LM2841, LM2842 www.ti.com SNVS540H – MARCH 2009 – REVISED APRIL 2013 LM2840/LM2841/LM2842/ LM2840-Q1/LM2841-Q1/LM2842-Q1 100/300/600 mA 42V Input Step-Down DC/DC Regulator in Thin SOT Check for Samples: LM2841, LM2842 FEATURES DESCRIPTION • The LM2840, LM2841 and LM2842 are PWM DC/DC buck (step-down) regulators. With a wide input range from 4.5V-42V, they are suitable for a wide range of applications such as power conditioning from unregulated sources. They feature a low RDSON (0.9Ω typical) internal switch for maximum efficiency (85% typical). Operating frequency is fixed at 550 kHz (X version) and 1.25 MHz (Y version) allowing the use of small external components while still being able to have low output voltage ripple. Soft-start can be implemented using the shutdown pin with an external RC circuit allowing the user to tailor the soft-start time to a specific application. 1 2 • • • • • • • • • LM2840Q, LM2841-Q1 and LM2842-Q1 are Automotive Grade Products that are AEC-Q100 Grade 1 Qualified (-40°C to +125°C Operating Junction Temperature) Input Voltage Range of 4.5V to 42V Output Current Options of 100 mA, 300 mA and 600 mA Feedback Pin Voltage of 0.765V 550 kHz (X) or 1.25 MHz (Y) Switching Frequency Low Shutdown IQ, 16 µA Typical Short Circuit Protected Internally Compensated Soft-Start Circuitry Small Overall Solution Size (SOT-6L Package) The LM2840 is optimized for up to 100 mA, the LM2841 for 300 mA and the LM2842 is optimized for up to 600 mA load currents. They all have a 0.765V nominal feedback voltage. Additional features include: thermal shutdown, VIN under-voltage lockout, and gate drive under-voltage lockout. The LM2840, LM2841 and LM2842 are available in a low profile SOT-6L package. APPLICATIONS • • • • Battery Powered Equipment Industrial Distributed Power Applications Portable Media Players Portable Hand Held Instruments Typical Application Circuit CBOOT L1 VOUT LM2840/1/2-ADJL VIN VIN CB SHDN SW GND FB D1 R1 CIN R2 COUT 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2009–2013, Texas Instruments Incorporated LM2841, LM2842 SNVS540H – MARCH 2009 – REVISED APRIL 2013 www.ti.com Connection Diagram Top View LM2840/1/2 CB 1 GND 2 FB 3 PIN 1 ID 6 SW 5 VIN 4 SHDN Figure 1. SOT 6 Lead See Package Number DDC (R-PDSO-G6) PIN DESCRIPTIONS Pin Name 1 CB 2 GND 3 FB 4 SHDN Function SW FET gate bias voltage. Connect CBOOT cap between CB and SW. Ground connection. Feedback pin: Set feedback voltage divider ratio with VOUT = VFB (1+(R1/R2)). Resistors should be in the 100-10K range to avoid input bias errors. Logic level shutdown input. Pull to GND to disable the device and pull high to enable the device. If this function is not used tie to VIN or leave open. 5 VIN Power input voltage pin: 4.5V to 42V normal operating range. 6 SW Power FET output: Connect to inductor, diode, and CBOOT cap. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM2841 LM2842 LM2841, LM2842 www.ti.com SNVS540H – MARCH 2009 – REVISED APRIL 2013 Absolute Maximum Ratings (1) (2) VIN -0.3V to +45V SHDN -0.3V to (VIN+0.3V) <45V SW Voltage -0.3V to +45V CB Voltage above SW Voltage 7V FB Voltage -0.3V to +5V Maximum Junction Temperature 150°C Power Dissipation (3) Internally Limited Lead Temperature 300°C Vapor Phase (60 sec.) 215°C Infrared (15 sec.) 220°C ESD Susceptibility (1) (4) Human Body Model 2 kV Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the device is intended to be functional, but device parameter specifications may not be ensured. For ensured specifications and test conditions, see the Electrical Characteristics. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal resistance, θJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using: PD (MAX) = (TJ(MAX) − TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=175°C (typ.) and disengages at TJ= 155°C (typ). Human Body Model, applicable std. JESD22-A114-C. (2) (3) (4) Operating Conditions Operating Junction Temperature Range (1) −40°C to +125°C −65°C to +150°C Storage Temperature Input Voltage VIN 4.5V to 42V SW Voltage (1) Up to 42V All limits specified at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are 100% production tested. All limits at temperature extremes are ensured via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL). Electrical Characteristics Specifications in standard type face are for TJ = 25°C and those with boldface type apply over the full Operating Temperature Range ( TJ = −40°C to +125°C). Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = +25°C, and are provided for reference purposes only. Unless otherwise stated the following conditions apply: VIN = 12V. Symbol IQ Parameter Quiescent current Conditions Min (1) SHDN = 0V Typ (2) Max (1) 16 40 Device On, Not Switching 1.30 1.75 Device On, No Load 1.35 1.85 Units µA mA RDSON Switch ON resistance See (3) 0.9 1.6 Ω ILSW Switch leakage current VIN = 42V 0.0 0.5 µA ICL Switch current limit LM2840 (4) 525 900 mA LM2841 (4) 525 900 mA LM2842 (4) 1.15 1.7 A 0.1 1.0 µA 0.765 0.782 V IFB Feedback pin bias current VFB FB Pin reference voltage (1) (2) (3) (4) (5) LM2840/41/42 (5) 0.747 All limits specified at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are 100% production tested. All limits at temperature extremes are ensured via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL). Typical numbers are at 25°C and represent the most likely norm. Includes the bond wires, RDSON from VIN pin to SW pin. Current limit at 0% duty cycle. May be lower at higher duty cycle or input voltages below 6V. Bias currents flow into pin. Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM2841 LM2842 3 LM2841, LM2842 SNVS540H – MARCH 2009 – REVISED APRIL 2013 www.ti.com Electrical Characteristics (continued) Specifications in standard type face are for TJ = 25°C and those with boldface type apply over the full Operating Temperature Range ( TJ = −40°C to +125°C). Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = +25°C, and are provided for reference purposes only. Unless otherwise stated the following conditions apply: VIN = 12V. Symbol Parameter Conditions Min (1) (6) Typ (2) Max (1) Units tON(min) Minimum ON time See 100 150 ns tOFF(min) Minimum OFF time X option 110 370 ns Y option 104 200 ns 550 750 fSW LM2840/41/42X, VFB = 0.5V Switching frequency 325 LM2840/41/42X, VFB = 0V LM2840/41/42Y, VFB = 0.5V 140 0.95 LM2840/41/42Y, VFB = 0V DMAX VUVP V SHDN Maximum duty cycle LM2840/41/42X 88 94 LM2840/41/42Y 81 87 Undervoltage lockout thresholds On threshold 4.4 3.7 Shutdown threshold Device on Off threshold Shutdown pin input bias current VSHDN = 2.3V 1.50 0.35 3.5 2.3 Device off ISHDN 1.25 (5) VSHDN = 0V kHz MHz % 3.25 1.0 0.9 0.3 0.05 1.5 0.02 1.5 V V µA THERMAL SPECIFICATIONS RθJA Junction-to-Ambient Thermal Resistance, SOT-6L Package RθJC Junction-to-Case Thermal Resistance, SOT-6L Package (6) (7) 4 See (7) 121 °C/W 94 °C/W Minimum On Time specified by design and simulation. All numbers apply for packages soldered directly onto a 3" x 3" PC board with 2 oz. copper on 4 layers in still air in accordance to JEDEC standards. Thermal resistance varies greatly with layout, copper thickness, number of layers in PCB, power distribution, number of thermal vias, board size, ambient temperature, and air flow. Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM2841 LM2842 LM2841, LM2842 www.ti.com SNVS540H – MARCH 2009 – REVISED APRIL 2013 Typical Performance Characteristics Efficiency vs. Load Current (LM2842X, VOUT = 3.3V) Efficiency vs. Load Current (LM2841X, VOUT = 3.3V) 100 100 VIN = 12V VIN = 12V 80 VIN = 36V 60 VIN = 36V EFFICIENCY (%) EFFICIENCY (%) 80 VIN = 24V 40 60 VIN = 24V 40 20 20 0 0.0 0.1 0.2 0.3 0.4 0.5 0 0.0 0.6 0.1 0.2 0.3 LOAD CURRENT (A) LOAD CURRENT (A) Figure 2. Figure 3. Efficiency vs. Load Current (LM2840X, VOUT = 8V) Switching Frequency vs. Temperature (X version) 100 VIN = 12V 90 EFFICIENCY (%) 80 VIN = 24V 70 60 50 40 30 20 10 0 0 20 40 60 80 100 120 LOAD CURRENT (mA) Figure 4. Figure 5. Input UVLO Voltage vs. Temperature Switch Current Limit vs. SHDN Pin Voltage (Soft-start Implementation, LM2840/41) SWITCH CURRENT LIMIT (mA) 800 600 400 200 0 1.0 1.6 2.2 2.8 3.4 4.0 SHDN PIN VOLTAGE (V) Figure 6. Figure 7. Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM2841 LM2842 5 LM2841, LM2842 SNVS540H – MARCH 2009 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) Switch Current Limit vs. SHDN Pin Voltage (Soft-start Implementation, LM2842) SHDN Pin Current vs. SHDN Pin Voltage SWITCH CURRENT LIMIT (A) 1.2 1.0 0.9 0.7 0.6 0.4 1.1 1.7 2.3 2.8 3.4 4.0 SHDN PIN VOLTAGE (V) Figure 8. Figure 9. Switching Node and Output Voltage Waveforms Load Transient Waveforms VIN = 12V, VOUT = 3.3V, IOUT = 200 mA Top trace: VOUT, 10 mV/div, AC Coupled Bottom trace: SW, 5V/div, DC Coupled T = 1 µs/div Figure 10. VIN = 12V, VOUT = 3.3V, IOUT = 300 mA to 200 mA to 300 mA Top trace: VOUT, 20 mV/div, AC Coupled Bottom trace: IOUT, 100 mA/div, DC Coupled T = 200 µs/div Figure 11. Start-up Waveform VIN = 12V, VOUT = 3.3V, IOUT = 50 mA Top trace: VOUT, 1V/div, DC Coupled Bottom trace: SHDN, 2V/div, DC Coupled T = 40 µs/div Figure 12. 6 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM2841 LM2842 LM2841, LM2842 www.ti.com SNVS540H – MARCH 2009 – REVISED APRIL 2013 BLOCK DIAGRAM CB + OSC SET FB + PWM Comp Error Amp + Bandgap Soft Start VIN Max Duty Cycle Limit + RESET Inductor Current Measurement DC LIMIT BUCK DRIVE FET Driver SW UVLO TSD UVLO Comp Thermal Shutdown BG Voltage Regulator GND SHDN Figure 13. Block Diagram OPERATION PROTECTION The LM2840/1/2 has dedicated protection circuitry running during normal operation to protect the IC. The thermal shutdown circuitry turns off the power device when the die temperature reaches excessive levels. The UVLO comparator protects the power device during supply power startup and shutdown to prevent operation at voltages less than the minimum input voltage. A gate drive (CB) under-voltage lockout is included to ensure that there is enough gate drive voltage to drive the MOSFET before the device tries to start switching. The LM2840/1/2 also features a shutdown mode decreasing the supply current to approximately 16 µA. CONTINUOUS CONDUCTION MODE The LM2840/1/2 contains a current-mode, PWM buck regulator. A buck regulator steps the input voltage down to a lower output voltage. In continuous conduction mode (when the inductor current never reaches zero at steady state), the buck regulator operates in two cycles. The power switch is connected between VIN and SW. In the first cycle of operation the transistor is closed and the diode is reverse biased. Energy is collected in the inductor and the load current is supplied by COUT and the rising current through the inductor. During the second cycle the transistor is open and the diode is forward biased due to the fact that the inductor current cannot instantaneously change direction. The energy stored in the inductor is transferred to the load and output capacitor. The ratio of these two cycles determines the output voltage. The output voltage is defined approximately as: D=VOUT/VIN and D’ = (1-D) where D is the duty cycle of the switch. D and D' will be required for design calculations. DESIGN PROCEDURE This section presents guidelines for selecting external components. SETTING THE OUTPUT VOLTAGE The output voltage is set using the feedback pin and a resistor divider connected to the output as shown on the front page schematic. The feedback pin voltage 0.765V, so the ratio of the feedback resistors sets the output voltage according to the following equation: VOUT=0.765V(1+(R1/R2)) Typically R2 will be given as 100Ω-10 kΩ for a starting value. To solve for R1 given R2 and VOUT use R1=R2((VOUT/0.765V)-1). Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM2841 LM2842 7 LM2841, LM2842 SNVS540H – MARCH 2009 – REVISED APRIL 2013 www.ti.com INPUT CAPACITOR A low ESR ceramic capacitor (CIN) is needed between the VIN pin and GND pin. This capacitor prevents large voltage transients from appearing at the input. Use a 2.2 µF-10 µF value with X5R or X7R dielectric. Depending on construction, a ceramic capacitor’s value can decrease up to 50% of its nominal value when rated voltage is applied. Consult with the capacitor manufacturer's data sheet for information on capacitor derating over voltage and temperature. INDUCTOR SELECTION The most critical parameters for the inductor are the inductance, peak current, and the DC resistance. The inductance is related to the peak-to-peak inductor ripple current, the input and the output voltages. L= (VIN - VOUT)VOUT VIN x IRIPPLE x fSW (1) A higher value of ripple current reduces inductance, but increases the conductance loss, core loss, and current stress for the inductor and switch devices. It also requires a bigger output capacitor for the same output voltage ripple requirement. A reasonable value is setting the ripple current to be 30% of the DC output current. Since the ripple current increases with the input voltage, the maximum input voltage is always used to determine the inductance. The DC resistance of the inductor is a key parameter for the efficiency. Lower DC resistance is available with a bigger winding area. A good tradeoff between the efficiency and the core size is letting the inductor copper loss equal 2% of the output power. See AN-1197 SNVA038 for more information on selecting inductors. A good starting point for most applications is a 10 µH to 22 µH with 1.1A or greater current rating for the LM2842 or a 0.7A or greater current rating for the LM2840/41. Using such a rating will enable the LM2840/1/2 to current limit without saturating the inductor. This is preferable to the LM2840/1/2 going into thermal shutdown mode and the possibility of damaging the inductor if the output is shorted to ground or other longterm overload. OUTPUT CAPACITOR The selection of COUT is driven by the maximum allowable output voltage ripple. The output ripple in the constant frequency, PWM mode is approximated by: VRIPPLE = IRIPPLE(ESR+(1/(8fSWCOUT))) The ESR term usually plays the dominant role in determining the voltage ripple. Low ESR ceramic capacitors are recommended. Capacitors in the range of 22 µF-100 µF are a good starting point with an ESR of 0.1Ω or less. BOOTSTRAP CAPACITOR A 0.15 µF ceramic capacitor or larger is recommended for the bootstrap capacitor (CBOOT). For applications where the input voltage is less than twice the output voltage a larger capacitor is recommended, generally 0.15 µF to 1 µF to ensure plenty of gate drive for the internal switches and a consistently low RDSON. SOFT-START COMPONENTS The LM2840/1/2 has circuitry that is used in conjunction with the SHDN pin to limit the inrush current on start-up of the DC/DC switching regulator. The SHDN