AD AD9776A-EBZ Dual, 12-/14-/16-bit,1 gsp Datasheet

Dual, 12-/14-/16-Bit,1 GSPS
Digital-to-Analog Converters
AD9776A/AD9778A/AD9779A
FEATURES
GENERAL DESCRIPTION
Low power: 1.0 W @ 1 GSPS, 600 mW @ 500 MSPS,
full operating conditions
Single carrier W-CDMA ACLR = 80 dBc @ 80 MHz IF
Analog output: adjustable 8.7 mA to 31.7 mA,
RL = 25 Ω to 50 Ω
Novel 2×, 4×, and 8× interpolator/coarse complex modulator
allows carrier placement anywhere in DAC bandwidth
Auxiliary DACs allow control of external VGA and offset control
Multiple chip synchronization interface
High performance, low noise PLL clock multiplier
Digital inverse sinc filter
100-lead, exposed paddle TQFP
The AD9776A/AD9778A/AD9779A are dual, 12-/14-/16-bit,
high dynamic range digital-to-analog converters (DACs) that
provide a sample rate of 1 GSPS, permitting a multicarrier
generation up to the Nyquist frequency. They include features
optimized for direct conversion transmission applications,
including complex digital modulation and gain and offset
compensation. The DAC outputs are optimized to interface
seamlessly with analog quadrature modulators such as the
ADL537x FMOD series from Analog Devices, Inc. A 3-wire
interface provides for programming/readback of many internal
parameters. Full-scale output current can be programmed over
a range of 10 mA to 30 mA. The devices are manufactured on
an advanced 0.18 μm CMOS process and operate on 1.8 V and
3.3 V supplies for a total power consumption of 1.0 W. They are
enclosed in a 100-lead thin quad flat package (TQFP).
APPLICATIONS
Wireless infrastructure
W-CDMA, CDMA2000, TD-SCDMA, WiMax, GSM, LTE
Digital high or low IF synthesis
Internal digital upconversion capability
Transmit diversity
Wideband communications: LMDS/MMDS, point-to-point
PRODUCT HIGHLIGHTS
1.
2.
3.
4.
5.
Ultralow noise and intermodulation distortion (IMD)
enable high quality synthesis of wideband signals from
baseband to high intermediate frequencies.
A proprietary DAC output switching technique enhances
dynamic performance.
The current outputs are easily configured for various
single-ended or differential circuit topologies.
CMOS data input interface with adjustable setup and hold.
Novel 2×, 4×, and 8× interpolator/coarse complex
modulator allows carrier placement anywhere in DAC
bandwidth.
TYPICAL SIGNAL CHAIN
QUADRATURE
MODULATOR/
MIXER/
AMPLIFIER
COMPLEX I AND Q
DC
LO
DC
DIGITAL INTERPOLATION FILTERS
I DAC
POST DAC
ANALOG FILTER
Q DAC
AD9776A/AD9778A/AD9779A
A
06452-114
FPGA/ASIC/DSP
Figure 1.
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113 ©2007–2008 Analog Devices, Inc. All rights reserved.
AD9776A/AD9778A/AD9779A
TABLE OF CONTENTS
Features .............................................................................................. 1
Inverse Sinc Filter ....................................................................... 38
Applications ....................................................................................... 1
Sourcing the DAC Sample Clock ................................................. 39
General Description ......................................................................... 1
Direct Clocking .......................................................................... 39
Product Highlights ........................................................................... 1
Clock Multiplication .................................................................. 39
Typical Signal Chain......................................................................... 1
Driving the REFCLK Input ....................................................... 42
Revision History ............................................................................... 3
Full-Scale Current Generation ..................................................... 43
Functional Block Diagram .............................................................. 4
Internal Reference ...................................................................... 43
Specifications..................................................................................... 5
Gain and Offset Correction .......................................................... 44
DC Specifications ......................................................................... 5
I/Q Channel Gain Matching ..................................................... 44
Digital Specifications ................................................................... 6
Auxiliary DAC Operation ......................................................... 44
Digital Input Data Timing Specifications ................................. 7
LO Feedthrough Compensation .............................................. 45
AC Specifications.......................................................................... 8
Results of Gain and Offset Correction .................................... 45
Absolute Maximum Ratings............................................................ 9
Input Data Ports ............................................................................. 46
Thermal Resistance ...................................................................... 9
Single Port Mode ........................................................................ 46
ESD Caution .................................................................................. 9
Dual Port Mode .......................................................................... 46
Pin Configurations and Function Descriptions ......................... 10
Input Data Referenced to DATACLK ...................................... 46
Typical Performance Characteristics ........................................... 16
Input Data Referenced to REFCLK ......................................... 47
Terminology .................................................................................... 24
Optimizing the Data Input Timing.......................................... 48
Theory of Operation ...................................................................... 25
Device Synchronization ................................................................. 49
Differences Between AD9776/AD9778/ AD9779 and
AD9776A/AD9778A/AD9779A............................................... 25
Synchronization Logic Overview ............................................. 49
3-Wire Interface .............................................................................. 26
Interrupt Request Operation .................................................... 50
General Operation of the Serial Interface ............................... 26
Power Dissipation ........................................................................... 51
Instruction Byte .......................................................................... 26
Power-Down and Sleep Modes................................................. 52
Serial Interface Port Pin Descriptions ..................................... 27
Evaluation Board Overview .......................................................... 53
MSB/LSB Transfers..................................................................... 27
Evaluation Board Operation ..................................................... 53
3-Wire Interface Register Map ...................................................... 28
Outline Dimensions ....................................................................... 55
Interpolation Filter Architecture .................................................. 33
Ordering Guide .......................................................................... 55
Synchronizing Devices to a System Clock .............................. 50
Interpolation Filter Bandwidth Limits .................................... 37
Rev. B | Page 2 of 56
AD9776A/AD9778A/AD9779A
REVISION HISTORY
9/08—Rev. A to Rev. B
Changed Serial Peripheral Interface (SPI) to 3-Wire Interface
Throughout ................................................................................... 1
Change to Features Section .............................................................. 1
Change to Applications Section ...................................................... 1
Changes to Integral Nonlinearity (INL) Parameter, Table 1 ....... 5
Changes to DAC Clock Input (REFCLK+, REFCLK−)
Parameter, Table 2 ........................................................................ 6
Changes to Input Data Parameter, Table 3..................................... 7
Changes to Hold Time Parameters, Table 3................................... 7
Added 3-Wire Interface Parameter, Table 3................................... 7
Added Reset Parameter, Table 3 ...................................................... 7
Changes to Endnotes, Table 3 .......................................................... 7
Added Exposed Pad Notation to Figure 3, Changes to Table 7 ...... 10
Added Exposed Pad Notation to Figure 4, Changes to Table 8 ...... 12
Added Exposed Pad Notation to Figure 5, Changes to Table 9 ...... 14
Changes to DATACLK Delay Range Section ..............................25
Changes to Version Register Section ............................................25
Changes to Table 10 ........................................................................25
Changes to Table 12 ........................................................................26
Changes to Table 13 ........................................................................28
Changes to Table 14 ........................................................................29
Changes to Interpolation Filter Architecture Section ................33
Changes to Figure 60 ......................................................................34
Changes to Table 19 ........................................................................36
Changes to Interpolation Filter Bandwidth Limits Section.......37
Changes to Figure 70 ......................................................................37
Added Digital Modulation Section ...............................................37
Added Table 20 and Table 21; Renumbered Sequentially ..........38
Added Inverse Sinc Filter Section .................................................38
Added Figure 71; Renumbered Sequentially ...............................38
Changes to Clock Multiplication Section ....................................39
Changes to Figure 72 ......................................................................39
Changes to Configuring the PLL Band Select Value Section ....39
Changes to Configuring the PLL Band Select with Temperature
Sensing Section ...........................................................................41
Changes to Known Temperature Calibration with Memory
Section .........................................................................................41
Changes to Set-and-Forget Device Option Section ....................41
Added Table 26 ................................................................................41
Changes to Internal Reference Section.........................................43
Changed Transmit Path Gain and Offset Correction Heading to
Gain and Offset Correction ......................................................44
Changes to I/Q Channel Gain Matching Section .......................44
Changes to Auxiliary DAC Operation Section ........................... 44
Replaced Figure 79 .......................................................................... 45
Deleted Figure 79; Renumbered Sequentially ............................. 41
Changes to LO Feedthrough Compensation Section................. 45
Changes to Table 28 ........................................................................ 47
Changes to Optimizing the Data Input Timing Section ............ 48
Change to Synchronization Logic Overview Section ................. 49
Changes to Figure 88 ...................................................................... 49
Changes to Figure 101 .................................................................... 53
Deleted Using the ADL5372 Quadrature Modulator Section and
Figure 104 .................................................................................... 51
Deleted Evaluation Board Schematics Section and Figure 105;
Renumbered Sequentially ......................................................... 52
Deleted Figure 106 .......................................................................... 53
Deleted Figure 107 .......................................................................... 54
Deleted Figure 108 .......................................................................... 55
Deleted Figure 109 .......................................................................... 56
Deleted Figure 110 .......................................................................... 57
Deleted Figure 111 .......................................................................... 58
Deleted Figure 112 .......................................................................... 59
Updated Outline Dimensions........................................................ 60
3/08—Rev. 0 to Rev. A
Changes to Features .......................................................................... 1
Added Note 2 ..................................................................................... 4
Changes to Table 2 ............................................................................ 5
Changes to Table 3 ............................................................................ 6
Changes to Thermal Resistance Section ........................................ 7
Inserted Table 6 ................................................................................. 8
Changes to Pin 39 Description, Table 7 ......................................... 9
Changes to Pin 39 Description, Table 8 ....................................... 10
Changes to Pin 39 Description, Table 9 ....................................... 12
Changes to Theory of Operation Section .................................... 23
Changes to Table 10 ........................................................................ 23
Changes to Table 13 ........................................................................ 26
Changes to Table 14 ........................................................................ 27
Changes to Interpolation Filter Architecture Section ................ 33
Replaced Sourcing the DAC Sample Clock Section ................... 36
Replaced Transmit Path Gain and Offset Correction Section ........ 40
Replaced Input Data Ports Section ............................................... 42
Replaced Device Synchronization Section .................................. 45
Deleted Figure 112 to Figure 117 .................................................. 58
8/07—Revision 0: Initial Version
Rev. B | Page 3 of 56
AD9776A/AD9778A/AD9779A
FUNCTIONAL BLOCK DIAGRAM
DELAY
LINE
CLOCK GENERATION/DISTRIBUTION
SYNC_I
DATACLK
CLOCK
MULTIPLIER
2×/4×/8×
DELAY
LINE
DATA
ASSEMBLER
SINC^-1
2×
2×
2×
n × fDAC /8
n = 0, 1, 2 ... 7
Q
LATCH
2×
2×
2×
SINC^-1
DIGITAL CONTROLLER
10
10
SERIAL
PERIPHERAL
INTERFACE
16-BIT
I DAC
GAIN
16-BIT
Q DAC
OUT1_P
OUT1_N
OUT2_P
OUT2_N
VREF
I120
GAIN
POWER-ON
RESET
10
AD9779A
GAIN
AUX1_P
AUX1_N
GAIN
AUX2_P
AUX2_N
06452-001
10
SDO
SDIO
SCLK
CSB
P2D[15:0]
REFCLK–
COMPLEX
MODULATOR
P1D[15:0]
I
LATCH
REFCLK+
REFERENCE
AND BIAS
SYNC_O
Figure 2. AD9779A Functional Block Diagram
Rev. B | Page 4 of 56
AD9776A/AD9778A/AD9779A
SPECIFICATIONS
DC SPECIFICATIONS
TMIN to TMAX, AVDD33 = 3.3 V, DVDD33 = 3.3 V, DVDD18 = 1.8 V, CVDD18 = 1.8 V, IOUTFs = 20 mA, maximum sample rate, unless
otherwise noted.
Table 1.
Parameter
RESOLUTION
ACCURACY
Differential Nonlinearity (DNL)
Integral Nonlinearity (INL)
MAIN DAC OUTPUTS
Offset Error
Gain Error (with Internal Reference)
Full-Scale Output Current 1
Output Compliance Range
Output Resistance
Gain DAC Monotonicity
MAIN DAC TEMPERATURE DRIFT
Offset
Gain
Reference Voltage
AUXILIARY DAC OUTPUTS
Resolution
Full-Scale Output Current1
Output Compliance Range (Source)
Output Compliance Range (Sink)
Output Resistance
Auxiliary DAC Monotonicity
REFERENCE
Internal Reference Voltage
Output Resistance
ANALOG SUPPLY VOLTAGES
AVDD33
CVDD18
DIGITAL SUPPLY VOLTAGES
DVDD33
DVDD18
POWER CONSUMPTION 2
1× Mode, fDAC = 100 MSPS, IF = 1 MHz
2× Mode, fDAC = 320 MSPS, IF = 16 MHz, PLL Off
2× Mode, fDAC = 320 MSPS, IF = 16 MHz, PLL On
4× Mode, fDAC/4 Modulation, fDAC = 500 MSPS,
IF = 137.5 MHz, Q DAC Off
8× Mode, fDAC/4 Modulation, fDAC = 1 GSPS,
IF = 262.5 MHz
Power-Down Mode
Power Supply Rejection Ratio, AVDD33
OPERATING RANGE
1
2
Min
AD9776A
Typ
Max
12
Min
±0.1
±0.86
−0.001
8.66
−1.0
0
±2
20.2
AD9779A
Typ Max
16
Min
±0.65
±1.5
+0.001
−0.001
31.66
+1.0
8.66
−1.0
10
Guaranteed
0
±2
20.2
±2.1
±6.0
+0.001
−0.001
31.66
+1.0
8.66
−1.0
10
Guaranteed
0.04
100
30
−1.998
0
0.8
1
Guaranteed
31.66
+1.0
−1.998
0
0.8
+1.998
1.6
1.6
1
Guaranteed
1.2
5
% FSR
% FSR
mA
V
MΩ
ppm/°C
ppm/°C
ppm/°C
10
+1.998
1.6
1.6
1
Guaranteed
1.2
5
+0.001
0.04
100
30
10
+1.998
1.6
1.6
0
±2
20.2
Unit
Bits
LSB
LSB
10
Guaranteed
0.04
100
30
10
−1.998
0
0.8
AD9778A
Typ
Max
14
1.2
5
Bits
mA
V
V
MΩ
V
kΩ
3.13
1.70
3.3
1.8
3.47
2.05
3.13
1.70
3.3
1.8
3.47
2.05
3.13
1.70
3.3
1.8
3.47
2.05
V
V
3.13
1.70
3.3
1.8
3.47
2.05
3.13
1.70
3.3
1.8
3.47
2.05
3.13
1.70
3.3
1.8
3.47
2.05
V
V
250
498
588
572
300
250
498
588
572
300
250
498
588
572
300
mW
mW
mW
mW
980
2.5
−0.3
−40
+25
980
9.8
+0.3
+85
2.5
−0.3
−40
Based on a 10 kΩ external resistor.
See the Power Dissipation section for more details.
Rev. B | Page 5 of 56
+25
980
9.8
+0.3
+85
2.5
−0.3
−40
+25
mW
9.8
+0.3
+85
mW
% FSR/V
°C
AD9776A/AD9778A/AD9779A
DIGITAL SPECIFICATIONS
TMIN to TMAX, AVDD33 = 3.3 V, DVDD33 = 3.3 V, DVDD18 = 1.8 V, CVDD18 = 1.8 V, IOUTFs = 20 mA, maximum sample rate, unless
otherwise noted. LVDS driver and receiver are compliant to the IEEE-1596 reduced range link, unless otherwise noted.
Table 2.
Parameter
CMOS INPUT LOGIC LEVEL
Input VIN Logic High
Input VIN Logic Low
Maximum Input Data Rate at Interpolation
1×
2×
4×
8×
CMOS OUTPUT LOGIC LEVEL (DATACLK, PIN 37) 1
Output VOUT Logic High
Output VOUT Logic Low
DATACLK Output Duty Cycle
LVDS RECEIVER INPUTS (SYNC_I+, SYNC_I−)
Input Voltage Range, VIA or VIB
Input Differential Threshold, VIDTH
Input Differential Hysteresis, VIDTHH − VIDTHL
Receiver Differential Input Impedance, RIN
LVDS Input Rate
Setup Time, SYNC_I to REFCLK
Hold Time, SYNC_I to REFCLK
LVDS DRIVER OUTPUTS (SYNC_O+, SYNC_O−)
Output Voltage High, VOA or VOB
Output Voltage Low, VOA or VOB
Output Differential Voltage, |VOD|
Output Offset Voltage, VOS
Output Impedance, RO
DAC CLOCK INPUT (REFCLK+, REFCLK−)
Differential Peak-to-Peak Voltage
Common-Mode Voltage
Maximum Clock Rate
1
Conditions
Min
Typ
Max
Unit
0.8
V
V
2.0
DVDD18, CVDD18 = 1.8 V ± 5%
DVDD18, CVDD18 = 1.9 V ± 5%
DVDD18, CVDD18 = 2.0 V ± 2%
300
250
200
112.5
125
137.5
MSPS
MSPS
MSPS
MSPS
MSPS
MSPS
2.4
At 250 MHz, into 5 pF load
SYNC_I+ = VIA, SYNC_I− = VIB
40
50
825
−100
0.4
60
1575
+100
20
80
120
250
Additional limits on fSYNC_I apply; see description of
Register 0x05, Bits[3:1], in Table 14
0.4
0.55
V
V
%
mV
mV
mV
Ω
MSPS
ns
ns
SYNC_O+ = VOA, SYNC_O− = VOB, 100 Ω termination
1375
Single-ended
1025
150
1150
80
DVDD18, CVDD18 = 1.8 V ± 5%, PLL off
DVDD18, CVDD18 = 1.9 V ± 5%, PLL off
DVDD18, CVDD18 = 2.0 V ± 2%, PLL off
DVDD18, CVDD18 = 2.0 V ± 2%, PLL on
400
300
900
1000
1100
250
200
100
250
1250
120
800
400
2000
500
mV
mV
mV
mV
Ω
mV
mV
MHz
MHz
MHz
MHz
Specification is at a DATACLK frequency of 100 MHz into a 1 kΩ load, with maximum drive capability of 8 mA. At higher speeds or greater loads, best practice suggests
using an external buffer for this signal.
Rev. B | Page 6 of 56
AD9776A/AD9778A/AD9779A
DIGITAL INPUT DATA TIMING SPECIFICATIONS
All modes, −40°C to +85°C.
Table 3.
Parameter
INPUT DATA 1
Setup Time
Hold Time
Setup Time
Hold Time
LATENCY
1× Interpolation
2× Interpolation
4× Interpolation
8× Interpolation
Inverse Sync
3-WIRE INTERFACE
Maximum Clock Rate (SCLK)
Minimum Pulse Width High, tPWH
Minimum Pulse Width Low, tPWL
Setup Time, tDS
Hold Time, tDH
Setup Time, tDS
Data Valid, tDV
POWER-UP TIME 2
RESET
Minimum Pulse Width, High
Conditions
Min
Input data to DATACLK
Input data to DATACLK
Input data to REFCLK
Input data to REFCLK
3.0
−0.05
−0.80
3.80
With or without modulation
With or without modulation
With or without modulation
With or without modulation
Typ
Max
ns
ns
ns
ns
25
70
146
297
18
DACCLK cycles
DACCLK cycles
DACCLK cycles
DACCLK cycles
DACCLK cycles
40
12.5
12.5
SDIO to SCLK
SDIO to SCLK
CSB to SCLK
SDO to SCLK
2.8
0.0
2.8
2.0
260
2
1
Unit
MHz
ns
ns
ns
ns
ns
ns
ms
DACCLK cycles
Specified values are with PLL disabled. Timing vs. temperature and data valid keep out windows (that is, the minimum amount of time valid data must be presented to
the device to ensure proper sampling) are delineated in Table 28.
2
Measured from CSB rising edge when Register 0x00, Bit 4, is written from 1 to 0 with the VREF decoupling capacitor equal to 0.1 μF.
Rev. B | Page 7 of 56
AD9776A/AD9778A/AD9779A
AC SPECIFICATIONS
TMIN to TMAX, AVDD33 = 3.3 V, DVDD33 = 3.3 V, DVDD18 = 1.8 V, CVDD18 = 1.8 V, IOUTFs = 20 mA, maximum sample rate, unless
otherwise noted.
