Product Folder Sample & Buy Support & Community Tools & Software Technical Documents LM6152, LM6154 SNOS752E – MAY 1999 – REVISED SEPTEMBER 2014 LM6152/LM6154 Dual and Quad 75 MHz GBW Rail-to-Rail I/O Operational Amplifiers 1 Features 3 Description • • Using patented circuit topologies, the LM6152/LM6154 provides new levels of speed vs. power performance in applications where low voltage supplies or power limitations previously made compromise necessary. With only 1.4 mA/amplifier supply current, the 75 MHz gain bandwidth of this device supports new portable applications where higher power devices unacceptably drain battery life. The slew rate of the devices increases with increasing input differential voltage, thus allowing the device to handle capacitive loads while maintaining large signal amplitude. 1 • • • • • • • • At VS = 5V, typical unless noted. Greater than Rail-to-rail Input CMVR −0.2 5V to 5.25 V Rail-to-rail Output Swing 0.01 V to 4.99 V Wide Gain-bandwidth 75 MHz @ 100 kHz Slew Rate – Small Signal 5 V/µs – Large Signal 45 V/µs Low Supply Current 1.4 mA/amplifier Wide Supply Range 2.7 V to 24 V Fast Settling Time of 1.1 µs for 2 V Step (to 0.01%) PSRR 91 dB CMRR 84 dB 2 Applications • • • Portable High Speed Instrumentation Signal Conditioning Amplifier/ADC Buffers Barcode Scanners The LM6152/LM6154 can be driven by voltages that exceed both power supply rails, thus eliminating concerns about exceeding the common-mode voltage range. The rail-to-rail output swing capability provides the maximum possible dynamic range at the output. This is particularly important when operating on low supply voltages. Operating on supplies from 2.7 V to over 24 V, the LM6152/LM6154 is excellent for a very wide range of applications, from battery operated systems with large bandwidth requirements to high speed instrumentation. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) LM6152 SOIC (8) 4.902 mm × 3.912 mm LM6154 SOIC (14) 8.636 mm × 3.912 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. Supply Current vs. Supply Voltage Offset Voltage vs. Supply voltage 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM6152, LM6154 SNOS752E – MAY 1999 – REVISED SEPTEMBER 2014 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 4 4 4 4 5 6 Absolute Maximum Ratings ...................................... Handling Ratings....................................................... Recommended Operating Conditions (1) ................... Thermal Information .................................................. 5.0 V DC Electrical Characteristics.......................... 5.0 V AC Electrical Characteristics .......................... 6.7 6.8 6.9 6.10 6.11 7 8 7 7 8 8 9 Application and Implementation ........................ 14 Device and Documentation Support.................. 16 8.1 8.2 8.3 8.4 9 2.7 V DC Electrical Characteristics.......................... 2.7 V AC Electrical Characteristics .......................... 24 V DC Electrical Characteristics........................... 24 V AC Electrical Characteristics ......................... Typical Performance Characteristics ...................... Related Links .......................................................... Trademarks ............................................................. Electrostatic Discharge Caution .............................. Glossary .................................................................. 16 16 16 16 Mechanical, Packaging, and Orderable Information ........................................................... 16 4 Revision History Changes from Revision D (March 2013) to Revision E Page • Changed "Junction Temperature Range" to "Operating Temperature Range" and deleted "TJ" in Recommended Operating Conditions ............................................................................................................................................................. 4 • Deleted TJ = 25°C for Electrical Characteristics Tables ......................................................................................................... 5 Changes from Revision C (March 2013) to Revision D • 2 Page Changed layout of National Data Sheet to TI format ........................................................................................................... 