Cyclone Series Device Thermal Resistance May 2008, version 3.0 Revision History Data Sheet The following table shows the revision history for this data sheet. Date Document Version Changes Made May 2008 3.0 Updated Tables 2, 4, and 5. July 2007 2.2 Updated values for EP3C25 (E144) device in Table 2. May 2007 2.1 Updated values for EP3C10 (E144) device in Table 2 and added Revision History. March 2007 2.0 Added Cyclone III information. April 2006 1.0 Initial release. Tables 1 through 6 in this data sheet provide θ JA (junction-to-ambient thermal resistance) and θ JC (junction-to-case thermal resistance) values for Altera® Cyclone® series devices available in Ball-Grid Array (BGA), FineLine® BGA (FBGA), Micro FineLine BGA® (MBGA), Ultra FineLine BGA (UBGA), Pin-Grid Array (PGA), Plastic J-Lead Chip Carrier (PLCC), Plastic Enhanced Quad Flat Pack (EQFP), Thin Quad Flat Pack (TQFP), Plastic Quad Flat Pack (PQFP), and Power Quad Flat Pack (RQFP). f Altera Corporation DS-CYTHRML-3.0 For additional packaging information, refer to the Altera Device Packaging Data Sheet. 1 Altera Device Package Information Data Sheet Cyclone III Devices Thermal resistance values for Cyclone III devices are provided for a board meeting JEDEC specifications and for a typical board. The JEDEC board specifications require two signals and two power/ground planes and are available at www.jedec.org. The values are described in Tables 1 through 4. Table 1. Thermal Resistance Values for Cyclone III Devices Value Description θJA (C/W) Still Air Junction-to-ambient thermal resistance (θJA) with no airflow when a heat sink is not being used. θJA (C/W) 100 ft./minute Junction-to-ambient thermal resistance with 100 ft./minute airflow when a heat sink is not being used. θJA (C/W) 200 ft./minute Junction-to-ambient thermal resistance with 200 ft./minute airflow when a heat sink is not being used. θJA (C/W) 400 ft./minute Junction-to-ambient thermal resistance with 400 ft./minute airflow when a heat sink is not being used. θJC (C/W) Junction-to-case thermal resistance (θJC) for device. θJB (C/W) Junction-to-board thermal resistance (θJB) for specific board being used. Table 2 provides θ JA (junction-to-ambient thermal resistance) values and θJC (junction-to-case thermal resistance) values for Cyclone III devices on a board meeting JEDEC specifications for thermal resistance calculation. Table 2. Thermal Resistance of Cyclone III Devices for Board Meeting JEDEC Specifications (Part 1 of 2) Device EP3C5 EP3C10 2 Package θJA (°C/W) Still Air θJA (°C/W) 100 ft./min. θ JA (°C/W) 200 ft./min. θ JA (°C/W) 400 ft./min. θJC (°C/W) E144 20 17.5 15.4 14 8.4 F256 32.4 28.9 27 25.5 11.7 U256 32.5 29.1 27.2 25.6 12.2 M164 38.2 31.5 29.6 27.9 11.6 E144 20 17.5 15.4 14 8.4 F256 32.4 28.9 27 25.5 11.7 U256 32.5 29.1 27.2 25.6 12.2 M164 38.2 31.5 29.6 27.9 11.6 DS-CYTHRML-3.0 Altera Corporation Altera