TI1 LM1085IS-3.3/NOPB Lm1085 3a low dropout positive regulator Datasheet

LM1085
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LM1085 3A Low Dropout Positive Regulators
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FEATURES
DESCRIPTION
•
The LM1085 is a series of low dropout positive
voltage regulators with a maximum dropout of 1.5V at
3A of load current. It has the same pin-out as TI's
industry standard LM317.
1
2
•
•
•
•
Available in 3.3V, 5.0V, 12V and Adjustable
Versions
Current Limiting and Thermal Protection
Output Current 3A
Line Regulation 0.015% (typical)
Load Regulation 0.1% (typical)
APPLICATIONS
•
•
•
•
•
High Efficiency Linear Regulators
Battery Charger
Post Regulation for Switching Supplies
Constant Current Regulator
Microprocessor Supply
The LM1085 is available in an adjustable version,
which can set the output voltage with only two
external resistors. It is also available in three fixed
voltages: 3.3V, 5.0V and 12.0V. The fixed versions
integrate the adjust resistors.
The LM1085 circuit includes a zener trimmed
bandgap reference, current limiting and thermal
shutdown.
The LM1085 series is available in TO-220 and
DDPAK/TO-263 packages. Refer to the LM1084 for
the 5A version, and the LM1086 for the 1.5A version.
Connection Diagram
Figure 1. TO-220 Top View
Figure 2. DDPAK/TO-263 Top View
Figure 3. Basic Functional Diagram, Adjustable
Version
Figure 4. Application Circuit
1.2V to 15V Adjustable Regulator
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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Simplified Schematic
Figure 5.
2
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1) (2)
Maximum Input to Output Voltage Differential
LM1085-ADJ
29V
LM1085-12
18V
LM1085-3.3
27V
LM1085-5.0
25V
(3)
Power Dissipation
Internally Limited
Junction Temperature (TJ) (4)
150°C
Storage Temperature Range
-65°C to 150°C
Lead Temperature
260°C, to 10 sec
(5)
2000V
ESD Tolerance
(1)
(2)
(3)
(4)
(5)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
Power dissipation is kept in a safe range by current limiting circuitry. Refer to Overload Recovery in Application Notes.
The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal
Considerations in the Application Notes.
For testing purposes, ESD was applied using human body model, 1.5kΩ in series with 100pF.
Operating Ratings (1)
Junction Temperature (TJ) (2)
(1)
(2)
−40°C to 125°C
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal
Considerations in the Application Notes.
Electrical Characteristics
Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the operating junction temperature (TJ)
range of -40°C to +125°C. Minimum and Maximum limits are ensured through test, design, or statistical correlation. Typical
values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.
Symbol
VREF
VOUT
(1)
(2)
(3)
Min
Typ
Max
(1)
Units
LM1085-ADJ
IOUT = 10mA, VIN−VOUT = 3V
10mA ≤IOUT ≤ IFULL LOAD,1.5V ≤ (VIN−VOUT) ≤ 15V
1.238
1.225
1.250
1.250
1.262
1.270
V
LM1085-3.3
IOUT = 0mA, VIN = 5V
0 ≤ IOUT ≤IFULL LOAD, 4.8V≤ VIN ≤15V
3.270
3.235
3.300
3.300
3.330
3.365
V
LM1085-5.0
IOUT = 0mA, VIN = 8V
0 ≤ IOUT ≤ IFULL LOAD, 6.5V ≤ VIN ≤ 20V
4.950
4.900
5.000
5.000
5.050
5.100
V
LM1085-12
IOUT = 0mA, VIN = 15V
0 ≤ IOUT ≤ IFULL LOAD, 13.5V ≤ VIN ≤ 25V
11.880
11.760
12.000
12.000
12.120
12.240
V
Parameter
Reference Voltage
(3)
Output Voltage
(3)
Conditions
(1)
(2)
All limits are specified by testing or statistical analysis.
Typical Values represent the most likely parametric norm.
IFULL LOAD is defined in the current limit curves. The IFULL LOAD Curve defines the current limit as a function of input-to-output voltage.
