Maxim MAX1246BEPE 2.7v, low-power, 4-channel, serial 12-bit adcs in qsop-16 Datasheet

19-1071; Rev 1; 3/97
KIT
ATION
EVALU
E
L
B
AVAILA
+2.7V, Low-Power, 4-Channel,
Serial 12-Bit ADCs in QSOP-16
____________________________Features
♦ 4-Channel Single-Ended or 2-Channel
Differential Inputs
♦ Single-Supply Operation:
+2.7V to +3.6V (MAX1246)
+2.7V to +5.25V (MAX1247)
♦ Internal 2.5V Reference (MAX1246)
♦ Low Power: 1.2mA (133ksps, 3V supply)
54µA (1ksps, 3V supply)
1µA (power-down mode)
♦ SPI/QSPI/Microwire/TMS320-Compatible
4-Wire Serial Interface
♦ Software-Configurable Unipolar or Bipolar Inputs
♦ 16-Pin QSOP Package (same area as 8-pin SO)
These devices provide a hard-wired SHDN pin and a
software-selectable power-down, and can be programmed to automatically shut down at the end of a conversion. Accessing the serial interface automatically
powers up the MAX1246/MAX1247, and the quick turn-on
time allows them to be shut down between all conversions. This technique can cut supply current to under
60µA at reduced sampling rates.
The MAX1246/MAX1247 are available in a 16-pin DIP and
a small QSOP that occupies the same board area as an
8-pin SO.
For 8-channel versions of these devices, see the
MAX146/MAX147 data sheet.
______________Ordering Information
INL
(LSB)
PART†
TEMP. RANGE
MAX1246ACPE
0°C to +70°C
16 Plastic DIP
±1/2
MAX1246BCPE
MAX1246ACEE
MAX1246BCEE
0°C to +70°C
0°C to +70°C
0°C to +70°C
16 Plastic DIP
16 QSOP
16 QSOP
±1
±1/2
±1
PIN-PACKAGE
Ordering Information continued at end of data sheet.
† Contact factory for availability of alternate surface-mount
packages.
__________Typical Operating Circuit
________________________Applications
Portable Data Logging
+3V
Data Acquisition
Medical Instruments
Battery-Powered Instruments
Pen Digitizers
Process Control
CH0
0V TO
+2.5V
ANALOG
INPUTS
VDD
DGND
MAX1246 AGND
CH3
VREF
4.7µF
CPU
COM
CS
SCLK
DIN
REFADJ
0.047µF
VDD
0.1µF
DOUT
I/O
SCK (SK)
MOSI (SO)
MISO (SI)
SSTRB
SHDN
VSS
Pin Configuration appears at end of data sheet.
SPI and QSPI are registered trademarks of Motorola, Inc. Microwire is a registered trademark of National Semiconductor Corp.
________________________________________________________________ Maxim Integrated Products
1
For free samples & the latest literature: http://www.maxim-ic.com, or phone 1-800-998-8800
MAX1246/MAX1247
_______________General Description
The MAX1246/MAX1247 12-bit data-acquisition systems
combine a 4-channel multiplexer, high-bandwidth
track/hold, and serial interface with high conversion
speed and low power consumption. The MAX1246 operates from a single +2.7V to +3.6V supply; the MAX1247
operates from a single +2.7V to +5.25V supply. Both
devices’ analog inputs are software configurable for
unipolar/bipolar and single-ended/differential operation.
The 4-wire serial interface connects directly to SPI™/
QSPI™ and Microwire™ devices without external logic. A
serial strobe output allows direct connection to TMS320family digital signal processors. The MAX1246/MAX1247
use either the internal clock or an external serial-interface
clock to perform successive-approximation analog-todigital conversions.
The MAX1246 has an internal 2.5V reference, while the
MAX1247 requires an external reference. Both parts have
a reference-buffer amplifier with a ±1.5% voltageadjustment range.
MAX1246/MAX1247
+2.7V, Low-Power, 4-Channel,
Serial 12-Bit ADCs in QSOP-16
ABSOLUTE MAXIMUM RATINGS
VDD to AGND, DGND................................................. -0.3V to 6V
AGND to DGND ...................................................... -0.3V to 0.3V
CH0–CH3, COM to AGND, DGND ............ -0.3V to (VDD + 0.3V)
VREF to AGND........................................... -0.3V to (VDD + 0.3V)
Digital Inputs to DGND .............................................. -0.3V to 6V
Digital Outputs to DGND ........................... -0.3V to (VDD + 0.3V)
Digital Output Sink Current .................................................25mA
Continuous Power Dissipation (TA = +70°C)
Plastic DIP (derate 10.53mW/°C above +70°C) ......... 842mW
QSOP (derate 8.36mW/°C above +70°C) ................... 667mW
CERDIP (derate 10.00mW/°C above +70°C) .............. 800mW
Operating Temperature Ranges
MAX1246_C_E/MAX1247_C_E .......................... 0°C to +70°C
MAX1246_E_E/MAX1247_E_E........................ -40°C to +85°C
MAX1246_MJE/MAX1247_MJE .................... -55°C to +125°C
Storage Temperature Range ............................ -60°C to +150°C
Lead Temperature (soldering, 10sec) ............................ +300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VDD = +2.7V to +3.6V (MAX1246); VDD = +2.7V to +5.25V (MAX1247); COM = 0V; fSCLK = 2.0MHz; external clock (50% duty cycle);
15 clocks/conversion cycle (133ksps); MAX1246—4.7µF capacitor at VREF pin; MAX1247—external reference, VREF = 2.500 V
applied to VREF pin; TA = TMIN to TMAX; unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC ACCURACY (Note 1)
Resolution
12
Relative Accuracy (Note 2)
INL
MAX124_A
MAX124_B
Differential Nonlinearity
DNL
No missing codes over temperature
Bits
±0.5
±1.0
LSB
±1
LSB
MAX124_A
±0.5
±3
MAX124_B
Gain Error (Note 3)
±0.5
±0.5
±4
±4
Gain Temperature Coefficient
±0.25
ppm/°C
Channel-to-Channel Offset
Matching
±0.25
LSB
Offset Error
LSB
LSB
DYNAMIC SPECIFICATIONS (10kHz sine-wave input, 0V to 2.500Vp-p, 133ksps, 2.0MHz external clock, bipolar input mode)
Signal-to-Noise + Distortion Ratio
SINAD
Total Harmonic Distortion
THD
Spurious-Free Dynamic Range
SFDR
70
Up to the 5th harmonic
73
-88
80
dB
-80
dB
90
dB
Channel-to-Channel Crosstalk
65kHz, 2.500Vp-p (Note 4)
-85
dB
Small-Signal Bandwidth
-3dB rolloff
2.25
MHz
1.0
MHz
Full-Power Bandwidth
CONVERSION RATE
Conversion Time (Note 5)
Track/Hold Acquisition Time
tCONV
Internal clock, SHDN = FLOAT
5.5
7.5
Internal clock, SHDN = VDD
35
65
µs
External clock = 2MHz, 12 clocks/conversion
6
1.5
µs
tACQ
Aperture Delay
Aperture Jitter
Internal Clock Frequency
External Clock Frequency
2
SHDN = FLOAT
ns
<50
ps
1.8
SHDN = VDD
Data transfer only
30
MHz
0.225
0.1
2.0
0
2.0
_______________________________________________________________________________________
MHz
+2.7V, Low-Power, 4-Channel,
Serial 12-Bit ADCs in QSOP-16
