56F8323/56F8123 Data Sheet Preliminary Technical Data 56F8300 16-bit Digital Signal Controllers MC56F8323 Rev. 17 04/2007 freescale.com Document Revision History Version History Description of Change Rev 1.0 Pre-Release version, Alpha customers only Rev 2.0 Initial Public Release Rev 3.0 Corrected typo in Table 10-4, Flash Endurance is 10,000 cycles. Addressed additional grammar issues. Rev 4.0 Added Package Pins to GPIO Table in Section 8. Removed reference to pin group 9 in Table 10-5. Replacing TBD Typical Min with values in Table 10-17. Editing grammar, spelling, consistency of language throughout family. Updated values in Regulator Parameters, Table 10-9, External Clock Operation Timing Requirements Table 10-13, SPI Timing, Table 10-18, ADC Parameters, Table 10-24, and IO Loading Coefficients at 10MHz, Table 10-25. Rev 5.0 Updated values in Power-On Reset Low Voltage, Table 10-6. Rev 6.0 Correcting package pin numbers in Table 2-2, PhaseA0 changed from 38 to 52, PhaseB0 changed from 37 to 51, Index0 changed from 36 to 50, and Home0 changed from 35 to 49. All pin changes in Table 2-2 were do to data entry errors - This package pin-out has not changed Rev 7.0 Added Part 4.8, added addition text to Part 6.9 on POR reset, added the word “access” to FM Error Interrupt in Table 4-3, removed min and max numbers; only documenting Typ. numbers for LVI in Table 10-6. Rev 8.0 Updated numbers in Table 10-7 and Table 10-8 with more recent data. Corrected typo in Table 10-3 in Pd characteristics. Rev 9.0 Replace any reference to Flash Interface Unit with Flash Memory Module; changed example in Part 2.2; added note on VREFH and VREFLO in Table 2-2 and Table 11-1; added note to Vcap pin in Table 2-2; corrected typo FIVAL1 and FIVAH1 in Table 4-12; removed unneccessary notes in Table 10-12; corrected temperature range in Table 10-14; added ADC calibration information to Table 10-24 and new graphs in Figure 10-21. Rev 10.0 Clarification to Table 10-23, corrected Digital Input Current Low (pull-up enabled) numbers in Table 10-5. Removed text and Table 10-2; replaced with note to Table 10-1. Rev. 11.0 Added 56F8123 information; edited to indicate differences in 56F8323 and 56F8123.Reformatted for Freescale look and feel. Updated Temperature Sensor and ADC tables, then updated balance of electrical tables for consistency throughout the family. Clarified I/O power description in Table 2-2, added note to Table 10-7 and clarified Section 12.3 . Rev 12.0 Added output voltage maximum value and note to clarify in Table 10-1; also removed overall life expectancy note, since life expectancy is dependent on customer usage and must be determined by reliability engineering. Clarified value and unit measure for Maximum allowed PD in Table 10-3. Corrected note about average value for Flash Data Retention in Table 10-4. Added new RoHS-compliant orderable part numbers in Table 13-1. Rev 13.0 Deleted formula for Max Ambient Operating Temperature (Automotive) and Max Ambient Operating Temperature (Industrial) in Table 10-4. Added RoHS-compliance and “pb-free” language to back cover. 56F8323 Technical Data, Rev. 17 2 Freescale Semiconductor Preliminary Document Revision History Version History Description of Change Rev 14.0 Added information/corrected state during reset in Table 2-2. Clarified external reference crystal frequency for PLL in Table 10-14 by increasing maximum value to 8.4MHz. Rev 15.0 Replaced “Tri-stated” with an explanation in State During Reset column in Table 2-2. Rev. 16 • Added the following note to the description of the TMS signal in Table 2-2: Note: Always tie the TMS pin to VDD through a 2.2K resistor. • Added the following note to the description of the TRST signal in Table 2-2: Note: For normal operation, connect TRST directly to VSS. If the design is to be used in a debugging environment, TRST may be tied to VSS through a 1K resistor. Rev. 17 Changed the “Frequency Accuracy” specification in Table 10-16 (was ±2.0%, is +2 / -3%). Please see http://www.freescale.com for the most current data sheet revision. 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 3 56F8323 Technical Data, Rev. 17 4 Freescale Semiconductor Preliminary 56F8323/56F8123 General Description Note: Features in italics are NOT available in the 56F8123 device. • Up to 60 MIPS at 60MHz core frequency • One Quadrature Decoder • DSP and MCU functionality in a unified, C-efficient architecture • One FlexCAN module • 32KB Program Flash • Up to two Serial Peripheral Interfaces (SPIs) • 4KB Program RAM • Two general-purpose Quad Timers • 8KB Data Flash • Computer Operating Properly (COP)/Watchdog • 8KB Data RAM • On-Chip Relaxation Oscillator • 8KB Boot Flash • One 6-channel PWM module • JTAG/Enhanced On-Chip Emulation (OnCE™) for unobtrusive, real-time debugging • Two 4-channel 12-bit ADCs • Up to 27 GPIO lines • Temperature Sensor • 64-pin LQFP Package • Up to two Serial Communication Interfaces (SCIs) OCR_DIS RESET VCAP 5 6 3 PWM Outputs Current Sense Inputs 3 Fault Inputs JTAG/ EOnCE Port PWMA or SPI1 or GPIOA Program Controller and Hardware Looping Unit AD0 4 AD1 Memory VREF Program Memory 16K x 16 Flash 2K x 16 RAM 4K x 16 Boot Flash TEMP_SENSE 4 Quadrature Decoder 0 or Quad Timer A or GPIO B VSS VDDA 4 Digital Reg Analog Reg Low Voltage Supervisor 16-Bit 56800E Core Address Generation Unit VSSA 2 Data ALU 16 x 16 + 36 −> 36-Bit MAC Three 16-bit Input Registers Four 36-bit Accumulators Bit Manipulation Unit PAB PDB CDBR CDBW 4 5 VDD 4 4 R/W Control Data Memory 4K x 16 Flash 4K x 16 RAM XDB2 XAB1 XAB2 PAB System Bus Control PDB CDBR CDBW IPBus Bridge (IPBB) 3 2 Quad Timer C or SCI0 or GPIOC FlexCAN or GPIOC Peripheral Device Selects Decoding Peripherals RW Control IPAB IPWDB IPRDB Clock resets SPI0 or SCI1 or GPIOB COP/ Watchdog Interrupt Controller P System O Integration R Module 4 IRQA PLL O Clock S Generator* C XTAL or GPIOC EXTAL or GPIOC *Includes On-Chip Relaxation Oscillator 56F8323/56F8123 Block Diagram 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 5 Table of Contents Part 1: Overview . . . . . . . . . . . . . . . . . . . . . . . 7 1.1. 1.2. 1.3. 1.4. 1.5. 1.6. 56F8323/56F8123 Features . . . . . . . . . . . . . 7 Device Description . . . . . . . . . . . . . . . . . . . . 9 Award-Winning Development Environment 10 Architecture Block Diagram . . . . . . . . . . . . 11 Product Documentation . . . . . . . . . . . . . . . 15 Data Sheet Conventions . . . . . . . . . . . . . . . 15 Part 2: Signal/Connection Descriptions . . 16 2.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 16 2.2. Signal Pins . . . . . . . . . . . . . . . . . . . . . . . . . 19 Part 3: On-Chip Clock Synthesis (OCCS) . . 30 3.1. 3.2. 3.3. 3.4. 3.5. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . External Clock Operation . . . . . . . . . . . . . . Use of On-Chip Relaxation Oscillator . . . . . Internal Clock Operation . . . . . . . . . . . . . . . Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 30 31 32 33 Part 4: Memory Map. . . . . . . . . . . . . . . . . . . 33 4.1. 4.2. 4.3. 4.4. 4.5. 4.6. 4.7. 4.8. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . Program Map. . . . . . . . . . . . . . . . . . . . . . . . Interrupt Vector Table . . . . . . . . . . . . . . . . . Data Map . . . . . . . . . . . . . . . . . . . . . . . . . . . Flash Memory Map . . . . . . . . . . . . . . . . . . . EOnCE Memory Map . . . . . . . . . . . . . . . . . Peripheral Memory Mapped Registers . . . . Factory Programmed Memory. . . . . . . . . . . 33 33 34 37 37 39 40 56 Part 5: Interrupt Controller (ITCN) . . . . . . . . 57 5.1. 5.2. 5.3. 5.4. 5.5. 5.6. 5.7. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . Functional Description . . . . . . . . . . . . . . . . Block Diagram . . . . . . . . . . . . . . . . . . . . . . . Operating Modes . . . . . . . . . . . . . . . . . . . . . Register Descriptions . . . . . . . . . . . . . . . . . Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 57 57 59 59 60 82 Part 6: System Integration Module (SIM) . . 83 6.1. 6.2. 6.3. 6.4. 6.5. 6.6. 6.7. 6.8. 6.9. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating Modes . . . . . . . . . . . . . . . . . . . . Operating Mode Register . . . . . . . . . . . . . . Register Descriptions . . . . . . . . . . . . . . . . . Clock Generation Overview. . . . . . . . . . . . . Power-Down Modes . . . . . . . . . . . . . . . . . . Stop and Wait Mode Disable Function . . . . Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 83 84 84 85 97 97 98 98 Part 8: General Purpose Input/Output (GPIO) . . . . . . . . . . . . . . . . . . . . . . 102 8.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . 102 8.2. Configuration. . . . . . . . . . . . . . . . . . . . . . . 102 8.3. Memory Maps . . . . . . . . . . . . . . . . . . . . . . 104 Part 9: Joint Test Action Group (JTAG) . . 104 9.1. JTAG Information . . . . . . . . . . . . . . . . . . . 104 Part 10: Specifications. . . . . . . . . . . . . . . . 105 10.1. General Characteristics . . . . . . . . . . . . . . 105 10.2. DC Electrical Characteristics. . . . . . . . . . 109 10.3. AC Electrical Characteristics . . . . . . . . . . 113 10.4. Flash Memory Characteristics. . . . . . . . . 114 10.5. External Clock Operation Timing . . . . . . 114 10.6. Phase Locked Loop Timing . . . . . . . . . . . 115 10.7. Crystal Oscillator Parameters . . . . . . . . . 115 10.8. Reset, Stop, Wait, Mode Select, and Interrupt Timing . . . . . . . . . . . . . 117 10.9. Serial Peripheral Interface (SPI) Timing . . 119 10.10. Quad Timer Timing . . . . . . . . . . . . . . . . 122 10.11. Quadrature Decoder Timing . . . . . . . . . . 122 10.12. Serial Communication Interface (SCI) Timing . . . . . . . . . . . . . . . . 123 10.13. Controller Area Network (CAN) Timing . 124 10.14. JTAG Timing . . . . . . . . . . . . . . . . . . . . . 124 10.15. Analog-to-Digital Converter (ADC) Parameters . . . . . . . . . . . 126 10.16. Equivalent Circuit for ADC Inputs . . . . . 129 10.17. Power Consumption . . . . . . . . . . . . . . . . 129 Part 11: Packaging 131 11.1. 56F8323 Package and Pin-Out Information . . . . . . . . . . . . . . . . . . 131 11.2. 56F8123 Package and Pin-Out Information . . . . . . . . . . . . . . . . . 133 Part 12: Design Considerations . . . . . . . . 136 12.1. Thermal Design Considerations . . . . . . . 136 12.2. Electrical Design Considerations . . . . . . . 137 12.3. Power Distribution and I/O Ring Implementation . . . . . . . . . . . . . . 138 Part 13: Ordering Information . . . . . . . . . . 139 Part 7: Security Features . . . . . . . . . . . . . . 99 7.1. Operation with Security Enabled . . . . . . . . 99 7.2. Flash Access Blocking Mechanisms . . . . . . 99 56F8323 Technical Data, Rev. 17 6 Freescale Semiconductor Preliminary 56F8323/56F8123 Features Part 1 Overview 1.1 56F8323/56F8123 Features 1.1.1 • • • • • • • • • • • • • • 1.1.2 Core Efficient 16-bit 56800E family engine with dual Harvard architecture Up to 60 Million Instructions Per Second (MIPS) at 60MHz core frequency Single-cycle 16 × 16-bit parallel Multiplier-Accumulator (MAC) Four 36-bit accumulators, including extension bits Arithmetic and logic multi-bit shifter Parallel instruction set with unique addressing modes Hardware DO and REP loops Three internal address buses Four internal data buses Instruction set supports both DSP and controller functions Controller-style addressing modes and instructions for compact code Efficient C compiler and local variable support Software subroutine and interrupt stack with depth limited only by memory JTAG/EOnCE debug programming interface Differences Between Devices Table 1-1 outlines the key differences between the 56F8323 and 56F8123 devices. Table 1-1 Device Differences Feature 56F8323 56F8123 60MHz/60 MIPS 40MHz/40 MIPS Program RAM 4KB Not Available Data Flash 8KB Not Available PWM 1x6 Not Available CAN 1 Not Available Quadrature Decoder 1x4 Not Available Temperature Sensor 1 Not Available Dedicated GPIO — 10 Guaranteed Speed 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 7 1.1.3 Memory Note: Features in italics are NOT available in the 56F8123 device. • • • Harvard architecture permits as many as three simultaneous accesses to program and data memory Flash security protection On-chip memory, including a low-cost, high-volume Flash solution — 32KB of Program Flash — 4KB of Program RAM — 8KB of Data Flash — 8KB of Data RAM — 8KB of Boot Flash • 1.1.4 EEPROM emulation capability Peripheral Circuits Note: Features in italics are NOT available in the 56F8123 device. • • • • One Pulse Width Modulator module with six PWM outputs, three Current Sense inputs and three Fault inputs; fault-tolerant design with dead time insertion; supports both center-aligned and edge-aligned modes Two 12-bit, Analog-to-Digital Converters (ADCs), which support two simultaneous conversions with dual, 4-pin multiplexed inputs; ADC and PWM modules can be synchronized through Timer C, channel 2 Temperature Sensor can be connected, on the board, to any of the ADC inputs to monitor the on-chip temperature Two 16-bit Quad Timer modules (TMR) totaling seven pins: — In the 56F8323, Timer A works in conjunction with Quad Decoder 0 and Timer C works in conjunction with the PWMA and ADCA — In the 56F8123, Timer C works in conjunction with ADCA • • • • • • • • • • • One Quadature Decoder which works in conjunction with Quad Timer A FlexCAN (CAN Version 2.0 B-compliant) module with 2-pin port for transmit and receive Up to two Serial Communication Interfaces (SCIs) Up to two Serial Peripheral Interfaces (SPIs) Computer Operating Properly (COP)/Watchdog timer One dedicated external interrupt pin 27 General Purpose I/O (GPIO) pins Integrated Power-On Reset and Low-Voltage Interrupt Module JTAG/Enhanced On-Chip Emulation (OnCE™) for unobtrusive, processor speed-independent, real-time debugging Software-programmable, Phase Lock Loop (PLL) On-chip relaxation oscillator 56F8323 Technical Data, Rev. 17 8 Freescale Semiconductor Preliminary Device Description 1.1.5 • • • • • • Energy Information Fabricated in high-density CMOS with 5V tolerant, TTL-compatible digital inputs On-board 3.3V down to 2.6V voltage regulator for powering internal logic and memories On-chip regulators for digital and analog circuitry to lower cost and reduce noise Wait and Stop modes available ADC smart power management Each peripheral can be individually disabled to save power 1.2 Device Description The 56F8323 and 56F8123 are members of the 56800E core-based family of controllers. Each combines, on a single chip, the processing power of a Digital Signal Processor (DSP) and the functionality of a microcontroller with a flexible set of peripherals to create an extremely cost-effective solution. Because of their low cost, configuration flexibility, and compact program code, the 56F8323 and 56F8123 are well-suited for many applications. The devices include many peripherals that are especially useful for automotive control (56F8323 only); industrial control and networking; motion control; home appliances; general purpose inverters; smart sensors; fire and security systems; power management; and medical monitoring applications. The 56800E core is based on a Harvard-style architecture consisting of three execution units operating in parallel, allowing as many as six operations per instruction cycle. The MCU-style programming model and optimized instruction set allow straightforward generation of efficient, compact DSP and control code. The instruction set is also highly efficient for C Compilers to enable rapid development of optimized control applications. The 56F8323 and 56F8123 support program execution from internal memories. Two data operands can be accessed from the on-chip data RAM per instruction cycle. These devices also provide one external dedicated interrupt line and up to 27 General Purpose Input/Output (GPIO) lines, depending on peripheral configuration. 