MC100EP140 3.3VECL Phase−Frequency Detector Description The MC100EP140 is a three state phase frequency−detector intended for phase−locked loop applications which require a minimum amount of phase and frequency difference at lock. Since the part is designed with fully differential internal gates, the noise is reduced throughout the circuit, especially at high speeds. The basic operation of a Phase/Frequency Detector (PFD) is to “compare” an incoming signal (feedback) to a set reference signal. When the Reference (R) and Feedback (FB) inputs are unequal in frequency and/or phase, the differential UP (U) and DOWN (D) outputs will provide pulse streams which, when subtracted and integrated, provide an error voltage for control of a VCO. Detector states of operation are shown in the Figure 2 and the State Table. The typical output amplitude of the EP140 is 400 mV, allowing faster switching time and greater bandwidth. For proper operation, the input edge rate of the R and FB inputs should be less than 5 ns. More information on Phase Lock Loop operation and application can be found in AND8040. The pinout is shown in Figure 1, the logic diagram in Figure 3, and the typical termination in Figure 5. Features • • • • • • • • • • • November, 2006 − Rev. 9 MARKING DIAGRAMS* 8 8 1 A L Y W G SOIC−8 D SUFFIX CASE 751 1 KP140 ALYW G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. 500 ps Typical Propagation Delay Maximum Frequency > 2.1 GHz Typical Fully Differential Internally Advanced High Band Output Swing of 400 mV Transfer Gain: 1.0 mV/Degree at 1.4 GHz 1.2 mV/Degree at 1.0 GHz Rise and Fall Time: 100 ps Typical The 100 Series Contains Temperature Compensation PECL Mode Operating Range: VCC = 3.0 V to 3.6 V with VEE = 0 V NECL Mode Operating Range: VCC = 0 V with VEE = −3.0 V to −3.6 V Open Input Default State Pb−Free Packages are Available © Semiconductor Components Industries, LLC, 2006 http://onsemi.com 1 Publication Order Number: MC100EP140/D MC100EP140 VCC R FB VEE 8 7 6 5 1 2 3 4 U U D D Table 1. PIN DESCRIPTION PIN FUNCTION D, D Differential Down Outputs U, U Differential Up Outputs R* ECL Reference Input FB* ECL Feedback Input VCC Positive Supply VEE Negative Supply * Pins will default LOW when left open. Figure 1. 8−Lead Pinout (Top View) Table 2. STATE TABLE R 1 FB R Pump Down U=L D=H PHASE DETECTOR STATE 2 3 Pump Up U=L D=L FB U=H D=L R L L L L H L H 1−2 H L L L 2 L L L L 2 L L L L 2−3 H L H L 3−2 H H L L 2 L L L L U U C R U FF C A Reset D VEE B Reset FB D R B S D FF D L C A A S U PUMP UP 2−3−2 U Reset FB 2−1 FB A R OUTPUT PUMP DOWN 2−1−2 2 Figure 2. Phase Detector Logic Model R INPUT D Reset B B D Figure 3. Logic Diagram http://onsemi.com 2 D D MC100EP140 Table 3. ATTRIBUTES Characteristics Value Internal Input Pulldown Resistor 75 kW Internal Input Pullup Resistor 37.5 kW ESD Protection Human Body Model Machine Model Charged Device Model > 2 kV > 200 V > 2 kV Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) SOIC−8 Flammability Rating Oxygen Index: 28 to 34 Pb Pkg Pb−Free Pkg Level 1 Level 1 UL 94 V−0 @ 0.125 in Transistor Count 457 Devices Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. Table 4. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit VCC PECL Mode Power Supply VEE = 0 V 6 V VEE NECL Mode Power Supply VCC = 0 V −6 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC = 0 V 6 −6 V V Iout Output Current Continuous Surge 50 100 mA mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm SOIC−8 SOIC−8 190 130 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board SOIC−8 41 to 44 °C/W Tsol Wave Solder 265 265 °C VI v VCC VI w VEE Pb Pb−Free Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 5. 