TI1 MSP430C11X1 Mixed signal microcontroller Datasheet

MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008
D Low Supply Voltage Range 1.8 V to 3.6 V
D Ultralow Power Consumption
D
D
D
D
D
− Active Mode: 160 μA at 1 MHz, 2.2 V
− Standby Mode: 0.7 μA
− Off Mode (RAM Retention): 0.1 μA
Wake-Up From Standby Mode in
Less Than 6 μs
16-Bit RISC Architecture, 125 ns
Instruction Cycle Time
Basic Clock Module Configurations:
− Various Internal Resistors
− Single External Resistor
− 32-kHz Crystal
− High-Frequency Crystal
− Resonator
− External Clock Source
16-Bit Timer_A With Three
Capture/Compare Registers
On-Chip Comparator for Analog Signal
Compare Function or Slope
Analog-to-Digital (A/D) Conversion
D Serial Onboard Programming,
D
D
D
No External Programming Voltage Needed,
Programmable Code Protection by
Security Fuse
Family Members Include
MSP430C1101: 1KB ROM, 128B RAM
MSP430C1111: 2KB ROM, 128B RAM
MSP430C1121: 4KB ROM, 256B RAM
MSP430F1101A: 1KB + 128B Flash Memory
128B RAM
MSP430F1111A: 2KB + 256B Flash Memory
128B RAM
MSP430F1121A: 4KB + 256B Flash Memory
256B RAM
Available in a 20-Pin Plastic Small-Outline
Wide Body (SOWB) Package, 20-Pin Plastic
Small-Outline Thin Package, 20-Pin TVSOP
(F11x1A only), and 24-Pin QFN
For Complete Module Descriptions, Refer
to the MSP430x1xx Family User’s Guide,
Literature Number SLAU049
description
The Texas Instruments MSP430 family of ultralow-power microcontrollers consists of several devices featuring
different sets of peripherals targeted for various applications. The architecture, combined with five low-power
modes is optimized to achieve extended battery life in portable measurement applications. The device features
a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code
efficiency. The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less
than 6 μs.
The MSP430x11x1(A) series is an ultralow-power mixed signal microcontroller with a built-in 16-bit timer,
versatile analog comparator and fourteen I/O pins.
Typical applications include sensor systems that capture analog signals, convert them to digital values, and then
process the data for display or for transmission to a host system. Stand alone radio frequency (RF) sensor front
end is another area of application. The I/O port inputs provide single slope A/D conversion capability on resistive
sensors.
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range
from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage
because very small parametric changes could cause the device not to meet its published specifications. These devices have limited
built-in ESD protection.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 2008 Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008
AVAILABLE OPTIONS
PACKAGED DEVICES
TA
40°C to 85°C
−40°C
2
PLASTIC
20-PIN SOWB
(DW)
PLASTIC
20-PIN TSSOP
(PW)
MSP430C1101IDW
MSP430C1111IDW
MSP430C1121IDW
MSP430F1101AIDW
MSP430F1111AIDW
MSP430F1121AIDW
MSP430C1101IPW
MSP430C1111IPW
MSP430C1121IPW
MSP430F1101AIPW
MSP430F1111AIPW
MSP430F1121AIPW
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PLASTIC
20-PIN TVSOP
(DGV)
MSP430F1101AIDGV
MSP430F1111AIDGV
MSP430F1121AIDGV
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PLASTIC
24-PIN QFN
(RGE)
MSP430C1101IRGE
MSP430C1111IRGE
MSP430C1121IRGE
MSP430F1101AIRGE
MSP430F1111AIRGE
MSP430F1121AIRGE
MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008
RGE PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
P1.7/TA2/TDO/TDI
P1.6/TA1/TDI/TCLK
P1.5/TA0/TMS
P1.4/SMCLK/TCK
P1.3/TA2
P1.2/TA1
P1.1/TA0
P1.0/TACLK
P2.4/CA1/TA2
P2.3/CA0/TA1
NC
VSS
XOUT
XIN
RST/NMI
P2.0/ACLK
1 23 22 21 20
2
3
4
5
6 8 9 10 11
18
17
16
15
14
13
P1.5/TA0/TMS
P1.4/SMCLK/TCK
P1.3/TA2
P1.2/TA1
P1.1/TA0
P1.0/TACLK
P2.1/INCLK
P2.2/CAOUT/TA0
NC
P2.3/CA0/TA1
P2.4/CA1/TA2
NC
TEST
VCC
P2.5/Rosc
VSS
XOUT
XIN
RST/NMI
P2.0/ACLK
P2.1/INCLK
P2.2/CAOUT/TA0
P2.5/ROSC
VCC
TEST
P1.7/TA2/TDO/TDI
P1.6/TA1/TDI/TCLK
NC
DW, PW, or DGV PACKAGE
(TOP VIEW)
Note: NC pins not internally connected
Power Pad connection to VSS recommended
functional block diagram
XIN
XOUT
VCC
P1/JTAG
RST/NMI
VSS
8
ROSC
Oscillator
System
Clock
ACLK
Flash/ROM
4KB
RAM
256B
2KB
128B
1KB
128B
SMCLK
I/O Port 1
8 I/Os, with
Interrupt
Capability
POR
P2
6
I/O Port 2
6 I/Os, with
Interrupt
Capability
MCLK
CPU
Incl. 16 Reg.
TEST
Emulation
Module
(F versions only)
Test
JTAG
MAB,
4 Bit
MAB,MAB,
16 Bit16-Bit
MCB
Bus
Conv
MDB,
16-Bit
MDB,
16 Bit
Watchdog
Timer
Timer_A3
MDB, 8 Bit
Comparator
A
3 CC Reg
15/16-Bit
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MSP430C11x1, MSP430F11x1A
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Terminal Functions
TERMINAL
NO.
NAME
DESCRIPTION
DW, PW,
OR DGV
RGE
I/O
P1.0/TACLK
13
13
I/O
General-purpose digital I/O pin/Timer_A, clock signal TACLK input
P1.1/TA0
14
14
I/O
General-purpose digital I/O pin/Timer_A, capture: CCI0A input, compare: Out0
output/BSL transmit
P1.2/TA1
15
15
I/O
General-purpose digital I/O pin/Timer_A, capture: CCI1A input, compare: Out1
output
P1.3/TA2
16
16
I/O
General-purpose digital I/O pin/Timer_A, capture: CCI2A input, compare: Out2
output
P1.4/SMCLK/TCK
17
17
I/O
General-purpose digital I/O pin/SMCLK signal output/test clock, input terminal for
device programming and test
P1.5/TA0/TMS
18
18
I/O
General-purpose digital I/O pin/Timer_A, compare: Out0 output/test mode select,
input terminal for device programming and test
P1.6/TA1/TDI/TCLK
19
20
I/O
General-purpose digital I/O pin/Timer_A, compare: Out1 output/test data input or
test clock input
P1.7/TA2/TDO/TDI†
20
21
I/O
General-purpose digital I/O pin/Timer_A, compare: Out2 output/test data output
terminal or data input during programming
P2.0/ACLK
8
6
I/O
General-purpose digital I/O pin/ACLK output
P2.1/INCLK
9
7
I/O
General-purpose digital I/O pin/Timer_A, clock signal at INCLK
P2.2/CAOUT/TA0
10
8
I/O
General-purpose digital I/O pin/Timer_A, capture: CCI0B input/ comparator_A,
output/BSL receive
P2.3/CA0/TA1
11
10
I/O
General-purpose digital I/O pin/Timer_A, compare: Out1 output/ comparator_A,
input
P2.4/CA1/TA2
12
11
I/O
General-purpose digital I/O pin/Timer_A, compare: Out2 output/ comparator_A,
input
P2.5/ROSC
3
24
I/O
General-purpose digital I/O pin/input for external resistor that defines the DCO
nominal frequency
RST/NMI
7
5
I
Reset or nonmaskable interrupt input
TEST
1
22
I
Selects test mode for JTAG pins on Port1. The device protection fuse is connected
to TEST.
VCC
2
23
Supply voltage
VSS
4
2
Ground reference
XIN
6
4
I
Input terminal of crystal oscillator
XOUT
5
3
O
Output terminal of crystal oscillator
NA
Package
Pad
NA
QFN Pad
†
4
QFN package pad connection to VSS recommended.
TDO or TDI is selected via JTAG instruction.
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MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008
short-form description
CPU
The MSP430 CPU has a 16-bit RISC architecture
that is highly transparent to the application. All
operations, other than program-flow instructions,
are performed as register operations in
conjunction with seven addressing modes for
source operand and four addressing modes for
destination operand.
Program Counter
PC/R0
Stack Pointer
SP/R1
Status Register
SR/CG1/R2
Constant Generator
The CPU is integrated with 16 registers that
provide reduced instruction execution time. The
register-to-register operation execution time is
one cycle of the CPU clock.
Four of the registers, R0 to R3, are dedicated as
program counter, stack pointer, status register,
and constant generator, respectively. The
remaining registers are general-purpose
registers.
Peripherals are connected to the CPU using data,
address, and control buses, and can be handled
with all instructions.
instruction set
The instruction set consists of 51 instructions with
three formats and seven address modes. Each
instruction can operate on word and byte data.