1.2.1 56F8323 Features The 56F8323 controller includes 32KB of Program Flash and 8KB of Data Flash, each programmable through the JTAG port, with 4KB of Program RAM and 8KB of Data RAM. A total of 8KB of Boot Flash is incorporated for easy customer inclusion of field-programmable software routines that can be used to program the main Program and Data Flash memory areas. Both Program and Data Flash memories can be independently bulk erased or erased in pages. Program Flash page erase size is 1KB. Boot and Data Flash page erase size is 512 bytes. The Boot Flash memory can also be either bulk or page erased. A key application-specific feature of the 56F8323 is the inclusion of one Pulse Width Modulator (PWM) module. This module incorporates three complementary, individually programmable PWM signal output pairs and is also capable of supporting six independent PWM functions to enhance motor control functionality. Complementary operation permits programmable dead time insertion, distortion correction via current sensing by software, and separate top and bottom output polarity control. The up-counter value is programmable to support a continuously variable PWM frequency. Edge-aligned and center-aligned 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 9 synchronous pulse width control (0% to 100% modulation) is supported. The device is capable of controlling most motor types: ACIM (AC Induction Motors); both BDC and BLDC (Brush and Brushless DC motors); SRM and VRM (Switched and Variable Reluctance Motors); and stepper motors. The PWM incorporates fault protection and cycle-by-cycle current limiting with sufficient output drive capability to directly drive standard optoisolators. A “smoke-inhibit”, write-once protection feature for key parameters is also included. A patented PWM waveform distortion correction circuit is also provided. Each PWM is double-buffered and includes interrupt controls to permit integral reload rates to be programmable from 1/2 (center-aligned mode only) to 16. The PWM module provides reference outputs to synchronize the Analog-to-Digital Converters (ADCs) through Quad Timer C, Channel 2. The 56F8323 incorporates one Quadrature Decoder capable of capturing all four transitions on the two-phase inputs, permitting generation of a number proportional to actual position. Speed computation capabilities accommodate both fast- and slow-moving shafts. An integrated watchdog timer in the Quadrature Decoder can be programmed with a time-out value to alarm when no shaft motion is detected. Each input is filtered to ensure only true transitions are recorded. This controller also provides a full set of standard programmable peripherals that include two Serial Communications Interfaces (SCIs), two Serial Peripheral Interfaces (SPIs), two Quad Timers, and FlexCAN. Any of these interfaces can be used as General Purpose Input/Outputs (GPIOs) if that function is not required. A Flex Controller Area Network (FlexCAN) interface (CAN Version 2.0 B-compliant) and an internal interrupt controller are also a part of the 56F8323. 1.2.2 56F8123 Features The 56F8123 controller includes 32KB of Program Flash, programmable through the JTAG port, and 8KB of Data RAM. A total of 8KB of Boot Flash is incorporated for easy customer inclusion of field-programmable software routines that can be used to program the main Program Flash memory area. The Program Flash memory can be independently bulk erased or erased in pages; Program Flash page erase size is 1KB. The Boot Flash memory can also be either bulk or page erased. This controller also provides a full set of standard programmable peripherals that include two Serial Communications Interfaces (SCIs), two Serial Peripheral Interfaces (SPIs), and two Quad Timers. Any of these interfaces can be used as General Purpose Input/Outputs (GPIOs) if that function is not required. An internal interrupt controller is also a part of the 56F8123. 1.3 Award-Winning Development Environment Processor ExpertTM (PE) provides a Rapid Application Design (RAD) tool that combines easy-to-use component-based software application creation with an expert knowledge system. The CodeWarrior Integrated Development Environment is a sophisticated tool for code navigation, compiling, and debugging. A complete set of evaluation modules (EVMs), demonstration board kit and development system cards will support concurrent engineering. Together, PE, CodeWarrior and EVMs create a complete, scalable tools solution for easy, fast, and efficient development. 56F8323 Technical Data, Rev. 17 10 Freescale Semiconductor Preliminary Architecture Block Diagram 1.4 Architecture Block Diagram Note: Features in italics are NOT available in the 56F8123 device and are shaded in the following figures. The 56F8323/56F8123 architecture is shown in Figure 1-1 and Figure 1-2. Figure 1-1 illustrates how the 56800E system buses communicate with internal memories and the IPBus Bridge. Table 1-2 lists the internal buses in the 56800E architecture and provides a brief description of their function. Figure 1-2 shows the peripherals and control blocks connected to the IPBus Bridge. The figures do not show the on-board regulator and power and ground signals. They also do not show the multiplexing between peripherals or the dedicated GPIOs. Please see Part 2 Signal/Connection Descriptions, to see which signals are multiplexed with those of other peripherals. Also shown in Figure 1-2 are connections between the PWM, Timer C and ADC blocks. These connections allow the PWM and/or Timer C to control the timing of the start of ADC conversions. The Timer C, Channel 2, output can generate periodic start (SYNC) signals to the ADC to start its conversions. In another operating mode, the PWM load interrupt (SYNC output) signal is routed internally to the Timer C, Channel 2, input as indicated. The timer can then be used to introduce a controllable delay before generating its output signal. The timer output then triggers the ADC. To fully understand this interaction, please see the 56F8300 Peripheral User Manual for clarification on the operation of all three of these peripherals. 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 11 5 JTAG / EOnCE Boot Flash pdb_m[15:0] CHIP TAP Controller TAP Linking Module pab[20:0] Program Flash cdbw[31:0] Program RAM 56800E xab1[23:0] Data RAM xab2[23:0] Data Flash External JTAG Port cdbr_m[31:0] xdb2_m[15:0] IPBus Bridge NOT available on the 56F8123 device. To Flash Control Logic Flash Memory Module IPBus Figure 1-1 System Bus Interfaces Note: Flash memories are encapsulated within the Flash Memory (FM) Module. Flash control is accomplished by the I/O to the FM over the peripheral bus, while reads and writes are completed between the core and the Flash memories. Note: The primary data RAM port is 32 bits wide. Other data ports are 16 bits. 56F8323 Technical Data, Rev. 17 12 Freescale Semiconductor Preliminary Architecture Block Diagram To/From IPBus Bridge CLKGEN (OSC/PLL) Interrupt Controller (ROSC) Low-Voltage Interrupt Timer A POR & LVI 4 System POR Quadrature Decoder 0 RESET SIM COP Reset 2 4 FlexCAN 2 COP SPI 1 SCI 1 4 SPI 0 PWM A 8 SYNC Output GPIO A 2 SCI 0 GPIO B GPIO C ch2i 3 Timer C ch2o ADCA 8 TEMP_SENSE NOT available on the 56F8123 device. IPBus Figure 1-2 Peripheral Subsystem 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 13 Table 1-2 Bus Signal Names Name Function Program Memory Interface pdb_m[15:0] Program data bus for instruction word fetches or read operations. cdbw[15:0] Primary core data bus used for program memory writes. (Only these 16 bits of the cdbw[31:0] bus are used for writes to program memory.) pab[20:0] Program memory address bus. Data is returned on pdb_m bus. Primary Data Memory Interface Bus cdbr_m[31:0] Primary core data bus for memory reads. Addressed via xab1 bus. cdbw[31:0] Primary core data bus for memory writes. Addressed via xab1 bus. xab1[23:0] Primary data address bus. Capable of addressing bytes1, words, and long data types. Data is written on cdbw and returned on cdbr_m. Also used to access memory-mapped I/O. Secondary Data Memory Interface xdb2_m[15:0] Secondary data bus used for secondary data address bus xab2 in the dual memory reads. xab2[23:0] Secondary data address bus used for the second of two simultaneous accesses. Capable of addressing only words. Data is returned on xdb2_m. Peripheral Interface Bus IPBus [15:0] Peripheral bus accesses all on-chip peripherals registers. This bus operates at the same clock rate as the Primary Data Memory and therefore generates no delays when accessing the processor. Write data is obtained from cdbw. Read data is provided to cdbr_m. 1. Byte accesses can only occur in the bottom half of the memory address space. The MSB of the address will be forced to 0. 56F8323 Technical Data, Rev. 17 14 Freescale Semiconductor Preliminary Product Documentation 1.5 Product Documentation The documents listed in Table 1-3 are required for a complete description and proper design with the 56F8323 and 56F8123 devices. Documentation is available from local Freescale distributors, Freescale semiconductor sales offices, Freescale Literature Distribution Centers, or online at http://www.freescale.com/semiconductors. Table 1-3 Chip Documentation Topic Description DSP56800E Reference Manual Order Number Detailed description of the 56800E family architecture, 16-bit controller core processor, and the instruction set DSP56800ERM 56F8300 Peripheral User Detailed description of peripherals of the 56800E family Manual of devices MC56F8300UM 56F8300 SCI/CAN Bootloader User Manual Detailed description of the SCI/CAN Bootloaders 56F8300 family of devices MC56F83xxBLUM 56F8323/56F8123 Technical Data Sheet Electrical and timing specifications, pin descriptions, and MC56F8323 package descriptions (this document) Errata Details any chip issues that might be present MC56F8323E MC56F8123E 1.6 Data Sheet Conventions This data sheet uses the following conventions: OVERBAR This is used to indicate a signal that is active when pulled low. For example, the RESET pin is active when low. “asserted” A high true (active high) signal is high or a low true (active low) signal is low. “deasserted” A high true (active high) signal is low or a low true (active low) signal is high. Examples: Signal/Symbol Logic State Signal State Voltage1 PIN True Asserted VIL/VOL PIN False Deasserted VIH/VOH PIN True Asserted VIH/VOH PIN False Deasserted VIL/VOL 1. Values for VIL, VOL, VIH, and VOH are defined by individual product specifications. 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 15 Part 2 Signal/Connection Descriptions 2.1 Introduction The input and output signals of the 56F8323 and 56F8123 are organized into functional groups, as detailed in Table 2-1 and as illustrated in Figure 2-1 and Figure 2-2. In Table 2-2, each table row describes the signal or signals present on a pin. Table 2-1 Functional Group Pin Allocations Number of Pins in Package Functional Group 56F8323 56F8123 Power (VDD or VDDA) 6 6 Power Option Control 1 1 Ground (VSS or VSSA) 5 5 Supply Capacitors1 & VPP2 4 4 PLL and Clock 2 2 Interrupt and Program Control 2 2 Pulse Width Modulator (PWM) Ports3 12 — Serial Peripheral Interface (SPI) Port 04 4 8 Quadrature Decoder Port 05 4 — CAN Ports 2 — Analog-to-Digital Converter (ADC) Ports 13 13 Timer Module Port C6 3 3 Timer Module Port A — 4 JTAG/Enhanced On-Chip Emulation (EOnCE) 5 5 Temperature Sensse 1 — Dedicated GPIO — 10 1. If the on-chip regulator is disabled, the VCAP pins serve as 2.5V VDD_CORE power inputs 2. The VPP input shares the IRQA input 3. Pins in this section can function as SPI #1 and GPIO 4. Pins in this section can function as SCI #1 and GPIO 5. Alternately, can function as Quad Timer A pins or GPIO 6. Two pins can function as SCI #0 and GPIO Note: See Table 1-1 for 56F8123 functional differences. 