Cypress CY7C1318CV18-200BZXC 18-mbit ddr ii sram 2-word burst architecture Datasheet

CY7C1318CV18, CY7C1320CV18
18-Mbit DDR II SRAM 2-Word
Burst Architecture
18-Mbit DDR II SRAM 2-Word Burst Architecture
Features
Configurations
■
18-Mbit density (1 M × 18, 512 K × 36)
CY7C1318CV18 – 1M × 18
■
267-MHz clock for high bandwidth
CY7C1320CV18 – 512K × 36
■
2-word burst for reducing address bus frequency
Functional Description
■
Double data rate (DDR) interfaces
(data transferred at 534 MHz) at 267 MHz
■
Two input clocks (K and K) for precise DDR timing
❐ SRAM uses rising edges only
■
Two input clocks for output data (C and C) to minimize clock
skew and flight time mismatches
■
Echo clocks (CQ and CQ) simplify data capture in high speed
systems
■
Synchronous internally self-timed writes
■
DDR II operates with 1.5 cycle read latency when delay lock
loop (DLL) is enabled
■
Operates similar to a DDR I device with one cycle read latency
in DLL Off mode
■
1.8 V core power supply with high-speed transceiver logic
(HSTL) inputs and outputs
■
Variable drive HSTL output buffers
■
Expanded HSTL output voltage (1.4 V – VDD)
■
Available in 165-ball fine pitch ball grid array (FPBGA) package
(13 × 15 × 1.4 mm)
■
Offered in both Pb-free and non Pb-free packages
■
JTAG 1149.1 compatible test access port
■
DLL for accurate data placement
Cypress Semiconductor Corporation
Document Number: 001-07160 Rev. *J
•
The CY7C1318CV18, and CY7C1320CV18 are 1.8 V
synchronous pipelined SRAMs equipped with DDR II
architecture. The DDR II consists of an SRAM core with
advanced synchronous peripheral circuitry and a one-bit burst
counter. Addresses for read and write are latched on alternate
rising edges of the input (K) clock. Write data is registered on the
rising edges of both K and K. Read data is driven on the rising
edges of C and C if provided, or on the rising edge of K and K if
C/C are not provided. For CY7C1318CV18 and
CY7C1320CV18, the burst counter takes in the least significant
bit of the external address and bursts two 18-bit words (in the
case of CY7C1318CV18) of two 36-bit words (in the case of
CY7C1320CV18) sequentially into or out of the device.
Asynchronous inputs include an output impedance matching
input (ZQ). Synchronous data outputs (Q, sharing the same
physical pins as the data inputs, D) are tightly matched to the two
output echo clocks CQ/CQ, eliminating the need to capture data
separately from each individual DDR SRAM in the system
design. Output data clocks (C/C) enable maximum system
clocking and data synchronization flexibility.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised February 2, 2011
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CY7C1318CV18, CY7C1320CV18
Logic Block Diagram (CY7C1318CV18)
A(19:1)
LD
K
Address
Register
CLK
Gen.
K
Write Add. Decode
19
DOFF
Write
Reg
Write
Reg
512K x 18 Array
20
512K x 18 Array
A(19:0)
Read Add. Decode
Burst
Logic
A0
18
Output
Logic
Control
R/W
C
Read Data Reg.
36
VREF
Control
Logic
R/W
BWS[1:0]
C
18
18
Reg.
Reg. 18
Reg.
18
CQ
CQ
18
DQ[17:0]
Logic Block Diagram (CY7C1320CV18)
A(18:1)
LD
K
K
Address
Register
CLK
Gen.
DOFF
VREF
R/W
BWS[3:0]
Write Add. Decode
18
Write
Reg
Write
Reg
256K x 36 Array
19
256K x 36 Array
A(18:0)
Read Add. Decode
Burst
Logic
A0
36
Output
Logic
Control
R/W
C
Read Data Reg.
72
Control
Logic
Document Number: 001-07160 Rev. *J
36
36
C
Reg.
Reg. 36
Reg.
36
CQ
CQ
36
DQ[35:0]
Page 2 of 29
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CY7C1318CV18, CY7C1320CV18
Contents
Selection Guide ................................................................ 4
Pin Configuration ............................................................. 5
165-ball FBGA (13 × 15 × 1.4 mm) Pinout .................. 5
Pin Definitions .................................................................. 6
Functional Overview ........................................................ 8
Read Operations ......................................................... 8
Write Operations ......................................................... 8
Byte Write Operations ................................................. 8
Single Clock Mode ...................................................... 8
DDR Operation ............................................................ 8
Depth Expansion ......................................................... 8
Programmable Impedance .......................................... 9
Echo Clocks ................................................................ 9
DLL .............................................................................. 9
Application Example ........................................................ 9
Truth Table ...................................................................... 10
Burst Address Table ...................................................... 10
Write Cycle Descriptions ............................................... 10
Write Cycle Descriptions ............................................... 11
IEEE 1149.1 Serial Boundary Scan (JTAG) .................. 12
Disabling the JTAG Feature ...................................... 12
Test Access Port—Test Clock ................................... 12
Test Mode Select (TMS) ........................................... 12
Test Data-In (TDI) ..................................................... 12
Test Data-Out (TDO) ................................................. 12
Performing a TAP Reset ........................................... 12
TAP Registers ........................................................... 12
TAP Instruction Set ................................................... 12
TAP Controller State Diagram ....................................... 14
TAP Controller Block Diagram ...................................... 15
TAP Electrical Characteristics ...................................... 15
Document Number: 001-07160 Rev. *J
TAP AC Switching Characteristics ............................... 16
TAP Timing and Test Conditions .................................. 16
Identification Register Definitions ................................ 17
Scan Register Sizes ....................................................... 17
Instruction Codes ........................................................... 17
Boundary Scan Order .................................................... 18
Power Up Sequence in DDR II SRAM ........................... 19
Power Up Sequence ................................................. 19
DLL Constraints ......................................................... 19
Maximum Ratings ........................................................... 20
Operating Range ............................................................. 20
Neutron Soft Error Immunity ......................................... 20
Electrical Characteristics ............................................... 20
DC Electrical Characteristics ..................................... 20
AC Electrical Characteristics ..................................... 21
Capacitance .................................................................... 21
Thermal Resistance ........................................................ 21
Switching Characteristics .............................................. 22
Switching Waveforms .................................................... 24
Ordering Information ...................................................... 25
Ordering Code Definitions ......................................... 25
Package Diagram ............................................................ 26
Acronyms ........................................................................ 27
Document Conventions ................................................. 27
Units of Measure ....................................................... 27
Document History Page ................................................. 28
Sales, Solutions, and Legal Information ...................... 29
Worldwide Sales and Design Support ....................... 29
Products .................................................................... 29
PSoC Solutions ......................................................... 29
Page 3 of 29
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CY7C1318CV18, CY7C1320CV18
Selection Guide
Description
267 MHz
250 MHz
200 MHz
167 MHz
Unit
267
250
200
167
MHz
×18
805
730
600
510
mA
×36
855
775
635
540
Maximum operating frequency
Maximum operating current
Document Number: 001-07160 Rev. *J
Page 4 of 29
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CY7C1318CV18, CY7C1320CV18
Pin Configuration
The pin configuration for CY7C1318CV18 and CY7C1320CV18 follow.[1]
165-ball FBGA (13 × 15 × 1.4 mm) Pinout
CY7C1318CV18 (1M × 18)
1
2
3
4
5
6
7
8
9
10
11
A
CQ
NC/72M
A
R/W
BWS1
K
NC/144M
LD
A
NC/36M
CQ
B
NC
DQ9
NC
A
NC/288M
K
BWS0
A
NC
NC
DQ8
C
NC
NC
NC
VSS
A
A0
A
VSS
NC
DQ7
NC
D
NC
NC
DQ10
VSS
VSS
VSS
VSS
VSS
NC
NC
NC
E
NC
NC
DQ11
VDDQ
VSS
VSS
VSS
VDDQ
NC
NC
DQ6
F
NC
DQ12
NC
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
DQ5
G
NC
NC
DQ13
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
NC
H
DOFF
VREF
VDDQ
VDDQ
VDD
VSS
VDD
VDDQ
VDDQ
VREF
ZQ
J
NC
NC
NC
VDDQ
VDD
VSS
VDD
VDDQ
NC
DQ4
NC
K
NC
NC
DQ14
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
DQ3
L
NC
DQ15
NC
VDDQ
VSS
VSS
VSS
VDDQ
NC
NC
DQ2
M
NC
NC
NC
VSS
VSS
VSS
VSS
VSS
NC
DQ1
NC
N
NC
NC
DQ16
VSS
A
A
A
VSS
NC
NC
NC
P
NC
NC
DQ17
A
A
C
A
A
NC
NC
DQ0
R
TDO
TCK
A
A
A
C
A
A
A
TMS
TDI
CY7C1320CV18 (512K × 36)