Table 1 shows examples of the three types of
instruction formats; Table 2 shows the address
modes.
CG2/R3
General-Purpose Register
R4
General-Purpose Register
R5
General-Purpose Register
R6
General-Purpose Register
R7
General-Purpose Register
R8
General-Purpose Register
R9
General-Purpose Register
R10
General-Purpose Register
R11
General-Purpose Register
R12
General-Purpose Register
R13
General-Purpose Register
R14
General-Purpose Register
R15
Table 1. Instruction Word Formats
Dual operands, source-destination
e.g., ADD R4,R5
R4 + R5 −−−> R5
Single operands, destination only
e.g., CALL
PC −−>(TOS), R8−−> PC
Relative jump, un/conditional
e.g., JNE
R8
Jump-on-equal bit = 0
Table 2. Address Mode Descriptions
ADDRESS MODE
S D
SYNTAX
EXAMPLE
Register
F F
MOV Rs,Rd
MOV R10,R11
Indexed
F F
MOV X(Rn),Y(Rm)
MOV 2(R5),6(R6)
Symbolic (PC relative)
F F
MOV EDE,TONI
Absolute
F F
MOV &MEM,&TCDAT
OPERATION
R10
−−> R11
M(2+R5)−−> M(6+R6)
M(EDE) −−> M(TONI)
M(MEM) −−> M(TCDAT)
Indirect
F
MOV @Rn,Y(Rm)
MOV @R10,Tab(R6)
M(R10) −−> M(Tab+R6)
Indirect
autoincrement
F
MOV @Rn+,Rm
MOV @R10+,R11
M(R10) −−> R11
R10 + 2−−> R10
F
MOV #X,TONI
MOV #45,TONI
Immediate
NOTE: S = source
#45
−−> M(TONI)
D = destination
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MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008
operating modes
The MSP430 has one active mode and five software selectable low-power modes of operation. An interrupt
event can wake up the device from any of the five low-power modes, service the request, and restore back to
the low-power mode on return from the interrupt program.
The following six operating modes can be configured by software:
D Active mode (AM)
−
All clocks are active.
D Low-power mode 0 (LPM0)
−
CPU is disabled.
−
ACLK and SMCLK remain active. MCLK is disabled.
D Low-power mode 1 (LPM1)
−
CPU is disabled.
−
ACLK and SMCLK remain active. MCLK is disabled.
−
DCO’s dc generator is disabled if DCO not used in active mode.
D Low-power mode 2 (LPM2)
−
CPU is disabled.
−
MCLK and SMCLK are disabled.
−
DCO’s dc generator remains enabled.
−
ACLK remains active.
D Low-power mode 3 (LPM3)
−
CPU is disabled.
−
MCLK and SMCLK are disabled.
−
DCO’s dc generator is disabled.
−
ACLK remains active.
D Low-power mode 4 (LPM4)
6
−
CPU is disabled.
−
ACLK is disabled.
−
MCLK and SMCLK are disabled.
−
DCO’s dc generator is disabled.
−
Crystal oscillator is stopped.
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MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
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interrupt vector addresses
The interrupt vectors and the power-up starting address are located in the address range of 0FFFFh to 0FFE0h.
The vector contains the 16-bit address of the appropriate interrupt handler instruction sequence.
INTERRUPT SOURCE
INTERRUPT FLAG
SYSTEM INTERRUPT
WORD ADDRESS
PRIORITY
Power-up
External reset
Watchdog
Flash Memory
WDTIFG
KEYV
(see Note 1)
Reset
0FFFEh
15, highest
NMI
Oscillator fault
Flash memory access violation
NMIIFG
OFIFG
ACCVIFG
(see Notes 1 and 4)
(non)-maskable,
(non)-maskable,
(non)-maskable
0FFFCh
14
0FFFAh
13
0FFF8h
12
Comparator_A
CAIFG
maskable
0FFF6h
11
Watchdog Timer
WDTIFG
maskable
0FFF4h
10
Timer_A3
TACCR0 CCIFG (see Note 2)
maskable
0FFF2h
9
Timer_A3
TACCR1 CCIFG.
TACCR2 CCIFG
TAIFG (see Notes 1 and 2)
maskable
0FFF0h
8
0FFEEh
7
0FFECh
6
0FFEAh
5
0FFE8h
4
I/O Port P2
(eight flags; see Note 3)
P2IFG.0 to P2IFG.7
(see Notes 1 and 2)
maskable
0FFE6h
3
I/O Port P1
(eight flags)
P1IFG.0 to P1IFG.7
(see Notes 1 and 2)
maskable
0FFE4h
2
0FFE2h
1
0FFE0h
0, lowest
NOTES: 1.
2.
3.
4.
Multiple source flags
Interrupt flags are located in the module
There are eight Port P2 interrupt flags, but only six Port P2 I/O pins (P2.0−5) implemented on the ’C11x1 and ’F11x1A devices.
(non)-maskable: the individual interrupt-enable bit can disable an interrupt event, but the general interrupt enable cannot.
Nonmaskable: neither the individual nor the general interrupt-enable bit will disable an interrupt event.
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MSP430C11x1, MSP430F11x1A
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special function registers
Most interrupt and module enable bits are collected into the lowest address space. Special function register bits
not allocated to a functional purpose are not physically present in the device. Simple software access is provided
with this arrangement.
interrupt enable 1 and 2
Address
7
6
0h
5
4
ACCVIE
NMIIE
rw-0
WDTIE:
OFIE:
NMIIE:
ACCVIE:
Address
3
2
1
OFIE
rw-0
0
WDTIE
rw-0
rw-0
Watchdog timer interrupt enable. Inactive if watchdog mode is selected. Active if watchdog timer
is configured in interval timer mode.
Oscillator fault enable
(Non)maskable interrupt enable
Flash access violation interrupt enable
7
6
5
6
5
4
3
2
4
3
2
1
0
01h
interrupt flag register 1 and 2
Address
7
02h
NMIIFG
rw-0
WDTIFG:
OFIFG:
NMIIFG:
Address
rw-1
7
6
5
4
3
rw:
rw-0,1:
rw-(0,1):
Bit can be read and written.
Bit can be read and written. It is Reset or Set by PUC.
Bit can be read and written. It is Reset or Set by POR.
SFR bit is not present in device
8
0
WDTIFG
rw-(0)
Set on watchdog timer overflow (in watchdog mode) or security key violation.
Reset on VCC power up or a reset condition at RST/NMI pin in reset mode.
Flag set on oscillator fault
Set via RST/NMI pin
03h
Legend
1
OFIFG
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1
0
MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008
memory organization
MSP430C1101
MSP430C1111
MSP430C1121
Memory
Main: interrupt vector
Main: code memory
Size
ROM
ROM
1KB ROM
0FFFFh−0FFE0h
0FFFFh−0FC00h
2KB ROM
0FFFFh−0FFE0h
0FFFFh−0F800h
4KB ROM
0FFFFh−0FFE0h
0FFFFh−0F000h
Information memory
Size
Flash
Not applicable
Not applicable
Not applicable
Boot memory
Size
ROM
Not applicable
Not applicable
Not applicable
Size
128 Byte
027Fh − 0200h
128 Byte
027Fh − 0200h
256 Byte
02FFh − 0200h
16-bit
8-bit
8-bit SFR
01FFh − 0100h
0FFh − 010h
0Fh − 00h
01FFh − 0100h
0FFh − 010h
0Fh − 00h
01FFh − 0100h
0FFh − 010h
0Fh − 00h
RAM
Peripherals
MSP430F1101A
MSP430F1111A
MSP430F1121A
Memory
Main: interrupt vector
Main: code memory
Size
Flash
Flash
1KB Flash
0FFFFh−0FFE0h
0FFFFh−0FC00h
2KB Flash
0FFFFh−0FFE0h
0FFFFh−0F800h
4KB Flash
0FFFFh−0FFE0h
0FFFFh−0F000h
Information memory
Size
Flash
128 Byte
010FFh − 01080h
256 Byte
010FFh − 01000h
256 Byte
010FFh − 01000h
Boot memory
Size
ROM
1KB
0FFFh − 0C00h
1KB
0FFFh − 0C00h
1KB
0FFFh − 0C00h
Size
128 Byte
027Fh − 0200h
128 Byte
027Fh − 0200h
256 Byte
02FFh − 0200h
16-bit
8-bit
8-bit SFR
01FFh − 0100h
0FFh − 010h
0Fh − 00h
01FFh − 0100h
0FFh − 010h
0Fh − 00h
01FFh − 0100h
0FFh − 010h
0Fh − 00h
RAM
Peripherals
bootstrap loader (BSL)
The MSP430 BSL enables users to program the flash memory or RAM using a UART serial interface. Access
to the MSP430 memory via the BSL is protected by user-defined password. For complete description of the
features of the BSL and its implementation, see the Application report Features of the MSP430 Bootstrap
Loader, Literature Number SLAA089.
BSL FUNCTION
DW, PW, AND DGV PACKAGE PINS
RGE PACKAGE PINS
Data Transmit
14 - P1.1
14 - P1.1
Data Receive
10 - P2.2
8 - P2.2
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MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
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flash memory
The flash memory can be programmed via the JTAG port, the bootstrap loader, or in-system by the CPU. The
CPU can perform single-byte and single-word writes to the flash memory. Features of the flash memory include:
D Flash memory has n segments of main memory and two segments of information memory (A and B) of
128 bytes each. Each segment in main memory is 512 bytes in size.