56F8323 Technical Data, Rev. 17 16 Freescale Semiconductor Preliminary Introduction Power VDD_IO Power VDDA_OSC_PLL Ground VSS Power Ground VDDA_ADC VSSA_ADC 4 1 1 1 4 1 1 1 PLL and Clock or GPIO VCAP1 - VCAP4 OCR_DIS EXTAL (GPIOC0) XTAL (GPIOC1) 4 1 1 1 56F8323 1 1 1 2 1 1 1 1 3 3 1 8 5 1 1 1 TCK JTAG/ EOnCE Port TMS TDI TDO TRST PHASEB0 (TA1, GPIOB6) INDEX0 (TA2, GPIOB5) HOME0 (TA3, GPIOB4) Quadrature Decoder 0 or Quad Timer A or GPIO 1 1 Other Supply Ports PHASEA0 (TA0, GPIOB7) 1 1 1 1 1 1 1 1 1 SCLK0 (GPIOB3) MOSI0 (GPIOB2) MISO0 (RXD1, GPIOB1) SS0 (TXD1, GPIOB0) SPI0 or SCI1 or GPIO PWMA0-1 (GPIOA0-1) PWMA2 (SS1, GPIOA2) PWMA3 (MISO1, GPIOA3) PWMA4 (MOSI1, GPIOA4) PWMA5 (SCLK1, GPIOA5) PWMA or SPI1 or GPIO FAULTA0 - 2 (GPIOA6-8) ISA0 - 2 (GPIOA9-11) TEMP_SENSE ANA0 - 7 VREF CAN_RX (GPIOC2) CAN_TX (GPIOC3) TC0 (TXD0, GPIOC6) TC1 (RXD0, GPIOC5) TC3 (GPIOC4) IRQA (VPP) RESET Temperature Sensor ADCA FlexCAN or GPIO QUAD TIMER C or SCI0 or GPIO INTERRUPT/ PROGRAM CONTROL Figure 2-1 56F8323 Signals Identified by Functional Group (64-Pin LQFP) 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 17 Power VDD_IO Power VDDA_OSC_PLL Ground VSS Power Ground VDDA_ADC VSSA_ADC 4 1 1 1 4 1 1 1 PLL and Clock or GPIO VCAP1 - VCAP4 OCR_DIS EXTAL (GPIOC0) XTAL (GPIOC1) 4 1 1 1 56F8123 1 1 1 2 1 1 1 1 3 3 8 5 1 1 1 TCK JTAG/ EOnCE Port TMS TDI TDO TRST TA1 (GPIOB6) TA2 (GPIOB5) Quad Timer A or GPIO TA3 (GPIOB4) 1 1 Other Supply Ports TA0 (GPIOB7) 1 1 1 1 1 1 1 1 1 SCLK0 (GPIOB3) MOSI0 (GPIOB2) MISO0 (RXD1, GPIOB1) SPI0 or SCI1 or GPIO SS0 (TXD1, GPIOB0) GPIOA0-1 SS1 (GPIOA2) MISO1 (GPIOA3) MOSI1 (GPIOA4) SPI1 or GPIO SCLK1 (GPIOA5) GPIOA6-8 GPIOA9-11 ANA0 - 7 VREF ADCA GPIOC2 GPIOC3 TC0 (TXD0, GPIOC6) TC1 (RXD0, GPIOC5) TC3 (GPIOC4) IRQA (VPP) RESET GPIO QUAD TIMER C or SCI0 or GPIO INTERRUPT/ PROGRAM CONTROL Figure 2-2 56F8123 Signals Identified by Functional Group (64-Pin LQFP) 56F8323 Technical Data, Rev. 17 18 Freescale Semiconductor Preliminary Signal Pins 2.2 Signal Pins After reset, each pin is configured for its primary function (listed first). In the 56F8123, after reset, each pin must be configured for the desired function. The initialization software will configure each pin for the function listed first for each pin, as shown in Table 2-2. Any alternate functionality must be programmed. Note: Signals in italics are not available in the 56F8123 device. If the “State During Reset” lists more than one state for a pin, the first state is the actual reset state. Other states show the reset condition of the alternate function, which you get if the alternate pin function is selected without changing the configuration of the alternate peripheral. For example, the SCLK0/GPIOB3 pin shows that it is tri-stated during reset. If the GPIOB_PER is changed to select the GPIO function of the pin, it will become an input if no other registers are changed. Table 2-2 Signal and Package Information for the 64-Pin LQFP State During Reset Signal Name Pin No. Type Signal Description VDD_IO 6 Supply VDD_IO 20 I/O Power — This pin supplies 3.3V power to the chip I/O interface and also the Processor core throught the on-chip voltage regulator, if it is enabled. VDD_IO 48 VDD_IO 59 VDDA_OSC_PLL 42 Supply Oscillator and PLL Power — This pin supplies 3.3V power to the OSC and to the internal regulator that in turn supplies the Phase Locked Loop. It must be connected to a clean analog power supply. VDDA_ADC 41 Supply ADC Power — This pin supplies 3.3V power to the ADC modules. It must be connected to a clean analog power supply. VSS 11 Supply Ground — These pins provide ground for chip logic and I/O drivers. VSS 17 VSS 44 VSS 60 VSSA_ADC 39 Supply ADC Analog Ground — This pin supplies an analog ground to the ADC modules. 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 19 Table 2-2 Signal and Package Information for the 64-Pin LQFP Signal Name Pin No. Type State During Reset VCAP1 57 Supply Supply VCAP2 23 VCAP3 5 VCAP4 43 Signal Description VCAP1 - 4 — When OCR_DIS is tied to VSS (regulator enabled), connect each pin to a 2.2μF or greater bypass capacitor in order to bypass the core logic voltage regulator, required for proper chip operation. When OCR_DIS is tied to VDD, (regulator disabled), these pins become VDD_CORE and should be connected to a regulated 2.5V power supply. Note: This bypass is required even if the chip is powered with an external supply. OCR_DIS 45 On-Chip Regulator Disable — Tie this pin to VSS to enable the on-chip regulator Tie this pin to VDD to disable the on-chip regulator This pin is intended to be a static DC signal from power-up to shut down. Do not try to toggle this pin for power savings during operation. EXTAL 46 Input Input External Crystal Oscillator Input — This input can be connected to an 8MHz external crystal. If an external clock is used, XTAL must be used as the input and EXTAL connected to VSS. The input clock can be selected to provide the clock directly to the core. This input clock can also be selected as the input clock for the on-chip PLL. (GPIOC0) Schmitt Input/ Output Port C GPIO — This GPIO pin can be individually programmed as an input or output pin. After reset, the default state is an EXTAL input with pull-ups disabled. XTAL 47 Output Output Crystal Oscillator Output — This output can be connected to an 8MHz external crystal. If an external clock is used, XTAL must be used as the input and EXTAL connected to VSS. The input clock can be selected to provide the clock directly to the core. This input clock can also be selected as the input clock for the on-chip PLL. (GPIOC1) Schmitt Input/ Output Port C GPIO — This GPIO pin can be individually programmed as an input or output pin. After reset, the default state is an XTAL input with pull-ups disabled. TCK 53 Schmitt Input Input, pulled low internally Test Clock Input — This input pin provides a gated clock to synchronize the test logic and shift serial data to the JTAG/EOnCE port. The pin is connected internally to a pull-down resistor. A Schmitt trigger input is used for noise immunity. 56F8323 Technical Data, Rev. 17 20 Freescale Semiconductor Preliminary Signal Pins Table 2-2 Signal and Package Information for the 64-Pin LQFP Signal Name Pin No. Type TMS 54 Schmitt Input State During Reset Input, pulled high internally Signal Description Test Mode Select Input — This input pin is used to sequence the JTAG TAP controller’s state machine. It is sampled on the rising edge of TCK and has an on-chip pull-up resistor. Note: TDI 55 Schmitt Input Input, pulled high internally TDO 56 Output In reset, output is disabled, pull-up is enabled TRST 58 Schmitt Input Input, pulled high internally Always tie the TMS pin to VDD through a 2.2K resistor. Test Data Input — This input pin provides a serial input data stream to the JTAG/EOnCE port. It is sampled on the rising edge of TCK and has an on-chip pull-up resistor. Test Data Output — This tri-stateable output pin provides a serial output data stream from the JTAG/EOnCE port. It is driven in the shift-IR and shift-DR controller states, and changes on the falling edge of TCK. Test Reset — As an input, a low signal on this pin provides a reset signal to the JTAG TAP controller. To ensure complete hardware reset, TRST should be asserted whenever RESET is asserted. The only exception occurs in a debugging environment when a hardware device reset is required and the EOnCE/JTAG module must not be reset. In this case, assert RESET, but do not assert TRST. To deactivate the internal pull-up resistor, set the JTAG bit in the SIM_PUDR register. Note: For normal operation, connect TRST directly to VSS. If the design is to be used in a debugging environment, TRST may be tied to VSS through a 1K resistor. PHASEA0 52 Schmitt Input Input, pull-up enabled Phase A — Quadrature Decoder 0, PHASEA input (TA0) Schmitt Input/ Output TA0 — Timer A, Channel 0 (GPIOB7) Schmitt Input/ Output Port B GPIO — This GPIO pin can be individually programmed as an input or output pin. (oscillator_ clock) Output Clock Output - can be used to monitor the internal oscillator clock signal (see Part 6.5.7 CLKO Select Register, SIM_CLKOSR). In the 56F8323, the default state after reset is PHASEA0. In the 56F8123, the default state is not one of the functions offered and must be reconfigured. 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 21 Table 2-2 Signal and Package Information for the 64-Pin LQFP Signal Name Pin No. Type PHASEB0 51 Schmitt Input State During Reset Input, pull-up enabled Signal Description Phase B — Quadrature Decoder 0, PHASEB input (TA1) Schmitt Input/ Output TA1 — Timer A ,Channel 1 (GPIOB6) Schmitt Input/ Output Port B GPIO — This GPIO pin can be individually programmed as an input or output pin. (SYS_CLK2) Output Clock Output - can be used to monitor the internal SYS_CLK2 signal (see Part 6.5.7 CLKO Select Register, SIM_CLKOSR). In the 56F8323, the default state after reset is PHASEB0. In the 56F8123, the default state is not one of the functions offered and must be reconfigured. INDEX0 50 Schmitt Input Input, pull-up enabled Index — Quadrature Decoder 0, INDEX input (TA2) Schmitt Input/ Output TA2 — Timer A, Channel 2 (GPIOB5) Schmitt Input/ Output Port B GPIO — This GPIO pin can be individually programmed as an input or output pin. (SYS_CLK) Output Clock Output - can be used to monitor the internal SYS_CLK signal (see Part 6.5.7 CLKO Select Register, SIM_CLKOSR). In the 56F8323, the default state after reset is INDEX0. In the 56F8123, the default state is not one of the functions offered and must be reconfigured. 56F8323 Technical Data, Rev. 17 22 Freescale Semiconductor Preliminary Signal Pins Table 2-2 Signal and Package Information for the 64-Pin LQFP Signal Name Pin No. Type HOME0 49 Schmitt Input State During Reset Input, pull-up enabled Signal Description Home — Quadrature Decoder 0, HOME input (TA3) Schmitt Input/ Output TA3 — Timer A, Channel 3 (GPIOB4) Schmitt Input/ Output Port B GPIO — This GPIO pin can be individually programmed as an input or output pin. (prescaler_ clock) Output Clock Output - can be used to monitor the internal prescaler_clock signal (see Part 6.5.7 CLKO Select Register, SIM_CLKOSR). In the 56F8323, the default state after reset is HOME0. In the 56F8123, the default state is not one of the functions offered and must be reconfigured. SCLK0 25 (GPIOB3) Schmitt Input/ Output Input, pull-up enabled Schmitt Input/ Output SPI 0 Serial Clock — In the master mode, this pin serves as an output, clocking slaved listeners. In slave mode, this pin serves as the data clock input. A Schmitt trigger input is used for noise immunity. Port B GPIO — This GPIO pin can be individually programmed as an input or output pin. After reset, the default state is SCLK0. MOSI0 24 (GPIOB2) Schmitt Input/ Output Schmitt Input/ Output In reset, output is disabled, pull-up is enabled SPI 0 Master Out/Slave In — This serial data pin is an output from a master device and an input to a slave device. The master device places data on the MOSI line a half-cycle before the clock edge the slave device uses to latch the data. Port B GPIO — This GPIO pin can be individually programmed as an input or output pin. After reset, the default state is MOSI0. 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 23 Table 2-2 Signal and Package Information for the 64-Pin LQFP Signal Name Pin No. Type State During Reset MISO0 22 Schmitt Input/ Output Input, pull-up enabled Signal Description SPI 0 Master In/Slave Out — This serial data pin is an input to a master device and an output from a slave device. The MISO line of a slave device is placed in the high-impedance state if the slave device is not selected. The slave device places data on the MISO line a half-cycle before the clock edge the master device uses to latch the data. (RXD1) Schmitt Input Receive Data — SCI1 receive data input (GPIOB1) Schmitt Input/ Output Port B GPIO — This GPIO pin can be individually programmed as an input or output pin. After reset, the default state is MISO0. SS0 21 Schmitt Input Input, pull-up enabled SPI 0 Slave Select — SS0 is used in slave mode to indicate to the SPI module that the current transfer is to be received. (TXD1) Output Transmit Data — SCI1 transmit data output (GPIOB0) Schmitt Input/ Output Port B GPIO — This GPIO pin can be individually programmed as an input or output pin. After reset, the default state is SS0. PWMA0 3 (GPIOA0) Output Schmitt Input/ Output In reset, output is disabled, pull-up is enabled PWMA0 — This is one of six PWMA output pins. Port A GPIO — This GPIO pin can be individually programmed as an input or output pin. In the 56F8323, the default state after reset is PWMA0. In the 56F8123, the default state is not one of the functions offered and must be reconfigured. PWMA1 (GPIOA1) 4 Output Schmitt Input/ Output In reset, output is disabled, pull-up is enabled PWMA1 — This is one of six PWMA output pins. Port A GPIO — This GPIO pin can be individually programmed as an input or output pin. In the 56F8323, the default state after reset is PWMA1. In the 56F8123, the default state is not one of the functions offered and must be reconfigured 56F8323 Technical Data, Rev. 17 24 Freescale Semiconductor Preliminary Signal Pins Table 2-2 Signal and Package Information for the 64-Pin LQFP Signal Name Pin No. Type PWMA2 7 Output (SS1) Schmitt Input (GPIOA2) Schmitt Input/ Output State During Reset In reset, output is disabled, pull-up is enabled Signal Description PWMA2 — This is one of six PWMA output pins. SPI 1 Slave Select — SS1 is used in slave mode to indicate to the SPI module that the current transfer is to be received. Port A GPIO — This GPIO pin can be individually programmed as an input or output pin. In the 56F8323, the default state after reset is PWMA2. In the 56F8123, the default state is not one of the functions offered and must be reconfigured. PWMA3 8 Output (MISO1) Schmitt Input/ Output (GPIOA3) Schmitt Input/ Output In reset, output is disabled, pull-up is enabled PWMA3 — This is one of six PWMA output pins. SPI 1 Master In/Slave Out — This serial data pin is an input to a master device and an output from a slave device. The MISO line of a slave device is placed in the high-impedance state if the slave device is not selected. The slave device places data on the MISO line a half-cycle before the clock edge the master device uses to latch the data. Port A GPIO — This GPIO pin can be individually programmed as an input or output pin. In the 56F8323, the default state after reset is PWMA3. In the 56F8123, the default state is not one of the functions offered and must be reconfigured. PWMA4 9 Output (MOSI1) Schmitt Input/ Output (GPIOA4) Schmitt Input/ Output In reset, output is disabled, pull-up is enabled PWMA4 — This is one of six PWMA output pins. SPI 1 Master Out/Slave In — This serial data pin is an output from a master device and an input to a slave device. The master device places data on the MOSI line a half-cycle before the clock edge the slave device uses to latch the data. Port A GPIO — This GPIO pin can be individually programmed as an input or output pin. In the 56F8323, the default state after reset is PWMA4. In the 56F8123, the default state is not one of the functions offered and must be reconfigured. 