Note that 30W power dissipation for the LM1085 is only achievable over a limited range of input-to-output voltage.
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Electrical Characteristics (continued)
Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the operating junction temperature (TJ)
range of -40°C to +125°C. Minimum and Maximum limits are ensured through test, design, or statistical correlation. Typical
values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.
Symbol
Typ
Max
(1)
Units
0.015
0.035
0.2
0.2
%
LM1085-3.3, IOUT = 0mA, 4.8V ≤ VIN ≤ 15V
0.5
1.0
6
6
mV
LM1085-5.0, IOUT = 0mA, 6.5V ≤ VIN ≤ 20V
0.5
1.0
10
10
mV
LM1085-12, I OUT =0mA, 13.5V ≤ VIN ≤ 25V
1.0
2.0
25
25
mV
LM1085-ADJ, (VIN-V OUT) = 3V, 10mA ≤ IOUT ≤ IFULL
0.1
0.2
0.3
0.4
%
LM1085-3.3, VIN = 5V, 0 ≤ IOUT ≤ IFULL LOAD
3
7
15
20
mV
LM1085-5.0, VIN = 8V, 0 ≤ IOUT ≤ IFULL LOAD
5
10
20
35
mV
LM1085-12, VIN = 15V, 0 ≤ IOUT ≤ IFULL LOAD
12
24
36
72
mV
LM1085-ADJ, 3.3, 5, 12
ΔVREF, ΔVOUT = 1%, IOUT = 3A
1.3
1.5
Parameter
Conditions
Min
(1)
LM1085-ADJ, IOUT =10mA, 1.5V≤ (VIN-VOUT) ≤ 15V
Line Regulation
ΔVOUT
(4)
LOAD
Load Regulation
ΔVOUT
(4)
VDO
Dropout Voltage
ILIMIT
(5)
Current Limit
Minimum Load
Current (6)
IGND
Quiescent Current
Thermal Regulation
(2)
V
LM1085-ADJ, VIN−VOUT = 5V
3.2
5.5
LM1085-ADJ, VIN−VOUT = 25V
0.2
0.5
LM1085-3.3, VIN = 8.0V
3.2
5.5
A
LM1085-5.0, VIN = 10V
3.2
5.5
A
LM1085-12, VIN = 17V
3.2
5.5
A
A
LM1085-ADJ, VIN −VOUT = 25V
5.0
10.0
mA
LM1085-3.3, VIN ≤ 18V
5.0
10.0
mA
LM1085-5.0, VIN ≤ 20V
5.0
10.0
mA
LM1085-12, VIN ≤ 25V
5.0
10.0
mA
TA = 25°C, 30ms Pulse
.004
0.02
%/W
fRIPPLE = 120Hz, COUT = 25µF Tantalum, IOUT = 3A
Ripple Rejection
LM1085-ADJ
CADJ = 25µF, (VIN−VO) = 3V
60
75
dB
LM1085-3.3, VIN = 6.3V
60
72
dB
LM1085-5.0, VIN = 8.0V
60
68
dB
LM1085-12, VIN = 15V
54
60
Adjust Pin Current
LM1085–ADJ
55
120
µA
ΔIADJ
Adjust Pin Current
Change
LM1085–ADJ
10mA ≤ IOUT ≤ IFULL LOAD, 1.5V ≤ VIN−VOUT ≤ 25V
0.2
5
µA
Temperature Stability
θJC
(4)
(5)
(6)
4
dB
IADJ
0.5
Long Term Stability
TA= 125°C, 1000 Hrs
RMS Output Noise
(% of VOUT)
10Hz ≤ f ≤ 10 kHz
Thermal Resistance
(Junction-to-Case)
0.3
%
1.0
0.003
%
%
3-Lead DDPAK/TO-263
-
0.7
-
3-Lead TO-220
-
0.7
-
°C/W
Load and line regulation are measured at constant junction temperature, and are ensured up to the maximum power dissipation of 30W.
