TECHNICAL NOTE Power Management LSI Series for Automotive Body Control High temperature operating LDO Regulator Now available BD3940FP, BD3941FP/HFP/T zDescription BD394□FP Series regulators feature a high 36 V breakdown voltage and are compatible with onboard vehicle microcontrollers. They offer an output current of 500 mA while limiting dark current to 30 µA (TYP). The series supports the use of ceramic capacitors as output phase compensation capacitors. Since the ICs use P-channel DMOS output transistors, increased loads do not result in increased total supply current. BD394□FP Series is ideal for lowering current consumption and costs in battery direct-coupled systems. zFeatures 1) Super-low dark current: 30 µA (Typ.) 2) Low-saturation voltage type P-channel DMOS output transistors Output on resistance: 1.6 Ω (Typ.) 3) High precision output voltage: 5 V ±2% (Ta = 25°C) / Iomax = 500 mA 4) Low-ESR ceramic capacitors can be used as output capacitors 5) Vcc power supply voltage = 36 V / Peak power supply voltage = 50 V (tr ≥ 1 ms, tH ≤ 200 ms) 6) Built-in over current protection circuit and thermal shutdown circuit 7) TO252-3/HRP-5/TO220FP-3 package zApplications Vehicle equipment, car stereos, satellite navigation systems, etc. zProduct line Model Output voltage BD3940FP BD3941FP/HFP/T 3.3 V 5.0 V zAbsolute maximum ratings (Ta = 25°C) Parameter Power supply voltage Output current Symbol Limit Vcc 36*1 Unit V Io 500 mA 1.2*2 Power dissipation Pd 1.6*3 2.0 W *4 Operating temperature range Topr −40 to +125 °C Storage temperature range Tstg −55 to +150 °C Vcc Peak 50*5 V Tjmax 150 °C Peak power supply voltage Maximum junction temperature * 1Not to exceed Pd. *2 For TO252-3, reduced by 9.6 mW/°C over 25°C, when mounted on a glass epoxy board (70 mm × 70 mm × 1.6 mm). *3 Reduced by 12.8 mW/°C over 25°C, when mounted on a glass epoxy board (70 mm × 70 mm × 1.6 mm). *4 For TO220FP-3, reduced by 16.0 mW/°C over 25°C. *5 Application time 200 ms or shorter. (tr ≥ 1 ms) Ver.B Oct2005 zRecommended operating conditions (Ta = 25°C) Parameter Input voltage Symbol Min. Max. Unit BD3940FP/HFP Vcc 4.5 25.0 V BD3941FP/HFP/T Vcc 6.2 25.0 V Io — 500 mA Output current zElectrical characteristics (Unless otherwise specified, Ta = 25°C; Vcc = 13.2 V; Io = 200 mA) Parameter Symbol Limit Min. Typ. Max. Unit Conditions Bias current 1 Ib1 — 30 40 µA Io = 0 mA Bias current 2 Ib2 — 30 — µA Io = 200 mA BD3940FP Vo 3.234 3.300 3.366 V BD3941FP/HFP/T Vo 4.900 5.000 5.100 V Io 500 — — mA ∆Vd — 0.45 0.65 V R.R. 45 55 — dB Reg.I — 10 30 mV Reg.L — 20 60 mV Output voltage Output current BD3940FP Minimum I/O voltage difference BD3941FP/HFP/T Ripple rejection BD3940FP Input stability BD3941FP/HFP/T Load stability Vcc = 3.135 V, Io = 100 ｍA Vcc = 4.75 V, Io = 200 ｍA f = 120 Hz, ein = 1 Vrms, Io = 100 mA Vcc = 4.5 V → 25 V Vcc = 6.2 V → 25 V Io = 0 mA → 200 mA zElectrical characteristics (Unless otherwise specified, Ta = −40°C to +125°C; Vcc = 13.2 V; Io = 200 mA) Parameter Bias current 1 Ib1 — 30 40 µA Io = 0 mA Io = 200 mA — 30 — µA 3.168 3.300 3.366 V BD3941FP/HFP/T Vo 4.800 5.000 5.100 V Io 500 — — mA ∆Vd — — 0.9 V R.R. 45 55 — dB Reg.