MMBT2222AW Rev.E Mar.-2016 描述 / DATA SHEET Descriptions SOT-323 塑封封装 NPN 半导体三极管。Silicon NPN transistor in a SOT-323 Plastic Package. 特征 / Features 小功率表面贴装。 Low power surface mount applications. 用途 / Applications 用于一般放大。 General purpose amplifier. 内部等效电路 引脚排列 / Equivalent Circuit / Pinning 3 2 1 PIN1：Emitter 印章代码 PIN 2：Base PIN 3：Collector / Marking hFE Range Marking http://www.fsbrec.com 100~300 H1P 1/6 MMBT2222AW Rev.E Mar.-2016 极限参数 / DATA SHEET Absolute Maximum Ratings(Ta=25℃) 参数 Parameter Collector to Base Voltage 符号 Symbol VCBO 数值 Rating 75 单位 Unit V Collector to Emitter Voltage VCEO 40 V Emitter to Base Voltage VEBO 6.0 V Collector Current - Continuous IC 600 mA Collector Power Dissipation PC 200 mW Junction Temperature Tj 150 ℃ Tstg -55～150 ℃ Storage Temperature Range 电性能参数 / Electrical Characteristics(Ta=25℃) 参数 Parameter Collector to Base Breakdown Voltage Collector to Emitter Breakdown Voltage 符号 Symbol 测试条件 Test Conditions 最小值 典型值 最大值 单位 Min Typ Max Unit VCBO IC=10μA IE=0 75 V VCEO IC=10mA IB=0 40 V Emitter to Base Breakdown Voltage VEBO IE=10μA IC=0 6.0 V Collector Cut-Off Current ICBO VCB=60V IE=0 0.01 μA Emitter Base Cut-Off Current IEBO VEB=5.0V IC=0 0.1 μA DC Current Gain hFE VCE=10V IC=150mA Collector to Emitter Saturation Voltage Base to Emitter Saturation Voltage Collector output capacitance 300 VCE(sat) (1) IC=150mA IB=15mA 0.3 V VCE(sat) (2) IC=500mA IB=50mA 1.0 V VBE(sat) (1) IC=150mA IB=15mA 1.2 V VBE(sat) (2) IC=500mA IB=50mA 2.0 V 8.0 pF Cob Transition Frequency fT Turn-On Time ton Turn-Off Time toff http://www.fsbrec.com 100 IE=0 VCB=10V f=1.0MHz VCE=20V IC=20mA f=100MHz VBE=-0.5V VCC=30V IB1=15mA IC=150mA IC=150mA VCC=30V IB1=IB2=15mA 0.6 300 MHz 35 ns 285 ns 2/6 MMBT2222AW Rev.E Mar.-2016 电参数曲线图 DATA SHEET / Electrical Characteristic Curve http://www.fsbrec.com 3/6 MMBT2222AW Rev.E Mar.-2016 外形尺寸图 DATA SHEET / Package Dimensions http://www.fsbrec.com 4/6 MMBT2222AW Rev.E Mar.-2016 印章说明 / DATA SHEET Marking Instructions H1P 说明： H： 为公司代码 1P： 为型号代码 Note: H: Company Code. 1P: Product Type. http://www.fsbrec.com 5/6 MMBT2222AW Rev.E Mar.-2016 DATA SHEET 回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free) 说明： Note: 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150℃, Time:60~90sec. 2、峰值温度 245±5℃，时间持续为 5±0.5sec; 2.Peak Temp.:245±5℃, Duration:5±0.5sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：260±5℃ 包装规格 Time:10±1 sec / REEL Package Type 封装形式 使用说明 Temp.:260±5℃ / Packaging SPEC. 卷盘包装 SOT-323 时间：10±1 sec. Units 包装数量 Dimension 包装尺寸 3 (unit：mm ) Units/Reel 只/卷盘 Reels/Inner Box 卷盘/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Reel Inner Box 盒 Outer Box 箱 3,000 10 30,000 8 240,000 7〞×8 180×120×180 385×257×392 / Notices http://www.fsbrec.com 6/6