D Segments 0 to n may be erased in one step, or each segment may be individually erased.
D Segments A and B can be erased individually, or as a group with segments 0 to n.
Segments A and B are also called information memory.
D New devices may have some bytes programmed in the information memory (needed for test during
manufacturing). The user should perform an erase of the information memory prior to the first use.
0FFFFh
0FE00h
Segment0 w/
Interrupt Vectors
0FDFFh
0FC00h
Segment1
0FBFFh
0FA00h
Segment2
0F9FFh
0F800h
Segment3
0F7FFh
0F600h
Segment4
0F5FFh
0F400h
Segment5
0F3FFh
0F200h
Segment6
0F1FFh
0F000h
Segment7
010FFh
01080h
SegmentA
0107Fh
01000h
SegmentB
Flash Main Memory
Information
Memory
NOTE: All segments not implemented on all devices.
10
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MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
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peripherals
Peripherals are connected to the CPU through data, address, and control buses and can be handled using all
instructions. For complete module descriptions, see the MSP430x1xx Family User’s Guide, literature number
SLAU049.
oscillator and system clock
The clock system is supported by the basic clock module that includes support for a 32768-Hz watch crystal
oscillator, an internal digitally-controlled oscillator (DCO), and a high-frequency crystal oscillator. The basic
clock module is designed to meet the requirements of both low system cost and low power consumption. The
internal DCO provides a fast turn-on clock source and stabilizes in less than 6 μs. The basic clock module
provides the following clock signals:
D Auxiliary clock (ACLK), sourced from a 32768-Hz watch crystal or a high-frequency crystal
D Main clock (MCLK), the system clock used by the CPU
D Sub-Main clock (SMCLK), the subsystem clock used by the peripheral modules
digital I/O
There are two 8-bit I/O ports implemented—ports P1 and P2 (only six P2 I/O signals are available on external
pins):
D
D
D
D
All individual I/O bits are independently programmable.
Any combination of input, output, and interrupt conditions is possible.
Edge-selectable interrupt input capability for all the eight bits of port P1 and six bits of port P2.
Read/write access to port-control registers is supported by all instructions.
NOTE:
Only six bits of port P2 (P2.0 to P2.5) are available on external pins, but all control and data bits
for port P2 are implemented.
watchdog timer (WDT)
The primary function of the WDT module is to perform a controlled system restart after a software problem
occurs. If the selected time interval expires, a system reset is generated. If the watchdog function is not needed
in an application, the module can be configured as an interval timer and can generate interrupts at selected time
intervals.
Comparator_A
The primary function of the Comparator_A module is to support precision slope analog-to-digital conversions,
battery-voltage supervision, and monitoring of external analog signals.
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MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
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Timer_A3
Timer_A3 is a 16-bit timer/counter with three capture/compare registers. Timer_A3 can support multiple
capture/compares, PWM outputs, and interval timing. Timer_A3 also has extensive interrupt capabilities.
Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare
registers.
TIMER_A3 SIGNAL CONNECTIONS
INPUT PIN NUMBER
DW, PW, DGV
RGE
DEVICE INPUT
SIGNAL
13 - P1.0
13 - P1.0
TACLK
TACLK
ACLK
ACLK
SMCLK
SMCLK
MODULE
BLOCK
MODULE
OUTPUT
SIGNAL
Timer
NA
OUTPUT PIN NUMBER
DW, PW, DGV
RGE
9 - P2.1
7 - P2.1
INCLK
INCLK
14 - P1.1
14 - P1.1
TA0
CCI0A
14 - P1.1
14 - P1.1
10 - P2.2
8 - P2.2
TA0
CCI0B
18 - P1.5
18 - P1.5
11 - P2.3
10 - P2.3
15 - P1.2
15 - P1.2
19 - P1.6
20 - P1.6
15 - P1.2
16 - P1.3
12
MODULE
INPUT NAME
15 - P1.2
16 - P1.3
VSS
GND
VCC
VCC
TA1
CCI1A
CAOUT
(internal)
CCI1B
VSS
GND
VCC
VCC
CCR0
CCR1
TA0
TA1
TA2
CCI2A
12 - P2.4
11 - P2.4
ACLK (internal)
CCI2B
16 - P1.3
16 - P1.3
VSS
GND
20 - P1.7
21 - P1.7
VCC
VCC
POST OFFICE BOX 655303
CCR2
• DALLAS, TEXAS 75265
TA2
MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008
peripheral file map
PERIPHERALS WITH WORD ACCESS
Timer_A
Reserved
Reserved
Reserved
Reserved
Capture/compare register
Capture/compare register
Capture/compare register
Timer_A register
Reserved
Reserved
Reserved
Reserved
Capture/compare control
Capture/compare control
Capture/compare control
Timer_A control
Timer_A interrupt vector
TACCTL2
TACCTL1
TACCTL0
TACTL
TAIV
017Eh
017Ch
017Ah
0178h
0176h
0174h
0172h
0170h
016Eh
016Ch
016Ah
0168h
0166h
0164h
0162h
0160h
012Eh
TACCR2
TACCR1
TACCR0
TAR
Flash Memory
Flash control 3
Flash control 2
Flash control 1
FCTL3
FCTL2
FCTL1
012Ch
012Ah
0128h
Watchdog
Watchdog/timer control
WDTCTL
0120h
PERIPHERALS WITH BYTE ACCESS
Comparator_A
Comparator_A port disable
Comparator_A control 2
Comparator_A control 1
CAPD
CACTL2
CACTL1
05Bh
05Ah
059h
Basic Clock
Basic clock system control 2
Basic clock system control 1
DCO clock frequency control
BCSCTL2
BCSCTL1
DCOCTL
058h
057h
056h
Port P2
Port P2 selection
Port P2 interrupt enable
Port P2 interrupt edge select
Port P2 interrupt flag
Port P2 direction
Port P2 output
Port P2 input
P2SEL
P2IE
P2IES
P2IFG
P2DIR
P2OUT
P2IN
02Eh
02Dh
02Ch
02Bh
02Ah
029h
028h
Port P1
Port P1 selection
Port P1 interrupt enable
Port P1 interrupt edge select
Port P1 interrupt flag
Port P1 direction
Port P1 output
Port P1 input
P1SEL
P1IE
P1IES
P1IFG
P1DIR
P1OUT
P1IN
026h
025h
024h
023h
022h
021h
020h
Special Function
SFR interrupt flag 2
SFR interrupt flag 1
SFR interrupt enable 2
SFR interrupt enable 1
IFG2
IFG1
IE2
IE1
003h
002h
001h
000h
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
13
MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008
absolute maximum ratings†
Voltage applied at VCC to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 4.1 V
Voltage applied to any pin (see Note) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VCC+0.3 V
Diode current at any device terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±2 mA
Storage temperature, Tstg (unprogrammed device) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 150°C
Storage temperature, Tstg (programmed device) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE: All voltages referenced to VSS. The JTAG fuse-blow voltage, VFB, is allowed to exceed the absolute maximum rating. The voltage is applied
to the TEST pin when blowing the JTAG fuse.
recommended operating conditions
MIN
Supply voltage during program execution
execution, VCC (see Note 1)
Supply voltage during program/erase flash memory, VCC
NOM
MAX
MSP430C11x1
18
1.8
36
3.6
MSP430F11x1A
1.8
3.6
MSP430F11x1A
2.7
Supply voltage, VSS
3.6
0
Operating free-air temperature range, TA
MSP430x11x1(A)
LF mode selected, XTS=0
t l frequency,
f
f(LFXT1)
LFXT1 crystal
(see Notes 1 and 2)
−40
Watch crystal
Processor frequency f(system) (MCLK signal)
85
V
°C
Hz
450
8000
1000
8000
VCC = 1.8 V,
MSP430x11x1(A)
dc
4.15
VCC = 3.6 V,
MSP430x11x1(A)
dc
8
Crystal
V
V
32 768
Ceramic resonator
XT1 mode selected
selected, XTS
XTS=1
1
UNITS
kHz
MHz
NOTES: 1. In LF mode, the LFXT1 oscillator requires a watch crystal. A 5.1MΩ resistor from XOUT to VSS is recommended when
VCC < 2.5 V. In XT1 mode, the LFXT1 and XT2 oscillators accept a ceramic resonator or crystal up to 4.15MHz at VCC ≥ 2.2 V. In
XT1 mode, the LFXT1 and XT2 oscillators accept a ceramic resonator or crystal up to 8 MHz at VCC ≥ 2.8 V.
2. In LF mode, the LFXT1 oscillator requires a watch crystal. In XT1 mode, LFXT1 accepts a ceramic resonator or a crystal.
fSYSTEM (MHz)
8.0 MHz
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
Supply voltage range,
’x11x1(A), during
program execution
4.15 MHz
1.8 V
2.7 V 3 V
Supply Voltage − V
Supply voltage range, ’F11x1A,
during flash memory programming
3.6 V
NOTE: Minimum processor frequency is defined by system clock. Flash
program or erase operations require a minimum VCC of 2.7 V.
