NCP565 1.5 A Low Dropout Linear Regulator The NCP565 low dropout linear regulator will provide 1.5 A at a fixed output voltage or an adjustable voltage down to 0.9 V. The fast loop response and low dropout voltage make this regulator ideal for applications where low voltage and good load transient response are important. Device protection includes current limit, short circuit protection, and thermal shutdown. The NCP565 is packaged in a 5 pin D2PAK for adjustable voltage version and a 3 pin D2PAK for fixed voltage version. http://onsemi.com MARKING DIAGRAMS Features • • • • • • • • • • Pb−Free Packages are Available Ultra Fast Transient Response (1.0 s) Low Ground Current (1.1 mA @ Iload = 1.5 A) Low Dropout Voltage (0.9 V @ Iload = 1.5 A) Low Noise (28 Vrms) 0.9 V Reference Voltage Adjustable Output Voltage from 7.7 V down to 0.9 V 1.2 V Fixed Output Version. Other Fixed Voltages Available on Request Current Limit Protection (3.5 A) Thermal Shutdown Protection (155°C) D2PAK CASE 936 FIXED 1 2 3 Tab = Ground Pin 1. Vin 2. Ground 3. Vout D2PAK CASE 936A ADJUSTABLE 1 5 Typical Applications • • • • NC P565D2Txx AWLYWWG NC P565D2Txx AWLYWWG Tab = Ground Pin 1. N.C. 2. Vin 3. Ground 4. Vout 5. Adj Servers ASIC Power Supplies Post Regulation for Power Supplies Constant Current Source xx A WL Y WW G = R4 or 12 = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. Semiconductor Components Industries, LLC, 2004 July, 2004 − Rev. 8 1 Publication Order Number: NCP565/D NCP565 PIN DESCRIPTION Pin No. Adjustable Version Pin No. Fixed Version Symbol 1 − N.C. 2 1 Vin 3, Tab 2, Tab Ground 4 3 Vout Regulated Output Voltage 5 − Adj This pin is to be connected to the Rsense resistors on the output. The linear regulator will attempt to maintain 0.9 V between this pin and ground. Refer to Figure 1 for the equation. ÁÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Description − Positive Power Supply Input Voltage Power Supply Ground MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage (Note 1) Vin 9.0 V Output Pin Voltage Vout −0.3 to Vin + 0.3 V Adjust Pin Voltage Vadj −0.3 to Vin + 0.3 V °C/W Thermal Characteristics (Note 2) Case 936A Thermal Resistance, Junction−to−Air Thermal Resistance, Junction−to−Case RJA RJC 45 5.0 Operating Junction Temperature Range TJ −40 to 150 °C Storage Temperature Range Tstg −55 to 150 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. This device series contains ESD protection and exceeds the following tests: Human Body Model JESD 22−A114−B Machine Model JESD 22−A115−A 2. The maximum package power dissipation is: TJ(max) TA PD RJA Vin C1 Voltage Reference Block Vin C1 Voltage Reference Block Vref = 0.9 V Output Stage Vout 5.6 pF Vref = 0.9 V R1 R1 C2 C2 R2 ADJ R2 GND R1 R2 VVout 1 ref Vout Output Stage GND GND Figure 1. Typical Schematic, Adjustable Output Figure 2. Typical Schematic, Fixed Output http://onsemi.com 2 NCP565 ELECTRICAL CHARACTERISTICS (Vin − Vout = 1.6 V, Vout = 0.9 V, TJ = 25°C, Cin = Cout = 150 F, values unless otherwise noted.) Characteristic Symbol Min Typ Max Unit Reference Voltage (10 mA < Iout < 1.5 A; 2.5 V < Vin < 9.0 V; TJ = −10 to 105°C) Vref 0.882 (−2%) 0.9 0.918 (+2%) V Reference Voltage (10 mA < Iout < 1.5 A; 2.5 V < Vin < 9.0 V; TJ = −40 to 125°C) Vout 0.873 (−3%) 0.9 0.927 (+3%) V ADJ Pin Current IAdj − 30 − nA Line Regulation (Iout = 10 mA) Regline − 0.03 − % Load Regulation (10 mA < Iout < 1.5 A) Regload − 0.03 − % Dropout Voltage (Iout = 1.5 A) (Note 3) Vdo − 0.9 1.3 V Current Limit Ilim 1.6 3.5 − A Ripple Rejection (120 Hz; Iout = 1.5 A) RR − 85 − dB Ripple Rejection (1 kHz; Iout = 1.5 A) RR − 75 − dB − 150 − °C ADJUSTABLE OUTPUT VERSION Thermal Shutdown Ground Current (Iout = 1.5 A) Iq − 1.1 3.0 mA Output Noise Voltage (f = 100 Hz to 100 kHz, Iout = 1.5 A) Vn − 28 − Vrms Output Voltage (10 mA < Iout < 1.5 A; 2.5 V < Vin < 9.0 V; TJ = −10 to 105°C) Vout 1.176 (−2%) 1.2 1.224 (+2%) % Output Voltage (10 mA < Iout < 1.5 A; 2.5 V < Vin < 9.0 V; TJ = −40 to 125°C) Vout 1.164 (−3%) 1.2 1.236 (+3%) % Line Regulation (Iout = 10 mA) Regline − 0.03 − % Load Regulation (10 mA < Iout < 1.5 A) Regload − 0.03 − % Dropout Voltage (Iout = 1.5 A) (Note 3) Vdo − 0.9 1.3 V Current Limit Ilim 1.6 3.5 − A Ripple Rejection (120 Hz; Iout = 1.5 A) RR − 85 − dB Ripple Rejection (1 kHz; Iout = 1.5 A) RR − 75 − dB FIXED OUTPUT VOLTAGE − 150 − °C Ground Current (Iout = 1.5 A) Iq − 1.1 3.0 mA Output Noise Voltage (f = 100 Hz to 100 kHz, Iout = 1.5 A) Vn − 28 − Vrms Thermal Shutdown 3. Dropout voltage is a measurement of the minimum input/output differential at full load. ORDERING INFORMATION Nominal Output Voltage* Package Shipping† Adj D2PAK 50 Tube NCP565D2TR4 Adj D2PAK 800 Tape & Reel NCP565D2TR4G Adj D2PAK (Pb−Free) 800 Tape & Reel NCP565D2T12 Fixed D2PAK 50 Tube NCP565D2T12R4 Fixed D2PAK 800 Tape & Reel NCP565D2T12R4G Fixed D2PAK (Pb−Free) 800 Tape & Reel Device NCP565D2T *For other fixed output versions, please contact the factory. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 3 NCP565 TYPICAL CHARACTERISTICS ISC, SHORT CIRCUIT CURRENT LIMIT (A) Vref, REFERENCE VOLTAGE (V) 0.9005 0.9000 0.8995 0.8990 0.8985 0.8980 Vin = 2.5 V Vout = 0.9 V Cin = Cout = 150 F 0.8975 0.8970 −50 0 −25 25 50 75 100 150 125 3.90 3.85 3.80 3.75 3.70 3.65 3.60 Vin = 2.5 V Vout = 0.9 V Cin = Cout = 150 F 3.55 3.50 3.45 3.40 3.35 −50 −25 TJ, JUNCTION TEMPERATURE (°C) 50 75 100 125 150 Figure 4. Short Circuit Current Limit vs. Temperature 1.16 1.0 IGND, GROUND CURRENT (mA) 1.2 Vin − Vout, DROPOUT VOLTAGE (V) 25 TJ, JUNCTION TEMPERATURE (°C) Figure 3. Output Voltage vs. Temperature Iout = 1.5 A 0.8 0.6 Iout = 50 mA 0.4 Cin = Cout = 150 F 0.2 0 −50 −25 0 25 50 75 100 125 1.14 1.12 1.10 1.08 1.06 Vin = 2.5 V Vout = 0.9 V Iout = 1.5 V Cin = Cout = 150 F 1.04 1.02 1.00 0.98 0.96 −50 150 0 −25 25 50 75 100 125 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 5. Dropout Voltage vs. Temperature Figure 6. Ground Current vs. Temperature 1.28 150 100 1.26 90 RIPPLE REJECTION (dB) IGND, GROUND CURRENT (mA) 0 1.24 1.22 1.2 1.18 1.16 1.14 80 70 60 50 40 Iout = 1.5 A 30 20 10 1.12 0 300 600 900 1200 1500 0 10 Iout, OUTPUT CURRENT (mA) 100 1000 10000 100000 1000000 F, FREQUENCY (Hz) Figure 7. Ground Current vs. Output Current Figure 8. Ripple Rejection vs. Frequency http://onsemi.com 4 NCP565 OUTPUT VOLTAGE DEVIATION (mV) 10 0 −10 Vin = 4.59 V Vout = 0.9 V −20 −30 −40 Iout, OUTPUT CURRENT (A) Iout, OUTPUT CURRENT (A) OUTPUT VOLTAGE DEVIATION (mV) TYPICAL CHARACTERISTICS 1.50 1.00 0.50 0 0 50 100 150 200 250 300 350 10 0 −10 Vin = 4.59 V Vout = 0.9 V −20 −30 −40 1.50 1.00 0.50 0 400 0 0.5 1.0 1.5 Figure 9. Load Transient from 10 mA to 1.5 A Vin = 4.59 V Vout = 0.9 V 10 0 Iout, OUTPUT CURRENT (A) 1.50 1.00 0.50 0 −50 0 50 100 150 200 250 300 350 30 10 0 1.50 1.00 0.50 0 400 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 TIME (s) Figure 12. Load Transient from 1.5 