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 25 Table 2-2 Signal and Package Information for the 64-Pin LQFP Signal Name Pin No. Type PWMA5 10 Output (SCLK1) Schmitt Input/ Output (GPIOA5) Schmitt Input/ Output State During Reset In reset, output is disabled, pull-up is enabled Signal Description PWMA5 — This is one of six PWMA output pins. SPI 1 Serial Clock — In the master mode, this pin serves as an output, clocking slaved listeners. In slave mode, this pin serves as the data clock input. A Schmitt trigger input is used for noise immunity. Port A GPIO — This GPIO pin can be individually programmed as an input or output pin. In the 56F8323, the default state after reset is PWMA5. In the 56F8123, the default state is not one of the functions offered and must be reconfigured. FAULTA0 13 (GPIOA6) Schmitt Input Input Schmitt Input/ Output FAULTA0 — This fault input pin is used for disabling selected PWMA outputs in cases where fault conditions originate off-chip. Port A GPIO — This GPIO pin can be individually programmed as an input or output pin. In the 56F8323, the default state after reset is FAULTA0. In the 56F8123, the default state is not one of the functions offered and must be reconfigured. FAULTA1 14 (GPIOA7) Schmitt Input Input Schmitt Input/ Output FAULTA1 — This fault input pin is used for disabling selected PWMA outputs in cases where fault conditions originate off-chip. Port A GPIO — This GPIO pin can be individually programmed as an input or output pin. In the 56F8323, the default state after reset is FAULTA1. In the 56F8123, the default state is not one of the functions offered and must be reconfigured. FAULTA2 (GPIOA8) 15 Schmitt Input Schmitt Input/ Output Input FAULTA2 — This fault input pin is used for disabling selected PWMA outputs in cases where fault conditions originate off-chip. Port A GPIO — This GPIO pin can be individually programmed as an input or output pin. In the 56F8323, the default state after reset is FAULTA2. In the 56F8123, the default state is not one of the functions offered and must be reconfigured. 56F8323 Technical Data, Rev. 17 26 Freescale Semiconductor Preliminary Signal Pins Table 2-2 Signal and Package Information for the 64-Pin LQFP Signal Name Pin No. Type ISA0 16 Schmitt Input (GPIOA9) State During Reset Input, pull-up enabled Schmitt Input/ Output Signal Description ISA0 — This input current status pin is used for top/bottom pulse width correction in complementary channel operation for PWMA. Port A GPIO — This GPIO pin can be individually programmed as an input or output pin. In the 56F8323, the default state after reset is ISA0. In the 56F8123, the default state is not one of the functions offered and must be reconfigured. ISA1 18 (GPIOA10) Schmitt Input Input, pull-up enabled Schmitt Input/ Output ISA1 — This input current status pin is used for top/bottom pulse width correction in complementary channel operation for PWMA. Port A GPIO — This GPIO pin can be individually programmed as an input or output pin. In the 56F8323, the default state after reset is ISA1. In the 56F8123, the default state is not one of the functions offered and must be reconfigured. ISA2 19 (GPIOA11) Schmitt Input Schmitt Input/ Output Input, pull-up enabled ISA2 — This input current status pin is used for top/bottom pulse width correction in complementary channel operation for PWMA. Port A GPIO — This GPIO pin can be individually programmed as an input or output pin. In the 56F8323, the default state after reset is ISA2. In the 56F8123, the default state is not one of the functions offered and must be reconfigured. ANA0 26 ANA1 27 ANA2 28 ANA3 29 ANA4 30 ANA5 31 ANA6 32 ANA7 33 VREFH 40 Input Analog Input ANA0 - 3 — Analog inputs to ADCA, Channel 0 Input Analog Input ANA4 - 7 — Analog inputs to ADCA, Channel 1 Schmitt Input Analog Input VREFH — Analog Reference Voltage High 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 27 Table 2-2 Signal and Package Information for the 64-Pin LQFP State During Reset Signal Name Pin No. Type VREFP 37 Input/ Output VREFMID 36 Analog Input/ VREFP, VREFMID & VREFN — Internal pins for voltage reference which Output are brought off-chip so that they can be bypassed. Connect to a 0.1μF ceramic low ESR capacitor VREFN 35 VREFLO 38 Schmitt Input Analog Input VREFLO — Analog Reference Voltage Low. This should normally be connected to a low-noise VSS. TEMP_SENSE 34 Output Analog Output Temperature Sense Diode — This signal connects to an on-chip diode that can be connected to one of the ADC inputs and used to monitor the temperature of the die. Must be bypassed with a 0.01μF capacitor CAN_RX 61 Schmitt Input Input, pull-up enabled FlexCAN Receive Data — This is the CAN input. This pin has an internal pull-up resistor. (GPIOC2) Schmitt Input/ Output Signal Description Port C GPIO — This GPIO pin can be individually programmed as an input or output pin. In the 56F8323, the default state after reset is CAN_RX. In the 56F8123, the default state is not one of the functions offered and must be reconfigured. CAN_TX 62 Open Drain Output Open Drain Output FlexCAN Transmit Data — CAN output with internal pull-up enable at reset.* * Note: If a pin is configured as open drain output mode, internal pull-up will automatically be disabled when it outputs low. Internal pull-up will be enabled unless it has been manually disabled by clearing the corresponding bit in the PUREN register of the GPIO module, when it outputs high. If a pin is configured as push-pull output mode, internal pull-up will automatically be disabled, whether it outputs low or high. (GPIOC3) Schmitt Input/ Output Port C GPIO — This GPIO pin can be individually programmed as an input or output pin. In the 56F8323, the default state after reset is CAN_TX. In the 56F8123, the default state is not one of the functions offered and must be reconfigured. 56F8323 Technical Data, Rev. 17 28 Freescale Semiconductor Preliminary Signal Pins Table 2-2 Signal and Package Information for the 64-Pin LQFP Signal Name Pin No. Type State During Reset TC0 1 Schmitt Input/ Output Input, pull-up enabled (TXD0) Input (GPIOC6) Schmitt Input/ Output Signal Description TC0 — Timer C, Channel 0 Transmit Data — SCI0 transmit data output Port C GPIO — This GPIO pin can be individually programmed as an input or output pin. After reset, the default state is TC0. TC1 64 Schmitt Input/ Output Input, pull-up enabled TC1 — Timer C, Channel 1 (RXD0) Schmitt Input Receive Data — SCI0 receive data input (GPIOC5) Schmitt Input/ Output Port C GPIO — This GPIO pin can be individually programmed as an input or output pin. After reset, the default state is TC1. TC3 63 (GPIOC4) Schmitt Input/ Output Input, pull-up enabled Schmitt Input/ Output TC3 — Timer C Channel 3 Port C GPIO — This GPIO pin can be individually programmed as an input or output pin. After reset, the default state is TC3. IRQA 12 (VPP) RESET Schmitt Input Input, pull-up enabled Input 2 Schmitt Input External Interrupt Request A — The IRQA input is an asynchronous external interrupt request during Stop and Wait mode operation. During other operating modes, it is a synchronized external interrupt request which indicates an external device is requesting service. It can be programmed to be level-sensitive or negative-edge-triggered VPP — This pin is used for Flash debugging purposes. Input, pull-up enabled Reset — This input is a direct hardware reset on the processor. When RESET is asserted low, the device is initialized and placed in the reset state. A Schmitt trigger input is used for noise immunity. The internal reset signal will be deasserted synchronous with the internal clocks after a fixed number of internal clocks. To ensure complete hardware reset, RESET and TRST should be asserted together. The only exception occurs in a debugging environment when a hardware device reset is required and the JTAG/EOnCE module must not be reset. In this case, assert RESET, but do not assert TRST. 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 29 Part 3 On-Chip Clock Synthesis (OCCS) 3.1 Introduction Refer to the OCCS chapter of the 56F8300 Peripheral User Manual for a full description of the OCCS. The material contained here identifies the specific features of the OCCS design. 3.2 External Clock Operation The system clock can be derived from an external crystal, ceramic resonator, or an external system clock signal. To generate a reference frequency using the internal oscillator, a reference crystal or ceramic resonator must be connected between the EXTAL and XTAL pins. 3.2.1 Crystal Oscillator The internal oscillator is designed to interface with a parallel-resonant crystal resonator in the frequency range specified for the external crystal in Table 10-15. A recommended crystal oscillator circuit is shown in Figure 3-1. Follow the crystal supplier’s recommendations when selecting a crystal, since crystal parameters determine the component values required to provide maximum stability and reliable start-up. The crystal and associated components should be mounted as near as possible to the EXTAL and XTAL pins to minimize output distortion and start-up stabilization time. Crystal Frequency = 4 - 8MHz (optimized for 8MHz) EXTAL XTAL Rz EXTAL XTAL Rz Note: If the operating temperature range is limited to below 85oC (105oC junction), then Rz = 10 Meg Ω CLKMODE = 0 CL1 Sample External Crystal Parameters: Rz = 750 KΩ CL2 Figure 3-1 Connecting to a Crystal Oscillator Note: The OCCS_COHL bit should be set to 1 when a crystal oscillator is used. The reset condition on the OCCS_COHL bit is 0. Please see the COHL bit in the Oscillator Control (OSCTL) register, discussed in the 56F8300 Peripheral User Manual. 3.2.2 Ceramic Resonator (Default) It is also possible to drive the internal oscillator with a ceramic resonator, assuming the overall system design can tolerate the reduced signal integrity. A typical ceramic resonator circuit is shown in Figure 3-2. Refer to the supplier’s recommendations when selecting a ceramic resonator and associated components. The resonator and components should be mounted as near as possible to the EXTAL and XTAL pins. 56F8323 Technical Data, Rev. 17 30 Freescale Semiconductor Preliminary Use of On-Chip Relaxation Oscillator Resonator Frequency = 4 - 8MHz (optimized for 8MHz) 3 Terminal 2 Terminal EXTAL XTAL Rz CL1 EXTAL XTAL Rz CL2 Sample External Ceramic Resonator Parameters: Rz = 750 KΩ CLKMODE = 0 C1 C2 Figure 3-2 Connecting a Ceramic Resonator Note: The OCCS_COHL bit must be set to 0 when a crystal resonator is used. The reset condition on the OCCS_COHL bit is 0. Please see the COHL bit in the Oscillator Control (OSCTL) register, discussed in the 56F8300 Peripheral User Manual. 3.2.3 External Clock Source The recommended method of connecting an external clock is illustrated in Figure 3-3. The external clock source is connected to XTAL and the EXTAL pin is grounded. The external clock input must be generated using a relatively low impedance driver, as the XTAL pin is actually the output pin of the oscillator (it has a very weak driver). XTAL EXTAL External Clock VSS Note: When using an external clocking source with this configuration, the “CLKMODE” and COHL bits of the OSCTL register should be set to 1. Figure 3-3 Connecting an External Clock Signal 3.3 Use of On-Chip Relaxation Oscillator An internal relaxtion oscillator can supply the reference frequency when an external frequency source of crystal is not used. During a boot or reset sequence, the relaxation oscillator is enabled by default, and the PRECS bit in the PLLCR word is set to 0. If an external oscillator is connected, the relaxation oscillator can be deselected instead by setting the PRECS bit in the PLLCR to 1. If a changeover between internal and external oscillators is required at start up, internal device circuits compensate for any asynchronous transitions between the two clock signals so that no glitches occur in the resulting master clock to the chip. When changing clocks, the user must ensure that the clock source is not switched until the desired clock is enabled and stable. To compensate for variances in the device manufacturing process, the accuracy of the relaxation oscillator can be incrementally adjusted to within + 0.1% of 8MHz by trimming an internal capacitor. Bits 0-9 of the OSCTL (oscillator control) register allow the user to set in an additional offset (trim) to this preset value 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 31 to increase or decrease capacitance. Upon power-up, the default value of this trim is 512 units. Each unit added or deleted changes the output frequency by about 0.1%, allowing incremental adjustment until the desired frequency accuracy is achieved. The internal oscillator is calibrated at the factory to 8MHz and the TRIM value is stored in the Flash information block and loaded to the FMOPT1 register at reset. When using the relaxation oscillator, the boot code should read the FMOPT1 register and set this value as OSCTL TRIM. For further information, see the 56F8300 Peripherals User Manual. 