B0 to H'01B3
Internal interrupt
120
⎜
123
H'01E0 to H'01E3
⎜
H'01EC to H'01EF
2
1
Notes: 1. Lower 16 bits of the address.
2. For details of internal interrupt vectors, see section 5.4.3, Interrupt Exception Handling
Vector Table.
3. For details on direct transitions, see section 22.10, Direct Transitions.
4. Supported only by the H8S/2268 Group.
4.3
Reset
A reset has the highest exception priority.
When the RES pin goes low, all processing halts and this LSI enters the reset. A reset initializes
the internal state of the CPU and the registers of on-chip peripheral modules. The interrupt control
mode is 0 immediately after reset.
When the RES pin goes high from the low state, this LSI starts reset exception handling.
The chip can also be reset by overflow of the watchdog timer. For details see section 12,
Watchdog Timer (WDT).
4.3.1
Reset Exception Handling
When the RES pin goes low, this LSI enters the reset. To ensure that this LSI is reset, hold the
RES pin low for at least 20 ms at power-up. To reset the chip during operation, hold the RES pin
low for at least 20 states. When the RES pin goes high after being held low for the necessary time,
this LSI starts reset exception handling as follows.
1. The internal state of the CPU and the registers of the on-chip peripheral modules are
initialized, the T bit in EXR* is cleared to 0, and the I bits in EXR* and CCR is set to 1.
2. The reset exception handling vector address is read and transferred to the PC, and program
execution starts from the address indicated by the PC.
Note: * Supported only by the H8S/2268 Group.
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Section 4 Exception Handling
Figures 4.1 shows an example of the reset sequence.
Vector fetch
Prefetch of first
Internal
processing program instruction
(1)
(3)
φ
RES
Internal
address bus
(5)
Internal read
signal
Internal write
signal
Internal data
bus
High
(2)
(4)
(6)
(1)(3) Reset exception handling vector address(when reset, (1)=H'000000, (3)=H'000002)
(2)(4) Start address (contents of reset exception handling vector address)
(5) Start address ((5)=(2)(4))
(6) First program instruction
Figure 4.1 Reset Sequence (Advanced Mode with On-chip ROM Enabled)
4.3.2
Interrupts after Reset
If an interrupt is accepted after a reset and before the stack pointer (SP) is initialized, the PC and
CCR will not be saved correctly, leading to a program crash. To prevent this, all interrupt requests,
including NMI, are disabled immediately after a reset. Since the first instruction of a program is
always executed immediately after the reset state ends, make sure that this instruction initializes
the stack pointer (example: MOV.L #xx: SP).
4.3.3
State of On-Chip Peripheral Modules after Reset Release
After reset release, MSTPCRA is initialized to H'3F, MSTPCRB to MSTPCRD are initialized to
H'FF, and all modules except the DTC (only for the H8S/2268 Group) enter module stop mode.
Consequently, on-chip peripheral module registers cannot be read or written to. Register reading
and writing is enabled when the module stop mode is exited.
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Section 4 Exception Handling
4.4
Traces (Supported Only by the H8S/2268 Group)
Traces are enabled in interrupt control mode 2. Trace mode is not activated in interrupt control
mode 0, irrespective of the state of the T bit. For details of interrupt control modes, see section 5,
Interrupt Controller.
If the T bit in EXR is set to 1, trace mode is activated. In trace mode, a trace exception occurs on
completion of each instruction. Trace mode is not affected by interrupt masking. Table 4.3 shows
the state of CCR and EXR after execution of trace exception handling. Trace mode is canceled by
clearing the T bit in EXR to 0. Interrupts are accepted even within the trace exception handling
routine.
The T bit saved on the stack retains its value of 1, and when control is returned from the trace
exception handling routine by the RTE instruction, trace mode resumes. Trace exception handling
is not carried out after execution of the RTE instruction.
Table 4.3
Status of CCR and EXR after Trace Exception Handling
Interrupt Control Mode
CCR
I
0
2
EXR
UI
I2 to I0
T
Trace exception handling cannot be used.
1
—
—
0
Legend:
1: Set to 1
0: Cleared to 0
—: Retains value prior to execution
4.5
Interrupts
Interrupts are controlled by the interrupt controller. The interrupt controller of the H8S/2268
Group has two interrupt control modes and can assign interrupts other than NMI to eight
priority/mask levels to enable multiplexed interrupt control. For details, refer to section 5,
Interrupt Controller.
Interrupt exception handling is conducted as follows:
1. The values in the program counter (PC), condition code register (CCR), and extended control
register (EXR)* are saved to the stack.
2. The interrupt mask bit is updated and the T bit* is cleared to 0.
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Section 4 Exception Handling
3. A vector address corresponding to the interrupt source is generated, the start address is loaded
from the vector table to the PC, and program execution begins from that address.
Note: * Supported only by the H8S/2268 Group.
4.6
Trap Instruction
Trap instruction exception handling starts when a TRAPA instruction is executed. Trap instruction
exception handling can be executed at all times in the program execution state.
Trap instruction exception handling is conducted as follows:
1. The values in the program counter (PC), condition code register (CCR), and extended control
register (EXR)* are saved to the stack.
2. The interrupt mask bit is updated and the T bit* is cleared.
3. A vector address corresponding to the interrupt source is generated, the start address is loaded
from the vector table to the PC, and program execution starts from that address.
The TRAPA instruction fetches a start address from a vector table entry corresponding to a vector
number from 0 to 3, as specified in the instruction code.
Table 4.4 shows the status of CCR and EXR* after execution of trap instruction exception
handling.
Table 4.4
Status of CCR and EXR* after Trap Instruction Exception Handling
Interrupt Control Mode
EXR*
CCR
I
UI
I2 to I0
T
0
1
—
—
—
2*
1
—
—
0
Legend:
1: Set to 1
0: Cleared to 0
—: Retains value prior to execution
Note: * Supported only by the H8S/2268 Group.
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Section 4 Exception Handling
4.7
Stack Status after Exception Handling
Figures 4.2 shows the stack after completion of trap instruction exception handling and interrupt
exception handling.
SP
EXR
RESERVED*1
SP
CCR
PC
(24 bit)
PC
(24 bit)
Interrupt control mode 0
Interrupt control mode*2
Note: 1. Ignored on return
2. Supported only by the H8S/2268 Group.
Figure 4.2 Stack Status after Exception Handling (Advanced Mode)
4.8
Usage Note
When accessing word data or longword data, this LSI assumes that the lowest address bit is 0. The
stack should always be accessed by word transfer instruction or longword transfer instruction, and
the value of the stack pointer (SP, ER7) should always be kept even. Use the following
instructions to save registers:
PUSH.W
Rn
(or MOV.W Rn, @-SP)
PUSH.L
ERn
(or MOV.L ERn, @-SP)
Use the following instructions to restore registers:
POP.W
Rn
(or MOV.W @SP+, Rn)
POP.L
ERn
(or MOV.L @SP+, ERn)
Setting SP to an odd value may lead to a malfunction. Figure 4.3 shows an example of what
happens when the SP value is odd.
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Section 4 Exception Handling
CCR
SP
R1L
SP
H'FFFEFA
H'FFFEFB
PC
PC
H'FFFEFC
H'FFFEFD
SP
H'FFFEFF
SP set to H'FFFEFF
TRAPA instruction executed
MOV.B R1L, @-ER7 executed
Data saved above SP
Contents of CCR lost
Legend:
CCR:
PC:
R1L:
SP:
Condition code register
Program counter
General register R1L
Stack pointer
Note: This diagram illustrates an example in which the interrupt control mode is 0, in advanced mode.
Figure 4.3 Operation when SP Value Is Odd
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Section 5 Interrupt Controller
Section 5 Interrupt Controller
5.1
Features
This LSI controls interrupts with the interrupt controller. The interrupt controller has the following
features:
• Two interrupt control modes (H8S/2268 Group only)
⎯ Any of two interrupt control modes can be set by means of the INTM1 and INTM0 bits in
the system control register (SYSCR).
• Priorities settable with IPR (H8S/2268 Group only)
⎯ An interrupt priority register (IPR) is provided for setting interrupt priorities. Eight priority
levels can be set for each module for all interrupts except NMI. NMI is assigned the
highest priority level of 8, and can be accepted at all times.
• Independent vector addresses
⎯ All interrupt sources except WKP7 to WKP0 are assigned independent vector addresses,
making it unnecessary for the source to be identified in the interrupt handling routine.
• External interrupts
H8S/2268 Group: 14 (NMI, IRQ5 to IRQ3, IRQ1, IRQ0, and WKP7 to WKP0)
H8S/2264 Group: 13 (NMI, IRQ4, IRQ3, IRQ1, IRQ0, and WKP7 to WKP0)
⎯ NMI is the highest-priority interrupt, and is accepted at all times. Rising edge or falling
edge can be selected for NMI. Falling edge, rising edge, or both edge detection, or level
sensing, can be independently selected for IRQ5 to IRQ3, IRQ1, and IRQ0.
WKP7 to WKP0 are accepted at a falling edge
• DTC control (H8S/2268 Group only)
⎯ The DTC can be activated by an interrupt request.
A block diagram of the interrupt controller for the H8S/2268 Group is shown in figure 5.1, and
that for the H8S/2264 Group is shown in figure 5.2
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Section 5 Interrupt Controller
CPU
INTM1, INTM0
SYSCR
NMIEG
NMI input
NMI input unit
IRQ input
IRQ input unit
ISR
ISCR
WKP input
IER
WKP input unit
IWPR
Interrupt
request
Vector number
Priority
determination
I
CCR
IENR1
I2 to I0
Internal interrupt
request
SWDTEND to TEI2
EXR
IPR
Interrupt controller
Legend:
ISCR: IRQ sense control register
IER:
IRQ enable register
ISR:
IRQ status register
IENR1: Interrupt enable register1
IWPR: Wakeup interrupt request register
IPR:
Interrupt priority register
SYSCR: System control register
Figure 5.1 Block Diagram of Interrupt Controller for H8S/2268 Group
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Section 5 Interrupt Controller
CPU
INTM1, INTM0
SYSCR
NMIEG
NMI input
NMI input unit
IRQ input
IRQ input unit
ISR
ISCR
WKP input
IER
WKP input unit
IWPR
Interrupt
request
Vector number
Priority
determination
I
IENR1
CCR
Internal interrupt
request
WOVI0 to TEI2
Interrupt controller
Legend:
ISCR: IRQ sense control register
IER:
IRQ enable register
ISR:
IRQ status register
IENR1: Interrupt enable register1
IWPR: Wakeup interrupt request register
SYSCR: System control register
Figure 5.2 Block Diagram of Interrupt Controller for H8S/2264 Group
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Section 5 Interrupt Controller
5.2
Input/Output Pins
Table 5.1 summarizes the pins of the interrupt controller.
Table 5.1
Pin Configuration
Name
I/O
Function
NMI
Input
Nonmaskable external interrupt
Rising or falling edge can be selected
IRQ5*
Input
IRQ4
Input
Maskable external interrupts
Rising, falling, or both edges, or level sensing, can be selected
IRQ3
Input
IRQ2
Input
IRQ1
Input
IRQ0
Input
WKP7
Input
WKP6
Input
WKP5
Input
WKP4
Input
WKP3
Input
WKP2
Input
WKP1
Input
WKP0
Input
Maskable external interrupts
Accepted at a falling edge
Note: * Supported only by the H8S/2268 Group.
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Section 5 Interrupt Controller
5.3
Register Descriptions
The interrupt controller has the following registers.
System control register (SYSCR)
IRQ sense control register H (ISCRH)
IRQ sense control register L (ISCRL)
IRQ enable register (IER)
IRQ status register (ISR)
Interrupt priority register A (IPRA)*
Interrupt priority register B (IPRB)*
Interrupt priority register C (IPRC)*
• Interrupt priority register D (IPRD)*
• Interrupt priority register E (IPRE)*
• Interrupt priority register F (IPRF)*
• Interrupt priority register G (IPRG)*
• Interrupt priority register I (IPRI)*
• Interrupt priority register J (IPRJ)*
• Interrupt priority register K (IPRK)*
• Interrupt priority register L (IPRL)*
• Interrupt priority register M (IPRM)*
• Interrupt priority register O (IPRO)*
• Wakeup interrupt request register (IWPR)
• Interrupt enable register 1 (IENR1)
Note: * Supported only by the H8S/2268 Group.
5.3.1
System Control Register (SYSCR)
SYSCR selects the interrupt control mode and the detected edge for NMI.
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Section 5 Interrupt Controller
Bit
Bit Name
Initial
Value
R/W
7
⎯
0
R/W
Descriptions
Reserved
The write value should always be 0.
6
⎯
0
⎯
Reserved
This bit is always read as 0, and cannot be modified.
5
INTM1
0
R/W
Interrupt Control Mode 1 and 0
4
INTM0
0
R/W
H8S/2268 Group:
These bits select the control mode of the interrupt
controller.
00: Interrupt control mode 0 (interrupts are controlled by
the I bit.)
01: Setting prohibited
10: Interrupt control mode 2 (Interrupts are controlled by
the I2 to I0 bits and IPR.)
11: Setting prohibited
H8S/2264 Group:
The write value should always be 0.
00: Interrupt control mode 0 (interrupts are controlled by
the I bit.)
01: Setting prohibited
10: Setting prohibited
11: Setting prohibited
3
NMIEG
0
R/W
NMI Edge Select
Selects the valid edge of the NMI interrupt input.
0: An interrupt is requested at the falling edge of NMI
input
1: An interrupt is requested at the rising edge of NMI
input
2
⎯
0
R/W
Reserved
The write value should always be 0.
1
⎯
0
⎯
Reserved
This bit is always read as 0, and cannot be modified.
0
⎯
1
R/W
Reserved
The write value should always be 0.
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Section 5 Interrupt Controller
5.3.2
Interrupt Priority Registers A to G, I to M, and O (IPRA to IPRG, IPRI to IPRM,
IPRO) (H8S/2268 Group Only)
The IPR registers are thirteen 8-bit readable/writable registers that set priorities (levels 7 to 0) for
interrupts other than NMI. The correspondence between interrupt sources and IPR settings is
shown in table 5.2. Setting a value in the range from H'0 to H'7 in the 3-bit groups of bits 0 to 2
and 4 to 6 sets the priority of the corresponding interrupt.
Bit
Bit Name
Initial
Value
R/W
Description
7
⎯
0
⎯
Reserved
This bit is always read as 0, and cannot be modified.
6
IPR6
1
R/W
Sets the priority of the corresponding interrupt source
5
IPR5
1
R/W
000: Priority level 0 (Lowest)
4
IPR4
1
R/W
001: Priority level 1
010: Priority level 2
011: Priority level 3
100: Priority level 4
101: Priority level 5
110: Priority level 6
111: Priority level 7 (Highest)
3
⎯
0
⎯
2
IPR2
1
R/W
Sets the priority of the corresponding interrupt source.
1
IPR1
1
R/W
000: Priority level 0 (Lowest)
0
IPR0
1
R/W
001: Priority level 1
Reserved
This bit is always read as 0, and cannot be modified.
010: Priority level 2
011: Priority level 3
100: Priority level 4
101: Priority level 5
110: Priority level 6
111: Priority level 7 (Highest)
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Section 5 Interrupt Controller
5.3.3
IRQ Enable Register (IER)
IER controls the enabling and disabling of interrupt requests IRQn (H8S/2268 Group: n = 5 to 3,
1, 0; H8S/2264 Group: n = 4, 3, 1, 0).
Bit
Bit Name
Initial
Value
R/W
Description
7, 6
⎯
All 0
R/W
Reserved
The write value should always be 0.
5
IRQ5E
0
R/W
H8S/2268 Group:
IRQ5 Enable
The IRQ5 interrupt request is enabled when this bit is 1.
H8S/2264 Group:
Reserved
The write value should always be 0.
4
IRQ4E
0
R/W
IRQ4 Enable
The IRQ4 interrupt request is enabled when this bit is 1.
3
IRQ3E
0
R/W
IRQ3 Enable
The IRQ3 interrupt request is enabled when this bit is 1.
2
⎯
0
R/W
Reserved
The write value should always be 0.
1
IRQ1E
0
R/W
IRQ1 Enable
The IRQ1 interrupt request is enabled when this bit is 1.
0
IRQ0E
0
R/W
IRQ0 Enable
The IRQ0 interrupt request is enabled when this bit is 1.
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Section 5 Interrupt Controller
5.3.4
IRQ Sense Control Registers H and L (ISCRH and ISCRL)
The ISCR registers select the source that generates an interrupt request at pins IRQn (H8S/2268
Group: n = 5 to 3, 1, 0; H8S/2264 Group: n = 4, 3, 1, 0). Specifiable sources are the falling edge,
rising edge, or both edge detection, and level sensing.
Bit
Bit Name
Initial
Value
R/W
Description
15 to 12
⎯
All 0
R/W
Reserved
The write value should always be 0.
11
IRQ5SCB
0
R/W
H8S/2268 Group:
10
IRQ5SCA
0
R/W
IRQ5 Sense Control B
IRQ5 Sense Control A
00: Interrupt request generated at IRQ5 input level low
01: Interrupt request generated at falling edge of IRQ5
input
10: Interrupt request generated at rising edge of IRQ5
input
11: Interrupt request generated at both falling and
rising edges of IRQ5 input
H8S/2264 Group:
Reserved
The write value should always be 0.
9
IRQ4SCB
0
R/W
8
IRQ4SCA
0
R/W
IRQ4 Sense Control B
IRQ4 Sense Control A
00: Interrupt request generated at IRQ4 input level low
01: Interrupt request generated at falling edge of IRQ4
input
10: Interrupt request generated at rising edge of IRQ4
input
11: Interrupt request generated at both falling and
rising edges of IRQ4 input
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Section 5 Interrupt Controller
Bit
Bit Name
Initial
Value
R/W
Description
7
IRQ3SCB
0
R/W
6
IRQ3SCA
0
R/W
IRQ3 Sense Control B
IRQ3 Sense Control A
00: Interrupt request generated at IRQ3 input level low
01: Interrupt request generated at falling edge of IRQ3
input
10: Interrupt request generated at rising edge of IRQ3
input
11: Interrupt request generated at both falling and rising
edges of IRQ3 input
5, 4
⎯
All 0
R/W
Reserved
The write value should always be 0.
3
IRQ1SCB
0
R/W
2
IRQ1SCA
0
R/W
IRQ1 Sense Control B
IRQ1 Sense Control A
00: Interrupt request generated at IRQ1 input level low
01: Interrupt request generated at falling edge of IRQ1
input
10: Interrupt request generated at rising edge of IRQ1
input
11: Interrupt request generated at both falling and rising
edges of IRQ1 input
1
IRQ0SCB
0
R/W
0
IRQ0SCA
0
R/W
IRQ0 Sense Control B
IRQ0 Sense Control A
00: Interrupt request generated at IRQ0 input level low
01: Interrupt request generated at falling edge of IRQ0
input
10: Interrupt request generated at rising edge of IRQ0
input
11: Interrupt request generated at both falling and rising
edges of IRQ0 input
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Section 5 Interrupt Controller
5.3.5
IRQ Status Register (ISR)
ISR indicates the status of IRQn (H8S/2268 Group: n = 5 to 3, 1, 0; H8S/2264 Group: n = 4, 3, 1,
0) interrupt requests.
Bit
Bit Name
Initial
Value
R/W
Description
7, 6
⎯
All 0
R/W
Reserved
0
The write value should always be 0.
1
*
R/(W) H8S/2268 Group:
5
IRQ5F
IRQ5 Flag
Indicates the status of an IRQ5 interrupt request.
[Setting condition]
When the interrupt source selected by the ISCR registers
occurs
[Clearing conditions]
•
Cleared by reading IRQ5F flag when IRQ5F = 1, then
writing 0 to IRQ5F flag
•
When interrupt exception handling is executed when
low-level detection is set and IRQ5 input is high level
•
When IRQ5 interrupt exception handling is executed
when falling, rising, or both-edge detection is set
•
When the DTC is activated by an IRQ5 interrupt, and
the DISEL bit in MRB of the DTC is cleared to 0
H8S/2264 Group:
Reserved
The write value should always be 0.
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Section 5 Interrupt Controller
Bit
Bit Name
Initial
Value
4
IRQ4F
0
3
IRQ3F
0
R/W
Description
2
R/(W)*
2
R/(W)*
IRQ4 and IRQ3 Flags
Indicate the status of IRQ4 and IRQ3 interrupt
requests.
[Setting condition]
When the interrupt source selected by the ISCR
registers occurs
[Clearing conditions]
2
⎯
0
R/W
•
Cleared by reading IRQnF flag when IRQnF = 1,
then writing 0 to IRQnF flag
•
When interrupt exception handling is executed
when low-level detection is set and IRQn input is
high
•
When IRQn interrupt exception handling is
executed when falling, rising, or both-edge
detection is set
•
When the DTC is activated by an IRQn interrupt,
and the DISEL bit in MRB of the DTC is cleared to
0 (H8S/2268 Group only)
Reserved
The write value should always be 0.
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Section 5 Interrupt Controller
Bit
Bit Name
Initial
Value
1
IRQ1F
0
0
IRQ0F
0
R/W
Description
2
R/(W)*
2
R/(W)*
IRQ1 and IRQ0 Flags
Indicate the status of IRQ1 and IRQ0 interrupt
requests.
[Setting condition]
When the interrupt source selected by the ISCR
registers occurs
[Clearing conditions]
•
Cleared by reading IRQnF flag when IRQnF = 1,
then writing 0 to IRQnF flag
•
When interrupt exception handling is executed
when low-level detection is set and IRQn input is
high
•
When IRQn interrupt exception handling is
executed when falling, rising, or both-edge
detection is set
•
When the DTC is activated by an IRQn interrupt,
and the DISEL bit in MRB of the DTC is cleared to
0 (H8S/2268 Group only)
Notes: 1. In the H8S/2268 Group, only 0 can be written to this bit to clear the flag. In the
H8S/2264 Group, this bit is readable/writable.
2. Only 0 can be written to this bit to clear the flag.
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Section 5 Interrupt Controller
5.3.6
Wakeup Interrupt Request Register (IWPR)
IWPR indicates the status of WKP7 to WKP0 interrupt requests.
Bit
Bit Name
Initial
Value
7
IWPF7
0
6
IWPF6
0
5
IWPF5
0
4
IWPF4
0
3
IWPF3
0
2
IWPF2
0
1
IWPF1
0
0
IWPF0
0
R/W
Description
R/(W)* Wakeup Interrupt Request Flags
R/(W)* Indicate the status of WKP7 to WKP0 interrupt requests.
R/(W)* [Setting condition]
R/(W)* When WKP7 to WKP0 pins are set as wakeup inputs and
R/(W)* these pins have a falling edge.
R/(W)* [Clearing condition]
R/(W)* When this bit reads 1 and then write 0.
R/(W)*
Note: Only 0 can be written to this bit to clear the flag.
5.3.7
Interrupt Enable Register 1 (IENR1)
IENR1 enables/disables wakeup interrupt requests.
Bit
Bit Name
Initial
Value
R/W
Description
7
IENWP
0
R/W
Wakeup Interrupt Enable
Enables/disables WKP7 to WKP0 interrupt requests
0: WKP7 to WKP0 pin interrupt requests are disabled.
1: WKP7 to WKP0 pin interrupt requests are enabled.
6 to 1
⎯
All 0
⎯
Reserved
These bits are always read as 0 and cannot be modified.
0
⎯
0
R/W
Reserved
This bit should always be 0 when it is read.
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Section 5 Interrupt Controller
5.4
Interrupt Sources
5.4.1
External Interrupts
There are 14 external interrupts for the H8S/2268 Group: NMI, IRQ5 to IRQ3, IRQ1, IRQ0, and
WKP7 to WKP0, and 13 external interrupts for the H8S/2264 Group: NMI, IRQ4, IRQ3, IRQ1,
IRQ0, and WKP7 to WKP0. These interrupts can be used to restore this LSI from software
standby mode.
NMI Interrupt: NMI is the highest-priority interrupt, and is always accepted by the CPU
regardless of the interrupt control mode or the status of the CPU interrupt mask bits. The NMIEG
bit in SYSCR can be used to select whether an interrupt is requested at a rising edge or a falling
edge on the NMI pin.
IRQn Interrupts (H8S/2268 Group: n = 5 to 3, 1, and 0; H8S/2264 Group: n = 4, 3, 1, and 0):
IRQn interrupts are requested by an input signal at IRQn pins. IRQn interrupts have the following
features:
• Using ISCR, it is possible to select whether an interrupt is generated by a low level, falling
edge, rising edge, or both edges, at IRQn pins.
• Enabling or disabling of IRQn interrupt requests can be selected with IER.
• The interrupt priority level can be set with IPR. (H8S/2268 Group only)
• The status of IRQn interrupt requests is indicated in ISR. ISR flags can be cleared to 0 by
software.
A block diagram of IRQn interrupts is shown in figure 5.3.
IRQnE
IRQnSCA, IRQnSCB
IRQnF
Edge/level
detection circuit
S
Q
IRQn interrupt
request
R
IRQn input
Clear signal
Note: H8S/2268 Group: n = 5 to 3, 1, 0
H8S/2264 Group: n = 4, 3, 1, 0
Figure 5.3 Block Diagram of IRQn Interrupts
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Section 5 Interrupt Controller
The set timing for IRQnF is shown in figure 5.4.
φ
IRQn
Input Pin
IRQnF
Note: H8S/2268 Group: n = 5 to 3, 1, 0
H8S/2264 Group: n = 4, 3, 1, 0
Figure 5.4 Set Timing for IRQnF
The detection of IRQn interrupts does not depend on whether the relevant pin has been set for
input or output. However, when a pin is used as an external interrupt input pin, do not clear the
corresponding DDR to 0; and use the pin as an I/O pin for another function. IRQnF interrupt
request flag is set to 1 when the setting condition is satisfied, regardless of IER settings.
Accordingly, refer to only necessary flags.
WKP7 to WKP0 Interrupts:WKP7 to WKP0 interrupts are requested by falling edge input
signal at WKP7 to WKP0 pins. WKP7 to WKP0 interrupts have the following features:
• WPCR selects whether the PJn/WKPn/SEGn+1 pin is used as the PJn pin or WKPn pin when
the PJn/WKPn/SEGn+1 pin is not used as the SEGn+1 pin. (n = 7 to 0)
For pin switching, see 9.8.5 Wakeup Control Register (WPCR).
• IENR1 can be used to select enabling or disabling of WKP7 to WKP0 interrupt requests.
• IPR sets the interrupt priority level. (H8S/2268 Group only)
• IWPR indicates the status of WKP7 to WKP0 interrupt requests. IWPR flag can be cleared to 0
by software.
The block diagram of interrupts WKP7 to WKP0 is shown in figure 5.5.
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Section 5 Interrupt Controller
IENWP
Falling edge
WKP7 to WKP0
Interrupt request
IWPF7
detection circuit
WKP7 Input
S
Q
R
Falling edge
IWPF6
detection circuit
WKP6 Input
S
Q
R
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Falling edge
IWPF0
detection circuit
WKP0 Input
S
Q
R
Clear signal
Figure 5.5 Block Diagram of Interrupts WKP7 to WKP0
Figure 5.6 shows the IWPFn setting timing.
φ
WKPn
input
IWPFn
(n = 7 to 0)
Figure 5.6 IWPFn Setting Timing
The vector number for the WKP7 to WKP0 interrupt exception handling is 108. Eight interrupt
pins are assigned to one vector number. Accordingly, determine the source using an exception
handling routine.
The detection of interrupts WKP7 to WKP0 does not depend on whether the relevant pin has been
set for input or output. However, when a pin is used as an external interrupt input pin, do not clear
Rev. 5.00 Sep. 01, 2009 Page 83 of 656
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Section 5 Interrupt Controller
the corresponding DDR to 0; and use the pin as an I/O pin for another function. IRQnF interrupt
request flag is set to 1 when the setting condition is satisfied, regardless of IER settings.
Accordingly, refer to only necessary flags.
5.4.2
Internal Interrupts
For each on-chip peripheral module, there are flags that indicate the interrupt request status, and
enable bits that select enabling or disabling of these interrupts. If both of these are set to 1 for a
particular interrupt source, an interrupt request is issued to the interrupt controller.
5.4.3
Interrupt Exception Handling Vector Table
Table 5.2 shows interrupt exception handling sources, vector addresses, and interrupt priorities.
For default priorities, the lower the vector number, the higher the priority.
Priorities among modules can be set by means of the IPR. (H8S/2268 Group only)
Modules set at the same priority will conform to their default priorities. Priorities within a module
are fixed.
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Section 5 Interrupt Controller
Table 5.2
Interrupt Sources, Vector Addresses, and Interrupt Priorities
Vector Address*1
Interrupt Source
Origin of Interrupt
Source
Vector
Number
External Pin
NMI
7
H'001C
IRQ0
16
H'0040
IPRA6 to IPRA4
IRQ1
17
H'0044
IPRA2 to IPRA0
Reserved
18
H'0048
IPRB6 to IPRB4
IRQ3
19
H'004C
IRQ4
20
H'0050
IRQ5*3
21
H'0054
Reserved
22
23
H'0058
H'005C
IPRC6 to IPRC4
DTC*3
SWDTEND
(completion of software
initiation data transfer)
24
H'0060
IPRC2 to IPRC0
Watchdog timer 0
WOVI0
(interval timer 0)
25
H'0064
IPRD6 to IPRD4
PC break*3
PC break
27
H'006C
IPRE6 to IPRE4
A/D
ADI (completion of A/D
conversion)
28
H'0070
IPRE2 to IPRE0
Watchdog timer 1
WOVI1 (interval timer 1)
29
H'0074
⎯
Reserved
30
31
H'0078
H'007C
TPU channel 0*3
TGI0A (TGR0A input
capture/compare-match)
32
H'0080
TGI0B (TGR0B input
capture/compare-match)
33
H'0084
TGI0C (TGR0C input
capture/compare-match)
34
H'0088
TGI0D (TGR0D input
capture/compare- match)
35
H'008C
TCI0V (overflow 0)
36
H'0090
Reserved
37
38
39
H'0094
H'0098
H'009C
⎯
Advanced Mode
IPR*2*3
Priority
High
IPRB2 to IPRB0
IPRF6 to IPRF4
Low
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Section 5 Interrupt Controller
Origin of Interrupt
Source
Vector
Number
TGI1A (TGR1A input
capture/compare-match)
Vector Address*1
Advanced Mode
IPR*2*3
Priority
40
H'00A0
IPRF2 to IPRF0
High
TGI1B (TGR1B input
capture/compare-match)
41
H'00A4
TCI1V (overflow 1)
42
H'00A8
43
H'00AC
TGI2A (TGR2A input
capture/compare-match)
44
H'00B0
TGI2B (TGR2B input
capture/compare-match)
45
H'00B4
TCI2V (overflow 2)
46
H'00B8
47
H'00BC
CMIA0
(compare-match A0)
64
H'0100
CMIB0
(compare-match B0)
65
H'0104
OVI0 (overflow 0)
66
H'0108
⎯
Reserved
67
H'010C
8-bit timer
channel 1
CMIA1
(compare-match A1)
68
H'0110
CMIB1
(compare-match B1)
69
H'0114
OVI1 (overflow 1)
70
H'0118
⎯
Reserved
71
H'011C
SCI channel 0
ERI0 (receive error 0)
80
H'0140
RXI0
(receive completion 0)
81
H'0144
TXI0
(transmit data empty 0)
82
H'0148
TEI0 (transmit end 0)
83
H'014C
Interrupt Source
TPU channel 1
TCI1U (underflow 1)*
TPU channel 2
TCI2U (underflow 2)*
8-bit timer
channel 0
3
3
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IPRG6 to IPRG4
IPRI6 to IPRI4
IPRI2 to IPRI0
IPRJ2 to IPRJ0
Low
Section 5 Interrupt Controller
Interrupt Source
Origin of Interrupt
Source
Vector
Number
SCI channel 1
ERI1 (receive error 1)
Vector Address*1
Advanced Mode
IPR*2*3
Priority
84
H'0150
IPRK6 to IPRK4
High
RXI1
(receive completion 1)
85
H'0154
TXI1
(transmit data empty 1)
86
H'0158
TEI1 (transmit end 1)
87
H'015C
CMIA2
(compare-match A2)
92
H'0170
CMIB2
(compare-match B2)
93
H'0174
OVI2 (overflow 2)
94
H'0178
⎯
Reserved
95
H'017C
8-bit timer
channel 3*3
CMIA3
(compare-match A3)
96
H'0180
CMIB3
(compare-match B3)
97
H'0184
OVI3 (overflow 3)
98
H'0188
⎯
Reserved
99
H'018C
IIC channel 0*4
IICI0 (1-byte transmission/ 100
reception completion)
H'0190
Reserved
101
H'0194
IICI1 (1-byte transmission/ 102
reception completion)
H'0198
Reserved
103
H'019C
OVI4 (overflow 4)
104
H'01A0
OVI5 (overflow 5)
105
H'01A4
OVI6 (overflow 6)
106
H'01A8
OVI7 (overflow 7)
107
H'01AC
WKP7 to WKP0
108
H'01B0
8-bit timer
channel 2*3
IIC channel 1*3
8-bit reload timer
channels 4 to 7*3
External pins
IPRL6 to IPRL4
IPRL2 to IPRL0
IPRM6 to IPRM4
IPRM2 to IPRM0
Low
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Section 5 Interrupt Controller
Interrupt Source
Origin of Interrupt
Source
Vector
Number
SCI channel 2
ERI2 (receive error 2)
Vector Address*1
Advanced Mode
IPR*2*3
Priority
120
H'01E0
IPRO6 to IPRO4
High
RXI2
(receive completion 2)
121
H'01E4
TXI2
(transmit data empty 2)
122
H'01E8
TEI2 (transmit end 2)
123
H'01EC
Low
Notes: 1. Lower 16 bits of the start address.
2. IPR6 to IPR4, and IPR2 to IPR0 bits are reserved, because these bits have no
corresponding interruption. These bits are always read as 0 and cannot be modified.
3. Supported only by the H8S/2268 Group.
4. Supported as an option by H8S/2264 Group.
5.5
Operation
5.5.1
Interrupt Control Modes and Interrupt Operation
Interrupt operations in the H8S/2268 differ depending on the interrupt control mode.
NMI interrupts are accepted at all times except in the reset state and the hardware standby state. In
the case of IRQ interrupts, WKP interrupts and on-chip peripheral module interrupts, an enable bit
is provided for each interrupt. Clearing an enable bit to 0 disables the corresponding interrupt
request. Interrupt sources for which the enable bits are set to 1 are controlled by the interrupt
controller.
Table 5.3 shows the interrupt control modes.
The interrupt controller performs interrupt control according to the interrupt control mode set by
the INTM1 and INTM0 bits in SYSCR, the priorities set in IPR*, and the masking state indicated
by the I bit in the CPU’s CCR, and bits I2 to I0 in EXR*.
Note: * Supported only by the H8S/2268 Group.
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Section 5 Interrupt Controller
Table 5.3
Interrupt Control Modes
SYSCR
Interrupt
Priority Setting
Control Mode INTM1 INTM0 Registers*
0
⎯
2*
0
1
⎯
Interrupt
Mask Bits
Description
0
⎯
I
Interrupt mask control is
performed by the I bit.
1
⎯
⎯
Setting prohibited
0
IPR
I2 to I0
8-level interrupt mask control
is performed by bits I2 to I0.
8 priority levels can be set with
IPR.
1
⎯
⎯
Setting prohibited
Note: * Supported only by the H8S/2268 Group.
Figures 5.7 and 5.8 show block diagrams of the priority decision circuits for the H8S/2268 Group
and H8S/2264 Group, respectively.
Interrupt
control
mode 0
I
Interrupt
acceptance
control
Default priority
determination
Interrupt source
Vector number
8-level
mask control
IPR
I2 to I0
Interrupt control mode 2
Figure 5.7 Block Diagram of Interrupt Control Operation for H8S/2268 Group
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Section 5 Interrupt Controller
Interrupt
control
mode 0
I
Interrupt
acceptance
control
Interrupt source
Default priority
determination
Vector number
Figure 5.8 Block Diagram of Interrupt Control Operation for H8S/2264 Group
Interrupt Acceptance Control: In interrupt control mode 0, interrupt acceptance is controlled by
the I bit in CCR.
Table 5.4 shows the interrupts selected in each interrupt control mode.
Table 5.4
Interrupts Selected in Each Interrupt Control Mode (1)
Interrupt Mask Bits
Interrupt Control Mode
I
Selected Interrupts
0
0
All interrupts
1
NMI interrupts
X
All interrupts
2*
Legend:
X: Don't care
Note: * Supported only by the H8S/2268 Group.
8-Level Control (H8S/2268 Group Only): In interrupt control mode 2, 8-level mask level
determination is performed for the selected interrupts in interrupt acceptance control according to
the interrupt priority level (IPR).
The interrupt source selected is the interrupt with the highest priority level, and whose priority
level set in IPR is higher than the mask level.
Table 5.5
Interrupts Selected in Each Interrupt Control Mode (2)
Interrupt Control Mode
Selected Interrupts
0
All interrupts
2
Highest-priority-level (IPR) interrupt whose priority level is greater
than the mask level (IPR > I2 to I0).
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Section 5 Interrupt Controller
Default Priority Determination: When an interrupt is selected by 8-level control, its priority is
determined and a vector number is generated.
If the same value is set for IPR, acceptance of multiple interrupts is enabled, and so only the
interrupt source with the highest priority according to the preset default priorities is selected and
has a vector number generated (H8S/2268 Group only).
Interrupt sources with a lower priority than the accepted interrupt source are held pending.
Table 5.6 shows operations and control signal functions in each interrupt control mode.
Table 5.6
Interrupt
Control
Mode
0
3
2*
Operations and Control Signal Functions in Each Interrupt Control Mode
Setting
Interrupt
Acceptance
Control
INTM1 INTM0
3
8-Level Control*
3
I2 to I0*
X
⎯
3
IPR*
2
⎯*
O
IM
PR
I
0
0
O
1
0
X
IM
1
⎯*
Default Priority
Determination
T
(Trace)
O
⎯
O
T
Legend:
O: Interrupt operation control performed
X:
No operation. (All interrupts enabled)
IM: Used as interrupt mask bit
PR: Sets priority.
⎯: Not used.
Notes: 1. Set to 1 when interrupt is accepted.
2. Keep the initial setting.
3. Supported only by the H8S/2268 Group.
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Section 5 Interrupt Controller
5.5.2
Interrupt Control Mode 0
Enabling and disabling of IRQ interrupts, WKP interrupts and on-chip peripheral module
interrupts can be set by means of the I bit in the CPU’s CCR. Interrupts are enabled when the I bit
is cleared to 0, and disabled when set to 1.
Figure 5.9 shows a flowchart of the interrupt acceptance operation in this case.
1. If an interrupt source occurs when the corresponding interrupt enable bit is set to 1, an
interrupt request is sent to the interrupt controller.
2. If the I bit is set to 1, only an NMI interrupt is accepted, and other interrupt requests are held
pending. If the I bit is cleared, an interrupt request is accepted.
3. Interrupt requests are sent to the interrupt controller, the highest-ranked interrupt according to
the priority system is accepted, and other interrupt requests are held pending.
4. When the CPU accepts an interrupt request, it starts interrupt exception handling after
execution of the current instruction has been completed.
5. The PC and CCR are saved to the stack area by interrupt exception handling. The PC saved on
the stack shows the address of the first instruction to be executed after returning from the
interrupt handling routine.
6. Next, the I bit in CCR is set to 1. This masks all interrupts except NMI.
7. The CPU generates a vector address for the accepted interrupt and starts execution of the
interrupt handling routine at the address indicated by the contents of the vector address in the
vector table.
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Section 5 Interrupt Controller
Program execution status
Interrupt generated
No
Yes
Yes
NMI
No
No
Hold
pending
I=0
Yes
IRQ0
No
No
Yes
IRQ1
Yes
TEI2
Yes
Save PC and CCR
I=1
Read vector address
Branch to interrupt handling routine
Figure 5.9 Flowchart of Procedure Up to Interrupt Acceptance
in Interrupt Control Mode 0
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Section 5 Interrupt Controller
5.5.3
Interrupt Control Mode 2 (H8S/2268 Group Only)
Eight-level masking is implemented for IRQ interrupts, WKP interrupts and on-chip peripheral
module interrupts by comparing the interrupt mask level set by bits I2 to I0 of EXR in the CPU
with IPR.
Figure 5.10 shows a flowchart of the interrupt acceptance operation in this case.
1. If an interrupt source occurs when the corresponding interrupt enable bit is set to 1, an interrupt
request is sent to the interrupt controller.
2. When interrupt requests are sent to the interrupt controller, the interrupt with the highest
priority according to the interrupt priority levels set in IPR is selected, and lower-priority
interrupt requests are held pending. If a number of interrupt requests with the same priority are
generated at the same time, the interrupt request with the highest priority according to the
priority system shown in table 5.2 is selected.
3. Next, the priority of the selected interrupt request is compared with the interrupt mask level set
in EXR. An interrupt request with a priority no higher than the mask level set at that time is
held pending, and only an interrupt request with a priority higher than the interrupt mask level
is accepted.
4. When the CPU accepts an interrupt request, it starts interrupt exception handling after
execution of the current instruction has been completed.
5. The PC, CCR, and EXR are saved to the stack area by interrupt exception handling. The PC
saved on the stack shows the address of the first instruction to be executed after returning from
the interrupt handling routine.
6. The T bit in EXR is cleared to 0. The interrupt mask level is rewritten with the priority level of
the accepted interrupt.
If the accepted interrupt is NMI, the interrupt mask level is set to H'7.
7. The CPU generates a vector address for the accepted interrupt and starts execution of the
interrupt handling routine at the address indicated by the contents of the vector address in the
vector table.
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Section 5 Interrupt Controller
Program execution status
No
Interrupt generated?
Yes
Yes
NMI
No
Level 7 interrupt?
No
Yes
Mask level 6
or below?
Yes
No
Level 6 interrupt?
No
Yes
Level 1 interrupt?
No
Mask level 5
or below?
No
Yes
Yes
Mask level 0?
No
Yes
Save PC, CCR, and EXR
Hold
pending
Clear T bit to 0
Update mask level
Read vector address
Branch to interrupt handling routine
Figure 5.10 Flowchart of Procedure Up to Interrupt Acceptance in Control Mode 2
5.5.4
Interrupt Exception Handling Sequence
Figure 5.11 shows the interrupt exception handling sequence. The example shown is for the case
where interrupt control mode 0 is set in advanced mode, and the program area and stack area are
in on-chip memory.
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Figure 5.11 Interrupt Exception Handling
(1)
(2)
(4)
(3)
Internal
operation
Instruction prefetch address (Not executed.
This is the contents of the saved PC, the return address.)
(2) (4) Instruction code (Not executed.)
(3)
Instruction prefetch address (Not executed.)
(5)
SP-2
(7)
SP-4
(1)
Internal
data bus
Internal
write signal
Internal
read signal
Internal
address bus
Interrupt
request signal
φ
Interrupt level determination Instruction
Wait for end of instruction
prefetch
Interrupt
acceptance
(7)
(8)
(10)
(9)
(12)
(11)
Internal
operation
(14)
(13)
Interrupt service
routine instruction
prefetch
Saved PC and saved CCR
Vector address
Interrupt handling routine start address (Vector address contents)
Interrupt handling routine start address ((13) = (10)(12))
First instruction of interrupt handling routine
(6)
(6) (8)
(9) (11)
(10) (12)
(13)
(14)
(5)
stack
Vector fetch
Section 5 Interrupt Controller
Section 5 Interrupt Controller
5.5.5
Interrupt Response Times
This LSI is capable of fast word transfer to on-chip memory, has the program area in on-chip
ROM and the stack area in on-chip RAM, enabling high-speed processing.
Table 5.7 shows interrupt response times - the interval between generation of an interrupt request
and execution of the first instruction in the interrupt handling routine. The execution status
symbols used in table 5.7 are explained in table 5.8.
Table 5.7
Interrupt Response Times (States)
Normal Mode*
5
No. Execution Status
Advanced Mode
INTM1 = 0
INTM1 = 1
INTM1 = 0
INTM1 = 1
1
1
Interrupt priority determination*
3
3
3
3
2
Number of wait states until executing
2
instruction ends*
1 to 19 +
2·SI
1 to 19 +
2·SI
1 to 19 +
2·SI
1 to 19 +
2·SI
3
PC, CCR, EXR stack save
2·SK
3·SK
2·SK
3·SK
4
Vector fetch
SI
SI
2·SI
2·SI
5
3
Instruction fetch*
2·SI
2·SI
2·SI
2·SI
6
4
Internal processing*
2
2
2
2
11 to 31
12 to 32
12 to 32
13 to 33
Total (using on-chip memory)
Notes: 1.
2.
3.
4.
5.
Two states in case of internal interrupt.
Refers to MULXS and DIVXS instructions.
Prefetch after interrupt acceptance and interrupt handling routine prefetch.
Internal processing after interrupt acceptance and internal processing after vector fetch.
Not available in this LSI.
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Section 5 Interrupt Controller
Table 5.8
Number of States in Interrupt Handling Routine Execution Status
Object of Access
External Device*
8 Bit Bus
Symbol
Instruction fetch
SI
Branch address read
SJ
Stack manipulation
SK
16 Bit Bus
Internal
Memory
2-State
Access
3-State
Access
2-State
Access
3-State
Access
1
4
6+2m
2
3+m
Legend:
m: Number of wait states in an external device access.
Note: * Cannot be used in this LSI.
5.5.6
DTC Activation by Interrupt (H8S/2268 Group Only)
The DTC can be activated by an interrupt. In this case, the following selections can be made.
1. Interrupt request to CPU
2. Activation request to DTC
3. Multiple selection of 1 and 2 above.
For details on interrupt request, which enables DTC activation, see section 8, Data Transfer
Controller (DTC). Figure 5.12 shows a block diagram of DTC and interrupt controller.
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Section 5 Interrupt Controller
Interrupt request
IRQ
interrupt
DTC activation
request vector
number
Selection
circuit
Selection
signal
Clear signal
On-chip
peripheral
module
Interrupt source
clear signal
Control
logic
DTC
DTCER
Clear signal
DTVECR
SWDTE
clear signal
Priority
determination
CPU interrupt
request vector
number
Interrupt controller
CPU
I, I2 to I0
Figure 5.12 DTC and Interrupt Controller
Interrupt controller of DTC control has the following three main functions.
Interrupt source selection: For interruption source, select DTC activation request or CPU
interruption request by the DTCE bits in DTCERA to DTCERF, and DTCERI of the DTC. After
DTC data transfer, the DTCE bit is cleared to 0, and an interrupt request to the CPU can be made
by the setting of the DISEL bit in MRB of the DTC. When DTC performs data transfer for
prescribed number of times and transfer counter becomes 0, the DTCE bit should be cleared to 0
and an interrupt request to the CPU is made after DTC data transfer.
Priority determination: DTC activation source is selected according to priority of default setting.
Mask level and priority level do not affect the selection. For details, see section 8.4, Location of
Register Information and DTC Vector Table.
Operation order: When the same interrupts are selected as DTC activation source and CPU
interruption source, DTC data is transferred, and then CPU interrupt exception processing is made.
Table 5.9 shows interrupt source selection and interrupt source clear control by the setting of the
DTCE bit in DTCERA to DTCERF, and DTCERI of the DTC and the setting of the DISEL bit in
MRB of the DTC.
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Section 5 Interrupt Controller
Table 5.9
Interrupt Source Selection and Clear Control
Settings
Interrupt Source Selection
and Clear Control
DTC
DTCE
DESEL
DTC
CPU
0
*
X
#
1
0
#
X
1
O
#
Legend:
#: Corresponding interrupt is used. Interrupt source is cleared.
(The CPU should clear the source flag in the interrupt processing routine.)
O: Corresponding interrupt is used. Interrupt source is not cleared.
X: Corresponding interrupt cannot be used.
*: Don’t care
Usage note: Interrupt sources of the SCI and A/D converter are cleared when the DTC reads or
writes prescribed register, and they do not depend on the DTCE or DISEL bit.
5.6
Usage Notes
5.6.1
Contention between Interrupt Generation and Disabling
When an interrupt enable bit is cleared to 0 to disable interrupt requests, the disabling becomes
effective after execution of the instruction.
When an interrupt enable bit is cleared to 0 by an instruction such as BCLR or MOV, and if an
interrupt is generated during execution of the instruction, the interrupt concerned will still be
enabled on completion of the instruction, and so interrupt exception handling for that interrupt will
be executed on completion of the instruction. However, if there is an interrupt request of higher
priority than that interrupt, interrupt exception handling will be executed for the higher-priority
interrupt, and the lower-priority interrupt will be ignored.
The same also applies when an interrupt source flag is cleared to 0.
Figure 5.13 shows an example in which the CMIEA bit in the TCR register of the 8-bit timer is
cleared to 0.
The above contention will not occur if an enable bit or interrupt source flag is cleared to 0 while
the interrupt is masked.
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Section 5 Interrupt Controller
TCR write cycle by CPU
CMIA exception handling
φ
Internal
address bus
TCR address
Internal
write signal
CMIEA
CMFA
CMIA
interrupt signal
Figure 5.13 Contention between Interrupt Generation and Disabling
5.6.2
Instructions that Disable Interrupts
The instructions that disable interrupts are LDC, ANDC, ORC, and XORC. After any of these
instructions are executed, all interrupts including NMI are disabled and the next instruction is
always executed. When the I bit is set by one of these instructions, the new value becomes valid
two states after execution of the instruction ends.
5.6.3
When Interrupts Are Disabled
There are times when interrupt acceptance is disabled by the interrupt controller.
The interrupt controller disables interrupt acceptance for a 3-state period after the CPU has
updated the mask level with an LDC, ANDC, ORC, or XORC instruction.
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Section 5 Interrupt Controller
5.6.4
Interrupts during Execution of EEPMOV Instruction
Interrupt operation differs between the EEPMOV.B instruction and the EEPMOV.W instruction.
With the EEPMOV.B instruction, an interrupt request (including NMI) issued during the transfer
is not accepted until the move is completed.
With the EEPMOV.W instruction, if an interrupt request is issued during the transfer, interrupt
exception handling starts at a break in the transfer cycle. The PC value saved on the stack in this
case is the address of the next instruction.
Therefore, if an interrupt is generated during execution of an EEPMOV.W instruction, the
following coding should be used.
L1:
5.6.5
EEPMOV.W
MOV.W
R4,R4
BNE
L1
IRQ Interrupt
When operating by clock input, acceptance of input to an IRQ is synchronized with the clock. In
software standby mode and watch mode, the input is accepted asynchronously. For details on the
input conditions, see section 25.2.3, 25.3.3, Control Signal Timing.
5.6.6
NMI Interrupt Usage Notes
The NMI interrupt is part of the exception processing performed cooperatively by the LSI’s
internal interrupt controller and the CPU when the system is operating normally under the
specified electrical conditions. No operations, including NMI interrupts, are guaranteed when
operation is not normal (runaway status) due to software problems or abnormal input to the LSI’s
pins. In such cases, the LSI may be restored to the normal program execution state by applying an
external reset.
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Section 6 PC Break Controller (PBC)
Section 6 PC Break Controller (PBC)
The H8S/2268 Group includes a PC break controller (PBC), while the H8S/2264 Group does not.
The PC break controller (PBC) provides functions that simplify program debugging. Using these
functions, it is easy to create a self-monitoring debugger, enabling programs to be debugged with
the chip alone, without using an in-circuit emulator. A block diagram of the PC break controller is
shown in figure 6.1.
6.1
Features
• Two break channels (A and B)
• 24-bit break address
⎯ Bit masking possible
• Four types of break compare conditions
⎯ Instruction fetch
⎯ Data read
⎯ Data write
⎯ Data read/write
• Bus master
⎯ Either CPU or CPU/DTC can be selected
• The timing of PC break exception handling after the occurrence of a break condition is as
follows:
⎯ Immediately before execution of the instruction fetched at the set address (instruction
fetch)
⎯ Immediately after execution of the instruction that accesses data at the set address (data
access)
• Module stop mode can be set
PBC0000B_000020020700
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Section 6 PC Break Controller (PBC)
BCRA
Mask control
Output control
BARA
Control
logic
Comparator
Match signal
Internal address
PC break
interrupt
Access
status
Comparator
Match signal
Mask control
BARB
Output control
Control
logic
BCRB
Figure 6.1 Block Diagram of PC Break Controller
6.2
Register Descriptions
The PC break controller has the following registers.
• Break address register A (BARA)
• Break address register B (BARB)
• Break control register A (BCRA)
• Break control register B (BCRB)
6.2.1
Break Address Register A (BARA)
BARA is a 32-bit readable/writable register that specifies the channel A break address.
Bit
Bit Name
Initial
Value
31 to 24
⎯
Undefined ⎯
R/W
Description
Reserved
These bits are read as an undefined value and
cannot be modified.
23 to 0
BAA23 to
BAA0
H'000000
R/W
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These bits set the channel A PC break address.
Section 6 PC Break Controller (PBC)
6.2.2
Break Address Register B (BARB)
BARB is the channel B break address register. The bit configuration is the same as for BARA.
6.2.3
Break Control Register A (BCRA)
BCRA controls channel A PC breaks.
Bit
7
Bit Name
CMFA
Initial
Value
R/W
0
R/(W)* Condition Match Flag A
Description
1
[Setting condition]
When a condition set for channel A is satisfied
[Clearing condition]
When 0 is written to CMFA after reading* CMFA = 1
2
6
CDA
0
R/W
CPU Cycle/DTC Cycle Select A
Selects the channel A break condition bus master.
0: CPU
1: CPU or DTC
5
BAMRA2
0
R/W
Break Address Mask Register A2 to A0
4
BAMRA1
0
R/W
3
BAMRA0
0
R/W
These bits specify which bits of the break address set in
BARA are to be masked.
000: BAA23 – 0 (All bits are unmasked)
001: BAA23 – 1 (Lowest bit is masked)
010: BAA23 – 2 (Lower 2 bits are masked)
011: BAA23 – 3 (Lower 3 bits are masked)
100: BAA23 – 4 (Lower 4 bits are masked)
101: BAA23 – 8 (Lower 8 bits are masked)
110: BAA23 – 12 (Lower 12 bits are masked)
111: BAA23 – 16 (Lower 16 bits are masked)
2
CSELA1
0
R/W
Break Condition Select
1
CSELA0
0
R/W
Selects break condition of channel A.
00: Instruction fetch is used as break condition
01: Data read cycle is used as break condition
10: Data write cycle is used as break condition
11: Data read/write cycle is used as break condition
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Section 6 PC Break Controller (PBC)
Bit
Bit Name
Initial
Value
R/W
0
BIEA
0
R/W
Description
Break Interrupt Enable
When this bit is 1, the PC break interrupt request of
channel A is enabled.
Notes: 1. Only a 0 can be written to this bit to clear the flag.
2. Read the state wherein CMFA = 1 twice or more, when the CMFA is polled after
inhibiting the PC break interruption.
6.2.4
Break Control Register B (BCRB)
BCRB is the channel B break control register. The bit configuration is the same as for BCRA.
6.3
Operation
The operation flow from break condition setting to PC break interrupt exception handling is
shown in section 6.3.1, PC Break Interrupt Due to Instruction Fetch, and 6.3.2, PC Break Interrupt
Due to Data Access, taking the example of channel A.
6.3.1
PC Break Interrupt Due to Instruction Fetch
1. Set the break address in BARA.
For a PC break caused by an instruction fetch, set the address of the first instruction byte as the
break address.
2. Set the break conditions in BCR.
Set bit 6 (CDA) to 0 to select the CPU because the bus master must be the CPU for a PC break
caused by an instruction fetch. Set the address bits to be masked to bits 3 to 5 (BAMA2 to 0).
Set bits 1 and 2 (CSELA1 to 0) to 00 to specify an instruction fetch as the break condition. Set
bit 0 (BIEA) to 1 to enable break interrupts.
3. When the instruction at the set address is fetched, a PC break request is generated immediately
before execution of the fetched instruction, and the condition match flag (CMFA) is set.
4. After priority determination by the interrupt controller, PC break interrupt exception handling
is started.
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Section 6 PC Break Controller (PBC)
6.3.2
PC Break Interrupt Due to Data Access
1. Set the break address in BARA.
For a PC break caused by a data access, set the target ROM, RAM, I/O, or external address
space address as the break address. Stack operations and branch address reads are included in
data accesses.
2. Set the break conditions in BCRA.
Select the bus master with bit 6 (CDA). Set the address bits to be masked to bits 3 to 5
(BAMA2 to 0). Set bits 1 and 2 (CSELA1 to 0) to 01, 10, or 11 to specify data access as the
break condition. Set bit 0 (BIEA) to 1 to enable break interrupts.
3. After execution of the instruction that performs a data access on the set address, a PC break
request is generated and the condition match flag (CMFA) is set.
4. After priority determination by the interrupt controller, PC break interrupt exception handling
is started.
6.3.3
Notes on PC Break Interrupt Handling
• When a PC break interrupt is generated at the transfer address of an EEPMOV.B instruction
PC break exception handling is executed after all data transfers have been completed and the
EEPMOV.B instruction has ended.
• When a PC break interrupt is generated at a DTC transfer address
PC break exception handling is executed after the DTC has completed the specified number of
data transfers, or after data for which the DISEL bit is set to 1 has been transferred.
6.3.4
Operation in Transitions to Power-Down Modes
The operation when a PC break interrupt is set for an instruction fetch at the address after a
SLEEP instruction is shown below.
• When the SLEEP instruction causes a transition from high-speed (medium-speed) mode to
sleep mode:
After execution of the SLEEP instruction, a transition is not made to sleep mode, and PC break
interrupt handling is executed. After execution of PC break interrupt handling, the instruction
at the address after the SLEEP instruction is executed (figure 6.2 (A)).
• When the SLEEP instruction causes a transition from high speed mode to subactive mode
(figure 6.2 (B)).
• When the SLEEP instruction causes a transition from subactive mode to high speed (medium
speed) mode (figure 6.2 (C)).
• When the SLEEP instruction causes a transition to software standby mode or watch mode:
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Section 6 PC Break Controller (PBC)
After execution of the SLEEP instruction, a transition is made to the respective mode, and PC
break interrupt handling is not executed. However, the CMFA or CMFB flag is set (figure 6.2
(D)).
SLEEP instruction
execution
SLEEP instruction
execution
SLEEP instruction
execution
SLEEP instruction
execution
PC break exception
handling
System clock
→ subclock
Subclock →
system clock,
oscillation settling time
Transition to
respective mode
Execution of instruction
after sleep instruction
Direct transition
exception handling
Direct transition
exception handling
(D)
(A)
PC break exception
handling
Subactive
mode
PC break exception
handling
Execution of instruction
after sleep instruction
Execution of instruction
after sleep instruction
(B)
(C)
High-speed
(medium-speed)
mode
Figure 6.2 Operation in Power-Down Mode Transitions
6.3.5
When Instruction Execution Is Delayed by One State
While the break interrupt enable bit is set to 1, instruction execution is one state later than usual.
• For 1-word branch instructions (Bcc d:8, BSR, JSR, JMP, TRAPA, RTE, and RTS) in on-chip
ROM or RAM.
• When break interruption by instruction fetch is set, the set address indicates on-chip ROM or
RAM space, and that address is used for data access, the instruction that executes the data
access is one state later than in normal operation.
• When break interruption by instruction fetch is set and a break interrupt is generated, if the
executing instruction immediately preceding the set instruction has one of the addressing
modes shown below, and that address indicates on-chip ROM or RAM, the instruction will be
one state later than in normal operation.
Addressing modes: @ERn, @(d:16,ERn), @(d:32,ERn), @-ERn/ERn+, @aa:8, @aa:24,
@aa:32, @(d:8,PC), @(d:16,PC), @@aa:8
• When break interruption by instruction fetch is set and a break interrupt is generated, if the
executing instruction immediately preceding the set instruction is NOP or SLEEP, or has #xx,
Rn as its addressing mode, and that instruction is located in on-chip ROM or RAM, the
instruction will be one state later than in normal operation.
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Section 6 PC Break Controller (PBC)
6.4
Usage Notes
6.4.1
Module Stop Mode Setting
PBC operation can be disabled or enabled using the module stop control register. The initial
setting is for PBC operation to be halted. Register access is enabled by clearing module stop
mode. For details, refer to section 22, Power-Down Modes.
6.4.2
PC Break Interrupts
The PC break interrupt is shared by channels A and B. The channel from which the request was
issued must be determined by the interrupt handler.
6.4.3
CMFA and CMFB
The CMFA and CMFB flags are not automatically cleared to 0, so 0 must be written to CMFA or
CMFB after first reading the flag while it is set to 1. If the flag is left set to 1, another interrupt
will be requested after interrupt handling ends.
6.4.4
PC Break Interrupt when DTC Is Bus Master
A PC break interrupt generated when the DTC is the bus master is accepted after the bus has been
transferred to the CPU by the bus controller.
6.4.5
PC Break Set for Instruction Fetch at Address Following BSR, JSR, JMP, TRAPA,
RTE, or RTS Instruction
When a PC break is set for an instruction fetch at an address following a BSR, JSR, JMP, TRAPA,
RTE, or RTS instruction:
Even if the instruction at the address following a BSR, JSR, JMP, TRAPA, RTE, or RTS
instruction is fetched, it is not executed, and so a PC break interrupt is not generated by the
instruction fetch at the next address.
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Section 6 PC Break Controller (PBC)
6.4.6
I Bit Set by LDC, ANDC, ORC, or XORC Instruction
When the I bit is set by an LDC, ANDC, ORC, or XORC instruction, a PC break interrupt
becomes valid two states after the end of the executing instruction. If a PC break interrupt is set
for the instruction following one of these instructions, since interrupts, including NMI, are
disabled for a 3-state period in the case of LDC, ANDC, ORC, and XOR, the next instruction is
always executed. For details, see section 5, Interrupt Controller.
6.4.7
PC Break Set for Instruction Fetch at Address Following Bcc Instruction
When a PC break is set for an instruction fetch at an address following a Bcc instruction:
A PC break interrupt is generated if the instruction at the next address is executed in accordance
with the branch condition, and is not generated if the instruction at the next address is not
executed.
6.4.8
PC Break Set for Instruction Fetch at Branch Destination Address of Bcc
Instruction
When a PC break is set for an instruction fetch at the branch destination address of a Bcc
instruction:
A PC break interrupt is generated if the instruction at the branch destination is executed in
accordance with the branch condition, and is not generated if the instruction at the branch
destination is not executed.
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Section 7 Bus Controller
Section 7 Bus Controller
The H8S/2000 CPU is driven by a system clock, denoted by the symbol φ.
The bus controller controls a memory cycle and a bus cycle. Different methods are used to access
on-chip memory and on-chip peripheral modules. In the H8S/2268 Group, the bus controller also
has a bus arbitration function, and controls the operation of the internal bus masters: the CPU and
data transfer controller (DTC).
7.1
Basic Timing
The period from one rising edge of φ to the next is referred to as a "state". The memory cycle or
bus cycle consists of one, two, or four states. Different methods are used to access on-chip
memory, on-chip peripheral modules, and the external address space.
7.1.1
On-Chip Memory Access Timing (ROM, RAM)
On-chip memory is accessed in one state. The data bus is 16 bits wide, permitting both byte and
word transfer instruction. Figure 7.1 shows the on-chip memory access cycle.
Bus cycle
T1
φ
Internal address bus
Read
access
Internal read signal
Internal data bus
Write
access
Address
Read data
Internal write signal
Internal data bus
Write data
Figure 7.1 On-Chip Memory Access Cycle
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Section 7 Bus Controller
7.1.2
On-Chip Peripheral Module Access Timing (H'FFFDAC to H'FFFFBF)
Addresses H'FFFDAC to H'FFFFBF in the on-chip peripheral modules are accessed in two states.
The data bus is either 8 bits or 16 bits wide, depending on the particular internal I/O register being
accessed. For details, refer to section 24, List of Registers. Figure 7.2 shows access timing for the
on-chip peripheral modules (H'FFFDAC to H'FFFFBF).
Bus cycle
T1
T2
φ
Internal address bus
Read
access
Internal read signal
Internal data bus
Write
access
Address
Read data
Internal write signal
Internal data bus
Write data
Figure 7.2 On-Chip Peripheral Module Access Cycle (H'FFFDAC to H'FFFFBF)
7.1.3
On-Chip Peripheral Module Access Timing (H'FFFC30 to H'FFFCA3)
Addresses H'FFFC30 to H'FFFCA3 on the on-chip peripheral modules and registers are accessed
in four states. The data bus is either 8 bits or 16 bits wide, depending on the particular internal I/O
register being accessed. For details, refer to section 24, List of Registers. Figure 7.3 shows access
timing for the on-chip peripheral modules (H'FFFC30 to H'FFFCA3).
The on-chip module of which address is between H'FFFC30 to H'FFFCA3 includes LCD,
DTMF*, TMR4*, ports H to L and ports M* and N*. The registers are WKP register and module
stop control register D.
Note: * Supported only by the H8S/2268 Group.
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Section 7 Bus Controller
Bus cycle
T1
T2
T3
T4
φ
Internal address bus
Address
Internal read signal
Read
access
Internal data bus
Read data
Internal write signal
Write
access
Internal data bus
Write data
Figure 7.3 On-Chip Peripheral Module Access Cycle (H'FFFC30 to H'FFFCA3)
7.2
Bus Arbitration (H8S/2268 Group Only)
The Bus Controller has a bus arbiter that arbitrates bus master operations.
There are two bus masters, the CPU and DTC, which perform read/write operations when they
control the bus.
7.2.1
Order of Priority of the Bus Masters
Each bus master requests the bus by means of a bus request signal. The bus arbiter detects the bus
masters’ bus request signals, and if the bus is requested, sends a bus request acknowledge signal to
the bus master making the request. If there are bus requests from more than one bus master, the
bus request acknowledge signal is sent to the one with the highest priority. When a bus master
receives the bus request acknowledge signal, it takes possession of the bus until that signal is
canceled.
The order of priority of the bus masters is as follows:
(High)
DTC
>
CPU
(Low)
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Section 7 Bus Controller
7.2.2
Bus Transfer Timing
Even if a bus request is received from a bus master with a higher priority than that of the bus
master that has acquired the bus and is currently operating, the bus is not necessarily transferred
immediately. The CPU is the lowest-priority bus master, and if a bus request is received from the
DTC, the bus arbiter transfers the bus to the bus master that issued the request. The timing for
transfer of the bus is as follows:
• The bus is transferred at a break between bus cycles. However, if a bus cycle is executed in
discrete operations, as in the case of a longword-size access, the bus is not transferred between
such operations. For details, refer to section 2.7, Bus States During Instruction Execution, in
the H8S/2600 Series, H8S/2000 Series Programming Manual.
• If the CPU is in sleep mode, it transfers the bus immediately.
The DTC sends the bus arbiter a request for the bus when an activation request is generated.
7.2.3
Resets and the Bus Controller
In a reset, the H8S/2268, including the bus controller, enters the reset state at that point, and an
executing bus cycle is discontinued.
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Section 8 Data Transfer Controller (DTC)
Section 8 Data Transfer Controller (DTC)
The H8S/2268 Group includes a data transfer controller (DTC), while the H8S/2264 Group does
not. The DTC can be activated by an interrupt or software, to transfer data.
Figure 8.1 shows a block diagram of the DTC.
The DTC’s register information is stored in the on-chip RAM. When the DTC is used, the RAME
bit in SYSCR must be set to 1. A 32-bit bus connects the DTC to the on-chip RAM (1 kbyte),
enabling 32-bit/1-state reading and writing of the DTC register information.
8.1
Features
• Transfer is possible over any number of channels
• Three transfer modes
⎯ Normal, repeat, and block transfer modes are available
• One activation source can trigger a number of data transfers (chain transfer)
• The direct specification of 16-Mbyte address space is possible
• Activation by software is possible
• Transfer can be set in byte or word units
• A CPU interrupt can be requested for the interrupt that activated the DTC
• Module stop mode can be set
DTCH808B_000020020700
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Section 8 Data Transfer Controller (DTC)
Internal address bus
On-chip
RAM
CPU interrupt
request
Legend:
MRA, MRB:
CRA, CRB:
SAR:
DAR:
DTCERA to DTCERF
and DTCERI:
DTVECR:
Internal data bus
DTC mode registers A and B
DTC transfer count registers A and B
DTC source address register
DTC destination address register
DTC enable registers A to F and I
DTC vector register
Figure 8.1 Block Diagram of DTC
8.2
Register Descriptions
The DTC has the following registers.
• DTC mode register A (MRA)
• DTC mode register B (MRB)
• DTC source address register (SAR)
• DTC destination address register (DAR)
• DTC transfer count register A (CRA)
• DTC transfer count register B (CRB)
These six registers cannot be directly accessed from the CPU.
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Register information
MRA MRB
CRA
CRB
DAR
SAR
DTC service
request
Control logic
DTC
DTVECR
Interrupt
request
DTCERA
to
DTCERF
and DTCERI
Interrupt controller
Section 8 Data Transfer Controller (DTC)
When activated, the DTC reads a set of register information that is stored in on-chip RAM to the
corresponding DTC registers and transfers data. After the data transfer, it writes a set of updated
register information back to the RAM.
• DTC enable registers (DTCER)
• DTC vector register (DTVECR)
8.2.1
DTC Mode Register A (MRA)
MRA selects the DTC operating mode.
Bit
Bit Name
Initial
Value
7
SM1
Undefined ⎯
Source Address Mode 1 and 0
6
SM0
Undefined ⎯
These bits specify an SAR operation after a data
transfer.
R/W
Description
0X: SAR is fixed
10: SAR is incremented after a transfer
(by +1 when Sz = 0; by +2 when Sz = 1)
11: SAR is decremented after a transfer
(by –1 when Sz = 0; by –2 when Sz = 1)
5
DM1
Undefined ⎯
Destination Address Mode 1 and 0
4
DM0
Undefined ⎯
These bits specify a DAR operation after a data
transfer.
0X: DAR is fixed
10: DAR is incremented after a transfer
(by +1 when Sz = 0; by +2 when Sz = 1)
11: DAR is decremented after a transfer
(by –1 when Sz = 0; by –2 when Sz = 1)
3
MD1
Undefined ⎯
DTC Mode 1 and 0
2
MD0
Undefined ⎯
These bits specify the DTC transfer mode.
00: Normal mode
01: Repeat mode
10: Block transfer mode
11: Setting prohibited
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Section 8 Data Transfer Controller (DTC)
Bit
Bit Name
Initial
Value
1
DTS
Undefined ⎯
R/W
Description
DTC Transfer Mode Select
Specifies whether the source side or the destination
side is set to be a repeat area or block area, in repeat
mode or block transfer mode.
0: Destination side is repeat area or block area
1: Source side is repeat area or block area
0
Sz
Undefined ⎯
DTC Data Transfer Size
Specifies the size of data to be transferred.
0: Byte-size transfer
1: Word-size transfer
Legend:
X: Don’t care
8.2.2
DTC Mode Register B (MRB)
MRB is an 8-bit register that selects the DTC operating mode.
Bit
Bit Name
Initial
Value
7
CHNE
Undefined ⎯
R/W
Description
DTC Chain Transfer Enable
This bit specifies a chain transfer. For details, refer to
8.5.4, Chain Transfer.
In data transfer with CHNE set to 1, determination of
the end of the specified number of transfers, clearing of
the interrupt source flag, and clearing of DTCER, are
not performed.
0: DTC data transfer completed (waiting for start)
1: DTC data transfer (reads new register information
and transfers data)
6
DISEL
Undefined ⎯
DTC Interrupt Select
This bit specifies whether CPU interrupt is disabled or
enabled after a data transfer.
0: Interrupt request is issued to the CPU when the
specified data transfer is completed.
1: DTC issues interrupt request to the CPU in every
data transfer (DTC does not clear the interrupt
request flag that is a cause of the activation).
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Section 8 Data Transfer Controller (DTC)
Bit
Bit Name
Initial
Value
5 to 0
⎯
Undefined ⎯
R/W
Description
Reserved
These bits have no effect on DTC operation. The write
value should always be 0.
8.2.3
DTC Source Address Register (SAR)
SAR is a 24-bit register that designates the source address of data to be transferred by the DTC.
For word-size transfer, specify an even source address.
8.2.4
DTC Destination Address Register (DAR)
DAR is a 24-bit register that designates the destination address of data to be transferred by the
DTC. For word-size transfer, specify an even destination address.
8.2.5
DTC Transfer Count Register A (CRA)
CRA is a 16-bit register that designates the number of times data is to be transferred by the DTC.
In normal mode, the entire CRA functions as a 16-bit transfer counter (1 to 65536). It is
decremented by 1 every time data is transferred, and transfer ends when the count reaches H'0000.
In repeat mode or block transfer mode, the CRA is divided into two parts: the upper 8 bits
(CRAH) and the lower 8 bits (CRAL). In repeat mode, CRAH holds the number of transfers while
CRAL functions as an 8-bit transfer counter (1 to 256). In block transfer mode, CRAH holds the
block size while CRAL functions as an 8-bit block size counter (1 to 256). CRAL is decremented
by 1 every time data is transferred, and the contents of CRAH are sent when the count reaches
H'00. This operation is repeated.
8.2.6
DTC Transfer Count Register B (CRB)
CRB is a 16-bit register that designates the number of times data is to be transferred by the DTC in
block transfer mode. It functions as a 16-bit transfer counter (1 to 65536) that is decremented by 1
every time data is transferred, and transfer ends when the count reaches H'0000.
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Section 8 Data Transfer Controller (DTC)
8.2.7
DTC Enable Register (DTCER)
DTCER is comprised of seven registers; DTCERA to DTCERF and DTCERI, and is a register
that specifies DTC activation interrupt sources. The correspondence between interrupt sources and
DTCE bits is shown in table 8.1. For DTCE bit setting, use bit manipulation instructions such as
BSET and BCLR for reading and writing. If all interrupts are masked, multiple activation sources
can be set at one time (only at the initial setting) by writing data after executing a dummy read on
the relevant register.
Bit
Bit Name
Initial
Value
R/W
Description
7
DTCE7
0
R/W
DTC Activation Enable
6
DTCE6
0
R/W
5
DTCE5
0
R/W
Setting this bit to 1 specifies a relevant interrupt source
as a DTC activation source.
4
DTCE4
0
R/W
[Clearing conditions]
3
DTCE3
0
R/W
•
2
DTCE2
0
R/W
When the DISEL bit is 1 and the data transfer has
ended
1
DTCE1
0
R/W
•
When the specified number of transfers have ended
0
DTCE0
0
R/W
•
These bits are not cleared when the DISEL bit is 0
and the specified number of transfers have not been
completed
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Section 8 Data Transfer Controller (DTC)
8.2.8
DTC Vector Register (DTVECR)
DTVECR is an 8-bit readable/writable register that enables or disables DTC activation by
software, and sets a vector number for the software activation interrupt.
Bit
Bit Name
Initial
Value
R/W
Description
7
SWDTE
0
R/W
DTC Software Activation Enable
Setting this bit to 1 activates DTC. Only a 1 can be written
to this bit.
[Clearing conditions]
•
When the DISEL bit is 0 and the specified number of
transfers have not ended
•
When 0 s written to the DISEL bit after a softwareactivated data transfer end interrupt (SWDTEND)
request has been sent to the CPU.
•
When the DISEL bit is 1 and data transfer has ended,
the specified number of transfers have ended, or
software-activated data transfer is in process, this bit
will not be cleared.
6
DTVEC6
0
R/W
DTC Software Activation Vectors 0 to 6
5
DTVEC5
0
R/W
4
DTVEC4
0
R/W
These bits specify a vector number for DTC software
activation.
3
DTVEC3
0
R/W
2
DTVEC2
0
R/W
The vector address is expressed as H'0400 + (vector
number × 2). For example, when DTVEC6 to DTVEC0 =
H'10, the vector address is H'0420.
1
DTVEC1
0
R/W
These bits are writable when SWDTE=0.
0
DTVEC0
0
R/W
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Section 8 Data Transfer Controller (DTC)
8.3
Activation Sources
The DTC operates when activated by an interrupt or by a write to DTVECR by software. An
interrupt request can be directed to the CPU or DTC, as designated by the corresponding DTCER
bit. At the end of a data transfer (or the last consecutive transfer in the case of chain transfer), the
activation source or corresponding DTCER bit is cleared. Table 8.1 shows the relationship
between the activation source and DTCER clearing. The activation source flag, in the case of
RXI0, for example, is the RDRF flag in SCI_0.
Since there are a number of DTC activation sources, transferring the last byte (or word) does not
clear the flag of its activation source. Take appropriate steps at each interrupt processing.
When an interrupt has been designated a DTC activation source, the existing CPU mask level and
interrupt controller priorities have no effect. If there is more than one activation source at the same
time, the DTC operates in accordance with the default priorities.
Table 8.1
Activation Source and DTCER Clearing
Activation Source
The DISEL Bit Is 0, and Transfer
Counts Specified have not Ended
The DISEL Bit Is 1, or Transfer
Counts Specified have Ended
Software activation
•
•
The SWDTE bit retains 1
•
The interrupt request is sent to
the CPU
Interrupt activation
The SWDTE bit is cleared to 0
•
The corresponding DTCER bit
retains 1
•
The corresponding DTCER bit is
cleared to 0
•
The activation source flag is
cleared to 0
•
The activation source flag
retains 1
•
The interrupt request which
becomes an activation source is
sent to the CPU
Figure 8.2 shows a block diagram of activation source control. For details, see section 5, Interrupt
Controller.
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Section 8 Data Transfer Controller (DTC)
Source flag cleared
Clear
controller
Clear
DTCER
Clear request
Select
IRQ interrupt
DTVECR
Interrupt
request
DTC
Selection circuit
On-chip
peripheral
module
CPU
Interrupt controller
Interrupt mask
Figure 8.2 Block Diagram of DTC Activation Source Control
8.4
Location of Register Information and DTC Vector Table
Locate the register information in the on-chip RAM (addresses: H'FFEBC0 to H'FFEFBF).
Register information should be located at an address that is a multiple of four within the range.
Locating the register information in address space is shown in figure 8.3. Locate the MRA, SAR,
MRB, DAR, CRA, and CRB registers, in that order, from the start address of the register
information.
In the case of chain transfer, register information should be located in consecutive areas as shown
in figure 8.3, and the register information start address should be located at the vector address
corresponding to the interrupt source. Figure 8.4 shows the correspondence between DTC vector
address and register information. The DTC reads the start address of the register information from
the vector address set for each activation source, and then reads the register information from that
start address.
When the DTC is activated by software, the vector address is obtained from: H'0400 +
(DTVECR[6:0] × 2). For example, if DTVECR is H'10, the vector address is H'0420.
The configuration of the vector address is the same in both normal* and advanced modes, a 2-byte
unit being used in both cases. These two bytes specify the lower bits of the register information
start address.
Note: * Normal mode cannot be used in this LSI.
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Section 8 Data Transfer Controller (DTC)
Lower address
0
Register
information
start address
1
2
MRA
SAR
MRB
DAR
Register information
CRB
CRA
Chain
transfer
3
MRA
SAR
MRB
DAR
Register information
for 2nd transfer in
chain transfer
CRB
CRA
4 bytes
Figure 8.3 The Location of DTC Register Information in Address Space
DTC vector
address
Register information
start address
Register information
Chain transfer
Figure 8.4 Correspondence between DTC Vector Address and Register Information
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Section 8 Data Transfer Controller (DTC)
Table 8.2
Interrupt Sources, DTC Vector Addresses, and Corresponding DTCEs
Interrupt
Source
Origin of Interrupt
Source
DTC
Vector Number Vector Address
Software
Write to DTVECR
DTVECR
H'0400 +
⎯
vector number × 2
External pin
IRQ0
16
H'0420
DTCEA7
IRQ1
17
H'0422
DTCEA6
IRQ3
19
H'0426
DTCEA4
IRQ4
20
H'0428
DTCEA3
IRQ5
21
H'042A
DTCEA2
A/D
ADI
28
(A/D conversion end)
H'0438
DTCEB6
TPU
Channel 0
TGI0A
H'0440
DTCEB5
TPU
Channel 1
TPU
Channel 2
8-bit timer
channel 0
8-bit timer
channel 1
SCI
channel 0
SCI
channel 1
8-bit timer
channel 2
8-bit timer
channel 3
32
DTCE*
TGI0B
33
H'0442
DTCEB4
TGI0C
34
H'0444
DTCEB3
TGI0D
35
H'0446
DTCEB2
TGI1A
40
H'0450
DTCEB1
TGI1B
41
H'0452
DTCEB0
TGI2A
44
H'0458
DTCEC7
TGI2B
45
H'045A
DTCEC6
CMIA0
64
H'0480
DTCED3
CMIB0
65
H'0482
DTCED2
CMIA1
68
H'0488
DTCED1
CMIB1
69
H'048A
DTCED0
RXI0
81
H'04A2
DTCEE3
TXI0
82
H'04A4
DTCEE2
RXI1
85
H'04AA
DTCEE1
TXI1
86
H'04AC
DTCEE0
CMIA2
92
H'04B8
DTCEF5
CMIB2
93
H'04BA
DTCEF4
CMIA3
96
H'04C0
DTCEF3
CMIB3
97
H'04C2
DTCEF2
Priority
High
Low
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Section 8 Data Transfer Controller (DTC)
Interrupt
Source
Origin of Interrupt
Source
DTC
Vector Number Vector Address
DTCE*
Priority
IIC channel 0
IICI0
100
H'04C8
DTCEF1
High
IIC channel 1
IICI1
102
H'04CC
DTCEF0
SCI
channel 2
RXI2
121
H'04F2
DTCEI7
TXI2
122
H'04F4
DTCEI6
Low
Note: * DTCE bits with no corresponding interrupt are reserved, and should be written with 0.
8.5
Operation
Register information is stored in on-chip RAM. When activated, the DTC reads register
information in on-chip RAM and transfers data. After the data transfer, the DTC writes updated
register information back to the memory.
The pre-storage of register information in memory makes it possible to transfer data over any
required number of channels. The transfer mode can be specified as normal, repeat, and block
transfer mode. Setting the CHNE bit in MRB to 1 makes it possible to perform a number of
transfers with a single activation source (chain transfer).
The 24-bit SAR designates the DTC transfer source address, and the 24-bit DAR designates the
transfer destination address. After each transfer, SAR and DAR are independently incremented,
decremented, or left fixed depending on its register information.
Figure 8.5 shows the flowchart of DTC operation.
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Section 8 Data Transfer Controller (DTC)
Start
Read DTC vector
Next transfer
Read register infomation
Data transfer
Write register information
CHNE = 1
Yes
No
Transfer Counter = 0
or DISEL = 1
Yes
No
Clear an activeation flag
Clear DTCER
End
Interupt exception
handling
*
Note: * For details, see section related to each peripheral module.
Figure 8.5 Flowchart of DTC Operation
8.5.1
Normal Mode
In normal mode, one operation transfers one byte or one word of data.
From 1 to 65,536 transfers can be specified. Once the specified number of transfers have been
completed, a CPU interrupt can be requested.
Table 8.3 lists the register information in normal mode. Figure 8.6 shows the memory mapping in
normal mode.
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Section 8 Data Transfer Controller (DTC)
Table 8.3
Register Information in Normal Mode
Name
Abbreviation
Function
DTC source address register
SAR
Designates source address
DTC destination address register
DAR
Designates destination address
DTC transfer count register A
CRA
Designates transfer count
DTC transfer count register B
CRB
Not used
SAR
DAR
Transfer
Figure 8.6 Memory Mapping in Normal Mode
8.5.2
Repeat Mode
In repeat mode, one operation transfers one byte or one word of data.
From 1 to 256 transfers can be specified. Once the specified number of transfers have ended, the
initial state of the transfer counter and the address register specified as the repeat area is restored,
and transfer is repeated. In repeat mode the transfer counter value does not reach H'00, and
therefore CPU interrupts cannot be requested when DISEL = 0.
Table 8.4 lists the register information in repeat mode. Figure 8.7 shows the memory mapping in
repeat mode.
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Section 8 Data Transfer Controller (DTC)
Table 8.4
Register Information in Repeat Mode
Name
Abbreviation
Function
DTC source address register
SAR
Designates source address
DTC destination address register
DAR
Designates destination address
DTC transfer count register AH
CRAH
Holds number of transfers
DTC transfer count register AL
CRAL
Designates transfer count
DTC transfer count register B
CRB
Not used
SAR
or
DAR
DAR
or
SAR
Repeat area
Transfer
Figure 8.7 Memory Mapping in Repeat Mode
8.5.3
Block Transfer Mode
In block transfer mode, one operation transfers one block of data. Either the transfer source or the
transfer destination is designated as a block area.
The block size can be between 1 to 256. When the transfer of one block ends, the initial state of
the block size counter and the address register specified as the block area is restored. The other
address register is then incremented, decremented, or left fixed.
From 1 to 65,536 transfers can be specified. Once the specified number of transfers have been
completed, a CPU interrupt is requested.
Table 8.5 lists the register information in block transfer mode. Figure 8.8 shows the memory
mapping in block transfer mode.
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Section 8 Data Transfer Controller (DTC)
Table 8.5
Register Information in Block Transfer Mode
Name
Abbreviation
Function
DTC source address register
SAR
Designates source address
DTC destination address register
DAR
Designates destination address
DTC transfer count register AH
CRAH
Holds block size
DTC transfer count register AL
CRAL
Designates block size count
DTC transfer count register B
CRB
Transfer count
First block
SAR
or
DAR
Block area
Transfer
Nth block
Figure 8.8 Memory Mapping in Block Transfer Mode
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DAR
or
SAR
Section 8 Data Transfer Controller (DTC)
8.5.4
Chain Transfer
Setting the CHNE bit in MRB to 1 enables a number of data transfers to be performed
consecutively in response to a single transfer request. SAR, DAR, CRA, CRB, MRA, and MRB,
which define data transfers, can be set independently.
Figure 8.9 shows the memory map for chain transfer.
When activated, the DTC reads the register information start address stored at the vector address,
and then reads the first register information at that start address. After the data transfer, the CHNE
bit will be tested. When it has been set to 1, DTC reads the next register information located in a
consecutive area and performs the data transfer. These sequences are repeated until the CHNE bit
is cleared to 0.
In the case of transfer with CHNE set to 1, an interrupt request to the CPU is not generated at the
end of the specified number of transfers or by setting of the DISEL bit to 1, and the interrupt
source flag for the activation source is not affected.
Source
Destination
Register information
CHNE=1
DTC vector
address
Register information
start address
Register information
CHNE=0
Source
Destination
Figure 8.9 Chain Transfer Operation
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Section 8 Data Transfer Controller (DTC)
8.5.5
Interrupts
An interrupt request is issued to the CPU when the DTC has completed the specified number of
data transfers, or a data transfer for which the DISEL bit was set to 1. In the case of interrupt
activation, the interrupt set as the activation source is generated. These interrupts to the CPU are
subject to CPU mask level and interrupt controller priority level control.
In the case of software activation, a software-activated data transfer end interrupt (SWDTEND) is
generated.
When the DISEL bit is 1 and one data transfer has been completed, or the specified number of
transfers have been completed, after data transfer ends the SWDTE bit is held at 1 and an
SWDTEND interrupt is generated. The interrupt handling routine will then clear the SWDTE bit
to 0.
When the DTC is activated by software, an SWDTEND interrupt is not generated during a data
transfer wait or during data transfer even if the SWDTE bit is set to 1.
8.5.6
Operation Timing
Figures 8.10 to 8.12 show the DTC operation timings.
φ
DTC activation
request
DTC
request
Vector read
Data transfer
Address
Read Write
Transfer
information read
Transfer
information write
Figure 8.10 DTC Operation Timing (Example in Normal Mode or Repeat Mode)
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Section 8 Data Transfer Controller (DTC)
φ
DTC activation
request
DTC
request
Data transfer
Vector read
Read Write Read Write
Address
Transfer
information read
Transfer
information write
Figure 8.11 DTC Operation Timing (Example of Block Transfer Mode,
with Block Size of 2)
φ
DTC activation
request
DTC
request
Data transfer
Data transfer
Read Write
Read Write
Vector read
Address
Transfer
information read
Transfer
information
write
Transfer
information
read
Transfer
information write
Figure 8.12 DTC Operation Timing (Example of Chain Transfer)
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Section 8 Data Transfer Controller (DTC)
8.5.7
Number of DTC Execution States
Table 8.6 lists execution status for a single DTC data transfer, and table 8.7 shows the number of
states required for each execution status.
Table 8.6
DTC Execution Status
Mode
Vector Read
I
Register
Information
Read/Write
J
Data Read
K
Data Write
L
Internal
Operations
M
Normal
1
6
1
1
3
Repeat
1
6
1
1
3
Block transfer
1
6
N
N
3
Legend:
N: Block size (initial setting of CRAH and CRAL)
Table 8.7
Number of States Required for Each Execution Status
OnChip
RAM
OnChip
ROM
Bus width
32
16
8
16
Access states
1
1
2
2
2
3
2
3
Execution Vector read
SI
Status
Register information
read/write
SJ
⎯
1
⎯
⎯
4
6+2m
2
3+m
1
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Object to be Accessed
Internal I/O
Registers
External Devices*
8
16
Byte data read
SK
1
1
2
2
2
3+m
2
3+m
Word data read
SK
1
1
4
2
4
6+2m
2
3+m
Byte data write
SL
1
1
2
2
2
3+m
2
3+m
Word data write
SL
1
1
4
2
4
6+2m
2
3+m
Internal operation SM
1
Legend:
m: The number of wait states for accessing external devices.
Note: * Cannot be used in this LSI.
The number of execution states is calculated from using the formula below. Note that Σ is the sum
of all transfers activated by one activation event (the number in which the CHNE bit is set to 1,
plus 1).
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Section 8 Data Transfer Controller (DTC)
Number of execution states = I · SI + Σ (J · SJ + K · SK + L · SL) + M · SM
For example, when the DTC vector address table is located in the on-chip ROM, normal mode is
set, and data is transferred from on-chip ROM to an internal I/O register, then the time required for
the DTC operation is 13 states. The time from activation to the end of the data write is 10 states.
8.6
Procedures for Using DTC
8.6.1
Activation by Interrupt
The procedure for using the DTC with interrupt activation is as follows:
1.
Set the MRA, MRB, SAR, DAR, CRA, and CRB register information in on-chip RAM.
2.
Set the start address of the register information in the DTC vector address.
3.
Set the corresponding bit in DTCER to 1.
4.
Set the enable bits for the interrupt sources to be used as the activation sources to 1. The DTC
is activated when an interrupt used as an activation source is generated.
5.
After one data transfer has been completed, or after the specified number of data transfers
have been completed, the DTCE bit is cleared to 0 and a CPU interrupt is requested. If the
DTC is to continue transferring data, set the DTCE bit to 1.
8.6.2
Activation by Software
The procedure for using the DTC with software activation is as follows:
1.
Set the MRA, MRB, SAR, DAR, CRA, and CRB register information in on-chip RAM.
2.
Set the start address of the register information in the DTC vector address.
3.
Check that the SWDTE bit is 0.
4.
Write 1 to SWDTE bit and the vector number to DTVECR.
5.
Check the vector number written to DTVECR.
6.
After one data transfer has been completed, if the DISEL bit is 0 and a CPU interrupt is not
requested, the SWDTE bit is cleared to 0. If the DTC is to continue transferring data, set the
SWDTE bit to 1. When the DISEL bit is 1, or after the specified number of data transfers
have been completed, the SWDTE bit is held at 1 and a CPU interrupt is requested.
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Section 8 Data Transfer Controller (DTC)
8.7
Examples of Use of DTC
8.7.1
Normal Mode
An example is shown in which the DTC is used to receive 128 bytes of data via the SCI.
1.
Set MRA to a fixed source address (SM1 = SM0 = 0), incrementing destination address
(DM1 = 1, DM0 = 0), normal mode (MD1 = MD0 = 0), and byte size (Sz = 0). The DTS bit
can have any value. Set MRB for one data transfer by one interrupt (CHNE = 0, DISEL = 0).
Set the SCI RDR address in SAR, the start address of the RAM area where the data will be
received in DAR, and 128 (H'0080) in CRA. CRB can be set to any value.
2.
Set the start address of the register information at the DTC vector address.
3.
Set the corresponding bit in DTCER to 1.
4.
Set the SCI to the appropriate receive mode. Set the RIE bit in SCR to 1 to enable the
reception complete (RXI) interrupt. Since the generation of a receive error during the SCI
reception operation will disable subsequent reception, the CPU should be enabled to accept
receive error interrupts.
5.
Each time the reception of one byte of data has been completed on the SCI, the RDRF flag
in SSR is set to 1, an RXI interrupt is generated, and the DTC is activated. The receive data is
transferred from RDR to RAM by the DTC. DAR is incremented and CRA is decremented.
The RDRF flag is automatically cleared to 0.
6.
When CRA becomes 0 after the 128 data transfers have been completed, the RDRF flag is
held at 1, the DTCE bit is cleared to 0, and an RXI interrupt request is sent to the CPU. The
interrupt handling routine will perform wrap-up processing.
8.7.2
Software Activation
An example is shown in which the DTC is used to transfer a block of 128 bytes of data by means
of software activation. The transfer source address is H'1000 and the destination address is
H'2000. The vector number is H'60, so the vector address is H'04C0.
1.
Set MRA to incrementing source address (SM1 = 1, SM0 = 0), incrementing destination
address (DM1 = 1, DM0 = 0), block transfer mode (MD1 = 1, MD0 = 0), and byte size (Sz =
0). The DTS bit can have any value. Set MRB for one block transfer by one interrupt (CHNE
= 0). Set the transfer source address (H'1000) in SAR, the destination address (H'2000) in
DAR, and 128 (H'8080) in CRA. Set 1 (H'0001) in CRB.
2.
Set the start address of the register information at the DTC vector address (H'04C0).
3.
Check that the SWDTE bit in DTVECR is 0. Check that there is currently no transfer
activated by software.
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Section 8 Data Transfer Controller (DTC)
4.
Write 1 to the SWDTE bit and the vector number (H'60) to DTVECR. The write data is
H'E0.
5.
Read DTVECR again and check that it is set to the vector number (H'60). If it is not, this
indicates that the write failed. This is presumably because an interrupt occurred between steps
3 and 4 and led to a different software activation. To activate this transfer, go back to step 3.
6.
If the write was successful, the DTC is activated and a block of 128 bytes of data is
transferred.
7.
After the transfer, an SWDTEND interrupt occurs. The interrupt handling routine should
clear the SWDTE bit to 0 and perform other wrap-up processing.
8.8
Usage Notes
8.8.1
Module Stop Mode Setting
DTC operation can be disabled or enabled using the module stop control register. The initial
setting is for DTC operation to be enabled. Register access is disabled by setting module stop
mode. Module stop mode cannot be set during DTC operation. For details, refer to section 22,
Power-Down Modes.
8.8.2
On-Chip RAM
The MRA, MRB, SAR, DAR, CRA, and CRB registers are all located in on-chip RAM. When the
DTC bit is used, the RAME bit in SYSCR should not be cleared to 0.
8.8.3
DTCE Bit Setting
For DTCE bit setting, use bit manipulation instructions such as BSET and BCLR. If all interrupts
are masked, multiple activation sources can be set at one time (only at the initial setting) by
writing data after executing a dummy read on the relevant register.
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Section 8 Data Transfer Controller (DTC)
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Section 9 I/O Ports
Section 9 I/O Ports
The H8S/2268 Group has ten I/O ports (ports 1, 3, 7, F, H, and J to N), and two input-only port
(ports 4 and 9). The H8S/2264 Group has eight I/O ports (ports 1, 3, 7, F, H, and J to L), and two
input-only port (ports 4 and 9).
Table 9.1 summarizes the port functions. The pins of each port also have other functions such as
input/output or interrupt input pins of on-chip peripheral modules.
Each I/O port includes a data direction register (DDR) that controls input/output, a data register
(DR) that stores output data, and a port register (PORT) used to read the pin states. The input-only
ports do not have DDR and DR registers.
Port J has a built-in input pull-up MOS function and an input pull-up MOS control register (PCR)
to control the on/off state of input pull-up MOS.
Port 3 includes an open-drain control register (ODR) that controls the on/off state of the output
buffer PMOS.
All the I/O ports can drive a single TTL load and a 30 pF capacitive load.
The P34 and P35 pins on port 3 are NMOS push pull outputs.
Pins IRQ and WKP are Schmitt-trigger inputs. Pins PH0 to PH3 and ports J to N in the H8S/2268
Group and pins PH0 to PH3 and ports J to L in the H8S/2264 Group are shared as LCD segment
pins and common pins. They can be selected on an 8-bit basis.
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Section 9 I/O Ports
Table 9.1
H8S/2268 Group Port Functions (1)
Port and
Other Functions Name
Port
Description
Port 1
P17/TIOCB2/TCLKD
General I/O port also
functioning as TPU I/O
P16/TIOCA2/IRQ1
pins and interrupt input
P15/TIOCB1/TCLKC
pins
Input/Output and
Output Type
Schmitt trigger input
(IRQ1, IRQ0)
P14/TIOCA1/IRQ0
P13/TIOCD0/TCLKB
P12/TIOCC0/TCLKA
P11/TIOCB0
P10/TIOCA0
Port 3
General I/O port also
functioning as SCI_0
2
and SCI_1 I/O pins, I C
bus interface I/O pins,
and interrupt input pins
P35/SCK1/SCL0/IRQ5
P34/RxD1/SDA0
P33/TxD1/SDA0
P32/SCK0/SDA1/IRQ4
P31/RxD0
P30/TxD0
Port 4
General input port also P47/AN7
functioning as A/D
P46/AN6
converter analog input
P45/AN5
pins
P44/AN4
P43/AN3
P42/AN2
P41/AN1
P40/AN0
Port 7
P77/TxD2
General I/O port also
functioning as SCI_2
P76/RxD2
I/O pins and 8-bit timer
P75/TMO3/SCK2
I/O pins
P74/TMO2
P73/TMO1
P72/TMO0
P71/TMRI23/TMCI23
P70/TMRI01/TMCI01
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Specifiable of open drain
output
Schmitt trigger input
(IRQ5, IRQ4)
NMOS push-pull output
(P35, P34, SCK1)
Section 9 I/O Ports
Port and
Other Functions Name
Port
Description
Port 9
General input port also P97/AN9/DA1
functioning as A/D
P96/AN8/DA0
converter analog input
and D/A converter
analog output pins
Port F
General I/O port also
PF3/ADTRG/IRQ3
functioning as interrupt
input pins and an A/D
converter input pins
Port H
General input port
PH7
General I/O port also
functioning as LCD
common output pins
PH3/COM4
Input/Output and
Output Type
Schmitt trigger input
(IRQ3)
PH2/COM3
PH1/COM2
PH0/COM1
Port J
General I/O port also
functioning as wakeup
input pins and LCD
segment output pins
PJ7/WKP7/SEG8
Built-in input pull-up MOS
PJ6/WKP6/SEG7
Schmitt trigger input
(WKP7 to WKP0)
PJ5/WKP5/SEG6
PJ4/WKP4/SEG5
PJ3/WKP3/SEG4
PJ2/WKP2/SEG3
PJ1/WKP1/SEG2
PJ0/WKP0/SEG1
Port K
General I/O port also
functioning as LCD
segment output pins
PK7/SEG16
PK6/SEG15
PK5/SEG14
PK4/SEG13
PK3/SEG12
PK2/SEG11
PK1/SEG10
PK0/SEG9
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Section 9 I/O Ports
Port
Description
Port L
General I/O port also
functioning as LCD
segment output pins
Port and
Other Functions Name
PL7/SEG24
PL6/SEG23
PL5/SEG22
PL4/SEG21
PL3/SEG20
PL2/SEG19
PL1/SEG18
PL0/SEG17
Port M
General I/O port also
functioning as LCD
segment output pins
PM7/SEG32
PM6/SEG31
PM5/SEG30
PM4/SEG29
PM3/SEG28
PM2/SEG27
PM1/SEG26
PM0/SEG25
Port N
General I/O port also
functioning as LCD
segment output pins
PN7/SEG40
PN6/SEG39
PN5/SEG38
PN4/SEG37
PN3/SEG36
PN2/SEG35
PN1/SEG34
PN0/SEG33
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Input/Output and
Output Type
Section 9 I/O Ports
Table 9.1
H8S/2264 Group Port Functions (2)
Port and
Other Functions Name
Port
Description
Port 1
P17/TIOCB2
General I/O port also
functioning as TPU I/O
P16/TIOCA2/IRQ1
pins and interrupt input
P15/TIOCB1/TCLKC
pins
Input/Output and
Output Type
Schmitt trigger input
(IRQ1, IRQ0)
P14/TIOCA1/IRQ0
P13/TCLKB
P12/TCLKA
P11
P10
Port 3
General I/O port also
functioning as SCI_0
2
and SCI_1 I/O pins, I C
bus interface I/O pins,
and interrupt input pins
P35/SCK1/SCL0
Specifiable of open drain
output
P34/RxD1/SDA0
Schmitt trigger input
(IRQ4)
P33/TxD1
P32/SCK0/IRQ4
NMOS push-pull output
(P35, P34, SCK1)
P31/RxD0
P30/TxD0
Port 4
General input port also P47/AN7
functioning as A/D
P46/AN6
converter analog input
P45/AN5
pins
P44/AN4
P43/AN3
P42/AN2
P41/AN1
P40/AN0
Port 7
P77/TxD2
General I/O port also
functioning as SCI_2
P76/RxD2
I/O pins and 8-bit timer
P75/SCK2
I/O pins
P74
P73/TMO1
P72/TMO0
P71
P70/TMRI01/TMCI01
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Section 9 I/O Ports
Port and
Other Functions Name
Port
Description
Port 9
General input port also P97/AN9
functioning as A/D
P96/AN8
converter analog inputs
Port F
General I/O port also
PF3/ADTRG/IRQ3
functioning as interrupt
input pins and an A/D
converter input pins
Port H
General input port
PH7
General I/O port also
functioning as LCD
common output pins
PH3/COM4
Input/Output and
Output Type
Schmitt trigger input
(IRQ3)
PH2/COM3
PH1/COM2
PH0/COM1
Port J
General I/O port also
functioning as wakeup
input pins and LCD
segment output pins
PJ7/WKP7/SEG8
Built-in input pull-up MOS
PJ6/WKP6/SEG7
Schmitt trigger input
(WKP7 to WKP0)
PJ5/WKP5/SEG6
PJ4/WKP4/SEG5
PJ3/WKP3/SEG4
PJ2/WKP2/SEG3
PJ1/WKP1/SEG2
PJ0/WKP0/SEG1
Port K
General I/O port also
functioning as LCD
segment output pins
PK7/SEG16
PK6/SEG15
PK5/SEG14
PK4/SEG13
PK3/SEG12
PK2/SEG11
PK1/SEG10
PK0/SEG9
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Section 9 I/O Ports
Port
Description
Port L
General I/O port also
functioning as LCD
segment output pins
Port and
Other Functions Name
Input/Output and
Output Type
PL7/SEG24
PL6/SEG23
PL5/SEG22
PL4/SEG21
PL3/SEG20
PL2/SEG19
PL1/SEG18
PL0/SEG17
9.1
Port 1
Port 1 is an 8-bit I/O port and has the following registers.
