LIGITEK LHRFDBK9553-R5-TR1 Surface mount led tape and reel Datasheet

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
SURFACE MOUNT LED TAPE AND REEL
Pb
Lead-Free Parts
LHRFDBK9553/R5/TR1
DATA SHEET
DOC. NO : QW0905-LHRFDBK9553/R5/TR1B
REV.
: B
DATE
: 12 - Jul. - 2016
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PART NO. LHRFDBK9553/R5/TR1
Features:
1. Top view LED.
2. white SMT package.
3. Leadframe package with individual 4 pin.
4.Wide viewing angle.
5.Soldering methods:IR reflow soldering.
6.Feature of the device:more light due to higher optical efficiency;extremely
wide viewing angle;ideal for backlighting and coupling in light guide.
Descriptions:
The LHRFDBK9553 SMD has wide viewing angle and optimized light coupling by
inter reflector,The low current requirement makes this device ideal for portable
equipment or any other application where power is at a premium.
Applications:
1. Telecommunication: indicator and backlighting in telephone and fax.
2. Indicators.
3. Switch lights.
Device Selection Guide:
PART NO
LHRFDBK9553/R5/TR1
MATERIAL
COLOR
Emitted
AlGaInP
Red
InGaN
Blue
Lens
Water Clear
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PART NO. LHRFDBK9553/R5/TR1
Package Dimensions
3.5
1.9
3
0.8
2
0.7±0.05
0.8
0.7±0.05
2.7
4
2.2
1
0.7±0.05
0.7±0.05
Soldering Terminal
3.2
HRF
0.8
3-
+2
4+
0.8
-1
DBK
0.8
Note : 1.All dimension are in millimeter tolerance is ±0.2mm unless otherwise noted.
2.Specifications are subject to change without notice.
Recommended Soldering Pad Dimensions
4.9
1.6
1.6
0.85
0.65
0.85
Note : The tolerances unless mentioned is ±0.1mm,Unit=mm.
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PART NO. LHRFDBK9553/R5/TR1
Absolute Maximum Ratings at Ta=25℃
Ratings
Parameter
Symbol
UNIT
HRF
DBK
Forward Current
IF
30
30
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
90
100
mA
Power Dissipation
PD
75
108
mW
Reverse Current @5V
Ir
10
50
μA
Electrostatic Discharge
ESD
2000
500
V
Operating Temperature
Topr
- 40 ~ + 85
℃
Storage Temperature
Tstg
- 40 ~ + 100
℃
Typical Electrical & Optical Characteristics (Ta=25℃)
Items
Luminous Intensity
Dominant Wavelength
Spectral Line Half-Width
Forward Voltage
Viewing Angle
Min.
Typ.
HRF
32
80
----
DBK
80
200
----
HRF
----
630
----
DBK
----
470
----
HRF
----
20
----
DBK
----
30
----
HRF
1.5
----
2.4
DBK
2.8
----
3.6
HRF
----
120
----
DBK
----
120
----
Symbol
Iv
λD
△λ
VF
2θ 1/2
Max. UNIT
CONDITION
mcd
IF=20mA
nm
IF=20mA
nm
IF=20mA
V
IF=20mA
deg
IF=20mA
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2.The luminous intensity data did not including ±15% testing tolerance.
3.The dominant wavelength data did not including ±1nm testing tolerance
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PART NO. LHRFDBK9553/R5/TR1
Luminous Intensity Classification
BIN CODE
HRF
Min.
Max.
N
32
50
P
50
80
Q
80
125
R
125
200
BIN CODE
DBK
Iv(mcd) at 20mA
Iv(mcd) at 20mA
Min.
Max.
Q
80
125
R
125
200
S
200
320
T
320
500
Dominant Wavelength Classification
BIN CODE
DBK
0D
0C
0B
0A
λD(nm) at 20mA
Min.
Max.