ｌ — 10 45 mV Reg.L — 20 60 mV BD3940FP difference BD3941FP/HFP/T Ripple rejection BD3940FP BD3941FP/HFP/T Conditions Max. Vo Minimum I/O voltage Load stability Unit Typ. Ib2 Output current Input stability Limit Min. BD3940FP Bias current 2 Output voltage Symbol Vcc = 3.135 V, Io = 100 ｍA Vcc = 4.75 V, Io = 200 ｍA f = 120 Hz, ein = 1 Vrms, Io = 100 mA Vcc = 4.5 V → 25 V Vcc = 6.2 V → 25 V Io = 0 mA → 200 mA Note: This IC is not designed to be radiation-resistant. Note: All characteristics are measured with 0.33 µF and 0.1 µF capacitors connected to input and output pins, respectively. Because measurements (pulse measurements) were taken when Ta ≈ Tj, data other than the output voltage/temperature coefficient does not include fluctuations due to temperature variations. 2/8 zReference data (Unless otherwise specified, Ta = 25°C) 30 20 10 5 4 Ta = −40°C 3 Ta = 25°C 2 Ta = 125°C 1 5 10 15 20 0 25 5 15 20 SUPPLY VOLTAGE: Vｃｃ [V] Fig. 1 Total Supply Current Fig. 2 Output Voltage vs Power Supply Voltage 0.6 0.4 0.2 100 200 300 400 50 40 30 20 10 100 1000 0.05 0 400 65 3 55 50 2 1 120 140 160 180 120 AMBIENT TEMPERATURE: Ta [℃] Fig. 10 Ripple Rejection vs Temperature 30 35 40 4.75 4.5 -40 200 0 40 80 120 AMBIENT TEMPERATURE: Ta [℃] AMBIENT TEMPERATURE: Ta [ ℃] Fig. 8 Thermal Shutdown Circuit Fig. 9 Output Voltage vs Temperature 50 0.5 0.4 0.3 0.2 0.1 0 45 25 5 CIRCUIT CURRENT: Icc [µA] DROPOUT VOLTAGE: ∆Vd [V] 60 80 1 5.25 0.6 40 2 Fig. 6 Overvoltage Protection 4 Fig. 7 Total Supply Current Classified by Load 0 Ta = −40°C SUPPLY VOLTAGE: Vcc [V] 5 OUTPUT CURRENT: Io [mA] -40 Ta = 125°C 3 5.5 0 100 500 2000 Ta = 25°C 20 OUTPUT VOLTAGE: Vo [V] OUTPUT VOLTAGE: Vo [V] 0.1 1500 4 Fig. 5 Ripple Rejection 0.15 1000 5 10000 100000 1E+06 6 300 500 FREQUENCY: f [Hz] 0.2 200 1 0 10 Fig. 4 I/O Voltage Difference 100 Ta = 125°C 6 OUTPUT CURRENT: Io [mA] 0 2 Fig. 3 Output Voltage vs Load 60 500 3 OUTPUT CURRENT: Io [mA] 0 0 Ta = 25°C 0 OUTPUT VOLTAGE: Vo [V] RIPPLE REJECTION: R.R. [dB] 0.8 4 25 70 0 CIRCUIT CURRENT: Icc [mA] 10 SUPPLY VOLTAGE: Vｃｃ [V] 1 5 0 0 0 RIPPLE REJECTION: R.R. [dB] OUTPUT VOLTAGE: Vo [V] Ta = −40°C 40 0 DROPOUT VOLTAGE: ∆Vd [V] 6 6 OUTPUT VOLTAGE: Vo [V] CIRCUIT CURRENT: Icc [µA] 50 40 30 20 10 0 -40 0 40 80 120 AMBIENT TEMPERATURE: Ta [℃] Fig. 11 Min. I/O Voltage Differential vs Temperature 3/8 -40 0 40 80 120 AMBIENT TEMPERATURE: Ta [℃] Fig. 12 Total Supply Current vs Temperature zBlock diagram Vcc Vcc Vcc 1 1 1 Cin Cin Cin Vref Vref Vref Vo Vo 3 OCP OCP Co OVP GND Co OCP OVP GND TSD Fin Fin 2 N.C Fig.13 Vo 3 5 TO252-3 3 Co OVP GND TSD TSD 2 2 4 N.C . N.C Fig.14 HRP5 Fig.15 TO220FP-3 Cin : 0.33 µF to 1000 µF Co : 0.1 µF to 1000 µF zPin assignments • TO252-3 FIN 1 2 3 Pin No. Pin No. Function 1 Vcc Power supply pin 2 N.C. NC pin 3 Vo Voltage output pin Fin GND Ground pin Pin No. Pin No. Function 1 Vcc Power supply pin Fig.16 • HRP5 FIN 1 2 34 5 Fig.17 2 N.C. NC pin 3 GND Ground pin 4 N.C. NC pin 5 Vo Voltage output pin Fin GND Ground pin Pin No. Pin No. Function 1 Vcc Power supply pin 2 GND Ground pin 3 Vo Voltage output pin • TO220FP-3 1 23 Fig.18 4/8 zThermal design TO252-3 HRP5 TO220FP-3 2.0 2.0 25 IC mounted on a ROHM standard board IC mounted on a ROHM standard board θja = 104.2 (°C /W) 1.2W 1.2 0.8 0.4 0 1.6W 1.6 Board size: 70 mm ×70 mm × 1.6mm θja = 78.1 (°C /W) 50 75 100 125 150 (2)IC 単体時 θja=62.5(℃/W) 15 1.2 10 0.8 0.4 5 (2)2.0W 0 0 25 0 (1)無限大放熱板使用時 θja=6.25( /W) (1)20W 20 POWER DISSIPATION: Pd [W] POWER DISSIPATION: Pd [W] POWER DISSIPATION: Pd [W] Board size: 70 mm ×70 mm × 1.6mm 1.6 0 25 50 75 100 125 150 0 AMBIENT TEMPERATURE: Ta [℃] AMBIENT TEMPERATURE: Ta [℃] Fig.19 25 50 75 100 125 150 AMBIENT TEMPERATURE: Ta [℃] Fig.20 Fig.21 Refer to