15 Submit Documentation Feedback Copyright © 1999–2014, Texas Instruments Incorporated Product Folder Links: LM6152 LM6154 LM6152, LM6154 www.ti.com SNOS752E – MAY 1999 – REVISED SEPTEMBER 2014 5 Pin Configuration and Functions Package D08A 8-Pin Top View Package D14A 14-Pin Top View Pin Functions PIN NAME LM6152 LM6154 I/O DESCRIPTION D08A D14A -IN A 2 2 I ChA Inverting Input +IN A 3 3 I ChA Non-inverting Input -IN B 6 6 I ChB Inverting Input +IN B 5 5 I ChB Non-inverting Input -IN C 9 I ChC Inverting Input +IN C 10 I ChC Non-inverting Input -IN D 13 I ChD Inverting Input +IN D 12 I ChD Non-inverting Input OUT A 1 1 O ChA Output OUT B 7 7 O ChB Output OUT C 8 O ChC Output OUT D 14 O ChD Output V- 4 11 I Negative Supply + 8 4 I Positive Supply V Submit Documentation Feedback Copyright © 1999–2014, Texas Instruments Incorporated Product Folder Links: LM6152 LM6154 3 LM6152, LM6154 SNOS752E – MAY 1999 – REVISED SEPTEMBER 2014 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1) (2) MIN MAX UNIT ±15 V (V+) + 0.3 (V−) −0.3 V Differential Input Voltage Voltage at Input/Output Pin Supply Voltage (V+ − V−) 35 V Current at Input Pin ±10 mA ±25 mA Current at Power Supply Pin 50 mA Lead Temperature (soldering, 10 sec) 260 °C 150 °C Current at Output Pin Junction Temperature (1) (2) (3) (4) (3) (4) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. The maximum power dissipation is a function of TJ(MAX) , RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX)–T A)/RθJA. All numbers apply for packages soldered directly into a PC board. 6.2 Handling Ratings Tstg Storage temperature range V(ESD) (1) MIN MAX UNIT -65 +150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) Electrostatic discharge 2500 V JEDEC document JEP155 states that 2500-V HBM allows safe manufacturing with a standard ESD control process. Human body model is 1.5 kΩ in series with 100 pF 6.3 Recommended Operating Conditions (1) over operating free-air temperature range (unless otherwise noted) MIN Supply Voltage Operating Temperature Range, LM6152,LM6154 (1) MAX + UNIT 2.7 ≤ V ≤ 24 V +70 °C 0 Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. 6.4 Thermal Information THERMAL METRIC (1) RθJA (1) 4 Junction-to-ambient thermal resistance D08A D14A 8 PINS 14 PINS 193°C/W 126°C/W UNIT °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 1999–2014, Texas Instruments Incorporated Product Folder Links: LM6152 LM6154 LM6152, LM6154 www.ti.com 6.5 SNOS752E – MAY 1999 – REVISED SEPTEMBER 2014 5.0 V DC Electrical Characteristics Unless otherwise specified, all limits are ensured for V+ = 5.0V, V− = 0V, VCM = VO = V+/2 and RL > 1 MΩ to V+/2. Boldface limits apply at the temperature extremes. PARAMETER TEST CONDITIONS TYP (1) LM6152AC LIMIT (2) LM6154BC LM6152BC LIMIT (2) UNIT 0.54 2 4 5 7 mV max VOS Input Offset Voltage TCVOS Input Offset Voltage Average Drift IB Input Bias Current IOS Input Offset Current RIN Input Resistance, CM 0V ≤ VCM ≤ 4V 30 CMRR Common Mode Rejection Ratio 0V ≤ VCM ≤ 4V 0V ≤ VCM ≤ 5V 10 0V ≤ VCM ≤ 5V µV/°C 500 750 980 1500 980 1500 nA max 32 40 100 160 100 160 nA max 94 70 70 84 60 60 91 80 80 dB min MΩ dB min PSRR Power Supply Rejection Ratio 5V ≤ V+ ≤ 24V VCM Input Common-Mode Voltage Range Low −0.25 0 0 V High 5.25 5.0 5.0 V 214 50 50 V/mV min 0.006 0.02 0.03 0.02 0.03 V max 4.992 4.97 4.96 4.97 4.96 V min 0.04 0.10 0.12 0.10 0.12 V max 4.89 4.80 4.70 4.80 4.70 V min 3 2.5 3 2.5 mA min 27 17 27 17 mA max 7 5 7 5 mA min 40 40 mA max 2 2.25 2 2.25 mA max AV Large Signal Voltage Gain RL = 10 kΩ VO Output Swing RL = 100 kΩ RL = 2 kΩ ISC Output Short Circuit Current Sourcing 6.2 Sinking 16.9 IS (1) (2) Supply Current Per Amplifier 1.4 Typical Values represent the most likely parametric norm. All limits are specified by testing or statistical analysis. Submit Documentation Feedback Copyright © 1999–2014, Texas Instruments Incorporated Product Folder Links: LM6152 LM6154 5 LM6152, LM6154 SNOS752E – MAY 1999 – REVISED SEPTEMBER 2014 6.6 www.ti.com 5.0 V AC Electrical Characteristics Unless otherwise specified, all limits ensured for V+ = 5.0V, V− = 0V, VCM = VO = V+/2 and RL > 1 MΩ to