1
2
4
5
6
7
8
9
10
11
R/W
BWS2
K
BWS1
LD
A
NC/72M
CQ
DQ18
A
BWS3
K
BWS0
A
NC
NC
DQ8
NC
DQ28
VSS
A
A0
A
VSS
NC
DQ17
DQ7
NC
DQ29
DQ19
VSS
VSS
VSS
VSS
VSS
NC
NC
DQ16
NC
NC
DQ20
VDDQ
VSS
VSS
VSS
VDDQ
NC
DQ15
DQ6
F
NC
DQ30
DQ21
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
DQ5
G
NC
DQ31
DQ22
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
DQ14
H
DOFF
VREF
VDDQ
VDDQ
VDD
VSS
VDD
VDDQ
VDDQ
VREF
ZQ
J
NC
NC
DQ32
VDDQ
VDD
VSS
VDD
VDDQ
NC
DQ13
DQ4
K
NC
NC
DQ23
VDDQ
VDD
VSS
VDD
VDDQ
NC
DQ12
DQ3
L
NC
DQ33
DQ24
VDDQ
VSS
VSS
VSS
VDDQ
NC
NC
DQ2
M
NC
NC
DQ34
VSS
VSS
VSS
VSS
VSS
NC
DQ11
DQ1
N
NC
DQ35
DQ25
VSS
A
A
A
VSS
NC
NC
DQ10
P
NC
NC
DQ26
A
A
C
A
A
NC
DQ9
DQ0
R
TDO
TCK
A
A
A
C
A
A
A
TMS
TDI
A
CQ
B
NC
DQ27
C
NC
D
E
3
NC/144M NC/36M
Note
1. NC/36M, NC/72M, NC/144M, and NC/288M are not connected to the die and can be tied to any voltage level.
Document Number: 001-07160 Rev. *J
Page 5 of 29
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CY7C1318CV18, CY7C1320CV18
Pin Definitions
Pin Name
I/O
Pin Description
DQ[x:0]
Input Output- Data Input Output Signals. Inputs are sampled on the rising edge of K and K clocks during valid write
Synchronous operations. These pins drive out the requested data during a read operation. Valid data is driven out on
the rising edge of both the C and C clocks during read operations or K and K when in single clock mode.
When read access is deselected, Q[x:0] are automatically tristated.
CY7C1318CV18  DQ[17:0]
CY7C1320CV18  DQ[35:0]
LD
InputSynchronous Load. This input is brought LOW when a bus cycle sequence is defined. This definition
Synchronous includes address and read/write direction. All transactions operate on a burst of 2 data.
BWS0,
BWS1,
BWS2,
BWS3
InputByte Write Select (BWS) 0, 1, 2, and 3 Active LOW. Sampled on the rising edge of the K and K clocks
Synchronous during write operations. Used to select which byte is written into the device during the current portion of
the Write operations. Bytes not written remain unaltered.
CY7C1318CV18 BWS0 controls D[8:0] and BWS1 controls D[17:9].
CY7C1320CV18 BWS0 controls D[8:0], BWS1 controls D[17:9], BWS2 controls D[26:18] and BWS3 controls
D[35:27].
All the BWS pins are sampled on the same edge as the data. Deselecting a BWS ignores the
corresponding byte of data and it is not written into the device.
A, A0
InputAddress Inputs. These address inputs are multiplexed for both read and write operations. Internally, the
Synchronous device is organized as 1M x 18 (2 arrays each of 512K x 18) for CY7C1318CV18, and 512K x 36 (2 arrays
each of 256K x 36) for CY7C1320CV18.
CY7C1318CV18 – A0 is the input to the burst counter. These are incremented internally in a linear fashion.
20 address inputs are needed to access the entire memory array.
CY7C1320CV18 – A0 is the input to the burst counter. These are incremented internally in a linear fashion.
19 address inputs are needed to access the entire memory array. All the address inputs are ignored when
the appropriate port is deselected.
R/W
InputSynchronous Read/Write Input. When LD is LOW, this input designates the access type (read when
Synchronous R/W is HIGH, write when R/W is LOW) for the loaded address. R/W must meet the setup and hold times
around the edge of K.
C
Input Clock
Positive Input Clock for Output Data. C is used in conjunction with C to clock out the read data from
the device. C and C can be used together to deskew the flight times of various devices on the board back
to the controller. See “Application Example” on page 9 for more information.
C
Input Clock
Negative Input Clock for Output Data. C is used in conjunction with C to clock out the read data from
the device. C and C can be used together to deskew the flight times of various devices on the board back
to the controller. See “Application Example” on page 9 for more information.
K
Input Clock
Positive Input Clock Input. The rising edge of K is used to capture synchronous inputs to the device
and to drive out data through Q[x:0] when in single clock mode. All accesses are initiated on the rising
edge of K.
K
Input Clock
Negative Input Clock Input. K is used to capture synchronous data being presented to the device and
to drive out data through Q[x:0] when in single clock mode.
CQ
Output Clock CQ Referenced with Respect to C. This is a free running clock and is synchronized to the input clock
for output data (C) of the DDR II. In single clock mode, CQ is generated with respect to K. The timing for
the echo clocks is shown in “Switching Characteristics” on page 22.
CQ
Output Clock CQ Referenced with Respect to C. This is a free running clock and is synchronized to the input clock
for output data (C) of the DDR II. In single clock mode, CQ is generated with respect to K. The timing for
the echo clocks is shown in “Switching Characteristics” on page 22.
ZQ
Input
Output Impedance Matching Input. This input is used to tune the device outputs to the system data bus
impedance. CQ, CQ, and Q[x:0] output impedance are set to 0.2 x RQ, where RQ is a resistor connected
between ZQ and ground. Alternatively, this pin can be connected directly to VDDQ, which enables the
minimum impedance mode. This pin cannot be connected directly to GND or left unconnected.
Document Number: 001-07160 Rev. *J
Page 6 of 29
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CY7C1318CV18, CY7C1320CV18
Pin Definitions
Pin Name
DOFF
(continued)
I/O
Pin Description
Input
DLL Turn Off Active LOW. Connecting this pin to ground turns off the DLL inside the device. The timing
in the DLL turned off operation is different from that listed in this data sheet. For normal operation, this
pin can be connected to a pull up through a 10 K or less pull up resistor. The device behaves in DDR I
mode when the DLL is turned off. In this mode, the device can be operated at a frequency of up to 167 MHz
with DDR I timing.
TDO
Output
Test Data Out (TDO) for JTAG.
TCK
Input
Test Clock (TCK) Pin for JTAG.
TDI
Input
Test Data In (TDI) Pin for JTAG.
TMS
Input
Test Mode Select (TMS) Pin for JTAG.
NC
N/A
Not Connected to the Die. Can be tied to any voltage level.
NC/36M
N/A
Not Connected to the Die. Can be tied to any voltage level.
NC/72M
N/A
Not Connected to the Die. Can be tied to any voltage level.
NC/144M
N/A
Not Connected to the Die. Can be tied to any voltage level.
NC/288M
N/A
Not Connected to the Die. Can be tied to any voltage level.
VREF
VDD
VSS
VDDQ
InputReference
Reference Voltage Input. Static input used to set the reference level for HSTL inputs, outputs, and AC
measurement points.
Power Supply Power Supply Inputs to the Core of the Device.
Ground
Ground for the Device.
Power Supply Power Supply Inputs for the Outputs of the Device.
Document Number: 001-07160 Rev. *J
Page 7 of 29
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CY7C1318CV18, CY7C1320CV18
Functional Overview
The CY7C1318CV18, and CY7C1320CV18 are synchronous
pipelined Burst SRAMs equipped with a DDR interface, which
operates with a read latency of one and half cycles when DOFF
pin is tied HIGH. When DOFF pin is set LOW or connected to
VSS the device behaves in DDR I mode with a read latency of
one clock cycle.