(VDD = +2.7V to +3.6V (MAX1246); VDD = +2.7V to +5.25V (MAX1247); COM = 0V; fSCLK = 2.0MHz; external clock (50% duty cycle);
15 clocks/conversion cycle (133ksps); MAX1246—4.7µF capacitor at VREF pin; MAX1247—external reference, VREF = 2.500 V
applied to VREF pin; TA = TMIN to TMAX; unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
ANALOG/COM INPUTS
Input Voltage Range, SingleEnded and Differential (Note 6)
Unipolar, COM = 0V
0 to VREF
Bipolar, COM = VREF / 2
±VREF / 2
Multiplexer Leakage Current
On/off leakage current, VCH_ = 0V or VDD
V
±0.01
Input Capacitance
±1
16
µA
pF
INTERNAL REFERENCE (MAX1246 only, reference buffer enabled)
VREF Output Voltage
TA = +25°C
2.480
2.500
VREF Short-Circuit Current
VREF Temperature Coefficient
Load Regulation (Note 8)
Capacitive Bypass at VREF
2.520
V
30
mA
MAX1246_C
±30
±50
MAX1246_E
±30
±60
MAX1246_M
±30
±80
0mA to 0.2mA output load
±0.35
Internal compensation mode
0
External compensation mode
4.7
Capacitive Bypass at REFADJ
mV
µF
0.047
REFADJ Adjustment Range
ppm/°C
µF
±1.5
%
EXTERNAL REFERENCE AT VREF (Buffer disabled)
VREF Input Voltage Range
(Note 9)
VREF Input Current
VDD +
50mV
1.0
VREF = 2.500V
VREF Input Resistance
100
18
Shutdown VREF Input Current
150
25
0.01
µA
kΩ
10
VDD 0.5
REFADJ Buffer Disable Threshold
V
µA
V
EXTERNAL REFERENCE AT REFADJ
Capacitive Bypass at VREF
Reference Buffer Gain
REFADJ Input Current
Internal compensation mode
0
External compensation mode
4.7
µF
MAX1246
2.06
MAX1247
2.00
V/V
MAX1246
±50
MAX1247
±10
µA
_______________________________________________________________________________________
3
MAX1246/MAX1247
ELECTRICAL CHARACTERISTICS (continued)
MAX1246/MAX1247
+2.7V, Low-Power, 4-Channel,
Serial 12-Bit ADCs in QSOP-16
ELECTRICAL CHARACTERISTICS (continued)
(VDD = +2.7V to +3.6V (MAX1246); VDD = +2.7V to +5.25V (MAX1247); COM = 0V; fSCLK = 2.0MHz; external clock (50% duty cycle);
15 clocks/conversion cycle (133ksps); MAX1246—4.7µF capacitor at VREF pin; MAX1247—external reference, VREF = 2.500 V
applied to VREF pin; TA = TMIN to TMAX; unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DIGITAL INPUTS (DIN, SCLK, CS, SHDN)
DIN, SCLK, CS Input High Voltage
VIH
DIN, SCLK, CS Input Low Voltage
VIL
DIN, SCLK, CS Input Hysteresis
VDD ≤ 3.6V
2.0
VDD > 3.6V, MAX1247 only
3.0
VHYST
IIN
VIN = 0V or VDD
DIN, SCLK, CS Input Capacitance
CIN
(Note 7)
VSH
VDD - 0.4
SHDN Input Mid Voltage
VSM
1.1
SHDN Input Low Voltage
VSL
IS
VFLT
SHDN Maximum Allowed
Leakage, Mid Input
V
±1
µA
15
pF
V
±0.01
SHDN Input High Voltage
SHDN Voltage, Floating
0.8
0.2
DIN, SCLK, CS Input Leakage
SHDN Input Current
V
V
VDD - 1.1
SHDN = 0V or VDD
SHDN = FLOAT
V
±4.0
µA
VDD / 2
SHDN = FLOAT
V
0.4
V
±100
nA
DIGITAL OUTPUTS (DOUT, SSTRB)
Output Voltage Low
VOL
Output Voltage High
VOH
Three-State Leakage Current
Three-State Output Capacitance
IL
COUT
ISINK = 5mA
0.4
ISINK = 16mA
0.8
ISOURCE = 0.5mA
VDD - 0.5
CS = VDD
V
V
±0.01
CS = VDD (Note 7)
±10
µA
15
pF
POWER REQUIREMENTS
Positive Supply Voltage
VDD
MAX1246
2.70
3.60
MAX1247
2.70
5.25
Operating mode, full-scale input
Positive Supply Current, MAX1246
IDD
VDD = 3.6V Fast power-down
Positive Supply Current, MAX1247
IDD
30
70
10
VDD = 5.25V
1.8
2.5
VDD = 3.6V
0.9
1.5
30
70
VDD = 5.25V
3.5
15
VDD = 3.6V
1.2
10
Fast power-down
Full power-down
Supply Rejection (Note 10)
4
PSR
2.0
1.2
Full power-down
Operating mode,
full-scale input
1.2
VDD = 2.7V to VDD(MAX), full-scale input,
external reference = 2.500V
±0.3
_______________________________________________________________________________________
V
mA
µA
mA
µA
mV
+2.7V, Low-Power, 4-Channel,
Serial 12-Bit ADCs in QSOP-16
(VDD = +2.7V to +3.6V (MAX1246); VDD = +2.7V to +5.25V (MAX1247); TA = TMIN to TMAX; unless otherwise noted.)
PARAMETER
SYMBOL
Acquisition Time
CONDITIONS
MIN
tACQ
1.5
DIN to SCLK Setup
tDS
100
DIN to SCLK Hold
tDH
TYP
MAX
UNITS
µs
ns
0
MAX124_ _C/E
20
200
Figure 1 _M
MAX124_
20
240
ns
SCLK Fall to Output Data Valid
tDO
Figure 1
ns
CS Fall to Output Enable
tDV
Figure 1
240
ns
CS Rise to Output Disable
tTR
Figure 2
240
ns
CS to SCLK Rise Setup
tCSS
100
ns
CS to SCLK Rise Hold
tCSH
0
ns
SCLK Pulse Width High
tCH
200
ns
SCLK Pulse Width Low
tCL
200
SCLK Fall to SSTRB
tSSTRB
ns
Figure 1
240
ns
tSDV
External clock mode only, Figure 1
240
ns
CS Rise to SSTRB Output Disable
tSTR
External clock mode only, Figure 2
240
ns
SSTRB Rise to SCLK Rise
tSCK
Internal clock mode only (Note 7)
CS Fall to SSTRB Output Enable
0
ns
Note 1: Tested at VDD = 2.7V; COM = 0V; unipolar single-ended input mode.
Note 2: Relative accuracy is the deviation of the analog value at any code from its theoretical value after the full-scale range has
been calibrated.
Note 3: MAX1246—internal reference, offset nulled; MAX1247—external reference (VREF = +2.500V), offset nulled.
Note 4: Ground “on” channel; sine wave applied to all “off” channels.
Note 5: Conversion time defined as the number of clock cycles multiplied by the clock period; clock has 50% duty cycle.
Note 6: The common-mode range for the analog inputs is from AGND to VDD.
Note 7: Guaranteed by design. Not subject to production testing.
Note 8: External load should not change during conversion for specified accuracy.
Note 9: ADC performance is limited by the converter’s noise floor, typically 300µVp-p.
Note 10: Measured as |VFS(2.7V) - VFS(VDD, MAX)|.
__________________________________________Typical Operating Characteristics
(VDD = 3.0V, VREF = 2.500V, fSCLK = 2.0MHz, CLOAD = 20pF, TA = +25°C, unless otherwise noted.)
0.45
0.35
0.1
0.30
0
-0.1
0.40
MAX1246
0.35
0.25
0.20
MAX1247
0.25
0.20
-0.3
0.10
0.10
-0.4
0.05
0.05
-0.5
0.00
2.25
2048
CODE
3072
4096
MAX1247
0.15
0.15
1024
MAX1246
0.30
-0.2
0
VDD = 2.7V
0.45
INL (LSB)
0.40
0.2
INL (LSB)
0.3
0.50
MAX1247-02
0.4
INL (LSB)
0.50
MAX1247-01
0.5
INTEGRAL NONLINEARITY
vs. TEMPERATURE
INTEGRAL NONLINEARITY
vs. SUPPLY VOLTAGE
MAX1247-03
INTEGRAL NONLINEARITY
vs. CODE
0.00
2.75
3.25
4.25
3.75
VDD (V)
4.75
5.25
-60
-20
20
60
100
140
TEMPERATURE (°C)
_______________________________________________________________________________________
5
MAX1246/MAX1247
TIMING CHARACTERISTICS
____________________________Typical Operating Characteristics (continued)
(VDD = 3.0V, VREF = 2.500V, fSCLK = 2.0MHz, CLOAD = 20pF, TA = +25°C, unless otherwise noted.)