• Port 1 data direction register (P1DDR)
• Port 1 data register (P1DR)
• Port 1 register (PORT1)
9.1.1
Port 1 Data Direction Register (P1DDR)
P1DDR specifies input or output of the port 1 pins using the individual bits. P1DDR cannot be
read; if it is, an undefined value will be read.
The value of this register when read is undefined after a bit manipulation instruction is executed.
To prevent undefined read values, do not use bit manipulation instructions to write to this register.
For details, see section 2.9.4, Access Methods for Registers with Write-Only Bits.
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Section 9 I/O Ports
Bit
Bit Name
Initial
Value
R/W
Description
7
P17DDR
0
W
6
P16DDR
0
W
5
P15DDR
0
W
When a pin is specified as a general purpose I/O port,
setting this bit to 1 makes the corresponding port 1 pin an
output pin. Clearing this bit to 0 makes the pin an input
pin.
4
P14DDR
0
W
3
P13DDR
0
W
2
P12DDR
0
W
1
P11DDR
0
W
0
P10DDR
0
W
9.1.2
Port 1 Data Register (P1DR)
P1DR stores output data for port 1 pins.
Bit
Bit Name
Initial
Value
R/W
Description
7
P17DR
0
R/W
6
P16DR
0
R/W
Output data for a pin is stored when the pin is specified
as a general purpose output port.
5
P15DR
0
R/W
4
P14DR
0
R/W
3
P13DR
0
R/W
2
P12DR
0
R/W
1
P11DR
0
R/W
0
P10DR
0
R/W
9.1.3
Port 1 Register (PORT1)
PORT1 shows the pin states. This register cannot be modified.
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Section 9 I/O Ports
Bit
Bit Name
Initial
Value
R/W
Description
7
P17
⎯*
R
6
P16
⎯*
R
5
P15
⎯*
R
If a port 1 read is performed while P1DDR bits are set to
1, the P1DR values are read. If a port 1 read is performed
while P1DDR bits are cleared to 0, the pin states are
read.
4
P14
⎯*
R
3
P13
⎯*
R
2
P12
⎯*
R
1
P11
⎯*
R
0
P10
⎯*
R
Note: * Determined by the states of pins P17 to P10.
9.1.4
Pin Functions
Port 1 pins also function as TPU I/O pins (TCLKA, TCLKB, TCLKC, TCLKD*, TIOCA0*,
TIOCB0*, TIOCC0*, TIOCD0*, TIOCA1, TIOCB1, TIOCA2, and TIOCB2) and external
interrupt input pins (IRQ0 and IRQ1). Port 1 pin functions are shown below. For the setting of the
TPU channel, see section 10, 16-Bit Timer Pulse Unit (TPU).
Note: * Supported only by the H8S/2268 Group.
• P17/TIOCB2/TCLKD*
3
The pin function is switched as shown below according to the combination of the TPU channel
2 setting, TPSC2 to TPS0 bits in TCR0*, and the P17DDR bit.
TPU Channel 2 Setting
P17DDR
Pin function
Output
Input or Initial Value
⎯
0
1
TIOCB2 output
P17 input
P17 output
TIOCB2 input*
2 3
TCLKD input* *
1
Notes: 1. This pin functions as TIOCB2 input when TPU channel 2 timer operating mode is set to
3
normal operation or phase counting mode* and IOB3 in TIOR_2 is set to 1.
2. In the H8S/2268 Group, this pin functions as TCLKD input when TPSC2 to TPSC0 in
3
TCR0 are set to 111 or when channel 2 is set to phase counting mode* .
3. Supported only by the H8S/2268 Group.
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Section 9 I/O Ports
• P16/TIOCA2/IRQ1
The pin function is switched as shown below according to the combination of the TPU channel
2 setting and the P16DDR bit.
TPU Channel 2 Setting
P16DDR
Pin function
Output
Input or Initial Value
⎯
0
TIOCA2 output
P16 input
1
P16 output
1
*
TIOCA2 input
IRQ1 input*
2
Notes: 1. This pin functions as TIOCA2 input when TPU channel 2 timer operating mode is set to
3
normal operation or phase counting mode* and IOA3 in TIOR_2 is 1.
2. When this pin is used as an external interrupt pin, do not specify other functions.
3. Supported only by the H8S/2268 Group.
• P15/TIOCB1/TCLKC
The pin function is switched as shown below according to the combination of the TPU channel
3
1 setting, TPSC2 to TPSC0 bits in TCR0* and TCR2, and the P15DDR bit.
TPU Channel 1 Setting
P15DDR
Pin function
Output
Input or Initial Value
⎯
0
TIOCB1 output
P15 input
1
P15 output
1
TIOCB1 input*
TCLKC input*
2
Notes: 1. This pin functions as TIOCB1 input when TPU channel 1 timer operating mode is set to
3
normal operation or phase counting mode* and IOB3 to IOB0 in TIOR_1 are set
to10xx.
3
2. This pin functions as TCLKC inputs when TPSC2 to TPSC0 in TCR0* or TCR2 are set
3
to 110 or TCLKC input when channel 2 is set to phase counting mode* .
3. Supported only by the H8S/2268 Group.
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Section 9 I/O Ports
• P14/TIOCA1/IRQ0
The pin function is switched as shown below according to the combination of the TPU channel
1 setting and the P14DDR bit.
TPU Channel 1 Setting
Output
P14DDR
Pin function
Input or Initial Value
⎯
0
TIOCA1 output
P14 input
1
P14 output
1
*
TIOCA1 input
IRQ0 input*
2
Notes: 1. This pin functions as TIOCA1 input when TPU channel 1 timer operating mode is set to
3
normal operation or phase counting mode* and IOA3 to IOA0 in TIOR_1 are set to
10xx.
2. When this pin is used as an external interrupt pin, do not specify other functions.
3. Supported only by the H8S/2268 Group.
• P13/TIOCD0* /TCLKB
3
The pin function is switched as shown below according to the combination of the TPU channel
3
3
0* setting, TPSC2 to TPSC0 bits in TCR0* , TCR1 and TCR2, and the P13DDR bit.
TPU Channel 0 Setting*
3
P13DDR
Pin function
Output
Input or Initial Value
⎯
0
1
3
TIOCD0 output*
P13 input
P13 output
1 3
TIOCD0 input* *
2
TCLKB input*
Notes: 1. In the H8S/2268 Group, this pin functions as TIOCD0 input when TPU channel 0 timer
operating mode is set to normal operation and IOD3 to IOD0 in TIORL_0 are set to
10xx.
2. This pin functions as TCLKB input when TPSC2 to TPSC0 are set to 101 in any of
3
TCR0* , TCR1 and TCR2. TCLKB input, or when channel 1 is set to phase counting
3
*
mode .
3. Supported only by the H8S/2268 Group.
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Section 9 I/O Ports
• P12/TIOCC0* /TCLKA
3
The pin function is switched as shown below according to the combination of the TPU channel
3
3
0* setting, TPSC2 to TPSC0 bits in TCR2, TCR1 and TCR0* , and the P12DDR bit.
TPU Channel 0 Setting*
3
P12DDR
Pin function
Output
Input or Initial Value
⎯
0
3
TIOCC0 output*
P12 input
1
P12 output
1 3
*
TIOCC0 input *
2
TCLKA input*
Notes: 1. In the H8S/2268 Group, TIOCC0 input when TPU channel 0 timer operating mode is set
to normal operation and IOC3 to IOC0 in TIORL_0 are set to 10xx.
2. This functions as TCLKA input when TPSC2 to TPSC0 are set to 100 in any of TCR2,
3
3
TCR1 and TCR0* or when channel 1 is set to phase counting mode* .
3. Supported only by the H8S/2268 Group.
• P11/TIOCB0*
2
The pin function is switched as shown below according to the combination of the TPU channel
2
0* setting and the P11DDR bit.
TPU Channel 0 Setting*
P11DDR
Pin function
2
Output
Input or Initial Value
⎯
0
2
TIOCB0 output*
P11 input
1
P11 output
1 2
TIOCB0 input* *
Notes: 1. In the H8S/2268 Group, this pin functions as TIOCB0 input when TPU channel 0 timer
operating mode is set to normal operation and IOB3 to IOB0 in TIORH_0 are set to
10xx.
2. Supported only by the H8S/2268 Group.
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Section 9 I/O Ports
• P10/TIOCA0*
2
The pin function is switched as shown below according to the combination of the TPU channel
2
0* setting and the P10DDR bit.
TPU Channel 0 Setting*
2
P10DDR
Pin function
Output
Input or Initial Value
⎯
0
2
TIOCA0 output*
P10 input
1
P10 output
1 2
*
TIOCA0 input *
Notes: 1. In the H8S/2268 Group, this pin functions as TIOCA0 input when TPU channel 0 timer
operating mode is set to normal operation and IOA3 to IOA0 in TIORH_0 are set to
10xx.
2. Supported only by the H8S/2268 Group.
9.2
Port 3
Port 3 is a 6-bit I/O port. The P34, P35, and SCK1 function as NMOS push-pull outputs. Port 3
has the following registers.
• Port 3 data direction register (P3DDR)
• Port 3 data register (P3DR)
• Port 3 register (PORT3)
• Port 3 open drain control register (P3ODR)
9.2.1
Port 3 Data Direction Register (P3DDR)
P3DDR specifies input or output of the port 3 pins using the individual bits.
P3DDR cannot be read; if it is, an undefined value will be read.
The value of this register when read is undefined after a bit manipulation instruction is executed.
To prevent undefined read values, do not use bit manipulation instructions to write to this register.
For details, see section 2.9.4, Access Methods for Registers with Write-Only Bits.
Rev. 5.00 Sep. 01, 2009 Page 151 of 656
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Section 9 I/O Ports
Bit
Bit Name
Initial
Value
7, 6
⎯
Undefined ⎯
R/W
Description
Reserved
These bits are always read as undefined value and
cannot be modified.
5
P35DDR
0
W
4
P34DDR
0
W
3
P33DDR
0
W
2
P32DDR
0
W
1
P31DDR
0
W
0
P30DDR
0
W
9.2.2
Port 3 Data Register (P3DR)
When a pin is specified as a general purpose I/O port,
setting this bit to 1 makes the corresponding port 3 pin
an output port. Clearing this bit to 0 makes the pin an
input port.
P3DR stores output data for port 3 pins.
Bit
Bit Name
Initial
Value
7, 6
⎯
Undefined ⎯
R/W
Description
Reserved
These bits are always read as undefined value and
cannot be modified.
5
P35DR
0
R/W
4
P34DR
0
R/W
3
P33DR
0
R/W
2
P32DR
0
R/W
1
P31DR
0
R/W
0
P30DR
0
R/W
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Output data for a pin is stored when the pin is specified
as a general purpose output port.
Section 9 I/O Ports
9.2.3
Port 3 Register (PORT3)
PORT3 shows the pin states. This register cannot be modified.
Bit
Bit Name
Initial
Value
7, 6
⎯
Undefined ⎯
R/W
Description
Reserved
These bits are always read as undefined value and
cannot be modified.
5
P35
⎯*
R
4
P34
⎯*
R
3
P33
⎯*
R
2
P32
⎯*
R
1
P31
⎯*
R
0
P30
⎯*
R
If a port 3 read is performed while P3DDR bits are set
to 1, the P3DR values are read. If a port 3 read is
performed while P3DDR bits are cleared to 0, the pin
states are read.
Note: * Determined by the states of pins P35 to P30.
9.2.4
Port 3 Open Drain Control Register (P3ODR)
P3ODR controls on/off state of the PMOS for port 3 pins.
Bit
Bit Name
Initial
Value
7, 6
⎯
Undefined ⎯
R/W
Description
Reserved
These bits are always read as undefined value and
cannot be modified.
5
P35ODR
0
R/W
4
P34ODR
0
R/W
3
P33ODR
0
R/W
2
P32ODR
0
R/W
1
P31ODR
0
R/W
0
P30ODR
0
R/W
When each of P33ODR to P30ODR bits is set to 1, the
corresponding pins P33 to P30 function as NMOS open
drain outputs. When cleared to 0, the corresponding
pins function as CMOS outputs. When each of P35ODR
and P34ODR bits is set to 1, the corresponding pins
P35 and P34 function as NMOS open drain outputs.
When they are cleared to 0, the corresponding pins
function as NMOS push pull outputs.
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Section 9 I/O Ports
9.2.5
Pin Functions
The port 3 pins also function as SCI I/O input pins (TxD0, RxD0, SCK0, TxD1, RxD1, and
2
SCK1), I C bus interface I/O pins (SCL0, SDA0, SCL1*, and SDA1*), and as external interrupt
input pins (IRQ4 and IRQ5*).
As shown in figure 9.1, when the pins P34, P35, SCK1, SCL0, or SDA0 type open drain output is
used, a bus line is not affected even if the power supply for this LSI fails. Use (a) type open drain
output when using a bus line having a state in which the power is not supplied to this LSI.
Note: * Supported only by the H8S/2268 Group.
NMOS Off
0
PMOS Off
1
Output
Input
Output
Input
(a) Open drain output type for
P34, P35, SCK1, SCL0, and SDA0 pins
(b) Open drain output type for
P33 to P30, SCL1*, and SDA1* pins
Note: * Supported only by the H8S/2268 Group.
Figure 9.1 Types of Open Drain Outputs
The NMOS push-pull outputs of the P34, P35, and SCK1 pins do not reach the voltage of Vcc,
even when the pins are specified so that they are driven high and regardless of the load.
To output the voltage of Vcc, a pull-up resistor must be externally connected.
Notes: 1. When a pull-up resistor is externally connected, signals take longer to rise and fall.
When the input signals take a long time to rise and fall, connect an input circuit that
has a noise reduction function, such as a Schmitt trigger circuit.
2. For high-speed operation, use an external circuit such as a level shifter.
3. For output characteristics, see the entries for high output voltage for pins P34 and P35
in table 25.15, DC Characteristics (1). The value of the pull-up resistor should satisfy
the specification in table 25.16, Permissible Output Currents.
The functions of port 3 pins are shown below.
Rev. 5.00 Sep. 01, 2009 Page 154 of 656
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Section 9 I/O Ports
2
• P35/SCK1/SCL0/IRQ5*
The pin function is switched as shown below according to the combination of the ICE bit in
ICCR_0 of IIC_0, C/A bit in SMR of SCI_1, CKE0 and CKE1 bits in SCR and the P35DDR
bit.
ICE
0
CKE1
0
C/A
1
0
1
⎯
0
1
⎯
⎯
0
⎯
⎯
⎯
⎯
0
CKE0
0
P35DDR
Pin functions
1
0
1
P35 input pin P35 output
pin
SCK1 output SCK1 output SCK1 input
pin
pin
pin
SCL0 I/O
pin
IRQ5 Input * *
1 2
Notes: 1. When this pin is used as an external interrupt pin, do not specify other functions.
2. Supported only by the H8S/2268 Group.
• P34/RxD1/SDA0
The pin function is switched as shown below according to the combination of the ICE bit in
ICCR_0 of IIC_0, RE bit in SCR of SCI_1 and the P34DDR bit.
ICE
0
1
⎯
0
1
⎯
⎯
P34 input pin
P34 output pin
RxD1 input pin
SDAO I/O pin
RE
0
P34DDR
Pin functions
1
• P33/TxD1/SCL1*
The pin function is switched as shown below according to the combination of the ICE bit* in
ICCR_1 of IIC_1, TE bit in SCR of SCI_1 and the P33DDR bit.
ICE*
0
TE
P33DDR
Pin functions
0
1
1
⎯
0
1
⎯
⎯
P33 input pin
P33 output pin
TxD1 output pin
SCL1 I/O pin*
Note: * Supported only by the H8S/2268 Group.
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Section 9 I/O Ports
• P32/SCK0/SDA1* /IRQ4
2
2
The pin function is switched as shown below according to the combination of the ICE bit* in
ICCR_1 of IIC_1, C/A bit in SMR of SCI_0, CKE0 and CKE1 bits in SCR and the P32DDR
bit.
ICE*
2
0
CKE1
0
C/A
Pin functions
1
0
1
⎯
0
1
⎯
⎯
0
⎯
⎯
⎯
⎯
0
CKE0
P32DDR
1
0
0
1
P32 input pin P32 output
pin
SCK0 output SCK0 output SCK0 input
pin
pin
pin
IRQ4 Input*
SDA1 I/O
2
pin*
1
Notes: 1. When this pin is used as an external interrupt pin, do not specify other functions.
2. Supported only by the H8S/2268 Group.
• P31/RxD0
The pin function is switched as shown below according to the combination of the RE bit in
SCR of SCI_0 and the P31DDR bit.
RE
0
P31DDR
Pin functions
1
0
1
⎯
P31 input pin
P31 output pin
RxD0 input pin
• P30/TxD0
The pin function is switched as shown below according to the combination of the TE bit in
SCR of SCI_0 and the P30DDR bit.
TE
P30DDR
Pin functions
0
1
0
1
⎯
P30 input pin
P30 output pin
TxD0 output pin
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Section 9 I/O Ports
9.3
Port 4
Port 4 is an 8-bit input-only port and has the following register.
• Port 4 register (PORT4)
9.3.1
Port 4 Register (PORT4)
PORT4 shows port 4 pin states. This register cannot be modified.
Bit
Bit Name
Initial
Value
R/W
Description
7
P47
⎯*
R
6
P46
⎯*
R
The pin states are always read when a port 4 read is
performed.
5
P45
⎯*
R
4
P44
⎯*
R
3
P43
⎯*
R
2
P42
⎯*
R
1
P41
⎯*
R
0
P40
⎯*
R
Note: * Determined by the states of pins P47 to P40.
9.3.2
Pin Functions
Port 4 pins also function as A/D converter analog input pins (AN0 to AN7).
9.4
Port 7
Port 7 is an 8-bit I/O port and has the following registers.
• Port 7 data direction register (P7DDR)
• Port 7 data register (P7DR)
• Port 7 register (PORT7)
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Section 9 I/O Ports
9.4.1
Port 7 Data Direction Register (P7DDR)
P7DDR specifies input or output of the port 7 pins using the individual bits. P7DDR cannot be
read; if it is, an undefined value will be read.
The value of this register when read is undefined after a bit manipulation instruction is executed.
To prevent undefined read values, do not use bit manipulation instructions to write to this register.
For details, see section 2.9.4, Access Methods for Registers with Write-Only Bits.
Bit
Bit Name
Initial
Value
R/W
Description
7
P77DDR
0
W
6
P76DDR
0
W
5
P75DDR
0
W
When a pin is specified as a general purpose I/O port,
setting this bit to 1 makes the corresponding port 7 pin an
output pin. Clearing this bit to 0 makes the pin an input
pin.
4
P74DDR
0
W
3
P73DDR
0
W
2
P72DDR
0
W
1
P71DDR
0
W
0
P70DDR
0
W
9.4.2
Port 7 Data Register (P7DR)
P7DR stores output data for port 7 pins.
Bit
Bit Name
Initial
Value
R/W
Description
7
P77DR
0
R/W
6
P76DR
0
R/W
Output data for a pin is stored when the pin is specified
as a general purpose output port.
5
P75DR
0
R/W
4
P74DR
0
R/W
3
P73DR
0
R/W
2
P72DR
0
R/W
1
P71DR
0
R/W
0
P70DR
0
R/W
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Section 9 I/O Ports
9.4.3
Port 7 Register (PORT7)
PORT7 shows the pin states. This register cannot be modified.
Bit
Bit Name
Initial
Value
R/W
Description
7
P77
⎯*
R
6
P76
⎯*
R
5
P75
⎯*
R
If a port 1 read is performed while P7DDR bits are set to
1, the P7DR values are read. If a port 1 read is performed
while P7DDR bits are cleared to 0, the pin states are
read.
4
P74
⎯*
R
3
P73
⎯*
R
2
P72
⎯*
R
1
P71
⎯*
R
0
P70
⎯*
R
Note: * Determined by the states of pins P77 to P70.
9.4.4
Pin Functions
Port 7 pins also function as the 8-bit timer I/O pins (TMRI01, TMCI01, TMRI23*, TMCI23*,
TMO0, TMO1, TMO2*, and TMO3*) and SCI I/O pins (SCK2, RxD2 and TxD2). Port 7 pin
functions are shown below.
Note: * Supported only by the H8S/2268 Group.
• P77/TxD2
The pin function is switched as shown below according to the combination of the TE bit in
SCR of SCI_2 and the P77DDR bit.
TE
P77DDR
Pin functions
0
1
0
1
⎯
P77 input pin
P77 output pin
TxD2 output pin
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Section 9 I/O Ports
• P76/RxD2
The pin function is switched as shown below according to the combination of the RE bit in
SCR of SCI_2 and the P76DDR bit.
RE
0
0
1
⎯
P76 input pin
P76 output pin
RxD2 Input pin
P76DDR
Pin functions
1
• P75/TMO3*/SCK2
The pin function is switched as shown below according to the combination of the OS3 to OS0
bits in TCSR_3* of the 8-bit timer, the C/A bit in SMR of SCI_2, the CKE0 and CKE1 bits in
SCR and the P75DDR bit.
OS3 to OS0*
All bits are 0
CKE1
⎯
1
⎯
⎯
1
⎯
⎯
⎯
⎯
⎯
⎯
⎯
0
CKE0
Pin functions
1
0
C/A
P75DDR
Any bit is 1
0
0
1
P75 input pin P75 output
pin
SCK2 output SCK2 output SCK2 input
TMO3
pin
pin
pin
output pin*
Note: * Supported only by the H8S/2268 Group.
• P74/TMO2*
The pin function is switched as shown below according to the combination of the OS3 to OS0
bits in TCSR_2* of the 8-bit timer and the P74DDR bit.
OS3 to OS0*
P74DDR
Pin functions
All bits are 0
Any bit is 1
0
1
⎯
P74 input pin
P74 output pin
TMO2 output pin*
Note: * Supported only by the H8S/2268 Group.
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Section 9 I/O Ports
• P73/TMO1
The pin function is switched as shown below according to the combination of the OS3 to OS0
bits in TCSR_1 of the 8-bit timer and the P73DDR bit.
OS3 to OS0
All bits are 0
0
1
⎯
P73 input pin
P73 output pin
TMO1 output pin
P73DDR
Pin functions
Any bit is 1
• P72/TMO0
The pin function is switched as shown below according to the combination of the OS3 to OS0
bits in TCSR_0 of the 8-bit timer and the P72DDR bit.
OS3 to OS0
All bits are 0
0
1
⎯
P72 input pin
P72 output pin
TMO0 output pin
P72DDR
Pin functions
Any bit is 1
• P71/TMRI23*/TMCI23*
The pin function is switched as shown below according to the P71DDR bit.
P71DDR
Pin functions
0
P71 input pin
1
P71 output pin
*
TMRI23/TMCI23 input pin
Note: * Supported only by the H8S/2268 Group.
• P70/TMRI01/TMCI01
The pin function is switched as shown below according to the P70DDR bit.
P70DDR
Pin functions
0
1
P70 input pin
P70 output pin
TMRI01/TMCI01 input pin
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Section 9 I/O Ports
9.5
Port 9
Port 9 is a 2-bit input-only port and has the following register.
• Port 9 register (PORT9)
9.5.1
Port 9 Register (PORT9)
PORT9 shows port 9 pin states. This register cannot be modified.
Bit
Bit Name
Initial
Value
R/W
Description
7
P97
⎯*
R
6
P96
⎯*
R
The pin states are always read when these bits are
read.
5 to 0
⎯
Undefined R
Reserved
These bits are always read as undefined value and
cannot be modified.
Note: * Determined by the states of pins P97 and P96.
9.5.2
Pin Functions
Port 9 pins also function as A/D converter analog input pins (AN8 and AN9) and D/A converter
analog output pins (DA0 and DA1)*.
Note: * Supported only by the H8S/2268 Group.
9.6
Port F
Port F is a 1-bit I/O port and has the following register.
• Port F data direction register (PFDDR)
• Port F data register (PFDR)
• Port F register (PORTF)
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Section 9 I/O Ports
9.6.1
Port F Data Direction Register (PFDDR)
PFDDR specifies input or output the port F pins using the individual bits. PFDDR cannot be read;
if it is, an undefined value will be read.
The value of this register when read is undefined after a bit manipulation instruction is executed.
To prevent undefined read values, do not use bit manipulation instructions to write to this register.
For details, see section 2.9.4, Access Methods for Registers with Write-Only Bits.
Bit
Bit Name
Initial
Value
7 to 4
⎯
Undefined ⎯
R/W
Description
Reserved
These bits are always read as undefined value and
cannot be modified.
3
PF3DDR
0
W
2 to 0
⎯
Undefined ⎯
When a pin is specified as a general purpose I/O port,
setting this bit to 1 makes the corresponding port F pin
an output pin. Clearing this bit to 0 makes the pin an
input pin.
Reserved
These bits are always read as undefined value and
cannot be modified.
9.6.2
Port F Data Register (PFDR)
PFDR stores output data for port F pins.
Bit
Bit Name
Initial
Value
7 to 4
⎯
Undefined ⎯
R/W
Description
Reserved
These bits are always read as undefined value and
cannot be modified.
3
PF3DR
0
R/W
2 to 0
⎯
Undefined ⎯
Output data for a pin is stored when the pin is specified
as a general purpose output port.
Reserved
These bits are always read as undefined value and
cannot be modified.
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Section 9 I/O Ports
9.6.3
Port F Register (PORTF)
PORTF shows the pin states. This register cannot be modified.
Bit
Bit Name
Initial
Value
7 to 4
⎯
Undefined ⎯
R/W
Description
Reserved
These bits are always read as undefined value and
cannot be modified.
3
PF3
⎯*
2 to 0
⎯
Undefined ⎯
R
If this bit is read while PFDDR is set to 1, the PFDR
value is read. If this bit is read while PFDDR is cleared,
the PF3 pin states are read.
Reserved
These bits are always read as undefined value and
cannot be modified.
Note: * Determined by the states of PF3 pin.
9.6.4
Pin Functions
Port F pins also function as an external interrupt input pin (IRQ3) and A/D trigger output pin
(ADTRG). Port F pin functions are shown below.
• PF3/ADTRG/IRQ3
The pin function is switched as shown below according to the combination of the TRGS1 and
TRGS0 bits of ADCR of the A/D converter and the PF3DDR bit.
PF3DDR
Pin functions
0
1
PF3 input pin
PF3 output pin
ADTRG Input pin*
2
IRQ3 input pin*
1
Notes: 1. When TRGS0 = TRGS1 = 1, port F is used as the ADTRG input pin.
2. When this port is used as an external interrupt pin, do not specify other functions.
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Section 9 I/O Ports
9.7
Port H
Port H is a 1-bit input and 4-bit I/O port. Port H has the following registers.
• Port H data direction register (PHDDR)
• Port H data register (PHDR)
• Port H register (PORTH)
9.7.1
Port H Data Direction Register (PHDDR)
PHDDR specifies input or output the port H pins using the individual bits. PHDDR cannot be
read; if it is, an undefined value will be read.
The value of this register when read is undefined after a bit manipulation instruction is executed.
To prevent undefined read values, do not use bit manipulation instructions to write to this register.
For details, see section 2.9.4, Access Methods for Registers with Write-Only Bits.
Bit
Bit Name
Initial
Value
7 to 4
⎯
Undefined ⎯
R/W
Description
Reserved
These bits are always read as undefined value and
cannot be modified.
3
PH3DDR
0
W
2
PH2DDR
0
W
1
PH1DDR
0
W
0
PH0DDR
0
W
When a pin is specified as a general purpose I/O port,
setting these bits to 1 makes the corresponding port H
pin an output pin. Clearing this bit to 0 makes the pin an
input pin.
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Section 9 I/O Ports
9.7.2
Port H Data Register (PHDR)
PHDR stores output data for port H.
Bit
Bit Name
Initial
Value
7 to 4
⎯
Undefined ⎯
R/W
Description
Reserved
These bits are always read as undefined value and
cannot be modified.
3
PH3DR
0
R/W
2
PH2DR
0
R/W
1
PH1DR
0
R/W
0
PH0DR
0
R/W
9.7.3
Port H Register (PORTH)
Output data for a pin is stored when the pin is specified
as a general purpose output port.
PORTH shows the pin states and cannot be modified.
Bit
Bit Name
Initial
Value
R/W
Description
7
PH7
⎯*
R
When this bit is read, PH7 pin status is always read.
6 to 4
⎯
Undefined ⎯
Reserved
These bits are always read as undefined value and
cannot be modified.
3
PH3
⎯*
R
2
PH2
⎯*
R
1
PH1
⎯*
R
0
PH0
⎯*
R
If these bits are read while the corresponding PHDDR
bits are set to 1, the PHDR value is read. If these bits
are read while PHDDR bits are cleared to 0, the pin
states are read.
Note: * Determined by the states of pins PH7 and PH3 to PH0.
9.7.4
Pin Functions
Port H pins also function as a DTMF generation circuit analog output pin (TONED)*, 8-bit reload
timer input pin (TMCI4)*, and LCD driver common output pins (COM4 to COM1). Port H pin
functions are shown below.
Note: * Supported only by the H8S/2268 Group.
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Section 9 I/O Ports
• PH7/TONED/TMCI4 (H8S/2268 Group)
The pin function is switched as shown below according to the combination of the CLOE and
RWOE bits in DTCR of the DTMF generation circuit.
CLOE, RWOE
All bits are 0
1
PH7 input pin*
Pin functions
Any bit is 1
TONED output pin
1 2
TMCI4 input pin* *
Notes: 1. Voltage applied to PH7 and TMCI4 should be within the range of AVss ≤ (PH7, TMCI4)
≤ AVcc.
2. When this port is used as TMCI4 input pin, do not specify other functions.
• PH7 (H8S/2264 Group)
This is an input pin. Voltage applied to this pin should be within the range of Vss ≤ (PH7) ≤
Vcc.
• PH3/COM4
The pin function is switched as shown below according to the combination of the DTS1,
DTS0, CMX, and SGS3 to SGS0 bits of LPCR, the SUPS* bit of LCR2 of the LCD
controller/driver and the PH3DDR bit.
SGS3 to
SGS0
B'0000
H8S/2268 Group: B'0001, B'001X, or B'010X
H8S/2264 Group: B'001X or B'010X
DTS1, DTS0
B'XX
B'0X
B'10
CMX
⎯
0
1
SUPS*
⎯
⎯
⎯
PH3DDR
Pin functions
0
1
0
1
PH3
input
pin
PH3
output
pin
PH3
input
pin
PH3
output
pin
⎯
B'11
1
⎯
1
⎯
⎯
1
⎯
⎯
⎯
PH3
output
pin
Setting
prohibited
COM4
output
pin
COM4
output
pin
0
0
0
COM4
PH3
output input pin
pin
Legend:
X: Don’t care
Note: * Supported only by the H8S/2268 Group.
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Section 9 I/O Ports
• PH2/COM3
The pin function is switched as shown below according to the combination of the DTS1,
DTS0, CMX, SGS3 to SGS0 bits of LPCR of the LCD controller/driver, and PH2DDR bit.
SGS3 to SGS0
B'0000
H8S/2268 Group: B'0001, B'001X or B'010X
H8S/2264 Group: B'001X or B'010X
DTS1, DTS0
B'XX
PH2DDR
Pin functions
B'0X
⎯
CMX
0
1
PH2 input pin
B'1X
0
1
⎯
PH2 output
pin
COM3 output
pin
0
PH2 output pin PH2 input pin
⎯
1
Legend:
X: Don’t care
• PH1/COM2
The pin function is switched as shown below according to the combination of the DTS1,
DTS0, CMX, SGS3 to SGS0 bits of LPCR of the LCD controller/driver, and PH2DDR bit.
SGS3 to SGS0
B'0000
H8S/2268 Group: B'0001, B'001X or B'010X
H8S/2264 Group: B'001X or B'010X
DTS1, DTS0
B'XX
⎯
CMX
PH1DDR
Pin functions
B'00
0
0
1
PH1 input pin
PH1 output
pin
Legend:
X: Don’t care
Rev. 5.00 Sep. 01, 2009 Page 168 of 656
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0
Other than
B'00X
⎯
1
1
PH1 input pin PH1 output
pin
⎯
COM2 output pin
Section 9 I/O Ports
• PH0/COM1
The pin function is switched as shown below according to the combination of the SGS3 to
SGS0 bits in LPCR of the LCD controller/driver and the PH0DDR bit.
SGS3 to SGS0
B'0000
H8S/2268 Group: B'0001, B'001X or B'010X
H8S/2264 Group: B'001X or B'010X
PH0DDR
Pin functions
0
1
⎯
PH0 input pin
PH0 output pin
COM1 output pin
Legend:
X: Don’t care
9.8
Port J
Port J is an 8-bit I/O port and has the following registers.
• Port J data direction register (PJDDR)
• Port J data register (PJDR)
• Port J register (PORTJ)
• Port J pull-up MOS control register (PJPCR)
• Wakeup control register (WPCR)
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Section 9 I/O Ports
9.8.1
Port J Data Direction Register (PJDDR)
PJDDR specifies input or output the port J pins using the individual bits. PJDDR cannot be read; if
it is, an undefined value will be read.
The value of this register when read is undefined after a bit manipulation instruction is executed.
To prevent undefined read values, do not use bit manipulation instructions to write to this register.
For details, see section 2.9.4, Access Methods for Registers with Write-Only Bits.
Bit
Bit Name
Initial
Value
R/W
Description
7
PJ7DDR
0
W
6
PJ6DDR
0
W
5
PJ5DDR
0
W
When a pin is specified as a general purpose I/O port,
setting this bit to 1 makes the corresponding port J pin an
output pin. Clearing this bit to 0 makes the pin an input
pin.
4
PJ4DDR
0
W
3
PJ3DDR
0
W
2
PJ2DDR
0
W
1
PJ1DDR
0
W
0
PJ0DDR
0
W
9.8.2
Port J Data Register (PJDR)
PJDR stores output data for port J pins.
Bit
Bit Name
Initial
Value
R/W
Description
7
PJ7DR
0
R/W
6
PJ6DR
0
R/W
Output data for a pin is stored when the pin is specified
as a general purpose output port.
5
PJ5DR
0
R/W
4
PJ4DR
0
R/W
3
PJ3DR
0
R/W
2
PJ2DR
0
R/W
1
PJ1DR
0
R/W
0
PJ0DR
0
R/W
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Section 9 I/O Ports
9.8.3
Port J Register (PORTJ)
PORTJ shows port J pin states. This register cannot be modified.
Bit
Bit Name
Initial
Value
R/W
Description
7
PJ7
⎯*
R
6
PJ6
⎯*
R
5
PJ5
⎯*
R
If a port J read is performed while PJDDR bits are set to
1, the PJDR values are read. If a port J read is performed
while PADDR bits are cleared to 0, the pin states are
read.
4
PJ4
⎯*
R
3
PJ3
⎯*
R
2
PJ2
⎯*
R
1
PJ1
⎯*
R
0
PJ0
⎯*
R
Note: * Determined by the states of pins PJ7 to PJ0.
9.8.4
Port J Pull-Up MOS Control Register (PJPCR)
PJPCR controls the input pull-up MOS function for each bit.
Bit
Bit Name
Initial
Value
R/W
Description
7
PJ7PCR
0
R/W
6
PJ6PCR
0
R/W
When a pin is specified as an input port, setting the
corresponding bit to 1 turns on the input pull-up MOS for
that pin.
5
PJ5PCR
0
R/W
4
PJ4PCR
0
R/W
3
PJ3PCR
0
R/W
2
PJ2PCR
0
R/W
1
PJ1PCR
0
R/W
0
PJ0PCR
0
R/W
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Section 9 I/O Ports
9.8.5
Wakeup Control Register (WPCR)
WPCR controls switching of port J pin functions. For details on interrupt request flags, refer to
5.3.6, Wakeup Interrupt Request Register (IWPR).
Bit
Bit Name
Initial
Value
R/W
Description
7
WPC7
0
R/W
6
WPC6
0
R/W
When these bits are set to 1, the corresponding
PJn/WKPn pin becomes the WKPn input pin. When
cleared, they become the PJn input/output pin.
5
WPC5
0
R/W
4
WPC4
0
R/W
3
WPC3
0
R/W
2
WPC2
0
R/W
1
WPC1
0
R/W
0
WPC0
0
R/W
9.8.6
Pin Functions
(n = 7 to 0)
Port J pins also function as wakeup input pins (WKP7 to WKP0) and LCD driver segment output
pins (SEG8 to SEG1). Port J pin functions are shown below.
• PJn/WKPn/SEGn + 1
The pin function is switched as shown below according to the combination of the SGS3 to
SGS0 bits in LPCR of the LCD driver/controller, WKP7 to WKP0 bits in WPCR, and
PJnDDR bit.
SGS3 to SGS0
H8S/2268 Group: B'00XX or B'0100
B'0101
H8S/2264 Group: B'0000, B'001X, or B'0100
0
1
⎯
⎯
⎯
PJn input pin
PJn output pin
WKPn input pin
SEGn + 1 output pin
WPCn
PJnDDR
Pin functions
0
1
Legend:
X: Don’t care
Note: n = 7 to 0
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Section 9 I/O Ports
9.8.7
Input Pull-Up MOS Function
Port J has a built-in input pull-up MOS function that can be controlled by software. Input pull-up
MOS can be specified as on or off on an individual bit basis.
When port J is set to port input and wakeup input, PJDDR is cleared to 0, and then PJPCR is set to
1, the input pull-up MOS is turned on.
The input pull-up MOS function is in the off state after a reset, and in hardware standby mode.
The prior state is retained in software standby mode.
Table 9.2 summarizes the input pull-up MOS states in port J.
Table 9.2
Input Pull-Up MOS States (Port J)
Pin States
Reset
Hardware
Standby Mode
Software
Standby Mode
In Other
Operations
Segment output and
port output
OFF
OFF
OFF
OFF
ON/OFF
ON/OFF
Port input and wakeup
input
Legend:
OFF
: Input pull-up MOS is always off.
ON/OFF : On when PJDDR = 0 and PJPCR = 1; otherwise off.
9.9
Port K
Port K is an 8-bit I/O port and has the following registers.
• Port K data direction register (PKDDR)
• Port K data register (PKDR)
• Port K register (PORTK)
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Section 9 I/O Ports
9.9.1
Port K Data Direction Register (PKDDR)
PKDDR specifies input or output the port K pins using the individual bits. PKDDR cannot be
read; if it is, an undefined value will be read.
The value of this register when read is undefined after a bit manipulation instruction is executed.
To prevent undefined read values, do not use bit manipulation instructions to write to this register.
For details, see section 2.9.4, Access Methods for Registers with Write-Only Bits.
Bit
Bit Name
Initial
Value
R/W
Description
7
PK7DDR
0
W
6
PK6DDR
0
W
5
PK5DDR
0
W
When a pin is specified as a general purpose I/O port,
setting this bit to 1 makes the corresponding port K pin an
output port. Clearing this bit to 0 makes the pin an input
port.
4
PK4DDR
0
W
3
PK3DDR
0
W
2
PK2DDR
0
W
1
PK1DDR
0
W
0
PK0DDR
0
W
9.9.2
Port K Data Register (PKDR)
PKDR stores output data for port K pins.
Bit
Bit Name
Initial
Value
R/W
Description
7
PK7DR
0
R/W
6
PK6DR
0
R/W
Output data for a pin is stored when the pin is specified
as a general purpose output port.
5
PK5DR
0
R/W
4
PK4DR
0
R/W
3
PK3DR
0
R/W
2
PK2DR
0
R/W
1
PK1DR
0
R/W
0
PK0DR
0
R/W
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Section 9 I/O Ports
9.9.3
Port K Register (PORTK)
PORTK shows port K pin states. This register cannot be modified.
Bit
Bit Name
Initial
Value
R/W
Description
7
PK7
⎯*
R
6
PK6
⎯*
R
5
PK5
⎯*
R
If a port K read is performed while PKDDR bits are set to
1, the PKDR values are read. If a port K read is
performed while PKDDR bits are cleared to 0, the pin
states are read.
4
PK4
⎯*
R
3
PK3
⎯*
R
2
PK2
⎯*
R
1
PK1
⎯*
R
0
PK0
⎯*
R
Note: * Determined by the states of pins PK7 to PK0.
9.9.4
Pin Functions
Port K pins also function as LCD driver segment output pins (SEG16 to SEG9). Port K pin
functions are shown below.
• PKn/SEGn + 9
The pin function is switched as shown below according to the combination of the SGS3 to
SGS0 bits in LPCR of the LCD driver/controller and PKnDDR bit.
SGS3 to SGS0
H8S/2268 Group: B'00XX
B'010X
H8S/2264 Group: B'0000 or B'001X
PKnDDR
Pin functions
0
1
⎯
PKn input pin
PKn output pin
SEGn + 9 output pin
Legend:
X: Don’t care
Note: n = 7 to 0
Rev. 5.00 Sep. 01, 2009 Page 175 of 656
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Section 9 I/O Ports
9.10
Port L
Port L is an 8-bit I/O port and has the following registers.
• Port L data direction register (PLDDR)
• Port L data register (PLDR)
• Port L register (PORTL)
9.10.1
Port L Data Direction Register (PLDDR)
PLDDR specifies input or output of the port L pins using the individual bits. PLDDR cannot be
read; if it is, an undefined value will be read.
The value of this register when read is undefined after a bit manipulation instruction is executed.
To prevent undefined read values, do not use bit manipulation instructions to write to this register.
For details, see section 2.9.4, Access Methods for Registers with Write-Only Bits.
Bit
Bit Name
Initial
Value
R/W
Description
7
PL7DDR
0
W
6
PL6DDR
0
W
5
PL5DDR
0
W
When a pin is specified as a general purpose I/O port,
setting this bit to 1 makes the corresponding port L pin an
output port. Clearing this bit to 0 makes the pin an input
port.
4
PL4DDR
0
W
3
PL3DDR
0
W
2
PL2DDR
0
W
1
PL1DDR
0
W
0
PL0DDR
0
W
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Section 9 I/O Ports
9.10.2
Port L Data Register (PLDR)
PLDR stores output data for port L pins.
Bit
Bit Name
Initial
Value
R/W
Description
7
PL7DR
0
R/W
6
PL6DR
0
R/W
Output data for a pin is stored when the pin is specified
as a general purpose output port.
5
PL5DR
0
R/W
4
PL4DR
0
R/W
3
PL3DR
0
R/W
2
PL2DR
0
R/W
1
PL1DR
0
R/W
0
PL0DR
0
R/W
9.10.3
Port L Register (PORTL)
PORTL shows port L pin states. This register cannot be modified.
Bit
Bit Name
Initial
Value
R/W
Description
7
PL7
⎯*
R
6
PL6
⎯*
R
5
PL5
⎯*
R
If a port L read is performed while PLDDR bits are set to
1, the PLDR values are read. If a port L read is performed
while PLDDR bits are cleared to 0, the pin states are
read.
4
PL4
⎯*
R
3
PL3
⎯*
R
2
PL2
⎯*
R
1
PL1
⎯*
R
0
PL0
⎯*
R
Note: * Determined by the states of pins PL7 to PL0.
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Section 9 I/O Ports
9.10.4
Pin Functions
Port L pins also function as LCD driver segment output pins (SEG24 to SEG17). Port L pin
functions are shown below.
• PLn/SEGn + 17
The pin function is switched as shown below according to the combination of the SGS3 to
SGS0 bits in LPCR of the LCD driver/controller and PLnDDR bit.
SGS3 to SGS0
H8S/2268 Group: B'000X or B'0010
B'0011 or B'010X
H8S/2264 Group: B'00X0
0
1
⎯
PLn input pin
PLn output pin
SEGn + 17 output pin
PLnDDR
Pin functions
Legend:
X: Don’t care
Note: n = 7 to 0
9.11
Port M (H8S/2268 Group Only)
Port M is an 8-bit I/O port and has the following registers.
• Port M data direction register (PMDDR)
• Port M data register (PMDR)
• Port M register (PORTM)
9.11.1
Port M Data Direction Register (PMDDR)
PMDDR specifies input or output of the port M pins using the individual bits. PMDDR cannot be
read; if it is, an undefined value will be read.
The value of this register when read is undefined after a bit manipulation instruction is executed.
To prevent undefined read values, do not use bit manipulation instructions to write to this register.
For details, see section 2.9.4, Access Methods for Registers with Write-Only Bits.
Rev. 5.00 Sep. 01, 2009 Page 178 of 656
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Section 9 I/O Ports
Bit
Bit Name
Initial
Value
R/W
Description
7
PM7DDR
0
W
6
PM6DDR
0
W
5
PM5DDR
0
W
When a pin is specified as a general purpose I/O port,
setting this bit to 1 makes the corresponding port M pin
an output port. Clearing this bit to 0 makes the pin an
input port.
4
PM4DDR
0
W
3
PM3DDR
0
W
2
PM2DDR
0
W
1
PM1DDR
0
W
0
PM0DDR
0
W
9.11.2
Port M Data Register (PMDR)
PMDR stores output data for port M pins.
Bit
Bit Name
Initial
Value
R/W
Description
7
PM7DR
0
R/W
6
PM6DR
0
R/W
Output data for a pin is stored when the pin is specified
as a general purpose output port.
5
PM5DR
0
R/W
4
PM4DR
0
R/W
3
PM3DR
0
R/W
2
PM2DR
0
R/W
1
PM1DR
0
R/W
0
PM0DR
0
R/W
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Section 9 I/O Ports
9.11.3
Port M Register (PORTM)
PORTM shows port M pin states.
Bit
Bit Name
Initial
Value
R/W
Description
7
PM7
⎯*
R
6
PM6
⎯*
R
5
PM5
⎯*
R
If a port M read is performed while PMDDR bits are set to
1, the PMDR values are read. If a port M read is
performed while PMDDR bits are cleared to 0, the pin
states are read.
4
PM4
⎯*
R
3
PM3
⎯*
R
2
PM2
⎯*
R
1
PM1
⎯*
R
0
PM0
⎯*
R
Note: * Determined by the states of pins PM7 to PM0.
9.11.4
Pin Functions
Port M pins also function as LCD driver segment output pins (SEG32 to SEG25). Port M pin
functions are shown below.
• PMn/SEGn + 25
The pin function is switched as shown below according to the combination of the SGS3 to
SGS0 bits in LPCR of the LCD driver/controller and PMnDDR bit.
SGS3 to SGS0
PMnDDR
Pin functions
B'000X
B'001X or B'010X
0
1
⎯
PMn input pin
PMn output pin
SEGn + 25 output pin
Legend:
X: Don’t care
Note: n = 7 to 0
Rev. 5.00 Sep. 01, 2009 Page 180 of 656
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Section 9 I/O Ports
9.12
Port N (H8S/2268 Group Only)
Port N is an 8-bit I/O port and has the following registers.
• Port N data direction register (PNDDR)
• Port N data register (PNDR)
• Port N register (PORTN)
9.12.1
Port N Data Direction Register (PNDDR)
PNDDR specifies input or output of the port N pins using the individual bits. PNDDR cannot be
read; if it is, an undefined value will be read.
The value of this register when read is undefined after a bit manipulation instruction is executed.
To prevent undefined read values, do not use bit manipulation instructions to write to this register.
For details, see section 2.9.4, Access Methods for Registers with Write-Only Bits.
Bit
Bit Name
Initial
Value
R/W
Description
7
PN7DDR
0
W
6
PN6DDR
0
W
5
PN5DDR
0
W
When a pin is specified as a general purpose I/O port,
setting this bit to 1 makes the corresponding port N pin an
output port. Clearing this bit to 0 makes the pin an input
port.
4
PN4DDR
0
W
3
PN3DDR
0
W
2
PN2DDR
0
W
1
PN1DDR
0
W
0
PN0DDR
0
W
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Section 9 I/O Ports
9.12.2
Port N Data Register (PNDR)
PNDR stores output data for port N pins.
Bit
Bit Name
Initial
Value
R/W
Description
7
PN7DR
0
R/W
6
PN6DR
0
R/W
Output data for a pin is stored when the pin is specified
as a general purpose output port.
5
PN5DR
0
R/W
4
PN4DR
0
R/W
3
PN3DR
0
R/W
2
PN2DR
0
R/W
1
PN1DR
0
R/W
0
PN0DR
0
R/W
9.12.3
Port N Register (PORTN)
PORTN shows port N pin states.
Bit
Bit Name
Initial
Value
R/W
Description
7
PN7
⎯*
R
6
PN6
⎯*
R
5
PN5
⎯*
R
If a port N read is performed while PNDDR bits are set to
1, the PNDR values are read. If a port N read is
performed while PNDDR bits are cleared to 0, the pin
states are read.
4
PN4
⎯*
R
3
PN3
⎯*
R
2
PN2
⎯*
R
1
PN1
⎯*
R
0
PN0
⎯*
R
Note: * Determined by the states of pins PN7 to PN0.
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Section 9 I/O Ports
9.12.4
Pin Functions
Port N pins also function as LCD driver segment output pins (SEG40 to SEG33). Port N pin
functions are shown below.
• PNn/SEGn + 33
The pin function is switched as shown below according to the combination of the SGS3 to
SGS0 bits in LPCR of the LCD driver/contoller and PNnDDR bit.
SGS3 to SGS0
PNnDDR
Pin functions
B'0000
B'0001, B'001X, or B'010X
0
1
⎯
PNn input pin
PNn output pin
SEGn + 33 output pin
Legend:
X: Don’t care
Note: n = 7 to 0
9.13
Handling of Unused Pins
Unused input pins should be fixed high or low. Generally, the input pins of CMOS products are
high-impedance. Leaving unused pins open can cause the generation of intermediate levels due to
peripheral noise induction. This can result in shoot-through current inside the device and cause it
to malfunction. Table 9.3 lists examples of ways to handle unused pins. Leave unused pins open.
Rev. 5.00 Sep. 01, 2009 Page 183 of 656
REJ09B0071-0500
Section 9 I/O Ports
Table 9.3
Examples of Ways to Handle Unused Input Pins
Port Name
Pin Handling Example
Port 1
Connect each pin to Vcc (pull-up) or to Vss (pull-down) via a resistor.
Port 3
Port 4
Connect each pin to AVcc (pull-up) or to AVss (pull-down) via a resistor.
Port 7
Connect each pin to Vcc (pull-up) or to Vss (pull-down) via a resistor.
Port 9
Connect each pin to AVcc (pull-up) or to AVss (pull-down) via a resistor.
Port F
Connect each pin to Vcc (pull-up) or to Vss (pull-down) via a resistor.
Port H
* Ports M and N apply to the H8S/2268 Group only.
Port J
Port K
Port L
Port M*
Port N*
For pins set as LCD SEG pins (see 17.3.1, LED Port Control Register (LPCR)), add extra
capacitance as appropriate to accommodate the LCD drive power supply capacity and the LCD
used.
Rev. 5.00 Sep. 01, 2009 Page 184 of 656
REJ09B0071-0500
Section 10 16-Bit Timer Pulse Unit (TPU)
Section 10 16-Bit Timer Pulse Unit (TPU)
The H8S/2268 Group has an on-chip 16-bit timer pulse unit (TPU) comprised of three 16-bit timer
channels, and the H8S/2264 Group has the TPU comprised of two 16-bit timer channels. The
function list of the TPU is shown in table 10.1. A block diagram of the TPU for the H8S/2268
Group and that for the H8S/2264 Group are shown figures 10.1 and 10.2, respectively.
10.1
Features
• Maximum 8-pulse input/output (H8S/2268 Group)
• Maximum 4-pulse input/output (H8S/2264 Group)
• Selection of 7 or 8 counter input clocks for each channel
• The following operations can be set for each channel:
⎯ Waveform output at compare match
⎯ Input capture function
⎯ Counter clear operation
⎯ Synchronous operation:
Multiple timer counters (TCNT) can be written to simultaneously
Simultaneous clearing by compare match and input capture is possible
Register simultaneous input/output is possible by synchronous counter operation
⎯ PWM output with any duty level is possible
⎯ A maximum 7-phase (H8S/2268 Group)/3-phase (H8S/2264 Group) PWM output is
possible in combination with synchronous operation
• Buffer operation settable for channel 0 (H8S/2268 Group only)
• Phase counting mode settable independently for each of channels 1 and 2 (H8S/2268 Group
only)
• Fast access via internal 16-bit bus
• 13-type interrupt sources (H8S/2268 Group)
• 6-type interrupt sources (H8S/2264 Group)
• Register data can be transmitted automatically
• A/D converter conversion start trigger can be generated
• Module stop mode can be set
TIMTPU3B_000020030700
Rev. 5.00 Sep. 01, 2009 Page 185 of 656
REJ09B0071-0500
Section 10 16-Bit Timer Pulse Unit (TPU)
Table 10.1 TPU Functions
Item
Channel 0*
Count clock
1
Channel 1
Channel 2
φ/1
φ/4
φ/16
φ/64
TCLKA
TCLKB
TCLKC
TCLKD
φ/1
φ/4
φ/16
φ/64
φ/256
TCLKA
TCLKB
φ/1
φ/4
φ/16
φ/64
φ/1024
TCLKA
TCLKB
TCLKC
General registers
(TGR)
TGRA_0
TGRB_0
TGRA_1
TGRB_1
TGRA_2
TGRB_2
General registers/
1
buffer registers*
TGRC_0
TGRD_0
⎯
⎯
I/O pins
TIOCA0
TIOCB0
TIOCC0
TIOCD0
TIOCA1
TIOCB1
TIOCA2
TIOCB2
Counter clear
function
TGR compare match or TGR compare match or TGR compare match or
input capture
input capture
input capture
Compare
match
output
0 output
1 output
Toggle
output
Input capture function
Synchronous
operation
PWM mode
Phase counting
1
mode*
1
Buffer operation*
1
DTC activation*
A/D converter trigger
⎯
⎯
⎯
TGR compare match
or input capture
TGR compare match
or input capture
TGR compare match
or input capture
TGRA_0 compare
match or input capture
TGRA_1 compare
match or input capture
TGRA_2 compare
match or input capture
Rev. 5.00 Sep. 01, 2009 Page 186 of 656
REJ09B0071-0500
Section 10 16-Bit Timer Pulse Unit (TPU)
Item
Interrupt sources
Channel 0*
1
Channel 1
Channel 2
5 sources
4 sources*
2
3 sources*
• Compare match or
input capture 0A
• Compare match or input • Compare match or
capture 1A
input capture 2A
• Compare match or
input capture 0B
• Compare match or
input capture 1B
• Compare match or
input capture 2B
• Compare match or
input capture 0C
• Overflow
• Overflow
1
• Underflow*
1
• Underflow*
1
4 sources*
2
3 sources*
1
• Compare match or
input capture 0D
• Overflow
Legend:
: Possible
⎯ : Not possible
Notes: 1. Supported only by the H8S/2268 Group.
2. Supported only by the H8S/2264 Group.
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Section 10 16-Bit Timer Pulse Unit (TPU)
A/D convertion start request signal
TGRC
TGRD
TGRB
TGRB
TGRB
TCNT
TCNT
TGRA
TCNT
TGRA
TSR
TSR
Module data bus
TIER
TIER
TIER
TSR
TIOR
TIOR
TIORH TIORL
TGRA
Bus
interface
Internal data bus
TSTR
Control logic
TMDR
Channel 2
TCR
TMDR
Channel 1
TIOR(H, L):
TIER:
TSR:
TGR(A, B, C, D):
TCR
Common
Legend:
TSTR: Timer start register
TSYR: Timer synchro register
TCR: Timer control register
TMDR: Timer mode register
TMDR
Channel 2:
Control logic for channel 0 to 2
Channel 1:
TIOCA0
TIOCB0
TIOCC0
TIOCD0
TIOCA1
TIOCB1
TIOCA2
TIOCB2
Channel 0
Input/output pins
Channel 0:
TCR
External clock:
φ/1
φ/4
φ/16
φ/64
φ/256
φ/1024
TCLKA
TCLKB
TCLKC
TCLKD
TSYR
Clock input
Internal clock:
Interrupt request signals
Channel 0: TGI0A
TGI0B
TGI0C
TGI0D
TCI0V
Channel 1: TGI1A
TGI1B
TCI1V
TCI1U
Channel 2: TGI2A
TGI2B
TCI2V
TCI2U
Timer I/O control registers (H, L)
Timer interrupt enable register
Timer status register
TImer general registers (A, B, C, D)
Figure 10.1 Block Diagram of TPU for H8S/2268 Group
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REJ09B0071-0500
Section 10 16-Bit Timer Pulse Unit (TPU)
A/D convertion start request signal
TGRB
TGRB
TCNT
TCNT
TGRA
TSR
Module data bus
TIER
TIER
TSR
TIOR
TIOR
TGRA
Bus
interface
Internal data bus
TSTR
Control logic
TMDR
Channel 2
TIOR:
TIER:
TSR:
TGR(A, B):
TCR
Common
Legend:
TSTR: Timer start register
TSYR: Timer synchro register
TCR: Timer control register
TMDR: Timer mode register
TMDR
Channel 2:
TIOCA1
TIOCB1
TIOCA2
TIOCB2
Channel 1
Channel 1:
TCR
Input/output pins
Control logic for channel 1 to 2
External clock:
φ/1
φ/4
φ/16
φ/64
φ/256
φ/1024
TCLKA
TCLKB
TCLKC
TSYR
Clock input
Internal clock:
Interrupt request signals
Channel 1: TGI1A
TGI1B
TCI1V
TCI1U
Channel 2: TGI2A
TGI2B
TCI2V
TCI2U
Timer I/O control registers
Timer interrupt enable register
Timer status register
TImer general registers (A, B)
Figure 10.2 Block Diagram of TPU for H8S/2264 Group
Rev. 5.00 Sep. 01, 2009 Page 189 of 656
REJ09B0071-0500
Section 10 16-Bit Timer Pulse Unit (TPU)
10.2
Input/Output Pins
Table 10.2 TPU Pins
Channel Symbol
I/O
Function
All
TCLKA
Input
External clock A input pin
(Channel 1 phase counting mode A phase input*)
TCLKB
Input
External clock B input pin
(Channel 1 phase counting mode B phase input*)
TCLKC
Input
External clock C input pin
(Channel 2 phase counting mode A phase input*)
TCLKD*
Input
External clock D input pin
(Channel 2 phase counting mode B phase input*)
TIOCA0
I/O
TGRA_0 input capture input/output compare output/PWM output pin
TIOCB0
I/O
TGRB_0 input capture input/output compare output/PWM output pin
TIOCC0
I/O
TGRC_0 input capture input/output compare output/PWM output pin
TIOCD0
I/O
TGRD_0 input capture input/output compare output/PWM output pin
TIOCA1
I/O
TGRA_1 input capture input/output compare output/PWM output pin
TIOCB1
I/O
TGRB_1 input capture input/output compare output/PWM output pin
TIOCA2
I/O
TGRA_2 input capture input/output compare output/PWM output pin
TIOCB2
I/O
TGRB_2 input capture input/output compare output/PWM output pin
0*
1
2
Note: * Supported only by the H8S/2268 Group.
Rev. 5.00 Sep. 01, 2009 Page 190 of 656
REJ09B0071-0500
Section 10 16-Bit Timer Pulse Unit (TPU)
10.3
Register Descriptions
The TPU has the following registers. To distinguish registers in each channel, an underscore and
the channel number are added as a suffix to the register name; TCR for channel 0 is expressed as
TCR_0.
• Timer control register_0 (TCR_0)*
• Timer mode register_0 (TMDR_0)*
• Timer I/O control register H_0 (TIORH_0)*
• Timer I/O control register L_0 (TIORL_0)*
• Timer interrupt enable register_0 (TIER_0)*
• Timer status register_0 (TSR_0)*
• Timer counter_0 (TCNT_0)*
• Timer general register A_0 (TGRA_0)*
• Timer general register B_0 (TGRB_0)*
• Timer general register C_0 (TGRC_0)*
• Timer general register D_0 (TGRD_0)*
• Timer control register_1 (TCR_1)
• Timer mode register_1 (TMDR_1)
• Timer I/O control register _1 (TIOR_1)
• Timer interrupt enable register_1 (TIER_1)
• Timer status register_1 (TSR_1)
• Timer counter_1 (TCNT_1)
• Timer general register A_1 (TGRA_1)
• Timer general register B_1 (TGRB_1)
• Timer control register_2 (TCR_2)
• Timer mode register_2 (TMDR_2)
• Timer I/O control register_2 (TIOR_2)
• Timer interrupt enable register_2 (TIER_2)
• Timer status register_2 (TSR_2)
• Timer counter_2 (TCNT_2)
• Timer general register A_2 (TGRA_2)
• Timer general register B_2 (TGRB_2)
Rev. 5.00 Sep. 01, 2009 Page 191 of 656
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Section 10 16-Bit Timer Pulse Unit (TPU)
Common Registers
• Timer start register (TSTR)
• Timer synchro register (TSYR)
Note: * Supported only by the H8S/2268 Group.
10.3.1
Timer Control Register (TCR)
The TCR registers control the TCNT operation for each channel. The H8S/2268 Group TPU has a
total of three TCR registers and the H8S/2264 Group TPU has a total of two TCR registers, one
for each channel (channels 0 to 2, or 1 and 2). TCR register settings should be conducted only
when TCNT operation is stopped.
Bit
Bit Name
Initial
value
R/W
Description
7
CCLR2
0
R/W
Counter Clear 0 to 2
6
CCLR1
0
R/W
5
CCLR0
0
R/W
These bits select the TCNT counter clearing source. See
tables 10.3 and 10.4 for details.
4
CKEG1
0
R/W
Clock Edge 0 and 1
3
CKEG0
0
R/W
These bits select the input clock edge. When the input
clock is counted using both edges, the input clock period
is halved (e.g. φ/4 both edges = φ/2 rising edge). Internal
clock edge selection is valid when the input clock is φ/4 or
slower. If the input clock is φ/1, this setting is ignored and
count at falling edge of φ is selected. In the H8S/2268
Group, if phase counting mode is used on channels 1 and
2, this setting is ignored and the phase counting mode
setting has priority.
00: Count at rising edge
01: Count at falling edge
1X: Count at both edges
Legend: X: Don’t care
2
TPSC2
0
R/W
Time Prescaler 0 to 2
1
TPSC1
0
R/W
0
TPSC0
0
R/W
These bits select the TCNT counter clock. The clock
source can be selected independently for each channel.
See tables10.5 to10.7 for details.
Rev. 5.00 Sep. 01, 2009 Page 192 of 656
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Section 10 16-Bit Timer Pulse Unit (TPU)
Table 10.3 CCLR0 to CCLR2 (Channel 0) (H8S/2268 Group Only)
Channel
Bit 7
CCLR2
Bit 6
CCLR1
Bit 5
CCLR0
Description
0
0
0
0
TCNT clearing disabled
1
TCNT cleared by TGRA compare match/input
capture
0
TCNT cleared by TGRB compare match/input
capture
1
TCNT cleared by counter clearing for another
channel performing synchronous clearing/
1
synchronous operation*
1
1
0
1
0
TCNT clearing disabled
1
TCNT cleared by TGRC compare match/input
2
capture*
0
TCNT cleared by TGRD compare match/input
2
capture*
1
TCNT cleared by counter clearing for another
channel performing synchronous clearing/
1
synchronous operation*
Notes: 1. Synchronous operation is set by setting the SYNC bit in TSYR to 1.
2. When TGRC or TGRD is used as a buffer register, TCNT is not cleared because the
buffer register setting has priority, and compare match/input capture does not occur.
Table 10.4 CCLR0 to CCLR2 (Channels 1 and 2)
Channel
Bit 7
Bit 6
2
Reserved* CCLR1
Bit 5
CCLR0
Description
1, 2
0
0
TCNT clearing disabled
1
TCNT cleared by TGRA compare match/input
capture
0
TCNT cleared by TGRB compare match/input
capture
1
TCNT cleared by counter clearing for another
channel performing synchronous clearing/
1
synchronous operation*
0
1
Notes: 1. Synchronous operation is selected by setting the SYNC bit in TSYR to 1.
2. Bit 7 is reserved in channels 1 and 2. It is always read as 0 and cannot be modified.
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Section 10 16-Bit Timer Pulse Unit (TPU)
Table 10.5 TPSC0 to TPSC2 (Channel 0) (H8S/2268 Group Only)
Channel
Bit 2
TPSC2
Bit 1
TPSC1
Bit 0
TPSC0
Description
0
0
0
0
Internal clock: counts on φ/1
1
Internal clock: counts on φ/4
0
Internal clock: counts on φ/16
1
Internal clock: counts on φ/64
0
External clock: counts on TCLKA pin input
1
External clock: counts on TCLKB pin input
0
External clock: counts on TCLKC pin input
1
External clock: counts on TCLKD pin input
1
1
0
1
Table 10.6 TPSC0 to TPSC2 (Channel 1)
Channel
Bit 2
TPSC2
Bit 1
TPSC1
Bit 0
TPSC0
Description
1
0
0
0
Internal clock: counts on φ/1
1
Internal clock: counts on φ/4
1
0
Internal clock: counts on φ/16
1
Internal clock: counts on φ/64
0
0
External clock: counts on TCLKA pin input
1
External clock: counts on TCLKB pin input
0
Internal clock: counts on φ/256
1
Setting prohibited
1
1
Note: * This setting is ignored when channel 1 is in phase counting mode (H8S/2268 Group only).
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Section 10 16-Bit Timer Pulse Unit (TPU)
Table 10.7 TPSC0 to TPSC2 (Channel 2)
Channel
Bit 2
TPSC2
Bit 1
TPSC1
Bit 0
TPSC0
Description
2
0
0
0
Internal clock: counts on φ/1
1
Internal clock: counts on φ/4
0
Internal clock: counts on φ/16
1
Internal clock: counts on φ/64
0
External clock: counts on TCLKA pin input
1
External clock: counts on TCLKB pin input
0
External clock: counts on TCLKC pin input
1
Internal clock: counts on φ/1024
1
1
0
1
Note: * This setting is ignored when channel 2 is in phase counting mode (H8S/2268 Group only).
10.3.2
Timer Mode Register (TMDR)
The TMDR registers are used to set the operating mode of each channel. The H8S/2268 Group
TPU has three TMDR registers and the H8S/2264 Group TPU has two TMDR registers, one for
each channel (channels 0 to 2, or 1 and 2). TMDR register settings should be changed only when
TCNT operation is stopped.
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Section 10 16-Bit Timer Pulse Unit (TPU)
Bit
Bit Name
Initial
value
R/W
7, 6
⎯
All 1
⎯
Description
Reserved
These bits are always read as 1 and cannot be modified.
5
BFB
0
R/W
H8S/2268 Group:
Buffer Operation B
Specifies whether TGRB is to operate in the normal way,
or TGRB and TGRD are to be used together for buffer
operation. When TGRD is used as a buffer register,
TGRD input capture/output compare is not generated.
In channels 1 and 2, which have no TGRD, bit 5 is
reserved. It is always read as 0 and cannot be modified.
0: TGRB operates normally
1: TGRB and TGRD used together for buffer operation
H8S/2264 Group:
Reserved
These bits are always read as 0 and cannot be modified.
4
BFA
0
R/W
H8S/2268 Group:
Buffer Operation A
Specifies whether TGRA is to operate in the normal way,
or TGRA and TGRC are to be used together for buffer
operation. When TGRC is used as a buffer register,
TGRC input capture/output compare is not generated.
In channels 1 and 2, which have no TGRC, bit 4 is
reserved. It is always read as 0 and cannot be modified.
0: TGRA operates normally
1:TGRA and TGRC used together for buffer operation
H8S/2264 Group:
Reserved
These bits are always read as 0 and cannot be modified.
3
MD3
0
R/W
Modes 0 to 3
2
MD2
0
R/W
These bits are used to set the timer operating mode.
1
MD1
0
R/W
0
MD0
0
R/W
MD3 is a reserved bit. In a write, it should always be
written with 0. See table 10.8 for details.
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Section 10 16-Bit Timer Pulse Unit (TPU)
Table 10.8 MD0 to MD3
Bit 3
1
MD3*
Bit 2
2
MD2*
Bit 1
MD1
Bit 0
MD0
Description
0
0
0
0
Normal operation
1
Reserved
0
PWM mode 1
1
PWM mode 2
0
Phase counting mode 1
1
Phase counting mode 2
0
Phase counting mode 3
1
Phase counting mode 4
X
⎯
1
1
0
1
1
X
X
Legend:
X: Don’t care
Notes: 1. MD3 is a reserved bit. In a write, it should always be written with 0.
2. Phase counting mode cannot be set in the H8S/2264 Group or for channels 0 in the
H8S/2268 Group. In this case, 0 should always be written to MD2.
10.3.3
Timer I/O Control Register (TIOR)
The TIOR registers control the TGR registers. The H8S/2268 Group TPU has four TIOR registers
and the H8S/2264 Group TPU has two TIOR registers, two for channel 0, and one each for
channels 1 and 2.
Care is required as TIOR is affected by the TMDR setting. The initial output specified by TIOR is
valid when the counter is stopped (the CST bit in TSTR is cleared to 0). Note also that, in PWM
mode 2, the output at the point at which the counter is cleared to 0 is specified.
In the H8S/2268 Group, when TGRC or TGRD is designated for buffer operation, this setting is
invalid and the register operates as a buffer register.
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Section 10 16-Bit Timer Pulse Unit (TPU)
• TIORH_0 (H8S/2268 Group only), TIOR_1, TIOR_2
Bit
Bit Name
Initial
value
R/W
Description
7
IOB3
All 0
R/W
I/O Control B0 to B3
6
IOB2
Specify the function of TGRB.
5
IOB1
For details, refer to table 10.9, 10.11, and 10.12.
4
IOB0
3
IOA3
2
IOA2
Specify the function of TGRA.
1
IOA1
For details, refer to table 10.13, 10.15, and 10.16.
0
IOA0
All 0
R/W
I/O Control A0 to A3
• TIORL_0 (H8S/2268 Group only)
Bit
Bit Name
Initial
value
R/W
Description
7
IOD3
All 0
R/W
I/O Control D0 to D3
6
IOD2
Specify the function of TGRD.
5
IOD1
For details, refer to table 10.10.
4
IOD0
3
IOC3
2
IOC2
Specify the function of TGRC.
1
IOC1
For details, refer to table 10.14.
0
IOC0
All 0
R/W
I/O Control C0 to C3
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Section 10 16-Bit Timer Pulse Unit (TPU)
Table 10.9 TIORH_0 (Channel 0) (H8S/2268 Group Only)
Description
Bit 7
IOB3
Bit 6
IOB2
Bit 5
IOB1
Bit 4
IOB0
TGRB_0
Function
0
0
0
0
Output
compare
register
1
TIOCB0 Pin Function
Output disabled
Initial output is 0
0 output at compare match
1
0
Initial output is 0
1 output at compare match
1
Initial output is 0
Toggle output at compare match
1
0
0
Output disabled
1
Initial output is 1
0 output at compare match
1
0
Initial output is 1
1 output at compare match
1
Initial output is 1
Toggle output at compare match
1
0
0
0
1
Input
capture
register
Capture input source is TIOCB0 pin
Input capture at rising edge
Capture input source is TIOCB0 pin
Input capture at falling edge
1
X
X
X
Capture input source is TIOCB0 pin
Input capture at both edges
1
Setting disabled
Legend:
X: Don’t care
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Section 10 16-Bit Timer Pulse Unit (TPU)
Table 10.10 TIORL_0 (Channel 0) (H8S/2268 Group Only)
Description
Bit 7
IOD3
Bit 6
IOD2
Bit 5
IOD1
Bit 4
IOD0
TGRD_0
Function
0
0
0
0
Output
compare
register*
1
TIOCD0 Pin Function
Output disabled
Initial output is 0
0 output at compare match
1
0
Initial output is 0
1 output at compare match
1
Initial output is 0
Toggle output at compare match
1
0
0
Output disabled
1
Initial output is 1
0 output at compare match
1
0
Initial output is 1
1 output at compare match
1
Initial output is 1
Toggle output at compare match
1
0
0
0
Input
capture
register*
1
Capture input source is TIOCD0 pin
Input capture at rising edge
Capture input source is TIOCD0 pin
Input capture at falling edge
1
X
X
X
Capture input source is TIOCD0 pin
Input capture at both edges
1
Setting disabled
Legend:
X: Don’t care
Note: * When the BFB bit in TMDR_0 is set to 1 and TGRD_0 is used as a buffer register, this
setting is invalid and input capture/output compare is not generated.
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Section 10 16-Bit Timer Pulse Unit (TPU)
Table 10.11 TIOR_1 (Channel 1)
Description
Bit 7
IOB3
Bit 6
IOB2
Bit 5
IOB1
Bit 4
IOB0
TGRB_1
Function
0
0
0
0
Output
compare
register
1
TIOCB1 Pin Function
Output disabled
Initial output is 0
0 output at compare match
1
0
Initial output is 0
1 output at compare match
1
Initial output is 0
Toggle output at compare match
1
0
0
Output disabled
1
Initial output is 1
0 output at compare match
1
0
Initial output is 1
1 output at compare match
1
Initial output is 1
Toggle output at compare match
1
0
0
0
1
Input
capture
register
Capture input source is TIOCB1 pin
Input capture at rising edge
Capture input source is TIOCB1 pin
Input capture at falling edge
1
X
X
X
Capture input source is TIOCB1 pin
Input capture at both edges
1
Setting disabled
Legend:
X: Don’t care
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Section 10 16-Bit Timer Pulse Unit (TPU)
Table 10.12 TIOR_2 (Channel 2)
Description
Bit 7
IOB3
Bit 6
IOB2
Bit 5
IOB1
Bit 4
IOB0
TGRB_2
Function
0
0
0
0
Output
compare
register
1
TIOCB2 Pin Function
Output disabled
Initial output is 0
0 output at compare match
1
0
Initial output is 0
1 output at compare match
1
Initial output is 0
Toggle output at compare match
1
0
0
Output disabled
1
Initial output is 1
0 output at compare match
1
0
Initial output is 1
1 output at compare match
1
Initial output is 1
Toggle output at compare match
1
X
0
0
Input
capture
register
1
Capture input source is TIOCB2 pin
Input capture at rising edge
Capture input source is TIOCB2 pin
Input capture at falling edge
1
X
Capture input source is TIOCB2 pin
Input capture at both edges
Legend:
X: Don’t care
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Section 10 16-Bit Timer Pulse Unit (TPU)
Table 10.13 TIORH_0 (Channel 0) (H8S/2268 Group Only)
Description
Bit 3
IOA3
Bit 2
IOA2
Bit 1
IOA1
Bit 0
IOA0
TGRA_0
Function
0
0
0
0
Output
compare
register
1
TIOCA0 Pin Function
Output disabled
Initial output is 0
0 output at compare match
1
0
Initial output is 0
1 output at compare match
1
Initial output is 0
Toggle output at compare match
1
0
0
Output disabled
1
Initial output is 1
0 output at compare match
1
0
Initial output is 1
1 output at compare match
1
Initial output is 1
Toggle output at compare match
1
0
0
0
1
Input
capture
register
Capture input source is TIOCA0 pin
Input capture at rising edge
Capture input source is TIOCA0 pin
Input capture at falling edge
1
X
X
X
Capture input source is TIOCA0 pin
Input capture at both edges
1
Setting disabled
Legend:
X: Don’t care
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Section 10 16-Bit Timer Pulse Unit (TPU)
Table 10.14 TIORL_0 (Channel 0) (H8S/2268 Group Only)
Description
Bit 3
IOC3
Bit 2
IOC2
Bit 1
IOC1
Bit 0
IOC0
TGRC_0
Function
0
0
0
0
Output
compare
register*
1
TIOCC0 Pin Function
Output disabled
Initial output is 0
0 output at compare match
1
0
Initial output is 0
1 output at compare match
1
Initial output is 0
Toggle output at compare match
1
0
0
Output disabled
1
Initial output is 1
0 output at compare match
1
0
Initial output is 1
1 output at compare match
1
Initial output is 1
Toggle output at compare match
1
0
0
0
Input
capture
register*
1
Capture input source is TIOCC0 pin
Input capture at rising edge
Capture input source is TIOCC0 pin
Input capture at falling edge
1
X
X
X
Capture input source is TIOCC0 pin
Input capture at both edges
1
Setting disabled
Legend:
X: Don’t care
Note: * When the BFA bit in TMDR_0 is set to 1 and TGRC_0 is used as a buffer register, this
setting is invalid and input capture/output compare is not generated.
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Section 10 16-Bit Timer Pulse Unit (TPU)
Table 10.15 TIOR_1 (Channel 1)
Description
Bit 3
IOA3
Bit 2
IOA2
Bit 1
IOA1
Bit 0
IOA0
TGRA_1
Function
0
0
0
0
Output
compare
register
1
TIOCA1 Pin Function
Output disabled
Initial output is 0
0 output at compare match
1
0
Initial output is 0
1 output at compare match
1
Initial output is 0
Toggle output at compare match
1
0
0
Output disabled
1
Initial output is 1
0 output at compare match
1
0
Initial output is 1
1 output at compare match
1
Initial output is 1
Toggle output at compare match
1
0
0
0
1
Input
capture
register
Capture input source is TIOCA1 pin
Input capture at rising edge
Capture input source is TIOCA1 pin
Input capture at falling edge
1
X
X
X
Capture input source is TIOCA1 pin
Input capture at both edges
1
Setting disabled
Legend:
X Don’t care
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Section 10 16-Bit Timer Pulse Unit (TPU)
Table 10.16 TIOR_2 (Channel 2)
Description
Bit 3
IOA3
Bit 2
IOA2
Bit 1
IOA1
Bit 0
IOA0
TGRA_2
Function
0
0
0
0
Output
compare
register
1
TIOCA2 Pin Function
Output disabled
Initial output is 0
0 output at compare match
1
0
Initial output is 0
1 output at compare match
1
Initial output is 0
Toggle output at compare match
1
0
0
Output disabled
1
Initial output is 1
0 output at compare match
1
0
Initial output is 1
1 output at compare match
1
Initial output is 1
Toggle output at compare match
1
X
0
0
Input
capture
register
1
Capture input source is TIOCA2 pin
Input capture at rising edge
Capture input source is TIOCA2 pin
Input capture at falling edge
1
X
Capture input source is TIOCA2 pin
Input capture at both edges
Legend:
X: Don’t care
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Section 10 16-Bit Timer Pulse Unit (TPU)
10.3.4
Timer Interrupt Enable Register (TIER)
The TIER registers control enabling or disabling of interrupt requests for each channel. The
H8S/2268 Group TPU has three TIER registers and the H8S/2264 Group TPU has two TIER
registers, one for each channel (channels 0 to 2, or 1 and 2).
Bit
Bit Name
Initial
value
R/W
Description
7
TTGE
0
R/W
A/D Conversion Start Request Enable
Enables or disables generation of A/D conversion start
requests by TGRA input capture/compare match.
0: A/D conversion start request generation disabled
1: A/D conversion start request generation enabled
6
⎯
1
⎯
Reserved
This bit is always read as 1 and cannot be modified.
5
TCIEU
0
R/W
H8S/2268 Group:
Underflow Interrupt Enable
Enables or disables interrupt requests (TCIU) by the
TCFU flag when the TCFU flag in TSR is set to 1 in
channels 1 and 2.
In channel 0, bit 5 is reserved. It is always read as 0 and
cannot be modified.
0: Interrupt requests (TCIU) by TCFU disabled
1: Interrupt requests (TCIU) by TCFU enabled
H8S/2264 Group:
The write value should always be 0.
4
TCIEV
0
R/W
Overflow Interrupt Enable
Enables or disables interrupt requests (TCIV) by the
TCFV flag when the TCFV flag in TSR is set to 1.
0: Interrupt requests (TCIV) by TCFV disabled
1: Interrupt requests (TCIV) by TCFV enabled
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Section 10 16-Bit Timer Pulse Unit (TPU)
Bit
Bit Name
Initial
value
R/W
3
TGIED
0
R/W
Description
TGR Interrupt Enable D
Enables or disables interrupt requests (TGID) by the
TGFD bit when the TGFD bit in TSR is set to 1 in channel
0.
In channels 1 and 2, bit 3 is reserved. It is always read as
0 and cannot be modified.
0: Interrupt requests (TGID) by TGFD bit disabled
1: Interrupt requests (TGID) by TGFD bit enabled
2
TGIEC
0
R/W
TGR Interrupt Enable C
Enables or disables interrupt requests (TGIC) by the
TGFC bit when the TGFC bit in TSR is set to 1 in channel
0.
In channels 1 and 2, bit 2 is reserved. It is always read as
0 and cannot be modified.
0: Interrupt requests (TGIC) by TGFC bit disabled
1: Interrupt requests (TGIC) by TGFC bit enabled
1
TGIEB
0
R/W
TGR Interrupt Enable B
Enables or disables interrupt requests (TGIB) by the
TGFB bit when the TGFB bit in TSR is set to 1.
0: Interrupt requests (TGIB) by TGFB bit disabled
1: Interrupt requests (TGIB) by TGFB bit enabled
0
TGIEA
0
R/W
TGR Interrupt Enable A
Enables or disables interrupt requests (TGIA) by the
TGFA bit when the TGFA bit in TSR is set to 1.
0: Interrupt requests (TGIA) by TGFA bit disabled
1: Interrupt requests (TGIA) by TGFA bit enabled
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Section 10 16-Bit Timer Pulse Unit (TPU)
10.3.5
Timer Status Register (TSR)
The TSR registers indicate the status of each channel. The H8S/2268 Group TPU has three TSR
registers and the H8S/2264 Group TPU has two TSR registers, one for each channel (channels 0 to
2, or 1 and 2).
Bit
Bit Name
Initial
value
R/W
Description
7
TCFD
1
R
H8S/2268 Group:
Count Direction Flag
Status flag that shows the direction in which TCNT counts
in channels 1 and 2.
In channel 0, bit 7 is reserved. It is always read as 1 and
cannot be modified.
0: TCNT counts down
1: TCNT counts up
H8S/2264 Group:
Reserved
This bit is always read as 1 and cannot be modified.
6
⎯
1
⎯
0
R/(W)* H8S/2268 Group:
Reserved
This bit is always read as 1 and cannot be modified.
5
TCFU
1
Underflow Flag
Status flag that indicates that TCNT underflow has
occurred when channels 1 and 2 are set to phase
counting mode. Only 0 can be written, for flag clearing.
In channel 0, bit 5 is reserved. It is always read as 0 and
cannot be modified.
[Setting condition]
When the TCNT value underflows (changes from H'0000
to H'FFFF)
[Clearing condition]
When 0 is written to TCFU after reading TCFU = 1
H8S/2264 Group:
Reserved
This bit is always read as 0 and cannot be modified.
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Section 10 16-Bit Timer Pulse Unit (TPU)
Bit
4
Bit Name
TCFV
Initial
value
R/W
0
1
R/(W)* Overflow Flag
Description
Status flag that indicates that TCNT overflow has
occurred. Only 0 can be written, for flag clearing.
[Setting condition]
When the TCNT value overflows (changes from H'FFFF
to H'0000 )
[Clearing condition]
3
TGFD
0
When 0 is written to TCFV after reading TCFV = 1
1
*
R/(W) H8S/2268 Group:
Input Capture/Output Compare Flag D
Status flag that indicates the occurrence of TGRD input
capture or compare match in channel 0. Only 0 can be
written, for flag clearing. In channels 1 and 2, bit 3 is
reserved. It is always read as 0 and cannot be modified.
[Setting conditions]
•
When TCNT = TGRD and TGRD is functioning as
output compare register
•
When TCNT value is transferred to TGRD by input
capture signal and TGRD is functioning as input
capture register
[Clearing conditions]
•
When DTC is activated by TGID interrupt and the
DISEL bit of MRB in DTC is 0 with the transfer
counter other than 0
•
When 0 is written to TGFD after reading TGFD = 1
H8S/2264 Group:
Reserved
This bit is always read as 0 and cannot be modified.
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Section 10 16-Bit Timer Pulse Unit (TPU)
Bit
2
Bit Name
TGFC
Initial
value
R/W
0
1
R/(W)* H8S/2268 Group:
Description
Input Capture/Output Compare Flag C
Status flag that indicates the occurrence of TGRC input
capture or compare match in channel 0. Only 0 can be
written, for flag clearing. In channels 1 and 2, bit 2 is
reserved. It is always read as 0 and cannot be modified.
[Setting conditions]
•
When TCNT = TGRC and TGRC is functioning as
output compare register
•
When TCNT value is transferred to TGRC by input
capture signal and TGRC is functioning as input
capture register
[Clearing conditions]
•
When DTC is activated by TGIC interrupt and the
DISEL bit of MRB in DTC is 0 with the transfer
counter other than 0
•
When 0 is written to TGFC after reading TGFC = 1
H8S/2264 Group:
Reserved
This bit is always read as 0 and cannot be modified.
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Section 10 16-Bit Timer Pulse Unit (TPU)
Bit
1
Bit Name
TGFB
Initial
value
R/W
0
1
R/(W)* Input Capture/Output Compare Flag B
Description
Status flag that indicates the occurrence of TGRB input
capture or compare match. Only 0 can be written, for flag
clearing.
[Setting conditions]
•
When TCNT = TGRB and TGRB is functioning as
output compare register
•
When TCNT value is transferred to TGRB by input
capture signal and TGRB is functioning as input
capture register
[Clearing conditions]
•
0
TGFA
0
2
When DTC* is activated by TGIB interrupt and the
2
DISEL bit of MRB in DTC* is 0 with the transfer
counter other than 0
• When 0 is written to TGFB after reading TGFB = 1
1
*
R/(W) Input Capture/Output Compare Flag A
Status flag that indicates the occurrence of TGRA input
capture or compare match. Only 0 can be written, for flag
clearing.
[Setting conditions]
•
When TCNT = TGRA and TGRA is functioning as
output compare register
•
When TCNT value is transferred to TGRA by input
capture signal and TGRA is functioning as input
capture register
[Clearing conditions]
•
•
2
When DTC* is activated by TGIA interrupt and the
2
DISEL bit of MRB in DTC* is 0 with the transfer
counter other than 0
When 0 is written to TGFA after reading TGFA = 1
Notes: 1. Only 0 can be written to this bit to clear the flag.
2. Supported only by the H8S/2268 Group.
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Section 10 16-Bit Timer Pulse Unit (TPU)
10.3.6
Timer Counter (TCNT)
The TCNT registers are 16-bit readable/writable counters. The H8S/2268 Group TPU has three
TCNT counters and the H8S/2264 Group TPU has two TCNT counters, one for each channel
(H8S/2268 Group: channels 0 to 2, H8S/2264 Group: channels 1and 2).
The TCNT counters are initialized to H'0000 by a reset, or in hardware standby mode.
The TCNT counters cannot be accessed in 8-bit units; they must always be accessed as a 16-bit
unit.
10.3.7
Timer General Register (TGR)
The TGR registers are dual function 16-bit readable/writable registers, functioning as either output
compare or input capture registers. The H8S/2268 Group TPU has eight TGR registers and the
H8S/2264 Group TPU has four TGR registers, four for channel 0 and two each for channels 1 and
2. TGR is initialized to H'FFFF at reset or in hardware standby mode. The TGR registers cannot
be accessed in 8-bit units; they must always be accessed as a 16-bit unit. In the H8S/2268 Group,
TGRC and TGRD for channel 0 can also be designated for operation as buffer registers. TGR
buffer register combinations are TGRA⎯TGRC and TGRB⎯TGRD.
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Section 10 16-Bit Timer Pulse Unit (TPU)
10.3.8
Timer Start Register (TSTR)
TSTR selects operation/stoppage for channels 0 to 2 in the H8S/2268 Group and for channels 1
and 2 in the H8S/2264 Group. When setting the operating mode in TMDR or setting the count
clock in TCR, first stop the TCNT counter.
Bit
Bit Name
Initial
value
R/W
Description
7 to 3
⎯
All 0
⎯
Reserved
The write value should always be 0.
2
CST2
0
R/W
Counter Start 0 to 2 (CST0 to CST2)
1
CST1
0
R/W
These bits select operation or stoppage for TCNT.
0
CST0*
0
R/W
If 0 is written to the CST bit during operation with the
TIOC pin designated for output, the counter stops but the
TIOC pin output compare output level is retained. If TIOR
is written to when the CST bit is cleared to 0, the pin
output level will be changed to the set initial output value.
0: TCNT_n count operation is stopped
1: TCNT_n performs count operation
(n = 0 to 2)
Note: * In the H8S/2264 Group, this bit is reserved. The write value should always be 0.
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Section 10 16-Bit Timer Pulse Unit (TPU)
10.3.9
Timer Synchro Register (TSYR)
TSYR selects independent operation or synchronous operation of the TCNT counters for channels
0 to 2 in the H8S/2268 Group and for channels 1 and 2 in the H8S/2264 Group. A channel
performs synchronous operation when the corresponding bit in TSYR is set to 1.
Bit
Bit Name
Initial
value
R/W
Description
7 to 3
⎯
0
⎯
Reserved
The write value should always be 0.
2
SYNC2
0
R/W
Timer Synchro 0 to 2
1
SYNC1
0
R/W
0
SYNC0*
0
R/W
These bits are used to select whether operation is
independent of or synchronized with other channels.
When synchronous operation is selected, the TCNT
synchronous presetting of multiple channels, and
synchronous clearing by counter clearing on another
channel, are possible.
To set synchronous operation, the SYNC bits for at least
two channels must be set to 1. To set synchronous
clearing, in addition to the SYNC bit , the TCNT clearing
source must also be set by means of bits CCLR0 to
CCLR2 in TCR.
0: TCNT_n operates independently (TCNT presetting/
clearing is unrelated to other channels)
1: TCNT_n performs synchronous operation
TCNT synchronous presetting/synchronous clearing
is possible
(n = 0 to 2)
Note: * In the H8S/2264 Group, this bit is reserved. The write value should always be 0.
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Section 10 16-Bit Timer Pulse Unit (TPU)
10.4
Interface to Bus Master
10.4.1
16-Bit Registers
TCNT and TGR are 16-bit registers. As the data bus to the master is 16 bits wide, these registers
can be read or written to in 8-bit units; 16-bit access must always be used.
An example of 16-bit register access operation is shown in figure 10.3.
Bus master
Internal data bus
H
L
Module data bus
Bus interface
TCNTH
TCNTL
Figure 10.3 16-Bit Register Access Operation [Bus Master ↔ TCNT (16 Bits)]
10.4.2
8-Bit Registers
Registers other than TCNT and TGR are 8-bit. As the data bus to the CPU is 16 bits wide, these
registers can be read and written to in 16-bit units. They can also be read and written to in 8-bit
units.
Examples of 8-bit register access operation are shown in figure 10.4, 10.5, and 10.6.
Internal data bus
Bus master
H
L
Module data bus
Bus interface
TCR
Figure 10.4 8-Bit Register Access Operation [Bus Master ↔ TCR (Upper 8 Bits)]
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Section 10 16-Bit Timer Pulse Unit (TPU)
Bus master
Internal data bus
H
L
Module data bus
Bus interface
TMDR
Figure 10.5 8-Bit Register Access Operation [Bus Master ↔ TMDR (Lower 8 Bits)]
Bus master
Internal data bus
H
L
Module data bus
Bus interface
TCR
TMDR
Figure 10.6 8-Bit Register Access Operation [Bus Master ↔ TCR and TMDR (16 Bits)]
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Section 10 16-Bit Timer Pulse Unit (TPU)
10.5
Operation
10.5.1
Basic Functions
Each channel has a TCNT and TGR register. TCNT performs up-counting, and is also capable of
free-running operation, synchronous counting, and external event counting.
Each TGR can be used as an input capture register or output compare register.
Counter Operation: When one of bits CST0 to CST2 in the H8S/2268 Group or one of bits CST1
and CST2 in the H8S/2264 Group is set to 1 in TSTR, the TCNT counter for the corresponding
channel begins counting. TCNT can operate as a free-running counter, periodic counter, for
example.
1. Example of count operation setting procedure
Figure 10.7 shows an example of the count operation setting procedure.
Operation selection
Select counter clock
[1]
Periodic counter
Select counter clearing source
Free-running counter
[2]
[3]
Select output compare register
Set period
[4]
Start count operation
[5]
<Periodic counter>
Start count operation
<Free-running counter>
[1] Select the counter
clock with bits
TPSC2 to TPSC0 in
TCR. At the same
time, select the
input clock edge
with bits CKEG1
and CKEG0 in TCR.
[2] For periodic counter
operation, select the
TGR to be used as
the TCNT clearing
source with bits
CCLR2 to CCLR0* in
TCR.
[3] Designate the TGR
selected in [2] as an
output compare
register by means of
TIOR.
[4] Set the periodic
counter cycle in the
TGR selected in [2].
[5] Set the CST bit in
TSTR to 1 to start
the counter
operation.
Note: * In the H8S/2264 Group, bits
CCLR1 and CCLR0 in TCR.
Figure 10.7 Example of Counter Operation Setting Procedure
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Section 10 16-Bit Timer Pulse Unit (TPU)
2. Free-running count operation and periodic count operation
Immediately after a reset, the TPU’s TCNT counters are all designated as free-running
counters. When the relevant bit in TSTR is set to 1 the corresponding TCNT counter starts upcount operation as a free-running counter. When TCNT overflows (from H'FFFF to H'0000),
the TCFV bit in TSR is set to 1. If the value of the corresponding TCIEV bit in TIER is 1 at
this point, the TPU requests an interrupt. After overflow, TCNT starts counting up again from
H'0000.
Figure 10.8 illustrates free-running counter operation.
TCNT value
H'FFFF
H'0000
Time
CST bit
TCFV
Figure 10.8 Free-Running Counter Operation
When compare match is selected as the TCNT clearing source, the TCNT counter for the relevant
channel performs periodic count operation. The TGR register for setting the period is designated
as an output compare register, and counter clearing by compare match is selected by means of bits
CCLR0 to CCLR2 in the H8S/2268 Group TCR or bits CCLR0 and CCLR1 in the H8S/2264
Group TCR. After the settings have been made, TCNT starts up-count operation as a periodic
counter when the corresponding bit in TSTR is set to 1. When the count value matches the value
in TGR, the TGF bit in TSR is set to 1 and TCNT is cleared to H'0000.
If the value of the corresponding TGIE bit in TIER is 1 at this point, the TPU requests an interrupt.
After a compare match, TCNT starts counting up again from H'0000.
Figure 10.9 illustrates periodic counter operation.
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Section 10 16-Bit Timer Pulse Unit (TPU)
Counter cleared by TGR
compare match
TCNT value
TGR
H'0000
Time
CST bit
Flag cleared by software or
DTC* activation
TGF
Note: * Supported only by the H8S/2268 Group.
Figure 10.9 Periodic Counter Operation
Waveform Output by Compare Match: The TPU can perform 0, 1, or toggle output from the
corresponding output pin using compare match.
1. Example of setting procedure for waveform output by compare match
Figure 10.10 shows an example of the setting procedure for waveform output by compare
match.
Input selection
[1]
[2]
[3]
Select waveform output mode
Set output timing
[1] Select initial value 0 output or 1 output, and
compare match output value 0 output, 1 output,
or toggle output, by means of TIOR. The set
initial value is output at the TIOC pin unit the
first compare match occurs.
[2] Set the timing for compare match generation in
TGR.
[3] Set the CST bit in TSTR to 1 to start the count
operation.
Start count operation
< Waveform output >
Figure 10.10 Example of Setting Procedure for Waveform Output by Compare Match
2. Examples of waveform output operation
Figure 10.11 shows an example of 0 output/1 output.
In this example TCNT has been designated as a free-running counter, and settings have been
made such that 1 is output by compare match A, and 0 is output by compare match B. When
the set level and the pin level coincide, the pin level does not change.
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Section 10 16-Bit Timer Pulse Unit (TPU)
TCNT value
H'FFFF
TGRA
TGRB
Time
H'0000
No change
No change
1 output
TIOCA
No change
TIOCB
No change
0 output
Figure 10.11 Example of 0 Output/1 Output Operation
Figure 10.12 shows an example of toggle output.
In this example, TCNT has been designated as a periodic counter (with counter clearing on
compare match B), and settings have been made such that the output is toggled by both
compare match A and compare match B.
TCNT value
Counter cleared by TGRB compare match
H'FFFF
TGRB
TGRA
Time
H'0000
Toggle output
TIOCB
Toggle output
TIOCA
Figure 10.12 Example of Toggle Output Operation
Input Capture Function: The TCNT value can be transferred to TGR on detection of the TIOC
pin input edge.
Rising edge, falling edge, or both edges can be selected as the detected edge.
1. Example of input capture operation setting procedure
Figure 10.13 shows an example of the input capture operation setting procedure.
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Section 10 16-Bit Timer Pulse Unit (TPU)
Input selection
Select input capture input
Start count
[1] Designate TGR as an input capture register by
means of TIOR, and select rising edge, falling
edge, or both edges as the input capture source
and input signal edge.
[2] Set the CST bit in TSTR to 1 to start the count
operation.
[1]
[2]
<Input capture operation>
Figure 10.13 Example of Input Capture Operation Setting Procedure
2. Example of input capture operation
Figure 10.14 shows an example of input capture operation.
In this example both rising and falling edges have been selected as the TIOCA pin input
capture input edge, the falling edge has been selected as the TIOCB pin input capture input
edge, and counter clearing by TGRB input capture has been designated for TCNT.
Counter cleared by TIOCB
input (falling edge)
TCNT value
H'0180
H'0160
H'0010
H'0005
Time
H'0000
TIOCA
TGRA
H'0005
H'0160
H'0010
TIOCB
TGRB
H'0180
Figure 10.14 Example of Input Capture Operation
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Section 10 16-Bit Timer Pulse Unit (TPU)
10.5.2
Synchronous Operation
In synchronous operation, the values in a number of TCNT counters can be rewritten
simultaneously (synchronous presetting). Also, a number of TCNT counters can be cleared
simultaneously by making the appropriate setting in TCR (synchronous clearing).
Synchronous operation enables TGR to be incremented with respect to a single time base.
Channels 0 to 2 in the H8S/2268 Group or channels 1 and 2 in the H8S/2264 Group can all be
designated for synchronous operation.
Example of Synchronous Operation Setting Procedure: Figure 10.15 shows an example of the
synchronous operation setting procedure.
Synchronous operation
selection
Set synchronous
operation
[1]
Synchronous presetting
Set TCNT
Synchronous clearing
[2]
Clearing
source generation
channel?
No
Yes
<Synchronous presetting>
Select counter
clearing source
[3]
Set synchronous
counter clearing
[4]
Start count
[5]
Start count
[5]
<Counter clearing>
<Synchronous clearing>
[1] Set to 1 the SYNC bits in TSYR corresponding to the channels to be designated for synchronous
operation.
[2] When the TCNT counter of any of the channels designated for synchronous operation is
written to, the same value is simultaneously written to the other TCNT counters.
[3] Use bits CCLR2 to CCLR0* in TCR to specify TCNT clearing by input capture/output compare,
etc.
[4] Use bits CCLR2 to CCLR0* in TCR to designate synchronous clearing for the counter clearing
source.
[5] Set to 1 the CST bits in TSTR for the relevant channels, to start the count operation.
Note: * In the H8S/2264 Group, bits CCRL1 and CCLR0 in TCR.
Figure 10.15 Example of Synchronous Operation Setting Procedure
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Section 10 16-Bit Timer Pulse Unit (TPU)
Example of Synchronous Operation: Figure 10.16 shows an example of synchronous operation.
In this example, synchronous operation and PWM mode 1 have been designated for channels 0 to
2 in the H8S/2268 Group, TGRB_0 compare match has been set as the channel 0 counter clearing
source, and synchronous clearing has been set for the channel 1 and 2 counter clearing source.
Three-phase PWM waveforms are output from pins TIOC0A, TIOC1A, and TIOC2A. At this
time, synchronous presetting, and synchronous clearing by TGRB_0 compare match, are
performed for channel 0 to 2 TCNT counters, and the data set in TGRB_0 is used as the PWM
cycle.
For details on PWM modes, see section 10.5.4, PWM Modes.
Synchronous clearing by TGRB_0 compare match
TCNT0 to TCNT2 values
TGRB_0
TGRB_1
TGRA_0
TGRB_2
TGRA_1
TGRA_2
Time
H'0000
TIOCA0
TIOCA1
TIOCA2
Figure 10.16 Example of Synchronous Operation
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Section 10 16-Bit Timer Pulse Unit (TPU)
10.5.3
Buffer Operation (H8S/2268 Group Only)
Buffer operation, provided for channel 0, enables TGRC and TGRD to be used as buffer registers.
Buffer operation differs depending on whether TGR has been designated as an input capture
register or as a compare match register.
Table 10.17 shows the register combinations used in buffer operation.
Table 10.17 Register Combinations in Buffer Operation
Channel
Timer General Register
Buffer Register
0
TGRA_0
TGRC_0
TGRB_0
TGRD_0
• When TGR is an output compare register
When a compare match occurs, the value in the buffer register for the corresponding channel is
transferred to the timer general register.
This operation is illustrated in figure 10.17.
Compare match signal
Timer general
register
Buffer register
Comparator
TCNT
Figure 10.17 Compare Match Buffer Operation
• When TGR is an input capture register
When input capture occurs, the value in TCNT is transferred to TGR and the value previously
held in the timer general register is transferred to the buffer register.
This operation is illustrated in figure 10.18.
Input capture
signal
Buffer register
Timer general
register
TCNT
Figure 10.18 Input Capture Buffer Operation
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Section 10 16-Bit Timer Pulse Unit (TPU)
Example of Buffer Operation Setting Procedure: Figure 10.19 shows an example of the buffer
operation setting procedure.
Buffer operation
Select TGR function
[1]
Set buffer operation
[2]
Start count
[3]
[1] Designate TGR as an input capture register or
output compare register by means of TIOR.
[2] Designate TGR for buffer operation with bits
BFA and BFB in TMDR.
[3] Set the CST bit in TSTR to 1 start the count
operation.
<Buffer operation>
Figure 10.19 Example of Buffer Operation Setting Procedure
Examples of Buffer Operation:
1. When TGR is an output compare register
Figure 10.20 shows an operation example in which PWM mode 1 has been designated for
channel 0, and buffer operation has been designated for TGRA and TGRC. The settings used
in this example are TCNT clearing by compare match B, 1 output at compare match A, and 0
output at compare match B.
As buffer operation has been set, when compare match A occurs the output changes and the
value in buffer register TGRC is simultaneously transferred to timer general register TGRA.
This operation is repeated each time that compare match A occurs.