3.4 Internal Clock Operation At reset, both oscillators will be powered up; however, the relaxation oscillator will be the default clock reference for the PLL. Software should power down the block not being used and program the PLL for the correct frequency. CLK_MODE MUX Relaxation OSC XTAL MUX Crystal OSC ZSRC PRECS PLLCID PLL x (1 to 128) FOUT ÷2 FOUT/2 Postscaler ÷ (1, 2, 4, 8) FEEDBACK MSTR_OSC PLLCOD PLLDB FREF Prescaler ÷ (1, 2, 4, 8) MUX EXTAL SYS_CLK2 source to the SIM Postscaler CLK Bus Interface & Control Bus Interface LCK Lock Detector Loss of Reference Clock Detector loss of reference clock interrupt Figure 3-4 Internal Clock Operation 56F8323 Technical Data, Rev. 17 32 Freescale Semiconductor Preliminary Registers 3.5 Registers When referring to the register definitions for the OCCS in the 56F8300 Peripheral User Manual, use the register definitions with the internal Relaxation Oscillator, since the 56F8323 and 56F8123 contain this oscillator. Part 4 Memory Map 4.1 Introduction The 56F8323 and 56F8123 devices are 16-bit motor-control chips based on the 56800E core. These parts use a Harvard-style architecture with two independent memory spaces for Data and Program. On-chip RAM and Flash memories are used in both spaces. This section provides memory maps for: • • Program Address Space, including the Interrupt Vector Table Data Address Space, including the EOnCE Memory and Peripheral Memory Maps On-chip memory sizes for the device are summarized in Table 4-1. Flash memories’ restrictions are identified in the “Use Restrictions” column of Table 4-1. Note: Data Flash and Program RAM are NOT available on the 56F8123 device. Table 4-1 Chip Memory Configurations On-Chip Memory 56F8323 56F8123 Use Restrictions Program Flash 32KB 32KB Erase / Program via Flash interface unit and word writes to CDBW Data Flash 8KB — Erase / Program via Flash interface unit and word writes to CDBW. Data Flash can be read via either CDBR or XDB2, but not by both simultaneously Program RAM 4KB — None Data RAM 8KB 8KB None Program Boot Flash 8KB 8KB Erase / Program via Flash Interface unit and word writes to CDBW 4.2 Program Map The Program Memory map is located in Table 4-2. The operating mode control bits (MA and MB) in the Operating Mode Register (OMR) control the Program Memory map. Because the 56F8323 and 56F8123 do not include EMI, the OMR MA bit, which is used to decide internal or external BOOT, will have no effect on the Program Memory Map. OMR MB reflects the security status of the Program Flash. After reset, changing the OMR MB bit will have no effect on the Program Flash. 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 33 Note: Program RAM is NOT available on the 56F8123 device. Table 4-2 Program Memory Map at Reset Begin/End Address Memory Allocation P: $1F FFFF P: $03 0000 RESERVED P: $02 FFFF P: $02 F800 On-Chip Program RAM 4KB P: $02 F7FF P: $02 1000 RESERVED P: $02 0FFF P: $02 0000 Boot Flash 8KB Cop Reset Address = $02 0002 Boot Location = $02 0000 P: $01 FFFF P: $00 4000 RESERVED P: $00 3FFF P: $00 0000 Internal Program Flash 32KB 4.3 Interrupt Vector Table Table 4-3 provides the device’s reset and interrupt priority structure, including on-chip peripherals. The table is organized with higher-priority vectors at the top and lower-priority interrupts lower in the table. As indicated, the priority of an interrupt can be assigned to different levels, allowing some control over interrupt priorities. All level 3 interrupts will be serviced before level 2, and so on. For a selected priority level, the lowest vector number has the highest priority. The location of the vector table is determined by the Vector Base Address (VBA). Please see Part 5.6.11 for the reset value of the VBA. In some configurations, the reset address and COP reset address will correspond to vector 0 and 1 of the interrupt vector table. In these instances, the first two locations in the vector table must contain branch or JMP instructions. All other entries must contain JSR instructions. Note: PWMA, CAN and Quadrature Decoder are NOT available on the 56F8123 device. Table 4-3 Interrupt Vector Table Contents1 Peripheral Vector Number Priority Level Vector Base Address + Interrupt Function Reserved for Reset Overlay2 Reserved for COP Reset Overlay2 core 2 3 P:$04 Illegal Instruction core 3 3 P:$06 SW Interrupt 3 56F8323 Technical Data, Rev. 17 34 Freescale Semiconductor Preliminary Interrupt Vector Table Table 4-3 Interrupt Vector Table Contents1 (Continued) Peripheral Vector Number Priority Level Vector Base Address + Interrupt Function core 4 3 P:$08 HW Stack Overflow core 5 3 P:$0A Misaligned Long Word Access core 6 1-3 P:$0C OnCE Step Counter core 7 1-3 P:$0E OnCE Breakpoint Unit 0 Reserved core 9 1-3 P:$12 OnCE Trace Buffer core 10 1-3 P:$14 OnCE Transmit Register Empty core 11 1-3 P:$16 OnCE Receive Register Full Reserved core 14 2 P:$1C SW Interrupt 2 core 15 1 P:$1E SW Interrupt 1 core 16 0 P:$20 SW Interrupt 0 core 17 0-2 P:$22 IRQA Reserved LVI 20 0-2 P:$28 Low-Voltage Detector (power sense) PLL 21 0-2 P:$2A PLL FM 22 0-2 P:$2C FM Access Error Interrupt FM 23 0-2 P:$2E FM Command Complete FM 24 0-2 P:$30 FM Command, data and address Buffers Empty Reserved FLEXCAN 26 0-2 P:$34 FLEXCAN Bus Off FLEXCAN 27 0-2 P:$36 FLEXCAN Error FLEXCAN 28 0-2 P:$38 FLEXCAN Wake Up FLEXCAN 29 0-2 P:$3A FLEXCAN Message Buffer Interrupt Reserved GPIOC 33 0-2 P:$42 GPIO C GPIOB 34 0-2 P:$44 GPIO B GPIOA 35 0-2 P:$46 GPIO A Reserved SPI1 38 0-2 P:$4C SPI 1 Receiver Full SPI1 39 0-2 P:$4E SPI 1 Transmitter Empty SPI0 40 0-2 P:$50 SPI 0 Receiver Full SPI0 41 0-2 P:$52 SPI 0 Transmitter Empty SCI1 42 0-2 P:$54 SCI 1 Transmitter Empty SCI1 43 0-2 P:$56 SCI 1Transmitter Idle Reserved 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 35 Table 4-3 Interrupt Vector Table Contents1 (Continued) Peripheral Vector Number Priority Level Vector Base Address + Interrupt Function SCI1 45 0-2 P:$5A SCI 1 Receiver Error SCI1 46 0-2 P:$5C SCI 1 Receiver Full Reserved DEC0 49 0-2 P:$62 Quadrature Decoder #0 Home Switch or Watchdog DEC0 50 0-2 P:$64 Quadrature Decoder #0 INDEX Pulse Reserved TMRC 56 0-2 P:$70 Timer C Channel 0 TMRC 57 0-2 P:$72 Timer C Channel 1 TMRC 58 0-2 P:$74 Timer C Channel 2 TMRC 59 0-2 P:$76 Timer C Channel 3 Reserved TMRA 64 0-2 P:$80 Timer A Channel 0 TMRA 65 0-2 P:$82 Timer A Channel 1 TMRA 66 0-2 P:$84 Timer A Channel 2 TMRA 67 0-2 P:$86 Timer A Channel 3 SCI0 68 0-2 P:$88 SCI 0 Transmitter Empty SCI0 69 0-2 P:$8A SCI 0 Transmitter Idle Reserved SCI0 71 0-2 P:$8E SCI 0 Receiver Error SCI0 72 0-2 P:$90 SCI 0 Receiver Full Reserved ADCA 74 0-2 P:$94 ADC A Conversion Complete / End of Scan Reserved ADCA 76 0-2 P:$98 ADC A Zero Crossing or Limit Error Reserved PWMA 78 0-2 P:$9C Reload PWM A Reserved PWMA 80 0-2 P:$A0 PWM A Fault core 81 -1 P:$A2 SW Interrupt LP 82 0-2 P:$A4 1. Two words are allocated for each entry in the vector table. This does not allow the full address range to be referenced from the vector table, providing only 19 bits of address. 2. If the VBA is set to $0200, the first two locations of the vector table will overlay the chip reset addresses. 56F8323 Technical Data, Rev. 17 36 Freescale Semiconductor Preliminary Data Map 4.4 Data Map Note: Data Flash is NOT available on the 56F8122 device. Table 4-4 Data Memory Map1 Begin/End Address Memory Allocation X:$FF FFFF X:$FF FF00 EOnCE 256 locations allocated X:$FF FEFF X:$01 0000 RESERVED X:$00 FFFF X:$00 F000 On-Chip Peripherals 4096 locations allocated X:$00 EFFF X:$00 2000 RESERVED X:$00 1FFF X:$00 1000 On-Chip Data Flash 8KB X:$00 0FFF X:$00 0000 On-Chip Data RAM 8KB2 1. All addresses are 16-bit Word addresses. 2. The Data RAM is organized as a 2K x 32-bit memory to allow single-cycle, long-word operations. 4.5 Flash Memory Map Figure 4-1 illustrates the Flash Memory (FM) map on the system bus. Flash Memory is divided into three functional blocks. The Program and boot memories reside on the Program Memory buses. They are controlled by one set of banked registers. Data Memory Flash resides on the Data Memory buses and is controlled separately by its own set of banked registers. The top nine words of the Program Memory Flash are treated as special memory locations. The content of these words is used to control the operation of the Flash controller. Because these words are part of the Flash Memory content, their state is maintained during power-down and reset. During chip initialization, the content of these memory locations is loaded into Flash Memory control registers, detailed in the Flash Memory chapter of the 56F8300 Peripheral User Manual. These configuration parameters are located between $00_3FF7 and $00_3FFF. 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 37 Data Memory Program Memory BOOT_FLASH_START + $0FFF FM_BASE + $14 8KB Boot BOOT_FLASH_START = $02_0000 FM_BASE + $00 Reserved Banked Registers Unbanked Registers DATA_FLASH_START + $0FFF 8KB DATA_FLASH_START + $0000 Configure Field FM_PROG_MEM_TOP = $00_3FFF Block 0 Odd Block 0 Even Note: Data Flash is NOT available in the 56F8123 device. ... PROG_FLASH_START + $00_3FFF PROG_FLASH_START + $00_3FF7 PROG_FLASH_START + $00_3FF6 32KB BLOCK 0 Odd (2 Bytes) $00_0003 BLOCK 0 Even (2 Bytes) $00_0002 BLOCK 0 Odd (2 Bytes) $00_0001 BLOCK 0 Even (2 Bytes) $00_0000 PROG_FLASH_START = $00_0000 Figure 4-1 Flash Array Memory Maps Table 4-5 shows the page and sector sizes used within each Flash memory block on the chip. Note: Data Flash is NOT available on the 56F8123 device. Table 4-5. Flash Memory Partitions Flash Size Sectors Sector Size Page Size Program Flash 32KB 16 1K x 16 bits 512 x 16 bits Data Flash 8KB 16 256 x 16 bits 256 x 16 bits Boot Flash 8KB 4 1K x 16 bits 256 x 16 bits Please see the 56F8300 Peripheral User Manual for additional Flash information. 56F8323 Technical Data, Rev. 17 38 Freescale Semiconductor Preliminary EOnCE Memory Map 4.6 EOnCE Memory Map Table 4-6 EOnCE Memory Map Address Register Acronym Register Name Reserved X:$FF FF8A OESCR External Signal Control Register Reserved X:$FF FF8E OBCNTR Breakpoint Unit [0] Counter Reserved X:$FF FF90 OBMSK (32 bits) Breakpoint 1 Unit [0] Mask Register X:$FF FF91 — Breakpoint 1 Unit [0] Mask Register X:$FF FF92 OBAR2 (32 bits) Breakpoint 2 Unit [0] Address Register X:$FF FF93 — Breakpoint 2 Unit [0] Address Register X:$FF FF94 OBAR1 (24 bits) Breakpoint 1 Unit [0] Address Register X:$FF FF95 — Breakpoint 1 Unit [0] Address Register X:$FF FF96 OBCR (24 bits) Breakpoint Unit [0] Control Register X:$FF FF97 — Breakpoint Unit [0] Control Register X:$FF FF98 OTB (21-24 bits/stage) Trace Buffer Register Stages X:$FF FF99 — Trace Buffer Register Stages X:$FF FF9A OTBPR (8 bits) Trace Buffer Pointer Register X:$FF FF9B OTBCR Trace Buffer Control Register X:$FF FF9C OBASE (8 bits) Peripheral Base Address Register X:$FF FF9D OSR Status Register X:$FF FF9E OSCNTR (24 bits) Instruction Step Counter X:$FF FF9F — Instruction Step Counter X:$FF FFA0 OCR (bits) Control Register Reserved X:$FF FFFC OCLSR (8 bits) Core Lock / Unlock Status Register X:$FF FFFD OTXRXSR (8 bits) Transmit and Receive Status and Control Register X:$FF FFFE OTX / ORX (32 bits) Transmit Register / Receive Register X:$FF FFFF OTX1 / ORX1 Transmit Register Upper Word Receive Register Upper Word 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 39 4.7 Peripheral Memory Mapped Registers On-chip peripheral registers are part of the data memory map on the 56800E series. These locations may be accessed with the same addressing modes used for ordinary Data memory, except all peripheral registers should be read/written using word accesses only. Table 4-7 summarizes base addresses for the set of peripherals on the 56F8323 and 56F8123 devices. Peripherals are listed in order of the base address. The following tables list all of the peripheral registers required to control or access the peripherals. Note: Features in italics are NOT available in the 56F8123 device. Table 4-7 Data Memory Peripheral Base Address Map Summary Peripheral Prefix Base Address Table Number Timer A TMRA X:$00 F040 4-8 Timer C TMRC X:$00 F0C0 4-9 PWM A PWMA X:$00 F140 4-10 Quadrature Decoder 0 DEC0 X:$00 F180 4-11 ITCN ITCN X:$00 F1A0 4-12 ADC A ADCA X:$00 F200 4-13 Temperature Sensor TSENSOR X:$00 F270 4-14 SCI #0 SCI0 X:$00 F280 4-15 SCI #1 SCI1 X:$00 F290 4-16 SPI #0 SPI0 X:$00 F2A0 4-17 SPI #1 SPI1 X:$00 F2B0 4-18 COP COP X:$00 F2C0 4-19 PLL, OSC CLKGEN X:$00 F2D0 4-20 GPIO Port A GPIOA X:$00 F2E0 4-21 GPIO Port B GPIOB X:$00 F300 4-22 GPIO Port C GPIOC X:$00 F310 4-23 SIM SIM X:$00 F350 4-24 Power Supervisor LVI X:$00 F360 4-25 FM FM X:$00 F400 4-26 FlexCAN FC X:$00 F800 4-27 56F8323 Technical Data, Rev. 17 40 Freescale Semiconductor Preliminary Peripheral Memory Mapped Registers Table 4-8 Quad Timer A Registers Address Map (TMRA_BASE = $00 F040) Register Acronym Address Offset Register Description TMRA0_CMP1 $0 Compare Register 1 TMRA0_CMP2 $1 Compare Register 2 TMRA0_CAP $2 Capture Register TMRA0_LOAD $3 Load Register TMRA0_HOLD $4 Hold Register TMRA0_CNTR $5 Counter Register TMRA0_CTRL $6 Control Register TMRA0_SCR $7 Status and Control Register TMRA0_CMPLD1 $8 Comparator Load Register 1 TMRA0_CMPLD2 $9 Comparator Load Register 2 TMRA0_COMSCR $A Comparator Status and Control Register Reserved TMRA1_CMP1 $10 Compare Register 1 TMRA1_CMP2 $11 Compare Register 2 TMRA1_CAP $12 Capture