19-0465; Rev 1; 6/97 KIT ATION EVALU E L B AVAILA +2.7V, Low-Power, 8-Channel, Serial 12-Bit ADCs These devices provide a hard-wired SHDN pin and a software-selectable power-down, and can be programmed to automatically shut down at the end of a conversion. Accessing the serial interface automatically powers up the MAX146/MAX147, and the quick turn-on time allows them to be shut down between all conversions. This technique can cut supply current to under 60µA at reduced sampling rates. The MAX146/MAX147 are available in 20-pin DIP and SSOP packages. For 4-channel versions of these devices, see the MAX1246/MAX1247 data sheet. ____________________________Features ♦ 8-Channel Single-Ended or 4-Channel Differential Inputs ♦ Single-Supply Operation: +2.7V to +3.6V (MAX146) +2.7V to +5.25V (MAX147) ♦ Internal 2.5V Reference (MAX146) ♦ Low Power: 1.2mA (133ksps, 3V supply) 54µA (1ksps, 3V supply) 1µA (power-down mode) ♦ SPI/QSPI/Microwire/TMS320-Compatible 4-Wire Serial Interface ♦ Software-Configurable Unipolar or Bipolar Inputs ♦ 20-Pin DIP/SSOP Packages ______________Ordering Information INL (LSB) PART† TEMP. RANGE MAX146ACPP 0°C to +70°C 20 Plastic DIP ±1/2 MAX146BCPP MAX146ACAP MAX146BCAP 0°C to +70°C 0°C to +70°C 0°C to +70°C 20 Plastic DIP 20 SSOP 20 SSOP ±1 ±1/2 ±1 MAX146BC/D 0°C to +70°C Dice* ±1 PIN-PACKAGE Ordering Information continued at end of data sheet. † Contact factory for availability of alternate surface-mount packages. *Dice are specified at TA = +25°C, DC parameters only. __________Typical Operating Circuit ________________________Applications Portable Data Logging +3V Data Acquisition CH0 Medical Instruments Battery-Powered Instruments Pen Digitizers Process Control 0V TO +2.5V ANALOG INPUTS VDD VDD 0.1µF DGND MAX146 AGND CPU CH7 VREF 4.7µF COM CS SCLK Pin Configuration appears at end of data sheet. DIN REFADJ 0.047µF DOUT I/O SCK (SK) MOSI (SO) MISO (SI) SSTRB SHDN VSS SPI and QSPI are registered trademarks of Motorola, Inc. Microwire is a registered trademark of National Semiconductor Corp. ________________________________________________________________ Maxim Integrated Products 1 For free samples & the latest literature: http://www.maxim-ic.com, or phone 1-800-998-8800 MAX146/MAX147 _______________General Description The MAX146/MAX147 12-bit data-acquisition systems combine an 8-channel multiplexer, high-bandwidth track/hold, and serial interface with high conversion speed and low power consumption. The MAX146 operates from a single +2.7V to +3.6V supply; the MAX147 operates from a single +2.7V to +5.25V supply. Both devices’ analog inputs are software configurable for unipolar/bipolar and single-ended/differential operation. The 4-wire serial interface connects directly to SPI™/ QSPI™ and Microwire™ devices without external logic. A serial strobe output allows direct connection to TMS320family digital signal processors. The MAX146/MAX147 use either the internal clock or an external serial-interface clock to perform successive-approximation analog-todigital conversions. The MAX146 has an internal 2.5V reference, while the MAX147 requires an external reference. Both parts have a reference-buffer amplifier with a ±1.5% voltageadjustment range. MAX146/MAX147 +2.7V, Low-Power, 8-Channel, Serial 12-Bit ADCs ABSOLUTE MAXIMUM RATINGS VDD to AGND, DGND................................................. -0.3V to 6V AGND to DGND ...................................................... -0.3V to 0.3V CH0–CH7, COM to AGND, DGND ............ -0.3V to (VDD + 0.3V) VREF, REFADJ to AGND ........................... -0.3V to (VDD + 0.3V) Digital Inputs to DGND .............................................. -0.3V to 6V Digital Outputs to DGND ........................... -0.3V to (VDD + 0.3V) Digital Output Sink Current .................................................25mA Continuous Power Dissipation (TA = +70°C) Plastic DIP (derate 11.11mW/°C above +70°C) ......... 889mW SSOP (derate 8.00mW/°C above +70°C) ................... 640mW CERDIP (derate 11.11mW/°C above +70°C) .............. 889mW Operating Temperature Ranges MAX146_C_P/MAX147_C_P .............................. 0°C to +70°C MAX146_E_P/MAX147_E_P............................ -40°C to +85°C MAX146_MJP/MAX147_MJP ........................ -55°C to +125°C Storage Temperature Range ............................ -60°C to +150°C Lead Temperature (soldering, 10sec) ............................ +300°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (VDD = +2.7V to +3.6V (MAX146); VDD = +2.7V to +5.25V (MAX147); COM = 0V; fSCLK = 2.0MHz; external clock (50% duty cycle); 15 clocks/conversion cycle (133ksps); MAX146—4.7µF capacitor at VREF pin; MAX147—external reference, VREF = 2.500 V applied to VREF pin; TA = TMIN to TMAX; unless otherwise noted.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DC ACCURACY (Note 1) Resolution 12 Relative Accuracy (Note 2) INL MAX14_A MAX14_B Differential Nonlinearity DNL No missing codes over temperature Bits ±0.5 ±1.0 LSB ±1 LSB MAX14_A ±0.5 ±3 MAX14_B Gain Error (Note 3) ±0.5 ±0.5 ±4 ±4 Gain Temperature Coefficient ±0.25 ppm/°C Channel-to-Channel Offset Matching ±0.25 LSB Offset Error LSB LSB DYNAMIC SPECIFICATIONS (10kHz sine-wave input, 0V to 2.500Vp-p, 133ksps, 2.0MHz external clock, bipolar input mode) Signal-to-Noise + Distortion Ratio SINAD Total Harmonic Distortion THD Spurious-Free Dynamic Range SFDR 70 Up to the 5th harmonic 73 -88 80 dB -80 dB 90 dB Channel-to-Channel Crosstalk 65kHz, 2.500Vp-p (Note 4) -85 dB Small-Signal Bandwidth -3dB rolloff 2.25 MHz 1.0 MHz Full-Power Bandwidth CONVERSION RATE Conversion Time (Note 5) Track/Hold Acquisition Time tCONV Internal clock, SHDN = FLOAT 5.5 7.5 Internal clock, SHDN = VDD 35 65 µs External clock = 2MHz, 12 clocks/conversion 6 1.5 µs tACQ Aperture Delay Aperture Jitter Internal Clock Frequency External Clock Frequency 2 SHDN = FLOAT ns <50 ps 1.8 SHDN = VDD Data transfer only 30 MHz 0.225 0.1 2.0 0 2.0 _______________________________________________________________________________________ MHz +2.7V, Low-Power, 8-Channel, Serial 12-Bit ADCs (VDD = +2.7V to +3.6V (MAX146); VDD = +2.7V to +5.25V (MAX147); COM = 0V; fSCLK = 2.0MHz; external clock (50% duty cycle); 15 clocks/conversion cycle (133ksps); MAX146—4.7µF capacitor at VREF pin; MAX147—external reference, VREF = 2.500 V applied to VREF pin; TA = TMIN to TMAX; unless otherwise noted.