MAX1246
1.25
1.00
CLOAD = 20pF
0.75
2.75
3.25
3.75
4.25
4.75
2.5010
2.5
2.0
1.5
2.5005
2.5000
1.0
2.4995
0
2.25
5.25
3.25
2.75
3.75
4.25
4.75
2.4990
2.25
5.25
2.75
3.25
3.75
4.25
4.75
SUPPLY VOLTAGE (V)
VDD (V)
VDD (V)
SUPPLY CURRENT vs. TEMPERATURE
SHUTDOWN CURRENT
vs. TEMPERATURE
MAX1246
INTERNAL REFERENCE VOLTAGE
vs. TEMPERATURE
1.0
MAX1247
RLOAD = ∞
CODE = 101010100000
-20
20
100
0.8
2.497
2.495
140
2.494
-60
-20
20
60
100
-60
140
-20
20
60
100
TEMPERATURE (°C)
TEMPERATURE (°C)
EFFECTIVE NUMBER OF BITS
vs. FREQUENCY
FFT PLOT
12.0
VDD = 2.7V
EFFECTIVE NUMBER OF BITS
VDD = 2.7V
fIN = 10k
fSAMPLE = 133k
MAX1247-10
20
-20
AMPLITUDE (dB)
2.498
2.496
TEMPERATURE (°C)
0
MAX1247-09
VDD = 2.7V
1.2
0
60
VDD = 3.6V
-40
-60
-80
MAX1247-11
-60
11.8
11.6
11.4
11.2
-100
-120
11.0
0
10
20
30
40
50
FREQUENCY (kHz)
60
5.25
2.499
0.4
0.9
2.500
1.6
VREF (V)
SHUTDOWN CURRENT (µA)
1.1
2.501
2.0
MAX1247-07
MAX1246
1.2
6
MAX1247-06
2.5015
0.5
1.3
0.8
2.5020
3.0
MAX1247
0.50
2.25
FULL POWER-DOWN
3.5
VREF (V)
1.50
4.0
MAX1247-08
SUPPLY CURRENT (mA)
1.75
CLOAD = 50pF
INTERNAL REFERENCE VOLTAGE
vs. SUPPLY VOLTAGE
MAX1247-05
RL = ∞
CODE = 101010100000
SHUTDOWN SUPPLY CURRENT (µA)
2.00
SHUTDOWN SUPPLY CURRENT
vs. SUPPLY VOLTAGE
MAX1247-04
SUPPLY CURRENT
vs. SUPPLY VOLTAGE
SUPPLY CURRENT (mA)
MAX1246/MAX1247
+2.7V, Low-Power, 4-Channel,
Serial 12-Bit ADCs in QSOP-16
70
1
10
FREQUENCY (kHz)
_______________________________________________________________________________________
100
140
+2.7V, Low-Power, 4-Channel,
Serial 12-Bit ADCs in QSOP-16
GAIN ERROR
vs. SUPPLY VOLTAGE
0.45
0.35
0.30
0.25
0.20
0.40
0.30
0.25
0.20
0.30
0.25
0.20
0.15
0.15
0.10
0.10
0.10
0.05
0.05
0.05
0
2.25
2.75
3.25
3.75 4.25
VDD (V)
4.75
0
2.25
5.25
2.75
OFFSET vs. TEMPERATURE
0.35
0.20
4.75
0.15
0
2.25
5.25
0.40
0.30
0.25
0.20
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.05
0
0
95
-55
120 145
TEMPERATURE (˚C)
-30
-5
20 45 70 95
TEMPERATURE (˚C)
MAX1247-18
0.40
0.35
0.30
0.25
0.20
0.15
0.35
0.30
0.25
0.20
0.15
0.05
0.05
3.25
3.75
VDD (V)
4.25
4.75
5.25
120 145
0.40
0.10
2.75
20 45 70 95
TEMPERATURE (˚C)
0.45
0.10
0
2.25
-5
0.50
OFFSET MATCHING (LSB)
OFFSET MATCHING (LSB)
0.45
-30
CHANNEL-TO-CHANNEL OFFSET MATCHING
vs. TEMPERATURE
CHANNEL-TO-CHANNEL OFFSET MATCHING
vs. SUPPLY VOLTAGE
0.50
-55
120 145
MAX1247-19
70
5.25
0.45
0.05
45
4.75
0.50
0.10
20
4.25
CHANNEL-TO-CHANNEL GAIN MATCHING
vs. TEMPERATURE
0.10
-5
3.75
GAIN ERROR
vs. TEMPERATURE
0.15
-30
3.25
VDD (V)
0.15
0
-55
2.75
VDD (V)
GAIN MATCHING (LSB)
0.35
GAIN ERROR (LSB)
0.40
0.25
4.25
0.45
0.40
0.30
3.75
MAX1247-16
0.45
3.25
0.50
MAX1247-15
0.50
OFFSET (LSB)
0.35
MAX1247-17
0.35
0.45
GAIN MATCHING (LSB)
0.40
GAIN ERROR (LSB)
0.40
0.50
MAX1247-13
0.45
OFFSET (LSB)
0.50
MAX1247-12
0.50
CHANNEL-TO-CHANNEL GAIN MATCHING
vs. SUPPLY VOLTAGE
MAX1247-14
OFFSET vs. SUPPLY VOLTAGE
0
-55
-30
-5
20 45 70 95
TEMPERATURE (˚C)
120 145
_______________________________________________________________________________________
7
MAX1246/MAX1247
____________________________Typical Operating Characteristics (continued)
(VDD = 3.0V, VREF = 2.500V, fSCLK = 2.0MHz, CLOAD = 20pF, TA = +25°C, unless otherwise noted.)
MAX1246/MAX1247
+2.7V, Low-Power, 4-Channel,
Serial 12-Bit ADCs in QSOP-16
______________________________________________________________Pin Description
PIN
NAME
FUNCTION
1
VDD
Positive Supply Voltage
2–5
CH0–CH3
Sampling Analog Inputs
6
COM
Ground reference for analog inputs. COM sets zero-code voltage in single-ended mode. Must be
stable to ±0.5LSB.
7
SHDN
Three-Level Shutdown Input. Pulling SHDN low shuts the MAX1246/MAX1247 down; otherwise, they
are fully operational. Pulling SHDN high puts the reference-buffer amplifier in internal compensation
mode. Letting SHDN float puts the reference-buffer amplifier in external compensation mode.
8
VREF
Reference-Buffer Output/ADC Reference Input. Reference voltage for analog-to-digital conversion.
In internal reference mode (MAX1246 only), the reference buffer provides a 2.500V nominal output,
externally adjustable at REFADJ. In external reference mode, disable the internal buffer by pulling
REFADJ to VDD.
9
REFADJ
Input to the Reference-Buffer Amplifier. To disable the reference-buffer amplifier, tie REFADJ to VDD.
10
AGND
Analog Ground
11
DGND
Digital Ground
12
DOUT
Serial Data Output. Data is clocked out at SCLK’s falling edge. High impedance when CS is high.
13
SSTRB
Serial Strobe Output. In internal clock mode, SSTRB goes low when the MAX1246/MAX1247 begin the
A/D conversion, and goes high when the conversion is finished. In external clock mode, SSTRB pulses
high for one clock period before the MSB decision. High impedance when CS is high (external clock
mode).
14
DIN
Serial Data Input. Data is clocked in at SCLK’s rising edge.
