Maxim MAX6473TA18BD3 300ma ldo linear regulators with internal microprocessor reset circuit Datasheet

19-2532; Rev 2; 6/03
KIT
ATION
EVALU
E
L
B
A
AVAIL
300mA LDO Linear Regulators with
Internal Microprocessor Reset Circuit
Features
The MAX6469–MAX6484 are low-dropout linear regulators with a fully integrated microprocessor reset circuit.
Each is available with preset output voltages from +1.5V
to +3.3V in 100mV increments and delivers up to 300mA
of load current. These devices consume only 82µA of
supply current. The low supply current, low dropout voltage, and integrated reset functionality make these
devices ideal for battery-powered portable equipment.
♦ 3 ✕ 3 UCSP, 6-Pin SOT23, and 8-Pin QFN Packages
♦ Preset +1.5V to +3.3V Output (100mV Increments)
♦ SET Pin for Adjustable Output Voltage
♦ 75µVRMS LDO Output Voltage Noise
(MAX6477–MAX6484)
♦ ±2.0% Accuracy Over Temperature
♦ Guaranteed 300mA Output Current
The MAX6469–MAX6484 include a reset output that indicates when the regulator output drops below standard
microprocessor supply tolerances (-7.5% or -12.5% of
nominal output voltage). This eliminates the need for an
external microprocessor supervisor, while ensuring that
supply voltages and clock oscillators have stabilized
before processor activity is enabled. Push-pull and opendrain active-low reset outputs are available, with reset
timeout periods of 2.5ms, 20ms, 150ms, or 1200ms (min).
♦ Low Dropout Voltage
55mV at 150mA
114mV at 300mA
The MAX6469/MAX6470/MAX6473–MAX6478/MAX6481–
MAX6484 also have a shutdown feature that reduces the
supply current to 0.1µA (typ). The MAX6471–MAX6474/
MAX6479–MAX6482 offer a manual reset input to assert a
microprocessor reset while the regulator output is within
specification. The MAX6475/MAX6476/MAX6483/
MAX6484 feature a remote feedback sense pin for use
with an external NPN transistor for higher-current applications. The MAX6469–MAX6476 are available in 6-pin
SOT23 and 8-pin thin QFN packages. The MAX6477–
MAX6484 are available in a 3 × 3 chip-scale package
(UCSP™). All devices are specified for operation from
-40°C to +85°C.
♦ Manual Reset Input
Applications
Hand-Held Instruments (PDAs, Palmtops)
PCMCIA Cards/USB Devices
Cellular/Cordless Telephones
CD/DVD Drives
Notebook Computers
Digital Cameras
Bluetooth Modules/Wireless LAN
UCSP is a trademark of Maxim Integrated Products, Inc.
Pin Configurations appear at end of data sheet.
♦ 82µA Supply Current, 0.1µA Shutdown Current
♦ Input Reverse Current, Thermal and Short-Circuit
Protection
♦ Microprocessor Reset with Four Timeout Options
♦ Push-Pull or Open-Drain RESET
♦ Remote Feedback Sense
Ordering Information
TEMP RANGE
PINPACKAGE
MAX6469UT_ _ _D_-T
-40°C to +85°C
6 SOT23-6
MAX6469TA_ _ _D_*
-40°C to +85°C
8 Thin QFN
MAX6470UT_ _ _D_-T
-40°C to +85°C
6 SOT23-6
MAX6470TA_ _ _D_*
-40°C to +85°C
8 Thin QFN
PART
*Future product—contact factory for availability.
Note: The first “_ _”are placeholders for the output voltage levels
of the devices. Desired output voltages are set by the suffix found
in the Output Voltage Suffix Guide (Table 1). The third “_” is a
placeholder for the reset threshold accuracy. Desired reset
threshold accuracy is set by the suffix found in the Reset
Threshold Accuracy Guide (Table 2). The “_” following the D is a
placeholder for the reset timeout delay time. Desired reset timeout
delay time is set by the suffix found in the Reset Timeout Delay
Guide (Table 3). For example, the MAX6481BL30BD4-T has a
3.0V output voltage, 12.5% reset threshold tolerance, and a
1200ms (min) reset timeout delay. Sample stock is generally available on standard versions only (Table 4). Standard versions
require a minimum order increment of 2.5k units. Nonstandard
versions must be ordered in 10k-unit increments. Contact factory
for availability.
Ordering Information continued at end of data sheet.
Typical Operating Circuits appear at end of data sheet.
________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
1
MAX6469–MAX6484
General Description
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND, unless otherwise noted.)
IN, SHDN, OUT, FB ..................................................-0.3V to +7V
MR, SET .......................................................-0.3V to (VIN + 0.3V)
RESET (push-pull) ...................................-0.3V to (VOUT + 0.3V)
RESET (open drain)..................................................-0.3V to +7V
OUT Short Circuit .......................................................Continuous
Input/Output Current (all pins except IN and OUT) ............20mA
Continuous Power Dissipation (TA = +70°C)
3 x 3 UCSP (derate 10.5mW/°C above +70°C) ............840mW
6-Pin SOT23 (derate 9.1mW/°C above +70°C).............727mW
8-Pin Thin QFN
(derate 24.4mW/°C above +70°C) ..............................1951mW
Operating Temperature Range ..........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1: The MAX6477–MAX6484 are constructed using a unique set of packaging techniques that impose a limit on the thermal profile the devices can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder
profiles recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and
Convection reflow. Pre-heating is required. Hand or wave soldering is not allowed.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VIN = (VOUT + 0.5V) or +2.5V, whichever is greater, COUT = 3.3µF, TA = -40°C to +85°C. Typical specifications are at TA = +25°C,
unless otherwise noted.) (Note 2)
PARAMETER
Input Voltage Range
Input Undervoltage Lockout
Supply Current (Ground Current)
Shutdown Supply Current
SYMBOL
CONDITIONS
VIN
VUVLO
IQ
ISHDN
VIN falling
IOUT = 0
IOUT = 300mA
Output Voltage Accuracy (Fixed
Output Voltage Operation,
Table 1) MAX6477–MAX6484
Adjustable Output Voltage Range
SET Reference Voltage
SET Dual ModeTM Threshold
SET Input Leakage Current
82
96
0.1
UNITS
5.5
2.47
136
V
V
1
300
-1.3
-2.3
+1.3
+2.3
1mA ≤ IOUT ≤ 300mA, TA = -40°C to +85°C
-2.7
+2.7
2mA ≤ IOUT ≤ 100mA, TA = +25°C
-1.1
+1.1
2mA ≤ IOUT ≤ 100mA, TA = -40°C to +85°C
-2.0
+2.0
2mA ≤ IOUT ≤ 300mA, TA = -40°C to +85°C
(Note 3)
-2.5
+2.5
VSET
1.200
VSET = 0, +1.2V (Note 3)
µA
µA
mA
1.229
185
±20
Dual Mode is a trademark of Maxim Integrated Products, Inc.