A to 10 mA 100 100 90 90 NOISE DENSITY (nVrms/Hz) NOISE DENSITY (nVrms/Hz) 4.0 Vin = 4.59 V Vout = 0.9 V 20 Figure 11. Load Transient from 1.5 A to 10 mA 80 70 60 Vin = 3.0 V Vout = 0.9 V Iout = 10 mA 40 3.5 40 TIME (nS) 50 3.0 50 OUTPUT VOLTAGE DEVIATION (mV) OUTPUT VOLTAGE DEVIATION (mV) Iout, OUTPUT CURRENT (A) 40 20 2.5 Figure 10. Load Transient from 10 mA to 1.5 A 50 30 2.0 TIME (s) TIME (nS) 30 20 10 80 70 Vin = 3.0 V Vout = 0.9 V Iout = 1.5 A 60 50 40 30 20 10 0 Start 1.0 kHz 0 Start 1.0 kHz Stop 100 kHz FREQUENCY (kHz) Stop 100 kHz FREQUENCY (kHz) Figure 13. Noise Density vs. Frequency Figure 14. Noise Density vs. Frequency http://onsemi.com 5 NCP565 Adjustable Operation APPLICATION INFORMATION The typical application circuit for the adjustable output regulators is shown in Figure 1. The adjustable device develops and maintains the nominal 0.9 V reference voltage between Adj and ground pins. A resistor divider network R1 and R2 causes a fixed current to flow to ground. This current creates a voltage across R1 that adds to the 0.9 V across R2 and sets the overall output voltage. The output voltage is set according to the formula: The NCP565 low dropout linear regulator provides adjustable voltages at currents up to 1.5 A. It features ultra fast transient response and low dropout voltage. These devices contain output current limiting, short circuit protection and thermal shutdown protection. Input, Output Capacitor and Stability An input bypass capacitor is recommended to improve transient response or if the regulator is located more than a few inches from the power source. This will reduce the circuit’s sensitivity to the input line impedance at high frequencies and significantly enhance the output transient response. Different types and different sizes of input capacitors can be chosen dependent on the quality of power supply. A 150F OSCON 16SA150M type from Sanyo should be adequate for most applications. The bypass capacitor should be mounted with shortest possible lead or track length directly across the regulator’s input terminals. The output capacitor is required for stability. The NCP565 remains stable with ceramic, tantalum, and aluminum− electrolytic capacitors with a minimum value of 1.0 F as long as the ESR remains between 50 m and 2.5. The NCP565 is optimized for use with a 150 F OSCON 16SA150M type in parallel with a 10F OSCON 10SL10M type from Sanyo. The 10F capacitor is used for best AC stability while 150F capacitor is used for achieving excellent output transient response. The output capacitors should be placed as close as possible to the output pin of the device. If not, the excellent load transient response of NCP565 will be degraded. Vout Vref R1 R2 IAdj R2 R2 The adjust pin current, Iadj, is typically 30 nA and normally much lower than the current flowing through R1 and R2, thus it generates a small output voltage error that can usually be ignored. Load Transient Measurement Large load current changes are always presented in microprocessor applications. Therefore good load transient performance is required for the power stage. NCP565 has the feature of ultra fast transient response. Its load transient responses in Figures 9 through 12 are tested on evaluation board shown in Figure 15. On the evaluation board, it consists of NCP565 regulator circuit with decoupling and filter capacitors and the pulse controlled current sink to obtain load current transitions. The