SCLS174E − MARCH 1984 − REVISED AUGUST 2003
D
D
D
D
D
D
LSTTL Loads
Low Power Consumption, 80-µA Max ICC
Typical tpd = 12 ns
±6-mA Output Drive at 5 V
Low Input Current of 1 µA Max
Inputs Are TTL-Voltage Compatible
3-State Outputs Drive Bus Lines or Buffer
Memory Address Registers
SN54HCT240 . . . J OR W PACKAGE
SN74HCT240 . . . DW, N, NS, OR PW PACKAGE
(TOP VIEW)
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
description/ordering information
These octal buffers and line drivers are designed
specifically to improve both the performance and
density of 3-state memory address drivers, clock
drivers, and bus-oriented receivers and
transmitters. The ’HCT240 devices are organized
as two 4-bit buffers/drivers with separate
output-enable (OE) inputs. When OE is low, the
device passes inverted data from the A inputs to
the Y outputs. When OE is high, the outputs are
in the high-impedance state.
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
2Y4
1A1
1OE
VCC
SN54HCT240 . . . FK PACKAGE
(TOP VIEW)
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
1Y1
2A4
1Y2
2A3
1Y3
2Y1
GND
2A1
1Y4
2A2
1A2
2Y3
1A3
2Y2
1A4
2OE
D Operating Voltage Range of 4.5 V to 5.5 V
D High-Current Outputs Drive Up To 15
ORDERING INFORMATION
PACKAGE†
TA
PDIP − N
SOIC − DW
−40°C
−40
C to 85
85°C
C
SOP − NS
TSSOP − PW
−55°C
−55
C to 125
125°C
C
ORDERABLE
PART NUMBER
Tube of 20
SN74HCT240N
Tube of 25
SN74HCT240DW
Reel of 2000
SN74HCT240DWR
Reel of 2000
SN74HCT240NSR
Tube of 70
SN74HCT240PW
Reel of 2000
SN74HCT240PWR
TOP-SIDE
MARKING
SN74HCT240N
HCT240
HCT240
HT240
Reel of 250
SN74HCT240PWT
CDIP − J
Tube of 20
SNJ54HCT240J
SNJ54HCT240J
CFP − W
Tube of 85
SNJ54HCT240W
SNJ54HCT240W
LCCC − FK
Tube of 55
SNJ54HCT240FK
SNJ54HCT240FK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
!"# $ %&'# "$ (&)*%"# +"#',
+&%#$ %! # $('%%"#$ (' #-' #'!$ '."$ $#&!'#$
$#"+"+ /""#0, +&%# (%'$$1 +'$ # '%'$$"*0 %*&+'
#'$#1 "** (""!'#'$,
(+&%#$ %!(*"# # 23 "** (""!'#'$ "' #'$#'+
&*'$$ #-'/$' #'+, "** #-' (+&%#$ (+&%#
(%'$$1 +'$ # '%'$$"*0 %*&+' #'$#1 "** (""!'#'$,
POST OFFICE BOX 655303
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1
SCLS174E − MARCH 1984 − REVISED AUGUST 2003
FUNCTION TABLE
(each buffer/driver)
INPUTS
OE
A
OUTPUT
Y
L
H
L
L
L
H
H
X
Z
logic diagram (positive logic)
1OE
1A1
1A2
1A3
1A4
1
2OE
2
4
18
16
6
14
8
12
1Y1
2A1
1Y2
2A2
1Y3
2A3
1Y4
2A4
19
11
9
13
7
15
5
17
3
2Y1
2Y2
2Y3
2Y4
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±70 mA
Package thermal impedance, θJA (see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
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SCLS174E − MARCH 1984 − REVISED AUGUST 2003
recommended operating conditions (see Note 3)
SN54HCT240
MIN
NOM
MAX
MIN
NOM
MAX
4.5
5
5.5
4.5
5
5.5
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
Input voltage
0
VO
∆t/∆v
Output voltage
0
High-level input voltage
VCC = 4.5 V to 5.5 V
VCC = 4.5 V to 5.5 V
SN74HCT240
2
2
Input transition rise/fall time
V
V
0.8
VCC
VCC
UNIT
0
0
500
0.8
V
VCC
VCC
V
500
ns
V
TA
Operating free-air temperature
−55
125
−40
85
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
VOH
VI = VIH or VIL
IOH = −20 µA
IOH = −6 mA
4.5 V
VOL
VI = VIH or VIL
IOL = 20 µA
IOL = 6 mA
4.5 V
II
IOZ
VI = VCC or 0
VO = VCC or 0,
ICC
∆ICC†
VI = VIH or VIL
VI = VCC or 0,
IO = 0
One input at 0.5 V or 2.4 V,
Other inputs at 0 or VCC
MIN
SN54HCT240
MIN
MAX
SN74HCT240
MIN
4.4
4.499
4.4
4.4
3.98
4.3
3.7
3.84
MAX
UNIT
V
0.001
0.1
0.1
0.1
0.17
0.26
0.4
0.33
5.5 V
±0.1
±100
±1000
±1000
nA
5.5 V
±0.01
±0.5
±10
±5
µA
8
160
80
µA
1.4
2.4
3
2.9
mA
3
10
10
10
pF
5.5 V
5.5 V
4.5 V
to 5.5 V
Ci
TA = 25°C
TYP
MAX
V
† This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC.