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS ANALOG/COM INPUTS Input Voltage Range, SingleEnded and Differential (Note 6) Unipolar, COM = 0V 0 to VREF Bipolar, COM = VREF / 2 ±VREF / 2 Multiplexer Leakage Current On/off leakage current, VCH_ = 0V or VDD V ±0.01 Input Capacitance ±1 16 µA pF INTERNAL REFERENCE (MAX146 only, reference buffer enabled) VREF Output Voltage TA = +25°C 2.480 2.500 VREF Short-Circuit Current VREF Temperature Coefficient Load Regulation (Note 7) Capacitive Bypass at VREF 2.520 V 30 mA MAX146_C ±30 ±50 MAX146_E ±30 ±60 MAX146_M ±30 ±80 0mA to 0.2mA output load 0.35 Internal compensation mode 0 External compensation mode 4.7 Capacitive Bypass at REFADJ mV µF 0.047 REFADJ Adjustment Range ppm/°C µF ±1.5 % EXTERNAL REFERENCE AT VREF (Buffer disabled) VREF Input Voltage Range (Note 8) VREF Input Current VDD + 50mV 1.0 VREF = 2.500V VREF Input Resistance 100 18 Shutdown VREF Input Current 150 25 0.01 µA kΩ 10 VDD 0.5 REFADJ Buffer Disable Threshold V µA V EXTERNAL REFERENCE AT REFADJ Capacitive Bypass at VREF Reference Buffer Gain REFADJ Input Current Internal compensation mode 0 External compensation mode 4.7 µF MAX146 2.06 MAX147 2.00 V/V MAX146 ±50 MAX147 ±10 µA _______________________________________________________________________________________ 3 MAX146/MAX147 ELECTRICAL CHARACTERISTICS (continued) MAX146/MAX147 +2.7V, Low-Power, 8-Channel, Serial 12-Bit ADCs ELECTRICAL CHARACTERISTICS (continued) (VDD = +2.7V to +3.6V (MAX146); VDD = +2.7V to +5.25V (MAX147); COM = 0V; fSCLK = 2.0MHz; external clock (50% duty cycle); 15 clocks/conversion cycle (133ksps); MAX146—4.7µF capacitor at VREF pin; MAX147—external reference, VREF = 2.500 V applied to VREF pin; TA = TMIN to TMAX; unless otherwise noted.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DIGITAL INPUTS (DIN, SCLK, CS, SHDN) DIN, SCLK, CS Input High Voltage VIH DIN, SCLK, CS Input Low Voltage VIL DIN, SCLK, CS Input Hysteresis VDD ≤ 3.6V 2.0 VDD > 3.6V, MAX147 only 3.0 VHYST IIN VIN = 0V or VDD DIN, SCLK, CS Input Capacitance CIN (Note 9) VSH VDD - 0.4 SHDN Input Mid Voltage VSM 1.1 SHDN Input Low Voltage VSL IS VFLT SHDN Maximum Allowed Leakage, Mid Input V ±1 µA 15 pF V ±0.01 SHDN Input High Voltage SHDN Voltage, Floating 0.8 0.2 DIN, SCLK, CS Input Leakage SHDN Input Current V V VDD - 1.1 SHDN = 0V or VDD SHDN = FLOAT V ±4.0 µA VDD / 2 SHDN = FLOAT V 0.4 V ±100 nA DIGITAL OUTPUTS (DOUT, SSTRB) Output Voltage Low VOL Output Voltage High VOH Three-State Leakage Current Three-State Output Capacitance IL COUT ISINK = 5mA 0.4 ISINK = 16mA 0.8 ISOURCE = 0.5mA VDD - 0.5 CS = VDD V V ±0.01 CS = VDD (Note 9) ±10 µA 15 pF POWER REQUIREMENTS Positive Supply Voltage VDD MAX146 2.70 3.60 MAX147 2.70 5.25 Operating mode, full-scale input Positive Supply Current, MAX146 IDD VDD = 3.6V Fast power-down 2.0 30 70 1.2 10 VDD = 5.25V 1.8 2.5 VDD = 3.6V 0.9 1.5 VDD = 5.25V 2.1 15 VDD = 3.6V 1.2 10 Full power-down Positive Supply Current, MAX147 IDD Operating mode, full-scale input Positive Supply Current, MAX147 IDD Full power-down Supply Rejection (Note 10) PSR Full-scale input, external reference = 2.500V, VDD = 2.7V to VDD(MAX) 4 1.2 ±0.3 _______________________________________________________________________________________ V mA µA mA µA µA mV +2.7V, Low-Power, 8-Channel, Serial 12-Bit ADCs (VDD = +2.7V to +3.6V (MAX146); VDD = +2.7V to +5.25V (MAX147); TA = TMIN to TMAX; unless otherwise noted.) PARAMETER SYMBOL Acquisition Time CONDITIONS MIN TYP MAX UNITS tACQ 1.5 µs DIN to SCLK Setup tDS 100 ns DIN to SCLK Hold tDH 0 ns MAX14_ _C/E 20 200 Figure 1 _M MAX14_ 20 240 SCLK Fall to Output Data Valid tDO Figure 1 ns CS Fall to Output Enable tDV Figure 1 240 ns CS Rise to Output Disable tTR Figure 2 240 ns CS to SCLK Rise Setup tCSS 100 ns CS to SCLK Rise Hold tCSH 0 ns SCLK Pulse Width High tCH 200 ns SCLK Pulse Width Low tCL 200 SCLK Fall to SSTRB tSSTRB ns Figure 1 240 ns tSDV External clock mode only, Figure 1 240 ns CS Rise to SSTRB Output Disable tSTR External clock mode only, Figure 2 240 ns SSTRB Rise to SCLK Rise tSCK Internal clock mode only (Note 9) CS Fall to SSTRB Output Enable 0 ns Note 1: Tested at VDD = 2.7V; COM = 0V; unipolar single-ended input mode. Note 2: Relative accuracy is the deviation of the analog value at any code from its theoretical value after the full-scale range has been calibrated. Note 3: MAX146—internal reference, offset nulled; MAX147—external reference (VREF = +2.500V), offset nulled. Note 4: Ground “on” channel; sine wave applied to all “off” channels. Note 5: Conversion time defined as the number of clock cycles multiplied by the clock period; clock has 50% duty cycle. Note 6: The common-mode range for the analog inputs is from AGND to VDD. Note 7: External load should not change during conversion for specified accuracy. Note 8: ADC performance is limited by the converter’s noise floor, typically 300µVp-p. Note 9: Guaranteed by design. Not subject to production testing. Note 10: Measured as |VFS(2.7V) - VFS(VDD, MAX)|. __________________________________________Typical Operating Characteristics (VDD = 3.0V, VREF = 2.500V, fSCLK = 2.0MHz, CLOAD = 20pF, TA = +25°C, unless otherwise noted.) 0.50 0.45 0.40 0.2 0.35 0.1 0.30 0 -0.1 0.50 0.40 MAX146 0.35 0.25 0.20 MAX147 0.25 0.20 0.15 -0.3 0.10 0.10 -0.4 0.05 0.05 0 1024 2048 CODE 3072 4096 0 2.25 MAX146 0.30 -0.2 -0.5 VDD = 2.7V 0.45 INL (LSB) 0.3 INL (LSB) INL (LSB) 0.4 MAX146/47-02 MAX146/47-01 0.5 INTEGRAL NONLINEARITY vs. TEMPERATURE INTEGRAL NONLINEARITY vs. SUPPLY VOLTAGE MAX146/47-03 INTEGRAL NONLINEARITY vs. CODE MAX147 0.15 0 2.75 3.25 4.25 3.75 VDD (V) 4.75 5.25 -60 -20 20 60 100 140 TEMPERATURE (°C) _______________________________________________________________________________________ 5 MAX146/MAX147 TIMING CHARACTERISTICS ____________________________Typical Operating Characteristics (continued) (VDD = 3.0V, VREF = 2.500V, fSCLK = 2.0MHz, CLOAD = 20pF, TA = +25°C, unless otherwise noted.) MAX146 1.25 1.00 CLOAD = 20pF 0.75 2.75 3.25 3.75 4.25 4.75 MAX146/47-06 2.5010 2.0 1.5 2.5005 2.5000 1.0 2.4995 0.5 0 2.25 5.25 3.25 2.75 3.75 4.25 4.75 2.4990 2.25 5.25 2.75 3.25 3.75 4.25 VDD (V) VDD (V) SUPPLY CURRENT vs. TEMPERATURE SHUTDOWN CURRENT vs. TEMPERATURE MAX146 INTERNAL REFERENCE VOLTAGE vs. TEMPERATURE MAX147 VDD = 3.6V 2.499 VDD = 2.7V 1.2 VREF (V) 1.0 2.500 1.6 SHUTDOWN CURRENT (µA) 1.1 2.501 5.25 MAX146/47-09 2.0 MAX146/47-07 MAX146 1.2 0.8 2.498 2.497 2.496 0.4 0.9 2.495 RLOAD = ∞ CODE = 101010100000 -20 20 0 60 100 2.494 -60 140 -20 20 60 100 140 -20 20 60 100 TEMPERATURE (°C) EFFECTIVE NUMBER OF BITS vs. FREQUENCY FFT PLOT VDD = 2.7V fIN = 10kHz fSAMPLE = 133kHz 12.0 MAX146/47-10 20 0 -60 TEMPERATURE (°C) TEMPERATURE (°C) MAX146/47-11 -60 VDD = 2.7V 11.8 -40 ENOB AMPLITUDE (dB) -20 -60 11.6 11.4 -80 11.2 -100 11.0 -120 0 6 4.75 SUPPLY VOLTAGE (V) 1.3 0.8 2.5015 2.5 MAX147 0.50 2.25 2.5020 VREF (V) 1.50 FULL POWER-DOWN 3.0 MAX1247-08 SUPPLY CURRENT (mA) 1.75 CLOAD = 50pF 3.5 MAX146/47-05 RL = ∞ CODE = 101010100000 SHUTDOWN SUPPLY CURRENT (µA) 2.00 MAX146 INTERNAL REFERENCE VOLTAGE vs. SUPPLY VOLTAGE SHUTDOWN SUPPLY CURRENT vs. SUPPLY VOLTAGE MAX146/47-04 SUPPLY CURRENT vs. SUPPLY VOLTAGE SUPPLY CURRENT (mA) MAX146/MAX147 +2.7V, Low-Power, 8-Channel, Serial 12-Bit ADCs 10 20 30 40 50 FREQUENCY (kHz) 60 70 1 10 FREQUENCY (kHz) _______________________________________________________________________________________ 100 140 +2.7V, Low-Power, 8-Channel, Serial 12-Bit ADCs 0.45 0.25 0.20 0.40 0.30 0.25 0.20 0.35 0.30 0.25 0.20 0.15 0.15 0.10 0.10 0.10 0.05 0.05 0.05 0 2.25 2.75 3.75 4.25 VDD (V) 3.25 4.75 0 2.25 5.25 2.75 0.45 0.35 GAIN ERROR (LSB) 0.35 0.20 4.75 0.15 0 2.25 5.25 0.45 0.30 0.25 0.20 0.35 0.30 0.25 0.20 0.10 0.05 0.05 0.15 0 95 0 -55 120 145 TEMPERATURE (˚C) -30 -5 20 45 70 95 TEMPERATURE (˚C) CHANNEL-TO-CHANNEL OFFSET MATCHING vs. SUPPLY VOLTAGE 0.40 0.35 0.30 0.25 0.20 0.15 0.35 0.30 0.25 0.20 0.15 0.10 0.05 3.25 3.75 VDD (V) 4.25 4.75 5.25 120 145 0.40 0.05 2.75 20 45 70 95 TEMPERATURE (˚C) 0.45 0.10 0 2.25 -5 0.50 OFFSET MATCHING (LSB) OFFSET MATCHING (LSB) 0.45 -30 CHANNEL-TO-CHANNEL OFFSET MATCHING vs. TEMPERATURE MAX146/47-18 0.50 -55 120 145 MAX146/47-19 70 5.25 0.40 0.05 45 4.75 0.50 0.10 20 4.25 CHANNEL-TO-CHANNEL GAIN MATCHING vs. TEMPERATURE 0.10 -5 3.75 GAIN ERROR vs. TEMPERATURE 0.15 -30 3.25 VDD (V) 0.15 0 -55 2.75 VDD (V) 0.45 0.40 0.25 4.25 0.50 0.40 0.30 3.75 GAIN MATCHING (LSB) 0.50 3.25 MAX146/47-16 MAX146/47-15 OFFSET vs. TEMPERATURE OFFSET (LSB) 0.45 MAX146/47-17 0.35 0.35 0.50 GAIN MATCHING (LSB) 0.40 GAIN ERROR (LSB) 0.40 0.30 MAX146/47-13 0.45 OFFSET (LSB) 0.50 MAX146/47-12 0.50 CHANNEL-TO-CHANNEL GAIN MATCHING vs. SUPPLY VOLTAGE MAX146/47-14 GAIN ERROR vs. SUPPLY VOLTAGE OFFSET vs. SUPPLY VOLTAGE 0 -55 -30 -5 20 45 70 95 TEMPERATURE (˚C) 120 145 _______________________________________________________________________________________ 7 MAX146/MAX147 ____________________________Typical Operating Characteristics (continued) (VDD = 3.0V, VREF = 2.500V, fSCLK = 2.0MHz, CLOAD = 20pF, TA = +25°C, unless otherwise noted.) MAX146/MAX147 +2.7V, Low-Power, 8-Channel, Serial 12-Bit ADCs ______________________________________________________________Pin Description PIN NAME FUNCTION 1–8 CH0–CH7 9 COM Ground reference for analog inputs. COM sets zero-code voltage in single-ended mode. Must be stable to ±0.5LSB. 10 SHDN Three-Level Shutdown Input. Pulling SHDN low shuts the MAX146/MAX147 down; otherwise, they are fully operational. Pulling SHDN high puts the reference-buffer amplifier in internal compensation mode. Letting SHDN float puts the reference-buffer amplifier in external compensation mode. 11 VREF Reference-Buffer Output/ADC Reference Input. Reference voltage for analog-to-digital conversion. In internal reference mode (MAX146 only), the reference buffer provides a 2.500V nominal output, externally adjustable at REFADJ. In external reference mode, disable the internal buffer by pulling REFADJ to VDD. 12 REFADJ Input to the Reference-Buffer Amplifier. To disable the reference-buffer amplifier, tie REFADJ to VDD. 13 AGND Analog Ground 14 DGND Digital Ground 15 DOUT Serial Data Output. Data is clocked out at SCLK’s falling edge. High impedance when CS is high. 16 SSTRB Serial Strobe Output. In internal clock mode, SSTRB goes low when the MAX146/MAX147 begin the A/D conversion, and goes high when the conversion is finished. In external clock mode, SSTRB pulses high for one clock period before the MSB decision. High impedance when CS is high (external clock mode). 17 DIN Serial Data Input. Data is clocked in at SCLK’s rising edge. 18 CS Active-Low Chip Select. Data will not be clocked into DIN unless CS is low. When CS is high, DOUT is high impedance. 19 SCLK 20 VDD Sampling Analog Inputs Serial Clock Input. Clocks data in and out of serial interface. In external clock mode, SCLK also sets the conversion speed. (Duty cycle must be 40% to 60%.) Positive Supply Voltage VDD DOUT DOUT CLOAD 50pF 6k 8 DOUT DGND b) High-Z to VOL and VOH to VOL Figure 1. Load Circuits for Enable Time 6k 6k CLOAD 50pF DGND a) High-Z to VOH and VOL to VOH VDD DOUT CLOAD 50pF 6k DGND a) VOH to High-Z Figure 2. Load Circuits for Disable Time _______________________________________________________________________________________ CLOAD 50pF DGND b) VOL to High-Z +2.7V, Low-Power, 8-Channel, Serial 12-Bit ADCs The MAX146/MAX147 analog-to-digital converters (ADCs) use a successive-approximation conversion technique and input track/hold (T/H) circuitry to convert an analog signal to a 12-bit digital output. A flexible serial interface provides easy interface to microprocessors (µPs). Figure 3 is a block diagram of the MAX146/ MAX147. Pseudo-Differential Input The sampling architecture of the ADC’s analog comparator is illustrated in the equivalent input circuit (Figure 4). In single-ended mode, IN+ is internally switched to CH0–CH7, and IN- is switched to COM. In differential mode, IN+ and IN- are selected from the following pairs: CH0/CH1, CH2/CH3, CH4/CH5, and CH6/CH7. Configure the channels with Tables 2 and 3. In differential mode, IN- and IN+ are internally switched to either of the analog inputs. This configuration is pseudo-differential to the effect that only the signal at IN+ is sampled. The return side (IN-) must remain stable within ±0.5LSB (±0.1LSB for best results) with respect to AGND during a conversion. To accomplish this, connect a 0.1µF capacitor from IN- (the selected analog input) to AGND. During the acquisition interval, the channel selected as the positive input (IN+) charges capacitor CHOLD. The acquisition interval spans three SCLK cycles and ends CS SCLK DIN SHDN CH0 CH1 CH2 CH3 CH4 CH5 CH6 CH7 COM on the falling SCLK edge after the last bit of the input control word has been entered. At the end of the acquisition interval, the T/H switch opens, retaining charge on CHOLD as a sample of the signal at IN+. The conversion interval begins with the input multiplexer switching CHOLD from the positive input (IN+) to the negative input (IN-). In single-ended mode, IN- is simply COM. This unbalances node ZERO at the comparator’s input. The capacitive DAC adjusts during the remainder of the conversion cycle to restore node ZERO to 0V within the limits of 12-bit resolution. This action is equivalent to transferring a 16pF x [(VIN+) (V IN -)] charge from C HOLD to the binary-weighted capacitive DAC, which in turn forms a digital representation of the analog input signal. Track/Hold The T/H enters its tracking mode on the falling clock edge after the fifth bit of the 8-bit control word has been shifted in. It enters its hold mode on the falling clock edge after the eighth bit of the control word has been shifted in. If the converter is set up for single-ended inputs, IN- is connected to COM, and the converter samples the “+” input. If the converter is set up for differential inputs, IN- connects to the “-” input, and the difference of |IN+ - IN-| is sampled. At the end of the conversion, the positive input connects back to IN+, and CHOLD charges to the input signal. 