PREPARED BY:
DATE:
/?7’
ZJ-dtx /t6
T. cleda
ELECTRONIC COMPONENTS GROUP
SHARP CORPORATION
s PEC~CATION
DEVICE SPECIFICATION
1
Opto-Electronic Devices Division
FOR
Light Emitting Diode
MODEL No.
I
1
GL6ZJ27
I
1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp”).
Please do not reproduce or cause anyone to reproduce them without Sharps consent.
2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined
in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility
for any damage resulting from use of the product which does not comply with the absolute maximum ratings
and the instructions included in these specification sheets, and the precautions mentioned below.
(Precautions)
(1) This products is designed for use in the following application areas;
* OA equipment * Audio visual equipment * Home appliance
* Telecommunication equipment (Terminal)
* Measuring equipment
*
Computers
*
Tooling
machines
L
If the use of the product in the above application areas is for equipment listed in paragraphs
(2) or (3), please be sure to observe the precautions given in those respective paragraphs.
1
(2) Appropriate measures, such as fail-safe design and redundant design considering
the safety design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment which demands high reliability and
safety in function and precision, such as ;
* Transportation control and safety equipment (aircraft, train, automobile etc.)
* Rescue and security equipment
* Traffic signals * Gas leakage sensor breakers
*
Other
safety
equipment
c
(3) Please do not use this product for equipment which require extremely high reliability
and safety in function and precision, such as ;
* Space equipment * Telecommunication equipment (for trunk lines)
C * Nuclear power control equipment * Medical equipment
(4) Please contact and consult with a Sharp sales representative if there are any questions
regarding interpretation of the above three paragraphs.
1
1
3. Please contact and consult with a Sharp sales representative for any questions about this product.
CUSTOMER’S
DATE:
BY:
APPROVAL.
DATE:
PRESENTED BY:
MKatoh,
Department General Manager of
Engineering Dept.,IH
Ooto-Electronic Devices Division
Eiectronic Components Group
SHARP CORPORATION
DG996048
Jun/16/99
PAGE
MODEL No.
GL6Zl27
GL6ZT27 Snecification
1. Application
This specificationappliesto the light emitting diode deviceModel No. GL6ZJ27.
[AlGalnP (dicing or scribe/braketype) Grange LED device]
2. Outline dimensionsandpin connections. . . . . . . . . . . . . . . . . . . . . . .. . . . .Refer to the attachedsheetPage2.
3. Ratingsandcharacteristics. . . . . . . . . . . . . . . . . . . . . ..*................
3-1. Absolute maximumratings
3-2. Electra-opticalcharacteristics
3-3. DeratingCurve
3-4. CharacteristicsDiagram
Refer to the attachedsheetPage3-4.
4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*............
4- 1. Test itemsand testconditions
4-2. MeasurementitemsandFailure judgement criteria
Refer to the attachedsheetPage5.
Refer to the attachedsheetPage6.
5. Incoming inspection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*.........
5-1. Applied standard
5-2. Samplingmethodand level
5-3. Test items,judgementcriteria and classificaof defect
54. Test itemsthe surfaceis be applied for flat type, judgementcriteria andclassificaof defect
6. Supplement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*...............
6-l. Packing
6-2. Luminousintensity rank
6-3. Dominantwavelengthrank
6-4. Environnient
Refer to the attachedsheetPage7-8.
7. Precautionsfor use. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage9- 10.
7- 1. Lead forming method
7-2. Notice of installation
7-3. SolderingConditions
.7-4. For cleaning
l/10
_
IX996048
Jun/16/99
PAGE
MODEL No.
2 ~the
dimensions and pin
COMeCtionS
Colorless
transparency
I
2. 54
OM
i
Pin coMections
0. Anode
0. cathode
iote) Unspecified tol. to be +0&m
rote) Cold rolled steel leads are plated with but the tie-bar cut portions have no plating do not solder this part of the product.
unit
mm
Material
Lead : (Fe) Cold rolled steel
Package : Epoxy resin
Fiih
Lead : Sn plated or wave soldering
Drawing No.
51106029
Junl16l99
PAGE
DG996048
MODEL No.
GL6ZJ27
3110
3. Ratings and characteristics \
(Note 1) Duty ratb=l/lO,Pulse tidth=O. lms
(Note 2) At the position of 1.6mm from the bottom resin package
(Note 3) Refer to the suplement item 6. regarding the standard of rank classification.
3-3. Derating Curve
Peak
Forward
Current
Derating
Forward
Curve
Current
Derating
Curve
120
5
e
100
01
-25
0
Ambient
25
50
Temperature
1585100
Ta?C)
125
-25
I
I
I
0
25
50
Ambient
Temperature
795I
I
1
100
125
Ta("C)
DG996048
MODEL
.Jun/16/99
PAGE
No.