Table 4.
Parameter
SPURIOUS-FREE DYNAMIC RANGE (SFDR)
fDAC = 100 MSPS, fOUT = 20 MHz
fDAC = 200 MSPS, fOUT = 50 MHz
fDAC = 400 MSPS, fOUT = 70 MHz
fDAC = 800 MSPS, fOUT = 70 MHz
TWO-TONE INTERMODULATION DISTORTION (IMD)
fDAC = 200 MSPS, fOUT = 50 MHz
fDAC = 400 MSPS, fOUT = 60 MHz
fDAC = 400 MSPS, fOUT = 80 MHz
fDAC = 800 MSPS, fOUT = 100 MHz
NOISE SPECTRAL DENSITY (NSD), EIGHT-TONE, 500 kHz
TONE SPACING
fDAC = 200 MSPS, fOUT = 80 MHz
fDAC = 400 MSPS, fOUT = 80 MHz
fDAC = 800 MSPS, fOUT = 80 MHz
W-CDMA ADJACENT CHANNEL LEAKAGE RATIO (ACLR),
SINGLE CARRIER
fDAC = 491.52 MSPS, fOUT = 100 MHz
fDAC = 491.52 MSPS, fOUT = 200 MHz
W-CDMA SECOND ADJACENT CHANNEL LEAKAGE RATIO
(ACLR), SINGLE CARRIER
fDAC = 491.52 MSPS, fOUT = 100 MHz
fDAC = 491.52 MSPS, fOUT = 200 MHz
Min
AD9776A
Typ
Max
Min
AD9778A
Typ
Max
Min
AD9779A
Typ
Max
Unit
82
81
80
85
82
81
80
85
82
82
80
87
dBc
dBc
dBc
dBc
87
80
75
75
87
85
81
80
91
85
81
81
dBc
dBc
dBc
dBc
−152
−155
−157.5
−155
−159
−160
−158
−160
−161
dBm/Hz
dBm/Hz
dBm/Hz
76
69
78
73
79
74
dBc
dBc
77.5
76
80
78
81
78
dBc
dBc
Rev. B | Page 8 of 56
AD9776A/AD9778A/AD9779A
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
AVDD33, DVDD33
DVDD18, CVDD18
AGND
DGND
CGND
I120, VREF, IPTAT
With Respect To
AGND, DGND,
CGND
AGND, DGND,
CGND
DGND, CGND
AGND, CGND
AGND, DGND
AGND
OUT1_P, OUT1_N,
OUT2_P, OUT2_N,
AUX1_P, AUX1_N,
AUX2_P, AUX2_N
P1D[15:0], P2D[15:0]
AGND
DATACLK, TXENABLE
DGND
REFCLK+, REFCLK−
CGND
RESET, IRQ, PLL_LOCK,
SYNC_O+, SYNC_O−,
SYNC_I+, SYNC_I−,
CSB, SCLK, SDIO, SDO
Junction Temperature
Storage Temperature
Range
DGND
DGND
Rating
−0.3 V to +3.6 V
−0.3 V to +2.1 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to
AVDD33 + 0.3 V
−1.0 V to
AVDD33 + 0.3 V
−0.3 V to
DVDD33 + 0.3 V
−0.3 V to
DVDD33 + 0.3 V
−0.3 V to
CVDD18 + 0.3 V
−0.3 V to
DVDD33 + 0.3 V
+125°C
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
For optimal thermal performance, the exposed paddle (EPAD)
should be soldered to the ground plane for the 100-lead,
thermally enhanced TQFP package.
Typical θJA and θJC are specified for a 4-layer board in still air.
Airflow increases heat dissipation, effectively reducing θJA.
Table 6. Thermal Resistance
Package Type
100-Lead TQFP
EPAD Soldered
EPAD Not Soldered
ESD CAUTION
Rev. B | Page 9 of 56
θJA
θJB
θJC
Unit
19.1
27.4
12.4
7.1
°C/W
°C/W
AD9776A/AD9778A/AD9779A
AVDD33
AGND
AVDD33
AGND
AVDD33
AGND
AGND
OUT2_P
OUT2_N
AGND
AUX2_P
AUX2_N
AGND
AUX1_N
AUX1_P
AGND
OUT1_N
OUT1_P
AGND
AGND
AVDD33
AGND
AVDD33
AGND
AVDD33
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
75
I120
74
VREF
73
IPTAT
4
72
AGND
REFCLK+
5
71
IRQ
REFCLK–
6
70
RESET
CGND
7
69
CSB
CGND
8
68
SCLK
CVDD18
9
67
SDIO
66
SDO
65
PLL_LOCK
AGND 12
64
DGND
SYNC_I+ 13
63
SYNC_O+
SYNC_I– 14
62
SYNC_O–
DGND 15
61
DVDD33
DVDD18 16
60
DVDD18
P1D11 17
59
NC
P1D10 18
58
NC
P1D9 19
57
NC
P1D8 20
56
NC
P1D7 21
55
P2D0
DGND 22
54
DGND
DVDD18 23
53
DVDD18
P1D6 24
52
P2D1
P1D5 25
51
P2D2
DIGITAL DOMAIN
AD9776A
CVDD18 10
TOP VIEW
(Not to Scale)
CGND 11
P2D3
P2D4
P2D5
P2D6
P2D7
P2D8
DGND
DVDD18
06452-002
NOTES
1. FOR OPTIMAL THERMAL PERFORMANCE, THE EXPOSED
PAD SHOULD BE SOLDERED TO THE GROUND PLANE FOR
THE 100-LEAD, THERMALLY ENHANCED TQFP PACKAGE.
P2D9
NC
NC
DVDD18
DGND
NC
P1D0
P1D1
P1D2
P1D3
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
P1D4
NC = NO CONNECT
P2D10
CGND
ANALOG DOMAIN
P2D11
3
TXENABLE/IQSELECT
CGND
PIN 1
DVDD33
2
DATACLK
1
CVDD18
NC
CVDD18
Figure 3. AD9776A Pin Configuration
Table 7. AD9776A Pin Function Descriptions
Pin
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Mnemonic
CVDD18
CVDD18
CGND
CGND
REFCLK+
REFCLK−
CGND
CGND
CVDD18
CVDD18
CGND
AGND
SYNC_I+
SYNC_I−
DGND
DVDD18
Description
1.8 V Clock Supply.
1.8 V Clock Supply.
Clock Ground.
Clock Ground.
Differential Clock Input.
Differential Clock Input.
Clock Ground.
Clock Ground.
1.8 V Clock Supply.
1.8 V Clock Supply.
Clock Ground.
Analog Ground.
Differential Synchronization Input.
Differential Synchronization Input.
Digital Ground.
1.8 V Digital Supply.
Pin
No.
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
Rev. B | Page 10 of 56
Mnemonic
P1D11
P1D10
P1D9
P1D8
P1D7
DGND
DVDD18
P1D6
P1D5
P1D4
P1D3
P1D2
P1D1
P1D0
NC
DGND
Description
Port 1, Data Input D11 (MSB).
Port 1, Data Input D10.
Port 1, Data Input D9.
Port 1, Data Input D8.
Port 1, Data Input D7.
Digital Ground.
1.8 V Digital Supply.
Port 1, Data Input D6.
Port 1, Data Input D5.
Port 1, Data Input D4.
Port 1, Data Input D3.
Port 1, Data Input D2.
Port 1, Data Input D1.
Port 1, Data Input D0 (LSB).
No Connect.
Digital Ground.
AD9776A/AD9778A/AD9779A
Pin
No.
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
Mnemonic
DVDD18
NC
NC
NC
DATACLK
DVDD33
TXENABLE/
IQSELECT
P2D11
P2D10
P2D9
DVDD18
DGND
P2D8
P2D7
P2D6
P2D5
P2D4
P2D3
P2D2
P2D1
DVDD18
DGND
P2D0
NC
NC
NC
NC
DVDD18
DVDD33
SYNC_O−
SYNC_O+
DGND
PLL_LOCK
SDO
SDIO
SCLK
Description
1.8 V Digital Supply.
No Connect.
No Connect.
No Connect.
Data Clock Output.
3.3 V Digital Supply.
Transmit Enable. In single port mode, this
pin also functions as IQSELECT.
Port 2, Data Input D11 (MSB).
Port 2, Data Input D10.
Port 2, Data Input D9.
1.8 V Digital Supply.
Digital Ground.
Port 2, Data Input D8.
Port 2, Data Input D7.
Port 2, Data Input D6.
Port 2, Data Input D5.
Port 2, Data Input D4.
Port 2, Data Input D3.
Port 2, Data Input D2.
Port 2, Data Input D1.
1.8 V Digital Supply.
Digital Ground.
Port 2, Data Input D0 (LSB).
No Connect.
No Connect.
No Connect.
No Connect.
1.8 V Digital Supply.
3.3 V Digital Supply.
Differential Synchronization Output.
Differential Synchronization Output.
Digital Ground.
PLL Lock Indicator.
3-Wire Interface Port Data Output.
3-Wire Interface Port Data Input/Output.
3-Wire Interface Port Clock.
Pin
No.
69
70
71
72
73
Mnemonic
CSB
RESET
IRQ
AGND
IPTAT
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
VREF
I120
AVDD33
AGND
AVDD33
AGND
AVDD33
AGND
AGND
OUT2_P
OUT2_N
AGND
AUX2_P
AUX2_N
AGND
AUX1_N
AUX1_P
AGND
OUT1_N
OUT1_P
AGND
AGND
AVDD33
AGND
AVDD33
AGND
AVDD33
Rev. B | Page 11 of 56
Description
3-Wire Interface Port Chip Select Bar.
Reset, Active High.
Interrupt Request.
Analog Ground.
Factory Test Pin. Output current is
proportional to absolute temperature,
approximately 14 μA at 25°C with
approximately 20 nA/°C slope. This pin
should remain floating.
Voltage Reference Output.
120 μA Reference Current.
3.3 V Analog Supply.
Analog Ground.
3.3 V Analog Supply.
Analog Ground.
3.3 V Analog Supply.
Analog Ground.
Analog Ground.
Differential DAC Current Output, Channel 2.
Differential DAC Current Output, Channel 2.
Analog Ground.
Auxiliary DAC Current Output, Channel 2.
Auxiliary DAC Current Output, Channel 2.
Analog Ground.
Auxiliary DAC Current Output, Channel 1.
Auxiliary DAC Current Output, Channel 1.
Analog Ground.
Differential DAC Current Output, Channel 1.
Differential DAC Current Output, Channel 1.
Analog Ground.
Analog Ground.
3.3 V Analog Supply.
Analog Ground.
3.3 V Analog Supply.
Analog Ground.
3.3 V Analog Supply.
AVDD33
AGND
AVDD33
AGND
AVDD33
AGND
AGND
OUT2_P
OUT2_N
AGND
AUX2_P
AUX2_N
AGND
AUX1_N
AUX1_P
AGND
OUT1_N
OUT1_P
AGND
AGND
AVDD33
AGND
AVDD33
AGND
AVDD33
AD9776A/AD9778A/AD9779A
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
75
I120
74
VREF
73
IPTAT
4
72
AGND
REFCLK+
5
71
IRQ
REFCLK–
6
70
RESET
CGND
7
69
CSB
CGND
8
68
SCLK
CVDD18
9
AD9778A
67
SDIO
TOP VIEW
(Not to Scale)
66
SDO
65
PLL_LOCK
AGND 12
64
DGND
SYNC_I+ 13
63
SYNC_O+
SYNC_I– 14
62
SYNC_O–
DGND 15
61
DVDD33
DVDD18 16
60
DVDD18
P1D13 17
59
NC
P1D12 18
58
NC
P1D11 19
57
P2D0
P1D10 20
56
P2D1
P1D9 21
55
P2D2
DGND 22
54
DGND
DVDD18 23
53
DVDD18
P1D8 24
52
P2D3
P1D7 25
51
P2D4
DIGITAL DOMAIN
CVDD18 10
CGND 11
P2D5
P2D6
P2D7
P2D8
P2D9
P2D10
DGND
DVDD18
06452-003
NOTES
1. FOR OPTIMAL THERMAL PERFORMANCE, THE EXPOSED
PAD SHOULD BE SOLDERED TO THE GROUND PLANE FOR
THE 100-LEAD, THERMALLY ENHANCED TQFP PACKAGE.
P2D11
NC
P1D0
DVDD18
DGND
P1D1
P1D2
P1D3
P1D4
P1D5
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
P1D6
NC = NO CONNECT
P2D12
CGND
ANALOG DOMAIN
P2D13
3
TXENABLE/IQSELECT
CGND
PIN 1
DVDD33
2
DATACLK
1
CVDD18
NC
CVDD18
Figure 4. AD9778A Pin Configuration
Table 8. AD9778A Pin Function Descriptions
Pin
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
Mnemonic
CVDD18
CVDD18
CGND
CGND
REFCLK+
REFCLK−
CGND
CGND
CVDD18
CVDD18
CGND
AGND
SYNC_I+
SYNC_I−
DGND
DVDD18
P1D13
P1D12
Description
1.8 V Clock Supply.
1.8 V Clock Supply.
Clock Ground.
Clock Common.
Differential Clock Input.
Differential Clock Input.
Clock Ground.
Clock Ground.
1.8 V Clock Supply.
1.8 V Clock Supply.
Clock Ground.
Analog Ground.
Differential Synchronization Input.
Differential Synchronization Input.
Digital Ground.
1.8 V Digital Supply.
Port 1, Data Input D13 (MSB).
Port 1, Data Input D12.
Pin
No.
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
Rev. B | Page 12 of 56
Mnemonic
P1D11
P1D10
P1D9
DGND
DVDD18
P1D8
P1D7
P1D6
P1D5
P1D4
P1D3
P1D2
P1D1
DGND
DVDD18
P1D0
NC
NC
Description
Port 1, Data Input D11.
Port 1, Data Input D10.
Port 1, Data Input D9.
Digital Ground.
1.8 V Digital Supply.
Port 1, Data Input D8.
Port 1, Data Input D7.
Port 1, Data Input D6.
Port 1, Data Input D5.
Port 1, Data Input D4.
Port 1, Data Input D3.
Port 1, Data Input D2.
Port 1, Data Input D1.
Digital Ground.
1.8 V Digital Supply.
Port 1, Data Input D0 (LSB).
No Connect.
No Connect.
AD9776A/AD9778A/AD9779A
Pin
No.
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
Mnemonic
DATACLK
DVDD33
TXENABLE/
IQSELECT
P2D13
P2D12
P2D11
DVDD18
DGND
P2D10
P2D9
P2D8
P2D7
P2D6
P2D5
P2D4
P2D3
DVDD18
DGND
P2D2
P2D1
P2D0
NC
NC
DVDD18
DVDD33
SYNC_O−
SYNC_O+
DGND
PLL_LOCK
SDO
SDIO
SCLK
CSB
RESET
Description
Data Clock Output.
3.3 V Digital Supply.
Transmit Enable. In single port mode, this
pin also functions as IQSELECT.
Port 2, Data Input D13 (MSB).
Port 2, Data Input D12.
Port 2, Data Input D11.
1.8 V Digital Supply.
Digital Ground.
Port 2, Data Input D10.
Port 2, Data Input D9.
Port 2, Data Input D8.
Port 2, Data Input D7.
Port 2, Data Input D6.
Port 2, Data Input D5.
Port 2, Data Input D4.
Port 2, Data Input D3.
1.8 V Digital Supply.
Digital Ground.
Port 2, Data Input D2.
Port 2, Data Input D1.
Port 2, Data Input D0 (LSB).
No Connect.
No Connect.
1.8 V Digital Supply.
3.3 V Digital Supply.
Differential Synchronization Output.
Differential Synchronization Output.
Digital Ground.
PLL Lock Indicator.
3-Wire Interface Port Data Output.
3-Wire Interface Port Data Input/Output.
3-Wire Interface Port Clock.
3-Wire Interface Port Chip Select Bar.
Reset, Active High.
Pin
No.
71
72
73
Mnemonic
IRQ
AGND
IPTAT
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
VREF
I120
AVDD33
AGND
AVDD33
AGND
AVDD33
AGND
AGND
OUT2_P
OUT2_N
AGND
AUX2_P
AUX2_N
AGND
AUX1_N
AUX1_P
AGND
OUT1_N
OUT1_P
AGND
AGND
AVDD33
AGND
AVDD33
AGND
AVDD33
Rev. B | Page 13 of 56
Description
Interrupt Request.
Analog Ground.
Factory Test Pin. Output current is
proportional to absolute temperature,
approximately 14 μA at 25°C with
approximately 20 nA/°C slope. This pin
should remain floating.
Voltage Reference Output.
120 μA Reference Current.
3.3 V Analog Supply.
Analog Ground.
3.3 V Analog Supply.
Analog Ground.
3.3 V Analog Supply.
Analog Ground.
Analog Ground.
Differential DAC Current Output, Channel 2.
Differential DAC Current Output, Channel 2.
Analog Ground.
Auxiliary DAC Current Output, Channel 2.
Auxiliary DAC Current Output, Channel 2.
Analog Ground.
Auxiliary DAC Current Output, Channel 1.
Auxiliary DAC Current Output, Channel 1.
Analog Ground.
Differential DAC Current Output, Channel 1.
Differential DAC Current Output, Channel 1.
Analog Ground.
Analog Ground.
3.3 V Analog Supply.
Analog Ground.
3.3 V Analog Supply.
Analog Ground.
3.3 V Analog Supply.
AVDD33
AGND
AVDD33
AGND
AVDD33
AGND
AGND
OUT2_P
OUT2_N
AGND
AUX2_P
AUX2_N
AGND
AUX1_N
AUX1_P
AGND
OUT1_N
OUT1_P
AGND
AGND
AVDD33
AGND
AVDD33
AGND
AVDD33
AD9776A/AD9778A/AD9779A
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
CVDD18
1
CVDD18
2
75
I120
74
CGND
3
VREF
73
CGND
IPTAT
4
72
AGND
REFCLK+
5
71
IRQ
REFCLK–
6
70
RESET
CGND
7
69
CSB
CGND
8
68
SCLK
CVDD18
9
AD9779A
67
SDIO
TOP VIEW
(Not to Scale)
66
SDO
65
PLL_LOCK
AGND 12
64
DGND
SYNC_I+ 13
63
SYNC_O+
SYNC_I– 14
62
SYNC_O–
DGND 15
61
DVDD33
DVDD18 16
60
DVDD18
P1D15 17
59
P2D0
P1D14 18
58
P2D1
P1D13 19
57
P2D2
P1D12 20
56
P2D3
P1D11 21
55
P2D4
DGND 22
54
DGND
DVDD18 23
53
DVDD18
P1D10 24
52
P2D5
P1D9 25
51
P2D6
PIN 1
ANALOG DOMAIN
DIGITAL DOMAIN
CVDD18 10
CGND 11
P2D7
P2D8
P2D9
P2D10
P2D11
P2D12
DGND
DVDD18
P2D13
P2D14
P2D15
06452-004
NOTES
1. FOR OPTIMAL THERMAL PERFORMANCE, THE EXPOSED
PAD SHOULD BE SOLDERED TO THE GROUND PLANE FOR
THE 100-LEAD, THERMALLY ENHANCED TQFP PACKAGE.
TXENABLE/IQSELECT
DVDD33
DATACLK
P1D0
P1D1
P1D2
DVDD18
DGND
P1D3
P1D4
P1D5
P1D6
P1D7
P1D8
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
Figure 5. AD9779A Pin Configuration
Table 9. AD9779A Pin Function Descriptions
Pin
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
Mnemonic
CVDD18
CVDD18
CGND
CGND
REFCLK+
REFCLK−
CGND
CGND
CVDD18
CVDD18
CGND
AGND
SYNC_I+
SYNC_I−
DGND
DVDD18
P1D15
P1D14
Description
1.8 V Clock Supply.
1.8 V Clock Supply.
Clock Ground.
Clock Ground.
Differential Clock Input.
Differential Clock Input.
Clock Ground.
Clock Ground.
1.8 V Clock Supply.
1.8 V Clock Supply.
Clock Ground.
Analog Ground.
Differential Synchronization Input.
Differential Synchronization Input.
Digital Ground.
1.8 V Digital Supply.
Port 1, Data Input D15 (MSB).
Port 1, Data Input D14.
Pin
No.