Figure 1. Frequency vs Supply Voltage
14
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
supply current (into VCC) excluding external current
PARAMETER
TEST CONDITIONS
C11x1
I(AM)
Active mode
F11x1A
C11x1
I(CPUOff)
Low power mode
Low-power
(LPM0)
F11x1A
I(LPM2)
Low power mode (LPM2)
Low-power
C11x1
I(LPM3)
MIN
160
200
3V
240
300
TA = −40°C
40 C to 85
85°C,
C,
f(MCLK) = f(SMCLK) = f(ACLK) = 4096 Hz
2.2 V
1.3
2
3V
2.5
3.2
TA = −40°C to 85°C,
fMCLK = f(SMCLK) = 1 MHz,
f(ACLK) = 32,768 Hz,
Program executes in flash
2.2 V
200
250
3V
300
350
TA = −40°C to 85°C,
Program executes in flash
f(MCLK) = f(SMCLK) = f(ACLK) = 4096 Hz
2.2 V
3
5
3V
11
18
TA = −40°C to 85°C,
f(MCLK) = 0,
0 f(SMCLK) = 1 MHz,
MHz
f(ACLK) = 32,768 Hz
2.2 V
30
40
3V
51
60
TA = −40°C to 85°C,
f(MCLK) = 0,
0 f(SMCLK) = 1 MHz,
MHz
f(ACLK) = 32,768 Hz
2.2 V
32
45
3V
55
70
TA = −40°C to 85°C,
f(MCLK) = f(SMCLK) = 0 MHz
MHz,
f(ACLK) = 32,768 Hz, SCG0 = 0
2.2 V
11
14
3V
17
22
TA = −40°C to 85°C,
f(MCLK) = f(SMCLK) = 0 MHz
MHz,
f(ACLK) = 32,768 Hz, SCG0 = 1
2.2 V
1.2
1.7
2
2.7
0.8
1.2
0.7
1
1.6
2.3
1.8
2.2
1.6
1.9
TA = 85°C
2.3
3.4
TA = −40°C
0.1
0.5
0.1
0.5
0.4
0.8
0.1
0.5
0.1
0.5
0.8
1.9
TA = 85°C
TA = −40°C
TA = 25°C
C11x1
3V
TA = −40°C
2.2 V
f(MCLK) = 0 MHz,
MHz
f(SMCLK) = 0 MHz,
f(ACLK) = 32,768 Hz,
SCG0 = 1
TA = 25°C
TA = 85°C
F11x1A
MAX
2.2 V
TA = 25°C
Low power mode
Low-power
(LPM4)
TYP
TA = −40°C to 85°C,
f(MCLK) = f(SMCLK) = 1 MHz,
MHz
f(ACLK) = 32,768 Hz
TA = −40°C
Low-power
Low
power mode
(LPM3)
F11x1A
I(LPM4)
VCC
3V
2.2 V/3 V
f(MCLK) = 0 MHz,
f(SMCLK) = 0 MHz,
MHz
f(ACLK) = 0 Hz, SCG0 = 1
TA = 25°C
2.2 V/3 V
TA = 85°C
UNIT
μA
μA
μA
μA
μA
NOTE: All inputs are tied to 0 V or VCC. Outputs do not source or sink any current.
current consumption of active mode versus system frequency, C version, F version
IAM = IAM[1 MHz] × fsystem [MHz]
current consumption of active mode versus supply voltage, C version
IAM = IAM[3 V] + 105 μA/V × (VCC−3 V)
current consumption of active mode versus supply voltage, F version
IAM = IAM[3 V] + 120 μA/V × (VCC−3 V)
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
15
MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (continued)
Schmitt-trigger inputs − Ports P1 (P1.0 to P1.7) and P2 (P2.0 to P2.5)
PARAMETER
VIT+
Positive going input threshold voltage
Positive-going
VIT−
Negative going input threshold voltage
Negative-going
Vhys
Input voltage hysteresis (VIT+ − VIT−)
VCC
MIN
2.2 V
1.1
TYP
MAX
1.5
3V
1.5
1.9
2.2 V
0.4
0.9
3V
0.9
1.3
2.2 V
0.3
1.1
3V
0.5
1
UNIT
V
V
V
standard inputs − RST/NMI, JTAG (TCK, TMS, TDI/TCLK)
PARAMETER
VIL
Low-level input voltage
VIH
High-level input voltage
VCC
MIN
22V/3V
2.2
TYP
MAX
UNIT
VSS
VSS+0.6
V
0.8×VCC
VCC
V
MAX
UNIT
inputs Px.x, TAx
PARAMETER
t(int)
External interrupt
p timing
g
TEST CONDITIONS
Port
signal
P t P1,
P1 P2:
P2 P1.x
P1 to
t P2.x,
P2 External
E t
l trigger
ti
i
l
for the interrupt flag (see Note 1)
t(cap)
(
)
Timer A capture timing
Timer_A,
TA0
TA0, TA1
TA1, TA2
f(TAext)
Timer_A clock frequency
externally applied to pin
TACLK,
TACLK INCLK t(H) = t(L)
f(TAint)
Timer A clock frequency
Timer_A
SMCLK or ACLK signal selected
VCC
MIN
2.2 V/3 V
1.5
2.2 V
62
3V
50
2.2 V
62
3V
50
TYP
cycle
ns
ns
2.2 V
8
3V
10
2.2 V
8
3V
10
MHz
MHz
NOTES: 1. The external signal sets the interrupt flag every time the minimum t(int) cycle and time parameters are met. It may be set even with
trigger signals shorter than t(int). Both the cycle and timing specifications must be met to ensure the flag is set. t(int) is measured in
MCLK cycles.
leakage current
PARAMETER
Ilkg(Px.x)
High impedance leakage current
High-impedance
TEST CONDITIONS
VCC
MIN
TYP
MAX
Port P1: P1.x, 0 ≤ × ≤ 7
(see Notes 1 and 2)
2.2 V/3 V
±50
Port P2: P2.x, 0 ≤ × ≤ 5
(see Notes 1 and 2)
2.2 V/3 V
±50
UNIT
nA
NOTES: 1. The leakage current is measured with VSS or VCC applied to the corresponding pin(s), unless otherwise noted.
2. The leakage of the digital port pins is measured individually. The port pin must be selected for input and there must be no optional
pullup or pulldown resistor.
16
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (continued)
outputs − Ports P1 (P1.0 to P1.7) and P2 (P2.0 to P2.5)
PARAMETER
TEST CONDITIONS
I(OHmax) = −1.5 mA
VOH
High-level output voltage
Port 1 and Port 2 (C11x1)
Port 1 (F11x1A)
I(OHmax) = −6 mA
I(OHmax) = −1.5 mA
I(OHmax) = −6 mA
I(OHmax) = −1 mA
VOH
High level output voltage
High-level
Port 2 (F11x1A)
I(OHmax) = −3.4 mA
I(OHmax) = −1 mA
I(OHmax) = −3.4 mA
I(OLmax) = 1.5 mA
VOL
Low-level output voltage
Port 1 and Port 2 (C11x1,
(C11x1
F11x1A)
I(OLmax) = 6 mA
I(OLmax) = 1.5 mA
I(OLmax) = 6 mA
MIN
See Note 1
VCC = 2
2.2
2V
VCC = 3 V
VCC = 2
2.2
2V
VCC = 3 V
2V
VCC = 2
2.2
VCC = 3 V
TYP
MAX
VCC−0.25
VCC
See Note 2
VCC−0.6
VCC
See Note 1
VCC−0.25
VCC
See Note 2
VCC−0.6
VCC
See Note 3
VCC−0.25
VCC
See Note 3
VCC−0.6
VCC
See Note 3
VCC−0.25
VCC
See Note 3
VCC−0.6
VCC
See Note 1
VSS
VSS+0.25
See Note 2
VSS
VSS+0.6
See Note 1
VSS
VSS+0.25
See Note 2
VSS
VSS+0.6
UNIT
V
V
V
NOTES: 1. The maximum total current, IOHmax and IOLmax, for all outputs combined, should not exceed ±12 mA to hold the maximum voltage
drop specified.
2. The maximum total current, IOHmax and IOLmax, for all outputs combined, should not exceed ±48 mA to hold the maximum voltage
drop specified.