the dissipation reduction illustrated in Figs. 19 to 21 when using the IC in an environment where Ta ≥ 25°C. The characteristics of the IC are greatly influenced by the operating temperature. If the temperature exceeds the maximum junction temperature Tjmax, the elements of the IC may be damaged. It is necessary to give sufficient consideration to the heat of the IC in view of two points, i.e., the protection of the IC from instantaneous damage and the maintenance of the reliability of the IC in long-time operation. In order to protect the IC from thermal destruction, the operating temperature of the IC must not exceed the maximum junction temperature Tjmax. Fig. 19 illustrates the power dissipation/power reduction for the TO252 package. Operate the IC within the power dissipation Pd. The following method is used to calculate the power consumption Pc (W). Pc = (Vcc − Vo) × Io + Vcc × Icc Power dissipation Pd ≤ Pc Vcc: Vo: Io: Icc: Input voltage Output voltage Load current Total supply current The load current Io is obtained to operate the IC within the power dissipation. Io ≤ Pd − Vcc × Icc Vcc − Vo (Refer to Icc in Fig.12) The maximum load current Iomax for the applied voltage Vcc can be calculated during the thermal design process. Calculation example Example) Vcc = 12 V and Vo = 5.0 V at Ta = 85°C, BD3941FP Io ≤ 0.624 −12 × Icc 12 − 5 Io ≤ 89 mA θja = 104.2°C/W → −9.6 mAW/°C 25°C = 1.2 W → 85°C = 0.624 W (Icc = 30 µA) Make a thermal calculation in consideration of the above equations so that the whole operating temperature range will be within the power dissipation. The power consumption Pc of the IC, in the event of shorting (i.e., if the Vo and GND pins are shorted), will be obtained from the following equation: Pc = Vcc × (Icc + Ishort) Ishort: Short current zExternal settings for pins and precautions 1) Vcc pin Insert capacitors with a capacitance of 0.33 µF to 1,000 µF between the Vcc and GND pins. The capacitance varies with the application. Be sure to design the capacitance with a sufficient margin. 2) Capacitors for stopping oscillation at output pins Capacitors for stopping oscillation must be placed between each output pin and the GND pin. Use a capacitor within a capacitance range between 1 µF and 1,000 µF. A ceramic capacitor with low ESR values, from 0.001 Ω to 100, can be used. Unstable input voltage and load fluctuations can affect output voltages. Output capacitor capacitance values should be determined for actual application. 5/8 zOperation Notes 1) Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2) GND voltage The potential of GND pin must be minimum potential in all operating conditions. 3) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 4) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. 5) Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. 6) Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. 7) Regarding input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used. Resistor Transistor (NPN) B (PinA) (PinB) C (PinB) E B C E P P+ P+ P P+ N P N GND P+ N N N Parasitic elements N or transistors P substrate Parasitic elements GND (PINA) Parasitic elements GND Parasitic elements or transistors Fig.22 Example of a Simple Monolithic IC Architecture 8) Ground Wiring Pattern When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. 