15
CS
Active-Low Chip Select. Data will not be clocked into DIN unless CS is low. When CS is high, DOUT is
high impedance.
16
SCLK
Serial Clock Input. Clocks data in and out of serial interface. In external clock mode, SCLK also sets
the conversion speed. (Duty cycle must be 40% to 60%.)
VDD
DOUT
DOUT
CLOAD
50pF
6k
DGND
b) High-Z to VOL and VOH to VOL
Figure 1. Load Circuits for Enable Time
8
6k
CLOAD
50pF
DGND
a) High-Z to VOH and VOL to VOH
VDD
6k
DOUT
DOUT
CLOAD
50pF
CLOAD
50pF
6k
DGND
a) VOH to High-Z
DGND
b) VOL to High-Z
Figure 2. Load Circuits for Disable Time
_______________________________________________________________________________________
+2.7V, Low-Power, 4-Channel,
Serial 12-Bit ADCs in QSOP-16
The MAX1246/MAX1247 analog-to-digital converters
(ADCs) use a successive-approximation conversion
technique and input track/hold (T/H) circuitry to convert
an analog signal to a 12-bit digital output. A flexible serial interface provides easy interface to microprocessors
(µPs). Figure 3 is a block diagram of the MAX1246/
MAX1247.
Pseudo-Differential Input
The sampling architecture of the ADC’s analog comparator is illustrated in the equivalent input circuit
(Figure 4). In single-ended mode, IN+ is internally
switched to CH0–CH3, and IN- is switched to COM. In
differential mode, IN+ and IN- are selected from two
pairs: CH0/CH1 and CH2/CH3. Configure the channels
with Tables 2 and 3. Please note that the codes for
CH0–CH3 in the MAX1246/MAX1247 correspond to the
codes for CH2–CH5 in the eight-channel (MAX146/
MAX147) versions.
In differential mode, IN- and IN+ are internally switched
to either of the analog inputs. This configuration is
pseudo-differential to the effect that only the signal at IN+
is sampled. The return side (IN-) must remain stable within
±0.5LSB (±0.1LSB for best results) with respect to AGND
during a conversion. To accomplish this, connect a 0.1µF
capacitor from IN- (the selected analog input) to AGND.
During the acquisition interval, the channel selected
as the positive input (IN+) charges capacitor CHOLD.
The acquisition interval spans three SCLK cycles and
ends on the falling SCLK edge after the last bit of the
CS
SCLK
DIN
SHDN
CH0
CH1
CH2
CH3
COM
REFADJ
input control word has been entered. At the end of the
acquisition interval, the T/H switch opens, retaining
charge on CHOLD as a sample of the signal at IN+.
The conversion interval begins with the input multiplexer
switching CHOLD from the positive input (IN+) to the
negative input (IN-). In single-ended mode, IN- is simply
COM. This unbalances node ZERO at the comparator’s
input. The capacitive DAC adjusts during the remainder
of the conversion cycle to restore node ZERO to 0V
within the limits of 12-bit resolution. This action is equivalent to transferring a 16pF x [(V IN+) - (VIN-)] charge
from CHOLD to the binary-weighted capacitive DAC,
which in turn forms a digital representation of the analog
input signal.
Track/Hold
The T/H enters its tracking mode on the falling clock
edge after the fifth bit of the 8-bit control word has been
shifted in. It enters its hold mode on the falling clock
edge after the eighth bit of the control word has been
shifted in. If the converter is set up for single-ended
inputs, IN- is connected to COM, and the converter
samples the “+” input. If the converter is set up for differential inputs, IN- connects to the “-” input, and the
difference of |IN+ - IN-| is sampled. At the end of the
conversion, the positive input connects back to IN+,
and CHOLD charges to the input signal.
The time required for the T/H to acquire an input signal
is a function of how quickly its input capacitance is
charged. If the input signal’s source impedance is high,
the acquisition time lengthens, and more time must be
15
16
12-BIT CAPACITIVE DAC
14
7
INPUT
SHIFT
REGISTER
INT
CLOCK
VREF
CONTROL
LOGIC
2
OUTPUT
SHIFT
REGISTER
3
4
ANALOG
INPUT
MUX
13
CH0
DOUT
SSTRB
CLOCK
IN 12-BIT
SAR
ADC OUT
REF
6
+1.21V
REFERENCE
(MAX1246)
20k
A ≈ 2.06*
CH2
11
10
+2.500V
VREF 8
MAX1246
MAX1247
RIN
9k
CSWITCH
1
VDD
ZERO
16pF
CH1
T/H
5
9
12
COMPARATOR
INPUT
CHOLD
MUX –
+
CH3
DGND
TRACK
HOLD
T/H
SWITCH
COM
AT THE SAMPLING INSTANT,
THE MUX INPUT SWITCHES
FROM THE SELECTED IN+
CHANNEL TO THE SELECTED
IN- CHANNEL.
AGND
SINGLE-ENDED MODE: IN+ = CH0–CH3, IN- = COM.
DIFFERENTIAL MODE: IN+ AND IN- SELECTED FROM PAIRS OF
CH0/CH1 AND CH2/CH3.
*A ≈ 2.00 (MAX1247)
Figure 3. Block Diagram
Figure 4. Equivalent Input Circuit
_______________________________________________________________________________________
9
MAX1246/MAX1247
_______________Detailed Description
MAX1246/MAX1247
+2.7V, Low-Power, 4-Channel,
Serial 12-Bit ADCs in QSOP-16
Table 1. Control-Byte Format
BIT 7
(MSB)
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
(LSB)
START
SEL2
SEL1
SEL0
UNI/BIP
SGL/DIF
PD1
PD0
BIT
NAME
DESCRIPTION
7(MSB)
START
The first logic “1” bit after CS goes low defines the beginning of the control byte.
6
5
4
SEL2
SEL1
SEL0
These three bits select which of the four channels are used for the conversion (Tables 2 and 3).
3
UNI/BIP
1 = unipolar, 0 = bipolar. Selects unipolar or bipolar conversion mode. In unipolar mode, an
analog input signal from 0V to VREF can be converted; in bipolar mode, the signal can range
from -VREF / 2 to +VREF / 2.
2
SGL/DIF
1 = single ended, 0 = differential. Selects single-ended or differential conversions. In singleended mode, input signal voltages are referred to COM. In differential mode, the voltage
difference between two channels is measured (Tables 2 and 3).
1
0(LSB)
PD1
PD0
Selects clock and power-down modes.
PD1
PD0
Mode
0
0
Full power-down
0
1
Fast power-down
1
0
Internal clock mode
1
1
External clock mode
allowed between conversions. The acquisition time,
tACQ, is the maximum time the device takes to acquire
the signal, and is also the minimum time needed for the
signal to be acquired. It is calculated by the following
equation:
tACQ = 9 x (RS + RIN) x 16pF
where RIN = 9kΩ, RS = the source impedance of the
input signal, and tACQ is never less than 1.5µs. Note
that source impedances below 1kΩ do not significantly
affect the ADC’s AC performance.
Higher source impedances can be used if a 0.01µF
capacitor is connected to the individual analog inputs.
Note that the input capacitor forms an RC filter with the
input source impedance, limiting the ADC’s signal
bandwidth.
Input Bandwidth
The ADC’s input tracking circuitry has a 2.25MHz
small-signal bandwidth, so it is possible to digitize
high-speed transient events and measure periodic signals with bandwidths exceeding the ADC’s sampling
rate by using undersampling techniques. To avoid
high-frequency signals being aliased into the frequency
band of interest, anti-alias filtering is recommended.
10
Analog Input Protection
Internal protection diodes, which clamp the analog input
to VDD and AGND, allow the channel input pins to swing
from AGND - 0.3V to V DD + 0.3V without damage.
However, for accurate conversions near full scale, the
inputs must not exceed VDD by more than 50mV or be
lower than AGND by 50mV.
