Mimix CMM1100-BD 2.0-18.0 ghz gaas mmic Datasheet

2.0-18.0 GHz GaAs MMIC
Low Noise Amplifier
CMM1100-BD
February 2010 - Rev-05-Feb-10
Features
Self Bias Architecture
17.0 dB Small Signal Gain
3.5 dB Noise Figure
+16.0 dBm P1dB Compression Point
100% Commercial-Level Visual Inspection Using
Mil-Std-883 Method 2010
Chip Device Layout
General Description
Mimix Broadband’s two stage 2.0-18.0 GHz GaAs MMIC
low noise amplifier has a small signal gain of 17.0 dB
with a noise figure of 3.5 dB across the band. This MMIC
uses Mimix Broadband’s GaAs PHEMT device model
technology, and is based upon optical lithography to
ensure high repeatability and uniformity. The chip has
surface passivation to protect and provide a rugged
part with backside via holes and gold metallization to
allow either a conductive epoxy or eutectic solder die
attach process. This device is well suited for fiber optic,
microwave radio, military, space, telecom infrastructure,
test instrumentation and VSAT applications.
Absolute Maximum Ratings
Supply Voltage (Vd)
Supply Current (Id)
Input Power (Pin)
Storage Temperature (Tstg)
Operating Temperature (Ta)
Channel Temperature (Tch)1
+8.0 VDC
180 mA
+10 dBm
-65 to +165 ºC
-55 to +85 ºC
+175 ºC
(1) Channel temperature affects a device's MTTF. It is
recommended to keep channel temperature as low as
possible for maximum life.
Electrical Characteristics (Ambient Temperature T = 25 oC)
Parameter
Frequency Range (f )
Input Return Loss (S11)
Output Return Loss (S22)
Small Signal Gain (S21)
Gain Flatness ( S21)
Reverse Isolation (S12)
Noise Figure (NF)
Output Power for 1 dB Compression (P1dB)
Output Second Order Intercept Point (OIP2)
Output Third Order Intercept Point (OIP3)
Drain Bias Voltage (Vd1,2)
Supply Current (Id) (Vd1,2=5.0V)
Units
GHz
dB
dB
dB
dB
dB
dB
dBm
dBm
dBm
VDC
mA
Min.
2.0
6.0
8.0
14.0
+13.0
90
Typ.
9.0
17.0
17.0
+/-0.5
40.0
3.5
+16.0
+33.0
+26.0
+5.0
100
Max.
18.0
5.0
+7.0
120
100% on-wafer DC testing and 100% RF wafer qualification. Wafer qualification includes sample testing from each quadrant
with an 80% pass rate required.
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 1 of 9
Characteristic Data and Specifications are subject to change without notice. ©2010 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
2.0-18.0 GHz GaAs MMIC
Low Noise Amplifier
CMM1100-BD
February 2010 - Rev-05-Feb-10
Low Noise Amplifier Measurements (On Wafer)
CMM1100-BD, Vd=5.0 V (80 devices, 10 wafers)
22
5.5
20
5.0
Noise Figure (dB)
21
19
Gain (dB)
CMM1100-BD, Vd=5.0 V (80 devices, 10 wafers))
6.0
18
17
16
15
4.5
4.0
3.5
3.0
2.5
14
2.0
13
1.5
12
1.0
0.0
2.0
4.0
6.0
8.0
10.0
12.0
14.0
16.0
18.0
20.0
22.0
24.0
2.0
4.0
6.0
8.0
Frequency (GHz)
Max
Median
Mean
-3sigma
Max
CMM1100-BD, Vd=5.0 V (80 devices, 10 wafers)
5
12.0
14.0
16.0
18.0
Median
Mean
Min
CMM1100-BD, Vd=5.0 V (80 devices, 10 wafers)
0
-5
Output Return Loss (dB)
0
Input Return Loss (dB)
10.0
Frequency (GHz)
-5
-10
-15
-20
-25
-30
-10
-15
-20
-25
-30
-35
-40
-45
-50
-35
-55
0.0
2.0
4.0
6.0
8.0
10.0
12.0
14.0
16.0
18.0
20.0
22.0
24.0
0.0
2.0
4.0
6.0
8.0
Frequency (GHz)
Max
Median
Mean
10.0
12.0
14.0
16.0
18.0
20.0
22.0
24.0
Frequency (GHz)
-3sigma
Max
Median
Mean
-3sigma
