Material Content Data Sheet Sales Product Name TLE4208G Issued MA# MA001102832 Package PG-DSO-28-41 16. June 2015 Weight* 834.61 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper copper carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 11.786 1.41 0.073 0.01 0.292 0.04 350 5.837 0.70 6994 237.007 28.40 29.15 283974 291405 0.406 0.05 0.05 487 487 1.136 0.14 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.41 14122 14122 87 1361 52.241 6.26 514.459 61.62 68.02 616407 680361 4.913 0.59 0.59 5887 5887 1.897 0.23 0.23 2273 2273 1.140 0.14 3.421 0.41 62593 1366 0.55 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 4099 5465 1000000