3. One output loaded at a time.
output frequency
PARAMETER
fP20
fTAx
Output frequency
TEST CONDITIONS
VCC
P2.0/ACLK, CL = 20 pF
2.2 V/3 V
TA0, TA1, TA2, CL = 20 pF
Internal clock source, SMCLK signal applied (see Note 1)
2.2 V/3 V
fSMCLK = fLFXT1 = fXT1
P1.4/SMCLK,
P1
4/SMCLK
CL = 20 pF
tXdc
Duty cycle of O/P
frequency
fSMCLK = fLFXT1 = fLF
2 2 V/3 V
2.2
fSMCLK = fLFXT1/n
fSMCLK = fDCOCLK
2.2 V/3 V
fP20 = fLFXT1 = fXT1
P2 0/ACLK
P2.0/ACLK,
CL = 20 pF
tTAdc
fP20 = fLFXT1 = fLF
MIN
dc
fSystem
40%
60%
35%
65%
50%−
15 ns
50%
50%+
15 ns
50%−
15 ns
50%
50%+
15 ns
40%
2.2 V/3 V
MAX
UNIT
fSystem
MHz
60%
30%
fP20 = fLFXT1/n
TA0, TA1, TA2, CL = 20 pF, duty cycle = 50%
TYP
70%
50%
2.2 V/3 V
0
±50
ns
NOTE 1: The limits of the system clock MCLK has to be met. MCLK and SMCLK can have different frequencies.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
17
MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (continued)
outputs − Ports P1 and P2 (continued)
TYPICAL LOW-LEVEL OUTPUT CURRENT
vs
LOW-LEVEL OUTPUT VOLTAGE
TYPICAL LOW-LEVEL OUTPUT CURRENT
vs
LOW-LEVEL OUTPUT VOLTAGE
25
TA = 25°C
VCC = 2.2 V
P1.0
14
I OL − Typical Low-Level Output Current − mA
I OL − Typical Low-Level Output Current − mA
16
12
TA = 85°C
10
8
6
4
2
0
0.0
0.5
1.0
1.5
2.0
VCC = 3 V
P1.0
20
TA = 85°C
15
10
5
0
0.0
2.5
TA = 25°C
0.5
VOL − Low-Level Output Voltage − V
1.0
TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
I OH − Typical High-Level Output Current − mA
I OH − Typical High-Level Output Current − mA
3.5
−4
−6
−8
−10
TA = 85°C
−12
TA = 25°C
1.0
1.5
2.0
2.5
VCC = 3 V
P1.0
−5
−10
−15
−20
TA = 85°C
−25
−30
0.0
VOH − High-Level Output Voltage − V
TA = 25°C
0.5
1.0
1.5
Figure 5
NOTE: One output loaded at a time.
POST OFFICE BOX 655303
2.0
2.5
3.0
VOH − High-Level Output Voltage − V
Figure 4
18
3.0
0
VCC = 2.2 V
P1.0
0.5
2.5
TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
0
−14
0.0
2.0
Figure 3
Figure 2
−2
1.5
VOL − Low-Level Output Voltage − V
• DALLAS, TEXAS 75265
3.5
MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (continued)
optional resistors, individually programmable with ROM code (see Note 1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
R(opt1)
2.5
5
10
kΩ
R(opt2)
3.8
7.7
15
kΩ
R(opt3)
7.6
15
31
kΩ
R(opt4)
11.5
23
46
kΩ
R(opt5)
23
45
90
kΩ
R(opt6)
Resistors, individually programmable with ROM code, all port pins,
values applicable for pulldown and pullup
2 2 V/3 V
VCC = 2.2
46
90
180
kΩ
R(opt7)
70
140
280
kΩ
R(opt8)
115
230
460
kΩ
R(opt9)
160
320
640
kΩ
R(opt10)
205
420
830
kΩ
MAX
UNIT
NOTE 1: Optional resistors Roptx for pulldown or pullup are not available in standard flash memory device MSP430F11x1A.
wake-up from low-power modes (LPMx)
PARAMETER
TEST CONDITIONS
MIN
TYP
t(LPM0)
VCC = 2.2 V/3 V
100
t(LPM2)
VCC = 2.2 V/3 V
100
t(LPM3)
Delay time (see Note 1)
t(LPM4)
ns
f(MCLK) = 1 MHz,
VCC = 2.2 V/3 V
6
f(MCLK) = 2 MHz,
VCC = 2.2 V/3 V
6
f(MCLK) = 3 MHz,
VCC = 2.2 V/3 V
6
f(MCLK) = 1 MHz,
VCC = 2.2 V/3 V
6
f(MCLK) = 2 MHz,
VCC = 2.2 V/3 V
6
f(MCLK) = 3 MHz,
VCC = 2.2 V/3 V
6
μs
μ
μs
μ
NOTE 1: Parameter applicable only if DCOCLK is used for MCLK.
RAM
PARAMETER
V(RAMh)
MIN
CPU halted (see Note 1)
1.6
TYP
MAX
UNIT
V
NOTE 1: This parameter defines the minimum supply voltage VCC when the data in the program memory RAM remains unchanged. No program
execution should happen during this supply voltage condition.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
19
MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (continued)
Comparator_A (see Note 1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
VCC = 2.2 V
25
40
VCC = 3 V
45
60
I(DD)
CAON=1 CARSEL=0
CAON=1,
CARSEL=0, CAREF=0
CAON=1, CARSEL=0,
CAREF 1/2/3 no load at
CAREF=1/2/3,
P2.3/CA0/TA1 and P2.4/CA1/TA2
VCC = 2.2 V
30
50
I(Refladder/RefDiode)
VCC = 3 V
45
71
CAON =1
VCC = 2.2 V/3 V
0
PCA0=1, CARSEL=1, CAREF=1,
No load at P2.3/CA0/TA1 and
P2.4/CA1/TA2
VCC = 2.2 V/3 V
0.23
0.24
0.25
PCA0=1, CARSEL=1, CAREF=2,
No load at P2.3/CA0/TA1 and
P2.4/CA1/TA2
VCC = 2.2 V/3 V
0.47
0.48
0.5
PCA0=1, CARSEL=1, CAREF=3,
P2 3/CA0/TA1 and
No load at P2.3/CA0/TA1
P2.4/CA1/TA2, TA = 85°C
VCC = 2.2 V
390
480
540
VCC = 3 V
400
490
550
−30
V(IC)
V(Ref025)
V(Ref050)
Common-mode input
voltage
Voltage @ 0.25 V
V
node
CC
Voltage @ 0.5V
V
CC
CC
node
CC
V(RefVT)
(see Figure 6 and Figure 7)
V(offset)
Offset voltage
See Note 2
VCC = 2.2 V/3 V
Vhys
Input hysteresis
CAON=1
VCC = 2.2 V/3 V
TA = 25
25°C,
C, Overdrive 10 mV,
Without filter: CAF=0
VCC = 2.2 V
t(response LH)
t(response HL)
VCC−1
UNIT
μA
μA
V
mV
30
mV
mV
0
0.7
1.4
160
210
300
VCC = 3 V
90
150
240
TA = 25
25°C,
C, Overdrive 10 mV,
With filter: CAF=1
VCC = 2.2 V
1.4
1.9
3.4
VCC = 3 V
0.9
1.5
2.6
25°C,
TA = 25
C, Overdrive 10 mV,
Without filter: CAF=0
VCC = 2.2 V
130
210
300
VCC = 3 V
80
150
240
TA = 25
25°C,
C, Overdrive 10 mV,
With filter: CAF=1
VCC = 2.2 V
1.4
1.9
3.4
VCC = 3 V
0.9
1.5
2.6
ns
μs
ns
μs
NOTES: 1. The leakage current for the Comparator_A terminals is identical to Ilkg(Px.x) specification.
2. The input offset voltage can be cancelled by using the CAEX bit to invert the Comparator_A inputs on successive measurements.
The two successive measurements are then summed together.
20
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (continued)
650
650
VCC = 2.2 V
V(REFVT) − Reference Volts −mV
V(REFVT) − Reference Volts −mV
VCC = 3 V
600
Typical
550
500
450
400
−45
−25
−5
15
35
55
75
600
Typical
550
500
450
400
−45
95
−25
TA − Free-Air Temperature − °C
0
15
35
55
75
95
Figure 7. V(RefVT) vs Temperature, VCC = 2.2 V
Figure 6. V(RefVT) vs Temperature, VCC = 3 V
0V
−5
TA − Free-Air Temperature − °C
VCC
1
CAF
CAON
Low Pass Filter
V+
V−
+
_
0
0
1
1
To Internal
Modules
CAOUT
Set CAIFG
Flag
τ ≈ 2.0 μs
Figure 8. Block Diagram of Comparator_A Module
VCAOUT
Overdrive
V−
400 mV
V+
t(response)
Figure 9. Overdrive Definition
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
21
MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (continued)
PUC/POR
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
150
250
μs
t(POR_Delay)
Internal time delay to release POR
VCC threshold at which POR
release delay time begins
(see Note 1)
TA = −40°C
1.4
1.8
VPOR
TA = 25°C
1.1
1.5
0.8
1.2
V(min)
VCC threshold required to
generate a POR (see Note 2)
VCC |dV/dt| ≥ 1V/ms
t(reset)
RST/NMI low time for PUC/POR
Reset is accepted internally
VCC = 2.2 V/3 V
TA = 85°C
V
0.2
V
2
μs
NOTES: 1. VCC rise time dV/dt ≥ 1V/ms.
2. When driving VCC low in order to generate a POR condition, VCC should be driven to 200mV or lower with a dV/dt equal to or less
than −1V/ms. The corresponding rising VCC must also meet the dV/dt requirement equal to or greater than +1V/ms.