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
Rev. B | Page 14 of 56
Mnemonic
P1D13
P1D12
P1D11
DGND
DVDD18
P1D10
P1D9
P1D8
P1D7
P1D6
P1D5
P1D4
P1D3
DGND
DVDD18
P1D2
P1D1
P1D0
Description
Port 1, Data Input D13.
Port 1, Data Input D12.
Port 1, Data Input D11.
Digital Ground.
1.8 V Digital Supply.
Port 1, Data Input D10.
Port 1, Data Input D9.
Port 1, Data Input D8.
Port 1, Data Input D7.
Port 1, Data Input D6.
Port 1, Data Input D5.
Port 1, Data Input D4.
Port 1, Data Input D3.
Digital Ground.
1.8 V Digital Supply.
Port 1, Data Input D2.
Port 1, Data Input D1.
Port 1, Data Input D0 (LSB).
AD9776A/AD9778A/AD9779A
Pin
No.
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
Mnemonic
DATACLK
DVDD33
TXENABLE/
IQSELECT
P2D15
P2D14
P2D13
DVDD18
DGND
P2D12
P2D11
P2D10
P2D9
P2D8
P2D7
P2D6
P2D5
DVDD18
DGND
P2D4
P2D3
P2D2
P2D1
P2D0
DVDD18
DVDD33
SYNC_O−
SYNC_O+
DGND
PLL_LOCK
SDO
SDIO
SCLK
CSB
RESET
Description
Data Clock Output.
3.3 V Digital Supply.
Transmit Enable. In single port mode, this
pin also functions as IQSELECT.
Port 2, Data Input D15 (MSB).
Port 2, Data Input D14.
Port 2, Data Input D13.
1.8 V Digital Supply.
Digital Ground.
Port 2, Data Input D12.
Port 2, Data Input D11.
Port 2, Data Input D10.
Port 2, Data Input D9.
Port 2, Data Input D8.
Port 2, Data Input D7.
Port 2, Data Input D6.
Port 2, Data Input D5.
1.8 V Digital Supply.
Digital Ground.
Port 2, Data Input D4.
Port 2, Data Input D3.
Port 2, Data Input D2.
Port 2, Data Input D1.
Port 2, Data Input D0 (LSB).
1.8 V Digital Supply.
3.3 V Digital Supply.
Differential Synchronization Output.
Differential Synchronization Output.
Digital Ground.
PLL Lock Indicator.
3-Wire Interface Port Data Output.
3-Wire Interface Port Data Input/Output.
3-Wire Interface Port Clock.
3-Wire Interface Port Chip Select Bar.
Reset, Active High.
Pin
No.
71
72
73
Mnemonic
IRQ
AGND
IPTAT
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
VREF
I120
AVDD33
AGND
AVDD33
AGND
AVDD33
AGND
AGND
OUT2_P
OUT2_N
AGND
AUX2_P
AUX2_N
AGND
AUX1_N
AUX1_P
AGND
OUT1_N
OUT1_P
AGND
AGND
AVDD33
AGND
AVDD33
AGND
AVDD33
Rev. B | Page 15 of 56
Description
Interrupt Request.
Analog Ground.
Factory Test Pin. Output current is
proportional to absolute temperature,
approximately 14 μA at 25°C with
approximately 20 nA/°C slope. This pin
should remain floating.
Voltage Reference Output.
120 μA Reference Current.
3.3 V Analog Supply.
Analog Ground.
3.3 V Analog Supply.
Analog Ground.
3.3 V Analog Supply.
Analog Ground.
Analog Ground.
Differential DAC Current Output, Channel 2.
Differential DAC Current Output, Channel 2.
Analog Ground.
Auxiliary DAC Current Output, Channel 2.
Auxiliary DAC Current Output, Channel 2.
Analog Ground.
Auxiliary DAC Current Output, Channel 1.
Auxiliary DAC Current Output, Channel 1.
Analog Ground.
Differential DAC Current Output, Channel 1.
Differential DAC Current Output, Channel 1.
Analog Ground.
Analog Ground.
3.3 V Analog Supply.
Analog Ground.
3.3 V Analog Supply.
Analog Ground.
3.3 V Analog Supply.
AD9776A/AD9778A/AD9779A
TYPICAL PERFORMANCE CHARACTERISTICS
100
4
3
fDATA = 160MSPS
90
2
fDATA = 200MSPS
0
SFDR (dBc)
INL (16-BIT LSB)
1
–1
–2
80
70
fDATA = 250MSPS
–3
60
–4
0
10k
20k
30k
50k
40k
50
06452-005
–6
60k
CODE
0
20
40
60
80
100
fOUT (MHz)
06452-008
–5
Figure 9. AD9779A In-Band SFDR vs. fOUT,
2× Interpolation
Figure 6. AD9779A Typical INL
100
1.5
fDATA = 200MSPS
fDATA = 100MSPS
1.0
90
SFDR (dBc)
DNL (16-BIT LSB)
0.5
0
–0.5
80
fDATA = 150MSPS
70
–1.0
60
0
10k
20k
30k
40k
50k
50
06452-006
–2.0
60k
CODE
0
40
60
80
100
fOUT (MHz)
Figure 10. AD9779A In-Band SFDR vs. fOUT,
4× Interpolation
Figure 7. AD9779A Typical DNL
100
100
90
20
06452-009
–1.5
fDATA = 100MSPS
fDATA = 50MSPS
90
fDATA = 160MSPS
SFDR (dBc)
80
fDATA = 200MSPS
70
50
80
fDATA = 125MSPS
70
60
0
20
40
60
80
fOUT (MHz)
100
50
Figure 8. AD9779A In-Band SFDR vs. fOUT,
1× Interpolation
0
10
20
30
40
fOUT (MHz)
Figure 11. AD9779A In-Band SFDR vs. fOUT,
8× Interpolation
Rev. B | Page 16 of 56
50
06452-010
60
06452-007
SFDR (dBc)
fDATA = 250MSPS
AD9776A/AD9778A/AD9779A
100
100
90
90
PLL OFF
PLL ON
SFDR (dBc)
fDATA = 200MSPS
70
fDATA = 250MSPS
50
0
20
40
60
80
70
60
100
fOUT (MHz)
50
0
10
20
30
40
fOUT (MHz)
Figure 12. AD9779A Out-of-Band SFDR vs. fOUT,
2× Interpolation
06452-014
60
80
06452-011
SFDR (dBc)
fDATA = 160MSPS
80
Figure 15. AD9779A In-Band SFDR vs. fOUT,
4× Interpolation, fDATA = 100 MSPS, PLL On/Off
100
100
0dBFS
–3dBFS
90
80
SFDR (dBc)
SFDR (dBc)
90
fDATA = 150MSPS
70
80
–6dBFS
70
fDATA = 100MSPS
0
20
40
60
80
100
fOUT (MHz)
50
06452-012
50
60
fDATA = 200MSPS
0
20
40
60
80
fOUT (MHz)
Figure 13. AD9779A Out-of-Band SFDR vs. fOUT,
4× Interpolation
06452-015
60
Figure 16. AD9779A In-Band SFDR vs. fOUT,
Digital Full Scale
100
100
10mA
90
90
SFDR (dBc)
fDATA = 50MSPS
80
fDATA = 100MSPS
70
80
70
30mA
fDATA = 125MSPS
50
0
10
20
30
60
40
fOUT (MHz)
50
50
Figure 14. AD9779A Out-of-Band SFDR vs. fOUT,
8× Interpolation
0
20
40
60
fOUT (MHz)
Figure 17. AD9779A In-Band SFDR vs. fOUT,
Output Full-Scale Current
Rev. B | Page 17 of 56
80
06452-016
60
06452-013
SFDR (dBc)
20mA
AD9776A/AD9778A/AD9779A
100
100
fDATA = 160MSPS
fDATA = 200MSPS
90
fDATA = 250MSPS
80
IMD (dBc)
IMD (dBc)
90
70
80
fDATA = 75MSPS
70
fDATA = 100MSPS
450
fOUT (MHz)
06452-020
425
400
375
350
325
300
275
250
225
200
175
150
fOUT (MHz)
fDATA = 125MSPS
50
125
120
100
75
80
100
60
50
40
0
20
25
0
06452-017
50
fDATA = 50MSPS
60
60
Figure 21. AD9779A Third-Order IMD vs. fOUT,
8× Interpolation
Figure 18. AD9779A Third-Order IMD vs. fOUT,
1× Interpolation
100
100
90
90
80
80
IMD (dBc)
IMD (dBc)
fDATA = 160MSPS
fDATA = 200MSPS
70
PLL OFF
70
PLL ON
fDATA = 250MSPS
0
20
40
60
80
100 120 140
160 180 200
220
fOUT (MHz)
50
0
20
40
60
80
100
120
140
160
180
200
fOUT (MHz)
06452-021
50
60
06452-018
60
Figure 22. AD9779A Third-Order IMD vs. fOUT,
4× Interpolation, fDATA = 100 MSPS, PLL On/Off
Figure 19. AD9779A Third-Order IMD vs. fOUT,
2× Interpolation
100
100
95
90
90
IMD (dBc)
fDATA = 150MSPS
70
fDATA = 100MSPS
75
70
60
60
fDATA = 200MSPS
0
40
80
120
160
200
240
280
320
fOUT (MHz)
55
360
400
50
0
40
80
120
160
200
240
280
320
360
fOUT (MHz)
Figure 23. AD9779A Third-Order IMD vs. fOUT,
Over 50 Parts, 4× Interpolation, fDATA = 200 MSPS
Figure 20. AD9779A Third-Order IMD vs. fOUT,
4× Interpolation
Rev. B | Page 18 of 56
400
06452-022
50
80
65
06452-019
IMD (dBc)
85
80
AD9776A/AD9778A/AD9779A
95
90
EXT REF
DC-COUPLED
0dBFS
85
–3dBFS
80
75
LGAV
51
W1 S2
S3 FC
AA
£(f):
FTUN
SWP
–6dBFS
70
65
60
55
0
40
80
120
160
200
240
280
320
360
400
06452-117
50
fOUT (MHz)
START 1.0MHz
*RES BW 20kHz
Figure 24. AD9779A IMD Performance vs. fOUT,
Digital Full-Scale Input Over Output Frequency,
4× Interpolation, fDATA = 200 MSPS
06452-024
IMD (dBc)
*ATTEN 20dB
REF 0dBm
*PEAK
Log
10dB
100
STOP 400.0MHz
SWEEP 1.203s (601 pts)
VBW 20kHz
Figure 27. AD9779A Two-Tone Spectrum,
4× Interpolation, fDATA = 100 MSPS, fOUT = 30 MHz, 35 MHz
100
–142
95
–146
90
20mA
10mA
80
NSD (dBm/Hz)
IMD (dBc)
85
75
30mA
70
65
–150
–3dBFS
–154
0dBFS
–158
–6dBFS
–162
60
–166
–170
0
40
80
120
160
200
240
280
320
360
400
06452-118
50
fOUT (MHz)
20
40
60
80
fOUT (MHz)
Figure 25. AD9779A IMD Performance vs. fOUT,
Full-Scale Output Current Over Output Frequency,
4× Interpolation, fDATA = 200 MSPS
REF 0dBm
*PEAK
log
10dB
0
06452-025
55
Figure 28. AD9779A Noise Spectral Density vs. fOUT,
Digital Full-Scale Over Output Frequency of Single-Tone Input,
2× Interpolation, fDATA = 200 MSPS
*ATTEN 20dB
–150
EXT REF
DC-COUPLED
–154
NSD (dBm/Hz)
fDAC = 400MSPS
LGAV
51
W1 S2
S3 FC
AA
£(f):
FTUN
SWP
fDAC = 200MSPS
–158
–162
fDAC = 800MSPS
VBW 20kHz
STOP 400.0MHz
SWEEP 1.203s (601 pts)
Figure 26. AD9779A Single Tone,
4× Interpolation, fDATA = 100 MSPS, fOUT = 30 MHz
–170
06452-023
START 1.0MHz
*RES BW 20kHz
0
20
40
60
fOUT (MHz)
80
100
06452-026
–166
Figure 29. AD9779A Noise Spectral Density vs. fOUT,
fDAC Over Output Frequency for Eight-Tone Input with 500 kHz Spacing,
fDATA = 200 MSPS
Rev. B | Page 19 of 56
AD9776A/AD9778A/AD9779A
–150
–55
–60
–154
–158
ACLR (dBc)
NSD (dBm/Hz)
–65
fDAC = 200MSPS
fDAC = 400MSPS
–162
fDAC = 800MSPS
0dBFS, PLL ENABLED
–70
–6dBFS, PLL DISABLED
–75
–80
–166
0
20
40
60
–90
100
80
06452-027
–170
fOUT (MHz)
0dBFS, PLL DISABLED
–3dBFS, PLL DISABLED
0
20
40
60
80 100 120 140 160 180 200 220 240 260
06452-301
–85
fOUT (MHz)
Figure 30. AD9779A Noise Spectral Density vs. fOUT,
fDAC Over Output Frequency with a Single-Tone Input at −6 dBFS
Figure 33. AD9779A ACLR for Second Adjacent Band W-CDMA,
4× Interpolation, fDATA = 122.88 MSPS,
On-Chip Modulation Translates Baseband Signal to IF
–55
–55
–60
–60
0dBFS, PLL ENABLED
–65
0dBFS, PLL DISABLED
ACLR (dBc)
ACLR (dBc)
–65
–70
–75
–70
–6dBFS, PLL DISABLED
–75
0dBFS, PLL ENABLED
–3dBFS, PLL DISABLED
–80
–80
–6dBFS, PLL DISABLED
0
20
40
60
–90
80 100 120 140 160 180 200 220 240 260
06452-300
–90
–85
fOUT (MHz)
Figure 31. AD9779A ACLR for First Adjacent Band W-CDMA,
4× Interpolation, fDATA = 122.88 MSPS,
On-Chip Modulation Translates Baseband Signal to IF
REF –25.28dBm
*AVG
log
10dB
–3dBFS, PLL DISABLED
0
20
40
60
0dBFS, PLL DISABLED
80 100 120 140 160 180 200 220 240 260
06452-302
–85
fOUT (MHz)
Figure 34. AD9779A ACLR for Third Adjacent Band W-CDMA,
4× Interpolation, fDATA = 122.88 MSPS,
On-Chip Modulation Translates Baseband Signal to IF
*ATTEN 4dB
REF –30.28dBm
*AVG
log
10dB
*ATTEN 4dB
EXT REF
EXT REF
PAVG
10
W1 S2
VBW 300kHz
RMS RESULTS FREQ OFFSET REF BW
CARRIER POWER 5.000MHz
10.00MHz
–12.49dBm/
15.00MHz
3.84000MHz
3.840MHz
3.840MHz
3.840MHz
CENTER 151.38MHz
*RES BW 30kHz
SPAN 50MHz
SWEEP 162.2ms (601 pts)
LOWER
dBm
dBc
–76.75 –89.23
–80.94 –93.43
–79.95 –92.44
UPPER
dBm
dBc
–77.42 –89.91
–80.47 –92.96
–78.96 –91.45
VBW 300kHz
TOTAL CARRIER POWER –12.61dBm/15.3600MHz
REF CARRIER POWER –17.87dBm/3.84000MHz
06452-031
CENTER 143.88MHz
*RES BW 30kHz
1 –17.87dBm
2 –20.65dBm
3 –18.26dBm
4 –18.23dBm
Figure 32. AD9779A W-CDMA Signal,
4× Interpolation, fDATA = 122.88 MSPS, fDAC/4 Modulation
FREQ OFFSET
5.000MHz
10.00MHz
15.00MHz
INTEG BW
3.840MHz
3.840MHz
3.840MHz
SPAN 50MHz
SWEEP 162.2ms (601 pts)
LOWER
dBm
dBc
–67.70 –85.57
–70.00 –97.87
–71.65 –99.52
UPPER
dBm
dBc
–67.70 –85.57
–69.32 –87.19
–71.00 –88.88
Figure 35. AD9779A Multicarrier W-CDMA Signal,
4× Interpolation, fDAC = 122.88 MSPS, fDAC/4 Modulation
Rev. B | Page 20 of 56
06452-032
PAVG
10
W1 S2
AD9776A/AD9778A/AD9779A
100
1.5
90
fDATA = 200MSPS
fDATA = 160MSPS
0.5
SFDR (dBc)
0
80
fDATA = 250MSPS
70
–0.5
60
–1.0
50
2k
0
4k
6k
8k
10k
CODE
06452-033
–1.5
0
20
40
60
100
80
06452-036
INL (14-BIT LSB)
1.0
fOUT (MHz)
Figure 36. AD9778A Typical INL
Figure 39. AD9778A In-Band SFDR vs. fOUT,
2× Interpolation
0.6
0.4
–60
0
ACLR (dBc)
DNL (14-BIT LSB)
0.2
–0.2
–70
FIRST ADJACENT CHANNEL
THIRD ADJACENT
CHANNEL
–0.4
–80
–0.6
SECOND ADJACENT
CHANNEL
–90
2k
0
4k
6k
8k
10k
12k
14k
16k
CODE
06452-034
–1.0
Figure 37. AD9778A Typical DNL
0
25
50
75
100
125
150
175
200
225
250
06452-037
–0.8
fOUT (MHz)
Figure 40. AD9778A ACLR, Single Carrier W-CDMA,
4× Interpolation, fDATA = 122.88 MSPS, Amplitude = −3 dBFS
REF –25.39dBm
*AVG
log
10dB
100
*ATTEN 4dB
90
80
4× 200MSPS
70
4× 100MSPS
PAVG
10
W1 S2
50
0
40
80
120
160
200
240
280
fOUT (MHz)
320
360
400
CENTER 143.88MHz
*RES BW 30kHz
VBW 300kHz
RMS RESULTS FREQ OFFSET REF BW
CARRIER POWER 5.000MHz
–12.74dBm/
10.00MHz
3.84000MHz
15.00MHz
3.884MHz
3.840MHz
3.840MHz
SPAN 50MHz
SWEEP 162.2ms (601 pts)
LOWER
dBc
dBm
–76.49 –89.23
–80.13 –92.87
–80.90 –93.64
UPPER
dBc
dBm
–76.89 –89.63
–80.02 –92.76
–79.53 –92.27
Figure 41. AD9778A ACLR,
fDATA = 122.88 MSPS, 4× Interpolation, fDAC/4 Modulation
Figure 38. AD9778A IMD vs. fOUT,
4× Interpolation
Rev. B | Page 21 of 56
06452-038
60
06452-035
IMD (dBc)
4× 150MSPS
AD9776A/AD9778A/AD9779A
–150
0.20
0.15
–154
0.10
–158
DNL (12-BIT LSB)
NSD (dBm/Hz)
fDAC = 200MSPS
fDAC = 400MSPS
–162
fDAC = 800MSPS
0.05
0
–0.05
–0.10
–166
0
20
40
60
100
80
fOUT (MHz)
–0.20
06452-039
–170
0
512
1024
1536
2048
2560
3072
3584
4096
CODE
06452-042
–0.15
Figure 45. AD9776A Typical DNL
Figure 42. AD9778A Noise Spectral Density vs. fOUT
for Eight-Tone Input with 500 kHz Spacing, fDATA = 200 MSPS
–150
100
95
90
–154
85
fDAC = 400MSPS
–158
IMD (dBc)
–162
fDAC = 800MSPS
80
75
4× 100MSPS
4× 200MSPS
70
65
60
–166
4× 150MSPS
55
0
20
40
60
100
80
fOUT (MHz)
50
06452-040
–170
0
40
80
120
160
200
240
280
320
360
400
fOUT (MHz)
Figure 43. AD9778A Noise Spectral Density vs. fOUT
with Single-Tone Input at −6 dBFS, fDATA = 200 MSPS
06452-043
NSD (dBm/Hz)
fDAC = 200MSPS
Figure 46. AD9776A IMD vs. fOUT,
4× Interpolation
100
0.4
0.3
90
fDATA = 160MSPS
SFDR (dBc)
0.1
0
80
fDATA = 250MSPS
70
fDATA = 200MSPS
–0.1
–0.2
60
–0.4
50
0
512
1024
1536
2048
2560
3072
CODE
3584
4096
0
20
40
60
80
fOUT (MHz)
Figure 47. AD9776A In-Band SFDR vs. fOUT,
2× Interpolation
Figure 44. AD9776A Typical INL
Rev. B | Page 22 of 56
100
06452-044
–0.3
06452-041
INL (12-BIT LSB)
0.2
AD9776A/AD9778A/AD9779A
–55
–150
fDAC = 200MSPS
–60
–154
fDAC = 400MSPS
–65
–70
NSD (dBm/Hz)
ACLR (dBc)
FIRST ADJACENT CHANNEL
THIRD ADJACENT
CHANNEL
–75
–80
SECOND ADJACENT
CHANNEL
–158
fDAC = 800MSPS
–162
–166
25
50
75
100
125
150
175
200
225
–170
250
FOUT (MHz)
10
20
30
40
50
80
90
100
*ATTEN 4dB
–150
fDAC = 200MSPS
fDAC = 400MSPS
NSD (dBm/Hz)
–158
fDAC = 800MSPS
–162
–166
PAVG
10
W1 S2
3.884MHz
3.840MHz
3.840MHz
SPAN 50MHz
SWEEP 162.2ms (601 pts)
LOWER
dBm
dBc
–75.00 –87.67
–78.05 –90.73
–77.73 –90.41
UPPER
dBm
dBc
–75.30 –87.97
–77.99 –90.66
–77.50 –90.17
–170
0
10
20
30
40
50
60
70
80
90
fOUT (MHz)
06452-046
VBW 300kHz
RMS RESULTS FREQ OFFSET REF BW
CARRIER POWER 5.000MHz
10.00MHz
–12.67dBm/
15.00MHz
3.84000MHz
70
Figure 50. AD9776A Noise Spectral Density vs. fOUT,
Eight-Tone Input with 500 kHz Spacing, fDATA = 200 MSPS
–154
CENTER 143.88MHz
*RES BW 30kHz
60
fOUT (MHz)
Figure 48. AD9776A ACLR vs. fOUT,
fDATA = 122.88 MSPS, 4× Interpolation, fDAC/4 Modulation
REF –25.29dBm
*AVG
log
10dB
0
Figure 51. AD9776A Noise Spectral Density vs. fOUT,
Single-Tone Input at −6 dBFS, fDATA = 200 MSPS
Figure 49. AD9776A Single Carrier W-CDMA,
4× Interpolation, fDATA = 122.88 MSPS, Amplitude = −3 dBFS
Rev. B | Page 23 of 56
100
06452-048
0
06452-045
–90
06452-047
–85
AD9776A/AD9778A/AD9779A
TERMINOLOGY
Integral Nonlinearity (INL)
INL is defined as the maximum deviation of the actual analog
output from the ideal output, determined by a straight line
drawn from zero scale to full scale.
