3.3 VOLT CMOS ASYNCHRONOUS FIFO 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9, 8,192 x 9, 16,384 x 9 IDT72V01, IDT72V02 IDT72V03, IDT72V04 IDT72V05, IDT72V06 FEATURES: DESCRIPTION: • The IDT72V01/72V02/72V03/72V04/72V05/72V06 are dual-port FIFO memories that operate at a power supply voltage (Vcc) between 3.0V and 3.6V. Their architecture, functional operation and pin assignments are identical to those of the IDT7201/7202/7203/7204/7205/7206. These devices load and empty data on a first-in/first-out basis. They use Full and Empty flags to prevent data overflow and underflow and expansion logic to allow for unlimited expansion capability in both word size and depth. The reads and writes are internally sequential through the use of ring pointers, with no address information required to load and unload data. Data is toggled in and out of the devices through the use of the Write (W) and Read (R) pins. The devices have a maximum data access time as fast as 25 ns. The devices utilize a 9-bit wide data array to allow for control and parity bits at the user’s option. This feature is especially useful in data communications applications where it is necessary to use a parity bit for transmission/reception error checking. They also feature a Retransmit (RT) capability that allows for reset of the read pointer to its initial position when RT is pulsed LOW to allow for retransmission from the beginning of data. A Half-Full Flag is available in the single device mode and width expansion modes. These FIFOs are fabricated using IDT’s high-speed CMOS technology. It has been designed for those applications requiring asynchronous and simultaneous read/writes in multiprocessing and rate buffer applications. • • • • • • • • • • • • • • • 3.3V family uses less power than the 5 Volt 7201/7202/7203/7204/ 7205/7206 family 512 x 9 organization (72V01) 1,024 x 9 organization (72V02) 2,048 x 9 organization (72V03) 4,096 X 9 organization (72V04) 8,192 x 9 organization (72V05) 16,384 X 9 organization (72V06) Functionally compatible with 720x family Low-power consumption — Active: 180 mW (max.) — Power-down: 18 mW (max.) 15 ns access time Asynchronous and simultaneous read and write Fully expandable by both word depth and/or bit width Status Flags: Empty, Half-Full, Full Auto-retransmit capability Available in 32-pin PLCC Industrial temperature range (–40°°C to +85°°C) is available FUNCTIONAL BLOCK DIAGRAM DATA INPUTS (D0-D8) W WRITE CONTROL WRITE POINTER R THREESTATE BUFFERS DATA OUTPUTS (Q0-Q8) READ CONTROL FLAG LOGIC XI RAM ARRAY 512 x 9 1,024 x 9 2,048 x 9 4,096 x 9 8,192 x 9 16,384 x 9 EF FF EXPANSION LOGIC XO/HF READ POINTER RS RESET LOGIC FL/RT 3033 drw 01 IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES MAY 2003 1 2003 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. DSC-3033/3 IDT72V01/72V02/72V03/72V04/72V05/72V06 3.3V ASYNCHRONOUS FIFO 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9, 8,192 x 9 and 16,384 x 9 ABSOLUTE MAXIMUM RATINGS D5 VCC D4 D8 D3 W NC PIN CONFIGURATION INDEX 4 3 2 1 32 31 30 D2 D1 D0 XI FF 5 6 29 28 D6 D7 7 8 27 26 25 NC FL/RT RS Q0 10 EF Q1 NC 11 12 Q2 13 24 23 22 21 9 Rating Terminal Voltage with Respect to GND Com'l & Ind'l –0.5 to +7.0 Unit V TSTG IOUT Storage Temperature DC Output Current –55 to +125 –50 to +50 °C mA RECOMMENDED DC OPERATING CONDITIONS XO/HF Q7 Symbol