V
VCC
V
POR
No POR
POR
V
(min)
POR
t
Figure 10. Power-On Reset (POR) vs Supply Voltage
2.0
1.8
1.8
V POR [V]
1.6
1.4
1.2
1.5
Max
1.2
1.4
1.0
Min
1.1
0.8
0.8
0.6
0.4
0.2
25°C
0
−40
−20
0
20
40
Temperature [°C]
Figure 11. VPOR vs Temperature
22
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
60
80
MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (continued)
DCO
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
2.2 V
0.08
0.12
0.15
3V
0.08
0.13
0.16
2.2 V
0.14
0.19
0.23
3V
0.14
0.18
0.22
2.2 V
0.22
0.30
0.36
3V
0.22
0.28
0.34
2.2 V
0.37
0.49
0.59
3V
0.37
0.47
0.56
2.2 V
0.61
0.77
0.93
3V
0.61
0.75
0.9
2.2 V
1
1.2
1.5
3V
1
1.3
1.5
2.2 V
1.6
1.9
2.2
3V
1.69
2
2.29
2.2 V
2.4
2.9
3.4
3V
2.7
3.2
3.65
4
4.5
4.9
4.4
4.9
5.4
2 2 V/3 V
2.2
fDCO40
x1.7
fDCO40
x2.1
fDCO40
x2.5
f(DCO03)
Rsel = 0,
0 DCO = 3,
3 MOD = 0,
0 DCOR = 0,
0
TA = 25°C
f(DCO13)
Rsel = 1,
1 DCO = 3,
3 MOD = 0,
0 DCOR = 0,
0
TA = 25°C
f(DCO23)
( CO )
Rsel = 2
2, DCO = 3
3, MOD = 0
0, DCOR = 0
0,
TA = 25°C
f(DCO33)
Rsel = 3
3, DCO = 3
3, MOD = 0
0, DCOR = 0
0,
TA = 25°C
f(DCO43)
Rsel = 4
4, DCO = 3
3, MOD = 0
0, DCOR = 0
0,
TA = 25°C
f(DCO53)
Rsel = 5
5, DCO = 3
3, MOD = 0
0, DCOR = 0
0,
TA = 25°C
f(DCO63)
Rsel = 6
6, DCO = 3
3, MOD = 0
0, DCOR = 0
0,
TA = 25°C
f(DCO73)
Rsel = 7
7, DCO = 3
3, MOD = 0
0, DCOR = 0
0,
TA = 25°C
f(DCO77)
Rsel = 7
7, DCO = 7
7, MOD = 0
0, DCOR = 0
0,
TA = 25°C
f(DCO47)
Rsel = 4
4, DCO = 7
7, MOD = 0
0, DCOR = 0
0,
TA = 25°C
S(Rsel)
SR = fRsel+1/fRsel
2.2 V/3 V
1.35
1.65
2
S(DCO)
SDCO = fDCO+1/fDCO
2.2 V/3 V
1.07
1.12
1.16
2.2 V
−0.31
−0.36
−0.40
Dt
Temperature drift,
drift Rsel = 4
4, DCO = 3
3, MOD = 0 (see Note 1)
3V
−0.33
−0.38
−0.43
DV
Drift with VCC variation, Rsel = 4, DCO = 3, MOD = 0 (see Note 1)
0
5
10
2.2 V
3V
2.2 V/3 V
UNIT
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
ratio
%/°C
%/V
f(DCOx7)
f(DCOx0)
Max
Min
Max
Min
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
2.2 V
1
f DCOCLK
Frequency Variance
NOTE 1: These parameters are not production tested.
3V
0
1
2
3
4
5
6
7
DCO Steps
VCC
Figure 12. DCO Characteristics
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
23
MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (continued)
main DCO characteristics
D Individual devices have a minimum and maximum operation frequency. The specified parameters for
f(DCOx0) to f(DCOx7) are valid for all devices.
D All ranges selected by Rsel(n) overlap with Rsel(n+1): Rsel0 overlaps Rsel1, ... Rsel6 overlaps Rsel7.
D DCO control bits DCO0, DCO1, and DCO2 have a step size as defined by parameter SDCO.
D Modulation control bits MOD0 to MOD4 select how often f(DCO+1) is used within the period of 32 DCOCLK
cycles. The frequency f(DCO) is used for the remaining cycles. The frequency is an average equal to:
f average +
MOD
32 f (DCO) f (DCO)1)
f (DCO))(32*MOD) f (DCO)1)
DCO when using ROSC (see Note 1)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
2.2 V
1.8±15%
3V
MAX
UNIT
MHz
fDCO
CO, DCO output frequency
Rsel = 4
4, DCO = 3
3, MOD = 0
0, DCOR = 1
1, TA = 25°C
1.95±15%
MHz
Dt, Temperature drift
Rsel = 4, DCO = 3, MOD = 0, DCOR = 1
2.2 V/3 V
±0.1
%/°C
Dv, Drift with VCC variation
Rsel = 4, DCO = 3, MOD = 0, DCOR = 1
2.2 V/3 V
10
%/V
NOTES: 1. ROSC = 100kΩ. Metal film resistor, type 0257. 0.6 watt with 1% tolerance and TK = ±50ppm/°C.
crystal oscillator, LFXT1
PARAMETER
CXIN
CXOUT
VIL
VIH
Input capacitance
Output capacitance
Input levels at XIN
TEST CONDITIONS
MIN
XTS=0, LF mode selected,
VCC = 2.2 V / 3 V
MAX
pF
2
XTS=0, LF mode selected,
VCC = 2.2 V / 3 V
12
pF
XTS=1, XT1 mode selected,
VCC = 2.2 V / 3 V (see Note 1)
2
VSS
0.2×VCC
0.8×VCC
VCC
NOTES: 1. Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
2. Applies only when using an external logic-level clock source. Not applicable when using a crystal or resonator.
24
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
12
XTS=1, XT1 mode selected,
VCC = 2.2 V / 3 V (see Note 1)
VCC = 2
2.2
2 V/3 V (see Note 2)
TYP
V
MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (continued)
flash memory
TEST
CONDITIONS
PARAMETER
VCC(PGM/
VCC
Program and erase supply voltage
MIN
TYP
2.7
MAX
UNIT
3.6
V
ERASE)
fFTG
Flash Timing Generator frequency
IPGM
Supply current from VCC during program
476
kHz
2.7 V/ 3.6 V
257
3
5
mA
IERASE
Supply current from VCC during erase
tCPT
Cumulative program time
See Note 1
2.7 V/ 3.6 V
2.7 V/ 3.6 V
3
7
mA
4
ms
tCMErase
Cumulative mass erase time
See Note 2
2.7 V/ 3.6 V
200
104
Program/erase endurance
TJ = 25°C
ms
105
tRetention
Data retention duration
tWord
Word or byte program time
35
tBlock, 0
Block program time for first byte or word
30
tBlock, 1-63
Block program time for each additional byte or word
tBlock, End
Block program end-sequence wait time
tMass Erase
Mass erase time
5297
tSeg Erase
Segment erase time
4819
cycles
100
years
21
See Note 3
tFTG
6
NOTES: 1. The cumulative program time must not be exceeded when writing to a 64-byte flash block. This parameter applies to all programming
methods: individual word/byte write and block write modes.
2. The mass erase duration generated by the flash timing generator is at least 11.1ms ( = 5297x1/fFTG,max = 5297x1/476kHz). To
achieve the required cumulative mass erase time the Flash Controller’s mass erase operation can be repeated until this time is met.
(A worst case minimum of 19 cycles are required).
3. These values are hardwired into the Flash Controller’s state machine (tFTG = 1/fFTG).
JTAG interface
TEST
CONDITIONS
PARAMETER
fTCK
TCK input frequency
see Note 1
RInternal
Internal pulldown resistance on TEST
see Note 2
VCC
MIN
2.2 V
3V
2.2 V/ 3 V
25
MIN
TYP
MAX
UNIT
0
5
MHz
0
10
MHz
60
90
kΩ
TYP
MAX
NOTES: 1. fTCK may be restricted to meet the timing requirements of the module selected.
2. TEST pull-down resistor implemented in all versions.
JTAG fuse (see Note 1)
TEST
CONDITIONS
PARAMETER
VCC(FB)
Supply voltage during fuse-blow condition
TA = 25°C
Voltage level on TEST for fuse blow (’C11x1)
VFB
Voltage level on TEST for fuse blow (’F11x1A)
IFB
Supply current into TEST during fuse blow
tFB
Time to blow fuse
VCC
2.5
UNIT
V
3.5
3.9
V
6
7
V
100
mA
1
ms
NOTES: 1. Once the fuse is blown, no further access to the MSP430 JTAG/Test and emulation (F versions only) features is possible. The JTAG
block is switched to bypass mode.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
25
MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008
APPLICATION INFORMATION
input/output schematic
Port P1, P1.0 to P1.3, input/output with Schmitt trigger
VCC
P1SEL.x
0
P1DIR.x
(See Note 1)
1
Direction Control
From Module
(See Note 2)
0
P1OUT.x
Pad Logic
P1.0 − P1.3
1
Module X OUT
(See Note 2)
(See Note 1)
P1IN.x
GND
EN
Module X IN
P1IRQ.x
D
P1IE.x
P1IFG.x
Q
Interrupt
Edge
Select
EN
Set
Interrupt
Flag
P1IES.x
P1SEL.x
NOTE: x = Bit/identifier, 0 to 3 for port P1
PnSel.x
PnDIR.x
Direction
control from
module
PnOUT.x
Module X OUT
PnIN.x
Module X IN
PnIE.x
PnIFG.x
PnIES.x
P1Sel.0
P1DIR.0
P1DIR.0
P1OUT.0
VSS
P1IN.0
TACLK†
P1IE.0
P1IFG.0
P1IES.0
signal†
P1IN.1
CCI0A†
P1IE.1
P1IFG.1
P1IES.1
P1IN.2
CCI1A†
P1IE.2
P1IFG.2
P1IES.2
P1IN.3
CCI2A†
P1IE.3
P1IFG.3
P1IES.3
P1Sel.1
P1DIR.1
P1DIR.1
P1OUT.1
Out0
P1Sel.2
P1DIR.2
P1DIR.2
P1OUT.2
Out1 signal†
P1OUT.3
signal†
P1Sel.3
P1DIR.3
P1DIR.3
Out2
†
Signal from or to Timer_A
NOTES: 1. Optional selection of pullup or pulldown resistors with ROM (masked) versions