18 19 17 10 1 2 3 4 5 6 7 8 INPUT SHIFT REGISTER VREF CONTROL LOGIC OUTPUT SHIFT REGISTER ANALOG INPUT MUX 15 16 DOUT CH0 CH1 SSTRB CH2 CH3 CH4 T/H CLOCK IN 12-BIT SAR ADC OUT REF 9 REFADJ 12 VREF 11 12-BIT CAPACITIVE DAC INT CLOCK +1.21V REFERENCE (MAX146) 20k A ≈ 2.06* CH5 20 14 13 +2.500V MAX146 MAX147 VDD DGND AGND CH6 CH7 COMPARATOR INPUT CHOLD MUX – + ZERO 16pF RIN 9k CSWITCH TRACK HOLD T/H SWITCH COM AT THE SAMPLING INSTANT, THE MUX INPUT SWITCHES FROM THE SELECTED IN+ CHANNEL TO THE SELECTED IN- CHANNEL. SINGLE-ENDED MODE: IN+ = CH0–CH7, IN- = COM. DIFFERENTIAL MODE: IN+ AND IN- SELECTED FROM PAIRS OF CH0/CH1, CH2/CH3, CH4/CH5, AND CH6/CH7. *A ≈ 2.00 (MAX147) Figure 3. Block Diagram Figure 4. Equivalent Input Circuit _______________________________________________________________________________________ 9 MAX146/MAX147 _______________Detailed Description MAX146/MAX147 +2.7V, Low-Power, 8-Channel, Serial 12-Bit ADCs Analog Input Protection The time required for the T/H to acquire an input signal is a function of how quickly its input capacitance is charged. If the input signal’s source impedance is high, the acquisition time lengthens, and more time must be allowed between conversions. The acquisition time, tACQ, is the maximum time the device takes to acquire the signal, and is also the minimum time needed for the signal to be acquired. It is calculated by the following equation: tACQ = 9 x (RS + RIN) x 16pF where RIN = 9kΩ, RS = the source impedance of the input signal, and tACQ is never less than 1.5µs. Note that source impedances below 1kΩ do not significantly affect the ADC’s AC performance. Higher source impedances can be used if a 0.01µF capacitor is connected to the individual analog inputs. Note that the input capacitor forms an RC filter with the input source impedance, limiting the ADC’s signal bandwidth. Internal protection diodes, which clamp the analog input to VDD and AGND, allow the channel input pins to swing from AGND - 0.3V to V DD + 0.3V without damage. However, for accurate conversions near full scale, the inputs must not exceed VDD by more than 50mV or be lower than AGND by 50mV. If the analog input exceeds 50mV beyond the supplies, do not forward bias the protection diodes of off channels over 2mA. Quick Look To quickly evaluate the MAX146/MAX147’s analog performance, use the circuit of Figure 5. The MAX146/ MAX147 require a control byte to be written to DIN before each conversion. Tying DIN to +3V feeds in control bytes of $FF (HEX), which trigger single-ended unipolar conversions on CH7 in external clock mode without powering down between conversions. In external clock mode, the SSTRB output pulses high for one clock period before the most significant bit of the 12-bit conversion result is shifted out of DOUT. Varying the analog input to CH7 will alter the sequence of bits from DOUT. A total of 15 clock cycles is required per conversion. All transitions of the SSTRB and DOUT outputs occur on the falling edge of SCLK. Input Bandwidth The ADC’s input tracking circuitry has a 2.25MHz small-signal bandwidth, so it is possible to digitize high-speed transient events and measure periodic signals with bandwidths exceeding the ADC’s sampling rate by using undersampling techniques. To avoid high-frequency signals being aliased into the frequency band of interest, anti-alias filtering is recommended. OSCILLOSCOPE MAX146 MAX147 0V TO 2.500V ANALOG INPUT 0.01µF CH7 VDD +3V SCLK 0.1µF DGND AGND COM SSTRB CS +3V REFADJ DOUT* SCLK +3V DIN +3V 2.5V VOUT 1000pF MAX872 COMP C1 0.1µF OPTIONAL FOR MAX146, REQUIRED FOR MAX147 DOUT VREF 2MHz OSCILLATOR SSTRB SHDN N.C. CH1 CH2 CH3 * FULL-SCALE ANALOG INPUT, CONVERSION RESULT = $FFF (HEX) Figure 5. Quick-Look Circuit 10 CH4 ______________________________________________________________________________________ +2.7V, Low-Power, 8-Channel, Serial 12-Bit ADCs BIT 7 (MSB) BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 (LSB) START SEL2 SEL1 SEL0 UNI/BIP SGL/DIF PD1 PD0 BIT NAME DESCRIPTION 7(MSB) START The first logic “1” bit after CS goes low defines the beginning of the control byte. 6 5 4 SEL2 SEL1 SEL0 These three bits select which of the eight channels are used for the conversion (Tables 2 and 3). 3 UNI/BIP 1 = unipolar, 0 = bipolar. Selects unipolar or bipolar conversion mode. In unipolar mode, an analog input signal from 0V to VREF can be converted; in bipolar mode, the signal can range from -VREF/2 to +VREF/2. 2 SGL/DIF 1 = single ended, 0 = differential. Selects single-ended or differential conversions. In singleended mode, input signal voltages are referred to COM. In differential mode, the voltage difference between two channels is measured (Tables 2 and 3). 1 0(LSB) PD1 PD0 Selects clock and power-down modes. PD1 PD0 Mode 0 0 Full power-down 0 1 Fast power-down (MAX146 only) 1 0 Internal clock mode 1 1 External clock mode Table 2. Channel Selection in Single-Ended Mode (SGL/DIF = 1) SEL2 0 SEL1 0 SEL0 0 1 0 0 0 0 1 1 0 1 0 1 0 1 1 0 0 1 1 1 1 1 CH0 + CH1 CH2 CH3 CH4 CH5 CH6 CH7 COM – + – + – + – + – + – + – + – Table 3. Channel Selection in Differential Mode (SGL/DIF = 0) SEL2 SEL1 SEL0 CH0 CH1 0 0 0 + – 0 0 1 0 1 0 0 1 1 1 0 0 1 0 1 1 1 0 1 1 1 – CH2 CH3 + – CH4 CH5 + – CH6 CH7 + – – + + – + – + ______________________________________________________________________________________ 11 MAX146/MAX147 Table 1. Control-Byte Format MAX146/MAX147 +2.7V, Low-Power, 8-Channel, Serial 12-Bit ADCs How to Start a Conversion 4) Transmit a byte of all zeros ($00 hex) and, simultaneously, receive byte RB2. 5) Transmit a byte of all zeros ($00 hex) and, simultaneously, receive byte RB3. 