Device Package Information Data Sheet Table 2. Thermal Resistance of Cyclone III Devices for Board Meeting JEDEC Specifications (Part 2 of 2) Device Package EP3C16 EP3C25 EP3C40 EP3C55 EP3C80 EP3C120 θJA (°C/W) Still Air θJA (°C/W) 100 ft./min. θ JA (°C/W) 200 ft./min. θ JA (°C/W) 400 ft./min. θJC (°C/W) E144 20 17.5 15.4 14 8 Q240 27.2 24.7 22.1 17.8 4.3 F256 28.5 25.1 23.2 21.7 9.1 U256 28.8 25.4 23.5 22 9.7 U484 26.9 23.5 21.6 20.1 8.5 F484 22.9 19.4 17.7 16.2 6.9 M164 34.7 28 26.1 24.4 9.2 E144 20 17.5 15.4 14 7.8 Q240 27 24.5 21.8 17.6 4.2 F256 27.5 24.1 22.2 20.7 8.5 U256 27.9 24.5 22.6 21.1 9.1 F324 26.6 23.1 21.3 19.8 8 Q240 25.8 23.2 20.6 17 4 F324 23.2 19.7 18 16.5 5.9 U484 22.8 19.3 17.6 16.1 5.9 F484 19.8 16.3 14.6 13.2 4.8 F780 18.7 15.2 13.5 12.2 4.5 F484 21.6 18.2 16.4 15 5.1 U484 18.9 15.4 13.8 12.2 4.2 F780 17.8 14.4 12.7 11.4 3.9 U484 20.4 16.9 15.2 13.8 4.4 F484 18 14.5 12.9 11.5 3.6 F780 16.9 13.5 11.8 10.5 3.3 F484 17.1 13.7 12 10.7 3.1 F780 16 12.6 11 9.7 2.8 Table 3 provides board dimension information for each package. Table 3. PCB Dimensions Notes (1), (2) 2.5 mm Thick Signal Layers Altera Corporation (Part 1 of 2) Power/Ground Layers Package Dimensions (mm) Board Dimensions (mm) F780 9 9 29 89 F484 7 7 23 83 DS-CYTHRML-3.0 3 Altera Device Package Information Data Sheet Table 3. PCB Dimensions Notes (1), (2) 2.5 mm Thick Signal Layers (Part 2 of 2) Power/Ground Layers Package Dimensions (mm) Board Dimensions (mm) U484 7 7 19 79 F324 6 6 19 79 F256 6 6 17 77 U256 6 6 14 74 Notes to Table 3: (1) (2) Power layer Cu thickness 35 um, Cu 90% Signal layer Cu thickness 17 um, Cu 15% Table 4 provides θ JA values and θ JB (junction-to-board thermal resistance) values for Cyclone III devices on a typical board. Table 4. Thermal Resistance of Cyclone III Devices for Typical Board (Part 1 of 2) Device EP3C5 EP3C10 EP3C16 EP3C25 EP3C40 EP3C55 4 Package θJA (°C/W) Still Air θJA (°C/W) 100 ft./min. θ JA (°C/W) 200 ft./min. θJA (°C/W) 400 ft./min. θJB (°C/W) F256 32.2 27.9 25.5 23.6 17.3 U256 32.7 28.2 25.7 23.7 16.3 F256 32.2 27.9 25.5 23.6 17.3 U256 32.7 28.2 25.7 23.7 16.3 F256 28.4 24.2 21.8 20 13.5 U256 29 24.6 22.2 20.2 12.7 U484 26.3 22.1 19.9 18.1 12.4 F484 22.5 18.5 16.4 14.8 9.8 F256 27.5 23.2 20.9 19.1 12.6 U256 28.1 23.7 21.3 19.4 11.8 F324 26.4 22.3 20.1 18.3 12.4 F324 23.1 19 16.9 15.1 9.2 F484 22.3 18.2 16 14.3 8.5 U484 19.4 15.4 13.5 11.9 6.8 F780 17.6 13.9 12.1 10.7 6.7 U484 21.2 17.1 15 13.3 7.5 F484 18.6 14.6 12.6 11.1 6 F780 16.8 13.1 11.3 9.9 5.9 DS-CYTHRML-3.0 Altera Corporation Altera Device Package Information Data Sheet Table 4. Thermal Resistance of Cyclone III Devices for Typical Board (Part 2 of 2) Device EP3C80 EP3C120 Cyclone II Devices θJA (°C/W) Still Air θJA (°C/W) 100 ft./min. θ JA (°C/W) 200 ft./min. θJA (°C/W) 400 ft./min. θJB (°C/W) U484 20 15.9 13.8 12.1 6.3 F484 17.7 13.7 11.8 10.3 5.2 Package