2. Fuses for optional pullup and pulldown resistors can only be programmed at the factory (ROM versions only).
26
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008
APPLICATION INFORMATION
Port P1, P1.4 to P1.7, input/output with Schmitt trigger and in-system access features
VCC
P1SEL.x
0
P1DIR.x
See Note 1
1
Direction Control
From Module
See Note 2
0
P1OUT.x
Pad Logic
P1.4−P1.7
1
Module X OUT
See Note 2
See Note 1
GND
TST
Bus Keeper
P1IN.x
EN
Module X IN
D
TEST
TST
P1IRQ.x
P1IE.x
P1IFG.x
Q
Interrupt
Edge
Select
EN
Set
60 kΩ
Typical
Fuse
GND
Interrupt
Flag
Control By JTAG
P1IES.x
P1SEL.x
Fuse
Blow
TSTControl
P1.x
TDO
Controlled By JTAG
P1.7/TDI/TDO
Controlled by JTAG
TDI
TST
P1.x
P1.6/TDI/TCLK
NOTE: The test pin should be protected from potential EMI
and ESD voltage spikes. This may require a smaller
external pulldown resistor in some applications.
TST
P1.x
TMS
P1.5/TMS
x = Bit identifier, 4 to 7 for port P1
During programming activity and during blowing
of the fuse, the pin TDO/TDI is used to apply the test
input for JTAG circuitry.
PnSel.x
PnDIR.x
Direction
control from
module
PnOUT.x
P1Sel.4
P1DIR.4
P1DIR.4
P1Sel.5
P1DIR.5
P1DIR.5
TST
P1.x
TCK
P1.4/TCK
Module X OUT
PnIN.x
Module X IN
PnIE.x
PnIFG.x
PnIES.x
P1OUT.4
SMCLK
P1IN.4
unused
P1IE.4
P1IFG.4
P1IES.4
P1OUT.5
Out0 signal†
P1IN.5
unused
P1IE.5
P1IFG.5
P1IES.5
signal†
P1IN.6
unused
P1IE.6
P1IFG.6
P1IES.6
P1IN.7
unused
P1IE.7
P1IFG.7
P1IES.7
P1Sel.6
P1DIR.6
P1DIR.6
P1OUT.6
Out1
P1Sel.7
P1DIR.7
P1DIR.7
P1OUT.7
Out2 signal†
†
Signal from or to Timer_A
NOTES: 1. Optional selection of pullup or pulldown resistors with ROM (masked) versions
2. Fuses for optional pullup and pulldown resistors can only be programmed at the factory (ROM versions only).
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
27
MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008
APPLICATION INFORMATION
Port P2, P2.0 to P2.2, input/output with Schmitt trigger
P2SEL.x
VCC
0
P2DIR.x
0: Input
1
Direction Control
From Module
See Note 2
Pad Logic
0
P2OUT.x
See Note 1
1: Output
P2.0 − P2.2
1
Module X OUT
See Note 2
See Note 1
GND
Bus Keeper
P2IN.x
EN
D
Module X IN
CAPD.X
P2IRQ.x
P2IE.x
P2IFG.x
Q
Interrupt
Edge
Select
EN
Set
Interrupt
Flag
NOTE: x = Bit Identifier, 0 to 2 for port P2
P2IES.x
P2SEL.x
PnSel.x
PnDIR.x
Direction
control from
module
PnOUT.x
Module X OUT
PnIN.x
P2Sel.0
P2DIR.0
P2DIR.0
P2OUT.0
ACLK
P2Sel.1
P2DIR.1
P2DIR.1
P2OUT.1
VSS
P2Sel.2
P2DIR.2
P2DIR.2
P2OUT.2
CAOUT
Module X IN
PnIE.x
PnIFG.x
PnIES.x
P2IN.0
unused
P2IE.0
P2IFG.0
P1IES.0
P2IN.1
INCLK†
P2IE.1
P2IFG.1
P1IES.1
P2IN.2
CCI0B†
P2IE.2
P2IFG.2
P1IES.2
†
Signal from or to Timer_A
NOTES: 1. Optional selection of pullup or pulldown resistors with ROM (masked) versions
2. Fuses for optional pullup and pulldown resistors can only be programmed at the factory (ROM versions only).
28
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008
APPLICATION INFORMATION
Port P2, P2.3 to P2.4, input/output with Schmitt trigger
P2SEL.3
P2DIR.3
VCC
0
Direction Control
From Module
P2OUT.3
0: Input
1
1: Output
0
Pad Logic
See Note 1
See Note 2
P2.3
1
Module X
OUT
See Note 2
See Note 1
P2IN.3
GND
Bus Keeper
EN
D
Module X IN
P2IE.3
P2IRQ.3
P2IFG.3
Interrupt
Edge
Select
EN
Q
Set
Interrupt
Flag
CAPD.3
Comparator_A
CAREF P2CA CAEX
P2IES.3 P2SEL.3
CAF
+
_
CCI1B
0V
Interrupt
Flag
P2IFG.4
P2IRQ.4
Q
P2IES.4 P2SEL.4
Set
EN
P2IE.4
CAREF
Reference Block
Interrupt
Edge
Select
CAPD.4
D
Module X IN
EN
Bus Keeper
P2IN.4
VCC
See Note 1
See Note 2
Module X OUT
P2OUT.4
Direction Control
From Module
P2DIR.4
P2SEL.4
1
0
Pad Logic
See Note 2
1
1: Output
See Note 1
P2.4
0: Input
0
GND
PnSel.x
PnDIR.x
Direction
control from module
PnOUT.x
Module X OUT
PnIN.x
Module X IN
PnIE.x
PnIFG.x
PnIES.x
P2Sel.3
P2DIR.3
P2DIR.3
P2OUT.3
Out1 signal†
P2IN.3
unused
P2IE.3
P2IFG.3
P1IES.3
P2Sel.4
P2DIR.4
P2DIR.4
P2OUT.4
Out2 signal†
P2IN.4
unused
P2IE.4
P2IFG.4
P1IES.4
†
Signal from Timer_A
NOTES: 1. Optional selection of pullup or pulldown resistors with ROM (masked) versions
2. Fuses for optional pullup and pulldown resistors can only be programmed at the factory (ROM versions only).
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
29
MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008
APPLICATION INFORMATION
Port P2, P2.5, input/output with Schmitt trigger and ROSC function for the Basic Clock module
VCC
P2SEL.5
0: Input
1: Output
0
P2DIR.5
Pad Logic
See Note 1
1
Direction Control
From Module
See Note 2
0
P2OUT.5
P2.5
1
Module X OUT
See Note 2
See Note 1
GND
Bus Keeper
P2IN.5
EN
Module X IN
P2IRQ.5
D
P2IE.5
P2IFG.5
Q
EN
Set
Interrupt
Flag
Internal to
Basic Clock
Module
0
VCC
Interrupt
Edge
Select
P2IES.5
1
DC
Generator
DCOR
P2SEL.5
CAPD.5
NOTE: DCOR: Control bit from Basic Clock Module if it is set, P2.5 Is disconnected from P2.5 pad
PnSel.x
PnDIR.x
Direction
control from
module
PnOUT.x
Module X OUT
PnIN.x
Module X IN
PnIE.x
PnIFG.x
PnIES.x
P2Sel.5
P2DIR.5
P2DIR.5
P2OUT.5
VSS
P2IN.5
unused
P2IE.5
P2IFG.5
P2IES.5
NOTES: 1. Optional selection of pullup or pulldown resistors with ROM (masked) versions
2. Fuses for optional pullup and pulldown resistors can only be programmed at the factory (ROM versions only).
30
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008
APPLICATION INFORMATION
Port P2, unbonded bits P2.6 and P2.7
P2SEL.x
0: Input
1: Output
0
P2DIR.x
1
Direction Control
From Module
0
P2OUT.x
1
Module X OUT
P2IN.x
Node Is Reset With PUC
EN
Bus Keeper
Module X IN
P2IRQ.x
D
P2IE.x
P2IFG.x
Q
EN
Set
Interrupt
Flag
PUC
Interrupt
Edge
Select
P2IES.x
P2SEL.x
NOTE: x = Bit/identifier, 6 to 7 for port P2 without external pins
P2Sel.x
P2DIR.x
Direction
control from
module
P2OUT.x
Module X OUT
P2IN.x
Module X IN
P2IE.x
P2IFG.x
P2IES.x
P2Sel.6
P2DIR.6
P2DIR.6
P2OUT.6
VSS
P2IN.6
unused
P2IE.6
P2IFG.6
P2IES.6
P2Sel.7
P2DIR.7
P2DIR.7
P2OUT.7
VSS
P2IN.7
unused
P2IE.7
P2IFG.7
P2IES.7
NOTE 1: Unbonded bits 6 and 7 of port P2 can be used as software interrupt flags. The interrupt flags can only be influenced by software. They
work then as a software interrupt.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
31
MSP430C11x1, MSP430F11x1A
MIXED SIGNAL MICROCONTROLLER
SLAS241I − SEPTEMBER 1999 − REVISED DECEMBER 2008
JTAG fuse check mode
MSP430 devices that have the fuse on the TEST terminal have a fuse check mode that tests the continuity of
the fuse the first time the JTAG port is accessed after a power-on reset (POR). When activated, a fuse check
current, ITF , of 1 mA at 3 V, 2.5 mA at 5 V can flow from the TEST pin to ground if the fuse is not burned. Care
must be taken to avoid accidentally activating the fuse check mode and increasing overall system power
consumption.