CMM1100-BD, Vd=5.0 V (80 devices, 10 wafers)
21
Output Power P1dB (dBm)
20
19
18
17
16
15
14
13
12
11
2.0
4.0
6.0
8.0
10.0
12.0
14.0
16.0
18.0
Frequency (GHz)
Max
Median
Mean
Min
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 2 of 9
Characteristic Data and Specifications are subject to change without notice. ©2010 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
2.0-18.0 GHz GaAs MMIC
Low Noise Amplifier
CMM1100-BD
February 2010 - Rev-05-Feb-10
Low Noise Amplifier Measurements (Test Fixture)
CMM1100-BD Vd=5.0 V, Id=105 mA
20
19
-10
Reverse Isolation (dB)
18
17
Gain (dB)
CMM1100-BD Vd=5.0 V, Id=105 mA
0
16
15
14
13
12
-20
-30
-40
-50
-60
11
-70
10
1.0
3.0
5.0
7.0
9.0
11.0
13.0
15.0
17.0
19.0
1.0
21.0
3.0
5.0
7.0
9.0
Frequency (GHz)
+85 Deg C
-40 deg C
+25 Deg C
+85 Deg C
CMM1100-BD Vd=5.0 V, Id=105 mA
0
15.0
17.0
19.0
21.0
-40 Deg C
19.0
21.0
+25 Deg C
-5
Output Return Loss (dB)
Input Return Loss (dB)
13.0
CMM1100-BD Vd=5.0 V, Id=105 mA
0
-5
-10
-15
-20
-25
-30
-10
-15
-20
-25
-30
-35
-40
-35
1.0
3.0
5.0
7.0
9.0
11.0
13.0
15.0
17.0
19.0
1.0
21.0
3.0
5.0
7.0
9.0
+85 Deg C
-40 Deg C
+25 Deg C
+85 Deg C
CMM1100-BD Vd=5.0 V, Id=105 mA
10
11.0
13.0
15.0
17.0
Frequency (GHz)
Frequency (GHz)
-40 Deg C
+25 Deg C
CMM1100-BD Vd=5.0 V, Id=105 mA
20
19
Output Power P1dB (dBm)
9
Noise Figure (dB)
11.0
Frequency (GHz)
8
7
6
5
4
3
18
17
16
15
14
13
12
11
2
10
1.0
3.0
5.0
7.0
9.0
11.0
13.0
15.0
17.0
19.0
1.0
3.0
5.0
7.0
Frequency (GHz)
+85 Deg C
-40 Deg C
+25 Deg C
9.0
11.0
13.0
15.0
17.0
19.0
Frequency (GHz)
+85 Deg C
-40 Deg C
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
+25 Deg C
Page 3 of 9
Characteristic Data and Specifications are subject to change without notice. ©2010 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
2.0-18.0 GHz GaAs MMIC
Low Noise Amplifier
CMM1100-BD
February 2010 - Rev-05-Feb-10
Low Noise Amplifier Measurements (Test Fixture) (cont.)
CMM1100-BD Vd=5.0 V, Id=105 mA
Output Third Order Intercept (dBm)
34
32
30
28
26
24
22
20
18
16
14
1.0
3.0
5.0
7.0
9.0
11.0
13.0
15.0
17.0
19.0
Frequency (GHz)
+85 Deg C
CMM1100-BD Vd=5.0 V, Id=See Legend
19.0
+25 Deg C
CMM1100-BD Vd=7.0 V, Id=See Legend
19.0
18.5
18.5
18.0
18.0
17.5
17.5
Gain (dB)
Gain (dB)
-40 Deg C
17.0
16.5
16.0
17.0
16.5
16.0
15.5
15.5
15.0
15.0
14.5
14.5
14.0
14.0
1.0
3.0
5.0
7.0
9.0
11.0
13.0
15.0
17.0
19.0
21.0
1.0
3.0
5.0
7.0
9.0
Frequency (GHz)
BP #8,12
BP #7,13
BP #7-9,11-13
BP #8,12
CMM1100-BD Vd=5.0 V, Id=See Legend
6.0
13.0
15.0
17.0
19.0
21.0
BP #7,13
BP #7-9,11-13
CMM1100-BD Vd=7.0 V, Id=See Legend
6.0
5.5
Noise Figure (dB)
5.5
Noise Figure (dB)
11.0
Frequency (GHz)
5.0
4.5
4.0
3.5
5.0
4.5
4.0
3.5
3.0
3.0
2.5
2.5
2.0
2.0
2.0
4.0
6.0
8.0
10.0
12.0
14.0
16.0
18.0
2.0
4.0
6.0
8.0
Frequency (GHz)
BP #8,12
BP #7,13
BP #7-9,11-13
10.0
12.0
14.0
16.0
18.0
Frequency (GHz)
BP #8,12
BP #7,13
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
BP #7-9,11-13
Page 4 of 9
Characteristic Data and Specifications are subject to change without notice. ©2010 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
2.0-18.0 GHz GaAs MMIC
Low Noise Amplifier
CMM1100-BD
February 2010 - Rev-05-Feb-10
Low Noise Amplifier Measurements (Test Fixture) (cont.)