2
MAX
1mA ≤ IOUT ≤ 150mA, TA = +25°C
1mA ≤ IOUT ≤ 150mA, TA = -40°C to +85°C
VSET
ISET
TYP
2.5
2.25
TA = +25°C
REGULATOR CIRCUIT
Output Current
Output Voltage Accuracy (Fixed
Output Voltage Operation,
Table 1) MAX6469–MAX6476
MIN
_______________________________________________________________________________________
5.0
1.258
±100
%
%
V
V
mV
nA
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
(VIN = (VOUT + 0.5V) or +2.5V, whichever is greater, COUT = 3.3µF, TA = -40°C to +85°C. Typical specifications are at TA = +25°C,
unless otherwise noted.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
VOUT = +3.3V
(fixed output operation)
VOUT = +3.0V
(fixed output operation)
Dropout Voltage
(Notes 3, 4)
∆VDO
VOUT = +2.8V
(fixed output operation)
VOUT = +2.5V
(fixed output operation)
Output Current Limit
VIN ≥ 2.5V (Note 3)
Input Reverse Leakage Current
(OUT to IN Leakage Current)
VIN = 4V, VOUT = 5.5V, SHDN deasserted
Startup Time Response
Rising edge of VIN or SHDN to VOUT
within specification, RL = 68Ω, SET = GND,
IOUT = 10mA
SHDN Input Low Voltage
VIL
SHDN Input High Voltage
VIH
SHDN Input Current
Thermal-Shutdown Temperature
Thermal-Shutdown Hysteresis
MIN
IOUT = 50mA
IOUT = 150mA
IOUT = 300mA
IOUT = 50mA
IOUT = 150mA
IOUT = 300mA
IOUT = 50mA
IOUT = 150mA
IOUT = 300mA
IOUT = 50mA
IOUT = 150mA
IOUT = 300mA
TYP
MAX
UNITS
23
55
114
25
61
114
26
65
137
30
75
158
32
90
180
40
100
190
50
110
210
60
150
250
mV
450
mA
0.01
1.5
20
µs
0.3 × VIN
V
+1
µA
0.7 × VIN
SHDN = VIN or GND
-1
µA
V
0.1
TSHDN
180
°C
∆TSHDN
20
°C
Line Regulation
VOUT = 1.5V, 2.5V ≤ VIN ≤ 5.5V,
IOUT = 10mA
0.09
%/V
Load Regulation
VOUT = 1.5V, VIN = 2.5V, 1mA ≤ IOUT ≤
150mA
0.2
%
Output Voltage Noise
10Hz to 100kHz,
CIN = 0.1µF,
IOUT = 100mA,
VOUT = 1.5V
MAX6469–MAX6476
150
MAX6477–MAX6484
75
µVRMS
RESET CIRCUIT
VOUT Reset Threshold
(VFB for MAX6475/MAX6476/
MAX6483/MAX6484) (Note 5)
VTHOUT
MAX64_ _ _ _ _ _ A
90
92.5
95
MAX64_ _ _ _ _ _ B
85
87.5
90
VOUT to Reset Delay
(VFB for MAX6475/MAX6476/
MAX6483/MAX6484)
35
D1
Reset Timeout Period
(Note 6)
tRP
2.5
3.75
%VOUT
µs
5.0
D2
20
30
40
D3
150
225
300
D4
1200
1800
2400
ms
_______________________________________________________________________________________
3
MAX6469–MAX6484
ELECTRICAL CHARACTERISTICS (continued)
ELECTRICAL CHARACTERISTICS (continued)
(VIN = (VOUT + 0.5V) or +2.5V, whichever is greater, COUT = 3.3µF, TA = -40°C to +85°C. Typical specifications are at TA = +25°C,
unless otherwise noted.) (Note 2)
PARAMETER
SYMBOL
MR Input Low Voltage
VIL
MR Input High Voltage
VIH
CONDITIONS
MIN
(Note 3)
TYP
200
VOL
Open-Drain Reset Output
Leakage Current
ILKG
25
ns
ns
40
70
VOUT ≥ 1.0V, ISINK = 50µA, RESET asserted
0.3
VOUT ≥ 1.5V, ISINK = 3.2mA, RESET asserted
0.4
(Note 3)
VOL
RESET Output Voltage Push-Pull
1
VOUT ≥ 1.0V, ISINK = 50µA, RESET asserted
0.3
VOUT ≥ 1.5V, ISINK = 3.2mA, RESET asserted
0.4
VOUT ≥ 2.0V, ISOURCE = 500µA, RESET
deasserted
VOH
Note 2:
Note 3:
Note 4:
Note 5:
Note 6:
V
µs
120
RESET Output Voltage
(Open Drain)
0.3 ×
VOUT
1
MR to Reset Delay
MR to OUT
UNITS
V
MR Glitch Rejection
MR Pullup Resistance
MAX
0.7 ×
VOUT
MR Minimum Input Pulse
kΩ
V
µA
0.8 ×
VOUT
V
All devices are 100% production tested at +25°C and are guaranteed by correlation for TA = TMIN to TMAX.
Guaranteed by design.
Dropout voltage is defined as (VIN - VOUT) when VOUT is 2% below the value of VOUT for VIN = VOUT(NOM) + 1V.
MAX6473/MAX6474/MAX6481/MAX6482 are guaranteed by design for VOUT < 2.5V.
Select the reset timeout period using the Reset Timeout Delay Guide (Table 3). Insert the appropriate suffix in the part number
when ordering.
Typical Operating Characteristics
(VIN = 5V, VOUT = 3.3V, COUT = 3.3µF, TA = +25°C, unless otherwise noted.)