6/8 9) Applications or inspection processes with modes where the potentials of the Vcc pin and other pins may be reversed from their normal states may cause damage to the IC's internal circuitry or elements. Use an output pin capacitance of 1,000 µF or lower in case Vcc is shorted with the GND pin while the external capacitor is charged. It is recommended to insert a diode for preventing back current flow in series with Vcc or bypass diodes between Vcc and each pin. Diode for preventing back current flow Vcc Bypass diode Pin Fig. 23 10) Thermal shutdown circuit (TSD) This IC incorporates a built-in thermal shutdown circuit for the protection from thermal destruction. The IC should be used within the specified power dissipation range. However, in the event that the IC continues to be operated in excess of its power dissipation limits, the attendant rise in the chip’s temperature Tj will trigger the thermal shutdown circuit to turn off all output power elements. The circuit will automatically reset once the chip’s temperature Tj drops. Operation of the thermal shutdown circuit presumes that the IC’s absolute maximum ratings have been exceeded. Application designs should never make use of the thermal shutdown circuit. (See Fig.8) 11) Overcurrent protection circuit (OCP) The IC incorporates a built-in overcurrent protection circuit that operates according to the output current capacity. This circuit serves to protect the IC from damage when the load is shorted. The protection circuit is designed to limit current flow by not latching in the event of a large and instantaneous current flow originating from a large capacitor or other component. However, while this protection circuit is effective in preventing damage due to sudden and unexpected accidents, it is not compatible with continuous operation or use during transitional periods. At the time of thermal designing, keep in mind that the current capability has negative characteristics to temperatures. (See Fig. 3.) 12) Overvoltage protection circuit (OVP) Overvoltage protection is designed to turn off all output when the voltage differential between the VCC and GND pins exceeds approximately 30 V (typ.). Use caution when determining the power supply voltage range to use. (See Fig. 6) zSelecting a model name when ordering 3 9 4 1 B D Part number 3940: 3.3 V output 3941: 5.0 V output ROHM model name F P E 2 Taping E2 : Reel-wound embossed taping Packaging type FP : TO252-3 HFP : HRP5 T : TO220FP-3 TO252-3 <Dimension> <Tape and Reel information> C0.5 6.5±0.2 2.3±0.2 1.5±0.2 +0.2 5.1−0.1 0.5±0.1 Embossed carrier tape Quantity 2000pcs Direction of feed E2 (The direction is the 1pin of product is at the lower left when you hold reel on the left hand and you pull out the tape on the right hand) 0.65 0.65 0.75 2.3±0.2 2.3±0.2 3 1.5 2 x x x x 2.5 1 0.8 9.5±0.5 5.5±0.2 FIN Tape x x x x x x x x x x x x x x x x x x x x 0.5±0.1 1.0±0.2 Reel (Unit:mm) 1pin Direction of feed ※When you order , please order in times the amount of package quantity. 7/8 HRP5 <Dimension> <Tape and Reel information> 2 3 4 1.523 ± 0.15 10.54 ± 0.13 0.835 ± 0.2 8.0 – 0.13 1 Tape Embossed carrier tape Quantity 2000pcs Direction of feed TR 1.905 ± 0.1 (7.49) 1.017 ± 0.2 9.395 ± 0.125 (MAX 9.745 include BURR) 8.82 – 0.1 (5.59) 5 1.2575 4.5 0.27 +5.5 -4.5 +0.1 -0.05 x x x x S 0.08 ± 0.05 (The direction is the 1pin of product is at the upper light when you hold reel on the left hand and you pull out the tape on the right hand) x x x x x x x x x x x x 0.73 ± 0.1 1.72 0.08 S Reel (Unit:mm) 