CMM1100-BD Vd=5.0 V, Id=See Legend
20.0
19.5
Output Power P1dB (dBm)
19.5
Output Power P1dB (dBm)
CMM1100-BD Vd=7.0 V, Id=See Legend
20.0
19.0
18.5
18.0
17.5
17.0
16.5
16.0
15.5
15.0
14.5
19.0
18.5
18.0
17.5
17.0
16.5
16.0
15.5
15.0
14.5
14.0
14.0
2.0
4.0
6.0
8.0
10.0
12.0
14.0
16.0
18.0
2.0
4.0
6.0
8.0
Frequency (GHz)
BP #7,13
BP #7-9,11-13
BP #8,12
CMM1100-BD Vd=5.0 V, Id=See Legend
23.0
Saturated Output Power Psat (dBm)
Saturated Output Power Psat (dBm)
BP #8,12
22.5
22.0
21.5
21.0
20.5
20.0
19.5
19.0
18.5
18.0
17.5
17.0
2.0
4.0
6.0
8.0
10.0
12.0
14.0
16.0
BP #7,13
21.0
20.5
20.0
19.5
19.0
18.5
18.0
17.5
17.0
4.0
6.0
8.0
BP #8,12
29
28
27
26
25
24
23
22
21
20
6.0
8.0
10.0
12.0
BP #7,13
10.0
12.0
14.0
16.0
18.0
14.0
16.0
18.0
BP #7-9,11-13
BP #7,13
BP #7-9,11-13
CMM1100-BD Vd=7.0 V, Id=See Legend
32
31
30
29
28
27
26
25
24
23
22
21
20
2.0
4.0
6.0
8.0
Frequency (GHz)
BP #8,12
BP #7-9,11-13
21.5
BP #7-9,11-13
30
4.0
18.0
Frequency (GHz)
31
2.0
16.0
22.0
2.0
CMM1100-BD Vd=5.0 V, Id=See Legend
32
14.0
22.5
18.0
Output Third Order Intercept (dBm)
Output Third Order Intercept (dBm)
BP #7,13
12.0
CMM1100-BD Vd=7.0 V, Id=See Legend
23.0
Frequency (GHz)
BP #8,12
10.0
Frequency (GHz)
10.0
12.0
14.0
16.0
18.0
Frequency (GHz)
BP #8,12
BP #7,13
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
BP #7-9,11-13
Page 5 of 9
Characteristic Data and Specifications are subject to change without notice. ©2010 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
2.0-18.0 GHz GaAs MMIC
Low Noise Amplifier
CMM1100-BD
February 2010 - Rev-05-Feb-10
S-Parameters
Typical S-Parameter Data for CMM1100
Vd=5.0 V Id=106 mA
Frequency
(GHz)
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0
11.0
12.0
13.0
14.0
15.0
16.0
17.0
18.0
19.0
20.0
21.0
22.0
23.0
24.0
25.0
26.0
27.0
28.0
29.0
30.0
S11
(Mag)
0.564
0.073
0.108
0.156
0.231
0.300
0.341
0.360
0.358
0.355
0.356
0.365
0.363
0.335
0.285
0.216
0.179
0.231
0.355
0.536
0.672
0.724
0.744
0.817
0.833
0.642
0.339
0.588
0.701
0.751
S11
(Ang)
113.40
-51.85
-112.43
-109.03
-111.81
-123.14
-135.59
-145.49
-153.82
-159.38
-164.32
-171.49
177.34
161.48
139.48
106.64
53.21
1.35
-27.53
-50.52
-74.63
-93.09
-104.71
-115.54
-134.08
-152.52
-134.36
-114.26
-124.81
-134.74
S21
(Mag)
3.998
7.217
7.697
7.579
7.270
6.945
6.755
6.714
6.795
6.950
7.077
7.088
7.023
6.990
7.064
7.277
7.468
7.529
7.272
6.255
4.519
3.071
2.382
1.594
0.779
0.290
0.174
0.122
0.067
0.036
S21
(Ang)
-135.42
61.62
-10.40
-60.06
-100.74
-136.61
-167.71
161.60
131.18
100.24
68.16
35.62
3.31
-28.77
-61.34
-96.06
-133.62
-174.55
139.73
89.50
41.30
1.39
-39.37
-90.33
-139.00
-165.96
-163.07
166.67
148.80
142.87
S12
(Mag)
0.0072
0.0009
0.0027
0.0036
0.0042
0.0048
0.0056
0.0060
0.0063
0.0067
0.0075
0.0081
0.0084
0.0091
0.0097
0.0111
0.0123
0.0138
0.0140
0.0133
0.0105
0.0087
0.0075
0.0084
0.0101
0.0074
0.0062
0.0076
0.0070
0.0084
S12
(Ang)
-64.86
113.67
95.10
60.15
30.44
10.91
-12.13
-40.52
-56.60
-83.85
-99.83
-123.98
-136.58
-158.13
-177.70
157.68