6) Pull CS high. Figure 6 shows the timing for this sequence. Bytes RB2 and RB3 contain the result of the conversion, padded with one leading zero and three trailing zeros. The total conversion time is a function of the serial-clock frequency and the amount of idle time between 8-bit transfers. To avoid excessive T/H droop, make sure the total conversion time does not exceed 120µs. Start a conversion by clocking a control byte into DIN. With CS low, each rising edge on SCLK clocks a bit from DIN into the MAX146/MAX147’s internal shift register. After CS falls, the first arriving logic “1” bit defines the control byte’s MSB. Until this first “start” bit arrives, any number of logic “0” bits can be clocked into DIN with no effect. Table 1 shows the control-byte format. The MAX146/MAX147 are compatible with SPI™/ QSPI™ and Microwire™ devices. For SPI, select the correct clock polarity and sampling edge in the SPI control registers: set CPOL = 0 and CPHA = 0. Microwire, SPI, and QSPI all transmit a byte and receive a byte at the same time. Using the Typical Operating Circuit, the simplest software interface requires only three 8-bit transfers to perform a conversion (one 8-bit transfer to configure the ADC, and two more 8-bit transfers to clock out the 12-bit conversion result). See Figure 20 for MAX146/MAX147 QSPI connections. Digital Output In unipolar input mode, the output is straight binary (Figure 17). For bipolar input mode, the output is two’s complement (Figure 18). Data is clocked out at the falling edge of SCLK in MSB-first format. Clock Modes Simple Software Interface Make sure the CPU’s serial interface runs in master mode so the CPU generates the serial clock. Choose a clock frequency from 100kHz to 2MHz. 1) Set up the control byte for external clock mode and call it TB1. TB1 should be of the format: 1XXXXX11 binary, where the Xs denote the particular channel and conversion mode selected. 2) Use a general-purpose I/O line on the CPU to pull CS low. 3) Transmit TB1 and, simultaneously, receive a byte and call it RB1. Ignore RB1. The MAX146/MAX147 may use either an external serial clock or the internal clock to perform the successive-approximation conversion. In both clock modes, the external clock shifts data in and out of the MAX146/MAX147. The T/H acquires the input signal as the last three bits of the control byte are clocked into DIN. Bits PD1 and PD0 of the control byte program the clock mode. Figures 7–10 show the timing characteristics common to both modes. CS tACQ SCLK 1 4 SEL2 SEL1 SEL0 UNI/ BIP DIN 8 SGL/ PD1 DIF 12 16 20 24 PD0 START SSTRB A/D STATE B11 MSB IDLE RB3 RB2 RB1 DOUT ACQUISITION 1.5µs B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 LSB FILLED WITH ZEROS CONVERSION IDLE (fSCLK = 2MHz) Figure 6. 24-Clock External Clock Mode Conversion Timing (Microwire and SPI Compatible, QSPI Compatible with fSCLK ≤ 2MHz) 12 ______________________________________________________________________________________ +2.7V, Low-Power, 8-Channel, Serial 12-Bit ADCs MAX146/MAX147 ••• CS tCSH tCSS tCH tCL SCLK tCSH ••• tDS tDH ••• DIN tDV tDO tTR ••• DOUT Figure 7. Detailed Serial-Interface Timing ••• CS ••• tSTR tSDV SSTRB ••• ••• tSSTRB SCLK •••• tSSTRB •••• PD0 CLOCKED IN Figure 8. External Clock Mode SSTRB Detailed Timing External Clock In external clock mode, the external clock not only shifts data in and out, but it also drives the analog-to-digital conversion steps. SSTRB pulses high for one clock period after the last bit of the control byte. Successive-approximation bit decisions are made and appear at DOUT on each of the next 12 SCLK falling edges (Figure 6). SSTRB and DOUT go into a high-impedance state when CS goes high; after the next CS falling edge, SSTRB outputs a logic low. Figure 8 shows the SSTRB timing in external clock mode. The conversion must complete in some minimum time, or droop on the sample-and-hold capacitors may degrade conversion results. Use internal clock mode if the serial clock frequency is less than 100kHz, or if serial clock interruptions could cause the conversion interval to exceed 120µs. Internal Clock In internal clock mode, the MAX146/MAX147 generate their own conversion clocks internally. This frees the µP from the burden of running the SAR conversion clock and allows the conversion results to be read back at the ______________________________________________________________________________________ 13 MAX146/MAX147 +2.7V, Low-Power, 8-Channel, Serial 12-Bit ADCs Pulling CS high prevents data from being clocked into the MAX146/MAX147 and three-states DOUT, but it does not adversely affect an internal clock mode conversion already in progress. When internal clock mode is selected, SSTRB does not go into a highimpedance state when CS goes high. Figure 10 shows the SSTRB timing in internal clock mode. In this mode, data can be shifted in and out of the MAX146/MAX147 at clock rates exceeding 2.0MHz if the minimum acquisition time (tACQ) is kept above 1.5µs. processor’s convenience, at any clock rate from 0MHz to 2MHz. SSTRB goes low at the start of the conversion and then goes high when the conversion is complete. SSTRB is low for a maximum of 7.5µs (SHDN = FLOAT), during which time SCLK should remain low for best noise performance. An internal register stores data when the conversion is in progress. SCLK clocks the data out of this register at any time after the conversion is complete. After SSTRB goes high, the next falling clock edge produces the MSB of the conversion at DOUT, followed by the remaining bits in MSB-first format (Figure 9). CS does not need to be held low once a conversion is started. CS SCLK 1 2 4 3 5 SEL2 SEL1 SEL0 UNI/ BIP DIN 7 8 SGL/ PD1 DIF PD0 6 9 10 11 18 12 19 20 21 22 23 24 START SSTRB tCONV B11 MSB DOUT A/D STATE IDLE ACQUISITION 1.5µs CONVERSION 7.5µs MAX (fSCLK = 2MHz) (SHDN = FLOAT) B10 B9 B2 B1 B0 LSB FILLED WITH ZEROS IDLE Figure 9. Internal Clock Mode Timing CS tCONV tSCK tCSH tCSS SSTRB tSSTRB SCLK tDO PD0 CLOCK IN DOUT NOTE: FOR BEST NOISE PERFORMANCE, KEEP SCLK LOW DURING CONVERSION. Figure. 