GL6ZJ27
Peak
Forward
vs. Duty Ratio
(Ta=25%)
Current
l/100
1
l/10
Duty
3-4. Characteristics
Current
10
DR
Raito
Diagram(typ)
Forward
4110
(Note 11
Relative
Luminous
intensity
vs. Ambient
Temperature
Voltage
vs.Forward
(Ta=25”C)
( I F=2OmA)
1000
.-s
t
E
2o-
100
.f E
5
2
.-e
?fl
z
J
O.l"!"'Ir""""'
1
1.2
1.4
1.6
Forward
Relative
Luminous
1.8
2
Voltage
Intensity
vs.
2.2
2.4
Ambient
VFW)
Froward
Voltage
(Ta=25"C)
1000
.-::
2
2
100
10
2
Oh
.E E
5
-J
2
.-+
2
d
1
0. 1
0.01
0. 1
Forward
(Note
l)Above
10
1
Current
characteristicdataaretypicaldata
10
-60 -40 -20
2.6
100
IFW)
andnotagumtteeddata.
0
20 40 60 80 100 120
Temprature
Ta(OC)-
DG996048
Jun/16/99
MODEL No.
PAGE
GL6ZJ27
5/10
4. Reliability
The reliability of productsshallbe satisfiedwith itemslisted below.
t-1. Test itemsandtestconditions
Test items
Solderability
Confidencelevel: 904
Samples(n)
LTPD
Defective (Cl
(%)
Test conditions
23Or+5'=C. 5s
n=ll. C=O
20
n=ll, C=O
20
n=ll, C=O
20
n=ll, c=O
20
Weight:lON. Ss/each terminal
n=ll, C=O
20
Weight:SN, 0” -90”
/each terminai
n=ll, C=O
20
n=22, C=O
10
n=22, C=O
10
tigh temperaturestorageTa=lOO”c, t=lOOOh
n=22,c=-O
10
ow temperaturestorageTa=-40=, t=lOOOh
n=22, C=O
10
n=22, C=O
10
Soldering
temperature
Mechanicalshock
Variabie frequency
vibration
Terminalstrength
(Tension)
Terminal strength
(Bending)
Prior disposition: Dip in rosin flux
26025°C.
5s
15 OOOm/s*,
0.5ms,
3tirnes/ S,fY,iZ
direction
2Olh/s*, 100 to 2 000 to lOOH&weep for 4min.
,4times/&iY ,Ez direction
-+ OQ -90” -+ 0”
Temperaturecycling
-40~(3Omin)~+l~“c(3~in),30
High temp*andhigh
humidity storage
Ta=+60”C, 9O%RH,t=lOOOh
Operationlife
cycles
Ta=25”C, IrMAX, t=lOOOh*3
4-2. MeasurementitemsandFailurejudgementcriteria * 1
Measurement
QIllbOl
Failurejudgementcriteria *2
Forward voltage
vF
v,>u.s.L.x
1.2
Reversecurrent
IR
I,>u.s.L.x
2.0
J.mninousintensity
IV
Iv > The first stagevalueX 2.0 or The first stagevalue X 0.5 > Iv
s Solderability : Sol&r shallbe adhereat the areaof 95% or moreof dippedportion.
Z Terminal strength: Packageis not destroyed,and terminal is not slack.
*l: Measuringcondition is in accordancewith specification.
*2: U.S.L. is shownby Upper Specification Limit.
*3: lr MAX.is shownby forward current of absolutemaximumratings.
DG996048
MODEL
I Jun/16/9!
No.
I
1 PAGE
GL62J27
5. Incoming inspection
5-l. Applied standard : IS0 2859-l
5-2. Sampling method and level : A single sampling phn,normal inspection level II
: AQL Major defect : 0.065%
Minor defect : 0.4%
classifica of defer
Exceed 9 0.3mm or O.lmm x 1.
9
Void
Exceed @0.3mm (on top view)
10
Uneven density of
material for scattering
Extremely uneven density
11
Unbalanced center
Exceed M.25mm from package center
12
BUlT
Exceed +0.2mm againstprovided dimension
13
Insertion position of
terminal
Insertion position of terminal
5-4. Test items the surface is be applied for flat type, judgement criteria and classifica of defect
No.
Test items
judgement criteria
classifica of defect
14
Chapped the surface
The surface chapped is striking for see the lamp top
Minor defect
15
Hollow the surface
The surface hollow is striking for see the lamp top
6110
.Tunll61W
DG996048
MODEL
No.
I
GL6Z27
PAGE
I
7110
6. Supplement
6-l. Packing
6-l-l. Inner package
Put 25Opcsthe sameluminousintensity rank productsinto pack andput following labelby pack.
Product weight: 0.28g (One Prodwt,Typ.)
(Indication labelsample)
SHIPMENTTABLE
PART No.
GL6ZJ27
+ Mcdel number
*cl
cl
00000
250
- Quantity of products
QUANXTY
KA99B19
* Lot number*
LOT No.