In-Band Spurious-Free Dynamic Range (SFDR)
In-band SFDR is the difference, in decibels, between the peak
amplitude of the output signal and the peak spurious signal
between dc and the frequency equal to half the input data rate.
Differential Nonlinearity (DNL)
DNL is the measure of the variation in analog value, normalized
to full scale, associated with a 1 LSB change in digital input code.
Out-of-Band Spurious-Free Dynamic Range (SFDR)
Out-of-band SFDR is the difference, in decibels, between the
peak amplitude of the output signal and the peak spurious signal
within the band that starts at the frequency of the input data
rate and ends at the Nyquist frequency of the DAC output sample
rate. Normally, energy in this band is rejected by the interpolation
filters. This specification, therefore, defines how well the interpolation filters work and the effect of other parasitic coupling
paths to the DAC output.
Monotonicity
A DAC is monotonic if the output either increases or remains
constant as the digital input increases.
Offset Error
The deviation of the output current at Code 0 from the ideal
of zero is called offset error. For IOUTA, 0 mA output is expected
when the inputs are all 0s. For IOUTB, 0 mA output is expected
when all inputs are set to 1s.
Gain Error
Gain error is the difference between the actual and the ideal
output spans. The actual span is determined by the difference
between the full-scale output and the bottom-scale output.
Output Compliance Range
Output compliance range is the range of allowable voltage at
the output of a current-output DAC. Operation beyond the
maximum compliance limits may cause either output stage
saturation or breakdown, resulting in nonlinear performance.
Temperature Drift
Temperature drift is specified as the maximum change from
the ambient (25°C) value to the value at either TMIN or TMAX.
For offset and gain drift, the drift is reported in ppm of fullscale range (FSR) per degree Celsius. For reference drift, the
drift is reported in ppm per degree Celsius.
Total Harmonic Distortion (THD)
THD is the ratio of the rms sum of the first six harmonic components to the rms value of the measured fundamental. It is
expressed as a percentage or in decibels.
Signal-to-Noise Ratio (SNR)
SNR is the ratio of the rms value of the measured output signal
to the rms sum of all other spectral components below the
Nyquist frequency, excluding the first six harmonics and dc.
The value for SNR is expressed in decibels.
Interpolation Filter
If the digital inputs to the DAC are sampled at a multiple rate of
fDATA (interpolation rate), a digital filter can be constructed that
has a sharp transition band near fDATA/2. Images that typically
appear around fDAC (output data rate) can be greatly suppressed.
Adjacent Channel Leakage Ratio (ACLR)
ACLR is the ratio in dBc of the measured power within a
channel relative to its adjacent channel.
Power Supply Rejection (PSR)
PSR is the maximum change in the full-scale output as the
supplies are varied from minimum to maximum specified
voltages.
Settling Time
Settling time is the time required for the output to reach and
remain within a specified error band around its final value,
measured from the start of the output transition.
Complex Image Rejection
In a traditional two-part upconversion, two images are created
around the second IF frequency. These images have the effect of
wasting transmitter power and system bandwidth. By placing
the real part of a second complex modulator in series with the
first complex modulator, either the upper or lower frequency
image near the second IF can be rejected.
Rev. B | Page 24 of 56
AD9776A/AD9778A/AD9779A
THEORY OF OPERATION
The AD9776A/AD9778A/AD9779A have many features that
make them highly suited for wired and wireless communications
systems. The dual digital signal path and dual DAC structure
allow an easy interface with common quadrature modulators
when designing single sideband transmitters. The speed and
performance of the parts allow wider bandwidths and more
carriers to be synthesized than in previously available DACs.
The digital engine uses an innovative filter architecture that
combines the interpolation with a digital quadrature modulator.
This allows the parts to perform digital quadrature frequency
upconversions. The on-chip synchronization circuitry enables
multiple devices to be synchronized to each other, or to a
system clock.
DIFFERENCES BETWEEN AD9776/AD9778/
AD9779 AND AD9776A/AD9778A/AD9779A
REFCLK Maximum Frequency vs. Supply
With some restrictions on the DVDD18 and CVDD18 power
supplies, the AD9776A/AD9778A/AD9779A support a maximum sample rate of 1100 MHz. Table 2 lists the valid operating
frequencies vs. power supply voltage.
REFCLK Amplitude
With a differential sinusoidal clock applied to REFCLK, the
PLL on the AD9776/AD9778/AD9779 does not achieve optimal
noise performance unless the REFCLK differential amplitude is
increased to 2 V p-p. Note that if an LVPECL driver is used on the
AD9776/AD9778/AD9779, the PLL exhibits optimal performance
if the REFCLK amplitude is well within LVPECL specifications
(<1.6 V p-p differential). The design of the PLL on the AD9779A
has been improved so that even with a sinusoidal clock, the PLL
still achieves optimal amplitude if the swing is 1.6 V p-p.
PLL Lock Ranges
The individual lock ranges for the AD9776A/AD9778A/AD9779A
PLL are wider than those for the AD9776/AD9778/AD9779.
This means that the AD9776A/AD9778A/AD9779A PLL
remains in lock in a given range over a wider temperature range
than the AD9776/AD9778/AD9779. See Table 23 for PLL lock
ranges for the AD9776A/AD9778A/AD9779A.
PLL Optimal Settings
The optimal settings for the AD9776/AD9778/AD9779 differ
from the AD9776A/AD9778A/AD9779A. Refer to the PLL Bias
Settings section for complete details.
Input Data Delay Line, Manual and Automatic
Correction Modes
The AD9776A/AD9778A/AD9779A can be programmed to not
only sense when the timing margin on the input data falls below
a preset threshold but to also take action. The device can be
programmed to either set the IRQ (pin and register) or
automatically reoptimize the timing input data timing.
Input Data Timing
See Table 28 for timing specifications vs. temperature. The
input data timing specifications (setup and hold) are different
for the AD9776A/AD9778A/AD9779A than they are for the
AD9776/AD9778/AD9779.
DATACLK Delay Range
In the AD9776/AD9778/AD9779, the input data delay was
controlled by Register 0x04, Bits[7:4]. At 25°C, the delay was
stepped by approximately 180 ps/increment. In the AD9776A/
AD9778A/AD9779A, an extra bit has been added, which effectively
doubles the delay range. This bit is now located at Register 0x01,
Bit 1. The increment/step on the AD9776A/AD9778A/AD9779A
remains at ~180 ps.
Version Register
The version register (Register 0x1F) of the AD9776A/AD9778A/
AD9779A reads a value of 0x07. The version register of the
AD9776/AD9778/AD9779 reads a value of 0x03.
Table 10. Register Value Differences Between AD9776/AD9778/AD9779 and AD9776A/AD9778A/AD9779A
Part No.
AD9776/AD9778/AD9779
AD9776A/AD9778A/AD9779A
PLL Loop Bandwidth,
Register 0x0A, Bits[4:0]
11111
01111
PLL Bias,
Register 0x09, Bits[2:0]
111
011
Rev. B | Page 25 of 56
VCO Control Voltage,
Register 0x0A, Bits[7:5]
010
011
PLL VCO Drive,
Register 0x08, Bits[1:0]
00
11
AD9776A/AD9778A/AD9779A
3-WIRE INTERFACE
The 3-wire port is a flexible, synchronous serial communications
port allowing easy interface to many industry-standard microcontrollers and microprocessors. The port is compatible with
most synchronous transfer formats, including both the
Motorola SPI and Intel® SSR protocols.
The interface allows read and write access to all registers
that configure the AD9776A/AD9778A/AD9779A. Singleor multiple-byte transfers are supported, as well as MSB-first
or LSB-first transfer formats. Serial data input/output can be
accomplished through a single bidirectional pin (SDIO) or
through two unidirectional pins (SDIO/SDO).
The serial port configuration is controlled by Register 0x00,
Bits[7:6]. It is important to note that any change made to the
serial port configuration occurs immediately upon writing to
the last bit of this byte. Therefore, it is possible with a multibyte
transfer to write to this register and change the configuration in
the middle of a communication cycle. Care must be taken to
compensate for the new configuration within the remaining
bytes of the current communication cycle.
Use of a single-byte transfer when changing the serial port
configuration is recommended to prevent unexpected device
behavior.
As described in this section, all serial port data is transferred
to/from the device in synchronization with the SCLK pin. If
synchronization is lost, the device has the ability to asynchronously terminate an I/O operation, putting the serial port
controller into a known state and, thereby, regaining synchronization.
SPI
PORT
06452-049
SCLK 68
CSB 69
The remaining SCLK edges are for Phase 2 of the communication cycle. Phase 2 is the actual data transfer between the device
and the system controller. Phase 2 of the communication cycle
is a transfer of one, two, three, or four data bytes, as determined
by the instruction byte. Using one multibyte transfer is preferred.
Single-byte data transfers are useful in reducing CPU overhead
when register access requires only one byte. Registers change
immediately upon writing to the last bit of each transfer byte.
INSTRUCTION BYTE
See Table 11 for information contained in the instruction byte.
Table 11. 3-Wire Interface Instruction Byte
MSB
I7
R/W
I6
N1
I5
N0
I4
A4
I3
A3
I2
A2
I1
A1
LSB
I0
A0
R/W, Bit 7 of the instruction byte, determines whether a read
or a write data transfer occurs after the instruction byte write.
Logic 1 indicates a read operation. Logic 0 indicates a write
operation.
N1 and N0, Bit 6 and Bit 5 of the instruction byte, determine
the number of bytes to be transferred during the data transfer
cycle. The translation for the number of bytes to be transferred
is listed in Table 12.
SDO 66
SDIO 67
A logic high on the CSB pin followed by a logic low resets the
3-wire interface port timing to the initial state of the instruction
cycle. From this state, the next eight rising SCLK edges represent
the instruction bits of the current I/O operation, regardless of
the state of the internal registers or the other signal levels at the
inputs to the 3-wire interface port. If the 3-wire interface port is
in an instruction cycle or a data transfer cycle, none of the present
data is written.
Figure 52. 3-Wire Interface Port
GENERAL OPERATION OF THE SERIAL INTERFACE
There are two phases of a communication cycle with the
AD9776A/AD9778A/AD9779A. Phase 1 is the instruction cycle
(the writing of an instruction byte into the device), coinciding with
the first eight SCLK rising edges. The instruction byte provides
the serial port controller with information regarding the data
transfer cycle, which is Phase 2 of the communication cycle. The
Phase 1 instruction byte defines whether the upcoming data
transfer is a read or write, the number of bytes in the data transfer,
and the starting register address for the first byte of the data
transfer. The first eight SCLK rising edges of each communication
cycle are used to write the instruction byte into the device.
A4, A3, A2, A1, and A0—Bit 4, Bit 3, Bit 2, Bit 1, and Bit 0,
respectively, of the instruction byte—determine the register that
is accessed during the data transfer portion of the communication
cycle. For multibyte transfers, this address is the starting byte
address. The remaining register addresses are generated by the
device, based on the LSB-first bit (Register 0x00, Bit 6).
Table 12. Byte Transfer Count
N1
0
0
1
1
Rev. B | Page 26 of 56
N0
0
1
0
1
Description
Transfer one byte
Transfer two bytes
Transfer three bytes
Transfer four bytes
AD9776A/AD9778A/AD9779A
SERIAL INTERFACE PORT PIN DESCRIPTIONS
Serial Clock (SCLK)
The serial clock pin synchronizes data to and from the device
and controls the internal state machines. The maximum frequency
of SCLK is 40 MHz. All data input is registered on the rising edge
of SCLK. All data is driven out on the falling edge of SCLK.
The serial port controller data address decrements from the data
address written toward 0x00 for multibyte I/O operations if the
MSB-first format is active. The serial port controller address
increments from the data address written toward 0x1F for
multibyte I/O operations if the LSB-first format is active.
INSTRUCTION CYCLE
DATA TRANSFER CYCLE
CSB
Chip Select (CSB)
Active low input starts and gates a communication cycle. It
allows more than one device to be used on the same serial
communication lines. The SDO and SDIO pins go to a high
impedance state when this input is high. Chip select should
stay low during the entire communication cycle.
SDIO
R/W N1
N0
A4 A3
A2 A1
A0
SDO
D7 D6 N D5 N
D30 D2 0 D1 0 D00
D7 D6 N D5N
D30 D20 D1 0 D00
06452-050
SCLK
Figure 53. Serial Register Interface Timing, MSB First
Serial Data I/O (SDIO)
Data is always written into the device on this pin. However, this
pin can be used as a bidirectional data line. The configuration
of this pin is controlled by Register 0x00, Bit 7. The default is
Logic 0, configuring the SDIO pin as unidirectional.
INSTRUCTION CYCLE
DATA TRANSFER CYCLE
CSB
Data is read from this pin for protocols that use separate lines
for transmitting and receiving data. In the case where the device
operates in a single bidirectional I/O mode, this pin does not
output data and is set to a high impedance state.
SDIO
A0
A1
A2
A3 A4
N0 N1 R/W D00 D10 D20
D4N D5N D6N D7 N
D00 D10 D20
D4N D5 N D6N D7N
SDO
06452-051
SCLK
Serial Data Out (SDO)
Figure 54. Serial Register Interface Timing, LSB First
MSB/LSB TRANSFERS
When LSB/MSB first = 1 (LSB first) the instruction and data
bit must be written from LSB to MSB. Multibyte data transfers
in LSB-first format start with an instruction byte that includes
the register address of the least significant data byte, followed by
multiple data bytes. The serial port internal byte address generator increments for each byte of the multibyte communication cycle.
tSCLK
CSB
tPWH
tPWL
SCLK
tDS
SDIO
tDH
INSTRUCTION BIT 7
INSTRUCTION BIT 6
06452-052
When MSB-first format is selected (LSB/MSB first = 0), the
instruction and data bit must be written from MSB to LSB.
Multibyte data transfers in MSB-first format start with an
instruction byte that includes the register address of the most
significant data byte. Subsequent data bytes should follow from
high address to low address. In MSB-first mode, the serial port
internal byte address generator decrements for each data byte of
the multibyte communication cycle.
tDS
Figure 55. Timing Diagram for 3-Wire Interface Register Write
CSB
SCLK
tDV
SDIO
SDO
Rev. B | Page 27 of 56
DATA BIT n
DATA BIT n – 1
Figure 56. Timing Diagram for 3-Wire Interface Register Read
06452-053
The serial port can support both MSB-first and LSB-first data
formats. This functionality is controlled by the LSB-/MSB-first
register bit (Register 0x00, Bit 6). The default is MSB-first format
(LSB/MSB first = 0).
AD9776A/AD9778A/AD9779A
3-WIRE INTERFACE REGISTER MAP
Note that all unused register bits should be kept at the device default values.
Table 13.
Register
Name
Comm
Address
Hex Decimal
0x00 00
Digital
Control
0x01
01
0x02
02
Data format
Single port
0x03
03
DATACLK
delay mode
0x04
04
Reserved
(set to 1)
DATACLK Delay[3:0]
0x05
05
SYNC_O Delay[3:0]
0x06
0x07
06
07
PLL
Control
0x08
0x09
08
09
Misc.
Control
I DAC
Control
0x0A
10
SYNC_I Delay[3:0]
SYNC_I Timing Margin[3:0]
SYNC_O
SYNC_O
Clock State[4:0]
enable
triggering
edge
PLL Band Select[5:0]
PLL VCO Drive[1:0]
PLL enable
PLL VCO Divide Ratio[1:0]
PLL Loop Divide
PLL Bias[2:0]
Ratio[1:0]
VCO Control Voltage[2:0] (read only)
PLL Loop Bandwidth[4:0]
0x0B
0x0C
11
12
I DAC sleep
I DAC
powerdown
Aux
DAC1
Control
0x0D
0x0E
13
14
Auxiliary
DAC1 sign
Auxiliary
DAC1
current
direction
Q DAC
Control
0x0F
0x10
15
16
Q DAC sleep
Q DAC
powerdown
Aux
DAC2
Control
0x11
0x12
17
18
Auxiliary
DAC2 sign
Auxiliary
DAC2
current
direction
19 to 24
Interrupt
0x13
to
0x18
0x19
25
Version
0x1F
31
Sync
Control
Bit 7
SDIO
bidirectional
Bit 6
LSB/MSB
first
Bit 5
Software
reset
Interpolation Factor[1:0]
Bit 4
Powerdown
mode
Bit 3
Bit 2
Auto
powerdown
enable
Filter Modulation Mode[3:0]
Real mode
DATACLK
delay
enable
DATACLK Divide[1:0]
Inverse
sinc
enable
DATACLK
invert
Bit 1
PLL lock
indicator
(read
only)
DATACLK
Delay[4]
TxEnable
invert
Bit 0
Def.
0x00
Zero
stuffing
enable
Q first
0x00
Data Timing Margin[3:0]
SYNC_O Divide[2:0]
SYNC_I Ratio[2:0]
0x00
SYNC_O
Delay[4]
SYNC_I
Delay[4]
SYNC_I
enable
I DAC Gain Adjustment[7:0]
I DAC Gain
Adjustment[9:8]
Auxiliary DAC1 Data[7:0]
Auxiliary
DAC1
powerdown
Q DAC Gain Adjustment[7:0]
Auxiliary DAC1
Data[9:8]
Q DAC Gain
Adjustment[9:8]
Auxiliary DAC2 Data[7:0]
Auxiliary
DAC2
powerdown
0x00
Auxiliary DAC2
Data[9:8]
0x00
0x00
0x00
0x00
0xE7
0x52
0x1F
0xF9
0x01
0x00
0x00
0xF9
0x01
0x00
0x00
Reserved
Data timing
error IRQ
Sync timing
error IRQ
Data
timing
error type
Data
timing
error
IRQ
enable
Version[7:0]
Rev. B | Page 28 of 56
Sync
timing
error IRQ
enable
Internal
sync
loopback
0x00
0x07
AD9776A/AD9778A/AD9779A
Table 14. 3-Wire Interface Register Description
Register Name
Comm
Digital Control
Register
Address
0x00
Bits
7
Parameter
SDIO bidirectional
0x00
6
LSB/MSB first
0x00
5
Software reset
0x00
4
Power-down mode
0x00
3
Auto power-down enable
0x00
1
PLL lock indicator
(read only)
0x01
7:6
Interpolation Factor[1:0]
0x01
0x01
5:2
1
Filter Modulation Mode[3:0]
DATACLK Delay[4]
0x01
0
Zero stuffing enable
0x02
7
Data format
0x02
6
Single port
0x02
5
Real mode
0x02
4
DATACLK delay enable
0x02
3
Inverse sinc enable
0x02
2
DATACLK invert
0x02
1
TxEnable invert
0x02
0
Q first
Function
0: use SDIO pin as input data only.