60
40
20
1
2
3
4
INPUT VOLTAGE (V)
5
6
150
MAX6469 toc02
80
60
+25°C
-40°C
40
125
RESET ASSERTS ABOVE
THIS LINE
100
75
50
25
0
0
4
+85°C
20
0
MAXIMUM TRANSIENT DURATION
vs. RESET THRESHOLD OVERDRIVE
PULSE DURATION (µs)
-40°C
80
100
GROUND CURRENT (µA)
+85°C
+25°C
100
120
MAX6469 toc01
120
GROUND CURRENT vs. INPUT VOLTAGE
(300mA LOAD)
MAX6469 toc03
GROUND CURRENT vs. INPUT VOLTAGE
(NO LOAD)
GROUND CURRENT (µA)
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
0
0
1
2
3
4
INPUT VOLTAGE (V)
5
6
1
10
RESET THRESHOLD OVERDRIVE (mV)
_______________________________________________________________________________________
100
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
VOUT = 3.3V
COUT = 3.3µF
ILOAD = 30mA
-10
PSRR (dB)
50
4
COUT ESR (Ω)
-20
75
-30
MAX6469 toc06
100
5
MAX6469 toc05
VOUT = 3.3V
COUT = 3.3µF
3
COUT = 4.7µF
2
COUT = 3.3µF
-40
25
1
-50
STABLE REGION
0
-60
0
50
100
150
200
250
0.01
300
0.1
OUTPUT NOISE
MAX6469 toc07
100
1000
0
50
100
150
200
250
LOAD CURRENT (mA)
OUTPUT NOISE vs. FREQUENCY
SHUTDOWN RESPONSE
VIN = 2.5V
VOUT = 1.5V
IOUT = 100mA
80
100µV/div
10
300
MAX6469 toc09
100
VIN = 4.5V
VOUT = 3.3V
ILOAD = 100mA
1
FREQUENCY (kHz)
LOAD CURRENT (mA)
MAX6469 toc08
0
VRMS (µV)
DROPOUT VOLTAGE (mV)
0
MAX6469 toc04
125
REGION OF STABLE COUT ESR
vs. LOAD CURRENT
PSRR vs. FREQUENCY
DROPOUT VOLTAGE vs. LOAD CURRENT
MAX6469–MAX6484
Typical Operating Characteristics (continued)
(VIN = 5V, VOUT = 3.3V, COUT = 3.3µF, TA = +25°C, unless otherwise noted.)
VSHDN
5V/div
60
40
VOUT
2V/div
20
ILOAD = 50mA
0
500µs/div
10
100
1k
10k
100k
20ms/div
FREQUENCY (Hz)
STARTUP RESPONSE
LOAD-TRANSIENT RESPONSE
NEAR DROPOUT
LOAD-TRANSIENT RESPONSE
MAX6469 toc10
MAX6469 toc12
MAX6469 toc11
VIN = 5V
VOUT = 3.3V
ILOAD = 100mA
VIN
2V/div
10µs/div
VOUT
5mV/div
VOUT
20mV/div
VOUT
2V/div
100µs/div
10µs/div
_______________________________________________________________________________________
5
Typical Operating Characteristics (continued)
(VIN = 5V, VOUT = 3.3V, COUT = 3.3µF, TA = +25°C, unless otherwise noted.)
RESET DELAY RESPONSE
LINE TRANSIENT RESPONSE
RESET RESPONSE TO MR
MAX6469 toc14
MAX6469 toc13
5V
4.5V
MAX6469 toc15
VIN
500mV/div
VIN
1V TO 4V
2V/div
MR
2V/div
RESET
2V/div
RESET
2V/div
VOUT
20mV/div
AC-COUPLED
VOUT = 3.3V
ILOAD = 10mA
200ms/div
100µs/div
200ns/div
MAX6469 toc16
1.012
RESET
2V/div
VOUT
2V/div
VIN
5V/div
MAX6469 toc17
NORMALIZED OUTPUT VOLTAGE
vs. TEMPERATURE
RESET RESPONSE TO VIN RISING
NORMALIZED OUTPUT VOLTAGE
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
NORMALIZED TO +25°C
1.006
ILOAD = 10mA
1.000
0.994
ILOAD = 150mA
ILOAD = 300mA
0.988
200ms/div
-40
-15
10
35
60
TEMPERATURE (°C)
6
_______________________________________________________________________________________
85
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
PIN
BUMP
MAX6469/MAX6470
MAX6477/MAX6478
SOT23
QFN
UCSP
1
1, 2
A1
NAME
IN
FUNCTION
Regulator Input. Bypass IN to GND with a 0.1µF capacitor.
2
3
A2
GND
Ground. This pin also functions as a heatsink. Solder to large pads or
the circuit-board ground plane to maximize thermal dissipation.
3
4
A3
SHDN
Active-Low Shutdown Input. Connect SHDN to VIN for normal
operation.
4
5
C3
RESET
Active-Low Reset Output. RESET remains low while VOUT is below the
reset threshold. RESET remains low for the duration of the reset timeout
period after the reset conditions are terminated. RESET is available in
open-drain and push-pull configurations.
5
6
C2
SET
Feedback Input for Externally Setting the Output Voltage. Connect SET
to GND to select the preset output voltage. Connect SET to an external
resistor-divider network for adjustable output operation.
6
7, 8
C1
OUT
Regulator Output. Bypass OUT to GND with a minimum 3.3µF low-ESR
capacitor.
MAX6471/MAX6472/MAX6479/MAX6480 Pin Description
PIN
BUMP
MAX6471/MAX6472
MAX6479/MAX6480
NAME
SOT23
QFN
UCSP
1
1, 2
A1
IN
2
3
A2
GND
3
4
A3
FUNCTION
Regulator Input. Bypass IN to GND with a 0.1µF capacitor.
Ground. This pin also functions as a heatsink. Solder to large pads or
the circuit-board ground plane to maximize thermal dissipation.
MR
Active-Low Manual Reset Input. The reset output is asserted while MR
is pulled low and remains asserted for the duration of the reset timeout
period after MR transitions from low to high. Leave MR unconnected or
connect to VOUT if not used. MR has an internal pullup resistor of 40kΩ
(typ) to VOUT.
4
5
C3
RESET
Active-Low Reset Output. RESET remains low while VOUT is below the
reset threshold or while MR is held low. RESET remains low for the
duration of the reset timeout period after the reset conditions are
terminated. RESET is available in open-drain and push-pull
configurations.
5
6
C2
SET
Feedback Input for Externally Setting the Output Voltage. Connect SET
to GND to select the preset output voltage. Connect SET to an external
resistor-divider network for adjustable output operation.
6
7, 8
C1
OUT
Regulator Output. Bypass OUT to GND with a minimum 3.3µF low-ESR
capacitor.
_______________________________________________________________________________________
7
MAX6469–MAX6484
MAX6469/MAX6470/MAX6477/MAX6478 Pin Description
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
MAX6469–MAX6484
MAX6473/MAX6474/MAX6481/MAX6482 Pin Description
PIN
BUMP
MAX6473/MAX6474
MAX6481/MAX6482
SOT23
QFN
UCSP
1
1, 2
A1
NAME
IN
FUNCTION
Regulator Input. Bypass IN to GND with a 0.1µF capacitor.