-5-G
0
0
0
O-0 t-
Luminous
SHARP’
AfADE IN JAPAN
0
@
@
@
@
intensity rank
dominantwavelengthrank
+
Production
country
Productionplantccxie(to be indicatedalphabetically)
Support code
Year of prcduction(thelast two figures of the year)
Month of production
(to be indicatedalphabeticallywith Januarycorrespondingto A)
Date of production(Ol-31)
6-l-2. Outer package
Put 8 packs (the sameluminousintensity rank) into outer package.
(approximately670gper one outer package)
6-l-3. Outer packageout line dimension
Width: 14Omm.Depth: 225mm. Hight: 90mm
(Note 1) Tolerance:flS%
In regardto luminousintensity , the following ranking shallbe carriedout.
However the quantity of eachrank shallnot be pre scribed.
In caseof the distributionof the luminousintensity shift to high, at that
point new upperrank is prescribedand lower rank is delete.
6-3.Dominantwavelengthrank (Note 2)
Dominantwavelength
Rank
617.0
T
613.5
U
616.0
619.5
622.0
V
618.5
W
624.5
621.0
627.0
X
623.5
-
Unit
(Ta=25”C)
Condition
nm
IF2OmA
(Note 2) The conditionof measurement: The measurementof the light emissionfrom the front sideof lamp.
This rank value is the settingvalue of when that classifiesit the rank andbe not a guaranteevalue.
Also I shallnot ask the delivery ratio of eachrank.
.
DO996048
MODELNo.
I
GL6ZJ27
64. Environment
6-4-l. ozOnosphere destructive chemicals.
(1) The &vice doesn’t contain following substance.
(2) The &vice doesn’t have a production line whose processnquires following substance.
Restricted part: CFCsJlalones,CCb,Trichloroethane(Methych)
I
642. Bromic non-burning materials
The &vice doesn’t contain bromic non-burning materials(PBBOs,PBBs)
Junl16/99
PAGE
1 8/10
DG996048
MODEL
I Jud16/99
No.
( PAGE
GL6ZJ27
7. Precautions
g/10
for use
7 - 1. Lead forming method
Avoid forming a lead pin with the lead pin base as
a fulcrum:be sure to hold a lead pin firmly when
forming. Lead pins should be forsed before soldering.
7 - 2. Notice of installation
7-2-l installation on a P W B
Vhen mounting an LED lamp on a PW.do not apply
physical stress to the lead pins.
*The lead pin pitch should match the PllB pin-hole
pitch:absolutely avoid widening or narrowing
the lead pins.
Bhen positioning an LED lamp,basically employ
an LEDwith tie-bar cut or use a spacer.
7-2-2 !Yhenan LED 1 is mounted directly on a P WB
If the bottom face of an LED lamp is mounted
directly on single-sided PVE$the base of the
lead pins may be subjected to physical stress
due to PWBwarp,cutting or clinching of lead
pins. Prior to’ use, be sure to check that no
disconnection inside of the resin or damageto
resin etc.,is found.Yhen an LED lamp is mounted
on a double-sided PTBthe heat during soldering
affects the resin;therefore,keep
the LED lamp
more that 1.6mmafloat above the PWB.
7-2-3 Installation using a holder
During an LED lamp positioning,when a holder is
used,a holder should be designed not to subject
lead pins to any undue stress.
(Note)Pay attention to the thermal expansion coefficient
of the material used for the holder.Since the
holder expands and contracts due to preheat and
soldering heat, mechanical stress may be applied to
the lead pins, resulting in disconnection.
7-2-4 Installation to the case
Do not fix part C with adhesives when fixed to the
case as shown in Figure.A hole of the case should
be designed not to subject the ins ide of resin
to any undue stress.
- y)&+FJJp-
d~cn
c
formint
NG
l
Good
0
I
!. 6mm
c
I
Do48
MODELNo.
GL6ZJ27
7 - 3. S oldering Conditions
Solder the lead pins under the following conditions
Conditions
Type of Soldering
295°C*S”c. within 3 seconds
1. Manual soldering
260°Ck 5°C. within 5 seconds
2. Wave soldering
Preheating 70°C to 8OC, within 30 seconds
3. Auto soldering
S oldering 245°Cf YC, within 5 seconds
(Note) Avoid dinning resin into soldering bath.
Avoid applying stress to lead pins while they are heated-For example ,
when the LEDlamp is moved with the heat applied to the lead pins during
manual soldering or solder repair,disconnection mayoccur.
i ton
7 - 4. For cleaning
( 1)
Solvent cleaning : Solvent temperature 45°C or less
Immersion for 3 min or less
(2 > Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs
by cleaning bath size,ultrasonic power
output,cleaning time,Pm size or device mounting
condition etc. Please test it in actual using condition
and confirm that doesn’t occur any defect before starting
the ultrasonic cleaning.
( 3 > Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol
In case when the other solvent -is used, there are cases that
the packaging resin is eroded. Please use the other solvent
after thorough confirmation is performed in actual using condition.
JunhY99
PAGE
lo/lo