Accesses are initiated on the rising edge of the positive input
clock (K). All synchronous input timing is referenced from the
rising edge of the input clocks (K and K) and all output timing is
referenced to the rising edge of the output clocks (C/C, or K/K
when in single clock mode).
All synchronous data inputs (D[x:0]) pass through input registers
controlled by the rising edge of the input clocks (K and K). All
synchronous data outputs (Q[x:0]) pass through output registers
controlled by the rising edge of the output clocks (C/C, or K/K
when in single-clock mode).
All synchronous control (R/W, LD, BWS[0:X]) inputs pass through
input registers controlled by the rising edge of the input clock (K).
CY7C1318CV18 is described in the following sections. The
same basic descriptions apply to CY7C1320CV18.
Read Operations
The CY7C1318CV18 is organized internally as two arrays of
512K x 18. Accesses are completed in a burst of two sequential
18-bit data words. Read operations are initiated by asserting
R/W HIGH and LD LOW at the rising edge of the positive input
clock (K). The address presented to address inputs is stored in
the read address register and the least significant bit of the
address is presented to the burst counter. The burst counter
increments the address in a linear fashion. Following the next K
clock rise, the corresponding 18-bit word of data from this
address location is driven onto Q[17:0], using C as the output
timing reference. On the subsequent rising edge of C the next
18-bit data word from the address location generated by the
burst counter is driven onto Q[17:0]. The requested data is valid
0.45 ns from the rising edge of the output clock (C or C, or K and
K when in single clock mode, 200 MHz and 250 MHz device). To
maintain the internal logic, each read access must be allowed to
complete. Read accesses can be initiated on every rising edge
of the positive input clock (K).
The CY7C1318CV18 first completes the pending read
transactions, when read access is deselected. Synchronous
internal circuitry automatically tristates the output following the
next rising edge of the positive output clock (C). This enables a
seamless transition between devices without the insertion of wait
states in a depth expanded memory.
Write Operations
Write operations are initiated by asserting R/W LOW and LD
LOW at the rising edge of the positive input clock (K). The
address presented to address inputs is stored in the write
address register and the least significant bit of the address is
presented to the burst counter. The burst counter increments the
address in a linear fashion. On the following K clock rise the data
presented to D[17:0] is latched and stored into the 18-bit write
data register, provided BWS[1:0] are both asserted active. On the
Document Number: 001-07160 Rev. *J
subsequent rising edge of the negative input clock (K) the
information presented to D[17:0] is also stored into the write data
register, provided BWS[1:0] are both asserted active. The 36 bits
of data are then written into the memory array at the specified
location. Write accesses can be initiated on every rising edge of
the positive input clock (K). This pipelines the data flow such that
18 bits of data can be transferred into the device on every rising
edge of the input clocks (K and K).
When Write access is deselected, the device ignores all inputs
after the pending write operations are completed.
Byte Write Operations
Byte write operations are supported by the CY7C1318CV18. A
write operation is initiated as described in the Write Operations
section. The bytes that are written are determined by BWS0 and
BWS1, which are sampled with each set of 18-bit data words.
Asserting the appropriate Byte Write Select input during the data
portion of a write latches the data being presented and writes it
into the device. Deasserting the Byte Write Select input during
the data portion of a write enables the data stored in the device
for that byte to remain unaltered. This feature can be used to
simplify read/modify/write operations to a byte write operation.
Single Clock Mode
The CY7C1318CV18 can be used with a single clock that
controls both the input and output registers. In this mode the
device recognizes only a single pair of input clocks (K and K) that
control both the input and output registers. This operation is
identical to the operation if the device had zero skew between
the K/K and C/C clocks. All timing parameters remain the same
in this mode. To use this mode of operation, tie C and C HIGH at
power on. This function is a strap option and not alterable during
device operation.
DDR Operation
The CY7C1318CV18 enables high-performance operation
through high clock frequencies (achieved through pipelining) and
double data rate mode of operation. The CY7C1318CV18
requires a single No Operation (NOP) cycle when transitioning
from a read to a write cycle. At higher frequencies, some
applications may require a second NOP cycle to avoid
contention.
If a read occurs after a write cycle, address and data for the write
are stored in registers. The write information must be stored
because the SRAM cannot perform the last word write to the
array without conflicting with the read. The data stays in this
register until the next write cycle occurs. On the first write cycle
after the read(s), the stored data from the earlier write is written
into the SRAM array. This is called a posted write.
If a read is performed on the same address on which a write is
performed in the previous cycle, the SRAM reads out the most
current data. The SRAM does this by bypassing the memory
array and reading the data from the registers.
Depth Expansion
Depth expansion requires replicating the LD control signal for
each bank. All other control signals can be common between
banks as appropriate.
Page 8 of 29
[+] Feedback
CY7C1318CV18, CY7C1320CV18
Programmable Impedance
DLL
An external resistor, RQ, must be connected between the ZQ pin
on the SRAM and VSS to enable the SRAM to adjust its output
driver impedance. The value of RQ must be 5x the value of the
intended line impedance driven by the SRAM. The allowable
range of RQ to guarantee impedance matching with a tolerance
of ±15% is between 175  and 350 , with VDDQ = 1.5 V. The
output impedance is adjusted every 1024 cycles at power up to
account for drifts in supply voltage and temperature.
These chips use a delay lock loop (DLL) that is designed to
function between 120 MHz and the specified maximum clock
frequency. During power up, when the DOFF is tied HIGH, the
DLL is locked after 1024 cycles of stable clock. The DLL can also
be reset by slowing or stopping the input clocks K and K for a
minimum of 30 ns. However, it is not necessary to reset the DLL
to lock it to the desired frequency. The DLL automatically locks
1024 clock cycles after a stable clock is presented. The DLL may
be disabled by applying ground to the DOFF pin. When the DLL
is turned off, the device behaves in DDR I mode (with one cycle
latency and a longer access time). For information refer to the
application note DLL Considerations in QDRII™/DDRII.
Echo Clocks
Echo clocks are provided on the DDR II to simplify data capture
on high speed systems. Two echo clocks are generated by the
DDR II. CQ is referenced with respect to C and CQ is referenced
with respect to C. These are free running clocks and are
synchronized to the output clock of the DDR II. In the single clock
mode, CQ is generated with respect to K and CQ is generated
with respect to K. The timing for the echo clocks is shown in
“Switching Characteristics” on page 22.
Application Example
Figure 1 shows two DDR II used in an application.
Figure 1. Application Example
SRAM#1
DQ
A
DQ
Addresses
Cycle Start#
R/W#
Return CLK
Source CLK
Return CLK#
Source CLK#
Echo Clock1/Echo Clock#1
Echo Clock2/Echo Clock#2
BUS
MASTER
(CPU
or
ASIC)
ZQ
CQ/CQ#
LD# R/W# C C# K K#
R = 250ohms
SRAM#2
DQ
A
ZQ
CQ/CQ#
LD# R/W# C C# K K#
R = 250ohms
Vterm = 0.75V
R = 50ohms
Vterm = 0.75V
Document Number: 001-07160 Rev. *J
Page 9 of 29
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CY7C1318CV18, CY7C1320CV18
Truth Table
The truth table for the CY7C1318CV18, and CY7C1320CV18 follows.[2, 3, 4, 5, 6, 7]
Operation
K
LD
R/W
Write cycle:
Load address; wait one cycle;
input write data on consecutive K and K rising edges.
L–H
L
L
D(A1) at K(t + 1)  D(A2) at K(t + 1) 
Read cycle:
Load address; wait one and a half cycle;
read data on consecutive C and C rising edges.
L–H
L
H
Q(A1) at C(t + 1) Q(A2) at C(t + 2) 
L–H
H
X
High Z
High Z
Stopped
X
X
Previous State
Previous State
NOP: No operation
Standby: Clock stopped
DQ
DQ
Burst Address Table
(CY7C1318CV18, CY7C1320CV18)
First Address (External)
Second Address (Internal)
X..X0
X..X1
X..X1
X..X0
Write Cycle Descriptions
The write cycle description table for CY7C1318CV18 follows. [2, 8]
BWS0
BWS1
K
K
L
L
L–H
–
L
L
–
L
H
L–H
L
H
–
H
L
L–H
H
L
–
H
H
L–H
H
H
–
Comments
During the data portion of a write sequence 
Both bytes (D[17:0]) are written into the device.
L–H During the data portion of a write sequence 
Both bytes (D[17:0]) are written into the device.
–
During the data portion of a write sequence 
Only the lower byte (D[8:0]) is written into the device, D[17:9] remains unaltered.