V+/2. Boldface limits apply at the temperature extremes. PARAMETER TEST CONDITIONS TYP (1) LM6152AC LIMIT (2) LM6154BC LM6152BC LIMIT (2) UNIT 24 15 24 15 V/µs min SR Slew Rate ±4V Step @ VS = ±6V, RS < 1 kΩ 30 GBW Gain-Bandwidth Product f = 100 kHz 75 125 MHz Amp-to-Amp Isolation RL = 10 kΩ en Input-Referred Voltage Noise f = 1 kHz 9 nV/√Hz in Input-Referred Current Noise f = 1 kHz 0.34 pA/√Hz T.H.D Total Harmonic Distortion f = 100 kHz, RL = 10 kΩ AV = −1, VO = 2.5 VPP −65 ts Settling Time 2V Step to 0.01% (1) (2) 6 1.1 dB dBc µs Typical Values represent the most likely parametric norm. All limits are specified by testing or statistical analysis. Submit Documentation Feedback Copyright © 1999–2014, Texas Instruments Incorporated Product Folder Links: LM6152 LM6154 LM6152, LM6154 www.ti.com 6.7 SNOS752E – MAY 1999 – REVISED SEPTEMBER 2014 2.7 V DC Electrical Characteristics Unless otherwise specified, all limits are ensured for V+ = 2.7V, V− = 0V, VCM = VO = V+/2 and RL > 1 MΩ to V+/2. Boldface limits apply at the temperature extremes. PARAMETER VOS Input Offset Voltage TCVOS Input Offset Voltage Average Drift IB Input Bias Current IOS Input Offset Current RIN Input Resistance, CM CMRR Common Mode Rejection Ratio TEST CONDITIONS TYP (1) LM6152AC LIMIT (2) LM6154BC LM6152BC LIMIT (2) UNIT 0.8 2 5 5 8 mV max 10 µV/°C 500 nA 50 nA 0V ≤ VCM ≤ 1.8V 30 MΩ 0V ≤ VCM ≤ 1.8V 88 0V ≤ VCM ≤ 2.7V 78 dB PSRR Power Supply Rejection Ratio 3V ≤ V+ ≤ 5V VCM Input Common-Mode Voltage Range Low −0.25 0 0 High 2.95 2.7 2.7 AV Large Signal Voltage Gain RL = 10 kΩ 5.5 VO Output Swing RL = 10 kΩ 0.032 0.07 0.11 0.07 0.11 V max 2.68 2.64 2.62 2.64 2.62 V min IS (1) (2) Supply Current Per Amplifier 69 dB V V V/mV 1.35 mA Typical Values represent the most likely parametric norm. All limits are specified by testing or statistical analysis. 6.8 2.7 V AC Electrical Characteristics Unless otherwise specified, all limits are ensured for V+ = 2.7V, V− = 0V, VCM = VO = V+/2 and RL > 1 MΩ to V+/2. Boldface limits apply at the temperature extremes. PARAMETER GBW (1) (2) Gain-Bandwidth Product TEST CONDITIONS f = 100 kHz TYP (1) 80 LM6152AC LIMIT (2) LM6154BC LM6152BC LIMIT (2) UNIT MHz Typical Values represent the most likely parametric norm. All limits are specified by testing or statistical analysis. Submit Documentation Feedback Copyright © 1999–2014, Texas Instruments Incorporated Product Folder Links: LM6152 LM6154 7 LM6152, LM6154 SNOS752E – MAY 1999 – REVISED SEPTEMBER 2014 6.9 www.ti.com 24 V DC Electrical Characteristics Unless otherwise specified, all limits are ensured for V+ = 24V, V− = 0V, VCM = VO = V+/2 and RL > 1 MΩ to V+/2. Boldface limits apply at the temperature extremes. PARAMETER VOS Input Offset Voltage TCVOS Input Offset Voltage Average Drift IB Input Bias Current IOS Input Offset Current RIN Input Resistance, CM CMRR Common Mode Rejection Ratio TEST CONDITIONS TYP (1) LM6152AC LIMIT (2) LM6154BC LM6152BC LIMIT (2) UNIT 0.3 2 4 7 9 mV max 10 µV/°C 500 nA 32 nA 0V ≤ VCM ≤ 23V 60 Meg Ω 0V ≤ VCM ≤ 23V 94 0V ≤ VCM ≤ 24V 84 dB PSRR Power Supply Rejection Ratio 0V ≤ VCM ≤ 24V VCM Input Common-Mode Voltage Range Low −0.25 0 0 High 24.25 24 24 AV Large Signal Voltage Gain RL = 10 kΩ 55 VO Output Swing RL = 10 kΩ 0.044 0.075 0.090 0.075 0.090 V max 23.91 23.8 23.7 23.8 23.7 V min 1.6 2.25 2.50 2.25 2.50 mA max IS (1) (2) Supply Current Per Amplifier 95 dB V V V/mV Typical Values represent the most likely parametric norm. All limits are specified by testing or statistical analysis. 6.10 24 V AC Electrical Characteristics Unless otherwise specified, all limits are ensured for V+ = 24V, V− = 0V, VCM = VO = V+/2 and RL > 1 MΩ to V+/2. Boldface limits apply at the temperature extremes. PARAMETER GBW (1) (2) 8 Gain-Bandwidth Product TEST CONDITIONS f = 100 kHz TYP (1) 80 LM6152AC LIMIT (2) LM6154BC LM6152BC LIMIT (2) UNIT MHz Typical Values represent the most likely parametric norm. All limits are specified by testing or statistical analysis. Submit Documentation Feedback Copyright © 1999–2014, Texas Instruments Incorporated Product Folder Links: LM6152 LM6154 LM6152, LM6154 www.ti.com SNOS752E – MAY 1999 – REVISED SEPTEMBER 2014 6.11 Typical Performance Characteristics