VCC GND VIH(1) VIL(2) Q6 Q4 Q5 NC R Q8 GND Symbol VTERM NOTE: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 14 15 16 17 18 19 20 Q3 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES 3033 drw 02b Rating Supply Voltage Supply Voltage Input High Voltage Input Low Voltage Min. 3.0 0 2.0 — TA Operating Temperature Commercial TA Operating Temperature Industrial Typ. Max. 3.3 3.6 0 0 — VCC+0.5 — 0.8 0 — 70 –40 — 85 Unit V V V V °C °C NOTES: 1. For RT/RS/XI input, VIH = 2.6V (commercial). For RT/RS/XI input, VIH = 2.8V (military). 2. 1.5V undershoots are allowed for 10ns once per cycle. PLCC (J32-1, order code: J) TOP VIEW DC ELECTRICAL CHARACTERISTICS (Commercial: VCC = 3.3V ± 0.3V, TA = 0°C to +70°C; Industrial: VCC = 3.3V ± 0.3V, TA = –40°C to +85°C) IDT72V01 IDT72V02 IDT72V03 IDT72V04 Commercial & Industrial(1) tA = 15, 25, 35 ns Symbol ILI(2) ILO(3) VOH VOL ICC1(4,5) ICC2(4,6) Parameter Input Leakage Current (Any Input) Output Leakage Current Output Logic “1” Voltage IOH = –2mA Output Logic “0” Voltage IOL = 8mA Active Power Supply Current Standby Current (R=W=RS=FL/RT=VIH) Min. –1 –10 2.4 — — — Max. 1 10 — 0.4 60 5 IDT72V05 IDT72V06 Commercial & Industrial(1) tA = 15, 25, 35 ns Min. –1 –10 2.4 — — — Max. 1 10 — 0.4 75 5 NOTES: 1. Industrial temperature range product for the 25ns speed grade is available as a standard device. All other speed grades are available by special order. 2. Measurements with 0.4 ≤ VIN ≤ VCC. 3. R ≥ VIH, 0.4 ≤ VOUT ≤ VCC. 4. Tested with outputs open (IOUT = 0). 5. Tested at f = 20 MHz. 6. All Inputs = VCC - 0.2V or GND + 0.2V. CAPACITANCE (TA = +25°C, f = 1.0 MHz) Symbol CIN C OUT Parameter(1) Input Capacitance Output Capacitance Condition VIN = 0V VOUT = 0V Max. 8 8 Unit pF pF NOTE: 1. Characterized values, not currently tested. 2 Unit µA µA V V mA mA COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES IDT72V01/72V02/72V03/72V04/72V05/72V06 3.3V ASYNCHRONOUS FIFO 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9, 8,192 x 9 and 16,384 x 9 AC ELECTRICAL CHARACTERISTICS(1) (Commercial: VCC = 3.3V ± 0.3V, TA = 0°C to +70°C; Industrial: VCC = 3.3V ± 0.3V, TA = –40°C to +85°C) Symbol fS tRC tA tRR tRPW tRLZ tWLZ tDV tRHZ tWC tWPW tWR tDS tDH tRSC tRS tRSS tRSR tRTC tRT tRTS tRTR tEFL tHFH,FFH tRTF tREF tRFF tRPE tWEF tWFF tWHF tRHF tWPF tXOL tXOH tXI tXIR tXIS Parameter Shift Frequency Read Cycle Time Access Time Read Recovery Time Read Pulse Width(3) Read Pulse Low to Data Bus at Low Z(4) Write Pulse High to Data Bus at Low Z(4,5) Data Valid from Read Pulse High Read Pulse High to Data Bus at High Z(4) Write Cycle Time Write Pulse Width(3) Write Recovery Time Data Setup Time Data Hold Time Reset Cycle Time Reset Pulse Width(3) Reset Setup Time(4) Reset Recovery Time Retransmit Cycle Time Retransmit Pulse Width(3) Retransmit Setup Time(4) Retransmit Recovery Time Reset to Empty Flag Low Reset to Half-Full and Full Flag High Retransmit Low to Flags Valid Read Low to Empty Flag Low Read High to Full Flag High Read Pulse Width after EF High Write High to Empty Flag High Write Low to Full Flag Low Write Low to Half-Full Flag Low Read High to Half-Full Flag High Write Pulse Width after FF High Read/Write to XO Low Read/Write to XO High XI Pulse Width(3) XI Recovery Time XI Setup Time Commercial IDT72V01L15 IDT72V02L15 IDT72V03L15 IDT72V04L15 IDT72V05L15 IDT72V06L15 Min. Max. — 40 25 — — 15 10 — 15 — 3 — 5 — 5 — — 15 25 — 15 — 10 — 11 — 0 — 25 — 15 — 15 — 10 — 25 — 15 — 15 — 10 — — 25 — 25 — 25 — 15 — 15 15 — — 15 — 15 — 25 — 25 15 — — 15 — 15 15 — 10 — 10 — NOTES: 1. Timings referenced as in AC Test Conditions. 