For details on PWM modes, see section 10.5.4, PWM Modes.
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Section 10 16-Bit Timer Pulse Unit (TPU)
TCNT value
TGRB_0
H'0520
H'0450
H'0200
TGRA_0
Time
H'0000
TGRC_0 H'0200
H'0450
H'0520
Transfer
TGRA_0
H'0200
H'0450
TIOCA
Figure 10.20 Example of Buffer Operation (1)
2. When TGR is an input capture register
Figure 10.21 shows an operation example in which TGRA has been designated as an input
capture register, and buffer operation has been designated for TGRA and TGRC.
Counter clearing by TGRA input capture has been set for TCNT, and both rising and falling
edges have been selected as the TIOCA pin input capture input edge.
As buffer operation has been set, when the TCNT value is stored in TGRA upon the
occurrence of input capture A, the value previously stored in TGRA is simultaneously
transferred to TGRC.
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Section 10 16-Bit Timer Pulse Unit (TPU)
TCNT value
H'0F07
H'09FB
H'0532
H'0000
Time
TIOCA
TGRA
H'0532
TGRC
H'0F07
H'09FB
H'0532
H'0F07
Figure 10.21 Example of Buffer Operation (2)
10.5.4
PWM Modes
In PWM mode, PWM waveforms are output from the output pins. The output level can be selected
as 0, 1, or toggle output in response to a compare match of each TGR.
Designating TGR compare match as the counter clearing source enables the period to be set in that
register. All channels can be designated for PWM mode independently. Synchronous operation is
also possible.
There are two PWM modes, as described below.
• PWM mode 1
H8S/2268 Group:
PWM output is generated from the TIOCA and TIOCC pins by pairing TGRA with TGRB and
TGRC with TGRD. The output specified by bits IOA0 to IOA3 and IOC0 to IOC3 in TIOR is
output from the TIOCA and TIOCC pins at compare matches A and C, and the output
specified by bits IOB0 to IOB3 and IOD0 to IOD3 in TIOR is output at compare matches B
and D. The initial output value is the value set in TGRA or TGRC. If the set values of paired
TGRs are identical, the output value does not change when a compare match occurs.
In PWM mode 1, PWM output is enable up to 4 phases.
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Section 10 16-Bit Timer Pulse Unit (TPU)
H8S/2264 Group:
PWM output is generated from the TIOCA pin by pairing TGRA with TGRB. The output
specified by bits IOA0 to IOA3 in TIOR is output from the TIOCA pin at compare match A,
and the output specified by bits IOB0 to IOB3 in TIOR is output at compare match B. The
initial output value is the value set in TGRA. If the set values of paired TGRs are identical, the
output value does not change when a compare match occurs.
In PWM mode 1, PWM output is enable up to 2 phases.
• PWM mode 2
PWM output is generated using one TGR as the cycle register and the others as duty registers.
The output specified in TIOR is performed by means of compare matches. Upon counter
clearing by a synchronization register compare match, the output value of each pin is the initial
value set in TIOR. If the set values of the cycle and duty registers are identical, the output
value does not change when a compare match occurs.
In PWM mode 2, PWM output is enabled up to 7 phases in the H8S/2268 Group or 3 phases in
the H8S/2264 Group by using also synchronous operation.
The correspondence between PWM output pins and registers is shown in table 10.18.
Table 10.18 PWM Output Registers and Output Pins
Output Pins
Channel
Registers
PWM Mode 1
PWM Mode 2*
0*
TGRA_0
TIOCA0
TIOCA0
1
TGRB_0
TGRC_0
TIOCB0
TIOCC0
TGRD_0
1
TGRA_1
TGRA_2
TGRB_2
TIOCC0
TIOCD0
TIOCA1
TGRB_1
2
2
TIOCA1
TIOCB1
TIOCA2
TIOCA2
TIOCB2
Notes: 1. Supported only by the H8S/2268 Group.
2. In PWM mode 2, PWM output is not possible for the TGR register in which the period is
set.
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Section 10 16-Bit Timer Pulse Unit (TPU)
Example of PWM Mode Setting Procedure: Figure 10.22 shows an example of the PWM mode
setting procedure.
PWM mode
Select counter clock
[1]
Select counter clearing source
[2]
Select waveform output level
[3]
Set TGR
[4]
Set PWM mode
[5]
Start count
[6]
[1] Select the counter clock with bits TPSC2 to
TPSC0 in TCR. At the same time, select the
input clock edge with bits CKEG1 and CKEG0
in TCR.
[2] Use bits CCLR2 to CCLR0* in TCR to select the
TGR to be used as the TCNT clearing source.
[3] Use TIOR to designate the TGR as an output
compare register, and select the initial value and
output value.
[4] Set the cycle in the TGR selected in [2], and set
the duty in the other the TGR.
[5] Select the PWM mode with bits MD3 to MD0 in
TMDR.
[6] Set the CST bit in TSTR to 1 start the count
operation.
Note: * In the H8S/2264 Group, bits CCLR1 and
CCLR0 in TCR.
<PWM mode>
Figure 10.22 Example of PWM Mode Setting Procedure
Examples of PWM Mode Operation: Figure 10.23 shows an example of PWM mode 1
operation.
In this example, TGRA compare match is set as the TCNT clearing source, 0 is set for the TGRA
initial output value and output value, and 1 is set as the TGRB output value.
In this case, the value set in TGRA is used as the period, and the values set in the TGRB registers
are used as the duty levels.
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Section 10 16-Bit Timer Pulse Unit (TPU)
TCNT value
Counter cleared by
TGRA compare match
TGRA
TGRB
H'0000
Time
TIOCA
Figure 10.23 Example of PWM Mode Operation (1)
Figure 10.24 shows an example of PWM mode 2 operation.
In this example, synchronous operation is designated for channels 0 and 1, TGRB_1 compare
match is set as the TCNT clearing source, and 0 is set for the initial output value and 1 for the
output value of the other TGR registers (TGRA_0 to TGRD_0, TGRA_1), outputting a 5-phase
PWM waveform, in the H8S/2268 Group.
In this case, the value set in TGRB_1 is used as the cycle, and the values set in the other TGRs are
used as the duty levels.
TCNT value
Counter cleared by
TGRB_1 compare match
TGRB_1
TGRA_1
TGRD_0
TGRC_0
TGRB_0
TGRA_0
H'0000
Time
TIOCA0
TIOCB0
TIOCC0
TIOCD0
TIOCA1
Figure 10.24 Example of PWM Mode Operation (2)
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Section 10 16-Bit Timer Pulse Unit (TPU)
Figure 10.25 shows examples of PWM waveform output with 0% duty and 100% duty in PWM
mode.
TCNT value
TGRB rewritten
TGRA
TGRB
TGRB rewritten
TGRB
rewritten
H'0000
Time
0% duty
TIOCA
Output does not change when cycle register and duty register
compare matches occur simultaneously
TCNT value
TGRB rewritten
TGRA
TGRB rewritten
TGRB rewritten
TGRB
H'0000
Time
100% duty
TIOCA
Output does not change when cycle register and duty
register compare matches occur simultaneously
TCNT value
TGRB rewritten
TGRA
TGRB rewritten
TGRB
TGRB rewritten
Time
H'0000
100% duty
TIOCA
0% duty
Figure 10.25 Example of PWM Mode Operation (3)
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Section 10 16-Bit Timer Pulse Unit (TPU)
10.5.5
Phase Counting Mode (H8S/2268 Group Only)
In phase counting mode, the phase difference between two external clock inputs is detected and
TCNT is incremented/decremented accordingly. This mode can be set for channels 1 and 2.
When phase counting mode is set, an external clock is selected as the counter input clock and
TCNT operates as an up/down-counter regardless of the setting of bits TPSC0 to TPSC2 and bits
CKEG0 and CKEG1 in TCR. However, the functions of bits CCLR0 and CCLR1 in TCR, and of
TIOR, TIER, and TGR, are valid, and input capture/compare match and interrupt functions can be
used.
If overflow occurs when TCNT is counting up, the TCFV flag in TSR is set; if underflow occurs
when TCNT is counting down, the TCFU flag is set.
The TCFD bit in TSR is the count direction flag. Reading the TCFD flag reveals whether TCNT is
counting up or down.
Table 10.19 shows the correspondence between external clock pins and channels.
Table 10.19 Phase Counting Mode Clock Input Pins
External Clock Pins
Channels
A-Phase
B-Phase
When channel 1 is set to phase counting mode
TCLKA
TCLKB
When channel 2 is set to phase counting mode
TCLKC
TCLKD
Example of Phase Counting Mode Setting Procedure: Figure 10.26 shows an example of the
phase counting mode setting procedure.
[1] Select phase counting mode with bits MD3 to
MD0 in TMDR.
[2] Set the CST bit in TSTR to 1 to start the count
operation.
Phase counting mode
Select phase counting mode
[1]
Start count
[2]
<Phase counting mode>
Figure 10.26 Example of Phase Counting Mode Setting Procedure
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Section 10 16-Bit Timer Pulse Unit (TPU)
Examples of Phase Counting Mode Operation: In phase counting mode, TCNT counts up or
down according to the phase difference between two external clocks. There are four modes,
according to the count conditions.
1. Phase counting mode 1
Figure 10.27 shows an example of phase counting mode 1 operation, and table 10.20
summarizes the TCNT up/down-count conditions.
TCLKA(channel 1)
TCLKC(channel 2)
TCLKB(channel 1)
TCLKD(channel 2)
TCNT value
Down-count
Up-count
Time
Figure 10.27 Example of Phase Counting Mode 1 Operation
Table 10.20 Up/Down-Count Conditions in Phase Counting Mode 1
TCLKA (Channel 1)
TCLKC (Channel 2)
TCLKB (Channel 1)
TCLKD (Channel 2)
Operation
Up-count
High level
Low level
Low level
High level
High level
Down-count
Low level
High level
Low level
Legend:
: Rising edge
: Falling edge
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Section 10 16-Bit Timer Pulse Unit (TPU)
2. Phase counting mode 2
Figure 10.28 shows an example of phase counting mode 2 operation, and table 10.21
summarizes the TCNT up/down-count conditions.
TCLKA(channel 1)
TCLKC(channel 2)
TCLKB(channel 1)
TCLKD(channel 2)
TCNT value
Up-count
Down-count
Time
Figure 10.28 Example of Phase Counting Mode 2 Operation
Table 10.21 Up/Down-Count Conditions in Phase Counting Mode 2
TCLKA (Channel 1)
TCLKC (Channel 2)
TCLKB (Channel 1)
TCLKD (Channel 2)
Operation
High level
Don’t care
Low level
Don’t care
Low level
Don’t care
High level
Up-count
High level
Don’t care
Low level
Don’t care
High level
Don’t care
Low level
Down-count
Legend:
: Rising edge
: Falling edge
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Section 10 16-Bit Timer Pulse Unit (TPU)
3. Phase counting mode 3
Figure 10.29 shows an example of phase counting mode 3 operation, and table 10.22
summarizes the TCNT up/down-count conditions.
TCLKA(channel 1)
TCLKC(channel 2)
TCLKB(channel 1)
TCLKD(channel 2)
TCNT value
Down-count
Up-count
Time
Figure 10.29 Example of Phase Counting Mode 3 Operation
Table 10.22 Up/Down-Count Conditions in Phase Counting Mode 3
TCLKA (Channel 1)
TCLKC (Channel 2)
TCLKB (Channel 1)
TCLKD (Channel 2)
Operation
High level
Don’t care
Low level
Don’t care
Low level
Don’t care
High level
Up-count
High level
Down-count
Low level
Don’t care
High level
Don’t care
Low level
Don’t care
Legend:
: Rising edge
: Falling edge
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Section 10 16-Bit Timer Pulse Unit (TPU)
4. Phase counting mode 4
Figure 10.30 shows an example of phase counting mode 4 operation, and table 10.23
summarizes the TCNT up/down-count conditions.
TCLKA(channels 1)
TCLKC(channels 2)
TCLKB(channels 1)
TCLKD(channels 2)
TCNT value
Down-count
Up-count
Time
Figure 10.30 Example of Phase Counting Mode 4 Operation
Table 10.23 Up/Down-Count Conditions in Phase Counting Mode 4
TCLKA (Channel 1)
TCLKC (Channel 2)
TCLKB (Channel 1)
TCLKD (Channel 2)
High level
Operation
Up-count
Low level
Low level
Don’t care
High level
High level
Down-count
Low level
High level
Don’t care
Low level
Legend:
: Rising edge
: Falling edge
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Section 10 16-Bit Timer Pulse Unit (TPU)
10.6
Interrupt Sources
There are three kinds of TPU interrupt source for the H8S/2268 Group; TGR input
capture/compare match, TCNT overflow, and TCNT underflow. There are two kinds of TPU
interrupt source for the H8S/2264 Group; TGR input capture/compare match and TCNT overflow.
Each interrupt source has its own status flag and enable/disabled bit, allowing the generation of
interrupt request signals to be enabled or disabled individually.
When an interrupt request is generated, the corresponding status flag in TSR is set to 1. If the
corresponding enable/disable bit in TIER is set to 1 at this time, an interrupt is requested. The
interrupt request is cleared by clearing the status flag to 0.
In the H8S/2268 Group, relative channel priorities can be changed by the interrupt controller,
however the priority order within a channel is fixed. For details, see section 5, Interrupt Controller.
Table 10.24 lists the TPU interrupt sources.
Table 10.24 TPU Interrupts
Channel Name
Interrupt Source
Interrupt Flag
DTC
Activation*
Priority Level
0*
TGI0A
TGRA_0 input capture/compare match
TGFA_0
Possible
High
TGI0B
TGRB_0 input capture/compare match
TGFB_0
Possible
TGI0C
TGRC_0 input capture/compare match
TGFC_0
Possible
TGI0D
TGRD_0 input capture/compare match
TGFD_0
Possible
1
2
TCI0V
TCNT_0 overflow
TCFV_0
Not possible
TGI1A
TGRA_1 input capture/compare match
TGFA_1
Possible
TGI1B
TGRB_1 input capture/compare match
TGFB_1
Possible
TCI1V
TCNT_1 overflow
TCFV_1
Not possible
TCI1U*
TCNT_1 underflow
TCFU_1
Not possible
TGI2A
TGRA_2 input capture/compare match
TGFA_2
Possible
TGI2B
TGRB_2 input capture/compare match
TGFB_2
Possible
TCI2V
TCNT_2 overflow
TCFV_2
Not possible
TCI2U*
TCNT_2 underflow
TCFU_2
Not possible
Note: * Supported only by the H8S/2268 Group.
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Low
Section 10 16-Bit Timer Pulse Unit (TPU)
Input Capture/Compare Match Interrupt: An interrupt is requested if the TGIE bit in TIER is
set to 1 when the TGF flag in TSR is set to 1 by the occurrence of a TGR input capture/compare
match on a particular channel. The interrupt request is cleared by clearing the TGF flag to 0. The
H8S/2268 Group TPU has eight input capture/compare match interrupts and the H8S/2264 Group
TPU has four input capture/compare match interrupts, four for channel 0, and two each for
channels 1 and 2.
Overflow Interrupt: An interrupt is requested if the TCIEV bit in TIER is set to 1 when the
TCFV flag in TSR is set to 1 by the occurrence of TCNT overflow on a channel. The interrupt
request is cleared by clearing the TCFV flag to 0. The H8S/2268 Group TPU has three overflow
interrupts and the H8S/2264 Group TPU has two overflow interrupts, one for each channel
(channels 0 to 2, or 1 and 2).
Underflow Interrupt (H8S/2268 Group Only): An interrupt is requested if the TCIEU bit in
TIER is set to 1 when the TCFU flag in TSR is set to 1 by the occurrence of TCNT underflow on a
channel. The interrupt request is cleared by clearing the TCFU flag to 0. The TPU has two
underflow interrupts, one each for channels 1 and 2.
10.7
DTC Activation (H8S/2268 Group Only)
The DTC can be activated by the TGR input capture/compare match interrupt for a channel. For
details, see section 8, Data Transfer Controller (DTC).
A total of eight TPU input capture/compare match interrupts can be used as DTC activation
sources, four for channel 0, and two each for channels 1 and 2.
10.8
A/D Converter Activation
The A/D converter can be activated by the TGRA input capture/compare match for a channel.
If the TTGE bit in TIER is set to 1 when the TGFA flag in TSR is set to 1 by the occurrence of a
TGRA input capture/compare match on a particular channel, a request to begin A/D conversion is
sent to the A/D converter. If the TPU conversion start trigger has been selected on the A/D
converter side at this time, A/D conversion is begun.
In the H8S/2268 Group TPU, a total of three TGRA input capture/compare match interrupts can
be used as A/D converter conversion start sources, one for each channel (channels 0 to 2). While
in the H8S/2264 Group TPU, a total of two TGRA input capture/compare match interrupts can be
used, one for each channel (channels 1 and 2).
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Section 10 16-Bit Timer Pulse Unit (TPU)
10.9
Operation Timing
10.9.1
Input/Output Timing
TCNT Count Timing: Figure 10.31 shows TCNT count timing in internal clock operation, and
figure 10.32 shows TCNT count timing in external clock operation.
φ
Internal clock
Falling edge
Rising edge
TCNT
input clock
N-1
TCNT
N
N+1
N+2
Figure 10.31 Count Timing in Internal Clock Operation
φ
External clock
Falling edge
Rising edge
Falling edge
TCNT
input clock
TCNT
N-1
N
N+1
N+2
Figure 10.32 Count Timing in External Clock Operation
Output Compare Output Timing: A compare match signal is generated in the final state in
which TCNT and TGR match (the point at which the count value matched by TCNT is updated).
When a compare match signal is generated, the output value set in TIOR is output at the output
compare output pin. After a match between TCNT and TGR, the compare match signal is not
generated until the TCNT input clock is generated.
Figure 10.33 shows output compare output timing.
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Section 10 16-Bit Timer Pulse Unit (TPU)
φ
TCNT
input clock
N
TCNT
N+1
N
TGR
Compare
match signal
TIOC pin
Figure 10.33 Output Compare Output Timing
Input Capture Signal Timing: Figure 10.34 shows input capture signal timing.
φ
Input capture
input
Input capture
signal
TCNT
TGR
N
N+1
N+2
N
N+2
Figure 10.34 Input Capture Input Signal Timing
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Section 10 16-Bit Timer Pulse Unit (TPU)
Timing for Counter Clearing by Compare Match/Input Capture: Figure 10.35 shows the
timing when counter clearing on compare match is specified, and figure 10.36 shows the timing
when counter clearing on input capture is specified.
φ
Compare
match signal
Counter
clear signal
TCNT
N
TGR
N
H'0000
Figure 10.35 Counter Clear Timing (Compare Match)
φ
Input capture
signal
Counter clear
signal
TCNT
N
H'0000
N
TGR
Figure 10.36 Counter Clear Timing (Input Capture)
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Section 10 16-Bit Timer Pulse Unit (TPU)
Buffer Operation Timing (H8S/2268 Group Only): Figures 10.37 and 10.38 show the timing in
buffer operation.
φ
n
TCNT
n+1
Compare
match signal
TGRA,
TGRB
n
TGRC,
TGRD
N
N
Figure 10.37 Buffer Operation Timing (Compare Match)
φ
Input capture
signal
TCNT
N
TGRA,
TGRB
n
TGRC,
TGRD
N+1
N
N+1
n
N
Figure 10.38 Buffer Operation Timing (Input Capture)
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Section 10 16-Bit Timer Pulse Unit (TPU)
10.9.2
Interrupt Signal Timing
TGF Flag Setting Timing in Case of Compare Match: Figure 10.39 shows the timing for
setting of the TGF flag in TSR on compare match, and TGI interrupt request signal timing.
φ
TCNT input
clock
TCNT
N
TGR
N
N+1
Compare
match signal
TGF flag
TGI interrupt
Figure 10.39 TGI Interrupt Timing (Compare Match)
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Section 10 16-Bit Timer Pulse Unit (TPU)
TGF Flag Setting Timing in Case of Input Capture: Figure 10.40 shows the timing for setting
of the TGF flag in TSR on input capture, and TGI interrupt request signal timing.
φ
Input capture
signal
TCNT
N
TGR
N
TGF flag
TGI interrupt
Figure 10.40 TGI Interrupt Timing (Input Capture)
TCFV Flag/TCFU Flag Setting Timing: Figure 10.41 shows the timing for setting of the TCFV
flag in TSR on overflow, and TCIV interrupt request signal timing.
Figure 10.42 shows the timing for setting of the TCFU flag in TSR on underflow, and TCIU
interrupt request signal timing in the H8S/2268 Group.
φ
TCNT input
clock
TCNT
(overflow)
H'FFFF
H'0000
Overflow
signal
TCFV flag
TCIV interrupt
Figure 10.41 TCIV Interrupt Setting Timing
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Section 10 16-Bit Timer Pulse Unit (TPU)
φ
TCNT
input clock
TCNT
(underflow)
H'0000
H'FFFF
Underflow
signal
TCFU flag
TCIU interrupt
Figure 10.42 TCIU Interrupt Setting Timing (H8S/2268 Group Only)
Status Flag Clearing Timing: After a status flag is read as 1 by the CPU, it is cleared by writing
0 to it. When the DTC is activated in the H8S/2268 Group, the flag is cleared automatically.
Figure 10.43 shows the timing for status flag clearing by the CPU, and figure 10.44 shows the
timing for status flag clearing by the DTC.
TSR write cycle
T1
T2
φ
TSR address
Address
Write signal
Status flag
Interrupt
request
signal
Figure 10.43 Timing for Status Flag Clearing by CPU
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Section 10 16-Bit Timer Pulse Unit (TPU)
DTC
read cycle
T1
T2
DTC
write cycle
T1
T2
φ
Address
Source address
Destination
address
Status flag
Interrupt
request
signal
Figure 10.44 Timing for Status Flag Clearing by DTC Activation (H8S/2268 Group Only)
10.10 Usage Notes
10.10.1 Module Stop Mode Setting
TPU operation can be disabled or enabled using the module stop control register. The initial
setting is for TPU operation to be halted. Register access is enabled by clearing module stop
mode. For details, refer to section 22, Power-Down Modes.
10.10.2 Input Clock Restrictions
The input clock pulse width must be at least 1.5 states in the case of single-edge detection, and at
least 2.5 states in the case of both-edge detection. The TPU will not operate properly at narrower
pulse widths.
In the H8S/2268 Group phase counting mode, the phase difference and overlap between the two
input clocks must be at least 1.5 states, and the pulse width must be at least 2.5 states. Figure
10.45 shows the input clock conditions in phase counting mode.
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Section 10 16-Bit Timer Pulse Unit (TPU)
Overlap
Phase
Phase
differdifference Overlap ence
Pulse width
Pulse width
TCLKA
(TCLKC)
TCLKB
(TCLKD)
Pulse width
Pulse width
Notes: Phase difference and overlap : 1.5 states or more
Pulse width
: 2.5 states or more
Figure 10.45 Phase Difference, Overlap, and Pulse Width in Phase Counting Mode
(H8S/2268 Group Only)
10.10.3 Caution on Period Setting
When counter clearing on compare match is set, TCNT is cleared in the final state in which it
matches the TGR value (the point at which the count value matched by TCNT is updated).
Consequently, the actual counter frequency is given by the following formula:
f=
φ
(N + 1)
Where f: Counter frequency
φ: Operating frequency
N: TGR set value
10.10.4 Contention between TCNT Write and Clear Operations
If the counter clear signal is generated in the T2 state of a TCNT write cycle, TCNT clearing takes
precedence and the TCNT write is not performed.
Figure 10.46 shows the timing in this case.
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Section 10 16-Bit Timer Pulse Unit (TPU)
TCNT write cycle
T1
T2
φ
TCNT address
Address
Write signal
Counter clear
signal
TCNT
N
H'0000
Figure 10.46 Contention between TCNT Write and Clear Operations
10.10.5 Contention between TCNT Write and Increment Operations
If incrementing occurs in the T2 state of a TCNT write cycle, the TCNT write takes precedence
and TCNT is not incremented.
Figure 10.47 shows the timing in this case.
TCNT write cycle
T1
T2
φ
TCNT address
Address
Write signal
TCNT input
clock
TCNT
N
M
TCNT write data
Figure 10.47 Contention between TCNT Write and Increment Operations
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Section 10 16-Bit Timer Pulse Unit (TPU)
10.10.6 Contention between TGR Write and Compare Match
If a compare match occurs in the T2 state of a TGR write cycle, the TGR write takes precedence
and the compare match signal is inhibited. A compare match does not occur even if the previous
value is written.
Figure 10.48 shows the timing in this case.
TGR write cycle
T1
T2
φ
TGR address
Address
Write signal
Compare
match signal
Inhibited
TCNT
N
N+1
TGR
N
M
TGR write data
Figure 10.48 Contention between TGR Write and Compare Match
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Section 10 16-Bit Timer Pulse Unit (TPU)
10.10.7 Contention between Buffer Register Write and Compare Match (H8S/2268 Group
Only)
If a compare match occurs in the T2 state of a TGR write cycle, the data that is transferred to TGR
by the buffer operation will be that in the buffer prior to the write.
Figure 10.49 shows the timing in this case.
TGR write cycle
T1
T2
φ
Buffer register
address
Address
Write signal
Compare
match signal
Buffer register write data
Buffer
register
TGR
N
M
N
Figure 10.49 Contention between Buffer Register Write and Compare Match
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Section 10 16-Bit Timer Pulse Unit (TPU)
10.10.8 Contention between TGR Read and Input Capture
If an input capture signal is generated in the T1 state of a TGR read cycle, the data that is read will
be that in the buffer after input capture transfer.
Figure 10.50 shows the timing in this case.
TGR read cycle
T1
T2
φ
TGR address
Address
Read signal
Input capture
signal
TGR
X
Internal
data bus
M
M
Figure 10.50 Contention between TGR Read and Input Capture
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Section 10 16-Bit Timer Pulse Unit (TPU)
10.10.9 Contention between TGR Write and Input Capture
If an input capture signal is generated in the T2 state of a TGR write cycle, the input capture
operation takes precedence and the write to TGR is not performed.
Figure 10.51 shows the timing in this case.
TGR write cycle
T1
T2
φ
Address
TGR address
Write signal
Input capture
signal
TCNT
TGR
M
M
Figure 10.51 Contention between TGR Write and Input Capture
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Section 10 16-Bit Timer Pulse Unit (TPU)
10.10.10 Contention between Buffer Register Write and Input Capture (H8S/2268 Group
Only)
If an input capture signal is generated in the T2 state of a buffer register write cycle, the buffer
operation takes precedence and the write to the buffer register is not performed.
Figure 10.52 shows the timing in this case.
Buffer register write cycle
T1
T2
φ
Buffer register
address
Address
Write signal
Input capture
signal
TCNT
TGR
Buffer
register
N
M
N
M
Figure 10.52 Contention between Buffer Register Write and Input Capture
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Section 10 16-Bit Timer Pulse Unit (TPU)
10.10.11 Contention between Overflow/Underflow and Counter Clearing
In the H8S/2268 Group, if overflow/underflow and counter clearing occur simultaneously, the
TCFV/TCFU flag in TSR is not set and TCNT clearing takes precedence.
In the H8S/2264 Group, if overflow and counter clearing occur simultaneously, the TCFV flag in
TSR is not set and TCNT clearing takes precedence.
Figure 10.53 shows the operation timing when a TGR compare match is specified as the clearing
source, and when H'FFFF is set in TGR.
φ
TCNT input
clock
TCNT
H'FFFF
H'0000
Counter
clear signal
TGF flag
TCFV flag
Prohibited
Figure 10.53 Contention between Overflow and Counter Clearing
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Section 10 16-Bit Timer Pulse Unit (TPU)
10.10.12 Contention between TCNT Write and Overflow/Underflow
In the H8S/2268 Group, if there is an up-count or down-count in the T2 state of a TCNT write
cycle and overflow/underflow occurs, the TCNT write takes precedence and the TCFV/TCFU flag
in TSR is not set.
In the H8S/2264 Group, if there is an up-count in the T2 state of a TCNT write cycle and overflow
occurs, the TCNT write takes precedence and the TCFV flag in TSR is not set.
Figure 10.54 shows the operation timing when there is contention between TCNT write and
overflow.
TCNT write cycle
T2
T1
φ
TCNT address
Address
Write signal
TCNT
TCNT write data
H'FFFF
TCFV flag
M
Prohibited
Figure 10.54 Contention between TCNT Write and Overflow
10.10.13 Multiplexing of I/O Pins
In the H8S/2268 Group, the TCLKA input pin is multiplexed with the TIOCC0 I/O pin, the
TCLKB input pin with the TIOCD0 I/O pin, the TCLKC input pin with the TIOCB1 I/O pin, and
the TCLKD input pin with the TIOCB2 I/O pin. In the H8S/2264 Group, the TCLKC input pin is
multiplexed with the TIOCB1 I/O pin. When an external clock is input, compare match output
should not be performed from a multiplexed pin.
10.10.14 Interrupts in Module Stop Mode
If module stop mode is entered when an interrupt has been requested, it will not be possible to
clear the CPU interrupt source, or the DTC activation source (the H8S/2268 Group only).
Interrupts should therefore be disabled before entering module stop mode.
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Section 11 8-Bit Timers
Section 11 8-Bit Timers
The H8S/2268 Group has an on-chip 8-bit timer module with four channels (TMR_0, TMR_1,
TMR_2 and TMR_3) operating on the basis of an 8-bit counter and an 8-bit reload timer with four
channels (TMR_4). The H8S/2264 Group has an on-chip 8-bit timer module with two channels
(TMR_0 and TMR_1) operating on the basis of an 8-bit counter.
11.1
8-Bit Timer Module (TMR_0, TMR_1, TMR_2, and TMR_3)
The 8-bit timer module can be used to count external events and be used as a multifunction timer
in a variety of applications, such as generation of counter reset, interrupt requests, and pulse
output with an arbitrary duty cycle using a compare-match signal with two registers.
11.1.1
Features
• Selection of clock sources
Selected from three internal clocks (φ/8, φ/64, and φ/8192) and an external clock.
• Selection of three ways to clear the counters
The counters can be cleared on compare-match A or B, or by an external reset signal.
• Timer output controlled by two compare-match signals
The timer output signal in each channel is controlled by two independent compare-match
signals, enabling the timer to be used for various applications, such as the generation of pulse
output or PWM output with an arbitrary duty cycle.
• Cascading of the two channels
The module can operate as a 16-bit timer using channel 0 (channel 2*) as the upper half and
channel 1 (channel 3*) as the lower half (16-bit count mode).
Channel 1 (channel 3*) can be used to count channel 0 (channel 2*) compare-match
occurrences (compare-match count mode).
• Multiple interrupt sources for each channel
Two compare-match interrupts and one overflow interrupt can be requested independently.
• Generation of A/D conversion start trigger
Channel 0 compare-match signal can be used as the A/D conversion start trigger.
• Module stop mode can be set
At initialization, the 8-bit timer operation is halted. Register access is enabled by canceling the
module stop mode.
Note: * Supported only by the H8S/2268 Group.
TIMH220B_000020020700
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Section 11 8-Bit Timers
Figure 11.1 shows a block diagram of the 8-bit timer module (TMR_0 and TMR_1).
Internal clock*
External clock
TMR0
φ/8
φ/64
φ/8192
TMCI01
Clock 1
Clock 0
Clock select
Compare-match A1
Compare-match A0 Comparator A_0
Overflow 1
Overflow 0
TMO
TMRI01
TCNT_0
TCORA_1
Comparator A_1
TCNT_1
Clear 0
Clear 1
Compare-match B1
Compare-match B0 Comparator B_0
TMO1
Comparator B_1
Control logic
TCORB_0
TCORB_1
TCSR_0
TCSR_1
TCR_0
TCR_1
A/D
CMIA0
CMIB0
OVI0
CMIA1
CMIB1
OVI1
Interrupt signals
Legend:
TCORA_0:
TCORB_0:
TCNT_0:
TCSR_0:
TCR_0:
TCORA_1:
TCORB_1:
TCNT_1:
TCSR_1:
TCR_1:
Time constant register A_0
Time constant register B_0
Timer counter_0
Timer control/status register_0
Timer control register_0
Time constant register A_1
Time constant register B_1
Timer counter_1
Timer control/status register_1
Timer control register_1
Note: * When a sub-clock is operating, φ will be φSUB.
Figure 11.1 Block Diagram of 8-Bit Timer Module
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Internal bus
TCORA_0
Section 11 8-Bit Timers
11.2
Input/Output Pins
Table 11.1 summarizes the input and output pins of the 8-bit timer module.
Table 11.1 Pin Configuration
Channel
Name
Symbol
I/O
Function
0
Timer output
TMO0
Output
Output controlled by compare-match
1
Timer output
TMO1
Output
Output controlled by compare-match
Common to
0 and 1
Timer clock input
TMCI01
Input
External clock input for the counter
Timer reset input
TMRI01
Input
External reset input for the counter
2*
Timer output
TMO2
Output
Output controlled by compare-match
3*
Timer output
TMO3
Output
Output controlled by compare-match
Common to
2 and 3*
Timer clock input
TMCI23
Input
External clock input for the counter
Timer reset input
TMRI23
Input
External reset input for the counter
Note: * Supported only by the H8S/2268 Group.
11.3
Register Descriptions
The 8-bit timer has the following registers. For details on the module stop register, refer to section
22.1.2, Module Stop Registers A to D (MSTPCRA to MSTPCRD).
• Timer counter_0 (TCNT_0)
• Time constant register A_0 (TCORA_0)
• Time constant register B_0 (TCORB_0)
• Timer control register_0 (TCR_0)
• Timer control/status register_0 (TCSR_0)
• Timer counter_1 (TCNT_1)
• Time constant register A_1 (TCORA_1)
• Time constant register B_1 (TCORB_1)
• Timer control register_1 (TCR_1)
• Timer control/status register_1 (TCSR_1)
• Timer counter_2 (TCNT_2)*
• Time constant register A_2 (TCORA_2)*
• Time constant register B_2 (TCORB_2)*
• Timer control register_2 (TCR_2)*
• Timer control/status register_2 (TCSR_2)*
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Section 11 8-Bit Timers
• Timer counter_3 (TCNT_3)*
• Time constant register A_3 (TCORA_3)*
• Time constant register B_3 (TCORB_3)*
• Timer control register_3 (TCR_3)*
• Timer control/status register_3 (TCSR_3)*
Note: * Supported only by the H8S/2268 Group.
11.3.1
Timer Counter (TCNT)
Each TCNT is an 8-bit up-counter. TCNT_0 and TCNT_1 (TCNT_2 and TCNT_3) comprise a
single 16-bit register, so they can be accessed together by word access.
TCNT increments on pulses generated from an internal or external clock source. This clock source
is selected by clock select bits CKS2 to CKS0 in TCR. TCNT can be cleared by an external reset
input signal or compare-match signals A and B. Counter clear bits CCLR1 and CCLR0 in TCR
select the method of clearing.
When TCNT overflows from H'FF to H'00, the overflow flag (OVF) in TCSR is set to 1.
11.3.2
Time Constant Register A (TCORA)
TCORA is an 8-bit readable/writable register. TCORA_0 and TCORA_1 (TCORA_2 and
TCORA_3) comprise a single 16-bit register, so they can be accessed together by word access.
TCORA is continually compared with the value in TCNT. When a match is detected, the
corresponding compare-match flag A (CMFA) in TCSR is set. Note, however, that comparison is
disabled during the T2 state of a TCORA write cycle.
The timer output from the TMO pin can be freely controlled by the compare-match signal A and
the settings of output select bits OS1 and OS0 in TCSR.
The initial value of TCORA is H'FF.
11.3.3
Time Constant Register B (TCORB)
TCORB is an 8-bit readable/writable register. TCORB_0 and TCORB_1 (TCORB_2 and
TCORB_3) comprise a single 16-bit register, so they can be accessed together by word access.
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Section 11 8-Bit Timers
TCORB is continually compared with the value in TCNT. When a match is detected, the
corresponding compare-match flag B (CMFB) in TCSR is set. Note, however, that comparison is
disabled during the T2 state of a TCORB write cycle.
The timer output from the TMO pin can be freely controlled by the compare-match signal B and
the settings of output select bits OS1 and OS0 in TCSR.
The initial value of TCORB is H'FF.
11.3.4
Timer Control Register (TCR)
TCR selects the TCNT clock source and the time at which TCNT is cleared, and controls interrupt
requests.
Bit
Bit Name
Initial
Value
R/W
Description
7
CMIEB
0
R/W
Compare-Match Interrupt Enable B
Selects whether the CMFB interrupt request (CMIB) is
enabled or disabled when the CMFB flag in TCSR is set
to 1.
0: CMFB interrupt request (CMIB) is disabled
1: CMFB interrupt request (CMIB) is enabled
6
CMIEA
0
R/W
Compare-Match Interrupt Enable A
Selects whether the CMFA interrupt request (CMIA) is
enabled or disabled when the CMFA flag in TCSR is set
to 1.
0: CMFA interrupt request (CMIA) is disabled
1: CMFA interrupt request (CMIA) is enabled
5
OVIE
0
R/W
Timer Overflow Interrupt Enable
Selects whether the OVF interrupt request (OVI) is
enabled or disabled when the OVF flag in TCSR is set to
1.
0: OVF interrupt request (OVI) is disabled
1: OVF interrupt request (OVI) is enabled
4
CCLR1
0
R/W
Counter Clear 1 and 0
3
CCLR0
0
R/W
These bits select the method by which TCNT is cleared
00: Clearing is disabled
01: Cleared on compare-match A
10: Cleared on compare-match B
11: Cleared on rising edge of external reset input
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Section 11 8-Bit Timers
Bit
Bit Name
Initial
Value
R/W
Description
2 to 0
CKS2
0
R/W
Clock Select 2 to 0
CKS1
0
R/W
CKS0
0
R/W
The input clock can be selected from three clocks divided
from the system clock (φ). When use of an external clock
is selected, three types of count can be selected: at the
rising edge, the falling edge, and both rising and falling
edges.
000: Clock input disabled
001: φ/8 internal clock source, counted on the falling edge
010: φ/64 internal clock source, counted on the falling
edge
011: φ/8192 internal clock source, counted on the falling
edge
100: For channel 0: Counted on TCNT1 overflow signal*
For channel 1: Counted on TCNT0 compare-matchA
signal*
For channel 2: Counted on TCNT3 overflow signal*
For channel 3: Counted on TCNT2 compare-matchA
signal*
101: External clock source, counted at rising edge
110: External clock source, counted at falling edge
111: External clock source, counted at both rising and
falling edges
Note: * If the count input of channel 0 (channel 2) is the TCNT1 (TCNT3) overflow signal and that of
channel 1 (channel 3) is the TCNT0 (TCNT2) compare-match signal, no incrementing clock
will be generated. Do not use this setting.
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Section 11 8-Bit Timers
11.3.5
Timer Control/Status Register (TCSR)
TCSR indicates status flags and controls compare-match output.
• TCSR_0
Bit
Bit Name
Initial
Value
R/W
7
CMFB
0
1
R/(W)* Compare-Match Flag B
Description
[Setting condition]
When TCNT = TCORB
[Clearing conditions]
•
•
6
CMFA
0
Read CMFB when CMFB = 1, then write 0 in CMFB
2
The DTC* is activated by the CMIB interrupt and the
2
DISEL bit = 0 in MRB of the DTC* with the transfer
counter other than 0
1
*
R/(W) Compare-match Flag A
[Setting condition]
When TCNT = TCORA
[Clearing conditions]
•
•
5
OVF
0
Read CMFA when CMFA = 1, then write 0 in CMFA
2
The DTC* is activated by the CMIA interrupt and
2
DISEL bit = 0 in MRB of the DTC* with the transfer
counter other than 0
1
*
R/(W) Timer Overflow Flag
[Setting condition]
When TCNT overflows from H'FF to H'00
[Clearing condition]
Read OVF when OVF = 1, then write 0 in OVF
4
ADTE
0
R/W
A/D Trigger Enable
Enables or disables A/D converter start requests by
compare-match A.
0: A/D converter start requests by compare-match A are
disabled
1: A/D converter start requests by compare-match A are
enabled
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Section 11 8-Bit Timers
Bit
Bit Name
Initial
Value
R/W
Description
3
OS3
0
R/W
Output Select 3 and 2
2
OS2
0
R/W
These bits specify how the timer output level is to be
changed by a compare-match B of TCORB and TCNT.
00: No change when compare-match B occurs
01: 0 is output when compare-match B occurs
10: 1 is output when compare-match B occurs
11: Output is inverted when compare-match B occurs
(toggle output)
1
OS1
0
R/W
Output Select 1 and 0
0
OS0
0
R/W
These bits specify how the timer output level is to be
changed by a compare-match A of TCORA and TCNT.
00: No change when compare-match A occurs
01: 0 is output when compare-match A occurs
10: 1 is output when compare-match A occurs
11: Output is inverted when compare-match A occurs
(toggle output)
Notes: 1. Only 0 can be written to this bit, to clear the flag.
2. Supported only by the H8S/2268 Group.
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Section 11 8-Bit Timers
• TCSR_1 and TCSR_3
Bit
Bit Name
Initial
Value
R/W
7
CMFB
0
1
R/(W)* Compare-Match Flag B
Description
[Setting condition]
When TCNT = TCORB
[Clearing conditions]
•
•
6
CMFA
0
Read CMFB when CMFB = 1, then write 0 in CMFB
2
The DTC* is activated by the CMIB interrupt and the
2
DISEL Bit = 0 in MRB of the DTC* with the transfer
counter other than 0
1
*
R/(W) Compare-match Flag A
[Setting condition]
When TCNT = TCORA
[Clearing conditions]
•
•
5
OVF
0
Read CMFA when CMFA = 1, then write 0 in CMFA
2
The DTC* is activated by the CMIA interrupt and the
2
DISEL Bit = 0 in MRB of the DTC* with the transfer
counter other than 0
1
*
R/(W) Timer Overflow Flag
[Setting condition]
When TCNT overflows from H'FF to H'00
[Clearing condition]
Read OVF when OVF = 1, then write 0 in OVF
4
⎯
1
⎯
Reserved
This bit is always read as 1 and cannot be modified.
3
OS3
0
R/W
Output Select 3 and 2
2
OS2
0
R/W
These bits specify how the timer output level is to be
changed by a compare-match B of TCORB and TCNT.
00: No change when compare-match B occurs
01: 0 is output when compare-match B occurs
10: 1 is output when compare-match B occurs
11: Output is inverted when compare-match B occurs
(toggle output)
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Section 11 8-Bit Timers
Bit
Bit Name
Initial
Value
R/W
Description
1
OS1
0
R/W
Output Select 1 and 0
0
OS0
0
R/W
These bits specify how the timer output level is to be
changed by a compare-match A of TCORA and TCNT.
00: No change when compare-match A occurs
01: 0 is output when compare-match A occurs
10: 1 is output when compare-match A occurs
11: Output is inverted when compare-match A occurs
(toggle output)
Notes: 1. Only 0 can be written to this bit, to clear the flag.
2. Supported only by the H8S/2268 Group.
• TCSR_2
Bit
7
Bit Name
CMFB
Initial
Value
R/W
0
1
R/(W)* Compare-Match Flag B
Description
[Setting condition]
When TCNT = TCORB
[Clearing conditions]
•
•
6
CMFA
0
Read CMFB when CMFB = 1, then write 0 in CMFB
2
The DTC* is activated by the CMIB interrupt and the
2
DISEL Bit = 0 in MRB of the DTC* with the transfer
counter other than 0
1
*
R/(W) Compare-match Flag A
[Setting condition]
When TCNT = TCORA
[Clearing conditions]
•
•
Read CMFA when CMFA = 1, then write 0 in CMFA
2
The DTC* is activated by the CMIA interrupt and the
2
DISEL Bit = 0 in MRB of the DTC* with the transfer
counter other than 0
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Section 11 8-Bit Timers
Bit
5
Bit Name
OVF
Initial
Value
R/W
0
1
R/(W)* Timer Overflow Flag
Description
[Setting condition]
When TCNT overflows from H'FF to H'00
[Clearing condition]
Read OVF when OVF = 1, then write 0 in OVF
4
⎯
0
R/W
Reserved
This bit is a readable/writable bit, but the write value
should always be 0.
3
OS3
0
R/W
Output Select 3 and 2
2
OS2
0
R/W
These bits specify how the timer output level is to be
changed by a compare-match B of TCORB and TCNT.
00: No change when compare-match B occurs
01: 0 is output when compare-match B occurs
10: 1 is output when compare-match B occurs
11: Output is inverted when compare-match B occurs
(toggle output)
1
OS1
0
R/W
Output Select 1 and 0
0
OS0
0
R/W
These bits specify how the timer output level is to be
changed by a compare-match A of TCORA and TCNT.
00: No change when compare-match A occurs
01: 0 is output when compare-match A occurs
10: 1 is output when compare-match A occurs
11: Output is inverted when compare-match A occurs
(toggle output)
Notes: 1. Only 0 can be written to this bit, to clear the flag.
2. Supported only by the H8S/2268 Group.
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Section 11 8-Bit Timers
11.4
Operation
11.4.1
Pulse Output
Figure 11.2 shows an example of arbitrary duty pulse output.
1. Set TCR in CCR1 to 0 and CCLR0 to 1 to clear TCNT by a TCORA compare-match.
2. Set OS3 to OS0 bits in TCSR to B'0110 to output 1 by a TCORA compare-match and 0 by a
TCORB compare-match.
By the above settings, waveforms with the cycle of TCORA and the pulse width of TCORB can
be output without software intervention.
TCNT
H'FF
Counter clear
TCORA
TCORB
H'00
TMO
Figure 11.2 Example of Pulse Output
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Section 11 8-Bit Timers
11.5
Operation Timing
11.5.1
TCNT Incrementation Timing
Figure 11.3 shows the TCNT count timing with internal clock source. Figure 11.4 shows the
TCNT incrementation timing with external clock source. The pulse width of the external clock for
incrementation at single edge must be at least 1.5 status, and at least 2.5 states for incrementation
at both edges. The counter will not increment correctly if the pulse width is less than these values.
φ
Internal clock
TCNT input
clock
TCNT
N–1
N
N+1
Figure 11.3 Count Timing for Internal Clock Input
φ
External clock
input pin
TCNT input
clock
TCNT
N–1
N
N+1
Figure 11.4 Count Timing for External Clock Input
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Section 11 8-Bit Timers
11.5.2
Timing of CMFA and CMFB Setting When a Compare-Match Occurs
The CMFA and CMFB flags in TCSR are set to 1 by a compare-match signal generated when the
TCOR and TCNT values match. The compare-match signal is generated at the last state in which
the match is true, just before the timer counter is updated. Therefore, when TCOR and TCNT
match, the compare-match signal is not generated until the next incrementation clock input. Figure
11.5 shows the timing of CMF flag setting.
φ
TCNT
N
TCOR
N
N+1
Compare-match
signal
CMF
Figure 11.5 Timing of CMF Setting
11.5.3
Timing of Timer Output When a Compare-Match Occurs
When a compare-match occurs, the timer output changes as specified by the output select bits
(OS3 to OS0) in TCSR. Figure 11.6 shows the timing when the output is set to toggle at comparematch A.
φ
Compare-match A
signal
Timer output
pin
Figure 11.6 Timing of Timer Output
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Section 11 8-Bit Timers
11.5.4
Timing of Compare-Match Clear When a Compare-Match Occurs
TCNT is cleared when compare-match A or B occurs, depending on the setting of the CCLR1 and
CCLR0 bits in TCR. Figure 11.7 shows the timing of this operation.
φ
Compare-match
signal
TCNT
N
H'00
Figure 11.7 Timing of Compare-Match Clear
11.5.5
TCNT External Reset Timing
TCNT is cleared at the rising edge of an external reset input, depending on the settings of the
CCLR1 and CCLR0 bits in TCR. The width of the clearing pulse must be at least 1.5 states. Figure
11.8 shows the timing of this operation.
φ
External reset
input pin
Clear signal
TCNT
N–1
N
H'00
Figure 11.8 Timing of Clearing by External Reset Input
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Section 11 8-Bit Timers
11.5.6
Timing of Overflow Flag (OVF) Setting
OVF in TCSR is set to 1 when the timer count overflows (changes from H'FF to H'00). Figure
11.9 shows the timing of this operation.
φ
TCNT
H'FF
H'00
Overflow signal
OVF
Figure 11.9 Timing of OVF Setting
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Section 11 8-Bit Timers
11.6
Operation with Cascaded Connection
If bits CKS2 to CKS0 in one of TCR_0 and TCR_1 (TCR_2 and TCR_3) are set to B'100, the 8bit timers of the two channels are cascaded. With this configuration, a single 16-bit timer can be
used (16-bit timer mode) or compare-matches of 8-bit channel 0 (channel 2) can be counted by the
timer of channel 1 (channel 3) (compare-match count mode). In the case that channel 0 is
connected to channel 1 in cascade, the timer operates as described below.
11.6.1
16-Bit Count Mode
When bits CKS2 to CKS0 in TCR_0 are set to B'100, the timer functions as a single 16-bit timer
with channel 0 occupying the upper 8 bits and channel 1 occupying the lower 8 bits.
• Setting of compare-match flags
⎯ The CMF flag in TCSR_0 is set to 1 when a 16-bit compare-match occurs.
⎯ The CMF flag in TCSR_1 is set to 1 when a lower 8-bit compare-match occurs.
• Counter clear specification
⎯ If the CCLR1 and CCLR0 bits in TCR_0 have been set for counter clear at compare-match,
the 16-bit counter (TCNT_0 and TCNT_1 together) is cleared when a 16-bit comparematch occurs. The 16-bit counter (TCNT_0 and TCNT_1 together) is cleared even if
counter clear by the TMRI01 pin has also been set.
⎯ The settings of the CCLR1 and CCLR0 bits in TCR_1 are ignored. The lower 8 bits cannot
be cleared independently.
• Pin output
⎯ Control of output from the TMO0 pin by bits OS3 to OS0 in TCSR_0 is in accordance with
the 16-bit compare-match conditions.
⎯ Control of output from the TMO1 pin by bits OS3 to OS0 in TCSR_1 is in accordance with
the lower 8-bit compare-match conditions.
11.6.2
Compare-Match Count Mode
When bits CKS2 to CKS0 in TCR_1 are B'100, TCNT_1 counts compare-match A for channel 0.
Channels 0 and 1 are controlled independently. Conditions such as setting of the CMF flag,
generation of interrupts, output from the TMO pin, and counter clearing are in accordance with the
settings for each channel.
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Section 11 8-Bit Timers
11.7
Interrupt Sources
11.7.1
Interrupt Sources and DTC Activation
The 8-bit timer can generate three types of interrupt: CMIA, CMIB, and OVI. Table 11.2 shows
the interrupt sources and priority. Each interrupt source can be enabled or disabled independently
by interrupt enable bits in TCR. Independent signals are sent to the interrupt controller for each
interrupt. In the H8S/2268 Group, it is also possible to activate the DTC by means of CMIA and
CMIB interrupts.
Table 11.2 8-Bit Timer Interrupt Sources
Interrupt
source
Description
Flag
DTC
Activation*
Interrupt
Priority
CMIA0
TCORA_0 compare-match
CMFA
Possible
High
CMIB0
TCORB_0 compare-match
CMFB
Possible
OVI0
TCNT_0 overflow
OVF
Not possible
Low
CMIA1
TCORA_1 compare-match
CMFA
Possible
High
CMIB1
TCORB_1 compare-match
CMFB
Possible
OVI1
TCNT_1 overflow
OVF
Not possible
Low
CMIA2*
TCORA_2 compare-match
CMFA
Possible
High
CMIB2*
TCORB_2 compare-match
CMFB
Possible
OVI2*
TCNT_2 overflow
OVF
Not possible
Low
CMIA3*
TCORA_3 compare-match
CMFA
Possible
High
CMIB3*
TCORB_3 compare-match
CMFB
Possible
OVI3*
TCNT_3 overflow
OVF
Not possible
Low
Note: * Supported only by the H8S/2268 Group.
11.7.2
A/D Converter Activation
The A/D converter can be activated only by channel 0 compare match A.
If the ADTE bit in TCSR0 is set to 1 when the CMFA flag is set to 1 by the occurrence of channel
0 compare match A, a request to start A/D conversion is sent to the A/D converter. If the 8-bit
timer conversion start trigger has been selected on the A/D converter side at this time, A/D
conversion is started.
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Section 11 8-Bit Timers
11.8
Usage Notes
11.8.1
Setting Module Stop Mode
The TMR is enabled or disabled by setting the module stop control register. In the initial state, the
TMR is disabled. After the module stop mode is canceled, registers can be accessed. For details,
see section 22, Power-Down Modes.
11.8.2
Contention between TCNT Write and Clear
If a timer counter clock pulse is generated during the T2 state of a TCNT write cycle, the clear
takes priority, so that the counter is cleared and the write is not performed. Figure 11.10 shows
this operation.
TCNT write cycle by CPU
T1
T2
φ
Address
TCNT address
Internal write signal
Counter clear signal
TCNT
N
H'00
Figure 11.10 Contention between TCNT Write and Clear
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Section 11 8-Bit Timers
11.8.3
Contention between TCNT Write and Increment
If a timer counter clock pulse is generated during the T2 state of a TCNT write cycle, the write
takes priority and the counter is not incremented. Figure 11.11 shows this operation.
TCNT write cycle by CPU
T1
T2
φ
Address
TCNT address
Internal write signal
TCNT input clock
TCNT
N
M
Counter write data
Figure 11.11 Contention between TCNT Write and Increment
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Section 11 8-Bit Timers
11.8.4
Contention between TCOR Write and Compare-Match
During the T2 state of a TCOR write cycle, the TCOR write has priority even if a compare-match
occurs and the compare-match signal is disabled. Figure 11.12 shows this operation.
TCOR write cycle by CPU
T1
T2
φ
Address
TCOR address
Internal write signal
TCNT
N
N+1
TCOR
N
M
TCOR write data
Compare-match signal
Prohibited
Figure 11.12 Contention between TCOR Write and Compare-Match
11.8.5
Contention between Compare-Matches A and B
If compare-matches A and B occur at the same time, the 8-bit timer operates in accordance with
the priorities for the output states set for compare-match A and compare-match B, as shown in
table 11.3.
Table 11.3 Timer Output Priorities
Output Setting
Priority
Toggle output
High
1 output
0 output
No change
Low
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Section 11 8-Bit Timers
11.8.6
Switching of Internal Clocks and TCNT Operation
TCNT may increment erroneously when the internal clock is switched over. Table 11.4 shows the
relationship between the timing at which the internal clock is switched (by writing to the CKS1
and CKS0 bits) and the TCNT operation
When the TCNT clock is generated from an internal clock, the falling edge of the internal clock
pulse is detected. If clock switching causes a change from high to low level, as shown in no. 3 in
table 11.4, a TCNT clock pulse is generated on the assumption that the switchover is a falling
edge. This increments TCNT.
Erroneous incrementation can also happen when switching between internal and external clocks.
Table 11.4 Switching of Internal Clock and TCNT Operation
Timing of Switchover
by Means of CKS1 and
TCNT Clock Operation
No. CKS0 Bits
1
Switching from low to
1
low*
Clock before
switchover
Clock after
switchover
TCNT clock
TCNT
N
N+1
CKS bit rewrite
2
Switching from low to
2
high*
Clock before
switchover
Clock after
switchover
TCNT clock
TCNT
N
N+1
N+2
CKS bit rewrite
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Section 11 8-Bit Timers
Timing of Switchover
by Means of CKS1 and
TCNT Clock Operation
No. CKS0 Bits
3
Switching from high to
3
low*
Clock before
switchover
Clock after
switchover
*4
TCNT clock
TCNT
N
N+1
N+2
CKS bit rewrite
4
Switching from high to
high
Clock before
switchover
Clock after
switchover
TCNT clock
TCNT
N
N+1
N+2
CKS bit rewrite
Notes: 1.
2.
3.
4.
11.8.7
Includes switching from low to stop, and from stop to low.
Includes switching from stop to high.
Includes switching from high to stop.
Generated on the assumption that the switchover is a falling edge; TCNT is
incremented.
Contention between Interrupts and Module Stop Mode
If module stop mode is entered when an interrupt has been requested, it will not be possible to
clear the CPU interrupt source or the DTC activation source. Interrupts should therefore be
disabled before entering module stop mode.
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Section 11 8-Bit Timers
11.9
8-Bit Reload Timer (TMR_4) (H8S/2268 Group Only)
The 8-bit reload timer comprises an 8-bit up-counter with four channels, and has two functions,
the interval function and automatic reload function.
11.9.1
Features
• Selection of clock sources
⎯ Selected from 14 internal clocks (φ/32768, φ/8192, φ/2048, φ/512, φ/128, φ/32, φ/8, φ/2,
φSUB/256, φSUB/128, φSUB/64, φSUB/32, φSUB/8 and φSUB/2) and an external clock.
• Interrupts requested by counter overflow
• Operation with cascaded connection (the lower the channel number, the higher the bit in the
connected timer)
⎯ Connecting two timers (channels 4 and 5, channels 5 and 6, or channels 6 and 7): The
module operates as a 16-bit timer
⎯ Connecting three timers (channels 4 to 6 or channels 5 to 7): The module operates as a 24bit timer
⎯ Connecting four timers (channels 4 to 7): The module operates as a 32-bit timer
• Module stop mode can be set
⎯ At initialization, the 8-bit reload timer is halted. Register access is enabled by canceling the
module stop mode.
Figure 11.13 shows a block diagram of the 8-bit reload timer.
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Section 11 8-Bit Timers
External clock TMCI4
Internal clock
φ/2
φ/8
φ/32
φ/128
φ/512
TCR_4
TCR_5
TCR_6
TCR_7
Clock select
Clock select
Clock select
Clock select
TCNT_4
TCNT_5
TCNT_6
TCNT_7
TLR_5
TLR_6
TLR_7
φ/32768
φSUB/2
φSUB/8
φSUB/32
φSUB/64
φSUB/128
Internal bus
φ/8192
Module bus
φ/2048
reload
φSUB/256
TLR_4
Bus
interface
Interrupt contorol
OVI4
OVI5
OVI6
OVI7
Legend:
TCR_4:
TCNT_4:
TLR_4:
TCR_5:
TCNT_5:
TLR_5:
Timer control register 4
Timer counter 4
Timer reload register 4
Timer control register 5
Timer counter 5
Timer reload register 5
TCR_6:
TCNT_6:
TLR_6:
TCR_7:
TCNT_7:
TLR_7:
Timer control register 6
Timer counter 6
Timer reload register 6
Timer control register 7
Timer counter 7
Timer reload register 7
Figure 11.13 Block Diagram of 8-Bit Reload Timer
11.9.2
Input/Output Pins
The following table shows the pin configuration for the 8-bit timer module.
Name
Symbol
I/O
Function
Timer clock input pin
TMCI4
Input
External clock input for the counter
Note: Voltage applied to the TMCI4 input pin should be within the range, AVss ≤ TMCI4 ≤ AVcc.
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Section 11 8-Bit Timers
11.10
Register Descriptions
The 8-bit reload timer has the following registers. For details on the module stop control register,
refer to section 22.1.2, Module Stop Control Registers A to D (MSTPCRA to MSTPCRD).
• Timer control register (TCR)
• Timer Counter (TCNT)
• Timer reload register (TLR)
TCNT or TLR can operate as a 16-bit timer using TCNT_4 or TLR_4 (TCNT_6 or TLR_6) as the
upper half and TCNT_5 or TLR_5 (TCNT_7 or TLR_7) as the lower half.
11.10.1 Timer Control Registers 4 to 7 (TCR_4 to TCR_7)
TCR selects the automatic reload function and TCNT clock source, and controls interrupt requests.
Bit
Bit Name
Initial
Value
R/W
Description
7
ARSL
0
R/W
Automatic Reload Function Select
Selects the automatic reload function
0: The interval function is selected
6
OVF
0
1: The automatic reload function is selected
*
R/(W) Timer Overflow Flag
Indicates that TCNT overflows from H'FF to H'00.
0: [Clearing condition]
Read OVF when OVF = 1, then write 0 in OVF
1: [Setting condition]
When TCNT overflows from H'FF to H'00
5
OVIE
0
R/W
Timer Overflow Interrupt Enable
Selects whether the OVF interrupt request (OVI) is
enabled or disabled when the OVF flag in TCSR is set to
1.
0: OVF interrupt request (OVI) is disabled
1: OVF interrupt request (OVI) is enabled
4, 3
⎯
All 1
⎯
Reserved
These bits are always read as 1 and cannot be modified.
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Section 11 8-Bit Timers
Bit
Bit Name
Initial
Value
R/W
Description
2 to 0
CKS2
0
R/W
Clock Select 2 to 0
CKS1
0
R/W
CKS0
0
R/W
The input clock can be selected from internal clocks and
an external clock, which are divided from the system
clock (φ) or subclock (φSUB).
Channel4
Channel5
Channel6
Channel7
000: φ/32768
φ/8192
φ/32768
φ/8192
001: φ/2048
φ/512
φ/2048
φ/512
010: φ/128
φ/32
φ/128
φ/32
011: φ/8
φ/2
φ/8
φ/2
100: φ SUB /256
φ SUB /128
φ SUB /256
φ SUB /128
101: φ SUB /64
φ SUB /32
φ SUB /64
φ SUB /32
110: φ SUB /8
φ SUB /2
φ SUB /8
φ SUB /2
111: TCNT_5
overflow
TCNT_6
overflow
TCNT_7
overflow
Count of the
rising clock of
the external
clock.
Note: * Only a 0 can be written to this bit, to clear the flag.
11.10.2 Timer Counters 4 to 7 (TCNT4 to TCNT7)
Each TCNT is an 8-bit readable up-counter and increments on clock pulses generated from an
internal or external clock source. This clock source is selected by clock select bits CKS2 to CKS0
in TCR
TCNT_4 and TCNT_5, or TCNT_6 and TCNT_7 comprise a single 16-bit register, and can be
accessed simultaneously by word access.
When TCNT overflows from H'FF to H'00, the overflow flag (OVF) in TCR is set to 1.
TCNT is initialized to H'00 by a reset or in hardware standby mode.
11.10.3 Time Reload Registers 4 to 7 (TLR_4 to TLR_7)
Each TLR is an 8-bit writable register and sets a reload value for TCNT. When a reload value is
set to TLR, the value is simultaneously load to TCNT and incrementation starts from the value.
When TCNT overflows during automatic reload operation, the TLR value is written to TCNT.
Therefore, the overflow cycle can be set within the range from 1 to 256 input clock cycles.
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Section 11 8-Bit Timers
TLR_4 and TLR_5, or TLR_6 and TLR_7 comprise a single 16-bit register, and can be accessed
simultaneously by word access.
TLR is initialized to H'00 by a reset or in hardware standby mode.
11.11
Operation
11.11.1 Interval Timer Operation
When the ARSL bit in TCR is set to 0, the timer operates as an interval timer.
After a module stop mode is canceled, the timer continues incrementation as an interval timer
without stopping because TCNT is initialized to H'00 and TLR is cleared to 0 by a reset. The input
clock source can be selected from 14 internal clocks output from the prescaler unit and an external
clock from the TMCI4 input pin, using the CKS2 to CKS0 bits in TCR.
When a clock is input after the TCNT value has been H'FF, the timer overflows and OVF in TCR
is set to 1. At this time, if OVIE in TCR is 1, an interrupt is generated.
When an overflow occurs, the TCNT count value is cleared to H'00 and TCNT restarts
incrementation. If a value is set to TLR during interval timer operation, the value is also written to
TCNT.
This operation timing is shown in figure 11.14.
TCNT value
Overflow
H'FF
Overflow
Overflow
Overflow
Time
H'00
MSTPD5 = 0
OVF
ARSL = 0
OVF
OVF
OVF
OVF: Timer overflow interrupt request generation
Figure 11.14 Operation in Interval Timer Mode
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Section 11 8-Bit Timers
11.11.2 Automatic Reload Timer Operation
When the ARSL bit in TCR is set to 1, the timer operates as an automatic reload timer.
When a reload value is set to TLR, the value is also loaded to TCNT simultaneously, and TCNT
starts incrementation from the value.
If a clock is input after the TCNT count value reaches H'FF, the timer overflows, the TLR value is
written to TCNT, and incrementation is continued from the value. Therefore, the overflow cycle
can be set within the range from 1 to 256, using a TLR value.
Clock sources and interrupts in automatic reload operation are the same as those in interval
operation. If TLR is re-set during automatic reload operation, the value is also set to TCNT.
This operation timing is shown in figure 11.15.
TCNT value
Overflow
Overflow
Overflow
Overflow
Overflow
Overflow
H'FF
H'80
H'40
H'00
Time
MSTPD5 = 0
ARSL = 0
ARSL = 1
TLR setting
(H'80))
OVF
OVF
OVF
OVF TLR setting
(H'40)
OVF
OVF
OVF: Timer overflow interrupt request generation
Figure 11.15 Operation in Automatic Reload Timer Mode
11.11.3 Cascaded Connection
• Read of TCNT
The channel relationship for cascaded connection is shown in figure 11.16.
When accessing beyond the word area, for example, when a cascaded connection including
channels 5 and 6 is created as shown in (3), and (6) to (8) in the figure, the counter value of the
lower channel is read when TCNT5 is read, and the data is stored in the TCNT register.
For case (7) where channels 5 to 7 are cascaded, the counter values of channels 6 and 7 are
read when TCNT5 is read, and the data is stored in TCNT6/7 registers. Accordingly, when
reading cascaded TCNT, read from the upper channel.
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Section 11 8-Bit Timers
For a word connection, access in word units.
Upper
Lower
1
Channel 4
Channel 5
Channel 6
Channel 7
Channel 4
Channel 5
Channel 6
Channel 7
3
Channel 4
Channel 5
Channel 6
Channel 7
4
Channel 4
Channel 5
Channel 6
Channel 7
5
Channel 4
Channel 5
Channel 6
Channel 7
6
Channel 4
Channel 5
Channel 6
Channel 7
7
Channel 4
Channel 5
Channel 6
Channel 7
Channel 4
Channel 5
Channel 6
Channel 7
2
8
Cascaded connection
Figure 11.16 Channel Relationship of Cascaded Connection
• Write to TLR
When writing to the cascaded TLR, even if a single channel of TLR is written, the system
regards that the entire channels of the cascaded TLR are rewritten. At this point in time, the
value in the entire cascaded TLR is loaded into the corresponding TCNT. The timer operation
starts at the TLR value that is most-recently written in TLR access cycles.
• Operation Clock
Although each channel usually operates on an individual clock, a cascaded channel operates on
the same clock. The operation clock for the lowest cascaded channel is used as a common
clock of each channel.
In this case, the setting for the clocks of the channels other than the lowest channel is disabled.
• Automatic Reload Function Select and Operation Timing
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Section 11 8-Bit Timers
Although the automatic reload function is usually set and implemented in individual channel, a
cascaded channel operates according to the setting for the automatic reload function of the
highest channel.
In this case, the automatic reload function settings for the channels other than the highest
channel are disabled. When the automatic reload function is enabled for cascaded channel, the
TLR setting value of each channel is automatically reloaded simultaneously in the reload
timing of the highest channel.
• Timer Overflow Flag (OVF)
Although an OVF is usually set to an individual channel independently, an OVF is set to the
highest channel of a cascaded channel. In this case, OVFs of the channels other than that of the
highest channel is disabled.
11.12
Usage Notes
11.12.1 Conflict between Write to TLR and Count Up/Automatic Reload
Even if a count up occurs in the T2 state during TLR write cycles, the counter is not incremented
and TLR write (load to TCNT) is carried out instead (as in Figure 11.11).
Likewise, if an automatic reload occurs during write cycles, TLR write (load to TCNT) is carried
out instead.
11.12.2 Switchover of Internal Clock and TCNT Operation
Depending on the timing which the internal clock is switched, TCNT may be incremented (see
table 11.4). Likewise, when the clock pulse is changed (φ and φ SUB), TCNT may be incremented,
and may not in some cases. Therefore, when the internal clock is changed, resume timer operation
by resetting TLR (Write H'00 to TLR when the interval timer is in operation).
11.12.3 Interrupt during Module Stop
When module stop mode is entered with an interrupt being requested, the cause of an interrupt to
the CPU cannot be cleared. Enter module stop mode after, for example, disabling an interrupt
request.
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Section 11 8-Bit Timers
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Section 12 Watchdog Timer (WDT)
Section 12 Watchdog Timer (WDT)
The watchdog timer (WDT) is an 8-bit timer that can generate an internal reset signal for this LSI
if a system crash prevents the CPU from writing to the timer counter, thus allowing it to overflow.
When this watchdog function is not needed, the WDT can be used as an interval timer. In interval
timer operation, an interval timer interrupt is generated each time the counter overflows.
The block diagram of the WDT is shown in figures 12.1 to 12.3.
12.1
Features
• Selectable from eight counter input clocks for WDT_0
Selectable from 16 counter input clocks for WDT_1
• Switchable between watchdog timer mode and interval timer mode
In watchdog timer mode
• If the counter in WDT_0 overflows, it is possible to select whether this LSI is internally reset
or not.
• If the counter in WDT_1 overflows, it is possible to select whether this LSI is internally reset
or the internal NMI interrupt is generated.
In interval timer mode
• If the counter overflows, the WDT generates an interval timer interrupt (WOVI).
WDT0105B_000020030700
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Section 12 Watchdog Timer (WDT)
Overflow
Internal reset signal*1
φ/2
φ/64
φ/128
φ/512
φ/2048
φ/8192
φ/32768
φ/131072
Internal clock*2
Clock
Clock
select
Reset
control
RSTCSR
TCNT_0
Internal bus
WOVI0
(interrupt request
signal)
Interrupt
control
TCSR_0
Bus
interface
Module bus
WDT
Legend:
TCSR_0: Timer control/status register0
TCNT_0: Timer counter0
RSTCSR: Reset control/status register
Notes: 1. The type of internal reset signal depends on a register setting.
2. When a sub-clock is operating, φ will be φSUB.
Figure 12.1 Block Diagram of WDT_0
WOVI1
(interrupt request
signal)
Internal NMI
(interrupt request signal)
Interrupt
control
Overflow
Clock
Reset
control
φ/2
φ/64
φ/128
φ/512
φ/2048
φ/8192
φ/32768
φ/131072
Clock
select
Internal reset signal*
Internal clock
TCSR_1
Module bus
WDT
Legend:
TCSR_1: Timer control/status register1
TCNT_1: Timer counter1
Note: * The type of internal reset signal depends on a register setting.
Figure 12.2 Block Diagram of WDT_1
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Bus
interface
Internal bus
TCNT_1
φSUB/2
φSUB/4
φSUB/8
φSUB/16
φSUB/32
φSUB/64
φSUB/128
φSUB/256
Section 12 Watchdog Timer (WDT)
12.2
Register Descriptions
The WDT has the following registers. To prevent accidental overwriting, TCSR and TCNT have
to be written to by a different method to normal registers. For details, refer to section 12.5.1, Notes
on Register Access.
• Timer counter (TCNT)
• Timer control/status register (TCSR)
• Reset control/status register (RSTCSR)
12.2.1
Timer Counter (TCNT)
TCNT is an 8-bit readable/writable up-counter. TCNT is initialized to H'00 when the TME bit in
TCSR is cleared to 0.
To initialize TCNT to H’00 while the timer is operating, write H’00 to TCNT directly. See 12.5.7,
Notes on Initializing TCNT by Using the TME Bit.
12.2.2
Timer Control/Status Register (TCSR)
TCSR functions include selecting the clock source to be input to TCNT and the timer mode.
• TCSR_0
Bit
7
Bit Name
OVF
Initial
Value
R/W
0
1
R/(W)* Overflow Flag
Description
Indicates that TCNT has overflowed. Only a 0 can be
written to this bit, to clear the flag.
[Setting condition]
When TCNT overflows (changes from H'FF to H'00)
When internal reset request generation is selected in
watchdog timer mode, OVF is cleared automatically by
the internal reset.
[Clearing condition]
Cleared by reading TCSR* when OVF = 1, then writing 0
to OVF
2
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Section 12 Watchdog Timer (WDT)
Bit
Bit Name
Initial
Value
R/W
Description
6
WT/IT
0
R/W
Timer Mode Select
Selects whether the WDT is used as a watchdog timer or
interval timer.
0: Interval timer mode
(interval timer interrupt (WOVI) is requested to CPU)
1: Watchdog timer mode (internal reset selectable)
5
TME
0
R/W
Timer Enable
When this bit is set to 1, TCNT starts counting. When this
bit is cleared, TCNT stops counting and is initialized to
H'00.
4, 3
⎯
All 1
⎯
Reserved
These bits are always read as 1 and cannot be modified.
2
CKS2
0
R/W
Clock Select 0 to 2
1
CKS1
0
R/W
0
CKS0
0
R/W
Selects the clock source to be input to TCNT. The
3
overflow frequency* for φ = 20 MHz is enclosed in
parentheses.
000: Clock φ/2 (frequency: 25.6 μs)
001: Clock φ/64 (frequency: 819.2 μs)
010: Clock φ/128 (frequency: 1.6 ms)
011: Clock φ/512 (frequency: 6.6 ms)
100: Clock φ/2048 (frequency: 26.2 ms)
101: Clock φ/8192 (frequency: 104.9 ms)
110: Clock φ/32768 (frequency: 419.4 ms)
111: Clock φ/131072 (frequency: 1.68 s)
Notes: 1. Only 0 can be written, for flag clearing.
2. When the OVF flag is polled with the interval timer interrupt disabled, read the OVF bit
while it is 1 at least twice.
3. The overflow period is the time from when TCNT starts counting up from H'00 until
overflow occurs.
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Section 12 Watchdog Timer (WDT)
• TCSR_1
Bit
Bit Name
Initial
Value
R/W
7
OVF
0
1
R/(W)* Overflow Flag
Description
Indicates that TCNT has overflowed. Only a 0 can be
written to this bit, to clear the flag.
[Setting condition]
When TCNT overflows (changes from H'FF to H'00)
When internal reset request generation is selected in
watchdog timer mode, OVF is cleared automatically by
the internal reset.
[Clearing conditions]
Cleared by reading TCSR* when OVF = 1, then writing 0
to OVF
2
6
WT/IT
0
R/W
Timer Mode Select
Selects whether the WDT is used as a watchdog timer or
interval timer.
0: Interval timer mode
(interval timer interrupt (WOVI) is requested to CPU)
1: Watchdog timer mode
(internal reset or NMI interrupt is requested to CPU)
5
TME
0
R/W
Timer Enable
When this bit is set to 1, TCNT starts counting. When this
bit is cleared, TCNT stops counting and is initialized to
H'00.
4
PSS
0
R/W
Prescaler Select
Selects the clock source input to TCNT of WDT_1
0: TCNT counts divided clock of φ-base prescaler (PSM).
1: TCNT counts divided clock of φSUB-base prescaler
(PSS)
3
RST/NMI
0
R/W
Reset or NMI
Selects either a power-on reset or the NMI interrupt
request when TCNT overflows in watchdog timer mode.
0: NMI interrupt is requested
1: Reset is requested
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Section 12 Watchdog Timer (WDT)
Bit
Bit Name
Initial
Value
R/W
Description
2
CKS2
0
R/W
Clock Select 0 to 2
1
CKS1
0
R/W
0
CKS0
0
R/W
Selects the clock source to be input to TCNT. The
3
overflow frequency* for φ = 20 MHz or φSUB = 32.768 kHz
is enclosed in parentheses.
When PSS = 0:
000: Clock φ/2 (frequency: 25.6 μs)
001: Clock φ/64 (frequency: 819.2 μs)
010: Clock φ/128 (frequency: 1.6 ms)
011: Clock φ/512 (frequency: 6.6 ms)
100: Clock φ/2048 (frequency: 26.2 ms)
101: Clock φ/8192 (frequency: 104.9 ms)
110: Clock φ/32768 (frequency: 419.4 ms)
111: Clock φ/131072 (frequency: 1.68 s)
When PSS = 1:
000: Clock φSUB/2 (frequency: 15.6 ms)
001: Clock φSUB/4 (frequency: 31.3 ms)
010: Clock φSUB/8 (frequency: 62.5 ms)
011: Clock φSUB/16 (frequency: 125 ms)
100: Clock φSUB/32 (frequency: 250 ms)
101: Clock φSUB/64 (frequency: 500 ms)
110: Clock φSUB/128 (frequency: 1 s)
111: Clock φSUB/256 (frequency: 2 s)
Notes: 1. Only 0 can be written, for flag clearing.
2. When the OVF flag is polled with the interval timer interrupt disabled, read the OVF bit
while it is 1 at least twice
3. The overflow period is the time from when TCNT starts counting up from H'00 until
overflow occurs.
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Section 12 Watchdog Timer (WDT)
12.2.3
Reset Control/Status Register (RSTCSR) (Only WDT_0)
RSTCSR controls the generation of the internal reset signal when TCNT overflows, and selects
the type of internal reset signal. RSTCSR is initialized to H'1F by a reset signal from the RES pin,
and not by the WDT internal reset signal caused by overflows.
Bit
7
Bit Name
WOVF
Initial
Value
R/W
0
R/(W)* Watchdog Overflow Flag
Description
This bit is set when TCNT overflows in watchdog timer
mode. This bit cannot be set in interval timer mode, and
only 0 can be written, to clear the flag.
[Setting condition]
Set when TCNT overflows (changed from H'FF to H'00) in
watchdog timer mode
[Clearing condition]
Cleared by reading RSTCSR when WOVF = 1, and then
writing 0 to WOVF
6
RSTE
0
R/W
Reset Enable
Specifies whether or not a reset signal is generated in the
chip if TCNT overflows during watchdog timer operation.
0: Reset signal is not generated even if TCNT overflows
(Though this LSI is not reset, TCNT and TCSR in WDT
are reset)
1: Reset signal is generated if TCNT overflows
5
⎯
0
R/W
Reserved
This bit can be read from and written to. However, the
write value should always be 0.
4 to 0
⎯
All 1
⎯
Reserved
These bits are always read as 1 and cannot be modified.
Note: * Only 0 can be written, to clear the flag.
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Section 12 Watchdog Timer (WDT)
12.3
Operation
12.3.1
Watchdog Timer Mode
To use the WDT as a watchdog timer, set the WT/IT bit in TCSR and the TME bit to 1.
Software must prevent TCNT overflows by rewriting the TCNT value (normally be writing H'00)
before overflows occurs. Thus, TCNT does not overflow while the system is operating normally.
When the WDT is used as a watchdog timer and the RSTE bit in RSTCSR of WDT_0 is set to 1,
and if TCNT overflows without being rewritten because of a system malfunction or other error, an
internal reset signal for this LSI is output for 518 system clocks.
When the RST/NMI bit in TCSR of WDT_1 is set to 1, and if TCNT overflows, the internal reset
signal is output for 516 system clock periods. When the RST/ NMI bit is cleared to 0, an NMI
interrupt request is generated (for 515 or 516 system clock periods when the clock source is set to
φSUB (PSS = 1)).
An internal reset request from the watchdog timer and a reset input from the RES pin are both
treated as having the same vector. If a WDT internal reset request and the RES pin reset occur at
the same time, the RES pin reset has priority and the WOVF bit in RSTCSR is cleared to 0.
An NMI request from the watchdog timer and an interrupt request from the NMI pin are both
treated as having the same vector. So, avoid handling an NMI request from the watchdog timer
and an interrupt request from the NMI pin at the same time.
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Section 12 Watchdog Timer (WDT)
TCNT value
Overflow
H'FF
Time
H'00
WT/IT = 1
TME = 1
WOVF = 1
Write H'00'
to TCNT
WT/IT = 1 Write H'00'
TME = 1 to TCNT
internal reset is
generated
Internal reset signal*
518 system clock (WDT0)
515/516 system clock (WDT1)
Legend:
WT/IT: Timer mode select bit
TME: Timer enable bit
Note: * In the case of WDT_0, the internal reset signal is generated only when the RSTE bit is set to 1.
In the case of WDT_1,either the internal reset or the NMI interrupt is generated.
Figure 12.3 Watchdog Timer Mode Operation
12.3.2
Interval Timer Mode
To use the WDT as an internal timer, set the WT/IT and TME bits in TCSR to 0.
When the WDT is used as an interval timer, an interval timer interrupt (WOVI) is generated each
time the TCNT overflows. (The NMI interrupt request is not generated.) Therefore, an interrupt
can be generated at intervals.
TCNT value
Overflow
H'FF
Overflow
Overflow
Overflow
Time
H'00
WT/IT = 0
TME = 1
WOVI
WOVI
WOVI
WOVI
Legend:
WOVI: Interval timer interrupt request generation
Figure 12.4 Interval Timer Mode Operation
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Section 12 Watchdog Timer (WDT)
12.3.3
Timing of Setting Overflow Flag (OVF)
The OVF flag is set to 1 if TCNT overflows during interval timer operation. At the same time, an
interval timer interrupt (WOVI) is requested. This timing is shown in figure 12.5.
φ
TCNT
H'FF
H'00
Overflow signal
(internal signal)
OVF
Figure 12.5 Timing of OVF Setting
12.3.4
Timing of Setting Watchdog Timer Overflow Flag (WOVF)
With WDT_0 the WOVF bit in RSTCSR is set to 1 if TCNT overflows in watchdog timer mode.
If TCNT overflows while the RSTE bit in RSTCSR is set to 1, an internal is generated for the
entire chip. (WOVI interrupt is not generated.) This timing is illustrated in figure 12.6.
φ
TCNT
H'FF
H'00
Overflow signal
(internal signal)
WOVF
Internal reset
signal
518 states (WDT_0)
515/516 states (WDT_1)
Figure 12.6 Timing of WOVF Setting
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Section 12 Watchdog Timer (WDT)
12.4
Interrupt Sources
During interval timer mode operation, an overflow generates an interval timer interrupt (WOVI).
The interval timer interrupt is requested whenever the OVF flag is set to 1 in TCSR. OVF must be
cleared to 0 in the interrupt handling routine.
If an NMI request has been chosen in the watchdog timer mode, an NMI request is generated
when a TCNT overflow occurs.
Table 12.1 WDT Interrupt Source
Name
Interrupt Source
Interrupt Flag
WOVI
TCNT overflow (interval timer mode)
OVF
NMI
TCNT overflow (watchdog timer mode)
OVF
12.5
Usage Notes
12.5.1
Notes on Register Access
The watchdog timer’s TCNT and TCSR registers differ from other registers in being more
difficult to write to. The procedures for writing to and reading these registers are given below.
(1) Writing to TCNT and TCSR
Word transfer instructions must be used to write to TCNT and TCSR. These registers cannot be
written with byte transfer instructions. This is shown in figure 12.7.
For writing, TCNT and TCSR are allocated to the same address. To write to TCNT, transfer a
word in which the upper byte is H'5A and the lower byte is the write data. To write to TCSR,
transfer a word in which the upper byte is H'A5 and the lower byte is the write data. When these
transfer operations are performed, the lower byte data is written to TCNT or TCSR.
TCNT write
15
Address: H'FF74
8
7
H'5A
0
Write data
TCSR write
15
Address: H'FF74
8
H'A5
7
0
Write data
Figure 12.7 Writing to TCNT, TCSR (WDT_0)
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Section 12 Watchdog Timer (WDT)
(2) Writing to RSTCSR
Use word transfer operations to write to RSTCSR. This register cannot be written using byte
transfer instructions. This is shown in figure 12.8.
The method used to write a 0 to the WOVF bit and the method used to write the RSTE and RSTS
bits are different.
To write a 0 to the WOVF bit, set the upper byte to H'A5 and the lower byte to H'00 and transfer
that data. This will clear the WOVF bit to 0. This operation does not affect the RSTE and RSTS
bits. To write the RSTE and RSTS bits, set the upper byte to H'5A and the lower byte to the data
to be written and transfer that data. This will write the data in bits 6 and 5 of the lower byte to the
RSTE and RSTS bits. This operation does not affect the WOVF bit.
When writing 0 to the WOVF bit
15
Address: H'FF76
8
7
H'A5
0
H'00
When writing to the RSTE and RSTS bits
15
Address: H'FF76
8
H'5A
7
0
Write data
Figure 12.8 Writing to RSTCSR
(3) Reading TCNT, TCSR, and RSTCSR (WDT_0)
These registers are read in the same way as other registers. The read addresses are H'FF74 for
TCSR and H'FF77 for RSTCSR.
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Section 12 Watchdog Timer (WDT)
12.5.2
Contention between Timer Counter (TCNT) Write and Increment
If a timer counter clock pulse is generated during the T2 state of a TCNT write cycle, the write
takes priority and the timer counter is not incremented. Figure 12.9 shows this operation.
TCNT write cycle
T1
T2
φ
Address
Internal write signal
TCNT input clock
TCNT
N
M
Counter write data
Figure 12.9 Contention between TCNT Write and Increment
12.5.3
Changing Value of CKS2 to CKS0
If bits CKS0 to CKS2 in TCSR are written to while the WDT is operating, errors could occur in
the incrementation. Software must be used to stop the watchdog timer (by clearing the TME bit to
0) before changing the value of bits CKS0 to CKS2.
12.5.4
Switching between Watchdog Timer Mode and Interval Timer Mode
If the mode is switched from watchdog timer to interval timer while the WDT is operating, errors
could occur in the incrementation. Software must be used to stop the watchdog timer (by clearing
the TME bit to 0) before switching the mode.
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Section 12 Watchdog Timer (WDT)
12.5.5
Internal Reset in Watchdog Timer Mode
This LSI is not reset internally if TCNT overflows while the RSTE bit is cleared to 0 during
watchdog timer operation, however TCNT_0 and TCSR_0 of the WDT_0 are reset.
TCNT, TCSR, or RSTCR cannot be written to for 132 states following an overflow. During this
period, any attempt to read the WOVF flag is not acknowledged. Accordingly, wait 132 states
after overflow to write 0 to the WOVF flag for clearing.
12.5.6
OVF Flag Clearing in Interval Timer Mode
When the OVF flag setting conflicts with the OVF flag reading in interval timer mode, writing 0
to the OVF bit may not clear the flag even though the OVF bit has been read while it is 1. If there
is a possibility that the OVF flag setting and reading will conflict, such as when the OVF flag is
polled with the interval timer interrupt disabled, read the OVF bit while it is 1 at least twice before
writing 0 to the OVF bit to clear the flag.
12.5.7
Notes on Initializing TCNT by Using the TME Bit
When the φSUB (subckock) division clock is selected as the TCNT input clock (PSS in TCSR set
to 1) and, after TME in TCSR is cleared to 0 to initialize the counter (TCNT) while the counter
(TCNT) is operating in the high-speed mode or medium-speed mode, TCNT is restarted by setting
TME to 1 once again, TCNT may not be correctly initialized.
In such cases, use either of the following methods to initialize TCNT:
(1) Write H'00 to TCNT.
(2) In subactive mode, clear the TME bit to 0.
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Section 13 Serial Communication Interface (SCI)
Section 13 Serial Communication Interface (SCI)
This LSI has three independent serial communication interface (SCI) channels. The SCI can
handle both asynchronous and clocked synchronous serial communication. Serial data
communication can be carried out using standard asynchronous communication chips such as a
Universal Asynchronous Receiver/Transmitter (UART) or an Asynchronous Communication
Interface Adapter (ACIA). A function is also provided for serial communication between
processors (multiprocessor communication function). The SCI also supports an IC card (Smart
Card) interface conforming to ISO/IEC 7816-3 (Identification Card) as a serial communication
interface extension function.
13.1
Features
• Choice of asynchronous or clocked synchronous serial communication mode
• Full-duplex communication capability
The transmitter and receiver are mutually independent, enabling transmission and reception to
be executed simultaneously.
Double-buffering is used in both the transmitter and the receiver, enabling continuous
transmission and continuous reception of serial data.
• On-chip baud rate generator allows any bit rate to be selected
External clock can be selected as a transfer clock source (except for in Smart Card interface
mode).
• Choice of LSB-first or MSB-first transfer (except in the case of asynchronous mode 7-bit data)
• Four interrupt sources
Transmit-end, transmit-data-empty, receive-data-full, and receive error ⎯ that can issue
requests.
The transmit-data-empty interrupt and receive data full interrupts can be used to activate the
data transfer controller (DTC) (H8S/2268 Group only).
• Module stop mode can be set
Asynchronous Mode
• Data length: 7 or 8 bits
• Stop bit length: 1 or 2 bits
• Parity: Even, odd, or none
• Receive error detection: Parity, overrun, and framing errors
• Break detection: Break can be detected by reading the RxD pin level directly in the case of a
framing error
SCI0025B_000020020700
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Section 13 Serial Communication Interface (SCI)
• Average transfer rate generator (SCI_0): 720 kbps, 460.784 kbps, or 115.196 kbps can be
selected at 16 MHz operation.
• Transfer rate clock can be input from the TPU (SCI_0).
• Communications between multi-processors are possible.
Clocked Synchronous Mode
• Data length: 8 bits
• Receive error detection: Overrun errors detected
Smart Card Interface
• Automatic transmission of error signal (parity error) in receive mode
• Error signal detection and automatic data retransmission in transmit mode
• Direct convention and inverse convention both supported
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Section 13 Serial Communication Interface (SCI)
Bus interface
Figure 13.1 shows a block diagram of the SCI_0, and figure 13.2 shows that of the SCI1 and
SCI_2.
Module data bus
RDR
SCMR
TDR
Internal
data bus
BRR
SSR
φ
SCR
RxD0
RSR
φ/4
Baud rate
generator
SMR
TSR
SEMR
φ/16
φ/64
Transmission/
reception control
TxD0
Clock
Parity generation
TEI
TXI
RXI
ERI
Parity check
External clock
SCK0
Average
transfer rate
generator
10.667 MHz operation
115.152 kbps
460.606 kbps
16 MHz operation
115.196 kbps
460.784 kbps
720 kbps
TIOCA1
TCLKA
TPU
TIOCA2
Legend:
RSR: Receive shift register
RDR: Receive data register
TSR: Transmit shift register
TDR: Transmit data register
SMR: Serial mode register
SCR:
SSR:
SCMR:
BRR:
SEMR:
Serial control register
Serial status register
Smart card mode register
Bit rate register
Serial expansion mode register
Figure 13.1 Block Diagram of SCI_0
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Bus interface
Section 13 Serial Communication Interface (SCI)
Module data bus
RDR
TDR
BRR
SCMR
SSR
RxD
TxD
SCR
RSR
TSR
SMR
Baud rate
generator
Transmission/
reception control
Parity generation
φ
φ/4
φ/16
φ/64
Clock
Parity check
External clock
SCK
Legend:
RSR:
RDR:
TSR:
TDR:
SMR:
SCR:
SSR:
SCMR:
BRR:
Receive shift register
Receive data register
Transmit shift register
Transmit data register
Serial mode register
Serial control register
Serial status register
Smart card mode register
Bit rate register
TEI
TXI
RXI
ERI
Figure 13.2 Block Diagram of SCI_1 or SCI_2
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Internal
data bus
Section 13 Serial Communication Interface (SCI)
13.2
Input/Output Pins
Table 13.1 shows the pin configuration for each SCI channel.
Table 13.1 Pin Configuration
Channel
Pin Name*
I/O
Function
0
SCK0
I/O
SCI0 clock input/output
RxD0
Input
SCI0 receive data input
TxD0
Output
SCI0 transmit data output
SCK1
I/O
SCI1 clock input/output
RxD1
Input
SCI1 receive data input
TxD1
Output
SCI1 transmit data output
SCK2
I/O
SCI2 clock input/output
RxD2
Input
SCI2 receive data input
TxD2
Output
SCI2 transmit data output
1
2
Note: * Pin names SCK, RxD, and TxD are used in the text for all channels, omitting the channel
designation.
13.3
Register Descriptions
The SCI has the following registers for each channel. For details on register addresses and register
states during each process, refer to Section 24, List of Registers. The serial mode register (SMR),
serial status register (SSR), and serial control register (SCR) are described separately for normal
serial communication interface mode and Smart Card interface mode because their bit functions
differ in part.
• Receive Shift Register (RSR)
• Receive Data Register (RDR)
• Transmit Data Register (TDR)
• Transmit Shift Register (TSR)
• Serial Mode Register (SMR)
• Serial Control Register (SCR)
• Serial Status Register (SSR)
• Smart Card Mode Register (SCMR)
• Bit Rate Register (BRR)
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Section 13 Serial Communication Interface (SCI)
Other than the above registers, SCI_0 has the following register.
• Serial Expansion Mode Register (SEMR0)
13.3.1
Receive Shift Register (RSR)
RSR is a shift register that is used to receive serial data input to the RxD pin and convert it into
parallel data. When one byte of data has been received, it is transferred to RDR automatically.
RSR cannot be directly accessed by the CPU.
13.3.2
Receive Data Register (RDR)
RDR is an 8-bit register that stores received data. When the SCI has received one byte of serial
data, it transfers the received serial data from RSR to RDR, where it is stored. After this, RSR is
receive-enabled. As RSR and RDR function as a double buffer in this way, continuous receive
operations are possible. After confirming that the RDRF bit in SSR is set to 1, read RDR only
once.
RDR cannot be written to by the CPU.
RDR is initialized to H'00 by a reset, in standby mode, watch mode,subactive mode, subsleep
mode or module stop mode.
13.3.3
Transmit Data Register (TDR)
TDR is an 8-bit register that stores data for transmission. When the SCI detects that TSR is empty,
it transfers the transmit data written in TDR to TSR and starts transmission. The double-buffered
structure of TDR and TSR enables continuous serial transmission. If the next transmit data has
already been written to TDR during serial transmission, the SCI transfers the written data to TSR
to continue transmission. Although TDR can be read or written to by the CPU at all times, to
achieve reliable serial transmission, write transmit data to TDR only once after confirming that the
TDRE bit in SSR is set to 1.
TDR is initialized to H'FF by a reset, in standby mode, watch mode, subactive mode, subsleep
mode or module stop mode.
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Section 13 Serial Communication Interface (SCI)
13.3.4
Transmit Shift Register (TSR)
TSR is a shift register that transmits serial data. To perform serial data transmission, the SCI first
transfers transmit data from TDR to TSR, then sends the data to the TxD pin. TSR cannot be
directly accessed by the CPU.
13.3.5
Serial Mode Register (SMR)
SMR is used to set the SCI’s serial transfer format and select the baud rate generator clock source.
Some bit functions of SMR differ between normal serial communication interface mode and Smart
Card interface mode.
• Normal Serial Communication Interface Mode (When SMIF in SCMR is 0)
Bit
Bit Name
Initial
Value
R/W
7
C/A
0
R/W
Description
Communication Mode
0: Asynchronous mode
1: Clocked synchronous mode
6
CHR
0
R/W
Character Length (enabled only in asynchronous mode)
0: Selects 8 bits as the data length.
1: Selects 7 bits as the data length. LSB-first is fixed and
the MSB (bit 7) of TDR is not transmitted in
transmission.
In clocked synchronous mode, a fixed data length of 8
bits is used.
5
PE
0
R/W
Parity Enable (enabled only in asynchronous mode)
When this bit is set to 1, the parity bit is added to transmit
data before transmission, and the parity bit is checked in
reception. For a multiprocessor format, parity bit addition
and checking are not performed regardless of the PE bit
setting.
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Section 13 Serial Communication Interface (SCI)
Bit
Bit Name
Initial
Value
R/W
Description
4
O/E
0
R/W
Parity Mode (enabled only when the PE bit is 1 in
asynchronous mode)
0: Selects even parity.
When even parity is set, parity bit addition is
performed in transmission so that the total number of 1
bits in the transmit character plus the parity bit is even.
In reception, a check is performed to see if the total
number of 1 bits in the receive character plus parity bit
is even.
1: Selects odd parity.
When odd parity is set, parity bit addition is performed
in transmission so that the total number of 1 bits in the
transmit character plus the parity bit is odd. In
reception, a check is performed to see if the total
number of 1 bits in the receive character plus the
parity bit is odd.
3
STOP
0
R/W
Stop Bit Length (enabled only in asynchronous mode)
Selects the stop bit length in transmission.
0: 1 stop bit
1: 2 stop bits
In reception, only the first stop bit is checked. If the
second stop bit is 0, it is treated as the start bit of the next
transmit character.
2
MP
0
R/W
Multiprocessor Mode (enabled only in asynchronous
mode)
When this bit is set to 1, the multiprocessor
communication function is enabled. The PE bit and O/E
bit settings are invalid in multiprocessor mode.
For details, see 13.5, Multiprocessor Communication
Function.
1
CKS1
0
R/W
Clock Select 0 and 1
0
CKS0
0
R/W
These bits select the clock source for the baud rate
generator.
00: φ clock (n = 0)
01: φ/4 clock (n = 1)
10: φ/16 clock (n = 2)
11: φ/64 clock (n = 3)
For the relationship between the bit rate register setting
and the baud rate, see section 13.3.9, Bit Rate Register
(BRR). n is the decimal representation of the value of n in
BRR (see section 13.3.9, Bit Rate Register (BRR)).
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Section 13 Serial Communication Interface (SCI)
• Smart Card Interface Mode (When SMIF in SCMR Is 1)
Bit
Bit Name
Initial
Value
R/W
Description
7
GM
0
R/W
GSM Mode
When this bit is set to 1, the SCI operates in GSM mode.
In GSM mode, the timing of the TEND setting is
advanced by 11.0 etu (Elementary Time Unit: the time for
transfer of one bit), and clock output control mode
addition is performed. For details, refer to section 13.7.8,
Clock Output Control.
0: Normal smart card interface mode operation (initial
value)
• The TEND flag is generated 12.5 etu (11.5 etu in the
block transfer mode) after the beginning of the start
bit.
• Clock output on/off control only
1: GSM mode operation in smart card interface mode
• The TEND flag is generated 11.0 etu after the
beginning of the start bit.
• In addition to clock output on/off control, high/low
fixed control is supported (set using SCR).
6
BLK
0
R/W
When this bit is set to 1, the SCI operates in block
transfer mode. For details on block transfer mode, refer to
section 13.7.3, Block Transfer Mode.
0: Normal smart card interface mode operation (initial
value)
• Error signal transmission, detection, and automatic
data retransmission are performed.
• The TXI interrupt is generated by the TEND flag.
• The TEND flag is set 12.5 etu (11.0 etu in the GSM
mode) after transmission starts.
1: Operation in block transfer mode
• Error signal transmission, detection, and automatic
data retransmission are not performed.
• The TXI interrupt is generated by the TDRE flag.
• The TEND flag is set 11.5 etu (11.0 etu in the GSM
mode) after transmission starts.
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Section 13 Serial Communication Interface (SCI)
Bit
Bit Name
Initial
Value
R/W
5
PE
0
R/W
Description
Parity Enable (enabled only in asynchronous mode)
When this bit is set to 1, the parity bit is added to transmit
data in transmission, and the parity bit is checked in
reception. In Smart Card interface mode, this bit must be
set to 1.
4
O/E
0
R/W
Parity Mode (enabled only when the PE bit is 1 in
asynchronous mode)
0: Selects even parity.
1: Selects odd parity.
For details on setting this bit in Smart Card interface
mode, refer to section 13.7.2, Data Format (Except for
Block Transfer Mode).
3
BCP1
0
R/W
Basic Clock Pulse 0 and 1
2
BCP0
0
R/W
These bits specify the number of basic clock periods in a
1-bit transfer interval on the Smart Card interface.
00: 32 clock (S = 32)
01: 64 clock (S = 64)
10: 372 clock (S = 372)
11: 256 clock (S = 256)
For details, refer to section 13.7.4, Receive Data
Sampling Timing and Reception Margin in Smart Card
Interface Mode. S stands for the value of S in BRR (see
section 13.3.9, Bit Rate Register (BRR)).
1
CKS1
0
R/W
Clock Select 0 and 1
0
CKS0
0
R/W
These bits select the clock source for the baud rate
generator.
00: φ clock (n = 0)
01: φ/4 clock (n = 1)
10: φ/16 clock (n = 2)
11: φ/64 clock (n = 3)
For the relationship between the bit rate register setting
and the baud rate, see section 13.3.9, Bit Rate Register
(BRR). n is the decimal representation of the value of n in
BRR (see section 13.3.9, Bit Rate Register (BRR)).
Note: etu (Elementary Time Unit): Abbreviation for the transfer period for one bit.
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Section 13 Serial Communication Interface (SCI)
13.3.6
Serial Control Register (SCR)
SCR is a register that enables or disables SCI transfer operations and interrupt requests, and is also
used to selection of the transfer clock source. For details on interrupt requests, refer to section
13.8, Interrupt Sources. Some bit functions of SCR differ between normal serial communication
interface mode and Smart Card interface mode.
• Normal Serial Communication Interface Mode (When SMIF in SCMR Is 0)
Bit
Bit Name
Initial
Value
R/W
Description
7
TIE
0
R/W
Transmit Interrupt Enable
When this bit is set to 1, the TXI interrupt request is
enabled.
TXI interrupt request cancellation can be performed by
reading 1 from the TDRE flag in SSR, then clearing it to
0, or clearing the TIE bit to 0.
6
RIE
0
R/W
Receive Interrupt Enable
When this bit is set to 1, RXI and ERI interrupt requests
are enabled.
RXI and ERI interrupt request cancellation can be
performed by reading 1 from the RDRF, FER, PER, or
ORER flag in SSR, then clearing the flag to 0, or clearing
the RIE bit to 0.
5
TE
0
R/W
Transmit Enable
When this bit s set to 1, transmission is enabled.
In this state, serial transmission is started when transmit
data is written to TDR and the TDRE flag in SSR is
cleared to 0.
SMR setting must be performed to decide the transfer
format before setting the TE bit to 1. When this bit is
cleared to 0, the transmission operation is disabled, and
the TDRE flag is fixed at 1.
Rev. 5.00 Sep. 01, 2009 Page 313 of 656
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Section 13 Serial Communication Interface (SCI)
Bit
Bit Name
Initial
Value
R/W
4
RE
0
R/W
Description
Receive Enable
When this bit is set to 1, reception is enabled.
Serial reception is started in this state when a start bit is
detected in asynchronous mode or serial clock input is
detected in clocked synchronous mode.
SMR setting must be performed to decide the reception
format before setting the RE bit to 1.
Clearing the RE bit to 0 does not affect the RDRF,
FER,PER, and ORER flags, which retain their states.
3
MPIE
0
R/W
Multiprocessor Interrupt Enable (enabled only when the
MP bit in SMR is 1 in asynchronous mode)
When this bit is set to 1, receive data in which the
multiprocessor bit is 0 is skipped, and setting of the
RDRF, FER, and ORER status flags in SSR is prohibited.
On receiving data in which the multiprocessor bit is 1, this
bit is automatically cleared and normal reception is
resumed. For details, refer to section 13.5, Multiprocessor
Communication Function.
When receive data including MPB = 0 is received, receive
data transfer from RSR to RDR, receive error detection,
and setting of the RERF, FER, and ORER flags in SSR,
are not performed.
