AH3 High Dynamic Range Gain Block Applications • • • 3G / 4G Mobile Infrastructure CDMA, WCDMA, LTE IF Applications SOT-89 Package Product Features • • • • • • • • • Functional Block Diagram 50 – 870 MHz +41 dBm OIP3 3 dB Noise Figure 13 dB Gain +20 dBm P1dB Internally matched Single +5 V Supply MTTF > 100 Years Lead-free/Green/RoHS-compliant SOT-89 Package GND 4 General Description 1 2 3 RF IN GND RF OUT Pin Configuration The AH3 is a high dynamic range amplifier in a low-cost surface-mount package. The combination of low noise figure and high output IP3 at the same bias point makes it ideal for receiver and transmitter applications. The device combines dependable performance with superb quality to maintain MTTF values exceeding 100 years at mounting temperatures of +85 °C. The AH3 is available in the environmentally-friendly lead-free/green/RoHS-compliant SOT-89 package. Pin # 1 2 3 4 The broadband amplifier uses a high reliability GaAs MESFET technology and is targeted for applications where high linearity is required. In addition, the AH3 is internally matched for 50 ohms. Symbol RF Input GND RF Output GND Paddle Not Recommended for New Designs Recommended Replacement Part: TQP3M9028 Ordering Information Part No. AH3-G Description High Dynamic Range Amplifier Standard T/R size = 1000 pieces on a 7” reel. Data Sheet: Rev D 06/05/2012 © 2012 TriQuint Semiconductor, Inc. - 1 of 7 - Disclaimer: Subject to change without notic ® Connecting the Digital World to the Global Network AH3 High Dynamic Range Gain Block Specifications Absolute Maximum Ratings Parameter Storage Temperature RF Input Power, CW, 50Ω, T = 25ºC Supply Voltage, Vdd Thermal Resistance (jnc. to case) θjc Recommended Operating Conditions Rating Parameter -55 to +125 oC +10 dBm +6 V 59 oC/W Vdd TJ (for >106 hours MTTF) Operating Temp. Range Min +3 Typ +5 -40 Max Units +5.25 160 +85 V C o C o Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Operation of this device outside the parameter ranges given above may cause permanent damage. Electrical Specifications Test conditions unless otherwise noted: Vdd = +5 V, TLEAD = 25 °C, 800 MHz. Parameter Operational Frequency Range Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 Conditions Min 50 12 See Note 1. Noise Figure Supply Voltage, Vdd Supply Current, Idd +37 120 Typical 800 12.9 10 20 +20 +41 2.9 +5 150 Max 870 14 180 Units MHz MHz dB dB dB dBm dBm dB V mA Notes: 1. 3OIP measured with two tones at an output power of +5 dBm/tone separated by 10 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. Data Sheet: Rev D 06/05/2012 © 2012 TriQuint Semiconductor, Inc. - 2 of 7 - Disclaimer: Subject to change without notic ® Connecting the Digital World to the Global Network AH3 High Dynamic Range Gain Block Device Characterization Data S-Parameter Data Test conditions unless otherwise noted: Vdd = +5 V, TLEAD = 25 °C, calibrated to device leads Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (angle) S22 (dB) S22 (ang) 50 100 150 200 250 300 350 400 450 500 550 600 650 700 750 800 850 900 950 1000 -11.93 -13.21 -13.51 -13.48 -13.55 -14.05 -14.12 -13.53 -13.60 -13.32 -13.11 -12.65 -12.43 -12.10 -11.79 -11.54 -11.28 -10.97 -10.69 -10.53 -33.34 -28.09 -28.85 -32.18 -36.10 -44.73 -48.60 -55.70 -61.16 -65.93 -70.97 -75.78 -80.45 -84.62 -88.75 -93.43 -96.17 -100.66 -104.85 -107.99 14.15 13.95 13.85 13.83 13.81 13.78 13.75 13.70 13.69 13.65 13.60 13.52 13.51 13.46 13.39 13.33 13.26 13.21 13.08 13.04 169.58 170.57 169.10 167.34 164.90 162.57 160.01 157.51 155.04 152.52 150.15 147.48 145.06 142.56 140.08 137.61 135.38 132.61 129.83 127.70 -19.95 -19.98 -19.86 -19.85 -19.87 -19.86 -19.91 -19.92 -19.95 -19.90 -19.85 -19.91 -19.89 -19.87 -19.82 -19.92 -19.84 -20.09 -20.09 -19.92 7.77 2.69 0.25 -1.46 -3.41 -4.62 -5.48 -7.31 -7.85 -10.12 -10.20 -11.07 -12.83 -12.67 -14.15 -14.94 -15.94 -16.96 -19.21 -19.33 -18.60 -20.54 -21.16 -21.23 -20.91 -19.26 -19.07 -19.12 -18.71 -18.67 -18.46 -18.43 -18.29 -18.31 -18.29 -18.18 -18.26 -18.20 -18.35 -17.83 -126.62 -149.57 -160.72 -167.36 -170.48 -177.22 -175.89 -178.33 -179.04 178.55 178.78 177.91 177.33 175.94 176.28 174.92 173.97 174.37 175.02 174.09 Gain vs. Frequency 14 -5 S11, S22 (dB) 12 Gain (dB) Return Loss 0 16 10 8 6 4 S11 S22 -10 -15 -20 2 0 -25 0 200 400 600 800 1000 