Figure 1. Supply Current vs. Supply Voltage Figure 2. Offset Voltage vs. Supply voltage Figure 3. Bias Current vs. Supply voltage Figure 4. Bias Current vs. VCM Figure 5. Bias Current vs. VCM Figure 6. Bias Current vs. VCM Submit Documentation Feedback Copyright © 1999–2014, Texas Instruments Incorporated Product Folder Links: LM6152 LM6154 9 LM6152, LM6154 SNOS752E – MAY 1999 – REVISED SEPTEMBER 2014 www.ti.com Typical Performance Characteristics (continued) 10 Figure 7. Output Voltage vs. Source Current Figure 8. Output Voltage vs. Source Current Figure 9. Output Voltage vs. Source Current Figure 10. Output Voltage vs. Sink Current Figure 11. Output Voltage vs. Sink Current Figure 12. Output Voltage vs. Sink Current Submit Documentation Feedback Copyright © 1999–2014, Texas Instruments Incorporated Product Folder Links: LM6152 LM6154 LM6152, LM6154 www.ti.com SNOS752E – MAY 1999 – REVISED SEPTEMBER 2014 Typical Performance Characteristics (continued) Figure 13. Crosstalk (dB) vs. Frequency Figure 14. GBWP (@ 100 kHz) vs. Supply Voltage Figure 15. Unity Gain Frequency vs. Supply Voltage for Various Loads Figure 16. CMRR Figure 17. Voltage Swing vs. Frequency (CL = 100 pF) Figure 18. PSRR vs. Frequency Submit Documentation Feedback Copyright © 1999–2014, Texas Instruments Incorporated Product Folder Links: LM6152 LM6154 11 LM6152, LM6154 SNOS752E – MAY 1999 – REVISED SEPTEMBER 2014 www.ti.com Typical Performance Characteristics (continued) 12 Figure 19. Open Loop Gain/Phase (VS = 5V) Figure 20. Open Loop Gain/Phase (VS = 10V) Figure 21. Open Loop Gain/Phase (VS = 24V) Figure 22. Noise Voltage vs. Frequency Figure 23. Noise Current vs. Frequency Figure 24. Voltage Error vs. Settle Time Submit Documentation Feedback Copyright © 1999–2014, Texas Instruments Incorporated Product Folder Links: LM6152 LM6154 LM6152, LM6154 www.ti.com SNOS752E – MAY 1999 – REVISED SEPTEMBER 2014 Typical Performance Characteristics (continued) 0 VS = ±5V HD (dBc) -10 AV = -1 -20 VIN = 5 VPP -30 RL = 10 k: THD HD2 -40 -50 -60 -70 -80 -90 HD3 -100 100k 1M FREQUENCY (Hz) Figure 25. Distortion vs. Frequency Submit Documentation Feedback Copyright © 1999–2014, Texas Instruments Incorporated Product Folder Links: LM6152 LM6154 13 LM6152, LM6154 SNOS752E – MAY 1999 – REVISED SEPTEMBER 2014 www.ti.com 7 Application and Implementation The LM6152/LM6154 is ideally suited for operation with about 10 kΩ (Feedback Resistor, RF) between the output and the negative input terminal. With RF set to this value, for most applications requiring a close loop gain of 10 or less, an additional small compensation capacitor (CF) (see Figure 26) is recommended across RF in order to achieve a reasonable overshoot (10%) at the output by compensating for stray capacitance across the inputs. The optimum value for CF can best be established experimentally with a trimmer cap in place since its value is dependant on the supply voltage, output driving load, and the operating gain. Below, some typical values used in an inverting configuration and driving a 10 kΩ load have been tabulated for reference: Table 1. Typical BW (−3 dB) at Various Supply Voltage and Gains VS Volts GAIN CF pF −1 5.6 4 3 −10 6.8 1.97 −100 None 0.797 6.6 24 BW (−3 dB) MHz −1 2.2 −10 4.7 2.2 −100 None 0.962 In the non-inverting configuration, the LM6152/LM6154 can be used for closed loop gains of +2 and above. In this case, also, the compensation capacitor (CF) is recommended across RF (= 10 kΩ) for gains of 10 or less. Figure 26. Typical Inverting Gain Circuit AV = −1 Because of the unique structure of this amplifier, when used at low closed loop gains, the realizable BW will be much less than the GBW product would suggest. The LM6152/LM6154 brings a new level of ease of use to op amp system design. The greater than rail-to-rail input voltage range eliminates concern over exceeding the common-mode voltage range. The rail-to-rail output swing provides the maximum possible dynamic range at the output. This is particularly important when operating on low supply voltages. The high gain-bandwidth with low supply current opens new battery powered applications where higher power consumption previously reduced battery life to