When receive data including MPB = 1 is received, the
MPB bit in SSR is set to 1, the MPIE bit is cleared to 0
automatically, and generation of RXI and ERI interrupts
(when the TIE and RIE bits in SCR are set to 1) and FER
and ORER flag setting are enabled.
2
TEIE
0
R/W
Transmit End Interrupt Enable
This bit is set to 1, TEI interrupt request is enabled.
TEI cancellation can be performed by reading 1 from the
TDRE flag in SSR, then clearing it to 0 and clearing the
TEND flag to 0, or clearing the TEIE bit to 0.
Rev. 5.00 Sep. 01, 2009 Page 314 of 656
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Section 13 Serial Communication Interface (SCI)
Bit
Bit Name
Initial
Value
R/W
Description
1
CKE1
0
R/W
Clock Enable 0 and 1
0
CKE0
0
R/W
Selects the clock source and SCK pin function.
Asynchronous mode
00: On-chip baud rate generator
SCK pin functions as I/O port
01: On-chip baud rate generator
Outputs a clock of the same frequency as the bit rate
from the SCK pin.
1X: External clock
Inputs a clock with a frequency 16 times the bit rate
from the SCK pin.
Clocked synchronous mode
0X: Internal clock (SCK pin functions as clock output)
1X: External clock (SCK pin functions as clock input)
Legend:
X: Don’t care
Rev. 5.00 Sep. 01, 2009 Page 315 of 656
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Section 13 Serial Communication Interface (SCI)
• Smart Card Interface Mode (When SMIF in SCMR Is 1)
Bit
Bit Name
Initial
Value
R/W
Description
7
TIE
0
R/W
Transmit Interrupt Enable
When this bit is set to 1, TXI interrupt request is enabled.
TXI interrupt request cancellation can be performed by
reading 1 from the TDRE flag in SSR, then clearing it to
0, or clearing the TIE bit to 0.
6
RIE
0
R/W
Receive Interrupt Enable
When this bit is set to 1, RXI and ERI interrupt requests
are enabled.
RXI and ERI interrupt request cancellation can be
performed by reading 1 from the RDRF, FER, PER, or
ORER flag in SSR, then clearing the flag to 0, or clearing
the RIE bit to 0.
5
TE
0
R/W
Transmit Enable
When this bit s set to 1, transmission is enabled.
In this state, serial transmission is started when transmit
data is written to TDR and the TDRE flag in SSR is
cleared to 0.
SMR setting must be performed to decide the transfer
format before setting the TE bit to 1. When this bit is
cleared to 0, the transmission operation is disabled, and
the TDRE flag is fixed at 1.
4
RE
0
R/W
Receive Enable
When this bit is set to 1, reception is enabled.
Serial reception is started in this state when a start bit is
detected in asynchronous mode or serial clock input is
detected in clocked synchronous mode.
SMR setting must be performed to decide the reception
format before setting the RE bit to 1.
Clearing the RE bit to 0 does not affect the RDRF,
FER,PER, and ORER flags, which retain their states.
Rev. 5.00 Sep. 01, 2009 Page 316 of 656
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Section 13 Serial Communication Interface (SCI)
Bit
Bit Name
Initial
Value
R/W
Description
3
MPIE
0
R/W
Multiprocessor Interrupt Enable (enabled only when the
MP bit in SMR is 1 in asynchronous mode)
Write 0 to this bit in Smart Card interface mode.
When receive data including MPB = 0 is received, receive
data transfer from RSR to RDR, receive error detection,
and setting of the RERF, FER, and ORER flags in SSR,
are not performed.
When receive data including MPB = 1 is received, the
MPB bit in SSR is set to 1, the MPIE bit is cleared to 0
automatically, and generation of RXI and ERI interrupts
(when the TIE and RIE bits in SCR are set to 1) and FER
and ORER flag setting are enabled.
2
TEIE
0
R/W
Transmit End Interrupt Enable
Write 0 to this bit in Smart Card interface mode.
TEI cancellation can be performed by reading 1 from the
TDRE flag in SSR, then clearing it to 0 and clearing the
TEND flag to 0, or clearing the TEIE bit to 0.
1
CKE1
0
0
CKE0
0
R/W
Clock Enable 0 and 1
Enables or disables clock output from the SCK pin. The
clock output can be dynamically switched in GSM mode.
For details, refer to section 13.7.8, Clock Output Control.
When the GM bit in SMR is 0:
00: Output disabled (SCK pin can be used as an I/O port
pin)
01: Clock output
1X: Reserved
When the GM bit in SMR is 1:
00: Output fixed low
01: Clock output
10: Output fixed high
11: Clock output
Legend:
X: Don’t care
Rev. 5.00 Sep. 01, 2009 Page 317 of 656
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Section 13 Serial Communication Interface (SCI)
13.3.7
Serial Status Register (SSR)
SSR is a register containing status flags of the SCI and multiprocessor bits for transfer. 1 cannot
be written to flags TDRE, RDRF, ORER, PER, and FER; they can only be cleared. Some bit
functions of SSR differ between normal serial communication interface mode and Smart Card
interface mode.
• Normal Serial Communication Interface Mode (When SMIF in SCMR Is 0)
Bit
7
Bit Name
TDRE
Initial
Value
R/W
1
1
R/(W)* Transmit Data Register Empty
Description
Displays whether TDR contains transmit data.
[Setting conditions]
•
When the TE bit in SCR is 0
•
When data is transferred from TDR to TSR and data
can be written to TDR
[Clearing conditions]
•
•
When 0 is written to TDRE after reading TDRE = 1
2
When the DTC* is activated by a TXI interrupt
request and writes data to TDR (H8S/2268 Group
only)
6
RDRF
0
1
R/(W)* Receive Data Register Full
Indicates that the received data is stored in RDR.
[Setting condition]
When serial reception ends normally and receive data is
transferred from RSR to RDR
[Clearing conditions]
•
•
When 0 is written to RDRF after reading RDRF = 1
2
When the DTC* is activated by an RXI interrupt and
transferred data from RDR (H8S/2268 Group only)
The RDRF flag is not affected and retains their previous
values when the RE bit in SCR is cleared to 0.
If reception of the next data is completed while the RDRF
flag is still set to 1, an overrun error will occur and the
receive data will be lost.
Rev. 5.00 Sep. 01, 2009 Page 318 of 656
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Section 13 Serial Communication Interface (SCI)
Bit
5
Bit Name
ORER
Initial
Value
R/W
0
1
R/(W)* Overrun Error
Description
Indicates that an overrun error occurred during reception,
causing abnormal termination.
[Setting condition]
When the next serial reception is completed while RDRF
=1
The receive data prior to the overrun error is retained in
RDR, and the data received subsequently is lost. Also,
subsequent serial reception cannot be continued while
the ORER flag is set to 1. In clocked synchronous mode,
serial transmission cannot be continued either.
[Clearing condition]
When 0 is written to ORER after reading ORER = 1
The ORER flag is not affected and retains its previous
state when the RE bit in SCR is cleared to 0.
4
FER
0
1
R/(W)* Framing Error
Indicates that a framing error occurred during reception in
asynchronous mode, causing abnormal termination.
[Setting condition]
When the stop bit is 0
In 2 stop bit mode, only the first stop bit is checked for a
value to 1; the second stop bit is not checked. If a framing
error occurs, the receive data is transferred to RDR but
the RDRF flag is not set. Also, subsequent serial
reception cannot be continued while the FER flag is set to
1. In clocked synchronous mode, serial transmission
cannot be continued, either.
[Clearing condition]
When 0 is written to FER after reading FER = 1
In 2-stop-bit mode, only the first stop bit is checked.
The FER flag is not affected and retains its previous state
when the RE bit in SCR is cleared to 0.
Rev. 5.00 Sep. 01, 2009 Page 319 of 656
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Section 13 Serial Communication Interface (SCI)
Bit
3
Bit Name
PER
Initial
Value
R/W
0
1
R/(W)* Parity Error
Description
Indicates that a parity error occurred during reception
using parity addition in asynchronous mode, causing
abnormal termination.
[Setting condition]
When a parity error is detected during reception
If a parity error occurs, the receive data is transferred to
RDR but the RDRF flag is not set. Also, subsequent
serial reception cannot be continued while the PER flag is
set to 1. In clocked synchronous mode, serial
transmission cannot be continued, either.
[Clearing condition]
When 0 is written to PER after reading PER = 1
The PER flag is not affected and retains its previous state
when the RE bit in SCR is cleared to 0.
2
TEND
1
R
Transmit End
Indicates that transmission has been ended.
[Setting conditions]
•
When the TE bit in SCR is 0
•
When TDRE = 1 at transmission of the last bit of a 1byte serial transmit character
[Clearing conditions]
•
•
When 0 is written to TDRE after reading TDRE = 1
2
When the DTC* is activated by a TXI interrupt
request and transfer transmission data to TDR
(H8S/2268 Group only)
1
MPB
0
R
Multiprocessor Bit
MPB stores the multiprocessor bit in the receive data.
When the RE bit in SCR is cleared to 0 its previous state
is retained.
0
MPBT
0
R/W
Multiprocessor Bit Transfer
MPBT stores the multiprocessor bit to be added to the
transmit data.
Notes: 1. Only a 0 can be written to this bit, to clear the flag.
2. This bit is cleared by DTC only when DISEL = 0 with the transfer counter other than 0.
Rev. 5.00 Sep. 01, 2009 Page 320 of 656
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Section 13 Serial Communication Interface (SCI)
• Smart Card Interface Mode (When SMIF in SCMR Is 1)
Bit
Bit Name
Initial
Value
R/W
7
TDRE
1
1
R/(W)* Transmit Data Register Empty
Description
Indicates whether TDR contains transmit data.
[Setting conditions]
•
When the TE bit in SCR is 0
•
When data is transferred from TDR to TSR and data
can be written to TDR
[Clearing conditions]
•
•
When 0 is written to TDRE after reading TDRE = 1
2
When the DTC* is activated by a TXI interrupt
request and writes data to TDR (H8S/2268 Group
only)
6
RDRF
0
1
R/(W)* Receive Data Register Full
Indicates that the received data is stored in RDR.
[Setting condition]
When serial reception ends normally and receive data is
transferred from RSR to RDR
[Clearing conditions]
•
•
When 0 is written to RDRF after reading RDRF = 1
2
When the DTC* is activated by an RXI interrupt and
transferred data from RDR (H8S/2268 Group only)
The RDRF flag is not affected and retains their previous
values when the RE bit in SCR is cleared to 0.
If reception of the next data is completed while the RDRF
flag is still set to 1, an overrun error will occur and the
receive data will be lost.
Rev. 5.00 Sep. 01, 2009 Page 321 of 656
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Section 13 Serial Communication Interface (SCI)
Bit
5
Bit Name
ORER
Initial
Value
R/W
0
1
R/(W)* Overrun Error
Description
Indicates that an overrun error occurred during reception,
causing abnormal termination.
[Setting condition]
When the next serial reception is completed while RDRF
=1
The receive data prior to the overrun error is retained in
RDR, and the data received subsequently is lost. Also,
subsequent serial cannot be continued while the ORER
flag is set to 1. In clocked synchronous mode, serial
transmission cannot be continued, either.
[Clearing condition]
When 0 is written to ORER after reading ORER = 1
The ORER flag is not affected and retains its previous
state when the RE bit in SCR is cleared to 0.
4
ERS
0
1
R/(W)* Error Signal Status
Indicates that the status of an error, signal 1 returned
from the reception side at reception
[Setting condition]
When the low level of the error signal is sampled
[Clearing condition]
When 0 is written to ERS after reading ERS = 1
The ERS flag is not affected and retains its previous state
when the RE bit in SCR is cleared to 0.
Rev. 5.00 Sep. 01, 2009 Page 322 of 656
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Section 13 Serial Communication Interface (SCI)
Bit
3
Bit Name
PER
Initial
Value
R/W
0
1
R/(W)* Parity Error
Description
Indicates that a parity error occurred during reception
using parity addition in asynchronous mode, causing
abnormal termination.
[Setting condition]
When a parity error is detected during reception
If a parity error occurs, the receive data is transferred to
RDR but the RDRF flag is not set. Also, subsequent
serial reception cannot be continued while the PER flag is
set to 1. In clocked synchronous mode, serial
transmission cannot be continued, either.
[Clearing condition]
When 0 is written to PER after reading PER = 1
The PER flag is not affected and retains its previous state
when the RE bit in SCR is cleared to 0.
Rev. 5.00 Sep. 01, 2009 Page 323 of 656
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Section 13 Serial Communication Interface (SCI)
Bit
Bit Name
Initial
Value
R/W
2
TEND
1
R
Description
Transmit End
This bit is set to 1 when no error signal has been sent
back from the receiving end and the next transmit data is
ready to be transferred to TDR.
[Setting conditions]
•
When the TE bit in SCR is 0 and the ERS bit is also 0
•
When the ERS bit is 0 and the TDRE bit is 1 after the
specified interval following transmission of 1-byte
data.
The timing of bit setting differs according to the register
setting as follows:
When GM = 0 and BLK = 0, 12.5 etu after transmission
starts
When GM = 0 and BLK = 1, 11.5 etu after transmission
starts
When GM = 1 and BLK = 0, 11.0 etu after transmission
starts
When GM = 1 and BLK = 1, 11.0 etu after transmission
starts
[Clearing conditions]
•
•
When 0 is written to TDRE after reading TDRE = 1
2
When the DTC* is activated by a TXI interrupt and
transfers transmission data to TDR (H8S/2268 Group
only)
1
MPB
0
R
Multiprocessor Bit
This bit is not used in Smart Card interface mode.
0
MPBT
0
R/W
Multiprocessor Bit Transfer
Write 0 to this bit in Smart Card interface mode.
Notes: 1. Only a 0 can be written to this bit, to clear the flag.
2. This bit is cleared by DTC only when DISEL = 0 with the transfer counter other than 0.
Rev. 5.00 Sep. 01, 2009 Page 324 of 656
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Section 13 Serial Communication Interface (SCI)
13.3.8
Smart Card Mode Register (SCMR)
SCMR is a register that selects Smart Card interface mode and transfer format.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 4
⎯
All 1
⎯
Reserved
These bits are always read as 1, and cannot be modified.
3
SDIR
0
R/W
Smart Card Data Transfer Direction
Selects the serial/parallel conversion format.
0: LSB-first in transfer
1: MSB-first in transfer
The bit setting is valid only when the transfer data format
is 8 bits. For 7-bit data, LSB-first is fixed.
2
SINV
0
R/W
Smart Card Data Invert
Specifies inversion of the data logic level. The SINV bit
does not affect the logic level of the parity bit. To invert
the parity bit, invert the O/E bit in SMR.
0: TDR contents are transmitted as they are. Receive
data is stored as it is in RDR
1: TDR contents are inverted before being transmitted.
Receive data is stored in inverted form in RDR
1
⎯
1
⎯
Reserved
This bit is always read as 1, and cannot be modified.
0
SMIF
0
R/W
Smart Card Interface Mode Select
This bit is set to 1 to make the SCI operate in Smart Card
interface mode.
0: Normal asynchronous mode or clocked synchronous
mode
1: Smart card interface mode
Rev. 5.00 Sep. 01, 2009 Page 325 of 656
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Section 13 Serial Communication Interface (SCI)
13.3.9
Bit Rate Register (BRR)
BRR is an 8-bit register that adjusts the bit rate. As the SCI performs baud rate generator control
independently for each channel, different bit rates can be set for each channel. Table 13.2 shows
the relationships between the N setting in BRR and bit rate B for normal asynchronous mode,
clocked synchronous mode, and Smart Card interface mode. The initial value of BRR is H'FF, and
it can be read or written to by the CPU at all times.
Table 13.2 The Relationships between the N Setting in BRR and Bit Rate B
Communication
Mode
Asynchronous
Mode
ABCS bit
0
Error
φ × 10
φ × 106
6
B=
1
B=
Clocked
⎯
Synchronous Mode
Smart Card
Interface Mode
Bit Rate
64 × 2
Error (%) = {
× (N + 1)
φ × 106
Error (%) = {
32 × 2 2n-1 × (N + 1)
B=
8×2
2n-1
S×2
2n+1
B × 64 × 2 2n-1 × (N + 1)
φ × 106
B × 32 × 2 2n-1 × (N + 1)
φ × 106
Error (%) = {
× (N + 1)
φ × 106
B × S × 2 2n+1 × (N + 1)
SMR Setting
CKS1
CKS0
Clock
Source
0
0
φ
0
0
0
32
0
1
φ/4
1
0
1
64
1
0
φ/16
2
1
0
372
1
1
φ/64
3
1
1
256
n
BCP1
BCP0
S
Rev. 5.00 Sep. 01, 2009 Page 326 of 656
REJ09B0071-0500
-1 } × 100
× (N + 1)
Note: B: Bit rate (bit/s)
N: BRR setting for baud rate generator (0 ≤ N ≤ 255)
φ: Operating frequency (MHz)
n and S: Determined by the SMR settings shown in the following tables.
SMR Setting
-1 } × 100
⎯
φ × 106
B=
⎯
2n-1
-1 } × 100
Section 13 Serial Communication Interface (SCI)
Table 13.3 shows sample N settings in BRR in normal asynchronous mode. Table 13.4 shows the
maximum bit rate for each frequency in normal asynchronous mode. Table 13.6 shows sample N
settings in BRR in clocked synchronous mode. Table 13.8 shows sample N settings in BRR in
Smart Card interface mode. In Smart Card interface mode, S (the number of basic clock periods in
a 1-bit transfer interval) can be selected. For details, refer to section 13.7.4, Receive Data
Sampling Timing and Reception Margin. Tables 13.5 and 13.7 show the maximum bit rates with
external clock input.
When the ABCS bit in SEMR_0 of SCI_0 is set to 1 in asynchronous mode, the maximum bit rate
is twice the value shown in tables 13.4 and 13.5.
Table 13.3 BRR Settings for Various Bit Rates (Asynchronous Mode) (1)
Operating Frequency φ (MHz)
2
2.097152
2.4576
3
n
N
Error
(%)
n
N
Error
(%)
n
N
Error (%)
141 0.03
1
148 –0.04
1
174
–0.26
1
212
0.33
1
103 0.16
1
108 0.21
1
127
0.00
1
155
0.16
300
0
207 0.16
0
217 0.21
0
255
0.00
1
77
0.16
600
0
103 0.16
0
108 0.21
0
127
0.00
0
155
0.16
1200
0
51
0.16
0
54
–0.70
0
63
0.00
0
77
0.16
2400
0
25
0.16
0
26
1.14
0
31
0.00
0
38
0.16
4800
0
12
0.16
0
13
–2.48
0
15
0.00
0
19
–2.34
9600
⎯
⎯
⎯
0
6
–2.48
0
7
0.00
0
9
–2.34
19200
⎯
⎯
⎯
⎯
⎯
⎯
0
3
0.00
0
4
–2.34
31250
0
1
0.00
⎯
⎯
⎯
⎯
⎯
⎯
0
2
0.00
38400
⎯
⎯
⎯
⎯
⎯
⎯
0
1
0.00
⎯
⎯
⎯
Bit Rate
(bps)
n
N
110
1
150
Error
(%)
Rev. 5.00 Sep. 01, 2009 Page 327 of 656
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Section 13 Serial Communication Interface (SCI)
Table 13.3 BRR Settings for Various Bit Rates (Asynchronous Mode) (2)
Operating Frequency φ (MHz)
3.6864
4
4.9152
5
Bit Rate
(bps)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
2
64
0.70
2
70
0.33
2
86
0.31
2
88
–0.25
150
1
191
0.00
1
207 0.16
2
255
0.00
2
64
0.16
300
1
95
0.00
1
103 0.16
1
127
0.00
1
129
0.16
600
0
191
0.00
0
207 0.16
1
255
0.00
1
64
0.16
1200
0
95
0.00
0
103 0.16
0
127
0.00
0
129
0.16
2400
0
47
0.00
0
51
0.16
0
63
0.00
0
64
0.16
4800
0
23
0.00
0
25
0.16
0
31
0.00
0
32
–1.36
9600
0
11
0.00
0
12
0.16
0
15
0.00
0
15
1.73
19200
0
5
0.00
⎯
⎯
⎯
0
7
0.00
0
7
1.73
31250
⎯
⎯
⎯
0
3
0.00
0
4
–1.70
0
4
0.00
38400
0
2
0.00
⎯
⎯
⎯
0
3
0.00
0
3
1.73
Operating Frequency φ (MHz)
6
6.144
7.3728
8
n
N
Error
(%)
n
N
Error
(%)
108 0.08
2
130
–0.07
2
141
0.03
2
79
0.00
2
95
0.00
2
103
0.16
0.16
1
159 0.00
1
191
0.00
1
207
0.16
77
0.16
1
79
0.00
1
95
0.00
1
103
0.16
0
155
0.16
0
159 0.00
0
191
0.00
0
207
0.16
2400
0
77
0.16
0
79
0
95
0.00
0
103
0.16
4800
0
38
0.16
0
39
0.00
0
47
0.00
0
51
0.16
9600
0
19
–2.34
0
19
0.00
0
23
0.00
0
25
0.16
19200
0
9
–2.34
0
9
0.00
0
11
0.00
0
12
0.16
31250
0
5
0.00
0
5
2.40
⎯
⎯
⎯
0
7
0.00
38400
0
4
–2.34
0
4
0.00
0
5
0.00
⎯
⎯
⎯
Bit Rate
(bps)
N
N
Error
(%)
n
N
110
2
106
–0.44
2
150
2
77
0.16
300
1
155
600
1
1200
Rev. 5.00 Sep. 01, 2009 Page 328 of 656
REJ09B0071-0500
Error
(%)
0.00
Section 13 Serial Communication Interface (SCI)
Table 13.3 BRR Settings for Various Bit Rates (Asynchronous Mode) (3)
Operating Frequency φ (MHz)
9.8304
10
12
12.288
Bit Rate
(bps)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
2
174
–0.26
2
177
–0.25
2
212
0.03
2
217
0.08
150
2
127
0.00
2
129
0.16
2
155
0.16
2
159
0.00
300
1
255
0.00
2
64
0.16
2
77
0.16
2
79
0.00
600
1
127
0.00
1
129
0.16
1
155
0.16
1
159
0.00
1200
0
255
0.00
1
64
0.16
1
77
0.16
1
79
0.00
2400
0
127
0.00
0
129
0.16
0
155
0.16
0
159
0.00
4800
0
63
0.00
0
64
0.16
0
77
0.16
0
79
0.00
9600
0
31
0.00
0
32
–1.36
0
38
0.16
0
39
0.00
19200
0
15
0.00
0
15
1.73
0
19
–2.34
0
19
0.00
31250
0
9
–1.70
0
9
0.00
0
11
0.00
0
11
2.40
38400
0
7
0.00
0
7
1.73
0
9
–2.34
0
9
0.00
Operating Frequency φ (MHz)
14
Bit Rate
(bps)
n
N
14.7456
Error
(%)
n
N
16
Error
(%)
n
N
17.2032
Error
(%)
n
N
Error
(%)
110
2
248
–0.17
3
64
0.70
3
70
0.03
3
75
0.48
150
2
181
0.16
2
191
0.00
2
207
0.16
2
223
0.00
300
2
90
0.16
2
95
0.00
2
103
0.16
2
111
0.00
600
1
181
0.16
1
191
0.00
1
207
0.16
1
223
0.00
1200
1
90
0.16
1
95
0.00
1
103
0.16
1
111
0.00
2400
0
181
0.16
0
191
0.00
0
207
0.16
0
223
0.00
4800
0
90
0.16
0
95
0.00
0
103
0.16
0
111
0.00
9600
0
45
–0.93
0
47
0.00
0
51
0.16
0
55
0.00
19200
0
22
–0.93
0
23
0.00
0
25
0.16
0
27
0.00
31250
0
13
0.00
0
14
–1.70
0
15
0.00
0
16
1.20
38400
⎯
⎯
⎯
⎯
11
0.00
0
12
0.16
0
13
0.00
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Section 13 Serial Communication Interface (SCI)
Table 13.3 BRR Settings for Various Bit Rates (Asynchronous Mode) (4)
Operating Frequency φ (MHz)
18
19.6608
20
Bit Rate
(bps)
n
N
Error (%)
n
N
Error (%)
n
N
Error (%)
110
3
79
–0.12
3
86
0.31
3
88
–0.25
150
2
233
0.16
2
255
0.00
2
64
0.16
300
2
116
0.16
2
127
0.00
2
129
0.16
600
1
233
0.16
1
255
0.00
1
64
0.16
1200
1
116
0.16
1
127
0.00
1
129
0.16
2400
0
233
0.16
0
255
0.00
0
64
0.16
4800
0
116
0.16
0
127
0.00
0
129
0.16
9600
0
58
–0.69
0
63
0.00
0
64
0.16
19200
0
28
1.02
0
31
0.00
0
32
–1.36
31250
0
17
0.00
0
19
–1.70
0
19
0.00
38400
0
14
–2.34
0
15
0.00
0
15
1.73
Table 13.4 Maximum Bit Rate for Each Frequency (Asynchronous Mode)
φ (MHz)
Maximum Bit
Rate (kbps)
n
N
φ (MHz)
Maximum Bit
Rate (kbps)
n
N
2
62.5
0
0
9.8304
307.2
0
0
0
0
10
312.5
0
0
2.097152 65.536
2.4576
76.8
0
0
12
375.0
0
0
3
93.75
0
0
12.288
384.0
0
0
3.6864
115.2
0
0
14
437.5
0
0
4
125.0
0
0
14.7456
460.8
0
0
4.9152
153.6
0
0
16
500.0
0
0
5
156.25
0
0
17.2032
537.6
0
0
6
187.5
0
0
18
562.5
0
0
6.144
192.0
0
0
19.6608
614.4
0
0
7.3728
230.4
0
0
20
625.0
0
0
8
250.0
0
0
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Section 13 Serial Communication Interface (SCI)
Table 13.5 Maximum Bit Rate with External Clock Input (Asynchronous Mode)
φ (MHz)
External Input
Clock (MHz)
Maximum Bit
Rate (kbps)
φ (MHz)
External Input
Clock (MHz)
Maximum Bit
Rate (kbps)
2
0.5000
31.25
9.8304
2.4576
153.6
2.097152 0.5243
32.768
10
2.5000
156.25
2.4576
0.6144
38.4
12
3.0000
187.5
3
0.7500
46.875
12.288
3.0720
192.0
3.6864
0.9216
57.6
14
3.5000
218.75
4
1.0000
62.5
14.7456
3.6864
230.4
4.9152
1.2288
76.8
16
4.0000
250.0
5
1.2500
78.125
17.2032
4.3008
268.8
6
1.5000
93.75
18
4.5000
281.25
6.144
1.5360
96.0
19.6608
4.9152
307.2
7.3728
1.8432
115.2
20
5.0000
312.5
8
2.0000
125.0
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Section 13 Serial Communication Interface (SCI)
Table 13.6 BRR Settings for Various Bit Rates (Clocked Synchronous Mode)
Operating Frequency φ (MHz)
2
4
Bit Rate
(bps)
n
N
n
N
110
3
70
⎯
⎯
250
2
124
2
500
1
249
1k
1
2.5k
8
10
16
20
n
N
n
N
n
N
249
3
124
⎯
⎯
3
249
2
124
2
249
⎯
⎯
3
124
1
249
2
124
⎯
⎯
0
199
1
99
1
199
1
5k
0
99
0
199
1
99
1
10k
0
49
0
99
0
199
0
249
1
99
1
124
25k
0
19
0
39
0
79
0
99
0
159
0
199
50k
0
9
0
19
0
39
0
49
0
79
0
99
100k
0
4
0
9
0
19
0
24
0
39
0
49
250k
0
1
0
3
0
7
0
9
0
15
0
19
0
0*
0
1
0
3
0
4
0
7
0
9
0
0*
0
1
0
3
0
4
0
0*
0
1
0
0*
500k
1M
2.5M
n
N
124
⎯
⎯
2
249
⎯
⎯
249
2
99
2
124
124
1
199
1
249
5M
Legend:
Blank : Cannot be set.
⎯
: Can be set, but there will be a degree of error.
*
: Continuous transfer is not possible.
Table 13.7 Maximum Bit Rate with External Clock Input (Clocked Synchronous Mode)
External Input Maximum Bit Rate
(bps)
φ (MHz) Clock (MHz)
φ (MHz)
External Input Maximum Bit Rate
Clock (MHz)
(bps)
2
0.3333
0.333
12
2.0000
2.000
4
0.6667
0.667
14
2.6667
2.667
6
1.0000
1.000
16
3.0000
3.000
8
1.3333
1.333
20
3.3333
3.333
10
1.6667
1.667
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Section 13 Serial Communication Interface (SCI)
Table 13.8 Examples of Bit Rate for Various BRR Settings (Smart Card Interface Mode)
(When n = 0 and S = 372)
Operating Frequency φ (MHz)
5.00
7.00
Bit Rate
(bps)
N
Error (%)
6720
0
0.01
9600
0
30.00
7.1424
10.00
10.7136
Error (%)
N
Error (%)
N
Error (%)
N
1
30
1
28.75
1
0.01
1
7.14
0
1.99
0
0.00
1
30
1
25
N
Error (%)
Operating Frequency φ (MHz)
Bit Rate
(bps)
13.00
14.2848
16.00
18.00
20.00
N
Error (%)
N
Error (%)
N
Error (%)
N
Error (%)
N
Error (%)
6720
2
13.33
2
4.76
2
6.67
3
9.99
3
0.01
9600
1
8.99
1
0.00
1
12.01
2
15.99
2
6.66
Table 13.9 Maximum Bit Rate at Various Frequencies (Smart Card Interface Mode)
(When S = 372)
φ (MHz)
Maximum Bit Rate (bps)
n
N
5.00
6720
0
0
7.00
9409
0
0
7.1424
9600
0
0
10.00
13441
0
0
10.7136
14400
0
0
13.00
17473
0
0
14.2848
19200
0
0
16.00
21505
0
0
18.00
24194
0
0
20.00
26882
0
0
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Section 13 Serial Communication Interface (SCI)
13.3.10
Serial Expansion Mode Register (SEMR_0)
SEMR_0 is an 8-bit register that expands SCI_0 functions; such as setting of the basic clock,
selecting of the clock source, and automatic setting of the transfer rate.
Bit
Bit Name
Initial
Value
R/W
Description
7
⎯
0
R/W
Reserved
This is a readable/writable bit, but the write value should
always be 0.
6 to 4
⎯
All 0
⎯
Reserved
The write value should always be 0.
3
ABCS
0
R/W
Asynchronous Basic Clock Select
Selects the 1-bit-interval base clock in asynchronous
mode.
The ABCS setting is valid in asynchronous mode (C/A in
SMR = 0).
0: Operates on a basic clock with a frequency of 16-times
the transfer rate.
1: Operates on a basic clock with a frequency of 8-times
the transfer rate.
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Section 13 Serial Communication Interface (SCI)
Bit
Bit Name
Initial
Value
R/W
Description
2
ACS2
0
R/W
Asynchronous Clock Source Select
1
ACS1
0
R/W
0
ACS0
0
R/W
When an average transfer rate is selected, the base clock
is set automatically regardless of the ABCS value. Note
that average transfer rates are not supported for
operating frequencies other than 10.667 MHz and 16
MHz.
The ACS0 to ACS0 settings are valid when the external
clock input is selected (CKE1 in SCR = 1) in
asynchronous mode (C/A in SMR = 0).
000: External clock input
001: Selects the average transfer rate 115.152 kbps only
for φ = 10.667MHz (operates on a basic clock with a
frequency of 16-times the transfer rate).
001: Selects the average transfer rate 460.606 kbps only
for φ = 10.667MHz (operates on a basic clock with a
frequency of 8-times the transfer rate).
011: Reserved
100: TPU clock input (logical ANDs TIOCA1 and
TIOCA2)
101: 115.196 kbps average transfer rate (for φ = 6 MHz
only) is selected (SCI0 operates on base clock with
frequency of 16 times transfer rate)
110: 460.784 kbps average transfer rate (for φ = 6 MHz
only) is selected (SCI0 operates on base clock with
frequency of 16 times transfer rate)
111: 720 kbps average transfer rate (for φ = 6 MHz only)
is selected (SCI0 operates on base clock with
frequency of 8 times transfer rate)
Figure 13.3 and 13.4 shows an example of the internal base clock when the average transfer rate is
selected.
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1
1
2
2
4
5
1
1
2
2
8
7
10 11 12
5
7
8
3.6848 MHz
4 5
6
5.333 MHz
4
6
13 14
15 16
7
Average error with 460.6kbps = - 0.043%
Average transfer rate = 3.6848 MHz/8 = 460.606 kbps
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 1
Average error with 115.2kbps = - 0.043%
1 bit = Base clock x 16*
3
3
9
Average transfer rate = 1.8424 MHz/16 = 115.152 kbps
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 1
1 bit = Base clock x 16*
1.8424 MHz
4 5
6
7
Note: The 1-bit length changes according to the base clock synchronization.
3.6848 MHz (Average)
5.333 MHz x (38/55) =
5.333 MHz
10.667 MHz/2 =
Base clock
6
2.667 MHz
3
3
Average transfer rate when φ = 460.606 MHz
1.8424 MHz (Average)
2.667 MHz x (38/55) =
2.667 MHz
10.667 MHz/4 =
Base clock
Average transfer rate when φ = 10.667 MHz
2
2
3 4
3 4
Section 13 Serial Communication Interface (SCI)
Figure 13.3 Example of Internal Base Clock when Average Transfer Rate Is Selected (1)
1
1
3
3
4
5
4
1
1
1
1
8
13 14 15 16
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 1
3
3
4
5
4
6
7
8
9 10 11 12
13 14 15 16
7
5.76 MHz
4 5
6
6
8
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 1
1 bit = Base clock x 16*
3
4
8 MHz
Average error with 720kbps = - 0%
Average transfer rate = 5.76 MHz/8 = 720 kbps
2
3
5
Average error with 460.8kbps = - 0.004%
2
2
3 4
5
6
7 8
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59
1 bit = Base clock x 16*
7.3725 MHz
5 6 7 8
8 MHz
Average transfer rate = 7.3725 MHz/16 = 460.784 kbps
2
2
Note: The 1-bit length changes according to the base clock synchronization.
5.76 MHz (Average)
8 MHz x (18/5) =
16 MHz/2 = 8 MHz
Base clock
7
Average error with 115.2kbps = - 0.004%
Average transfer rate when φ = 720 kbps
7.3725 MHz (Average)
8 MHz x (47/51) =
16 MHz/2 = 8 MHz
Base clock
6
1.8431 MHz
5 6 7 8 9 10 11 12
1 bit = Base clock x 16*
2 MHz
Average transfer rate = 1.8431 MHz/16 = 115.196 kbps
2
2
Average transfer rate when φ = 460.784 kbps
1.8431 MHz (Average)
2 MHz x (47/51) =
16 MHz/8 = 2 MHz
Base clock
Average transfer rate when f = 115.196 kbps
Section 13 Serial Communication Interface (SCI)
Figure 13.4 Example of Internal Base Clock when Average Transfer Rate Is Selected (2)
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Section 13 Serial Communication Interface (SCI)
13.4
Operation in Asynchronous Mode
Figure 13.5 shows the general format for asynchronous serial communication. One frame consists
of a start bit (low level), followed by data, a parity bit, and finally stop bits (high level). In
asynchronous serial communication, the transmission line is usually held in the mark state (high
level). The SCI monitors the transmission line, and when it goes to the space state (low level),
recognizes a start bit and starts serial communication. Inside the SCI, the transmitter and receiver
are independent units, enabling full-duplex communication. Both the transmitter and the receiver
also have a double-buffered structure, so that data can be read or written during transmission or
reception, enabling continuous data transfer. In asynchronous mode, the SCI performs
synchronization at the falling edge of the start bit in reception. The SCI samples the data on the
8th pulse of a clock with a frequency of 16 times the length of one bit, so that the transfer data is
latched at the center of each bit.
The SCI_0 samples the data on the 4th pulse of a clock with a frequency of 8 times the length of
one bit when the ABCS bit in SEMR_0 is 1.
1
Serial
data
LSB
0
D0
Idle state
(mark state)
1
MSB
D1
D2
D3
D4
D5
Start
bit
Transmit/receive data
1 bit
7 or 8 bits
D6
D7
0/1
Parity
bit
1 bit,
or none
1
1
Stop bit
1 or
2 bits
One unit of transfer data (character or frame)
Figure 13.5 Data Format in Asynchronous Communication
(Example with 8-Bit Data, Parity, Two Stop Bits)
13.4.1
Data Transfer Format
Table 13.10 shows the data transfer formats that can be used in asynchronous mode. Any of 12
transfer formats can be selected according to the SMR setting. For details on the multiprocessor
bit, refer to section 13.5, Multiprocessor Communication Function.
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Section 13 Serial Communication Interface (SCI)
Table 13.10 Serial Transfer Formats (Asynchronous Mode)
SMR Settings
Serial Transfer Format and Frame Length
CHR
PE
MP
STOP
1
2
3
4
5
6
7
8
9
10
11
12
0
0
0
0
S
8-bit data
STOP
0
0
0
1
S
8-bit data
STOPSTOP
0
1
0
0
S
8-bit data
P STOP
0
1
0
1
S
8-bit data
P STOPSTOP
1
0
0
0
S
7-bit data
STOP
1
0
0
1
S
7-bit data
STOP STOP
1
1
0
0
S
7-bit data
P STOP
1
1
0
1
S
7-bit data
P STOPSTOP
0
—
1
0
S
8-bit data
MPB STOP
0
—
1
1
S
8-bit data
MPB STOPSTOP
1
—
1
0
S
7-bit data
MPB STOP
1
—
1
1
S
7-bit data
MPB STOPSTOP
Legend:
S:
Start bit
STOP: Stop bit
P:
Parity bit
MPB: Multiprocessor bit
Rev. 5.00 Sep. 01, 2009 Page 339 of 656
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Section 13 Serial Communication Interface (SCI)
13.4.2
Receive Data Sampling Timing and Reception Margin in Asynchronous Mode
In asynchronous mode, the SCI operates on a basic clock with a frequency of 16 times the transfer
rate. In reception, the SCI samples the falling edge of the start bit using the basic clock, and
performs internal synchronization. Receive data is latched internally at the rising edge of the 8th
pulse of the basic clock as shown in figure 13.6. Thus, the reception margin in asynchronous mode
is given by formula (1) below.
M = | (0.5 –
| D – 0.5 | (1 + F) | × 100 [%]
1
) – (L – 0.5) F –
N
2N
... Formula (1)
Where M:
N:
D:
L:
F:
Reception margin (%)
Ratio of bit rate to clock (N = 16)
Clock duty (D = 0 to 1.0)
Frame length (L = 9 to 12)
Absolute value of clock rate deviation
Assuming values of F (absolute value of clock rate deviation) = 0, D (clock duty) = 0.5, and N
(ratio of bit rate to clock) = 16 in formula (1), the reception margin can be given by the formula.
M = {0.5 – 1/(2 × 16)} × 100 [%] = 46.875%
However, this is only the computed value, and a margin of 20% to 30% should be allowed for in
system design.
16 clocks
8 clocks
0
7
15 0
7
15 0
Internal basic
clock
Receive data
(RxD)
Start bit
D0
Synchronization
sampling timing
Data sampling
timing
Figure 13.6 Receive Data Sampling Timing in Asynchronous Mode
Rev. 5.00 Sep. 01, 2009 Page 340 of 656
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D1
Section 13 Serial Communication Interface (SCI)
13.4.3
Clock
Either an internal clock generated by the on-chip baud rate generator or an external clock input at
the SCK pin can be selected as the SCI’s serial clock, according to the setting of the C/A bit in
SMR and the CKE0 and CKE1 bits in SCR. When an external clock is input at the SCK pin, the
clock frequency should be 16 times the bit rate used. When an external clock is selected, a base
clock with an average transfer rate can be selected by setting bits ACS2 to ACS0 in SEMR_0.
When the SCI is operated on an internal clock, the clock can be output from the SCK pin when
setting CKE1 = 0 and CKE0 = 1. The frequency of the clock output in this case is equal to the bit
rate, and the phase is such that the rising edge of the clock is in the middle of the transmit data, as
shown in figure 13.7.
SCK
TxD
0
D0
D1
D2
D3
D4
D5
D6
D7
0/1
1
1
1 frame
Figure 13.7 Relationship between Output Clock and Transfer Data Phase
(Asynchronous Mode)
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Section 13 Serial Communication Interface (SCI)
13.4.4
SCI Initialization (Asynchronous Mode)
Before transmitting and receiving data, you should first clear the TE and RE bits in SCR to 0, then
initialize the SCI as described below. When the operating mode, or transfer format, is changed for
example, the TE and RE bits must be cleared to 0 before making the change using the following
procedure. When the TE bit is cleared to 0, the TDRE flag is set to 1. Note that clearing the RE bit
to 0 does not initialize the contents of the RDRF, PER, FER, and ORER flags, or the contents of
RDR. When the external clock is used in asynchronous mode, the clock must be supplied even
during initialization.
Start initialization
[1] Set the clock selection in SCR.
Be sure to clear bits RIE, TIE,
TEIE, and MPIE, and bits TE and
RE, to 0.
Clear TE and RE bits in SCR to 0
Set CKE1 and CKE0 bits in SCR
(TE, RE bits 0)
[1]
When the clock is selected in
asynchronous mode, it is output
immediately after SCR settings are
made.
[2] Set the data transfer format in
SMR, SCMR and SEMR_0.
Set data transfer format in
SMR, SCMR, and SEMR_0
[2]
Set value in BRR
[3]
Wait
No
1-bit interval elapsed?
[3] Write a value corresponding to the
bit rate to BRR. Not necessary if
an external clock or an average
transfer rate clock by bits AC2 to
ACS0 in SEMR_0 is used.
[4] Wait at least one bit interval, then
set the TE bit or RE bit in SCR to 1.
Also set the RIE, TIE, TEIE, and
MPIE bits.
Yes
Set TE and RE bits* in
SCR to 1, and set RIE, TIE, TEIE,
and MPIE bits
<Initialization completion>
[4]
Note: * Perform this set operation with the
RxD pin in the 1 state. If the RE bit is
set to 1 with the RxD pin in the 0
state, it may be misinterpreted as a
start bit.
Figure 13.8 Sample SCI Initialization Flowchart
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Section 13 Serial Communication Interface (SCI)
13.4.5
Serial Data Transmission (Asynchronous Mode)
Figure 13.9 shows an example of operation for transmission in asynchronous mode. In
transmission, the SCI operates as described below.
1. The SCI monitors the TDRE flag in SSR. If the flag is cleared to 0, the SCI recognizes that
data has been written to TDR, and transfers the data from TDR to TSR.
2. After transferring data from TDR to TSR, the SCI sets the TDRE flag to 1 and starts
transmission. If the TIE bit is set to 1 at this time, a transmit data empty interrupt request (TXI)
is generated. Continuous transmission is possible because the TXI interrupt routine writes next
transmit data to TDR before transmission of the current transmit data has been completed.
3. Data is sent from the TxD pin in the following order: start bit, transmit data, parity bit or
multiprocessor bit (may be omitted depending on the format), and stop bit.
4. The SCI checks the TDRE flag at the timing for sending the stop bit.
5. If the TDRE flag is 0, the data is transferred from TDR to TSR, the stop bit is sent, and then
serial transmission of the next frame is started.
6. If the TDRE flag is 1, the TEND flag in SSR is set to 1, the stop bit is sent, and then the “mark
state” is entered, in which 1 is output. If the TEIE bit in SCR is set to 1 at this time, a TEI
interrupt request is generated.
1
Start
bit
0
Data
D0
D1
Parity Stop Start
bit
bit
bit
D7
0/1
1
0
Data
D0
D1
Parity Stop
bit
bit
D7
0/1
1
1
Idle state
(mark state)
TDRE
TEND
TXI interrupt
Data written to TDR and
TXI interrupt
request generated TDRE flag cleared to 0 in
request generated
TXI interrupt service routine
TEI interrupt
request generated
1 frame
Figure 13.9 Example of Operation in Transmission in Asynchronous Mode
(Example with 8-Bit Data, Parity, One Stop Bit)
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Section 13 Serial Communication Interface (SCI)
Figure 13.10 shows a sample flowchart for data transmission.
[1]
Initialization
Start transmission
Read TDRE flag in SSR
[2]
[2] SCI status check and transmit data
write:
Read SSR and check that the
TDRE flag is set to 1, then write
transmit data to TDR and clear the
TDRE flag to 0.
No
TDRE = 1
Yes
Write transmit data to TDR
and clear TDRE flag in SSR to 0
No
All data transmitted?
Yes
[3]
Read TEND flag in SSR
No
TEND = 1
Yes
No
Break output?
Yes
Clear DR to 0 and
set DDR to 1
Clear TE bit in SCR to 0
<End>
[1] SCI initialization:
The TxD pin is automatically
designated as the transmit data
output pin.
After the TE bit is set to 1, a frame
of 1s is output, and transmission is
enabled.
[4]
[3] Serial transmission continuation
procedure:
To continue serial transmission,
read 1 from the TDRE flag to
confirm that writing is possible,
then write data to TDR, and then
clear the TDRE flag to 0. Checking
and clearing of the TDRE flag is
automatic when the DTC* is
activated by a transmit data empty
interrupt (TXI) request, and data is
written to TDR. (H8S/2268 Group
only)
[4] Break output at the end of serial
transmission:
To output a break in serial
transmission, set DR for the port
corresponding to the TxD pin to 0,
clear DDR to 1, then clear the TE
bit in SCR to 0.
Note: * The case, in which the DTC
automatically checks and
clears the TDRE flag, occurs
only when DISEL in DTC is 0
with the transfer counter not
being 0.
Therefore, the TDRE flag
should be cleared by CPU
when DISEL is 1, or when
DISEL is 0 with the transfer
counter being 0.
Figure 13.10 Sample Serial Transmission Flowchart
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Section 13 Serial Communication Interface (SCI)
13.4.6
Serial Data Reception (Asynchronous Mode)
Figure 13.11 shows an example of operation for reception in asynchronous mode. In serial
reception, the SCI operates as described below.
1. The SCI monitors the communication line. If a start bit is detected, the SCI performs internal
synchronization, receives receive data in RSR, and checks the parity bit and stop bit.
2. If an overrun error occurs (when reception of the next data is completed while the RDRF flag
is still set to 1), the ORER bit in SSR is set to 1. If the RIE bit in SCR is set to 1 at this time, an
ERI interrupt request is generated. Receive data is not transferred to RDR. The RDRF flag
remains to be set to 1.
3. If a parity error is detected, the PER bit in SSR is set to 1 and receive data is transferred to
RDR. If the RIE bit in SCR is set to 1 at this time, an ERI interrupt request is generated.
4. If a framing error is detected (when the stop bit is 0), the FER bit in SSR is set to 1 and receive
data is transferred to RDR. If the RIE bit in SCR is set to 1 at this time, an ERI interrupt
request is generated.
5. If reception is completed successfully, the RDRF bit in SSR is set to 1, and receive data is
transferred to RDR. If the RIE bit in SCR is set to 1 at this time, an RXI interrupt request is
generated. Continuous reception is possible because the RXI interrupt routine reads the receive
data transferred to RDR before reception of the next receive data has been completed.
1
Start
bit
0
Data
D0
D1
Parity Stop Start
bit
bit
bit
D7
0/1
1
0
Data
D0
D1
Parity Stop
bit
bit
D7
0/1
0
1
Idle state
(mark state)
RDRF
FER
RXI interrupt
request
generated
RDR data read and RDRF
flag cleared to 0 in RXI
interrupt service routine
ERI interrupt request
generated by framing
error
1 frame
Figure 13.11 Example of SCI Operation in Reception
(Example with 8-Bit Data, Parity, One Stop Bit)
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Section 13 Serial Communication Interface (SCI)
Table 13.11 shows the states of the SSR status flags and receive data handling when a receive
error is detected. If a receive error is detected, the RDRF flag retains its state before receiving
data. Reception cannot be resumed while a receive error flag is set to 1. Accordingly, clear the
ORER, FER, PER, and RDRF bits to 0 before resuming reception. Figure 13.12 shows a sample
flow chart for serial data reception.
Table 13.11 SSR Status Flags and Receive Data Handling
SSR Status Flag
RDRF*
ORER
FER
PER
Receive Data
Receive Error Type
1
1
0
0
Lost
Overrun error
0
0
1
0
Transferred to RDR
Framing error
0
0
0
1
Transferred to RDR
Parity error
1
1
1
0
Lost
Overrun error + framing error
1
1
0
1
Lost
Overrun error + parity error
0
0
1
1
Transferred to RDR
Framing error + parity error
1
1
1
1
Lost
Overrun error + framing error +
parity error
Note: * The RDRF flag retains the state it had before data reception.
Rev. 5.00 Sep. 01, 2009 Page 346 of 656
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Section 13 Serial Communication Interface (SCI)
Initialization
[1]
Start reception
[1] SCI initialization:
The RxD pin is automatically
designated as the receive data input
pin.
[2] [3] Receive error processing and break
detection:
[2]
If a receive error occurs, read the
ORER, PER, and FER flags in SSR to
identify the error. After performing the
appropriate error processing, ensure
Yes
that the ORER, PER, and FER flags are
PER∨FER∨ORER = 1
all cleared to 0. Reception cannot be
[3]
resumed if any of these flags are set to
No
Error processing
1. In the case of a framing error, a
break can be detected by reading the
(Continued on next page)
value of the input port corresponding to
the RxD pin.
[4]
Read RDRF flag in SSR
[4] SCI status check and receive data read:
Read SSR and check that RDRF = 1,
then read the receive data in RDR and
RDRF = 1
clear the RDRF flag to 0. Transition of
the RDRF flag from 0 to 1 can also be
identified by an RXI interrupt.
Yes
Read ORER, PER, and
FER flags in SSR
No
Read receive data in RDR, and
clear RDRF flag in SSR to 0
No
All data received?
Yes
Clear RE bit in SCR to 0
<End>
[5]
[5] Serial reception continuation procedure:
To continue serial reception, before the
stop bit for the current frame is
received, read the RDRF flag, read
RDR, and clear the RDRF flag to 0.
The RDRF flag is cleared automatically
when DTC* is activated by an RXI
interrupt and the RDR value is read.
(H8S/2268 Group only)
Note: * The case, in which the DTC
automatically clears the RDRF flag,
occurs only when DISEL in DTC is
0 with the transfer counter not
being 0. Therefore, the RDRF flag
should be cleared by CPU when
DISEL is 1, or when DISEL is 0
with the transfer counter being 0.
Figure 13.12 Sample Serial Reception Data Flowchart (1)
Rev. 5.00 Sep. 01, 2009 Page 347 of 656
REJ09B0071-0500
Section 13 Serial Communication Interface (SCI)
[3]
Error processing
No
ORER = 1
Yes
Overrun error processing
No
FER = 1
Yes
Yes
Break?
No
Framing error processing
Clear RE bit in SCR to 0
No
PER = 1
Yes
Parity error processing
Clear ORER, PER, and
FER flags in SSR to 0
<End>
Figure 13.12 Sample Serial Reception Data Flowchart (2)
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Section 13 Serial Communication Interface (SCI)
13.5
Multiprocessor Communication Function
Use of the multiprocessor communication function enables data transfer between a number of
processors sharing communication lines by asynchronous serial communication using the
multiprocessor format, in which a multiprocessor bit is added to the transfer data. When
multiprocessor communication is performed, each receiving station is addressed by a unique ID
code. The serial communication cycle consists of two component cycles; an ID transmission cycle
that specifies the receiving station, and a data transmission cycle. The multiprocessor bit is used to
differentiate between the ID transmission cycle and the data transmission cycle. If the
multiprocessor bit is 1, the cycle is an ID transmission cycle; if the multiprocessor bit is 0, the
cycle is a data transmission cycle. Figure 13.13 shows an example of inter-processor
communication using the multiprocessor format. The transmitting station first sends the ID code
of the receiving station with which it wants to perform serial communication as data with a 1
multiprocessor bit added. It then sends transmit data as data with a 0 multiprocessor bit added.
When data with a 1 multiprocessor bit is received, the receiving station compares that data with its
own ID. The station whose ID matches then receives the data sent next. Stations whose IDs do not
match continue to skip data until data with a 1 multiprocessor bit is again received.
The SCI uses the MPIE bit in SCR to implement this function. When the MPIE bit is set to 1,
transfer of receive data from RSR to RDR, error flag detection, and setting the SSR status flags,
RDRF, FER, and ORER to 1, are inhibited until data with a 1 multiprocessor bit is received. On
reception of a receive character with a 1 multiprocessor bit, the MPB bit in SSR is set to 1 and the
MPIE bit is automatically cleared, thus normal reception is resumed. If the RIE bit in SCR is set to
1 at this time, an RXI interrupt is generated.
When the multiprocessor format is selected, the parity bit setting is rendered invalid. All other bit
settings are the same as those in normal asynchronous mode. The clock used for multiprocessor
communication is the same as that in normal asynchronous mode.
Rev. 5.00 Sep. 01, 2009 Page 349 of 656
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Section 13 Serial Communication Interface (SCI)
Transmitting
station
Serial transmission line
Receiving
station A
Receiving
station B
Receiving
station C
Receiving
station D
(ID = 01)
(ID = 02)
(ID = 03)
(ID = 04)
Serial
data
H'01
H'AA
(MPB = 1)
(MPB = 0)
ID transmission cycle = Data transmission cycle =
Data transmission to
receiving station
receiving station specified by ID
specification
Legend:
MPB: Multiprocessor bit
Figure 13.13 Example of Communication Using Multiprocessor Format
(Transmission of Data H'AA to Receiving Station A)
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Section 13 Serial Communication Interface (SCI)
13.5.1
Multiprocessor Serial Data Transmission
Figure 13.14 shows a sample flowchart for multiprocessor serial data transmission. For an ID
transmission cycle, set the MPBT bit in SSR to 1 before transmission. For a data transmission
cycle, clear the MPBT bit in SSR to 0 before transmission. All other SCI operations are the same
as those in asynchronous mode.
Initialization
[1]
Start transmission
Read TDRE flag in SSR
TDRE = 1
[2]
[2] SCI status check and transmit
data write:
Read SSR and check that the
TDRE flag is set to 1, then write
transmit data to TDR. Set the
MPBT bit in SSR to 0 or 1.
Finally, clear the TDRE flag to 0.
No
Yes
Write transmit data to TDR and
set MPBT bit in SSR
Clear TDRE flag to 0
All data transmitted?
No
[3]
Yes
Read TEND flag in SSR
TEND = 1
Yes
Clear DR to 0 and set DDR to 1
Clear TE bit in SCR to 0
[3] Serial transmission continuation
procedure:
To continue serial transmission,
be sure to read 1 from the TDRE
flag to confirm that writing is
possible, then write data to TDR,
and then clear the TDRE flag to
0. Checking and clearing of the
TDRE flag is automatic when the
DTC* is activated by a transmit
data empty interrupt (TXI)
request, and data is written to
TDR. (H8S/2268 Group only)
[4] Break output at the end of serial
transmission:
To output a break in serial
transmission, set the port DR to
0, clear DDR to 1, then clear the
TE bit in SCR to 0.
No
Yes
Break output?
[1] SCI initialization:
The TxD pin is automatically
designated as the transmit data
output pin.
After the TE bit is set to 1, a
frame of 1s is output, and
transmission is enabled.
No
[4]
Note: * The case, in which the DTC
automatically clears the
TDRE flag, occurs only when
DISEL in DTC is 0 with the
transfer counter not being 0.
Therefore, the TDRE flag
should be cleared by CPU
when DISEL is 1, or when
DISEL is 0 with the transfer
counter being 0.
<End>
Figure 13.14 Sample Multiprocessor Serial Transmission Flowchart
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Section 13 Serial Communication Interface (SCI)
13.5.2
Multiprocessor Serial Data Reception
Figure 13.16 shows a sample flowchart for multiprocessor serial data reception. If the MPIE bit in
SCR is set to 1, data is skipped until data with a 1 multiprocessor bit is sent. On receiving data
with a 1 multiprocessor bit, the receive data is transferred to RDR. An RXI interrupt request is
generated at this time. All other SCI operations are the same as in asynchronous mode. Figure
13.15 shows an example of SCI operation for multiprocessor format reception.
1
Start
bit
0
Data (ID1)
MPB
D0
D1
D7
1
Stop
bit
Start
bit
1
0
Data (Data1)
D0
D1
Stop
MPB bit
D7
0
1
1 Mark state
(idle state)
MPIE
RDRF
RDR
value
ID1
MPIE = 0
RXI interrupt
request
(multiprocessor
interrupt)
generated
If not this station’s ID,
MPIE bit is set to 1
again
RDR data read
and RDRF flag
cleared to 0 in
RXI interrupt
service routine
RXI interrupt request is
not generated, and RDR
retains its state
(a) Data does not match station’s ID
1
Start
bit
0
Data (ID2)
D0
D1
Stop
MPB bit
D7
1
1
Start
bit
0
Data (Data2)
D0
D1
D7
Stop
MPB bit
0
1
1 Mark state
(idle state)
MPIE
RDRF
RDR
value
ID1
MPIE = 0
Data2
ID2
RXI interrupt
request
(multiprocessor
interrupt)
generated
RDR data read and
RDRF flag cleared
to 0 in RXI interrupt
service routine
Matches this station’s ID,
so reception continues, and
data is received in RXI
interrupt service routine
MPIE bit set to 1
again
(b) Data matches station’s ID
Figure 13.15 Example of SCI Operation in Reception
(Example with 8-Bit Data, Multiprocessor Bit, One Stop Bit)
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Section 13 Serial Communication Interface (SCI)
Initialization
[1]
[1] SCI initialization:
The RxD pin is automatically designated
as the receive data input pin.
Start reception
Read MPIE bit in SCR
[2] ID reception cycle:
Set the MPIE bit in SCR to 1.
[2]
[3] SCI status check, ID reception and
comparison:
Read SSR and check that the RDRF
flag is set to 1, then read the receive
data in RDR and compare it with this
station’s ID.
If the data is not this station’s ID, set the
MPIE bit to 1 again, and clear the RDRF
flag to 0.
If the data is this station’s ID, clear the
RDRF flag to 0.
Read ORER and FER flags in SSR
Yes
FER∨ORER = 1
No
Read RDRF flag in SSR
[3]
No
RDRF = 1
[4] SCI status check and data reception:
Read SSR and check that the RDRF
flag is set to 1, then read the data in
RDR.
Yes
Read receive data in RDR
[5] Receive error processing and break
detection:
If a receive error occurs, read the ORER
and FER flags in SSR to identify the
error. After performing the appropriate
error processing, ensure that the ORER
and FER flags are all cleared to 0.
Reception cannot be resumed if either
of these flags is set to 1.
In the case of a framing error, a break
can be detected by reading the RxD pin
value.
No
This station’s ID?
Yes
Read ORER and FER flags in SSR
Yes
FER∨ORER = 1
No
Read RDRF flag in SSR
[4]
No
RDRF = 1
Yes
Read receive data in RDR
No
All data received?
[5]
Error processing
Yes
Clear RE bit in SCR to 0
(Continued on
next page)
<End>
Figure 13.16 Sample Multiprocessor Serial Reception Flowchart (1)
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Section 13 Serial Communication Interface (SCI)
[5]
Error processing
No
ORER = 1
Yes
Overrun error processing
No
FER = 1
Yes
Yes
Break?
No
Framing error processing
Clear RE bit in SCR to 0
Clear ORER, PER, and
FER flags in SSR to 0
<End>
Figure 13.16 Sample Multiprocessor Serial Reception Flowchart (2)
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Section 13 Serial Communication Interface (SCI)
13.6
Operation in Clocked Synchronous Mode
Figure 13.17 shows the general format for clocked synchronous communication. In clocked
synchronous mode, data is transmitted or received synchronous with clock pulses. In clocked
synchronous serial communication, data on the transmission line is output from one falling edge of
the serial clock to the next. In clocked synchronous mode, the SCI receives data in synchronous
with the rising edge of the serial clock. After 8-bit data is output, the transmission line holds the
MSB state. In clocked synchronous mode, no parity or multiprocessor bit is added. Inside the SCI,
the transmitter and receiver are independent units, enabling full-duplex communication through
the use of a common clock. Both the transmitter and the receiver also have a double-buffered
structure, so data can be read or written during transmission or reception, enabling continuous data
transfer.
One unit of transfer data (character or frame)
*
*
Synchronization
clock
LSB
Bit 0
Serial data
MSB
Bit 1
Bit 2
Bit 3
Bit 4
Don’t care
Bit 5
Bit 6
Bit 7
Don’t care
Note: * High except in continuous transfer
Figure 13.17 Data Format in Synchronous Communication (For LSB-First)
13.6.1
Clock
Either an internal clock generated by the on-chip baud rate generator or an external
synchronization clock input at the SCK pin can be selected, according to the setting of CKE0 and
CKE1 bits in SCR. When the SCI is operated on an internal clock, the serial clock is output from
the SCK pin. Eight serial clock pulses are output in the transfer of one character, and when no
transfer is performed the clock is fixed high.
13.6.2
SCI Initialization (Clocked Synchronous Mode)
Before transmitting and receiving data, the TE and RE bits in SCR should be cleared to 0, then the
SCI should be initialized as described in a sample flowchart in figure 13.18. When the operating
mode, or transfer format, is changed for example, the TE and RE bits must be cleared to 0 before
making the change using the following procedure. When the TE bit is cleared to 0, the TDRE flag
is set to 1. Note that clearing the RE bit to 0 does not change the contents of the RDRF, PER,
FER, and ORER flags, or the contents of RDR.
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Section 13 Serial Communication Interface (SCI)
Start initialization
[1] Set the clock selection in SCR. Be sure
to clear bits RIE, TIE, TEIE, and MPIE,
TE and RE, to 0.
Clear TE and RE bits in SCR to 0
[2] Set the data transfer format in SMR and
SCMR.
Set CKE1 and CKE0 bits in SCR
(TE, RE bits 0)
[1]
Set data transfer format in
SMR and SCMR
[2]
Set value in BRR
[3]
[3] Write a value corresponding to the bit
rate to BRR. Not necessary if an
external clock is used.
[4] Wait at least one bit interval, then set
the TE bit or RE bit in SCR to 1.
Also set the RIE, TIE TEIE, and MPIE
bits.
Setting the TE and RE bits enables the
TxD and RxD pins to be used.
Wait
No
1-bit interval elapsed?
Yes
Set TE and RE bits in SCR to 1, and
set RIE, TIE, TEIE, and MPIE bits
[4]
<Transfer start>
Note: In simultaneous transmit and receive operations, the TE and RE bits should both be cleared
to 0 or set to 1 simultaneously.
Figure 13.18 Sample SCI Initialization Flowchart
13.6.3
Serial Data Transmission (Clocked Synchronous Mode)
Figure 13.19 shows an example of SCI operation for transmission in clocked synchronous mode.
In serial transmission, the SCI operates as described below.
1. The SCI monitors the TDRE flag in SSR, and if the flag is 0, the SCI recognizes that data has
been written to TDR, and transfers the data from TDR to TSR.
2. After transferring data from TDR to TSR, the SCI sets the TDRE flag to 1 and starts
transmission. If the TIE bit in SCR is set to 1 at this time, a transmit data empty interrupt
(TXI) is generated. Continuous transmission is possible because the TXI interrupt routine
writes the next transmit data to TDR before transmission of the current transmit data has been
completed.
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Section 13 Serial Communication Interface (SCI)
3. 8-bit data is sent from the TxD pin synchronized with the output clock when output clock
mode has been specified, and synchronized with the input clock when use of an external clock
has been specified.
4. The SCI checks the TDRE flag at the timing for sending the MSB (bit 7).
5. If the TDRE flag is cleared to 0, data is transferred from TDR to TSR, and serial transmission
of the next frame is started.
6. If the TDRE flag is set to 1, the TEND flag in SSR is set to 1, and the TDRE flag maintains the
output state of the last bit. If the TEIE bit in SCR is set to 1 at this time, a TEI interrupt request
is generated. The SCK pin is fixed high.
Figure 13.20 shows a sample flow chart for serial data transmission. Even if the TDRE flag is
cleared to 0, transmission will not start while a receive error flag (ORER, FER, or PER) is set to 1.
Make sure that the receive error flags are cleared to 0 before starting transmission. Note that
clearing the RE bit to 0 does not clear the receive error flags.
Transfer direction
Synchronization
clock
Serial data
Bit 0
Bit 1
Bit 7
Bit 0
Bit 1
Bit 6
Bit 7
TDRE
TEND
TXI interrupt
request generated
Data written to TDR
and TDRE flag cleared
to 0 in TXI interrupt
service routine
TXI interrupt
request generated
TEI interrupt request
generated
1 frame
Figure 13.19 Sample SCI Transmission Operation in Clocked Synchronous Mode
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Section 13 Serial Communication Interface (SCI)
[1]
Initialization
Start transmission
Read TDRE flag in SSR
[2]
No
TDRE = 1
Yes
Write transmit data to TDR and
clear TDRE flag in SSR to 0
No
All data transmitted?
[3]
Yes
[1] SCI initialization:
The TxD pin is automatically
designated as the transmit data output
pin.
[2] SCI status check and transmit data
write:
Read SSR and check that the TDRE
flag is set to 1, then write transmit data
to TDR and clear the TDRE flag to 0.
[3] Serial transmission continuation
procedure:
To continue serial transmission, be
sure to read 1 from the TDRE flag to
confirm that writing is possible, then
write data to TDR, and then clear the
TDRE flag to 0.
Checking and clearing of the TDRE
flag is automatic when the DTC* is
activated by a transmit data empty
interrupt (TXI) request and data is
written to TDR. (H8S/2268 Group
only)
Read TEND flag in SSR
No
TEND = 1
Yes
Clear TE bit in SCR to 0
Note: * The case, in which the DTC
automatically clears the TDRE
flag, occurs only when DISEL in
DTC is 0 with the transfer counter
not being 0. Therefore, the TDRE
flag should be cleared by CPU
when DISEL is 1, or when DISEL
is 0 with the transfer counter
being 0.
<End>
Figure 13.20 Sample Serial Transmission Flowchart
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Section 13 Serial Communication Interface (SCI)
13.6.4
Serial Data Reception (Clocked Synchronous Mode)
Figure 13.21 shows an example of SCI operation for reception in clocked synchronous mode. In
serial reception, the SCI operates as described below.
1. The SCI performs internal initialization synchronous with a synchronous clock input or output,
starts receiving data, and stores the received data in RSR.
2. If an overrun error occurs (when reception of the next data is completed while the RDRF flag
in SSR is still set to 1), the ORER bit in SSR is set to 1. If the RIE bit in SCR is set to 1 at this
time, an ERI interrupt request is generated, receive data is not transferred to RDR, and the
RDRF flag remains to be set to 1.
3. If reception is completed successfully, the RDRF bit in SSR is set to 1, and receive data is
transferred to RDR. If the RIE bit in SCR is set to 1 at this time, an RXI interrupt request is
generated. Continuous reception is possible because the RXI interrupt routine reads the receive
data transferred to RDR before reception of the next receive data has finished.
Synchronization
clock
Serial data
Bit 7
Bit 0
Bit 7
Bit 0
Bit 1
Bit 6
Bit 7
RDRF
ORER
RXI interrupt
request
generated
RDR data read and
RDRF flag cleared
to 0 in RXI interrupt
RXI interrupt
request generated
ERI interrupt request
generated by overrun
error
1 frame
Figure 13.21 Example of SCI Operation in Reception
Reception cannot be resumed while a receive error flag is set to 1. Accordingly, clear the ORER,
FER, PER, and RDRF bits to 0 before resuming reception. Figure 13.22 shows a sample flow
chart for serial data reception.
An overrun error occurs or synchronous clocks are output until the RE bit is cleared to 0 when an
internal clock is selected and only receive operation is possible. When a transmission and
reception will be carried out in a unit of one frame, be sure to carry out a dummy transmission
with only one frame by the simultaneous transmit and receive operations at the same time.
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Section 13 Serial Communication Interface (SCI)
Initialization
[1]
Start reception
[2]
Read ORER flag in SSR
Yes
ORER = 1
[3]
No
Error processing
(Continued below)
Read RDRF flag in SSR
[4]
No
RDRF = 1
Yes
Read receive data in RDR, and
clear RDRF flag in SSR to 0
No
All data received?
Yes
[5]
[1] SCI initialization:
The RxD pin is automatically
designated as the receive data input
pin.
[2] [3] Receive error processing:
If a receive error occurs, read the
ORER flag in SSR, and after
performing the appropriate error
processing, clear the ORER flag to 0.
Transfer cannot be resumed if the
ORER flag is set to 1.
[4] SCI status check and receive data
read:
Read SSR and check that the RDRF
flag is set to 1, then read the receive
data in RDR and clear the RDRF flag
to 0.
Transition of the RDRF flag from 0 to 1
can also be identified by an RXI
interrupt.
[5] Serial reception continuation
procedure:
To continue serial reception, before
the final bit of the current frame is
received, reading the RDRF flag,
reading RDR, and clearing the RDRF
flag to 0 should be finished. The
RDRF flag is cleared automatically
when the DTC* is activated by a
receive data full interrupt (RXI) request
and the RDR value is read. (H8S/2268
Group only)
Clear RE bit in SCR to 0
<End>
[3]
Error processing
Overrun error processing
Note: * The case, in which the DTC
automatically clears the RDRF
flag, occurs only when DISEL in
DTC is 0 with the transfer counter
not being 0. Therefore, the RDRF
flag should be cleared by CPU
when DISEL is 1, or when DISEL
is 0 with the transfer counter
being 0.
Clear ORER flag in SSR to 0
<End>
Figure 13.22 Sample Serial Reception Flowchart
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Section 13 Serial Communication Interface (SCI)
13.6.5
Simultaneous Serial Data Transmission and Reception (Clocked Synchronous
Mode)
Figure 13.23 shows a sample flowchart for simultaneous serial transmit and receive operations.
The following procedure should be used for simultaneous serial data transmit and receive
operations. To switch from transmit mode to simultaneous transmit and receive mode, after
checking that the SCI has finished transmission and the TDRE and TEND flags are set to 1, clear
TE to 0. Then simultaneously set TE and RE to 1 with a single instruction. To switch from receive
mode to simultaneous transmit and receive mode, after checking that the SCI has finished
reception, clear RE to 0. Then after checking that the RDRF and receive error flags (ORER, FER,
and PER) are cleared to 0, simultaneously set TE and RE to 1 with a single instruction.
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Section 13 Serial Communication Interface (SCI)
Initialization
[1]
[1]
SCI initialization:
The TxD pin is designated as the
transmit data output pin, and the RxD
pin is designated as the receive data
input pin, enabling simultaneous
transmit and receive operations.
[2]
[2]
SCI status check and transmit data
write:
Read SSR and check that the TDRE
flag is set to 1, then write transmit
data to TDR and clear the TDRE flag
to 0.
Transition of the TDRE flag from 0 to
1 can also be identified by a TXI
interrupt.
Receive error processing:
If a receive error occurs, read the
ORER flag in SSR, and after
performing the appropriate error
processing, clear the ORER flag to 0.
Transmission/reception cannot be
resumed if the ORER flag is set to 1.
Start transmission/reception
Read TDRE flag in SSR
No
TDRE = 1
Yes
Write transmit data to TDR and
clear TDRE flag in SSR to 0
[3]
Read ORER flag in SSR
ORER = 1
No
Read RDRF flag in SSR
Yes
Yes
Read receive data in RDR, and
clear RDRF flag in SSR to 0
No
Clear TE and RE bits in SCR to 0
<End>
[5]
Serial transmission/reception
continuation procedure:
To continue serial transmission/
reception, before the final bitof the
current frame is received, finish
reading the RDRF flag, reading RDR,
and clearing the RDRF flag to 0.
Also, before the final bit of the current
frame is transmitted, read 1 from the
TDRE flag to confirm that writing is
possible. Then write data to TDR and
clear the TDRE flag to 0.
Checking and clearing of the TDRE
flag is automatic when the DTC* is
activated by a transmit data empty
interrupt (TXI) request and data is
written to TDR. Also, the RDRF flag
is cleared automatically when the
DTC* is activated by a receive data
full interrupt (RXI) request and the
RDR value is read. (H8S/2268
[4]
RDRF = 1
Yes
SCI status check and receive data
read:
Read SSR and check that the RDRF
flag is set to 1, then read the receive
data in RDR and clear the RDRF flag
to 0. Transition of the RDRF flag from
0 to 1 can also be identified by an RXI
interrupt.
Error processing
No
All data received?
[4]
[3]
[5]
Group only)
Notes: When switching from transmit or receive operation to simultaneous transmit and receive operations, first clear
the TE bit and RE bit to 0, then set both these bits to 1 by one instruction simultaneously.
* The case, in which the DTC automatically clears the TDRE flag or RDRF flag, occurs only when DISEL in
the corresponding DTC transfer is 0 with the transfer counter not being 0. Therefore, the corresponding
flag should be cleared by CPU when DISEL in the corresponding DTC transfer is 1, or when DISEL is 0
with the transfer counter being 0.
Figure 13.23 Sample Flowchart of Simultaneous Serial Transmit and Receive Operations
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Section 13 Serial Communication Interface (SCI)
13.7
Operation in Smart Card Interface
The SCI supports an IC card (Smart Card) interface that conforms to ISO/IEC 7816-3
(Identification Card) as a serial communication interface extension function. Switching between
the normal serial communication interface and the Smart Card interface mode is carried out by
means of a register setting.
13.7.1
Pin Connection Example
Figure 13.24 shows an example of connection with the Smart Card. In communication with an IC
card, as both transmission and reception are carried out on a single data transmission line, the TxD
pin and RxD pin should be connected to the LSI pin. The data transmission line should be pulled
up to the VCC power supply with a resistor. If an IC card is not connected, and the TE and RE bits
are both set to 1, closed transmission/reception is possible, enabling self-diagnosis to be carried
out. When the clock generated on the Smart Card interface is used by an IC card, the SCK pin
output is input to the CLK pin of the IC card. This LSI port output is used as the reset signal.
VCC
TxD
RxD
SCK
Px (port)
This LSI
Data line
Clock line
Reset line
I/O
CLK
RST
IC card
Connected equipment
Figure 13.24 Schematic Diagram of Smart Card Interface Pin Connections
13.7.2
Data Format (Except for Block Transfer Mode)
Figure 13.25 shows the transfer data format in Smart Card interface mode.
• One frame consists of 8-bit data plus a parity bit in asynchronous mode.
• In transmission, a guard time of at least 2 etu (Elementary Time Unit: the time for transfer of
one bit) is left between the end of the parity bit and the start of the next frame.
• If a parity error is detected during reception, a low error signal level is output for one etu
period, 10.5 etu after the start bit.
• If an error signal is sampled during transmission, the same data is retransmitted automatically
after a delay of 2 etu or longer.
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Section 13 Serial Communication Interface (SCI)
When there is no parity error
Ds
D0
D1
D2
D3
D4
D5
D6
D7
Dp
D6
D7
Dp
Transmitting station output
When a parity error occurs
Ds
D0
D1
D2
D3
D4
D5
DE
Transmitting station output
Legend:
DS:
D0 to D7:
Dp:
DE:
Receiving station
output
Start bit
Data bits
Parity bit
Error signal
Figure 13.25 Normal Smart Card Interface Data Format
Data transfer with other types of IC cards (direct convention and inverse convention) are
performed as described in the following.
(Z)
A
Z
Z
A
Z
Z
Z
A
A
Z
Ds
D0
D1
D2
D3
D4
D5
D6
D7
Dp
(Z)
State
Figure 13.26 Direct Convention (SDIR = SINV = O/E = 0)
With the direction convention type IC and the above sample start character, the logic 1 level
corresponds to state Z and the logic 0 level to state A, and transfer is performed in LSB-first order.
The start character data above is H'3B. For the direct convention type, clear the SDIR and SINV
bits in SCMR to 0. According to Smart Card regulations, clear the O/E bit in SMR to 0 to select
even parity mode.
(Z)
A
Z
Z
A
A
A
A
A
A
Z
Ds
D7
D6
D5
D4
D3
D2
D1
D0
Dp
(Z)
State
Figure 13.27 Inverse Convention (SDIR = SINV = O/E = 1)
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Section 13 Serial Communication Interface (SCI)
With the inverse convention type, the logic 1 level corresponds to state A and the logic 0 level to
state Z, and transfer is performed in MSB-first order. The start character data for the above is
H'3F. For the inverse convention type, set the SDIR and SINV bits in SCMR to 1. According to
Smart Card regulations, even parity mode is the logic 0 level of the parity bit, and corresponds to
state Z. In this LSI, the SINV bit inverts only data bits D0 to D7. Therefore, set the O/E bit in
SMR to 1 to invert the parity bit for both transmission and reception.
13.7.3
Block Transfer Mode
Operation in block transfer mode is the same as that in the normal Smart Card interface mode,
except for the following points.
• In reception, though the parity check is performed, no error signal is output even if an error is
detected. However, the PER bit in SSR is set to 1 and must be cleared before receiving the
parity bit of the next frame.
• In transmission, a guard time of at least 1 etu is left between the end of the parity bit and the
start of the next frame.
• In transmission, because retransmission is not performed, the TEND flag is set to 1, 11.5 etu
after transmission start.
• As with the normal Smart Card interface, the ERS flag indicates the error signal status, but
since error signal transfer is not performed, this flag is always cleared to 0.
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Section 13 Serial Communication Interface (SCI)
13.7.4
Receive Data Sampling Timing and Reception Margin
In Smart Card interface mode an internal clock generated by the on-chip baud rate generator can
only be used as a transmission/reception clock. In this mode, the SCI operates on a basic clock
with a frequency of 32, 64, 372, or 256 times the transfer rate (fixed to 16 times in normal
asynchronous mode) as determined by bits BCP1 and BCP0. In reception, the SCI samples the
falling edge of the start bit using the basic clock, and performs internal synchronization. As shown
in figure 13.28, by sampling receive data at the rising-edge of the 16th, 32nd, 186th, or 128th
pulse of the basic clock, data can be latched at the middle of the bit. The reception margin is given
by the following formula.
M = | (0.5 –
| D – 0.5 |
1
) – (L – 0.5) F –
(1 + F) | × 100%
N
2N
Where M: Reception margin (%)
N: Ratio of bit rate to clock (N = 32, 64, 372, and 256)
D: Clock duty (D = 0 to 1.0)
L: Frame length (L = 10)
F: Absolute value of clock frequency deviation
Assuming values of F = 0, D = 0.5 and N = 372 in the above formula, the reception margin
formula is as follows.
M = (0.5 – 1/2 × 372) × 100%
= 49.866%
372 clocks
186 clocks
0
185
185
371 0
371 0
Internal
basic clock
Receive data
(RxD)
Start bit
D0
D1
Synchronization
sampling timing
Data sampling
timing
Figure 13.28 Receive Data Sampling Timing in Smart Card Mode
(Using Clock of 372 Times the Transfer Rate)
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Section 13 Serial Communication Interface (SCI)
13.7.5
Initialization
Before transmitting and receiving data, initialize the SCI as described below. Initialization is also
necessary when switching from transmit mode to receive mode, or vice versa.
1. Clear the TE and RE bits in SCR to 0.
2. Clear the error flags ERS, PER, and ORER in SSR to 0.
3. Set the GM, BLK, O/E, BCP0, BCP1, CKS0, CKS1 bits in SMR. Set the PE bit to 1.
4. Set the SMIF, SDIR, and SINV bits in SCMR.
When the SMIF bit is set to 1, the TxD and RxD pins are both switched from ports to SCI pins,
and are placed in the high-impedance state.
5. Set the value corresponding to the bit rate in BRR.
6. Set the CKE0 and CKE1 bits in SCR. Clear the TIE, RIE, TE, RE, MPIE, and TEIE bits to 0.
If the CKE0 bit is set to 1, the clock is output from the SCK pin.
7. Wait at least one bit interval, then set the TIE, RIE, TE, and RE bits in SCR. Do not set the TE
bit and RE bit at the same time, except for self-diagnosis.
To switch from receive mode to transmit mode, after checking that the SCI has finished reception,
initialize the SCI, and set RE to 0 and TE to 1. Whether SCI has finished reception or not can be
checked with the RDRF, PER, or ORER flags. To switch from transmit mode to receive mode,
after checking that the SCI has finished transmission, initialize the SCI, and set TE to 0 and RE to
1. Whether SCI has finished transmission or not can be checked with the TEND flag.
13.7.6
Serial Data Transmission (Except for Block Transfer Mode)
As data transmission in Smart Card interface mode involves error signal sampling and
retransmission processing, the operations are different from those in normal serial communication
interface mode (except for block transfer mode). Figure 13.29 illustrates the retransfer operation
when the SCI is in transmit mode.
1. If an error signal is sent back from the receiving end after transmission of one frame is
complete, the ERS bit in SSR is set to 1. If the RIE bit in SCR is enabled at this time, an ERI
interrupt request is generated. The ERS bit in SSR should be cleared to 0 by the time the next
parity bit is sampled.
2. The TEND bit in SSR is not set for a frame in which an error signal indicating an abnormality
is received. Data is retransferred from TDR to TSR, and retransmitted automatically.
3. If an error signal is not sent back from the receiving end, the ERS bit in SSR is not set.
Transmission of one frame, including a retransfer, is judged to have been completed, and the
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Section 13 Serial Communication Interface (SCI)
TEND bit in SSR is set to 1. If the TIE bit in SCR is enabled at this time, a TXI interrupt
request is generated. Writing transmit data to TDR transfers the next transmit data.
Figure 13.31 shows a flowchart for transmission. In the H8S/2268 Group, a sequence of transmit
operations can be performed automatically by specifying the DTC to be activated with a TXI
interrupt source. In a transmit operation, the TDRE flag is set to 1 at the same time as the TEND
flag in SSR is set, and a TXI interrupt will be generated if the TIE bit in SCR has been set to 1. If
the TXI request is designated beforehand as a DTC activation source, the DTC will be activated
by the TXI request, and transfer of the transmit data will be carried out. At this moment, when the
DISEL bit in DTC is 0 and the transfer counter is other than 0, the TDRE and TEND flags are
automatically cleared to 0 when data is transferred by the DTC. When the DISEL bit in the
corresponding DTC is 1, or both DISEL bit and the transfer counter are 0, flags are not cleared
although transfer data is written to TDR by DTC. Consequently give the CPU an instruction of
flag clear processing. In addition, in the event of an error, the SCI retransmits the same data
automatically. During this period, the TEND flag remains cleared to 0 and the DTC is not
activated. Therefore, the SCI and DTC will automatically transmit the specified number of bytes
in the event of an error, including retransmission. However, the ERS flag is not cleared
automatically when an error occurs, and so the RIE bit should be set to 1 beforehand so that an
ERI request will be generated in the event of an error, and the ERS flag will be cleared.
When performing transfer using the DTC, it is essential to set and enable the DTC before carrying
out SCI setting. For details of the DTC setting procedures, refer to section 8, Data Transfer
Controller (DTC).
nth transfer frame
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp DE
Transfer
frame n+1
Retransferred frame
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
(DE)
Ds D0 D1 D2 D3 D4
TDRE
Transfer to TSR from TDR
Transfer to TSR from TDR
TEND
FER/ERS
Figure 13.29 Retransfer Operation in SCI Transmit Mode
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Transfer to TSR
from TDR
Section 13 Serial Communication Interface (SCI)
The timing for setting the TEND flag depends on the value of the GM bit in SMR. The TEND flag
set timing is shown in figure 13.30.
I/O data
Ds
TXI
(TEND interrupt)
D0
D1
D2
D3
D4
D5
D6
D7
Dp
DE
Guard
time
12.5etu
When GM = 0
11.0etu
When GM = 1
Legend:
Ds:
D0 to D7:
Dp:
DE:
Start bit
Data bits
Parity bit
Error signal
Figure 13.30 TEND Flag Generation Timing in Transmission Operation
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Section 13 Serial Communication Interface (SCI)
Start
Initialization
Start transmission
ERS = 0?
No
Yes
Error processing
No
TEND = 1?
Yes
Write data to TDR,
and clear TDRE flag
in SSR to 0
No
All data transmitted ?
Yes
No
ERS = 0?
Yes
Error processing
No
TEND = 1?
Yes
Clear TE bit to 0
End
Figure 13.31 Example of Transmission Processing Flow
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Section 13 Serial Communication Interface (SCI)
13.7.7
Serial Data Reception (Except for Block Transfer Mode)
Data reception in Smart Card interface mode uses the same operation procedure as for normal
serial communication interface mode. Figure 13.32 illustrates the retransfer operation when the
SCI is in receive mode.
1. If an error is found when the received parity bit is checked, the PER bit in SSR is
automatically set to 1. If the RIE bit in SCR is set at this time, an ERI interrupt request is
generated. The PER bit in SSR should be kept cleared to 0 until the next parity bit is sampled.
2. The RDRF bit in SSR is not set for a frame in which an error has occurred.
3. If no error is found when the received parity bit is checked, the PER bit in SSR is not set to 1,
the receive operation is judged to have been completed normally, and the RDRF flag in SSR is
automatically set to 1. If the RIE bit in SCR is enabled at this time, an RXI interrupt request is
generated.
Figure 13.33 shows a flowchart for reception. In the H8S/2268 Group, a sequence of receive
operations can be performed automatically by specifying the DTC to be activated using an RXI
interrupt source. In a receive operation, an RXI interrupt request is generated when the RDRF flag
in SSR is set to 1. If the RXI request is designated beforehand as a DTC activation source, the
DTC will be activated by the RXI request, and the receive data will be transferred. The RDRF flag
is cleared to 0 automatically when the DISEL bit in DTC is 0 and the transfer counter is other than
0. When the DISEL bit in DTC is 1, or both the DISEL bit and the transfer counter are 0, flag is
not cleared although the receive data is transferred by DTC. Consequently, give the CPU an
instruction of flag clear processing. If an error occurs in receive mode and the ORER or PER flag
is set to 1, a transfer error interrupt (ERI) request will be generated. Hence, so the error flag must
be cleared to 0. In the event of an error, the DTC is not activated and receive data is skipped.
Therefore, receive data is transferred for only the specified number of bytes in the event of an
error. Even when a parity error occurs in receive mode and the PER flag is set to 1, the data that
has been received is transferred to RDR and can be read from there.
Note: For details on receive operations in block transfer mode, refer to section 13.4, Operation in
Asynchronous Mode.
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Section 13 Serial Communication Interface (SCI)
nth transfer frame
Transfer
frame n+1
Retransferred frame
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp DE
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
(DE)
Ds D0 D1 D2 D3 D4
RDRF
PER
Figure 13.32 Retransfer Operation in SCI Receive Mode
Start
Initialization
Start reception
ORER = 0 and
PER = 0
No
Yes
Error processing
No
RDRF = 1?
Yes
Read RDR and clear
RDRF flag in SSR to 0
No
All data received?
Yes
Clear RE bit to 0
Figure 13.33 Example of Reception Processing Flow
13.7.8
Clock Output Control
When the GM bit in SMR is set to 1, the clock output level can be fixed with bits CKE0 and
CKE1 in SCR. At this time, the minimum clock pulse width can be made the specified width.
Figure 13.34 shows the timing for fixing the clock output level. In this example, GM is set to 1,
CKE1 is cleared to 0, and the CKE0 bit is controlled.
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Section 13 Serial Communication Interface (SCI)
CKE0
SCK
Specified pulse width
Specified pulse width
Figure 13.34 Timing for Fixing Clock Output Level
When turning on the power or switching between Smart Card interface mode and software
standby mode, the following procedures should be followed in order to maintain the clock duty.
Powering on: To secure clock duty from power-on, the following switching procedure should be
followed.
1. The initial state is port input and high impedance. Use a pull-up resistor or pull-down resistor
to fix the potential.
2. Fix the SCK pin to the specified output level with the CKE1 bit in SCR.
3. Set SMR and SCMR, and switch to smart card mode operation.
4. Set the CKE0 bit in SCR to 1 to start clock output.
When changing from smart card interface mode to software standby mode:
1. Set the data register (DR) and data direction register (DDR) corresponding to the SCK pin to
the value for the fixed output state in software standby mode.
2. Write 0 to the TE bit and RE bit in the serial control register (SCR) to halt transmit/receive
operation. At the same time, set the CKE1 bit to the value for the fixed output state in software
standby mode.
3. Write 0 to the CKE0 bit in SCR to halt the clock.
4. Wait for one serial clock period.
During this interval, clock output is fixed at the specified level, with the duty preserved.
5. Make the transition to the software standby state.
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Section 13 Serial Communication Interface (SCI)
When returning to smart card interface mode from software standby mode:
1. Exit the software standby state.
2. Write 1 to the CKE0 bit in SCR and output the clock. Signal generation is started with the
normal duty.
Normal operation
Software
standby
Normal operation
Figure 13.35 Clock Halt and Restart Procedure
13.8
Interrupt Sources
13.8.1
Interrupts in Normal Serial Communication Interface Mode
Table 13.12 shows the interrupt sources in normal serial communication interface mode. A
different interrupt vector is assigned to each interrupt source, and individual interrupt sources can
be enabled or disabled using the enable bits in SCR.
When the TDRE flag in SSR is set to 1, a TXI interrupt request is generated. When the TEND flag
in SSR is set to 1, a TEI interrupt request is generated.
A TXI interrupt can activate the DTC to perform data transfer. The TDRE flag is cleared to 0
automatically when data is transferred by the DTC. (H8S/2268 Group only)
When the RDRF flag in SSR is set to 1, an RXI interrupt request is generated. When the ORER,
PER, or FER flag in SSR is set to 1, an ERI interrupt request is generated.
An RXI interrupt request can activate the DTC to transfer data. The RDRF flag is cleared to 0
automatically when data is transferred by the DTC*. (H8S/2268 Group only)
A TEI interrupt is requested when the TEND flag is set to 1 and the TEIE bit is set to 1. If a TEI
interrupt and a TXI interrupt are requested simultaneously, the TXI interrupt has priority for
acceptance. However, if the TDRE and TEND flags are cleared simultaneously by the TXI
interrupt routine, the SCI cannot branch to the TEI interrupt routine later.
Note: * Flags are cleared only when the DISEL bit in DTC is 0 with the transfer counter other
than 0.
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Section 13 Serial Communication Interface (SCI)
Table 13.12 Interrupt Sources of Serial Communication Interface Mode
Channel
Name
Interrupt Source
Interrupt Flag
DTC Activation*
0
ERI0
Receive Error
ORER, FER, PER
Not possible
RXI0
Receive Data Full
RDRF
Possible
TXI0
Transmit Data Empty
TDRE
Possible
TEI0
Transmission End
TEND
Not possible
ERI1
Receive Error
ORER, FER, PER
Not possible
RXI1
Receive Data Full
RDRF
Possible
TXI1
Transmit Data Empty
TDRE
Possible
TEI1
Transmission End
TEND
Not possible
ERI2
Receive Error
ORER, FER, PER
Not possible
RXI2
Receive Data Full
RDRF
Possible
TXI2
Transmit Data Empty
TDRE
Possible
TEI2
Transmission End
TEND
Not possible
1
2
2
Priority*
1
High
Low
Notes: 1. Indicates the initial state immediately after a reset.
Priorities in channels can be changed by the interrupt controller. (H8S/2268 Group only)
2. Supported only by the H8S/2268 Group.
13.8.2
Interrupts in Smart Card Interface Mode
Table 13.13 shows the interrupt sources in Smart Card interface mode. The transmit end interrupt
(TEI) request cannot be used in this mode.
Note: In case of block transfer mode, see 13.8.1, Interrupts in Nomal Serial Communication
Interface Mode.
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Section 13 Serial Communication Interface (SCI)
Table 13.13 Interrupt Sources in Smart Card Interface Mode
Channel
Name
Interrupt Source
Interrupt Flag
DTC
2
Activation*
Priority*
0
ERI0
Receive Error, detection
ORER, PER, ERS
Not possible
High
RXI0
Receive Data Full
RDRF
Possible
TXI0
Transmit Data Empty
TEND
Possible
ERI1
Receive Error, detection
ORER, PER, ERS
Not possible
RXI1
Receive Data Full
RDRF
Possible
TXI1
Transmit Data Empty
TEND
Possible
ERI2
Receive Error, detection
ORER, PER, ERS
Not possible
RXI2
Receive Data Full
RDRF
Possible
TXI2
Transmit Data Empty
TEND
Possible
1
2
1
Low
Notes: 1. Indicates the initial state immediately after a reset.
Priorities in channels can be changed by the interrupt controller. (H8S/2268 Group only)
2. Supported only by the H8S/2268 Group.
13.9
13.9.1
Usage Notes
Module Stop Mode Setting
SCI operation can be disabled or enabled using the module stop control register. The initial setting
is for SCI operation to be halted. Register access is enabled by clearing module stop mode. For
details, refer to section 22, Power-Down Modes.
13.9.2
Break Detection and Processing (Asynchronous Mode Only)
When framing error (FER) detection is performed, a break can be detected by reading the RxD pin
value directly. In a break, the input from the RxD pin becomes all 0s, setting the FER flag, and
possibly the PER flag. Note that as the SCI continues the receive operation after receiving a break,
even if the FER flag is cleared to 0, it will be set to 1 again.
13.9.3
Mark State and Break Detection (Asynchronous Mode Only)
When TE is 0, the TxD pin is used as an I/O port whose direction (input or output) and level are
determined by DDR. This can be used to set the TxD pin to mark state (high level) or send a break
during serial data transmission. To maintain the communication line at mark state until TE is set to
1, set both DDR and DR to 1. As TE is cleared to 0 at this point, the TxD pin becomes an I/O port,
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Section 13 Serial Communication Interface (SCI)
and 1 is output from the TxD pin. To send a break during serial transmission, first set PDR to 1
and DR to 0, and then clear TE to 0. When TE is cleared to 0, the transmitter is initialized
regardless of the current transmission state, the TxD pin becomes an I/O port, and 0 is output from
the TxD pin.
13.9.4
Receive Error Flags and Transmit Operations (Clocked Synchronous Mode Only)
Transmission cannot be started when a receive error flag (ORER, PER, or FER) is set to 1, even if
the TDRE flag is cleared to 0. Be sure to clear the receive error flags to 0 before starting
transmission. Note also that receive error flags cannot be cleared to 0 even if the RE bit is cleared
to 0.
13.9.5
Restrictions on Use of DTC (H8S/2268 Group Only)
• When an external clock source is used as the serial clock, the transmit clock should not be
input until at least 5 φ clock cycles after TDR is updated by the DTC. Misoperation may occur
if the transmit clock is input within 4 φ clocks after TDR is updated. (Figure 13.36)
• When RDR is read by the DTC, be sure to set the activation source to the relevant SCI
reception data full interrupt (RXI).
• The flags are automatically cleared to 0 by DTC during the data transfer only when the DISEL
bit in DTC is 0 with the transfer counter other than 0. When the DISEL bit in the
corresponding DTC is 1, or both the DISEL bit and the transfer counter are 0, give the CPU an
Instruction to clear flags. Note that, particularly during transmission, the TDRE flag that is not
cleared by the CPU causes incorrect transmission.
SCK
t
TDRE
LSB
Serial data
D0
D1
D2
D3
D4
D5
D6
D7
Note: When operating on an external clock, set t > 4 clocks.
Figure 13.36 Example of Clocked Synchronous Transmission by DTC
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Section 13 Serial Communication Interface (SCI)
13.9.6
Operation in Case of Mode Transition
• Transmission
Operation should be stopped (by clearing TE, TIE, and TEIE to 0) before making a module
stop mode, software standby mode, watch mode, subactive mode, or subsleep mode transition.
TSR, TDR, and SSR are reset. The output pin states in module stop mode, software standby
mode, watch mode, subactive mode, or subsleep mode depend on the port settings, and
becomes high-level output after the relevant mode is cleared. If a transition is made during
transmission, the data being transmitted will be undefined. When transmitting without
changing the transmit mode after the relevant mode is cleared, transmission can be started by
setting TE to 1 again, and performing the following sequence: SSR read -> TDR write ->
TDRE clearance. To transmit with a different transmit mode after clearing the relevant mode,
the procedure must be started again from initialization. Figure 13.37 shows a sample flowchart
for mode transition during transmission. Port pin states are shown in figures 13.38 and 13.39.
Operation should also be stopped (by clearing TE, TIE, and TEIE to 0) before making a
transition from transmission by DTC transfer to module stop mode, software standby mode,
watch mode, subactive mode, or subsleep mode transition. To perform transmission with the
DTC after the relevant mode is cleared, setting TE and TIE to 1 will set the TXI flag and start
DTC transmission. (H8S/2268 Group only)
• Reception
Receive operation should be stopped (by clearing RE to 0) before making a module stop mode,
software standby mode, watch mode, subactive mode, or subsleep mode transition. RSR, RDR,
and SSR are reset. If a transition is made without stopping operation, the data being received
will be invalid.
To continue receiving without changing the reception mode after the relevant mode is cleared,
set RE to 1 before starting reception. To receive with a different receive mode, the procedure
must be started again from initialization.
Figure 13.40 shows a sample flowchart for mode transition during reception.
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Section 13 Serial Communication Interface (SCI)
<Transmission>
No
All data
transmitted?
[1]
Yes
Read TEND flag in SSR
No
TEND = 1
Yes
[2] If TIE and TEIE are set to 1, clear
them to 0 in the same way.
[2]
TE = 0
Transition to software
standby mode, etc.
[3]
Exit from software
standby mode, etc.
Change
operating mode?
[1] Data being transmitted is interrupted.
After exiting software standby mode,
etc., normal CPU transmission is
possible by setting TE to 1, reading
SSR, writing TDR, and clearing
TDRE to 0, but note that if the DTC
has been activated, the remaining
data in DTCRAM will be transmitted
when TE and TIE are set to 1.
(H8S/2268 Group only)
[3] Includes module stop mode, watch
mode, subactive mode, and subsleep
mode.
No
Yes
Initialization
TE = 1
<Start of transmission>
Figure 13.37 Sample Flowchart for Mode Transition during Transmission
Start of transmission
End of
transmission
Exit from
software
standby
Transition
to software
standby
TE bit
Port input/output
SCK output pin
TxD output pin
Port input/output
Port
High output
Start
SCI TxD output
Stop
Port input/output
Port
High output
SCI TxD
output
Figure 13.38 Asynchronous Transmission Using Internal Clock
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Section 13 Serial Communication Interface (SCI)
Start of transmission
End of
transmission
Exit from
software
standby
Transition
to software
standby
TE bit
Port input/output
SCK output pin
TxD output pin Port input/output
Last TxD bit held
Marking output
Port
SCI TxD output
Port input/output
Port
Note: * Initialized by software standby.
Figure 13.39 Synchronous Transmission Using Internal Clock
<Reception>
Read RDRF flag in SSR
RDRF = 1
No
[1]
[1] Receive data being received
becomes invalid.
[2]
[2] Includes module stop mode,
watch mode, subactive mode,
and subsleep mode.
Yes
Read receive data in RDR
RE = 0
Transition to software
standby mode, etc.
Exit from software
standby mode, etc.
Change
operating mode?
No
Yes
Initialization
RE = 1
<Start of reception>
Figure 13.40 Sample Flowchart for Mode Transition during Reception
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High output*
SCI TxD
output
Section 13 Serial Communication Interface (SCI)
13.9.7
Switching from SCK Pin Function to Port Pin Function:
• Problem in Operation: When switching the SCK pin function to the output port function (highlevel output) by making the following settings while DDR = 1, DR = 1, C/A = 1, CKE1 = 0,
CKE0 = 0, and TE = 1 (synchronous mode), low-level output occurs for one half-cycle.
1. End of serial data transmission
2. TE bit = 0
3. C/A bit = 0 ... switchover to port output
4. Occurrence of low-level output (see figure 13.41)
Half-cycle low-level output
SCK/port
1. End of transmission
Data
TE
C/A
Bit 6
4. Low-level output
Bit 7
2. TE = 0
3. C/A = 0
CKE1
CKE0
Figure 13.41 Operation when Switching from SCK Pin Function to Port Pin Function
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Section 13 Serial Communication Interface (SCI)
• Sample Procedure for Avoiding Low-Level Output: As this sample procedure temporarily
places the SCK pin in the input state, the SCK/port pin should be pulled up beforehand with an
external circuit.
With DDR = 1, DR = 1, C/A = 1, CKE1 = 0, CKE0 = 0, and TE = 1, make the following
settings in the order shown.
1. End of serial data transmission
2. TE bit = 0
3. CKE1 bit = 1
4. C/A bit = 0 ... switchover to port output
5. CKE1 bit = 0
High-level output
SCK/port
1. End of transmission
Data
Bit 6
Bit 7
2. TE = 0
TE
4. C/A = 0
C/A
3. CKE1 = 1
CKE1
5. CKE1 = 0
CKE0
Figure 13.42 Operation when Switching from SCK Pin Function to Port Pin Function
(Example of Preventing Low-Level Output)
13.9.8
Assignment and Selection of Registers
Some serial communication interface registers are assigned to the same address as other registers.
Register selection is performed by means of the IICE bit in the serial control register (SCRX). For
details on register addresses, see section 24, List of Registers.
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2
Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
2
Section 14 I C Bus Interface (IIC) (Supported as an Option
by H8S/2264 Group)
2
An I C bus interface is available as an option in H8S/2264 Group. Observe the following note
when using this option.
• For mask-ROM versions, a W is added to the part number in products in which this optional
function is used.
Examples: HD6432264WTF
2
The H8S/2268 Group has an internal I C bus interface of two channels, while the H8S/2264 Group
has that of one channel.
2
2
The I C bus interface conforms to and provides a subset of the Philips I C bus (inter-IC bus)
2
interface functions. The register configuration that controls the I C bus differs partly from the
Philips configuration, however.
2
The I C bus interface data transfer is performed using a data line (SDA) and a clock line (SCL) for
each channel, which allows efficient use of connectors and the area of the PCB.
14.1
Features
• Selection of I C bus format or clocked synchronous serial format
2
⎯ I C bus format: addressing format with acknowledge bit, for master/slave operation
2
⎯ Clocked synchronous serial format: non-addressing format without acknowledge bit, for
master operation only
2
I C bus format
• Two ways of setting slave address
• Start and stop conditions generated automatically in master mode
• Selection of acknowledge output levels when receiving
• Automatic loading of acknowledge bit when transmitting
• Wait function in master mode
A wait can be inserted by driving the SCL pin low after data transfer, excluding
acknowledgement. The wait can be cleared by clearing the interrupt flag.
• Wait function in slave mode
A wait request can be generated by driving the SCL pin low after data transfer, excluding
acknowledgement. The wait request is cleared when the next transfer becomes possible.