If the analog input exceeds 50mV beyond the supplies, do not forward bias the protection diodes of
off channels over 4mA.
How to Start a Conversion
Start a conversion by clocking a control byte into DIN.
With CS low, each rising edge on SCLK clocks a bit from
DIN into the MAX1246/MAX1247’s internal shift register.
After CS falls, the first arriving logic “1” bit defines the
control byte’s MSB. Until this first “start” bit arrives, any
number of logic “0” bits can be clocked into DIN with no
effect. Table 1 shows the control-byte format.
The MAX1246/MAX1247 are compatible with SPI™/
QSPI™ and Microwire™ devices. For SPI, select the
correct clock polarity and sampling edge in the SPI
control registers: set CPOL = 0 and CPHA = 0. Microwire, SPI, and QSPI all transmit a byte and receive a
byte at the same time. Using the Typical Operating
______________________________________________________________________________________
+2.7V, Low-Power, 4-Channel,
Serial 12-Bit ADCs in QSOP-16
SEL2
0
SEL1
0
SEL0
1
1
0
1
0
1
0
1
1
0
CH0
+
CH1
CH2
CH3
MAX1246/MAX1247
DIF = 1)
Table 2. Channel Selection in Single-Ended Mode (SGL/D
COM
–
+
–
+
–
+
–
DIF = 0)
Table 3. Channel Selection in Differential Mode (SGL/D
SEL2
SEL1
SEL0
CH0
CH1
0
0
1
+
–
0
1
0
1
0
1
–
+
1
1
0
Circuit, the simplest software interface requires only
three 8-bit transfers to perform a conversion (one 8-bit
transfer to configure the ADC, and two more 8-bit transfers to clock out the 12-bit conversion result). See Figure
19 for MAX1246/MAX1247 QSPI connections.
Simple Software Interface
Make sure the CPU’s serial interface runs in master
mode so the CPU generates the serial clock. Choose a
clock frequency from 100kHz to 2MHz.
1) Set up the control byte for external clock mode and
call it TB1. TB1 should be of the format: 1XXXXX11
binary, where the Xs denote the particular channel
and conversion mode selected.
2) Use a general-purpose I/O line on the CPU to pull
CS low.
3) Transmit TB1 and, simultaneously, receive a byte
and call it RB1. Ignore RB1.
4) Transmit a byte of all zeros ($00 hex) and, simultaneously, receive byte RB2.
5) Transmit a byte of all zeros ($00 hex) and, simultaneously, receive byte RB3.
6) Pull CS high.
Figure 5 shows the timing for this sequence. Bytes RB2
and RB3 contain the result of the conversion, padded
with one leading zero and three trailing zeros. The total
conversion time is a function of the serial-clock frequency and the amount of idle time between 8-bit
transfers. To avoid excessive T/H droop, make sure the
total conversion time does not exceed 120µs.
CH2
CH3
+
–
–
+
Digital Output
In unipolar input mode, the output is straight binary
(Figure 16). For bipolar inputs, the output is two’s complement (Figure 17). Data is clocked out at the falling
edge of SCLK in MSB-first format.
Clock Modes
The MAX1246/MAX1247 may use either an external
serial clock or the internal clock to perform the successive-approximation conversion. In both clock modes,
the external clock shifts data in and out of the
MAX1246/MAX1247. The T/H acquires the input signal
as the last three bits of the control byte are clocked into
DIN. Bits PD1 and PD0 of the control byte program the
clock mode. Figures 6–9 show the timing characteristics
common to both modes.
External Clock
In external clock mode, the external clock not only shifts
data in and out, but it also drives the analog-to-digital
conversion steps. SSTRB pulses high for one clock
period after the last bit of the control byte. Successive-approximation bit decisions are made and appear
at DOUT on each of the next 12 SCLK falling edges
(Figure 5). SSTRB and DOUT go into a high-impedance
state when CS goes high; after the next CS falling edge,
SSTRB outputs a logic low. Figure 7 shows the SSTRB
timing in external clock mode.
The conversion must complete in some minimum time,
or droop on the sample-and-hold capacitors may
degrade conversion results. Use internal clock mode if
the serial clock frequency is less than 100kHz, or if
serial clock interruptions could cause the conversion
interval to exceed 120µs.
______________________________________________________________________________________
11
MAX1246/MAX1247
+2.7V, Low-Power, 4-Channel,
Serial 12-Bit ADCs in QSOP-16
CS
tACQ
SCLK
1
4
8
UNI/
BIP
SEL2 SEL1 SEL0
DIN
SGL/ PD1
DIF
12
16
20
24
PD0
START
SSTRB
B11
MSB
A/D STATE
RB3
RB2
RB1
DOUT
B10
B9
ACQUISITION
1.5µs
IDLE
B8
B7
B6
B5
B4
B3
B2
B1
B0
LSB
FILLED WITH
ZEROS
CONVERSION
IDLE
(fSCLK = 2MHz)
Figure 5. 24-Clock External Clock Mode Conversion Timing (Microwire and SPI Compatible, QSPI Compatible with fSCLK ≤ 2MHz)
•••
CS
tCSH
tCSS
tCL
SCLK
tCH
tCSH
•••
tDS
tDH
•••
DIN
tDV
DOUT
tDO
tTR
•••
Figure 6. Detailed Serial-Interface Timing
Internal Clock
In internal clock mode, the MAX1246/MAX1247 generate
their own conversion clocks internally. This frees the µP
from the burden of running the SAR conversion clock
and allows the conversion results to be read back at the
processor’s convenience, at any clock rate from 0MHz
to 2MHz. SSTRB goes low at the start of the conversion
and then goes high when the conversion is complete.
SSTRB is low for a maximum of 7.5µs (SHDN = FLOAT),
during which time SCLK should remain low for best
noise performance.
12
An internal register stores data when the conversion is
in progress. SCLK clocks the data out of this register at
any time after the conversion is complete. After SSTRB
goes high, the next falling clock edge produces the
MSB of the conversion at DOUT, followed by the
remaining bits in MSB-first format (Figure 8). CS does
not need to be held low once a conversion is started.
Pulling CS high prevents data from being clocked into
the MAX1246/MAX1247 and three-states DOUT, but it
does not adversely affect an internal clock mode
______________________________________________________________________________________
+2.7V, Low-Power, 4-Channel,
Serial 12-Bit ADCs in QSOP-16
•••
tSTR
tSDV
SSTRB
•••
•••
tSSTRB
SCLK
MAX1246/MAX1247
•••
CS
tSSTRB
••••
••••
PD0 CLOCKED IN
Figure 7. External Clock Mode SSTRB Detailed Timing
CS
SCLK
1
2
3
4
5
SEL2 SEL1 SEL0 UNI/
BIP
DIN
7
8
SGL/ PD1
DIF
PD0
6
9
10
11
12
18
19
20
21
22
23
24
START
SSTRB
tCONV
B11
MSB
DOUT
A/D STATE
IDLE
ACQUISITION
1.5µs
CONVERSION
7.5µs MAX
(fSCLK = 2MHz)
(SHDN = FLOAT)
B10
B9
B2
B1
B0
LSB
FILLED WITH
ZEROS
IDLE
Figure 8. Internal Clock Mode Timing
conversion already in progress. When internal clock
mode is selected, SSTRB does not go into a highimpedance state when CS goes high.
Figure 9 shows the SSTRB timing in internal clock
mode. In this mode, data can be shifted in and out of
the MAX1246/MAX1247 at clock rates exceeding
2.0MHz if the minimum acquisition time (tACQ) is kept
above 1.5µs.
conversion starts on SCLK’s falling edge, after the eighth
bit of the control byte (the PD0 bit) is clocked into DIN.
The start bit is defined as follows:
Data Framing
If CS is toggled before the current conversion is complete, the next high bit clocked into DIN is recognized as
a start bit; the current conversion is terminated, and a
new one is started.
The falling edge of CS does not start a conversion.