134.05
106.85
76.50
25.64
-3.89
-37.62
-82.40
-111.46
-159.83
175.00
-166.95
111.86
141.10
114.00
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
S22
(Mag)
0.608
0.245
0.105
0.092
0.117
0.139
0.143
0.130
0.103
0.060
0.015
0.039
0.068
0.089
0.101
0.104
0.108
0.091
0.041
0.091
0.184
0.213
0.214
0.165
0.130
0.104
0.111
0.101
0.097
0.105
S22
(Ang)
-147.64
169.55
168.57
-167.04
-163.10
-169.57
173.76
158.50
139.11
116.93
53.27
-67.58
-94.03
-110.68
-119.80
-129.14
-140.57
-158.99
142.10
-7.89
-57.94
-89.57
-112.14
-126.73
-128.87
-123.13
-111.81
-106.87
-98.09
-83.07
Page 6 of 9
Characteristic Data and Specifications are subject to change without notice. ©2010 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
2.0-18.0 GHz GaAs MMIC
Low Noise Amplifier
CMM1100-BD
February 2010 - Rev-05-Feb-10
0.215
(0.009)
Mechanical Drawing
1.550
(0.061)
1.460
(0.058)
2 3
0.418
(0.017)
0.843
(0.033)
1.508
(0.059)
4
5
1
6
14 13 12 11 10
0.0
0.356 0.599 0.838
(0.014) (0.024) (0.033)
0.484 0.714
(0.019) (0.028)
0.0
0.418
(0.017)
9 8 7
1.245 1.480
(0.049) (0.058)
1.360 1.600
(0.054) (0.063)
(Note: Engineering designator is M425)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.076 +/- 0.010 (0.003 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.080 x 0.080 (0.003 x 0.003). All RF Bond Pads are 0.180 x 0.080 (0.007 x 0.003).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.538 mg
Bond Pad #1 (RF In)
Bond Pad #2 (Vg1a)
Bond Pad #3 (Vg1b)
Bond Pad #4 (Vd1)
Bond Pad #5 (Vd2)
Bond Pad #6 (RF Out)
Bias Arrangement
Vd1,2
2 3
RF In
Bond Pad #7 (Rs2-9.0 )
Bond Pad #8 (Rs2-12.5 )
Bond Pad #9 (Rs2-12.5 )
Bond Pad #10 (Rs2-Off Chip)
Bond Pad #11 (Rs1-29.0 )
Bond Pad #12 (Rs1-29.0 )
Bond Pad #13 (Rs1-16.6 )
Bond Pad #14 (Rs1-Off Chip)
Bypass Capacitors - See App Note [2]
4
1
5
6
14 13 12 11 10
RF Out
9 8 7
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 7 of 9
Characteristic Data and Specifications are subject to change without notice. ©2010 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
2.0-18.0 GHz GaAs MMIC
Low Noise Amplifier
CMM1100-BD
February 2010 - Rev-05-Feb-10
App Note [1] Biasing - As shown in the bonding diagram, this device operates
using a self-biased architecture and only requires one drain bias. Bias is nominally
Vd1=Vd2=5V, I(total)=105mA. Additionally there are six total source resistors on
chip. The three resistors on the input stage are 16.6, 29.0 and 29.0 Ohms. The
three resistors on the output stage are 12.5, 12.5 and 9.0 Ohms. One of these
must be bonded to ground for each amplifier stage to achieve performance as
shown. Bonding to one of the other resistors or any or all in parallel may allow
additional performance adjustment. Lastly for additional stability pad #3 can be
grounded instead of bond pad #2.
App Note [2] Bias Arrangement - Each DC pad (Vd) needs to have DC bypass
capacitance (~100-200 pF) as close to the device as possible. Additional DC
bypass capacitance (~0.01 uF) is also recommended.