IICIC05B_000020020700
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2
Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
• Interrupt sources
⎯ Data transfer end (including transmission mode transition with I C bus format and address
reception after loss of master arbitration)
2
⎯ Address match: when any slave address matches or the general call address is received in
slave receive mode
⎯ Start condition detection (in master mode)
⎯ Stop condition detection (in slave mode)
• Selection of 16 internal clocks (in master mode)
• Direct bus drive
⎯ Two pins, P35/SCL0 and P34/SDA0, function as NMOS open-drain outputs when the bus
drive function is selected.
⎯ Two pins – P33/SCL1 and P32/SDA1—function as NMOS-only outputs when the bus
drive function is selected. (H8S/2268 Group only)
2
Figure 14.1 shows a block diagram of the I C bus interface. Figure 14.2 shows an example of I/O
pin connections to external circuits. Channel I/O pins are NMOS open drains, and it is possible to
apply voltages in excess of the power supply (Vcc) voltage for this LSI. Set the upper limit of
voltage applied to the power supply (Vcc) power supply range +0.3 V, i.e. 5.8 V. Channel 1
(H8S/2268 Group only) I/O pins are driven solely by NMOS, so in terms of appearance they carry
out the same operations as an NMOS open drain. However, the voltage which can be applied to
the I/O pins depends on the voltage of the power supply (Vcc) of this LSI.
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2
Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
φ
PS
ICCR
SCL
Clock
control
Noise
canceler
Bus state
decision
circuit
SDA
ICSR
Arbitration
decision
circuit
ICDRT
Output data
control
circuit
ICDRS
Internal data bus
ICMR
ICDRR
Noise
canceler
Address
comparator
SAR, SARX
Interrupt
generator
Legend:
ICCR: I2C bus control register
ICMR: I2C bus mode register
ICSR: I2C bus status register
ICDR: I2C bus data register
SAR: Slave address register
SARX: Second slave address register
Prescaler
PS:
Interrupt
request
2
Figure 14.1 Block Diagram of I C Bus Interface
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
VDD
VCC
SCL
SCL
SDA
SDA
SCL in
SDA in
SCL
SDA
SDA out
(Master)
SCL in
This LSI
SCL out
SCL out
SDA in
SDA in
SDA out
SDA out
SCL in
(Slave 1)
SCL
SDA
SCL out
(Slave 2)
2
Figure 14.2 I C Bus Interface Connections (Example: This LSI as Master)
14.2
Input/Output Pins
2
Table 14.1 shows the pin configuration for the I C bus interface.
Table 14.1 Pin Configuration
Name
Abbreviation*
Serial clock
SCL0
Serial data
Serial clock*
Serial data*
2
2
1
I/O
Function
I/O
IIC_0 serial clock input/output
SDA0
I/O
IIC_0 serial data input/output
SCL1
I/O
IIC_1 serial clock input/output
SDA1
I/O
IIC_1 serial data input/output
Notes: 1. In the text, the channel subscript is omitted, and only SCL and SDA are used.
2. Supported only by the H8S/2268 Group.
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
14.3
Register Descriptions
2
The I C bus interface has the following registers. Registers ICDR and SARX and registers ICMR
and SAR are allocated to the same addresses. Accessible addresses differ depending on the ICE bit
in ICCR. SAR and SARX are accessed when ICE is 0, and ICMR and ICDR are accessed when
ICE is 1. For details on the module stop control register, refer to section 22.1.2, Module Stop
Control Registers A to D (MSTPCRA to MSTPCRD).
• I C bus data register_0 (ICDR_0)*
2
• Slave address register_0 (SAR_0)*
2
2
• Second slave address register_0 (SARX_0)*
2
2
• I C bus mode register_0 (ICMR_0)*
• I C bus control register_0 (ICCR_0)*
2
2
• I C bus status register_0 (ICSR_0)*
2
2
2
• I C bus data register_1 (ICDR_1)* *
1 2
• Slave address register_1 (SAR_1)* *
2
1
2
1 2
• Second slave address register_1 (SARX_1)* *
2
1 2
• I C bus mode register_1 (ICMR_1)* *
2
1 2
• I C bus control register_1 (ICCR_1)* *
2
1 2
• I C bus status register_1 (ICSR_1)* *
• DDC switch register (DDCSWR)
• Serial control register X (SCRX)
Notes: 1. Supported only by the H8S/2268 Group.
2
2. Some of the registers in the I C bus interface are allocated to the same addresses of
other registers. The IICE bit in serial control register X (SCRX) selects each register.
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
14.3.1
2
I C Bus Data Register (ICDR)
ICDR is an 8-bit readable/writable register that is used as a transmit data register when
transmitting and a receive data register when receiving. ICDR is divided internally into a shift
register (ICDRS), receive buffer (ICDRR), and transmit buffer (ICDRT). Data transfers among the
three registers are performed automatically in coordination with changes in the bus state, and
affect the status of internal flags such as TDRE and RDRF. When TDRE is 1 and the transmit
buffer is empty, TDRE shows that the next transmit data can be written from the CPU. When
RDRF is 1, it shows that the valid receive data is stored in the receive buffer.
2
If I C is in transmit mode and the next data is in ICDRT (the TDRE flag is 0) following
transmission/reception of one frame of data using ICDRS, data is transferred automatically from
2
ICDRT to ICDRS. If I C is in receive mode and no previous data remains in ICDRR (the RDRF
flag is 0) following transmission/reception of one frame of data using ICDRS, data is transferred
automatically from ICDRS to ICDRR.
If the number of bits in a frame, excluding the acknowledge bit, is less than 8, transmit data and
receive data are stored differently. Transmit data should be written justified toward the MSB side
when MLS = 0, and toward the LSB side when MLS = 1. Receive data bits read from the LSB
side should be treated as valid when MLS = 0, and bits read from the MSB side when MLS = 1.
ICDR can be written and read only when the ICE bit is set to 1 in ICCR. The value of ICDR is
undefined after a reset.
The TDRE and RDRF flags are set and cleared under the conditions shown below. Setting the
TDRE and RDRF flags affects the status of the interrupt flags.
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
Bit
Bit Name
Initial
Value
R/W
⎯
TDRE
⎯
⎯
Description
Transmit Data Register Empty
[Setting conditions]
•
In transmit mode, when a start condition is detected in
the bus line state after a start condition is issued in
2
master mode with the I C bus format or serial format
selected
•
When data is transferred from ICDRT to ICDRS
•
When a switch is made from receive mode to transmit
mode after detection of a start condition
[Clearing conditions]
⎯
RDRF
⎯
⎯
•
When transmit data is written in ICDR in transmit
mode
•
When a stop condition is detected in the bus line state
2
after a stop condition is issued with the I C bus format
or serial format selected
•
When a stop condition is detected with the I C bus
format selected
•
In receive mode
2
Receive Data Register Full
[Setting condition]
When data is transferred from ICDRS to ICDRR
[Clearing condition]
When ICDR (ICDRR) receive data is read in receive
mode
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
14.3.2
Slave Address Register (SAR)
SAR selects the slave address and selects the transfer format. SAR can be written and read only
when the ICE bit is cleared to 0 in ICCR.
Bit
Bit Name
Initial
Value
R/W
Description
7
SVA6
0
R/W
Slave Address 6 to 0
6
SVA5
0
R/W
Sets a slave address
5
SVA4
0
R/W
4
SVA3
0
R/W
3
SVA2
0
R/W
2
SVA1
0
R/W
1
SVA0
0
R/W
0
FS
0
R/W
14.3.3
Second Slave Address Register (SARX)
Selects the transfer format together with the FSX bit in
SARX. Refer to table 14.2.
SARX stores the second slave address and selects the transfer format. SARX can be written and
read only when the ICE bit is cleared to 0 in ICCR.
Bit
Bit Name
Initial
Value
R/W
Description
7
SVAX6
0
R/W
Slave Address 6 to 0
6
SVAX5
0
R/W
Sets the second slave address
5
SVAX4
0
R/W
4
SVAX3
0
R/W
3
SVAX2
0
R/W
2
SVAX1
0
R/W
1
SVAX0
0
R/W
0
FSX
1
R/W
Selects the transfer format together with the FS bit in
SAR. Refer to table 14.2.
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
Table 14.2 Transfer Format
SAR
SARX
FS
FSX
I C Transfer Format
0
0
SAR and SARX are used as the slave addresses with
2
the I C bus format.
0
1
Only SAR is used as the slave address with the I C bus
format.
1
0
Only SARX is used as the slave address with the I C
bus format.
1
1
Clock synchronous serial format (SAR and SARX are
invalid)
14.3.4
2
2
2
2
I C Bus Mode Register (ICMR)
ICMR sets the transfer format and transfer rate. It can only be accessed when the ICE bit in ICCR
is 1.
Bit
Bit Name
Initial
Value
R/W
Description
7
MLS
0
R/W
MSB-First/LSB-First Select
0: MSB-first
1: LSB-first
2
Set this bit to 0 when the I C bus format is used.
6
WAIT
0
R/W
Wait Insertion Bit
2
This bit is valid only in master mode with the I C bus
format.
When WAIT is set to 1, after the fall of the clock for the
final data bit, the IRIC flag is set to 1 in ICCR, and a wait
state begins (with SCL at the low level). When the IRIC
flag is cleared to 0 in ICCR, the wait ends and the
acknowledge bit is transferred.
If WAIT is cleared to 0, data and acknowledge bits are
transferred consecutively with no wait inserted.
The IRIC flag in ICCR is set to 1 on completion of the
acknowledge bit transfer, regardless of the WAIT setting.
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
Bit
Bit Name
Initial
Value
R/W
Description
5
CKS2
0
R/W
Serial Clock Select 2 to 0
4
CKS1
0
R/W
This bit is valid only in master mode.
3
CKS0
0
R/W
These bits select the required transfer rate, together with
the IICX 1 and IICX0 bit in SCRX. Refer table 14.3.
2
BC2
0
R/W
Bit Counter 2 to 0
1
BC1
0
R/W
0
BC0
0
R/W
These bits specify the number of bits to be transferred
2
next. With the I C bus format, the data is transferred with
one addition acknowledge bit. Bit BC2 to BC0 settings
should be made during an interval between transfer
frames. If bits BC2 to BC0 are set to a value other than
000, the setting should be made while the SCL line is low.
The value returns to 000 at the end of a data transfer,
including the acknowledge bit.
2
I C Bus Format
Clocked Synchronous Mode
000: 9 bit
000: 8 bit
001: 2 bit
001: 1 bit
010: 3 bit
010: 2 bit
011: 4 bit
011: 3 bit
100: 5 bit
100: 4 bit
101: 6 bit
101: 5 bit
110: 7 bit
110: 6 bit
111: 8 bit
111: 7 bit
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
2
Table 14.3 I C Transfer Rate
SCRX
ICMR
Bit 5 or 6 Bit 5
Bit 4
Bit 3
Transfer Rate
IICX
CKS2 CKS1 CKS0 Clock φ = 5 MHz φ = 8 MHz φ = 10 MHz φ = 16 MHz φ = 20 MHz
0
0
0
0
φ/28
179 MHz 286 kHz
357 kHz
571 kHz*
714 kHz*
0
0
0
1
φ/40
125 kHz
200 kHz
250 kHz
400 kHz
0
0
1
0
φ/48
104 kHz
167 kHz
208 kHz
333 kHz
500 kHz*
417 kHz*
0
0
1
1
φ/64
78.1 kHz 125 kHz
156 kHz
250 kHz
313 kHz
0
1
0
0
φ/80
62.5 kHz 100 kHz
125 kHz
200 kHz
250 kHz
0
1
0
1
φ/100
50.0 kHz 80.0 kHz
100 kHz
160 kHz
200 kHz
0
1
1
0
φ/112
44.6 kHz 71.4 kHz
89.3 kHz
143 kHz
179 kHz
0
1
1
1
φ/128
39.1 kHz 62.5 kHz
78.1 kHz
125 kHz
156 kHz
1
0
0
0
φ/56
89.3 kHz 143 kHz
179 kHz
286 kHz
357 kHz
1
0
0
1
φ/80
62.5 kHz 100 kHz
125 kHz
200 kHz
250 kHz
1
0
1
0
φ/96
52.1 kHz 83.3 kHz
104 kHz
167 kHz
208 kHz
1
0
1
1
φ/128
39.1 kHz 62.5 kHz
78.1 kHz
125 kHz
156 kHz
1
1
0
0
φ/160
31.3 kHz 50.0 kHz
62.5 kHz
100 kHz
125 kHz
1
1
0
1
φ/200
25.0 kHz 40.0 kHz
50.0 kHz
80.0 kHz
100 kHz
1
1
1
0
φ/224
22.3 kHz 35.7 kHz
44.6 kHz
71.4 kHz
89.3 kHz
1
1
1
1
φ/256
19.5 kHz 31.3 kHz
39.1 kHz
62.5 kHz
78.1 kHz
2
Note: * Out of the range of the I C bus interface specification (normal mode: 100 kHz in max. and
high-speed mode: 400 kHz in max)
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
14.3.5
Serial Control Register X (SCRX)
SCRX controls the IIC operating modes.
Bit
Bit Name
Initial
Value
R/W
7
⎯
0
R/W
Description
Reserved
The initial value should not be changed.
6
IICX1*
0
R/W
I C Transfer Rate Select 1 and 0
5
IICX0
0
R/W
Selects the transfer rate in master mode, together with
bits CKS2 to CKS0 in ICMR. Refer to table 14.3.
2
IICX1 controls IIC_1 and IICX0 controls IIC_0.
Note: * In the H8S/2264 Group, this bit is reserved.
The initial value should not be changed.
4
IICE
0
R/W
2
I C Master Enable
Controls CPU access to the IIC data register and control
registers (ICCR, ICSR, ICDR/SARX, and ICMR/SAR).
0: CPU access to the IIC data register and control
registers is disabled.
1: CPU access to the IIC data register and control
registers is enabled.
3
FLSHE
0
R/W
2 to 0
⎯
All 0
R/W
For details on this bit, refer to section 20.5.7, Serial
Control Register X (SCRX).
Reserved
The initial value should not be changed.
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
14.3.6
2
I C Bus Control Register (ICCR)
2
2
I C bus control register (ICCR) consists of the control bits and interrupt request flags of I C bus
interface.
Bit
Bit Name
Initial
Value
R/W
Description
7
ICE
0
R/W
I C Bus Interface Enable
2
2
When this bit is set to 1, the I C bus interface module is
enabled to send/receive data and drive the bus since it is
connected to the SCL and SDA pins. ICMR and ICDR
can be accessed.
When this bit is cleared, the module is halted and
separated from the SCL and SDA pins. SAR and SARX
can be accessed.
6
IEIC
0
R/W
2
I C Bus Interface Interrupt Enable
When this bit is 1, interrupts are enabled by IRIC.
5
MST
0
4
TRS
0
R/W
Master/Slave Select
Transmit/Receive Select
00: Slave receive mode
01: Slave transmit mode
10: Master receive mode
11: Master transmit mode
Both these bits will be cleared by hardware when they
2
lose in a bus contention in master mode of the I C bus
format. In slave receive mode, the R/W bit in the first
frame immediately after the start automatically sets these
bits in receive mode or transmit mode by using hardware.
The settings can be made again for the bits that were
set/cleared by hardware, by reading these bits. When the
TRS bit is intended to change during a transfer, the bit
will not be switched until the frame transfer is completed,
including acknowledgement.
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
Bit
Bit Name
Initial
Value
R/W
3
ACKE
0
R/W
Description
Acknowledge Bit Judgement Selection
0: The value of the acknowledge bit is ignored, and
continuous transfer is performed. The value of the
received acknowledge bit is not indicated by the ACKB
bit, which is always 0.
1: If the acknowledge bit is 1, continuous transfer is
interrupted.
In the H8S/2268 Group, the DTC* can be used to
perform continuous transfer. The DTC* is activated when
the IRTR interrupt flag is set to 1 (IRTR us one of two
interrupt flags, the other being IRIC). When the ACKE bit
is 0, the TDRE, IRIC, and IRTR flags are set on
completion of data transmission, regardless of the
acknowledge bit. When the ACKE bit is 1, the TDRE,
IRIC, and IRTR flags are set on completion of data
transmission when the acknowledge bit is 0, and the IRIC
flag alone is set on completion of data transmission when
the acknowledge bit is 1.
When the DTC* is activated, the TDRE, IRIC, and IRTR
flags are cleared to 0 after the specified number of data
transfers have been executed. Consequently, interrupts
are not generated during continuos data transfer, but if
data transmission is completed with a 1 acknowledge bit
when the ACKE bit is set to 1, the DTC* is not activated
and an interrupt is generated, if enabled.
Depending on the receiving device, the acknowledge bit
may be significant, in indicating completion of processing
of the received data, for instance, or may be fixed at 1
and have no significance.
Note: * Supported only by the H8S/2268 Group.
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
Bit
Bit Name
Initial
Value
R/W
2
BBSY
0
R/W
Description
Bus Busy
In slave mode, reading the BBSY flag enables to confirm
2
whether the I C bus is occupied or released. The BBSY
flag is set to 0 when the SDA level changes from high to
low under the condition of SCl = high, assuming that the
start condition has been issued. The BBSY flag is cleared
to 0 when the SDA level changes from low to high under
the condition of SCl = high, assuming that the start
condition has been issued. Writing to the BBSY flag in
slave mode is disabled.
In master mode, the BBSY flag is used to issue start and
stop conditions. Write 1 to BBSY and 0 to SCP to issue a
start condition. Follow this procedure when also retransmitting a start condition. To issue a start/stop
2
condition, use the MOV instruction. The I C bus interface
must be set in master transmit mode before the issue of a
start condition.
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
Bit
Bit Name
Initial
Value
R/W
Description
1
IRIC
0
R/W
I2C Bus Interface Interrupt Request Flag
Also see table 14.4.
[Setting conditions]
In I2C bus format master mode
• When a start condition is detected in the bus line state after
a start condition is issued (when the TDRE flag is set to 1
because of first frame transmission)
• When a wait is inserted between the data and acknowledge
bit when WAIT = 1
• At the end of data transfer (when the TDRE or RDRF flag is
set to 1)
• When a slave address is received after bus arbitration is lost
(when the AL flag is set to1)
• When 1 is received as the acknowledge bit when the ACKE
bit is 1 (when the ACKB bit is set to 1)
In I2C bus format slave mode
• When the slave address (SVA, SVAX) matches (when the
AAS and AASX flags are set to 1) and at the end of data
transfer up to the subsequent retransmission start condition
or stop condition detection (when the TDRE or RDRF flag is
set to 1)
• When the general call address (one frame including a R/W
bit is H'00) is detected (when the ADZ flag is set to 1) and at
the end of data transfer up to the subsequent retransmission
start condition or stop condition detection (when the TDRE
or RDRF flag is set to 1)
• When 1 is received as the acknowledge bit when the ACKE
bit is 1 (when the ACKB bit is set to 1)
• When a stop condition is detected (when the STOP or ESTP
flag is set to 1)
With clocked synchronous serial format
• At the end of data transfer (when the TDRE or RDRF flag is
set to 1)
• When a start condition is detected with serial format selected
When a condition occurs in which internal flag of TDRE and
RDFR is set to 1 except for the above
[Clearing condition]
When 0 is written in IRIC after reading IRIC = 1
When ICDR is read/written by DTC (H8S/2268 Group only)
(When TDRE or RDRF flag is cleared to 0)
(As it might not be a condition to clear, for details, see section
14.4.8.
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
Bit
Bit Name
Initial
Value
R/W
0
SCP
1
W
Description
Start Condition/Stop Condition Prohibit bit
The SCP bit controls the issue of start/stop conditions in
master mode.
To issue a start condition, write 1 in BBSY and 0 in SCP.
A retransmit start condition is issued in the same way. To
issue a stop condition, write 0 in BBSY and 0 in SCP.
This bit is always read as 1. Data is not stored even if it
is written.
2
When, with the I C bus format selected, IRIC is set to 1 and an interrupt is generated, other flags
must be checked in order to identify the source that set IRIC to 1. Although each source has a
corresponding flag, caution is needed at the end of a transfer.
When the TDRE or RDRF internal flag is set, the readable IRTR flag may or may not be set. In
the H8S/2268 Group, even when data transfer is complete, the DTC activation request flag, IRTR,
is not set until a retransmission start condition or stop condition is detected after a slave address
2
(SVA) or general call address matched in the I C bus format slave mode.
Even when the IRIC flag and IRTR flag are set, the TDRE or RDRF internal flag may not be set.
For a continuous transfer using the DTC in the H8S/2268 Group, the IRIC or IRTR flag is not
cleared at the completion of the specified number of times of transfers. On the other hand, the
TDRE and RDRF flags are cleared because the specified number of times of read/write operations
have been complete.
Table 14.4 shows the relationship between the flags and the transfer states.
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
Table 14.4 Flags and Transfer States
MST TRS BBSY ESTP STOP IRTR AASX AL
AAS ADZ ACKB State
1/0
1/0
0
0
0
0
0
0
0
0
0
Idle state (flag clearing required)
1
1
0
0
0
0
0
0
0
0
0
Start condition issuance
1
1
1
0
0
1
0
0
0
0
0
Start condition established
1
1/0
1
0
0
0
0
0
0
0
0/1
Master mode wait
1
1/0
1
0
0
1
0
0
0
0
0/1
Master mode transmit/receive end
0
0
1
0
0
0
1/0
1
1/0
1/0 0
Arbitration lost
0
0
1
0
0
0
0
0
1
0
0
SAR match by first frame in slave mode
0
0
1
0
0
0
0
0
1
1
0
General call address match
0
0
1
0
0
0
1
0
0
0
0
SARX match
0
1/0
1
0
0
0
0
0
0
0
0/1
Slave mode transmit/receive end(except
after SARX match)
0
1/0
1
0
0
1
1
0
0
0
0
Slave mode transmit/receive end(after
SARX match)
0
1
1
0
0
0
1
0
0
0
1
0
1/0
0
1/0
1/0
0
0
0
0
0
0/1
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Stop condition detected
2
Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
14.3.7
2
I C Bus Status Register (ICSR)
ICSR consists of status flags.
Bit
7
Bit Name
ESTP
Initial
Value
R/W
0
R/(W)* Error Stop Condition Detection Flag
Description
2
This bit is valid in I C bus format slave mode.
[Setting condition]
When a stop condition is detected during frame transfer.
[Clearing conditions]
6
STOP
0
•
When 0 is written in ESTP after reading the state of 1
•
When the IRIC flag is cleared to 0
R/(W)* Normal Stop Condition Detection Flag
2
This bit is valid in I C bus format slave mode.
[Setting condition]
When a stop condition is detected during frame transfer.
[Clearing conditions]
•
5
IRTR
0
When 0 is written in STOP after reading STOP = 1
• When the IRIC flag is cleared to 0
2
*
R/(W) I C Bus Interface Continuous Transmission/Reception
Interrupt Request Flag
[Setting conditions]
2
In I C bus interface slave mode
•
When the TDRE or RDRF flag is set to 1 when AASX
=1
2
In I C bus interface other modes
•
When the TDRE or RDRF flag is set to 1
[Clearing conditions]
•
When 0 is written in IRTR after reading IRTR = 1
•
When the IRIC flag is cleared to 0 while ICE is 1
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
Bit
4
Bit Name
AASX
Initial
Value
R/W
0
R/(W)* Second Slave Address Recognition Flag
Description
[Setting condition]
When the second slave address is detected in slave
receive mode and FSX = 0
[Clearing conditions]
3
AL
0
•
When 0 is written in AASX after reading AASX = 1
•
When a start condition is detected
• In master mode
*
R/(W) Arbitration Lost Flag
Indicates that bus arbitration was lost in master mode.
[Setting condition]
•
When the internal SDA and SDA pin do not match at
the rise of SCL.
•
When the internal SCL is high at the fall of SCL.
[Clearing conditions]
2
AAS
0
•
When 0 is written in AL after reading AL = 1
•
When ICDR data is written (transmit mode) or read
(receive mode)
R/(W)* Slave Address Recognition Flag
[Setting condition]
When the slave address or general call address (one
frame including a R/W bit is H'00) is detected in slave
receive mode and FS = 0.
[Clearing conditions]
•
When ICDR data is written (transmit mode) or read
(receive mode)
•
When 0 is written in AAS after reading AAS = 1
•
In master mode
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
Bit
1
Bit Name
ADZ
Initial
Value
R/W
0
R/(W)* General Call Address Recognition Flag
Description
2
In I C bus format slave receive mode, this flag is set to 1
if the first frame following a start condition is the general
call address (H'00).
[Setting condition]
When the general call address (one frame including a
R/W bit is H'00) is detected in slave receive mode and
FSX = 0 or FS = 0.
[Clearing conditions]
•
When ICDR data is written (transmit mode) or read
(receive mode)
•
When 0 is written in ADZ after reading ADZ = 1
•
In master mode
If a general call address is detected while FS = 1 and
FSX = 0, the ADZ flag is set to 1; however, the general
call address is not recognized (AAS flag is not set to 1).
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
Bit
Bit Name
Initial
Value
R/W
0
ACKB
0
R/W
Description
Acknowledge Bit
Stores acknowledge data.
Transmit mode:
[Setting condition]
When 1 is received as the acknowledge bit when ACKE =
1 in trasmit mode.
[Clearing conditions]
•
When 0 is received as the acknowledge bit when
ACKE = 1 in transmit mode
•
When 0 is written to the ACKE bit
Receive mode:
0: Returns 0 as acknowledge data after data reception
1: Retruns 1 as acknowledge data after data reception
When this bit is read, the value loaded from the bus line
(returned by the receiving device) is read in transmission
(when TRS = 1). In reception (when TRS = 0), the value
set by internal software is read.
When this bit is written, acknowledge data that is returned
after receiving is written regardless of the TRS value. If
bit in ICSR is written using bit-manipulation instructions,
the acknowledge data should be re-set since the
acknowledge data setting is rewritten by the ACKB bit
reading value.
Write the ACKE bit to 0 to clear the ACKB flag to 0,
bofore transmission is ended and a stop condition is
issued in master mode, or before transmission is ended
and SDA is released to issue a stop condition by a
master device.
Note: * Only a 0 can be written to this bit, to clear the flag.
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
14.3.8
DDC Switch Register (DDCSWR)
2
DDCSWR controls the I C bus interface format automatic switching function and internal latch
clear.
Bit
Bit Name
7 to 4
⎯
Initial
Value
R/W
All 0
R/(W)* Reserved
Description
1
The write value should always be 0.
2
3
CLR3
1
W
I C Bus Interface Clear 3 to 0:
2
CLR2
1
W
1
CLR1
1
W
0
CLR0
1
W
When bits CLR3 to CLR0 are set, a clear signal is
2
generated for the I C bus interface internal latch circuit,
and the internal state is initialized. The write data for
2
these bits is not retained. To perform I C clearance, bits
CLR3 to CLR0 must be written to simultaneously using
an MOV instruction. Do not use a bit manipulation
instruction such as BCLR.
00XX: Setting prohibited
0100: Setting prohibited
0101: IIC_0 Internal latch cleared
2
0110: IIC_1* Internal Iatch cleared
2
0111: IIC_0, IIC_1* Internal Iatch cleared
1XXX: Invalid setting
Legend:
X: Don’t care
Notes: 1. Only 0 can be written to these bits.
2. Supported only by the H8S/2268 Group.
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
14.4
Operation
2
2
The I C bus interface has clocked synchronous serial and I C bus formats.
14.4.1
2
I C Bus Data Format
2
The I C bus formats are addressing formats and an acknowledge bit is inserted. The first frame
2
following a start condition always consists of 8 bits. The I C bus format is shown in figure 14.3.
The clocked synchronous serial format is a non-addressing format with no acknowledge bit. This
2
is shown in figure 14.4. Figure 14.5 shows the I C bus timing.
(a) I2C bus format (FS = 0 or FSX = 0)
S
SLA
R/W
A
DATA
A
A/A
P
1
7
1
1
n
1
1
1
1
n: transfer bit count
(n = 1 to 8)
m: transfer frame count
(m ≥ 1)
m
(b) I2C bus format (start condition retransmission, FS = 0 or FSX = 0)
S
SLA
R/W
A
DATA
A/A
S
SLA
R/W
A
DATA
A/A
P
1
7
1
1
n1
1
1
7
1
1
n2
1
1
1
m1
1
m2
n1 and n2: transfer bit count (n1 and n2 = 1 to 8)
m1 and m2: transfer frame count (m1 and m2 ≥ 1)
2
2
Figure 14.3 I C Bus Data Formats (I C Bus Formats)
FS = 1 and FSX = 1
S
DATA
DATA
P
1
8
n
1
1
2
m
n: transfer bit count
(n = 1 to 8)
m: transfer frame count
(m ≥ 1)
Figure 14.4 I C Bus Data Format (Clocked Synchronous Serial Format)
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
SDA
SCL
S
1-7
8
9
SLA
R/W
A
1-7
8
DATA
9
A
1-7
DATA
8
9
A/A
P
Legend:
S:
Start condition. The master device drives SDA from high to low while SCL is high
SLA: Slave address
R/W: Indicates the direction of data transfer: from the slave device to the master device when R/W is 1,
or from the master device to the slave device when R/W is 0
A:
Acknowledge. The receiving device drives SDA low to acknowledge a transfer.
DATA: Transferred data
P:
Stop condition. The master device drives SDA from low to high while SCL is high
2
Figure 14.5 I C Bus Timing
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
14.4.2
Initial Setting
At startup the following procedure is used to initialize the IIC.
Start initialization
Set MSTPB4 = 0 (IIC0)
MSTPB3 = 0 (IIC1)
(MSTPCRB)
Set IICE = 1 (SCRX)
Clear module stop.
Enable CPU access by IIC control register and data register.
Set ICE = 0 (ICCR)
Enable SAR and SARX access.
Set SAR and SARX
Set transfer format for 1st slave address, 2nd slave address,
and IIC (SVA8 to SVA0, FS, SVAX6 to SVAX0, FSX).
Set ICE = 1 (ICCR)
Enable IMCR and IMDR access. Use SCL and SDA pins is IIC
port.
Set ICSR
Set acknowledge bit (ACKB).
Set SCRX
Set transfer rate (IICX).
Set ICMR
Set transfer format, wait insertion, and transfer rate (MLS,
WAIT, CKS2 to CKS0).
Set ICCR
Set interrupt enable, transfer mode, and acknowledge
judgment (IEIC, MST, TRS, ACKE).
Transmit/receive start
Note: Setting only valid for H8S/2268 Group.
For the H8S/2264 Group, only write 1 to this bit.
Figure 14.6 Flowchart for IIC Initialization (Example)
Note: The ICMR register should be written to only after transmit or receive operations have
completed.
Writing to the ICMR register while a transmit or receive operation is in progress could
cause an erroneous value to be written to bit counter bits BC2 to BC0. This could result in
improper operation.
14.4.3
Master Transmit Operation
2
In I C bus format master transmit mode, the master device outputs the transmit clock and transmit
data, and the slave device returns an acknowledge signal.
Figure 14.7 is a flowchart showing an example of the master transmit mode.
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
Start
[1] Initial settings.
Initial settings
Read BBSY flag in ICCR
[2] Determine status of SCL and SDA lines.
No
BBSY = 0?
Yes
Set MST = 1
and TRS = 1 (ICCR)
[3] Set to master transmit mode.
Write BBSY = 1
and SCP = 0 (ICCR)
[4] Generate start condition.
Read IRIC flag in ICCR
[5] Wait for start condition to be met.
No
IRIC = 1?
Yes
Write transmit data to ICDR
[6] Set 1st byte (slave address + R/W) transmit data.
(Perform ICDR write and IRIC flag clear
operations continuously.)
Clear IRIC flag in ICCR
Read IRIC flag in ICCR
[7] Wait for end of 1 byte transmission.
No
IRIC = 1?
Yes
Read ACKB bit in ICSR
ACKB = 0?
No
[8] Judge acknowledge signal from specified.
slave device.
Yes
Transmit mode?
No
Master receive mode
Yes
Write transmit data to ICDR
Clear IRIC flag in ICCR
[9] Set transmit data for 2nd byte onward.
(Perform ICDR write and IRIC flag clear
operations continuously.)
Read IRIC flag in ICCR
[10] Wait for end of 1 byte transmission.
No
IRIC = 1?
Yes
Read ACKB bit in ICSR
[11] Judge end of transmission.
No
Transmit complete?
(ACKB = 1?)
Yes
Clear IRIC flag in ICCR
[12] Generate stop condition.
Write ACKE = 0 (ICCR)
(Clear ACKB = 0)
Write BBSY = 0 and
SCP = 0 (ICCR)
End
Figure 14.7 Flowchart for Master Transmit Mode (Example)
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
The transmission procedure and operations synchronized with the ICDR writing are described
below.
1. Perform initial settings as described in section 14.4.2, Initial Setting.
2. Read the BBSY flag in ICCR to confirm that the bus is free.
3. Set bits MST and TRS to 1 in ICCR to select master transmit mode.
4. Write 1 to BBSY and 0 to SCP. This changes SDA from high to low when SCL is high, and
generates the start condition.
5. Then IRIC and IRTR flags are set to 1. If the IEIC bit in ICCR has been set to 1, an interrupt
request is sent to the CPU.
6. After the start condition is detected, write the data (slave address + R/W) to ICDR. With the
2
I C bus format (when the FS bit in SAR or the FSX bit in SARX is 0), the first frame data
following the start condition indicates the 7-bit slave address and transmit/receive direction
(R/W). As indicating the end of the transfer, and so the IRIC flag is cleared to 0. After writing
ICDR, clear IRIC continuously not to execute other interrupt handling routine. If one frame of
data has been transmitted before the IRIC clearing, it can not be determine the end of
transmission. The master device sequentially sends the transmission clock and the data written
to ICDR using the timing shown in figure 14.8. The selected slave device (i.e. the slave device
with the matching slave address) drives SDA low at the 9th transmit clock pulse and returns an
acknowledge signal.
7. When one frame of data has been transmitted, the IRIC flag is set to 1 at the rise of the 9th
transmit clock pulse. After one frame has been transmitted SCL is automatically fixed low in
synchronization with the internal clock until the next transmit data is written.
8. Read the ACKB bit in ICSR to confirm that ACKB is cleared to 0. When the slave device has
not acknowledged (ACKB bit is 1), operate the step [12] to end transmission, and retry the
transmit operation.
9. Write the transmit data to ICDR. As indicating the end of the transfer, and so the IRIC flag is
cleared to 0. Perform the ICDR write and the IRIC flag clearing sequentially, just as in point 6
in this flowchart. Transmission of the next frame is performed in synchronization with the
internal clock.
10. When one frame of data has been transmitted, the IRIC flag is set to 1 at the rise of the 9th
transmit clock pulse. After one frame has been transmitted SCL is automatically fixed low in
synchronization with the internal clock until the next transmit data is written.
11. Read the ACKB bit in ICSR. Confirm that the slave device has been acknowledged (ACKB bit
is 0). When there is data to be transmitted, go to the step [9] to continue next transmission.
When the slave device has not acknowledged (ACKB bit is set to 1), operate the step [12] to
end transmission.
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
12. Clear the IRIC flag to 0. Write 0 to ACKE in ICCR, to clear received ACKB contents to 0.
Write 0 to BBSY and SCP in ICCR. This changes SDA from low to high when SCL is high,
and generates the stop condition.
Start condition
generated
SCL
(Master output)
1
2
3
4
5
6
7
SDA
(Master output)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Slave address
8
9
Bit 0
2
Bit 7
R/W
SDA
(Slave output)
1
Bit 6
Data 1
[7]
A
[5]
Interrupt
request
IRIC
Interrupt
request
IRTR
ICDRT
Data 1
Address + R/W
ICDRS
Data 1
Address + R/W
Note: Do not write data
to ICDR.
User processing
[4] Write BBSY = 1
and SCP = 0
(start condition
issued)
[6] ICDR write
[6] IRIC clearance
[9] ICDR write
[9] IRIC clearance
Figure 14.8 Example of Master Transmit Mode Operation Timing (MLS = WAIT = 0)
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
Stop condition
generated
SCL
(Master output)
SDA
(Master output)
8
Bit 0
Data 1
SDA
(Slave output)
9
1
Bit 7
2
3
Bit 6 Bit 5
[7]
4
Bit 4
5
Bit 3
Data 2
A
6
Bit 2
7
8
9
Bit 1 Bit 0
[10]
A
IRIC
IRTR
Data 1
ICDR
User processing
[9] ICDR write
Data 2
[9] IRIC clearance
[12] Write BBSY = 0
and SCP = 0
(stop condition
issued)
[12] IRIC clearance
[11] ACKB read
Figure 14.9 Example of Master Transmit Mode Stop Condition Generation Timing
(MLS = WAIT = 0)
14.4.4
Master Receive Operation
2
In I C bus format master receive mode, the master device outputs the receive clock, receives data,
and returns an acknowledge signal. The slave device transmits data.
The master device transmits the data containing the slave address + R/W (0: read) in the 1st frame
after a start condition is generated in the master transmit mode. After the slave device is selected
the switch to receive operation takes place.
(1) Receive Operation Using Wait States
Figures 14.10 and 14.11 are flowcharts showing examples of the master receive mode (WAIT =
1).
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
Master receive mode
Set TRS = 0 (ICCR)
[1] Set to receive mode.
Set ACKB = 0 (ICSR)
Clear IRIC flag in ICCR
Set WAIT = 1 (ICMR)
Read ICDR
[2] Receive start, dummy read.
Read IRIC flag in ICCR
No
[3] Receive wait state (IRIC set at falling edge of 8th clock cycle)
or
Wait for end of reception of 1 byte (IRIC set at rising edge
of 9th clock cycle).
IRIC = 1?
Yes
No
[4] Data receive completed judgment.
IRTR = 1?
Yes
Is next receive
the last one?
Yes
No
Read ICDR
[5] Read receive data.
[6] Clear IRIC flag (cancel wait state).
Clear IRIC flag in ICCR
[7] Set acknowledge data for final receive.
Set ACKB = 1 (ICSR)
[8] Wait time until TRS setting.
1 clock cycle wait state
[9] Set TRS to generate stop condition.
Set TRS = 1 (ICCR)
[10] Read receive data.
Read ICDR
No
Clear IRIC flag in ICCR
[11] Clear IRIC flag (cancel wait state).
Read IRIC flag in ICCR
[12] Receive wait state (IRIC set at falling edge of 8th clock cycle)
or
Wait for end of reception of 1 byte (IRIC set at rising edge
of 9th clock cycle).
IRIC = 1?
Yes
IRTR = 1?
No
Clear IRIC flag in ICCR
Set WAIT = 0 (ICMR)
Yes
[13] Data receive completed judgment.
[14] Clear IRIC flag (cancel wait state).
[15] Cancel wait mode
Clear IRIC flag. (IRIC flag should be cleared when WAIT = 0.)
Clear IRIC flag in ICCR
Read ICDR
[16] Read final receive data.
Write BBSY = 0
and SCP = 0 (ICCR)
[17] Generate stop condition.
End
Figure 14.10 Flowchart for Master Receive Mode (Receiving Multiple Bytes) (WAIT = 1)
(Example)
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
Master receive mode
Set TRS = 0 (ICCR)
Set ACKB = 0 (ICSR)
[1]
Set to receive mode
[2]
Receive start, dummy read.
[3]
Receive wait state (IRIC set at falling edge
of 8th clock cycle)
Set ACKB = 1 (ICSR)
[7]
Set acknowledge data for final receive.
Set TRS = 1 (ICCR)
[9]
Set TRS to generate stop condition.
Clear IRIC flag in ICCR
Set WAIT = 1 (ICMR)
Read ICDR
Read IRIC flag in ICCR
No
IRIC = 1?
Yes
Clear IRIC flag in ICCR
[11] Clear IRIC flag (cancel wait state).
Read IRIC flag in ICCR
No
[12] Wait for end of reception of 1 byte.
(IRIC set at rising edge of 9th clock cycle)
IRIC = 1?
Yes
Set WAIT = 0 (ICMR)
Clear IRIC flag in ICCR
[15] Cancel wait mode
Clear IRIC flag. (IRIC flag should be
cleared when WAIT = 0.)
Read ICDR
[16] Read final receive data.
Write BBSY = 0
and SCP = 0 (ICCR)
[17] Generate stop condition.
End
Figure 14.11 Flowchart for Master Receive Mode (Receiving 1 Byte) (WAIT = 1)
(Example)
The procedure for receiving data sequentially, using the wait states (WAIT bit) for
synchronization with ICDR (ICDRR) read operations, is described below.
The procedure below describes the operation for receiving multiple bytes. Note that some of the
steps are omitted when receiving only 1 byte. Refer to figure 14.11 for details.
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
[1] Clear the TRS bit in ICCR to 0 to switch from transmit mode to receive mode. Clear the
ACKB bit in ICSR to 0 (acknowledge data setting). Clear the IRIC flag to 0, then set the
WAIT bit in ICMR to 1.
[2] When ICDR is read (dummy data read), reception is started, and the receive clock is output,
and data received, in synchronization with the internal clock.
[3] The IRIC flag is set to 1 by the following two conditions. At that point, an interrupt request
is issued to the CPU if the IEIC bit in ICCR is set to 1.
(1) The flag is set at the falling edge of the 8th clock cycle of the receive clock for 1 frame.
SCL is automatically held low, in synchronization with the internal clock, until the IRIC
flag is cleared.
(2) The flag is set at the rising edge of the 9th clock cycle of the receive clock for 1 frame.
The IRTR flag is set to 1, indicating that reception of 1 frame of data has ended. The
master device continues to output the receive clock for the receive data.
[4] Read the IRTR flag in ICSR. If the IRTR flag value is 0, the wait state is cancelled by
clearing the IRIC flag as described in step [6] below. If the IRTR flag value is 1 and the next
receive data is the final receive data, perform the end processing described in step [7] below.
[5] If the IRTR flag value is 1, read the ICDR receive data.
[6] Clear the IRIC flag to 0. The reading of the ICDR flag described in step [5] and the clearing
of the IRIC flag to 0 should be performed consecutively, with no interrupt processing
occurring between them. During wait operation, clear the IRIC flag to 0 when the value of
counter BC2 to BC0 is 2 or greater. If the IRIC flag is cleared to 0 when the value of counter
BC2 to BC0 is 1 or 0, it will not be possible to determine when the transfer has completed. If
condition [3]-1 is true, the master device drives SDA to low level and returns an
acknowledge signal when the receive clock outputs the 9th clock cycle.
Further data can be received by repeating steps [3] through [6].
[7] Set the ACKB bit in ICSR to 1 to set the acknowledge data for the final receive.
[8] Wait for at least 1 clock cycle after the IRIC flag is set to 1 and then wait for the rising edge
of the 1st clock cycle of the next receive data.
[9] Set the TSR bit in ICCR to 1 to switch from the receive mode to the transmit mode. The TSR
bit setting value at this point becomes valid when the rising edge of the next 9th clock cycle
is input.
[10] Read the ICDR receive data.
[11] Clear the IRIC flag to 0. As in step [6], read the ICDR flag and clear the IRIC flag to 0
consecutively, with no interrupt processing occurring between them. During wait operation,
clear the IRIC flag to 0 when the value of counter BC2 to BC0 is 2 or greater.
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
[12] The IRIC flag is set to 1 by the following two conditions.
(1) The flag is set at the falling edge of the 8th clock cycle of the receive clock for 1 frame.
SCL is automatically held low, in synchronization with the internal clock, until the IRIC
flag is cleared.
(2) The flag is set at the rising edge of the 9th clock cycle of the receive clock for 1 frame.
The IRTR flag is set to 1, indicating that reception of 1 frame of data has ended. The
master device continues to output the receive clock for the receive data.
[13] Read the IRTR flag in ICSR. If the IRTR flag value is 0, the wait state is cancelled by
clearing the IRIC flag as described in step [14] below. If the IRTR flag value is 1 and the
receive operation has finished, perform the issue stop condition processing described in step
[15] below.
[14] If the IRTR flag value is 0, clear the IRIC flag to 0 to cancel the wait state. Return to reading
the IRIC flag, as described in step [12], to detect the end of the receive operation.
[15] Clear the WAIT bit in ICMR to 0 to cancel the wait mode. Then clear the IRIC flag to 0. The
IRIC flag should be cleared when the value of WAIT is 0. (The stop condition may not be
output properly when the issue stop condition instruction is executed if the WAIT bit was
cleared to 0 after the IRIC flag is cleared to 0.)
[16] Read the final receive data in ICDR.
[17] Write 0 to BBSY and SCP in ICCR. This changes SDA from low to high when SCL is high,
and generates the stop condition.
Master transmit mode
SCL
(master output)
9
SDA
(slave output)
A
Master receive mode
1
2
3
4
5
6
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2
Data 1
SDA
(master output)
7
8
9
Bit 1 Bit 0
1
2
3
4
5
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3
[3]
Data 2
[3]
A
IRIC
IRTR
[4] IRTR = 0
ICDR
User processing
[4] IRTR = 1
Data 1
[2] ICDR read (dummy read)
[1] TRS cleared to 0
IRIC clearance
[6] IRIC clearance
(cancel wait)
[5] ICDR read
(data 1)
[6] IRIC clearance
Figure 14.12 Example of Master Receive Mode Operation Timing
(MLS = ACKB = 0, WAIT = 1)
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
[8] 1 clock cycle wait time
SCL
(master output)
8
9
SDA
Bit 0
(slave output)
Data 2
[3]
SDA
(master output)
1
2
3
Stop condition
generated
4
5
6
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2
Data 3
[3]
7
8
9
Bit 1 Bit 0
[12]
[12]
A
A
IRIC
IRTR
[4] IRTR = 0
ICDR
[4] IRTR = 1
Data 1
User processing
[13] IRTR = 0
Data 2
Data 3
[11] IRIC clearance
[6] IRIC clearance
[10] ICDR read (data 2)
[9] TRS set to 1
[7] ACKB set to 1
[13] IRTR = 1
[14] IRIC clearance
[15] WAIT cleared to 0
IRIC clearance
[17] Stop condition
issued
[16] ICDR read (data 3)
Figure 14.13 Example of Master Receive Mode Stop Condition Generation Timing
(MLS = ACKB = 0, WAIT = 1)
14.4.5
Slave Receive Operation
In slave receive mode, the master device outputs the transmit clock and transmit data, and the
slave device returns an acknowledge signal.
The slave device compares its own address with the slave address in the first frame following the
establishment of the start condition issued by the master device. If the addresses match, the slave
device operates as the slave device designated by the master device.
Figure 14.14 is a flowchart showing an example of slave receive mode operation.
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
Start
Initialize
Set MST = 0
and TRS = 0 in ICCR
[1]
Set ACKB = 0 in ICSR
Read IRIC in ICCR
No
[2]
IRIC = 1?
Yes
Read AAS and ADZ in ICSR
AAS = 1
and ADZ = 0?
No
General call address processing
* Description omitted
Yes
Read TRS in ICCR
No
TRS = 0?
Slave transmit mode
Yes
Is next receive
the last one?
No
Read ICDR
Yes
[3]
[1] Select slave receive mode.
Clear IRIC in ICCR
[2] Wait for the first byte to be received (slave
address).
Read IRIC in ICCR
[3] Start receiving. The first read is a dummy read.
No
[4]
IRIC = 1?
[4] Wait for the transfer to end.
[5] Set acknowledge data for the last receive.
Yes
[6] Start the last receive.
[7] Wait for the transfer to end.
Set ACKB = 0 in ICSR
[5]
Read ICDR
[6]
[8] Read the last receive data.
Clear IRIC in ICCR
Read IRIC in ICCR
No
[7]
IRIC = 1?
Yes
Read ICDR
[8]
Clear IRIC in ICCR
End
Figure 14.14 Flowchart for Slave Transmit Mode (Example)
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
The reception procedure and operations in slave receive mode are described below.
1. Set the ICE bit in ICCR to 1. Set the MLS bit in ICMR and the MST and TRS bits in ICCR
according to the operating mode.
2. When the start condition output by the master device is detected, the BBSY flag in ICCR is set
to 1.
3. When the slave address matches in the first frame following the start condition, the device
operates as the slave device specified by the master device. If the 8th data bit (R/W) is 0, the
TRS bit in ICCR remains cleared to 0, and slave receive operation is performed.
4. At the 9th clock pulse of the receive frame, the slave device drives SDA low and returns an
acknowledge signal. At the same time, the IRIC flag in ICCR is set to 1. If the IEIC bit in
ICCR has been set to 1, an interrupt request is sent to the CPU. If the RDRF internal flag has
been cleared to 0, it is set to 1, and the receive operation continues. If the RDRF internal flag
has been set to 1, the slave device drives SCL low from the fall of the receive clock until data
is read into ICDR.
5. Read ICDR and clear the IRIC flag in ICCR to 0. The RDRF flag is cleared to 0. Read the
IRDR flag and clear the IRIC flag to 0 consecutively, with no interrupt processing occurring
between them. If the time needed to transmit one byte of data elapses before the IRIC flag is
cleared, it will not be possible to determine when the transfer has completed.
Receive operations can be performed continuously by repeating steps [4] and [5]. When SDA is
changed from low to high when SCL is high, and the stop condition is detected, the BBSY flag in
ICCR is cleared to 0.
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
Start condition issuance
SCL
(master output)
1
2
3
Bit 7
Bit 6
Bit 5
4
5
Bit 4
Bit 3
6
7
Bit 2
Bit 1
8
9
1
2
SCL
(slave output)
SDA
(master output)
Slave address
SDA
(slave output)
Bit 0
R/W
Bit 7
Bit 6
Data 1
[4]
A
RDRF
IRIC
ICDRS
ICDRR
User processing
Address + R/W
Address + R/W
[5] ICDR read
[5] IRIC clearance
Figure 14.15 Example of Slave Receive Mode Operation Timing (1) (MLS = ACKB = 0)
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
SCL
(master output)
7
8
Bit 1
Bit 0
9
1
2
Bit 7
Bit 6
3
4
5
6
7
8
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
9
SCL
(slave output)
SDA
(master output)
Data 1
SDA
(slave output)
[4]
[4]
Data 2
A
A
RDRF
IRIC
ICDRS
Data 1
ICDRR
Data 1
User processing
Data 2
Data 2
[5] ICDR read [5] IRIC clearance
Figure 14.16 Example of Slave Receive Mode Operation Timing (2) (MLS = ACKB = 0)
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
14.4.6
Slave Transmit Operation
If the slave address matches to the address in the first frame (address reception frame) following
the start condition detection when the 8th bit data (R/W) is 1 (read), the TRS bit in ICCR is
automatically set to 1 and the mode changes to slave transmit mode.
Figure 14.17 shows the sample flowchart for the operations in slave transmit mode.
Slave transmit mode
Clear IRIC in ICCR
[1], [2] If the slave address matches to the address in the first frame
following the start condition detection and the R/W bit is 1
in slave recieve mode, the mode changes to slave transmit mode.
[3], [5] Set transmit data for the second and subsequent bytes.
Write transmit data in ICDR
Clear IRIC in ICCR
Read IRIC in ICCR
No
[3], [4] Wait for 1 byte to be transmitted.
IRIC = 1?
Yes
Read ACKB in ICSR
[4] Determine end of transfer.
End
of transmission
(ACKB = 1)?
No
Yes
Clear IRIC in ICCR
Clear ACKE to 0 in ICCR
(ACKB = 0 clear)
Set TRS = 0 in ICCR
Read ICDR
Read IRIC in ICCR
No
[6] Read IRIC in ICCR
[7] Clear acknowledge bit data
[8] Set slave receive mode.
[9] Dummy read (to release the SCL line).
[10] Wait for stop condition
IRIC = 1?
Yes
Clear IRIC in ICCR
End
Figure 14.17 Sample Flowchart for Slave Transmit Mode
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
In slave transmit mode, the slave device outputs the transmit data, while the master device outputs
the receive clock and returns an acknowledge signal. The transmission procedure and operations
in slave transmit mode are described below.
1. Initialize slave receive mode and wait for slave address reception.
When making initial settings for slave receive mode, set the ACKE bit in ICCR to 1. This is
necessary in order to enable reception of the acknowledge bit after entering slave transmit
mode.
2. When the slave address matches in the first frame following detection of the start condition,
the slave device drives SDA low at the 9th clock pulse and returns an acknowledge signal. If
the 8th data bit (R/W) is 1, the TRS bit in ICCR is set to 1, and the mode changes to slave
transmit mode automatically. The IRIC flag is set to 1 at the rise of the 9th clock. If the IEIC
bit in ICCR has been set to 1, an interrupt request is sent to the CPU. At the same time, the
TDRE internal flag is set to 1. The slave device drives SCL low from the fall of the transmit
clock until ICDR data is written, to disable the master device to output the next transfer clock.
3. After clearing the IRIC flag to 0, write data to ICDR. At this time, the TDRE internal flag is
cleared to 0. The written data is transferred to ICDRS, and the TDRE internal and IRIC flags
are set to 1 again. The slave device sequentially sends the data written into ICDRS in
accordance with the clock output by the master device.
The IRIC flag is cleared to 0 to detect the end of transmission. Processing from the ICDR
writing to the IRIC flag clearing should be performed continuously. Prevent any other interrupt
processing from being inserted. If the time for transmission of one frame of data has passed
before the IRIC clearing, the end of transmission cannot be determined.
4. The master device drives SDA low at the 9th clock pulse, and returns an acknowledge signal.
This acknowledge signal is stored in the ACKB bit in ICSR if the ACKE bit in has been set to
1, so the ACKB bit can be used to determine whether the transfer operation was performed
successfully. When one frame of data has been transmitted, the IRIC flag in ICCR is set to 1
at the rise of the 9th transmit clock pulse. When the TDRE internal flag is 0, the data written
into ICDR is transferred to ICDRS, transmission starts, and the TDRE internal and IRIC flags
are set to 1 again. If the TDRE internal flag has been set to 1, this slave device drives SCL low
from the fall of the transmit clock until data is written to ICDR.
5. To continue transmission, write the next data to be transmitted into ICDR. The TDRE internal
flag is cleared to 0. The IRIC flag is cleared to 0 to detect the end of transmission. Processing
from the ICDR register writing to the IRIC flag clearing should be performed continuously.
Prevent any other interrupt processing from being inserted.
Transmit operations can be performed continuously by repeating steps [4] and [5].
6. Clear the IRIC flag to 0.
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
7. To end transmission, clear the ACKE bit in ICCR to 0, to clear the acknowledge bit stored in
the ACKB bit to 0.
8. Clear the TRS bit to 0 for the next address reception, to set slave receive mode.
9. Dummy-read ICDR to release SDA on the slave side.
10. When the stop condition is detected, that is, when SDA is changed from low to high when SCL
is high, the BBSY flag in ICCR is cleared to 0 and the STOP flag in ICSR is set to 1. At the
same time, the IRIC flag is set to 1. If the IRIC flag has been set, it is cleared to 0.
To restart slave transmit mode operation, make the initial settings once again.
Slave receive mode
SCL
(master output)
8
Slave transmit mode
9
1
2
A
Bit 7
Bit 6
3
4
5
6
7
8
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
9
1
2
Bit 7
Bit 6
SCL
(slave output)
SDA
(slave output)
[2]
Data 1
SDA
(master output) R/W
Data 2
A
TDRE
[4]
IRIC
ICDRT
Data 1
Data 2
ICDRS
Data 1
Data 2
[3] IRIC clearance
User processing
[3] ICDR write
[5] IRIC clearance
[5] ICDR write
[3] IRIC clearance
Figure 14.18 Example of Slave Transmit Mode Operation Timing (MLS = 0)
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
14.4.7
IRIC Setting Timing and SCL Control
The interrupt request flag (IRIC) is set at different times depending on the WAIT bit in ICMR, the
FS bit in SAR, and the FSX bit in SARX. If the TDRE or RDRF internal flag is set to 1, SCL is
automatically held low after one frame has been transferred; this timing is synchronized with the
internal clock. Figure 14.19 shows the IRIC set timing and SCL control.
(a) When WAIT = 0, and FS = 0 or FSX = 0 (I2C bus format, no wait)
SCL
7
8
9
SDA
7
8
A
1
1
2
2
IRIC
User processing
Write to ICDR (transmit) Clear IRIC
or read ICDR (receive)
(b) When WAIT = 1, and FS = 0 or FSX = 0 (I2C bus format, wait inserted)
SCL
8
SDA
8
9
1
A
1
2
2
IRIC
Clear Write to ICDR (transmit) Clear
IRIC or read ICDR (receive) IRIC
User processing
(c) When FS = 1 and FSX = 1 (synchronous serial format)
SCL
7
8
SDA
7
8
1
1
2
2
IRIC
User processing
Write to ICDR (transmit)
or read ICDR (receive)
Clear IRIC
Figure 14.19 IRIC Setting Timing and SCL Control
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
14.4.8
Operation Using the DTC (H8S/2268 Group Only)
2
The I C bus format provides for selection of the slave device and transfer direction by means of
the slave address and the R/W bit, confirmation of reception with acknowledge bit, indication of
the last frame, and so on. Therefore, continuous data transfer using the DTC must be carried out in
conjunction CPU processing by means of interrupts.
Table 14.5 shows some example of processing using the DTC. These examples assume that the
number of transfer data bytes is know in slave mode.
Table 14.5 Flags and Transfer States
Item
Master Transmit Master Receive
Mode
Mode
Slave Transmit
Mode
Slave address + Transmission by Transmission by Reception by CPU
DTC (ICDR write) CPU (ICDR write) (ICDR read)
R/W bit
Slave Receive
Mode
Reception by CPU
(ICDR read)
Transmission/
reception
Dummy data
read
⎯
Processing by
⎯
CPU (ICDR read)
Actual data
Transmission by Reception by DTC Transmission by
transmission/re DTC (ICDR write) (ICDR read)
DTC (ICDR write)
ception
⎯
Reception by DTC
(ICDR read)
Dummy data
(H′FF) write
⎯
⎯
Last frame
processing
Not necessary
Reception by CPU Not necessary
(ICDR read)
Transfer
request
processing after
last frame
processing
1st time: Clearing Not necessary
by CPU
2nd time: End
condition issuance
by CPU
Automatic clearing Not necessary
on detection of end
condition during
transmission of
dummy data (H′FF)
Setting of
number of DTC
transfer data
frames
Transmission:
Reception: Actual
Actual data count data count
+ 1 (+ 1
equivalent to
slave address +
R/W bits)
Transmission:
Reception: Actual
Actual data count + data count
1 (+ 1 equivalent to
dummy data (H′FF))
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Processing by DTC ⎯
(ICDR write)
Reception by CPU
(ICDR read)
2
Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
14.4.9
Noise Canceler
The logic levels at the SCL and SDA pins are routed through noise cancellors before being latched
internally. Figure 14.20 shows a block diagram of the noise cancelled circuit.
The noise cancellor consists of two cascaded latches and a match detector. The SCL (or SDA)
input signal is sampled on the system clock, but is not passed forward to the next circuit unless the
outputs of both latches agree. If they do not agree, the previous value is held.
Sampling clock
C
SCL or
SDA input
signal
D
C
Q
Latch
D
Q
Latch
Match
detector
Internal
SCL or
SDA
signal
System clock
period
Sampling
clock
Figure 14.20 Block Diagram of Noise Cancellor
14.4.10 Initialization of Internal State
The IIC has a function for forcible initialization of its internal state if a deadlock occurs during
communication.
Initialization is executed by (1) setting bits CLR3 to CLR0 in the DDCSWR register or (2)
clearing the ICE bit. For details of settings for bits CLR3 to CLR0, see section 14.3.8, DDC
Switch Register (DDCSWR).
Scope of Initialization: The initialization executed by this function covers the following items:
• TDRE and RDRF internal flags
• Transmit/receive sequencer and internal operating clock counter
• Internal latches for retaining the output state of the SCL and SDA pins (wait, clock, data
output, etc.)
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
The following items are not initialized:
• Actual register values (ICDR, SAR, SARX, ICMR, ICCR, ICSR, DDCSWR, and STCR)
• Internal latches used to retain register read information for setting/clearing flags in the ICMR,
ICCR, ICSR, and DDCSWR registers
• The value of the ICMR register bit counter (BC2 to BC0)
• Generated interrupt sources (interrupt sources transferred to the interrupt controller)
Notes on Initialization:
• Interrupt flags and interrupt sources are not cleared, and so flag clearing measures must be
taken as necessary.
• Basically, other register flags are not cleared either, and so flag clearing measures must be
taken as necessary.
• When initialization is performed by means of the DDCSWR register, the write data for bits
CLR3 to CLR0 is not retained. To perform IIC clearance, bits CLR3 to CLR0 must be written
to simultaneously using an MOV instruction. Do not use a bit manipulation instruction such as
BCLR. Similarly, when clearing is required again, all the bits must be written to
simultaneously in accordance with the setting.
• If a flag clearing setting is made during transmission/reception, the IIC module will stop
transmitting/receiving at that point and the SCL and SDA pins will be released. When
transmission/reception is started again, register initialization, etc., must be carried out as
necessary to enable correct communication as a system.
The value of the BBSY bit cannot be modified directly by this module clear function, but since the
stop condition pin waveform is generated according to the state and release timing of the SCL and
SDA pins, the BBSY bit may be cleared as a result. Similarly, state switching of other bits and
flags may also have an effect.
To prevent problems caused by these factors, the following procedure should be used when
initializing the IIC state.
1. Execute initialization of the internal state according to the setting of bits CLR3 to CLR0, or
according to the ICE bit.
2. Execute a stop condition issuance instruction (write 0 to BBSY and SCP) to clear the BBSY
bit to 0, and wait for two transfer rate clock cycles.
3. Re-execute initialization of the internal state according to the setting of bits CLR3 to CLR0, or
according to the ICE bit.
4. Initialize (re-set) the IIC registers.
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
14.5
Interrupt Source
IICI is the interrupt source of IIC. Table 14.6 shows each interrupt source and its priority. The
ICCR interrupt enable bit sets each interrupt and the setting is independently sent to the interrupt
controller.
Table 14.6 IIC Interrupt Source
Interrupt
Flag
Interrupt
Priority
2
IRIC
High
2
IRIC
Channel
Name
Enable Bit
Interrupt Source
0
IICI0
IEIC
I C bus interface interrupt
request
1
IICI1
IEIC
I C bus interface interrupt
request
14.6
Low
Usage Notes
1. In master mode, if an instruction to generate a start condition is issued and then an instruction
2
to generate a stop condition is issued before the start condition is output to the I C bus, neither
condition will be output correctly. To output consecutive start and stop conditions, after
issuing the instruction that generates the start condition, read the relevant ports, check that
SCL and SDA are both low, then issue the instruction that generates the stop condition. Note
that SCL may not yet have gone low when BBSY is cleared to 0.
2. Either of the following two conditions will start the next transfer. Pay attention to these
conditions when reading or writing to ICDR.
⎯ Write access to ICDR when ICE = 1 and TRS = 1 (including automatic transfer from
ICDRT to ICDRS)
⎯ Read access to ICDR when ICE = 1 and TRS = 0 (including automatic transfer from
ICDRS to ICDRR)
3. Table 14.7 shows the timing of SCL and SDA output in synchronization with the internal
clock. Timings on the bus are determined by the rise and fall times of signals affected by the
bus load capacitance, series resistance, and parallel resistance.
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
2
Table 14.7 I C Bus Timing (SCL and SDA Output)
Item
Symbol
Output Timing
Unit
SCL output cycle time
tSCLO
28 tcyc to 256 tcyc
ns
SCL output high pulse width
tSCLHO
0.5 tSCLO
ns
SCL output low pulse width
tSCLLO
0.5 tSCLO
ns
SDA output bus free time
tBUFO
0.5 tSCLO – 1 tcyc
ns
Start condition output hold time
tSTAHO
0.5 tSCLO – 1 tcyc
ns
Retransmission start condition output
setup time
tSTASO
1 tSCLO
ns
Stop condition output setup time
tSTOSO
0.5 tSCLO + 2 tcyc
ns
Data output setup time (master)
tSDASO
1 tSCLLO – 3 tcyc
ns
1 tSCLL – 3 tcyc
ns
3 tcyc
ns
Data output setup time (slave)
Data output hold time
tSDAHO
Notes
4. SCL and SDA inputs are sampled in synchronization with the internal clock. The AC timing
2
therefore depends on the system clock cycle tcyc, as shown in table 25.8. Note that the I C bus
interface AC timing specifications will not be met with a system clock frequency of less than 5
MHz.
2
5. The I C bus interface specification for the SCL rise time tsr is under 1000 ns (300 ns for high2
speed mode). In master mode, the I C bus interface monitors the SCL line and synchronizes
one bit at a time during communication. If tsr (the time for SCL to go from low to VIH) exceeds
2
the time determined by the input clock of the I C bus interface, the high period of SCL is
extended. The SCL rise time is determined by the pull-up resistance and load capacitance of
the SCL line. To insure proper operation at the set transfer rate, adjust the pull-up resistance
and load capacitance so that the SCL rise time does not exceed the values given in the table in
table 14.8.
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
Table 14.8 Permissible SCL Rise Time (tsr) Values
Time Indication
2
I C Bus
Specification
(Max.)
φ=
5 MHz
φ=
8 MHz
φ=
10 MHz
φ=
16 MHz
φ=
20 MHz
Normal mode
1000 ns
1000 ns
937 ns
750 ns
468 ns
375 ns
High-speed
mode
300 ns
300 ns
300 ns
300 ns
300 ns
300 ns
Normal mode
1000 ns
1000 ns
1000 ns
1000 ns
1000 ns
875 ns
High-speed
mode
300 ns
300 ns
300 ns
300 ns
300 ns
300 ns
tcyc
IICX Indication
0
1
7.5 tcyc
17.5 tcyc
2
6. The I C bus interface specifications for the SCL and SDA rise and fall times are under 1000 ns
2
and 300 ns. The I C bus interface SCL and SDA output timing is prescribed by tScyc and tcyc, as
2
shown in table 14.7. However, because of the rise and fall times, the I C bus interface
specifications may not be satisfied at the maximum transfer rate. Table 14.9 shows output
timing calculations for different operating frequencies, including the worst-case influence of
rise and fall times. The values in the above table will vary depending on the settings of the
IICX bit and bits CKS0 to CKS2. Depending on the frequency it may not be possible to
2
achieve the maximum transfer rate; therefore, whether or not the I C bus interface
specifications are met must be determined in accordance with the actual setting conditions.
2
tBUFO fails to meet the I C bus interface specifications at any frequency. The solution is either (a)
to provide coding to secure the necessary interval (approximately 1 µs) between issuance of a
stop condition and issuance of a start condition, or (b) to select devices whose input timing
2
permits this output timing for use as slave devices connected to the I C bus.
2
tSCLLO in high-speed mode and tSTASO in standard mode fail to satisfy the I C bus interface
specifications for worst-case calculations of tSr/tSf. Possible solutions that should be
investigated include (a) adjusting the rise and fall times by means of a pull-up resistor and
capacitive load, (b) reducing the transfer rate to meet the specifications, or (c) selecting devices
2
whose input timing permits this output timing for use as slave devices connected to the I C
bus.
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
2
Table 14.9 I C Bus Timing (with Maximum Influence of tSr/tSf)
Time Indication (at Maximum Transfer Rate) [ns]
2
I C Bus
Item
tcyc Indication
tSCLHO
0.5 tSCLO (–tSr)
tSCLLO
tBUFO
tSTAHO
tSTASO
tSTOSO
Specifi-
Influence
cation
φ=
φ=
φ=
φ=
φ=
(Max.)
(Min.)
5 MHz
8 MHz
10 MHz
16 MHz
20 MHz
4000
4000
4000
4000
4000
4000
High-speed mode –300
600
950
950
950
950
950
Standard mode
4700
4750
High-speed mode –250
1300
1000*
1000*
0.5 tSCLO –1 tcyc
Standard mode
4700
1
3800*
( –tSr)
High-speed mode –300
1300
0.5 tSCLO –1 tcyc
Standard mode
(–tSf)
High-speed mode –250
0.5 tSCLO (–tSf)
1 tSCLO (–tSr)
Standard mode
tSr/tSf
Standard mode
–1000
–250
–1000
–250
–1000
4750
4750
4750
4750
1000*
1000*
1
1
1000*
1
3875*
1
3900*
1
3938*
1
3950*
1
750*
1
825*
1
850*
1
888*
1
900*
4000
4550
4625
4650
4688
4700
600
800
875
900
938
950
1
1
1
4700
9000
9000
9000
9000
9000
High-speed mode –300
600
2200
2200
2200
2200
2200
0.5 tSCLO + 2 tcyc
Standard mode
4000
4400
4250
4200
4125
4100
(–tSr)
High-speed mode –300
600
1350
1200
1150
1075
1050
250
3100
3325
3400
3513
3550
–1000
tSDASO
1tSCLLO* –3tcyc
Standard mode
(master)
(–tSr)
High-speed mode –300
100
400
625
700
813
850
Standard mode
250
3100
3325
3400
3513
3550
tSDASO
2
*2 –
1 tSCLL
–1000
–1000
3 tcyc*
2
(slave)
(–tSr)
High-speed mode –300
100
400
625
700
813
850
tSDAHO
3 tcyc
Standard mode
0
0
600
375
300
188
150
High-speed mode 0
0
600
375
300
188
150
2
Notes: 1. Does not meet the I C bus interface specification. Remedial action such as the following
is necessary: (a) secure a start/stop condition issuance interval; (b) adjust the rise and
fall times by means of a pull-up resistor and capacitive load; (c) reduce the transfer rate;
(d) select slave devices whose input timing permits this output timing.
The values in the above table will vary depending on the settings of the IICX bit and bits
CKS0 to CKS2. Depending on the frequency it may not be possible to achieve the
2
maximum transfer rate; therefore, whether or not the I C bus interface specifications are
met must be determined in accordance with the actual setting conditions.
2
2. Calculated using the I C bus specification values (standard mode: 4700 ns min.; highspeed mode: 1300 ns min.).
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
7. Note on ICDR Read at End of Master Reception
To halt reception after completion of a receive operation in master receive mode, set the TRS
bit to 1 and write 0 to BBSY and SCP in ICCR. This changes the SDA pin from low to high
when the SCL pin is high, and generates the stop condition. After this, receive data can be read
by means of an ICDR read, but if data remains in the buffer the ICDRS receive data will not be
transferred to ICDR, and so it will not be possible to read the second byte of data. If it is
necessary to read the second byte of data, issue the stop condition in master receive mode (i.e.
with the TRS bit cleared to 0). When reading the receive data, first confirm that the BBSY bit
in ICCR is cleared to 0, the stop condition has been generated, and the bus has been released,
then read ICDR with TRS cleared to 0. Note that if the receive data (ICDR data) is read in the
interval between execution of the instruction for issuance of the stop condition (writing of 0 to
BBSY and SCP in ICCR) and the actual generation of the stop condition, the clock may not be
output correctly in subsequent master transmission.
Clearing of the MST bit after completion of master transmission/reception, or other
modifications of IIC control bits to change the transmit/receive operating mode or settings,
must be carried out during interval (a) in figure 14.21 (after confirming that the BBSY bit has
been cleared to 0 in the ICCR register).
Stop condition
Start condition
(a)
SDA
Bit 0
A
SCL
8
9
Internal clock
BBSY bit
Master receive mode
ICDR reading
prohibited
Execution of stop
condition issuance
instruction
(0 written to BBSY
and SCP)
Confirmation of stop
condition generation
(0 read from BBSY)
Start condition
issuance
Figure 14.21 Points for Attention Concerning Reading of Master Receive Data
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
8. Notes on Start Condition Issuance for Retransmission
Depending on the timing combination with the start condition issuance and the subsequently
writing data to ICDR, it may not be possible to issue the retransmission and the data
transmission after retransmission condition issuance.
After start condition issuance is done and determined the start condition, write the transmit
data to ICDR, as shown below. Figure 14.22 shows the timing of start condition issuance for
retransmission, and the timing for subsequently writing data to ICDR, together with the
corresponding flowchart.
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
[1] Wait for end of 1-byte transfer
No
IRIC = 1?
[1]
[2] Determine whether SCL is low
Yes
Clear IRIC in ICSR
[3] Issue restart condition instruction for transmission
No
Start condition
issuance?
Other processing
[4] Determine whether start condition is generated or not
Yes
[5] Set transmit data (slave address + R/W)
Read SCL pin
No
SCL = Low?
[2]
Yes
Write BBSY = 1,
SCP = 0 (ICSR)
[3]
No
IRIC = 1?
[4]
Note: Program so that processing from [3] to [5]
is executed continuously.
Yes
Write transmit data to ICDR
[5]
Start condition
(retransmission)
SCL
9
SDA
ACK
Bit 7
Data output
IRIC
[5] ICDR write (next transmit data)
[4] IRIC determination
[3] (Restart) Start condition instruction issuance
[2] Detemination of SCL = Low
[1] IRIC determination
Figure 14.22 Flowchart and Timing of Start Condition Instruction Issuance for
Retransmission
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
2
9. Notes on I C Bus Interface Stop Condition Instruction Issuance
If the rise time of the 9th SCL clock exceeds the specification because the bus load capacitance
is large, or if there is a slave device of the type that drives SCL low to effect a wait, after rising
of the 9th SCL clock, issue the stop condition after reading SCL and determining it to be low,
as shown below.
9th clock
VIH
SCL
High period secured
As waveform rise is late,
SCL is detected as low
SDA
Stop condition
IRIC
[1] Determination of SCL = Low
[2] Stop condition instruction isuuance
Figure 14.23 Timing of Stop Condition Issuance
10. Notes on IRIC Flag Clearance When Using Wait Function
If the SCL rise time exceeds the designated duration or if the slave device is of the type that
keeps SCL low and applies a wait state when the wait function is used in the master mode of
2
the I C bus interface, read SCL and clear the IRIC flag after determining that SCL has gone
low, as shown below.
Clearing the IRIC flag to 0 when WAIT is set to 1 and SCL is being held at high level can
cause the SDA value to change before SCL goes low, resulting in a start condition or stop
condition being generated erroneously.
SCL
VIH
SCL = high duration
maintained
SCL = low detected
SDA
IRIC
[1] Judgement that SCL = low [2] IRIC clearance
Figure 14.24 IRIC Flag Clearance in WAIT = 1 Status
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
11. Notes on ICDR Reads and ICCR Access in Slave Transmit Mode
2
In a transmit operation in the slave mode of the I C bus interface, do not read the ICDR register
or read or write to the ICCR register during the period indicated by the shaded portion
in figure 14.25.
Normally, when interrupt processing is triggered in synchronization with the rising edge of the
9th clock cycle, the period in question has already elapsed when the transition to interrupt
processing takes place, so there is no problem with reading the ICDR register or reading or
writing to the ICCR register.
To ensure that the interrupt processing is performed properly, one of the following two
conditions should be applied.
(1) Make sure that reading received data from the ICDR register, or reading or writing to the
ICCR register, is completed before the next slave address receive operation starts.
(2) Monitor the BC2 to BC0 counter in the ICMR register and, when the value of BC2 to BC0
is 000 (8th or 9th clock cycle), allow a waiting time of at least 2 transfer clock cycles in
order to involve the problem period in question before reading from the ICDR register, or
reading or writing to the ICCR register.
Waveforms if
problem occurs
SDA
SCL
TRS
R/W
8
Bit 7
A
9
Address received
Data transmission
Period when ICDR reads and ICCR
reads and writes are prohibited
(6 system clock cycles)
ICDR write
Detection of 9th clock
cycle rising edge
Figure 14.25 ICDR Read and ICCR Access Timing in Slave Transmit Mode
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
12. Notes on TRS Bit Setting in Slave Mode
From the detection of the rising edge of the 9th clock cycle or of a stop condition to when the
rising edge of the next SCL pin signal is detected (the period indicated as (a) in figure 14.26)
2
in the slave mode of the I C bus interface, the value set in the TRS bit in the ICCR register is
effective immediately.
However, at other times (indicated as (b) in figure 14.26) the value set in the TRS bit is put on
hold until the next rising edge of the 9th clock cycle or stop condition is detected, rather than
taking effect immediately.
This results in the actual internal value of the TRS bit remaining 1 (transmit mode) and no
acknowledge bit being sent at the 9th clock cycle address receive completion in the case of an
address receive operation following a restart condition input with no stop condition
intervening.
When receiving an address in the slave mode, clear the TRS bit to 0 during the period
indicated as (a) in figure 14.26.
To cancel the holding of the SCL bit low by the wait function in the slave mode, clear the TRS
bit to 0 and then perform a dummy read of the ICDR register.
Restart condition
(b)
(a)
A
SDA
SCL
TRS
8
9
1
2
3
4
5
6
7
8
9
Address reception
Data transmission
TRS bit setting hold time
ICDR dummy read
TRS bit set
Detection of 9th clock
cycle rising edge
Detection of 9th clock
cycle rising edge
Figure 14.26 TRS Bit Setting Timing in Slave Mode
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
13. Notes on ICDR Reads in Transmit Mode and ICDR Writes in Receive Mode
When attempting to read ICDR in the transmit mode (TRS = 1) or write to ICDR in the receive
mode (TRS = 0) under certain conditions, the SCL pin may not be held low after the
completion of the transmit or receive operation and a clock may not be output to the SCL bus
line before the ICDR register access operation can take place properly.
When accessing ICDR, always change the setting to the transmit mode before performing a
read operation, and always change the setting to the receive mode before performing a write
operation.
14.Notes on ACKE Bit and TRS Bit in Slave Mode
2
When using the I C bus interface, if an address is received in the slave mode immediately after
1 is received as an acknowledge bit (ACKB = 1) in the transmit mode (TRS = 1), an interrupt
may be generated at the rising edge of the 9th clock cycle if the address does not match.
2
When performing slave mode operations using the I C bus interface module, make sure to do
the following.
(1) When a 1 is received as an acknowledge bit for the final transmit data after completing a
series of transmit operations, clear the ACKE bit in the ICCR register to 0 to initialize the
ACKB bit to 0.
(2) In the slave mode, change the setting to the receive mode (TRS = 0) before the start
condition is input. To ensure that the switch from the slave transmit mode to the slave
receive mode is accomplished properly, end the transmission as described in figure 14.17.
15. Notes on Arbitration Lost in Master Mode
2
The I C bus interface recognizes the data in transmit/receive frame as an address when
arbitration is lost in master mode and a transition to slave receive mode is automatically
carried out.
When arbitration is lost not in the first frame but in the second frame or subsequent frame,
transmit/receive data that is not an address is compared with the value set in the SAR or SARX
register as an address. If the receive data matches with the address in the SAR or SARX
2
register, the I C bus interface erroneously recognizes that the address call has occurred. (See
figure 14.27.)
2
In multi-master mode, a bus conflict could happen. When The I C bus interface is operated in
master mode, check the state of the AL bit in the ICSR register every time after one frame of
data has been transmitted or received.
When arbitration is lost during transmitting the second frame or subsequent frame, take
avoidance measures.
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
• Arbitration is lost
• The AL flag in ICSR is set to 1
I2C bus interface
(Master transmit mode)
S
SLA
R/W A
DATA1
Transmit data match
Transmit timing match
Other device
(Master transmit mode)
S
SLA
R/W A
Transmit data does not match
DATA2
A
DATA3
A
Data contention
I2C bus interface
(Slave receive mode)
S
SLA
R/W A
• Receive address is ignored
SLA
R/W
A
DATA4
A
• Automatically transferred to slave
receive mode
• Receive data is recognized as an
address
• When the receive data matches to
the address set in the SAR or SARX
register, the I2C bus interface operates
as a slave device.
Figure 14.27 Diagram of Erroneous Operation when Arbitration Is Lost
2
Though it is prohibited in the normal I C protocol, the same problem may occur when the MST
bit is erroneously set to 1 and a transition to master mode is occurred during data transmission
or reception in slave mode. In multi-master mode, pay attention to the setting of the MST bit
when a bus conflict may occur. In this case, the MST bit in the ICCR register should be set to
1 according to the order below.
(1) Make sure that the BBSY flag in the ICCR register is 0 and the bus is free before setting
the MST bit.
(2) Set the MST bit to 1.
(3) To confirm that the bus was not entered to the busy state while the MST bit is being set,
check that the BBSY flag in the ICCR register is 0 immediately after the MST bit has been
set.
16. Notes on Wait Operation in Master Mode
When attempting to use the wait function in master mode, if the interrupt flag IRIC bit is
cleared from 1 to 0 between the falling edges of the seventh and eighth clock pulses, the LSI
may fail to enter wait status after the falling edge of the eighth clock pulse and instead output
the ninth clock pulse continuously.
When using the wait function, keep the following points in mind with regard to clearing the
IRIC flag.
Ensure that the IRIC flag is set to 1 at the rising edge of the ninth clock pulse and cleared to 0
before the rising edge of the seventh clock pulse (when the counter value in BC2 to BC0 is 2
or higher).
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
If clearing of the IRIC flag is delayed due to interrupt handling or the like and the BC counter
value is 1 or 0, confirm that the SCL pin signal is low level after the BC2 to BC0 counter value
has reached 0 before clearing the IRIC flag. (See figure 14.28.)
SDA
A
SCL
9
BC2 to BC0
0
Send/receive data
1
2
7
3
6
4
5
5
4
6
3
Send/receive
data
A
Confirm SCL =
8 low level
7
2
9
1
2
7
1
Clear IRIC
IRIC (operation
example)
IRIC flag may be cleared
3
6
5
Clear IRIC when
BC2 to BC0 ≥ 2
IRIC flag may be cleared
IRIC flag may not be cleared
Figure 14.28 Timing of IRIC Flag Clearing during Wait Operation
17. Interrupt during Module Stop Mode
When the module is stopped in the state that an interrupt is requested, the interrupt source of
the CPU or activation source of the DTC* is not cleared. Be sure to enter module stop mode by
disabling the interrupt beforehand.
Note: * Supported only by the H8S/2268 Group.
18. Assignment and Selection of Register Addresses
2
Some I C bus interface registers are assigned to the same address as other registers. Register
selection is performed by means of the IICE bit in the serial control register X (SCRX). For
details on register addresses, see section 24, List of Registers.
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Section 14 I C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
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Section 15 A/D Converter
Section 15 A/D Converter
This LSI includes a successive approximation type 10-bit A/D converter that allows up to ten
analog input channels to be selected. A block diagram of the A/D converter is shown in figure
15.1.
15.1
Features
• 10-bit resolution
• Ten input channels
• Conversion time: 6.3 µs per channel (at 20.5 MHz operation)
• Two operating modes
Single mode: Single-channel A/D conversion
Scan mode: Continuous A/D conversion on 1 to 4 channels
• Four data registers
Conversion results are held in a 16-bit data register for each channel.
• Sample and hold function
• Three methods conversion start
Software
16-bit timer pulse unit (TPU or TMR) conversion start trigger
External trigger signal
• Interrupt request
An A/D conversion end interrupt request (ADI) can be generated.
• Module stop mode can be set
• Selectable range of voltages of analog inputs
The range of voltages of analog inputs to be converted can be specified using the Vref signal
as the analog reference voltage.
ADCMS35B_000020020700
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Section 15 A/D Converter
Module data bus
Bus interface
Internal data bus
AN0
φ/2
+
AN1
φ/4
Comparator
AN2
AN5
Multiplexer
AN3
AN4
ADCR
ADCSR
ADDRD
ADDRB
ADDRC
10-bit D/A
converter
Vref
ADDRA
Successive approximations
register
AVcc
Control circuit
Sample-andhold circuit
AN6
AN7
φ/8
φ/16
ADI
interrupt signal
Conversion start
trigger from TPU or
8-bit timer
AN8
AN9
ADTRG
Off while waiting for A/D conversion
On during A/D conversion
AVSS
Legend:
ADCR:
ADCSR:
ADDRA:
ADDRB:
ADDRC:
ADDRD:
A/D control register
A/D control/status register
A/D data register A
A/D data register B
A/D data register C
A/D data register D
Figure 15.1 Block Diagram of A/D Converter
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Section 15 A/D Converter
15.2
Input/Output Pins
Table 15.1 summarizes the input pins used by the A/D converter. The eight analog input pins are
divided into two groups each of which consists of four channels; analog input pins 0 to 3 (AN0 to
AN3) comprising group 0 and analog input pins 4 to 7 (AN4 to AN7) comprising group 1. The
AVcc and AVss pins are the power supply pins for the analog block in the A/D converter. The
Vref pin is the A/D conversion reference voltage pin.
Table 15.1 Pin Configuration
Pin Name
Symbol
I/O
Function
Analog power supply pin
AVcc
Input
Analog block power supply and reference
voltage
Analog ground pin
AVss
Input
Analog block ground and reference voltage
Reference voltage pin
Vref
Input
Reference voltage for A/D conversion
Analog input pin 0
AN0*
Input
Group 0 analog input pins
Analog input pin 1
AN1*
Input
Analog input pin 2
AN2
Input
Analog input pin 3
AN3
Input
Analog input pin 4
AN4
Input
Analog input pin 5
AN5
Input
Analog input pin 6
AN6
Input
Analog input pin 7
AN7
Input
Analog input pin 8
AN8
Input
Analog input pin 9
AN9
Input
A/D external trigger input pin
ADTRG
Input
Group 1 analog input pins
Analog input pins
External trigger input pin for starting A/D
conversion
Note: * AN0 and AN1 can be used only when Vcc = AVcc.
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Section 15 A/D Converter
15.3
Register Descriptions
The A/D converter has the following registers. For details on the module stop control register,
refer to section 22.1.2, Module Stop Control Registers A to D (MSTPCRA to MSTPCRD).
• A/D data register A (ADDRA)
• A/D data register B (ADDRB)
• A/D data register C (ADDRC)
• A/D data register D (ADDRD)
• A/D control/status register (ADCSR)
• A/D control register (ADCR)
15.3.1
A/D Data Registers A to D (ADDRA to ADDRD)
There are four 16-bit read-only ADDR registers; ADDRA to ADDRD, used to store the results of
A/D conversion. The ADDR registers, which store a conversion result for each channel, are shown
in table 15.2.
The converted 10-bit data is stored in bits 6 to 15. The lower 6 bits are always read as 0.
The data bus between the CPU and the A/D converter is 8 bits width. The upper byte can be read
directly from the CPU, however the lower byte should be read via a temporary register. Therefore,
when reading the ADDR, read only the upper byte, or read in word unit.
Table 15.2 Analog Input Channels and Corresponding ADDR Registers
Analog Input Channel
CH3 = 0
CH3 = 1
A/D Data Register to be
Stored Results of A/D
Conversion
Group 0
(CH2 = 0)
Group 1
(CH2 = 1)
⎯
(CH2 = 0)
⎯
(CH2 = 1)
AN0
AN4
Setting
prohibited
Setting
prohibited
ADDRA
AN1
AN5
Setting
prohibited
Setting
prohibited
ADDRB
AN2
AN6
Setting
prohibited
AN8
ADDRC
AN3
AN7
Setting
prohibited
AN9
ADDRD
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Section 15 A/D Converter
15.3.2
A/D Control/Status Register (ADCSR)
ADCSR controls A/D conversion operations.
Bit
7
Bit Name
ADF
Initial
Value
R/W
0
1
R/(W)* A/D End Flag
Description
A status flag that indicates the end of A/D conversion.
[Setting conditions]
•
When A/D conversion ends in single mode
•
When A/D conversion ends on all specified channels
in scan mode
[Clearing conditions]
•
•
When 0 is written after reading ADF = 1
2
When the DTC* is activated by an ADI interrupt, and
the DISEL bit in DTC is 0 with the transfer counter
other than 0
6
ADIE
0
R/W
A/D Interrupt Enable
A/D conversion end interrupt (ADI) request enabled when
1 is set
5
ADST
0
R/W
A/D Start
Clearing this bit to 0 stops A/D conversion, and the A/D
converter enters the wait state.
Setting this bit to 1 starts A/D conversion. In single mode,
this bit is cleared to 0 automatically when conversion on
the specified channel is complete. In scan mode,
conversion continues sequentially on the specified
channels until this bit is cleared to 0 by software, a reset,
or a transition to power-down mode in which the A/D
converter is halted, shown in table 22.1.
The ADST bit can be set to 1 by software, a timer
conversion start trigger, or the A/D external trigger input
pin (ADTRG).
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Section 15 A/D Converter
Bit
Bit Name
Initial
Value
R/W
4
SCAN
0
R/W
Description
Scan Mode
Selects single mode or scan mode as the A/D conversion
operating mode.
Only set the SCAN bit while conversion is stopped (ADST
= 0).
0: Single mode
1: Scan mode
3
CH3
0
R/W
Channel Select 0 to 3
2
CH2
0
R/W
Select analog input channels.
1
CH1
0
R/W
When SCAN = 0
When SCAN = 1
0
CH0
0
R/W
0000: AN0
0000: AN0
0001: AN1
0001: AN0 to AN1
0010: AN2
0010: AN0 to AN2
0011: AN3
0011: AN0 to AN3
0100: AN4
0100: AN4
0101: AN5
0101: AN4 to AN5
0110: AN6
0110: AN4 to AN6
0111: AN7
0111: AN4 to AN7
1000: Setting prohibited
1000: Setting prohibited
1001: Setting prohibited
1001: Setting prohibited
1010: Setting prohibited
1010: Setting prohibited
1011: Setting prohibited
1011: Setting prohibited
1100: Setting prohibited
1100: Setting prohibited
1101: Setting prohibited
1101: Setting prohibited
1110: AN8
1110: Setting prohibited
1111: AN9
1111: Setting prohibited
Notes: 1. Only 0 can be written to bit 7, to clear this bit.
2. Supported only by the H8S/2268 Group.
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Section 15 A/D Converter
15.3.3
A/D Control Register (ADCR)
The ADCR enables A/D conversion started by an external trigger signal.
Bit
Bit Name
Initial
Value
R/W
Description
7
TRGS1
0
R/W
Timer Trigger Select 0 and 1
6
TRGS0
0
R/W
Enables the start of A/D conversion by a trigger signal.
Only set bits TRGS0 and TRGS1 while conversion is
stopped (ADST = 0).
00: A/D conversion start by software is enabled
01: A/D conversion start by TPU conversion start trigger
is enabled
10: A/D conversion start by 8-bit timer conversion start
trigger is enabled
11: A/D conversion start by external trigger pin (ADTRG)
is enabled
5, 4
⎯
All 1
⎯
Reserved
These bits are always read as 1 and cannot be modified.
3
CKS1
0
R/W
Clock Select 0 and 1
2
CKS0
0
R/W
These bits specify the A/D conversion time. The
conversion time should be changed only when ADST = 0.
Specify a setting that gives a value within the range
shown in table 26.9 or 26.22 in section 26, Electrical
Characteristics.
00: Conversion time = 530 states (max.)
01: Conversion time = 266 states (max.)
10: Conversion time = 134 states (max.)
11: Conversion time = 68 states (max.)
1, 0
⎯
All 1
⎯
Reserved
These bits are always read as 1 and cannot be modified.
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Section 15 A/D Converter
15.4
Interface to Bus Master
ADDRA to ADDRD are 16-bit registers. As the data bus to the bus master is 8 bits wide, the bus
master accesses to the upper byte of the registers directly while to the lower byte of the registers
via the temporary register (TEMP).
Data in ADDR is read in the following way: When the upper-byte data is read, the upper-byte data
will be transferred to the CPU and the lower-byte data will be transferred to TEMP. Then, when
the lower-byte data is read, the lower-byte data will be transferred to the CPU.
When data in ADDR is read, the data should be read from the upper byte and lower byte in the
order. When only the upper-byte data is read, the data is guaranteed. However, when only the
lower-byte data is read, the data is not guaranteed.
Figure 15.2 shows data flow when accessing to ADDR.
Read the upper byte
Bus master
(H'AA)
Module data bus
Bus interface
TEMP
(H'40)
ADDRnH
(H'AA)
ADDRnL
(H'40)
(n = A to D)
Read the lower byte
Bus master
(H'40)
Module data bus
Bus interface
TEMP
(H'40)
ADDRnH
(H'AA)
ADDRnL
(H'40)
(n = A to D)
Figure 15.2 Access to ADDR (When Reading H'AA40)
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Section 15 A/D Converter
15.5
Operation
The A/D converter operates by successive approximation with 10-bit resolution. It has two
operating modes; single mode and scan mode. When changing the operating mode or analog input
channel, in order to prevent incorrect operation, first clear the bit ADST to 0 in ADCSR. The
ADST bit can be set at the same time as the operating mode or analog input channel is changed.
15.5.1
Single Mode
In single mode, A/D conversion is to be performed only once on the specified single channel. The
operations are as follows.
1. A/D conversion is started when the ADST bit is set to 1, according to software, timer
conversion start trigger, or external trigger input.
2. When A/D conversion is completed, the result is transferred to the corresponding A/D data
register to the channel.
3. On completion of conversion, the ADF bit in ADCSR is set to 1. If the ADIE bit is set to 1 at
this time, an ADI interrupt request is generated.
4. The ADST bit remains set to 1 during A/D conversion. When A/D conversion ends, the ADST
bit is automatically cleared to 0 and the A/D converter enters the wait state.
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Section 15 A/D Converter
Set*
ADIE
A/D
conversion start
Set*
Set*
ADST
Clear*
Clear*
ADF
State of channel 0 (AN0)
Idle
State of channel 1 (AN1)
Idle
State of channel 2 (AN2)
Idle
State of channel 3 (AN3)
Idle
A/D conversion 1
A/D conversion 2
Idle
ADDRA
Read conversion result*
A/D conversion result 1
ADDRB
Read conversion result*
A/D conversion result 2
ADDRC
ADDRD
Note: *
Vertical arrows indicate instructions executed by software.
Figure 15.3 Example of A/D Converter Operation (Single Mode, Channel 1 Selected)
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Section 15 A/D Converter
15.5.2
Scan Mode
In scan mode, A/D conversion is to be performed sequentially on the specified channels (four
channels maximum). The operations are as follows.
1. When the ADST bit is set to 1 by software, TPU, timer conversion start trigger, or external
trigger, input, A/D conversion starts on the first channel in the group (AN0 when CH3 and
CH2 = 00, AN4 when CH3 and CH2 = 01, or AN8 when CH3 and CH2 = 10).
2. When A/D conversion for each channel is completed, the result is sequentially transferred to
the A/D data register corresponding to each channel.
3. When conversion of all the selected channels is completed, the ADF flag is set to 1. If the
ADIE bit is set to 1 at this time, an ADI interrupt is requested after A/D conversion ends.
Conversion of the first channel in the group starts again.
4. Steps [2] to [3] are repeated as long as the ADST bit remains set to 1. When the ADST bit is
cleared to 0, A/D conversion stops and the A/D converter enters the wait state.
Contimuous A/D conversion
Clear*1
Set*1
ADST
Clear*1
ADF
State of channel 0
(AN0)
A/D conversion time
Idle
A/D conversion 1
State of channel 1
(AN1)
Idle
State of channel 2
(AN2)
Idle
State of channel 3
(AN3)
ADDRA
Idle
Idle
A/D conversion 4
Idle
A/D conversion 2
A/D conversion 5
*2
Idle
Idle
A/D conversion 3
Idle
A/D conversion result 1
ADDRB
A/D conversion result 2
A/D conversion result 2
ADDRC
A/D conversion result 3
ADDRD
Notes: 1. Vertical arrows indicate instructions executed by software.
2. Data currently being converted is ignored.
Figure 15.4 Example of A/D Converter Operation
(Scan Mode, Channels AN0 to AN2 Selected)
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Section 15 A/D Converter
15.5.3
Input Sampling and A/D Conversion Time
The A/D converter has a built-in sample-and-hold circuit. The A/D converter samples the analog
input when the A/D conversion start delay time (tD) has passed after the ADST bit is set to 1, then
starts conversion. Figure 15.5 shows the A/D conversion timing. Table 15.3 shows the A/D
conversion time.
As indicated in figure 15.5, the A/D conversion time (tCONV) includes tD and the input sampling time
(tSPL). The length of tD varies depending on the timing of the write access to ADCSR. The total
conversion time therefore varies within the ranges indicated in table 15.3.
Specify the conversion time by setting bits CKS0 and CKS1 in ADCR with ADST cleared to 0.
Note that the specified conversion time should be longer than the value described in A/D
Conversion Characteristics in section 25, Electrical Characteristics.
In scan mode, the values given in table 15.3 apply to the first conversion time. The values given in
table 15.4 apply to the second and subsequent conversions.
(1)
φ
Address
(2)
Write signal
Input sampling
timing
ADF
tD
tSPL
tCONV
Legend:
(1):
ADCSR write cycle
(2):
ADCSR address
tD:
A/D conversion start delay
tSPL: Input sampling time
tCONV: A/D conversion time
Figure 15.5 A/D Conversion Timing
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Section 15 A/D Converter
Table 15.3 A/D Conversion Time (Single Mode)
CKS1 = 0
CKS0 = 0
Item
Symbol Min. Typ. Max.
CKS1 = 1
CKS0 = 1
CKS0 = 0
CKS0 = 1
Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.
A/D conversion tD
start delay
18
⎯
33
10
⎯
17
6
⎯
9
4
⎯
5
Input sampling tSPL
time
⎯
127 ⎯
⎯
63
⎯
⎯
31
⎯
⎯
15
⎯
A/D conversion tCONV
time
515 ⎯
266
131 ⎯
134
67
⎯
68
530
259 ⎯
Note: * All values represent the number of states.
Table 15.4 A/D Conversion Time (Scan Mode)
CKS1
CKS0
Conversion Time (State)
0
0
512 (Fixed)
1
256 (Fixed)
0
128 (Fixed)
1
64 (Fixed)
1
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Section 15 A/D Converter
15.5.4
External Trigger Input Timing
A/D conversion can be externally triggered. When the TRGS0 and TRGS1 bits are set to 11 in
ADCR, external trigger input is enabled at the ADTRG pin. A falling edge at the ADTRG pin sets
the ADST bit to 1 in ADCSR, starting A/D conversion. Other operations, in both single and scan
modes, are the same as when the bit ADST has been set to 1 by software. Figure 15.6 shows the
timing.
φ
ADTRG
Internal trigger signal
ADST
A/D conversion
Figure 15.6 External Trigger Input Timing
15.6
Interrupt Source
The A/D converter generates an A/D conversion end interrupt (ADI) at the end of A/D conversion.
Setting the ADIE bit to 1 enables ADI interrupt requests while the bit ADF in ADCSR is set to 1
after A/D conversion is completed. In the H8S/2268 Group, the DTC* can be activated by an ADI
interrupt. Having the converted data read by the DTC* in response to an ADI interrupt enables
continuous conversion without imposing a load on software.
Table 15.5 A/D Converter Interrupt Source
Name
Interrupt Source
Interrupt Source Flag
DTC Activation*
ADI
A/D conversion completed
ADF
Possible
Note: * Supported only by the H8S/2268 Group.
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Section 15 A/D Converter
15.7
A/D Conversion Accuracy Definitions
This LSI's A/D conversion accuracy definitions are given below.
• Resolution
The number of A/D converter digital output codes
• Quantization error
The deviation inherent in the A/D converter, given by 1/2 LSB (see figure 15.7).
• Offset error
The deviation of the analog input voltage value from the ideal A/D conversion characteristic
when the digital output changes from the minimum voltage value B'0000000000 (H'000) to
B'0000000001 (H'001) (see figure 15.8).
• Full-scale error
The deviation of the analog input voltage value from the ideal A/D conversion characteristic
when the digital output changes from B'1111111110 (H'3FE) to B'1111111111 (H'3FF) (see
figure 15.8).
• Nonlinearity error
The error with respect to the ideal A/D conversion characteristic between zero voltage and fullscale voltage. Does not include offset error, full-scale error, or quantization error (see figure
15.8).
• Absolute accuracy
The deviation between the digital value and the analog input value. Includes offset error, fullscale error, quantization error, and nonlinearity error.
Rev. 5.00 Sep. 01, 2009 Page 457 of 656
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Section 15 A/D Converter
Digital output
111
Ideal A/D conversion
characteristic
110
101
100
011
010
Quantization error
001
000
1
2
1024 1024
1022 1023 FS
1024 1024
Analog
input voltage
Figure 15.7 A/D Conversion Accuracy Definitions (1)
Full-scale error
Digital output
Ideal A/D conversion
characteristic
Nonlinearity
error
Actual A/D conversion
characteristic
Offset error
FS
Analog
input voltage
Figure 15.8 A/D Conversion Accuracy Definitions (2)
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Section 15 A/D Converter
15.8
15.8.1
Usage Notes
Module Stop Mode Setting
Operation of the A/D converter can be disabled or enabled using the module stop control register.
The initial setting is for operation of the A/D converter to be halted. Register access is enabled by
clearing module stop mode. For details, refer to section 22, Power-Down Modes.
15.8.2
Permissible Signal Source Impedance
This LSI's analog input is designed such that conversion accuracy is guaranteed for an input signal
for which the signal source impedance is 5 kΩ or less. This specification is provided to enable the
A/D converter's sample-and-hold circuit input capacitance to be charged within the sampling time;
if the sensor output impedance exceeds 5 kΩ, charging may be insufficient and it may not be
possible to guarantee A/D conversion accuracy. However, for A/D conversion in single mode with
a large capacitance provided externally, the input load will essentially comprise only the internal
input resistance of 10 kΩ, and the signal source impedance is ignored. However, as a low-pass
filter effect is obtained in this case, it may not be possible to follow an analog signal with a large
differential coefficient (e.g., 5 mV/μs or greater) (see figure 15.9). When converting a high-speed
analog signal, a low-impedance buffer should be inserted.
15.8.3
Influences on Absolute Accuracy
Adding capacitance results in coupling with GND, and therefore noise in GND may adversely
affect absolute accuracy. Be sure to make the connection to an electrically stable GND such as
AVss.
Care is also required to insure that filter circuits do not communicate with digital signals on the
mounting board (i.e., acting as antennas).
This LSI
Sensor input
Sensor output
impedance
to 5 kΩ
Low-pass
filter
C to 0.1 mF
A/D converter
equivalent circuit
10 kΩ
Cin =
15 pF
20 pF
Figure 15.9 Example of Analog Input Circuit
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Section 15 A/D Converter
15.8.4
Range of Analog Power Supply and Other Pin Settings
If the conditions below are not met, the reliability of the device may be adversely affected.
• Analog input voltage range
The voltage applied to analog input pin ANn during A/D conversion should be in the range
AVss ≤ ANn ≤ AVcc.
• Relationship between AVcc, AVss and Vcc, Vss
Set AVss = Vss as the relationship between AVcc, AVss and Vcc, Vss. If the A/D converter is
not used, the AVcc and AVss pins must not be left open. In addition, analog input pins AN0
and AN1 can be used only when Vcc = AVcc.
• Vref range
The reference voltage input from the Vref pin should be set to AVcc or less.
15.8.5
Notes on Board Design
In board design, digital circuitry and analog circuitry should be as mutually isolated as possible,
and layout in which digital circuit signal lines and analog circuit signal lines cross or are in close
proximity should be avoided as far as possible. Failure to do so may result in incorrect operation
of the analog circuitry due to inductance, adversely affecting A/D conversion values. Also, digital
circuitry must be isolated from the analog input signals (AN0 to AN9), and analog power supply
(AVcc) by the analog ground (AVss). Also, the analog ground (AVss) should be connected at one
point to a stable digital ground (Vss) on the board.