1: use SDIO as both input and output data.
0: first bit of serial data is MSB of data byte.
1: first bit of serial data is LSB of data byte.
Bit must be written with a 1 and then 0 to soft reset
the 3-wire interface register map.
0: all circuitry is active.
1: disable all digital and analog circuitry, only
3-wire interface port is active.
Controls auto power-down mode. See the PowerDown and Sleep Modes section.
0: PLL is not locked.
1: PLL is locked.
00: 1× interpolation.
01: 2× interpolation.
10: 4× interpolation.
11: 8× interpolation.
See Table 19 for filter modes.
Sets MSB of delay of REFCLK input to DATACLK
output.
0: zero stuffing off.
1: zero stuffing on.
0: twos compliment.
1: unsigned binary.
0: both P1D and P2D data ports enabled.
1: data for both DACs received on P1D data port.
0: enable Q path for signal processing.
1: disable Q path data (internal Q channel clocks
disabled, I and Q modulators disabled).
Enables the DATACLK delay feature. More details
on this feature are shown in the Optimizing the
Data Input Timing section.
0: inverse sinc filter disabled.
1: inverse sinc filter enabled.
0: output DATACLK same phase as internal data
sampling clock, DCLK_SMP signal.
1: output DATACLK opposite phase as internal data
sampling clock, DCLK_SMP signal.
Inverts the polarity of Pin 39, the TXENABLE input
pin (also functions as IQSELECT).
0: in interleaved mode, the I data precedes the
Q data on the input port.
1: in interleaved mode, the Q data precedes the
I data on the input port.
Rev. B | Page 29 of 56
Default
0
0
0
0
00
0000
0
0
0
0
0
0
0
0
AD9776A/AD9778A/AD9779A
Register Name
Sync Control
Register
Address
0x03
Bits
7
Parameter
DATACLK delay mode
0x03
0x03
6
5:4
Reserved
DATACLK Divide[1:0]
0x03
3:0
Data Timing Margin[3:0]
0x04
7:4
DATACLK Delay[3:0]
0x04
3:1
SYNC_O Divide[2:0]
0x04
0x05
0
7:4
SYNC_O Delay[4]
SYNC_O Delay[3:0]
0x05
3:1
SYNC_I Ratio[2:0]
0x05
0x06
0
7:4
SYNC_I Delay[4]
SYNC_I Delay[3:0]
0x06
0x07
0x07
0x07
3:0
7
6
5
SYNC_I Timing Margin[3:0]
SYNC_I enable
SYNC_O enable
SYNC_O triggering edge
0x07
4:0
Clock State[4:0]
Function
0: manual data timing error detect mode.
1: automatic data timing error detect mode.
Should always be set to 1.
DATACLK output divider value.
00: divide by 1.
01: divide by 2.
10: divide by 4.
11: divide by 1.
Sets the timing margin required to prevent the
data timing error IRQ bit from being asserted.
Sets delay of REFCLK input to DATACLK output (see
Table 29 for details).
The frequency of the SYNC_O signal is equal to
fDAC/N, where N is set as follows:
000: N = 32.
001: N = 16.
010: N = 8.
011: N = 4.
100: N = 2.
101: N = 1.
110: N = undefined.
111: N = undefined.
The SYNC_O Delay[4:0] value programs the value
of the delay line of the SYNC_O signal. The delay of
SYNC_O is relative to REFCLK. The delay line
resolution is 80 ps per step.
00000: nominal delay.
00001: adds 80 ps delay to SYNC_O.
00010: adds 160 ps delay to SYNC_O.
…
11111: Adds 2480 ps delay to SYNC_O.
This value controls the number of SYNC_I input
pulses required to generate a synchronization
pulse (see Table 30 for details).
The SYNC_I Delay[4:0] value programs the value of
the delay line of the SYNC_I signal. The delay line
resolution is 80 ps per step.
00000: nominal delay.
00001: adds 80 ps delay to SYNC_I.
00010: adds 160 ps delay to SYNC_I.
…
11111: adds 2480 ps delay to SYNC_I.
1: enables the SYNC_I input.
1: enables the SYNC_O output.
0: SYNC_O changes on REFCLK falling edge.
1: SYNC_O changes on REFCLK rising edge.
This value determines the state of the internal
clock generation state machine upon
synchronization.
Rev. B | Page 30 of 56
Default
0
0
00
0000
0000
000
0
0000
000
0
0000
0000
0
0
0
0
AD9776A/AD9778A/AD9779A
Register Name
PLL Control
Misc. Control
I DAC Control
Aux DAC1 Control
Q DAC Control
Register
Address
0x08
Bits
7:2
Parameter
PLL Band Select[5:0]
Function
0x08
1:0
PLL VCO Drive[1:0]
0x09
7
PLL enable
0x09
6:5
PLL VCO Divide Ratio[1:0]
0x09
4:3
PLL Loop Divide Ratio[1:0]
0x09
2:0
PLL Bias[2:0]
0x0A
7:5
VCO Control Voltage[2:0]
(read only)
0x0A
4:0
PLL Loop Bandwidth[4:0]
0x0C
0x0B
1:0
7:0
I DAC Gain Adjustment[9:8]
I DAC Gain Adjustment[7:0]
0x0C
7
I DAC sleep
0x0C
6
I DAC power-down
0x0E
0x0D
1:0
7:0
Auxiliary DAC1 Data[9:8]
Auxiliary DAC1 Data[7:0]
0x0E
7
Auxiliary DAC1 sign
0x0E
6
Auxiliary DAC1 current
direction
0x0E
5
Auxiliary DAC1 power-down
0x10
0x0F
1:0
7:0
Q DAC Gain Adjustment[9:8]
Q DAC Gain Adjustment[7:0]
0x10
7
Q DAC sleep
0x10
6
Q DAC power-down
Controls the signal strength of the VCO output. Set
to 11 for optimal performance.
0: PLL off, DAC sample clock is sourced directly by
the REFCLK input.
1: PLL on, DAC clock synthesized internally from
REFCLK input via PLL clock multiplier.
Sets the value of the VCO output divider, which
determines the ratio of the VCO output frequency
to the DAC sample clock frequency, fVCO/fDACCLK.
00: fVCO/fDACCLK = 1.
01: fVCO/fDACCLK = 2.
10: fVCO/fDACCLK = 4.
11: fVCO/fDACCLK = 8.
Sets the value of the DACCLK divider, which
determines the ratio of the DAC sample clock
frequency to the REFCLK frequency, fDACCLK/fREFCLK.
00: fDACCLK/fREFCLK = 2.
01: fDACCLK/fREFCLK = 4.
10: fDACCLK/fREFCLK = 8.
11: fDACCLK/fREFCLK = 16.
Controls VCO bias current. Set to 011 for optimal
performance.
000 to 111, proportional to voltage at VCO control
voltage input, readback only. A value of 011
indicates the VCO centered in its frequency range.
Controls the bandwidth of the PLL filter. Increasing
the value lowers the loop bandwidth. Set to 01111
for optimal performance.
The I DAC Gain Adjustment[9:0] value is the I DAC
10-bit gain setting word. Bit 9 is the MSB and Bit 0
is the LSB.
0: I DAC on.
1: I DAC off, but reference remains powered.
0: I DAC on.
1: I DAC off.
The auxiliary DAC 1 Data [9:0] value is the Aux DAC1
10-bit output current control word. Magnitude of
the auxiliary DAC current increases with increasing
value. Bit 9 is the MSB and Bit 0 is the LSB.
0: AUX1_P active.
1: AUX1_N active.
0: source.
1: sink.
0: auxiliary DAC1 on.
1: auxiliary DAC1 off.
The Q DAC Gain Adjustment[9:0] value is the Q DAC
10-bit gain setting word. Bit 9 is the MSB and Bit 0
is the LSB.
0: Q DAC on.
1: Q DAC off.
0: Q DAC on.
1: Q DAC off.
This sets the operating frequency range of the
VCO. For details (see Table 23).
Rev. B | Page 31 of 56
Default
111001
11
0
10
10
010
000
11111
01
11111001
0
0
00
00000000
0
0
0
01
11111001
0
0
AD9776A/AD9778A/AD9779A
Register Name
AUX DAC2 Control
Interrupt
Version
Register
Address
0x12
0x11
Bits
1:0
7:0
Parameter
Auxiliary DAC2 Data[9:8]
Auxiliary DAC2 Data[7:0]
0x12
7
Auxiliary DAC2 sign
0x12
6
0x12
5
Auxiliary DAC2 current
direction
Auxiliary DAC2 power-down
Function
Auxiliary DAC2 Data[9:0] is the 10-bit output
current control word. Magnitude of the auxiliary
DAC current increases with increasing value. Bit 9 is
the MSB and Bit 0 is the LSB.
0: AUX2_P active.
1: AUX2_N active.
0: source.
1: sink.
0: auxiliary DAC2 on.
1: auxiliary DAC2 off.
Default
00
00000000
Read only. Active high indicates a timing violation
occurred on the input data port. The IRQ is latched.
This bit is cleared when the Interrupt register is read.
Read only. Active high indicates a timing violation
occurred on the SYNC_I input. The IRQ is latched.
This bit is cleared when the Interrupt register is read.
Read only. Indicates the timing error type.
0: hold time violation.
1: setup time violation.
Meaningful when data timing error IRQ is active.
0: data timing error IRQ is masked.
1: data timing error IRQ is enabled.
0: sync timing error IRQ is masked.
1: sync timing error IRQ is enabled.
The received SYNC_O signal is looped back to the
SYNC_I signal.
Indicates device hardware revision number.
0
0
0
0
Reserved
0x13 to
0x18
0x19
7
Data timing error IRQ
0x19
6
Sync timing error IRQ
0x19
4
Data timing error type
0x19
3
Data timing error IRQ enable
0x19
2
Sync timing error IRQ enable
0x19
0
Internal sync loopback
0x1F
7:0
Version[7:0]
Rev. B | Page 32 of 56
0
0
0
0
0
00000111
AD9776A/AD9778A/AD9779A
INTERPOLATION FILTER ARCHITECTURE
Table 15. Low-Pass Filter 1
Upper Coefficient
H(55)
H(54)
H(53)
H(52)
H(51)
H(50)
H(49)
H(48)
H(47)
H(46)
H(45)
H(44)
H(43)
H(42)
H(41)
H(40)
H(39)
H(38)
H(37)
H(36)
H(35)
H(34)
H(33)
H(32)
H(31)
H(30)
H(29)
Integer Value
−4
0
+13
0
−34
0
+72
0
−138
0
+245
0
−408
0
+650
0
−1003
0
+1521
0
−2315
0
+3671
0
−6642
0
+20,755
+32,768
Lower Coefficient
H(1)
H(2)
H(3)
H(4)
H(5)
H(6)
H(7)
H(8)
H(9)
H(10)
H(11)
H(12)
Upper Coefficient
H(23)
H(22)
H(21)
H(20)
H(19)
H(18)
H(17)
H(16)
H(15)
H(14)
H(13)
Integer Value
−2
0
+17
0
−75
0
+238
0
−660
0
+2530
+4096
Table 17. Low-Pass Filter 3
Lower Coefficient
H(1)
H(2)
H(3)
H(4)
H(5)
H(6)
H(7)
H(8)
Upper Coefficient
H(15)
H(14)
H(13)
H(12)
H(11)
H(10)
H(9)
Integer Value
−39
0
+273
0
−1102
0
+4964
+8192
Table 18. Inverse Sinc Filter
Lower Coefficient
H(1)
H(2)
H(3)
H(4)
H(5)
Upper Coefficient
H(9)
H(8)
H(7)
H(6)
Integer Value
+2
−4
+10
−35
+401
10
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–4
–3
–2
–1
0
1
fOUT (× Input Data Rate)
2
3
4
06452-054
Lower Coefficient
H(1)
H(2)
H(3)
H(4)
H(5)
H(6)
H(7)
H(8)
H(9)
H(10)
H(11)
H(12)
H(13)
H(14)
H(15)
H(16)
H(17)
H(18)
H(19)
H(20)
H(21)
H(22)
H(23)
H(24)
H(25)
H(26)
H(27)
H(28)
Table 16. Low-Pass Filter 2
ATTENUATION (dB)
The AD9776A/AD9778A/AD9779A can provide up to 8× interpolation, or the interpolation filters can be entirely disabled. It
is important to note that the input signal should be backed off
by approximately 0.01 dB from full scale to avoid overflowing
the interpolation filters. The coefficients of the low-pass filters
and the inverse sinc filter are given in Table 15, Table 16, Table 17,
and Table 18. Spectral plots for the filter responses are shown in
Figure 57, Figure 58, and Figure 59.
Figure 57. 2× Interpolation, Low-Pass Response to ±4× Input Data Rate
(Dotted Lines Indicate 1 dB Roll-Off)
Rev. B | Page 33 of 56
AD9776A/AD9778A/AD9779A
10
0
–10
–20
–20
–30
–40
–50
–60
–30
–40
–50
–60
–70
–70
–80
–80
–90
–90
–100
–4
–100
–4
–3
–2
–1
0
1
2
4
3
fOUT (× Input Data Rate)
–3
–2
–1
0
1
2
3
4
fOUT (× Input Data Rate)
Figure 58. 4× Interpolation, Low-Pass Response to ±4× Input Data Rate
(Dotted Lines Indicate 1 dB Roll-Off)
06452-058
ATTENUATION (dB)
0
–10
06452-055
ATTENUATION (dB)
10
Figure 61. Interpolation/Modulation Combination of 4fDAC/8 Filter
10
10
0
0
–10
–10
ATTENUATION (dB)
–20
–30
–40
–50
–60
–40
–50
–60
–70
–70
–80
–80
–90
–90
–100
–4
–3
–2
–1
0
1
2
4
3
fOUT (× Input Data Rate)
–3
–2
–1
0
1
2
3
4
fOUT (× Input Data Rate)
06452-056
–100
–4
–30
06452-059
ATTENUATION (dB)
–20
Figure 62. Interpolation/Modulation Combination of −3fDAC/8 Filter
Figure 59. 8× Interpolation, Low-Pass Response to ±4× Input Data Rate
(Dotted Lines Indicate 1 dB Roll-Off)
The Nyquist regions of up to 4× the input data rate can be seen
in Figure 60.
–3×
–2×
–1×
DC
2
1×
3
4
2×
5
6
3×
7
8
4×
–10
–20
–30
–40
–50
–60
–70
–80
–90
Figure 60. Nyquist Zones
Figure 57, Figure 58, and Figure 59 show the low-pass response
of the digital filters with no modulation. By turning on the modulation feature, the response of the digital filters can be tuned to
anywhere within the DAC bandwidth. As an example, Figure 61
to Figure 67 show the nonshifted mode filter responses for 8×
interpolation (refer to Table 19 for shifted/nonshifted mode
filter responses).
Rev. B | Page 34 of 56
–100
–4
–3
–2
–1
0
1
fOUT (× Input Data Rate)
2
3
4
06452-060
–4
1
0
06452-086
–8 –7 –6 –5 –4 –3 –2 –1 0
10
ATTENUATION (dB)
With the interpolation filter and modulator combined, the
incoming signal can be placed anywhere within the Nyquist
region of the DAC output sample rate. When the input signal
is complex, this architecture allows modulation of the input
signal to positive or negative Nyquist regions (see Table 19).
Figure 63. Interpolation/Modulation Combination of −2fDAC/8 Filter
AD9776A/AD9778A/AD9779A
10
0
–10
–20
–20
–30
–40
–50
–60
–50
–60
–70
–80
–80
–90
–90
–100
–4
–100
–4
–3
–2
–1
0
1
2
3
4
–1
0
1
2
3
4
Shifted mode filter responses allow the pass band to be centered
around ±0.5 fDATA, ±1.5 fDATA, ±2.5 fDATA, and ±3.5 fDATA. Switching to
the shifted mode response does not affect the center frequency
of the signal. Instead, the pass band of the filter is simply shifted.
For example, use the response shown in Figure 67 and assume
the signal in-band is a complex signal over the bandwidth 3.2 fDATA
to 3.3 fDATA. If the shifted mode filter response is then selected,
the pass band becomes centered at 3.5 fDATA. However, the signal
remains at the same place in the spectrum. The shifted mode
capability allows the filter pass band to be placed anywhere in
the DAC Nyquist bandwidth.
0
–10
–20
–30
–40
–50
–60
–70
–80
–3
–2
–1
0
1
2
3
4
fOUT (× Input Data Rate)
06452-062
–90
Figure 65. Interpolation/Modulation Combination of fDAC/8 Filter
10
The AD9776A/AD9778A/AD9779A are dual DACs with
internal complex modulators built into the interpolating filter
response. In dual channel mode, the devices expect the real and
imaginary components of a complex signal at Digital Input Port 1
and Digital Input Port 2 (I and Q, respectively). The DAC outputs
then represent the real and imaginary components of the input
signal, modulated by the complex carrier (fDAC/2, fDAC/4, or fDAC/8).
With Register 0x02, Bit 6, set, the device accepts interleaved data
on Port 1 in the I, Q, I, Q … sequence. Note that in interleaved
mode, the channel data rate at the beginning of the I and Q data
paths is now half the input data rate because of the interleaving.
The maximum input data rate is still subject to the maximum
specification of the device. This limits the synthesis bandwidth
available at the input in interleaved mode.
0
–10
–20
–30
–40
–50
–60
With Register 0x02, Bit 5 (the real mode bit), set, the Q channel
and the internal I and Q digital modulation are turned off. The
output spectrum at the I DAC then represents the signal at
Digital Input Port 1, interpolated by 1×, 2×, 4×, or 8×.
–70
–80
–3
–2
–1
0
1
2
3
4
fOUT (× Input Data Rate)
Figure 66. Interpolation/Modulation Combination of 2fDAC/8 Filter
06452-063
–90
–100
–4
–2
Figure 67. Interpolation/Modulation Combination of 3fDAC/8 Filter
10
–100
–4
–3
fOUT (× Input Data Rate)
Figure 64. Interpolation/Modulation Combination of −fDAC/8 Filter
ATTENUATION (dB)
–40
–70
fOUT (× Input Data Rate)
ATTENUATION (dB)
–30
06452-064
ATTENUATION (dB)
0
–10
06452-061
ATTENUATION (dB)
10
The general recommendation is that if the desired signal is
within ±0.4 × fDATA, use the nonshifted filter mode. Outside of
this, the shifted filter mode should be used. In any situation, the
total bandwidth of the signal is less than 0.8 × fDATA.