10. Internal Clock Mode SSTRB Detailed Timing 14 ______________________________________________________________________________________ +2.7V, Low-Power, 8-Channel, Serial 12-Bit ADCs The first high bit clocked into DIN with CS low any time the converter is idle; e.g., after VDD is applied. __________ Applications Information OR Power-On Reset The first high bit clocked into DIN after bit 5 of a conversion in progress is clocked onto the DOUT pin. When power is first applied, and if SHDN is not pulled low, internal power-on reset circuitry activates the MAX146/MAX147 in internal clock mode, ready to convert with SSTRB = high. After the power supplies stabilize, the internal reset time is 10µs, and no conversions should be performed during this phase. SSTRB is high on power-up and, if CS is low, the first logical 1 on DIN is interpreted as a start bit. Until a conversion takes place, DOUT shifts out zeros. (Also see Table 4.) If CS is toggled before the current conversion is complete, the next high bit clocked into DIN is recognized as a start bit; the current conversion is terminated, and a new one is started. The fastest the MAX146/MAX147 can run with CS held low between conversions is 15 clocks per conversion. Figure 11a shows the serial-interface timing necessary to perform a conversion every 15 SCLK cycles in external CS 1 8 15 1 8 15 1 SCLK S DIN CONTROL BYTE 0 DOUT S S CONTROL BYTE 1 CONTROL BYTE 2 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 CONVERSION RESULT 0 CONVERSION RESULT 1 SSTRB Figure 11a. External Clock Mode, 15 Clocks/Conversion Timing ••• CS 1 8 16 1 8 16 SCLK DIN DOUT S S CONTROL BYTE 0 CONVERSION RESULT 0 ••• CONTROL BYTE 1 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 ••• B11 B10 B9 B8 ••• CONVERSION RESULT 1 Figure 11b. External Clock Mode, 16 Clocks/Conversion Timing ______________________________________________________________________________________ 15 MAX146/MAX147 clock mode. If CS is tied low and SCLK is continuous, guarantee a start bit by first clocking in 16 zeros. Most microcontrollers (µCs) require that conversions occur in multiples of 8 SCLK clocks; 16 clocks per conversion is typically the fastest that a µC can drive the MAX146/MAX147. Figure 11b shows the serialinterface timing necessary to perform a conversion every 16 SCLK cycles in external clock mode. Data Framing The falling edge of CS does not start a conversion. The first logic high clocked into DIN is interpreted as a start bit and defines the first bit of the control byte. A conversion starts on SCLK’s falling edge, after the eighth bit of the control byte (the PD0 bit) is clocked into DIN. The start bit is defined as follows: MAX146/MAX147 +2.7V, Low-Power, 8-Channel, Serial 12-Bit ADCs Reference-Buffer Compensation In addition to its shutdown function, SHDN selects internal or external compensation. The compensation affects both power-up time and maximum conversion speed. The100kHz minimum clock rate is limited by droop on the sample-and-hold and is independent of the compensation used. Float SHDN to select external compensation. The Typical Operating Circuit uses a 4.7µF capacitor at VREF. A 4.7µF value ensures reference-buffer stability and allows converter operation at the 2MHz full clock speed. External compensation increases power-up time (see the Choosing Power-Down Mode section and Table 4). Pull SHDN high to select internal compensation. Internal compensation requires no external capacitor at VREF and allows for the shortest power-up times. The maximum clock rate is 2MHz in internal clock mode and 400kHz in external clock mode. Choosing Power-Down Mode You can save power by placing the converter in a lowcurrent shutdown state between conversions. Select full power-down mode or fast power-down mode via bits 1 and 0 of the DIN control byte with SHDN high or floating (Tables 1 and 5). In both software power-down modes, the serial interface remains operational, but the ADC does not convert. Pull SHDN low at any time to shut down the converter completely. SHDN overrides bits 1 and 0 of the control byte. Full power-down mode turns off all chip functions that draw quiescent current, reducing supply current to 2µA (typ). Fast power-down mode turns off all circuitry except the bandgap reference. With fast power-down mode, the supply current is 30µA. Power-up time can be shortened to 5µs in internal compensation mode. Table 4 shows how the choice of reference-buffer compensation and power-down mode affects both power-up delay and maximum sample rate. In external compensation mode, power-up time is 20ms with a 4.7µF compensation capacitor when the capacitor is initially fully discharged. From fast power-down, start-up time can be eliminated by using low-leakage capacitors that do not discharge more than 1/2LSB while shut down. In powerdown, leakage currents at VREF cause droop on the reference bypass capacitor. Figures 12a and 12b show the various power-down sequences in both external and internal clock modes. Software Power-Down Software power-down is activated using bits PD1 and PD0 of the control byte. As shown in Table 5, PD1 and PD0 also specify the clock mode. When software shutdown is asserted, the ADC operates in the last specified clock mode until the conversion is complete. Then the ADC powers down into a low quiescent-current state. In internal clock mode, the interface remains active and conversion results may be clocked out after the MAX146/MAX147 enter a software power-down. The first logical 1 on DIN is interpreted as a start bit and powers up the MAX146/MAX147. Following the start bit, the data input word or control byte also determines clock mode and power-down states. For example, if the DIN word contains PD1 = 1, then the chip remains powered up. If PD0 = PD1 = 0, a power-down resumes after one conversion. Table 4. Typical Power-Up Delay Times 16 REFERENCE BUFFER REFERENCEBUFFER COMPENSATION MODE VREF CAPACITOR (µF) POWER-DOWN MODE Enabled Internal — Enabled Internal — Enabled External 4.7 POWER-UP DELAY (µs) MAXIMUM SAMPLING RATE (ksps) Fast 5 26 Full 300 26 Fast See Figure 14c 133 Enabled External 4.7 Full See Figure 14c 133 Disabled — — Fast 2 133 Disabled — — Full 2 133 ______________________________________________________________________________________ +2.7V, Low-Power, 8-Channel, Serial 12-Bit ADCs MAX146/MAX147 CLOCK MODE EXTERNAL EXTERNAL SHDN SETS SOFTWARE POWER-DOWN SETS EXTERNAL CLOCK MODE DIN S X X X X X 1 1 DOUT S X X X X X 0 0 SETS EXTERNAL CLOCK MODE S X X X X X 1 1 VALID DATA 12 DATA BITS 12 DATA BITS POWERED UP POWERED UP MODE SOFTWARE POWER-DOWN INVALID DATA HARDWARE POWERDOWN POWERED UP Figure 12a. Timing Diagram Power-Down Modes, External Clock CLOCK MODE DIN INTERNAL S X X X X X 1 0 S X X X X X 0 0 DOUT SSTRB MODE SETS POWER-DOWN SETS INTERNAL CLOCK MODE S DATA VALID DATA VALID CONVERSION CONVERSION POWERED UP POWER-DOWN POWERED UP Figure 12b. Timing Diagram Power-Down Modes, Internal Clock Hardware Power-Down Pulling SHDN low places the converter in hardware power-down (Table 6). Unlike software power-down mode, the conversion is not completed; it stops coincidentally with SHDN being brought low. SHDN also controls the clock frequency in internal clock mode. Letting SHDN float sets the internal clock frequency to 1.8MHz. When returning to normal operation with SHDN floating, there is a tRC delay of approximately 