2. Industrial temperature range product for the 25ns speed grade is available as a standard device. All other speed grades are available by special order. 3. Pulse widths less than minimum value are not allowed. 4. Values guaranteed by design, not currently tested. 5. Only applies to read data flow-through mode. AC TEST CONDITIONS Input Pulse Levels Input Rise/Fall Times Input Timing Reference Levels Output Reference Levels Output Load Com'l and Ind'l(2) IDT72V01L25 IDT72V02L25 IDT72V03L25 IDT72V04L25 IDT72V05L25 IDT72V06L25 Min. Max. — 28.5 35 — — 25 10 — 25 — 3 — 5 — 5 — — 18 35 — 25 — 10 — 15 — 0 — 35 — 25 — 25 — 10 — 35 — 25 — 25 — 10 — — 35 — 35 — 35 — 25 — 25 25 — — 25 — 25 — 35 — 35 25 — — 25 — 25 25 — 10 — 10 — Commercial IDT72V01L35 IDT72V02L35 IDT72V03L35 IDT72V04L35 IDT72V05L35 IDT72V06L35 Min. Max. — 22.2 45 — — 35 10 — 35 — 3 — 5 — 5 — — 20 45 — 35 — 10 — 18 — 0 — 45 — 35 — 35 — 10 — 45 — 35 — 35 — 10 — — 45 — 45 — 45 — 30 — 30 35 — — 30 — 30 — 45 — 45 35 — — 35 — 35 35 — 10 — 10 — 3.3V 330Ω D.U.T. 510Ω GND to 3.0V 5ns 1.5V 1.5V See Figure 1 30pF* 3033 drw 03 or equivalent circuit Figure 1. Output Load * Includes scope and jig capacitances. 3 Unit MHz ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns IDT72V01/72V02/72V03/72V04/72V05/72V06 3.3V ASYNCHRONOUS FIFO 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9, 8,192 x 9 and 16,384 x 9 SIGNAL DESCRIPTIONS COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES FIRST LOAD/RETRANSMIT (FL/RT) This is a dual-purpose input. In the Depth Expansion Mode, this pin is grounded to indicate that it is the first loaded (see Operating Modes). In the Single Device Mode, this pin acts as the retransmit input. The Single Device Mode is initiated by grounding the Expansion In (XI). These FIFOs can be made to retransmit data when the Retransmit Enable control (RT) input is pulsed LOW. A retransmit operation will set the internal read pointer to the first location and will not affect the write pointer. Read Enable (R) and Write Enable (W) must be in the HIGH state during retransmit. This feature is useful when less than 512/1,024/2,048/4,096/8,192/16,384 writes are performed between resets. The retransmit feature is not compatible with the Depth Expansion Mode and will affect the Half-Full Flag (HF), depending on the relative locations of the read and write pointers. INPUTS: DATA IN (D0 – D8) Data inputs for 9-bit wide data. CONTROLS: RESET (RS) Reset is accomplished whenever the Reset (RS) input is taken to a LOW state. During reset, both internal read and write pointers are set to the first location. A reset is required after power up before a write operation can take place. Both the Read Enable (R) and Write Enable (W) inputs must be in the HIGH state during the window shown in Figure 2, (i.e., tRSS before the rising edge of RS ) and should not change until tRSR after the rising edge of RS. Half-Full Flag (HF) will be reset to HIGH after Reset (RS). EXPANSION IN (XI) This input is a dual-purpose pin. Expansion In (XI) is grounded to indicate an operation in the single device mode. Expansion