Register TMRA1_LOAD $13 Load Register TMRA1_HOLD $14 Hold Register TMRA1_CNTR $15 Counter Register TMRA1_CTRL $16 Control Register TMRA1_SCR $17 Status and Control Register TMRA1_CMPLD1 $18 Comparator Load Register 1 TMRA1_CMPLD2 $19 Comparator Load Register 2 TMRA1_COMSCR $1A Comparator Status and Control Register Reserved TMRA2_CMP1 $20 Compare Register 1 TMRA2_CMP2 $21 Compare Register 2 TMRA2_CAP $22 Capture Register TMRA2_LOAD $23 Load Register TMRA2_HOLD $24 Hold Register TMRA2_CNTR $25 Counter Register TMRA2_CTRL $26 Control Register TMRA2_SCR $27 Status and Control Register TMRA2_CMPLD1 $28 Comparator Load Register 1 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 41 Table 4-8 Quad Timer A Registers Address Map (Continued) (TMRA_BASE = $00 F040) Register Acronym Address Offset Register Description TMRA2_CMPLD2 $29 Comparator Load Register 2 TMRA2_COMSCR $2A Comparator Status and Control Register Reserved TMRA3_CMP1 $30 Compare Register 1 TMRA3_CMP2 $31 Compare Register 2 TMRA3_CAP $32 Capture Register TMRA3_LOAD $33 Load Register TMRA3_HOLD $34 Hold Register TMRA3_CNTR $35 Counter Register TMRA3_CTRL $36 Control Register TMRA3_SCR $37 Status and Control Register TMRA3_CMPLD1 $38 Comparator Load Register 1 TMRA3_CMPLD2 $39 Comparator Load Register 2 TMRA3_COMSCR $3A Comparator Status and Control Register Table 4-9 Quad Timer C Registers Address Map (TMRC_BASE = $00 F0C0) Register Acronym Address Offset Register Description TMRC0_CMP1 $0 Compare Register 1 TMRC0_CMP2 $1 Compare Register 2 TMRC0_CAP $2 Capture Register TMRC0_LOAD $3 Load Register TMRC0_HOLD $4 Hold Register TMRC0_CNTR $5 Counter Register TMRC0_CTRL $6 Control Register TMRC0_SCR $7 Status and Control Register TMRC0_CMPLD1 $8 Comparator Load Register 1 TMRC0_CMPLD2 $9 Comparator Load Register 2 TMRC0_COMSCR $A Comparator Status and Control Register Reserved TMRC1_CMP1 $10 Compare Register 1 TMRC1_CMP2 $11 Compare Register 2 TMRC1_CAP $12 Capture Register TMRC1_LOAD $13 Load Register 56F8323 Technical Data, Rev. 17 42 Freescale Semiconductor Preliminary Peripheral Memory Mapped Registers Table 4-9 Quad Timer C Registers Address Map (Continued) (TMRC_BASE = $00 F0C0) Register Acronym Address Offset Register Description TMRC1_HOLD $14 Hold Register TMRC1_CNTR $15 Counter Register TMRC1_CTRL $16 Control Register TMRC1_SCR $17 Status and Control Register TMRC1_CMPLD1 $18 Comparator Load Register 1 TMRC1_CMPLD2 $19 Comparator Load Register 2 TMRC1_COMSCR $1A Comparator Status and Control Register Reserved TMRC2_CMP1 $20 Compare Register 1 TMRC2_CMP2 $21 Compare Register 2 TMRC2_CAP $22 Capture Register TMRC2_LOAD $23 Load Register TMRC2_HOLD $24 Hold Register TMRC2_CNTR $25 Counter Register TMRC2_CTRL $26 Control Register TMRC2_SCR $27 Status and Control Register TMRC2_CMPLD1 $28 Comparator Load Register 1 TMRC2_CMPLD2 $29 Comparator Load Register 2 TMRC2_COMSCR $2A Comparator Status and Control Register Reserved TMRC3_CMP1 $30 Compare Register 1 TMRC3_CMP2 $31 Compare Register 2 TMRC3_CAP $32 Capture Register TMRC3_LOAD $33 Load Register TMRC3_HOLD $34 Hold Register TMRC3_CNTR $35 Counter Register TMRC3_CTRL $36 Control Register TMRC3_SCR $37 Status and Control Register TMRC3_CMPLD1 $38 Comparator Load Register 1 TMRC3_CMPLD2 $39 Comparator Load Register 2 TMRC3_COMSCR $3A Comparator Status and Control Register 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 43 Table 4-10 Pulse Width Modulator A Registers Address Map (PWMA_BASE = $00 F140) PWM is NOT available in the 56F8123 device Register Acronym Address Offset Register Description PWMA_PMCTRL $0 Control Register PWMA_PMFCTRL $1 Fault Control Register PWMA_PMFSA $2 Fault Status Acknowledge Register PWMA_PMOUT $3 Output Control Register PWMA_PMCNT $4 Counter Register PWMA_PWMCM $5 Counter Modulo Register PWMA_PWMVAL0 $6 Value Register 0 PWMA_PWMVAL1 $7 Value Register 1 PWMA_PWMVAL2 $8 Value Register 2 PWMA_PWMVAL3 $9 Value Register 3 PWMA_PWMVAL4 $A Value Register 4 PWMA_PWMVAL5 $B Value Register 5 PWMA_PMDEADTM $C Dead Time Register PWMA_PMDISMAP1 $D Disable Mapping Register 1 PWMA_PMDISMAP2 $E Disable Mapping Register 2 PWMA_PMCFG $F Configure Register PWMA_PMCCR $10 Channel Control Register PWMA_PMPORT $11 Port Register PWMA_PMICCR $12 Internal Correction Control Register Table 4-11 Quadrature Decoder 0 Registers Address Map (DEC0_BASE = $00 F180) Quadrature Decoder is NOT available in the 56F8123 device Register Acronym Address Offset Register Description DEC0_DECCR $0 Decoder Control Register DEC0_FIR $1 Filter Interval Register DEC0_WTR $2 Watchdog Time-out Register DEC0_POSD $3 Position Difference Counter Register DEC0_POSDH $4 Position Difference Counter Hold Register DEC0_REV $5 Revolution Counter Register DEC0_REVH $6 Revolution Hold Register DEC0_UPOS $7 Upper Position Counter Register DEC0_LPOS $8 Lower Position Counter Register 56F8323 Technical Data, Rev. 17 44 Freescale Semiconductor Preliminary Peripheral Memory Mapped Registers Table 4-11 Quadrature Decoder 0 Registers Address Map (Continued) (DEC0_BASE = $00 F180) Quadrature Decoder is NOT available in the 56F8123 device Register Acronym Address Offset Register Description DEC0_UPOSH $9 Upper Position Hold Register DEC0_LPOSH $A Lower Position Hold Register DEC0_UIR $B Upper Initialization Register DEC0_LIR $C Lower Initialization Register DEC0_IMR $D Input Monitor Register Table 4-12 Interrupt Control Registers Address Map (ITCN_BASE = $00 F1A0) Register Acronym Address Offset Register Description IPR0 $0 Interrupt Priority Register 0 IPR1 $1 Interrupt Priority Register 1 IPR2 $2 Interrupt Priority Register 2 IPR3 $3 Interrupt Priority Register 3 IPR4 $4 Interrupt Priority Register 4 IPR5 $5 Interrupt Priority Register 5 IPR6 $6 Interrupt Priority Register 6 IPR7 $7 Interrupt Priority Register 7 IPR8 $8 Interrupt Priority Register 8 IPR9 $9 Interrupt Priority Register 9 VBA $A Vector Base Address Register FIM0 $B Fast Interrupt Match Register 0 FIVAL0 $C Fast Interrupt Vector Address Low 0 Register FIVAH0 $D Fast Interrupt Vector Address High 0 Register FIM1 $E Fast Interrupt Match Register 1 FIVAL1 $F Fast Interrupt Vector Address Low 1 Register FIVAH1 $10 Fast Interrupt Vector Address High 1 Register IRQP0 $11 IRQ Pending Register 0 IRQP1 $12 IRQ Pending Register 1 IRQP2 $13 IRQ Pending Register 2 IRQP3 $14 IRQ Pending Register 3 IRQP4 $15 IRQ Pending Register 4 IRQP5 $16 IRQ Pending Register 5 Reserved ICTL $1D Interrupt Control Register 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 45 Table 4-13 Analog-to-Digital Converter Registers Address Map (ADCA_BASE = $00 F200) Register Acronym Address Offset Register Description ADCA_CR1 $0 Control Register 1 ADCA_CR2 $1 Control Register 2 ADCA_ZCC $2 Zero Crossing Control Register ADCA_LST 1 $3 Channel List Register 1 ADCA_LST 2 $4 Channel List Register 2 ADCA_SDIS $5 Sample Disable Register ADCA_STAT $6 Status Register ADCA_LSTAT $7 Limit Status Register ADCA_ZCSTAT $8 Zero Crossing Status Register ADCA_RSLT 0 $9 Result Register 0 ADCA_RSLT 1 $A Result Register 1 ADCA_RSLT 2 $B Result Register 2 ADCA_RSLT 3 $C Result Register 3 ADCA_RSLT 4 $D Result Register 4 ADCA_RSLT 5 $E Result Register 5 ADCA_RSLT 6 $F Result Register 6 ADCA_RSLT 7 $10 Result Register 7 ADCA_LLMT 0 $11 Low Limit Register 0 ADCA_LLMT 1 $12 Low Limit Register 1 ADCA_LLMT 2 $13 Low Limit Register 2 ADCA_LLMT 3 $14 Low Limit Register 3 ADCA_LLMT 4 $15 Low Limit Register 4 ADCA_LLMT 5 $16 Low Limit Register 5 ADCA_LLMT 6 $17 Low Limit Register 6 ADCA_LLMT 7 $18 Low Limit Register 7 ADCA_HLMT 0 $19 High Limit Register 0 ADCA_HLMT 1 $1A High Limit Register 1 ADCA_HLMT 2 $1B High Limit Register 2 ADCA_HLMT 3 $1C High Limit Register 3 ADCA_HLMT 4 $1D High Limit Register 4 ADCA_HLMT 5 $1E High Limit Register 5 ADCA_HLMT 6 $1F High Limit Register 6 ADCA_HLMT 7 $20 High Limit Register 7 56F8323 Technical Data, Rev. 17 46 Freescale Semiconductor Preliminary Peripheral Memory Mapped Registers Table 4-13 Analog-to-Digital Converter Registers Address Map (Continued) (ADCA_BASE = $00 F200) Register Acronym Address Offset Register Description ADCA_OFS 0 $21 Offset Register 0 ADCA_OFS 1 $22 Offset Register 1 ADCA_OFS 2 $23 Offset Register 2 ADCA_OFS 3 $24 Offset Register 3 ADCA_OFS 4 $25 Offset Register 4 ADCA_OFS 5 $26 Offset Register 5 ADCA_OFS 6 $27 Offset Register 6 ADCA_OFS 7 $28 Offset Register 7 ADCA_POWER $29 Power Control Register ADCA_CAL $2A ADC Calibration Register Table 4-14 Temperature Sensor Register Address Map (TSENSOR_BASE = $00 F270) Temperature Sensor is NOT available in the 56F8123 device Register Acronym TSENSOR_CNTL Address Offset $0 Register Description Control Register Table 4-15 Serial Communication Interface 0 Registers Address Map (SCI0_BASE = $00 F280) Register Acronym Address Offset Register Description SCI0_SCIBR $0 Baud Rate Register SCI0_SCICR $1 Control Register Reserved SCI0_SCISR $3 Status Register SCI0_SCIDR $4 Data Register Table 4-16 Serial Communication Interface 1 Registers Address Map (SCI1_BASE = $00 F290) Register Acronym Address Offset Register Description SCI1_SCIBR $0 Baud Rate Register SCI1_SCICR $1 Control Register Reserved SCI1_SCISR $3 Status Register SCI1_SCIDR $4 Data Register 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 47 Table 4-17 Serial Peripheral Interface 0 Registers Address Map (SPI0_BASE = $00 F2A0) Register Acronym Address Offset Register Description SPI0_SPSCR $0 Status and Control Register SPI0_SPDSR $1 Data Size Register SPI0_SPDRR $2 Data Receive Register SPI0_SPDTR $3 Data Transmitter Register Table 4-18 Serial Peripheral Interface 1 Registers Address Map (SPI1_BASE = $00 F2B0) Register Acronym Address Offset Register Description SPI1_SPSCR $0 Status and Control Register SPI1_SPDSR $1 Data Size Register SPI1_SPDRR $2 Data Receive Register SPI1_SPDTR $3 Data Transmitter Register Table 4-19 Computer Operating Properly Registers Address Map (COP_BASE = $00 F2C0) Register Acronym Address Offset Register Description COPCTL $0 Control Register COPTO $1 Time-Out Register COPCTR $2 Counter Register Table 4-20 Clock Generation Module Registers Address Map (CLKGEN_BASE = $00 F2D0) Register Acronym Address Offset Register Description PLLCR $0 Control Register PLLDB $1 Divide-By Register PLLSR $2 Status Register Reserved SHUTDOWN $4 Shutdown Register OSCTL $5 Oscillator Control Register 56F8323 Technical Data, Rev. 17 48 Freescale Semiconductor Preliminary Peripheral Memory Mapped Registers Table 4-21 GPIOA Registers Address Map (GPIOA_BASE = $00 F2E0) Register Acronym Address Offset Register Description Reset Value GPIOA_PUR $0 Pull-up Enable Register 0 x 0FFF GPIOA_DR $1 Data Register 0 x 0000 GPIOA_DDR $2 Data Direction Register 0 x 0000 GPIOA_PER $3 Peripheral Enable Register 0 x 0FFF GPIOA_IAR $4 Interrupt Assert Register 0 x 0000 GPIOA_IENR $5 Interrupt Enable Register 0 x 0000 GPIOA_IPOLR $6 Interrupt Polarity Register 0 x 0000 GPIOA_IPR $7 Interrupt Pending Register 0 x 0000 GPIOA_IESR $8 Interrupt Edge-Sensitive Register 0 x 0000 GPIOA_PPMODE $9 Push-Pull Mode Register 0 x 0FFF GPIOA_RAWDATA $A Raw Data Input Register — Table 4-22 GPIOB Registers Address Map (GPIOB_BASE = $00 F300) Register Acronym Address Offset Register Description Reset Value GPIOB_PUR $0 Pull-up Enable Register 0 x 00FF GPIOB_DR $1 Data Register 0 x 0000 GPIOB_DDR $2 Data Direction Register 0 x 0000 GPIOB_PER $3 Peripheral Enable Register 0 x 00FF GPIOB_IAR $4 Interrupt Assert Register 0 x 0000 GPIOB_IENR $5 Interrupt Enable Register 0 x 0000 GPIOB_IPOLR $6 Interrupt Polarity Register 0 x 0000 GPIOB_IPR $7 Interrupt Pending Register 0 x 0000 GPIOB_IESR $8 Interrupt Edge-Sensitive Register 0 x 0000 GPIOB_PPMODE $9 Push-Pull Mode Register 0 x 00FF GPIOB_RAWDATA $A Raw Data Input Register — 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 49 Table 4-23 GPIOC Registers Address Map (GPIOC_BASE = $00 F310) Register Acronym Address Offset Register Description Reset Value GPIOC_PUR $0 Pull-up Enable Register 0 x 007C GPIOC_DR $1 Data Register 0 x 0000 GPIOC_DDR $2 Data Direction Register 0 x 0000 GPIOC_PER $3 Peripheral Enable Register 0 x 007F GPIOC_IAR $4 Interrupt Assert Register 0 x 0000 GPIOC_IENR $5 Interrupt Enable Register 0 x 0000 GPIOC_IPOLR $6 Interrupt Polarity Register 0 x 0000 GPIOC_IPR $7 Interrupt Pending Register 0 x 0000 GPIOC_IESR $8 Interrupt Edge-Sensitive Register 0 x 0000 GPIOC_PPMODE $9 Push-Pull Mode Register 0 x 007F GPIOC_RAWDATA $A Raw Data Input Register — Table 4-24 System Integration Module Registers Address Map (SIM_BASE = $00 F350) Register Acronym Address Offset Register Description SIM_CONTROL $0 Control Register SIM_RSTSTS $1 Reset Status Register SIM_SCR0 $2 Software Control Register 0 SIM_SCR1 $3 Software Control Register 1 SIM_SCR2 $4 Software Control Register 2 SIM_SCR3 $5 Software Control Register 3 SIM_MSH_ID $6 Most Significant Half JTAG ID SIM_LSH_ID $7 Least Significant Half JTAG ID SIM_PUDR $8 Pull-up Disable Register Reserved SIM_CLKOSR $A Clock Out Select Register SIM_GPS $B GPIO Peripheral Select Register SIM_PCE $C Peripheral Clock Enable Register SIM_ISALH $D I/O Short Address Location High Register SIM_ISALL $E I/O Short Address Location Low Register 56F8323 Technical Data, Rev. 17 50 Freescale Semiconductor Preliminary Peripheral Memory Mapped Registers Table 4-25 Power Supervisor Registers Address Map (LVI_BASE = $00 F360) Register Acronym Address Offset Register Description LVI_CONTROL $0 Control Register LVI_STATUS $1 Status Register Table 4-26 Flash Module Registers Address Map (FM_BASE = $00 F400) Register Acronym Address Offset Register Description FMCLKD $0 Clock Divider Register FMMCR $1 Module Control Register Reserved FMSECH $3 Security High Half Register FMSECL $4 Security Low Half Register Reserved Reserved FMPROT $10 Protection Register (Banked) FMPROTB $11 Protection Boot Register (Banked) Reserved FMUSTAT $13 User Status Register (Banked) FMCMD $14 Command Register (Banked) Reserved Reserved FMOPT 0 $1A 16-Bit Information Option Register 0 Hot temperature ADC reading of Temperature Sensor; value set during factory test FMOPT 1 $1B 16-Bit Information Option Register 1 Trim cap setting of the relaxation oscillator FMOPT 2 $1C 16-Bit Information Option Register 2 Room temperature ADC reading of Temperature Sensor; value set during factory test 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 51 Table 4-27 FlexCAN Registers Address Map (FC_BASE = $00 F800) FlexCAN is NOT available in the 56F8123 device Register Acronym FCMCR Address Offset $0 Register Description Module Configuration Register Reserved FCCTL0 $3 Control Register 0 Register FCCTL1 $4 Control Register 1 Register FCTMR $5 Free-Running Timer Register FCMAXMB $6 Maximum Message Buffer Configuration Register Reserved FCRXGMASK_H $8 Receive Global Mask High Register FCRXGMASK_L $9 Receive Global Mask Low Register FCRX14MASK_H $A Receive Buffer 14 Mask High Register FCRX14MASK_L $B Receive Buffer 14 Mask Low Register FCRX15MASK_H $C Receive Buffer 15 Mask High Register FCRX15MASK_L $D Receive Buffer 15 Mask Low Register Reserved FCSTATUS $10 Error and Status Register FCIMASK1 $11 Interrupt Masks 1 Register FCIFLAG1 $12 Interrupt Flags 1 Register FCR/T_ERROR_CNTRS $13 Receive and Transmit Error Counters Register Reserved Reserved Reserved FCMB0_CONTROL $40 Message Buffer 0 Control / Status Register FCMB0_ID_HIGH $41 Message Buffer 0 ID High Register FCMB0_ID_LOW $42 Message Buffer 0 ID Low Register FCMB0_DATA $43 Message Buffer 0 Data Register FCMB0_DATA $44 Message Buffer 0 Data Register FCMB0_DATA $45 Message Buffer 0 Data Register FCMB0_DATA $46 Message Buffer 0 Data Register Reserved FCMSB1_CONTROL $48 Message Buffer 1 Control / Status Register FCMSB1_ID_HIGH $49 Message Buffer 1 ID High Register FCMSB1_ID_LOW $4A Message Buffer 1 ID Low Register 56F8323 Technical Data, Rev. 17 52 Freescale Semiconductor Preliminary Peripheral Memory Mapped Registers Table 4-27 FlexCAN Registers Address Map (Continued) (FC_BASE = $00 F800) FlexCAN is NOT available in the 56F8123 device Register Acronym Address Offset Register Description FCMB1_DATA $4B Message Buffer 1 Data Register FCMB1_DATA $4C Message Buffer 1 Data Register FCMB1_DATA $4D Message Buffer 1 Data Register FCMB1_DATA $4E Message Buffer 1 Data Register Reserved FCMB2_CONTROL $50 Message Buffer 2 Control / Status Register FCMB2_ID_HIGH $51 Message Buffer 2 ID High Register FCMB2_ID_LOW $52 Message Buffer 2 ID Low Register FCMB2_DATA $53 Message Buffer 2 Data Register FCMB2_DATA $54 Message Buffer 2 Data Register FCMB2_DATA $55 Message Buffer 2 Data Register FCMB2_DATA $56 Message Buffer 2 Data Register Reserved FCMB3_CONTROL $58 Message Buffer 3 Control / Status Register FCMB3_ID_HIGH $59 Message Buffer 3 ID High Register FCMB3_ID_LOW $5A Message Buffer 3 ID Low Register FCMB3_DATA $5B Message Buffer 3 Data Register FCMB3_DATA $5C Message Buffer 3 Data Register FCMB3_DATA $5D Message Buffer 3 Data Register FCMB3_DATA $5E Message Buffer 3 Data Register Reserved FCMB4_CONTROL $60 Message Buffer 4 Control / Status Register FCMB4_ID_HIGH $61 Message Buffer 4 ID High Register FCMB4_ID_LOW $62 Message Buffer 4 ID Low Register FCMB4_DATA $63 Message Buffer 4 Data Register FCMB4_DATA $64 Message Buffer 4 Data Register FCMB4_DATA $65 Message Buffer 4 Data Register FCMB4_DATA $66 Message Buffer 4 Data Register Reserved FCMB5_CONTROL $68 Message Buffer 5 Control / Status Register FCMB5_ID_HIGH $69 Message Buffer 5 ID High Register FCMB5_ID_LOW $6A Message Buffer 5 ID Low Register FCMB5_DATA $6B Message Buffer 5 Data Register 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 53 Table 4-27 FlexCAN Registers Address Map (Continued) (FC_BASE = $00 F800) FlexCAN is NOT available in the 56F8123 device Register Acronym Address Offset Register Description FCMB5_DATA $6C Message Buffer 5 Data Register FCMB5_DATA $6D Message Buffer 5 Data Register FCMB5_DATA $6E Message Buffer 5 Data Register Reserved FCMB6_CONTROL $70 Message Buffer 6 Control / Status Register FCMB6_ID_HIGH $71 Message Buffer 6 ID High Register FCMB6_ID_LOW $72 Message Buffer 6 ID Low Register FCMB6_DATA $73 Message Buffer 6 Data Register FCMB6_DATA $74 Message Buffer 6 Data Register FCMB6_DATA $75 Message Buffer 6 Data Register FCMB6_DATA $76 Message Buffer 6 Data Register Reserved FCMB7_CONTROL $78 Message Buffer 7 Control / Status Register FCMB7_ID_HIGH $79 Message Buffer 7 ID High Register FCMB7_ID_LOW $7A Message Buffer 7 ID Low Register FCMB7_DATA $7B Message Buffer 7 Data Register FCMB7_DATA $7C Message Buffer 7 Data Register FCMB7_DATA $7D Message Buffer 7 Data Register FCMB7_DATA $7E Message Buffer 7 Data Register Reserved FCMB8_CONTROL $80 Message Buffer 8 Control / Status Register FCMB8_ID_HIGH $81 Message Buffer 8 ID High Register FCMB8_ID_LOW $82 Message Buffer 8 ID Low Register FCMB8_DATA $83 Message Buffer 8 Data Register FCMB8_DATA $84 Message Buffer 8 Data Register FCMB8_DATA $85 Message Buffer 8 Data Register FCMB8_DATA $86 Message Buffer 8 Data Register Reserved FCMB9_CONTROL $88 Message Buffer 9 Control / Status Register FCMB9_ID_HIGH $89 Message Buffer 9 ID High Register FCMB9_ID_LOW $8A Message Buffer 9 ID Low Register FCMB9_DATA $8B Message Buffer 9 Data Register FCMB9_DATA $8C Message Buffer 9 Data Register 56F8323 Technical Data, Rev. 17 54 Freescale Semiconductor Preliminary Peripheral Memory Mapped Registers Table 4-27 FlexCAN Registers Address Map (Continued) (FC_BASE = $00 F800) FlexCAN is NOT available in the 56F8123 device Register Acronym Address Offset Register Description FCMB9_DATA $8D Message Buffer 9 Data Register FCMB9_DATA $8E Message Buffer 9 Data Register Reserved FCMB10_CONTROL $90 Message Buffer 10 Control / Status Register FCMB10_ID_HIGH $91 Message Buffer 10 ID High Register FCMB10_ID_LOW $92 Message Buffer 10 ID Low Register FCMB10_DATA $93 Message Buffer 10 Data Register FCMB10_DATA $94 Message Buffer 10 Data Register FCMB10_DATA $95 Message Buffer 10 Data Register FCMB10_DATA $96 Message Buffer 10 Data Register Reserved FCMB11_CONTROL $98 Message Buffer 11 Control / Status Register FCMB11_ID_HIGH $99 Message Buffer 11 ID High Register FCMB11_ID_LOW $9A Message Buffer 11 ID Low Register FCMB11_DATA $9B Message Buffer 11 Data Register FCMB11_DATA $9C Message Buffer 11 Data Register FCMB11_DATA $9D Message Buffer 11 Data Register FCMB11_DATA $9E Message Buffer 11 Data Register Reserved FCMB12_CONTROL $A0 Message Buffer 12 Control / Status Register FCMB12_ID_HIGH $A1 Message Buffer 12 ID High Register FCMB12_ID_LOW $A2 Message Buffer 12 ID Low Register FCMB12_DATA $A3 Message Buffer 12 Data Register FCMB12_DATA $A4 Message Buffer 12 Data Register FCMB12_DATA $A5 Message Buffer 12 Data Register FCMB12_DATA $A6 Message Buffer 12 Data Register Reserved FCMB13_CONTROL $A8 Message Buffer 13 Control / Status Register FCMB13_ID_HIGH $A9 Message Buffer 13 ID High Register FCMB13_ID_LOW $AA Message Buffer 13 ID Low Register FCMB13_DATA $AB Message Buffer 13 Data Register FCMB13_DATA $AC Message Buffer 13 Data Register FCMB13_DATA $AD Message Buffer 13 Data Register 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 55 Table 4-27 FlexCAN Registers Address Map (Continued) (FC_BASE = $00 F800) FlexCAN is NOT available in the 56F8123 device Register Acronym FCMB13_DATA Address Offset $AE Register Description Message Buffer 13 Data Register Reserved FCMB14_CONTROL $B0 Message Buffer 14 Control / Status Register FCMB14_ID_HIGH $B1 Message Buffer 14 ID High Register FCMB14_ID_LOW $B2 Message Buffer 14 ID Low Register FCMB14_DATA $B3 Message Buffer 14 Data Register FCMB14_DATA $B4 Message Buffer 14 Data Register FCMB14_DATA $B5 Message Buffer 14 Data Register FCMB14_DATA $B6 Message Buffer 14 Data Register Reserved FCMB15_CONTROL $B8 Message Buffer 15 Control / Status Register FCMB15_ID_HIGH $B9 Message Buffer 15 ID High Register FCMB15_ID_LOW $BA Message Buffer 15 ID Low Register FCMB15_DATA $BB Message Buffer 15 Data Register FCMB15_DATA $BC Message Buffer 15 Data Register FCMB15_DATA $BD Message Buffer 15 Data Register FCMB15_DATA $BE Message Buffer 15 Data Register Reserved 4.8 Factory Programmed Memory The Boot Flash memory block is programmed during manufacturing with a default Serial Bootloader program. The Serial Bootloader application can be used to load a user application into the Program and Data Flash (NOT available in the 56F8123) memories of the device. The 56F83xx SCI/CAN Bootloader User Manual provides detailed information on this firmware. An application note, Production Flash Programming, details how the Serial Bootloader program can be used to perform production Flash programming of the on-board Flash memories as well as other optional methods. Like all the Flash memory blocks, the Boot Flash can be erased and programmed by the user. The Serial Bootloader application is programmed as an aid to the end user, but is not required to be used or maintained in the Boot Flash memory. 56F8323 Technical Data, Rev. 17 56 Freescale Semiconductor Preliminary Introduction Part 5 Interrupt Controller (ITCN) 5.1 Introduction The Interrupt Controller (ITCN) module is used to arbitrate between various interrupt requests (IRQs), to signal to the 56800E core when an interrupt of sufficient priority exists, and to what address to jump in order to service this interrupt. 5.2 Features The ITCN module design includes these distinctive features: • • • • Programmable priority levels for each IRQ Two programmable Fast Interrupts Notification to SIM module to restart clocks out of Wait and Stop modes Drives initial address on the address bus after reset For further information, see Table 4-3, Interrupt Vector Table Contents. 5.3 Functional Description The Interrupt Controller is a slave on the IPBus. It contains registers allowing each of the 82 interrupt sources to be set to one of four priority levels, excluding certain interrupts of fixed priority. Next, all of the interrupt requests of a given level are priority encoded to determine the lowest numerical value of the active interrupt requests for that level. Within a given priority level, 0 is the highest priority, while number 81 is the lowest. 5.3.1 Normal Interrupt Handling Once the ITCN has determined that an interrupt is to be serviced and which interrupt has the highest priority, an interrupt vector address is generated. Normal interrupt handling concatenates the VBA and the vector number to determine the vector address. In this way, an offset is generated into the vector table for each interrupt. 5.3.2 Interrupt Nesting Interrupt exceptions may be nested to allow an IRQ of higher priority than the current exception to be serviced. The following tables define the nesting requirements for each priority level. Table 5-1 Interrupt Mask Bit Definition SR[9]1 SR[8]1 Permitted Exceptions Masked Exceptions 0 0 Priorities 0, 1, 2, 3 None 0 1 Priorities 1, 2, 3 Priority 0 1 0 Priorities 2, 3 Priorities 0, 1 1 1 Priority 3 Priorities 0, 1, 2 1. Core status register bits indicating current interrupt mask within the core. 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 57 Table 5-2. Interrupt Priority Encoding Current Interrupt Priority Level IPIC_LEVEL[1:0]1 Required Nested Exception Priority 00 No Interrupt or SWILP Priorities 0, 1, 2, 3 01 Priority 0 Priorities 1, 2, 3 10 Priority 1 Priorities 2, 3 11 Priorities 2 or 3 Priority 3 1. See IPIC field definition in Section 5.6.30.2 5.3.3 Fast Interrupt Handling Fast interrupts are described in the DSP56800E Reference Manual. The interrupt controller recognizes fast interrupts before the core does. A fast interrupt is defined (to the ITCN) by: 1. Setting the priority of the interrupt as level 2, with the appropriate field in the IPR registers 2. Setting the FIMn register to the appropriate vector number 3. Setting the FIVALn and FIVAHn registers with the address of the code for the fast interrupt When an interrupt occurs, its vector number is compared with the FIM0 and FIM1 register values. If a match occurs, and it is a level 2 interrupt, the ITCN handles it as a fast interrupt. The ITCN takes the vector address from the appropriate FIVALn and FIVAHn registers, instead of generating an address that is an offset from the VBA. The core then fetches the instruction from the indicated vector adddress and if it is not a JSR, the core starts its fast interrupt handling. 56F8323 Technical Data, Rev. 17 58 Freescale Semiconductor Preliminary Block Diagram 5.4 Block Diagram any0 Priority Level INT1 Level 0 82 -> 7 Priority Encoder 2 -> 4 Decode 7 INT VAB CONTROL any3 Level 3 IACK SR[9:8] Priority Level INT82 IPIC 82 -> 7 Priority Encoder 7 PIC_EN 2 -> 4 Decode Figure 5-1 Interrupt Controller Block Diagram 5.5 Operating Modes The ITCN module design contains two major modes of operation: • • Functional Mode The ITCN is in this mode by default. Wait and Stop Modes During Wait and Stop modes, the system clocks and the 56800E core are turned off. The ITCN will signal a pending IRQ to the System Integration Module (SIM) to restart the clocks and service the IRQ. An IRQ can only wake up the core if the IRQ is enabled prior to entering the Wait or Stop mode. Also, the IRQA signal automatically becomes low-level sensitive in these modes, even if the control register bits are set to make them falling-edge sensitive. This is because there is no clock available to detect the falling edge. A peripheral which requires a clock to generate interrupts will not be able to generate interrupts during Stop mode. The FlexCAN module can wake the device from Stop mode, and a reset will do just that, or IRQA and IRQB can wake it up. 