MC10E101, MC100E101 5V ECL Quad 4‐Input OR/NOR Gate Description The MC10E/100E101 is a quad 4-input OR/NOR gate. The 100 Series contains temperature compensation. www.onsemi.com Features • 500 ps Max. Propagation Delay • PECL Mode Operating Range: • • • • • • • • VCC = 4.2 V to 5.7 V with VEE = 0 V NECL Mode Operating Range: ♦ VCC = 0 V with VEE = −4.2 V to −5.7 V Internal Input 50 kW Pulldown Resistors ESD Protection: ♦ Human Body Model; > 2 kV ♦ Machine Model; > 200 V Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test Moisture Sensitivity: Level 3 (Pb-Free) Flammability Rating: ♦ UL 94 V−0 @ 0.125 in, Oxygen Index: 28 to 34 Transistor Count = 115 devices These Devices are Pb-Free, Halogen Free and are RoHS Compliant ♦ PLCC−28 FN SUFFIX CASE 776−02 MARKING DIAGRAM* MCxxxE101FNG AWLYYWW xxx A WL YY WW G = 10 or 100 = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION Package Shipping† MC10E101FNR2G PLCC−28 (Pb-Free) 500/Tape & Reel MC100E101FNR2G PLCC−28 (Pb-Free) 500/Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2016 July, 2016 − Rev. 9 1 Publication Order Number: MC10E101/D MC10E101, MC100E101 D3a D3b D3c 25 24 23 D3d VCCO 22 21 Q3 Q3 20 19 D0a D0b 26 18 Q2 D2c 27 17 Q2 D2b 28 16 VCC D2d D0c D0d Q0 Q0 D1a VEE 1 D2a 15 Q1 2 14 Q1 D1d 3 13 Q0 D1c 4 5 6 7 8 9 D1b D1a D0d D0c D0b 10 Q1 D1c Q1 D1d D2a Q0 12 D1b 11 D0a VCCO D2b Q2 D2c D2d Q2 D3a D3b Q3 D3c Q3 D3d All VCC and VCCO pins are tied together on the die. Figure 2. Logic Diagram Warning: All VCC, VCCO, and VEE pins must be externally connected to Power Supply to guarantee proper operation. Figure 1. 28-Lead Pinout: Assignment (Top View) Table 1. PIN DESCRIPTION Pin Function D0a − D3d ECL Data Inputs Q0 − Q3, Q0 − Q3 ECL Differential Outputs VCC, VCCO Positive Supply VEE Negative Supply Table 2. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit VCC PECL Mode Power Supply VEE = 0 V 8 V VEE NECL Mode Power Supply VCC = 0 V −6 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC = 0 V 6 −6 V Iout Output Current Continuous Surge 50 100 mA TA Operating Temperature Range 0 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm 500 lfpm PLCC−28 63.5 43.5 °C/W qJC Thermal Resistance (Junction-to-Case) Standard Board PLCC−28 22 to 26 °C/W Tsol Wave Solder (Pb-Free) 265 °C VI v VCC VI w VEE Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. www.onsemi.com 2 MC10E101, MC100E101 Table 3. 10E SERIES PECL DC CHARACTERISTICS (VCC = 5.0 V, VEE = 0.0 V (Note 1)) −40°C Symbol Characteristic IEE Power Supply Current 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit 23 30 40 23 30 40 23 30 40 mA IEE Power Supply Current 30 36 30 36 30 36 mA VOH Output HIGH Voltage (Note 2) 3980 4070 4160 4020 4105 4190 4090 4185 4280 mV VOL Output LOW Voltage (Note 2) 3050 3210 3370 3050 3210 3370 3050 3227 3405 mV VIH Input HIGH Voltage 3830 3995 4160 3870 4030 4190 3940 4110 4280 mV VIL Input LOW Voltage 3050 3285 3520 3050 3285 3520 3050 3302 3555 mV IIH Input HIGH Current 150 mA IIL Input LOW Current 0.5 0.3 0.5 0.25 0.3 0.2 150 150 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary −0.46 V / +0.06 V. 2. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. Table 4. 10E SERIES NECL DC CHARACTERISTICS (VCCx = 0.0 V; VEE = −5.0 V (Note 1)) −40°C Symbol Characteristic Min 25°C Typ Max 30 36 Min 85°C Typ Max 30 36 Min IEE Power Supply Current VOH Output HIGH Voltage (Note 2) −1020 −930 −840 −980 −895 −810 −910 VOL Output LOW Voltage (Note 2) −1950 −1790 −1630 −1950 −1790 −1630 −1950 VIH Input HIGH Voltage −1170 −1005 −840 −1130 −970 −810 −1060 VIL Input LOW Voltage −1950 −1715 −1480 −1950 −1715 −1480 −1950 IIH Input HIGH Current IIL Input LOW Current 150 0.5 Typ Max Unit 30 36 mA −815 −720 mV −1773 −1595 mV −890 −720 mV −1698 −1445 mV 150 mA 150 0.3 0.5 0.065 0.3 0.2 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary −0.46 V / +0.06 V. 2. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. Table 5. 