The first logic high clocked into DIN is interpreted as a
start bit and defines the first bit of the control byte. A
The first high bit clocked into DIN with CS low any
time the converter is idle; e.g., after VDD is applied.
OR
The first high bit clocked into DIN after bit 5 of a conversion in progress is clocked onto the DOUT pin.
______________________________________________________________________________________
13
MAX1246/MAX1247
+2.7V, Low-Power, 4-Channel,
Serial 12-Bit ADCs in QSOP-16
The fastest the MAX1246/MAX1247 can run with CS held
low between conversions is 15 clocks per conversion.
Figure 10a shows the serial-interface timing necessary to
perform a conversion every 15 SCLK cycles in external
clock mode. If CS is tied low and SCLK is continuous,
guarantee a start bit by first clocking in 16 zeros.
Most microcontrollers (µCs) require that conversions
occur in multiples of 8 SCLK clocks; 16 clocks per conversion is typically the fastest that a µC can drive the
MAX1246/MAX1247. Figure 10b shows the serialinterface timing necessary to perform a conversion every
16 SCLK cycles in external clock mode.
CS
tCONV
tCSS
tSCK
tCSH
SSTRB
tSSTRB
SCLK
tDO
PD0 CLOCK IN
DOUT
NOTE: FOR BEST NOISE PERFORMANCE, KEEP SCLK LOW DURING CONVERSION.
Figure 9. Internal Clock Mode SSTRB Detailed Timing
CS
1
8
15 1
8
15
1
SCLK
S
DIN
CONTROL BYTE 0
DOUT
S
S
CONTROL BYTE 1
CONTROL BYTE 2
B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0
B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0
CONVERSION RESULT 0
CONVERSION RESULT 1
SSTRB
Figure 10a. External Clock Mode, 15 Clocks/Conversion Timing
•••
CS
1
8
16
1
8
16
SCLK
DIN
DOUT
S
S
CONTROL BYTE 0
CONVERSION RESULT 0
•••
CONTROL BYTE 1
B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0
B11 B10 B9 B8
CONVERSION RESULT 1
Figure 10b. External Clock Mode, 16 Clocks/Conversion Timing
14
•••
______________________________________________________________________________________
•••
+2.7V, Low-Power, 4-Channel,
Serial 12-Bit ADCs in QSOP-16
Power-On Reset
When power is first applied, and if SHDN is not pulled
low, internal power-on reset circuitry activates the
MAX1246/MAX1247 in internal clock mode, ready to
convert with SSTRB = high. After the power supplies
stabilize, the internal reset time is 10µs, and no conversions should be performed during this phase. SSTRB is
high on power-up and, if CS is low, the first logical 1 on
DIN is interpreted as a start bit. Until a conversion takes
place, DOUT shifts out zeros. (Also see Table 4.)
Reference-Buffer Compensation
In addition to its shutdown function, SHDN selects internal or external compensation. The compensation
affects both power-up time and maximum conversion
speed. The100kHz minimum clock rate is limited by
droop on the sample-and-hold and is independent of
the compensation used.
Float SHDN to select external compensation. The
Typical Operating Circuit uses a 4.7µF capacitor at
VREF. A 4.7µF value ensures reference-buffer stability
and allows converter operation at the 2MHz full clock
speed. External compensation increases power-up
time (see the Choosing Power-Down Mode section and
Table 4).
Pull SHDN high to select internal compensation.
Internal compensation requires no external capacitor at
VREF and allows for the shortest power-up times. The
maximum clock rate is 2MHz in internal clock mode
and 400kHz in external clock mode.
Choosing Power-Down Mode
You can save power by placing the converter in a lowcurrent shutdown state between conversions. Select full
power-down mode or fast power-down mode via bits 1
and 0 of the DIN control byte with SHDN high or floating
(Tables 1 and 5). In both software power-down modes,
the serial interface remains operational, but the ADC
does not convert. Pull SHDN low at any time to shut
down the converter completely. SHDN overrides bits 1
and 0 of the control byte.
Full power-down mode turns off all chip functions that
draw quiescent current, reducing supply current to 2µA
(typ). Fast power-down mode turns off all circuitry
except the bandgap reference. With fast power-down
mode, the supply current is 30µA. Power-up time can be
shortened to 5µs in internal compensation mode.
Table 4 shows how the choice of reference-buffer compensation and power-down mode affects both power-up
delay and maximum sample rate. In external compensation mode, power-up time is 20ms with a 4.7µF compensation capacitor when the capacitor is initially fully
discharged. From fast power-down, start-up time can be
eliminated by using low-leakage capacitors that do not
discharge more than 1/2LSB while shut down. In powerdown, leakage currents at VREF cause droop on the reference bypass capacitor. Figures 11a and 11b show
the various power-down sequences in both external and
internal clock modes.
Software Power-Down
Software power-down is activated using bits PD1 and PD0
of the control byte. As shown in Table 5, PD1 and PD0
also specify the clock mode. When software shutdown is
asserted, the ADC operates in the last specified clock
mode until the conversion is complete. Then the ADC
powers down into a low quiescent-current state. In internal
clock mode, the interface remains active and conversion
results may be clocked out after the MAX1246/MAX1247
enter a software power-down.
The first logical 1 on DIN is interpreted as a start bit
and powers up the MAX1246/MAX1247. Following
the start bit, the data input word or control byte also
Table 4. Typical Power-Up Delay Times
REFERENCE
BUFFER
REFERENCEBUFFER
COMPENSATION
MODE
Enabled
Internal
Enabled
Internal
Enabled
External
Enabled
External
VREF
CAPACITOR
(µF)
POWER-UP
DELAY
(µs)
MAXIMUM
SAMPLING RATE
(ksps)
Fast
5
26
Full
300
26
4.7
Fast
See Figure 13c
133
4.7
Full
See Figure 13c
133
Disabled
Fast
2
133
Disabled
Full
2
133
POWER-DOWN
MODE
______________________________________________________________________________________
15
MAX1246/MAX1247
__________ Applications Information
MAX1246/MAX1247
+2.7V, Low-Power, 4-Channel,
Serial 12-Bit ADCs in QSOP-16
CLOCK
MODE
EXTERNAL
EXTERNAL
SHDN
SETS SOFTWARE
POWER-DOWN
SETS EXTERNAL
CLOCK MODE
DIN
S X X X X X 1 1
DOUT
S X X X X X 0 0
SETS EXTERNAL
CLOCK MODE
S X X X X X 1 1
VALID
DATA
12 DATA BITS
12 DATA BITS
POWERED UP
POWERED UP
MODE
SOFTWARE
POWER-DOWN
INVALID
DATA
HARDWARE
POWERDOWN
POWERED UP
Figure 11a. Timing Diagram Power-Down Modes, External Clock
CLOCK
MODE
DIN
INTERNAL
S X X X X X 1 0
S X X X X X 0 0
DOUT
SSTRB
MODE
SETS
POWER-DOWN
SETS INTERNAL
CLOCK MODE
S
DATA VALID
DATA VALID
CONVERSION
CONVERSION
POWERED UP
POWER-DOWN
POWERED UP
Figure 11b. Timing Diagram Power-Down Modes, Internal Clock
determines clock mode and power-down states. For
example, if the DIN word contains PD1 = 1, then the
chip remains powered up. If PD0 = PD1 = 0, a
power-down resumes after one conversion.
Hardware Power-Down
Pulling SHDN low places the converter in hardware
power-down (Table 6). Unlike software power-down
mode, the conversion is not completed; it stops coincidentally with SHDN being brought low. SHDN also
16
controls the clock frequency in internal clock mode.
Letting SHDN float sets the internal clock frequency to
1.8MHz. When returning to normal operation with SHDN
floating, there is a tRC delay of approximately 2MΩ x CL,
where CL is the capacitive loading on the SHDN pin.
Pulling SHDN high sets internal clock frequency to
225kHz. This feature eases the settling-time requirement
for the reference voltage. With an external reference, the
MAX1246/MAX1247 can be considered fully powered up
within 2µs of actively pulling SHDN high.