When the TEST pin is taken back low after a test or programming session, the fuse check mode and sense
currents are terminated.
Activation of the fuse check mode occurs with the first negative edge on the TMS pin after power up or if TMS
is being held low during power up. The second positive edge on the TMS pin deactivates the fuse check mode.
After deactivation, the fuse check mode remains inactive until another POR occurs. After each POR the fuse
check mode has the potential to be activated.
The fuse check current will only flow when the fuse check mode is active and the TMS pin is in a low state (see
Figure 13). Therefore, the additional current flow can be prevented by holding the TMS pin high (default
condition).
Time TMS Goes Low After POR
TMS
ITEST
ITF
Figure 13. Fuse Check Mode Current, MSP430F11x1A and MSP430C11x1
NOTE:
The CODE and RAM data protection is ensured if the JTAG fuse is blown and the 256-bit bootloader
access key is used. Also, see the bootstrap loader section for more information.
32
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
28-Oct-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
TBD
Call TI
Call TI
-40 to 85
Device Marking
(4/5)
MSP430C1101
ACTIVE
MSP430F1101AIDGV
ACTIVE
TVSOP
DGV
20
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
4F1101A
MSP430F1101AIDGVR
ACTIVE
TVSOP
DGV
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
4F1101A
MSP430F1101AIDW
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
M430F1101A
MSP430F1101AIDWR
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
M430F1101A
MSP430F1101AIPW
ACTIVE
TSSOP
PW
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
430F1101A
MSP430F1101AIPWR
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
430F1101A
MSP430F1101AIRGER
ACTIVE
VQFN
RGE
24
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
M430F
1101A
MSP430F1101AIRGET
ACTIVE
VQFN
RGE
24
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
M430F
1101A
TBD
Call TI
Call TI
-40 to 85
M430F1101
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
M430F1101
TBD
Call TI
Call TI
-40 to 85
430F1101
MSP430F1101IDW
OBSOLETE
SOIC
DW
20
MSP430F1101IDWR
NRND
SOIC
DW
20
MSP430F1101IPW
OBSOLETE
TSSOP
PW
20
MSP430F1101IPWR
OBSOLETE
TSSOP
PW
20
TBD
Call TI
Call TI
-40 to 85
430F1101
MSP430F1111AIDGV
ACTIVE
TVSOP
DGV
20
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
4F1111A
MSP430F1111AIDGVR
ACTIVE
TVSOP
DGV
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
4F1111A
MSP430F1111AIDW
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
M430F1111A
MSP430F1111AIDWR
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
M430F1111A
MSP430F1111AIPW
ACTIVE
TSSOP
PW
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
430F1111A
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
28-Oct-2014
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
MSP430F1111AIPWR
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
430F1111A
MSP430F1111AIRGER
ACTIVE
VQFN
RGE
24
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
M430F
1111A
MSP430F1111AIRGET
ACTIVE
VQFN
RGE
24
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
M430F
1111A
MSP430F1121AIDGV
ACTIVE
TVSOP
DGV
20
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
4F1121A
MSP430F1121AIDGVR
ACTIVE
TVSOP
DGV
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
4F1121A
MSP430F1121AIDW
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
M430F1121A
MSP430F1121AIDWR
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
M430F1121A
MSP430F1121AIPW
ACTIVE
TSSOP
PW
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
430F1121A
MSP430F1121AIPWR
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
430F1121A
MSP430F1121AIRGER
ACTIVE
VQFN
RGE
24
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
M430F
1121A
MSP430F1121AIRGET
ACTIVE
VQFN
RGE
24
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
M430F
1121A
MSP430F1121CY
NRND
DIESALE
Y
0
TBD
Call TI
Call TI
-40 to 85
MSP430F1121IDW
NRND
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
M430F1121
MSP430F1121IDWR
NRND
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
M430F1121
MSP430F1121IPW
NRND
TSSOP
PW
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
430F1121
MSP430F1121IPWR
NRND
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
430F1121
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
28-Oct-2014
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Mar-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
MSP430F1101AIDGVR
TVSOP
DGV
20
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
MSP430F1101AIRGER
VQFN
RGE
24
3000
330.0
12.4
4.25
4.25
1.15
8.0
12.0
Q2
MSP430F1101AIRGET
VQFN
RGE
24
250
180.0
12.4
4.25
4.25
1.15
8.0
12.0
Q2
MSP430F1101IDWR
SOIC
DW
20
2000
330.0
24.4
10.8
13.3
2.7
12.0
24.0
Q1
MSP430F1111AIDGVR
TVSOP
DGV
20
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
MSP430F1111AIDWR
SOIC
DW
20
2000
330.0
24.4
10.8
13.3
2.7
12.0
24.0
Q1
MSP430F1111AIRGER
VQFN
RGE
24
3000
330.0
12.4
4.25
4.25
1.15
8.0
12.0
Q2
MSP430F1111AIRGET
VQFN
RGE
24
250
180.0
12.4
4.25
4.25
1.15
8.0
12.0
Q2
MSP430F1121AIDGVR
TVSOP
DGV
20
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
MSP430F1121AIDWR
SOIC
DW
20
2000
330.0
24.4
10.8
13.3
2.7
12.0
24.0
Q1
MSP430F1121AIRGER
VQFN
RGE
24
3000
330.0
12.4
4.25
4.25
1.15
8.0
12.0
Q2
MSP430F1121AIRGET
VQFN
RGE
24
250
180.0
12.4
4.25
4.25
1.15
8.0
12.0
Q2
MSP430F1121IDWR
SOIC
DW
20
2000
330.0
24.4
10.8
13.3
2.7
12.0
24.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Mar-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
MSP430F1101AIDGVR
TVSOP
DGV
20
2000
367.0
367.0
35.0
MSP430F1101AIRGER
VQFN
RGE
24
3000
367.0
367.0
35.0
MSP430F1101AIRGET
VQFN
RGE
24
250
210.0
185.0
35.0
MSP430F1101IDWR
SOIC
DW
20
2000
367.0
367.0
45.0
MSP430F1111AIDGVR
TVSOP
DGV
20
2000
367.0
367.0
35.0
MSP430F1111AIDWR
SOIC
DW
20
2000
367.0
367.0
45.0
MSP430F1111AIRGER
VQFN
RGE
24
3000
367.0
367.0
35.0
MSP430F1111AIRGET
VQFN
RGE
24
250
210.0
185.0
35.0
MSP430F1121AIDGVR
TVSOP
DGV
20
2000
367.0
367.0
35.0
MSP430F1121AIDWR
SOIC
DW
20
2000
367.0
367.0
45.0
MSP430F1121AIRGER
VQFN
RGE
24
3000
367.0
367.0
35.0
MSP430F1121AIRGET
VQFN
RGE
24
250
210.0
185.0
35.0
MSP430F1121IDWR
SOIC
DW
20
2000
367.0
367.0
45.0
Pack Materials-Page 2
PACKAGE OUTLINE
DW0020A
SOIC - 2.65 mm max height
SCALE 1.200
SOIC
C
10.63
TYP
9.97
SEATING PLANE
PIN 1 ID
AREA
A
0.1 C
20
1
13.0
12.6
NOTE 3
18X 1.27
2X
11.43
10
11
B
7.6
7.4
NOTE 4
20X
0.51
0.31
0.25
C A B
2.65 MAX
0.33
TYP
0.10
SEE DETAIL A
0.25
GAGE PLANE
0 -8
0.3
0.1
1.27
0.40
DETAIL A
TYPICAL
4220724/A 05/2016
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side.
5. Reference JEDEC registration MS-013.
www.ti.com
EXAMPLE BOARD LAYOUT
DW0020A
SOIC - 2.65 mm max height
SOIC
20X (2)
SYMM
1
20
20X (0.6)
18X (1.27)
SYMM
(R0.05)
TYP
10
11
(9.3)
LAND PATTERN EXAMPLE
SCALE:6X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4220724/A 05/2016
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DW0020A
SOIC - 2.65 mm max height
SOIC
20X (2)
SYMM
1
20
20X (0.6)
18X (1.27)
SYMM
11
10
(9.3)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:6X
4220724/A 05/2016
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
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supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
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