L–H During the data portion of a write sequence 
Only the lower byte (D[8:0]) is written into the device, D[17:9] remains unaltered.
–
During the data portion of a write sequence 
Only the upper byte (D[17:9]) is written into the device, D[8:0] remains unaltered.
L–H During the data portion of a write sequence 
Only the upper byte (D[17:9]) is written into the device, D[8:0] remains unaltered.
–
No data is written into the devices during this portion of a write operation.
L–H No data is written into the devices during this portion of a write operation.
Notes
2. X = “Don’t Care,” H = Logic HIGH, L = Logic LOW, represents rising edge.
3. Device powers up deselected with the outputs in a tristate condition.
4. On CY7C1318CV18 and CY7C1320CV18, “A1” represents address location latched by the devices when transaction was initiated and “A2” represents the addresses
sequence in the burst.
5. “t” represents the cycle at which a read/write operation is started. t + 1 and t + 2 are the first and second clock cycles succeeding the “t” clock cycle.
6. Data inputs are registered at K and K rising edges. Data outputs are delivered on C and C rising edges, except when in single clock mode.
7. It is recommended that K = K and C = C = HIGH when clock is stopped. This is not essential, but permits most rapid restart by overcoming transmission line charging
symmetrically.
8. Is based on a write cycle that was initiated in accordance with the Write Cycle Descriptions table. BWS0, BWS1, BWS2, and BWS3 can be altered on different portions
of a write cycle, as long as the setup and hold requirements are achieved.
Document Number: 001-07160 Rev. *J
Page 10 of 29
[+] Feedback
CY7C1318CV18, CY7C1320CV18
Write Cycle Descriptions
The write cycle description table for CY7C1320CV18 follows.[9, 10]
BWS0
BWS1
BWS2
BWS3
K
K
Comments
L
L
L
L
L–H
–
During the data portion of a write sequence, all four bytes (D[35:0]) are written into
the device.
L
L
L
L
–
L
H
H
H
L–H
L
H
H
H
–
H
L
H
H
L–H
H
L
H
H
–
H
H
L
H
L–H
H
H
L
H
–
H
H
H
L
L–H
H
H
H
L
–
H
H
H
H
L–H
H
H
H
H
–
L–H During the data portion of a write sequence, all four bytes (D[35:0]) are written into
the device.
–
During the data portion of a write sequence, only the lower byte (D[8:0]) is written
into the device. D[35:9] remains unaltered.
L–H During the data portion of a write sequence, only the lower byte (D[8:0]) is written
into the device. D[35:9] remains unaltered.
–
During the data portion of a write sequence, only the byte (D[17:9]) is written into
the device. D[8:0] and D[35:18] remains unaltered.
L–H During the data portion of a write sequence, only the byte (D[17:9]) is written into
the device. D[8:0] and D[35:18] remains unaltered.
–
During the data portion of a write sequence, only the byte (D[26:18]) is written into
the device. D[17:0] and D[35:27] remains unaltered.
L–H During the data portion of a write sequence, only the byte (D[26:18]) is written into
the device. D[17:0] and D[35:27] remains unaltered.
–
During the data portion of a write sequence, only the byte (D[35:27]) is written into
the device. D[26:0] remains unaltered.
L–H During the data portion of a write sequence, only the byte (D[35:27]) is written into
the device. D[26:0] remains unaltered.
–
No data is written into the device during this portion of a write operation.
L–H No data is written into the device during this portion of a write operation.
Notes
9. X = “Don’t Care,” H = Logic HIGH, L = Logic LOW, represents rising edge.
10. Is based on a write cycle that was initiated in accordance with the Write Cycle Descriptions table. BWS0, BWS1, BWS2, and BWS3 can be altered on different portions
of a write cycle, as long as the setup and hold requirements are achieved.
Document Number: 001-07160 Rev. *J
Page 11 of 29
[+] Feedback
CY7C1318CV18, CY7C1320CV18
IEEE 1149.1 Serial Boundary Scan (JTAG)
These SRAMs incorporate a serial boundary scan Test Access
Port (TAP) in the FBGA package. This part is fully compliant with
IEEE Standard #1149.1-2001. The TAP operates using JEDEC
standard 1.8 V I/O logic levels.
Disabling the JTAG Feature
It is possible to operate the SRAM without using the JTAG
feature. To disable the TAP controller, TCK must be tied LOW
(VSS) to prevent clocking of the device. TDI and TMS are
internally pulled up and may be unconnected. They may
alternatively be connected to VDD through a pull up resistor. TDO
must be left unconnected. Upon power up, the device comes up
in a reset state, which does not interfere with the operation of the
device.
Test Access Port—Test Clock
The test clock is used only with the TAP controller. All inputs are
captured on the rising edge of TCK. All outputs are driven from
the falling edge of TCK.
Test Mode Select (TMS)
The TMS input is used to give commands to the TAP controller
and is sampled on the rising edge of TCK. This pin may be left
unconnected if the TAP is not used. The pin is pulled up internally, resulting in a logic HIGH level.
Test Data-In (TDI)
The TDI pin is used to serially input information into the registers
and can be connected to the input of any of the registers. The
register between TDI and TDO is chosen by the instruction that
is loaded into the TAP instruction register. For information on
loading the instruction register, see the “TAP Controller State
Diagram” on page 14. TDI is internally pulled up and can be
unconnected if the TAP is unused in an application. TDI is
connected to the most significant bit (MSB) on any register.
Test Data-Out (TDO)
The TDO output pin is used to serially clock data out from the
registers. The output is active, depending upon the current state
of the TAP state machine (see “Instruction Codes” on page 17).
The output changes on the falling edge of TCK. TDO is
connected to the least significant bit (LSB) of any register.
Performing a TAP Reset
A Reset is performed by forcing TMS HIGH (VDD) for five rising
edges of TCK. This Reset does not affect the operation of the
SRAM and can be performed while the SRAM is operating. At
power up, the TAP is reset internally to ensure that TDO comes
up in a high Z state.
TAP Registers
Registers are connected between the TDI and TDO pins to scan
the data in and out of the SRAM test circuitry. Only one register
can be selected at a time through the instruction registers. Data
is serially loaded into the TDI pin on the rising edge of TCK. Data
is output on the TDO pin on the falling edge of TCK.
Document Number: 001-07160 Rev. *J
Instruction Register
Three-bit instructions can be serially loaded into the instruction
register. This register is loaded when it is placed between the TDI
and TDO pins, as shown in “TAP Controller Block Diagram” on
page 15. Upon power up, the instruction register is loaded with
the IDCODE instruction. It is also loaded with the IDCODE
instruction if the controller is placed in a reset state, as described
in the previous section.
When the TAP controller is in the Capture-IR state, the two least
significant bits are loaded with a binary “01” pattern to allow for
fault isolation of the board level serial test path.
Bypass Register
To save time when serially shifting data through registers, it is
sometimes advantageous to skip certain chips. The bypass
register is a single-bit register that can be placed between TDI
and TDO pins. This enables shifting of data through the SRAM
with minimal delay. The bypass register is set LOW (VSS) when
the BYPASS instruction is executed.
Boundary Scan Register
The boundary scan register is connected to all of the input and
output pins on the SRAM. Several No Connect (NC) pins are also
included in the scan register to reserve pins for higher density
devices.
The boundary scan register is loaded with the contents of the
RAM input and output ring when the TAP controller is in the
Capture-DR state and is then placed between the TDI and TDO
pins when the controller is moved to the Shift-DR state. The
EXTEST, SAMPLE/PRELOAD, and SAMPLE Z instructions can
be used to capture the contents of the input and output ring.
The “Boundary Scan Order” on page 18 shows the order in which
the bits are connected. Each bit corresponds to one of the bumps
on the SRAM package. The MSB of the register is connected to
TDI, and the LSB is connected to TDO.
Identification (ID) Register
The ID register is loaded with a vendor-specific, 32-bit code
during the Capture-DR state when the IDCODE command is
loaded in the instruction register. The IDCODE is hardwired into
the SRAM and can be shifted out when the TAP controller is in
the Shift-DR state. The ID register has a vendor code and other
information described in “Identification Register Definitions” on
page 17.
TAP Instruction Set
Eight different instructions are possible with the three-bit
instruction register. All combinations are listed in “Instruction
Codes” on page 17. Three of these instructions are listed as
RESERVED and must not be used. The other five instructions
are described in detail below.