2
3
A2
GND
Ground. This pin also functions as a heatsink. Solder to large pads or
the circuit-board ground plane to maximize thermal dissipation.
3
4
A3
SHDN
Active-Low Shutdown Input. Connect SHDN to VIN for normal
operation.
RESET
Active-Low Reset Output. RESET remains low while VOUT is below the
reset threshold or while MR is held low. RESET remains low for the
duration of the reset timeout period after the reset conditions are
terminated. RESET is available in open-drain and push-pull
configurations.
4
5
C3
5
6
C2
MR
Active-Low Manual Reset Input. The reset output is asserted while MR
is pulled low and remains asserted for the duration of the reset timeout
period after MR transitions from low to high. Leave MR unconnected or
connect to VOUT if not used. MR has an internal pullup resistor of 40kΩ
(typ) to VOUT.
6
7, 8
C1
OUT
Regulator Output. Bypass OUT to GND with a minimum 3.3µF (min)
low-ESR capacitor.
MAX6475/MAX6476/MAX6483/MAX6484 Pin Description
8
PIN
BUMP
MAX6475/MAX6476
MAX6483/MAX6484
SOT23
QFN
UCSP
1
1, 2
A1
NAME
IN
FUNCTION
Regulator Input. Bypass IN to GND with a 0.1µF capacitor.
2
3
A2
GND
Ground. This pin also functions as a heatsink. Solder to large pads or
the circuit-board ground plane to maximize thermal dissipation.
3
4
A3
SHDN
Active-Low Shutdown Input. Connect SHDN to VIN for normal
operation.
Active-Low Reset Output. RESET remains low while FB is below the
reset threshold. RESET remains low for the duration of the reset
timeout period after the reset conditions are terminated. RESET is
available in open-drain and push-pull configurations.
4
5
C3
RESET
5
6
C2
FB
Feedback Input for Linear Regulator Controller or Remote Sense
Applications. Connect FB to the external load (VCC) to obtain the fixed
output voltage.
6
7, 8
C1
OUT
Regulator Output. Bypass OUT to GND with a minimum 3.3µF low-ESR
capacitor.
_______________________________________________________________________________________
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
2.5V TO 5.5V
IN
OUT
MAX6469–MAX6472
MAX6477–MAX6480
SET
(MR)
MANUAL
RESET
R1
COUT
GND
R2
Regulator
The regulator core operates with +2.5V to +5.5V input
voltage range. The output voltage is offered in 100mV
increments between +1.5V and +3.3V (contact factory
for other output voltage options). The MAX6469–
MAX6472/MAX6477–MAX6480 offer an adjustable output voltage implemented with an external resistordivider network between OUT, SET, and GND (Figure
1). SET must be connected to either GND for fixed
VOUT or to an external divider for adjustable VOUT. The
MAX6469–MAX6472/MAX6477–MAX6480 automatically
determine the feedback path depending on the connection of SET. The Typical Operating Circuit shows a
typical connection for the MAX6469. OUT is an internally regulated low-dropout (LDO) linear regulator that
powers a microprocessor.
Reset Circuit
The reset supervisor circuit is fully integrated in the
MAX6469–MAX6484 and uses the same reference voltage as the regulator. Two supply tolerance reset
thresholds, -7.5% and -12.5%, are provided for each
type of device.
-7.5% Reset: Reset does not assert until the regulator
output voltage is at least -5% out of tolerance and
always asserts before the regulator output voltage is
-10% out of tolerance.
-12.5% Reset: Reset does not assert until the regulator
output voltage is at least -10% out of tolerance and
always asserts before the regulator output voltage is
-15% out of tolerance.
RESET Output
A µP’s reset input starts the µP in a known state. The
MAX6469–MAX6484 µP supervisory circuits assert
RESET during power-up, power-down, and brownout
conditions. RESET asserts when the input voltage is
below the undervoltage lockout threshold. RESET
asserts when VOUT is below the reset threshold and
remains asserted for at least the minimum selected reset
timeout period (tRP, Table 3) after VIN rises above the
undervoltage lockout threshold and VOUT rises above
( ) ARE FOR MAX6471/MAX6472/MAX6479/MAX6480 ONLY
Figure 1. Adjustable Output Voltage Configuration
the reset threshold. RESET asserts when MR is pulled
low (MAX6471–MAX6474/MAX6479–MAX6482). RESET
asserts when SHDN is pulled low (MAX6469/
MAX6470/MAX6473–MAX6478/MAX6481–MAX6484).
Shutdown
(MAX6469/MAX6470/MAX6473–MAX6478/MAX6481–
MAX6484 only)
SHDN allows the regulator to shut down, thereby reducing the total IIN consumption of the device. SHDN provides a digitally controlled active-low shutdown. In
shutdown mode, the pass transistor, control circuit, and
reference turn off to reduce the supply current to below
0.1µA. Connect SHDN to IN for normal operation.
Manual Reset Input
(MAX6471–MAX6474/MAX6479–MAX6482 only)
Many µP-based products require manual reset capability, allowing the operator, a test technician, or external
logic circuitry to initiate a reset. A logic low on MR
asserts reset while the regulator output voltage is still
within tolerance.
Reset remains asserted while MR is low and for the
reset timeout period (tRP) after MR returns high. The
MR input has an internal pullup of 40kΩ (typ) to OUT.
MR can be driven with TTL/CMOS logic levels or with
open-drain/collector outputs. Connect a normally open
switch from MR to GND to create a manual reset function; external debounce circuitry is not required. If MR
is driven from long cables or the device is used in a
noisy environment, connect a 0.1µF capacitor from MR
to GND to provide additional noise immunity.
Feedback Input
(MAX6475/MAX6476/MAX6483/MAX6484 only)
The feedback input (FB) connects to an internal resistordivider network (Functional Diagram). FB is not internally
connected to VOUT, and as a result can be used to
_______________________________________________________________________________________
9
MAX6469–MAX6484
Detailed Description
The MAX6469–MAX6484 are ultra-low, quiescent current, low-dropout linear regulators with an integrated
microprocessor reset circuit. These devices guarantee
300mA (min) drive capabilities and are available with
preset output voltages in 100mV increments between
+1.5V and +3.3V. The internal reset circuit monitors the
regulator output voltage and asserts the reset output
when the regulator output is below the microprocessor
supply tolerance.