Rev. B | Page 35 of 56
AD9776A/AD9778A/AD9779A
Table 19. Interpolation Filter Modes, (Register 0x01, Bits[5:2])
Interpolation
Factor[7:6]
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
4
4
4
4
4
4
4
4
2
2
2
2
Filter Modulation
Mode[5:2]
0x00
0x01
0x02
0x03
0x04
0x05
0x06
0x07
0x08
0x09
0x0A
0x0B
0x0C
0x0D
0x0E
0x0F
0x00
0x01
0x02
0x03
0x04
0x05
0x06
0x07
0x00
0x01
0x02
0x03
Modulation
DC
DC shifted
fDAC/8
fDAC/8 shifted
fDAC/4
fDAC/4 shifted
3fDAC/8
3fDAC/8 shifted
fDAC/2
fDAC/2 shifted
−3fDAC/8
−3fDAC/8 shifted
−fDAC/4
−fDAC/4 shifted
−fDAC/8
−fDAC/8 shifted
DC
DC shifted
fDAC/4
fDAC/4 shifted
fDAC/2
fDAC/2 shifted
−fDAC/4
−fDAC/4 shifted
DC
DC shifted
fDAC/2
fDAC/2 shifted
Nyquist Zone
Pass Band
0
+1
+2
+3
+4
+5
+6
+7
±8
−7
−6
−5
−4
−3
−2
−1
0
+1
+2
+3
±4
−3
−2
−1
0
+1
±2
−1
Frequency Normalized to fDAC
Low
Center
High
−0.05
0
+0.05
+0.0125
+0.0625
+0.1125
+0.075
+0.125
+0.175
+0.1375
+0.1875
+0.2375
+0.2
+0.25
+0.3
+0.2625
+0.3125
+0.3625
+0.325
+0.375
+0.425
+0.3875
+0.4375
+0.4875
−0.55
−0.5
−0.45
−0.4875
−0.4375
−0.3875
−0.425
−0.375
−0.343
−0.3625
−0.3125
−0.2625
−0.3
−0.25
−0.2
−0.2375
−0.1875
−0.1375
−0.175
−0.125
−0.075
−0.1125
−0.0625
−0.0125
−0.1
0
+0.1
+0.025
+0.125
+0.225
+0.15
+0.25
+0.35
+0.275
+0.375
+0.475
−0.6
−0.5
−0.4
−0.475
−0.375
−0.275
−0.35
−0.25
−0.15
−0.225
−0.125
−0.025
−0.2
0
+0.2
+0.05
+0.25
+0.45
−0.7
−0.5
−0.3
−0.45
−0.25
−0.05
Rev. B | Page 36 of 56
Comments
In 8× interpolation;
BW (min) = 0.0375 × fDAC
BW (max) = 0.1 × fDAC
In 4× interpolation;
BW (min) = 0.075 × fDAC
BW (max) = 0.2 × fDAC
In 2× interpolation;
BW (min) = 0.15 × fDAC
BW (max) = 0.4 × fDAC
AD9776A/AD9778A/AD9779A
10
SHIFTED + 3 × fDAC /8
SHIFTED + fDAC/4
SHIFTED + fDAC/8
SHIFTED + DC
SHIFTED – DC
–40
–50
–80
–4
–3
–2
–30
–1
0
1
fOUT (× Input Data Rate),
2
ASSUMING 8× INTERPOLATION
–40
3
4
06452-087
+fDAC /2
+fDAC /4
–70
Figure 70. Shifted Bandwidths Accessible with the Filter Architecture
–50
–60
–70
–3
–2
–1
0
1
2
3
4
06452-065
–80
–4
fOUT (× Input Data Rate),
ASSUMING 8× INTERPOLATION
Figure 68. Traditional Bandwidth Options for TxDAC Output IF
The filter architecture not only allows the interpolation filter
pass bands to be centered in the middle of the input Nyquist
zones (as explained in this section), but also allows the possibility of a 3 × fDAC/8 modulation mode when interpolating by 8.
With all of these filter combinations, a carrier of given bandwidth
can be placed anywhere in the spectrum and fall into a possible
pass band of the interpolation filters. The possible bandwidths
accessible with the filter architecture are shown in Figure 69 and
Figure 70. Note that the shifted and nonshifted filter modes are
all accessible by programming the filter mode for a particular
interpolation rate.
10
+fDAC /2
+3 × fDAC /8
+fDAC /4
+fDAC /8
BASEBAND
–fDAC /8
–fDAC /4
–20
–3 × fDAC /8
–10
–fDAC /2
0
ATTENUATION (dB)
–30
–60
+fDAC /8
BASEBAND
–fDAC /8
–20
–fDAC /4
ATTENUATION (dB)
–10
–fDAC /2
0
–20
SHIFTED – fDAC /8
ATTENUATION (dB)
–10
SHIFTED – fDAC /4
0
The AD9776A/AD9778A/AD9779A use a novel interpolation
filter architecture that allows DAC IF frequencies to be generated anywhere in the spectrum. Figure 68 shows the traditional
choice of DAC IF output bandwidth placement. Note that there
are no possible filter modes in which the carrier can be placed
near 0.5 × fDATA, 1.5 × fDATA, 2.5 × fDATA, and so on.
SHIFTED – 3 × fDAC /8
10
INTERPOLATION FILTER BANDWIDTH LIMITS
–30
The maximum bandwidth condition exists if the carrier is
placed directly in the center of one of the filter pass bands. In
this case, the total 0.1 dB bandwidth of the interpolation filters
is equal to 0.8 × fDATA. As Table 19 shows, the synthesis bandwidth as a fraction of the DAC output sample rate drops by a
factor of 2 for every doubling of interpolation rate. The minimum bandwidth condition exists, for example, if a carrier is
placed at 0.25 × fDATA. In this situation, if the nonshifted filter
response is enabled, the high end of the filter response cuts off
at 0.4 × fDATA, thus limiting the high end of the signal bandwidth.
If the shifted filter response is instead enabled, then the low end
of the filter response cuts off at 0.1 × fDATA, thus limiting the low
end of the signal bandwidth. The minimum bandwidth specification that applies for a carrier at 0.25 × fDATA is therefore 0.3 ×
fDATA. The minimum bandwidth behavior is repeated over the
spectrum for carriers placed at (±n ± 0.25) × fDATA, where n is
any integer.
Digital Modulation
–40
The digital quadrature modulation occurs within the interpolation
filter. The modulation shifts the frequency spectrum of the
incoming data by the frequency offset selected. The frequency
offsets available are multiples of the input data rate. The
modulation is equivalent to multiplying the quadrature input
signal by a complex carrier signal, C(t), of the following form:
–50
–60
–70
–3
–2
–1
0
1
fOUT (× Input Data Rate),
2
ASSUMING 8× INTERPOLATION
3
4
06452-066
–80
–4
With this filter architecture, a signal placed anywhere in the
spectrum is possible. However, the signal bandwidth is limited
by the input sample rate of the DAC and the specific placement
of the carrier in the spectrum. The bandwidth restriction resulting
from the combination of filter response and input sample rate is
often referred to as the synthesis bandwidth, because this is the
largest bandwidth that the DAC can synthesize.
Figure 69. Nonshifted Bandwidths Accessible with the Filter Architecture
Rev. B | Page 37 of 56
C(t) = cos(ωct) + j sin(ωct)
AD9776A/AD9778A/AD9779A
Table 20. Modulation Mixing Sequences
fDAC/4
−fDAC/4
fDAC/8
Mixing Sequence
I = I, −I, I, −I, …
Q = Q, −Q, Q, −Q, …
I = I, Q, −I, −Q, …
Q = Q, −I, −Q, I, …
I = I, −Q, −I, Q, …
Q = Q, I, −Q, −I, …
I = I, r(I + Q), Q, r(−I + Q), −I, −r(I + Q), −Q, r(I − Q),
…
Q = Q, r(Q − I), −I, −r(Q + I), −Q, r(−Q + I), I, r(Q + I),
…
where r = √2/2
Lower Coefficient
H(1)
H(2)
H(3)
H(4)
H(5)
Upper Coefficient
H(9)
H(8)
H(7)
H(6)
N/A
Integer Value
+2
−4
+10
−35
+401
The inverse sinc filter is disabled by default. It can be enabled by
setting the inverse sinc enable bit (Bit 3) in Register 0x02.
0
–0.5
–1.0
–1.5
SINC–1 RESPONSE
–2.0
–2.5
–3.0
–3.5
COMBINED SINC AND SINC –1 RESPONSE
–4.0
INVERSE SINC FILTER
The inverse sinc filter is implemented as a nine-tap FIR filter. It
is designed to provide less than ±0.05 dB pass-band ripple up to
a frequency of 0.4 × fDATA. To provide the necessary gain at the
upper end of the pass band, the inverse sinc filter has an intrinsic
insertion loss of 3.4 dB. The transfer function is shown in
Figure 71 and the tap coefficients are given in Table 21.
–4.5
0
0.05
0.10
0.15
0.20 0.25 0.30
f/fSAMPLE
0.35
0.40
0.45
0.50
06452-088
Modulation
fDAC/2
Table 21. Inverse Sinc Filter
(dB)
As shown in Table 20, the mixing functions of most of the
modes result in cross-coupling of samples between the I and Q
channels. The I and Q channels only operate independently
with the fS/2 mode. This means that real modulation using both
the I and Q DAC outputs can only be done in the fS/2 mode. All
other modulation modes require complex input data and
produce complex output signals.
Figure 71. Transfer Function of Inverse Sinc Filter with the DAC sin(x)/x Output
Rev. B | Page 38 of 56
AD9776A/AD9778A/AD9779A
SOURCING THE DAC SAMPLE CLOCK
The AD9776A/AD9778A/AD9779A offer two modes of sourcing
the DAC sample clock (DACCLK). The first mode employs an
on-chip clock multiplier that accepts a reference clock operating
at the lower input frequency, most commonly the data input
frequency. The on-chip PLL then multiplies the reference clock
up to a higher frequency, which can then be used to generate all
of the internal clocks required by the DAC. The clock multiplier
provides a high quality clock that meets the performance requirements of most applications. Using the on-chip clock multiplier
removes the burden of generating and distributing the high
speed DACCLK at the board level. The second mode bypasses
the clock multiplier circuitry and allows DACCLK to be directly
sourced through the REFCLK pins. This mode enables the user
to source a very high quality input clock directly to the DAC
core. Sourcing the DACCLK directly through the REFCLK pins
may be necessary in demanding applications that require the
lowest possible DAC output noise at higher output frequencies.
In either case (that is, using the on-chip clock multiplier or
sourcing the DACCLK directly though the REFCLK pins), it is
necessary that the REFCLK signal have low jitter to maximize
the DAC noise performance.
DIRECT CLOCKING
When the PLL is disabled (Register 0x09, Bit 7 = 0), the REFCLK
input is used directly as the DAC sample clock (DACCLK). The
frequency of REFCLK needs to be the input data rate multiplied
by the interpolation factor (and by an additional factor of 2 if
zero stuffing is enabled).
CLOCK MULTIPLICATION
When the PLL is enabled (Register 0x09, Bit 7 = 1), the clock
multiplication circuit generates the DAC sample clock from the
lower rate REFCLK input. The functional diagram of the clock
multiplier is shown in Figure 72.
REFCLK
(PIN 5,
PIN 6)
LOOP
FILTER
PHASE
DETECTOR
0x08[7:2]
VCO BAND
SELECT
VCO
÷N2
÷N1
0x09[4:3]
PLL LOOP
DIVISOR
0x09[6:5]
PLL VCO
DIVISOR
÷IF
0x09[7]
PLL ENABLE
0x0A[7:5]
PLL CONTROL
VOLTAGE
ADC
DATACLK OUT
(PIN 37)
0x01[7:6]
INTERPOLATION
FACTOR
DACCLK
Figure 72. Clock Multiplier Circuit
06452-092
PIN 65 AND
0x00[1]
PLL LOCK
DETECT
The clock multiplier circuit operates such that the VCO outputs
a frequency, fVCO, equal to the REFCLK input signal frequency
multiplied by N1 × N2.
f VCO = f REFCLK × (N1 × N2)
The DAC sample clock frequency, fDACCLK, is equal to
f DACCLK = f REFCLK × N2
When the PLL is enabled, the maximum input clock frequency
fREFCLK is 250 MHz. The values of N1 and N2 must be chosen to
keep fVCO in the optimal operating range of 1.0 GHz to 2.0 GHz.
Once the VCO output frequency is known, the correct PLL
band select (Register 0x08, Bits[7:2]) value can be chosen.
PLL Bias Settings
There are three bias settings for the PLL circuitry that should be
programmed to their nominal values. The PLL values shown in
Table 22 are the recommended settings for these parameters.
Table 22. PLL Settings
PLL 3-Wire Interface
Control
PLL Loop Bandwidth
PLL VCO Drive
PLL Bias
Address
Register
Bits
0x0A
[4:0]
0x08
[1:0]
0x09
[2:0]
Optimal Setting
01111
11
011
The PLL loop bandwidth variable configures the bandwidth of
the PLL loop filter. A setting of 00000 configures the bandwidth
to be approximately 1 MHz. A setting of 11111 configures the
bandwidth to be approximately 10 MHz. The optimal value of
01111 sets the loop bandwidth to be approximately 3 MHz.
Configuring the PLL Band Select Value
The PLL VCO has a valid operating range from approximately
1.0 GHz to 2.0 GHz. This range is covered in 63 overlapping
frequency bands, as shown in Table 23. For any desired VCO
output frequency, there are multiple valid PLL band select values.
It is important to note that the data shown in Table 23 is for a
typical device. Device-to-device variations can shift the actual
VCO output frequency range by 30 MHz to 40 MHz. In addition,
the VCO output frequency varies as a function of temperature.
Therefore, it is required that the optimal PLL band select value
be determined for each individual device at a particular
operating temperature.
The device has an automatic PLL band select feature on chip.
When this feature is enabled, the device determines the optimal
PLL band setting for the device at the given temperature. This
setting holds for a ±60°C temperature swing in ambient temperature. If the device is operated in an environment that
experiences a larger temperature swing, an offset should be
applied to the automatically selected PLL band.
Rev. B | Page 39 of 56
AD9776A/AD9778A/AD9779A
Table 23. Typical VCO Frequency Range vs. PLL Band Select Value
PLL Lock Ranges Over Temperature, −40°C to +85°C
VCO Frequency Range (MHz)
PLL Band Select
fLOW
fHIGH
111111 (63)
Auto mode
111110 (62)
1975
2026
111101 (61)
1956
2008
111100 (60)
1938
1992
111011 (59)
1923
1977
111010 (58)
1902
1961
111001 (57)
1883
1942
111000 (56)
1870
1931
110111 (55)
1848
1915
110110 (54)
1830
1897
110101 (53)
1822
1885
110100 (52)
1794
1869
110011 (51)
1779
1853
110010 (50)
1774
1840
110001 (49)
1748
1825
110000 (48)
1729
1810
101111 (47)
1730
1794
101110 (46)
1699
1780
101101 (45)
1685
1766
101100 (44)
1684
1748
101011 (43)
1651
1729
101010 (42)
1640
1702
101001 (41)
1604
1681
101000 (40)
1596
1658
100111 (39)
1564
1639
100110 (38)
1555
1606
100101 (37)
1521
1600
100100 (36)
1514
1575
100011 (35)
1480
1553
100010 (34)
1475
1529
100001 (33)
1439
1505
100000 (32)
1435
1489
PLL Lock Ranges Over Temperature, −40°C to +85°C
VCO Frequency Range (MHz)
PLL Band Select
fLOW
fHIGH
011111 (31)
1402
1468
011110 (30)
1397
1451
011101 (29)
1361
1427
011100 (28)
1356
1412
011011 (27)
1324
1389
011010 (26)
1317
1375
011001 (25)
1287
1352
011000 (24)
1282
1336
010111 (23)
1250
1313
010110 (22)
1245
1299
010101 (21)
1215
1277
010100 (20)
1210
1264
010011 (19)
1182
1242
010010 (18)
1174
1231
010001 (17)
1149
1210
010000 (16)
1141
1198
001111 (15)
1115
1178
001110 (14)
1109
1166
001101 (13)
1086
1145
001100 (12)
1078
1135
001011 (11)
1055
1106
001010 (10)
1047
1103
001001 (9)
1026
1067
001000 (8)
1019
1072
000111 (7)
998
1049
000110 (6)
991
1041
000101 (5)
976
1026
000100 (4)
963
1011
000011 (3)
950
996
000010 (2)
935
981
000001 (1)
922
966
000000 (0)
911
951
Rev. B | Page 40 of 56
AD9776A/AD9778A/AD9779A
Configuring PLL Band Select with Temperature Sensing
Known Temperature Calibration with Memory
The following procedure outlines a method for setting the PLL
band select value for a device operating at a particular temperature
that holds for a change in ambient temperature over the total
−40°C to +85°C operating range of the device without further
user intervention. Note that REFCLK must be applied to the
device during this procedure.
If temperature sensing is not available in the system, a factory
calibration at a known temperature is another method for
guaranteeing lock over temperature. Factory calibration can be
performed as follows:
1.
2.
3.
4.
5.
Program the values of N1 (Register 0x09, Bits[6:5]) and N2
(Register 0x09, Bits[4:3]), along with the PLL settings
shown in Table 22.
Set the PLL band (Register 0x08, Bits[7:2]) to 63 to enable
PLL auto mode.
Wait for the PLL_LOCK pin or the PLL lock indicator
(Register 0x00, Bit 1) to go high. This should occur
within 5 ms.
Read back the 6-bit PLL band (Register 0x08, Bits[7:2]).
Based on the temperature when the PLL auto band select is
performed, set the PLL band indicated in either Table 24 or
Table 25 by rewriting the readback values into the PLL
Band Select parameter (Register 0x08, Bits[7:2]).
This procedure requires temperature sensing upon start-up or
reset of the device to optimally choose the PLL band select
value that holds over the entire operating temperature range. If
the optimal band is in the range of 0 to 31 (lower VCO
frequency), refer to Table 24.
Table 24. Setting Optimal PLL Band, When Band Is in the
Lower Range (0 to 31)
If System Startup
Temperature Is
−40°C to −10°C
−10°C to +15°C
15°C to 55°C
55°C to 85°C
Table 25. Setting Optimal PLL Band, When Band Is in the
Higher Range (32 to 62)
Set PLL Band as Follows
Set PLL band = readback band + 3
Set PLL band = readback band + 2
Set PLL band = readback band + 1
Set PLL band = readback band
Set PLL band = readback band − 1
2.
3.
4.
5.
Program the values of N1 (Register 0x09, Bits[6:5]) and N2
(Register 0x09, Bits[4:3]), along with the PLL settings
shown in Table 22.
Set the PLL band (Register 0x08, Bits[7:2]) to 63 to enable
PLL auto mode.
Wait for the PLL_LOCK pin or the PLL lock indicator
(Register 0x00, Bit 1) to go high. This should occur
within 5 ms.
Read back the 6-bit PLL band (Register 0x08, Bits[7:2]).
Based on the temperature when the PLL auto band select is
performed, store into nonvolatile memory the PLL band
indicated in either Table 24 or Table 25. On system powerup or restart, load the stored PLL band value into the PLL
band select parameter (Register 0x08, Bits[7:2]).
Set-and-Forget Device Option
If the PLL band select configuration methods described in
the previous sections cannot be implemented in a particular
system, there may be a screened device option that can satisfy
the system requirements. This allows the user to preload a
specific PLL band select value for all devices that holds over
temperature. Example REFCLK and VCO frequencies are
shown in Table 26.
Table 26. Typical VCO Frequency Range vs.
PLL Band Select Value
Set PLL Band as Follows
Set PLL band = readback band + 2
Set PLL band = readback band + 1
Set PLL band = readback band
Set PLL band = readback band − 1
If the optimal band is in the range of 32 to 62 (higher VCO
frequency), refer to Table 25.
If System Startup
Temperature Is
−40°C to −30°C
−30°C to −10°C
−10°C to +15°C
15°C to 55°C
55°C to 85°C
1.
fREFCLK (MHz)
59.73335
61.44
67.2
76.8
80.01
81.92
92.16
112.0
119.4667
122.88
Rev. B | Page 41 of 56
fVCO (MHz)
955.7336
1966.08
1075.2
1228.8
1280
1310.72
1474.56
1792.0
955.7336
1966.08
Guaranteed
PLL Band
2
61
11
20
23
25
34
50
2
61
Total PLL
Divide Ratio
16
32
16
16
16
16
16
16
8
16
AD9776A/AD9778A/AD9779A
DRIVING THE REFCLK INPUT
TTL OR CMOS
CLK INPUT
0.1µF
LVDS_P_IN
REFCLK+
50Ω
50Ω
REFCLK+
REFCLK–
50Ω BAV99ZXCT
HIGH SPEED
DUAL DIODE
06452-069
The REFCLK input requires a low jitter differential drive signal.
The signal level can range from 400 mV p-p differential to
1.6 V p-p differential centered about a 400 mV input commonmode voltage. Looking at the single-ended inputs, REFCLK+ or
REFCLK−, each input pin can safely swing from 200 mV p-p to
800 mV p-p about the 400 mV common-mode voltage. Although
these input levels are not directly LVDS compatible, REFCLK
can be driven by an offset ac-coupled LVDS signal, as shown in
Figure 73.
0.1µF
VCM = 400mV
Figure 74. TTL or CMOS REFCLK Drive Circuit
A simple bias network for generating VCM is shown in Figure 75.
It is important to use CVDD18 and CGND for the clock bias
circuit. Any noise or other signal that is coupled onto the clock
is multiplied by the DAC digital input signal and can degrade
DAC performance.