In (XI) is connected to Expansion Out (XO) of the previous device in the Depth Expansion or Daisy Chain Mode. WRITE ENABLE (W) A write cycle is initiated on the falling edge of this input if the Full Flag (FF) is not set. Data setup and hold times must be adhered to with respect to the rising edge of the Write Enable (W). Data is stored in the RAM array sequentially and independently of any ongoing read operation. After half of the memory is filled and at the falling edge of the next write operation, the Half-Full Flag (HF) will be set to LOW and will remain set until the difference between the write pointer and read pointer is less than or equal to one half of the total memory of the device. The Half-Full Flag (HF) is then reset by the rising edge of the read operation. To prevent data overflow, the Full Flag (FF) will go LOW, inhibiting further write operations. Upon the completion of a valid read operation, the Full Flag (FF) will go HIGH after tRFF, allowing a valid write to begin. When the FIFO is full, the internal write pointer is blocked from W, so external changes in W will not affect the FIFO when it is full. OUTPUTS: FULL FLAG (FF) The Full Flag (FF) will go LOW, inhibiting further write operation, when the write pointer is one location less than the read pointer, indicating that the device is full. If the read pointer is not moved after Reset (RS), the Full-Flag (FF) will go LOW after 512/1,024/2,048/4,096/8,192/16,384 writes to the IDT72V01/ 72V02/72V03/72V04/72V05/72V06. EMPTY FLAG (EF) The Empty Flag (EF) will go LOW, inhibiting further read operations, when the read pointer is equal to the write pointer, indicating that the device is empty. EXPANSION OUT/HALF-FULL FLAG (XO/HF) This is a dual-purpose output. In the single device mode, when Expansion In (XI) is grounded, this output acts as an indication of a half-full memory. After half of the memory is filled and at the falling edge of the next write operation, the Half-Full Flag (HF) will be set LOW and will remain set until the difference between the write pointer and read pointer is less than or equal to one half of the total memory of the device. The Half-Full Flag (HF) is then reset by using rising edge of the read operation. In the Depth Expansion Mode, Expansion In (XI) is connected to Expansion Out (XO) of the previous device. This output acts as a signal to the next device in the Daisy Chain by providing a pulse to the next device when the previous device reaches the last location of memory. READ ENABLE (R) A read cycle is initiated on the falling edge of the Read Enable (R) provided the Empty Flag (EF) is not set. The data is accessed on a First-In/First-Out basis, independent of any ongoing write operations. After Read Enable (R) goes HIGH, the Data Outputs (Q0 – Q8) will return to a high impedance condition until the next Read operation. When all data has been read from the FIFO, the Empty Flag (EF) will go LOW, allowing the “final” read cycle but inhibiting further read operations with the data outputs remaining in a high impedance state. Once a valid write operation has been accomplished, the Empty Flag (EF) will go HIGH after tWEF and a valid Read can then begin. When the FIFO is empty, the internal read pointer is blocked from R so external changes in R will not affect the FIFO when it is empty. DATA OUTPUTS (Q0 – Q8) Data outputs for 9-bit wide data. This data is in a high impedance condition whenever Read (R) is in a HIGH state. 4 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES IDT72V01/72V02/72V03/72V04/72V05/72V06 3.3V ASYNCHRONOUS FIFO 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9, 8,192 x 9 and 16,384 x 9 tRSC tRS RS tRSR tRSS W tRSS R tEFL EF tHFH, tFFH HF, FF 3033 drw 04 NOTES: 1. EF, FF, HF may change status during Reset, but flags will be valid at tRSC. 2. W and R = VIH around the rising edge of RS. Figure 2. Reset tRC tRPW tRR tA tA R tDV tRLZ Q0-Q8 tRHZ DATA OUT VALID tWC tWPW DATA OUT VALID tWR W tDS D0-D8 tDH DATA IN VALID DATA IN VALID 3033 drw 05 Figure 3. Asynchronous Write and Read Operation LAST WRITE IGNORED WRITE FIRST READ ADDITIONAL READS FIRST WRITE R W tWFF t RFF FF 3033 drw 06 Figure 4. Full Flag From Last Write to First Read 5 IDT72V01/72V02/72V03/72V04/72V05/72V06 3.3V ASYNCHRONOUS FIFO 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9, 8,192 x 9 and 16,384 x 9 LAST READ IGNORED READ FIRST WRITE ADDITIONAL WRITES COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES FIRST READ W R t WEF t REF EF tA DATA OUT VALID VALID 3033 drw 07 Figure 5. Empty Flag From Last Read to First Write t RTC tRT RT t RTS tRTR W,R t RTF HF, EF, FF FLAG VALID 3033 drw 08 Figure 6. Retransmit W tWEF EF tRPE R 3033 drw 09 Figure 7. Minimum Timing for an Empty Flag Coincident Read Pulse R t RFF FF t WPF W 3033 drw 10 Figure 8. Minimum Timing for a Full Flag Coincident Write Pulse 6 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES IDT72V01/72V02/72V03/72V04/72V05/72V06 3.3V ASYNCHRONOUS FIFO 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9, 8,192 x 9 and 16,384 x 9 W tRHF R tWHF HF HALF-FULL OR LESS HALF-FULL OR LESS MORE THAN HALF-FULL 3033 drw 11 Figure 9. Half-Full Flag Timing WRITE TO LAST PHYSICAL LOCATION W READ FROM LAST PHYSICAL LOCATION R t XOH t XOL t XOL t XOH 3033 drw 12 XO Figure 10. Expansion Out t XI t XIR XI t XIS W WRITE TO FIRST PHYSICAL LOCATION t XIS READ FROM FIRST PHYSICAL LOCATION R Figure 11. Expansion In 7 3033 drw 13 IDT72V01/72V02/72V03/72V04/72V05/72V06 3.3V ASYNCHRONOUS FIFO 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9, 8,192 x 9 and 16,384 x 9 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES OPERATING MODES: USAGE MODES: Care must be taken to assure that the appropriate flag is monitored by each system (i.e. FF is monitored on the device where W is used; EF is monitored on the device where R is used). For additional information, refer to Tech Note 8: Operating FIFOs on Full and Empty Boundary Conditions and Tech Note 6: Designing with FIFOs. WIDTH EXPANSION Word width may be increased simply by connecting the corresponding input control signals of multiple devices. Status flags (EF, FF and HF) can be detected from any one device. Figure 13 demonstrates an 18-bit word width by using two IDT72V01/72V02/72V03/72V04/72V05/72V06s. Any word width can be attained by adding additional IDT72V01/72V02/72V03/72V04/72V05/72V06s (Figure 13). SINGLE DEVICE MODE A single IDT72V01/72V02/72V03/72V04/72V05/72V06 may be used when the application requirements are for 512/1,024/2,048/4,096/8,192/ 16,384 words or less. These devices are in a Single Device Configuration when the Expansion In ( XI ) control input is grounded (see Figure 12). These FIFOs