pin in conjunction with a RC filter is used to tailor the soft-start for a specific application. When a voltage applied to the SHDN pin is between 0V and up to 2.3V it will cause the cycle by cycle current limit in the power stage to be modulated for minimum current limit at 0V up to the rated current limit at 2.3V. Thus controlling the output rise time and inrush current at startup. The resistor value should be selected so the current sourced into the SHDN pin will be greater then the leakage current of the SHDN pin (1.5 µA ) when the voltage at SHDN is equal or greater then 2.3V. SHUTDOWN OPERATION The SHDN pin of the LM2840/1/2 is designed so that it may be controlled using 2.3V or higher logic signals. If the shutdown function is not to be used the SHDN pin may be tied to VIN. The maximum voltage to the SHDN pin should not exceed 42V. If the use of a higher voltage is desired due to system or other constraints it may be used, however a 100 kΩ or larger resistor is recommended between the applied voltage and the SHDN pin to protect the device. 8 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM2841 LM2842 LM2841, LM2842 www.ti.com SNVS540H – MARCH 2009 – REVISED APRIL 2013 SCHOTTKY DIODE The breakdown voltage rating of the diode (D1) is preferred to be 25% higher than the maximum input voltage. The current rating for the diode should be equal to the maximum output current for best reliability in most applications. In cases where the duty cycle is greater than 50%, the average diode current is lower. In this case it is possible to use a diode with a lower average current rating, approximately (1-D)IOUT, however the peak current rating should be higher than the maximum load current. A 0.5A to 1A rated diode is a good starting point. LAYOUT CONSIDERATIONS To reduce problems with conducted noise pick up, the ground side of the feedback network should be connected directly to the GND pin with its own connection. The feedback network, resistors R1 and R2, should be kept close to the FB pin, and away from the inductor to minimize coupling noise into the feedback pin. The input bypass capacitor CIN must be placed close to the VIN pin. This will reduce copper trace resistance which effects input voltage ripple of the IC. The inductor L1 should be placed close to the SW pin to reduce EMI and capacitive coupling. The output capacitor, COUT should be placed close to the junction of L1 and the diode D1. The L1, D1, and COUT trace should be as short as possible to reduce conducted and radiated noise and increase overall efficiency. The ground connection for the diode, CIN, and COUT should be as small as possible and tied to the system ground plane in only one spot (preferably at the COUT ground point) to minimize conducted noise in the system ground plane. For more detail on switching power supply layout considerations see Application Note AN1149: Layout Guidelines for Switching Power Supplies SNVA021. Application Information L1 15 PH CBOOT LM2840/1/2-ADJL 4.5V to 42V IN VIN CB SHDN SW GND FB 3.3V OUT 0.1 PF D1 MA2YD26 R1 3.4k R2 1.02k CIN 2.2 PF COUT 10 PF Figure 14. Application Circuit, 3.3V Output @ 100 mA Table 1. Some Recommended Inductors (Others May Be Used) Manufacturer Inductor Contact Information Coilcraft LPS4018, DO1608C, DO3308, and LPO2506 series www.coilcraft.com 800-3222645 MuRata LQH55D and LQH66S series www.murata.com Coiltronics MP2 and MP2A series www.cooperbussman.com Table 2. Some Recommended Input And Output Capacitors (Others May Be Used) Manufacturer Capacitor Contact Information Vishay Sprague 293D, 592D, and 595D series tantalum www.vishay.com 407-324-4140 Taiyo Yuden High capacitance MLCC ceramic www.t-yuden.com 