______________________________________________________________________________________
+2.7V, Low-Power, 4-Channel,
Serial 12-Bit ADCs in QSOP-16
Lowest Power at up to 500
Conversions/Channel/Second
The following examples show two different power-down
sequences. Other combinations of clock rates, compensation modes, and power-down modes may give lowest
power consumption in other applications.
Figure 13a depicts the MAX1246 power consumption
for one or four channel conversions utilizing full powerdown mode and internal-reference compensation. A
0.047µF bypass capacitor at REFADJ forms an RC filter
with the internal 20kΩ reference resistor with a 0.9ms
time constant. To achieve full 12-bit accuracy, 10 time
constants or 9ms are required after power-up. Waiting
this 9ms in FASTPD mode instead of in full power-up
can reduce power consumption by a factor of 10 or
more. This is achieved by using the sequence shown in
Figure 14.
AVERAGE SUPPLY CURRENT
vs. CONVERSION RATE
(USING FULLPD)
AVERAGE SUPPLY CURRENT
vs. CONVERSION RATE
WITH EXTERNAL REFERENCE
IDD (µA)
100
4 CHANNELS
10
1 CHANNEL
1
0.1
0.1
1
10
100
1k
10k
100k
RLOAD = ∞
CODE = 101010100000
4 CHANNELS
10
1 CHANNEL
1
0.01
1M
Figure 12. Average Supply Current vs. Conversion Rate with
External Reference
RLOAD = ∞
CODE = 101010100000
IDD (µA)
4 CHANNELS
1 CHANNEL
10
1
10
100
2.0
POWER-UP DELAY (msec)
1000
1
1k
10k
100
1k
TYPICAL REFERENCE-BUFFER POWER-UP
DELAY vs. TIME IN SHUTDOWN
MAX1247-F13B
10,000
0.1
10
1
Figure 13a. MAX1246 Supply Current vs. Conversion Rate,
FULLPD
AVERAGE SUPPLY CURRENT
vs. CONVERSION RATE
(USING FASTPD)
100
0.1
CONVERSION RATE (Hz)
CONVERSION RATE (Hz)
100k
1M
CONVERSION RATE (Hz)
Figure 13b. MAX1246 Supply Current vs. Conversion Rate,
FASTPD
MAX1247-F13C
1000
100
MAX1247-F13A
VREF = VDD = 3.0V
RLOAD = ∞
CODE = 101010100000
AVERAGE SUPPLY CURRENT (µA)
MAX1247-12
10,000
1.5
1.0
0.5
0.0
0.001
0.01
0.1
1
10
TIME IN SHUTDOWN (sec)
Figure 13c. Typical Reference-Buffer Power-Up Delay vs. Time
in Shutdown
______________________________________________________________________________________
17
MAX1246/MAX1247
Power-Down Sequencing
The MAX1246/MAX1247 auto power-down modes can
save considerable power when operating at less than
maximum sample rates. Figures 12, 13a, and 13b show
the average supply current as a function of the sampling rate. The following discussion illustrates the various power-down sequences.
MAX1246/MAX1247
+2.7V, Low-Power, 4-Channel,
Serial 12-Bit ADCs in QSOP-16
COMPLETE CONVERSION SEQUENCE
9ms WAIT
DIN
CH1
(ZEROS)
1
00
FULLPD
1
01
11
FASTPD
(ZEROS)
CH7
1
1
NOPD
00
1
01
FULLPD
FASTPD
1.21V
REFADJ
0V
2.50V
τ = RC = 20kΩ x CREFADJ
VREF
0V
tBUFFEN ≈ 200µs
Figure 14. MAX1246 FULLPD/FASTPD Power-Up Sequence
Lowest Power at Higher Throughputs
Figure 13b shows the power consumption with
external-reference compensation in fast power-down,
with one and four channels converted. The external
4.7µF compensation requires a 200µs wait after
power-up with one dummy conversion. This circuit
combines fast multi-channel conversion with the lowest
power consumption possible. Full power-down mode
may provide increased power savings in applications
where the MAX1246/MAX1247 are inactive for long
periods of time, but where intermittent bursts of
high-speed conversions are required.
Internal and External References
The MAX1246 can be used with an internal or external
reference voltage, whereas an external reference is
required for the MAX1247. An external reference can
be connected directly at VREF or at the REFADJ pin.
An internal buffer is designed to provide 2.5V at
VREF for both the MAX1246 and the MAX1247. The
MAX1246’s internally trimmed 1.21V reference is buffered with a 2.06 gain. The MAX1247’s REFADJ pin is
also buffered with a 2.00 gain to scale an external 1.25V
reference at REFADJ to 2.5V at VREF.
Internal Reference (MAX1246)
The MAX1246’s full-scale range with the internal reference is 2.5V with unipolar inputs and ±1.25V with bipolar inputs. The internal reference voltage is adjustable
to ±1.5% with the circuit in Figure 15.
External Reference
With both the MAX1246 and MAX1247, an external reference can be placed at either the input (REFADJ) or
the output (VREF) of the internal reference-buffer amplifier. The REFADJ input impedance is typically 20kΩ for
the MAX1246, and higher than 100kΩ for the MAX1247.
18
+3.3V
24k
MAX1246
510k
100k
9
REFADJ
0.047µF
Figure 15. MAX1246 Reference-Adjust Circuit
Table 5. Software Power-Down
and Clock Mode
PD1
PD0
DEVICE MODE
0
0
Full Power-Down
0
1
Fast Power-Down
1
0
Internal Clock
1
1
External Clock
Table 6. Hard-Wired Power-Down
and Internal Clock Frequency
SHDN
STATE
DEVICE
MODE
REFERENCE
BUFFER
COMPENSATION
INTERNAL
CLOCK
FREQUENCY
1
Enabled
Internal
225kHz
Floating
Enabled
External
1.8MHz
0
Power-Down
N/A
N/A
______________________________________________________________________________________
+2.7V, Low-Power, 4-Channel,
Serial 12-Bit ADCs in QSOP-16
Using the REFADJ input makes buffering the external
reference unnecessary. To use the direct VREF input,
disable the internal buffer by tying REFADJ to VDD. In
power-down, the input bias current to REFADJ can be
as much as 25µA with REFADJ tied to V DD . Pull
REFADJ to AGND to minimize the input bias current in
power-down.
OUTPUT CODE
FULL-SCALE
TRANSITION
11 . . . 111
11 . . . 110
11 . . . 101
FS = VREF + COM
ZS = COM
VREF
1LSB =
4096
00 . . . 011
Transfer Function
Table 7 shows the full-scale voltage ranges for unipolar
and bipolar modes.
The external reference must have a temperature coefficient of 4ppm/°C or less to achieve accuracy to within
1LSB over the 0°C to +70°C commercial temperature
range.
Figure 16 depicts the nominal, unipolar input/output
(I/O) transfer function, and Figure 17 shows the bipolar
input/output transfer function. Code transitions occur
halfway between successive-integer LSB values.
Output coding is binary, with 1LSB = 610µV (2.500V /
4096) for unipolar operation, and 1LSB = 610µV
[(2.500V / 2 - -2.500V / 2) / 4096] for bipolar operation.
Layout, Grounding, and Bypassing
For best performance, use printed circuit boards.
Wire-wrap boards are not recommended. Board layout
should ensure that digital and analog signal lines are
separated from each other. Do not run analog and digital (especially clock) lines parallel to one another, or
digital lines underneath the ADC package.
Figure 18 shows the recommended system ground
connections. Establish a single-point analog ground
(star ground point) at AGND, separate from the logic
ground. Connect all other analog grounds and DGND
to the star ground. No other digital system ground
should be connected to this ground. For lowest-noise
operation, the ground return to the star ground’s power
00 . . . 010
00 . . . 001
00 . . . 000
0 1
(COM)
2
3
FS
INPUT VOLTAGE (LSB)
FS - 3/2LSB
Figure 16. Unipolar Transfer Function, Full Scale (FS) = VREF
+ COM, Zero Scale (ZS) = COM
supply should be low impedance and as short as
possible.