unacceptable levels. The ability to drive large capacitive loads without oscillating functional removes this common problem. To take advantage of these features, some ideas should be kept in mind. The LM6152/LM6154, capacitive loads do not lead to oscillations, in all but the most extreme conditions, but they will result in reduced bandwidth. They also cause increased settling time. 14 Submit Documentation Feedback Copyright © 1999–2014, Texas Instruments Incorporated Product Folder Links: LM6152 LM6154 LM6152, LM6154 www.ti.com SNOS752E – MAY 1999 – REVISED SEPTEMBER 2014 Unlike most bipolar op amps, the unique phase reversal prevention/speed-up circuit in the input stage, causes the slew rate to be very much a function of the input pulse amplitude. This results in a 10 to 1 increase in slew rate when the differential input signal increases. Large fast pulses will raise the slew-rate to more than 30 V/µs. Figure 27. Slew Rate vs. VDIFF The speed-up action adds stability to the system when driving large capacitive loads. A conventional op amp exhibits a fixed maximum slew-rate even though the differential input voltage rises due to the lagging output voltage. In the LM6152/LM6154, increasing lag causes the differential input voltage to increase but as it does, the increased slew-rate keeps the output following the input much better. This effectively reduces phase lag. As a result, the LM6152/LM6154 can drive capacitive loads as large as 470 pF at gain of 2 and above, and not oscillate. Capacitive loads decrease the phase margin of all op amps. This can lead to overshoot, ringing and oscillation. This is caused by the output resistance of the amplifier and the load capacitance forming an R-C phase shift network. The LM6152/6154 senses this phase shift and partly compensates for this effect. Submit Documentation Feedback Copyright © 1999–2014, Texas Instruments Incorporated Product Folder Links: LM6152 LM6154 15 LM6152, LM6154 SNOS752E – MAY 1999 – REVISED SEPTEMBER 2014 www.ti.com 8 Device and Documentation Support 8.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 2. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY LM6152 Click here Click here Click here Click here Click here LM6154 Click here Click here Click here Click here Click here 8.2 Trademarks All trademarks are the property of their respective owners. 8.3 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 8.4 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 9 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 16 Submit Documentation Feedback Copyright © 1999–2014, Texas Instruments Incorporated Product Folder Links: LM6152 LM6154 PACKAGE OPTION ADDENDUM www.ti.com 25-Feb-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM6152ACM NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM61 52ACM LM6152ACM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM61 52ACM LM6152ACMX NRND SOIC D 8 2500 TBD Call TI Call TI 0 to 70 LM61 52ACM LM6152ACMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM61 52ACM LM6152BCM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM61 52BCM LM6152BCMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM61 52BCM LM6154BCM NRND SOIC D 14 55 TBD Call TI Call TI 0 to 70 LM6154BCM LM6154BCM/NOPB ACTIVE SOIC D 14 55 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM6154BCM LM6154BCMX/NOPB ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM6154BCM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com (4) 25-Feb-2015 There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 5-Dec-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM6152ACMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM6152ACMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM6152BCMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM6154BCMX/NOPB SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Dec-2014 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM6152ACMX SOIC D 8 2500 367.0 367.0 35.0 LM6152ACMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM6152BCMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM6154BCMX/NOPB SOIC D 14 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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