can easily be adapted to applications when the requirements are for greater than 512/1,024/2,048/4,096/8,192/16,384 words. Figure 14 demonstrates Depth Expansion using three IDT72V01/72V02/72V03/72V04/ 72V05/72V06s. Any depth can be attained by adding additional IDT72V01/ 72V02/72V03/72V04/72V05/72V06s. These devices operate in the Depth Expansion mode when the following conditions are met: BIDIRECTIONAL OPERATION Applications which require data buffering between two systems (each system capable of Read and Write operations) can be achieved by pairing IDT72V01/72V02/72V03/72V04/72V05/72V06s as shown in Figure 16. Both Depth Expansion and Width Expansion may be used in this mode. DATA FLOW-THROUGH Two types of flow-through modes are permitted, a read flow-through and write flow-through mode. For the read flow-through mode (Figure 17), the FIFO permits a reading of a single word after writing one word of data into an empty FIFO. The data is enabled on the bus in (tWEF + tA) ns after the rising edge of W, called the first write edge, and it remains on the bus until the R line is raised from LOW-to-HIGH, after which the bus would go into a three-state mode after tRHZ ns. The EF line would have a pulse showing temporary deassertion and then would be asserted. In the write flow-through mode (Figure 18), the FIFO permits the writing of a single word of data immediately after reading one word of data from a full FIFO. The R line causes the FF to be deasserted but the W line being LOW causes it to be asserted again in anticipation of a new data word. On the rising edge of W, the new word is loaded in the FIFO. The W line must be toggled when FF is not asserted to write new data in the FIFO and to increment the write pointer. 1. The first device must be designated by grounding the First Load ( FL) control input. 2. All other devices must have FL in the HIGH state. 3. The Expansion Out ( XO) pin of each device must be tied to the Expansion In ( XI ) pin of the next device. See Figure 14. 4. External logic is needed to generate a composite Full Flag ( FF) and Empty Flag ( EF ). This requires the ORing of all EFs and ORing of all FFs (i.e. all must be set to generate the correct composite FF or EF). See Figure 14. 5. The Retransmit ( RT ) function and Half-Full Flag ( HF ) are not available in the Depth Expansion Mode. For additional information, refer to Tech Note 9: Cascading FIFOs or FIFO Modules. 8 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES IDT72V01/72V02/72V03/72V04/72V05/72V06 3.3V ASYNCHRONOUS FIFO 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9, 8,192 x 9 and 16,384 x 9 (HALF-FULL FLAG) (HF) WRITE (W) IDT 72V01 72V02 72V03 72V04 72V05 72V06 9 DATA IN (D) FULL FLAG (FF) RESET (RS) READ (R) 9 DATA OUT (Q) EMPTY FLAG (EF) RETRANSMIT (RT) 3033 drw 14 EXPANSION IN (XI) Figure 12. Block Diagram of Single 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9, 8,192 x 9 and 16,384 x 9 FIFO HF HF 18 9 9 DATA IN (D) IDT 72V01 72V02 72V03 72V04 72V05 72V06 WRITE (W) FULL FLAG (FF) RESET (RS) IDT 72V01 72V02 72V03 72V04 72V05 72V06 9 XI READ (R) EMPTY FLAG (EF) RETRANSMIT (RT) 9 XI 18 DATA OUT(Q) 3033 drw 15 Figure 13. Block Diagram of 512 x 18, 1,024 x 18, 2,048 x 18, 4,096 x 18, 8,192 x 18 and 16,384 x 18 FIFO Memory Used in Width Expansion Mode TABLE 1 — RESET AND RETRANSMIT Single Device