465
468
471
474
468
471
474
477
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PART NO. LHRFDBK9553/R5/TR1
Typical Electro-Optical Characteristics Curve
HRF CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.5
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
3.0
2.5
2.0
1.5
1.0
0.5
0
0.1
1.0
1.5
2.0
2.5
3.0
1.0
10
Fig.4 Relative Intensity vs. Temperature
Fig.3 Forward Voltage vs. Temperature
3.0
Relative Intensity@20mA
Normalize@25℃
1.2
Forward Voltage@20mA
Normalize @25℃
1000
Forward Current(mA)
Forward Voltage(V)
1.1
1.0
0.9
0.8
-40
-20
-0
20
40
60
80
100
2.5
2.0
1.5
1.0
0.5
0
-40
-20
-0
20
40
60
80
100
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
100
Fig.6 Directive Radiation
0°
1.0
-30°
30°
-60°
0.5
100% 75% 50%
0
550
600
650
Wavelength (nm)
700
60°
25%
0
25%
50% 75% 100%
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PART NO. LHRFDBK9553/R5/TR1
Typical Electro-Optical Characteristics Curve
DBK CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
0.1
2.5
2.0
1.5
1.0
0.5
0.0
1.0
3.0
2.0
4.0
5.0
1
10
1.2
Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
Fig.3 Forward Voltage vs. Temperature
1.1
1.0
0.9
0.8
-20
20
0
40
60
80
100
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
100
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
Fig.6 Directive Radiation
0°
1.0
-30°
30°
-60°
0.5
0.0
100% 75% 50%
400
450
500
Wavelength (nm)
550
60°
25%
0
25% 50% 75% 100%
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PART NO. LHRFDBK9553/R5/TR1
Carrier Type Dimensions
4.0
2.0
4.0
ψ1.5
2.08
1.75
3.5
8.0
±0.3
5.4
3.66
3.00
Note : The tolerances unless mentioned is ± 0.1mm,Angle ± 0.5. Unit=mm.
‧ Packing Specifications
0.2
0.8
0.6
Aluminum Moist-Proof bag
Label
0.8
0.6
0.2
0.4
0.4
Label
Part No.
Description
Quantity/Reel
LHRFDBK9553/R5/TR1
8.0mm tape,7"reel
2000 PCS
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PART NO. LHRFDBK9553/R5/TR1
Label Explanation
LIGITEK ELECTRONICS CO., LTD.
Pb
PART :
LHRFDBK9553/R5/TR1/A
BIN : Luminous Intensity
LOT :
GS11670205
HUE : Dominant Wavelength
QTY(PCS):
2000
BIN/HUE :
P-R/0B
Reel Dimensions
0.2
0.4
0.8
0.8
0.6
0.2
0.4
0.6
2.0±0.5
178 ±1.5
60.0±1.0
9.0±1.0
ψ13.5±1.0
12.0±1.0
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PART NO. LHRFDBK9553/R5/TR1
Box Explanation
1. 5 BAG / INNER BOX
2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm
H
W
L
3. 10 INNER BOXES / CARTON
4. CARTON SIZE : L X W X H 58cm X 34cm x 35cm
L
W
H
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PART NO. LHRFDBK9553/R5/TR1
Recommended Soldering Conditions
1. Hand Solder
Basic spec is ≦ 320℃ 3 sec one time only.
2 PB-Free Reflow Solder
1~5°C/sec
1~5°C/sec
Preheat
180~200°C
260°C MaX. 10sec.Max
6°C/sec
Above 220°C
60 sec.Max.
120 sec.Max.
Note:
1.Reflow soldering should not be done more than two times.
2.When soldering,do not put stress on the LEDs during heating.
3.After soldering,do not warp the circuit board.
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PART NO. LHRFDBK9553/R5/TR1
Precautions For Use:
Storage time:
1. Calculated shelf life before opening is 12 months at < 30°C and < 90% relative humidity (RH)
2. After bag is opened, devices which will be subjected to reflow soldering or other high
temperature processes must be
a) Assemblied within 168 hours in an environment of ≦ 30°C / 60% RH, or
b) Stored at ambient of 10% RH or less
3. Devices are required baking before assembly if:
a) Humidity Indicator Card reads >10% (for level 2a -5a)
or >60% (for level 2) at ambient temperature 23 ±5°C
b) 2.a) or 2.b) doesn't meet
4. If baking is required, devices should be baked for >24 hours at 60±5°C.Performing baking only once,
and using the baked devices within 72 hours.
Drive Method:
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into
the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series
with the LED.
Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd
current should not be allowed to change by more than 40% of its desired value.
Circuit model A
Circuit model B
LED
LED
(A) Recommended circuit.
(B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
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Page 12/12
PART NO. LHRFDBK9553/R5/TR1
Classification
Test Item
Test Condition
Sample
Size
Operating Life Test
1.Ta=25°C
2.If=20mA
3.t=1000 hrs (-24hrs,+72hrs)
22
High Temperature
Storage Test
1.Ta=100°C±5°C
2.t=1000 hrs (-24hrs,+72hrs)
22
Low Temperature
Storage Test
1.Ta=-40°C±5°C
2.t=1000 hrs (-24hrs,+72hrs)
22
High Temperature
High Humidity
Storage Test
1.Ta=85°C
2.RH=85%
3.t=1000hrs(-24hrs,+72hrs)
22
1.Ta=100°C±5°C ~ -40°C±5°C
20min/ 10sec / 20min
2.total 100 cycles
22
1.100°C±5°C ~ -40°C±5°C
30mins / 5mins / 30mins
2.100 Cyeles
22
Endurance
Test
Thermal Shock Test
Environmental
Test
Temperature
Cycling
IR Reflow
1.T=260°C Max. 10sec.Max.
2. 6 Min
22
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