15.8.6
Notes on Noise Countermeasures
A protection circuit should be connected in order to prevent damage due to abnormal voltage, such
as an excessive surge at the analog input pins (AN0 to AN9), between AVcc and AVss, as shown
in figure 15.10. Also, the bypass capacitors connected to AVcc and the filter capacitor connected
to AN0 to AN9 must be connected to AVss.
If a filter capacitor is connected, the input currents at the analog input pins (AN0 to AN9) are
averaged, and so an error may arise. Also, when A/D conversion is performed frequently, as in
scan mode, if the current charged and discharged by the capacitance of the sample-and-hold circuit
in the A/D converter exceeds the current input via the input impedance (Rin), an error will arise in
the analog input pin voltage. Careful consideration is therefore required when deciding circuit
constants.
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Section 15 A/D Converter
AVCC
Vref
Rin*2
*1
100 Ω
*1
AN0 to AN9
0.1 μF
AVSS
Notes: Values are reference values.
1.
10 μF
0.01 μF
2. Rin: Input impedance
Figure 15.10 Example of Analog Input Protection Circuit
Table 15.6 Analog Pin Specifications
Item
Min.
Max.
Unit
Analog input capacitance
⎯
20
pF
Permissible signal source impedance
⎯
5
kΩ
10 kΩ
AN0 to AN9
To A/D converter
20 pF
Note: Values are reference values.
Figure 15.11 Analog Input Pin Equivalent Circuit
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Section 15 A/D Converter
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REJ09B0071-0500
Section 16 D/A Converter
Section 16 D/A Converter
The H8S/2268 Group includes a D/A converter, while the H8S/2264 Group does not.
16.1
Features
• 8-bit resolution
• Two output channels
• Conversion time: 10 µs, maximum (when load capacitance is 20 pF)
• Output voltage: 0 V to Vref
• Module stop mode can be set
Internal data bus
Module data bus
Bus interface
Vref
DACR
8-bit D/A
DADR1
DA1
DADR0
AVCC
DA0
AVSS
Control circuit
Legend:
DACR: D/A control register
DADR0: D/A data register 0
DADR1: D/A data register 1
Figure 16.1 Block Diagram of D/A Converter
DAC0004B_000020020700
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Section 16 D/A Converter
16.2
Input/Output Pins
Table 16.1 shows the pin configuration for the D/A converter.
Table 16.1 Pin Configuration
Pin Name
Symbol
I/O
Function
Analog power supply pin
AVCC
Input
Analog block power supply
Analog ground pin
AVSS
Input
Analog block ground and reference voltage
Analog output pin 0
DA0
Output
Channel 0 analog output pin
Analog output pin 1
DA1
Output
Channel 1 analog output pin
Reference voltage pin
Vref
Input
Reference voltage for analog block
16.3
Register Description
The D/A converter has the following registers. For details on the module stop control register,
refer to section 22.1.2, Module Stop Control Registers A to D (MSTPCRA to MSTPCRD).
• D/A data register 0 (DADR0)
• D/A data register 1 (DADR1)
• D/A control register (DACR)
16.3.1
D/A Data Registers 0 and 1 (DADR0 and DADR1)
DADR0 and DADR1 are 8-bit readable/writable registers that store data for D/A conversion.
When analog output is permitted, D/A data register contents are converted and output to analog
output pins.
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Section 16 D/A Converter
16.3.2
D/A Control Register (DACR)
DACR controls D/A converter operation.
Bit
Bit Name
Initial
Value
R/W
Description
7
DAOE1
0
R/W
D/A Output Enable 1
Controls D/A conversion and analog output
0: Analog output DA1 is disabled
1: D/A conversion for channel 1 and analog output DA1
are enabled
6
DAOE0
0
R/W
D/A Output Enable 0
Controls D/A conversion and analog output
0: Analog output DA0 is disabled
1: D/A conversion for channel 0 and analog output DA0
are enabled
5
DAE
0
R/W
D/A Enable
Controls D/A conversion in conjunction with the DAOE0
and DAOE1 bits. When the DAE bit is cleared to 0, D/A
conversion for channels 0 and 1 are controlled
individually. When DAE is set to 1, D/A conversion for
channels 0 and 1 are controlled as one. Conversion result
output is controlled by the DAOE0 and DAOE1 bits. For
details, see table 16.2.
4 to 0
⎯
All 1
⎯
Reserved
These bits are always read as 1 and cannot be modified.
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Section 16 D/A Converter
Table 16.2 D/A Conversion Control
Bit 5
Bit 7
Bit 6
DAE
DAOE1
DAOE0
Description
0
0
0
Disables D/A Conversion
1
Enables D/A Conversion for channel 0
0
Enables D/A Conversion for channel 1
1
Enables D/A Conversion for channels 0 and 1
0
Disables D/A Conversion
1
Enables D/A Conversion for channels 0 and 1
1
1
0
1
0
1
16.4
Operation
Two channels of the D/A converter can perform conversion individually.
When the DAOE bit in DACR is set to 1, D/A conversion is enabled and the conversion results are
output.
An example of D/A conversion of channel 0 is shown below. The operation timing is shown in
figure 16.2.
1. Write conversion data to DADR0.
2. When the DAOE0 bit in DACR is set to 1, D/A conversion starts. After the interval of tDCONV,
the conversion results are output from the analog output pin DA0. The conversion results are
output continuously until DADR0 is modified or DAOE0 bit is cleared to 0. The output value
is calculated by the following formula:
(DADR contents)/256 × Vref
3. Conversion starts immediately after DADR0 is modified. After the interval of tDCONV,
conversion results are output.
4.
When the DAOE bit is cleared to 0, analog output is disabled.
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Section 16 D/A Converter
DADR0
write cycle
DACR
write cycle
DADR0
write cycle
DACR
write cycle
φ
ADRES
Conversion data (1)
DADR0
Conversion data (2)
DAOE0
Conversion result (2)
Conversion result (1)
DA0
High impedance state
tDCONV
tDCONV
Legend:
tDCONV: D/A conversion time
Figure 16.2 D/A Converter Operation Example
16.5
16.5.1
Usage Notes
Analog Power Supply Current in Power-Down Mode
If this LSI enters a power-down mode such as software standby, watch, sub-active, sub-sleep, and
module stop modes while D/A conversion is enabled, the D/A cannot retain analog outputs within
the given D/A absolute accuracy although it retains digital values. The analog power supply
current is approximately the same as that during D/A conversion. To reduce analog power supply
current in power-down mode, clear the DAOE0, DAOE1 and DAE bits to 0 to disable D/A
outputs before entering the mode.
16.5.2
Setting for Module Stop Mode
It is possible to enable/disable the D/A converter operation using the module stop control register,
the D/A converter does not operate by the initial value of the register. The register can be accessed
by releasing the module stop mode. For more details, see section 22, Power-Down Modes.
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Section 16 D/A Converter
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Section 17 LCD Controller/Driver
Section 17 LCD Controller/Driver
The H8S/2268 has an on-chip segment type LCD control circuit, LCD driver, and power supply
circuit, enabling it to directly drive an LCD panel.
17.1
Features
Features of the LCD controller/driver are given below.
• Display capacity
Duty Cycle
Internal Driver
Static
40 SEG
1/2
40 SEG
1/3
40 SEG
1/4
40 SEG
• LCD RAM capacity
8 bits × 20 bytes (160 bits)
Byte or word access to LCD RAM
• The segment output pins can be used as ports.
H8S/2268 Group: SEG40 to SEG1 pins can be used as ports in groups of eight.
H8S/2264 Group: SEG24 to SEG1 pins can be used as ports in groups of eight.
• Common output pins not used because of the duty cycle can be used for common doublebuffering (parallel connection).
With 1/2 duty, parallel connection of COM1 to COM2, and of COM3 to COM4, can be used
In static mode, parallel connection of COM1 to COM2, COM3, and COM4 can be used
• Choice of 11 frame frequencies
• A or B waveform selectable by software
• Built-in power supply split-resistance
• Display possible in operating modes other than standby mode and module stop mode
• Display possible during low-voltage operation by built-in triple step-up voltage circuit
(supposrted only by the H8S/2268 Group)
• Module stop mode
As the initial setting, LCD operation is halted. Access to registers and LCD RAM is enabled
by clearing module stop mode.
LCDSG00B_000020030700
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Section 17 LCD Controller/Driver
Figure 17.1 shows a block diagram of the LCD controller/driver.
VCC
M
φ/16 to φ/2048*2
V1
V2
V3
VSS
CL2
Common
data latch
φSUB to φSUB/4
Internal data bus
LCD drive
power supply
(Built-in step-up
voltage circuit*1)
Common
driver
COM4
SEG40
SEG39
SEG38
SEG37
SEG36
LPCR
LCR
LCR2
Display timing generator
COM1
40-bit
shift
register
CL1
Segment
driver
LCD RAM
20 bytes
SEG1
SEGn, DO
Legend:
LPCR: LCD port control register
LCR: LCD control register
LCR2: LCD control register 2
Notes: 1. Supported only by the H8S/2268 Group.
2. The clock oscillator stops operating in subactive, subsleep, and watch mode.
Therefore, be sure to select a frequency between φSUB and φSUB/4.
Figure 17.1 Block Diagram of LCD Controller/Driver
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Section 17 LCD Controller/Driver
17.2
Input/Output Pins
Table 17.1 shows the LCD controller/driver pin configuration.
Table 17.1 Pin Configuration
Name
Abbreviation
I/O
Function
Segment output
pins
SEG40 to SEG1
Output
LCD segment drive pins
(H8S/2268 Group)
All pins are multiplexed as port pins (setting
programmable)
(H8S/2264 Group)
SEG24 to SEG1 pins are multiplexed as port
pins (setting programmable)
Common output
pins
COM4 to COM1
LCD power supply
pins
V1, V2, V3
Output
LCD common drive pins
Pins can be used in parallel with static or
1/2 duty
⎯
Used when a bypass capacitor is connected
externally, and when an external power supply
circuit is used
V3 pin is LCD input reference power supply
when triple step-up voltage circuit is used*.
Capacitance pins
for LCD step-up
voltage*
C1, C2
⎯
Capacitance pins for step-up voltage LCD
drive power supply
Note: * Supported only by the H8S/2268 Group.
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Section 17 LCD Controller/Driver
17.3
Register Descriptions
The LCD controller/driver has the following registers.
• LCD port control register (LPCR)
• LCD control register (LCR)
• LCD control register 2 (LCR2)
• LCDRAM
17.3.1
LCD Port Control Register (LPCR)
LPCR selects the duty cycle, LCD driver, and pin functions.
Bit
Bit Name
Initial
Value
R/W
Description
7
DTS1
0
R/W
Duty Cycle Select 1 and 0
6
DTS0
0
R/W
Common Function Select
5
CMX
0
R/W
The combination of DTS1 and DTS0 selects static, 1/2,
1/3, or 1/4 duty.
CMX specifies whether or not the same waveform is to be
output from multiple pins to increase the common drive
power when not all common pins are used because of the
duty setting.
4
⎯
0
⎯
Reserved
This bit is always read as 0 and should only be written
with 0.
3
SGS3
0
R/W
Segment Driver Select 3 to 0
2
SGS2
0
R/W
Bits 3 to 0 select the segment drivers to be used.
1
SGS1
0
R/W
For details, see tables 17.3 and 17.4.
0
SGS0
0
R/W
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Section 17 LCD Controller/Driver
Table 17.2 Duty Cycle and Common Function Selection
Bit 7:
DTS1
Bit 6:
DTS0
Bit 5:
CMX
Duty Cycle
Common Drivers
Notes
0
0
0
Static
COM1
COM4, COM3, and COM2 can
be used as ports (Initial value)
COM4 to COM1
COM4, COM3, and COM2 output
the same waveform as COM1
COM2 to COM1
COM4 and COM3 can be used
as ports
COM4 to COM1
COM4 outputs the same
waveform as COM3, and COM2
outputs the same waveform as
COM1
COM3 to COM1
COM4 can be used as a port*
COM4 to COM1
Do not use COM4
COM4 to COM1
⎯
1
1
0
1/2 duty
1
1
0
0
1/3 duty
1
1
X
1/4 duty
Legend:
X: Don’t care
Notes: COM4 to COM1 function as ports when the setting of SGS3 to SGS0 is 0000.
* Cannot be used as a port when the SUPS bit in LCR2 is 1 in the H8S/2268 Group. Set
the SUPS bit to 0 when using as a port.
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Section 17 LCD Controller/Driver
Table 17.3 Segment Driver Selection (1) (H8S/2268 Group)
Function of Pins SEG40 to SEG1
Bit 3: Bit 2: Bit 1: Bit 0: SEG40 to
SGS3 SGS2 SGS1 SGS0 SEG33
SEG32 to
SEG25
SEG24 to
SEG17
SEG16 to
SEG9
SEG8 to
SEG1
0
0
0
0
Port
Port
Port
Port
Port
1
SEG
Port
Port
Port
Port
0
SEG
SEG
Port
Port
Port
1
SEG
SEG
SEG
Port
Port
0
SEG
SEG
SEG
SEG
Port
1
SEG
SEG
SEG
SEG
SEG
1
X
Setting
prohibited
Setting
prohibited
Setting
prohibited
Setting
prohibited
Setting
prohibited
X
X
Setting
prohibited
Setting
prohibited
Setting
prohibited
Setting
prohibited
Setting
prohibited
1
1
1
X
0
Legend:
X: Don’t care
Note: COM4 to COM1 also function as ports when the setting of SGS3 to SGS0 is 0000.
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Section 17 LCD Controller/Driver
Table 17.4 Segment Driver Selection (2) (H8S/2264 Group)
Function of Pins SEG40 to SEG1
Bit 3:
SGS3
Bit 2:
SGS2
Bit 1:
SGS1
Bit 0:
SGS0
SEG40 to
SEG25
SEG24 to
SEG17
SEG16 to
SEG9
SEG8 to
SEG1
0
0
0
0
⎯
Port
Port
Port
1
Setting
prohibited
Setting
prohibited
Setting
prohibited
Setting
prohibited
0
SEG
Port
Port
Port
1
SEG
SEG
Port
Port
0
SEG
SEG
SEG
Port
1
SEG
SEG
SEG
SEG
1
X
Setting
prohibited
Setting
prohibited
Setting
prohibited
Setting
prohibited
X
X
Setting
prohibited
Setting
prohibited
Setting
prohibited
Setting
prohibited
1
1
1
X
0
Legend:
X: Don’t care
Note: COM4 to COM1 also function as ports when the setting of SGS3 to SGS0 is 0000.
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Section 17 LCD Controller/Driver
17.3.2
LCD Control Register (LCR)
LCR performs LCD power supply split-resistance connection control and display data control, and
selects the frame frequency.
Bit
Bit Name
Initial
Value
R/W
Description
7
⎯
1
R/W
LCD Disable Bit
This bit is always read as 1. The write value should
always be 0.
6
PSW
0
R/W
LCD Power Supply Split-Resistance Connection Control
Bit 6 can be used to disconnect the LCD power supply
split-resistance from VCC when LCD display is not required
in a power-down mode, or when an external power
supply is used. When the ACT bit is cleared to 0, and
also in standby mode, the LCD power supply splitresistance is disconnected from VCC regardless of the
setting of this bit.
0: LCD power supply split-resistance is disconnected
from VCC
1: LCD power supply split-resistance is connected to VCC
5
ACT
0
R/W
Display Function Activate
Bit 5 specifies whether or not the LCD controller/driver is
used. Clearing this bit to 0 halts operation of the LCD
controller/driver. The LCD drive power supply ladder
resistance is also turned off, regardless of the setting of
the PSW bit. However, register contents are retained.
0: LCD controller/driver operation halted
1: LCD controller/driver operation enabled
4
DISP
0
R/W
Display Data Control
Bit 4 specifies whether the LCD RAM contents are
displayed or blank data is displayed regardless of the
LCD RAM contents.
0: Blank data is displayed
1: LCD RAM data is displayed
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Section 17 LCD Controller/Driver
Bit
Bit Name
Initial
Value
R/W
Description
3
CKS3
0
R/W
Frame Frequency Select 3 to 0
2
CKS2
0
R/W
1
CKS1
0
R/W
0
CKS0
0
R/W
Bits 3 to 0 select the operating clock and the frame
frequency. In subactive mode, watch mode, and subsleep
mode, the system clock (φ) is halted, and therefore
display operations are not performed if one of the clocks
from φ/16 to φ/2048 is selected. If LCD display is required
in these modes, φSUB, φSUB/2, or φSUB/4 must be selected as
the operating clock.
For details, see table 17.5.
Note: 0 should be written to bit 7 after the other bits have been set.
Table 17.5 Frame Frequency Selection
Bit 3:
CKS3
0
1
Bit 2:
CKS2
X
0
Bit 1:
CKS1
1
Operating Clock
φ = 20 MHz
φ = 2 MHz
0
φSUB
1
φSUB/2
128 Hz*
2
64 Hz*
128 Hz*
2
64 Hz*
1
X
φ SUB/4
2
32 Hz*
2
32 Hz*
0
0
φ/16
⎯
488 Hz
1
φ/32
⎯
244 Hz
0
φ/64
⎯
122 Hz
1
φ/128
610 Hz
61 Hz
0
φ/256
305 Hz
30.5 Hz
1
φ/512
152.6 Hz
⎯
0
φ/1024
76.3 Hz
⎯
1
φ/2048
38.1 Hz
⎯
0
1
1
Frame Frequency*
Bit 0:
CKS0
0
1
2
2
Legend:
X: Don’t care
Notes: 1. When 1/3 duty is selected, the frame frequency is 4/3 times the value shown.
2. This is the frame frequency when φSUB = 32.768 kHz.
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Section 17 LCD Controller/Driver
17.3.3
LCD Control Register 2 (LCR2)
LCR2 controls switching between the A waveform and B waveform, selects clock for step-up
voltage circuit, selects power supply, and selects the duty ratio for charge/discharge pulse that
controls to separate power supply divider resistance from power supply circuit.
Bit
Bit Name
Initial
Value
R/W
Description
7
LCDAB
0
R/W
A Waveform/B Waveform Switching Control
Bit 7 specifies whether the A waveform or B waveform is
used as the LCD drive waveform.
0: Drive using A waveform
1: Drive using B waveform
6
⎯
1
⎯
Reserved
These bits are always read as 1 and cannot be modified.
5
HCKS
0
R/W
(H8S/2268 Group)
Triple Step-Up Voltage Circuit Clock Select
This bit selects a clock used for triple step-up voltage
circuit. This bit selects a clock which divides a clock
specified by the LCD operating control register (LCR) by
4 or 8 as step-up voltage circuit clock.
0: A clock, which divides a LCD operating clock by 4, is
selected as step-up voltage circuit clock
1: A clock, which divides a LCD operating clock by 8, is
selected as step-up voltage circuit clock
(H8S/2264 Group)
Reserved
0 should be written to this bit.
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Section 17 LCD Controller/Driver
Bit
Bit Name
Initial
Value
R/W
4
SUPS
0
R/W
Description
(H8S/2268 Group)
Drive Power Select
Triple Step-up Voltage Circuit Control
The triple step-up voltage circuit stops operation when
Vcc is selected as drive power. The triple step-up voltage
circuit starts operation when LCD input reference voltage
(VLCD3) is selected as drive power.
0: Drive power is Vcc, triple step-up voltage circuit halts
1: Drive power is triple step-up voltage of the LCD input
reference voltage (VLCD3), triple step-up voltage circuit
operates
(H8S/2264 Group)
Reserved
0 should be written to this bit.
3
CDS3
0
R/W
Selection of Duty Ratio for Charge/Discharge Pulse
2
CDS2
0
R/W
1
CDS1
0
R/W
0
CDS0
0
R/W
Duty ratio is selected during the power supply divider
resistance is connected to power supply circuit. When the
duty ratio of 0 is selected, the power supply divider
resistance is fixed to the state that the resistance is
separated from the power supply circuit. Therefore,
supply the power to pins V1, V2, and V3 from the external
circuit.
The charge/discharge pulses have the waveform shown
in figure 17.2. The duty ratio is represented by TC/TW.
0000: duty ratio = 1 (stack at high)
0001: duty ratio = 1/8
0010: duty ratio = 2/8
0011: duty ratio = 3/8
0100: duty ratio = 4/8
0101: duty ratio = 5/8
0110: duty ratio = 6/8
0111: duty ratio = 0 (stack at low)
10XX: duty ratio = 1/16
11XX: duty ratio = 1/32
Legend:
X: Don’t care
Rev. 5.00 Sep. 01, 2009 Page 479 of 656
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Section 17 LCD Controller/Driver
Figure 17.2 shows the waveform of the charge/discharge pulses. The duty cycle is Tc/Tw.
1 frame
Tw
COM1
Tc
Tdc
Legend:
Tc: Power supply split-resistance
connected
Tdc: Power supply split-resistance
disconnected
Charge/discharge
pulses
Figure 17.2 A Waveform 1/2 Duty 1/2 Vias
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Section 17 LCD Controller/Driver
The relationships between the LCD operating clock and step-up voltage clock, and between bits
CKS3 to CKS0 in LCD control register (LCR) and bit HCKS in LCD control register 2 (LCR2)
are shown below.
LCR
LCR2
Bit 5
Bit 3
Bit 2
Bit 1
Bit 0
CKS3
CKS2
CKS1
CKS0
0
X
0
0
0
0
X
0
1
0
HCKS*
LCD
clock
φSUB
1
X
0
0
0
0
0
0
0
1
0
1
0
1
0
0
φ/16
1
1
1
0
0
0
0
1
0
1
0
1
1
1
0
0
φ/128
488 Hz
⎯
244 Hz
⎯
122 Hz
0
610 Hz
61 Hz
φ1024
φ/256
305 Hz
φ/512
152.6 Hz
⎯
76.3 Hz
⎯
φ4096
φ/1024
φ8192
φ/2048
1
38.1 Hz
φ16384
⎯
31.3 kHz
⎯
15.6 kHz
⎯
7.81 kHz
⎯
3.91 kHz
39.1 kHz
19.5 kHz
1.95 kHz
9.77 kHz
977 kHz
30.5 Hz
φ2048
1
1
⎯
φ256
1
1
1024 Hz
φ512
1
1
φ64
φ/64
1
1
32 Hz
φ/32
1
1
2048 Hz
φ128
1
0
4096 Hz
φSUB/32
1
1
8192 Hz
64 Hz
φSUB/4
1
1
128 Hz
φSUB/16
1
1
Step-Up Voltage
Circuit clock
frequency*
φ = 20 MHz φ = 2 MHz φ = 20 MHz φ = 2 MHz
φSUB/2
1
X
φSUB/4
Frame frequency
φSUB/8
1
0
Step-up
Voltage
Circuit
clock*
⎯
4.88 kHz
⎯
2.44 kHz
⎯
1.22 kHz
⎯
⎯
Legend:
X: Don’t care
Note: * Supported only by the H8S/2268 Group.
Rev. 5.00 Sep. 01, 2009 Page 481 of 656
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Section 17 LCD Controller/Driver
17.4
Operation
17.4.1
Settings up to LCD Display
To perform LCD display, the hardware and software related items described below must first be
determined.
1. Hardware Settings
A. Using 1/2 duty
When 1/2 duty is used, interconnect pins V2 and V3 as shown in figure 17.3.
VCC
V1
V2
V3
VSS
Figure 17.3 Handling of LCD Drive Power Supply when Using 1/2 Duty
B. Large-panel display
As the impedance of the built-in power supply split-resistance is large, it may not be
suitable for driving a large panel. If the display lacks sharpness when using a large panel,
refer to section 17.4.6, Boosting the LCD Drive Power Supply. When static or 1/2 duty is
selected, the common output drive capability can be increased. Set CMX to 1 when
selecting the duty cycle. In this mode, with a static duty cycle pins COM4 to COM1 output
the same waveform, and with 1/2 duty the COM1 waveform is output from pins COM2 and
COM1, and the COM2 waveform is output from pins COM4 and COM3.
C. LCD drive power supply setting
With the H8S/2268 and 2264, there are two ways of providing LCD power: by using the
on-chip power supply circuit, or by using an external power supply circuit.
When an external power supply circuit is used for the LCD drive power supply, connect the
external power supply to the V1 pin.
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Section 17 LCD Controller/Driver
2. Software Settings
A. Duty selection
Any of four duty cycles⎯static, 1/2 duty, 1/3 duty, or 1/4 duty⎯can be selected with bits
DTS1 and DTS0.
B. Segment selection
The segment drivers to be used can be selected with bits SGS3 to SGS0.
3. Frame frequency selection
The frame frequency can be selected by setting bits CKS3 to CKS0. The frame frequency
should be selected in accordance with the LCD panel specification. For the clock selection
method in watch mode, subactive mode, and subsleep mode, see section 17.4.4, Operation in
Power-Down Modes.
A. A or B waveform selection
Either the A or B waveform can be selected as the LCD waveform to be used by means of
LCDAB.
B. LCD drive power supply selection
When an external power supply circuit is used, turn the LCD drive power supply off with
the PSW bit.
17.4.2
Relationship between LCD RAM and Display
The relationship between the LCD RAM and the display segments differs according to the duty
cycle. LCD RAM maps for the different duty cycles are shown in figures 17.4 to 17.7.
After setting the registers required for display, data is written to the part corresponding to the duty
using the same kind of instruction as for ordinary RAM, and display is started automatically when
turned on. Word- or byte-access instructions can be used for RAM setting.
Rev. 5.00 Sep. 01, 2009 Page 483 of 656
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Section 17 LCD Controller/Driver
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
H'FC40
SEG2
SEG2
SEG2
SEG2
SEG1
SEG1
SEG1
SEG1
H'FC53
SEG40
SEG40
SEG40
SEG40
SEG39
SEG39
SEG39
SEG39
COM4
COM3
COM2
COM1
COM4
COM3
COM2
COM1
Figure 17.4 LCD RAM Map (1/4 Duty)
Bit 7
Bit 6
Bit 5
Bit 4
H'FC40
SEG2
SEG2
H'FC53
SEG40
COM3
Bit 3
Bit 2
Bit 1
Bit 0
SEG2
SEG1
SEG1
SEG1
SEG40
SEG40
SEG39
SEG39
SEG39
COM2
COM1
COM3
COM2
COM1
Space not used for display
Figure 17.5 LCD RAM Map (1/3 Duty)
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Section 17 LCD Controller/Driver
H'FC40
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
SEG4
SEG4
SEG3
SEG3
SEG2
SEG2
SEG1
SEG1
Display space
H'FC49
SEG40
SEG40
SEG39
SEG39
SEG38
SEG38
SEG37
SEG37
Space not used
for display
H'FC53
COM2
COM1
COM2
COM1
COM2
COM1
COM2
COM1
Figure 17.6 LCD RAM Map (1/2 Duty)
H'FC40
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
SEG8
SEG7
SEG6
SEG5
SEG4
SEG3
SEG2
SEG1
Display space
H'FC44
SEG40
SEG39
SEG38
SEG37
SEG36
SEG35
SEG34
SEG33
Space not used
for display
H'FC53
COM1
COM1
COM1
COM1
COM1
COM1
COM1
COM1
Figure 17.7 LCD RAM Map (Static Mode)
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Section 17 LCD Controller/Driver
1 frame
1 frame
M
M
Data
Data
COM1
V1
V2
V3
VSS
COM1
V1
V2
V3
VSS
COM2
V1
V2
V3
VSS
COM2
V1
V2
V3
VSS
COM3
V1
V2
V3
VSS
COM3
V1
V2
V3
VSS
COM4
V1
V2
V3
VSS
SEGn
V1
V2
V3
VSS
SEGn
V1
V2
V3
VSS
(a) Waveform with 1/4 duty
(b) Waveform with 1/3 duty
1 frame
1 frame
M
M
Data
Data
COM1
V1
V2,V3
VSS
COM1
V1
COM2
V1
V2,V3
VSS
SEGn
SEGn
V1
V2,V3
VSS
VSS
V1
VSS
(d) Waveform with static output
(c) Waveform with 1/2 duty
Figure 17.8 Output Waveforms for Each Duty Cycle (A Waveform)
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REJ09B0071-0500
Section 17 LCD Controller/Driver
1 frame
1 frame
1 frame
1 frame
1 frame
M
M
Data
Data
1 frame
1 frame
1 frame
COM1
V1
V2
V3
VSS
COM1
V1
V2
V3
VSS
COM2
V1
V2
V3
VSS
COM2
V1
V2
V3
VSS
COM3
V1
V2
V3
VSS
COM3
V1
V2
V3
VSS
COM4
V1
V2
V3
VSS
SEGn
V1
V2
V3
VSS
SEGn
V1
V2
V3
VSS
(a) Waveform with 1/4 duty
1 frame
1 frame
1 frame
(b) Waveform with 1/3 duty
1 frame
1 frame
M
1 frame
1 frame
1 frame
M
Data
Data
COM1
COM2
V1
V2,V3
VSS
COM1
V1
V2,V3
VSS
SEGn
V1
V2,V3
VSS
SEGn
V1
VSS
V1
VSS
(d) Waveform with static output
(c) Waveform with 1/2 duty
Figure 17.9 Output Waveforms for Each Duty Cycle (B Waveform)
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Section 17 LCD Controller/Driver
Table 17.6 Output Levels
Data
0
0
1
1
M
0
1
0
1
Common output
V1
VSS
V1
VSS
Segment output
V1
VSS
VSS
V1
Common output
V2, V3
V2, V3
V1
VSS
Segment output
V1
VSS
VSS
V1
Common output
V3
V2
V1
VSS
Static
1/2 duty
1/3 duty
1/4 duty
17.4.3
Segment output
V2
V3
VSS
V1
Common output
V3
V2
V1
VSS
Segment output
V2
V3
VSS
V1
Triple Step-Up Voltage Circuit (Supported Only by the H8S/2268 Group)
The H8S/2268 Group incorporates a triple step-up voltage circuit. Triple voltage of liquid crystal
input reference voltage (VLCD3) input from V3 pin can be used for the LCD driver.
Before enabling the step-up voltage circuit, duty cycle (1/3 duty or 1/4 duty), LCD driver or I/O
pin function, and display data and frame frequency should be selected. Around 0.1-µF capacitor
should be connected between C1 and C2, and voltage specified in section 25.2.6, LCD
Characteristics should be applied to V3 pin.
After above settings, by selecting the step-up voltage circuit clock in LCD control register 2
(LCR2) and setting SUPS to 1, the triple step-up voltage circuit operates, voltage double of VLCD3
is generated for V2 pin, and voltage triple of VLCD3 is generated for V1pin.
Notes: 1. The triple step-up voltage circuit should only be used as LCD drive power of the
H8S/2268 Group. To drive large panel, power supply capacitance may be insufficient.
In this case, Vcc should be used as power supply or external power supply circuit
should be used.
2. When the triple step-up voltage circuit is used, do not specify static or 1/2 duty as duty
cycle.
3. Do not use capacitance with polarity such as electrolytic capacitor as capacitance to be
connected between C1 and C2.
Rev. 5.00 Sep. 01, 2009 Page 488 of 656
REJ09B0071-0500
Section 17 LCD Controller/Driver
C1
C
C2
V1
C
V2
C
V3
C
Note: C: 0.1 µF (typ.) (0.05 to 0.2 µF)
Figure 17.10 Connection when Triple Step-Up Voltage Circuit Used
(Supported Only by the H8S/2268 Group)
17.4.4
Operation in Power-Down Modes
In the H8S/2268 and 2264, the LCD controller/driver can be operated even in the power-down
modes. The operating state of the LCD controller/driver in the power-down modes is summarized
in table 17.7.
In subactive mode, watch mode, and subsleep mode, the system clock oscillator stops, and
therefore, unless φSUB, φSUB/2, or φSUB/4 has been selected by bits CKS3 to CKS0, the clock will not
be supplied and display will halt. Since there is a possibility that a direct current will be applied to
the LCD panel in this case, it is essential to ensure that φSUB, φSUB/2, or φSUB/4 is selected.
In the software standby mode the segment output and common output pins switch to I/O port
status. In this case if a port’s DDR or PCR bit is set to 1, a DC voltage could be applied to the
LCD panel. Therefore, DDR and PCR must never be set to 1 for ports being used for segment
output or common output.
Rev. 5.00 Sep. 01, 2009 Page 489 of 656
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Section 17 LCD Controller/Driver
Table 17.7 Power-Down Modes and Display Operation
Software Hardware Module
Mode
Clock
Reset
Active
Sleep
Watch
Subactive Subsleep
Standby
standby
Stop
φ
Runs
Runs
Runs
Stops
Stops
Stops
Stops
Stops
Stops*4
φw
Runs
Runs
Runs
Runs
Runs
Runs
Stops*
Stops
Stops*
Stops
Stops
Stops
Stops
Stops
Stops
2
Stops*
2
Stops*
Stops
Stops
Functions Functions Functions*3 Functions*3 Functions*3 Stops*2
2
Stops*
Stops
Display
ACT = 0
operation
ACT = 1
1
4
Notes: 1. The subclock oscillator does not stop, but clock supply is halted.
2. The LCD drive power supply is turned off regardless of the setting of the PSW bit.
3. Display operation is performed only if φSUB, φSUB/2, or φSUB/4 is selected as the operating
clock.
4. The clock supplied to the LCD stops.
17.4.5
Low-Power LCD Drive
The simplest way to achieve low-power operation for an LCD power supply circuit is to use an
internal division resistor. However, since the values of the internal resistors are fixed, a constant
current continually flows from Vcc to Vss of the internal resistor. Since the quantity of the current
is independent of the dissipation current of an LCD panel, power is wasted in using a low-power
LCD. This LSI incorporates a function that eliminates wastage of power. By using this function, a
power supply circuit that is most suitable for the power of a given LCD panel can be obtained.
• Principle
⎯ As shown in figure 17.11, external capacitors are connected to V1, V2, and V3 of the LCD
power supply terminals.
⎯ The capacitors connected to V1, V2, and V3 are repeatedly charged and discharged to
retain required voltage levels in the cycles shown in figure 17.11.
⎯ In this case, the charged voltages are equivalent to V1, V2, and V3, respectively. (In 1/3
bias operation, for example, the V2 voltage is two thirds of the V1 voltage and the V3
voltage is one third of the V1 voltage.)
⎯ Power is supplied to the LCD panel by the electric charges that are accumulated in these
capacitors.
⎯ The capacitances of the capacitors and the charge-discharge period are determined by the
quantity of power which the LCD panel requires.
⎯ The charge-discharge period can be determined by software.
Rev. 5.00 Sep. 01, 2009 Page 490 of 656
REJ09B0071-0500
Section 17 LCD Controller/Driver
• Example of Operation (1/3 bias operation)
⎯ During charging period Tc in figure 17.11, the voltages that are divided by the internal
division resistors are applied to the V1, V2, and V3 terminals (the V2 voltage is two thirds
of the V1 voltage and the V3 voltage is one third of the V1 voltage), and these voltages
charge external capacitors C1, C2, and C3. Even during this period, the LCD panel is
being driven.
⎯ In the subsequent discharge period Tdc, the charge operation stops. The LCD panel is now
driven by discharge of the charges accumulated in the respective capacitors.
⎯ At this point in time, the respective voltages fall slightly as the capacitors are discharged.
Attention must be paid so that the operation of the LCD panel is not affected, by selecting
the proper charging period and the capacitance of the capacitors.
⎯ The capacitors connected to the V1, V2, and V3 terminals are repeatedly charged and
discharged in the cycles shown in figure 17.11 and retain required voltages, keeping the
LCD panel in operation.
⎯ The capacitance of the capacitors and a charge-discharge period is determined by the
quantity of power in which the LCD panel requires. In addition, the charge-discharge
period can be selected by CDS3 to 0.
⎯ In actuality, the capacitance of the capacitors and the charge-discharge period must be
determined through experiment, on the basis of the power dissipation specifications of the
LCD panel. This method, however, permits the most proper current value to be selected,
compared with a case in which a DC current continually flows in the internal resistors.
Charging
period Tc
V1 potential
V1
V2 potential
C1
V2
C2
V3
C3
V3 potential
V1 × 2/3
V1 × 1/3
Discharging
period Tdc
Voltage drop
Vd1 associated with
discharging due
to LCD panel
driving
Vd2
Vd3
Power supply voltage fluctuation in 1/3 bias system
Figure 17.11 Example of Low-Power-Consumption LCD Drive Operation
Rev. 5.00 Sep. 01, 2009 Page 491 of 656
REJ09B0071-0500
Section 17 LCD Controller/Driver
17.4.6
Boosting the LCD Drive Power Supply
When a large panel is driven, the on-chip power supply capacity may be insufficient. In this case,
the power supply impedance must be reduced. This can be done by connecting bypass capacitors
of around 0.1 to 0.3 µF to pins V1 to V3, as shown in figure 17.12, or by adding a split-resistance
externally.
VCC
VR
V1
R
This LSI
R = several kΩ to
several MΩ
V2
R
C = 0.1 to 0.3 μF
V3
R
VSS
Figure 17.12 Connection of External Split-Resistance
Rev. 5.00 Sep. 01, 2009 Page 492 of 656
REJ09B0071-0500
Section 18 DTMF Generation Circuit
Section 18 DTMF Generation Circuit
The H8S/2268 Group contains a Dual-Tone Multi-Frequency generation circuit to generate DTMF
signals. It is not contained in the H8S/2264 Group.
1
2
3
A
R1 (697 Hz)
4
5
6
B
R2 (770 Hz)
7
8
9
C
R3 (852 Hz)
*
0
#
D
R4 (941 Hz)
C1 (1,209 Hz)
C2 (1,336 Hz)
C3 (1,477 Hz)
C4 (1,633 Hz)
The DTMF signal consists of two types of sine waveforms and is used to access a switch device.
The function of the DTMF signal is shown in the frequency matrix in figure 18.1. The DTMF
generation circuit produces the frequencies corresponding to the numbers and symbols in the
figure.
Figure 18.1 DTMF Frequencies
18.1
Features
• Generating DTMF frequency sine waveform from the system clock (φ)
The system clock (2.0 to 20.4 MHz, with 400-kHz steps) is divided to produce a 400-kHz
clock signal. This clock signal is then supplied to the feedback loop, comprised of a variant
program divider and sine waveform counter to generate a DTMF frequency sine waveform.
• Producing low distortion, stable sine waveforms
Sine waveforms signals are output from the high-precision resistor rudder-type D/A converter.
In addition, one cycle is divided into 32, resulting in low-distortion stable signal waveforms.
• Synthesis or single waveform output selectable
Synthesized row and column output, row output, or column output are selectable.
• Module stop mode can be set.
Figure 18.2 shows the block diagram for the DTMF generation circuit.
DTMF000B_000020020700
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Section 18 DTMF Generation Circuit
DTLR
(2.0 to 20.4 MHz,
with 400-kHz steps)
φ
400 kHz
Clock
counter
Sine waveform
counterD/A
TONED
Variant program
divider
Feed back
Internal data bus
Row
DTCR
AVCC
Column
Sine waveform
counter D/A
Variant progam
divider
Feedback
Legend:
DTLR: DTMF Load Register
DTCR: DTMF Control Register
Figure 18.2 DTMF Generation Circuit Diagram
18.2
Input/Output Pins
Table 18.1 shows the pin configuration of the DTMF generation circuit.
Table 18.1 Pin Configuration
Name
Abbreviation
Input/Output
Function
Analog power supply pin
AVcc
Input
Power supply of analog section
DTMF signal output
TONED
Output
DTMF signal output pin
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Section 18 DTMF Generation Circuit
18.3
Register Descriptions
The DTMF generation circuit contains the following resisters:
• DTMF control register (DTCR)
• DTMF load register (DTLR)
18.3.1
DTMF Control Register (DTCR)
The DTCR controls the DTMF generation circuit operation, column and row outputs, and selects
the output frequency.
Bit
Bit Name
Initial
Value
R/W
Description
7
DTEN
0
R/W
This bit controls DTMF generation
0: Halts the DTMF generation circuit.
1: Operates DTMF generation circuit.
6
—
1
—
Reserved
This bit is always read as 1 and cannot be modified.
5
CLOE
0
R/W
This bit controls Column section outputs
0: Inhibits DTMF signal output on Column section (hiimpedance)
1: Enables DTMF signal output on Column section.
4
RWOE
0
R/W
This bit controls Column section outputs
0: Inhibits DTMF signal output on Row section (hiimpedance)
1: Enables DTMF signal output on Row section.
3
CLF1
0
R/W
DTMF signal output frequency on Column section 1 and 0
2
CLF0
0
R/W
Selects Column DTMF signal frequency from C1 to C4.
00: Column DTMF signal output frequency: 1209 Hz (C1)
01: Column DTMF signal output frequency: 1336 Hz (C2)
10: Column DTMF signal output frequency: 1447 Hz (C3)
11: Column DTMF signal output frequency: 1633 Hz (C4)
1
RWF1
0
R/W
DTMF signal output frequency on Row section: 1, 0
0
RWF0
0
R/W
Selects Column DTMF signal frequency from R1 to R4.
00: Row DTMF signal output frequency: 697 Hz (R1)
01: Row DTMF signal output frequency: 770 Hz (R2)
10: Row DTMF signal output frequency: 852 Hz (R3)
11: Row DTMF signal output frequency: 941 Hz (R4)
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Section 18 DTMF Generation Circuit
18.3.2
DTMF Load Register (DTLR)
The DTLR sets the system clock division ratio for the DTMF generation circuit.
Bit
Bit Name
Initial
Value
R/W
7, 6
—
All 1
—
Description
Reserved
These bits are always read as 1 and cannot be modified.
5
DTL5
0
R/W
Main clock division ratio 5 to 0
4
DTL4
0
R/W
3
DTL3
0
R/W
2
DTL2
0
R/W
1
DTL1
0
R/W
These bits set the system clock division ratio to produce
400-kHz clock signals to be supplied to the DTMF
generation circuit. The division ratio determines the
counter value of 6b'000101 to 6b'110011(D'5 to D'51)
according to the range 2.0 to 20.4 MHz.
0
DTL0
0
R/W
000000: Setting prohibited
000001: Setting prohibited
000010: Setting prohibited
000011: Setting prohibited
000100: Setting prohibited
000101: Division ratio (5) main clock frequency (2.0 MHz)
000110: Division ratio (6) main clock frequency (2.4 MHz)
000111: Division ratio (7) main clock frequency (2.8 MHz)
:
:
110001: Division ratio (49) main clock frequency (19.6
MHz)
110010: Division ratio (50) main clock frequency (20.0
MHz)
110011: Division ratio (51) main clock frequency (20.4
MHz)
110100: Setting prohibited
:
:
111111: Setting prohibited
Note: The correct values should be set in DTL0 to DTL5. If these bit settings do not match the
system clock, correct DTMF signal output frequency cannot be obtained. Additionally,
correct operation is not guaranteed if the DTL0 to DTL5 settings are other than 5 to 51
(division ratio 5 to 51).
Rev. 5.00 Sep. 01, 2009 Page 496 of 656
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Section 18 DTMF Generation Circuit
18.4
Operation
18.4.1
Output Waveform
The DTMF generation circuit provides synthesized row and column groups output waveforms or
sine waveforms (DTCR signal) of row or column group from TONED pin. These signals are
produced in the high-precision resistor rudder-type D/A converter. The output frequency is set in
DTCR.
Figure 18.3 shows the TONED pin output equivalent circuit. Figure 18.4 shows a single output
waveform of column or row group alone. One cycle of the output waveform is divided into 32,
resulting in low-distortion stable signal waveforms.
control
AVCC
Output control
AVSS
Row
TONED
Column
Figure 18.3 TONED Pin Output Equivalent Circuit
AVCC
1 2 3 4 5 6 7 8 9 10111213141516171819202122232425 26272829 303132
AVSS
Time slot
Figure 18.4 TONED Pin Output Waveform (Row or Column Group Alone)
Table 18.2 shows DTMF generation circuit output signal and typical signal frequencies, and
frequency deviation between the two.
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Section 18 DTMF Generation Circuit
Table 18.2 Frequency Deviation between DTMF Output Signals and Typical Signals
Symbol
Typical Signal (Hz)
DTMF Signal Output (Hz)
Frequency Deviation (%)
R1
697
694.44
−0.37
R2
770
769.23
−0.10
R3
852
851.06
−0.11
R4
941
938.97
−0.22
C1
1209
1212.12
0.26
C2
1336
1333.33
−0.20
C3
1477
1481.48
0.30
C4
1633
1639.34
0.39
18.4.2
Operation Flow
The operating procedure for the DTMF generation circuit is as follows:
1. Set the system clock division ratio for the DTLR based on the frequency of the connected
system clock. (2.0 to 20.4 MHz, with 400-kHz steps)
2. Set the frequencies of the Row (R1 to R4) and Column (C1 to C4) sections based on CLF0,
CLF1, RWF0 and RWF1 of the DTCR.
3. Select the outputs of the Row and Column based on CLOE and RWOE of the DTCR, and set
DTEN to 1 to operate the DTMF generation circuit.
With the above setting, the set DTMF signal is output from the TONED pin.
Rev. 5.00 Sep. 01, 2009 Page 498 of 656
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Section 18 DTMF Generation Circuit
18.5
Application Circuit Example
An application example of the DTMF generation circuit is shown in figure 18.5.
24 kΩ
19
TONED
DTMF
2 kΩ
HA16808ANT
LSI
20
AVCC
100 kΩ
360 kΩ
Pxx
Vref1
+0.47 μF
11
MUTE
2SC458
Note: The numeric values on the right end of the signal lines indicate the HA16808ANT pin numbers.
Figure 18.5 Example of HA16808ANT Connection
18.6
Usage Notes
1. Setting the module stop mode
It is possible to enable/disable the DTMF operation using the module stop control register. The
DTMF does not operate by the initial value of the register. The register can be accessed by
releasing the module stop mode. For more details, see section 22, Power-Down Modes.
2. DTLR setting and system clock
When using the DTMF generation circuit, note the following: The DTLR must be set so as to
accommodate the system clock. If the DTLR setting does not match the system clock, correct
DTMF signal output frequency cannot be obtained.
3. Relationship between AVcc, AVss and Vcc, Vss
Set AVss = Vss as the relationship between AVcc, AVss and Vcc, Vss. If the DTMF
generation circuit is not used, the AVcc and AVss pins must not be left open.
Note: If the conditions above are not met, the reliability of the device may be adversely affected.
Rev. 5.00 Sep. 01, 2009 Page 499 of 656
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Section 18 DTMF Generation Circuit
Rev. 5.00 Sep. 01, 2009 Page 500 of 656
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Section 19 RAM
Section 19 RAM
The H8S/2268 Group and the H8S/2264 Group have on-chip high-speed static RAM. The RAM is
connected to the CPU by a 16-bit data bus, enabling one-state access by the CPU to both byte data
and word data.
Product Classification
Flash memory
version
Masked ROM
version
RAM Size
RAM Address
H8S/2268F
16 kbytes
H'FFB000 to H'FFEFBF,
H'FFFFC0 to H'FFFFFF
H8S/2266F
8 kbytes
H'FFD000 to H'FFEFBF,
H'FFFFC0 to H'FFFFFF
H8S/2265F
4 kbytes
H'FFE000 to H'FFEFBF,
H'FFFFC0 to H'FFFFFF
H8S/2264
4 kbytes
H'FFE000 to H'FFEFBF,
H'FFFFC0 to H'FFFFFF
H8S/2262
2 kbytes
H'FFE800 to H'FFEFBF,
H'FFFFC0 to H'FFFFFF
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Section 19 RAM
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Section 20 ROM
Section 20 ROM
The features of the flash memory are summarized below.
The block diagram of the flash memory is shown in figure 20.1.
20.1
Features
• Size
Product Type
ROM Size
ROM Address
H8S/2268F
256 kbytes
H'000000 to H'03FFFF
H8S/2266F
128 kbytes
H'000000 to H'01FFFF
H8S/2265F
128 kbytes
H'000000 to H'01FFFF
• Programming/erase methods
The flash memory is programmed 128 bytes at a time. Erase is performed in single-block units.
The flash memory of the H8S/2268 is configured as follows: 64 kbytes × 3 blocks, 32 kbytes ×
1 block, and 4 kbytes × 8 blocks. The flash memory of the H8S/2266 and H8S/2265 is
configured as follows: 64 kbytes × 1 block, 32 kbytes × 1 block, and 4 kbytes × 8 blocks. To
erase the entire flash memory, each block must be erased in turn.
• Reprogramming capability
The flash memory can be reprogrammed for 100 times.
• Two programming modes
Boot mode
User program mode
On-board programming/erasing can be done in boot mode, in which the boot program built
into the chip is started to erase or program of the entire flash memory. In normal user program
mode, individual blocks can be erased or programmed.
• Automatic bit rate adjustment
For data transfer in boot mode, this LSI's bit rate can be automatically adjusted to match the
transfer bit rate of the host.
• Programming/erasing protection
There are three protect modes, hardware, software, and error protect, which allow protected
status to be designated for flash memory program/erase operations.
ROMF253B_000020030700
Rev. 5.00 Sep. 01, 2009 Page 503 of 656
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Section 20 ROM
• Programmer mode
Flash memory can be programmed/erased in programmer mode using a PROM programmer,
as well as in on-board programming mode.
• Emulation function for flash memory in RAM
The real-time emulation for programming of flash memory is possible by overlapping the flash
memory to a part of RAM.
Internal address bus
Module bus
Internal data bus (16 bits)
FLMCR1
FLMCR2
EBR1
Bus interface/controller
Operating
mode
FWE pin
Mode pin
EBR2
RAMER
FLPWCR
Flash memory
Legend:
FLMCR1:
FLMCR2:
EBR1:
EBR2:
RAMER:
FLPWCR:
Flash memory control register 1
Flash memory control register 2
Erase block register 1
Erase block register 2
RAM emulation register
Flash memory power control register
Figure 20.1 Block Diagram of Flash Memory
20.2
Mode Transitions
When the mode pins and the FWE pin are set in the reset state and a reset-start is executed, this
LSI enters an operating mode as shown in figure 20.2. In user mode, flash memory can be read but
not programmed or erased.
The boot, user program and programmer modes are provided as modes to write and erase the flash
memory.
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Section 20 ROM
The differences between boot mode and user program mode are shown in table 20.1.
Figure 20.3 shows the operation flow for boot mode and figure 20.4 shows that for user program
mode.
MD1 = 1,
MD2 = 1,
FWE = 0*1
Reset state
RES = 0
RES = 0
User mode
MD1 = 1,
MD2 = 1,
FWE = 1
FWE = 1
RES = 0
FWE = 0
User
program mode
*2
MD1 = 0
MD2 = 1,
FWE = 1
RES = 0
Programmer
mode
*1
Boot mode
On-board programming mode
Notes: Only make a transition between user mode and user program mode when the CPU is
not accessing the flash memory.
1. RAM emulation possible
2. MD1 = 0, MD2 = 0, P14 = 0, P16 = 0, P70 = 1
Figure 20.2 Flash Memory State Transitions
Table 20.1 Differences between Boot Mode and User Program Mode
Boot Mode
User Program Mode
Total erase
Yes
Yes
Block erase
No
Yes
Programming control program*
Program/program-verify
Program/program-verify/erase/
erase-verify/emulation
Note: * To be provided by the user, in accordance with the recommended algorithm.
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Section 20 ROM
1. Initial state
The old program version or data remains written
in the flash memory. The user should prepare the
programming control program and new
application program beforehand in the host.
2. Programming control program transfer
When boot mode is entered, the boot program in
this LSI (originally incorporated in the chip) is
started and the programming control program in
the host is transferred to RAM via SCI
communication. The boot program required for
flash memory erasing is automatically transferred
to the RAM boot program area.
Host
Host
Programming control
program
New application
program
New application
program
This LSI
This LSI
SCI
Boot program
Flash memory
SCI
Boot program
Flash memory
RAM
RAM
Boot program area
Application program
(old version)
Application program
(old version)
3. Flash memory initialization
The erase program in the boot program area (in
RAM) is executed, and the flash memory is
initialized (to H'FF). In boot mode, total flash
memory erasure is performed, without regard to
blocks.
Programming control
program
4. Writing new application program
The programming control program transferred
from the host to RAM is executed, and the new
application program in the host is written into the
flash memory.
Host
Host
New application
program
This LSI
This LSI
SCI
Boot program
Flash memory
Flash memory
RAM
Boot program area
Flash memory
preprogramming
erase
Programming control
program
SCI
Boot program
RAM
Boot program area
New application
program
Programming control
program
Program execution state
Figure 20.3 Boot Mode
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Section 20 ROM
1. Initial state
The FWE assessment program that confirms that
user program mode has been entered, and the
program that will transfer the programming/erase
control program from flash memory to on-chip
RAM should be written into the flash memory by
the user beforehand. The programming/erase
control program should be prepared in the host
or in the flash memory.
2. Programming/erase control program transfer
When user program mode is entered, user
software confirms this fact, executes transfer
program in the flash memory, and transfers the
programming/erase control program to RAM.
Host
Host
Programming/
erase control program
New application
program
New application
program
This LSI
This LSI
SCI
Boot program
Flash memory
RAM
SCI
Boot program
RAM
Flash memory
FWE assessment
program
FWE assessment
program
Transfer program
Transfer program
Programming/
erase control program
Application program
(old version)
Application program
(old version)
3. Flash memory initialization
The programming/erase program in RAM is
executed, and the flash memory is initialized (to
H'FF). Erasing can be performed in block units,
but not in byte units.
4. Writing new application program
Next, the new application program in the host is
written into the erased flash memory blocks. Do
not write to unerased blocks.
Host
Host
New application
program
This LSI
This LSI
SCI
Boot program
Flash memory
RAM
FWE assessment
program
RAM
Flash memory
FWE assessment
program
Transfer program
Transfer program
Programming/
erase control program
Flash memory
erase
SCI
Boot program
Programming/
erase control program
New application
program
Program execution state
Figure 20.4 User Program Mode (Example)
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Section 20 ROM
20.3
Block Configuration
Figure 20.5 shows the block configuration of 256-kbyte flash memory of the H8S/2268. Figure
20.6 shows the block configuration of 128-kbyte flash memory of the H8S/2266 and H8S/2265.
The thick lines indicate erasing units, the narrow lines indicate programming units, and the values
are addresses. The flash memory of the H8S/2268 is divided into 4 kbytes (8 blocks), 32 kbytes (1
block), and 64 kbytes (3 blocks). The flash memory of the H8S/2266 and H8S/2265 is divided into
4 kbytes (8 blocks), 32 kbytes (1 block), and 64 kbytes (1 block). Erasing is performed in these
units. Programming is performed in 128-byte units starting from an address with lower eight bits
H'00 or H'80.
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Section 20 ROM
EB0
Erase unit
4 kbytes
H'000000
H'000001
H'000002
Programming unit: 128 bytes
EB1
Erase unit
4 kbytes
H'001000
H'001001
H'001002
Programming unit: 128 bytes
EB2
Erase unit
4 kbytes
H'002000
H'002001
H'002002
Programming unit: 128 bytes
EB3
Erase unit
4 kbytes
H'003000
H'003001
H'003002
Programming unit: 128 bytes
EB4
Erase unit
4 kbytes
H'004000
H'004001
H'004002
Programming unit: 128 bytes
EB5
Erase unit
4 kbytes
H'005000
H'005001
H'005002
Programming unit: 128 bytes
EB6
Erase unit
4 kbytes
H'006000
H'006001
H'006002
Programming unit: 128 bytes
EB7
Erase unit
4 kbytes
H'007000
H'007001
H'007002
Programming unit: 128 bytes
EB8
Erase unit
32 kbytes
H'008000
H'008001
H'008002
Programming unit: 128 bytes
EB9
Erase unit
64 kbytes
H'010000
H'010001
H'010002
Programming unit: 128 bytes
H'01007F
EB10
Erase unit
64 kbytes
H'020000
H'020001
H'020002
Programming unit: 128 bytes
H'02007F
EB11
Erase unit
64 kbytes
H'030000
H'030001
H'030002
Programming unit: 128 bytes
H'00007F
H'000FFF
H'00107F
H'001FFF
H'00207F
H'002FFF
H'00307F
H'003FFF
H'00407F
H'004FFF
H'00507F
H'005FFF
H'00607F
H'006FFF
H'00707F
H'007FFF
H'00807F
H'00FFFF
H'01FFFF
H'02FFFF
H'03007F
H'03FFFF
Figure 20.5 Flash Memory Block Configuration (H8S/2268)
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Section 20 ROM
EB0
Erase unit
4 kbytes
H'000000
H'000001
H'000002
Programming unit: 128 bytes
EB1
Erase unit
4 kbytes
H'001000
H'001001
H'001002
Programming unit: 128 bytes
EB2
Erase unit
4 kbytes
H'002000
H'002001
H'002002
Programming unit: 128 bytes
EB3
Erase unit
4 kbytes
H'003000
H'003001
H'003002
Programming unit: 128 bytes
EB4
Erase unit
4 kbytes
H'004000
H'004001
H'004002
Programming unit: 128 bytes
EB5
Erase unit
4 kbytes
H'005000
H'005001
H'005002
Programming unit: 128 bytes
EB6
Erase unit
4 kbytes
H'006000
H'006001
H'006002
Programming unit: 128 bytes
EB7
Erase unit
4 kbytes
H'007000
H'007001
H'007002
Programming unit: 128 bytes
EB8
Erase unit
32 kbytes
H'008000
H'008001
H'008002
Programming unit: 128 bytes
EB9
Erase unit
64 kbytes
H'010000
H'010001
H'010002
Programming unit: 128 bytes
H'00007F
H'000FFF
H'00107F
H'001FFF
H'00207F
H'002FFF
H'00307F
H'003FFF
H'00407F
H'004FFF
H'00507F
H'005FFF
H'00607F
H'006FFF
H'00707F
H'007FFF
H'00807F
H'00FFFF
H'01007F
H'01FFFF
Figure 20.6 Flash Memory Block Configuration (H8S/2266 and H8S/2265)
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Section 20 ROM
20.4
Input/Output Pins
The flash memory is controlled by means of the pins shown in table 20.2.
Table 20.2 Pin Configuration
Pin Name
I/O
Function
RES
Input
Reset
FWE
Input
Flash program/erase protection by hardware
MD2
Input
Sets this LSI’s operating mode
MD1
Input
Sets this LSI’s operating mode
P70
Input
Sets MCU operating mode in programmer mode
P16
Input
Sets MCU operating mode in programmer mode
P14
Input
Sets MCU operating mode in programmer mode
TxD0
Output
Serial transmit data output
RxD0
Input
Serial receive data input
20.5
Register Descriptions
The flash memory has the following registers.
• Flash memory control register 1 (FLMCR1)
• Flash memory control register 2 (FLMCR2)
• Erase block register 1 (EBR1)
• Erase block register 2 (EBR2)
• RAM emulation register (RAMER)
• Flash memory power control register (FLPWCR)
• Serial control register X (SCRX)
The registers described above are not present in the masked ROM version. If a register described
above is read in the masked ROM version, an undefined value will be returned.
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Section 20 ROM
20.5.1
Flash Memory Control Register 1 (FLMCR1)
FLMCR1 is a register that makes the flash memory change to program mode, program-verify
mode, erase mode, or erase-verify mode. For details on register setting, refer to section 20.8, Flash
Memory Programming/Erasing.
Bit
Bit Name
Initial
Value
R/W
Description
7
FWE
⎯
R
Flash Write Enable Bit
Reflects the input level at the FWE pin. It is cleared to 0
when a low level is input to the FWE pin, and set to 1
when a high level is input. When this bit is cleared to 0,
the flash memory changes to hardware protect mode.
6
SWE1
0
R/W
Software Write Enable Bit
When this bit is set to 1, flash memory
programming/erasing is enabled. When this bit is cleared
to 0, bits 5 to 0 in FLMCR1 register and all EBR1 and
EBR2 bits cannot be set.
[Setting condition]
When FWE = 1.
5
ESU1
0
R/W
Erase Setup Bit
When this bit is set to 1, the flash memory changes to the
erase setup state. When it is cleared to 0, the erase setup
state is cancelled. Set this bit to 1 before setting the E1
bit in FLMCR1.
[Setting condition]
When FWE = 1 and SWE1 = 1
4
PSU1
0
R/W
Program Setup Bit
When this bit is set to 1, the flash memory changes to the
program setup state. When it is cleared to 0, the program
setup state is cancelled. Set this bit to 1 before setting the
P1 bit in FLMCR1.
[Setting condition]
When FWE = 1 and SWE1 = 1
3
EV1
0
R/W
Erase-Verify
When this bit is set to 1, the flash memory changes to
erase-verify mode. When it is cleared to 0, erase-verify
mode is cancelled.
[Setting condition]
When FWE = 1 and SWE1 = 1
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Section 20 ROM
Bit
Bit Name
Initial
Value
R/W
2
PV1
0
R/W
Description
Program-Verify
When this bit is set to 1, the flash memory changes to
program-verify mode. When it is cleared to 0, programverify mode is cancelled.
[Setting condition]
When FWE = 1 and SWE1 = 1
1
E1
0
R/W
Erase
When this bit is set to 1, and while the SWE1 and ESU1
bits are 1, the flash memory changes to erase mode.
When it is cleared to 0, erase mode is cancelled.
[Setting condition]
When FWE = 1, SWE1 = 1, and ESU1 = 1
0
P1
0
R/W
Program
When this bit is set to 1, and while the SWE1 and PSU1
bits are 1, the flash memory changes to program mode.
When it is cleared to 0, program mode is cancelled.
When FWE = 1, SWE1 = 1, and PSU1 = 1
20.5.2
Flash Memory Control Register 2 (FLMCR2)
FLMCR2 is a register that displays the state of flash memory programming/erasing. FLMCR2 is a
read-only register, and should not be written to.
Bit
Bit Name
Initial
Value
R/W
Description
7
FLER
0
R
Indicates that an error has occurred during an operation
on flash memory (programming or erasing). When FLER
is set to 1, flash memory goes to the error-protection
state.
See section 20.9.3, Error Protection, for details.
6 to 0
⎯
All 0
R
Reserved
These bits are always read as 0.
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Section 20 ROM
20.5.3
Erase Block Register 1 (EBR1)
EBR1 specifies the flash memory erase area block. EBR1 is initialized to H'00 when the SWE1 bit
in FLMCR1 is 0. Do not set more than one bit at a time, as this will cause all the bits in EBR1 and
EBR2 to be automatically cleared to 0.
Bit
Bit Name
Initial
Value
R/W
Description
7
EB7
0
R/W
When this bit is set to 1, 4 kbytes of EB7 (H'007000 to
H'007FFF) will be erased.
6
EB6
0
R/W
When this bit is set to 1, 4 kbytes of EB6 (H'006000 to
H'006FFF) will be erased.
5
EB5
0
R/W
When this bit is set to 1, 4 kbytes of EB5 (H'005000 to
H'005FFF) will be erased.
4
EB4
0
R/W
When this bit is set to 1, 4 kbytes of EB4 (H'004000 to
H'004FFF) will be erased.
3
EB3
0
R/W
When this bit is set to 1, 4 kbytes of EB3 (H'003000 to
H'003FFF) will be erased.
2
EB2
0
R/W
When this bit is set to 1, 4 kbytes of EB2 (H'002000 to
H'002FFF) will be erased.
1
EB1
0
R/W
When this bit is set to 1, 4 kbytes of EB1 (H'001000 to
H'001FFF) will be erased.
0
EB0
0
R/W
When this bit is set to 1, 4 kbytes of EB0 (H'000000 to
H'000FFF) will be erased.
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Section 20 ROM
20.5.4
Erase Block Register 2 (EBR2)
EBR2 specifies the flash memory erase area block. EBR2 is initialized to H'00 when the SWE1 bit
in FLMCR1 is 0. Do not set more than one bit at a time, as this will cause all the bits in EBR1 and
EBR2 to be automatically cleared to 0.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 4
⎯
All 0
R/W
Reserved
These bits are always read as 0. Only 0 should be written
to these bits.
3
EB11*
0
R/W
When this bit is set to 1, 64 kbytes of EB11 (H'030000 to
H'03FFFF) will be erased.
2
EB10*
0
R/W
When this bit is set to 1, 64 kbytes of EB10 (H'020000 to
H'02FFFF) will be erased.
1
EB9
0
R/W
When this bit is set to 1, 64 kbytes of EB9 (H'010000 to
H'01FFFF) will be erased.
0
EB8
0
R/W
When this bit is set to 1, 32 kbytes of EB8 (H'008000 to
H'00FFFF) will be erased.
Note: * These bits are reserved bits in the H8S/2266 and H8S/2265. Only 0 should be written to
these bits.
20.5.5
RAM Emulation Register (RAMER)
RAMER specifies the area of flash memory to be overlapped with part of RAM when emulating
real-time flash memory programming. RAMER settings should be made in user mode or user
program mode. To ensure correct operation of the emulation function, the ROM for which RAM
emulation is performed should not be accessed immediately after this register has been modified.
Normal execution of an access immediately after register modification is not guaranteed.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 5
⎯
All 0
R
Reserved
These bits are always read as 0.
4
⎯
0
R/W
Reserved
Only 0 should be written to this bit.
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Section 20 ROM
Bit
Bit Name
Initial
Value
R/W
Description
3
RAMS
0
R/W
RAM Select
Specifies selection or non-selection of flash memory
emulation in RAM. When RAMS = 1, the flash memory is
overlapped with part of RAM, and all flash memory block
are program/erase-protected.
2
RAM2
0
R/W
Flash Memory Area Selection
1
RAM1
0
R/W
0
RAM0
0
R/W
When the RAMS bit is set to 1, one of the following flash
memory areas is selected to overlap the RAM area. The
areas correspond with 4-kbyte erase blocks.
000: H'000000 to H'000FFF (EB0)
001: H'001000 to H'001FFF (EB1)
010: H'002000 to H'002FFF (EB2)
011: H'003000 to H'003FFF (EB3)
100: H'004000 to H'004FFF (EB4)
101: H'005000 to H'005FFF (EB5)
110: H'006000 to H'006FFF (EB6)
111: H'007000 to H'007FFF (EB7)
20.5.6
Flash Memory Power Control Register (FLPWCR)
FLPWCR enables/disables transition to power-down modes for the flash memory when this LSI
enters sub-active mode.
Bit
Bit Name
Initial
Value
R/W
Description
7
PDWND
0
R/W
Power Down Disable
Enables/disables transition to power-down modes for the
flash memory when this LSI enters sub-active mode.
0: Transition to power-down modes for the flash memory
enabled.
1: Transition to power-down modes for the flash memory
disabled.
6 to 0
⎯
All 0
R
Reserved
These bits are always read as 0.
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Section 20 ROM
20.5.7
Serial Control Register X (SCRX)
SCRX performs register access control.
Bit
Bit Name
Initial
Value
R/W
7
⎯
0
R/W
Description
Reserved
Only 0 should be written to this bit.
2
6
IICX1
0
R/W
I C Transfer Select 1, 0
5
IICX0
0
R/W
For details, see section 14.3.5, Serial Control Register X
(SCRX).
4
IICE
0
R/W
I C Master Enable
2
For details, see section 14.3.5, Serial Control Register X
(SCRX).
3
FLSHE
0
R/W
Flash Memory Control Register Enable
Controls for the CPU accessing to the control registers
(FLMCR1, FLMCR2, EBR1, EBR2) of the flash memory.
When this bit is set to 1, the flash memory control
registers can be read/written to. When this bit is cleared
to 0, the flash memory control registers are not selected.
At this time, the contents of the flash memory control
registers are retained.
0: Area at H'FFFFA8 to H'FFFFAC not selected for the
flash memory control registers.
1: Area at H'FFFFA8 to H'FFFFAC selected for the flash
memory control registers.
2 to 0
⎯
All 0
R/W
Reserved
Only 0 should be written to these bits.
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Section 20 ROM
20.6
On-Board Programming Modes
When pins are set to on-board programming mode, program/erase/verify operations can be
performed on the on-chip flash memory. There are two on-board programming modes: boot mode
and user program mode. The pin settings for transition to each of these modes are shown in table
20.3. For a diagram of the transitions to the various flash memory modes, see figure 20.2.
Table 20.3 Setting On-Board Programming Modes
FWE
MD2
MD1
Mode Setting
1
1
0
Boot Mode
1
1
1
User program mode
0
1
1
User mode
20.6.1
Boot Mode
Table 20.4 shows the boot mode operations between reset end and branching to the programming
control program.
1. When boot mode is used, the flash memory programming control program must be prepared in
the host beforehand. Prepare a programming control program in accordance with the
description in section 20.8, Flash Memory Programming/Erasing.
In boot mode, if any data has been programmed into the flash memory (if all data is not 1), all
flash memory blocks are erased. Boot mode is for use when user program mode is unavailable,
such as the first time on-board programming is performed, or if the program activated in user
program mode is accidentally erased.
2. SCI_0 should be set to asynchronous mode, and the transfer format as follows: 8-bit data, 1
stop bit, and no parity.
3. When the boot program is initiated, the chip measures the low-level period of asynchronous
SCI communication data (H'00) transmitted continuously from the host. The chip then
calculates the bit rate of transmission from the host, and adjusts the SCI_0 bit rate to match
that of the host. The reset should end with the RxD pin high. The RxD and TxD pins should be
pulled up on the board if necessary. After the reset is complete, it takes approximately 100
states before the chip is ready to measure the low-level period.
4. After matching the bit rates, the chip transmits one H'00 byte to the host to indicate the
completion of bit rate adjustment. The host should confirm that this adjustment end indication
(H'00) has been received normally, and transmit one H'55 byte to the chip. If reception could
not be performed normally, initiate boot mode again by a reset. Depending on the host's
transfer bit rate and system clock frequency of this LSI, there will be a discrepancy between
Rev. 5.00 Sep. 01, 2009 Page 518 of 656
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Section 20 ROM
the bit rates of the host and the chip. To operate the SCI properly, set the host's transfer bit rate
and system clock frequency of this LSI within the ranges listed in table 20.5.
5. In boot mode, a part of the on-chip RAM area is used by the boot program. The area
H'FFC000 to H'FFDFFF is the area to which the programming control program is transferred
from the host. In the H8S/2266 and H8S/2265, the RAM in this area is enabled only in boot
mode. The boot program area cannot be used until the execution state in boot mode switches to
the programming control program.
6. Before branching to the programming control program, the chip terminates transfer operations
by SCI_0 (by clearing the RE and TE bits in SCR to 0), however the adjusted bit rate value
remains set in BRR. Therefore, the programming control program can still use it for transfer of
write data or verify data with the host. The TxD pin is high. The contents of the CPU general
registers are undefined immediately after branching to the programming control program.
These registers must be initialized at the beginning of the programming control program, as the
stack pointer (SP), in particular, is used implicitly in subroutine calls, etc.
7. Boot mode can be cleared by driving the reset pin low, waiting at least 20 states, then setting
the FWE pin and mode pins, and executing reset release*. Boot mode is also cleared when a
WDT overflow occurs.
8. All interrupts are disabled during programming or erasing of the flash memory.
Note: * The input signals on the FWE and mode pins must satisfy the mode programming setup
time (tMDS = 200 ns) at the reset release timing.
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Section 20 ROM
Table 20.4 Boot Mode Operation
Host Operation
Item
Boot mode
start
LSI Operation
Processing Contents
Communications Contents
Processing Contents
Branches to boot program at reset-start.
Boot program initiation
Bit rate
adjustment
Continuously transmits data H'00 at
specified bit rate.
Transmits data H'55 when data H'00
is received error-free.
H'00, H'00 ...... H'00
· Measures low-level period of receive data
H'00.
· Calculates bit rate and sets it in BRR of
SCI_0.
· Transmits data H'00 to host as adjustment
end indication.
H'00
H'55
H'AA
Transmits data H'AA to host when data
H'55 is received.
Receives data H'AA.
Transfer of
programming
control
program
Transmits number of bytes (N) of
programming control program to be
transferred as 2-byte data (low-order
byte following high-order byte)
Transmits 1-byte of programming
control program (repeated for
N times)
High-order byte and
low-order byte
Echobacks the 2-byte data received.
Echoback
H'XX
Echoback
Flash memory
erase
Boot program
erase error
Receives data H'AA.
Execution of
programming
control program
H'FF
H'AA
Echobacks received data to host and also
transfers it to RAM (repeated for N times)
Checks flash memory data, erases all
flash memory blocks in case of written
data existing, and transmits data H'AA to
host. (If erase could not be done,
transmits data H'FF to host and aborts
operation.)
Branches to programming control program
transferred to on-chip RAM and starts
execution.
Table 20.5 System Clock Frequencies for which Automatic Adjustment of LSI Bit Rate Is
Possible
Host Bit Rate
System Clock Frequency Range of this LSI
19,200 bps
8 to 20.5 MHz
9,600 bps
4 to 20.5 MHz
4,800 bps
2 to 20.5 MHz
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Section 20 ROM
20.6.2
Programming/Erasing in User Program Mode
On-board programming/erasing of an individual flash memory block can also be performed in user
program mode by branching to a user program/erase control program. The user must prepare onboard means for controlling FWE, on-board means of supplying programming data, and branching
conditions. The flash memory must contain the user program/erase control program or a program
that provides the user program/erase control program from external memory. As the flash memory
itself cannot be read during programming/erasing, transfer the user program/erase control program
to on-chip RAM, as in boot mode. Figure 20.7 shows a sample procedure for
programming/erasing in user program mode. Prepare a user program/erase control program in
accordance with the description in section 20.8, Flash Memory Programming/Erasing.
Reset-start
No
Program/erase?
Yes
Transfer user program/erase control
program to RAM
Branch to flash memory application
program
Branch to user program/erase control
program in RAM
Execute user program/erase control
program (flash memory rewrite)
Branch to flash memory application
program
Figure 20.7 Programming/Erasing Flowchart Example in User Program Mode
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Section 20 ROM
20.7
Flash Memory Emulation in RAM
A setting in the RAM emulation register (RAMER) enables part of RAM to be overlapped onto
the flash memory area so that data to be written to flash memory can be emulated in RAM in real
time. Emulation can be performed in user mode or user program mode. Figure 20.8 shows an
example of emulation of real-time flash memory programming.
1. Set RAMER to overlap part of RAM onto the area for which real-time programming is
required.
2. Emulation is performed using the overlapping RAM.
3. After the program data has been confirmed, the RAMS bit is cleared, thus releasing the RAM
overlap.
4. The data written in the overlapping RAM is written into the flash memory space.
Start of emulation program
Set RAMER
Write tuning data to overlap
RAM
Execute application program
No
Tuning OK?
Yes
Clear RAMER
Write to flash memory
emulation block
End of emulation program
Figure 20.8 Flowchart for Flash Memory Emulation in RAM
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Section 20 ROM
An example in which flash memory block area EB0 is overlapped is shown in figure 20.9.
1. The RAM area to be overlapped is fixed at a 4-kbyte area in the range H'FFD000 to
H'FFDFFF. In the H8S/2265, the RAM in this area is enabled only in RAM emulation mode.
2. The flash memory area to be overlapped is selected by RAMER from a 4-kbyte area of the
EB0 to EB7 blocks.
3. The overlapped RAM area can be accessed from both the flash memory addresses and RAM
addresses.
4. When the RAMS bit in RAMER is set to 1, program/erase protection is enabled for all flash
memory blocks (emulation protection). In this state, setting the P1 or E1 bit in FLMCR1 to 1
does not cause a transition to program mode or erase mode.
5. A RAM area cannot be erased by execution of software in accordance with the erase
algorithm.
6. Block area EB0 contains the vector table. When performing RAM emulation, the vector table
is needed in the overlap RAM.
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Section 20 ROM
H'000000
Flash memory
(EB0)
Flash memory
(EB0)
(EB1)
On-chip RAM
(Shadow of
H'FFD000 to
H'FFDFFF)
(EB2)
Flash memory
(EB2)
(EB3)
(EB3)
On-chip RAM
(4 kbytes)
On-chip RAM
(4 kbytes)
Normal memory map
RAM overlap memory map
H'001000
H'002000
H'003000
H'FFD000
H'FFDFFF
Figure 20.9 Example of RAM Overlap Operation
20.8
Flash Memory Programming/Erasing
A software method using the CPU is employed to program and erase flash memory in the onboard programming modes. Depending on the FLMCR1 setting, the flash memory operates in one
of the following four modes: Program mode, program-verify mode, erase mode, and erase-verify
mode. The programming control program in boot mode and the user program/erase control
program in user program mode use these operating modes in combination to perform
programming/erasing. Flash memory programming and erasing should be performed in
accordance with the descriptions in section 20.8.1, Program/Program-Verify and section 20.8.2,
Erase/Erase-Verify, respectively.
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Section 20 ROM
20.8.1
Program/Program-Verify
When writing data or programs to the flash memory, the program/program-verify flowchart shown
in figure 20.10 should be followed. Performing programming operations according to this
flowchart will enable data or programs to be written to the flash memory without subjecting the
chip to voltage stress or sacrificing program data reliability.
1. Programming must be done to an empty address. Do not reprogram an address to which
programming has already been performed.
2. Programming should be carried out 128 bytes at a time. A 128-byte data transfer must be
performed even if writing fewer than 128 bytes. In this case, H'FF data must be written to the
extra addresses.
3. Prepare the following data storage areas in RAM: A 128-byte programming data area, a 128byte reprogramming data area, and a 128-byte additional-programming data area. Perform
reprogramming data computation and additional programming data computation according to
figure 20.10.
4. Consecutively transfer 128 bytes of data in byte units from the reprogramming data area or
additional-programming data area to the flash memory. The program address and 128-byte
data are latched in the flash memory. The lower 8 bits of the start address in the flash memory
destination area must be H'00 or H'80.
5. The time during which the P1 bit is set to 1 is the programming time. Figure 20.10 shows the
allowable programming times.
6. The watchdog timer (WDT) is set to prevent overprogramming due to program runaway, etc.
Set a value greater than (tspsu + tsp200 + tcp + tcpsu) µs as the WDT overflow period.
7. For a dummy write to a verify address, write 1-byte data H'FF to an address whose lower 1 bit
is B'0. Verify data can be read in words from the address to which a dummy write was
performed.
8. The maximum number of repetitions of the program/program-verify sequence of the same bit
is (N).
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Section 20 ROM
Start of programming
Write pulse application subroutine
Sub-Routine Write Pulse
START
WDT enable
Set SWE1 bit in FLMCR1
Perform programming in the erased state.
Do not perform additional programming
on previously programmed addresses.
Set PSU1 bit in FLMCR1
Wait (tsswe) 1μs
Wait (tspsu) 50μs
Store 128-byte program data in program
data area and reprogram data area
Set P1 bit in FLMCR1
Start of programming
n=1
Wait tsp10 or 30 or 200
*5
m=0
Write 128-byte data in RAM reprogram
data area consecutively to flash memory
End of programming
Clear P1 bit in FLMCR1
Wait (tcp) 5μs
*4
*1
Sub-Routine-Call
Apply Write pulse tsp30 or 200
See Note 6 for pulse width
Clear PSU1 bit in FLMCR1
Set PV1 bit in FLMCR1
Wait (tcpsu) 5μs
Wait (tspv) 4μs
Disable WDT
H'FF dummy write to verify address
End Sub
Number of Writes n
Write Time
(tsp30/tsp200) μs
Read verify data
*2
Write data =
verify data?
No
Increment address
30 *
30 *
30 *
30 *
30 *
30 *
1
2
3
4
5
6
7
8
9
10
11
12
13
n←n+1
tspvr = Wait 2μs
Note 6: Write Pulse Width
m=1
Yes
No
6≥n?
Yes
Additional-programming data computation
200
200
200
200
200
200
200
Transfer additional-programming data to
additional-programming data area
*4
Reprogram data computation
*3
Transfer reprogram data to reprogram data area *4
998
999
1000
200
200
200
No
128-byte
data verification completed?
Yes
Clear PV1 bit in FLMCR1
Note: * Use a 10 μs write pulse for additional programming.
Reprogram
RAM
Wait (tcpv) μs
Program data storage
area (128 bytes)
No
6 ≥ n?
Yes
Successively write 128-byte data from additional1
programming data area in RAM to flash memory *
Reprogram data storage
area (128 bytes)
Sub-Routine-Call
Apply Write Pulse (Additional programming)
Additional-programming
data storage area
(128 bytes)
No
m=0?
n ≥ 1000?
No
Yes
Yes
Notes: 1. Data transfer is performed by byte transfer. The lower 8 bits of the first address written
Clear SWE1 bit in FLMCR1
Clear SWE1 bit in FLMCR1
to must be H'00 or H'80.
A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case,
H'FF data must be written to the extra addresses.
Wait (tcswe) 100μs
Wait (tcswe) 100μs
2. Verify data is read in 16-bit (word) units.
3. Reprogram data is determined by the operation shown in the table below (comparison between
End of programming
Programming failure
the data stored in the program data area and the verify data). Bits for which the reprogram data is 0
are programmed in the next reprogramming loop. Therefore, even bits for which programming has been
completed will be subjected to programming once again if the result of the subsequent verify operation is NG.
4. A 128-byte area for storing program data, a 128-byte area for storing reprogram data, and a 128-byte area for storing additional data must be provided in RAM.
The contents of the reprogram data area and additional data area are modified as programming proceeds.
5. A write pulse of 30 μs or 200 μs is applied according to the progress of the programming operation. See Note 6 for details of the pulse widths.
When writing of additional-programming data is executed, a 10 μs write pulse should be applied. Reprogram data X' means reprogram data when the write pulse is applied.
Additional-Programming Data Computation Table
Reprogram Data Computation Table
Original Data Verify Data Reprogram Data
(D)
0
0
(V)
0
1
(X)
1
0
1
1
0
1
1
1
Comments
Programming completed
Programming incomplete; reprogram
Still in erased state; no action
Reprogram Data Verify Data
Additional(X')
(V)
Programming Data (Y)
Comments
0
0
0
1
0
1
Additional programming to be executed
Additional programming not to be executed
1
0
1
1
1
1
Additional programming not to be executed
Additional programming not to be executed
Figure 20.10 Program/Program-Verify Flowchart
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Section 20 ROM
20.8.2
Erase/Erase-Verify
When erasing flash memory, the erase/erase-verify flowchart shown in figure 20.11 should be
followed.
1. Prewriting (setting erase block data to all 0) is not necessary.
2. Erasing is performed in block units. Make only a single-bit specification in the erase block
register 1 and 2 (EBR1 and EBR2). To erase multiple blocks, each block must be erased in
turn.
3. The time during which the E1 bit is set to 1 is the flash memory erase time.
4. The watchdog timer (WDT) is set to prevent overprogramming due to program runaway, etc.
Set a value greater than (tsesu + tse + tce + tcesu) ms as the WDT overflow period.
5. For a dummy write to a verify address, write 1-byte data H'FF to an address whose lower 1 bit
is B'0. Verify data can be read in words from the address to which a dummy write was
performed.
6. If the read data is not erased successfully, set erase mode again, and repeat the erase/eraseverify sequence as before. The maximum number of repetitions of the erase/erase-verify
sequence is (N).
20.8.3
Interrupt Handling when Programming/Erasing Flash Memory
All interrupts, including the NMI interrupt, are disabled while flash memory is being programmed
or erased, or while the boot program is executing, for the following three reasons:
1. Interrupt during programming/erasing may cause a violation of the programming or erasing
algorithm, with the result that normal operation cannot be assured.
2. If interrupt exception handling starts before the vector address is written or during
programming/erasing, a correct vector cannot be fetched and the CPU malfunctions.
3. If an interrupt occurs during boot program execution, normal boot mode sequence cannot be
carried out.
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Section 20 ROM
Erase start
*1
Erasing should be
done to a block
SWE1 bit in FLMCR1 ← 1
tsswe: Wait 1 μs
n=1
*3
Set EBR1 (2)
Enable WDT
ESU1 bit in FLMCR1 ← 1
tsesu: Wait 100 μs
E1 bit in FLMCR1 ← 1
start erasing
tse: Wait 10 ms
E1 bit in FLMCR1 ← 0
stop erasing
tce: Wait 10 μs
ESU1 bit in FLMCR1 ← 0
tcesu: Wait 10 μs
Disable WDT
EV1 bit in FLMCR1 ← 1
tsev: Wait 20 μs
Set block start address as verify address
H'FF dummy write to verify address
tsevr: Wait 2 μs
n←n+1
Read verify data
Verify data = all 1?
Increment address
*2
No
Yes
No
Last address of block?
Yes
EV1 bit in FLMCR1 ← 0
EV1 bit in FLMCR1 ← 0
tcev: Wait 4 μs
tcev: Wait 4 μs
All erase block erased?
n ≥ 100?
*4
No
No
Yes
Yes
SWE1 bit in FLMCR1 ← 0
SWE1 bit in FLMCR1 ← 0
tcswe: Wait 100 μs
tcswe: Wait 100 μs
End of erasing
Erase failure
Notes: 1. Pre-writing (all erase block data are cleared to 0) is not necessary.
2. Verify data is read out in 16 bit size (word access).
3. Erasing block register (EBR) can be set about 1 bit at a time.
Do not specify 2 bits or more.
4. Erasing is performed block by block. when multiple blocks must be erased,
erase each lock one by one.
Figure 20.11 Erase/Erase-Verify Flowchart
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Section 20 ROM
20.9
Program/Erase Protection
There are three kinds of flash memory program/erase protection; hardware protection, software
protection, and error protection.
20.9.1
Hardware Protection
Hardware protection refers to a state in which programming/erasing of flash memory is forcibly
disabled or aborted because of a transition to reset or standby mode. Flash memory control register
1 (FLMCR1), flash memory control register 2 (FLMCR2), erase block register 1 (EBR1), and
erase block register 2 (EBR2) are initialized. In a reset via the RES pin, the reset state is not
entered unless the RES pin is held low until oscillation stabilizes after powering on. In the case of
a reset during operation, hold the RES pin low for the RES pulse width specified in the AC
Characteristics section.
20.9.2
Software Protection
Software protection can be implemented against programming/erasing of all flash memory blocks
by clearing the SWE1 bit in FLMCR1. When software protection is in effect, setting the P1 or E1
bit in FLMCR1 does not cause a transition to program mode or erase mode. By setting the erase
block register 1 and 2 (EBR1 and EBR2), erase protection can be set for individual blocks. When
EBR1 and EBR2 are set to H'00, erase protection is set for all blocks. By setting bit RAMS in
RAMER, programming/erase protection is set for all blocks.
20.9.3
Error Protection
In error protection, an error is detected when CPU runaway occurs during flash memory
programming/erasing, or operation is not performed in accordance with the program/erase
algorithm, and the program/erase operation is aborted. Aborting the program/erase operation
prevents damage to the flash memory due to overprogramming or overerasing.
When the following errors are detected during programming/erasing of flash memory, the FLER
bit in FLMCR2 is set to 1, and the error protection state is entered.
• When the flash memory of the relevant address area is read during programming/erasing
(including vector read and instruction fetch)
• Immediately after exception handling (excluding a reset) during programming/erasing
• When a SLEEP instruction is executed during programming/erasing
• When the CPU loses the bus during programming/erasing
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Section 20 ROM
The FLMCR1, FLMCR2, EBR1, and EBR2 settings are retained, however program mode or erase
mode is aborted at the point at which the error occurred. Program mode or erase mode cannot be
re-entered by re-setting the P1 or E1 bit. However, PV1 and EV1 bit setting is enabled, and a
transition can be made to verify mode. Error protection can be cleared only by a reset or in
hardware standby.
20.10
Interrupt Handling when Programming/Erasing Flash Memory
All interrupts, including NMI input, are disabled when flash memory is being programmed or
erased (when the P1 or E1 bit is set in FLMCR1), and while the boot program is executing in boot
1
mode* , to give priority to the program or erase operation. There are three reasons for this:
1. Interrupt during programming or erasing might cause a violation of the programming or
erasing algorithm, with the result that normal operation could not be assured.
2. In the interrupt exception handling sequence during programming or erasing, the vector would
2
not be read correctly* , possibly resulting in CPU runaway.
3. If an interrupt occurred during boot program execution, it would not be possible to execute the
normal boot mode sequence.
Notes: 1. Interrupt requests must be disabled inside and outside the CPU until the programming
control program has completed programming.
2. The vector may not be read correctly in this case for the following two reasons:
• If flash memory is read while being programmed or erased (while the P1 or E1 bit is
set in FLMCR1), correct read data will not be obtained (undetermined values will be
returned).
• If the interrupt entry in the vector table has not been programmed yet, interrupt
exception handling will not be executed correctly.
20.11
Programmer Mode
In programmer mode, a PROM programmer can be used to perform programming/erasing via a
socket adapter, just as for a discrete flash memory. Use a PROM programmer which supports the
Renesas 256-kbyte flash memory on-chip microcomputer device type (FZTAT256V3A).
The socket adapter pin correspondence diagram is shown in figure 20.12.
Rev. 5.00 Sep. 01, 2009 Page 530 of 656
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Section 20 ROM
This LSI
Pin No.
Socket Adapter
(Conversion to
40-Pin
Arrangement)
HN27C4096HG (40-Pin)
Pin No.
Pin Name
A0
21
A0
A1
22
A1
15
A2
23
A2
13
A3
24
A3
11
A4
25
A4
10
A5
26
A5
9
A6
27
A6
8
A7
28
A7
7
A8
29
A8
6
A9
31
A9
5
A10
32
A10
4
A11
33
A11
3
A12
34
A12
2
A13
35
A13
1
A14
36
A14
100
A15
37
A15
99
A16
38
A16
98
A17
39
A17
97
A18
10
A18
25
D0
19
I/O0
24
D1
18
I/O1
23
D2
17
I/O2
22
D3
16
I/O3
21
D4
15
I/O4
20
D5
14
I/O5
19
D6
13
I/O6
18
D7
12
I/O7
26
CE
2
CE
28
OE
20
OE
27
WE
3
WE
66
FWE
4
FWE
1, 40
VCC
VCC
11, 30
VSS
FP-100B,TFP-100B,
TFP-100G
Pin Name
17
16
12, 30, 53, 54, 58,
60, 61, 62, 75
14, 29, 38, 40,42,
VSS
5, 6, 7
NC
8
A20
9
A19
56, 64, 67
59
RES
63
XTAL
65
EXTAL
Other than the above
N.C.(OPEN)
Power-on
reset circuit
Oscillator
circuit
Legend:
FWE:
I/O0 to 7:
A20 to 0:
OE:
CE:
WE:
Flash write enable
Data input/output
Address input
Output enable
Chip enable
Write enable
Note: This drawing indicates pin correspondences and does not show the entire circuitry of the socket adapter.
Figure 20.12 Socket Adapter Pin Correspondence Diagram
Rev. 5.00 Sep. 01, 2009 Page 531 of 656
REJ09B0071-0500
Section 20 ROM
20.12
Power-Down States for Flash Memory
In user mode, the flash memory will operate in either of the following states:
• Normal operating mode
The flash memory can be read and written to at high speed.
• Power-down state
The flash memory can be read when part of the power circuit is halted and the LSI operates by
subclocks.
• Standby mode
All flash memory circuits are halted.
Table 20.6 shows the correspondence between the operating modes of the H8S/2268 Group and
the flash memory. When the flash memory returns to its normal operating state from standby
mode, a period to stabilize the power supply circuits that were stopped is needed. When the flash
memory returns to its normal operating state, bits STS2 to STS0 in SBYCR must be set to provide
a wait time of at least 100 µs, even when the external clock is being used.
Table 20.6 Flash Memory Operating States
LSI Operating State
Flash Memory Operating State
Active mode
Normal operating mode
Sleep mode
Normal operating mode
Watch mode
Standby mode
Standby mode
Sub-active mode
PDWND = 0: Power-down mode (read only)
Sub-sleep mode
PDWND = 1: Normal operating mode (read only)
Rev. 5.00 Sep. 01, 2009 Page 532 of 656
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Section 20 ROM
20.13
Flash Memory Programming and Erasing Precautions
Precautions concerning the use of on-board programming mode, the RAM emulation function, and
programmer mode are summarized below.
Use the specified voltages and timing for programming and erasing: Applied voltages in
excess of the rating can permanently damage the device. Use a PROM programmer that supports
the Renesas 256-kbyte flash memory on-chip microcomputer device type (FZTAT256V3A).
Do not select the HN27C4096 setting for the PROM programmer, and only use the specified
socket adapter. Failure to observe these points may result in damage to the device.
Powering on and off (see figures 20.13 to 20.15): Do not apply a high level to the FWE pin until
VCC has stabilized. Also, drive the FWE pin low before turning off VCC.
When applying or disconnecting VCC power, fix the FWE pin low and place the flash memory in
the hardware protection state.
The power-on and power-off timing requirements should also be satisfied in the event of a power
failure and subsequent recovery.
FWE application/disconnection (see figures 20.13 to 20.15): FWE application should be carried
out when MCU operation is in a stable condition. If MCU operation is not stable, fix the FWE pin
low and set the protection state.
The following points must be observed concerning FWE application and disconnection to prevent
unintentional programming or erasing of flash memory:
• Apply FWE when the VCC voltage has stabilized within its rated voltage range.
• In boot mode, apply and disconnect FWE during a reset.
• In user program mode, FWE can be switched between high and low level regardless of the
reset state. FWE input can also be switched during execution of a program in flash memory.
• Do not apply FWE if program runaway has occurred.
• Disconnect FWE only when the SWE1, ESU1, PSU1, EV1, PV1, P1, and E1 bits in FLMCR1
are cleared.
Make sure that the SWE1, ESU1, PSU1, EV1, PV1, P1, and E1 bits are not set by mistake
when applying or disconnecting FWE.
Rev. 5.00 Sep. 01, 2009 Page 533 of 656
REJ09B0071-0500
Section 20 ROM
Do not apply a constant high level to the FWE pin: Apply a high level to the FWE pin only
when programming or erasing flash memory. A system configuration in which a high level is
constantly applied to the FWE pin should be avoided. Also, while a high level is applied to the
FWE pin, the watchdog timer should be activated to prevent overprogramming or overerasing due
to program runaway, etc.
Use the recommended algorithm when programming and erasing flash memory: The
recommended algorithm enables programming and erasing to be carried out without subjecting the
device to voltage stress or sacrificing program data reliability. When setting the P1 or E1 bit in
FLMCR1, the watchdog timer should be set beforehand as a precaution against program runaway,
etc.
Do not set or clear the SWE1 bit during execution of a program in flash memory: Wait for at
least 100 µs after clearing the SWE1 bit before executing a program or reading data in flash
memory.
When the SWE1 bit is set, data in flash memory can be rewritten. Access flash memory only for
verify operations (verification during programming/erasing). Also, do not clear the SWE1 bit
during programming, erasing, or verifying. Similarly, when using the RAM emulation function
while a high level is being input to the FWE pin, the SWE1 bit must be cleared before executing a
program or reading data in flash memory.
However, the RAM area overlapping flash memory space can be read and written to regardless of
whether the SWE1 bit is set or cleared.
Do not use interrupts while flash memory is being programmed or erased: All interrupt
requests, including NMI, should be disabled during FWE application to give priority to
program/erase operations.
Do not perform additional programming. Erase the memory before reprogramming: In onboard programming, perform only one programming operation on a 128-byte programming unit
block. In programmer mode, too, perform only one programming operation on a 128-byte
programming unit block. Programming should be carried out with the entire programming unit
block erased.
Before programming, check that the chip is correctly mounted in the PROM programmer:
Overcurrent damage to the device can result if the index marks on the PROM programmer socket,
socket adapter, and chip are not correctly aligned.
Rev. 5.00 Sep. 01, 2009 Page 534 of 656
REJ09B0071-0500
Section 20 ROM
Do not touch the socket adapter or chip during programming: Touching either of these can
cause contact faults and write errors.
Reset the flash memory before turning on the power: To reset the flash memory during
oscillation stabilization period, the reset signal must be input for at least 100 µs.
Apply the reset signal while SWE1 is low to reset the flash memory during its operation: The
reset signal is applied at least 100 µs after the SWE1 bit has been cleared.
Wait time: tsswe
Programming/
erasing
possible
Wait time: 100µs
φ
min 0µs
tOSC1
VCC
tMDS*3
FWE
min 0µs
MD2, MD1*1
tMDS*3
RES
SWE1 set
SWE1 cleared
SWE1bit
Period during which flash memory access is prohibited
(tsswe: Wait time after setting SWE1 bit)*2
Period during which flash memory can be programmed
(Execution of program in flash memory prohibited, and data reads other than verify operations
prohibited)
Notes: 1. Except when switching modes, the level of the mode pins (MD2, MD1) must be fixed until
power-off by pulling the pins up or down.
2. See section 25.2.8, Flash Memory Characteristics.
3. Mode programming setup time tMDS (min.) = 200ns.
Figure 20.13 Power-On/Off Timing (Boot Mode)
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REJ09B0071-0500
Section 20 ROM
Programming/
erasing
Wait time: tsswe possible
Wait time: 100µs
φ
tOSC1
min 0µs
VCC
FWE
MD2,MD1*1
tMDS*3
RES
SWE1 set
SWE1 cleared
SWE1 bit
Period during which flash memory access is prohibited
(tsswe: Wait time after setting SWE1 bit)*2
Period during which flash memory can be programmed
(Execution of program in flash memory prohibited, and data reads other than verify operations
prohibited)
Notes: 1. Except when switching modes, the level of the mode pins (MD2, MD1) must be fixed until
power-off by pulling the pins up or down.
2. See section 25.2.8, Flash Memory Characteristics.
3. Mode programming setup time tMDS (min.) = 200ns.
Figure 20.14 Power-On/Off Timing (User Program Mode)
Rev. 5.00 Sep. 01, 2009 Page 536 of 656
REJ09B0071-0500
*4
*4
Programming/
erasing possible
Wait time: tsswe
Wait time: tsswe
Programming/
erasing possible
Wait time: tsswe
Programming/
erasing possible
Programming/
erasing possible
Wait time: tsswe
Section 20 ROM
*4
φ
tOSC1
VCC
min 0µs
FWE
tMDS
2
tMDS*
MD2, MD1
tMDS
tRESW
RES
SWE1
cleared
SWE1 set
SWE1 bit
Mode
change*1
Boot
mode
Mode
User
change*1 mode
User program mode
User
mode
User program
mode
Period during which flash memory access is prohibited
(tsswe: Wait time after setting SWE1 bit)*3
Period during which flash memory can be programmed
(Execution of program in flash memory prohibited, and data reads other than verify operations prohibited)
Notes: 1. When entering boot mode or making a transition from boot mode to another mode, mode switching must be
carried out by means of RES input.
2. When making a transition from boot mode to another mode, a mode programming setup time tMDS (min.) of 200
ns is necessary with respect to RES clearance timing.
3. See section 25.2.8, Flash Memory Characteristics.
4. Wait time: 100µs.
Figure 20.15 Mode Transition Timing
(Example: Boot Mode → User Mode ↔ User Program Mode)
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Section 20 ROM
20.14
Note on Switching from F-ZTAT Version to Masked ROM Version
The masked ROM version does not have the internal registers for flash memory control that are
provided in the F-ZTAT version. Table 20.7 lists the registers that are present in the F-ZTAT
version but not in the masked ROM version. If a register listed in table 20.7 is read in the masked
ROM version, an undefined value will be returned. Therefore, if application software developed
on the F-ZTAT version is switched to a masked ROM version product, it must be modified to
ensure that the registers in table 20.7 have no effect.
Table 20.7 Registers Present in F-ZTAT Version but Absent in Masked ROM Version
Register
Abbreviation
Address
Flash memory control register 1
FLMCR1
H'FFA8
Flash memory control register 2
FLMCR2
H'FFA9
Erase block register 1
EBR1
H'FFAA
Erase block register 2
EBR2
H'FFAB
RAM emulation register
RAMER
H'FEDB
Flash memory power control register
FLPWCR
H'FFAC
Serial control register X (Only bit 3)
SCRX
H'FDB4
Rev. 5.00 Sep. 01, 2009 Page 538 of 656
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Section 21 Clock Pulse Generator
Section 21 Clock Pulse Generator
This LSI has an on-chip clock pulse generator that generates the system clock (φ), the bus master
clock, and internal clocks. The clock pulse generator consists of an oscillator, duty adjustment
circuit, clock selection circuit, medium-speed clock divider, bus master clock selection circuit,
subclock oscillator, and wave formation circuit. A block diagram of the clock pulse generator is
shown in figure 21.1.
LPWRCR
SCKCR
RFCUT
EXTAL
XTAL
System
clock
oscillator
SCK2 to SCK0
Duty
adjustment
circuit
Mediumspeed
clock divider
Clock
selection
circuit
φ SUB
OSC1
Subclock
oscillator
OSC2
Waveform
Generation
Circuit
φ/2 to
φ/32
Bus
master
clock
selection
circuit
Internal
clock φ
Internal clock to
peripheral modules
Bus master clock
to CPU and DTC
WDT_1, TMR4, LCD count clock
Legend:
LPWRCR: Low-power control register
SCKCR:
System clock control register
Figure 21.1 Block Diagram of Clock Pulse Generator
Frequency changes are performed by software by settings in the low-power control register
(LPWRCR) and system clock control register (SCKCR).
CPG0501B_000020020700
Rev. 5.00 Sep. 01, 2009 Page 539 of 656
REJ09B0071-0500
Section 21 Clock Pulse Generator
21.1
Register Descriptions
The on-chip clock pulse generator has the following registers.
• System clock control register (SCKCR)
• Low-power control register (LPWRCR)
21.1.1
System Clock Control Register (SCKCR)
SCKCR performs medium-speed mode control.
Bit
Bit Name
Initial
Value
R/W
Description
7, 6
⎯
All 0
R/W
Reserved
These are readable/writable bits, but the write value
should always be 0.
5, 4
⎯
All 0
⎯
Reserved
These bits are always read as 0.Writing is invalid.
3
⎯
0
R/W
Reserved
This is a readable/writable bit, but the write value should
always be 0.
2
SCK2
0
R/W
System Clock Select 2 to 0
1
SCK1
0
R/W
These bits select the bus master clock.
0
SCK0
0
R/W
000: High-speed mode
001: Medium-speed clock is φ/2
010: Medium-speed clock is φ/4
011: Medium-speed clock is φ/8
100: Medium-speed clock is φ/16
101: Medium-speed clock is φ/32
11X: Setting prohibited
Legend:
X: Don’t care
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Section 21 Clock Pulse Generator
21.1.2
Low-Power Control Register (LPWRCR)
LPWRCR performs down-mode control, selects sampling frequency for eliminating noise,
performs subclock generation control, and specifies multiplication factor.
Bit
Bit Name
Initial
Value
R/W
Description
7
DTON
0
R/W
Direct Transition ON Flag
0: When the SLEEP instruction is executed in high-speed
mode or medium-speed mode, operation shifts to
sleep mode, software standby mode, or watch mode.