Instructions are loaded into the TAP controller during the Shift-IR
state when the instruction register is placed between TDI and
TDO. During this state, instructions are shifted through the
instruction register through the TDI and TDO pins. To execute
the instruction once it is shifted in, the TAP controller must be
moved into the Update-IR state.
Page 12 of 29
[+] Feedback
CY7C1318CV18, CY7C1320CV18
IDCODE
The IDCODE instruction loads a vendor-specific, 32-bit code into
the instruction register. It also places the instruction register
between the TDI and TDO pins and shifts the IDCODE out of the
device when the TAP controller enters the Shift-DR state. The
IDCODE instruction is loaded into the instruction register at
power up or whenever the TAP controller is supplied a
Test-Logic-Reset state.
SAMPLE Z
The SAMPLE Z instruction connects the boundary scan register
between the TDI and TDO pins when the TAP controller is in a
Shift-DR state. The SAMPLE Z command puts the output bus
into a high Z state until the next command is supplied during the
Update IR state.
SAMPLE/PRELOAD
SAMPLE/PRELOAD is a 1149.1 mandatory instruction. When
the SAMPLE/PRELOAD instructions are loaded into the
instruction register and the TAP controller is in the Capture-DR
state, a snapshot of data on the input and output pins is captured
in the boundary scan register.
PRELOAD places an initial data pattern at the latched parallel
outputs of the boundary scan register cells before the selection
of another boundary scan test operation.
The shifting of data for the SAMPLE and PRELOAD phases can
occur concurrently when required, that is, while the data
captured is shifted out, the preloaded data can be shifted in.
BYPASS
When the BYPASS instruction is loaded in the instruction register
and the TAP is placed in a Shift-DR state, the bypass register is
placed between the TDI and TDO pins. The advantage of the
BYPASS instruction is that it shortens the boundary scan path
when multiple devices are connected together on a board.
EXTEST
The EXTEST instruction drives the preloaded data out through
the system output pins. This instruction also connects the
boundary scan register for serial access between the TDI and
TDO in the Shift-DR controller state.
EXTEST OUTPUT BUS TRISTATE
IEEE Standard 1149.1 mandates that the TAP controller be able
to put the output bus into a tristate mode.
The user must be aware that the TAP controller clock can only
operate at a frequency up to 20 MHz, while the SRAM clock
operates more than an order of magnitude faster. Because there
is a large difference in the clock frequencies, it is possible that
during the Capture-DR state, an input or output undergoes a
transition. The TAP may then try to capture a signal while in
transition (metastable state). This does not harm the device, but
there is no guarantee as to the value that is captured.
Repeatable results may not be possible.
The boundary scan register has a special bit located at bit #47.
When this scan cell, called the “extest output bus tristate,” is
latched into the preload register during the Update-DR state in
the TAP controller, it directly controls the state of the output
(Q-bus) pins, when the EXTEST is entered as the current
instruction. When HIGH, it enables the output buffers to drive the
output bus. When LOW, this bit places the output bus into a
high Z condition.
To guarantee that the boundary scan register captures the
correct value of a signal, the SRAM signal must be stabilized
long enough to meet the TAP controller's capture setup plus hold
times (tCS and tCH). The SRAM clock input might not be captured
correctly if there is no way in a design to stop (or slow) the clock
during a SAMPLE/PRELOAD instruction. If this is an issue, it is
still possible to capture all other signals and simply ignore the
value of the CK and CK captured in the boundary scan register.
This bit can be set by entering the SAMPLE/PRELOAD or
EXTEST command, and then shifting the desired bit into that cell,
during the Shift-DR state. During Update-DR, the value loaded
into that shift-register cell latches into the preload register. When
the EXTEST instruction is entered, this bit directly controls the
output Q-bus pins. Note that this bit is pre-set HIGH to enable
the output when the device is powered up, and also when the
TAP controller is in the Test-Logic-Reset state.
Once the data is captured, it is possible to shift out the data by
putting the TAP into the Shift-DR state. This places the boundary
scan register between the TDI and TDO pins.
Reserved
Document Number: 001-07160 Rev. *J
These instructions are not implemented but are reserved for
future use. Do not use these instructions.
Page 13 of 29
[+] Feedback
CY7C1318CV18, CY7C1320CV18
TAP Controller State Diagram
The state diagram for the TAP controller follows.[11]
1
TEST-LOGIC
RESET
0
0
TEST-LOGIC/
IDLE
1
SELECT
DR-SCAN
1
1
SELECT
IR-SCAN
0
0
1
1
CAPTURE-DR
CAPTURE-IR
0
0
SHIFT-DR
0
SHIFT-IR
1
1
EXIT1-DR
1
EXIT1-IR
0
0
PAUSE-IR
1
0
1
EXIT2-DR
0
EXIT2-IR
1
1
UPDATE-IR
UPDATE-DR
1
1
0
PAUSE-DR
0
0
0
1
0
Note
11. The 0/1 next to each state represents the value at TMS at the rising edge of TCK.
Document Number: 001-07160 Rev. *J
Page 14 of 29
[+] Feedback
CY7C1318CV18, CY7C1320CV18
TAP Controller Block Diagram
0
Bypass Register
2
Selection
Circuitry
TDI
1
0
Selection
Circuitry
Instruction Register
31
30
29
.
.
2
1
0
1
0
TDO
Identification Register
106
.
.
.
.
2
Boundary Scan Register
TCK
TAP Controller
TMS
TAP Electrical Characteristics
Over the Operating Range[12, 13, 14]
Parameter
Description
Test Conditions
Min
Max
Unit
VOH1
Output HIGH voltage
IOH =2.0 mA
1.4
–
V
VOH2
Output HIGH voltage
IOH =100 A
1.6
–
V
VOL1
Output LOW voltage
IOL = 2.0 mA
–
0.4
V
VOL2
Output LOW voltage
IOL = 100 A
–
0.2
V
VIH
Input HIGH voltage
VIL
Input LOW voltage
IX
Input and output load current
0.65 VDD VDD + 0.3
GND  VI  VDD
V
–0.3
0.35 VDD
V
–5
5
A
Notes
12. These characteristics pertain to the TAP inputs (TMS, TCK, TDI and TDO). Parallel load levels are specified in the Electrical Characteristics Table.
13. Overshoot: VIH(AC) < VDDQ + 0.85 V (Pulse width less than tCYC/2), Undershoot: VIL(AC) > 1.5 V (Pulse width less than tCYC/2).
14. All Voltage referenced to Ground.
Document Number: 001-07160 Rev. *J
Page 15 of 29
[+] Feedback
CY7C1318CV18, CY7C1320CV18
TAP AC Switching Characteristics
Over the Operating Range[15, 16]
Parameter
Description
Min
Max
Unit
50
–
ns
TCK clock frequency
–
20
MHz
TCK clock HIGH
20
–
ns
TCK clock LOW
20
–
ns
tTCYC
TCK clock cycle time
tTF
tTH
tTL
Setup Times
tTMSS
TMS setup to TCK clock rise
5
–
ns
tTDIS
TDI setup to TCK clock rise
5
–
ns
tCS
Capture setup to TCK rise
5
–
ns
Hold Times
tTMSH
TMS hold after TCK clock rise
5
–
ns
tTDIH
TDI hold after clock rise
5
–
ns
tCH
Capture hold after clock rise
5
–
ns
Output Times
tTDOV
TCK clock LOW to TDO valid
–
10
ns
tTDOX
TCK clock LOW to TDO invalid
0
–
ns
TAP Timing and Test Conditions
Figure 2 shows the TAP timing and test conditions.[16]
Figure 2. TAP Timing and Test Conditions
0.9 V
ALL INPUT PULSES
1.8 V
0.9 V
50
TDO
0V
Z0 = 50
(a)
CL = 20 pF
tTH
GND
tTL
Test Clock
TCK
tTCYC
tTMSH
tTMSS
Test Mode Select
TMS
tTDIS
tTDIH
Test Data In
TDI
Test Data Out
TDO
tTDOV
tTDOX
Notes
15. tCS and tCH refer to the setup and hold time requirements of latching data from the boundary scan register.
16. Test conditions are specified using the load in TAP AC Test Conditions. tR/tF = 1 ns.
Document Number: 001-07160 Rev. *J
Page 16 of 29
[+] Feedback
CY7C1318CV18, CY7C1320CV18
Identification Register Definitions
Value
Instruction Field
Description
CY7C1318CV18
CY7C1320CV18
000
000
Cypress device ID (28:12)
11010100010010101
11010100010100101
Cypress JEDEC ID (11:1)
00000110100
00000110100
Allows unique identification of
SRAM vendor.