F780 15.9 12.2 10.5 9.1 5.1 F484 16.8 12.9 11 9.4 4.4 F780 15.1 11.4 9.6 8.3 4.2 Table 5 provides θ JA (junction-to-ambient thermal resistance) and θ JC (junction-to-case thermal resistance) values for Cyclone II devices. Table 5. Thermal Resistance of Cyclone II Devices Device EP2C5 EP2C8 EP2C20 EP2C35 EP2C50 EP2C70 Altera Corporation Package F256 0 ft./min. θ JA (°C/W) 100 ft./min. θJA (°C/W) 200 ft./min. θJA (°C/W) 400 ft./min. θ JC (°C/W) 30.2 26.1 23.6 21.7 8.7 θJA (°C/W) T144 31 29.3 27.9 25.5 10 Q208 30.4 29.2 27.3 22.3 5.5 F256 27.0 23.0 20.5 18.5 7.1 T144 29.8 28.3 26.9 24.9 9.9 Q208 30.2 28.2 26.9 21.7 5.4 Q240 26.6 24.0 21.4 17.4 4.2 F256 24.2 20.0 17.8 16.0 5.5 F484 21.0 17.0 14.8 13.1 4.2 T144 27.6 26.4 25.4 23.8 9.6 F484 19.4 15.4 13.3 11.7 3.3 U484 20.6 16.6 14.5 12.8 5.0 F672 18.6 14.6 12.6 11.1 3.1 F484 18.4 14.4 12.4 10.9 2.8 U484 19.6 15.6 13.6 11.9 4.4 F672 17.7 13.7 11.8 10.2 2.6 F672 16.9 13.0 11.1 9.7 2.2 F896 16.3 11.9 10.5 9.1 2.1 DS-CYTHRML-3.0 5 Altera Device Package Information Data Sheet Table 6 provides θ JA and θ JB (junction-to-board thermal resistance) values for Cyclone II devices on a typical board. Table 6. Thermal Resistance of Cyclone II Devices Package θJA (° C/W) Still Air θ JA (° C/W) 100 ft./min. θ JA (° C/W) 200 ft./min. θ JA (° C/W) 400 ft./min. θJB (°C/W) EP2C5 F256 30.2 25.8 22.9 20.6 14.8 EP2C8 F256 27.9 23.2 20.5 18.4 12.3 EP2C20 F256 24.7 20.1 17.5 15.3 9.1 F484 20.5 16.2 13.9 12.2 7.2 Device EP2C35 EP2C50 F484 18.8 14.5 12.3 10.6 5.7 U484 20.0 15.5 13.2 11.3 5.3 F484 17.7 13.5 11.4 9.8 4.5 U484 19.0 14.6 12.3 10.6 4.4 EP2C35 F672 17.4 13.3 11.3 9.8 5.5 EP2C50 F672 16.5 12.4 10.5 9.0 4.6 F672 15.7 11.7 9.8 8.3 3.8 F896 14.6 10.7 8.9 7.6 3.7 EP2C70 Table 7 provides θ JA (junction-to-ambient thermal resistance) and θ JC (junction-to-case thermal resistance) values for Cyclone devices. Cyclone Devices Table 7. Thermal Resistance of Cyclone Devices (Part 1 of 2) Device EP1C3 EP1C6 EP1C12 6 θ JA (°C/W) θJA (°C/W) θJA (°C/W) θJA (°C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min. Pin Count Package θJC (°C/W) 100 TQFP 11.0 37.5 35.4 33.4 29.8 144 TQFP 10.0 31.1 29.4 27.9 25.5 144 TQFP 9.8 29.4 28.0 26.7 24.7 240 PQFP 4.3 27.2 24.7 22.1 17.8 256 FBGA 8.8 28.7 24.5 22.3 20.5 240 PQFP 4.0 26.0 23.4 20.8 17.1 256 FBGA 6.6 24.3 20.2 18.1 16.4 324 FBGA 6.1 23.0 19.8 17.7 16.1 DS-CYTHRML-3.0 Altera Corporation Altera Device Package Information Data Sheet Table 7. Thermal Resistance of Cyclone Devices (Part 2 of 2) Device θ JA (°C/W) θJA (°C/W) θJA (°C/W) θJA (°C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min. Pin Count Package θJC (°C/W) 324 FBGA 5.0 21.0 17.7 15.6 14.1 400 FBGA 4.7 20.7 17.5 15.5 13.9 EP1C20 101 Innovation Drive San Jose, CA 95134 www.altera.com Altera Corporation Copyright © 2008 Altera Corporation. All rights reserved. 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