When the SLEEP instruction is executed in sub-active
mode, operation shifts to sub-sleep mode or watch
mode.
1: When the SLEEP instruction is executed in high-speed
mode or medium-speed mode, operation shifts directly
to sub-active mode, or shifts to sleep mode or software
standby mode.
When the SLEEP instruction is executed in sub-active
mode, operation shifts directly to high-speed mode, or
shifts to sub-sleep mode.
6
LSON
0
R/W
Low Speed ON Fag
0: When the SLEEP instruction is executed in high-speed
mode or medium-speed mode, operation shifts to
sleep mode, software standby mode, or watch mode*.
When the SLEEP instruction is executed in sub-active
mode, operation shifts to watch mode* or shifts directly
to high-speed mode.
Operation shifts to high-speed mode when watch
mode is cancelled.
1: When the SLEEP instruction is executed in high-speed
mode, operation shifts to watch mode or sub-active
mode.
When the SLEEP instruction is executed in sub-active
mode, operation shifts to sub-sleep mode or watch
mode.
Operation shifts to sub-active mode when watch mode
is cancelled.
Rev. 5.00 Sep. 01, 2009 Page 541 of 656
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Section 21 Clock Pulse Generator
Bit
Bit Name
Initial
Value
R/W
5
NESEL
0
R/W
Description
Noise Elimination Sampling Frequency Select
This bit selects the sampling frequency of the subclock
(φSUB) generated by the subclock oscillator is sampled by
the clock (φ) generated by the system clock oscillator
Set 0 when φ is 5 MHz or higher. Set 1 when φ is 2.1 MHz
or lower. Any value can be set when φ is 2.1 to 5 MHz.
0: Sampling using 1/32 × φ
1: Sampling using 1/4 × φ
4
SUBSTP
0
R/W
Subclock Enable
This bit enables/disables subclock generation. This bit
should be set to 1 when subclock is not used.
0: Enables subclock generation.
1: Disables subclock generation.
3
RFCUT
0
R/W
Oscillation Circuit Feedback Resistance Control Bit
Selects whether or not built-in feedback resistance and
duty adjustment circuit of the system clock generator are
used when an external clock is input. Do not access
when the crystal resonator is used.
After setting this bit in the external clock input state, enter
software standby mode, watch mode, or subactive mode.
When software standby mode, watch mode, or subactive
mode is entered, switch whether or not built-in feedback
resistance and duty adjustment circuit are used.
0: Built-in feedback resistance and duty adjustment circuit
of the system clock generator used.
1: Built-in feedback resistance and duty adjustment circuit
of the system clock generator not used.
2
⎯
0
R/W
Reserved
This is a readable/writable bit, but the write value should
always be 0.
Rev. 5.00 Sep. 01, 2009 Page 542 of 656
REJ09B0071-0500
Section 21 Clock Pulse Generator
Bit
Bit Name
Initial
Value
R/W
Description
1
STC1
0
R/W
Multiplication factor setting
0
STC0
0
R/W
Specifies multiplication factor of the PLL circuit built in the
evaluation chip. The specified multiplication factor
becomes valid software standby mode, watch mode, or
subactive mode is entered.
These bits should be set to 11 in this LSI. Since the value
becomes STC1 = STC0 = 0 after a reset, set STC1 =
STC0 = 1.
00: × 1
01: × 2 (setting prohibited)
10: × 4 (setting prohibited)
11: PLL is bypass
Note: * When watch mode or subactive mode is entered, set high-speed mode.
21.2
System Clock Oscillator
System clock pulses can be supplied by connecting a crystal resonator, or by input of an external
clock.
21.2.1
Connecting a Crystal Resonator
A crystal resonator can be connected as shown in the example in figure 21.2. Select the damping
resistance Rd according to table 21.1. An AT-cut parallel-resonance crystal should be used.
CL1
EXTAL
XTAL
Rd
CL2
CL1 = CL2 = 10 to 22 pF
Note: CL1 and CL2 are reference values including the floating capacitance of the board.
Figure 21.2 Connection of Crystal Resonator (Example)
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REJ09B0071-0500
Section 21 Clock Pulse Generator
Table 21.1 Damping Resistance Value
Frequency (MHz)
2
4
6
8
10
12
16
20
Rd (Ω)
1k
500
300
200
100
0
0
0
Figure 21.3 shows the equivalent circuit of the crystal resonator. Use a crystal resonator that has
the characteristics shown in table 21.2.
CL
L
XTAL
Rs
C0
EXTAL
AT-cut parallel-resonance type
Figure 21.3 Crystal Resonator Equivalent Circuit
Table 21.2 Crystal Resonator Characteristics
Frequency (MHz)
2
4
6
8
10
12
16
20
RS max. (Ω)
500
120
100
80
60
60
50
40
C0 max. (pF)
7
7
7
7
7
7
7
7
21.2.2
External Clock Input
An external clock signal can be input as shown in the examples in figure 21.4. If the XTAL pin is
left open, ensure that stray capacitance does not exceed 10 pF. When complementary clock is
input to the XTAL pin, the external clock input should be fixed high in standby mode, subactive
mode, subsleep mode, or watch mode.
External clock input
EXTAL
Open
XTAL
(a) XTAL pin left open
External clock input
EXTAL
XTAL
(b) Complementary clock input at XTAL pin
Figure 21.4 External Clock Input (Examples)
Rev. 5.00 Sep. 01, 2009 Page 544 of 656
REJ09B0071-0500
Section 21 Clock Pulse Generator
Table 21.3 shows the input conditions for the external clock. Table 21.4 shows the input
conditions for the external clock when duty adjustment circuit is not used.
Table 21.3 External Clock Input Conditions
VCC = 2.7 V to 5.5 V
V CC = 4.0 V to 5.5 V
Item
Symbol
Min.
Max.
Min.
Max.
Unit
Test
Conditions
External clock input
low pulse width
tEXL
30
⎯
20
⎯
ns
Figure 21.5
External clock input
high pulse width
tEXH
30
⎯
20
⎯
ns
External clock rise
time
tEXr
⎯
7
⎯
5
ns
External clock fall
time
tEXf
⎯
7
⎯
5
ns
Table 21.4 External Clock Input Conditions (Duty Adjustment Circuit Not Used)
VCC = 2.7 V to 5.5 V
VCC = 4.0 V to 5.5 V
Item
Symbol
Min.
Max.
Min.
Max.
Unit
Test
Conditions
External clock input
low pulse width
tEXL
37
⎯
25
⎯
ns
Figure 21.5
External clock input
high pulse width
tEXH
37
⎯
25
⎯
ns
External clock rise
time
tEXr
⎯
7
⎯
5
ns
External clock fall
time
tEXf
⎯
7
⎯
5
ns
Note: When duty adjustment circuit is not used, maximum operating frequency is lowered
according to the input waveform.
(Example: When tEXL = tEXH = 50 ns, tEXr = tEXf = 10 ns, clock cycle time = 120 ns, and
maximum operating frequency = 8.3 MHz)
Rev. 5.00 Sep. 01, 2009 Page 545 of 656
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Section 21 Clock Pulse Generator
tEXH
tEXL
VCC × 0.5
EXTAL
tEXr
tEXf
Figure 21.5 External Clock Input Timing
21.2.3
Notes on Switching External Clock
When two or more external clocks (e.g.: 10 MHz and 2 MHz) are used as the system clock, input
clock should be switched in software standby mode.
An example of external clock switching circuit is shown in figure 21.6. An example of external
clock switching timing is shown in figure 21.7.
This LSI
External clock switch request
Control
circuit
External interrupt signal
Port output
External
interrupt
External clock 1
External clock 2
Selector
External clock switch signal
EXTAL
Figure 21.6 External Clock Switching Circuit (Examples)
Rev. 5.00 Sep. 01, 2009 Page 546 of 656
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Section 21 Clock Pulse Generator
External
clock 1
External
clock 2
Operation
Clock switching
request
SLEEP instruction
execution
Interrupt exception handling
(5)
(1)
Port output
External
clock
switching
circuit
(2)
(3)
EXTAL
Internal
clock φ
Standby mode
External
interrupt
200ns or more
Active (external clock2)
(4)
Software standby mode
Active (external clock1)
(1) Port output (clock switching)
(2) Transition to software standby mode
(3) External clock switchover
(4) External interrupt generation
(An interrupt should be input 200 ns or more after transition to software standby mode.)
(5) Interrupt exception handling
Figure 21.7 External Clock Switching Timing (Examples)
21.3
Duty Adjustment Circuit
The duty adjustment circuit is valid when oscillation frequency is more than 5 MHz. The duty
adjustment circuit adjusts clock output fr/m the system clock oscillator to generate the system
clock (φ).
21.4
Medium-Speed Clock Divider
The medium-speed clock divider divides the system clock to generate φ/2, φ/4, φ/8, φ/16, and
φ/32.
21.5
Bus Master Clock Selection Circuit
The bus master clock selection circuit selects the clock supplied to the bus master by setting the
bits SCK2 to SCK0 in SCKCR. The bus master clock can be selected from system clock (φ), or
medium-speed clocks (φ/2, φ/4, φ/8, φ/16, φ/32).
Rev. 5.00 Sep. 01, 2009 Page 547 of 656
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Section 21 Clock Pulse Generator
21.6
Subclock Oscillator
21.6.1
Connecting 32.768-kHz Crystal Resonator
To supply a clock to the subclock divider, connect a 32.768-kHz crystal resonator, as shown in
Figure 21.8. Figure 21.9 shows the equivalence circuit for a 32.768kHz oscillator.
C1
OSC1
C2
OSC2
C1 = C2 = 15 pF (typ.)
Note: C1 and C2 are reference values including the floating
capacitance of the boad.
Figure 21.8 Example Connection of 32.768-kHz Crystal Resonator
Ls
Cs
Rs
OSC1
OSC2
Co
Co = 1.5 pF (typ.)
Rs = 14 kΩ (typ.)
fw = 32.768 kHz
Type name = C001R (SEIKO EPSON)
Figure 21.9 Equivalence Circuit for 32.768-kHz Crystal Resonator
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REJ09B0071-0500
Section 21 Clock Pulse Generator
21.6.2
Handling Pins when Subclock not Required
If no subclock is required, connect the OSC1 pin to Vss and leave OSC2 open, as shown in figure
21.10. Set the SUBSTP bit of LPWRCR to 1.
OSC1
OSC2
Open
Note: Set the SUBSTP
bit in LPWRCR to 1.
Figure 21.10 Pin Handling When Subclock Not Required
21.7
Subclock Waveform Generation Circuit
To eliminate noise from the subclock input to OSCI, the subclock is sampled using the dividing
clock φ. The sampling frequency is set using the NESEL bit of LPWRCR. For details, see section
21.1.2, Low Power Control Register (LPWRCR).
No sampling is performed in sub-active mode, sub-sleep mode, or watch mode.
21.8
Usage Notes
21.8.1
Note on Crystal Resonator
As various characteristics related to the crystal resonator are closely linked to the user's board
design, thorough evaluation is necessary on the user's part, using the resonator connection
examples shown in this section as a guide. As the resonator circuit ratings will depend on the
floating capacitance of the resonator and the mounting circuit, the ratings should be determined in
consultation with the resonator manufacturer. The design must ensure that a voltage exceeding the
maximum rating is not applied to the oscillator pin.
Rev. 5.00 Sep. 01, 2009 Page 549 of 656
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Section 21 Clock Pulse Generator
21.8.2
Note on Board Design
When designing the board, place the crystal resonator and its load capacitors as close as possible
to the XTAL and EXTAL pins. Make wires as short as possible. Other signal lines should be
routed away from the oscillator circuit, as shown in figure 21.11. This is to prevent induction from
interfering with correct oscillation.
Signal A Signal B
Avoid
C2
This LSI
XTAL, OSC2
EXTAL, OSC1
C1
Figure 21.11 Note on Board Design of Oscillator Circuit
21.8.3
Note on Using a Crystal Resonator
When a microcomputer runs, internal power supply potential will fluctuate synchronized with the
system clock. In addition, according to the individual characteristics of crystal resonator, there is
a case where the amplitude of the oscillation waveform will not be grown sufficiently immediately
after oscillation stabilization period, thus the oscillation waveform is easily affected by the
fluctuation of the power supply voltage. In this condition, oscillation waveform will be unstable,
resulting in the system clock instability and malfunction of the microcomputer.
If a malfunction occurs, the setting of the standby timer select 2 to 0 (STS2 to STS0) bits in the
standby control register (SBYCR) must be set so as for the standby time to be longer.
For example, if a malfunction occurs when the standby time is set to 8192 states, the operation
should be confirmed by setting the standby time to 16384 states or longer.
In addition, if a malfunction similar to at state transition occurs at reset, the RES pin hold time
must be set longer.
Rev. 5.00 Sep. 01, 2009 Page 550 of 656
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Section 22 Power-Down Modes
Section 22 Power-Down Modes
In addition to the normal program execution state, the H8S/2268 Group and the H8S/2264 Group
have nine power-down modes in which operation of the CPU and oscillator is halted and power
dissipation is reduced. Low-power operation can be achieved by individually controlling the CPU,
on-chip peripheral modules, and so on.
The H8S/2268 Group and the H8S/2264 Group operating modes are as follows:
1. High-speed mode
2. Medium-speed mode
3. Subactive mode
4. Sleep mode
5. Subsleep mode
6. Watch mode
7. Module stop mode
8. Software standby mode
9. Hardware standby mode
2. to 9. are low power dissipation states. Sleep mode and sub-sleep mode are CPU states, mediumspeed mode is a CPU and bus master state, sub-active mode is a CPU and bus master and internal
peripheral function state, and module stop mode is an internal peripheral function (including bus
masters other than the CPU) state. Some of these states can be combined.
After a reset, the LSI is in high-speed mode with modules other than the DTC in module stop
mode.
Table 22.1 shows the internal state of the LSI in the respective modes. Table 22.2 shows the
conditions for shifting between the low power dissipation modes.
Figure 22.1 is a mode transition diagram.
Rev. 5.00 Sep. 01, 2009 Page 551 of 656
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Section 22 Power-Down Modes
Table 22.1 LSI Internal States in Each Mode
Function
HighSpeed
System clock pulse
generator
Function- Function- Function- Function- Halted
ing
ing
ing
ing
Subclock pulse
generator
Function- Function- Function- Function- Function- Function- Function- Function- Halted
ing/halted ing/halted ing/halted ing/halted ing
ing
ing
ing/halted
CPU
MediumSpeed
Sleep
Instructions Function- Medium- Halted
ing
speed
Registers
Retained
operation
Module
Stop
Watch
Subactive
Software Hardware
Subsleep Standby Standby
Halted
Halted
Halted
Halted
Function- Halted
ing
Retained
Subclock Halted
operation
Retained
Halted
Halted
Retained
Undefined
RAM
Function- Function- Function- Function- Retained
ing
ing
ing (DTC) ing
*2
Function- Retained
ing
Retained
Retained
I/O
Function- Function- Function- Function- Retained
ing
ing
ing
ing
Function- Function- Halted
ing
ing
External NMI
interrupts IRQn
WKPn
Function- Function- Function- Function- Function- Function- Function- Function- Halted
ing
ing
ing
ing
ing
ing
ing
ing
Peripheral PBC*2
functions
Function- Medium- Function- Function- Halted
Subclock Halted
Halted
Halted
ing
speed
ing
ing/halted (retained) operation (retained) (retained) (reset)
operation
(retained)
DTC*2
Halted
Halted
Halted
Halted
Function- Medium- Function- Function- Halted
ing
ing/halted (retained) (retained) (retained) (retained) (reset)
ing
speed
(retained)
operation
TMR_4*2
Function- Function- Function- Function- Subclock Subclock Subclock Halted
Halted
ing
ing
ing
ing/halted operation operation operation (retained) (reset)
*1
*1
(retained) *1
LCD
High
impedance
WDT_1
Halted
Function- Function- Function- Function- Subclock Subclock Subclock Halted
ing
ing
ing
ing
operation operation operation (retained) (reset)
*1
*1
*1
WDT_0
Function- Function- Function- Function- Halted
Subclock Subclock Halted
Halted
ing
ing
ing
ing
(retained) operation operation (retained) (reset)
TMR_0
TMR_1
TMR_2*2
TMR_3*2
Subclock Subclock Halted
Halted
Function- Function- Function- Function- Halted
ing
ing
ing
ing/halted (retained) operation operation (retained) (reset)
(retained)
TPU
SCI
IIC
DTMF*2
D/A*2 *3
Function- Function- Function- Function- Halted
Halted
Halted
Halted
Halted
ing
ing
ing
ing/halted (retained) (retained) (retained) (retained) (reset)
(retained)
A/D
Function- Function- Function- Function- Halted
ing
ing
ing
ing/halted (reset)
(reset)
Rev. 5.00 Sep. 01, 2009 Page 552 of 656
REJ09B0071-0500
Halted
(reset)
Halted
(reset)
Halted
(reset)
Halted
(reset)
Section 22 Power-Down Modes
Notes: “Halted (retained)” means that internal register values are retained. The internal state is
“operation suspended.”
“Halted (reset)” means that internal register values and internal states are initialized.
In module stop mode, only modules for which a stop setting has been made are halted
(reset or retained).
2
1. When the TMR_4* , WDT_1, or LCD is operated in watch, subactive, or subsleep
mode, use the subclock.
2. Supported only by the H8S/2268 Group.
3. "Halted (retained)" means that internal register values are retained. For analog outputs,
the given D/A absolute accuracy is not satisfies because the internal state is "operation
suspended."
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Section 22 Power-Down Modes
Program-halted state
STBY pin = Low
Reset state
STBY pin = High
RES pin = Low
Program execution state
Hardware
standby mode
RES pin = High
SSBY= 0, LSON= 0
SLEEP instruction
High-speed mode
(main clock)
Sleep mode
(main clock)
Any interrupt *3
SCK2 to
SCK0= 0
SCK2 to
SCK0 0
Medium-speed
mode
(main clock)
SLEEP
instruction
External
interrupt *4
SLEEP instruction
SSBY = 1, PSS = 1
DTON = 1, LSON = 1
Clock switching
exception processing
SLEEP
instruction
Interrupt *1
LSON bit = 1
Sub-active mode
(subclock)
Software
standby mode
SLEEP
instruction
Interrupt *1
LSON bit = 0
SLEEP instruction
SSBY = 1, PSS = 1
DTON = 1, LSON = 0
After the oscillation
settling time
(STS2 to 0), clock
switching exception
processing
SSBY= 1,
PSS= 0, LSON= 0
SLEEP instruction
Interrupt *2
: Transition after exception processing
SSBY= 1,
PSS= 1, DTON= 0
Watch mode
(subclock)
SSBY= 0,
PSS= 1, LSON= 1
Sub-sleep mode
(subclock)
: Low power dissipation mode
Notes: When a transition is made between modes by means of an interrupt, the transition cannot be made on interrupt
source generation alone. Ensure that interrupt handling is performed after accepting the interrupt request.
From any state except hardware standby mode, a transition to the reset state occurs when RES is driven Low.
From any state, a transition to hardware standby mode occurs when STBY is driven low.
Always select high-speed mode before making a transition to watch mode or sub-active mode.
1. H8S/2268 Group: NMI, IRQ0, IRQ1, IRQ3 to IRQ5, WKP0 to WKP7, WDT1 interrupt, and TMR4
interrupt
H8S/2264 Group: NMI, IRQ0, IRQ1, IRQ3, IRQ4, WKP0 to WKP7, and WDT1 interrupt
2. H8S/2268 Group: NMI, IRQ0, IRQ1, IRQ3 to IRQ5, WKP0 to WKP7, WDT0 interrupt, WDT1 interrupt,
and TMR0 to TMR4 interrupts
H8S/2264 Group: NMI, IRQ0, IRQ1, IRQ3, IRQ4, WKP0 to WKP7, WDT0 interrupt, WDT1 interrupt,
TMR0 interrupt, and TMR1 interrupt
3. All interrupts
4. H8S/2268 Group: NMI, IRQ0, IRQ1, IRQ3 to IRQ5, WKP0 to WKP7
H8S/2264 Group: NMI, IRQ0, IRQ1, IRQ3, IRQ4, WKP0 to WKP7
Figure 22.1 Mode Transition Diagram
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Section 22 Power-Down Modes
Table 22.2 Low Power Dissipation Mode Transition Conditions
Status of Control Bit at
Transition
Pre-Transition
SSBY PSS
State
State After Transition
State After Transition Back from Low Power
Mode Invoked by
Invoked by SLEEP
Interrupt
LSON DTON Instruction
High-speed/
0
Medium-speed
0
X
0
X
Sleep
High-speed/Medium-speed
X
1
X
⎯
⎯
1
0
0
X
Software standby
High-speed/Medium-speed
1
0
1
X
⎯
⎯
1
1
0
0
Watch
High-speed
1
1
1
0
Watch
Sub-active
1
1
0
1
⎯
⎯
1
1
1
1
Sub-active
⎯
0
0
X
X
⎯
⎯
0
1
0
X
⎯
⎯
0
1
1
X
Sub-sleep
Sub-active
1
0
X
X
⎯
⎯
1
1
0
0
Watch
High-speed
1
1
1
0
Watch
Sub-active
1
1
0
1
High-speed
⎯
1
1
1
1
⎯
⎯
Sub-active
Legend:
X : Don’t care
⎯: Do not set.
Rev. 5.00 Sep. 01, 2009 Page 555 of 656
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Section 22 Power-Down Modes
22.1
Register Description
The following registers relates to the power-down modes. For details on system clock control
register (SCKCR), refer to section 21.1.1, System Clock Control Register (SCKCR). For details
on low power control register (LPWRCR), refer to section 21.1.2, Low Power Control Register
(LPWRCR). For details on timer control status register (TCSR_1), refer to section 12.2.2, Timer
Control/Status Register (TCSR).
• Standby control register (SBYCR)
• Module stop control register A (MSTPCRA)
• Module stop control register B (MSTPCRB)
• Module stop control register C (MSTPCRC)
• Module stop control register D (MSTPCRD)
• Low power control register (LPWRCR)
• System clock control register (SCKCR)
• Timer control status register (TCSR_1)
22.1.1
Standby Control Register (SBYCR)
SBYCR performs power-down mode control.
Bit
Bit Name
Initial
Value
R/W
Description
7
SSBY
0
R/W
Software Standby
Specifies transition destination when the SLEEP
instruction is executed.
0: Shifts to sleep mode when the SLEEP instruction is
executed in high-speed mode or medium-speed mode.
Shifts to sub-sleep mode when the SLEEP instruction
is executed in sub-active mode.
1: Shifts to software standby mode, sub-active mode, and
watch mode when the SLEEP instruction is executed
in high-speed mode or medium-speed mode.
Shifts to watch mode or high-speed mode when the
SLEEP instruction is executed in sub-active mode.
Note that the value of the SSBY bit does not change even
when software standby mode is canceled and making
normal operation mode transition by executing an
external interrupt. To clear this bit, 0 should be written to.
Rev. 5.00 Sep. 01, 2009 Page 556 of 656
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Section 22 Power-Down Modes
Bit
Bit Name
Initial
Value
R/W
Description
6
STS2
0
R/W
Standby Timer Select 2 to 0
5
STS1
0
R/W
4
STS0
0
R/W
These bits select the MCU wait time for clock settling to
cancel software standby mode, watch mode, or subactive mode.
With a crystal resonator (Table 22.3), select a wait time of
8 ms (oscillation settling time) or more, depending on the
operating frequency. With an external clock, there are no
specific wait requirements.
000: Standby time = 8192 states
001: Standby time = 16384 states
010: Standby time = 32768 states
011: Standby time = 65536 states
100: Standby time = 131072 states
101: Standby time = 262144 states
110: Standby time = 2048 states
111: Standby time = Reserved
3
⎯
1
R/W
Reserved
This is a readable/writable bit, but the write value should
always be 1.
2 to 0
⎯
All 0
⎯
Reserved
These bits are always read as 0 and cannot be modified.
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Section 22 Power-Down Modes
22.1.2
Module Stop Control Registers A to D (MSTPCRA to MSTPCRD)
MSTPCR performs module stop mode control. When bits in MSTPCR registers are set to 1,
module stop mode is set. When cleared to 0, module stop mode is cleared.
MSTPCRA
Bit
Bit Name
Initial Value
7
6
MSTPA7* 0
2
MSTPA6* 0
R/W
Data transfer controller (DTC)
5
MSTPA5
1
R/W
16-bit timer pulse unit (TPU)
4
MSTPA4
1
R/W
8-bit timer (TMR_0, TMR_1)
3
R/W
2
1
MSTPA3* 1
1
MSTPA2* 1
1
MSTPA1
1
R/W
A/D converter
0
MSTPA0*
1
R/W
8-bit timer (TMR_2, TMR_3)
1
2
R/W
Target Module
R/W
R/W
MSTPCRB
Bit
Bit Name
Initial Value
R/W
Target Module
7
MSTPB7
1
R/W
Serial communication interface 0 (SCI_0)
Serial communication interface 1 (SCI_1)
6
MSTPB6
1
R/W
5
MSTPB5*
1
R/W
4
R/W
I C bus interface 0 (I C_0) (optional)
R/W
I C bus interface 1 (I C_1) (optional)
2
MSTPB4
1
2
MSTPB3* 1
1
MSTPB2* 1
1
1
MSTPB1* 1
R/W
0
1
MSTPB0* 1
R/W
3
1
R/W
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REJ09B0071-0500
2
2
2
2
Section 22 Power-Down Modes
MSTPCRC
Bit
Bit Name
Initial Value
R/W
Target Module
7
MSTPC7
1
R/W
Serial communication interface 2 (SCI_2)
6
1
MSTPC6* 1
2
MSTPC5* 1
R/W
R/W
D/A converter
MSTPC4* 1
1
MSTPC3* 1
2
MSTPC2* 1
R/W
PC break controller (PBC)
MSTPC1* 1
1
MSTPC0* 1
R/W
5
4
3
2
1
0
2
1
R/W
R/W
DTMF generation circuit
R/W
MSTPCRD
Bit
Bit Name
7
MSTPD7* 1
R/W
6
MSTPD6
1
R/W
LCD controller/driver
5
MSTPD5* 1
R/W
8-bit reload timer (TMR_4)
4
MSTPD4* 1
1
MSTPD3* 1
1
MSTPD2* 1
R/W
1
MSTPD1* 1
1
MSTPD0* 1
R/W
3
2
1
0
Initial Value
1
2
1
R/W
Target Module
R/W
R/W
R/W
Notes: 1. Bit MSTPA7 can be read/written to. This bit is initialized to 0. Only 1 should be written
to. Bits MSTPA3, MSTPA2, MSTPB5, MSTPB2 to MSTPB0, MSTPC6, MSTPC3,
MSTPC1, MSTPC0, MSTPD7, MSTPD4 to MSTPD0 can be read/written to. These bits
are initialized to 1. Only 1 should be written to.
2. With the H8S/2264 Group, only 1 should be written to.
Rev. 5.00 Sep. 01, 2009 Page 559 of 656
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Section 22 Power-Down Modes
22.2
Medium-Speed Mode
In high-speed mode, when the SCK2 to SCK0 bits in SCKCR are set to 1, the operating mode
changes to medium-speed mode as soon as the current bus cycle ends. In medium-speed mode, the
CPU operates on the operating clock (φ/2, φ/4, φ/8, φ/16, or φ/32) specified by the SCK2 to SCK0
bits. The bus masters other than the CPU (DTC*) also operate in medium-speed mode.
On-chip peripheral modules other than the bus masters always operate on the high-speed clock (φ).
In medium-speed mode, a bus access is executed in the specified number of states with respect to
the bus master operating clock. For example, if φ/4 is selected as the operating clock, on-chip
memory is accessed in 4 states, and internal I/O registers in 8 states.
Medium-speed mode is cleared by clearing all of bits SCK2 to SCK0 to 0. A transition is made to
high-speed mode and medium-speed mode is cleared at the end of the current bus cycle.
If a SLEEP instruction is executed when the SSBY bit in SBYCR is cleared to 0, and LSON bit in
LPWRCR is cleared to 0, a transition is made to sleep mode. When sleep mode is cleared by an
interrupt, medium-speed mode is restored.
When the SLEEP instruction is executed with the SSBY bit = 1, LSON bit = 0, and PSS bit in
TCSR_1 (WDT_1) = 0, operation shifts to the software standby mode. When software standby
mode is cleared by an external interrupt, medium-speed mode is restored.
When the RES pin is set low and medium-speed mode is cancelled, operation shifts to the reset
state. The same applies in the case of a reset caused by overflow of the watchdog timer.
When the STBY pin is driven low, a transition is made to hardware standby mode.
Figure 22.2 shows the timing for transition to and clearance of medium-speed mode.
Note: * Supported only by the H8S/2268 Group.
Rev. 5.00 Sep. 01, 2009 Page 560 of 656
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Section 22 Power-Down Modes
Medium-speed mode
Internal clock φ,
peripheral module clock
Bus master clock
Internal address bus
SBYCR
SBYCR
Internal write signal
Figure 22.2 Medium-Speed Mode Transition and Clearance Timing
22.3
Sleep Mode
22.3.1
Sleep Mode
When the SLEEP instruction is executed while the SBYCR SSBY bit = 0 and the LPWRCR
LSON bit = 0, the CPU enters the sleep mode. In sleep mode, CPU operation stops but the
contents of the CPU’s internal registers are retained. Other peripheral modules do not stop.
22.3.2
Exiting Sleep Mode
Sleep mode is exited by any interrupt, or signals at the RES, or STBY pins.
• Exiting Sleep Mode by Interrupts
When an interrupt occurs, sleep mode is exited and interrupt exception processing starts. Sleep
mode is not exited if the interrupt is disabled, or interrupts other than NMI are masked by the
CPU.
• Exiting Sleep Mode by RES pin
Setting the RES pin level low selects the reset state. After the stipulated reset input duration,
driving the RES pin high starts the CPU performing reset exception processing.
• Exiting Sleep Mode by STBY Pin
When the STBY pin level is driven low, a transition is made to hardware standby mode.
Rev. 5.00 Sep. 01, 2009 Page 561 of 656
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Section 22 Power-Down Modes
22.4
Software Standby Mode
22.4.1
Software Standby Mode
A transition is made to software standby mode when the SLEEP instruction is executed while the
SBYCR SSBY bit = 1 and the LPWRCR LSON bit = 0, and the TCSR_1 (WDT_1) PSS bit = 0.
In this mode, the CPU, on-chip peripheral modules, and oscillator all stop. However, the contents
of the CPU’s internal registers, RAM data, and the states of on-chip peripheral modules other than
the A/D converter, and the states of I/O ports are retained. In this mode the oscillator stops, and
therefore power dissipation is significantly reduced.
22.4.2
Clearing Software Standby Mode
Software standby mode is cleared by an external interrupt (NMI pin, or pins IRQ0, IRQ1, IRQ3,
IRQ4 , IRQ5*, WKP0 to WKP7), or by means of the RES pin or STBY pin.
• Clearing with an interrupt
When an NMI, or IRQ0, IRQ1, IRQ3, IRQ4, IRQ5*, or WKP0 to WKP7 interrupt request
signal is input, clock oscillation starts, and after the elapse of the time set in bits STS2 to STS0
in SYSCR, stable clocks are supplied to the entire chip, software standby mode is cleared, and
interrupt exception handling is started.
When clearing software standby mode with an IRQ0, IRQ1, IRQ3, IRQ4, IRQ5*, or WKP0 to
WKP7 interrupt, set the corresponding enable bit/pin function switching bit to 1 and ensure
that no interrupt with a higher priority than interrupts IRQ0, IRQ1, IRQ3, IRQ4, IRQ5*, or
WKP0 to WKP7 is generated. Software standby mode cannot be cleared if the interrupt has
been masked on the CPU side or has been designated as a DTC activation source.
• Clearing with the RES pin
When the RES pin is driven low, clock oscillation is started. At the same time as clock
oscillation starts, clocks are supplied to the entire chip. Note that the RES pin must be held low
until clock oscillation settles. When the RES pin goes high, the CPU begins reset exception
handling.
• Clearing with the STBY pin
When the STBY pin is driven low, a transition is made to hardware standby mode.
Note: * Supported only by the H8S/2268 Group.
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Section 22 Power-Down Modes
22.4.3
Oscillation Settling Time after Clearing Software Standby Mode
Bits STS2 to STS0 in SBYCR should be set as described below.
• Using a Crystal Oscillator
Set bits STS2 to STS0 so that the standby time is at least 8 ms (the oscillation settling time).
Table 22.3 shows the standby times for different operating frequencies and settings of bits
STS2 to STS0.
• Using an External Clock
Any value can be set. Normally, minimum time is recommended.
Note: The 16-state standby time cannot be used in the F-ZTAT versions; a standby time of 2048
states or longer should be used.
Table 22.3 Oscillation Settling Time Settings
STS2
STS1
STS0
Standby Time
20 MHz
16 MHz
13 MHz
10 MHz
8 MHz 6 MHz 4 MHz 2 MHz
Unit
0
0
0
8192 states
0.41
0.51
0.63
0.82
1.0
1.4
2.0
ms
1
16384 states
0.82
1.0
1.3
1.6
2.0
2.7
4.1
0
32768 states
1.6
2.0
2.5
3.3
4.1
5.5
1
65536 states
3.3
4.1
5.0
6.6
0
131072 states
6.6
1
262144 states
16.4
20.2
26.2
32.8
43.7
65.5
131.1
0
2048 states
0.10
0.13
0.16
0.20
0.26
0.34
0.51
1.0
1
16 states
0.8
1.0
1.2
1.6
2.0
2.7
4.0
8.0
1
1
0
1
13.1
8.2
10.1
13.1
8.2
16.4
10.9
21.8
8.2
4.1
8.2
16.4
16.4
32.8
32.8
65.5
μs
: Recommended time setting
22.4.4
Software Standby Mode Application Example
Figure 22.3 shows an example in which a transition is made to software standby mode at the
falling edge on the NMI pin, and software standby mode is cleared at the rising edge on the NMI
pin.
In this example, an NMI interrupt is accepted with the NMIEG bit in SYSCR cleared to 0 (falling
edge specification), then the NMIEG bit is set to 1 (rising edge specification), the SSBY bit is set
to 1, and a SLEEP instruction is executed, causing a transition to software standby mode.
Software standby mode is then cleared at the rising edge on the NMI pin.
Rev. 5.00 Sep. 01, 2009 Page 563 of 656
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Section 22 Power-Down Modes
Oscillator
Internal clock φ
NMI
NMIEG
SSBY
NMI exception
Software standby mode
handling
(power-down mode)
NMIEG = 1
SSBY = 1
SLEEP instruction
Oscillation
settling
time tOSC2
NMI exception
handling
Figure 22.3 Software Standby Mode Application Example
22.5
Hardware Standby Mode
22.5.1
Hardware Standby Mode
When the STBY pin is driven low, a transition is made to hardware standby mode from any mode.
In hardware standby mode, all functions enter the reset state and stop operation, resulting in a
significant reduction in power dissipation. As long as the prescribed voltage is supplied, on-chip
RAM data is retained. I/O ports are set to the high-impedance state.
Do not change the state of the mode pins (MD2, MD1) during hardware standby mode.
22.5.2
Clearing Hardware Standby Mode
Hardware standby mode is cleared by means of the STBY pin and the RES pin. When the STBY
pin is driven high while the RES pin is low, the reset state is set and clock oscillation is started.
Ensure that the RES pin is held low until the clock oscillator settles (at least tosc1 ms⎯the
oscillation settling time⎯when using a crystal/ceramic oscillator). When the RES pin is
subsequently driven high, a transition is made to the program execution state via the reset
exception handling state.
Rev. 5.00 Sep. 01, 2009 Page 564 of 656
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Section 22 Power-Down Modes
22.5.3
Hardware Standby Mode Timing
Figure 22.4 shows an example of hardware standby mode timing.
When the STBY pin is driven low after the RES pin has been driven low, a transition is made to
hardware standby mode. Hardware standby mode is cleared by driving the STBY pin high,
waiting for the oscillation settling time, then changing the RES pin from low to high.
Oscillator
RES
STBY
Oscillation
settling
time tosc1
Reset
exception
handling
Figure 22.4 Hardware Standby Mode Timing
22.6
Module Stop Mode
Module stop mode can be set for individual on-chip peripheral modules.
When the corresponding MSTP bit in MSTPCR is set to 1, module operation stops at the end of
the bus cycle and a transition is made to module stop mode. The CPU continues operating
independently.
When the corresponding MSTP bit is cleared to 0, module stop mode is cleared and the module
starts operating at the end of the bus cycle. In module stop mode, the internal states of modules
other than the A/D converter are retained.
After reset clearance, all modules other than DTC* are in module stop mode.
When an on-chip peripheral module is in module stop mode, read/write access to its registers is
disabled.
Since the operations of the bus controller and I/O port are stopped when sleep mode is entered at
the all-module stop state (MSTPCR=H'FFFFFFFF), power consumption can further be reduced.
Note: * Supported only by the H8S/2268 Group.
Rev. 5.00 Sep. 01, 2009 Page 565 of 656
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Section 22 Power-Down Modes
22.7
Watch Mode
22.7.1
Transition to Watch Mode
CPU operation makes a transition to watch mode when the SLEEP instruction is executed in highspeed mode or sub-active mode with SBYCR SSBY=1, LPWRCR DTON = 0, and TCSR_1
(WDT_1) PSS = 1.
In watch mode, the CPU is stopped and peripheral modules other than WDT_1, TMR_4*, and
LCD are also stopped. The contents of the CPU’s internal registers, the data in internal RAM, and
the statuses of the internal peripheral modules (excluding the A/D converter) and I/O ports are
retained. To make a transition to watch mode, bits SCK2 to SCK0 in SCKCR must be set to 0.
Note: * Supported only by the H8S/2268 Group.
22.7.2
Exiting Watch Mode
Watch mode is exited by any interrupt (WOVI1 interrupt, OVI4 to OVI7 interrupts*, NMI pin, or
IRQ0, IRQ1, IRQ3, IRQ4, IRQ5*, or WKP0 to WKP7), or signals at the RES, or STBY pins.
• Exiting Watch Mode by Interrupts
When an interrupt occurs, watch mode is exited and a transition is made to high-speed mode or
medium-speed mode when the LPWRCR LSON bit = 0 or to sub-active mode when the LSON
bit = 1. When a transition is made to high-speed mode, a stable clock is supplied to all LSI
circuits and interrupt exception processing starts after the time set in SBYCR STS2 to STS0
has elapsed. In the case of IRQ0, IRQ1, IRQ3, IRQ4, IRQ5*, and WKP0 to WKP7 interrupts,
no transition is made from watch mode if the corresponding enable bit/pin function switching
bit has been cleared to 0, and, in the case of interrupts from the internal peripheral modules, the
interrupt enable register has been set to disable the reception of that interrupt, or is masked by
the CPU.
See section 22.4.3, Oscillation Settling Time after Clearing Software Standby Mode, for how
to set the oscillation settling time when making a transition from watch mode to high-speed
mode.
• Exiting Watch Mode by RES pins
For exiting watch mode by the RES pins, see section 22.4.2, Clearing Software Standby Mode.
• Exiting Watch Mode by STBY pin
When the STBY pin level is driven low, a transition is made to hardware standby mode.
Note: * Supported only by the H8S/2268 Group.
Rev. 5.00 Sep. 01, 2009 Page 566 of 656
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Section 22 Power-Down Modes
22.8
Sub-Sleep Mode
22.8.1
Transition to Sub-Sleep Mode
When the SLEEP instruction is executed with the SBYCR SSBY bit = 0, LPWRCR LSON bit = 1,
and TCSR_1 (WDT_1) PSS bit = 1, CPU operation shifts to sub-sleep mode.
In sub-sleep mode, the CPU is stopped. Peripheral modules other than TMR_0, TMR_1, TMR_2
to TMR_4*, WDT_0, WDT_1, and LCD are also stopped. The contents of the CPU’s internal
registers, the data in internal RAM, and the statuses of the internal peripheral modules (excluding
the A/D converter) and I/O ports are retained.
Note: * Supported only by the H8S/2268 Group.
22.8.2
Exiting Sub-Sleep Mode
Sub-sleep mode is exited by an interrupt (interrupts from internal peripheral modules, NMI pin, or
IRQ0, IRQ1, IRQ3, IRQ4, IRQ5*, or WKP0 to WKP7), or signals at the RES or STBY pins.
• Exiting Sub-Sleep Mode by Interrupts
When an interrupt occurs, sub-sleep mode is exited and interrupt exception processing starts.
In the case of IRQ0, IRQ1, IRQ3, IRQ4, IRQ5*, and WKP0 to WKP7 interrupts, sub-sleep
mode is not cancelled if the corresponding enable bit/pin function switching bit has been
cleared to 0, and, in the case of interrupts from the internal peripheral modules, the interrupt
enable register has been set to disable the reception of that interrupt, or is masked by the CPU.
• Exiting Sub-Sleep Mode by RES
For exiting sub-sleep mode by the RES pins, see section 22.4.2, Clearing Software Standby
Mode.
• Exiting Sub-Sleep Mode by STBY Pin
When the STBY pin level is driven low, a transition is made to hardware standby mode.
Note: * Supported only by the H8S/2268 Group.
Rev. 5.00 Sep. 01, 2009 Page 567 of 656
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Section 22 Power-Down Modes
22.9
Sub-Active Mode
22.9.1
Transition to Sub-Active Mode
When the SLEEP instruction is executed in high-speed mode with the SBYCR SSBY bit = 1,
LPWRCR DTON bit = 1, LSON bit = 1, and TCSR_1 (WDT_1) PSS bit = 1, CPU operation shifts
to sub-active mode. When an interrupt occurs in watch mode, and if the LSON bit of LPWRCR is
1, a transition is made to sub-active mode. And if an interrupt occurs in sub-sleep mode, a
transition is made to sub-active mode.
In sub-active mode, the CPU operates at low speed on the subclock, and the program is executed
step by step. Peripheral modules other than PBC*, TMR_0, TMR_1, TMR_2 to TMR_4*,
WDT_0, WDT_1, and LCD are also stopped.
When operating the CPU in sub-active mode, the SCKCR SCK2 to SCK0 bits must be set to 0.
Note: * Supported only by the H8S/2268 Group.
22.9.2
Exiting Sub-Active Mode
Sub-active mode is exited by the SLEEP instruction or the RES or STBY pins.
• Exiting Sub-Active Mode by SLEEP Instruction
When the SLEEP instruction is executed with the SBYCR SSBY bit = 1, LPWRCR DTON bit
= 0, and TCSR_1 (WDT_1) PSS bit = 1, the CPU exits sub-active mode and a transition is
made to watch mode. When the SLEEP instruction is executed with the SBYCR SSBY bit = 0,
LPWRCR LSON bit = 1, and TCSR (WDT_1) PSS bit = 1, a transition is made to sub-sleep
mode. Finally, when the SLEEP instruction is executed with the SBYCR SSBY bit = 1,
LPWRCR DTON bit = 1, LSON bit = 0, and TCSR (WDT_1) PSS bit = 1, a direct transition is
made to high-speed mode (SCK0 to SCK2 all 0).
• Exiting Sub-Active Mode by RES Pins
For exiting sub-active mode by the RES pins, see section 22.4.2, Clearing Software Standby
Mode.
• Exiting Sub-Active Mode by STBY Pin
When the STBY pin level is driven low, a transition is made to hardware standby mode.
Rev. 5.00 Sep. 01, 2009 Page 568 of 656
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Section 22 Power-Down Modes
22.10
Direct Transitions
There are three modes, high-speed, medium-speed, and sub-active, in which the CPU executes
programs. When a direct transition is made, there is no interruption of program execution when
shifting between high-speed and sub-active modes. Direct transitions are enabled by setting the
LPWRCR DTON bit to 1, then executing the SLEEP instruction. After a transition, direct
transition interrupt exception processing starts.
22.10.1 Direct Transitions from High-Speed Mode to Sub-Active Mode
Execute the SLEEP instruction in high-speed mode when the SBYCR SSBY bit = 1, LPWRCR
LSON bit = 1, and DTON bit = 1, and TSCR_1 (WDT_1) PSS bit = 1 to make a transition to subactive mode.
22.10.2 Direct Transitions from Sub-Active Mode to High-Speed Mode
Execute the SLEEP instruction in sub-active mode when the SBYCR SSBY bit = 1, LPWRCR
LSON bit = 0, and DTON bit = 1, and TSCR_1 (WDT_1) PSS bit = 1 to make a direct transition
to high-speed mode after the time set in SBYCR STS2 to STS0 has elapsed.
22.11
Usage Notes
22.11.1 I/O Port Status
In software standby mode and watch mode, I/O port states are retained. Therefore, there is no
reduction in current dissipation for the output current when a high-level signal is output.
22.11.2 Current Dissipation during Oscillation Settling Wait Period
Current dissipation increases during the oscillation settling wait period.
22.11.3 DTC Module Stop (Supported Only by the H8S/2268 Group)
Depending on the operating status of the DTC, the MSTPA6 bit may not be set to 1. Setting of the
DTC module stop mode should be carried out only when the respective module is not activated.
For details, refer to section 8, Data Transfer Controller (DTC).
Rev. 5.00 Sep. 01, 2009 Page 569 of 656
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Section 22 Power-Down Modes
22.11.4 On-Chip Peripheral Module Interrupt
• Module stop mode
Relevant interrupt operations cannot be performed in module stop mode. Consequently, if
module stop mode is entered when an interrupt has been requested, it will not be possible to
clear the CPU interrupt source or the DTC* activation source. Interrupts should therefore be
disabled before entering module stop mode.
Note: Supported only by the H8S/2268 Group.
• Subactive mode / Watch mode
On-chip peripheral modules (DTC*, TPU, IIC) that stop operation in subactive mode cannot
clear interrupts in subactive mode. Therefore, if subactive mode is entered when an interrupt is
requested, CPU interrupt factors cannot be cleared.
Interrupts should therefore before executing the SLEEP instruction and entering subactive or
watch mode.
Note: * Supported only by the H8S/2268 Group.
22.11.5 Writing to MSTPCR
MSTPCR should only be written to by the CPU.
22.11.6 Entering Subactive/Watch Mode and DTC Module Stop (Supported Only by
H8S/2268 Group)
To enter subactive or watch mode, set DTC to module stop (write 1 to the MSTPA6 bit) and
reading the MSTPA6 bit as 1 before transiting mode. After transiting from subactive mode to
active mode, clear module stop.
When DTC activation factor occurs in subactive mode, DTC is activated when module stop is
cleared after active mode is entered.
Rev. 5.00 Sep. 01, 2009 Page 570 of 656
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Section 23 Power Supply Circuit
Section 23 Power Supply Circuit
This LSI has an internal power step-down circuit built into it. Using this circuit allows the internal
power supply to be fixed at approximately 3.0 V without relaying on the power supply voltage
connected to the external Vcc terminal. This means that, when used at an external power supply
higher than 3.0 V, the current consumption value can be suppressed to largely the same value as
that when used at approximately 3.0 V. If the external voltage is 3.0 V or less, the internal voltage
will be largely consistent with the external voltage.
23.1
When Internal Power Step-Down Circuit Is Used
As shown in figure 23.1, an external power supply should be connected to the Vcc pin, using the
shortest possible wiring, with a capacitance (H8S/2268 Group: 0.1 μF/0.2 μF and H8S/2264
Group: 0.2 μF) between CVcc and Vss. Adding this external circuit makes the internal step-down
circuit valid. Applying a power supply exceeding the absolute maximum rated value of 4.3 V to
the CVcc terminal can permanently damage the LSI, so the power supply should not be connected
to the CVcc terminal. The external power supply voltage connected to Vcc and the GND potential
connected to Vss serve as the references for the input/output levels of the external circuit. For
example, a “High” port input/output level will be the Vcc reference, and a “Low” level will be the
Vss reference. The analog power supplies of the A/D converter, D/A converter*, and DTMF
generation circuit* do not affect the internal step-down circuit.
Note: * Supported only by the H8S/2268 Group.
Vcc
Vcc 2.7 to 5.5 V
(Vcc = 3.0 to 5.5 V for the F-ZTAT version)
Step-down
voltage circuit
CVcc
Internal
logic
Internal
power
supply
Stabilized capacitance
(H8S/2268 Group: 0.1 µF/0.2 µF and H8S/2264 Group: 0.2 µF)
Vss
Figure 23.1 Power Supply Connections When Internal Power Supply
Step-Down Circuit Is Used
PSCKT20A_000020020700
Rev. 5.00 Sep. 01, 2009 Page 571 of 656
REJ09B0071-0500
Section 23 Power Supply Circuit
Rev. 5.00 Sep. 01, 2009 Page 572 of 656
REJ09B0071-0500
Section 24 List of Registers
Section 24 List of Registers
This section gives information on the on-chip I/O registers and is configured as described below.
1. Register Addresses (by functional module, in address order)
⎯ Descriptions by functional module, in ascending order of addresses
⎯ When registers consist of 16 bits, the addresses of the MSBs are given.
⎯ Data bus width is given.
⎯ The number of access states are given.
2. Register Bits
⎯ Bit configurations of the registers are described in the same order as the Register Addresses
(by functional module, in ascending order of addresses).
⎯ Reserved bits are indicated by ⎯ in the bit name.
⎯ When registers consist of 16 or 32 bits, bits are described from the MSB side.
3. Register States in Each Operating Mode
⎯ Register states are described in the same order as the Register Addresses (by functional
module, in ascending order of addresses).
⎯ The register states described are for the basic operating modes. If there is a specific reset
for an on-chip module, refer to the section on that on-chip module.
Rev. 5.00 Sep. 01, 2009 Page 573 of 656
REJ09B0071-0500
Section 24 List of Registers
24.1
Register Addresses (by Function Module, in Address Order)
The data bus width indicates the numbers of bits by which the register is accessed.
The number of access states indicates the number of states based on the specified reference clock.
Data
Width
Access
State
H'EBC0 to DTC
H'EFBF
DTC
2
16/32*
2
16/32*
1
8
DTC
1
DAR
24
DTC
2
16/32*
2
16/32*
4
DTC transfer count register A* CRA
4
DTC transfer count register B* CRB
16
DTC
1
16
DTC
2
16/32*
2
16/32*
LCD port control register
LPCR
8
H'FC30
LCD
8/16
4
LCD control register
LCR
8
H'FC31
LCD
8/16
4
LCD control register 2
LCR2
8
H'FC32
LCD
8/16
4
LCD RAM
⎯
8
H'FC40 to
H'FC53
LCD
8/16
4
Module stop control register D
4
DTMF control register*
MSTPCRD
8
H'FC60
SYSTEM 8
4
DTCR
8
H'FC68
DTMF
8
4
DTMF load register*
Register Name
DTC mode register A*
4
DTC source address
4
register*
DTC mode register B*
4
DTC destination address
4
register*
4
Abbreviation Bit No.
Address*
MRA
8
SAR
24
MRB
1
Module
1
1
1
DTLR
8
H'FC69
DTMF
8
4
4
TCR_4
8
H'FC70
TMR_4
8/16
4
Timer control register_5*
4
Timer control register_6*
TCR_5
8
H'FC71
TMR_4
8/16
4
TCR_6
8
H'FC72
TMR_4
8/16
4
4
Timer control register_7*
TCR_7
8
H'FC73
TMR_4
8/16
4
Timer counter 4/Timer reload
4
register 4*
TCNT_4(R)/ 8
TLR_4(W)
H'FC74
TMR_4
8/16
4
Timer counter 5/Timer reload
4
register 5*
TCNT_5(R)/ 8
TLR_5(W)
H'FC75
TMR_4
8/16
4
Timer counter 6/Timer reload
4
register 6*
TCNT_6(R)/ 8
TLR_6(W)
H'FC76
TMR_4
8/16
4
Timer counter 7/Timer reload
4
register 7*
TCNT_7(R)/ 8
TLR_7(W)
H'FC77
TMR_4
8/16
4
Timer control register_4*
4
Rev. 5.00 Sep. 01, 2009 Page 574 of 656
REJ09B0071-0500
Section 24 List of Registers
Register Name
Abbreviation Bit No.
Address*
Module
Data
Width
Access
State
Port H data direction register
PHDDR
8
H'FC80
PORT
8
4
Port J data direction register
PJDDR
8
H'FC81
PORT
8
4
1
Port K data direction register
PKDDR
8
H'FC82
PORT
8
4
Port L data direction register
PLDDR
8
H'FC83
PORT
8
4
Port M data direction register* PMDDR
4
Port N data direction register* PNDDR
8
H'FC84
PORT
8
4
8
H'FC85
PORT
8
4
Port H data register
PHDR
8
H'FC88
PORT
8
4
Port J data register
PJDR
8
H'FC89
PORT
8
4
Port K data register
PKDR
8
H'FC8A
PORT
8
4
Port L data register
PLDR
8
H'FC8B
PORT
8
4
4
Port M data register*
4
Port N data register*
PMDR
8
H'FC8C
PORT
8
4
PNDR
8
H'FC8D
PORT
8
4
Port H register
PORTH
8
H'FC90
PORT
8
4
Port J register
PORTJ
8
H'FC91
PORT
8
4
Port K register
PORTK
8
H'FC92
PORT
8
4
Port L register
PORTL
8
H'FC93
PORT
8
4
4
Port M register*
4
Port N register*
PORTM
8
H'FC94
PORT
8
4
PORTN
8
H'FC95
PORT
8
4
Port J pull-up MOS control
register
PJPCR
8
H'FC99
PORT
8
4
Wakeup control register
WPCR
8
H'FC9F
PORT
8
4
Wakeup interrupt request
register
IWPR
8
H'FCA0
INT
8
4
Interrupt enable register
IENR1
8
H'FCA1
INT
8
4
4
D/A data register_0*
DADR_0
8
H'FDAC
D/A
8
2
D/A data register_1*
4
D/A control register*
DADR_1
8
H'FDAD
D/A
8
2
DACR
8
H'FDAE
D/A
8
2
Serial control register X
SCRX
8
H'FDB4
IIC,
FLASH
8
2
DDC switch register
DDCSWR
8
H'FDB5
IIC
8
2
4
Timer control register_2*
TCR_2
8
H'FDC0
TMR_2
8
2
4
4
Rev. 5.00 Sep. 01, 2009 Page 575 of 656
REJ09B0071-0500
Section 24 List of Registers
Register Name
Abbreviation Bit No.
Address*
Module
Data
Width
Access
State
4
Timer control register_3*
TCR_3
8
H'FDC1
TMR_3
8
2
Timer control/status
4
register_2*
TCSR_2
8
H'FDC2
TMR_2
8
2
Timer control/status
4
register_3*
TCSR_3
8
H'FDC3
TMR_3
8
2
4
TCORA_2
8
H'FDC4
TMR_2
8/16
2
4
Time constant register A_3*
TCORA_3
8
H'FDC5
TMR_3
8/16
2
4
Time constant register B_2*
TCORB_2
8
H'FDC6
TMR_2
8/16
2
4
Time constant register B_3*
TCORB_3
8
H'FDC7
TMR_3
8/16
2
Timer counter_2*
4
Timer counter_3*
TCNT_2
8
H'FDC8
TMR_2
8/16
2
TCNT_3
8
H'FDC9
TMR_3
8/16
2
Serial mode register_2
SMR_2
8
H'FDD0
SCI_2
8
2
Bit rate register_2
BRR_2
8
H'FDD1
SCI_2
8
2
Serial control register_2
SCR_2
8
H'FDD2
SCI_2
8
2
Transmit data register_2
TDR_2
8
H'FDD3
SCI_2
8
2
Serial status register_2
SSR_2
8
H'FDD4
SCI_2
8
2
Receive data register_2
RDR_2
8
H'FDD5
SCI_2
8
2
Smart card mode register_2
SCMR_2
8
H'FDD6
SCI_2
8
2
Standby control register
SBYCR
8
H'FDE4
SYSTEM 8
2
System control register
SYSCR
8
H'FDE5
SYSTEM 8
2
System clock control register
SCKCR
8
H'FDE6
SYSTEM 8
2
Mode control register
MDCR
8
H'FDE7
SYSTEM 8
2
Module stop control register A
MSTPCRA
8
H'FDE8
SYSTEM 8
2
Module stop control register B
MSTPCRB
8
H'FDE9
SYSTEM 8
2
Module stop control register C
MSTPCRC
8
H'FDEA
SYSTEM 8
2
Low power control register
LPWRCR
8
H'FDEC
SYSTEM 8
2
Serial expansion mode
register_0
SEMR_0
8
H'FDF8
SCI_0
8
2
4
Break address register A*
4
Break address register B*
BARA
32
H'FE00
PBC
8/16
2
BARB
32
H'FE04
PBC
8/16
2
4
Break control register A*
BCRA
8
H'FE08
PBC
8/16
2
Time constant register A_2*
4
Rev. 5.00 Sep. 01, 2009 Page 576 of 656
REJ09B0071-0500
1
Section 24 List of Registers
Register Name
Abbreviation Bit No.
Address*
Module
Data
Width
Access
State
4
Break control register B*
BCRB
8
H'FE09
PBC
8/16
2
IRQ sense control register H
ISCRH
8
H'FE12
INT
8
2
IRQ sense control register L
ISCRL
8
H'FE13
INT
8
2
IRQ enable register
IER
8
H'FE14
INT
8
2
ISR
8
H'FE15
INT
8
2
DTCER
8
H'FE16 to
H'FE1B,
H'FE1E
DTC
8
2
IRQ status register
DTC enable register*
4
1
DTC vector register*
DTVECR
8
H'FE1F
DTC
8
2
Port 1 data direction register
P1DDR
8
H'FE30
PORT
8
2
Port 3 data direction register
P3DDR
8
H'FE32
PORT
8
2
Port 7 data direction register
P7DDR
8
H'FE36
PORT
8
2
Port F data direction register
PFDDR
8
H'FE3E
PORT
8
2
Port 3 open drain control
register
P3ODR
8
H'FE46
PORT
8
2
Timer start register
TSTR
8
H'FEB0
TPU
8
2
Timer synchro register
TSYR
8
H'FEB1
TPU
8
2
Interrupt priority register A*
4
Interrupt priority register B*
IPRA
8
H'FEC0
INT
8
2
IPRB
8
H'FEC1
INT
8
2
4
Interrupt priority register C*
IPRC
8
H'FEC2
INT
8
2
4
Interrupt priority register D*
IPRD
8
H'FEC3
INT
8
2
4
Interrupt priority register E*
4
Interrupt priority register F*
IPRE
8
H'FEC4
INT
8
2
IPRF
8
H'FEC5
INT
8
2
4
Interrupt priority register G*
IPRG
8
H'FEC6
INT
8
2
Interrupt priority register I*
4
Interrupt priority register J*
IPRI
8
H'FEC8
INT
8
2
IPRJ
8
H'FEC9
INT
8
2
Interrupt priority register K*
IPRK
8
H'FECA
INT
8
2
4
4
4
4
Interrupt priority register L*
4
Interrupt priority register M*
IPRL
8
H'FECB
INT
8
2
IPRM
8
H'FECC
INT
8
2
4
Interrupt priority register O*
IPRO
8
H'FECE
INT
8
2
4
RAM emulation register*
RAMER
8
H'FEDB
FLASH
8
2
4
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REJ09B0071-0500
Section 24 List of Registers
Register Name
Abbreviation Bit No.
Address*
Module
Data
Width
Access
State
Port 1 data register
P1DR
8
H'FF00
PORT
8
2
Port 3 data register
P3DR
8
H'FF02
PORT
8
2
1
Port 7 data register
P7DR
8
H'FF06
PORT
8
2
Port F data register
PFDR
8
H'FF0E
PORT
8
2
TCR_0
8
H'FF10
TPU_0
8
2
TMDR_0
8
H'FF11
TPU_0
8
2
Timer I/O control register H_0* TIORH_0
4
Timer I/O control register L_0* TIORL_0
8
H'FF12
TPU_0
8
2
8
H'FF13
TPU_0
8
2
TIER_0
8
H'FF14
TPU_0
8
2
TSR_0
8
H'FF15
TPU_0
8
2
TCNT_0
16
H'FF16
TPU_0
16
2
Timer general register A_0*
4
Timer general register B_0*
TGRA_0
16
H'FF18
TPU_0
16
2
TGRB_0
16
H'FF1A
TPU_0
16
2
4
Timer general register C_0*
TGRC_0
16
H'FF1C
TPU_0
16
2
4
Timer general register D_0*
TGRD_0
16
H'FF1E
TPU_0
16
2
Timer control register_1
TCR_1
8
H'FF20
TPU_1
8
2
Timer mode register_1
TMDR_1
8
H'FF21
TPU_1
8
2
Timer I/O control register_1
TIOR_1
8
H'FF22
TPU_1
8
2
Timer interrupt enable
register_1
TIER_1
8
H'FF24
TPU_1
8
2
Timer status register_1
TSR_1
8
H'FF25
TPU_1
8
2
Timer counter_1
TCNT_1
16
H'FF26
TPU_1
16
2
Timer general register A_1
TGRA_1
16
H'FF28
TPU_1
16
2
Timer control register_0*
4
Timer mode register_0*
4
4
Timer interrupt enable
4
register_0*
Timer status register_0*
4
Timer counter_0*
4
4
Timer general register B_1
TGRB_1
16
H'FF2A
TPU_1
16
2
Timer control register_2
TCR_2
8
H'FF30
TPU_2
8
2
Timer mode register_2
TMDR_2
8
H'FF31
TPU_2
8
2
Timer I/O control register_2
TIOR_2
8
H'FF32
TPU_2
8
2
Timer interrupt enable
register_2
TIER_2
8
H'FF34
TPU_2
8
2
Timer status register_2
TSR_2
8
H'FF35
TPU_2
8
2
Rev. 5.00 Sep. 01, 2009 Page 578 of 656
REJ09B0071-0500
Section 24 List of Registers
Register Name
Abbreviation Bit No.
Address*
Module
Data
Width
Access
State
Timer counter_2
TCNT_2
16
H'FF36
TPU_2
16
2
Timer general register A_2
TGRA_2
16
H'FF38
TPU_2
16
2
1
Timer general register B_2
TGRB_2
16
H'FF3A
TPU_2
16
2
Timer control register_0
TCR_0
8
H'FF68
TMR_0
8
2
Timer control register_1
TCR_1
8
H'FF69
TMR_1
8
2
Timer control/status register_0 TCSR_0
8
H'FF6A
TMR_0
8
2
Timer control/status register_1 TCSR_1
8
H'FF6B
TMR_1
8
2
Time constant register A_0
TCORA_0
8
H'FF6C
TMR_0
8/16
2
Time constant register A_1
TCORA_1
8
H'FF6D
TMR_1
8/16
2
Time constant register B_0
TCORB_0
8
H'FF6E
TMR_0
8/16
2
Time constant register B_1
TCORB_1
8
H'FF6F
TMR_1
8/16
2
Timer counter_0
TCNT_0
8
H'FF70
TMR_0
8/16
2
Timer counter_1
TCNT_1
8
H'FF71
TMR_1
8/16
2
Timer control/status register_0 TCSR_0
8
H'FF74(W) WDT_0
H'FF74(R)
16
2
Timer counter_0
TCNT_0
8
H'FF74(W) WDT_0
H'FF75(R)
16
2
Reset control/status register
RSTCSR
8
H'FF76(W) WDT_0
H'FF77(R)
16
2
Serial mode register_0
SMR_0
8
SCI_0
8
2
ICCR_0
8
H'FF78*
3
H'FF78*
IIC_0
8
2
8
3
H'FF79*
SCI_0
8
2
8
3
H'FF79*
IIC_0
8
2
2
I C bus control register_0
Bit rate register_0
2
I C bus status register_0
BRR_0
ICSR_0
3
Serial control register_0
SCR_0
8
H'FF7A
SCI_0
8
2
Transmit data register_0
TDR_0
8
H'FF7B
SCI_0
8
2
Serial status register_0
SSR_0
8
H'FF7C
SCI_0
8
2
Receive data register_0
RDR_0
8
H'FF7D
SCI_0
8
2
SCI_0
8
2
IIC_0
8
2
IIC_0
8
2
SCMR_0
8
2
I C bus data register_0/Second ICDR_0/
slave address register_0
SARX_0
8
H'FF7E*
3
H'FF7E*
2
8
H'FF7F
Smart card mode register_0
I C bus mode register_0/Slave ICMR_0/
address register_0
SAR_0
3
Rev. 5.00 Sep. 01, 2009 Page 579 of 656
REJ09B0071-0500
Section 24 List of Registers
Register Name
Abbreviation Bit No.
Address*
Module
Data
Width
Access
State
Serial mode register_1
SMR_1
8
H'FF80*
SCI_1
8
2
8
3
H'FF80*
IIC_1
8
2
SCI_1
8
2
IIC_1
8
2
4
I C bus control register_1*
2
ICCR_1
1
3
BRR_1
8
3
H'FF81*
ICSR_1
8
H'FF81*
Serial control register_1
SCR_1
8
H'FF82
SCI_1
8
2
Transmit data register_1
TDR_1
8
H'FF83
SCI_1
8
2
Serial status register_1
SSR_1
8
H'FF84
SCI_1
8
2
Receive data register_1
RDR_1
8
H'FF85
SCI_1
8
2
Bit rate register_1
I C bus status register_1*
2
4
3
8
3
H'FF86*
SCI_1
8
2
2
8
3
H'FF86*
IIC_1
8
2
I C bus mode register_1/Slave ICMR_1/
4
address register_1*
SAR_1
2
8
H'FF87
IIC_1
8
2
A/D data register AH
ADDRAH
8
H'FF90
A/D
8
2
A/D data register AL
ADDRAL
8
H'FF91
A/D
8
2
A/D data register BH
ADDRBH
8
H'FF92
A/D
8
2
Smart card mode register_1
SCMR_1
I C bus data register_1/Second ICDR_1/
4
slave address register_1*
SARX_1
A/D data register BL
ADDRBL
8
H'FF93
A/D
8
2
A/D data register CH
ADDRCH
8
H'FF94
A/D
8
2
A/D data register CL
ADDRCL
8
H'FF95
A/D
8
2
A/D data register DH
ADDRDH
8
H'FF96
A/D
8
2
A/D data register DL
ADDRDL
8
H'FF97
A/D
8
2
A/D control/status register
ADCSR
8
H'FF98
A/D
8
2
A/D control register
ADCR
8
H'FF99
A/D
8
2
Timer control/status register_1 TCSR_1
8
H'FFA2(W) WDT_1
H'FFA2(R)
16
2
Timer counter_1
TCNT_1
8
H'FFA2(W) WDT_1
H'FFA3(R)
16
2
Flash memory control
4
register 1*
FLMCR1
8
H'FFA8
FLASH
8
2
Flash memory control
4
register 2*
FLMCR2
8
H'FFA9
FLASH
8
2
EBR1
8
H'FFAA
FLASH
8
2
Erase block register 1*
4
Rev. 5.00 Sep. 01, 2009 Page 580 of 656
REJ09B0071-0500
Section 24 List of Registers
Abbreviation Bit No.
Address*
Module
Data
Width
Access
State
EBR2
8
H'FFAB
FLASH
8
2
Flash memory power control
4
register*
FLPWCR
8
H'FFAC
FLASH
8
2
Port 1 register
PORT1
8
H'FFB0
PORT
8
2
Port 3 register
PORT3
8
H'FFB2
PORT
8
2
Port 4 register
PORT4
8
H'FFB3
PORT
8
2
Port 7 register
PORT7
8
H'FFB6
PORT
8
2
Port 9 register
PORT9
8
H'FFB8
PORT
8
2
Port F register
PORTF
8
H'FFBE
PORT
8
2
Register Name
Erase block register 2*
4
1
Notes: 1. Lower 16 bits of the address.
2. Allocated on the on-chip RAM. 32-bit bus when DTC accesses as register information,
and 16-bit in other cases.
4
3. Part of registers SCI_0 and SCI_1 and part of registers IIC_0 and IIC_1* are allocated
to the same address. Use the IICE bit of the serial control register X (SCRX) to select
the register.
4. Supported only by the H8S/2268 Group.
Rev. 5.00 Sep. 01, 2009 Page 581 of 656
REJ09B0071-0500
Section 24 List of Registers
24.2
Register Bits
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
MRA*
SM1
SM0
DM1
DM0
MD1
MD0
DTS
Sz
DTC
CHNE
DISEL
—
—
—
—
—
—
LPCR
DTS1
DTS0
CMX
—
SGS3
SGS2
SGS1
SGS0
LCR
—
PSW
ACT
DISP
CKS3
CKS2
CKS1
CKS0
LCR2
LCDAB
—
HCKS*2
SUPS*2
CDS3
CDS2
CDS1
CDS0
LCD RAM
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
MSTPCRD
MSTPD7
MSTPD6
MSTPD5
MSTPD4
MSTPD3
MSTPD2
MSTPD1
MSTPD0
SYSTEM
DTCR*1
DTEN
—
CLOE
RWOE
CLF1
CLF0
RWF1
RWF0
DTMF
DTLR*1
—
—
DTL5
DTL4
DTL3
DTL2
DTL1
DTL0
TCR_4*1
ARSL
OVF
OVIE
—
—
CKS2
CKS1
CKS0
TCR_5*1
ARSL
OVF
OVIE
—
—
CKS2
CKS1
CKS0
TCR_6*1
ARSL
OVF
OVIE
—
—
CKS2
CKS1
CKS0
TCR_7*
ARSL
OVF
OVIE
—
—
CKS2
CKS1
CKS0
TCNT_4(R)/ Bit7
1
TLR_4(W)*
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
TCNT_5(R)/ Bit7
1
TLR_5(W)*
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
TCNT_6(R)/ Bit7
1
TLR_6(W)*
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
TCNT_7(R)/ Bit7
1
TLR_7(W)*
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
1
1
SAR*
MRB*
1
DAR*
1
CRA*1
CRB*1
1
Rev. 5.00 Sep. 01, 2009 Page 582 of 656
REJ09B0071-0500
LCD
TMR_4
Section 24 List of Registers
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
PHDDR
—
—
—
—
PH3DDR
PH2DDR
PH1DDR
PH0DDR
PORT
PJDDR
PJ7DDR
PJ6DDR
PJ5DDR
PJ4DDR
PJ3DDR
PJ2DDR
PJ1DDR
PJ0DDR
PKDDR
PK7DDR
PK6DDR
PK5DDR
PK4DDR
PK3DDR
PK2DDR
PK1DDR
PK0DDR
PLDDR
PL7DDR
PL6DDR
PL5DDR
PL4DDR
PL3DDR
PL2DDR
PL1DDR
PL0DDR
1
PM7DDR
PM6DDR
PM5DDR
PM4DDR
PM3DDR
PM2DDR
PM1DDR
PM0DDR
1
PNDDR*
PN7DDR
PN6DDR
PN5DDR
PN4DDR
PN3DDR
PN2DDR
PN1DDR
PN0DDR
PHDR
—
—
—
—
PH3DR
PH2DR
PH1DR
PH0DR
PJDR
PJ7DR
PJ6DR
PJ5DR
PJ4DR
PJ3DR
PJ2DR
PJ1DR
PJ0DR
PKDR
PK7DR
PK6DR
PK5DR
PK4DR
PK3DR
PK2DR
PK1DR
PK0DR
PLDR
PL7DR
PL6DR
PL5DR
PL4DR
PL3DR
PL2DR
PL1DR
PL0DR
PMDR*1
PM7DR
PM6DR
PM5DR
PM4DR
PM3DR
PM2DR
PM1DR
PM0DR
PNDR*1
PN7DR
PN6DR
PN5DR
PN4DR
PN3DR
PN2DR
PN1DR
PN0DR
PORTH
PH7
—
—
—
PH3
PH2
PH1
PH0
PORTJ
PJ7
PJ6
PJ5
PJ4
PJ3
PJ2
PJ1
PJ0
PORTK
PK7
PK6
PK5
PK4
PK3
PK2
PK1
PK0
PORTL
PL7
PL6
PL5
PL4
PL3
PL2
PL1
PL0
PORTM*1
PM7
PM6
PM5
PM4
PM3
PM2
PM1
PM0
PORTN*1
PN7
PN6
PN5
PN4
PN3
PN2
PN1
PN0
PJPCR
PJ7PCR
PJ6PCR
PJ5PCR
PJ4PCR
PJ3PCR
PJ2PCR
PJ1PCR
PJ0PCR
WPCR
WPC7
WPC6
WPC5
WPC4
WPC3
WPC2
WPC1
WPC0
IWPR
IWPF7
IWPF6
IWPF5
IWPF4
IWPF3
IWPF2
IWPF1
IWPF0
IENWP
—
—
—
—
—
—
—
PMDDR*
IENR1
DADR_0*
1
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
DADR_1*1
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
DACR*1
DAOE1
DAOE0
DAE
—
—
—
—
—
—
IICX1*2
IICE
FLSHE*1
—
—
—
SCRX
IICX0
INT
D/A
IIC,
FLASH
DDCSWR
—
—
—
—
CLR3
CLR2
CLR1
CLR0
IIC
TCR_2*
1
CMIEB
CMIEA
OVIE
CCLR1
CCLR0
CKS2
CKS1
CKS0
TMR_2
TCR_3*
1
CMIEB
CMIEA
OVIE
CCLR1
CCLR0
CKS2
CKS1
CKS0
TMR_3
CMFB
CMFA
OVF
—
OS3
OS2
OS1
OS0
TMR_2
TCSR_2*1
Rev. 5.00 Sep. 01, 2009 Page 583 of 656
REJ09B0071-0500
Section 24 List of Registers
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
TCSR_3*1
CMFB
CMFA
OVF
—
OS3
OS2
OS1
OS0
TMR_3
1
TCORA_2*
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
TMR_2
1
TCORA_3*
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
TMR_3
1
TCORB_2*
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
TMR_2
TCORB_3*
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
TMR_3
TCNT_2*
1
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
TMR_2
TCNT_3*
1
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
TMR_3
SMR_2
C/A
CHR
PE
O/E
STOP
MP
CKS1
CKS0
SCI_2
SMR_2
GM
BLK
PE
O/E
BCP1
BCP0
CKS1
CKS0
BRR_2
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
SCR_2
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
TDR_2
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
SSR_2
TDRE
RDRF
ORER
FER
PER
TEND
MPB
MPBT
SSR_2
TDRE
RDRF
ORER
ERS
PER
TEND
MPB
MPBT
RDR_2
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
SCMR_2
—
—
—
—
SDIR
SINV
—
SMIF
SBYCR
SSBY
STS2
STS1
STS0
—
—
—
—
SYSCR
—
—
INTM1
INTM0
NMIEG
—
—
—
1
SYSTEM
SCKCR
—
—
—
—
—
SCK2
SCK1
SCK0
MDCR
—
—
—
—
—
MDS2
MDS1
—
MSTPCRA
MSTPA7
MSTPA6
MSTPA5
MSTPA4
MSTPA3
MSTPA2
MSTPA1
MSTPA0
MSTPCRB
MSTPB7
MSTPB6
MSTPB5
MSTPB4
MSTPB3
MSTPB2
MSTPB1
MSTPB0
MSTPCRC
MSTPC7
MSTPC6
MSTPC5
MSTPC4
MSTPC3
MSTPC2
MSTPC1
MSTPC0
LPWRCR
DTON
LSON
NESEL
SUBSTP
RFCUT
—
STC1
STC0
SEMR0
—
—
—
—
ABCS
ACS2
ACS1
ACS0
SCI_0
BARA*1
—
—
—
—
—
—
—
—
PBC
BAA23
BAA22
BAA21
BAA20
BAA19
BAA18
BAA17
BAA16
BAA15
BAA14
BAA13
BAA12
BAA11
BAA10
BAA9
BAA8
BAA7
BAA6
BAA5
BAA4
BAA3
BAA2
BAA1
BAA0
Rev. 5.00 Sep. 01, 2009 Page 584 of 656
REJ09B0071-0500
Section 24 List of Registers
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
BARB*1
—
—
—
—
—
—
—
—
PBC
BAB23
BAB22
BAB21
BAB20
BAB19
BAB18
BAB17
BAB16
BAB15
BAB14
BAB13
BAB12
BAB11
BAB10
BAB9
BAB8
BAB7
BAB6
BAB5
BAB4
BAB3
BAB2
BAB1
BAB0
BCRA*
1
CMFA
CDA
BAMRA2
BAMRA1
BAMRA0
CSELA1
CSELA0
BIEA
BCRB*
1
CMFB
CDB
BAMRB2
BAMRB1
BAMRB0
CSELB0
BIEB
CSELB1
ISCRH
—
—
—
—
IRQ5SCB* IRQ5SCA* IRQ4SCB
IRQ4SCA
ISCRL
IRQ3SCB
IRQ3SCA
—
—
IRQ1SCB
IRQ1SCA
IRQ0SCB
IRQ0SCA
—
2
IRQ5E*
IRQ4E
IRQ3E
—
IRQ1E
IRQ0E
—
2
IRQ5F*
IRQ4F
IRQ3F
—
IRQ1F
IRQ0F
IER
—
2
2
ISR
—
DTCER*1
DTCE7
DTCE6
DTCE5
DTCE4
DTCE3
DTCE2
DTCE1
DTCE0
DTVECR*1
SWDTE
DTVEC6
DTVEC5
DTVEC4
DTVEC3
DTVEC2
DTVEC1
DTVEC0
P1DDR
P17DDR
P16DDR
P15DDR
P14DDR
P13DDR
P12DDR
P11DDR
P10DDR
P3DDR
—
—
P35DDR
P34DDR
P33DDR
P32DDR
P31DDR
P30DDR
P7DDR
P77DDR
P76DDR
P75DDR
P74DDR
P73DDR
P72DDR
P71DDR
P70DDR
PFDDR
—
—
—
—
PF3DDR
—
—
—
P3ODR
—
—
P35ODR
P34ODR
P33ODR
P32ODR
P31ODR
P30ODR
TSTR
—
—
—
—
—
CST2
CST1
CST0*2
TSYR
—
—
—
—
—
SYNC2
SYNC1
SYNC0*2
IPRA*1
—
IPR6
IPR5
IPR4
—
IPR2
IPR1
IPR0
IPRB*
—
IPR6
IPR5
IPR4
—
IPR2
IPR1
IPR0
IPRC*
—
—
—
—
—
IPR2
IPR1
IPR0
IPRD*
—
IPR6
IPR5
IPR4
—
—
—
—
IPRE*1
—
IPR6
IPR5
IPR4
—
IPR2
IPR1
IPR0
IPRF*1
—
IPR6
IPR5
IPR4
—
IPR2
IPR1
IPR0
IPRG*1
—
IPR6
IPR5
IPR4
—
—
—
—
IPRI*1
—
IPR6
IPR5
IPR4
—
IPR2
IPR1
IPR0
IPRJ*1
—
—
—
—
—
IPR2
IPR1
IPR0
1
IPRK*
—
IPR6
IPR5
IPR4
—
IPR2
IPR1
IPR0
IPRL*
1
—
IPR6
IPR5
IPR4
—
IPR2
IPR1
IPR0
1
1
1
INT
DTC
PORT
TPU
INT
Rev. 5.00 Sep. 01, 2009 Page 585 of 656
REJ09B0071-0500
Section 24 List of Registers
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
IPRM*1
—
IPR6
IPR5
IPR4
—
IPR2
IPR1
IPR0
INT
1
IPRO*
—
IPR6
IPR5
IPR4
—
—
—
—
1
RAMER*
—
—
—
—
RAMS
RAM2
RAM1
RAM0
FLASH
P1DR
P17DR
P16DR
P15DR
P14DR
P13DR
P12DR
P11DR
P10DR
PORT
P3DR
—
—
P35DR
P34DR
P33DR
P32DR
P31DR
P30DR
P7DR
P77DR
P76DR
P75DR
P74DR
P73DR
P72DR
P71DR
P70DR
PFDR
—
—
—
—
PF3DR
—
—
—
1
TCR_0*
CCLR2
CCLR1
CCLR0
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
1
TMDR_0*
—
—
BFB
BFA
MD3
MD2
MD1
MD0
1
TIORH_0*
IOA3
IOA2
IOA1
IOA0
IOB3
IOB2
IOB1
IOB0
TIORL_0*1
IOD3
IOD2
IOD1
IOD0
IOC3
IOC2
IOC1
IOC0
TIER_0*1
TTGE
—
—
TCIEV
TGIED
TGIEC
TGIEB
TGIEA
—
—
—
TCFV
TGFD
TGFC
TGFB
TGFA
Bit15
Bit14
Bit13
Bit12
Bit11
Bit10
Bit9
Bit8
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Bit15
Bit14
Bit13
Bit12
Bit11
Bit10
Bit9
Bit8
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Bit15
Bit14
Bit13
Bit12
Bit11
Bit10
Bit9
Bit8
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Bit15
Bit14
Bit13
Bit12
Bit11
Bit10
Bit9
Bit8
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Bit15
Bit14
Bit13
Bit12
Bit11
Bit10
Bit9
Bit8
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
TCR_1
—
CCLR1
CCLR0
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
TMDR_1
—
—
—
—
MD3
MD2
MD1
MD0
TIOR_1
IOB3
IOB2
IOB1
IOB0
IOA3
IOA2
IOA1
IOA0
TSR_0*
1
TCNT_0*
1
TGRA_0*1
TGRB_0*1
TGRC_0*1
TGRD_0*
1
TIER_1
TTGE
—
TCIEU*2
TCIEV
—
—
TGIEB
TGIEA
TSR_1
TCFD*2
—
TCFU*2
TCFV
—
—
TGFB
TGFA
TCNT_1
Bit15
Bit14
Bit13
Bit12
Bit11
Bit10
Bit9
Bit8
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Rev. 5.00 Sep. 01, 2009 Page 586 of 656
REJ09B0071-0500
TPU_0
TPU_1
Section 24 List of Registers
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
TGRA_1
Bit15
Bit14
Bit13
Bit12
Bit11
Bit10
Bit9
Bit8
TPU_1
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
TGRB_1
Bit15
Bit14
Bit13
Bit12
Bit11
Bit10
Bit9
Bit8
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
TCR_2
—
CCLR1
CCLR0
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
TMDR_2
—
—
—
—
MD3
MD2
MD1
MD0
TIOR_2
IOB3
IOB2
IOB1
IOB0
IOA3
IOA2
IOA1
IOA0
TPU_2
TIER_2
TTGE
—
2
TCIEU*
TCIEV
—
—
TGIEB
TGIEA
TSR_2
2
TCFD*
—
2
TCFU*
TCFV
—
—
TGFB
TGFA
TCNT_2
Bit15
Bit14
Bit13
Bit12
Bit11
Bit10
Bit9
Bit8
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Bit15
Bit14
Bit13
Bit12
Bit11
Bit10
Bit9
Bit8
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Bit15
Bit14
Bit13
Bit12
Bit11
Bit10
Bit9
Bit8
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
TCR_0
CMIEB
CMIEA
OVIE
CCLR1
CCLR0
CKS2
CKS1
CKS0
TMR_0
TCR_1
CMIEB
CMIEA
OVIE
CCLR1
CCLR0
CKS2
CKS1
CKS0
TMR_1
TCSR_0
CMFB
CMFA
OVF
ADTE
OS3
OS2
OS1
OS0
TMR_0
TGRA_2
TGRB_2
TCSR_1
CMFB
CMFA
OVF
—
OS3
OS2
OS1
OS0
TMR_1
TCORA_0
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
TMR_0
TCORA_1
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
TMR_1
TCORB_0
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
TMR_0
TCORB_1
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
TMR_1
TCNT_0
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
TMR_0
TCNT_1
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
TMR_1
TCSR_0
OVF
WT/IT
TME
—
—
CKS2
CKS1
CKS0
WDT_0
TCNT_0
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
RSTCSR
WOVF
RSTE
—
—
—
—
—
—
SMR_0
C/A
CHR
PE
O/E
STOP
MP
CKS1
CKS0
SMR_0
GM
BLK
PE
O/E
BCP1
BCP0
CKS1
CKS0
SCI_0
Rev. 5.00 Sep. 01, 2009 Page 587 of 656
REJ09B0071-0500
Section 24 List of Registers
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
ICCR_0
ICE
IEIC
MST
TRS
ACKE
BBSY
IRIC
SCP
IIC_0
BRR_0
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
SCI_0
ICSR_0
ESTP
STOP
IRTR
AASX
AL
AAS
ADZ
ACKB
IIC_0
SCR_0
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
SCI_0
TDR_0
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
SSR_0
TDRE
RDRF
ORER
FER
PER
TEND
MPB
MPBT
SSR_0
TDRE
RDRF
ORER
ERS
PER
TEND
MPB
MPBT
RDR_0
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
SCMR_0
—
—
—
—
SDIR
SINV
—
SMIF
ICDR_0/
ICDR7/
ICDR6/
ICDR5/
ICDR4/
ICDR3/
ICDR2/
ICDR1/
ICDR0/
SARX_0
SVAX6
SVAX5
SVAX4
SVAX3
SVAX2
SVAX1
SVAX0
FSX
ICMR_0/
MLS/
WAIT/
CKS2/
CKS1/
CKS0/
BC2/
BC1/
BC0/
SAR_0
SVA6
SVA5
SVA4
SVA3
SVA2
SVA1
SVA0
FS
SMR_1
C/A
CHR
PE
O/E
STOP
MP
CKS1
CKS0
SMR_1
GM
BLK
PE
O/E
BCP1
BCP0
CKS1
CKS0
ICCR_1*1
ICE
IEIC
MST
TRS
ACKE
BBSY
IRIC
SCP
IIC_1
IIC_0
SCI_1
BRR_1
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
SCI_1
ICSR_1*1
ESTP
STOP
IRTR
AASX
AL
AAS
ADZ
ACKB
IIC_1
SCR_1
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
SCI_1
TDR_1
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
SSR_1
TDRE
RDRF
ORER
FER
PER
TEND
MPB
MPBT
SSR_1
TDRE
RDRF
ORER
ERS
PER
TEND
MPB
MPBT
RDR_1
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
SCMR_1
—
—
—
—
SDIR
SINV
—
SMIF
ICDR_1/
1
SARX_1*
ICDR7/
ICDR6/
ICDR5/
ICDR4/
ICDR3/
ICDR2/
ICDR1/
ICDR0/FSX IIC_1
SVAX6
SVAX5
SVAX4
SVAX3
SVAX2
SVAX1
SVAX0
ICMR_1/
1
SAR_1*
MLS/
WAIT/
CKS2/
CKS1/
CKS0/
BC2/
BC1/
SVA6
SVA5
SVA4
SVA3
SVA2
SVA1
SVA0
ADDRAH
AD9
AD8
AD7
AD6
AD5
AD4
AD3
AD2
ADDRAL
AD1
AD0
—
—
—
—
—
—
BC0/FS
ADDRBH
AD9
AD8
AD7
AD6
AD5
AD4
AD3
AD2
ADDRBL
AD1
AD0
—
—
—
—
—
—
Rev. 5.00 Sep. 01, 2009 Page 588 of 656
REJ09B0071-0500
A/D
Section 24 List of Registers
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
ADDRCH
AD9
AD8
AD7
AD6
AD5
AD4
AD3
AD2
A/D
ADDRCL
AD1
AD0
—
—
—
—
—
—
ADDRDH
AD9
AD8
AD7
AD6
AD5
AD4
AD3
AD2
ADDRDL
AD1
AD0
—
—
—
—
—
—
ADCSR
ADF
ADIE
ADST
SCAN
CH3
CH2
CH1
CH0
ADCR
TRGS1
TRGS0
—
—
CKS1
CKS0
—
—
TCSR_1
OVF
WT/IT
TME
PSS
RST/NMI
CKS2
CKS1
CKS0
TCNT_1
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
1
FLMCR1*
FWE
SWE1
ESU1
PSU1
EV1
PV1
E1
P1
1
FLMCR2*
FLER
—
—
—
—
—
—
—
EBR1*1
EB7
EB6
EB5
EB4
EB3
EB2
EB1
EB0
EBR2*1
—
—
—
—
EB11
EB10
EB9
EB8
PDWND
—
—
—
—
—
—
—
PORT1
P17
P16
P15
P14
P13
P12
P11
P10
PORT3
—
—
P35
P34
P33
P32
P31
P30
PORT4
P47
P46
P45
P44
P43
P42
P41
P40
PORT7
P77
P76
P75
P74
P73
P72
P71
P70
PORT9
P97
P96
—
—
—
—
—
—
PORTF
—
—
—
—
PF3
—
—
—
FLPWCR*
1
WDT_1
FLASH
PORT
Notes: 1. Supported only by the H8S/2268 Group.
2. Reserved in the H8S/2264 Group.
Rev. 5.00 Sep. 01, 2009 Page 589 of 656
REJ09B0071-0500
Section 24 List of Registers
24.3
Register States in Each Operating Mode
Register
Name
Reset
High- Mediumspeed speed
Sleep
Module
Stop
Watch
Subactive
Subsleep
Software Hardware
Standby Standby Module
MRA*
—
—
—
—
—
—
—
—
—
—
SAR*
—
—
—
—
—
—
—
—
—
—
MRB*
—
—
—
—
—
—
—
—
—
—
DAR*
—
—
—
—
—
—
—
—
—
—
CRA*
—
—
—
—
—
—
—
—
—
—
CRB*
—
—
—
—
—
—
—
—
—
—
LPCR
Initialized —
—
—
—
—
—
—
—
Initialized LCD
LCR
Initialized —
—
—
—
—
—
—
—
Initialized
LCR2
Initialized —
—
—
—
—
—
—
—
Initialized
LCD RAM
—
—
—
—
—
—
—
—
—
—
MSTPCRD Initialized —
—
—
—
—
—
—
—
Initialized SYSTEM
DTCR*
Initialized —
—
—
—
—
—
—
—
Initialized DTMF
DTLR*
Initialized —
—
—
—
—
—
—
—
Initialized
TCR_4*
Initialized —
—
—
—
—
—
—
—
Initialized TMR_4
TCR_5*
Initialized —
—
—
—
—
—
—
—
Initialized
TCR_6*
Initialized —
—
—
—
—
—
—
—
Initialized
TCR_7*
Initialized —
—
—
—
—
—
—
—
Initialized
TCNT_4/
TLR_4*
Initialized —
—
—
—
—
—
—
—
Initialized
TCNT_5/
TLR_5*
Initialized —
—
—
—
—
—
—
—
Initialized
TCNT_6/
TLR_6*
Initialized —
—
—
—
—
—
—
—
Initialized
TCNT_7/
TLR_7*
Initialized —
—
—
—
—
—
—
—
Initialized
PHDDR
Initialized —
—
—
—
—
—
—
—
Initialized PORT
PJDDR
Initialized —
—
—
—
—
—
—
—
Initialized
PKDDR
Initialized —
—
—
—
—
—
—
—
Initialized
PLDDR
Initialized —
—
—
—
—
—
—
—
Initialized
PMDDR*
Initialized —
—
—
—
—
—
—
—
Initialized
Rev. 5.00 Sep. 01, 2009 Page 590 of 656
REJ09B0071-0500
DTC
Section 24 List of Registers
Register
Name
Reset
High- Mediumspeed speed
Sleep
PNDDR*
Initialized —
—
PHDR
Initialized —
—
Module
Stop
Watch
Subactive
Subsleep
Software Hardware
Standby Standby Module
—
—
—
—
—
—
Initialized PORT
—
—
—
—
—
—
Initialized
PJDR
Initialized —
—
—
—
—
—
—
—
Initialized
PKDR
Initialized —
—
—
—
—
—
—
—
Initialized
PLDR
Initialized —
—
—
—
—
—
—
—
Initialized
PMDR*
Initialized —
—
—
—
—
—
—
—
Initialized
PNDR*
Initialized —
—
—
—
—
—
—
—
Initialized
PORTH
Initialized —
—
—
—
—
—
—
—
Initialized
PORTJ
Initialized —
—
—
—
—
—
—
—
Initialized
PORTK
Initialized —
—
—
—
—
—
—
—
Initialized
PORTL
Initialized —
—
—
—
—
—
—
—
Initialized
PORTM*
Initialized —
—
—
—
—
—
—
—
Initialized
PORTN*
Initialized —
—
—
—
—
—
—
—
Initialized
PJPCR
Initialized —
—
—
—
—
—
—
—
Initialized
WPCR
Initialized —
—
—
—
—
—
—
—
Initialized
IWPR
Initialized —
—
—
—
—
—
—
—
Initialized INT
IENR1
Initialized —
—
—
—
—
—
—
—
Initialized
DADR_0*
Initialized —
—
—
—
—
—
—
—
Initialized D/A
DADR_1*
Initialized —
—
—
—
—
—
—
—
Initialized
DACR
Initialized —
—
—
—
—
—
—
—
Initialized
SCRX
Initialized —
—
—
—
—
—
—
—
Initialized IIC,
FLASH
DDCSWR
Initialized —
—
—
—
—
—
—
—
Initialized IIC
TCR_2*
Initialized —
—
—
—
—
—
—
—
Initialized TMR_2
TCR_3*
Initialized —
—
—
—
—
—
—
—
Initialized TMR_3
TCSR_2*
Initialized —
—
—
—
—
—
—
—
Initialized TMR_2
TCSR_3*
Initialized —
—
—
—
—
—
—
—
Initialized TMR_3
TCORA_2* Initialized —
—
—
—
—
—
—
—
Initialized TMR_2
TCORA_3* Initialized —
—
—
—
—
—
—
—
Initialized TMR_3
TCORB_2* Initialized —
—
—
—
—
—
—
—
Initialized TMR_2
TCORB_3* Initialized —
—
—
—
—
—
—
—
Initialized TMR_3
Rev. 5.00 Sep. 01, 2009 Page 591 of 656
REJ09B0071-0500
Section 24 List of Registers
Register
Name
Reset
High- Mediumspeed speed
Sleep
Module
Stop
Watch
Subactive
Subsleep
Software Hardware
Standby Standby Module
TCNT_2*
Initialized —
—
TCNT_3*
—
—
—
—
—
—
Initialized TMR_2
Initialized —
—
—
—
—
—
—
—
Initialized TMR_3
SMR_2
BRR_2
Initialized —
—
—
—
—
—
—
—
Initialized SCI_2
Initialized —
—
—
—
—
—
—
—
Initialized
SCR_2
Initialized —
—
—
—
—
—
—
—
Initialized
TDR_2
Initialized —
—
—
Initialized Initialized Initialized Initialized Initialized Initialized
SSR_2
Initialized —
—
—
Initialized Initialized Initialized Initialized Initialized Initialized
RDR_2
Initialized —
—
—
Initialized Initialized Initialized Initialized Initialized Initialized
SCMR_2
Initialized —
—
—
—
—
—
—
—
Initialized
SBYCR
Initialized —
—
—
—
—
—
—
—
Initialized SYSTEM
SYSCR
Initialized —
—
—
—
—
—
—
—
Initialized
SCKCR
Initialized —
—
—
—
—
—
—
—
Initialized
MDCR
Initialized —
—
—
—
—
—
—
—
Initialized
MSTPCRA Initialized —
—
—
—
—
—
—
—
Initialized
MSTPCRB Initialized —
—
—
—
—
—
—
—
Initialized
MSTPCRC Initialized —
—
—
—
—
—
—
—
Initialized
LPWRCR
Initialized —
—
—
—
—
—
—
—
Initialized
SEMR_0
Initialized —
—
—
—
—
—
—
—
Initialized SCI_0
BARA*
Initialized —
—
—
—
—
—
—
—
Initialized PBC
BARB*
Initialized —
—
—
—
—
—
—
—
Initialized
BCRA*
Initialized —
—
—
—
—
—
—
—
Initialized
BCRB*
Initialized —
—
—
—
—
—
—
—
Initialized
ISCRH
Initialized —
—
—
—
—
—
—
—
Initialized INT
ISCRL
Initialized —
—
—
—
—
—
—
—
Initialized
IER
Initialized —
—
—
—
—
—
—
—
Initialized
ISR
Initialized —
—
—
—
—
—
—
—
Initialized
DTCER*
Initialized —
—
—
—
—
—
—
—
Initialized DTC
DTVECR* Initialized —
—
—
—
—
—
—
—
Initialized
P1DDR
Initialized —
—
—
—
—
—
—
—
Initialized PORT
P3DDR
Initialized —
—
—
—
—
—
—
—
Initialized
P7DDR
Initialized —
—
—
—
—
—
—
—
Initialized
Rev. 5.00 Sep. 01, 2009 Page 592 of 656
REJ09B0071-0500
Section 24 List of Registers
Register
Name
Reset
High- Mediumspeed speed
Sleep
PFDDR
Initialized —
—
P3ODR
Initialized —
—
Module
Stop
Watch
Subactive
Subsleep
Software Hardware
Standby Standby Module
—
—
—
—
—
—
Initialized PORT
—
—
—
—
—
—
Initialized
TSTR
Initialized —
—
—
—
—
—
—
—
Initialized TPU
TSYR
Initialized —
—
—
—
—
—
—
—
Initialized
IPRA*
Initialized —
—
—
—
—
—
—
—
Initialized INT
IPRB*
Initialized —
—
—
—
—
—
—
—
Initialized
IPRC*
Initialized —
—
—
—
—
—
—
—
Initialized
IPRD*
Initialized —
—
—
—
—
—
—
—
Initialized
IPRE*
Initialized —
—
—
—
—
—
—
—
Initialized
IPRF*
Initialized —
—
—
—
—
—
—
—
Initialized
IPRG*
Initialized —
—
—
—
—
—
—
—
Initialized
IPRI*
Initialized —
—
—
—
—
—
—
—
Initialized
IPRJ*
Initialized —
—
—
—
—
—
—
—
Initialized
IPRK*
Initialized —
—
—
—
—
—
—
—
Initialized
IPRL*
Initialized —
—
—
—
—
—
—
—
Initialized
IPRM*
Initialized —
—
—
—
—
—
—
—
Initialized
IPRO*
Initialized —
—
—
—
—
—
—
—
Initialized
RAMER*
Initialized —
—
—
—
—
—
—
—
Initialized FLASH
P1DR
Initialized —
—
—
—
—
—
—
—
Initialized PORT
P3DR
Initialized —
—
—
—
—
—
—
—
Initialized
P7DR
Initialized —
—
—
—
—
—
—
—
Initialized
PFDR
Initialized —
—
—
—
—
—
—
—
Initialized
TCR_0*
Initialized —
—
—
—
—
—
—
—
Initialized TPU_0
TMDR_0*
Initialized —
—
—
—
—
—
—
—
Initialized
TIORH_0* Initialized —
—
—
—
—
—
—
—
Initialized
TIORL_0*
Initialized —
—
—
—
—
—
—
—
Initialized
TIER_0*
Initialized —
—
—
—
—
—
—
—
Initialized
TSR_0*
Initialized —
—
—
—
—
—
—
—
Initialized
TCNT_0*
Initialized —
—
—
—
—
—
—
—
Initialized
TGRA_0*
Initialized —
—
—
—
—
—
—
—
Initialized
TGRB_0*
Initialized —
—
—
—
—
—
—
—
Initialized
Rev. 5.00 Sep. 01, 2009 Page 593 of 656
REJ09B0071-0500
Section 24 List of Registers
Register
Name
Reset
High- Mediumspeed speed
Sleep
Module
Stop
Watch
Subactive
Subsleep
Software Hardware
Standby Standby Module
TGRC_0*
Initialized —
—
TGRD_0*
—
—
—
—
—
—
Initialized TPU_0
Initialized —
—
—
—
—
—
—
—
Initialized
TCR_1
TMDR_1
Initialized —
—
—
—
—
—
—
—
Initialized TPU_1
Initialized —
—
—
—
—
—
—
—
Initialized
TIOR_1
Initialized —
—
—
—
—
—
—
—
Initialized
TIER_1
Initialized —
—
—
—
—
—
—
—
Initialized
TSR_1
Initialized —
—
—
—
—
—
—
—
Initialized
TCNT_1
Initialized —
—
—
—
—
—
—
—
Initialized
TGRA_1
Initialized —
—
—
—
—
—
—
—
Initialized
TGRB_1
Initialized —
—
—
—
—
—
—
—
Initialized
TCR_2
Initialized —
—
—
—
—
—
—
—
Initialized TPU_2
TMDR_2
Initialized —
—
—
—
—
—
—
—
Initialized
TIOR_2
Initialized —
—
—
—
—
—
—
—
Initialized
TIER_2
Initialized —
—
—
—
—
—
—
—
Initialized
TSR_2
Initialized —
—
—
—
—
—
—
—
Initialized
TCNT_2
Initialized —
—
—
—
—
—
—
—
Initialized
TGRA_2
Initialized —
—
—
—
—
—
—
—
Initialized
TGRB_2
Initialized —
—
—
—
—
—
—
—
Initialized
TCR_0
Initialized —
—
—
—
—
—
—
—
Initialized TMR_0
TCR_1
Initialized —
—
—
—
—
—
—
—
Initialized TMR_1
TCSR_0
Initialized —
—
—
—
—
—
—
—
Initialized TMR_0
TCSR_1
Initialized —
—
—
—
—
—
—
—
Initialized TMR_1
TCORA_0 Initialized —
—
—
—
—
—
—
—
Initialized TMR_0
TCORA_1 Initialized —
—
—
—
—
—
—
—
Initialized TMR_1
TCORB_0 Initialized —
—
—
—
—
—
—
—
Initialized TMR_0
TCORB_1 Initialized —
—
—
—
—
—
—
—
Initialized TMR_1
TCNT_0
Initialized —
—
—
—
—
—
—
—
Initialized TMR_0
TCNT_1
Initialized —
—
—
—
—
—
—
—
Initialized TMR_1
TCSR_0
Initialized —
—
—
—
—
—
—
—
Initialized WDT_0
TCNT_0
Initialized —
—
—
—
—
—
—
—
Initialized
RSTCSR
Initialized —
—
—
—
—
—
—
—
Initialized
Rev. 5.00 Sep. 01, 2009 Page 594 of 656
REJ09B0071-0500
Section 24 List of Registers
Register
Name
Reset
High- Mediumspeed speed
Sleep
Module
Stop
Watch
Subactive
Subsleep
Software Hardware
Standby Standby Module
SMR_0
Initialized —
—
—
—
—
—
—
—
Initialized SCI_0
ICCR_0
Initialized —
—
—
—
—
—
—
—
Initialized IIC_0
BRR_0
ICSR_0
Initialized —
—
—
—
—
—
—
—
Initialized SCI_0
Initialized —
—
—
—
—
—
—
—
Initialized IIC_0
SCR_0
Initialized —
—
—
—
—
—
—
—
Initialized SCI_0
TDR_0
Initialized −
−
−
Initialized Initialized Initialized Initialized Initialized Initialized
SSR_0
Initialized −
−
−
Initialized Initialized Initialized Initialized Initialized Initialized
RDR_0
Initialized −
−
−
Initialized Initialized Initialized Initialized Initialized Initialized
SCMR_0
Initialized —
—
—
—
—
—
—
—
Initialized
ICDR_0/
Initialized —
—
—
—
—
—
—
—
Initialized IIC_0
Initialized —
—
—
—
—
—
—
—
Initialized
SMR_1
Initialized —
—
—
—
—
—
—
—
Initialized SCI_1
ICCR_1*
Initialized —
—
—
—
—
—
—
—
Initialized IIC_1
BRR_1
Initialized —
—
—
—
—
—
—
—
Initialized SCI_1
ICSR_1*
Initialized —
—
—
—
—
—
—
—
Initialized IIC_1
SCR_1
Initialized —
—
—
—
—
—
—
—
Initialized SCI_1
TDR_1
Initialized —
—
—
Initialized Initialized Initialized Initialized Initialized Initialized
SSR_1
Initialized —
—
—
Initialized Initialized Initialized Initialized Initialized Initialized
RDR_1
Initialized —
—
—
Initialized Initialized Initialized Initialized Initialized Initialized
SCMR_1
Initialized —
—
—
—
—
—
—
—
Initialized
ICDR_1/
SARX_1*
Initialized —
—
—
—
—
—
—
—
Initialized IIC_1
ICMR_1/
SAR_1*
Initialized —
—
—
—
—
—
—
—
Initialized
ADDRAH
Initialized —
—
—
Initialized Initialized Initialized Initialized Initialized Initialized A/D
ADDRAL
Initialized —
—
—
Initialized Initialized Initialized Initialized Initialized Initialized
ADDRBH
Initialized —
—
—
Initialized Initialized Initialized Initialized Initialized Initialized
ADDRBL
Initialized —
—
—
Initialized Initialized Initialized Initialized Initialized Initialized
ADDRCH
Initialized —
—
—
Initialized Initialized Initialized Initialized Initialized Initialized
ADDRCL
Initialized —
—
—
Initialized Initialized Initialized Initialized Initialized Initialized
SARX_0
ICMR_0/
SAR_0
Rev. 5.00 Sep. 01, 2009 Page 595 of 656
REJ09B0071-0500
Section 24 List of Registers
Register
Name
Reset
High- Mediumspeed speed
Sleep
Module
Stop
ADDRDH
Initialized —
—
—
Initialized Initialized Initialized Initialized Initialized Initialized A/D
ADDRDL
Initialized —
—
—
Initialized Initialized Initialized Initialized Initialized Initialized
ADCSR
Initialized —
—
—
Initialized Initialized Initialized Initialized Initialized Initialized
ADCR
Initialized —
—
—
Initialized Initialized Initialized Initialized Initialized Initialized
TCSR_1
Initialized —
—
—
—
—
—
—
—
Initialized WDT_1
TCNT_1
Initialized —
—
—
—
—
—
—
—
Initialized
FLMCR1*
Initialized —
—
—
—
—
—
—
Initialized Initialized FLASH
FLMCR2*
Initialized —
—
—
—
—
—
—
Initialized Initialized
EBR1*
Initialized —
—
—
—
—
—
—
Initialized Initialized
EBR2*
Initialized —
—
—
—
—
—
—
Initialized Initialized
Watch
Subactive
Subsleep
Software Hardware
Standby Standby Module
FLPWCR* Initialized —
—
—
—
—
—
—
Initialized Initialized
PORT1
Initialized —
—
—
—
—
—
—
—
Initialized PORT
PORT3
Initialized —
—
—
—
—
—
—
—
Initialized
PORT4
Initialized —
—
—
—
—
—
—
—
Initialized
PORT7
Initialized —
—
—
—
—
—
—
—
Initialized
PORT9
Initialized —
—
—
—
—
—
—
—
Initialized
PORTF
Initialized —
—
—
—
—
—
—
—
Initialized
Notes:
— is not initialized.