1
1
Indicates the presence of an
ID register.
Revision number (31:29)
ID register presence (0)
Version number.
Defines the type of SRAM.
Scan Register Sizes
Register Name
Bit Size
Instruction
3
Bypass
1
ID
32
Boundary Scan
107
Instruction Codes
Instruction
Code
Description
EXTEST
000
Captures the input and output ring contents.
IDCODE
001
Loads the ID register with the vendor ID code and places the register between TDI and TDO.
This operation does not affect SRAM operation.
SAMPLE Z
010
Captures the input and output contents. Places the boundary scan register between TDI and
TDO. Forces all SRAM output drivers to a high Z state.
RESERVED
011
Do Not Use: This instruction is reserved for future use.
SAMPLE/PRELOAD
100
Captures the input and output ring contents. Places the boundary scan register between TDI
and TDO. Does not affect the SRAM operation.
RESERVED
101
Do Not Use: This instruction is reserved for future use.
RESERVED
110
Do Not Use: This instruction is reserved for future use.
BYPASS
111
Places the bypass register between TDI and TDO. This operation does not affect SRAM
operation.
Document Number: 001-07160 Rev. *J
Page 17 of 29
[+] Feedback
CY7C1318CV18, CY7C1320CV18
Boundary Scan Order
Bit #
Bump ID
Bit #
Bump ID
Bit #
Bump ID
Bit #
Bump ID
0
6R
28
10G
56
6A
84
2J
1
6P
29
9G
57
5B
85
3K
2
6N
30
11F
58
5A
86
3J
3
7P
31
11G
59
4A
87
2K
4
7N
32
9F
60
5C
88
1K
5
7R
33
10F
61
4B
89
2L
6
8R
34
11E
62
3A
90
3L
7
8P
35
10E
63
1H
91
1M
8
9R
36
10D
64
1A
92
1L
9
11P
37
9E
65
2B
93
3N
10
10P
38
10C
66
3B
94
3M
11
10N
39
11D
67
1C
95
1N
12
9P
40
9C
68
1B
96
2M
13
10M
41
9D
69
3D
97
3P
14
11N
42
11B
70
3C
98
2N
15
9M
43
11C
71
1D
99
2P
16
9N
44
9B
72
2C
100
1P
17
11L
45
10B
73
3E
101
3R
18
11M
46
11A
74
2D
102
4R
19
9L
47
Internal
75
2E
103
4P
20
10L
48
9A
76
1E
104
5P
21
11K
49
8B
77
2F
105
5N
22
10K
50
7C
78
3F
106
5R
23
9J
51
6C
79
1G
24
9K
52
8A
80
1F
25
10J
53
7A
81
3G
26
11J
54
7B
82
2G
27
11H
55
6B
83
1J
Document Number: 001-07160 Rev. *J
Page 18 of 29
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CY7C1318CV18, CY7C1320CV18
Power Up Sequence in DDR II SRAM
DLL Constraints
DDR II SRAMs must be powered up and initialized in a
predefined manner to prevent undefined operations.
■
DLL uses K clock as its synchronizing input. The input must
have low phase jitter, which is specified as tKC Var.
■
The DLL functions at frequencies down to 120 MHz.
■
If the input clock is unstable and the DLL is enabled, then the
DLL may lock onto an incorrect frequency, causing unstable
SRAM behavior. To avoid this, provide1024 cycles stable clock
to relock to the desired clock frequency.
Power Up Sequence
■
Apply power and drive DOFF either HIGH or LOW (all other
inputs can be HIGH or LOW).
❐ Apply VDD before VDDQ.
❐ Apply VDDQ before VREF or at the same time as VREF.
❐ Drive DOFF HIGH.
■
Provide stable DOFF (HIGH), power, and clock (K, K) for 1024
cycles to lock the DLL.
~
~
Figure 3. Power Up Waveforms
K
K
~
~
Unstable Clock
> 1024 Stable clock
Start Normal
Operation
Clock Start (Clock Starts after V DD / V DDQ Stable)
VDD / VDDQ
DOFF
Document Number: 001-07160 Rev. *J
V DD / V DDQ Stable (< +/- 0.1V DC per 50ns )
Fix High (or tie to VDDQ)
Page 19 of 29
[+] Feedback
CY7C1318CV18, CY7C1320CV18
Maximum Ratings
Neutron Soft Error Immunity
Exceeding maximum ratings may impair the useful life of the
device. These user guidelines are not tested.
Parameter
Storage temperature ................................ –65 °C to +150 °C
LSBU
Logical
single-bit
upsets
25 °C
LMBU
Logical
multi-bit
upsets
Single event
latch up
Ambient temperature with power applied . –55 °C to +125 °C
Supply voltage on VDD relative to GND ........–0.5 V to +2.9 V
Supply voltage on VDDQ relative to GND....... –0.5 V to +VDD
DC applied to outputs in high Z .........–0.5 V to VDDQ + 0.3 V
DC input voltage[17] ............................. –0.5 V to VDD + 0.3 V
Current into outputs (LOW) ......................................... 20 mA
Static discharge voltage (MIL-STD-883, M 3015)... > 2001 V
Latch up current..................................................... > 200 mA
SEL
Description
Test
Conditions Typ
Max*
Unit
320
368
FIT/
Mb
25 °C
0
0.01
FIT/
Mb
85 °C
0
0.1
FIT/
Dev
* No LMBU or SEL events occurred during testing; this column represents a
statistical 2, 95% confidence limit calculation. For more details refer to
Application Note AN 54908 “Accelerated Neutron SER Testing and Calculation
of Terrestrial Failure Rates”
Operating Range
Range
Commercial
Industrial
Ambient
Temperature (TA)
VDD[18]
VDDQ[18]
0 °C to +70 °C
1.8 ± 0.1 V
1.4 V to
VDD
–40 °C to +85 °C
Electrical Characteristics
DC Electrical Characteristics
Over the Operating Range[19]
Parameter
VDD
VDDQ
VOH
VOL
VOH(LOW)
VOL(LOW)
VIH
VIL
IX
IOZ
VREF
IDD[23]
Description
Power supply voltage
I/O supply voltage
Output HIGH voltage
Output LOW voltage
Output HIGH voltage
Output LOW voltage
Input HIGH voltage
Input LOW voltage
Input leakage current
Output leakage current
Input reference voltage[22]
VDD operating supply
Test Conditions
Note 20
Note 21
IOH =0.1 mA, nominal impedance
IOL = 0.1 mA, nominal impedance
GND  VI  VDDQ
GND  VI  VDDQ, output disabled
Typical Value = 0.75 V
VDD = Max,
267 MHz (×18)
IOUT = 0 mA,
(×36)
f = fMAX = 1/tCYC
250 MHz (×18)
(×36)
200 MHz (×18)
(×36)
167 MHz (×18)
(×36)
Min
Typ
Max
Unit
1.7
1.8
1.9
V
1.4
1.5
VDD
V
VDDQ/2 – 0.12
–
VDDQ/2 + 0.12 V
VDDQ/2 – 0.12
–
VDDQ/2 + 0.12 V
VDDQ – 0.2
–
VDDQ
V
VSS
–
0.2
V
VREF + 0.1
–
VDDQ + 0.3
V
–0.3
–
VREF – 0.1
V
5
–
5
A
5
–
5
A
0.68
0.75
0.95
V
–
–
805
mA
–
–
855
–
–
730
–
–
775
–
–
600
–
–
635
–
–
510
–
–
540
Notes
17. Overshoot: VIH(AC) < VDDQ + 0.85 V (Pulse width less than tCYC/2), Undershoot: VIL(AC) > 1.5 V (Pulse width less than tCYC/2).