load current transitions are measured by current probe. Because the signal from current probe has some time delay, it causes un−synchronization between the load current transition and output voltage response, which is shown in Figures 9 through 12. GEN Vout −VCC Vin Pulse V NCP565 RL Evaluation Board GND + + GND Scope Voltage Probe Figure 15. Schematic for Transient Response Measurement http://onsemi.com 6 NCP565 PCB Layout Considerations several capacitors in parallel. This reduces the overall ESR and reduces the instantaneous output voltage drop under transient load conditions. The output capacitor network should be as close as possible to the load for the best results. The schematic of NCP565 typical application circuit, which this PCB layout is base on, is shown in Figure 16. The output voltage is set to 3.3 V for this demonstration board according to the feedback resistors in the Table 1. Good PCB layout plays an important role in achieving good load transient performance. Because it is very sensitive to its PCB layout, particular care has to be taken when tackling Printed Circuit Board (PCB) layout. The figures below give an example of a layout where parasitic elements are minimized. For microprocessor applications it is customary to use an output capacitor network consisting of 2 Vin Vin Vout Vout 4 NCP565 C1 150 C2 150 1 Adj NC 5 C4 10 GND C3 150 C3 150 3 GND GND R2 R1 15.8 k 42.2 k C6 5.6 p Figure 16. Schematic of NCP565 Typical Application Circuit Figure 17. Top Layer http://onsemi.com 7 NCP565 Figure 18. Bottom Layer NCP565 ON Semiconductor www.onsemi.com D1 VIN R2 C2 R1C6 VOUT C4 C3 C1 C5 GND GND July, 2003 Figure 19. Silkscreen Layer Table 1. Bill of Materials for NCP565 Adj Demonstration Board Item Used # Component Designators Suppliers Part Number 1 4 Radial Lead Aluminum Capacitor 150 F/16 V C1, C2, C3, C5 Sanyo Oscon 16SA150M 2 1 Radial Lead Aluminum Capacitor 10 F/10 V C4 Sanyo Oscon 10SL10M 3 1 SMT Chip Resistor (0805) 15.8 K 1% R2 Vishay CRCW08051582F 4 1 SMT Chip Resistor (0805) 42.2 K 1% R1 Vishay CRCW08054222F 5 1 SMT Ceramic Capacitor (0603) 5.6 pF 10% C6 Vishay VJ0603A5R6KXAA 6 1 NCP565 Low Dropout Linear Regulator U1 ON Semiconductor NCP565D2TR4 http://onsemi.com 8 NCP565 Protection Diodes Thermal Considerations When large external capacitors are used with a linear regulator it is sometimes necessary to add protection diodes. If the input voltage of the regulator gets shorted, the output capacitor will discharge into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage and the rate at which Vin drops. In the NCP565 linear regulator, the discharge path is through a large junction and protection diodes are not usually needed. If the regulator is used with large values of output capacitance and the input voltage is instantaneously shorted to ground, damage can occur. In this case, a diode connected as shown in Figure 20 is recommended. This series contains an internal thermal limiting circuit that is designed to protect the regulator in the event that the maximum junction temperature is exceeded. This feature provides protection from a catastrophic device failure due to accidental overheating. It is not intended to be used as a substitute for proper heat sinking. The maximum device power dissipation can be calculated by: PD The devices are available in surface mount D2PAK package. The package has an exposed metal tab that is specifically designed to reduce the junction