* Supported only by the H8S/2268 Group.
Rev. 5.00 Sep. 01, 2009 Page 596 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
Section 25 Electrical Characteristics
25.1
Power Supply Voltage and Operating Frequency Range
Power supply voltage and operating frequency ranges (shaded areas) are shown in figure 25.1.
Condition A (F-ZTAT version):
Vcc = 3.0 to 5.5 V, AVcc = 2.7 to 5.5 V, Vref = 2.7 V to AVcc, Vss = AVss = 0 V,
φ = 32.768 kHz, 2 to 13.5 MHz, Ta = -20 to +75 (regular specification),
Ta = -40 to + 85 (wide range specification)
Condition B (masked ROM version): Vcc = 2.7 to 5.5 V, AVcc = 2.7 to 5.5 V, Vref = 2.7 V to AVcc, Vss = AVss = 0 V,
φ = 32.768 kHz, 2 to 13.5 MHz, Ta = -20 to +75 (regular specification),
Condition C (F-ZTAT version):
Ta = -40 to + 85 (wide range specification)
Vcc = 4.0 to 5.5 V, AVcc = 4.0 to 5.5 V, Vref = 4.0 V to AVcc, Vss = AVss = 0 V,
φ = 32.768 kHz, 10 to 20.5 MHz, Ta = -20 to +75 (regular specification),
Ta = -40 to + 85 (wide range specification)
Condition D (masked ROM version): Vcc = 4.0 to 5.5 V, AVcc = 4.0 to 5.5 V, Vref = 4.0 V to AVcc, Vss = AVss = 0 V,
φ = 32.768 kHz, 10 to 20.5 MHz, Ta = -20 to +75 (regular specification),
Ta = -40 to +85 (wide range specification)
(1) Power supply voltage and range of oscillation frequency (condition A)
f (kHz)
f (MHz)
System clock
32.768
20.5
Sub clock
13.5
2.0
0
2.7 3.0
4.0
5.5 Vcc (V)
Active (high-speed/medium-speed) mode
Sleep mode
0
2.7 3.0
AII operating modes
4.0
5.5 Vcc (V)
4.0
5.5 Vcc (V)
(2) Power supply voltage and range of oscillation frequency (condition B)
f (MHz)
20.5
System clock
f (kHz)
32.768
Sub clock
0
2.7 3.0
AII operating modes
13.5
2.0
0
2.7 3.0
4.0
5.5 Vcc (V)
Active (high-speed/medium-speed) mode
Sleep mode
Figure 25.1 Power Supply Voltage and Operating Ranges (1)
Rev. 5.00 Sep. 01, 2009 Page 597 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
(3) Power supply voltage and range of oscillation frequency (condition C and D)
f (MHz)
f (kHz)
System clock
20.5
32.768
Sub clock
13.5
10.0
2.0
0
2.7 3.0
4.0
5.5 Vcc (V)
Active (high-speed/medium-speed) mode
Sleep mode
0
2.7 3.0
AII operating modes
(4) Power supply voltage and range of instruction execution (condition A)
t (ns)
t (μs)
System clock
48.8
30.5
4.0
5.5 Vcc (V)
4.0
5.5 Vcc (V)
4.0
5.5 Vcc (V)
4.0
5.5 Vcc (V)
Sub clock
74
500
0
2.7 3.0
4.0
5.5 Vcc (V)
Active (high-speed/medium-speed) mode
0
2.7 3.0
Subactive mode
(5) Power supply voltage and range of instruction execution (condition B)
t (ns)
t (μs)
System clock
48.8
30.5
Sub clock
74
500
0
2.7 3.0
4.0
5.5 Vcc (V)
Active (high-speed/medium-speed) mode
0
2.7 3.0
Subactive mode
(6) Power supply voltage and range of instruction execution (condition C and D)
t (ns)
t (μs)
System clock
48.8
30.5
Sub clock
74
100
500
0
2.7 3.0
4.0
5.5 Vcc (V)
Active (high-speed/medium-speed) mode
0
2.7 3.0
Subactive mode
Figure 25.1 Power Supply Voltage and Operating Ranges (2)
Rev. 5.00 Sep. 01, 2009 Page 598 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
25.2
Electrical Characteristics of H8S/2268 Group
25.2.1
Absolute Maximum Ratings
Table 25.1 lists the absolute maximum ratings.
Table 25.1 Absolute Maximum Ratings
Item
Symbol
Value
Unit
Power supply voltage
VCC
–0.3 to +7.0
V
CVCC
–0.3 to +4.3
V
Input voltage (except port 4, 9, PH7) Vin
–0.3 to VCC + 0.3
V
Input voltage (port 4, 9, PH7)
–0.3 to AVCC + 0.3
V
Vin
Reference voltage
Vref
–0.3 to AVCC + 0.3
V
Analog power supply voltage
AVCC
–0.3 to +7.0
V
Analog input voltage
VAN
–0.3 to AVCC + 0.3
V
Operating temperature
Topr
Regular specifications: –20 to +75*
°C
Wide-range specifications: –40 to +85*
°C
–55 to +125
°C
Storage temperature
Tstg
Caution: Permanent damage to the chip may result if absolute maximum rating are exceeded.
Note: * Operating temperature range for flash memory programming/erasing is Ta = –20 to +75°C.
Rev. 5.00 Sep. 01, 2009 Page 599 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
25.2.2
DC Characteristics
Table 25.2 lists the DC characteristics. Table 25.3 lists the permissible output currents. Table 25.4
lists the bus drive characteristics.
Table 25.2 DC Characteristics (1)
Condition A (F-ZTAT version): VCC = 3.0 V to 5.5 V, AVCC = 2.7 V to 5.5 V, Vref = 2.7 V to AVCC,
VSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to
1
+85°C (wide-range specifications)*
Item
Schmitt trigger
input voltage
Input high
voltage
Input low
voltage
Symbol
IRQ0, IRQ1,
IRQ3 to IRQ5,
WKP0 to WKP7
VT
Min.
Typ.
Max.
Unit
−
VCC × 0.2
⎯
⎯
V
+
⎯
⎯
VCC × 0.8
V
VT+ - VT− VCC × 0.05
⎯
⎯
V
Vcc = 4.0 to 5.5 V
VCC × 0.04
⎯
⎯
V
Vcc = 3.0 to 4.0 V
VCC × 0.9
⎯
VCC + 0.3
V
EXTAL, Ports 1, 3,
7, F, J to N,
PH0 to PH3
VCC × 0.8
⎯
VCC + 0.3
V
Ports 4*4, 9, PH7
VCC × 0.8
⎯
AVCC + 0.3*4 V
- 0.3
⎯
VCC × 0.1
V
- 0.3
⎯
VCC × 0.2
V
VCC - 0.5
⎯
⎯
V
IOH = - 200 μA
VCC - 1.0
⎯
⎯
V
IOH = - 1 mA
P34 and P35*2
VCC - 2.7
⎯
⎯
V
IOH = - 100 μA, VCC
= 4.0 to 5.5 V
PH0 to PH3,
Ports J to N
VCC - 0.5
⎯
⎯
V
IOH = - 200 μA
VCC - 1.0
⎯
⎯
V
IOH = - 1 mA,
VCC = 4.0 to 5.5 V
RES, STBY, NMI,
FWE, MD2, MD1
RES, STBY,
FWE, MD2, MD1
VT
VIH
VIL
NMI, EXTAL, Ports
1, 3, 4, 7, 9, F, H,
J to N
Output high
voltage
Test Conditions
All output pins
except P34 and
P35, PH0 to PH3,
and Ports J to N
VOH
Rev. 5.00 Sep. 01, 2009 Page 600 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
Item
Output low
voltage
Symbol
All output pins*3
VOL
Port 7
Min.
Typ.
Max.
Unit
Test Conditions
⎯
⎯
0.4
V
IOL = - 0.8 mA
⎯
⎯
1.0
V
IOL = 5 mA
IOL = 10 mA,
VCC = 4.0 to 5.5 V
Input leakage
current
RES
| lin |
⎯
⎯
1.0
μA
STBY, NMI, FWE,
MD2, MD1
⎯
⎯
1.0
μA
Ports 4, 9
⎯
⎯
1.0
μA
Vin = 0.5 to AVCC0.5 V
PH7
⎯
⎯
1.0
μA
Vin = 0.5 to AVCC0.5 V
Vin = 0.5 to VCC0.5 V
Three-state
leakage current
(off state)
Ports 1, 3, 7, F, J
to N, PH0 to PH3
| lTSI |
⎯
⎯
1.0
μA
Vin = 0.5 to AVCC0.5 V
Input pull-up
MOS current
Port J
–lP
10
⎯
300
μA
Vin = 0 V
Notes: 1. If the A/D and D/A converters and DTMF generation circuit are not used, do not leave
the AVCC, Vref, and AVSS pins open. Apply a voltage 2.0 V to 5.5 V to the AVCC and
Vref pins by connecting them to VCC, for instance. Set Vref ≤ AVCC.
2. P35/SCK1/SCL0 and P34/SDA0 are NMOS push-pull outputs.
To output high level signal from SCL0 and SDA0 (ICE = 1), pull-up resistance must be
connected externally.
P35/SCK1 and P34 (ICE = 0) are driven high by NMOS. To output high, pull-up
resistance should be connected externally.
3. When ICE = 0. To output low when bus drive function is selected is determined in table
25.4, Bus Drive Characteristics.
4. When Vcc < AVcc, the maximum value for P40 and P41 is Vcc + 0.3 V.
Rev. 5.00 Sep. 01, 2009 Page 601 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
Table 25.2 DC Characteristics (2)
Condition C (F-ZTAT version): VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V, Vref = 4.0 V to AVCC,
VSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C
1
(wide-range specifications)*
Item
Schmitt trigger
input voltage
Input high
voltage
Input low
voltage
Symbol
Typ.
Max.
VCC × 0.2
⎯
⎯
V
⎯
⎯
VCC × 0.8
V
⎯
⎯
V
VCC × 0.9
⎯
VCC + 0.3
V
EXTAL, Ports 1, 3,
7, F, J to N, PH0 to
PH3
VCC × 0.8
⎯
VCC + 0.3
V
Ports 4*4, 9, PH7
VCC × 0.8
⎯
VCC + 0.3*4 V
- 0.3
⎯
VCC × 0.1
V
- 0.3
⎯
VCC × 0.2
V
VCC - 0.5
⎯
⎯
V
IOH = - 200 μA
VCC - 1.0
⎯
⎯
V
IOH = - 1 mA
P34 and P35*2
VCC - 2.7
⎯
⎯
V
IOH = - 100 μA
PH0 to PH3,
Ports J to N
VCC - 0.5
⎯
⎯
V
IOH = - 200 μA
VCC - 1.0
⎯
⎯
V
IOH = - 1 mA
IRQ0, IRQ1,
IRQ3 to IRQ5,
WKP0 to WKP7
RES, STBY,NMI,
FWE, MD2, MD1
RES, STBY,FWE,
MD2, MD1
VT
−
VT+
VT+ - VT− VCC × 0.05
VIH
VIL
NMI, EXTAL, Ports
1, 3, 4, 7, 9, F, H,
J to N
Output high
voltage
Output low
voltage
Input leakage
current
All output pins
except P34 and
P35, PH0 to PH3,
and Ports J to N
Min.
VOH
Unit
Test Conditions
⎯
⎯
0.4
V
IOL = 0.8 mA
⎯
⎯
1.0
V
IOL = 10 mA
⎯
⎯
1.0
μA
STBY, NMI, FWE,
MD2, MD1
⎯
⎯
1.0
μA
Vin = 0.5 to VCC0.5 V
Ports 4, 9
⎯
⎯
1.0
μA
Vin = 0.5 to AVCC0.5 V
PH7
⎯
⎯
1.0
μA
Vin = 0.5 to AVCC0.5 V
All output pins*3
VOL
Port 7
RES
| lin |
Rev. 5.00 Sep. 01, 2009 Page 602 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
Item
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
Three-state
leakage current
(off state)
Ports 1, 3, 7,
Ports F, J to N,
PH0 to PH3
| lTSI |
⎯
⎯
1.0
μA
Vin = 0.5 to AVCC0.5 V
Input pull-up
MOS current
Port J
–lP
50
⎯
300
μA
Vin = 0 V
Notes: 1. If the A/D and D/A converters and DTMF generation circuit are not used, do not leave
the AVCC, Vref, and AVSS pins open. Apply a voltage 4.0 V to 5.5 V to the AVCC and
Vref pins by connecting them to VCC, for instance. Set Vref ≤ AVCC.
2. P35/SCK1/SCL0 and P34/SDA0 are NMOS push-pull outputs.
To output high level signal from SCL0 and SDA0 (ICE = 1), pull-up resistors must be
connected externally.
P35/SCK1 and P34 (ICE = 0) are driven high by NMOS. To output high, pull-up
resistors should be connected externally.
3. When ICE = 0. To output low when bus drive function is selected is determined in table
25.4, Bus Drive Characteristics.
4. When Vcc < AVcc, the maximum value for P40 and P41 is Vcc + 0.3 V.
Rev. 5.00 Sep. 01, 2009 Page 603 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
Table 25.2
DC Characteristics (3)
Condition A (F-ZTAT version): VCC = 3.0 V to 5.5 V, AVCC = 2.7 V to 5.5 V, Vref = 2.7 V to AVCC,
VSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C
1
(wide-range specifications)*
Item
Input
capacitance
Symbol Min.
Typ.
Max.
Unit
Test Conditions
⎯
⎯
30
pF
NMI
⎯
⎯
30
pF
Vin = 0 V, f = 1 MHz,
Ta = 25°C
P32 to P35
⎯
⎯
20
pF
All input pins
except RES, NMI,
P32 to P35
⎯
⎯
15
pF
⎯
18
VCC = 3.0 V
30
VCC = 5.5 V
mA
f = 13.5 MHz
Sleep mode
⎯
13
VCC = 3.0 V
22
VCC = 5.5 V
mA
f = 13.5 MHz
All modules
stopped
⎯
10
⎯
mA
f = 13.5 MHz,
VCC = 3.0 V (reference
values)
Medium-speed
mode (φ/32)
⎯
12
⎯
mA
f = 13.5 MHz,
VCC = 3.0 V (reference
values)
Subactive mode
⎯
60
110
μA
Using 32.768 kHz
crystal resonator,
Vcc = 3.0 V (LCD
lighting)
Subsleep mode
⎯
50
90
μA
Using 32.768 kHz
crystal resonator,
Vcc = 3.0 V (LCD
lighting)
Watch mode
⎯
4
25
μA
Using 32.768 kHz
crystal resonator,
Vcc = 3.0 V (LCD and
TMR4 not used,
WDT_1 operates)
RES
Current
Normal operation
consumption*2
Cin
ICC*4
Rev. 5.00 Sep. 01, 2009 Page 604 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
Item
Symbol Min.
Current
Standby mode*
consumption*2
Analog
power supply
current
3
During A/D
conversion,
D/A conversion,
DTMF output
ICC*
4
AlCC
Waiting for A/D
conversion,
D/A conversion,
DTMF stopped
Reference
current
During A/D
conversion,
D/A conversion
AlCC
Waiting for A/D
conversion,
D/A conversion
RAM standby voltage
VRAM
Typ.
Max.
Unit
Test Conditions
⎯
0.5
Vcc = 3.0 V
10
Vcc = 5.5 V
μA
Ta ≤ 50°C,
32.768 kHz not used
⎯
⎯
50
Vcc = 5.5 V
⎯
1.0
2.4
mA
⎯
0.01
5.0
μA
⎯
1.0
2.2
mA
⎯
0.01
5.0
μA
2.0
⎯
⎯
V
50°C < Ta,
32.768 kHz not used
Notes: 1. If the A/D and D/A converters and DTMF generation circuit are not used, do not leave
the AVCC, Vref, and AVSS pins open. Apply a voltage 2.0 to 5.5 V to the AVCC and
Vref pins by connecting them to VCC, for instance. Set Vref ≤ AVCC.
2. Current consumption values are for VIH min. = VCC – 0.2 V, VIL max. = 0.2 V with all
output pins unloaded and the on-chip pull-up resistors in the off state.
3. The values are for VRAM ≤ VCC < 3.0 V, VIH min. = VCC – 0.2, and VIL max. = 0.2 V.
4. ICC depends on VCC and f as follows (reference):
ICC max. = 4.0 (mA) + 0.64 (mA/V) × Vcc + 0.75 (mA/MHz) × f + 0.15 (mA/(MHz × V)) ×
VCC × f (normal operation)
ICC max. = 3.0 (mA) + 0.60 (mA/V) × Vcc + 0.60 (mA/MHz) × f + 0.10 (mA/(MHz × V))
× VCC × f (sleep mode)
Rev. 5.00 Sep. 01, 2009 Page 605 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
Table 25.2 DC Characteristics (4)
Condition C (F-ZTAT version): VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V, Vref = 4.0 V to AVCC,
VSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C
1
(wide-range specifications)*
Item
Input
capacitance
Symbol Min.
RES
Typ.
Max.
Unit
Test Conditions
Vin = 0 V, f = 1 MHz, Ta
= 25°C
⎯
⎯
30
pF
NMI
⎯
⎯
30
pF
P32 to P35
⎯
⎯
20
pF
All input pins
except RES,
NMI, P32 to P35
⎯
⎯
15
pF
⎯
40
mA
30
VCC = 5.0 V VCC = 5.5 V
f = 20.5 MHz
Sleep mode
⎯
30
mA
22
VCC = 5.0 V VCC = 5.5 V
f = 20.5 MHz
All modules
stopped
⎯
15
⎯
mA
f = 20.5 MHz,
VCC = 5.0 V
(reference values)
Medium-speed
mode (φ/32)
⎯
19
⎯
mA
f = 20.5 MHz,
VCC = 5.0 V
(reference values)
Subactive mode
⎯
70
120
μA
Using 32.768 kHz
crystal resonator, Vcc =
5.0 V (LCD lighting)
Subsleep mode
⎯
60
100
μA
Using 32.768 kHz
crystal resonator, Vcc =
5.0 V (LCD lighting)
Watch mode
⎯
5
30
μA
Using 32.768 kHz
crystal resonator, Vcc =
5.0 V (LCD and TMR4
not used, WDT_1
operates)
Standby mode*3
⎯
1.0
10
μA
Vcc = 5.0 V Vcc = 5.5 V
Ta ≤ 50°C, 32.768 kHz
not used
⎯
⎯
50°C < Ta, 32.768 kHz
not used
Normal
Current
consumption*2 operation
Cin
ICC*4
Rev. 5.00 Sep. 01, 2009 Page 606 of 656
REJ09B0071-0500
50
Vcc = 5.5 V
Section 25 Electrical Characteristics
Item
Analog
power supply
current
Symbol Min.
During A/D
conversion,
D/A conversion,
DTMF output
AlCC
Waiting for A/D
conversion,
D/A conversion,
DTMF stopped
Reference
current
During A/D
conversion,
D/A conversion
AlCC
Waiting for A/D
conversion,
D/A conversion
RAM standby voltage
VRAM
Typ.
Max.
Unit
⎯
1.5
2.5
mA
⎯
0.01
5.0
μA
⎯
1.5
2.2
mA
⎯
0.01
5.0
μA
2.0
⎯
⎯
V
Test Conditions
Notes: 1. If the A/D and D/A converters and DTMF generation circuit are not used, do not leave
the AVCC, Vref, and AVSS pins open. Apply a voltage 4.0 to 5.5 V to the AVCC and
Vref pins by connecting them to VCC, for instance. Set Vref ≤ AVCC.
2. Current consumption values are for VIH min. = VCC – 0.2 V, VIL max. = 0.2 V with all
output pins unloaded and the on-chip pull-up resistors in the off state.
3. The values are for VRAM ≤ VCC < 4.0 V, VIH min. = VCC – 0.2, and VIL max. = 0.2 V.
4. ICC depends on VCC and f as follows (reference):
ICC max. = 4.0 (mA) + 0.64 (mA/V) × Vcc + 0.75 (mA/MHz) × f + 0.15 (mA/(MHz × V)) ×
VCC × f (normal operation)
ICC max. = 3.0 (mA) + 0.60 (mA/V) × Vcc + 0.60 (mA/MHz) × f + 0.10 (mA/(MHz × V)) ×
VCC × f (sleep mode)
Rev. 5.00 Sep. 01, 2009 Page 607 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
Table 25.3 Permissible Output Currents
Condition A (F-ZTAT version): VCC = 3.0 V to 5.5 V, AVCC = 2.7 V to 5.5 V, Vref = 2.7 V to AVCC,
VSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to
+85°C (wide-range specifications)
Condition C (F-ZTAT version): VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V, Vref = 4.0 V to AVCC,
VSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to
+85°C (wide-range specifications)
Item
Permissible output
low current (per pin)
Permissible output
low current (total)
Symbol
Min.
Typ.
Max.
Unit
IOL
⎯
⎯
10
mA
SCL1, SCL0, SDA1, SDA0
⎯
⎯
10
mA
Output pins except port 7,
SCL1, SCL0, SDA1, SDA0
⎯
⎯
1.0
mA
⎯
⎯
30
mA
⎯
⎯
60
mA
Port 7
Total of port 7
∑ IOL
Total of all output pins
including port 7
Permissible output
All output pins
high current (per pin)
–IOH
⎯
⎯
1.0
mA
Permissible output
high current (total)
∑ –IOH
⎯
⎯
30
mA
Total of all output pins
Note: To protect chip reliability, do not exceed the output current values in table 25.3.
Rev. 5.00 Sep. 01, 2009 Page 608 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
Table 25.4 Bus Drive Characteristics (1)
Condition A (F-ZTAT version): VCC = 3.0 V to 5.5 V, AVCC = 2.7 V to 5.5 V, Vref = 2.7 V to AVCC,
VSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to
1
+85°C (wide-range specifications)* , Target pins: SCL1, SCL0, SDA1, SDA0
Item
Symbol
Schmitt trigger input
voltage
VT
−
VT
+
+
VT - VT
−
Min.
Typ.
Max.
Unit
VCC × 0.3
⎯
⎯
V
⎯
⎯
VCC × 0.7
Test Conditions
0.4
⎯
⎯
VCC= 4.0 to 5.5 V
VCC × 0.05
⎯
⎯
VCC = 3.0 to 4.0 V
Input high voltage
VIH
VCC × 0.7
⎯
VCC + 0.5
V
Input low voltage
VIL
-0.5
⎯
VCC × 0.3
V
Output low voltage
VOL
⎯
⎯
0.5
V
⎯
⎯
0.4
IOL = 8 mA,
VCC = 4.0 to 5.5 V
IOL = 3 mA
Input capacitance
CIN
⎯
⎯
20
pF
VIN = 0 V, f = 1
MHz, Ta = 25°C
Three-state leakage
current (off state)
| lSTI |
⎯
⎯
1.0
μA
VIN = 0.5 to VCC-0.5
SDL, SDA output fall time
tOf
20 +
0.1 Cb
⎯
250
ns
Note:
If the A/D and D/A converters and DTMF generation circuit are not used, do not leave the
AVCC, Vref, and AVSS pins open. Apply a voltage 2.0 V to 5.5 V to the AVCC and Vref
pins by connecting them to VCC, for instance. Set Vref ≤ AVCC
Rev. 5.00 Sep. 01, 2009 Page 609 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
Table 25.4 Bus Drive Characteristics (2)
Condition C (F-ZTAT version): VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V, Vref = 4.0 V to AVCC,
VSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C
1
(wide-range specifications)* , Target pins: SCL1, SCL0, SDA1, SDA0
Item
Symbol
Schmitt trigger input
voltage
VT
−
VT
+
Min.
Typ.
Max.
Unit
VCC × 0.3
⎯
⎯
V
⎯
⎯
VCC × 0.7
0.4
⎯
⎯
Input high voltage
VIH
VCC × 0.7
⎯
VCC + 0.5
V
Input low voltage
VIL
-0.5
⎯
VCC × 0.3
V
Output low voltage
VOL
⎯
⎯
0.5
V
⎯
⎯
0.4
+
VT - VT
−
Test Conditions
IOL = 8 mA
IOL = 3 mA
Input capacitance
Cin
⎯
⎯
20
pF
VIN = 0 V, f = 1
MHz, Ta = 25°C
Three-state leakage
current (off state)
| lSTI |
⎯
⎯
1.0
μA
VIN = 0.5 to VCC
- 0.5
SDL, SDA output fall time
tOf
20 + 0.1Cb ⎯
250
ns
Note:
25.2.3
If the A/D and D/A converters and DTMF generation circuit are not used, do not leave the
AVCC, Vref, and AVSS pins open. Apply a voltage 4.0 V to 5.5 V to the AVCC and Vref
pins by connecting them to VCC, for instance. Set Vref ≤ AVCC
AC Characteristics
Figure 25.2 show, the test conditions for the AC characteristics.
5V
RL
LSI output pin
C
RH
C = 30 pF:
RL = 2.4 kΩ
RH = 12 Ω
Input/output timing measurement levels
• Low level : 0.8 V
• High level : 2.0 V
Figure 25.2 Output Load Circuit
Rev. 5.00 Sep. 01, 2009 Page 610 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
Clock Timing: Table 25.5 lists the clock timing.
Table 25.5 Clock Timing
Condition A (F-ZTAT version): VCC = 3.0 V to 5.5 V, AVCC = 2.7 V to 5.5 V, Vref = 2.7 V to AVCC,
VSS = AVSS = 0 V, φ = 32.768 kHz, 2 to 13.5 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition C (F-ZTAT version): VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V, Vref = 4.0 V to AVCC,
VSS = AVSS = 0 V, φ = 32.768 kHz, 10 to 20.5 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition A
Condition C
13.5 MHz
20.5 MHz
Item
Symbol Min.
Clock cycle time
tcyc
Clock oscillator settling
time at reset (crystal)
Test
Conditions
Typ.
Max.
Min.
Typ.
Max. Unit
74
⎯
500
48.8
⎯
100
ns
tOSC1
20
⎯
⎯
10
⎯
⎯
ms
Figure 25.4
Clock oscillator settling
time in software standby
(crystal)
tOSC2
8
⎯
⎯
8
⎯
⎯
ms
Figure 22.3
External clock settling
delay time
tDEXT
500
⎯
⎯
500
⎯
⎯
μs
Figure 25.4
Sub clock oscillator
settling time
tOSC3
⎯
⎯
2
⎯
⎯
2
s
Sub clock oscillator
frequency
fSUB
⎯
32.768 ⎯
⎯
32.768 ⎯
Sub clock (φSUB) cycle
time
tSUB
⎯
30.5
⎯
⎯
30.5
⎯
kHz
μs
Rev. 5.00 Sep. 01, 2009 Page 611 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
Control Signal Timing: Table 25.6 lists the control signal timing.
Table 25.6 Control Signal Timing
Condition A (F-ZTAT version): VCC = 3.0 V to 5.5 V, AVCC = 2.7 V to 5.5 V, Vref = 2.7 V to AVCC,
VSS = AVSS = 0 V, φ = 32.768 kHz, 2 to 13.5 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition C (F-ZTAT version): VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V, Vref = 4.0 V to AVCC,
VSS = AVSS = 0 V, φ = 32.768 kHz, 10 to 20.5 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Item
Symbol
Min.
RES pulse width
tRESW
20
⎯
tcyc
Figure 25.5
NMI pulse width (exiting
software standby mode)
tNMIW
200
⎯
ns
Figure 25.6
IRQ pulse width (exiting
software standby mode)
tIRQW
200
⎯
ns
Rev. 5.00 Sep. 01, 2009 Page 612 of 656
REJ09B0071-0500
Max.
Unit
Test Conditions
Section 25 Electrical Characteristics
Timing of On-Chip Peripheral Modules: Table 25.7 lists the timing of on-chip peripheral
2
modules. Table 25.8 lists the I C bus timing.
Table 25.7 Timing of On-Chip Peripheral Modules
Condition A (F-ZTAT version): VCC = 3.0 V to 5.5 V, AVCC = 2.7 V to 5.5 V, Vref = 2.7 V to AVCC,
VSS = AVSS = 0 V, φ = 32.768 kHz, 2 to 13.5 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition C (F-ZTAT version): VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V, Vref = 4.0 V to AVCC,
VSS = AVSS = 0 V, φ = 32.768 kHz, 10 to 20.5 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition A
Symbol Min.
Max.
Min.
Max.
Unit
Test
Conditions
tTCKWH
1.5
⎯
1.5
⎯
tCyC
Figure 25.7
Both edges
tTCKWL
2.5
⎯
2.5
⎯
Single edge
tTMCWH
1.5
⎯
1.5
⎯
tCyC
Figure 25.8
Both edges
tTMCWL
2.5
⎯
2.5
⎯
tTMCWH
1.5
⎯
1.5
⎯
tCyC
Asynchronous tSCyC
⎯
4
⎯
tCyC
Synchronous
⎯
6
⎯
Item
TPU
Timer clock
pulse width
TMR_0 to Timer clock
TMR_3
pulse width
Condition C
Single edge
TMR_4
Timer clock pulse width
SCI
Input clock
cycle
tTMCWL
Input clock pulse width
tSCKW
0.4
0.6
0.4
0.6
tScyC
Input clock rise time
tSCKf
⎯
1.5
⎯
1.5
tCyC
Input clock fall time
tSCKf
⎯
1.5
⎯
1.5
Transmit data delay time
tTXD
⎯
75
⎯
50
ns
Receive data setup time
(synchronous)
tRXS
75
⎯
50
⎯
ns
Receive data hold time
(synchronous)
tRXH
75
⎯
50
⎯
ns
Figure 25.9
Figure 25.10
Rev. 5.00 Sep. 01, 2009 Page 613 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
2
Table 25.8 I C Bus Timing
Condition:
VCC = 3.0 V to 5.5 V, VSS = 0 V, φ = 5 MHz to maximum operating frequency
Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range
specifications)
Typ. Max.
Test
Unit Conditions Remarks
Item
Symbol Min.
SCL input cycle time
tSCL
12 tcyc ⎯
⎯
ns
SCL input high pulse width
tSCLH
3 tcyc
⎯
⎯
ns
SCL input low pulse width
tSCLL
5 tcyc
⎯
⎯
ns
SCL, SDA input rise time
tSr
⎯
⎯
7.5 tcyc* ns
SCL, SDA input fall time
tSf
⎯
⎯
300
ns
SCL, SDA input spike pulse
elimination time
tSP
⎯
⎯
1 tcyc
ns
SDA input bus free time
tBUF
5 tcyc
⎯
⎯
ns
Start condition input hold time
tSTAH
3 tcyc
⎯
⎯
ns
Retransmission start condition
input setup time
tSTAS
3 tcyc
⎯
⎯
ns
Stop condition input setup time tSTOS
3 tcyc
⎯
⎯
ns
0.5 tcyc ⎯
⎯
ns
Data input setup time
tSDAS
Data input hold time
tSDAH
0
⎯
⎯
ns
SCL, SDA load capacitance
Cb
⎯
⎯
400
pF
Figure 25.11
2
Note: * tSr can be set to 7.5 tcyc or 17.5 tcyc according to the clock used for the I C module. For details,
see section 14.6 Usage Notes.
Rev. 5.00 Sep. 01, 2009 Page 614 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
25.2.4
A/D Conversion Characteristics
Table 25.9 lists the A/D conversion characteristics.
Table 25.9 A/D Conversion Characteristics
Condition A (F-ZTAT version): VCC = 3.0 V to 5.5 V*, AVCC = 2.7 V to 5.5 V*, Vref = 2.7 V to
AVCC, VSS = AVSS = 0 V, φ = 2 to 13.5 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition C (F-ZTAT version): VCC = 4.0 V to 5.5 V*, AVCC = 4.0 V to 5.5 V*, Vref = 4.0 V to
AVCC, VSS = AVSS = 0 V, φ = 10 to 20.5 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition A
Condition C
13.5 MHz
20.5 MHz
Item
Min.
Typ.
Max.
Min.
Typ.
Max.
Unit
Resolution
10
10
10
10
10
10
bits
Conversion time
9.6
⎯
⎯
6.3
⎯
⎯
µs
Analog input capacitance
⎯
⎯
20
⎯
⎯
20
pF
Permissible signal-source impedance
⎯
⎯
5
⎯
⎯
5
kΩ
Nonlinearity error
⎯
⎯
±6.0
⎯
⎯
±3.0
LSB
Offset error
⎯
⎯
±4.0
⎯
⎯
±2.0
LSB
Full-scale error
⎯
⎯
±4.0
⎯
⎯
±2.0
LSB
Quantization error
⎯
⎯
±0.5
⎯
⎯
±0.5
LSB
Absolute accuracy
⎯
⎯
±8.0
⎯
⎯
±4.0
LSB
Note: * AN0 and AN1 can be used only when Vcc = AVcc.
Rev. 5.00 Sep. 01, 2009 Page 615 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
25.2.5
D/A Conversion Characteristics
Table 25.10 lists the D/A conversion characteristics.
Table 25.10 D/A Conversion Characteristics
Condition A (F-ZTAT version): VCC = 3.0 V to 5.5 V, AVCC = 2.7 V to 5.5 V, Vref = 2.7 V to AVCC,
VSS = AVSS = 0 V, φ = 2 to 13.5 MHz, Ta = –20°C to +75°C (regular specifications),
Ta = –40°C to +85°C (wide-range specifications)
Condition C (F-ZTAT version): VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V, Vref = 4.0 V to AVCC,
VSS = AVSS = 0 V, φ = 10 to 20.5 MHz, Ta = –20°C to +75°C (regular specifications),
Ta = –40°C to +85°C (wide-range specifications)
Condition A and C
Item
Min.
Typ.
Max.
Unit
Test Conditions
Resolution
8
8
8
bits
Conversion time
⎯
⎯
10
µs
Load capacitance: 20 pF
Absolute accuracy*
⎯
±2.0
±3.0
LSB
Load resistance: 2 MΩ
⎯
⎯
±2.0
LSB
Load resistance: 4 MΩ
Note: * Does not apply to module stop mode, software standby mode, watch mode, subactive
mode, and subsleep mode.
Rev. 5.00 Sep. 01, 2009 Page 616 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
25.2.6
LCD Characteristics
Table 25.11 lists the LCD characteristics.
Table 25.11 LCD Characteristics
Condition A (F-ZTAT version): VCC = 3.0 V to 5.5 V, AVCC = 2.7 V to 5.5 V, Vref = 2.7 V to AVCC,
VSS = AVSS = 0 V, φ = 32.768 kHz, 2 to 13.5 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition C (F-ZTAT version): VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V, Vref = 4.0 V to AVCC,
VSS = AVSS = 0 V, φ = 32.768 kHz, 10 to 20.5 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition A
Item
Symbol
Standard Value
Applicable Test
Pins
Conditions Min. Typ.
Max.
Condition C
Standard Value
Min.
Typ.
Max.
Unit
Notes
Segment driver
step-down voltage
VDS
SEG1 to
SEG40
ID = 2μA
⎯
⎯
0.6
⎯
⎯
0.6
V
*1
Common driver
step-down voltage
VDC
COM1 to
COM4
ID = 2μA
⎯
⎯
0.3
⎯
⎯
0.3
V
*1
LCD power supply
division resistor
RLCD
Between
V1 and VSS
40
360
1000
40
360
1000
kΩ
LCD voltage (step- VLCD
up voltage circuit
not used)
V1
3.0*4
⎯
VCC
4.0
⎯
VCC
V
LCD input
reference voltage
(using step-up
voltage circuit)*3
VLCD3
V3
1.0
1.67
1.83
⎯
⎯
⎯
V
LCD voltage
(using step-up
voltage circuit)*3
VLCD2
V2
No load
⎯
2 × VLCD3 ⎯
⎯
⎯
⎯
V
⎯
3 × VLCD3 ⎯
⎯
⎯
⎯
Reference
value
No load,
frame
frequency:
64 Hz,
VLCD3 =
1.67 V
⎯
2.0
⎯
⎯
⎯
⎯
μA
Reference
value
LCD input
reference power
supply current
(using step-up
voltage circuit)*3
VLCD1
V1
ILCD3
V3
*2
Notes: 1. Voltage step-down between power supply pins V1, V2, V3, and VSS and segment pins.
2. If the LCD voltage is provided by an external power supply, the following relationship
must be maintained: VCC ≥ V1 ≥ V2 ≥ V3 ≥ VSS.
3. The step-up voltage circuit should be used with 1/3 duty or 1/4 duty.
4. When the step-up voltage circuit is not used, the lowest value is V1 = 3.0 V. Use the
step-up voltage circuit when V1 < 3.0 V.
Rev. 5.00 Sep. 01, 2009 Page 617 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
25.2.7
DTMF Characteristics
Table 25.12 lists the DTMF characteristics.
Table 25.12 DTMF Characteristics
Condition A (F-ZTAT version): VCC = 3.0 V to 5.5 V, AVCC = 2.7 V to 5.5 V, Vref = 2.7 V to AVCC,
VSS = AVSS = 0 V, φ = 2 to 13.2 MHz, Ta = –20°C to +75°C (regular specifications),
Ta = –40°C to +85°C (wide-range specifications)
Condition C (F-ZTAT version): VCC = 4.0 V to 5.5 V, AVCC = 2.7 V* to 5.5 V, Vref = 2.7 V* to
AVCC, VSS = AVSS = 0 V, φ = 10 to 20.4 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
1
Item
Symbol
Applicable
Pins
Test
Conditions
DTMF output
voltage
(Row side)
VOR
TONED
AVcc-GND =
2.7 V
RL = 100 kΩ
DTMF output
voltage
(Column side)
VOC
DTMF output
distortion
DTMF output
ratio
1
Standard Value
Min.
Typ.
Max.
Unit
Notes
750
924
⎯
mVrms
Figure 25.12*2
TONED
AVcc - GND = 770
2.7 V
RL = 100 kΩ
945
⎯
mVrms
Figure 25.12*2
%
DISDT
TONED
AVcc – GND = ⎯
2.7 V
RL = 100 kΩ
3
7
%
Figure 25.12
dBCR
TONED
AVcc – GND = ⎯
2.7 V
RL = 100 kΩ
2.5
⎯
dB
Figure 25.12
Notes: 1. When AVcc = 2.7 to 4.0 V, and Vref = 2.7 to 4.0 V, DTMF is only available.
2. VOR and Vcc are output voltages when a single waveform is output.
Rev. 5.00 Sep. 01, 2009 Page 618 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
25.2.8
Flash Memory Characteristics
Table 25.13 shows the flash memory characteristics.
Table 25.13 Flash Memory Characteristics
Condition: VCC = 3.0 V to 5.5 V, AVCC = 2.7 V to 5.5 V, Vref = 2.7 V to AVCC, VSS = AVSS = 0 V,
Ta = –25°C to +75°C (Programming/erasing operating temperature range: regular
specification)
Item
Symbol Min.
Programming time*1*2*4
tp
⎯
Erase time*1*3*5
tE
⎯
Count of rewriting
NWEC
TDRP*8
Data retention time
Programming Wait time after SWE1 bit setting*1
Wait time after PSU1 bit setting*1
Wait time after P1 bit setting*1 *4
Max. Unit
30
200
Test
Condition
ms/
128 bytes
100
1200 ms/block
6
7
*
*
100
⎯
Times
10000
10
⎯
⎯
Year
tsswe
1
1
⎯
μs
tspsu
50
50
⎯
μs
tsp10
8
10
12
μs
tsp30
28
30
32
μs
6≥n≥1
tsp200
198
200
202
μs
1000 ≥ n ≥ 7
Wait time after P1 bit clear*1
tcp
5
5
⎯
μs
Wait time after PSU1 bit clear*1
Wait time after PV1 bit setting*1
tcpsu
4
4
⎯
μs
tspv
2
2
⎯
μs
Wait time after H'FF dummy write*1 tspvr
Wait time after PV1 bit clear*1
tcpv
2
2
⎯
μs
100
100
⎯
μs
Times
Wait time after SWE1 bit clear
Maximum programming count*1*4
Erase
Typ.
μs
tcswe
⎯
⎯
N1
⎯
⎯
⎯
6*4
N2
⎯
⎯
994*4 Times
μs
Wait time after SWE1 bit setting*1
Wait time after ESU1 bit setting*1
tsswe
1
1
⎯
tsesu
100
100
⎯
μs
Wait time after E1 bit setting*1*5
Wait time after E1 bit clear*1
tse
10
10
100
ms
tce
10
10
⎯
μs
Wait time after ESU1 bit clear*1
Wait time after EV1 bit setting*1
tcesu
10
10
⎯
μs
tsev
20
20
⎯
μs
Wait time after H'FF dummy write*1 tsevr
Wait time after EV1 bit clear*1
tcev
2
2
⎯
μs
4
4
⎯
μs
Wait time after SWE1 bit clear
Maximum erase count*1*5
tcswe
100
100
⎯
μs
N
⎯
⎯
100
Times
Rev. 5.00 Sep. 01, 2009 Page 619 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
Notes: 1. Make each time setting in accordance with the program or erase algorithm.
2. Programming time per 128 bytes (Shows the total period for which the P1 bit in the
flash memory control register (FLMCR1) is set. It does not include the programming
verification time.)
3. Block erase time (Shows the total period for which the E1 bit in FLMCR1 is set. It does
not include the erase verification time.)
4. The maximum programming time value (tp(max.)):
tP(max.) = Wait time after P1 bit setting (tsp) × maximum programming count (N)
(tsp30 + tsp10) × 6 + (tsp200) × 994
5. For the maximum erase time (tE(max.)), the following relationship applies between the
wait time after E1 bit setting (tse) and the maximum erase count (N):
tE(max.) = Wait time after E1 bit setting (tse) × maximum erase count (N)
6. The minimum times that all characteristics after rewriting are guaranteed. (A range
between 1 and minimum value is guaranteed.)
7. The reference value at 25°C. (Normally, it is a reference that rewriting is enabled up to
this value.)
8. Data hold characteristics when rewriting is performed within the range of specifications
including minimum value.
Rev. 5.00 Sep. 01, 2009 Page 620 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
25.3
Electrical Characteristics of H8S/2264 Group
25.3.1
Absolute Maximum Ratings
Table 25.14 lists the absolute maximum ratings.
Table 25.14 Absolute Maximum Ratings
Item
Power supply voltage
Symbol
Value
Unit
VCC
–0.3 to +7.0
V
CVCC
–0.3 to +4.3
V
Input voltage (except ports 4 and 9)
Vin
–0.3 to VCC + 0.3
V
Input voltage (ports 4 and 9)
Vin
–0.3 to AVCC + 0.3
V
Reference voltage
Vref
–0.3 to AVCC + 0.3
V
Analog power supply voltage
AVCC
–0.3 to +7.0
V
Analog input voltage
VAN
–0.3 to AVCC + 0.3
V
Operating temperature
Topr
Regular specifications: –20 to +75
°C
Wide-range specifications: –40 to +85
°C
Storage temperature
Tstg
–55 to +125
°C
Caution:
Permanent damage to the chip may result if absolute maximum rating are exceeded.
Rev. 5.00 Sep. 01, 2009 Page 621 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
25.3.2
DC Characteristics
Table 25.15 lists the DC characteristics. Table 25.16 lists the permissible output currents. Table
25.17 lists the bus drive characteristics.
Table 25.15 DC Characteristics (1)
Condition B (Masked-ROM version): VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, Vref = 2.7 V to
AVCC, VSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to
1
+85°C (wide-range specifications)*
Item
Schmitt trigger
input voltage
Input high
voltage
Input low
voltage
Symbol
Typ.
Max.
Unit
IRQ0, IRQ1, IRQ3, VT
VCC × 0.2
IRQ4, WKP0 to
+
VT
⎯
WKP7
+
−
VT - VT VCC × 0.05
⎯
⎯
V
⎯
VCC × 0.8
V
⎯
⎯
V
Vcc = 4.0 to 5.5 V
VCC × 0.04
⎯
⎯
V
Vcc = 2.7 to 4.0 V
VCC × 0.9
⎯
VCC + 0.3
V
EXTAL, Ports 1, 3,
7, F, H, J to L
VCC × 0.8
⎯
VCC + 0.3
V
Ports 4*4, 9
VCC × 0.8
⎯
AVCC + 0.3*4 V
- 0.3
⎯
VCC × 0.1
V
- 0.3
⎯
VCC × 0.2
V
VCC – 0.5
⎯
⎯
V
IOH = - 200 μA
VCC – 1.0
⎯
⎯
V
IOH = - 1 mA
VCC – 2.7
⎯
⎯
V
IOH = - 100 μA,
VCC = 4.0 to 5.5 V
⎯
⎯
0.4
V
IOL = 0.8 mA
⎯
⎯
1.0
V
IOL = 5 mA
RES, STBY, NMI,
FWE, MD2, MD1
RES, STBY, FWE,
MD2, MD1
VIH
VIL
NMI, EXTAL,
Ports 1, 3, 4, 7, 9,
F, H, J to L
Output high
voltage
All output pins
except P34 and
P35
VOH
P34 and P35*2
Output low
voltage
Min.
−
All output pins*3
VOL
Port 7
Test Conditions
IOL = 10 mA,
VCC = 4.0 to 5.5 V
Rev. 5.00 Sep. 01, 2009 Page 622 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
Item
Input leakage
current
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
| lin |
⎯
⎯
1.0
μA
Vin = 0.5 to VCC- 0.5 V
STBY, NMI, FWE,
MD2, MD1
⎯
⎯
1.0
μA
Ports 4, 9
⎯
⎯
1.0
μA
Vin = 0.5 to AVCC- 0.5 V
PH7
⎯
⎯
1.0
μA
Vin = 0.5 to VCC- 0.5 V
RES
Three-state
Ports 1, 3, 7, F, J
leakage current to L, PH0 to PH3
(off state)
| lTSI |
⎯
⎯
1.0
μA
Vin = 0.5 to VCC- 0.5 V
Input pull-up
MOS current
–lP
10
⎯
300
μA
Vin = 0 V
Port J
Notes: 1. If the A/D converter is not used, do not leave the AVCC, Vref, and AVSS pins open.
Apply a voltage 2.0 V to 5.5 V to the AVCC and Vref pins by connecting them to VCC, for
instance. Set Vref ≤ AVCC.
2. P35/SCK1/SCL0 and P34/SDA0 are NMOS push-pull outputs. To output high level
signal from SCL0 and SDA0 (ICE = 1), pull-up resistors must be connected externally.
P35/SCK1 and P34 (ICE = 0) are driven high by NMOS. To output high pull-up resistors
should be connected externally.
3. When ICE = 0. The output low level when bus drive function is selected is indicated in
table 25.17, Bus Drive Characteristics.
4. When Vcc < AVcc, the maximum value for P40 and P41 is Vcc + 0.3 V.
Rev. 5.00 Sep. 01, 2009 Page 623 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
Table 25.15 DC Characteristics (2)
Condition D (Masked-ROM version): VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V, Vref = 4.0 V to
AVCC, VSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to
1
+85°C (wide-range specifications)*
Item
Schmitt trigger
input voltage
Input high
voltage
Input low
voltage
Symbol
Typ.
Max.
Unit
⎯
⎯
V
⎯
VCC × 0.8
V
⎯
⎯
V
VCC × 0.9
⎯
VCC + 0.3
V
EXTAL, Ports 1, 3,
7, F, H, J to L
VCC × 0.8
⎯
VCC + 0.3
V
Ports 4*4, 9
VCC × 0.8
⎯
AVCC + 0.3*4 V
- 0.3
⎯
VCC × 0.1
V
- 0.3
⎯
VCC × 0.2
V
VCC - 0.5
⎯
⎯
V
IOH = - 200 μA
VCC - 1.0
⎯
⎯
V
IOH = - 1 mA
VCC - 2.7
⎯
⎯
V
IOH = - 100 μA
⎯
⎯
0.4
V
IOL = 0.8 mA
⎯
⎯
1.0
V
IOL = 10 mA
⎯
⎯
1.0
μA
STBY, NMI, FWE,
MD2, MD1
⎯
⎯
1.0
μA
Vin = 0.5 to VCC- 0.5
V
Ports 4, 9
⎯
⎯
1.0
μA
Vin = 0.5 to AVCC- 0.5
V
PH7
⎯
⎯
1.0
μA
Vin = 0.5 to VCC- 0.5
V
IRQ0, IRQ1, IRQ3, VT
VCC × 0.2
IRQ4, WKP0 to
+
VT
⎯
WKP7
+
VT - VT VCC × 0.05
RES, STBY,NMI,
FWE, MD2, MD1
RES, STBY,FWE,
MD2, MD1
VIH
VIL
NMI, EXTAL,
Ports 1, 3, 4, 7, 9,
F, H, J to L
Output high
voltage
All output pins
except P34 and
P35
VOH
P34 and P35*2
Output low
voltage
All output pins*
3
VOL
Port 7
Input leakage
current
Min.
-
RES
| lin |
Test Conditions
Three-state
Ports 1, 3, 7, F, J
leakage current to L, PH0 to PH3
(off state)
| lTSI |
⎯
⎯
1.0
μA
Vin = 0.5 to VCC- 0.5
V
Input pull-up
MOS current
–lP
50
⎯
300
μA
Vin = 0 V
Port J
Rev. 5.00 Sep. 01, 2009 Page 624 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
Notes: 1. If the A/D converter is not used, do not leave the AVCC, Vref, and AVSS pins open.
Apply a voltage 4.0 V to 5.5 V to the AVCC and Vref pins by connecting them to VCC, for
instance. Set Vref ≤ AVCC.
2. P35/SCK1/SCL0 and P34/SDA0 are NMOS push-pull outputs. To output high level
signal from SCL0 and SDA0 (ICE = 1), pull-up resistors must be connected externally.
P35/SCK1 and P34 (ICE = 0) are driven high by NMOS. To output high pill-up resistors
should be connected externally.
3. When ICE = 0. The output low level when bus drive function is selected is indicated in
table 25.17, Bus Drive Characteristics.
4. When Vcc < AVcc, the maximum value for P40 and P41 is Vcc + 0.3 V.
Table 25.15 DC Characteristics (3)
Condition B (Masked-ROM version): VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, Vref = 2.7 V to
AVCC, VSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to
1
+85°C (wide-range specifications)*
Item
Input
capacitance
RES
Symbol
Min.
Typ.
Max.
Unit Test Conditions
Cin
⎯
⎯
30
pF
⎯
⎯
30
pF
NMI
Vin = 0 V, f = 1 MHz, Ta
= 25°C
P34 and P35
⎯
⎯
20
pF
All input pins
except RES,
NMI, P34, and
P35
⎯
⎯
15
pF
⎯
11
VCC = 3.0 V
18
VCC = 5.5 V
mA
f = 13.5 MHz
Sleep mode
⎯
7
VCC = 3.0 V
12.5
VCC = 5.5 V
mA
f = 13.5 MHz
All modules
stopped
⎯
7
⎯
mA
f = 13.5 MHz,
VCC = 3.0 V
(reference values)
Mediumspeed mode
(φ/32)
⎯
6
⎯
mA
f = 13.5 MHz,
VCC = 3.0 V
(reference values)
Subactive
mode
⎯
20
40
μA
Using 32.768 kHz
crystal resonator, Vcc =
3.0 V (LCD lighting)
Subsleep
mode
⎯
8
25
μA
Using 32.768 kHz
crystal resonator, Vcc
= 3.0 V (LCD lighting)
Current
Normal
consumption*2 operation
ICC*4
Rev. 5.00 Sep. 01, 2009 Page 625 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
Item
Symbol
Min.
Typ.
Max.
Unit Test Conditions
Current
Watch mode
consumption*2
ICC*
⎯
2.5
8
μA
⎯
⎯
10
⎯
0.5
Vcc = 3.0 V
5
Vcc = 5.5 V
⎯
⎯
20
Vcc = 5.5 V
⎯
0.3
1.5
mA
⎯
0.01
5.0
μA
⎯
0.4
1.0
mA
⎯
0.01
5.0
μA
2.0
⎯
⎯
V
4
Standby
mode*3
Analog
power supply
current
During A/D
conversion
Reference
current
During A/D
conversion
AlCC
Waiting for
A/D
conversion
AlCC
Waiting for
A/D
conversion
RAM standby voltage
VRAM
Ta ≤ 50°C, Using
32.768 kHz crystal
resonator, Vcc = 3.0 V
(LCD not used, WDT_1
operates)
50°C < Ta, using
32.768 kHz crystal
resonator, Vcc = 3.0 V
(LCD not used, WDT_1
operates)
μA
Ta ≤ 50°C, 32.768 kHz
not used
50°C < Ta, 32.768 kHz
not used
Notes: 1. If the A/D converter is not used, do not leave the AVCC, Vref, and AVSS pins open.
Apply a voltage 2.0 to 5.5 V to the AVCC and Vref pins by connecting them to VCC, for
instance. Set Vref ≤ AVCC.
2. Current consumption values are for VIH min. = VCC – 0.2 V, VIL max. = 0.2 V with all
output pins unloaded and the on-chip pull-up resistors in the off state.
3. The values are for VRAM ≤ VCC < 2.7 V, VIH min. = VCC – 0.2, and VIL max. = 0.2 V.
4. ICC depends on VCC and f as follows (reference):
ICC max. = 3.0 (mA) + 1.24 (mA/V) × (Vcc – 2.7 (V)) + 1.00 (mA/MHz) × (f – 2.0 (MHz))
(normal operation)
ICC max. = 2.0 (mA) + 1.12 (mA/V) × (Vcc – 2.7 (V)) + 0.64 (mA/MHz) × (f – 2.0 (MHz))
(sleep mode)
Rev. 5.00 Sep. 01, 2009 Page 626 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
Table 25.15 DC Characteristics (4)
Condition D (Masked-ROM version): VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V, Vref = 4.0 V to
AVCC, VSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to
1
+85°C (wide-range specifications)*
Item
Input
capacitance
Symbol
Min.
Typ.
Max.
Unit Test Conditions
Cin
⎯
⎯
30
pF
NMI
⎯
⎯
30
pF
P34 and P35
⎯
⎯
20
pF
All input pins
except RES,
NMI, P34, and
P35
⎯
⎯
15
pF
⎯
18
VCC = 5.0 V
25
VCC = 5.5 V
mA
f = 20.5 MHz
Sleep mode
⎯
12
VCC = 5.0 V
17
VCC = 5.5 V
mA
f = 20.5 MHz
All modules
stopped
⎯
11
⎯
mA
f = 20.5 MHz,
VCC = 5.0 V
(reference values)
Mediumspeed mode
(φ/32)
⎯
10
⎯
mA
f = 20.5 MHz,
VCC = 5.0 V
(reference values)
Subactive
mode
⎯
20
40
μA
Using 32.768 kHz
crystal resonator, Vcc =
5.0 V (LCD lighting)
Subsleep
mode
⎯
8
25
μA
Using 32.768 kHz
crystal resonator, Vcc
= 5.0 V (LCD lighting)
Watch mode
⎯
3
10
μA
Ta ≤ 50°C, Using
32.768 kHz crystal
resonator, Vcc = 5.0 V
(LCD not used, WDT_1
operates)
RES
Current
Normal
consumption*2 operation
ICC*4
Vin = 0 V, f = 1 MHz, Ta
= 25°C
Rev. 5.00 Sep. 01, 2009 Page 627 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
Item
Symbol
Min.
Typ.
Max.
Unit Test Conditions
Current
Watch mode
consumption*2
ICC*
⎯
⎯
12
μA
50°C < Ta, using
32.768 kHz crystal
resonator, Vcc = 5.0 V
(LCD not used, WDT_1
operates)
⎯
0.5
Vcc = 5.0 V
5
Vcc = 5.5 V
μA
Ta ≤ 50°C, 32.768 kHz
not used
⎯
⎯
20
Vcc = 5.5 V
⎯
0.8
1.6
mA
⎯
0.01
5.0
μA
⎯
0.6
1.0
mA
⎯
0.01
5.0
μA
2.0
⎯
⎯
V
4
Standby
mode*3
Analog
power supply
current
During A/D
conversion
Reference
current
During A/D
conversion
AlCC
Waiting for
A/D
conversion
AlCC
Waiting for
A/D
conversion
RAM standby voltage
VRAM
50°C < Ta, 32.768 kHz
not used
Notes: 1. If the A/D converter is not used, do not leave the AVCC, Vref, and AVSS pins open.
Apply a voltage 4.0 to 5.5 V to the AVCC and Vref pins by connecting them to VCC, for
instance. Set Vref ≤ AVCC.
2. Current consumption values are for VIH min. = VCC – 0.2 V, VIL max. = 0.2 V with all
output pins unloaded and the on-chip pull-up resistors in the off state.
3. The values are for VRAM ≤ VCC < 4.0 V, VIH min. = VCC – 0.2, and VIL max. = 0.2 V.
4. ICC depends on VCC and f as follows (reference):
ICC max. = 3.0 (mA) + 1.24 (mA/V) × (Vcc – 2.7 (V)) + 1.00 (mA/MHz) × (f – 2.0 (MHz))
(normal operation)
ICC max. = 2.0 (mA) + 1.12 (mA/V) × (Vcc – 2.7 (V)) + 0.64 (mA/MHz) × (f – 2.0 (MHz))
(sleep mode)
Rev. 5.00 Sep. 01, 2009 Page 628 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
Table 25.16 Permissible Output Currents
Condition B (Masked-ROM version): VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, Vref = 2.7 V to
AVCC, VSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to
+85°C (wide-range specifications)
Condition D (Masked-ROM version): VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V, Vref = 4.0 V to
AVCC, VSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to
+85°C (wide-range specifications)
Item
Permissible output low
current (per pin)
Symbol
Min.
Typ.
Max. Unit
IOL
⎯
⎯
10
mA
SCL0, SDA0
⎯
⎯
10
mA
Output pins except port 7, SCL0,
SDA0
⎯
⎯
1.0
mA
⎯
⎯
30
mA
⎯
⎯
60
mA
Port 7
∑ IOL
Permissible output low
current (total)
Total of port 7
Permissible output high
current (per pin)
All output pins
–IOH
⎯
⎯
1.0
mA
Permissible output high
current (total)
Total of all output pins
∑ –IOH
⎯
⎯
30
mA
Total of all output pins including
port 7
Note: To protect chip reliability, do not exceed the output current values in table 25.16.
Rev. 5.00 Sep. 01, 2009 Page 629 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
Table 25.17 Bus Drive Characteristics (1)
Condition B (Masked-ROM version): VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, Vref = 2.7 V to
AVCC, VSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to
+85°C (wide-range specifications)*, Target pins: SCL0, SDA0
Item
Schmitt trigger input
voltage
Symbol
VT
-
VT
+
+
VT - VT
-
Min.
Typ.
Max.
Unit
VCC × 0.3
⎯
⎯
V
⎯
⎯
VCC × 0.7
0.4
⎯
⎯
VCC = 4.5 to 5.5 V
VCC × 0.05
⎯
⎯
VCC = 2.7 to 4.5 V
Input high voltage
VIH
VCC × 0.7
⎯
VCC + 0.5
V
Input low voltage
VIL
-0.5
⎯
VCC × 0.3
V
Output low voltage
VOL
⎯
⎯
0.5
V
⎯
⎯
0.4
Test Conditions
IOL = 8 mA,
VCC = 4.5 to 5.5 V
IOL = 3 mA
Input capacitance
CIN
⎯
⎯
20
pF
VIN = 0 V,
f = 1 MHz,
Ta = 25°C
Three-state leakage
current (off state)
| lTSI |
⎯
⎯
1.0
μA
VIN = 0.5 to VCC
-0.5
SDL, SDA output fall
time
tOf
20 + 0.1 Cb ⎯
250
ns
Note: * If the A/D converter is not used, do not leave the AVCC, Vref, and AVSS pins open. Apply a
voltage 2.7 V to 5.5 V to the AVCC and Vref pins by connecting them to VCC, for instance.
Set Vref ≤ AVCC.
Rev. 5.00 Sep. 01, 2009 Page 630 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
Table 25.17 Bus Drive Characteristics (2)
Condition D (Masked-ROM version): VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V, Vref = 4.0 V to
AVCC, VSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to
+85°C (wide-range specifications)*, Target pins: SCL0, SDA0
Item
Symbol
Schmitt trigger input
voltage
VT
−
VT
+
+
VT - VT
−
Min.
Typ.
Max.
Unit
VCC × 0.3
⎯
⎯
V
⎯
⎯
VCC × 0.7
Test Conditions
0.4
⎯
⎯
VCC = 4.5 to 5.5 V
VCC × 0.05
⎯
⎯
VCC = 4.0 to 4.5 V
Input high voltage
VIH
VCC × 0.7
⎯
VCC + 0.5
V
Input low voltage
VIL
-0.5
⎯
VCC × 0.3
V
Output low voltage
VOL
⎯
⎯
0.5
V
⎯
⎯
0.4
IOL = 8mA
IOL = 3mA
Input capacitance
Cin
⎯
⎯
20
pF
VIN = 0 V,
f = 1 MHz,
Ta = 25°C
Three-state leakage
current (off state)
| lTSI |
⎯
⎯
1.0
μA
VIN = 0.5 to VCC-0.5
SDL, SDA output fall
time
tOf
20 + 0.1Cb
⎯
250
ns
Note: * If the A/D converter is not used, do not leave the AVCC, Vref, and AVSS pins open. Apply a
voltage 4.0 V to 5.5 V to the AVCC and Vref pins by connecting them to VCC, for instance.
Set Vref ≤ AVCC.
25.3.3
AC Characteristics
Figure 25.3 shows the test conditions for the AC characteristics.
5V
RL
LSI output pin
C
RH
C = 30 pF
RL = 2.4 kΩ
RH = 12 Ω
Input/output timing measurement levels
• Low level : 0.8 V
• High level : 2.0 V
Figure 25.3 Output Load Circuit
Rev. 5.00 Sep. 01, 2009 Page 631 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
Clock Timing: Table 25.18 lists the clock timing.
Table 25.18 Clock Timing
Condition B (Masked-ROM version): VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, Vref = 2.7 V to
AVCC, VSS = AVSS = 0 V, φ = 32.768 kHz, 2 to 13.5 MHz, Ta = –20°C to +75°C
(regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition D (Masked-ROM version): VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V, Vref = 4.0 V to
AVCC, VSS = AVSS = 0 V, φ = 32.768 kHz, 10 to 20.5 MHz, Ta = –20°C to +75°C
(regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition B
Condition D
13.5 MHz
20.5 MHz
Typ.
Max.
Min.
Typ.
Test
Max. Unit Conditions
74
⎯
500
48.8
⎯
100 ns
tOSC1
20
⎯
⎯
10
⎯
⎯
ms
Figure 25.4
Clock oscillator settling
time in software standby
(crystal)
tOSC2
8
⎯
⎯
8
⎯
⎯
ms
Figure 22.3
External clock settling
time
tDEXT
500
⎯
⎯
500
⎯
⎯
μs
Figure 25.4
Sub clock oscillator
settling time
tOSC3
⎯
⎯
2
⎯
⎯
2
s
Sub clock oscillator
frequency
fSUB
⎯
32.768 ⎯
⎯
32.768 ⎯
Sub clock (φSUB) cycle
time
tSUB
⎯
30.5
⎯
⎯
30.5
Item
Symbol Min.
Clock cycle time
tcyc
Clock oscillator settling
time at reset (crystal)
Rev. 5.00 Sep. 01, 2009 Page 632 of 656
REJ09B0071-0500
⎯
kHz
μs
Section 25 Electrical Characteristics
Control Signal Timing: Table 25.19 lists the control signal timing.
Table 25.19 Control Signal Timing
Condition B (Masked-ROM version): VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, Vref = 2.7 V to
AVCC, VSS = AVSS = 0 V, φ = 32.768 kHz, 2 to 13.5 MHz, Ta = –20°C to +75°C
(regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition D (Masked-ROM version): VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V, Vref = 4.0 V to
AVCC, VSS = AVSS = 0 V, φ = 32.768 kHz, 10 to 20.5 MHz, Ta = –20°C to +75°C
(regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Item
Symbol
Min.
Max.
Unit
Test Conditions
RES pulse width
tRESW
20
⎯
tcyc
Figure 25.5
NMI pulse width
(exiting software standby mode)
tNMIW
200
⎯
ns
Figure 25.6
IRQ pulse width
(exiting software standby mode)
tIRQW
200
⎯
ns
Rev. 5.00 Sep. 01, 2009 Page 633 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
Timing of On-Chip Peripheral Modules: Table 25.20 lists the timing of on-chip peripheral
2
modules. Table 25.21 lists the I C bus timing.
Table 25.20 Timing of On-Chip Peripheral Modules
Condition B (Masked-ROM version): VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, Vref = 2.7 V to
AVCC, VSS = AVSS = 0 V, φ = 32.768 kHz, 2 to 13.5 MHz, Ta = –20°C to +75°C
(regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition D (Masked-ROM version): VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V, Vref = 4.0 V to
AVCC, VSS = AVSS = 0 V, φ = 32.768 kHz, 10 to 20.5 MHz, Ta = –20°C to +75°C
(regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition B
Condition D
Symbol Min.
Max.
Min.
Test
Max. Unit Conditions
tTCKWH
1.5
⎯
1.5
⎯
Both edges
tTCKWL
2.5
⎯
2.5
⎯
TMR_0, Timer clock
TMR_1 pulse width
Single edge
tTMCWH
1.5
⎯
1.5
⎯
Both edges
tTMCWL
2.5
⎯
2.5
⎯
SCI
Asynchronous
tScyc
4
⎯
4
⎯
6
⎯
6
⎯
Item
TPU
Timer clock
pulse width
Input clock
cycle
Single edge
Synchronous
tcyc
Figure 25.7
tcyc
Figure 25.8
tcyc
Figure 25.9
Input clock pulse width
tSCKW
0.4
0.6
0.4
0.6
tScyc
Input clock rise time
tSCKr
⎯
1.5
⎯
1.5
tcyc
Input clock fall time
tSCKf
⎯
1.5
⎯
1.5
Transmit data delay time
tTXD
⎯
75
⎯
50
ns
Receive data setup time
(synchronous)
tRXS
75
⎯
50
⎯
ns
Receive data hold time
(synchronous)
tRXH
75
⎯
50
⎯
ns
Rev. 5.00 Sep. 01, 2009 Page 634 of 656
REJ09B0071-0500
Figure 25.10
Section 25 Electrical Characteristics
2
Table 25.21 I C Bus Timing
Conditions: VCC = 2.7 V to 5.5 V, VSS = 0 V, φ = 5 MHz to maximum operating frequency,
Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range
specifications)
Typ. Max.
Test
Unit Conditions Remarks
Item
Symbol Min.
SCL input cycle time
tSCL
12 tcyc ⎯
⎯
ns
SCL input high pulse width
tSCLH
3 tcyc
⎯
⎯
ns
SCL input low pulse width
tSCLL
5 tcyc
⎯
⎯
ns
SCL, SDA input rise time
tSr
⎯
⎯
7.5 tcyc* ns
SCL, SDA input fall time
tSf
⎯
⎯
300
ns
SCL, SDA input spike pulse
elimination time
tSP
⎯
⎯
1 tcyc
ns
SDA input bus free time
tBUF
5 tcyc
⎯
⎯
ns
Start condition input hold time
tSTAH
3 tcyc
⎯
⎯
ns
Retransmission start condition
input setup time
tSTAS
3 tcyc
⎯
⎯
ns
Stop condition input setup time tSTOS
3 tcyc
⎯
⎯
ns
0.5 tcyc ⎯
⎯
ns
Data input setup time
tSDAS
Data input hold time
tSDAH
0
⎯
⎯
ns
SCL, SDA load capacitance
Cb
⎯
⎯
400
pF
Figure 25.11
2
Note: * tSr can be set to 7.5 tcyc or 17.5 tcyc according to the clock used for the I C module. For details,
see section 14.5, Usage Notes.
Rev. 5.00 Sep. 01, 2009 Page 635 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
25.3.4
A/D Conversion Characteristics
Table 25.22 lists the A/D conversion characteristics.
Table 25.22 A/D Conversion Characteristics
Condition B (Masked-ROM version): VCC = 2.7 V to 5.5 V*, AVCC = 2.7 V to 5.5 V*, Vref = 2.7 V
to AVCC, VSS = AVSS = 0 V, φ = 2 to 13.5 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition D (Masked-ROM version): VCC = 4.0 V to 5.5 V*, AVCC = 4.0 V to 5.5 V*, Vref = 4.0 V
to AVCC, VSS = AVSS = 0 V, φ = 10 to 20.5 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition B
Condition D
13.5 MHz
20.5 MHz
Item
Min.
Typ.
Max.
Min.
Typ.
Max.
Unit
Resolution
10
10
10
10
10
10
bits
Conversion time
9.6
⎯
⎯
6.3
⎯
⎯
µs
Analog input capacitance
⎯
⎯
20
⎯
⎯
20
pF
Permissible signal-source
impedance
⎯
⎯
5
⎯
⎯
5
kΩ
Nonlinearity error
⎯
⎯
±6.0
⎯
⎯
±3.0
LSB
Offset error
⎯
⎯
±4.0
⎯
⎯
±2.0
LSB
Full-scale error
⎯
⎯
±4.0
⎯
⎯
±2.0
LSB
Quantization error
⎯
⎯
±0.5
⎯
⎯
±0.5
LSB
Absolute accuracy
⎯
⎯
±8.0
⎯
⎯
±4.0
LSB
Note: * AN0 and AN1 can be used only when Vcc = AVcc.
Rev. 5.00 Sep. 01, 2009 Page 636 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
25.3.5
LCD Characteristics
Table 25.23 lists the LCD characteristics.
Table 25.23 LCD Characteristics
Condition B (Masked-ROM version): VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, Vref = 2.7 V to
AVCC, VSS = AVSS = 0 V, φ = 32.768 kHz, 2 to 13.5 MHz, Ta = –20°C to +75°C
Condition D (Masked-ROM version): VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V, Vref = 4.0 V to
AVCC, VSS = AVSS = 0 V, φ = 32.768 kHz, 10 to 20.5 MHz, Ta = –20°C to +75°C
(regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition B
Item
Standard Value
Applicable Test
Pins
Conditions
Min. Typ. Max.
Symbol
Condition D
Standard Value
Min.
Typ.
Max. Unit Notes
Segment driver
step-down
voltage
VDS
SEG1 to
SEG40
ID = 2μA
⎯
⎯
0.6
⎯
⎯
0.6
V
*1
Common driver
step-down
voltage
VDC
COM1 to
COM4
ID = 2μA
⎯
⎯
0.3
⎯
⎯
0.3
V
*1
LCD power
supply division
resistor
RLCD
Between
V1 and VSS
150
360
800
150
360
800
kΩ
LCD voltage
VLCD
3.0
⎯
VCC
4.0
⎯
VCC
V
V1
*2
Notes: 1. Voltage step-down between power supply pins V1, V2, V3, and VSS and segment pins.
2. If the LCD voltage is provided by an external power supply, the following relationship
must be maintained: VCC ≥ V1 ≥ V2 ≥ V3 ≥ VSS.
Rev. 5.00 Sep. 01, 2009 Page 637 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
25.4
Operation Timing
Operation timings are shown below.
25.4.1
Oscillator Settling Timing
Figure 25.4 shows the oscillator settling timing.
EXTAL
tDEXT
tDEXT
Vcc
STBY
tOSC1
tOSC1
RES
Internal
clock φ
Figure 25.4 Oscillator Settling Timing
25.4.2
Control Signal Timings
Control signal timings are shown below.
• Reset Input Timing
Figure 25.5 shows the reset input timing.
• Interrupt Input Timing
Figure 25.6 shows the NMI, IRQ interrupt reset input timing.
RES
tRESW
Figure 25.5 Reset Input Timing
Rev. 5.00 Sep. 01, 2009 Page 638 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
NMI
tNMIW
IRQ
tIRQW
Figure 25.6 Interrupt Input Timing
25.4.3
Timing of On-Chip Peripheral Modules
Figures 25.7 to 25.12 show timing of on-chip peripheral modules.
TCLKA to TCLKC,
TCLKD*
tTCKWL
tTCKWH
Note: * Supported only by the H8S/2268 Group.
Figure 25.7 TPU Clock Input Timing
TMCI01,
TMCI23*,
TMCI4*
tTMCWL
tTMCWH
Note: * Supported only by the H8S/2268 Group.
Figure 25.8 8-Bit Timer Clock Input Timing
tSCKW
tSCKr
tSCKf
SCK0 to SCK2
tScyc
Figure 25.9 SCK Clock Input Timing
Rev. 5.00 Sep. 01, 2009 Page 639 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
SCK0 to SCK2
tTXD
TxD0 to TxD2
(transmit data)
tRXS
tRXH
RxD0 to RxD2
(receive data)
Figure 25.10 SCI Input/Output Timing (Clock Synchronous Mode)
SDA0
to
SDA1*2
VIH
VIL
tBUF
tSTAH
tSCLH
tSTAS
tSP
SCL0
to
SCL1*2
P*1
S*1
tsf
Sr*1
tSCLL
tSr
tSCL
Notes: 1.
2.
tSDAS
tSDAH
S, P, and Sr indicate the following conditions.
S : Start condition
P : Stop condition
Sr : Retransmission start condition
Supported only by the H8S/2268 Group.
2
Figure 25.11 I C Bus Interface Input/Output Timing (Option)
Rev. 5.00 Sep. 01, 2009 Page 640 of 656
REJ09B0071-0500
tSTOS
Section 25 Electrical Characteristics
RL = 100 kΩ
TONED
GND
Figure 25.12 TONED Load Circuit (Supported Only by the H8S/2268 Group)
25.5
Usage Note
The F-ZTAT and masked ROM versions both satisfy the electrical characteristics shown in this
manual, but actual electrical characteristic values, operating margins, noise margins, and other
properties may vary due to differences in manufacturing process, on-chip ROM, layout patterns,
and so on. When system evaluation testing is carried out using the F-ZTAT version, the same
evaluation testing should also be conducted for the masked ROM version when changing over to
that version.
When combination of the F-ZTAT version of the H8S/2268 Group and the masked ROM version
of the H8S/2264 Group is used, the following condition should be satisfied.
• Stabilization capacitance between the CVCC pin and ground = 0.2 μF
• Vcc = AVcc
Rev. 5.00 Sep. 01, 2009 Page 641 of 656
REJ09B0071-0500
Section 25 Electrical Characteristics
Rev. 5.00 Sep. 01, 2009 Page 642 of 656
REJ09B0071-0500
Appendix A I/O Port States in Each Pin State
Appendix A I/O Port States in Each Pin State
A.1
I/O Port State in Each Pin State of H8S/2268 Group
Port Name Reset
Hardware
Standby
Software
Mode
Standby Mode
Watch Mode
Program Execution
State Sleep Mode
Subsleep Mode
Port 1
T
T
Keep
Keep
I/O port
Port 3
T
T
Keep
Keep
I/O port
Port 4
T
T
T
T
I/O port
Port 7
T
T
Keep
Keep
I/O port
P97/DA1
P96/DA0
T
T
[DAOEn = 1]
Keep
[DAOEn = 0]
T
[DAOEn = 1]
Keep
[DAOEn = 0]
T
Input port
Port F
T
T
Keep
Keep
I/O port
PH7
T
T
T
T
Input port
PH3 to PH0 T
T
[Common output] [Common output]
[Common output]
Port
COM4 to COM1
COM4 to COM1
[Otherwise]
[Otherwise]
[Otherwise]
Keep
Keep
I/O port
Port J
Port K
Port L
T
T
T
T
T
T
[Segment output] [Segment output]
[Segment output]
Port
SEG8 to SEG1
SEG8 to SEG1
[Otherwise]
[Otherwise]
[Otherwise]
Keep
Keep
I/O port
[Segment output] [Segment output]
[Segment output]
Port
SEG16 to SEG9
SEG16 to SEG9
[Otherwise]
[Otherwise]
[Otherwise]
Keep
Keep
I/O port
[Segment output] [Segment output]
[Segment output]
Port
SEG24 to SEG17
SEG24 to SEG17
[Otherwise]
[Otherwise]
[Otherwise]
Keep
Keep
I/O port
Rev. 5.00 Sep. 01, 2009 Page 643 of 656
REJ09B0071-0500
Appendix A I/O Port States in Each Pin State
Port Name Reset
Hardware
Software
Standby
Standby Mode
Mode
Port M
T
Port N
A.2
T
T
T
Watch Mode
Program Execution
State Sleep Mode
Subsleep Mode
[Segment output] [Segment output]
[Segment output]
Port
SEG32 to SEG25
SEG32 to SEG25
[Otherwise]
[Otherwise]
[Otherwise]
Keep
Keep
I/O port
[Segment output] [Segment output]
[Segment output]
Port
SEG40 to SEG33
SEG40 to SEG33
[Otherwise]
[Otherwise]
[Otherwise]
Keep
Keep
I/O port
I/O Port State in Each Pin State of H8S/2264 Group
Port Name Reset
Hardware
Software
Standby
Standby Mode
Mode
Watch Mode
Program Execution
State Sleep Mode
Subsleep Mode
Port 1
T
T
Keep
Keep
I/O port
Port 3
T
T
Keep
Keep
I/O port
Port 4
T
T
T
T
Input port
Port 7
T
T
Keep
Keep
I/O port
Port 9
T
T
T
T
Input port
Port F
T
T
Keep
Keep
I/O port
PH7
T
T
T
T
Input port
PH3 to PH0 T
T
Port J
T
T
[Common output] [Common output]
[Common output]
Port
COM4 to COM1
COM4 to COM1
[Otherwise]
[Otherwise]
[Otherwise]
Keep
Keep
I/O port
[Segment output] [Segment output]
[Segment output]
Port
SEG8 to SEG1
SEG8 to SEG1
[Otherwise]
[Otherwise]
[Otherwise]
Keep
Keep
I/O port
Rev. 5.00 Sep. 01, 2009 Page 644 of 656
REJ09B0071-0500
Appendix A I/O Port States in Each Pin State
Port Name Reset
Hardware
Software
Standby
Standby Mode
Mode
Port K
T
Port L
SEG40 to
SEG25
T
T
T
T
T
Watch Mode
Program Execution
State Sleep Mode
Subsleep Mode
[Segment output] [Segment output]
[Segment output]
Port
SEG16 to SEG9
SEG16 to SEG9
[Otherwise]
[Otherwise]
[Otherwise]
Keep
Keep
I/O port
[Segment output] [Segment output]
[Segment output]
Port
SEG24 to SEG17
SEG24 to SEG17
[Otherwise]
[Otherwise]
[Otherwise]
Keep
Keep
I/O port
T
[Segment output]
[Segment output]
SEG40 to SEG25
SEG40 to SEG25
[Otherwise]
[Otherwise]
T
T
Legend:
H:
High level
T:
High-impedance
Keep: Input port becomes high-impedance, output port retains state
Port: Determined by port setting (input is high-impedance)
Rev. 5.00 Sep. 01, 2009 Page 645 of 656
REJ09B0071-0500
Appendix B Product Codes
Appendix B Product Codes
• H8S/2268 Group
Product Type
H8S/2268 F-ZTAT
version
H8S/2266 F-ZTAT
version
Standard
product
Standard
product
Package
(Renesas
Package
Code)
Operating
Voltage
Product Code
Mark Code
HD64F2268
HD64F2268TE13
100-pin TQFP 3.0 V to 5.5 V
(TFP-100B,
TFP-100BV)
HD64F2268TF13
100-pin TQFP
(TFP-100G,
TFP-100GV)
HD64F2268FA13
100-pin QFP
(FP-100B,
FP-100BV)
HD64F2268TE20
100-pin TQFP 4.0 V to 5.5 V
(TFP-100B,
TFP-100BV)
HD64F2268TF20
100-pin TQFP
(TFP-100G,
TFP-100GV)
HD64F2268FA20
100-pin QFP
(FP-100B,
FP-100BV)
HD64F2266TE13
100-pin TQFP 3.0 V to 5.5 V
(TFP-100B,
TFP-100BV)
HD64F2266TF13
100-pin TQFP
(TFP-100G,
TFP-100GV)
HD64F2266FA13
100-pin QFP
(FP-100B,
FP-100BV)
HD64F2266TE20
100-pin TQFP 4.0 V to 5.5 V
(TFP-100B,
TFP-100BV)
HD64F2266TF20
100-pin TQFP
(TFP-100G,
TFP-100GV)
HD64F2266FA20
100-pin QFP
(FP-100B,
FP-100BV)
HD64F2266
Rev. 5.00 Sep. 01, 2009 Page 646 of 656
REJ09B0071-0500
Appendix B Product Codes
Product Type
H8S/2265 F-ZTAT
version
Standard
product
Package
(Renesas
Package
Code)
Operating
Voltage
Product Code
Mark Code
HD64F2265
HD64F2265TE13
100-pin TQFP 3.0 V to 5.5 V
(TFP-100B,
TFP-100BV)
HD64F2265TF13
100-pin TQFP
(TFP-100G,
TFP-100GV)
HD64F2265FA13
100-pin QFP
(FP-100B,
FP-100BV)
HD64F2265TE20
100-pin TQFP 4.0 V to 5.5 V
(TFP-100B,
TFP-100BV)
HD64F2265TF20
100-pin TQFP
(TFP-100G,
TFP-100GV)
HD64F2265FA20
100-pin QFP
(FP-100B,
FP-100BV)
Rev. 5.00 Sep. 01, 2009 Page 647 of 656
REJ09B0071-0500
Appendix B Product Codes
• H8S/2264 Group
Product Type
H8S/2264 MaskedROM
version
Standard
product
Package
(Renesas
Package
Code)
Operating
Voltage
Product Code
Mark Code
HD6432264
HD6432264(A**)TF
100-pin TQFP 2.7 V to 5.5 V
(TFP-100G,
TFP-100GV)
HD6432264(A**)FA
100-pin QFP
(FP-100B,
FP-100BV)
HD6432264(F**)TF
100-pin TQFP 4.0 V to 5.5 V
(TFP-100G,
TFP-100GV)
HD6432264(F**)FA
100-pin QFP
(FP-100B,
FP-100BV)
Version with HD6432264W
on-chip I2C
bus interface
HD6432264W(A**)TF 100-pin TQFP 2.7 V to 5.5 V
(TFP-100G,
TFP-100GV)
HD6432264W(A**)FA 100-pin QFP
(FP-100B,
FP-100BV)
HD6432264W(F**)TF 100-pin TQFP 4.0 V to 5.5 V
(TFP-100G,
TFP-100GV)
HD6432264W(F**)FA 100-pin QFP
(FP-100B,
FP-100BV)
H8S/2262 MaskedROM
version
Standard
product
HD6432262
Rev. 5.00 Sep. 01, 2009 Page 648 of 656
REJ09B0071-0500
HD6432262(A**)TF
100-pin TQFP 2.7 V to 5.5 V
(TFP-100G,
TFP-100GV)
HD6432262(A**)FA
100-pin QFP
(FP-100B,
FP-100BV)
HD6432262(F**)TF
100-pin TQFP 4.0 V to 5.5 V
(TFP-100G,
TFP-100GV)
HD6432262(F**)FA
100-pin QFP
(FP-100B,
FP-100BV)
Appendix B Product Codes
Product Type
H8S/2262 MaskedROM
version
Product Code
Version with HD6432262W
on-chip I2C
bus interface
Mark Code
Package
(Renesas
Package
Code)
Operating
Voltage
HD6432262W(A**)TF 100-pin TQFP 2.7 V to 5.5 V
(TFP-100G,
TFP-100GV)
HD6432262W(A**)FA 100-pin QFP
(FP-100B,
FP-100BV)
HD6432262W(F**)TF 100-pin TQFP 4.0 V to 5.5 V
(TFP-100G,
TFP-100GV)
HD6432262W(F**)FA 100-pin QFP
(FP-100B,
FP-100BV)
Legend:
(A**), (F**): ROM code
Note: Some products above are in the developing or planning stage. Please contact Renesas
agency to confirm the present state of each product.
Rev. 5.00 Sep. 01, 2009 Page 649 of 656
REJ09B0071-0500
Appendix C Package Dimensions
Appendix C Package Dimensions
The package dimensions that are shown in the Renesas Semiconductor Packages Data Book have
priority.
JEITA Package Code
P-TQFP100-14x14-0.50
RENESAS Code
PTQP0100KA-A
Previous Code
TFP-100B/TFP-100BV
MASS[Typ.]
0.5g
HD
*1
D
75
NOTE)
1. DIMENSIONS"*1"AND"*2"
DO NOT INCLUDE MOLD FLASH
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
51
76
50
bp
Reference
Symbol
Nom
Max
14
D
c
c1
HE
Dimension in Millimeters
Min
E
14
A2
1.00
*2
E
b1
Terminal cross section
HD
15.8
16.0
16.2
HE
15.8
16.0
16.2
A1
0.00
0.10
0.20
bp
0.17
0.22
0.27
1.20
ZE
A
26
100
0.20
b1
ZD
c
0.12
θ
A1
L
L1
Detail F
θ
0°
e
*3
bp
x
M
8°
0.5
0.08
x
0.10
y
1.00
ZD
1.00
ZE
y
L
L1
0.4
0.5
1.0
Figure C.1 TFP-100B and TFP-100BV Package Dimensions (H8S/2268 Group Only)
Rev. 5.00 Sep. 01, 2009 Page 650 of 656
REJ09B0071-0500
0.22
0.15
c1
Index mark
F
e
0.17
c
A2
25
A
1
0.6
Appendix C Package Dimensions
JEITA Package Code
P-TQFP100-12x12-0.40
RENESAS Code
PTQP0100LC-A
Previous Code
TFP-100G/TFP-100GV
MASS[Typ.]
0.4g
HD
*1
D
75
NOTE)
1. DIMENSIONS"*1"AND"*2"
DO NOT INCLUDE MOLD FLASH
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
51
76
50
Reference
Symbol
HE
b1
c
c1
*2
E
bp
Dimension in Millimeters
Min
12
E
12
A2
26
Terminal cross section
ZE
100
Nom
D
1.00
HD
13.8
14.0
14.2
HE
13.8
14.0
14.2
A1
0.00
0.10
0.20
bp
0.13
0.18
0.23
A
1
ZD
2
5
Index mark
F
θ
bp
A1
*3
y
x
L1
M
0.16
0.12
c1
c
A2
A
c
e
1.20
b1
L
Detail F
Max
θ
0.17
0.22
0.15
0°
e
8°
0.4
x
0.07
y
0.10
ZD
1.2
ZE
L
L1
1.2
0.4
0.5
0.6
1.0
Figure C.2 TFP-100G and TFP-100GV Package Dimensions
Rev. 5.00 Sep. 01, 2009 Page 651 of 656
REJ09B0071-0500
Appendix C Package Dimensions
JEITA Package Code
P-QFP100-14x14-0.50
RENESAS Code
PRQP0100KA-A
Previous Code
FP-100B/FP-100BV
MASS[Typ.]
1.2g
NOTE)
1. DIMENSIONS"*1"AND"*2"
DO NOT INCLUDE MOLD FLASH
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
HD
*1
D
75
51
76
50
bp
Reference
Symbol
c
c1
HE
Dimension in Millimeters
Min
Nom
D
14
E
14
Max
*2
E
b1
2.70
A2
ZE
Terminal cross section
1
2
5
16.0
16.3
HE
15.7
16.0
16.3
A1
0.00
0.12
0.25
bp
0.17
0.22
0.27
A1
θ
y
x
θ
L
e
L1
x
Detail F
bp
0.20
M
0.22
0.15
8°
0.5
0.08
0.10
1.0
ZD
1.0
ZE
L1
Figure C.3 FP-100B and FP-100BV Package Dimensions
0.17
0°
y
L
Rev. 5.00 Sep. 01, 2009 Page 652 of 656
REJ09B0071-0500
0.12
c1
c
A2
A
c
F
*3
3.05
b1
ZD
e
15.7
A
26
100
HD
0.3
0.5
1.0
0.7
Index
Index
16-bit timer pulse unit (TPU).................. 185
Buffer operation.................................. 225
Buffer operation timing ...................... 243
Counter operation ............................... 218
Free-running count operation.............. 219
Input capture function......................... 221
Input capture signal timing ................. 241
Output compare output timing ............ 240
Periodic count operation ..................... 219
Phase counting mode .......................... 233
PWM modes ....................................... 228
Synchronous operation ....................... 223
TCNT count timing............................. 240
Toggle output...................................... 220
Waveform output by compare match.. 220
8-bit reload timer .................................... 280
Automatic reload timer operation ....... 285
Interval timer operation ...................... 284
8-bit timers.............................................. 257
16-bit count mode ............................... 273
Cascaded connection........................... 273
Compare-match count mode............... 273
Pulse output ........................................ 268
TCNT incrementation timing.............. 269
Toggle output...................................... 277
A/D converter ......................................... 443
A/D converter activation..................... 239
Analog input channel .......................... 446
Conversion time.................................. 454
External trigger ................................... 456
Scan mode........................................... 453
Single mode ........................................ 451
Address map ............................................. 57
Address space ........................................... 20
Addressing modes..................................... 40
Absolute address................................... 42
Immediate .............................................43
Memory indirect....................................43
Program-counter relative.......................43
Register direct .......................................41
Register indirect ....................................41
Register indirect with displacement ......41
Register indirect with post-increment ...42
Register indirect with pre-decrement ....42
Bcc ............................................................37
Break address ..........................................103
Break condition.......................................105
Bus arbitration.........................................113
Bus cycle.................................................111
Bus masters .............................................113
Clock pulse generator..............................539
Condition field ..........................................39
Condition-code register.............................24
D/A converter..........................................463
Data direction register (DDR).................139
Data register (DR)...................................139
Data transfer controller ...........................115
Activated by software .........................132
Block transfer mode ............................129
Chain transfer......................................131
DTC vector table.................................123
Normal mode ......................................127
Register information ...........................123
Repeat mode........................................128
Software activation ..................... 132, 136
Vector number for the software activation
interrupt...............................................121
DTMF generation circuit ........................493
Effective address ................................. 40, 44
Effective address extension.......................39
Rev. 5.00 Sep. 01, 2009 Page 653 of 656
REJ09B0071-0500
Index
Exception handling ................................... 59
Interrupts............................................... 63
Reset exception handling ...................... 61
Stack status ........................................... 65
Traces.................................................... 63
Trap instruction..................................... 64
Exception Vector Table ............................ 60
Extended control register .......................... 23
Flash memory ......................................... 503
Boot mode........................................... 518
Emulation............................................ 522
Erase/erase-verify ............................... 527
Erasing units ....................................... 508
Error protection................................... 529
Hardware protection ........................... 529
Program/program-verify ..................... 525
Software protection............................. 529
User program mode ............................ 521
General register......................................... 26
2
I C bus interface...................................... 383
2
I C bus format ..................................... 406
Noise cancelers ................................... 427
Serial format ....................................... 406
Input pull-up MOS function ................... 139
Instruction set ........................................... 29
Arithmetic operations instructions........ 32
Bit Manipulation instructions ............... 35
Block data transfer instructions ............ 39
Branch instructions ............................... 37
Data transfer instructions ...................... 31
Logic operations instructions................ 34
Shift instructions................................... 34
System control instructions................... 38
Interrupt
ADI ..................................................... 456
CMIA.................................................. 274
CMIB .................................................. 274
Rev. 5.00 Sep. 01, 2009 Page 654 of 656
REJ09B0071-0500
ERI ......................................................375
NMI.....................................................299
OVI .....................................................274
RXI......................................................375
SWDTEND .........................................132
TCI ......................................................238
TEI ......................................................375
TGI......................................................238
TXI......................................................375
WOVI..................................................299
Interrupt control modes.............................88
Interrupt controller ....................................67
Interrupt exception handling vector table..84
Interrupt mask bit......................................24
LCD controller/driver .............................469
Common drivers..................................473
Duty cycle ...........................................469
LCD display ........................................482
LCD RAM ..........................................483
Segment driver ....................................475
Memory cycle .........................................111
On-board programming...........................518
Operating mode selection..........................55
Operation field ..........................................39
PC break controller .................................103
Power-down modes.................................551
Direct transitions .................................569
Hardware standby mode......................564
Medium-speed mode...........................560
Module stop mode...............................565
Sleep mode..........................................561
Software standby mode.......................562
Sub-active mode..................................568
Sub-sleep mode...................................567
Watch mode ........................................566
Program counter........................................23
Index
Program/erase protection ........................ 529
Programmer mode .................................. 530
Register
ADCR ......................... 449, 580, 589, 596
ADCSR ....................... 447, 580, 589, 596
ADDR ......................... 446, 580, 588, 595
BARA ......................... 104, 576, 584, 592
BARB ......................... 105, 576, 585, 592
BCRA ......................... 105, 576, 585, 592
BCRB.......................... 106, 577, 585, 592
BRR ............................ 326, 579, 588, 595
CRA ............................ 119, 574, 582, 590
CRB ............................ 119, 574, 582, 590
DACR ......................... 465, 575, 583, 591
DADR ......................... 464, 575, 583, 591
DAR............................ 119, 574, 582, 590
DDCSWR ................... 405, 575, 583, 591
DTCER ....................... 120, 577, 585, 592
DTCR.......................... 495, 574, 582, 590
DTLR.......................... 496, 574, 582, 590
DTVECR .................... 121, 577, 585, 592
EBR1 .......................... 514, 580, 589, 596
EBR2 .......................... 515, 581, 589, 596
FLMCR1..................... 512, 580, 589, 596
FLMCR2..................... 513, 580, 589, 596
FLPWCR .................... 516, 581, 589, 596
ICCR........................... 395, 579, 588, 595
ICDR........................... 388, 579, 588, 595
ICMR .......................... 391, 579, 588, 595
ICSR ........................... 401, 579, 588, 595
IENR1 ........................... 80, 575, 583, 591
IER................................ 74, 577, 585, 592
IPR ................................ 73, 577, 585, 593
ISCR ............................. 75, 577, 585, 592
ISR ................................ 77, 577, 585, 592
IWPR ............................ 80, 575, 583, 591
LCD RAM .................. 483, 574, 582, 590
LCR ............................ 476, 574, 582, 590
LCR2 .......................... 478, 574, 582, 590
LPCR........................... 472, 574, 582, 590
LPWRCR .................... 541, 576, 584, 592
MDCR........................... 56, 576, 584, 592
MRA ........................... 117, 574, 582, 590
MRB............................ 118, 574, 582, 590
MSTPCR..................... 558, 584, 590, 592
P1DDR........................ 145, 577, 585, 592
P1DR........................... 146, 578, 586, 593
P3DDR........................ 151, 577, 585, 592
P3DR........................... 152, 578, 586, 593
P3ODR........................ 153, 577, 585, 593
P7DDR........................ 158, 577, 585, 592
P7DR........................... 158, 578, 586, 593
PFDDR........................ 163, 577, 585, 593
PFDR........................... 163, 578, 586, 593
PHDDR ....................... 165, 575, 583, 590
PHDR.......................... 166, 575, 583, 591
PJDDR ........................ 170, 575, 583, 590
PJDR ........................... 170, 575, 583, 591
PJPCR ......................... 171, 575, 583, 591
PKDDR ....................... 174, 575, 583, 590
PKDR.......................... 174, 575, 583, 591
PLDDR ....................... 176, 575, 583, 590
PLDR .......................... 177, 575, 583, 591
PMDDR ...................... 178, 575, 583, 590
PMDR ......................... 179, 575, 583, 591
PNDDR ....................... 181, 575, 583, 591
PNDR.......................... 182, 575, 583, 591
PORT1 ........................ 146, 581, 589, 596
PORT3 ........................ 153, 581, 589, 596
PORT4 ........................ 157, 581, 589, 596
PORT7 ........................ 159, 581, 589, 596
PORT9 ........................ 162, 581, 589, 596
PORTF ........................ 164, 581, 589, 596
PORTH ....................... 166, 575, 583, 591
PORTJ......................... 171, 575, 583, 591
PORTK ....................... 175, 575, 583, 591
PORTL........................ 177, 575, 583, 591
PORTM....................... 180, 575, 583, 591
PORTN ....................... 182, 575, 583, 591
Rev. 5.00 Sep. 01, 2009 Page 655 of 656
REJ09B0071-0500
Index
RAMER ...................... 515, 577, 586, 593
RDR ............................ 308, 579, 588, 595
RSR..................................................... 308
RSTCSR ..................... 295, 579, 587, 594
SAR ............................ 119, 574, 582, 590
SARX.................. 390, 579, 580, 588, 595
SBYCR ....................... 556, 576, 584, 592
SCKCR ....................... 540, 576, 584, 592
SCMR ......................... 325, 579, 588, 595
SCR............................. 313, 579, 588, 595
SCRX.......................... 394, 575, 583, 591
SEMR ......................... 334, 576, 584, 592
SMR............................ 309, 579, 587, 595
SSR ............................. 318, 579, 588, 595
SYSCR.......................... 71, 576, 584, 592
TCNT..........213, 291, 578, 579, 586, 587,
.................................................... 593, 594
TCORA....................... 260, 579, 587, 594
TCORB ....................... 260, 579, 587, 594
TCR ............192, 261, 578, 579, 586, 587,
.................................................... 593, 594
TCSR .......................... 263, 579, 587, 594
TDR ............................ 308, 579, 588, 595
TGR ............................ 213, 578, 586, 593
TIER ........................... 207, 578, 586, 593
TIOR........................... 197, 578, 586, 593
TMDR......................... 195, 578, 586, 593
Rev. 5.00 Sep. 01, 2009 Page 656 of 656
REJ09B0071-0500
TSR ............................. 209, 578, 586, 593
TSTR........................... 214, 577, 585, 593
TSYR .......................... 215, 577, 585, 593
WPCR ......................... 172, 575, 583, 591
Register field .............................................39
Reset..........................................................61
Serial communication interface (SCI).....303
Asynchronous mode............................338
Bit rate.................................................326
Break ...................................................376
Clocked synchronous mode ................355
Framing error ......................................345
Mark state............................................376
Multiprocessor communication
function ...............................................349
Overrun error.......................................345
Parity error ..........................................345
Smart card ...............................................303
Smart card interface ................................363
Stack pointer .............................................22
Watchdog timer.......................................289
Interval timer mode.............................297
Overflow .............................................298
Watchdog timer mode.........................296
Renesas 16-Bit Single-Chip Microcomputer
Hardware Manual
H8S/2268 Group, H8S/2264 Group
Publication Date: 1st Edition, April 2001
Rev.5.00, September 1, 2009
Published by:
Sales Strategic Planning Div.
Renesas Technology Corp.
Edited by:
Customer Support Department
Global Strategic Communication Div.
Renesas Solutions Corp.
©2009. Renesas Technology Corp., All rights reserved. Printed in Japan.
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
RENESAS SALES OFFICES
http://www.renesas.com
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
Renesas Technology Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology (Shanghai) Co., Ltd.
Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120
Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7858/7898
Renesas Technology Hong Kong Ltd.
7th Floor, North Tower, World Finance Centre, Harbour City, Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2377-3473
Renesas Technology Taiwan Co., Ltd.
10th Floor, No.99, Fushing North Road, Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 3518-3399
Renesas Technology Singapore Pte. Ltd.
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
Renesas Technology Korea Co., Ltd.
Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea
Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
Renesas Technology Malaysia Sdn. Bhd
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: <603> 7955-9390, Fax: <603> 7955-9510
Colophon 6.2
H8S/2268 Group, H8S/2264 Group
Hardware Manual
1753, Shimonumabe, Nakahara-ku, Kawasaki-shi, Kanagawa 211-8668 Japan
REJ09B0071-0500