Frequency (MHz) Data Sheet: Rev D 06/05/2012 © 2012 TriQuint Semiconductor, Inc. 0 200 400 600 800 1000 Frequency (MHz) - 3 of 7 - Disclaimer: Subject to change without notic ® Connecting the Digital World to the Global Network AH3 High Dynamic Range Gain Block Reference Design 50 - 870 MHz (AH3WB-PCB) Bill of Material Ref Des Value Description Manufacturer C1 1000 pF Cap, Chip, 0603, 5%, 50V, X7R various C2 .01 uF Cap, Chip, 0603, 5%, 50V, X7R various L1 12 nH Ind, Chip, 0603, 5% various L2 390 nH Coil Wire-wound, 1008, 5% Coilcraft Q1 High Dynamic Range Block Part Number TriQuint AH3 1008CS-391XJLC Typical Performance 50-800 MHz (AH3WB-PCB) Test conditions unless otherwise noted: Vdd = +5 V, TLEAD = 25 °C Frequency MHz Gain Input Return Loss Output Return Loss Output P1dB OIP3 @ +5 dBm/tone Δf = 10 MHz Noise Figure Idd Vdd 50 dB dB dB dBm dBm dB mA V 13.2 8.4 18.7 +20 +36 6 Gain vs. Frequency 800 13 16 16 +20 +40 3.5 150 +5 12.5 15 15 +20 +41 3.4 Return Loss vs. Frequency 15 0 -5 S11, S22 (dB) 12 Gain (dB) 450 9 6 S11 S22 -10 -15 -20 -25 3 -30 0 50 200 350 500 650 800 0 950 © 2012 TriQuint Semiconductor, Inc. 400 600 800 1000 Millions Frequency (MHz) Data Sheet: Rev D 06/05/2012 200 Frequency (MHz) - 4 of 7 - Disclaimer: Subject to change without notic ® Connecting the Digital World to the Global Network AH3 High Dynamic Range Gain Block Pin Description GND 4 1 2 3 RF IN GND RF OUT Pin Symbol Description 2, 4 GND RF/DC Ground. Ensure good solder attach for optimal RF and thermal performance. 3 RF OUT RF Output. DC supply input. 1 RF IN RF Input. Internally DC grounded. No DC blocking capacitor required. Applications Information PC Board Layout Circuit Board Material: .062” total thickness with a .014” FR-4 top RF layer, 4 layers (other layers added for rigidity), 1 oz copper, 50Ω Microstrip line details: width = .025”. The pad pattern shown has been developed and tested for optimized assembly at TriQuint Semiconductor. The PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful process development is recommended. For further technical information, Refer to http://www.triquint.com/prodserv/more_info/default.aspx?prod_id=AH3 Data Sheet: Rev D 06/05/2012 © 2012 TriQuint Semiconductor, Inc. - 5 of 7 - Disclaimer: Subject to change without notic ® Connecting the Digital World to the Global Network AH3 High Dynamic Range Gain Block Mechanical Information Package Information and Dimensions Lead-free/Green/RoHS-compliant. Package pin plating - NiPdAu. Compatible with lead-free (Tmax=260°C) and lead (Tmax=245 °C) soldering processes. AH3G XXXX-X The AH3-G will be marked with an “AH3G” designator. An alphanumeric lot code (“XXXX-X”) is also marked below the part designator on the top surface of the package Mounting Configuration All dimensions in millimeters(inches) Angles are in degrees Notes: 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. Data Sheet: Rev D 06/05/2012 © 2012 TriQuint Semiconductor, Inc. - 6 of 7 - Disclaimer: Subject to change without notic ® Connecting the Digital World to the Global Network AH3 High Dynamic Range Gain Block Product Compliance Information ESD Information Solderability This part is compliant with EU 2002/95/EC RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment). ESD Rating: Value: Test: Standard: Class1B Passes ≥ 500 to < 1000 V. Human Body Model (HBM) JEDEC Standard JESD22-A114 ESD Rating: Value: Test: Standard: Class IV Passes ≥ 1000 to < 2000 V. Charged Device Model (CDM) JEDEC Standard JESD22-C101 This product also has the following attributes: • Lead Free • Halogen Free (Chlorine, Bromine) • Antimony Free • TBBP-A (C15H12Br402) Free • PFOS Free • SVHC Free MSL Rating The part is rated Moisture Sensitivity Level 1 at 260°C per JEDEC standard J-STD-020. Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: www.triquint.com Email: [email protected] Tel: Fax: +1.503.615.9000 +1.503.615.8902 For technical questions and application information: Email: [email protected] Important Notice The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for TriQuint products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Data Sheet: Rev D 06/05/2012 © 2012 TriQuint Semiconductor, Inc. - 7 of 7 - Disclaimer: Subject to change without notic ® Connecting the Digital World to the Global Network