408-573-4150 Cornell Dubilier ESRD seriec Polymer Aluminum Electrolytic SPV and AFK series V-chip series www.cde.com MuRata High capacitance MLCC ceramic www.murata.com Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM2841 LM2842 9 LM2841, LM2842 SNVS540H – MARCH 2009 – REVISED APRIL 2013 www.ti.com CBOOT LM2840/1/2-ADJL 7V to 42V IN SHDN SW GND FB 5V OUT 0.15 PF D1 MA2YD26 CB VIN L1 15 PH R1 5.62k CIN 2.2 PF R2 1.02k COUT 47 PF Figure 15. Application Circuit, 5V Output CBOOT LM2840/1/2-ADJL 15V to 42V IN VIN CB SHDN SW GND FB L1 47 PH 12V OUT 0.15 PF D1 MA2YD26 R1 14.7k R2 1k CIN 2.2 PF COUT 22 PF Figure 16. Application Circuit, 12V Output CBOOT LM2840/1/2-ADJL 18V to 42V IN VIN CB SHDN SW GND FB L1 47 PH 15V OUT 0.15 PF D1 MA2YD26 R1 28k CIN 2.2 PF R2 1.5k COUT 22 PF Figure 17. Application Circuit, 15V Output CBOOT LM2840/1/2-ADJL 4.5V to 12V IN VIN CB SHDN SW GND FB L1 10 PH 0.8V OUT 0.15 PF D1 MA2YD26 R1 30.9 CIN 2.2 PF R2 787 COUT 100 PF Figure 18. Application Circuit, 0.8V Output 10 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM2841 LM2842 LM2841, LM2842 www.ti.com SNVS540H – MARCH 2009 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision G (April 2013) to Revision H • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 10 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM2841 LM2842 11 PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) LM2840XMK-ADJL/NOPB ACTIVE SOT DDC 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM SE8B LM2840XMKX-ADJL/NOPB ACTIVE SOT DDC 6 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM SE8B LM2840XQMK/NOPB ACTIVE SOT DDC 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SE9B LM2840XQMKX/NOPB ACTIVE SOT DDC 6 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SE9B LM2840YMK-ADJL/NOPB ACTIVE SOT DDC 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM SF1B LM2840YMKX-ADJL/NOPB ACTIVE SOT DDC 6 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM SF1B LM2840YQMK/NOPB ACTIVE SOT DDC 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SF2B LM2840YQMKX/NOPB ACTIVE SOT DDC 6 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SF2B LM2841XMK-ADJL/NOPB ACTIVE SOT DDC 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 STFB LM2841XMKX-ADJL/NOPB ACTIVE SOT DDC 6 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 STFB LM2841XQMK/NOPB ACTIVE SOT DDC 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SB1B LM2841XQMKX/NOPB ACTIVE SOT DDC 6 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SB1B LM2841YMK-ADJL/NOPB ACTIVE SOT DDC 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 STTB LM2841YMKX-ADJL/NOPB ACTIVE SOT DDC 6 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 STTB LM2841YQMK/NOPB ACTIVE SOT DDC 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SB2B LM2841YQMKX/NOPB ACTIVE SOT DDC 6 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SB2B LM2842XMK-ADJL/NOPB ACTIVE SOT DDC 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 STVB Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 11-Apr-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) LM2842XMKX-ADJL/NOPB ACTIVE SOT DDC 6 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 STVB LM2842XQMK/NOPB ACTIVE SOT DDC 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SB3B LM2842XQMKX/NOPB ACTIVE SOT DDC 6 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SB3B LM2842YMK-ADJL/NOPB ACTIVE SOT DDC 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 STXB LM2842YMKX-ADJL/NOPB ACTIVE SOT DDC 6 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 STXB LM2842YQMK/NOPB ACTIVE SOT DDC 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SB4B LM2842YQMKX/NOPB ACTIVE SOT DDC 6 