High-frequency noise in the VDD power supply may
affect the high-speed comparator in the ADC. Bypass
the supply to the star ground with 0.1µF and 1µF
capacitors close to pin 1 of the MAX1246/MAX1247.
Minimize capacitor lead lengths for best supply-noise
rejection. If the power supply is very noisy, a 10Ω resistor can be connected as a lowpass filter (Figure 18).
High-Speed Digital Interfacing with QSPI
The MAX1246/MAX1247 can interface with QSPI using
the circuit in Figure 19 (fSCLK = 2.0MHz, CPOL = 0,
CPHA = 0). This QSPI circuit can be programmed to do a
conversion on each of the four channels. The result is
stored in memory without taxing the CPU, since QSPI
incorporates its own microsequencer.
The MAX1246/MAX1247 are QSPI compatible up to its
maximum external clock frequency of 2MHz.
Table 7. Full Scale and Zero Scale
UNIPOLAR MODE
BIPOLAR MODE
Full Scale
Zero Scale
Positive
Full Scale
Zero
Scale
Negative
Full Scale
VREF + COM
COM
VREF / 2
+ COM
COM
-VREF / 2
+ COM
______________________________________________________________________________________
19
MAX1246/MAX1247
At VREF, the DC input resistance is a minimum of 18kΩ.
During conversion, an external reference at VREF must
deliver up to 350µA DC load current and have 10Ω or
less output impedance. If the reference has a higher
output impedance or is noisy, bypass it close to the
VREF pin with a 4.7µF capacitor.
MAX1246/MAX1247
+2.7V, Low-Power, 4-Channel,
Serial 12-Bit ADCs in QSOP-16
OUTPUT CODE
011 . . . 111
FS = VREF + COM
2
011 . . . 110
ZS = COM
000 . . . 010
000 . . . 001
000 . . . 000
SUPPLIES
+3V
-VREF
+ COM
2
VREF
1LSB =
4096
+3V
GND
+3V
DGND
-FS =
R* = 10Ω
111 . . . 111
111 . . . 110
111 . . . 101
VDD
AGND
COM DGND
100 . . . 001
100 . . . 000
MAX1246
MAX1247
- FS
COM*
DIGITAL
CIRCUITRY
+FS - 1LSB
*OPTIONAL
INPUT VOLTAGE (LSB)
*COM ≤ VREF / 2
Figure 17. Bipolar Transfer Function, Full Scale (FS) =
VREF / 2 + COM, Zero Scale (ZS) = COM
TMS320LC3x Interface
Figure 20 shows an application circuit to interface the
MAX1246/MAX1247 to the TMS320 in external clock
mode. The timing diagram for this interface circuit is
shown in Figure 21.
Use the following steps to initiate a conversion in the
MAX1246/MAX1247 and to read the results:
1) The TMS320 should be configured with CLKX
(transmit clock) as an active-high output clock and
CLKR (TMS320 receive clock) as an active-high
input clock. CLKX and CLKR on the TMS320 are
tied together with the MAX1246/MAX1247’s SCLK
input.
2) The MAX1246/MAX1247’s CS pin is driven low by
the TMS320’s XF_ I/O port to enable data to be
clocked into the MAX1246/MAX1247’s DIN.
3) An 8-bit word (1XXXXX11) should be written to the
MAX1246/MAX1247 to initiate a conversion and
place the device into external clock mode. Refer to
Table 1 to select the proper XXXXX bit values for
your specific application.
20
Figure 18. Power-Supply Grounding Connection
4) The MAX1246/MAX1247’s SSTRB output is monitored via the TMS320’s FSR input. A falling edge on
the SSTRB output indicates that the conversion is in
progress and data is ready to be received from the
MAX1246/MAX1247.
5) The TMS320 reads in one data bit on each of the
next 16 rising edges of SCLK. These data bits represent the 12-bit conversion result followed by four
trailing bits, which should be ignored.
6) Pull CS high to disable the MAX1246/MAX1247 until
the next conversion is initiated.
______________________________________________________________________________________
+2.7V, Low-Power, 4-Channel,
Serial 12-Bit ADCs in QSOP-16
MAX1246/MAX1247
+3V
+3V
(POWER SUPPLIES)
1µF
0.1µF
ANALOG
INPUTS
+2.5V
1
VDD
SCLK 16
2
CH0
CS 15
PCS0
3
MAX1246
CH1 MAX1247 DIN 14
MOSI
4
CH2
SSTRB 13
5
CH3
DOUT 12
6
COM
DGND 11
7
SHDN
AGND 10
8
VREF
REFADJ
SCK
MC683XX
MISO
9
0.1µF
(GND)
Figure 19. MAX1246/MAX1247 QSPI Connections, External Reference
XF
CLKX
CS
SCLK
TMS320LC3x
MAX1246
MAX1247
CLKR
DX
DIN
DR
DOUT
FSR
SSTRB
Figure 20. MAX1246/MAX1247-to-TMS320 Serial Interface
______________________________________________________________________________________
21
MAX1246/MAX1247
+2.7V, Low-Power, 4-Channel,
Serial 12-Bit ADCs in QSOP-16
CS
SCLK
DIN
START
SEL2
SEL1
SEL0
UNI/BIP SGL/DIF
PD1
PD0
HIGH
IMPEDANCE
SSTRB
DOUT
MSB
B10
B1
HIGH
IMPEDANCE
LSB
Figure 21. TMS320 Serial-Interface Timing Diagram
_Ordering Information (continued)
PART†
TEMP. RANGE
PIN-PACKAGE
INL
(LSB)
MAX1246AEPE -40°C to +85°C
16 Plastic DIP
±1/2
MAX1246BEPE
MAX1246AEEE
MAX1246BEEE
MAX1246AMJE
MAX1246BMJE
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-55°C to +125°C
-55°C to +125°C
16 Plastic DIP
16 QSOP
16 QSOP
16 CERDIP*
16 CERDIP*
±1
±1/2
±1
±1/2
±1
MAX1247ACPE
0°C to +70°C
16 Plastic DIP
±1/2
MAX1247BCPE
MAX1247ACEE
MAX1247BCEE
MAX1247AEPE
MAX1247BEPE
MAX1247AEEE
MAX1247BEEE
MAX1247AMJE
MAX1247BMJE
0°C to +70°C
0°C to +70°C
0°C to +70°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-55°C to +125°C
-55°C to +125°C
16 Plastic DIP
16 QSOP
16 QSOP
16 Plastic DIP
16 Plastic DIP
16 QSOP
16 QSOP
16 CERDIP*
16 CERDIP*
±1
±1/2
±1
±1/2
±1
±1/2
±1
±1/2
±1
__________________Pin Configuration
TOP VIEW
VDD 1
16 SCLK
CH0 2
15 CS
CH1 3
14 DIN
CH2 4
CH3 5
MAX1246
MAX1247
13 SSTRB
12 DOUT
COM 6
11 DGND
SHDN 7
10 AGND
VREF 8
9
DIP/QSOP
___________________Chip Information
TRANSISTOR COUNT: 2554
Contact factory for availability of alternate surface-mount
packages.
* Contact factory for availability of CERDIP package, and for
processing to MIL-STD-883B.
†
22
REFADJ
______________________________________________________________________________________
+2.7V, Low-Power, 4-Channel,
Serial 12-Bit ADCs in QSOP-16
QSOP.EPS
______________________________________________________________________________________
23
MAX1246/MAX1247
________________________________________________________Package Information
___________________________________________Package Information (continued)
PDIPN.EPS
MAX1246/MAX1247
+2.7V, Low-Power, 4-Channel,
Serial 12-Bit ADCs in QSOP-16
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
24 __________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 (408) 737-7600
© 1997 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.