to air thermal resistance, RJA, by utilizing the printed circuit board copper as a heat dissipater. Figure 21 shows typical RJA values that can be obtained from a square pattern using economical single sided 2.0 ounce copper board material. The final product thermal limits should be tested and quantified in order to insure acceptable performance and reliability. The actual RJA can vary considerably from the graph shown. This will be due to any changes made in the copper aspect ratio of the final layout, adjacent heat sources, and air flow. 1N4002 (Optional) Vin Vin Vout Vout CAdj NCP565 C1 GND Adj TJ(max) TA RJA C2 R1 R2 3.5 JUNCTION-TO-AIR (° C/W) R θ JA, THERMAL RESISTANCE 80 PD(max) for TA = +50°C 70 3.0 Free Air Mounted Vertically 60 Minimum Size Pad 50 ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ 2.0 oz. Copper L 2.5 2.0 L 40 1.5 RJA 1.0 30 0 5.0 10 15 20 L, LENGTH OF COPPER (mm) 25 Figure 21. 3−Pin and 5−Pin D2PAK Thermal Resistance and Maximum Power Dissipation vs. P.C.B Length http://onsemi.com 9 30 PD, MAXIMUM POWER DISSIPATION (W) Figure 20. Protection Diode for Large Output Capacitors NCP565 PACKAGE DIMENSIONS D2PAK−3 D2T SUFFIX CASE 936−03 ISSUE B −T− K OPTIONAL CHAMFER A E U S B F 1 2 3 V H M J D 0.010 (0.254) M T NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A AND K. 4. DIMENSIONS U AND V ESTABLISH A MINIMUM MOUNTING SURFACE FOR TERMINAL 4. 5. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH OR GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.025 (0.635) MAXIMUM. TERMINAL 4 L P N G DIM A B C D E F G H J K L M N P R S U V R C SOLDERING FOOTPRINT* 8.38 0.33 1.016 0.04 10.66 0.42 5.08 0.20 3.05 0.12 17.02 0.67 SCALE 3:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 10 INCHES MIN MAX 0.386 0.403 0.356 0.368 0.170 0.180 0.026 0.036 0.045 0.055 0.051 REF 0.100 BSC 0.539 0.579 0.125 MAX 0.050 REF 0.000 0.010 0.088 0.102 0.018 0.026 0.058 0.078 5 REF 0.116 REF 0.200 MIN 0.250 MIN MILLIMETERS MIN MAX 9.804 10.236 9.042 9.347 4.318 4.572 0.660 0.914 1.143 1.397 1.295 REF 2.540 BSC 13.691 14.707 3.175 MAX 1.270 REF 0.000 0.254 2.235 2.591 0.457 0.660 1.473 1.981 5 REF 2.946 REF 5.080 MIN 6.350 MIN NCP565 PACKAGE DIMENSIONS D2PAK−5 D2T SUFFIX CASE 936A−02 ISSUE B −T− OPTIONAL CHAMFER A E U S K B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A AND K. 4. DIMENSIONS U AND V ESTABLISH A MINIMUM MOUNTING SURFACE FOR TERMINAL 6. 5. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH OR GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.025 (0.635) MAXIMUM. TERMINAL 6 V H 1 2 3 4 5 M D 0.010 (0.254) M T L G DIM A B C D E G H K L M N P R S U V P N R C SOLDERING FOOTPRINT* 8.38 0.33 1.702 0.067 10.66 0.42 3.05 0.12 16.02 0.63 SCALE 3:1 1.016 0.04 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 11 INCHES MIN MAX 0.386 0.403 0.356 0.368 0.170 0.180 0.026 0.036 0.045 0.055 0.067 BSC 0.539 0.579 0.050 REF 0.000 0.010 0.088 0.102 0.018 0.026 0.058 0.078 5 REF 0.116 REF 0.200 MIN 0.250 MIN MILLIMETERS MIN MAX 9.804 10.236 9.042 9.347 4.318 4.572 0.660 0.914 1.143 1.397 1.702 BSC 13.691 14.707 1.270 REF 0.000 0.254 2.235 2.591 0.457 0.660 1.473 1.981 5 REF 2.946 REF 5.080 MIN 6.350 MIN NCP565 The product described herein (NCP565), may be covered by one or more of the following U.S. patents: 5,920,184; 5,834,926. There may be other patents pending. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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