2MΩ x CL, where CL is the capacitive loading on the SHDN pin. Pulling SHDN high sets internal clock frequency to 225kHz. This feature eases the settling-time requirement for the reference voltage. With an external reference, the MAX146/MAX147 can be considered fully powered up within 2µs of actively pulling SHDN high. ______________________________________________________________________________________ 17 Power-Down Sequencing The MAX146/MAX147 auto power-down modes can save considerable power when operating at less than maximum sample rates. Figures 13, 14a, and 14b show the average supply current as a function of the sampling rate. The following discussion illustrates the various power-down sequences. Lowest Power at up to 500 Conversions/Channel/Second The following examples show two different power-down sequences. Other combinations of clock rates, compensation modes, and power-down modes may give lowest power consumption in other applications. Figure 14a depicts the MAX146 power consumption for one or eight channel conversions utilizing full powerdown mode and internal-reference compensation. A 0.047µF bypass capacitor at REFADJ forms an RC filter with the internal 20kΩ reference resistor with a 0.9ms time constant. To achieve full 12-bit accuracy, 10 time constants or 9ms are required after power-up. Waiting this 9ms in FASTPD mode instead of in full power-up can reduce power consumption by a factor of 10 or more. This is achieved by using the sequence shown in Figure 15. AVERAGE SUPPLY CURRENT vs. CONVERSION RATE WITH EXTERNAL REFERENCE 100 8 CHANNELS 1 CHANNEL 1 0.1 0.1 1 10 100 1k 10k 100k 1 CHANNEL CONVERSION RATE (Hz) 0.1 1 10 100 1k CONVERSION RATE (Hz) Figure 13. Average Supply Current vs. Conversion Rate with External Reference Figure 14a. MAX146 Supply Current vs. Conversion Rate, FULLPD AVERAGE SUPPLY CURRENT vs. CONVERSION RATE (USING FASTPD) TYPICAL REFERENCE-BUFFER POWER-UP DELAY vs. TIME IN SHUTDOWN 2.0 MAX146/47-Fig14b 10,000 RLOAD = ∞ CODE = 101010100000 POWER-UP DELAY (ms) 1000 8 CHANNELS 100 1 CHANNEL 1.5 1.0 0.5 10 1 0.1 1 10 100 1k 10k 100k 1M CONVERSION RATE (Hz) Figure 14b. MAX146 Supply Current vs. Conversion Rate, FASTPD 18 8 CHANNELS 10 1 0.01 1M MAX146/47-Fig14a RLOAD = ∞ CODE = 101010100000 MAX146/47-Fig14c 10 100 AVERAGE SUPPLY CURRENT (µA) VREF = VDD = 3.0V RLOAD = ∞ CODE = 101010100000 1000 AVERAGE SUPPLY CURRENT vs. CONVERSION RATE (USING FULLPD) MAX146/47-13 AVERAGE SUPPLY CURRENT (µA) 10,000 AVERAGE SUPPLY CURRENT (µA) MAX146/MAX147 +2.7V, Low-Power, 8-Channel, Serial 12-Bit ADCs 0 0.001 0.01 0.1 1 10 TIME IN SHUTDOWN (sec) Figure 14c. Typical Reference-Buffer Power-Up Delay vs. Time in Shutdown ______________________________________________________________________________________ +2.7V, Low-Power, 8-Channel, Serial 12-Bit ADCs MAX146/MAX147 COMPLETE CONVERSION SEQUENCE 9ms WAIT DIN CH1 (ZEROS) 1 00 FULLPD 1 01 FASTPD (ZEROS) CH7 1 11 1 00 NOPD 1 FULLPD 01 FASTPD 1.21V REFADJ 0V 2.50V τ = RC = 20kΩ x CREFADJ VREF 0V tBUFFEN ≈ 200µs Figure 15. MAX146 FULLPD/FASTPD Power-Up Sequence Lowest Power at Higher Throughputs Figure 14b shows the power consumption with external-reference compensation in fast power-down, with one and eight channels converted. The external 4.7µF compensation requires a 200µs wait after power-up with one dummy conversion. This graph shows fast multi-channel conversion with the lowest power consumption possible. Full power-down mode may provide increased power savings in applications where the MAX146/MAX147 are inactive for long periods of time, but where intermittent bursts of high-speed conversions are required. Internal and External References The MAX146 can be used with an internal or external reference voltage, whereas an external reference is required for the MAX147. An external reference can be connected directly at VREF or at the REFADJ pin. An internal buffer is designed to provide 2.5V at VREF for both the MAX146 and the MAX147. The MAX146’s internally trimmed 1.21V reference is buffered with a 2.06 gain. The MAX147’s REFADJ pin is also buffered with a 2.00 gain to scale an external 1.25V reference at REFADJ to 2.5V at VREF. Internal Reference (MAX146) The MAX146’s full-scale range with the internal reference is 2.5V with unipolar inputs and ±1.25V with bipolar inputs. The internal reference voltage is adjustable to ±1.5% with the circuit in Figure 16. External Reference With both the MAX146 and MAX147, an external reference can be placed at either the input (REFADJ) or the output (VREF) of the internal reference-buffer amplifier. The REFADJ input impedance is typically 20kΩ for the MAX146, and higher than 100kΩ for the MAX147. At +3.3V 24k MAX146 510k 100k 12 REFADJ 0.047µF Figure 16. MAX146 Reference-Adjust Circuit Table 5. Software Power-Down and Clock Mode PD1 PD0 DEVICE MODE 0 0 Full Power-Down 0 1 Fast Power-Down 1 0 Internal Clock 1 1 External Clock Table 6. Hard-Wired Power-Down and Internal Clock Frequency SHDN STATE DEVICE MODE REFERENCE BUFFER COMPENSATION INTERNAL CLOCK FREQUENCY 1 Enabled Internal 225kHz Floating Enabled External 1.8MHz 0 Power-Down N/A N/A ______________________________________________________________________________________ 19 MAX146/MAX147 +2.7V, Low-Power, 8-Channel, Serial 12-Bit ADCs VREF, the DC input resistance is a minimum of 18kΩ. During conversion, an external reference at VREF must deliver up to 350µA DC load current and have 10Ω or less output impedance. If the reference has a higher output impedance or is noisy, bypass it close to the VREF pin with a 4.7µF capacitor. Using the REFADJ input makes buffering the external reference unnecessary. To use the direct VREF input, disable the internal buffer by tying REFADJ to VDD. In power-down, the input bias current to REFADJ is typically 25µA (MAX146) with REFADJ tied to VDD. Pull REFADJ to AGND to minimize the input bias current in power-down. OUTPUT CODE FULL-SCALE TRANSITION 11 . . . 111 11 . . . 110 11 . . . 101 FS = VREF + COM ZS = COM VREF 1LSB = 4096 00 . . . 