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tpd
A
Y
ten
OE
Y
tdis
OE
Y
tt
Y
VCC
MIN
TA = 25°C
TYP
MAX
SN54HCT240
MIN
MAX
SN74HCT240
MIN
MAX
4.5 V
13
25
37
32
5.5 V
12
23
33
29
4.5 V
21
35
53
44
5.5 V
19
32
48
40
4.5 V
19
35
53
44
5.5 V
18
32
48
40
4.5 V
8
12
18
15
5.5 V
7
11
16
14
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
ns
ns
ns
ns
3
SCLS174E − MARCH 1984 − REVISED AUGUST 2003
switching characteristics over recommended operating free-air temperature range, CL = 150 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tpd
A
Y
ten
OE
Y
tt
Y
VCC
MIN
TA = 25°C
TYP
MAX
SN54HCT240
MIN
MAX
SN74HCT240
MIN
MAX
4.5 V
20
42
63
53
5.5 V
19
38
56
48
4.5 V
25
52
79
65
5.5 V
22
47
71
59
4.5 V
17
42
63
53
5.5 V
14
38
57
48
UNIT
ns
ns
ns
operating characteristics, TA = 25°C
PARAMETER
Cpd
4
TEST CONDITIONS
Power dissipation capacitance
No load
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TYP
40
UNIT
pF
SCLS174E − MARCH 1984 − REVISED AUGUST 2003
PARAMETER MEASUREMENT INFORMATION
VCC
From Output
Under Test
CL
(see Note A)
PARAMETER
S1
Test
Point
tPZH
ten
RL
S2
1 kΩ
tPZL
tPHZ
tdis
S2
50 pF
or
150 pF
Open
Closed
Closed
Open
Open
Closed
Closed
Open
Open
Open
50 pF
tPLZ
−−
LOAD CIRCUIT
2.7 V
S1
1 kΩ
tpd or tt
Input 1.3 V
0.3 V
CL
RL
2.7 V
50 pF
or
150 pF
3V
1.3 V
0.3 V 0 V
tr
tf
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
3V
Input
1.3 V
1.3 V
0V
tPLH
In-Phase
Output
1.3 V
10%
tPHL
90%
90%
tr
tPHL
Out-ofPhase
Output
90%
VOH
1.3 V
10% V
OL
tf
tPLH
1.3 V
10%
1.3 V
10%
tf
Output
Control
(Low-Level
Enabling)
3V
1.3 V
1.3 V
0V
tPZL
Output
Waveform 1
(See Note B)
tPLZ
≈VCC
1.3 V
10%
tPZH
90%
VOH
VOL
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT RISE AND FALL TIMES
Output
Waveform 2
(See Note B)
VOL
tPHZ
1.3 V
90%
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS
NOTES: A. CL includes probe and test-fixture capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
85505012A
ACTIVE
LCCC
FK
20
1
None
Call TI
Level-NC-NC-NC
8550501RA
ACTIVE
CDIP
J
20
1
None
Call TI
Level-NC-NC-NC
JM38510/65753BRA
ACTIVE
CDIP
J
20
1
None
Call TI
Level-NC-NC-NC
SN54HCT240J
ACTIVE
CDIP
J
20
1
None
Call TI
Level-NC-NC-NC
SN74HCT240DW
ACTIVE
SOIC
DW
20
25
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
SN74HCT240DWR
ACTIVE
SOIC
DW
20
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
SN74HCT240N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74HCT240NSR
ACTIVE
SO
NS
20
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SN74HCT240PW
ACTIVE
TSSOP
PW
20
70
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74HCT240PWR
ACTIVE
TSSOP
PW
20
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74HCT240PWT
ACTIVE
TSSOP
PW
20
250
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SNJ54HCT240FK
ACTIVE
LCCC
FK
20
1
None
Call TI
Level-NC-NC-NC
SNJ54HCT240J
ACTIVE
CDIP
J
20
1
None
Call TI
Level-NC-NC-NC
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
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MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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