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
remotely sense the output voltage of the device. Using
FB with an external NPN transistor, the current drive
capability can be increased according to the following
equation (Figure 2):
IOUT(TOTAL) = IOUT ✕ (β+1)
The external NPN pass transistor must meet specifications for current gain, power dissipation, and collector
current. The beta influences the maximum output current the circuit can deliver. The largest guaranteed output current is given by ILOAD (max) = 300mA × beta
(min). The transistor’s rated power dissipation must
exceed the actual power dissipated in the transistor.
The power dissipated (PD) equals the maximum load
current (ILOAD (max)) times the maximum input-to-output voltage differential: PD = ILOAD (max) × (VIN (max) V OUT ). The rated transistor collector current must
exceed the maximum load current.
Reverse Leakage Protection
Reverse OUT to IN Current
An internal circuit monitors the MAX6469–MAX6484
input and output voltages. When the output voltage is
greater than the input voltage, the internal IN-to-OUT
pass transistor and parasitic diode turn off. An external
voltage applied to OUT does not reverse charge a battery or power source applied to IN (the leakage path
from OUT to IN is 0.01µA typ). When the output voltage
exceeds the input voltage, OUT powers the device and
shutdown must be logic high (greater than 0.7 ✕ VOUT).
RESET asserts until IN exceeds OUT and OUT is above
the specified VTHOUT threshold (based on the selected
or adjusted regulator OUT nominal voltage).
OUT-to-GND current through the LDO is 40µA (typ). The
regulator output can be held up with an external super
capacitor or backup battery at OUT until the IN battery is
replaced. The RESET output is asserted while the IN battery is removed to place the system in a low-power
mode. Volatile memory content is maintained until the
super capacitor or battery voltage drops below RAM
standby specifications. RESET deasserts when the IN
battery has been replaced and OUT exceeds the
desired reset threshold. For nonrechargeable backup
battery applications, place a reverse diode between
OUT and the backup battery (to prevent battery charging). The external diode does not affect the regulator’s
dropout voltage because it is not between the LDO output and the processor/memory Vcc supply. The diode
can be replaced with a current-limiting resistor for
rechargeable backup battery applications.
Current Limit
The MAX6469–MAX6484 include an internal currentlimit circuit that monitors and controls the pass transistor’s gate voltage, limiting the output current to 450mA
(min). The output can be shorted to ground indefinitely
without damaging the part.
Thermal Shutdown
When the junction temperature (TJ) exceeds +180°C
(typ), the thermal sensor signals the shutdown logic,
turning off the pass transistor and allowing the IC to
REMOVABLE
LITHIUM ION OR
3-CELL
ALKALINE
IN
Reverse OUT to Ground Current
The MAX6469–MAX6484 maintain a low OUT-to-GND
reverse-current flow when the IN power source is
removed. When IN floats (input battery removed) and
SHDN is pulled up to VOUT (by an external diode), the
OUT
MAX6469–
MAX6484
3.3µF
3.0V
LITHIUM
µP
MEMORY
µP
MEMORY
SHDN
5.0V
1A TOTAL CURRENT
IN
VCC = 3.3V
REMOVABLE
LITHIUM ION OR
3-CELL
ALKALINE
OUT
IN
OUT
MAX6475/MAX6476
MAX6483/MAX6484
330Ω
3.3µF
0.1µF
MAX6469–
MAX6484
RPULLUP
FB
µP
3.3µF
SUPERCAP
SHDN
GND
RESET
Figure 2. High-Current, External Transistor Application
10
Figure 3. Battery Backup
______________________________________________________________________________________
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
Operating Region and Power Dissipation
The MAX6469–MAX6484’s maximum power dissipation
depends on the thermal resistance of the case and circuit board, the temperature difference between the die
junction and the ambient air, and the rate of airflow. The
power dissipation across the device is:
P = IOUT (VIN - VOUT)
The maximum power dissipation is:
PMAX = (TJ - TA) / (ØJB + ØBA)
where TJ - TA is the temperature difference between the
die junction and the surrounding air, ØJB (or ØJC) is the
thermal resistance of the package, and ØBA is the thermal resistance through the PC board, copper traces,
and other materials to the surrounding air. The
MAX6469–MAX6476 QFN package ØJC = 41°C/W, and
the MAX6469–MAX6476 SOT package ØJC = 110°C/W.
The MAX6469–MAX6484’s ground pin (GND) performs
the dual function of providing an electrical connection
to the system ground and channeling heat away.
Connect GND to the system ground using a large pad
or ground plane. For continuous operation, do not
exceed the absolute maximum junction temperature
rating of TJMAX = +150°C.
Applications Information
Output Voltage Selection
The MAX6469–MAX6484 feature dual-mode operation:
they operate in either a preset output voltage mode
or an adjustable mode. In preset voltage mode, internal
feedback resistors set the MAX6469–MAX6484’s output
from +1.5V to +3.3V (Table 1). Select this mode by connecting SET to ground (MAX6469–MAX6472/
MAX6477–MAX6480). In adjustable mode, select an
output between 1.25V and 5.5V using two external
resistors connected as a voltage-divider to SET (Figure
1). The output voltage is set by the following equation:
VOUT = VSET (1 + R1 / R2)
where VSET = 1.23V. To simplify resistor selection:
R1 = R2 (VOUT / VSET - 1)
Choose R2 = 50kΩ to maintain stability, accuracy and
high-frequency power-supply rejection. Avoid selecting
resistor values greater than 100kΩ. In preset voltage
mode, the impedance between SET and ground should
always be less than 50kΩ. In most applications, connect SET directly to ground.
Low-Noise UCSP Output
MAX6477–MAX6484 UCSP products include internal filtering to yield low output noise without an additional
external bypass capacitor. The devices yield 75µVRMS
(typ) output noise (for VOUT = 3.0V) and 150µVRMS (for
V OUT = 3.3V). This low-noise feature makes the
MAX6477–MAX6484 ideal for audio applications.
Capacitor Selection and Regulator
Stability
For stable operation over the full temperature range
and with load currents up to 300mA, use a 3.3µF (min)
ceramic output capacitor with an ESR <0.2Ω. To
reduce noise and improve load transient response, stability, and power-supply rejection, use large output
capacitor values such as 10µF.
Note that some ceramic capacitors exhibit large capacitance and ESR variation with temperature. With capacitor dielectrics such as Z5U and Y5V, use 4.7µF or more
to ensure stability over temperature. With X7R or X5R
capacitor dielectrics, 3.3µF should be sufficient at all
operating temperatures. Higher ESR capacitors require
more capacitance to maintain stability. A graph of the
Region of Stable ESR vs. Load Current is shown in the
Typical Operating Characteristics.
To improve power-supply rejection and transient
response, use a 1µF capacitor between IN and GND.
The MAX6469–MAX6484 remain stable with purely
resistive loads or current loads up to 300mA.
Reset Transient Immunity
The reset circuit is relatively immune to short-duration,
falling V OUT transients. The Typical Operating
Characteristics section shows a graph of the Maximum
Transient Duration vs. Reset Threshold Overdrive for
which reset is not asserted. The graph was produced
using falling VOUT transients starting at VOUT and ending below the reset threshold by the magnitude indicated (reset threshold overdrive). The graph shows the
maximum pulse width that a falling VOUT transient can
typically have without triggering a reset pulse. As the
amplitude of the transient increases (i.e., goes further
below the reset threshold), the maximum allowable
pulse width decreases. Typically, a VOUT transient that
goes only 10mV below the reset threshold and lasts for
75µs does not trigger a reset pulse.
______________________________________________________________________________________
11
MAX6469–MAX6484
cool. The thermal sensor turns the pass transistor on
again after the IC’s junction temperature cools by 20°C,
resulting in a pulsed output during continuous thermal
overload conditions. Thermal overload protection is
designed to protect the MAX6469–MAX6484 in the
event of fault conditions. For continuous operation, do
not exceed the absolute maximum junction temperature
rating of TJMAX = +150°C.
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
Power Dissipation Consideration
UCSP Reliability
For the SOT23 package, any pin except the SET pin
can be used as a heatsink. If the SET pin is used as a
heatsink, excessive parasitic capacitance can affect
stability. For the QFN package, the exposed metal pad
on the back side of a package connects to GND of the
chip. This metal pad can be used as a heatsink.
For general UCSP package information and PC layout
considerations, refer to Maxim Application Note: WaferLevel Chip-Scale Package.
The chip-scale package (UCSP) represents a unique
packaging form factor that might not perform equally to
a packaged product through traditional mechanical
reliability tests. CSP reliability is integrally linked to the
user’s assembly methods, circuit-board material, and
usage environment. The user should closely review
these areas when considering a CSP package.
Performance through operating life test and moisture
resistance remains uncompromised, because it is primarily determined by the wafer-fabrication process.
Mechanical stress performance is a greater consideration for a CSP package. CSPs are attached through
direct solder contact to the user’s PC board, forgoing
the inherent stress relief of a packaged product’s lead
frame. Solder-joint contact integrity must be considered.
Information on Maxim’s qualification plan, test data, and
recommendations are detailed in the UCSP application
note on Maxim’s website at www.maxim-ic.com.
Table 1. Output Voltage Suffix Guide
Table 2. Reset Threshold Accuracy Guide
UCSP Consideration
SUFFIX
OUTPUT
VOLTAGE (V)
SUFFIX
VOUT RESET
TOLERANCE (%)
15
1.5
A
-7.5
16
1.6
B
-12.5
17
1.7
18
1.8
19
1.9
20
2.0
21
2.1
22
23
Table 3. Reset Timeout Delay Guide
SUFFIX
MINIMUM RESET
TIMEOUT PERIOD (ms)
2.2
D1
2.5
2.3
D2
20
24
2.4
D3
150
25
2.5
D4
1200
26
2.6
27
2.7
28
2.8
285
2.85
29
2.9
30
3.0
31
3.1
32
3.2
33
3.3
Note: Factory-trimmed custom output voltages may be available; contact factory for availability.
12
______________________________________________________________________________________
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
MAX6469–MAX6484
Table 4. Standard Versions
DEVICE
MAX6469TA15BD3
MAX6469TA18AD3
MAX6469TA25BD3
TOP MARK
DEVICE
TOP MARK
ADO
MAX6471UT28BD3
ABLG
ADP
ADQ
MAX6471UT30AD3
ABLH
ABLI
AEF
MAX6469TA28AD3
ACT
MAX6471UT33BD3
MAX6472TA15AD3
MAX6469TA30BD3
ADR
MAX6472TA18BD3
ACW
MAX6469TA33AD3
MAX6469UT15BD3
ADS
ABKS
MAX6472TA25AD3
AEG
MAX6469UT18AD3
ABKT
MAX6472TA28BD3
MAX6472TA30AD3
AEH
AEI
MAX6469UT25BD3
ABKU
MAX6472TA33BD3
AEJ
MAX6469UT28AD3
MAX6469UT285AD3
ABFF
ABMZ
MAX6472UT15AD3
ABLJ
MAX6469UT285BD3
ABFI
ABLK
ABNA
MAX6472UT18BD3
MAX6472UT25AD3
MAX6469UT30BD3
ABKV
MAX6472UT28BD3
ABLL
MAX6469UT33AD3
MAX6470TA15BD3
ABKW
ADT
MAX6472UT30AD3
ABLM
MAX6470TA18AD3
ADU
MAX6472UT33BD3
MAX6473TA15AD3
ABLN
AEK
MAX6470TA25BD3
ADV
MAX6473TA18BD3
AEL
MAX6470TA28AD3
MAX6470UT285AD3
ADW
ABNB
MAX6473TA25AD3
AEM
MAX6470UT285BD3
AEN
AEO
ABNC
MAX6473TA28BD3
MAX6473TA30AD3
MAX6470TA30BD3
ADY
MAX6473TA33BD3
AEP
MAX6470TA33AD3
MAX6470UT15BD3
ACU
ABKX
MAX6473UT15AD3
ABLO
MAX6470UT18AD3
ABKY
MAX6473UT18BD3
MAX6473UT25AD3
ABLP
ABLQ
MAX6470UT25BD3
ABKZ
MAX6473UT28BD3
ABLR
MAX6470UT28AD3
MAX6470UT30BD3
ABLA
ABLB
MAX6473UT30AD3
ABLS
MAX6470UT33AD3
ABLC
MAX6473UT33BD3
MAX6474TA15AD3
ABLT
AEQ
MAX6471TA15AD3
ADZ
MAX6474TA18BD3
AER
MAX6471TA18BD3
MAX6471TA25AD3
AEA
AEB
MAX6474TA25AD3
AES
MAX6471TA28BD3
AEC
MAX6471TA30AD3
AED
MAX6471TA33BD3
MAX6471UT15AD3
AEE
ABLD
MAX6471UT18BD3
ABLE
MAX6471UT25AD3
ABLF
______________________________________________________________________________________
13
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
Table 4. Standard Versions (continued)
DEVICE
MAX6474TA28BD3
MAX6474TA30AD3
TOP MARK
DEVICE
TOP MARK
AET
AEU
MAX6478BL28AD3
MAX6478BL30BD3
ACE
ACF
MAX6474TA33BD3
AEV
MAX6478BL33AD3
ACG
MAX6474UT15AD3
ABLU
MAX6479BL15AD3
ACH
MAX6474UT18BD3
MAX6474UT25AD3
ABLV
ABLW
MAX6479BL18BD3
MAX6479BL25AD3
ACI
ACJ
MAX6474UT28BD3
ABLX
MAX6479BL28BD3
ACK
MAX6474UT30AD3
ABLY
MAX6479BL30AD3
ACL
MAX6474UT33BD3
MAX6475TA15BD3
ABLZ
AEW
MAX6479BL33BD3
MAX6480BL15BD3
ACM
ACN
MAX6475TA18AD3
AEX
MAX6480BL18AD3
ACO
MAX6475TA25BD3
AEY
MAX6480BL25BD3
ACP
MAX6475TA28AD3
MAX6475TA30BD3
AEZ
AFA
MAX6480BL28AD3
MAX6480BL30BD3
ACQ
ACR
MAX6475TA33AD3
ACZ
MAX6480BL33AD3
ABJ
MAX6475UT15BD3
ABMA
MAX6481BL15BD3
ACS
MAX6475UT18AD3
MAX6475UT25BD3
ABMB
ABMC
MAX6481BL18AD3
MAX6481BL25BD3
ACT
ACU
MAX6475UT28AD3
ABMD
MAX6481BL28AD3
ACV
MAX6475UT30BD3
ABME
MAX6481BL30BD3
ACW
MAX6475UT33AD3
MAX6476TA15BD3
ABFL
AFB
MAX6481BL33AD3
MAX6482BL15BD3
ACX
ACY
MAX6476TA18AD3
AFC
MAX6482BL18AD3
ACZ
MAX6476TA25BD3
AFD
MAX6482BL25BD3
ADA
MAX6476TA28AD3
MAX6476TA30BD3
AFE
AEF
MAX6482BL28AD3
MAX6482BL30BD3
ADB
ADC
MAX6476TA33AD3
AFG
MAX6482BL33AD3
ADD
MAX6476UT15BD3
ABMF
MAX6483BL15BD3
ADE
MAX6476UT18AD3
MAX6476UT25BD3
ABMG
ABMH
MAX6483BL18AD3
MAX6483BL25BD3
ADF
ADG
MAX6476UT28AD3
ABMI
MAX6483BL28AD3
ADH
MAX6476UT30BD3
ABMJ
MAX6483BL30BD3
ADI
MAX6476UT33AD3
MAX6477BL15BD3
ABMK
ABW
MAX6483BL33AD3
MAX6484BL15BD3
ADJ
ADK
MAX6477BL18AD3
ABG
MAX6484BL18AD3
ADL
MAX6477BL25BD3
ABX
MAX6484BL25BD3
ADM
MAX6477BL28AD3
MAX6477BL30BD3
ABY
ABZ
MAX6484BL28AD3
MAX6484BL30BD3
ADN
ADO
MAX6477BL33AD3
ACA
MAX6484BL33AD3
ADP
MAX6478BL15BD3
ACB
MAX6478BL18AD3
MAX6478BL25BD3
ACC
ACD
14
Sample stock is generally available on standard versions only.
Standard versions require a minimum order increment of 2.5k
units. Nonstandard versions must be ordered in 10k-unit increments. Contact factory for availability.
______________________________________________________________________________________
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
TOP VIEW
IN 1
MAX6469
MAX6470
GND 2
SHDN 3
6
OUT
5
SET
4
RESET
IN
1
IN
2
GND
3
6
SET
SHDN 4
5
RESET
1
IN
2
8
OUT
IN 1
MAX6471 7 OUT
MAX6472
GND 2
3
6
SET
MR 4
5
RESET
GND
OUT
IN 1
MAX6469 7 OUT
MAX6470
GND 2
MR 3
SHDN 3
6
OUT
5
MR
4
RESET
IN
1
MAX6475
MAX6476
GND 2
SHDN 3
6
OUT
5
FB
4
RESET
IN
C2 MAX6478
A2
GND
C3
A3
SHDN
SET
RESET
MAX6477
IN
1
IN
C2 MAX6480
A2
GND
C3
A3
MR
SET
RESET
MAX6479
3 x 3 UCSP
RESET
IN
2
7
OUT
GND
3
6
MR
SHDN 4
5
RESET
MAX6473
MAX6474
OUT
IN
2
7
OUT
GND
3
6
FB
SHDN 4
5
RESET
MAX6475
MAX6476
OUT
MR
RESET
A1
IN
C2 MAX6482
A2
GND
C3
A3
SHDN
A1
IN
C2 MAX6484
A2
GND
C3
A3
SHDN
C1
MAX6481
3 x 3 UCSP
A1
C1
4
OUT
8
3 x 3 UCSP
OUT
SET
THIN QFN
A1
C1
5
THIN QFN
SOT23-6
OUT
OUT
8
SOT23-6
IN 1
6
SOT23-6
MAX6473
MAX6474
THIN QFN
UCSP DEVICES SHOWN AS
MOUNTED ON PC BOARD.
BALL SOLDERED DOWN.
MAX6471
MAX6472
THIN QFN
SOT23-6
IN
8
OUT
FB
RESET
C1
MAX6483
3 x 3 UCSP
______________________________________________________________________________________
15
MAX6469–MAX6484
Pin Configurations
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
Functional Diagrams
IN
SHDN
IN
THERMAL SENSOR
REVERSE
LEAKAGE
PROTECTION
OUT
SHDN*
THERMAL SENSOR
REVERSE
LEAKAGE
PROTECTION
OUT
MOS DRIVER WITH
CURRENT LIMIT
MOS DRIVER WITH
CURRENT LIMIT
ERROR
AMP
FB
ERROR
AMP
SET**
FEEDBACK-MODE
COMPARATOR
1.23V
MAX6475/MAX6476
MAX6483/MAX6484
1.23V
185mV
RESET
TIMEOUT
RESET
TIMEOUT
OUTPUT
STAGE
RESET
COMPARATOR
MAX6469–MAX6474
MAX6477–MAX6482
GND
MR***
*MAX6469/MAX6470/MAX6473–MAX6478/MAX6481–MAX6484
**MAX6469–MAX6472/MAX6477–MAX6480
***MAX6471–MAX6474/MAX6479–MAX6482
GND
Typical Operating Circuit
Chip Information
TRANSISTOR COUNT: 1041
PROCESS: BiCMOS
2.5V TO 5.5V
IN
VCC
OUT
3.3µF
MAX6469/MAX6470
MAX6477/MAX6478
SET
RESET
GND
16
RESET
RESET
RESET
COMPARATOR
SHDN
OUTPUT
STAGE
µP
RESET
GND
______________________________________________________________________________________
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
PART
TEMP RANGE
MAX6469–MAX6484
Ordering Information (continued)
PINPACKAGE
MAX6471UT_ _ _D_-T
-40°C to +85°C
6 SOT23-6
MAX6471TA_ _ _D_*
-40°C to +85°C
8 Thin QFN
MAX6472UT_ _ _D_-T
-40°C to +85°C
6 SOT23-6
MAX6472TA_ _ _D_*
-40°C to +85°C
8 Thin QFN
MAX6473UT_ _ _D_-T
-40°C to +85°C
6 SOT23-6
MAX6473TA_ _ _D_*
-40°C to +85°C
8 Thin QFN
MAX6474UT_ _ _D_-T
-40°C to +85°C
6 SOT23-6
MAX6474TA_ _ _D_*
-40°C to +85°C
8 Thin QFN
MAX6475UT_ _ _D_-T
-40°C to +85°C
6 SOT23-6
MAX6475TA_ _ _D_*
-40°C to +85°C
8 Thin QFN
MAX6476UT_ _ _D_-T
-40°C to +85°C
6 SOT23-6
MAX6476TA_ _ _D_*
-40°C to +85°C
8 Thin QFN
MAX6477BL_ _ _D_-T
-40°C to +85°C
6 UCSP
MAX6478BL_ _ _D_-T
-40°C to +85°C
6 UCSP
MAX6479BL_ _ _D_-T
-40°C to +85°C
6 UCSP
MAX6480BL_ _ _D_-T
-40°C to +85°C
6 UCSP
MAX6481BL_ _ _D_-T
-40°C to +85°C
6 UCSP
MAX6482BL_ _ _D_-T
-40°C to +85°C
6 UCSP
MAX6483BL_ _ _D_-T
-40°C to +85°C
6 UCSP
MAX6484BL_ _ _D_-T
-40°C to +85°C
6 UCSP
*Future product—contact factory for availability.
Note: The first “_ _”are placeholders for the output voltage levels
of the devices. Desired output voltages are set by the suffix found
in the Output Voltage Suffix Guide (Table 1). The third “_” is a
placeholder for the reset threshold accuracy. Desired reset
threshold accuracy is set by the suffix found in the Reset
Threshold Accuracy Guide (Table 2). The “_” following the D is a
placeholder for the reset timeout delay time. Desired reset timeout
delay time is set by the suffix found in the Reset Timeout Delay
Guide (Table 3). For example, the MAX6481BL30BD4-T has a
3.0V output voltage, 12.5% reset threshold tolerance, and a
1200ms (min) reset timeout delay. Sample stock is generally available on standard versions only (Table 4). Standard versions
require a minimum order increment of 2.5k units. Nonstandard
versions must be ordered in 10k-unit increments. Contact factory
for availability.
______________________________________________________________________________________
17
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
MAX6469–MAX6484
Selector Guide
18
PUSH-PULL
RESET
OPEN-DRAIN
RESET
PACKAGE
—
√
—
SOT23-6/8-QFN
—
—
√
SOT23-6/8-QFN
—
√
—
SOT23-6/8-QFN
—
—
√
SOT23-6/8-QFN
√
—
√
—
SOT23-6/8-QFN
√
√
—
—
√
SOT23-6/8-QFN
√
—
√
√
—
SOT23-6/8-QFN
—
√
—
√
—
√
SOT23-6/8-QFN
MAX6477
√
√
—
—
√
—
3 x 3 UCSP B9-3
MAX6478
√
√
—
—
—
√
3 x 3 UCSP B9-3
MAX6479
√
—
√
—
√
—
3 x 3 UCSP B9-3
MAX6480
√
—
√
—
—
√
3 x 3 UCSP B9-3
MAX6481
—
√
√
—
√
—
3 x 3 UCSP B9-3
MAX6482
—
√
√
—
—
√
3 x 3 UCSP B9-3
MAX6483
—
√
—
√
√
—
3 x 3 UCSP B9-3
MAX6484
—
√
—
√
—
√
3 x 3 UCSP B9-3
PART
SET
SHDN
MR
FB
MAX6469
√
√
—
MAX6470
√
√
—
MAX6471
√
—
√
MAX6472
√
—
√
MAX6473
—
√
MAX6474
—
MAX6475
—
MAX6476
______________________________________________________________________________________
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
6LSOT.EPS
PACKAGE OUTLINE, SOT-23, 6L
F
1
1
9LUCSP, 3x3.EPS
21-0058
PACKAGE OUTLINE, 3x3 UCSP
21-0093
I
1
1
______________________________________________________________________________________
19
MAX6469–MAX6484
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
6, 8, &10L, QFN THIN.EPS
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
L
A
D
D2
A2
PIN 1 ID
1
N
1
C0.35
b
E
PIN 1
INDEX
AREA
[(N/2)-1] x e
REF.
E2
DETAIL A
e
k
A1
CL
CL
L
L
e
e
A
DALLAS
SEMICONDUCTOR
PROPRIETARY INFORMATION
TITLE:
PACKAGE OUTLINE, 6, 8 & 10L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY
APPROVAL
DOCUMENT CONTROL NO.
21-0137
REV.
D
1
2
COMMON DIMENSIONS
SYMBOL
A
MIN.
0.70
MAX.
0.80
D
2.90
3.10
E
2.90
3.10
A1
0.00
0.05
L
k
0.20
0.40
0.25 MIN.
A2
0.20 REF.
PACKAGE VARIATIONS
PKG. CODE
N
D2
E2
e
JEDEC SPEC
b
T633-1
6
1.50–0.10
2.30–0.10
0.95 BSC
MO229 / WEEA
0.40–0.05
1.90 REF
T833-1
8
1.50–0.10
2.30–0.10
0.65 BSC
MO229 / WEEC
0.30–0.05
1.95 REF
T1033-1
10
1.50–0.10
2.30–0.10
0.50 BSC
MO229 / WEED-3
0.25–0.05
2.00 REF
[(N/2)-1] x e
DALLAS
SEMICONDUCTOR
PROPRIETARY INFORMATION
TITLE:
PACKAGE OUTLINE, 6, 8 & 10L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
APPROVAL
DOCUMENT CONTROL NO.
21-0137
REV.
D
2
2
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
20 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2003 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.