100EP DC CHARACTERISTICS, PECL VCC = 3.3 V, VEE = 0 V (Note 2) −40°C Symbol Characteristic 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit 45 65 85 50 70 90 53 73 93 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 3) 2155 2280 2405 2155 2280 2405 2155 2280 2405 mV VOL Output LOW Voltage (Note 3) 1755 1880 2005 1755 1880 2005 1755 1880 2005 mV VIH Input HIGH Voltage (Single−Ended) 2075 2420 2075 2420 2075 2420 mV VIL Input LOW Voltage (Single−Ended) 1355 1675 1355 1675 1355 1675 mV IIH Input HIGH Current 150 mA IIL Input LOW Current 150 0.5 150 0.5 0.5 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 2. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to −0.3 V. 3. All loading with 50 W to VCC − 2.0 V. http://onsemi.com 3 MC100EP140 Table 6. 100EP DC CHARACTERISTICS, NECL VCC = 0 V, VEE = −3.6 V to −3.0 V (Note 4) −40°C Symbol Characteristic 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit 45 65 85 50 70 90 53 73 93 mA Output HIGH Voltage (Note 5) −1145 −1020 −895 −1145 −1020 −895 −1145 −1020 −895 mV VOL Output LOW Voltage (Note 5) −1545 −1420 −1295 −1545 −1420 −1295 −1545 −1420 −1295 mV VIH Input HIGH Voltage (Single−Ended) −1225 −880 −1225 −880 −1225 −880 mV VIL Input LOW Voltage (Single−Ended) −1945 −1625 −1945 −1625 −1945 −1625 mV IIH Input HIGH Current 150 mA IIL Input LOW Current IEE Power Supply Current VOH 150 150 0.5 0.5 0.5 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 4. Input and output parameters vary 1:1 with VCC. 5. All loading with 50 W to VCC − 2.0 V. Table 7. AC CHARACTERISTICS VCC = 0 V; VEE = −3.0 V to −3.6 V or VCC = 3.0 V to 3.6 V; VEE = 0 V (Note 6) −40°C Symbol Characteristic Min fmax Maximum Frequency (Figure 4) tPLH, tPHL Propagation Delay to Output Differential tJITTER Cycle−to−Cycle Jitter (Figure 4) VPP Input Voltage Swing tr tf Output Rise/Fall Times (20% − 80%) Typ 25°C Max Min >2 R to U, FB to D FB to U, R to D 300 400 Q, Q Typ 85°C Max Min >2 450 600 6002 800 .2 <1 400 800 1200 50 90 180 325 450 Typ Max >2 475 650 625 850 .2 <1 400 800 1200 60 100 200 350 500 Unit GHz 500 700 650 900 ps .2 <1 ps 400 800 1200 mV 70 120 220 ps 600 6 500 5 400 4 300 3 JITTER OUT ps (RMS) VOUTpp (mV) NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 6. Measured using a 750 mV VPP pk−pk, 50% duty cycle, clock source. All loading with 50 W to VCC − 2.0 V. Ï Ï ÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏ Ï ÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏ ÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏ 2 200 (JITTER) 100 0 1 0 400 800 1200 1600 FREQUENCY (MHz) Figure 4. Fmax/Jitter http://onsemi.com 4 2000 2400 MC100EP140 Q Zo = 50 W D Receiver Device Driver Device Q D Zo = 50 W 50 W 50 W VTT VTT = VCC − 2.0 V Figure 5. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) ORDERING INFORMATION Device MC100EP140D Package Shipping † SOIC−8 98 Units / Rail MC100EP140DG SOIC−8 (Pb−Free) 98 Units / Rail MC100EP140DR2 SOIC−8 2500 / Tape & Reel SOIC−8 (Pb−Free) 2500 / Tape & Reel MC100EP140DR2G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Resource Reference of Application Notes AN1405/D − ECL Clock Distribution Techniques AN1406/D − Designing with PECL (ECL at +5.0 V) AN1503/D − ECLinPSt I/O SPiCE Modeling Kit AN1504/D − Metastability and the ECLinPS Family AN1568/D − Interfacing Between LVDS and ECL AN1672/D − The ECL Translator Guide AND8001/D − Odd Number Counters Design AND8002/D − Marking and Date Codes AND8020/D − Termination of ECL Logic Devices AND8066/D − Interfacing with ECLinPS AND8090/D − AC Characteristics of ECL Devices http://onsemi.com 5 MC100EP140 PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AH −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 S B 1 0.25 (0.010) M Y M 4 −Y− K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− H 0.10 (0.004) D 0.25 (0.010) M Z Y S X S M J SOLDERING FOOTPRINT* MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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