011 Transfer Function Table 7 shows the full-scale voltage ranges for unipolar and bipolar modes. The external reference must have a temperature coefficient of 4ppm/°C or less to achieve accuracy to within 1LSB over the 0°C to +70°C commercial temperature range. Figure 17 depicts the nominal, unipolar input/output (I/O) transfer function, and Figure 18 shows the bipolar input/output transfer function. Code transitions occur halfway between successive-integer LSB values. Output coding is binary, with 1LSB = 610µV (2.500V / 4096) for unipolar operation, and 1LSB = 610µV [(2.500V / 2 - -2.500V / 2) / 4096] for bipolar operation. Layout, Grounding, and Bypassing For best performance, use printed circuit boards. Wire-wrap boards are not recommended. Board layout should ensure that digital and analog signal lines are separated from each other. Do not run analog and digital (especially clock) lines parallel to one another, or digital lines underneath the ADC package. Figure 19 shows the recommended system ground connections. Establish a single-point analog ground (star ground point) at AGND, separate from the logic ground. Connect all other analog grounds and DGND to the star ground. No other digital system ground should be connected to this ground. For lowest-noise operation, the ground return to the star ground’s power 00 . . . 010 00 . . . 001 00 . . . 000 0 1 (COM) 2 3 FS INPUT VOLTAGE (LSB) FS - 3/2LSB Figure 17. Unipolar Transfer Function, Full Scale (FS) = VREF + COM, Zero Scale (ZS) = COM supply should be low impedance and as short as possible. High-frequency noise in the VDD power supply may affect the high-speed comparator in the ADC. Bypass the supply to the star ground with 0.1µF and 1µF capacitors close to pin 20 of the MAX146/MAX147. Minimize capacitor lead lengths for best supply-noise rejection. If the power supply is very noisy, a 10Ω resistor can be connected as a lowpass filter (Figure 19). High-Speed Digital Interfacing with QSPI The MAX146/MAX147 can interface with QSPI using the circuit in Figure 20 (fSCLK = 2.0MHz, CPOL = 0, CPHA = 0). This QSPI circuit can be programmed to do a conversion on each of the eight channels. The result is stored in memory without taxing the CPU, since QSPI incorporates its own microsequencer. The MAX146/MAX147 are QSPI compatible up to the maximum external clock frequency of 2MHz. Table 7. Full Scale and Zero Scale UNIPOLAR MODE 20 BIPOLAR MODE Full Scale Zero Scale Positive Full Scale Zero Scale Negative Full Scale VREF + COM COM VREF / 2 + COM COM -VREF / 2 + COM ______________________________________________________________________________________ +2.7V, Low-Power, 8-Channel, Serial 12-Bit ADCs MAX146/MAX147 OUTPUT CODE 011 . . . 111 FS = VREF + COM 2 011 . . . 110 ZS = COM 000 . . . 010 000 . . . 001 -FS = +3V -VREF + COM 2 1LSB = 000 . . . 000 SUPPLIES +3V GND +3V DGND VREF 4096 R* = 10Ω 111 . . . 111 111 . . . 110 111 . . . 101 VDD AGND 100 . . . 001 100 . . . 000 MAX146 MAX147 - FS COM* COM DGND DIGITAL CIRCUITRY +FS - 1LSB *OPTIONAL INPUT VOLTAGE (LSB) *COM ≤ VREF / 2 Figure 18. Bipolar Transfer Function, Full Scale (FS) = VREF / 2 + COM, Zero Scale (ZS) = COM TMS320LC3x Interface Figure 21 shows an application circuit to interface the MAX146/MAX147 to the TMS320 in external clock mode. The timing diagram for this interface circuit is shown in Figure 22. Use the following steps to initiate a conversion in the MAX146/MAX147 and to read the results: 1) The TMS320 should be configured with CLKX (transmit clock) as an active-high output clock and CLKR (TMS320 receive clock) as an active-high input clock. CLKX and CLKR on the TMS320 are tied together with the MAX146/MAX147’s SCLK input. 2) The MAX146/MAX147’s CS pin is driven low by the TMS320’s XF_ I/O port to enable data to be clocked into the MAX146/MAX147’s DIN. 3) An 8-bit word (1XXXXX11) should be written to the MAX146/MAX147 to initiate a conversion and place the device into external clock mode. Refer to Table 1 to select the proper XXXXX bit values for your specific application. Figure 19. Power-Supply Grounding Connection 4) The MAX146/MAX147’s SSTRB output is monitored via the TMS320’s FSR input. A falling edge on the SSTRB output indicates that the conversion is in progress and data is ready to be received from the MAX146/MAX147. 5) The TMS320 reads in one data bit on each of the next 16 rising edges of SCLK. These data bits represent the 12-bit conversion result followed by four trailing bits, which should be ignored. 6) Pull CS high to disable the MAX146/MAX147 until the next conversion is initiated. ______________________________________________________________________________________ 21 MAX146/MAX147 +2.7V, Low-Power, 8-Channel, Serial 12-Bit ADCs +3V 0.1µF ANALOG INPUTS +3V 1µF (POWER SUPPLIES) 1 CH0 2 CH1 SCLK 19 3 CH2 CS 18 PCS0 4 CH3 DIN 17 MOSI 5 CH4 6 CH5 DOUT 15 7 CH6 DGND 14 8 CH7 AGND 13 9 COM REFADJ 12 10 SHDN VREF 11 VDD MAX146 MAX147 20 SCK MC683XX SSTRB 16 MISO (GND) 0.1µF +2.5V Figure 20. MAX146/MAX147 QSPI Connections, External Reference XF CLKX CS SCLK TMS320LC3x MAX146 MAX147 CLKR DX DIN DR DOUT FSR SSTRB Figure 21. MAX146/MAX147-to-TMS320 Serial Interface 22 ______________________________________________________________________________________ +2.7V, Low-Power, 8-Channel, Serial 12-Bit ADCs MAX146/MAX147 CS SCLK DIN START SEL2 SEL1 SEL0 UNI/BIP SGL/DIF PD1 PD0 HIGH IMPEDANCE SSTRB DOUT MSB B10 B1 HIGH IMPEDANCE LSB Figure 22. TMS320 Serial-Interface Timing Diagram _Ordering Information (continued) PART† TEMP. RANGE PIN-PACKAGE INL (LSB) MAX146AEPP -40°C to +85°C 20 Plastic DIP ±1/2 MAX146BEPP MAX146AEAP MAX146BEAP -40°C to +85°C -40°C to +85°C -40°C to +85°C 20 Plastic DIP 20 SSOP 20 SSOP ±1 ±1/2 ±1 MAX146AMJP -55°C to +125°C 20 CERDIP** ±1/2 MAX147BCPP -55°C to +125°C 0°C to +70°C 0°C to +70°C MAX147ACAP 0°C to +70°C 20 SSOP ±1/2 MAX147BCAP 0°C to +70°C 20 SSOP ±1 MAX147BC/D MAX147AEPP MAX147BEPP 0°C to +70°C -40°C to +85°C -40°C to +85°C Dice* 20 Plastic DIP 20 Plastic DIP ±1 ±1/2 ±1 MAX147AEAP -40°C to +85°C 20 SSOP ±1/2 MAX147BEAP MAX147AMJP MAX147BMJP -40°C to +85°C -55°C to +125°C -55°C to +125°C 20 SSOP 20 CERDIP** 20 CERDIP** ±1 ±1/2 ±1 MAX146BMJP MAX147ACPP 20 CERDIP** 20 Plastic DIP 20 Plastic DIP ±1 ±1/2 ±1 Contact factory for availability of alternate surface-mount packages. * Dice are specified at TA = +25°C, DC parameters only. ** Contact factory for availability of CERDIP package, and for processing to MIL-STD-883B. † __________________Pin Configuration TOP VIEW CH0 1 20 VDD CH1 2 19 SCLK 18 CS CH2 3 CH3 4 CH4 5 MAX146 MAX147 17 DIN 16 SSTRB CH5 6 15 DOUT CH6 7 14 DGND CH7 8 13 AGND COM 9 12 REFADJ 11 VREF SHDN 10 DIP/SSOP ___________________Chip Information TRANSISTOR COUNT: 2554 ______________________________________________________________________________________ 23 ________________________________________________________Package Information SSOP.EPS MAX146/MAX147 +2.7V, Low-Power, 8-Channel, Serial 12-Bit ADCs Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 24 __________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 (408) 737-7600 © 1997 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.