Configuration/Width Expansion Mode Reset Retransmit RS 0 1 Inputs RT X 0 XI 0 0 Read Pointer Location Zero Location Zero Read/Write 1 1 0 Increment(1) Mode NOTE: 1. Pointer will increment if flag is HIGH 9 Internal Status Write Pointer Location Zero Unchanged Increment(1) EF 0 X X Outputs FF 1 X X HF 1 X X IDT72V01/72V02/72V03/72V04/72V05/72V06 3.3V ASYNCHRONOUS FIFO 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9, 8,192 x 9 and 16,384 x 9 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES TABLE 2 — RESET AND FIRST LOAD TRUTH TABLE Depth Expansion/Compound Expansion Mode Mode Reset First Device Reset All Other Devices Read/Write RS 0 0 Inputs FL 0 1 XI (1) (1) 1 X (1) Read Pointer Location Zero Location Zero Internal Status Write Pointer Location Zero Location Zero X X Outputs EF 0 0 FF 1 1 X X NOTE: 1. XI is connected to XO of previous device. See Figure 14. RS = Reset Input, FL/RT = First Load/Retransmit, EF = Empty Flag Output, FF = Full Flag Output, XI = Expansion Input, HF = Half-Full Flag Output XO W D FF 9 9 IDT 72V01 72V02 72V03 72V04 72V05 72V06 R EF 9 FL Q VCC XI XO FF FULL 9 IDT 72V01 72V02 72V03 72V04 72V05 72V06 EF EMPTY FL XI XO FF 9 RS IDT 72V01 72V02 72V03 72V04 72V05 72V06 EF FL XI Figure 14. Block Diagram of 1,536 x 9, 3,072 x 9, 6,144 x 9, 12,288 x 9, 24,576 x 9 and 49,152 x 9 FIFO Memory (Depth Expansion) Q0-Q8 R, W, RS Q9-Q17 IDT 72V01/72V02/72V03/ 72V04/72V05/72V06 DEPTH EXPANSION BLOCK IDT 72V01/72V02/72V03/ 72V04/72V05/72V06 DEPTH EXPANSION BLOCK D0-D8 D9-D17 Q(N-8)-QN IDT 72V01/72V02/72V03/ 72V04/72V05/72V06 DEPTH EXPANSION BLOCK D(N-8)-DN D0-DN 3033 drw 17 NOTES: 1. For depth expansion block see section on Depth Expansion and Figure 14. 2. For Flag detection see section on Width Expansion and Figure 13. Figure 15. Compound FIFO Expansion 10 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES IDT72V01/72V02/72V03/72V04/72V05/72V06 3.3V ASYNCHRONOUS FIFO 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9, 8,192 x 9 and 16,384 x 9 WA FFA IDT 72V01 72V02 IDT 72V03 7201A 72V04 72V05 72V06 DA 0-8 RB EFB HFB QB 0-8 SYSTEM A SYSTEM B QA 0-8 RA HFA EFA IDT 72V01 72V02 72V03 72V04 72V05 72V06 DB 0-8 WB FFB 3033 drw 18 Figure 16. Bidirectional FIFO Mode DATA IN W t RPE R EF t WLZ t WEF tA t REF DATA OUT DATA OUT VALID 3033 drw 19 Figure 17. Read Data Flow-Through Mode R tWPF W tRFF FF tDH tWFF DATA DATA IN tA DATA OUT IN VALID t DS DATA OUT VALID 3033 drw 20 Figure 18. Write Data Flow-Through Mode 11 ORDERING INFORMATION IDT XXXXX L XXX X X Device Type Power Speed Package Process/ Temperature Range Blank I(1) Commercial (0°C to +70°C) Industrial (-40°C to +85°C) J Plastic Leaded Chip Carrier (PLCC, J32-1) 15 25 35 Commercial Only Com’l and Ind’l Commercial Only L Low Power 72V01 72V02 72V03 72V04 72V05 72V06 512 x 9 FIFO 1,024 x 9 FIFO 2,048 x 9 FIFO 4,096 x 9 FIFO 8,192 x 9 FIFO 16,384 x 9 FIFO Access Time (tA) Speed in Nanoseconds 3033 drw 21 NOTE: 1. Industrial temperature range product for the 25ns speed grade is available as a standard device. All other speed grades are available by special order. DATASHEET DOCUMENT HISTORY 08/29/2001 04/08/2003 05/05/2003 pg. 3. pg. 2. pg. 2. CORPORATE HEADQUARTERS 2975 Stender Way Santa Clara, CA 95054 for SALES: 800-345-7015 or 408-727-6116 fax: 408-492-8674 www.idt.com 12 for Tech Support: 408-330-1753 email:[email protected]