18. Power up: assumes a linear ramp from 0 V to VDD(min) within 200 ms. During this time VIH < VDD and VDDQ < VDD.
19. All Voltage referenced to Ground.
20. Outputs are impedance controlled. IOH = –(VDDQ/2)/(RQ/5) for values of 175  < RQ < 350 .
21. Outputs are impedance controlled. IOL = (VDDQ/2)/(RQ/5) for values of 175  < RQ < 350 .
22. VREF(min) = 0.68 V or 0.46 VDDQ, whichever is larger, VREF(max) = 0.95 V or 0.54 VDDQ, whichever is smaller.
23. The operation current is calculated with 50% read cycle and 50% write cycle.
Document Number: 001-07160 Rev. *J
Page 20 of 29
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CY7C1318CV18, CY7C1320CV18
Electrical Characteristics
(continued)
DC Electrical Characteristics
Over the Operating Range[19]
Parameter
Description
ISB1
Automatic power down
current
Test Conditions
Max VDD,
267 MHz
Both Ports Deselected,
VIN  VIH or VIN  VIL
250 MHz
f = fMAX = 1/tCYC,
Inputs Static
200 MHz
Min
–
–
–
–
–
–
–
–
Typ
–
–
–
–
–
–
–
–
Max
315
330
300
320
290
300
285
295
Unit
mA
Min
VREF + 0.2
–
Typ
–
–
Max
–
VREF – 0.2
Unit
V
V
Max
5
6
7
Unit
pF
pF
pF
165 FBGA
Package
18.7
Unit
°C/W
4.5
°C/W
(×18)
(×36)
(×18)
(×36)
(×18)
(×36)
167 MHz (×18)
(×36)
AC Electrical Characteristics
Over the Operating Range[24]
Parameter
Description
VIH
Input HIGH voltage
Input LOW voltage
VIL
Test Conditions
Capacitance
Tested initially and after any design or process change that may affect these parameters.
Parameter
Description
CIN
Input capacitance
Clock input capacitance
CCLK
Output capacitance
CO
Test Conditions
TA = 25 C, f = 1 MHz, VDD = 1.8 V, VDDQ = 1.5 V
Thermal Resistance
Tested initially and after any design or process change that may affect these parameters.
Parameter
JA
JC
Description
Test Conditions
Thermal resistance
(Junction to ambient)
Thermal resistance
(Junction to case)
Test conditions follow standard test methods and procedures for
measuring thermal impedance, in accordance with EIA/JESD51.
Figure 4. AC Test Loads and Waveforms
VREF = 0.75 V
VREF
0.75 V
VREF
OUTPUT
Z0 = 50 
Device
Under
Test
ZQ
RL = 50 
VREF = 0.75 V
R = 50
ALL INPUT PULSES
1.25 V
0.75 V
OUTPUT
Device
Under
Test ZQ
RQ =
250 
(a)
0.75 V
INCLUDING
JIG AND
SCOPE
5 pF
[25]
0.25 V
Slew Rate = 2 V/ns
RQ =
250 
(b)
Note
24. Overshoot: VIH(AC) < VDDQ + 0.85 V (Pulse width less than tCYC/2), Undershoot: VIL(AC) > 1.5 V (Pulse width less than tCYC/2).
25. Unless otherwise noted, test conditions assume signal transition time of 2 V/ns, timing reference levels of 0.75 V, VREF = 0.75 V, RQ = 250 , VDDQ = 1.5 V, input pulse
levels of 0.25 V to 1.25 V, and output loading of the specified IOL/IOH and load capacitance shown in (a) of AC Test Loads and Waveforms.
Document Number: 001-07160 Rev. *J
Page 21 of 29
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CY7C1318CV18, CY7C1320CV18
Switching Characteristics
Over the Operating Range[26, 27]
Cypress Consortium
Parameter Parameter
Description
VDD(Typical) to the first access [28]
tPOWER
267 MHz
250 MHz
200 MHz
167 MHz
Min Max Min Max Min Max Min Max
Unit
1
–
1
–
1
–
1
–
ms
tCYC
tKHKH
K clock and C clock cycle time
3.75
8.4
4.0
8.4
5.0
8.4
6.0
8.4
ns
tKH
tKHKL
Input clock (K/K and C/C) HIGH
1.5
–
1.6
–
2.0
–
2.4
–
ns
tKL
tKLKH
Input clock (K/K and C/C) LOW
1.5
–
1.6
–
2.0
–
2.4
–
ns
tKHKH
tKHKH
K clock Rise to K clock rise and C to C rise (rising 1.68
edge to rising edge)
–
1.8
–
2.2
–
2.7
–
ns
tKHCH
tKHCH
K/K clock rise t o C/C clock rise
(rising edge to rising edge)
0.00 1.68 0.00
1.8
0.00
2.2
0.00
2.7
ns
Setup Times
tSA
tAVKH
Address setup to K clock rise
0.3
–
0.5
–
0.6
–
0.7
–
ns
tSC
tIVKH
Control setup to K clock rise (LD, R/W)
0.3
–
0.5
–
0.6
–
0.7
–
ns
tSCDDR
tIVKH
Double data rate control setup to clock (K/K) rise
(BWS0, BWS1, BWS2, BWS3)
0.3
–
0.35
–
0.4
–
0.5
–
ns
tSD
tDVKH
D[X:0] setup to clock (K and K) rise
0.3
–
0.35
–
0.4
–
0.5
–
ns
Hold Times
tHA
tKHAX
Address hold after K clock rise
0.3
–
0.5
–
0.6
–
0.7
–
ns
tHC
tKHIX
Control hold after K clock rise (LD, R/W)
0.3
–
0.5
–
0.6
–
0.7
–
ns
tHCDDR
tKHIX
Double data rate control hold after clock (K/K)
Rise (BWS0, BWS1, BWS2, BWS3)
0.3
–
0.35
–
0.4
–
0.5
–
ns
tHD
tKHDX
D[X:0] hold after clock (K/K) rise
0.3
–
0.35
–
0.4
–
0.5
–
ns
Notes
26. Unless otherwise noted, test conditions assume signal transition time of 2 V/ns, timing reference levels of 0.75 V, VREF = 0.75 V, RQ = 250 , VDDQ = 1.5 V, input pulse
levels of 0.25 V to 1.25 V, and output loading of the specified IOL/IOH and load capacitance shown in (a) of AC Test Loads and Waveforms.
27. When a part with a maximum frequency above 167 MHz is operating at a lower clock frequency, it requires the input timings of the frequency range in which it is being
operated and outputs data with the output timings of that frequency range.
28. This part has an internal voltage regulator; tPOWER is the time that the power is supplied above VDD minimum initially before a read or write operation can be initiated.
Document Number: 001-07160 Rev. *J
Page 22 of 29
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CY7C1318CV18, CY7C1320CV18
Switching Characteristics (continued)
Over the Operating Range[26, 27]
Cypress Consortium
Parameter Parameter
Description
267 MHz
250 MHz
200 MHz
167 MHz
Min Max Min Max Min Max Min Max
Unit
Output Times
tCO
tCHQV
C/C clock rise (or K/K in single clock mode) to
data valid
tDOH
tCHQX
Data output hold after output C/C clock rise
(active to active)
tCCQO
tCHCQV
C/C clock rise to echo clock valid
tCQOH
tCHCQX
Echo clock hold after C/C clock rise
tCQD
tCQHQV
Echo clock high to data valid
tCQDOH
tCQHQX
Echo clock high to data invalid
HIGH[29]
tCQH
tCQHCQL
Output clock (CQ/CQ)
tCQHCQH
tCQHCQH
CQ clock rise to CQ clock rise
(rising edge to rising edge)[29]
tCHZ
tCHQZ
Clock (C/C) rise to high Z
(Active to high Z)[30, 31]
tCLZ
tCHQX1
Clock (C/C) rise to low Z[30, 31]
–
0.45
–
0.45
–
0.45
–
0.50
ns
–0.45
–
–0.45
–
–0.45
–
–0.50
–
ns
–
0.45
–
0.45
–
0.45
–
0.50
ns
–0.45
–
–0.45
–
–0.45
–
–0.50
–
ns
–
0.27
–
0.30
–
0.35
–
0.40
ns
–0.27
–
–0.30
–
–0.35
–
–0.40
–
ns
1.43
–
1.55
–
1.95
–
2.45
–
ns
1.43
–
1.55
–
1.95
–
2.45
–
ns
–
0.45
–
0.45
–
0.45
–
0.50
ns
–0.45
–
–0.45
–
–0.45
–
–0.50
–
ns
–
0.20
–
0.20
–
0.20
–
0.20
ns
DLL Timing
tKC Var
tKC Var
Clock phase jitter
tKC lock
tKC lock
DLL lock time (K, C)
1024
–
1024
–
1024
–
1024
–
Cycles
tKC Reset
tKC Reset
K static to DLL reset
30
–
30
–
30
–
30
–
ns
Notes
29. These parameters are extrapolated from the input timing parameters (tKHKH - 250 ps, where 250 ps is the internal jitter. An input jitter of 200 ps (tKC Var) is already
included in the tKHKH). These parameters are only guaranteed by design and are not tested in production.
30. tCHZ, tCLZ are specified with a load capacitance of 5 pF as in (b) of AC Test Loads and Waveforms. Transition is measured 100 mV from steady-state voltage.
31. At any voltage and temperature tCHZ is less than tCLZ and tCHZ less than tCO.
Document Number: 001-07160 Rev. *J
Page 23 of 29
[+] Feedback
CY7C1318CV18, CY7C1320CV18
Switching Waveforms
Figure 5. Read/Write/Deselect Sequence[32, 33, 34]
READ
2
NOP
1
READ
3
NOP
4
NOP
5
WRITE
6
WRITE
7
READ
8
A3
A4
9
10
K
tKH
tKL
tKHKH
tCYC
K
LD
tSC tHC
R/W
A
A0
tSA
A2
A1
tHD
tHA
tHD
tSD
DQ
Q00
t KHCH
t CLZ
Q01
Q10
Q11
tSD
D20
D21
D30
D31
Q40
Q41
t CQDOH
t CHZ
tDOH
tCO
t CQD
C
t KHCH
tKH
tKL
tCYC
tKHKH
C#
tCQOH
tCCQO
CQ
tCQOH
tCCQO
tCQH
tCQHCQH
CQ#
DON’T CARE
UNDEFINED
Notes
32. Q00 refers to output from address A0. Q01 refers to output from the next internal burst address following A0, that is, A0 + 1.
33. Outputs are disabled (high Z) one clock cycle after a NOP.
34. In this example, if address A4 = A3, then data Q40 = D30 and Q41 = D31. Write data is forwarded immediately as read results. This note applies to the whole diagram.
Document Number: 001-07160 Rev. *J
Page 24 of 29
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CY7C1318CV18, CY7C1320CV18
Ordering Information
Cypress offers other versions of this type of product in many different configurations and features. The following table contains only
the list of parts that are currently available.
For a complete listing of all options, visit the Cypress website at www.cypress.com and refer to the product summary page at
http://www.cypress.com/products or contact your local sales representative.
Cypress maintains a worldwide network of offices, solution centers, manufacturer's representatives and distributors. To find the office
closest to you, visit us at http://www.cypress.com/go/datasheet/offices.
Speed
(MHz)
Ordering Code
Package
Diagram
Package Type
Operating
Range
267
CY7C1320CV18-267BZXC
51-85180 165-ball FPBGA (13 × 15 × 1.4 mm) Pb-free
Commercial
250
CY7C1318CV18-250BZXC
51-85180 165-ball FPBGA (13 × 15 × 1.4 mm) Pb-free
Commercial
CY7C1320CV18-250BZXC
200
CY7C1318CV18-250BZI
51-85180 165-ball FPBGA (13 × 15 × 1.4 mm)
CY7C1318CV18-200BZXC
51-85180 165-ball FPBGA (13 × 15 × 1.4 mm) Pb-free
CY7C1318CV18-200BZI
51-85180 165-ball FPBGA (13 × 15 × 1.4 mm)
Industrial
Commercial
Industrial
Ordering Code Definitions
CY 7C 13XX C V18 - XXX XXX X
Temperature Range: X = C or I
C = Commercial; I = Industrial
Package Type: XXX = BZX or BZ
BZX = 165-ball FPBGA (Pb-free)
BZ = 165-ball FPBGA
Frequency Range: XXX = 267 MHz or 250 MHz or 200 MHz
Voltage: 1.8 V
Die Revision: C = 90nm, errata fix (PCN061213)
Part Identifier:
13XX = 1320 or 1318 = 18-Mbit DDR II SRAM 2-Word Burst Architecture
Marketing Code : 7C = SRAM
Company ID: CY = Cypress
Document Number: 001-07160 Rev. *J
Page 25 of 29
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CY7C1318CV18, CY7C1320CV18
Package Diagram
Figure 6. 165-ball FBGA (13 × 15 × 1.4 mm), 51-85180
51-85180 *C
Document Number: 001-07160 Rev. *J
Page 26 of 29
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CY7C1318CV18, CY7C1320CV18
Acronyms
Acronym
Description
DDR
double data rate
DLL
delay lock loop
FPBGA
fine-pitch ball grid array
HSTL
high-speed transceiver logic
JEDEC
Joint Electron Device Engineering Council
JTAG
joint test action group
SRAM
static random access memory
SEL
single event latch up
TDO
test data out
TCK
test clock
TDI
test data in
TMS
test mode select
TAP
test access port
Document Conventions
Units of Measure
Symbol
Unit of Measure
ns
nano seconds
V
Volts
µA
micro Amperes
mA
milli Amperes
mm
milli meter
ms
milli seconds
MHz
Mega Hertz
pF
pico Farad
W
Watts
k
kilo ohms

ohms
°C
degree Celcius
Document Number: 001-07160 Rev. *J
Page 27 of 29
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CY7C1318CV18, CY7C1320CV18
Document History Page
Document Title: CY7C1318CV18/CY7C1320CV18, 18-Mbit DDR II SRAM 2-Word Burst Architecture
Document Number: 001-07160
Rev. ECN No.
Submission
Date
Orig. of
Change
Description of Change
**
433284
See ECN
NXR
New data sheet
*A
462615
See ECN
NXR
Changed tTH and tTL from 40 ns to 20 ns, changed tTMSS, tTDIS, tCS, tTMSH, tTDIH, tCH
from 10 ns to 5 ns and changed tTDOV from 20 ns to 10 ns in TAP AC Switching
Characteristics table
Modified Power-Up waveform
*B
503690
See ECN
VKN
Minor change: Moved data sheet to web
*C
1523383
See ECN
VKN/AESA
Converted from preliminary to final
Updated Logic Block diagram
Removed 300 MHz and 278 MHz speed bins
Added 267 MHz speed bin
Updated IDD/ISB specs
Changed DLL minimum operating frequency from 80MHz to 120MHz
Changed tCYC max spec to 8.4ns
Modified footnotes 20 and 28
*D
2507747
See ECN
VKN/PYRS
Changed Ambient Temperature with Power Applied from “–10 C to +85 C” to
“–55 C to +125 C” in the “Maximum Ratings“ on page 20
Updated power up sequence waveform and its description
Added footnote #19 related to IDD
Changed JA spec from 28.51 to 18.7; Changed JC spec from 5.91 to 4.5
See ECN
NXR/PYRS Changed JTAG ID (31:29) from 001 to 000
*E
2518624
*F
2755838
08/25/2009
VKN/AESA
Removed x8 and x9 part number details
Included Soft Error Immunity Data
Modified Ordering Information table by including parts that are available and modified
the disclaimer for the Ordering information.
*G
2896382
04/09/2010
NJY
Removed obsolete part numbers from Ordering Information. Updated package
diagram, Sales, Solutions, and Legal Information section, and data sheet template.
Removed pruned part CY7C1320CV18-200BZC.
*H
2957481
06/21/2010
VKN
Included “CY7C1318CV18-250BZI” in Ordering Information
Added Ordering Code Definitions
*I
3096143
11/27/2010
NJY
Added Units of Measure.
Minor edits.
*J
3160521
02/02/2011
NJY
Updated Ordering Information.
Document Number: 001-07160 Rev. *J
Page 28 of 29
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CY7C1318CV18, CY7C1320CV18
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
closest to you, visit us at Cypress Locations.
Products
Automotive
Clocks & Buffers
Interface
Lighting & Power Control
PSoC Solutions
cypress.com/go/automotive
cypress.com/go/clocks
psoc.cypress.com/solutions
cypress.com/go/interface
PSoC 1 | PSoC 3 | PSoC 5
cypress.com/go/powerpsoc
cypress.com/go/plc
Memory
Optical & Image Sensing
cypress.com/go/memory
cypress.com/go/image
PSoC
Touch Sensing
cypress.com/go/psoc
cypress.com/go/touch
USB Controllers
Wireless/RF
cypress.com/go/USB
cypress.com/go/wireless
© Cypress Semiconductor Corporation, 2006-2011. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 001-07160 Rev. *J
Revised February 2, 2011
Page 29 of 29
QDR RAMs and Quad Data Rate RAMs comprise a new family of products developed by Cypress, IDT, NEC, Renesas, and Samsung. All product and company names mentioned in this document
are the trademarks of their respective holders.
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