March 1997 1. Amendment November 1997 ZMD-Standard Package SOP32 (300 mil) MDS 745 Dimensions in millimetres Based on JEDEC: JEP95 MO-119 A2 X A 1 Dimensions View X k x 45 0,1 1 Z bp e HE E 0,2 M D Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax 2,54 Amin 2,29 bPmin 0,36 A1min 0,102 bPmax 0,51 A1max 0,254 enom 1,27 A2min 2,18 HEmin 10,29 A2max 2,29 HEmax 10,64 cmin 0,15 LPmin 0,53 cmax 0,32 Zmax 0,91 Dmin* 20,57 Dmax* 20,88 2 Weight 0,91 g Emin* 7,42 3 Package Body Material Low Stress Epoxy Emax* 7,60 4 Lead Material FeNi-Alloy or Cu-Alloy kmin 0,25 5 Lead Finish solder plating °min 0 6 Lead Form Z-bends °max 8 * without mold-flash Zentrum Mikroelektronik Dresden Editor: signed Schoder Date: 27.03.1997 Check: signed Marx Quality: signed Lorenz Doc-No. QS-000745-HD-01 ° A1 LP c 32