1pin x x x x Direction of feed ※When you order , please order in times the amount of package quantity. TO220FP-3 <Dimension> <Packing information> + 0.3 − 0.1 7.0 + 0.3 − 0.1 12.0 ± 0.2 5.0 ± 0.2 8.0 ± 0.2 13.5Min. 17.0 + 0.4 − 0.2 1.8 ± 0.2 10.0 4.5 φ 3.2 ± 0.1 + 0.3 − 0.1 2.8 + 0.2 − 0.1 Container Tube Quantity 500pcs Direction of feed Direction of products is fixed in a container tube. 1.3 1 2.54 ± 0.5 0.8 3 2.54 ± 0.5 0.55 + 0.1 − 0.05 2.6 ± 0.5 (Unit:mm) ※When you order , please order in times the amount of package quantity. The contents described herein are correct as of October, 2005 The contents described herein are subject to change without notice. For updates of the latest information, please contact and confirm with ROHM CO.,LTD. Any part of this application note must not be duplicated or copied without our permission. Application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. Please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. Any data, including, but not limited to application circuit diagrams and information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by ROHM CO., LTD. is granted to any such buyer. The products described herein utilize silicon as the main material. The products described herein are not designed to be X ray proof. Published by Application Engineering Group 8/8 Catalog NO.05T389Be '05.10 ROHM C 1000 TSU Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request that specifications to be separately delivered. Application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. Please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. Any data, including, but not limited to application circuit diagrams information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, no express or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by ROHM CO., LTD. is granted to any such buyer. Products listed in this document are no antiradiation design. The products listed in this document are designed to be used with ordinary electronic equipment or devices (such as audio visual equipment, office-automation equipment, communications devices, electrical appliances and electronic toys). Should you intend to use these products with equipment or devices which require an extremely high level of reliability and the malfunction of which would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), please be sure to consult with our sales representative in advance. It is our top priority to supply products with the utmost quality and reliability. However, there is always a chance of failure due to unexpected factors. Therefore, please take into account the derating characteristics and allow for sufficient safety features, such as extra margin, anti-flammability, and fail-safe measures when designing in order to prevent possible accidents that may result in bodily harm or fire caused by component failure. ROHM cannot be held responsible for any damages arising from the use of the products under conditions out of the range of the specifications or due to non-compliance with the NOTES specified in this catalog. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact your nearest sales office. ROHM Customer Support System www.rohm.com Copyright © 2008 ROHM CO.,LTD. THE AMERICAS / EUROPE / ASIA / JAPAN Contact us : webmaster@ rohm.co. jp 21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan TEL : +81-75-311-2121 FAX : +81-75-315-0172 Appendix1-Rev2.0