100E SERIES PECL DC CHARACTERISTICS (VCCx = 5.0 V; VEE = 0.0 V (Note 1)) −40°C Symbol Characteristic Min Typ 25°C Max Min Typ 85°C Max Min Typ Max Unit IEE Power Supply Current 30 36 30 36 35 42 mA VOH Output HIGH Voltage (Note 2) 3975 4050 4120 3975 4050 4120 3975 4050 4120 mV VOL Output LOW Voltage (Note 2) 3190 3295 3380 3190 3255 3380 3190 3260 3380 mV VIH Input HIGH Voltage 3835 3975 4120 3835 3975 4120 3835 3975 4120 mV VIL Input LOW Voltage 3190 3355 3525 3190 3355 3525 3190 3355 3525 mV IIH Input HIGH Current 150 mA IIL Input LOW Current 0.5 0.3 0.5 0.25 0.5 0.2 150 150 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary −0.46 V / +0.8 V. 2. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. www.onsemi.com 3 MC10E101, MC100E101 Table 6. 100E SERIES NECL DC CHARACTERISTICS (VCCx = 0.0 V; VEE = −5.0 V (Note 1)) −40°C Symbol Characteristic Min 25°C Typ Max 30 36 Min 85°C Typ Max 30 36 Min Typ Max Unit 35 42 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 2) −1025 −950 −880 −1025 −950 −880 −1025 −950 −880 mV VOL Output LOW Voltage (Note 2) −1810 −1705 −1620 −1810 −1745 −1620 −1810 −1740 −1620 mV VIH Input HIGH Voltage −1165 −1025 −880 −1165 −1025 −880 −1165 −1025 −880 mV VIL Input LOW Voltage −1810 −1645 −1475 −1810 −1645 −1475 −1810 −1645 −1475 mV IIH Input HIGH Current 150 mA IIL Input LOW Current 0.5 0.3 0.5 0.25 0.5 0.2 150 150 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary −0.46 V / +0.8 V. 2. Outputs are terminated through a 50ĂW resistor to VCC − 2.0 V. Table 7. AC CHARACTERISTICS (VCCx = 5.0 V; VEE = 0.0 V or VCCx = 0.0 V; VEE = −5.0 V (Note 1)) −40°C Symbol Characteristic fMAX Maximum Toggle Frequency tPLH tPHL Propagation Delay to Output D to Q tSKEW Within-Device Skew (Note 2) Within-Gate Skew (Note 3) tJITTER Random Clock Jitter (RMS) tr tf Rise/Fall Time (20 - 80%) Min Typ 25°C Max Min 600 300 700 300 450 Min 450 600 300 300 380 Max 450 275 380 ps ps <1 575 Unit MHz 600 50 25 <1 575 Typ 700 50 25 <1 380 Max 700 50 25 275 Typ 85°C ps 575 ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. 10 Series: VEE can vary −0.46 V / +0.06 V. 100 Series: VEE can vary −0.46 V / +0.8 V. 2. Within-device skew is defined as identical transitions on similar paths through a device. 3. Within-gate skew is defined as the variation in propagation delays of a gate when driven from its different inputs. www.onsemi.com 4 MC10E101, MC100E101 Q Zo = 50 W D Receiver Device Driver Device Q D Zo = 50 W 50 W 50 W VTT VTT = VCC − 2.0 V Figure 3. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) Resource Reference of Application Notes AN1405/D − ECL Clock Distribution Techniques AN1406/D − Designing with PECL (ECL at +5.0 V) AN1503/D − ECLinPSt I/O SPiCE Modeling Kit AN1504/D − Metastability and the ECLinPS Family AN1568/D − Interfacing Between LVDS and ECL AN1672/D − The ECL Translator Guide AND8001/D − Odd Number Counters Design AND8002/D − Marking and Date Codes AND8020/D − Termination of ECL Logic Devices AND8066/D − Interfacing with ECLinPS AND8090/D − AC Characteristics of ECL Devices www.onsemi.com 5 MC10E101, MC100E101 PACKAGE DIMENSIONS 28 LEAD PLLC CASE 776−02 ISSUE F B Y BRK −N− 0.007 (0.180) U M T L-M 0.007 (0.180) M N S T L-M S S N S D Z −M− −L− W 28 D X V 1 G1 0.010 (0.250) T L-M S N S S VIEW D−D Z A 0.007 (0.180) R 0.007 (0.180) M M T L-M S T L-M S N N H S 0.007 (0.180) M T L-M N S S S K1 C E 0.004 (0.100) G J S K SEATING PLANE F VIEW S G1 0.010 (0.250) −T− T L-M S N VIEW S S NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.021 0.050 BSC 0.026 0.032 0.020 --0.025 --0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 --0.020 2_ 10_ 0.410 0.430 0.040 --- www.onsemi.com 6 MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.53 1.27 BSC 0.66 0.81 0.51 --0.64 --11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 --0.50 2_ 10_ 10.42 10.92 1.02 --- 0.007 (0.180) M T L-M S N S MC10E101, MC100E101 ECLinPS is a registered trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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