KOA DNAN08TTE Diode terminator network Datasheet

1733 Reader's Spreadspg189-328:1570 Reader's Spreadspg189-328
1/27/09
4:44 PM
Page 5
PMS 300 neg.
Black neg.
DN(X)
diode terminator network
EU
features
circuit
protection
•
•
•
•
Fast reverse recovery time
• Fast turn on time
Low capacitance
• SMD packages
16 kV IEC61000-4-2 capable
Products with lead-free terminations meet EU RoHS
and China RoHS requirements
applications
• Signal termination
• Signal conditioning
• ESD suppression
• Transient suppression
dimensions and construction
S03
S04
L
L
P
p
Bonding
Wire
Bonding
Wire
d
Lead
Si
Wafer
W
d
Molded
Resin
Molded
Resin
N08, Q20,
Q24
S06
L
p
Die
Si Pad
Wafer
L
Bonding
Wire
Bonding
Wire
d
Lead
Si
Wafer
Molded
Resin
Dimensions inches (mm)
Ht
d ±0.05
L ±0.2 W ±0.2 p ±0.1 Pkg
±0.2
S03
225mw
3
.115
(2.92)
.091
(2.30)
.075
(1.91)
.037
(0.95)
.017
(0.43)
S04
225mw
4
.115
(2.92)
.091
(2.30)
.075
(1.91)
.037
(0.95)
.017
(0.43)
S06
225mw
6
.115
(2.92)
.110
(2.80)
.037
(0.95)
.037
(0.95)
.017
(0.43)
N08
400mw
8
Q20
1000mw
20
.190
(4.83)
.341
(8.66)
.236
(5.99)
.236
(5.99)
.050
(1.27)
.025
(0.635)
.063
(1.60)
.063
(1.60)
.016
(0.41)
.010
(0.25)
Q24
1000mw
24
.341
(8.66)
.236
(5.99)
.025
(0.635)
.063
(1.60)
.010
(0.25)
p
W
W
Pins
Lead
Die
Pad
W
Package Total
Code Power
d Die
Pad
Lead
Die
Pad
Si
Wafer
Molded
Resin
circuit schematic
1
1
1
1
1
DN5: 24 pins
1
DN3: 6 pins
DN2: 20 pins
DNA: 20 pins
DN4: 4 pins
1
DN6: 8 pins
DN7: 24 pins
For further information on packaging, please refer to Appendix A.
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
200
11/21/08
KOA Speer Electronics, Inc. • 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com
1733 Reader's Spreadspg189-328:1570 Reader's Spreadspg189-328
1/27/09
4:44 PM
Page 6
DN(X)
diode terminator network
ordering information
DNA
Q20
T
Package
Symbol
Package type symbol + number of pins
S03: 3 pin SOT23
S04: 4 pin SOT23
S06: 6 pin SOT23
N08: 8 pin Narrow SOIC
Q20: 20 pin QSOP
Q24: 24 pin QSOP
Type
DNA
DN2
DN3
DN4
DN5
DN6
DN7
Termination
Material
T: Sn
(Other termination
styles available,
contact factory
for options)
TEB
Packaging
TE: 7" embossed plastic
TEB: 13" embossed
plastic tape
application schematic
ESD Suppression
Signal Conditioning
Transient
+ Rail
Signal
Ringing
Transient
Suppressed
Driver
Ringing
Eliminate
+ Rail
Receiver
Driver
Receiver
– Rail or GND
– Rail or GND
applications and ratings
Part
Designation
Forward
Voltage
1F=50ma
Reverse
Breakdown
Voltage
1R=1ma
Leakage
Current
@7V
Capacitance
@1Mhz
ESD
Voltage
Capability
IEC 61000-4-2
Operating
Temperature
Range
Continuous
Forward
Current*
DN(X)
0.4 to 1.2V
7.2V
1uA
2pF
16kV
-55°C
to +125°C
50mA
* One diode conducting
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
11/21/08
KOA Speer Electronics, Inc. • 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com
201
circuit
protection
New Part #
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