MTTF Graphs
These numbers were calculated based upon accelerated life test information received from the fabricating foundry and extensive thermal modeling/
finite element analysis done at Mimix Broadband. The values shown here are only to be used as a guideline against the end application requirements
and only represent reliability information under one bias condition. Ultimately bias conditions and resulting power dissipation along with the
practical aspects, i.e. thermal material stack-up, attach method of die placement are the key parts in determining overall reliability for a specific
application, see previous pages. If the data shown below does not meet your reliability requirements or if the bias conditions are not within your
operating limits please contact technical sales for additional information.
CMM1100-BD Vd=5.0 V, Id=105 mA
CMM1100-BD Vd=5.0 V, Id=105 mA
1.00E+00
1.0E+08
1.00E-01
FITS
MTTF (hours)
1.0E+09
1.0E+07
1.00E-02
1.0E+06
1.0E+05
1.00E-03
55
65
75
85
95
105
115
125
55
65
Backplate Temperature (deg C)
75
85
95
105
115
125
Baseplate Temperature (deg C)
CMM1100-BD Vd=5.0 V, Id=105 mA
160
150
Tch (deg C)
140
130
120
110
100
90
80
55
65
75
85
95
105
115
125
Backplate Temperature (deg C)
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 8 of 9
Characteristic Data and Specifications are subject to change without notice. ©2010 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
2.0-18.0 GHz GaAs MMIC
Low Noise Amplifier
CMM1100-BD
February 2010 - Rev-05-Feb-10
Handling and Assembly Information
CAUTION! - Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the
human body and the environment. For safety, observe the following procedures:
• Do not ingest.
• Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical
processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed.
• Observe government laws and company regulations when discarding this product. This product must be
discarded in accordance with methods specified by applicable hazardous waste procedures.
Life Support Policy - Mimix Broadband's products are not authorized for use as critical components in life support
devices or systems without the express written approval of the President and General Counsel of Mimix Broadband. As
used herein: (1) Life support devices or systems are devices or systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.
(2) A critical component is any component of a life support device or system whose failure to perform can be
reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
ESD - Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied in
antistatic containers, which should be opened in cleanroom conditions at an appropriately grounded antistatic workstation. Devices need careful handling using correctly designed collets, vacuum pickups or, with care, sharp tweezers.
Die Attachment - GaAs Products from Mimix Broadband are 0.076 mm (0.003") thick and have vias through to the
backside to enable grounding to the circuit. Microstrip substrates should be brought as close to the die as possible. The
mounting surface should be clean and flat. If using conductive epoxy, recommended epoxies are Tanaka TS3332LD, Die
Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per manufacturer's cure schedule. Apply epoxy
sparingly to avoid getting any on to the top surface of the die. An epoxy fillet should be visible around the total die
periphery. For additional information please see the Mimix "Epoxy Specifications for Bare Die" application note. If
eutectic mounting is preferred, then a fluxless gold-tin (AuSn) preform, approximately 0.0012 thick, placed between the
die and the attachment surface should be used. A die bonder that utilizes a heated collet and provides scrubbing action
to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. The gold-tin eutectic
(80% Au 20% Sn) has a melting point of approximately 280º C (Note: Gold Germanium should be avoided). The work
station temperature should be 310ºC +/- 10ºC. Exposure to these extreme temperatures should be kept to minimum.
The collet should be heated, and the die pre-heated to avoid excessive thermal shock. Avoidance of air bridges and
force impact are critical during placement.
Wire Bonding - Windows in the surface passivation above the bond pads are provided to allow wire bonding to the
die's gold bond pads. The recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x 0.0005") 99.99%
pure gold ribbon with 0.5-2% elongation to minimize RF port bond inductance. Gold 0.025 mm (0.001") diameter
wedge or ball bonds are acceptable for DC Bias connections. Aluminum wire should be avoided. Thermo-compression
bonding is recommended though thermosonic bonding may be used providing the ultrasonic content of the bond is
minimized. Bond force, time and ultrasonics are all critical parameters. Bonds should be made from the bond pads on
the die to the package or substrate. All bonds should be as short as possible.
Part Number for Ordering
Description
CMM1100-BD-000W
PB-CMM1100-BD-0000
RoHS compliant die packed in waffle trays
CMM1100-BD evaluation module
Caution: ESD Sensitive
Appropriate precautions in handling, packaging
and testing devices must be observed.
Proper ESD procedures should be followed when handling this device.
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 9 of 9
Characteristic Data and Specifications are subject to change without notice. ©2010 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
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