VCM = 400mV
VCM = 400mV
50Ω
0.1µF
CVDD18
1kΩ
1nF
Figure 73. LVDS REFCLK Drive Circuit
287Ω
If a clean sine clock is available, it can be transformer-coupled
to REFCLK, as shown in Figure 73. Use of a CMOS or TTL
clock is also acceptable for lower sample rates. It can be routed
through a CMOS to LVDS translator, and then ac-coupled as
described in this section. Alternatively, it can be transformercoupled and clamped, as shown in Figure 74.
Rev. B | Page 42 of 56
0.1µF
1nF
CGND
Figure 75. REFCLK VCM Generator Circuit
06452-070
REFCLK–
06452-068
LVDS_N_IN
AD9776A/AD9778A/AD9779A
FULL-SCALE CURRENT GENERATION
INTERNAL REFERENCE
AD9776A/AD9778A/AD9779A
Internal current mirrors provide a current-gain scaling, where
the I DAC or Q DAC gain is a 10-bit word in the 3-wire interface
port register (Register 0x0B, Register 0x0C, Register 0x0F, and
Register 0x10). The default value for the DAC gain registers
gives an IFS of approximately 20 mA. IFS is equal to
I DAC
DAC FULL-SCALE
REFERENCE
CURRENT
CURRENT
SCALING
I120
0.1µF
10kΩ
06452-073
1.2V BAND GAP
VREF
Q DAC
Q DAC GAIN
Figure 76. Reference Circuitry
35
30
25
20
15
10
5
1.2 V ⎛ 27 ⎛ 6
⎞
×⎜ + ⎜
× DAC Gain ⎞⎟ ⎟ × 32
12
1024
R
⎝
⎠
⎝
⎠
0
0
200
400
600
DAC GAIN CODE
Figure 77. IFS vs. DAC Gain Code
Rev. B | Page 43 of 56
800
1000
06452-074
I FS =
I DAC GAIN
IFS (mA)
Full-scale current on the I DAC and Q DAC can be set from
8.66 mA to 31.66 mA. Initially, the 1.2 V band gap reference is
used to set up a current in an external resistor connected to I120
(Pin 75). A simplified block diagram of the reference circuitry is
shown in Figure 76. The recommended value for the external
resistor is 10 kΩ, which sets up an IREFERENCE in the resistor of
120 μA, which in turn provides a DAC output full-scale current
of 20 mA. Because the gain error is a linear function of this resistor,
a high precision resistor improves gain matching to the internal
matching specification of the devices. Gain drift over temperature
is also affected by this resistor. A resistor with a low temperature
coefficient is recommended in applications requiring good gain
stability.
AD9776A/AD9778A/AD9779A
GAIN AND OFFSET CORRECTION
•
Gain mismatch: The gain in the real and imaginary signal
paths of the quadrature modulator may not be matched
perfectly. This leads to less than optimal image rejection
because the cancellation of the negative frequency image is
less than perfect.
•
Local oscillator (LO) feedthrough: The quadrature modulator has a finite dc-referred offset, as well as coupling
from its LO port to the signal inputs. These can lead to
significant spectral spurs at the frequency of the quadrature
modulator LO.
The AD9776A/AD9778A/AD9779A have the capability to
correct for both of these analog degradations. Note that these
degradations drift over temperature; therefore, if close to optimal
single sideband performance is desired, a scheme for sensing
these degradations over temperature and correcting for them
may be necessary.
I/Q CHANNEL GAIN MATCHING
Gain matching is achieved by adjusting the values in the DAC
gain registers. For the I DAC, these values are in the 0x0B and
0x0C I DAC control registers. For the Q DAC, these values are
in the 0x0F and 0x10 Q DAC control registers. These are 10-bit
values. To perform gain compensation, raise or lower the value
of one of these registers by a fixed step size and measure the
amplitude of the unwanted image. If the unwanted image is
increasing in amplitude, stop the procedure and try the same
adjustment on the other DAC control register. Do this until the
image rejection cannot be improved through further adjustment
of these registers.
It should be noted that LO feedthrough compensation is independent of gain. However, gain compensation can affect the LO
compensation because the gain compensation may change the
common-mode level of the signal. The dc offset of some
modulators is common-mode level dependent. Therefore, it is
recommended that the gain adjustment be performed prior to
LO compensation.
AUXILIARY DAC OPERATION
Two auxiliary DACs are provided on the AD9776A/AD9778A/
AD9779A. The full-scale output current on these DACs is derived
from the 1.2 V band gap reference and external resistor between
the I120 pin and ground. The gain scale from the reference
amplifier current (IREFERENCE) to the auxiliary DAC reference
current is 16.67 mA with the auxiliary DAC gain set to full
scale (10-bit values, 3-wire interface Register 0x0D and 3-wire
interface Register 0x11). This results in a full-scale current of
approximately 2 mA for auxiliary DAC1 and auxiliary DAC2.
The auxiliary DAC structure is shown in Figure 78. Only one of
the two output pins of the auxiliary DAC is active at a time. The
inactive side goes to a high impedance state (>100 kΩ). The
active output pin is chosen by writing to Bit 7 of Register 0x0E
and Register 0x12.
The active output can act as either a current source or a current
sink. When sourcing current, the output compliance voltage is
0 V to 1.6 V. When sinking current, the output compliance voltage
is 0.8 V to 1.6 V. The output pin is chosen to be a current source or
current sink by writing to Bit 6 of Register 0x0E and Register 0x12.
0mA TO 2mA
(SOURCE)
AUXP
VBIAS
0mA TO 2mA
(SINK)
AUXN
P/N
SOURCE/
SINC
06452-303
Analog quadrature modulators make it very easy to realize
single sideband radios. However, there are several nonideal
aspects of quadrature modulator performance. Among these
analog degradations are
Figure 78. Auxiliary DAC Source/Sink for AD9776A/AD9778A/AD97779A
The magnitude of the auxiliary DAC1 current is controlled by the
0x0D and 0x0E auxiliary DAC1 control registers; the magnitude of
the auxiliary DAC2 current is controlled by the 0x11 and 0x12
auxiliary DAC2 control registers. These auxiliary DACs have
the ability to source or sink current. This is programmable via
Bit 6 in either auxiliary DAC control register. The choice of
sinking or sourcing should be made at circuit design time.
There is no advantage to switching between current source or
current sink once the circuit is in place.
The auxiliary DACs can be used for LO cancellation when the
DAC output is followed by a quadrature modulator. This LO
feedthrough is caused by the input-referred dc offset voltage of
the quadrature modulator (and the DAC output offset voltage
mismatch) and may degrade system performance.
Typical DAC-to-quadrature modulator interfaces are shown
in Figure 79. Often, the input common-mode voltage for the
modulator is much higher than the output compliance range of
the DAC, making ac coupling or a dc level shift necessary. If the
required common-mode input voltage on the quadrature modulator matches that of the DAC, then the dc shown in Figure 79 can
be used. A low-pass or band-pass passive filter is recommended
when spurious signals from the DAC (distortion and DAC images)
at the quadrature modulator inputs may affect the system performance. Placing the filter at the location shown in Figure 79 allows
easy design of the filter because the source and load impedances
can easily be designed close to 50 Ω.
Rev. B | Page 44 of 56
AD9776A/AD9778A/AD9779A
RESULTS OF GAIN AND OFFSET CORRECTION
90
AUX1_P
OUT1_N
RBIP
50Ω
RBIN
92 50Ω
250Ω
AUX1_N
89
82pF
C1I
LPI
390nH
39pF
C2I
21
IBBP
RSLI
100Ω
22
82pF
C3I
The results of gain and offset correction can be seen in Figure 80
and Figure 81. Figure 80 shows the output spectrum of the quadrature demodulator before gain and offset correction. Figure 81
shows the output spectrum after correction. The LO feedthrough
spur at 2.1 GHz has been suppressed to the noise level. This
result can be achieved by applying the correction, but the correction needs to be repeated after a large change in temperature.
LNI
390nH
IBBN
500Ω
500Ω
OUT2_N
RBQN
50Ω
OUT2_P
AUX2_P
250Ω
84
82pF
C1Q
RBQP
83 50Ω
86
250Ω
LNQ
390nH
39pF
C2Q
9
RSLQ
100Ω
10
82pF
C3Q
QBBN
LPQ
390nH
QBBP
500Ω
06452-093
AUX2_N
87
Note that the gain matching improved the negative frequency
image rejection, but there is still a significant image present.
The remaining image is now due to phase mismatch in the
quadrature modulator. Phase mismatch can be distinguished
from gain mismatch by the shape of the image. Note that the
image in Figure 80 is relatively flat and the image in Figure 81
slopes down with frequency. Phase mismatch is frequency
dependent, so an image dominated by phase mismatch has
this sloping characteristic.
0
Figure 79. Typical Use of Auxiliary DACs AC Coupling to
Quadrature Modulator
REF LVL
0dBm
RBW
VBW
SWT
3kHz
3kHz
56s
REF ATT
MIXER
UNIT
30dB
–40dBm
dBm
–10
–20
LO FEEDTHROUGH COMPENSATION
–30
The LO feedthrough compensation is the most complex of all
three operations. This is due to the structure of the offset auxiliary DACs, as shown in Figure 78. To achieve LO feedthrough
compensation in a circuit, each of four outputs of these auxiliary
DACs can be connected through a 500 Ω resistor to ground
and through a 250 Ω resistor to one of the four quadrature
modulator signal inputs. The purpose of these connections is
to drive a very small amount of current into the nodes at the
quadrature modulator inputs, therefore adding a slight dc bias
to one of the quadrature modulator signal inputs.
To achieve LO feedthrough compensation, the user should start
with the default conditions of the auxiliary DAC sign registers,
and then increment the magnitude of one or the other auxiliary
DAC output currents. While this is being done, the amplitude of
the LO feedthrough at the quadrature modulator output should
be sensed. If the LO feedthrough amplitude increases, try either
changing the sign of the auxiliary DAC being adjusted or
adjusting the output current of the other auxiliary DAC. It may
take practice before an effective algorithm is achieved.
–40
–50
–60
–70
–80
–90
–100
CENTER 2.1GHz
20MHz
SPAN 200MHz
06452-304
OUT1_P
250Ω
93
Figure 80. AD9779A and ADL5372 with a Multitone Signal at 2.1 GHz,
No Gain or LO Compensation
0
REF LVL
0dBm
RBW
VBW
SWT
20kHz
20kHz
1.25s
REF ATT
MIXER
UNIT
20dB
–40dBm
dBm
–10
–20
–30
–40
–50
Using the AD9776A/AD9778A/AD9779A evaluation board, the
LO feedthrough can typically be adjusted down to the noise
floor, although this is not stable over temperature.
–60
–70
–80
–90
–100
CENTER 2.1GHz
20MHz
SPAN 200MHz
06452-305
AD9779A
500Ω
Figure 81. AD9779A and ADL5372 with a Multitone Signal at 2.1 GHz,
Gain and LO Compensation Optimized
Rev. B | Page 45 of 56
AD9776A/AD9778A/AD9779A
INPUT DATA PORTS
The AD9776A/AD9778A/AD9779A can operate in two data
input modes: dual port mode and single port mode. For the
default dual port mode (single port bit = 0), each DAC receives
data from a dedicated input port. In single port mode (single
port bit = 1), both DACs receive data from Port 1. In single port
mode, DAC1 and DAC2 data is interleaved, and the TXENABLE
input is used to steer data to the intended DAC. In dual port
mode, the TXENABLE input is used to power down the digital
data path.
DUAL PORT MODE
In dual port mode, data for each DAC is received on the
respective input bus (P1D[15:0] or P2D[15:0]). I and Q data
arrive simultaneously and are sampled on the rising edge of the
DATACLK signal. The TXENABLE signal must be high to enable
the transmit path.
INPUT DATA REFERENCED TO DATACLK
The simplest method of interfacing to the AD9776A/AD9778A/
AD9779A is when the input data is referenced to the DATACLK
output. The DATACLK output is a buffered version (with some
fixed delay) of the internal clock that is used to latch the input
data. Therefore, if setup and hold times of the input data with
respect to DATACLK are met, the input data is latched correctly.
Detailed timing diagrams for the single and dual port cases
using DATACLK as the timing reference are shown in Figure 82.
In dual port mode, the data must be delivered at the input data
rate. In single port mode, data must be delivered at twice the
input data rate of each DAC. Because the data inputs function
up to a maximum of 300 MSPS, it is practical to operate with
input data rates up to 150 MHz per DAC in single port mode.
In dual port and single port modes, a data clock output
(DATACLK) signal is available as a fixed time base with which
to drive data from an FPGA or other data source. This output
signal operates at the input data rate.
tSDATACLK
SINGLE PORT MODE
tHDATACLK
DATA
In single port mode, data for both DACs is received on the Port 1
input bus (P1D[15:0]). I and Q data samples are interleaved and
are sampled on the rising edges of DATACLK. Along with the
data, a framing signal must be supplied on the TXENABLE
input (Pin 39), which steers incoming data to its respective DAC.
When TXENABLE is high, the corresponding data-word is sent
to the I DAC. When TXENABLE is low, the corresponding data is
sent to the Q DAC. The timing of the digital interface in
interleaved mode is shown in Figure 83.
Figure 82. Input Data Port Timing, Data Referenced to DATACLK
Table 28 shows the setup and hold time requirements for the
input data over the operating temperature range of the device.
Also shown is the keep out window (KOW). The keep out
window is the sum of the setup and hold times of the interface.
This is the minimum amount of time valid data must be
presented to the device to ensure proper sampling.
DATACLK Frequency Settings
The DATACLK signal is derived from the internal DAC sample
clock, DACCLK. The frequency of the DATACLK output depends
on several programmable settings. Normally, the frequency of
DATACLK is equal to the input data rate. The relationship
between the frequency of DACCLK and DATACLK is
The Q first bit (Register 0x02, Bit 0) controls the pairing order
of the input data. With the Q first bit set to the default of 0, the
I-Q pairing sent to the DACs is the two input data-words
corresponding to TXENABLE low followed by TXENABLE
high. With the Q first bit set to 1, the I-Q pairing sent to the
DACs is the two input data-words corresponding to TXENABLE
high, followed by TXENABLE low. Note that with either order
pairing, the data sent with TXENABLE high is directed to the
I DAC, and the data sent with TXENABLE low is directed to the
Q DAC.
f DACCLK
IF × ZS × SP × DATACLKDIV
f DATACLK =
where the variables IF, ZS, SP, and DATACLKDIV have the
values shown in Table 27.
DATACLK
P1D[15:0]
P1D1
P1D2
P1D3
P1D4
P1D5
P1D6
P1D7
P1D8
I DAC[15:0]
P1D1
P1D3
P1D5
Q DAC[15:0]
P1D2
P1D4
P1D6
I DAC[15:0]
P1D1
P1D3
P1D5
Q DAC[15:0]
P1D0
P1D2
P1D4
Q FIRST = 1
Figure 83. Single Port Mode Digital Interface Timing
Rev. B | Page 46 of 56
06452-306
TXENABLE
Q FIRST = 0
06452-308
DATACLK
AD9776A/AD9778A/AD9779A
SYNC_I
tH_SYNC
tS_SYNC
REFCLK
tSREFCLK
tHREFCLK
Table 27. DACCLK to DATACLK Divisor Values
ZS
SP
DATACLKDIV
Value
Interpolation factor (1, 2, 4,
or 8)
1, if zero stuffing is disabled
2, if zero stuffing is enabled
0.5, if single port is enabled
1, if dual port is selected
1, 2, or 4
Address
Register Bit
0x01
[7:6]
0x01
[0]
0x02
[6]
0x03
[5:4]
INPUT DATA REFERENCED TO REFCLK
In some systems, it may be more convenient to use the REFCLK
input than the DATACLK output as the input data timing
reference. If the frequency of DACCLK is equal to the frequency
of the data input (without interpolation), then the data with
respect to REFCLK± timing specifications in Table 28 apply
directly without further considerations. If the frequency of
DACCLK is greater than the frequency of the input data, a
divider is used to generate the DATACLK output (and the
internal data sampling clock). This divider creates a phase
ambiguity between REFCLK and DATACLK, which results in
uncertainty in the sampling time. To establish fixed setup and
hold times of the data interface, this phase ambiguity must be
eliminated.
To eliminate the phase ambiguity, the SYNC_I input pins (Pin 13
and Pin 14) must be used to force the data to be sampled on a
specific REFCLK edge. The relationship among REFCLK,
SYNC_I, and input data is shown in Figure 84 and Figure 85.
Therefore, both SYNC_I and data must meet the timing in
Table 28 for reliable data transfer into the device.
DATA
Figure 84. Input Data Port Timing, Data Referenced to REFCLK, fDACCLK = fREFCLK
Note that even though the setup and hold times of SYNC_I
are relative to REFCLK, the SYNC_I input is sampled at the
internal DACCLK rate. In the case where the PLL is employed,
SYNC_I must be asserted to meet the setup time with respect to
REFCLK (tS_SYNC), but cannot be asserted prior to the previous
rising edge of the internal SYNC_I sample clock. In other words,
the SYNC_I assert edge has to be placed between its successive
keep out windows that replicate at the DACCLK rate, not the
REFCLK rate. The valid window for asserting SYNC_I is
shaded gray in Figure 85 for the case where the PLL provides a
DACCLK frequency of four times the REFCLK frequency.
Thus, the minimum setup time is tS_SYNC, and the maximum
setup time is tDACCLK − tH_SYNC.
tDACCLK
SYNC_I
tH_SYNC
tS_SYNC
REFCLK
DACCLK
tSREFCLK
tHREFCLK
06452-310
Variable
IF
06452-309
The DATACLKDIV only affects the DATACLK output frequency,
not the frequency of the data sampling clock. To maintain an
fDATACLK frequency that samples the input data that remains
consistent with the expected data rate, DATACLKDIV should
be set to 00.
DATA
Figure 85. Input Data Port Timing, Data Referenced to REFCLK,
fDACCLK = fREFCLK × 4
More details of the synchronization circuitry are found in the
Device Synchronization section of this data sheet.
Table 28. Data Timing Specifications vs. Temperature
Timing Parameter
Data with Respect to REFCLK±
Data with Respect to DATACLK
SYNC_I± to REFCLK±
Temperature
−40°C
+25°C
+85°C
−40°C to +85°C
−40°C
+25°C
+85°C
−40°C to +85°C
−40°C
+25°C
+85°C
−40°C to +85°C
Min tS (ns)
−0.80
−1.00
−1.10
−0.80
2.50
2.70
3.00
3.00
0.30
0.25
0.15
0.30
PLL Disabled
Min tH (ns) Min KOW (ns)
3.35
2.55
3.50
2.50
3.80
2.70
3.80
3.00
−0.05
2.45
−0.20
2.50
−0.40
2.60
−0.05
2.95
0.65
0.95
0.75
1.00
0.90
1.05
0.90
1.20
Rev. B | Page 47 of 56
Min tS (ns)
−0.83
−1.06
−1.19
−0.83
2.50
2.70
3.00
3.00
0.27
0.19
0.06
0.27
PLL Enabled
Min tH (ns) Min KOW (ns)
3.87
2.99
4.04
2.98
4.37
3.16
4.37
3.54
−0.05
2.45
−0.20
2.50
−0.40
2.60
−0.05
2.95
1.17
1.39
1.29
1.48
1.47
1.51
1.47
1.74
AD9776A/AD9778A/AD9779A
The AD9776A/AD9778A/AD9779A have on-chip circuitry that
enables the user to optimize the input data timing by adjusting
the relationship between the DATACLK output and DCLK_SMP
(the internal clock that samples the input data). This optimization
is made by a sequence of 3-wire interface register read and write
operations. The timing optimization can be done under strict
control of the user, or the device can be programmed to maintain a
configurable timing margin automatically. This function is only
available when the input data is referenced to the DATACLK
output. Each of these methods is detailed in the following section.
In addition to setting the data timing error IRQ, the data timing
error type bit is indicated when an error occurs. The data timing
error type bit is set low to indicate a hold error and high to
indicate a setup error. Figure 87 shows a timing diagram of the
data interface and the status of the data timing error type bit.
