B0530W-B0540W Rev.F Mar.-2016 描述 / DATA SHEET Descriptions SOD-123 塑封封装 硅半导体二极管。 Silicon Diode in a SOD-123 Plastic Package. 特征 / Features 低正向压降、用于瞬态保护的保护环结构。 Low forward voltage drop, Guard ring construction for transient Protection. 用途 / Applications 半导体二极管. Silicon diode. 内部等效电路 引脚排列 / Equivalent Circuit / Pinning 1 2 PIN1:Cathode 放大及印章代码 Model PIN2:Anode / hFE Classifications & Marking B0530W B0540W HSE HSF Marking http://www.fsbrec.com 1/6 B0530W-B0540W Rev.F Mar.-2016 极限参数 / DATA SHEET Absolute Maximum Ratings(Ta=25℃) 参数 Parameter Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Reverse Voltage RMS Reverse Voltage Non-Repetitive Peak Forward Surge Current Average Rectified Output Current @ TL = 100℃ Power Dissipation Typical Thermal Resistance Junction to Ambient Operating and Storage Temperature Range Voltage Rate of Change 电性能参数 数值 Rating 符号 Symbol 单位 Unit B0530W B0540W 30 40 V 21 28 V VRRM VRWM VR VR(RMS) IFSM 5.5 A IO 0.5 A PD 410 mW RθJA 244 ℃/W Tj,Tstg -65 to 125 ℃ dv/dt 1000 V/μs / Electrical Characteristics(Ta=25℃) 参数 Parameter Reverse Breakdown Voltage Peak Forward Voltage Instantaneous Reverse Current Capacitance http://www.fsbrec.com 符号 Symbol V(BR)R VFM IRM CJ 测试条件 Test Conditions IR=130uA 数值 Rating B0530W B0540W 30 单位 Unit V IR=20uA 40 IF=100mA Tj =25℃ 0.375 IF=500mA Tj =25℃ 0.430 IF=1.0A Tj =25℃ 0.620 IF=500mA Tj =100℃ 0.460 IF=1.0A Tj =100℃ 0.610 VR=15V Tj=25℃ VR=20V Tj=25℃ VR=30V Tj=25℃ VR=40V Tj=25℃ 20 VR=20V Tj=100℃ 5.0 VR=40V Tj=100℃ 13 VR=0V DC f=1.0MHz V 0.510 V 20 10 130 170 μA mA pF 2/6 B0530W-B0540W Rev.F Mar.-2016 电参数曲线图 DATA SHEET / Electrical Characteristic Curve http://www.fsbrec.com 3/6 B0530W-B0540W Rev.F Mar.-2016 外形尺寸图 DATA SHEET / Package Dimensions http://www.fsbrec.com 4/6 B0530W-B0540W Rev.F Mar.-2016 印章说明 / DATA SHEET Marking Instructions HSE 说明： H： 为公司代码 SE： 为型号代码 Note: H: Company Code. SE: Product Type. http://www.fsbrec.com 5/6 B0530W-B0540W Rev.F Mar.-2016 DATA SHEET 回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free) 说明： Note: 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150℃, Time:60~90sec. 2、峰值温度 245±5℃，时间持续为 5±0.5sec; 2.Peak Temp.:245±5℃, Duration:5±0.5sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：260±5℃ 包装规格 Time:10±1 sec / REEL Package Type 封装形式 使用说明 Temp.:260±5℃ / Packaging SPEC. 卷盘包装 SOD-123 时间：10±1 sec. Units 包装数量 Dimension 包装尺寸 3 (unit：mm ) Units/Reel 只/卷盘 Reels/Inner Box 卷盘/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Reel Inner Box 盒 Outer Box 箱 3,000 10 30,000 8 240,000 7〞×8 180×120×180 385×257×392 / Notices http://www.fsbrec.com 6/6