HITFETÒ II.Generation BSP 78 Smart Lowside Power Switch Features Product Summary · Logic Level Input Drain source voltage VDS 42 V · Input Protection (ESD) On-state resistance RDS(on) 50 mW · Thermal shutdown with Nominal load current ID(Nom) 3 A Clamping energy EAS auto restart 500 mJ · Overload protection · Short circuit protection 4 · Overvoltage protection 3 · Current limitation 2 · Analog driving possible 1 VPS05163 Application · All kinds of resistive, inductive and capacitive loads in switching or linear applications · µC compatible power switch for 12 V DC applications · Replaces electromechanical relays and discrete circuits General Description N channel vertical power FET in Smart SIPMOS Ò technology. Fully protected by embedded protection functions. Vbb M HITFET â Drain Current Limitation In Pin 2 and 4 (TAB) OvervoltageProtection Gate-Driving Unit Pin 1 ESD Overload Protection Overtemperature Protection Short circuit Protection Pin 3 Source Complete product spectrum and additional information http://www.infineon.com/hitfet Page 1 2004-03-05 BSP 78 Maximum Ratings at Tj = 25°C, unless otherwise specified Parameter Symbol Drain source voltage VDS 42 Supply voltage for full short circuit protection Vbb(SC) 42 Continuous input voltage1) VIN Continuous input current2) IIN -0.2V £ VIN £ 10V Value Unit V -0.22) ... +10 mA self limited | IIN | £ 2 VIN < -0.2V or VIN > 10V °C Operating temperature Tj -40 ...+150 Storage temperature Tstg -55 ... +150 Power dissipation 5) Ptot 3.8 W Unclamped single pulse inductive energy 2) EAS 500 mJ Load dump protection VLoadDump2)3) = VA + VS VIN = 0 and 10 V, td = 400 ms, RI = 2 W, VLD 53.5 V 2 kV TC = 85 °C RL = 4.5 W, VA = 13.5 V Electrostatic discharge voltage2) (Human Body Model) VESD according to Jedec norm EIA/JESD22-A114-B, Section 4 MSL1 Jedec humidity category,J-STD-20-B IEC climatic category; DIN EN 60068-1 40/150/56 Thermal resistance RthJA junction - ambient: K/W @ min. footprint 125 @ 6 cm 2 cooling area 4) 72 junction-soldering point: RthJS 17 K/W 1For input voltages beyond these limits I has to be limited. IN 2not subject to production test, specified by design 3V Loaddump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839 4 Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70µm thick) copper area for drain connection. PCB mounted vertical without blown air. 5not subject to production test, calculated by R thJA and Rds(on) Page 2 2004-03-05 BSP 78 Electrical Characteristics Parameter Symbol at Tj = 25°C, unless otherwise specified Values Unit min. typ. max. 42 - 55 Characteristics Drain source clamp voltage VDS(AZ) V Tj = - 40 ...+ 150, ID = 10 mA Off-state drain current µA IDSS Tj = -40...+85 °C, V DS = 32 V , VIN = 0 V - 1.5 8 Tj = 150 °C - 5 15 Input threshold voltage V VIN(th) ID = 1.4 mA, T j = 25 °C ID = 1.4 mA, T j = 150 °C On state input current IIN(on) On-state resistance RDS(on) 1.3 1.7 2.2 0.8 - - - 10 30 mW VIN = 5 V, ID = 3 A, Tj = 25 °C - 45 60 VIN = 5 V, ID = 3 A, Tj = 150 °C - 75 100 VIN = 10 V, I D = 3 A, Tj = 25 °C - 35 50 VIN = 10 V, I D = 3 A, Tj = 150 °C - 65 90 ID(Nom) 3 4 - ID(lim) 18 24 30 On-state resistance µA RDS(on) Nominal load current 5) A VDS = 0.5 V, Tj < 150°C, VIN = 10 V, T A = 85 °C Current limit (active if VDS>2.5 V)1) VIN = 10 V, VDS = 12 V, t m = 200 µs 1Device switched on into existing short circuit (see diagram Determination of I D(lim) ). If the device is in on condition and a short circuit occurs, these values might be exceeded for max. 50 µs. 5not subject to production test, calculated by R thJA and Rds(on) Page 3 2004-03-05 BSP 78 Electrical Characteristics Parameter Symbol at Tj = 25°C, unless otherwise specified Values Unit min. typ. max. ton - 60 100 RL = 4.7 W, VIN = 0 to 10 V, Vbb = 12 V Turn-off time VIN to 10% ID: toff - 60 100 RL = 4.7 W, VIN = 10 to 0 V, Vbb = 12 V Slew rate on 70 to 50% Vbb: -dVDS/dt on - 0.3 1.5 RL = 4.7 W, VIN = 0 to 10 V, Vbb = 12 V Slew rate off 50 to 70% Vbb: dVDS/dtoff - 0.7 1.5 150 175 - °C Dynamic Characteristics Turn-on time VIN to 90% ID : µs V/µs RL = 4.7 W, VIN = 10 to 0 V, Vbb = 12 V Protection Functions1) Thermal overload trip temperature Tjt Thermal hysteresis 2) DTjt - 10 - K Input current protection mode IIN(Prot) - 130 300 µA EAS 500 - - mJ VSD - 1 1.5 Tj = 150 °C Unclamped single pulse inductive energy 2) ID = 3 A, Tj = 25 °C, Vbb = 12 V Inverse Diode Inverse diode forward voltage V IF = 15 A, tm = 250 µs, V IN = 0 V, tP = 300 µs 1Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as "outside" normal operating range. Protection functions are not designed for continuous repetitive operation. 2not subject to production test, specified by design Page 4 2004-03-05 BSP 78 Block diagram Inductive and overvoltage output clamp Terms RL V I IN 1 D IN 2 ID VDS D Z Vbb HITFET VIN S S 3 HITFET Short circuit behaviour Input circuit (ESD protection) Gate Drive Input VIN Source/ Ground IIN IDS Tj Page 5 2004-03-05 BSP 78 1 Maximum allowable power dissipation 2 On-state resistance Ptot = f(TS) resp. RON = f(Tj ); ID=3A; VIN=10V Ptot = f(TA) @ R thJA=72 K/W 10 100 mW W 8 80 RDS(on) max. 7 Ptot max. 6 70 60 5 50 4 40 3 30 2 6cm2 20 1 10 0 -75 -50 -25 0 25 50 75 100 °C 0 -50 150 typ. -25 0 25 50 75 100 125 °C TS ;TA 3 On-state resistance 4 Typ. input threshold voltage RON = f(T j); ID= 3A; VIN=5V VIN(th) = f(Tj); ID = 0.7 mA; V DS = 12V 2 110 mW V max. 90 1.6 80 typ. 70 VGS(th) RDS(on) 175 Tj 1.4 1.2 60 1 50 0.8 40 0.6 30 20 0.4 10 0.2 0 -50 -25 0 25 50 75 100 125 °C 0 -50 175 Tj -25 0 25 50 75 100 °C 150 Tj Page 6 2004-03-05 BSP 78 5 Typ. transfer characteristics 6 Typ. short circuit current I D=f(V IN); VDS=12V; T Jstart=25°C ID(lim) = f(Tj); VDS=12V Parameter: VIN A A 20 20 ID 30 ID 30 Vin=10V 15 15 10 10 5 5 0 0 1 2 3 4 5 6 7 8 V 0 -50 10 5V -25 0 25 50 75 VIN 100 125 °C 175 Tj 7 Typ. output characteristics 8 Off-state drain current I D=f(V DS); T Jstart=25°C Parameter: VIN IDSS = f(Tj) 35 16 max. µA A 10V 7V 12 25 ID IDSS 6V 5V 20 4V 10 8 15 6 typ. 10 Vin=3V 4 5 0 0 2 1 2 3 4 V 0 -40 6 VDS -15 10 35 60 85 110 135 °C 185 Tj Page 7 2004-03-05 BSP 78 9 Typ. overload current 10 Typ. transient thermal impedance ID(lim) = f(t), Vbb=12 V, no heatsink ZthJA=f(tp) @ 6 cm2 cooling area Parameter: Tjstart Parameter: D=tp/T 10 2 40 K/W D=0.5 A 10 1 0.1 -40°C ZthJA ID(lim) 30 0.2 25 0.05 10 0 0.02 0.01 20 10 -1 15 10 85°C 150°C 25°C 10 -2 Single pulse 5 0 0 0.5 1 1.5 2 2.5 3 ms 10 -3 -7 -6 -5 -4 -3 -2 -1 0 1 10 10 10 10 10 10 10 10 10 4 s 10 3 tp t 11 Determination of ID(lim) ID(lim) = f(t); t m = 200µs Parameter: TJstart 40 A ID(lim) 30 -40°C 25 25°C 20 85°C 15 150°C 10 5 0 0 0.1 0.2 0.3 0.4 ms 0.6 t Page 8 2004-03-05 BSP 78 Package Ordering Code SOT-223 Q67060-S7203-A3 1.6 ±0.1 6.5 ±0.2 +0.2 acc. to DIN 6784 1 2 3 3.5 ±0.2 4 7 ±0.3 B 15˚ max 0.1 max 3 ±0.1 0.5 min A 0.28 ±0.04 2.3 0.7 ±0.1 4.6 0.25 M A 0.25 M B GPS05560 Page 9 2004-03-05 BSP 78 Revision History : Previous version : 2004-03-05 2003-04-22 Page Subjects (major changes since last revision) 2, 4 Footnote 2 extended to Vin<0V, Etot and ∆TjT 2, 3 Footnote 5 implemented to Ptot and ID(nom) 2 ESD test condition changed from MIL STD 883D, methode 3015.7 and EOS/ESD assn. standard S5.1-1993 to Jedec Norm EIA/JESD22-A114-B, Section 4 2 Humidity category classification changed from DIN 40040 value E to J-STD-20-B value MSL1 2 climatic category changed from DIN IEC 68-1 to DIN EN 60068-1 3 VIN(th) test conditions from ID=0.7mA to ID=1.4mA For questions on technology, delivery and prices please contact the Infineon Technologies Offices in Germany or the Infineon Technologies Companies and Representatives worldwide: see our webpage at http://www.infineon.com HITFET®, SIPMOS® are registered trademarks of Infineon Technologies AG. Edition 2004-02-02 Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81541 München, Germany © Infineon Technologies AG 2001 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Page 10 2004-03-05