DATA
TIMING ERROR = 0
TIMING
MARGIN[3:0]
D
TIMING
ERROR
DETECTION
CLK
PD1[0]
D
ΔtM
TIMING
ERROR IRQ
Q
Q
CLK
DATACLK
Δt M
ΔtM
Δt M
TIMING ERROR = 1
DATA TIMING ERROR TYPE = 1
DATA
DELAYED
DATA
SAMPLING
ACTUAL
SAMPLING
INSTANT
TIMING ERROR = 1
DATA TIMING ERROR TYPE = 0
DELAYED
CLOCK
SAMPLING
Figure 87. Timing Diagram of Margin Test Data
When automatic timing optimization mode is enabled
(Register 0x03, Bit 7 = 1), the device continuously monitors
the data timing error IRQ and data timing error type bits. The
DATACLK Delay[3:0] is increased if a setup error is detected and
decreased if a hold error is detected. The value of the DATACLK
Delay[3:0] setting currently in use can be read back by the user.
TIMING
ERROR TYPE
06452-402
ΔtD
ΔtM
Automatic Timing Optimization
DATACLK
DELAY[3:0]
DCLK_SMP
Δt M
DATA
Figure 86 shows the circuitry that detects sample timing errors
and adjusts the data interface timing. The DCLK_SMP signal is
the internal clock used to latch the input data. Ultimately, it is
the rising edge of this signal that needs to be centered in the
valid sampling period of the input data. This is accomplished by
adjusting the time delay, tD, which changes the DATACLK
timing and, as a result, the arrival time of the input data with
respect to DCLK_SMP.
ΔtM
ΔtM
06452-403
OPTIMIZING THE DATA INPUT TIMING
Figure 86. Timing Error Detection and Optimization Circuitry
The error detect circuitry works by creating two sets of sampled
data (referred to as the margin test data) in addition to the
actual sampled data used in the device data path. One set of
sampled data is latched before the actual data sampling point.
The other set of sampled data is latched after the actual data
sampling point. If the margin test data match the actual data,
the sampling is considered valid and no error is declared. If
there is a mismatch between the actual data and the margin test
data, an error is declared.
The Data Timing Margin[3:0] variable determines how much
before and after the actual data sampling point the margin test
data are latched. Therefore, the data timing margin variable
determines how much setup and hold margin the interface
needs for the data timing error IRQ to remain inactive (show
error free operation). Therefore, the timing error IRQ is set
whenever the setup and hold margins drop below the Data
Timing Margin[3:0] value and does not necessarily indicate that
the data latched into the device is incorrect.
Manual Timing Optimization
When the device is operating in manual timing optimization
mode (Register 0x03, Bit 7 = 0), the device does not alter the
DATACLK Delay[3:0] value from what is programmed by the
user. By default, the DATACLK delay enable bit is inactive. This
bit must be set high for the DATACLK Delay[3:0] value to be
realized. The delay (in absolute time) when programming
DATACLK delay between 00000 and 11111 varies from about
700 ps to about 6.5 ns. The typical delays per increment over
temperature are shown in Table 29.
Table 29. Data Delay Line Typical Delays Over Temperature
Delay
Zero Code Delay (Delay Upon
Enabling Delay Line)
Average Unit Delay
−40°C
630
+25°C
700
+85°C
740
Unit
ps
175
190
210
ps
When the device is placed into manual mode, the error
checking logic is activated. If the IRQs are enabled, an interrupt
is generated if a setup/hold violation is detected. One error
check operation is performed per device configuration. Any
change to the Data Timing Margin[3:0] or DATACLK
Delay[3:0] values triggers a new error check operation.
Rev. B | Page 48 of 56
AD9776A/AD9778A/AD9779A
DEVICE SYNCHRONIZATION
System demands can impose two different requirements for
synchronization. Some systems require multiple DACs to be
synchronized to each other. This is the case when supporting
transmit diversity or beam forming, where multiple antennas
are used to transmit a correlated signal. In this case, the DAC
outputs need to be phase aligned with each other, but there may
not be a requirement for the DAC outputs to be aligned with a
system level reference clock. In systems with a time division
multiplexing transmit chain, one or more DACs may need to be
synchronized with a system level reference clock. The options
for synchronizing devices under these two conditions are
described in the Synchronization Logic Overview section
and the Synchronizing Devices to a System Clock section.
SYNCHRONIZATION LOGIC OVERVIEW
Figure 88 shows the block diagram of the on-chip synchronization logic. The basic operation of the synchronization logic is to
generate a single DACCLK-cycle-wide initialization pulse that
sets the clock generation state machine logic to a known state.
This initialization pulse loads the clock generation state machine
with the Clock State[4:0] value as its next state. If the initialization pulse from the synchronization logic is generated properly,
it is active for one DACCLK cycle, every 32 DACCLK cycles.
Because the clock generation state machine has 32 states operating
at the DACCLK rate, every initialization pulse received after the
first pulse loads the state in which the state machine is already
in, maintaining proper clocking operation of the device.
PLL
BYPASS INTERNAL
PLL
REFCLK
DACCLK
CLOCK
GENERATION
STATE
MACHINE
BIT 0 (1× INTERPOLATION)
BIT 1 (2×)
BIT 2 (4×)
BIT 3 (8×)
BIT 4 (8× WITH
ZERO STUFFING)
DELAY REGISTER
(REG 0x0, BITS[7:4])
fSYNC_1 < fDATA/2^N
SYNC_I
Ratio[2:0]
000
001
010
011
100
101
110
111
SYNC_I Rising Edges Required for
Synchronization Pulse
1 (default)
2
4
8
16
Invalid setting
Invalid setting
Invalid setting
As an example, if a SYNC_I signal with a frequency of fDACCLK/4
is used, then both 011 and 100 are valid settings for the SYNC_I
Ratio[2:0] value. A setting of 011 results in one initialization
pulse being generated every 32 DACCLK cycles, and a setting
of 100 results in one initialization pulse being generated every
64 DACCLK cycles. Both cases result in proper device
synchronization.
The Clock State[4:0] value is the state to which the clock
generation state machine resets upon initialization. By varying
this value, the timing of the internal clocks with respect to the
SYNC_I signal can be adjusted. Every increment of the Clock
State[4:0] value advances the internal clocks by one DACCLK
period.
The synchronization logic has error detection circuitry similar to
the input data timing. The SYNC_I Timing Margin[3:0] variable
determines how much setup and hold margin the synchronization
interface needs for the sync timing error IRQ bit to remain inactive
(that is, to indicate error free operation). Therefore, the sync timing
error IRQ bit is set whenever the setup and hold margins drop
below the SYNC_I Timing Margin[3:0] value and, therefore,
does not necessarily indicate that the SYNC_I input was latched
incorrectly.
MUX
ERROR DETECT
CIRCUITRY
SYNC IRQ
PULSE
GENERATION
LOGIC
06452-094
SYNC
DELAY
Table 30. Settings Required to Support Various SYNC_I
Frequencies
Synchronization Timing Error Detection
LOAD DACCLK OFFSET VALUE (REG 0x07,
BITS[4:0]), ONE DACCLK CYCLE/INCREMENT
SYNC_I
multiple of 32 DACCLK periods. In any case, the maximum
frequency of SYNC_I must be less than fDATACLK.
Figure 88. Synchronization Circuitry Block Diagram
Nominally, the SYNC_I input should have one rising edge every
32 clock cycles (or multiple of 32 clock cycles) to maintain
proper synchronization. The pulse generation logic can be
programmed to suppress outgoing pulses if the incoming
SYNC_I frequency is greater than DACCLK/32. Extra pulses
can be suppressed by the ratios listed in Table 30. The SYNC_I
frequency can be lower than DACCLK/32 as long as output
pulses are generated from the pulse generation circuit on a
When the sync timing error IRQ bit is set, corrective action can
be taken to restore timing margin. One course of action is to
temporarily reduce the timing margin until the sync timing
error IRQ is cleared. Then, increase the SYNC_I delay by two
increments and check whether the timing margin has increased
or decreased. If it has increased, continue incrementing the
value of SYNC_I delay until the margin is maximized. However,
if incrementing the SYNC_I delay reduced the timing margin,
then the delay should be reduced until the timing margin is
optimized.
Rev. B | Page 49 of 56
AD9776A/AD9778A/AD9779A
Figure 90 shows the timing of the SYNC_I input with respect to
the REFCLK input. Note that although the timing is relative to
the REFCLK signal, SYNC_I is sampled at the DACCLK rate.
This means that the rising edge of the SYNC_I signal must occur
after the hold time of the preceding DACCLK rising edge, not
the preceding REFCLK rising edge.
SYNCHRONIZING DEVICES TO A SYSTEM CLOCK
The AD9776A/AD9778A/AD9779A offer a pulse mode synchronization scheme (see Figure 89) to align the DAC outputs of
multiple devices within a system to the same DACCLK edge.
The internal clocks are synchronized by providing either a onetime pulse or a periodic signal to the SYNC_I inputs (SYNC_I+,
SYNC_I−). The SYNC_I signal is sampled by the internal
DACCLK sample rate clock.
INTERRUPT REQUEST OPERATION
The IRQ pin (Pin 71) acts as an alert in the event that the
device has a timing error and should be queried (by reading
Register 0x19) to determine the exact fault condition. The IRQ pin
is an open-drain, active low output. The IRQ pin should be pulled
high external to the device. This pin can be tied to the IRQ pins
of other devices with open-drain outputs to wire-OR these pins
together.
The SYNC_I input frequency has the following constraint:
fSYNC_I ≤ fDATA
When the internal clocks are synchronized, the data-sampling
clocks between all devices are phase aligned. The data input
timing relationships can be referenced to either REFCLK or
DATACLK.
There are two different error flags that can trigger an interrupt
request: a data timing error flag or a sync timing error flag. By
default, when either or both of these error flags are set, the IRQ pin
is active low. Either or both of these error flags can be masked
to prevent them from activating an interrupt on the IRQ pin.
For this synchronization scheme, all devices are slave devices,
and the system clock generation/distribution chip serves as the
master. It is vital that the SYNC_I signal be distributed between
the DACs with low skew. Likewise, the REFCLK signals must be
distributed with low skew. Any skew on these signals between the
DACs must be accounted for in the timing budget. Figure 89
shows an example clock and synchronization input scheme.
The error flags are latched and remain active until the interrupt
register, Register 0x19, is either read from or the error flag bits
are overwritten.
MATCHED
LENGTH TRACES
REFCLK
OUT
SYNC_I
SYSTEM CLOCK
LOW SKEW
CLOCK DRIVER
REFCLK
OUT
SYNC_I
LOW SKEW
CLOCK DRIVER
06452-311
PULSE
GENERATOR
MATCHED
LENGTH TRACES
Figure 89. Multichip Synchronization in Pulse Mode
SYNC_I
tH_SYNC
tS_SYNC
06452-312
REFCLK
DACCLK
Figure 90. Timing Diagram of SYNC_I with Respect to REFCLK When Synchronizing Multiple Devices to Each Other
Rev. B | Page 50 of 56
AD9776A/AD9778A/AD9779A
POWER DISSIPATION
Figure 91 to Figure 99 show the power dissipation of the 1.8 V and 3.3 V digital and clock supplies in single DAC mode and dual DAC
mode. In addition to this, the power dissipation/current of the 3.3 V analog supply (mode and speed independent) in single DAC mode is
102 mW/31 mA. In dual DAC mode, this is 182 mW/55 mA. When the PLL is enabled, it adds 50 mA/90 mW to the 1.8 V clock supply.
0.075
0.7
8× INTERPOLATION
0.6
4× INTERPOLATION
4× INTERPOLATION,
ZERO STUFFING
8× INTERPOLATION,
ZERO STUFFING
0.5
ALL INTERPOLATION MODES
POWER (W)
POWER (W)
0.050
2× INTERPOLATION,
ZERO STUFFING
0.4
2× INTERPOLATION
0.3
1× INTERPOLATION,
ZERO STUFFING
0.025
0.2
1× INTERPOLATION
0
25
50
75
100
125
150
175
200
225
250
fDATA (MSPS)
0
06452-076
0
Figure 91. Total Power Dissipation, I Data Only, Real Mode
0
25
50
75
100
150
175
200
225
250
Figure 94. Power Dissipation, Digital 3.3 V Supply, I Data Only, Real Mode,
Includes Modulation Modes and Zero Stuffing
0.4
1.0
4× INTERPOLATION
8× INTERPOLATION, ALL
MODULATION MODES
8× INTERPOLATION,
ZERO STUFFING
0.9
8× INTERPOLATION
125
fDATA (MSPS)
06452-080
0.1
4× INTERPOLATION,
ALL MODULATION
MODES
0.8
0.3
0.2
POWER (W)
POWER (W)
0.7
2× INTERPOLATION
0.6
2× INTERPOLATION,
ALL MODULATION MODES
0.5
0.4
0.3
0.1
0.2
1× INTERPOLATION
2× INTERPOLATION,
ZERO STUFFING
4× INTERPOLATION,
ZERO STUFFING
0.1
1× INTERPOLATION,
ZERO STUFFING
25
50
75
100
125
150
175
200
225
250
fDATA (MSPS)
0
06452-078
0
0
75
100 125 150 175 200 225 250 275 300
Figure 95. Total Power Dissipation, Dual DAC Mode
0.8
0.08
8× INTERPOLATION, fDAC /8,
fDAC /4,
fDAC /2,
NO MODULATION
0.7
4× INTERPOLATION
0.6
8× INTERPOLATION
4× INTERPOLATION
POWER (W)
0.06
0.04
2× INTERPOLATION
0.5
0.4
2× INTERPOLATION
0.3
0.2
0.02
1× INTERPOLATION
25
50
75
100
125
150
fDATA (MSPS)
175
200
225
250
06452-079
0
0
1× INTERPOLATION,
NO MODULATION
0.1
Figure 93. Power Dissipation, Clock 1.8 V Supply, I Data Only, Real Mode,
Includes Modulation Modes, Does Not Include Zero Stuffing
0
25
50
75
100
125
150
fDATA (MSPS)
175
200
225
250
06452-081
POWER (W)
50
fDATA (MSPS)
Figure 92. Power Dissipation, Digital 1.8 V Supply, I Data Only, Real Mode,
Does Not Include Zero Stuffing
0
25
06452-077
1× INTERPOLATION
0
Figure 96. Power Dissipation, Digital 1.8 V Supply, I and Q Data, Dual DAC
Mode, Does Not Include Zero Stuffing
Rev. B | Page 51 of 56
AD9776A/AD9778A/AD9779A
0.125
POWER-DOWN AND SLEEP MODES
8× INTERPOLATION, fDAC /8,
fDAC /4,
fDAC /2,
NO
MODULATION
0.100
4× INTERPOLATION
POWER (W)
0.075
2× INTERPOLATION
0.050
0.025
1× INTERPOLATION,
NO MODULATION
0
25
50
75
100
125
150
175
200
225
250
fDATA (MSPS)
06452-082
0
Figure 97. Power Dissipation, Clock 1.8 V Supply, I and Q Data, Dual DAC
Mode, Does Not Include Zero Stuffing
0.075
The AD9776A/AD9778A/AD9779A have a variety of power-down
modes; thus, the digital engine, main TxDACs, or auxiliary DACs
can be powered down individually or together. Via the 3-wire
interface port, the main TxDACs can be placed in sleep or powerdown mode. In sleep mode, the TxDAC output is turned off,
thus reducing power dissipation. The reference remains powered
on, however, so that recovery from sleep mode is very fast. With
the power-down mode bit set (Register 0x00, Bit 4), all analog
and digital circuitry, including the reference, is powered down.
The 3-wire interface port remains active in this mode. This
mode offers more substantial power savings than sleep mode,
but the turn-on time is much longer. The auxiliary DACs also
have the capability to be programmed into sleep mode via the
3-wire interface port. The auto power-down enable bit (Register
0x00, Bit 3) controls the power-down function for the digital
section of the devices. The auto power-down function works in
conjunction with the TXENABLE pin (Pin 39); see Table 31 for
details.
Table 31.
TXENABLE
(Pin 39)
0
ALL INTERPOLATION MODES
POWER (W)
0.050
0.025
1
0
25
50
75
100
125
150
175
200
225
250
fDATA (MSPS)
06452-083
0
Figure 98. Power Dissipation, Digital 3.3 V Supply, I and Q Data,
Dual DAC Mode
0.16
0.14
0.10
0.08
0.06
0.04
0.02
0
0
200
400
600
800
1000
1200
fDAC (MSPS)
06452-084
POWER (W)
0.12
Figure 99. DVDD18 Power Dissipation of Inverse Sinc Filter
Rev. B | Page 52 of 56
Description
If auto power-down enable bit = 0, flush data
path with 0s.
If auto power-down enable bit = 1, flush data for
multiple REFCLK cycles; then, automatically
place the digital engine in power-down state.
DACs, reference, and 3-wire interface port are
not affected.
Normal operation.
AD9776A/AD9778A/AD9779A
EVALUATION BOARD OVERVIEW
The typical evaluation setup is shown in Figure 100. A sine or
square wave clock can be used to source the DAC sample clock.
The spectral purity of the clock directly affects the device performance. A low noise, low jitter clock source is required.
EVALUATION BOARD OPERATION
The AD9776A/AD9778A/AD9779A evaluation board is provided
to help users quickly become familiar with the operation of the
device and to evaluate the device performance. To operate the
evaluation board, the user needs a PC, a 5 V power supply, a
clock source, and a digital data source. The user also needs a
spectrum analyzer or an oscilloscope to observe the DAC output.
All necessary connections to the evaluation board are shown in
more detail in Figure 101.
CLOCK
GENERATOR
ADAPTER
CABLES
CLKIN
SPI PORT
SPECTRUM
ANALYZER
AD9776A/
AD9778A/
AD9779A
DIGITAL
PATTERN
GENERATOR
EVALUATION
BOARD
CLOCK IN
06452-097
1.8V POWER SUPPLY
DATACLK OUT
3.3V POWER SUPPLY
Figure 100. Typical Test Setup
DVDD18
DVDD33
P4 DIGITAL INPUT CONNECTOR
CVDD18
J1 CLOCK IN
AD9779A
JP4
JP15
JP8
JP14
JP3
JP16
JP2
JP17
S7 DCLKOUT
J2
5V SUPPLY
MODULATOR
OUTPUT
S5 OUTPUT 1
ADL537x
+5V
GND
S6 OUTPUT 2
LOCAL OSC
INPUT
ANALOG
DEVICES
AD9776A/
AD9778A/
AD9779A
06452-095
SPI PORT
AVDD33
Figure 101. AD9776A/AD9778A/AD9779A Evaluation Board Showing All Connections
Rev. B | Page 53 of 56
AD9776A/AD9778A/AD9779A
The evaluation board comes with software that allows the user
to program the on-chip configuration registers. Via the 3-wire
interface port, the devices can be programmed into any of its
various operating modes. The default software window is
shown in Figure 102.
The evaluation board also comes populated with the ADL537x
modulator to allow for the evaluation of an RF subsystem.
Complete details on the evaluation board and the 3-wire
interface software can be downloaded from the Analog Devices
website.
1. SET INTERPOLATION RATE
2. SET INTERPOLATION FILTER MODE
3. SET INPUT DATA FORMAT
06452-099
4. SET DATACLK POLARITY TO MATCH INPUT TIMING
Figure 102. 3-Wire Interface Port Software Window
Rev. B | Page 54 of 56
AD9776A/AD9778A/AD9779A
OUTLINE DIMENSIONS
0.75
0.60
0.45
16.00 BSC SQ
1.20
MAX
14.00 BSC SQ
100
1
SEATING
PLANE
76
76
75
100
1
75
PIN 1
BOTTOM VIEW
(PINS UP)
TOP VIEW
(PINS DOWN)
CONDUCTIVE
HEAT SINK
51
50
25
50
1.05
1.00
0.95
7°
3.5°
0°
0.50 BSC
0.27
0.22
0.17
0.15
0.05
COPLANARITY
0.08
26
6.50
NOM
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MS-026-AED-HDT
072408-A
51
25
26
0.20
0.09
Figure 103. 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
(SV-100-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
AD9776ABSVZ 1
AD9776ABSVZRL1
AD9778ABSVZ1
AD9778ABSVZRL1
AD9779ABSVZ1
AD9779ABSVZRL1
AD9776A-EBZ1
AD9778A-EBZ1
AD9779A-EBZ1
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
Evaluation Board
Evaluation Board
Evaluation Board
Z = RoHS Compliant Part.
Rev. B | Page 55 of 56
Package Option
SV-100-1
SV-100-1
SV-100-1
SV-100-1
SV-100-1
SV-100-1
AD9776A/AD9778A/AD9779A
NOTES
©2007–2008 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06452-0-9/08(B)
Rev. B | Page 56 of 56