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SB4B (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LM2840, LM2840-Q1, LM2841, LM2841-Q1, LM2842, LM2842-Q1 : • Catalog: LM2840, LM2841, LM2842 • Automotive: LM2840-Q1, LM2841-Q1, LM2842-Q1 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device LM2840XMK-ADJL/NOPB LM2840XMKX-ADJL/NOP B Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SOT DDC 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 SOT DDC 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2840XQMK/NOPB SOT DDC 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2840XQMKX/NOPB SOT DDC 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2840YMK-ADJL/NOPB SOT DDC 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 SOT DDC 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2840YMKX-ADJL/NOP B LM2840YQMK/NOPB SOT DDC 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2840YQMKX/NOPB SOT DDC 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2841XMK-ADJL/NOPB SOT DDC 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 SOT DDC 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2841XMKX-ADJL/NOP B LM2841XQMK/NOPB SOT DDC 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2841XQMKX/NOPB SOT DDC 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2841YMK-ADJL/NOPB SOT DDC 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 SOT DDC 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 SOT DDC 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2841YMKX-ADJL/NOP B LM2841YQMK/NOPB Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM2841YQMKX/NOPB SOT DDC 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2842XMK-ADJL/NOPB SOT DDC 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 SOT DDC 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2842XQMK/NOPB SOT DDC 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2842XQMKX/NOPB SOT DDC 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2842YMK-ADJL/NOPB SOT DDC 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 SOT DDC 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2842YQMK/NOPB SOT DDC 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2842YQMKX/NOPB SOT DDC 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2842XMKX-ADJL/NOP B LM2842YMKX-ADJL/NOP B *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2840XMK-ADJL/NOPB SOT DDC 6 1000 210.0 185.0 35.0 SOT DDC 6 3000 210.0 185.0 35.0 LM2840XQMK/NOPB SOT DDC 6 1000 210.0 185.0 35.0 LM2840XQMKX/NOPB SOT DDC 6 3000 210.0 185.0 35.0 LM2840YMK-ADJL/NOPB SOT DDC 6 1000 210.0 185.0 35.0 SOT DDC 6 3000 210.0 185.0 35.0 LM2840XMKX-ADJL/NOP B LM2840YMKX-ADJL/NOP Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) B LM2840YQMK/NOPB SOT DDC 6 1000 210.0 185.0 35.0 LM2840YQMKX/NOPB SOT DDC 6 3000 210.0 185.0 35.0 LM2841XMK-ADJL/NOPB SOT DDC 6 1000 210.0 185.0 35.0 SOT DDC 6 3000 210.0 185.0 35.0 LM2841XMKX-ADJL/NOP B LM2841XQMK/NOPB SOT DDC 6 1000 210.0 185.0 35.0 LM2841XQMKX/NOPB SOT DDC 6 3000 210.0 185.0 35.0 LM2841YMK-ADJL/NOPB SOT DDC 6 1000 210.0 185.0 35.0 SOT DDC 6 3000 210.0 185.0 35.0 LM2841YMKX-ADJL/NOP B LM2841YQMK/NOPB SOT DDC 6 1000 210.0 185.0 35.0 LM2841YQMKX/NOPB SOT DDC 6 3000 210.0 185.0 35.0 LM2842XMK-ADJL/NOPB SOT DDC 6 1000 210.0 185.0 35.0 SOT DDC 6 3000 210.0 185.0 35.0 LM2842XMKX-ADJL/NOP B LM2842XQMK/NOPB SOT DDC 6 1000 210.0 185.0 35.0 LM2842XQMKX/NOPB SOT DDC 6 3000 210.0 185.0 35.0 LM2842YMK-ADJL/NOPB SOT DDC 6 1000 210.0 185.0 35.0 SOT DDC 6 3000 210.0 185.0 35.0 LM2842YQMK/NOPB SOT DDC 6 1000 210.0 185.0 35.0 LM2842YQMKX/NOPB SOT DDC 6 3000 210.0 185.0 35.0 LM2842YMKX-ADJL/NOP B Pack Materials-Page 3 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated