ZMD MDS745 Package sop32 Datasheet

March 1997
1. Amendment November 1997
ZMD-Standard
Package SOP32
(300 mil)
MDS
745
Dimensions in millimetres
Based on JEDEC: JEP95 MO-119
A2
X
A
1 Dimensions
View X
k x 45
0,1
1
Z
bp
e
HE
E
0,2 M
D
Dimensions of Sub-Group B1
Dimensions of Sub-Group C1
Amax
2,54
Amin
2,29
bPmin
0,36
A1min
0,102
bPmax
0,51
A1max
0,254
enom
1,27
A2min
2,18
HEmin
10,29
A2max
2,29
HEmax
10,64
cmin
0,15
LPmin
0,53
cmax
0,32
Zmax
0,91
Dmin*
20,57
Dmax*
20,88
2 Weight
 0,91 g
Emin*
7,42
3 Package Body Material
Low Stress Epoxy
Emax*
7,60
4 Lead Material
FeNi-Alloy or Cu-Alloy
kmin
0,25
5 Lead Finish
solder plating
°min
0
6 Lead Form
Z-bends
°max
8
* without mold-flash
Zentrum Mikroelektronik Dresden
Editor: signed Schoder
Date: 27.03.1997
Check: signed Marx
Quality: signed Lorenz
Doc-No.
QS-000745-HD-01
°
A1
LP
c
32
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