Power dissipation is determined by the input/output differential and the output current. Ensured maximum power dissipation will not be
available over the full input/output range.
Dropout voltage is specified over the full output current range of the device.
The minimum output current required to maintain regulation.
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Typical Performance Characteristics
Dropout Voltage vs. Output Current
Short-Circuit Current vs. Input/Output Difference
Figure 6.
Figure 7.
Percent Change in Output Voltage vs. Temperature
Adjust Pin Current vs. Temperature
Figure 8.
Figure 9.
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Typical Performance Characteristics (continued)
Maximum Power Dissipation vs. Temperature
Ripple Rejection vs. Frequency (LM1085-Adj.)
Figure 10.
Figure 11.
Ripple Rejection vs. Output Current (LM1085-Adj.)
Line Transient Response
Figure 12.
Figure 13.
Load Transient Response
Figure 14.
6
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APPLICATION NOTE
GENERAL
Figure 15 shows a basic functional diagram for the LM1085-Adj (excluding protection circuitry) . The topology is
basically that of the LM317 except for the pass transistor. Instead of a Darlingtion NPN with its two diode voltage
drop, the LM1085 uses a single NPN. This results in a lower dropout voltage. The structure of the pass transistor
is also known as a quasi LDO. The advantage a quasi LDO over a PNP LDO is its inherently lower quiescent
current. The LM1085 is ensured to provide a minimum dropout voltage 1.5V over temperature, at full load.
Figure 15. Basic Functional Diagram for the LM1085, excluding Protection circuitry
OUTPUT VOLTAGE
The LM1085 adjustable version develops at 1.25V reference voltage, (VREF), between the output and the adjust
terminal. As shown in figure 2, this voltage is applied across resistor R1 to generate a constant current I1. This
constant current then flows through R2. The resulting voltage drop across R2 adds to the reference voltage to
sets the desired output voltage.
The current IADJ from the adjustment terminal introduces an output error . But since it is small (120uA max), it
becomes negligible when R1 is in the 100Ω range.
For fixed voltage devices, R1 and R2 are integrated inside the devices.
Figure 16. Basic Adjustable Regulator
STABILITY CONSIDERATION
Stability consideration primarily concern the phase response of the feedback loop. In order for stable operation,
the loop must maintain negative feedback. The LM1085 requires a certain amount series resistance with
capacitive loads. This series resistance introduces a zero within the loop to increase phase margin and thus
increase stability. The equivalent series resistance (ESR) of solid tantalum or aluminum electrolytic capacitors is
used to provide the appropriate zero (approximately 500 kHz).
The Aluminum electrolytic are less expensive than tantalums, but their ESR varies exponentially at cold
temperatures; therefore requiring close examination when choosing the desired transient response over
temperature. Tantalums are a convenient choice because their ESR varies less than 2:1 over temperature.
The recommended load/decoupling capacitance is a 10uF tantalum or a 50uF aluminum. These values will
assure stability for the majority of applications.
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The adjustable versions allows an additional capacitor to be used at the ADJ pin to increase ripple rejection. If
this is done the output capacitor should be increased to 22uF for tantalums or to 150uF for aluminum.
Capacitors other than tantalum or aluminum can be used at the adjust pin and the input pin. A 10uF capacitor is
a reasonable value at the input. See RIPPLE REJECTION section regarding the value for the adjust pin
capacitor.
It is desirable to have large output capacitance for applications that entail large changes in load current
(microprocessors for example). The higher the capacitance, the larger the available charge per demand. It is also
desirable to provide low ESR to reduce the change in output voltage:
V = ΔI x ESR
It is common practice to use several tantalum and ceramic capacitors in parallel to reduce this change in the
output voltage by reducing the overall ESR.
Output capacitance can be increased indefinitely to improve transient response and stability.
RIPPLE REJECTION
Ripple rejection is a function of the open loop gain within the feed-back loop (refer to Figure 15 and Figure 16).
The LM1085 exhibits 75dB of ripple rejection (typ.). When adjusted for voltages higher than VREF, the ripple
rejection decreases as function of adjustment gain: (1+R1/R2) or VO/VREF. Therefore a 5V adjustment decreases
ripple rejection by a factor of four (−12dB); Output ripple increases as adjustment voltage increases.
However, the adjustable version allows this degradation of ripple rejection to be compensated. The adjust
terminal can be bypassed to ground with a capacitor (CADJ). The impedance of the CADJ should be equal to or
less than R1 at the desired ripple frequency. This bypass capacitor prevents ripple from being amplified as the
output voltage is increased.
1/(2π*fRIPPLE*CADJ) ≤ R1
LOAD REGULATION
The LM1085 regulates the voltage that appears between its output and ground pins, or between its output and
adjust pins. In some cases, line resistances can introduce errors to the voltage across the load. To obtain the
best load regulation, a few precautions are needed.
Figure 17 shows a typical application using a fixed output regulator. Rt1 and Rt2 are the line resistances. VLOAD
is less than the VOUT by the sum of the voltage drops along the line resistances. In this case, the load regulation
seen at the RLOAD would be degraded from the data sheet specification. To improve this, the load should be tied
directly to the output terminal on the positive side and directly tied to the ground terminal on the negative side.
Figure 17. Typical Application using Fixed Output Regulator
When the adjustable regulator is used (Figure 18), the best performance is obtained with the positive side of the
resistor R1 tied directly to the output terminal of the regulator rather than near the load. This eliminates line drops
from appearing effectively in series with the reference and degrading regulation. For example, a 5V regulator with
0.05Ω resistance between the regulator and load will have a load regulation due to line resistance of 0.05Ω x IL.
If R1 (= 125Ω) is connected near the load the effective line resistance will be 0.05Ω (1 + R2/R1) or in this case, it
is 4 times worse. In addition, the ground side of the resistor R2 can be returned near the ground of the load to
provide remote ground sensing and improve load regulation.
8
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Figure 18. Best Load Regulation using Adjustable Output Regulator
PROTECTION DIODES
Under normal operation, the LM1085 regulator does not need any protection diode. With the adjustable device,
the internal resistance between the adjustment and output terminals limits the current. No diode is needed to
divert the current around the regulator even with a capacitor on the adjustment terminal. The adjust pin can take
a transient signal of ±25V with respect to the output voltage without damaging the device.
When an output capacitor is connected to a regulator and the input is shorted, the output capacitor will discharge
into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage
of the regulator, and rate of decrease of VIN. In the LM1085 regulator, the internal diode between the output and
input pins can withstand microsecond surge currents of 10A to 20A. With an extremely large output capacitor
(≥1000 µf), and with input instantaneously shorted to ground, the regulator could be damaged. In this case, an
external diode is recommended between the output and input pins to protect the regulator, shown in Figure 19.
Figure 19. Regulator with Protection Diode
OVERLOAD RECOVERY
Overload recovery refers to regulator's ability to recover from a short circuited output. A key factor in the recovery
process is the current limiting used to protect the output from drawing too much power. The current limiting circuit
reduces the output current as the input to output differential increases. Refer to short circuit curve in the Typical
Performance Characteristics section.
During normal start-up, the input to output differential is small since the output follows the input. But, if the output
is shorted, then the recovery involves a large input to output differential. Sometimes during this condition the
current limiting circuit is slow in recovering. If the limited current is too low to develop a voltage at the output, the
voltage will stabilize at a lower level. Under these conditions it may be necessary to recycle the power of the
regulator in order to get the smaller differential voltage and thus adequate start up conditions. Refer to Typical
Performance Characteristics section for the short circuit current vs. input differential voltage.
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THERMAL CONSIDERATIONS FOR THE TO-220 PACKAGE
ICs heats up when in operation, and power consumption is one factor in how hot it gets. The other factor is how
well the heat is dissipated. Heat dissipation is predictable by knowing the thermal resistance between the IC and
ambient (θJA). Thermal resistance has units of temperature per power (°C/W). The higher the thermal resistance,
the hotter the IC.
The LM1085 specifies the thermal resistance for the TO-220 package as Junction to Case (θJC). In order to get
the total resistance to ambient (θJA), two other thermal resistances must be added, one for case to heat-sink
(θCH) and one for heatsink to ambient (θHA). The junction temperature can be predicted as follows:
TJ = TA + (PD x (θJC + θCH + θHA))
TJ = TA + (PD x θJA)
(1)
(2)
where TJ is junction temperature, TA is ambient temperature, and PD is the power dissipation of the device.
Device power dissipation is calculated as follows:
PD = OUTPUT Section Dissipation + CONTROL Section Dissipation
PD = ( (VIN - VOUT) x ILOAD) + ( (VIN - VOUT) x IGND)
(3)
(4)
Figure 20 shows the voltages and currents which are present in the circuit.
Figure 20. Power Dissipation Diagram
Once the devices power is determined, the maximum allowable (θJA(max)) is calculated as:
θJA(MAX) = TR(MAX) / PD
θJA(MAX)= TJ(MAX) - TA(MAX)) / PD
(5)
(6)
The required heat sink is determined by calculating its required thermal resistance (θHA(MAX)).
θHA(MAX) = θJA(MAX) − (θJC + θCH)
(7)
If thermal compound is used, θCH can be estimated at 0.2 C/W. If the case is soldered to the heat sink, then a
θCH can be estimated as 0 C/W.
If PC board copper is going to be used as a heat sink, then Figure 21 can be used to determine the appropriate
area (size) of copper foil required.
10
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Figure 21. Heat sink thermal Resistance vs Area
THERMAL CONSIDERATION FOR THE DDPAK/TO-263 PACKAGE
Unlike the TO-220 package, the TO-263 package uses the printed circuit board as the heat sink to remove heat
from the device. The device dissipation is:
PD = OUTPUT Section Dissipation + CONTROL Section Dissipation
(8)
For the LM1085IS-x.x pre-set voltage versions, the dissipation can be calculated using:
PD = ( (VIN - VOUT) x ILOAD) + ( (VIN- VOUT) x IGND)
(9)
The LM1085IS-ADJ adjustable voltage version, the dissipation can be calculated using:
PD = ( (VIN - VOUT) x ILOAD) + ( (VIN - VOUT) x (VREF / R1))
(10)
Current through the ADJ pin is sufficiently small such that any contribution to the device dissipation is so low that
it can safely be ignored.
Maximum power dissipation of the LM1085IS depends on the total thermal resistance from the silicon junction
through the package TAB (θJC), into the PC board, copper traces, and other materials, and then into the
surrounding air (θJA), the maximum allowed operating junction temperature (TJ(MAX)) of 125°C, and the maximum
ambient temperature (TA(MAX)). The maximum power dissipation in the device is:
PD(MAX) = (TJ(MAX) - TA(MAX)) / (θJA
(11)
For the LM1085IS in the DDPAK/TO-263 3-pin package, the junction-to-case thermal rating, θJC, is 0.7°C/W,
where the case is the bottom of the package at the center of the TAB. Typical junction-to-ambient thermal
performance for the LM1085IS, using the JESD51 standards, is summarized in the following table:
BOARD TYPE
THERMAL VIAS
θJA
JEDEC 2-Layer
(per JESD 51-3)
None
81 °C/W
0
59 °C/W
2
31 °C/W
4
27 °C/W
8
24 °C/W
12
23 °C/W
JEDEC 4-Layer
(per JESD 51-7)
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For more information refer to : “Application Note 1520 A Guide to Board Layout for Best Thermal Resistance for
Exposed Packages”, TI Literature Number: SNVA183
It is important to remember that the TAB of the LM1085IS package is internally conntected to device pin 2
(OUTPUT), so the copper area connected to the TAB must be isolated from all other potentials, including ground.
The copper area connected to the TAB can be left floating, used as the primary VOUT connection, or connected to
device pin 2 (OUTPUT) .
Typical Applications
12
Figure 22. 5V to 3.3V, 1.5A Regulator
Figure 23. Adjustable @ 5V
Figure 24. 1.2V to 15V Adjustable Regulator
Figure 25. 5V Regulator with Shutdown
Figure 26. Battery Charger
Figure 27. Adjustable Fixed Regulator
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Figure 28. Regulator with Reference
Figure 29. High Current Lamp Driver Protection
Figure 30. Battery Backup Regulated Supply
Figure 31. Ripple Rejection Enhancement
Figure 32. Automatic Light control
Figure 33. Generating Negative Supply voltage
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Figure 34. Remote Sensing
14
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REVISION HISTORY
Changes from Revision F (March 2013) to Revision G
•
Page
Deleted layout of National Data Sheet to TI format ............................................................................................................ 14
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PACKAGE OPTION ADDENDUM
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11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
LM1085IS-12/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LM1085
IS-12
LM1085IS-3.3
ACTIVE
DDPAK/
TO-263
KTT
3
45
TBD
Call TI
Call TI
-40 to 125
LM1085
IS-3.3
LM1085IS-3.3/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LM1085
IS-3.3
LM1085IS-5.0/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LM1085
IS-5.0
LM1085IS-ADJ
ACTIVE
DDPAK/
TO-263
KTT
3
45
TBD
Call TI
Call TI
LM1085IS-ADJ/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
LM1085ISX-3.3
ACTIVE
DDPAK/
TO-263
KTT
3
500
TBD
Call TI
Call TI
LM1085ISX-3.3/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
500
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LM1085
IS-3.3
LM1085ISX-5.0/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
500
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LM1085
IS-5.0
LM1085ISX-ADJ
ACTIVE
DDPAK/
TO-263
KTT
3
500
TBD
Call TI
Call TI
-40 to 125
LM1085
IS-ADJ
LM1085ISX-ADJ/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
500
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LM1085
IS-ADJ
LM1085IT-12/NOPB
ACTIVE
TO-220
NDE
3
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 125
LM1085
IT-12
LM1085IT-3.3/NOPB
ACTIVE
TO-220
NDE
3
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 125
LM1085
IT-3.3
LM1085IT-5.0
ACTIVE
TO-220
NDE
3
45
TBD
Call TI
Call TI
LM1085IT-5.0/NOPB
ACTIVE
TO-220
NDE
3
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 125
LM1085
IT-5.0
LM1085IT-ADJ
ACTIVE
TO-220
NDE
3
45
TBD
Call TI
Call TI
-40 to 125
LM1085
IT-ADJ
LM1085IT-ADJ/NOPB
ACTIVE
TO-220
NDE
3
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 125
LM1085
IT-ADJ
Addendum-Page 1
LM1085
IS-ADJ
-40 to 125
LM1085
IS-ADJ
LM1085
IS-3.3
LM1085
IT-5.0
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM1085ISX-3.3
DDPAK/
TO-263
KTT
3
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
LM1085ISX-3.3/NOPB
DDPAK/
TO-263
KTT
3
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
LM1085ISX-5.0/NOPB
DDPAK/
TO-263
KTT
3
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
LM1085ISX-ADJ
DDPAK/
TO-263
KTT
3
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
LM1085ISX-ADJ/NOPB
DDPAK/
TO-263
KTT
3
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM1085ISX-3.3
DDPAK/TO-263
KTT
3
500
367.0
367.0
45.0
LM1085ISX-3.3/NOPB
DDPAK/TO-263
KTT
3
500
367.0
367.0
45.0
LM1085ISX-5.0/NOPB
DDPAK/TO-263
KTT
3
500
367.0
367.0
45.0
LM1085ISX-ADJ
DDPAK/TO-263
KTT
3
500
367.0
367.0
45.0
LM1085ISX-ADJ/NOPB
DDPAK/TO-263
KTT
3
500
367.0
367.0
45.0
Pack Materials-Page 2
MECHANICAL DATA
NDE0003B
www.ti.com
MECHANICAL DATA
KTT0003B
TS3B (Rev F)
BOTTOM SIDE OF PACKAGE
www.ti.com
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