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 59 5.6 Register Descriptions A register address is the sum of a base address and an address offset. The base address is defined at the system level and the address offset is defined at the module level. The ITCN peripheral has 24 registers. Table 5-3 ITCN Register Summary (ITCN_BASE = $00 F1A0) Register Acronym Base Address + Register Name Section Location IPR0 $0 Interrupt Priority Register 0 5.6.1 IPR1 $1 Interrupt Priority Register 1 5.6.2 IPR2 $2 Interrupt Priority Register 2 5.6.3 IPR3 $3 Interrupt Priority Register 3 5.6.4 IPR4 $4 Interrupt Priority Register 4 5.6.5 IPR5 $5 Interrupt Priority Register 5 5.6.6 IPR6 $6 Interrupt Priority Register 6 5.6.7 IPR7 $7 Interrupt Priority Register 7 5.6.8 IPR8 $8 Interrupt Priority Register 8 5.6.9 IPR9 $9 Interrupt Priority Register 9 5.6.10 VBA $A Vector Base Address Register 5.6.11 FIM0 $B Fast Interrupt 0 Match Register 5.6.12 FIVAL0 $C Fast Interrupt 0 Vector Address Low Register 5.6.13 FIVAH0 $D Fast Interrupt 0 Vector Address High Register 5.6.14 FIM1 $E Fast Interrupt 1 Match Register 5.6.15 FIVAL1 $F Fast Interrupt 1 Vector Address Low Register 5.6.16 FIVAH1 $10 Fast Interrupt 1 Vector Address High Register 5.6.17 IRQP0 $11 IRQ Pending Register 0 5.6.18 IRQP1 $12 IRQ Pending Register 1 5.6.19 IRQP2 $13 IRQ Pending Register 2 5.6.20 IRQP3 $14 IRQ Pending Register 3 5.6.21 IRQP4 $15 IRQ Pending Register 4 5.6.22 IRQP5 $16 IRQ Pending Register 5 5.6.23 Reserved ICTL $1D Interrupt Control Register 5.6.30 56F8323 Technical Data, Rev. 17 60 Freescale Semiconductor Preliminary Register Descriptions Add. Offset Register Name $0 IPR0 $1 IPR1 $2 IPR2 $3 IPR3 $4 IPR4 $5 IPR5 $6 IPR6 $7 IPR7 $8 IPR8 $9 IPR9 $A VBA $B FIM0 $C FIVAL0 $D FIVAH0 $E FIM1 $F FIVAL1 $10 FIVAH1 $11 IRQP0 $12 IRQP1 $13 IRQP2 $14 IRQP3 $15 IRQP4 $16 IRQP5 R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R 15 14 0 0 0 0 13 BKPT_ U0 IPL 0 FMCBE IPL 0 0 FMCC IPL 0 0 SPI0_RCV IPL 0 12 0 SPI1_XMIT IPL 0 TMRC0 IPL 0 0 0 0 TMRA0 IPL SCI0_RCV IPL 0 0 SCI0_RERR IPL PWMA F IPL 0 0 0 0 0 0 0 0 11 10 STPCNT IPL 0 0 FMERR IPL 0 0 SPI1_RCV IPL SCI1_RCV IPL 0 0 0 0 0 0 PWMA_RL IPL 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 LOCK IPL LVI IPL FCMSGBUF IPL FCWKUP IPL 0 0 SCI1_RERR IPL 0 0 0 0 SCI0_TIDL IPL 0 0 0 0 0 0 0 0 0 SCI0_XMIT IPL ADCA_ZC IPL 0 0 TX_REG IPL 0 0 TRBUF IPL IRQA IPL 0 0 FCERR IPL FCBOFF IPL GPIOA IPL GPIOB IPL GPIOC IPL SCI1_TIDL IPL SCI1_XMIT IPL SPI0_XMIT IPL DEC0_XIRQ IPL DEC0_HIRQ IPL TMRC3 IPL TMRC2 IPL TMRC1 IPL TMRA3 IPL TMRA2 IPL TMRA1 IPL 0 0 0 0 0 0 ADCA_CC IPL 0 0 VECTOR BASE ADDRESS 0 0 0 0 0 0 FAST INTERRUPT 0 FAST INTERRUPT 0 VECTOR ADDRESS LOW 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 FAST INTERRUPT 0 VECTOR ADDRESS HIGH FAST INTERRUPT 1 FAST INTERRUPT 1 VECTOR ADDRESS LOW 0 0 0 0 0 0 0 0 0 0 0 FAST INTERRUPT 1 VECTOR ADDRESS HIGH PENDING [16:2] 1 PENDING [32:17] PENDING [48:33] PENDING [64:49] W R W R 0 RX_REG IPL PENDING [80:65] 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 INT_ DIS 1 0 IRQA STATE 0 PENDING [81] W Reserved $1D ICTL R INT IPIC VAB W IRQA EDG = Reserved Figure 5-2 ITCN Register Map Summary 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 61 5.6.1 Interrupt Priority Register 0 (IPR0) Base + $0 15 14 Read 0 0 13 12 BKPT_U0 IPL 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 STPCNT IPL Write RESET 0 0 0 0 0 0 Figure 5-3 Interrupt Priority Register 0 (IPR0) 5.6.1.1 Reserved—Bits 15–14 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.1.2 EOnCE Breakpoint Unit 0 Interrupt Priority Level (BKPT_U0 IPL)— Bits13–12 This field is used to set the interrupt priority levels for IRQs. This IRQ is limited to priorities 1 through 3. It is disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 1 10 = IRQ is priority level 2 11 = IRQ is priority level 3 5.6.1.3 EOnCE Step Counter Interrupt Priority Level (STPCNT IPL)— Bits 11–10 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 1 through 3. It is disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 1 10 = IRQ is priority level 2 11 = IRQ is priority level 3 5.6.1.4 Reserved—Bits 9–0 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.2 Interrupt Priority Register 1 (IPR1) Base + $1 15 14 13 12 11 10 9 8 7 6 Read 0 0 0 0 0 0 0 0 0 0 5 4 RX_REG IPL 3 2 TX_REG IPL 1 0 TRBUF IPL Write RESET 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 5-4 Interrupt Priority Register 1 (IPR1) 56F8323 Technical Data, Rev. 17 62 Freescale Semiconductor Preliminary Register Descriptions 5.6.2.1 Reserved—Bits 15–6 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.2.2 EOnCE Receive Register Full Interrupt Priority Level (RX_REG IPL)—Bits 5–4 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 1 through 3. It is disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 1 10 = IRQ is priority level 2 11 = IRQ is priority level 3 5.6.2.3 EOnCE Transmit Register Empty Interrupt Priority Level (TX_REG IPL)—Bits 3–2 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 1 through 3. It is disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 1 10 = IRQ is priority level 2 11 = IRQ is priority level 3 5.6.2.4 EOnCE Trace Buffer Interrupt Priority Level (TRBUF IPL)— Bits 1–0 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 1 through 3. It is disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 1 10 = IRQ is priority level 2 11 = IRQ is priority level 3 5.6.3 Interrupt Priority Register 2 (IPR2) Base + $2 15 14 13 12 11 10 9 8 7 6 Read FMCBE IPL FMCC IPL FMERR IPL LOCK IPL 5 4 3 2 0 0 0 0 LVI IPL 1 0 IRQA IPL Write RESET 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 5-5 Interrupt Priority Register 2 (IPR2) 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 63 5.6.3.1 Flash Memory Command, Data, Address Buffers Empty Interrupt Priority Level (FMCBE IPL)—Bits 15–14 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. It is disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.3.2 Flash Memory Command Complete Priority Level (FMCC IPL)—Bits 13–12 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. It is disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.3.3 Flash Memory Error Interrupt Priority Level (FMERR IPL)—Bits 11–10 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. It is disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.3.4 PLL Loss of Lock Interrupt Priority Level (LOCK IPL)—Bits 9–8 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. It is disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 56F8323 Technical Data, Rev. 17 64 Freescale Semiconductor Preliminary Register Descriptions 5.6.3.5 Low Voltage Detector Interrupt Priority Level (LVI IPL)—Bits 7–6 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. It is disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.3.6 Reserved—Bits 5–2 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.3.7 External IRQ A Interrupt Priority Level (IRQA IPL)—Bits 1–0 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. It is disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.4 Interrupt Priority Register 3 (IPR3) Base + $3 15 14 13 12 11 10 Read 0 0 0 0 0 0 9 8 FCMSGBUF IPL 7 6 FCWKUP IPL 5 4 FCERR IPL 3 2 1 0 0 0 0 0 FCBOFF IPL Write RESET 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 5-6 Interrupt Priority Register 3 (IPR3) 5.6.4.1 Reserved—Bits 15–10 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.4.2 FlexCAN Message Buffer Interrupt Priority Level (FCMSGBUF IPL)—Bits 9–8 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 65 5.6.4.3 FlexCAN Wake Up Interrupt Priority Level (FCWKUP IPL)— Bits 7–6 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.4.4 FlexCAN Error Interrupt Priority Level (FCERR IPL)— Bits 5–4 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.4.5 FlexCAN Bus Off Interrupt Priority Level (FCBOFF IPL)— Bits 3–2 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.4.6 Reserved—Bits 1–0 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.5 Interrupt Priority Register 4 (IPR4) Base + $4 Read Write RESET 15 14 SPI0_RCV IPL 0 0 13 12 SPI1_XMIT IPL 0 0 11 10 9 8 7 6 SPI1_RCV IPL 0 0 0 0 0 0 0 5 4 GPIOA IPL 0 0 0 0 0 3 2 GPIOB IPL 0 0 1 0 GPIOC IPL 0 0 Figure 5-7 Interrupt Priority Register 4 (IPR4) 56F8323 Technical Data, Rev. 17 66 Freescale Semiconductor Preliminary Register Descriptions 5.6.5.1 SPI0 Receiver Full Interrupt Priority Level (SPI0_RCV IPL)— Bits 15–14 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.5.2 SPI1 Transmit Empty Interrupt Priority Level (SPI1_XMIT IPL)— Bits 13–12 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.5.3 SPI1 Receiver Full Interrupt Priority Level (SPI1_RCV IPL)— Bits 11–10 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.5.4 Reserved—Bits 9–6 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.5.5 GPIOA Interrupt Priority Level (GPIOA IPL)—Bits 5–4 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 67 5.6.5.6 GPIOB Interrupt Priority Level (GPIOB IPL)—Bits 3–2 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.5.7 GPIOC Interrupt Priority Level (GPIOC IPL)—Bits 1–0 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.6 Interrupt Priority Register 5 (IPR5) Base + $5 15 14 13 12 Read 0 0 0 0 0 0 0 0 Write RESET 11 10 SCI1_RCV IPL 0 0 9 8 SCI1_RERR IPL 0 0 7 6 0 0 0 0 5 4 SCI1_TIDL IPL 0 0 3 2 SCI1_XMIT IPL 0 0 1 0 SPI0_XMIT IPL 0 0 Figure 5-8 Interrupt Priority Register 5 (IPR5) 5.6.6.1 Reserved—Bits 15–12 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.6.2 SCI1 Receiver Full Interrupt Priority Level (SCI1_RCV IPL)— Bits 11–10 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 56F8323 Technical Data, Rev. 17 68 Freescale Semiconductor Preliminary Register Descriptions 5.6.6.3 SCI1 Receiver Error Interrupt Priority Level (SCI1_RERR IPL)— Bits 9–8 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.6.4 Reserved—Bits 7–6 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.6.5 SCI1 Transmitter Idle Interrupt Priority Level (SCI1_TIDL IPL)— Bits 5–4 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.6.6 SCI1 Transmitter Empty Interrupt Priority Level (SCI1_XMIT IPL)— Bits 3–2 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.6.7 SPI0 Transmitter Empty Interrupt Priority Level (SPI0_XMIT IPL)— Bits 1–0 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 69 5.6.7 Interrupt Priority Register 6 (IPR6) Base + $6 15 14 Read 13 12 11 10 9 8 7 6 5 4 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 TMRC0 IPL Write RESET 0 0 3 2 DEC0_XIRQ IPL 0 0 1 0 DEC0_HIRQ IPL 0 0 Figure 5-9 Interrupt Priority Register 6 (IPR6) 5.6.7.1 Timer C, Channel 0 Interrupt Priority Level (TMRC0 IPL)— Bits 15–14 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.7.2 Reserved—Bits 13–4 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.7.3 Quadrature Decoder 0, INDEX Pulse Interrupt Priority Level (DEC0_XIRQ IPL)—Bits 3–2 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.7.4 Quadrature Decoder 0, HOME Signal Transition or Watchdog Timer Interrupt Priority Level (DEC0_HIRQ IPL)—Bits 1–0 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 56F8323 Technical Data, Rev. 17 70 Freescale Semiconductor Preliminary Register Descriptions 5.6.8 Interrupt Priority Register 7 (IPR7) Base + $7 15 14 Read 13 12 11 10 9 8 7 6 0 0 0 0 0 0 0 0 TMRA0 IPL 5 4 TMRC3 IPL 3 2 TMRC2 IPL 1 0 TMRC1 IPL Write RESET 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 5-10 Interrupt Priority Register (IPR7) 5.6.8.1 Timer A, Channel 0 Interrupt Priority Level (TMRA0 IPL)— Bits 15–14 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.8.2 Reserved—Bits 13–6 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.8.3 Timer C, Channel 3 Interrupt Priority Level (TMRC3 IPL)—Bits 5–4 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.8.4 Timer C, Channel 2 Interrupt Priority Level (TMRC2 IPL)—Bits 3–2 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 71 5.6.8.5 Timer C, Channel 1 Interrupt Priority Level (TMRC1 IPL)—Bits 1–0 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.9 Interrupt Priority Register 8 (IPR8) Base + $8 Read 15 14 SCI0_RCV IPL Write RESET 0 0 13 12 SCI0_RERR IPL 0 0 11 10 0 0 0 0 9 8 SCI0_TIDL IPL 0 0 7 6 SCI0_XMIT IPL 0 0 5 4 TMRA3 IPL 0 0 3 2 TMRA2 IPL 0 1 0 TMRA1 IPL 0 0 0 Figure 5-11 Interrupt Priority Register 8 (IPR8) 5.6.9.1 SCI0 Receiver Full Interrupt Priority Level (SCI0 RCV IPL)— Bits 15–14 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.9.2 SCI0 Receiver Error Interrupt Priority Level (SCI0 RERR IPL)— Bits 13–12 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 56F8323 Technical Data, Rev. 17 72 Freescale Semiconductor Preliminary Register Descriptions 5.6.9.3 Reserved—Bits 11–10 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.9.4 SCI0 Transmitter Idle Interrupt Priority Level (SCI0 TIDL IPL)— Bits 9–8 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.9.5 SCI0 Transmitter Empty Interrupt Priority Level (SCI0 XMIT IPL)— Bits 7–6 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.9.6 Timer A, Channel 3 Interrupt Priority Level (TMRA 3 IPL)—Bits 5–4 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.9.7 Timer A, Channel 2 Interrupt Priority Level (TMRA 2 IPL)—Bits 3–2 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 73 5.6.9.8 Timer A, Channel 1 Interrupt Priority Level (TMRA 1 IPL)—Bits 1–0 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.10 Interrupt Priority Register 9 (IPR9) Base + $9 15 14 Read 13 12 0 0 PWMA F IPL Write RESET 0 0 0 0 11 10 9 8 PWMA_RL IPL 0 0 0 0 7 6 5 4 3 2 1 0 0 0 ADCA_CC IPL 0 0 0 0 0 0 ADCA_ZC IPL 0 0 0 0 0 0 Figure 5-12 Interrupt Priority Register 9 (IPR9) 5.6.10.1 PWM A Fault Interrupt Priority Level (PWMA F IPL)—Bits 15–14 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.10.2 Reserved—Bits 13–12 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.10.3 Reload PWM A Interrupt Priority Level (PWMA_RL IPL)— Bits 11–10 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 56F8323 Technical Data, Rev. 17 74 Freescale Semiconductor Preliminary Register Descriptions 5.6.10.4 Reserved—Bits 9–8 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.10.5 ADC A Zero Crossing or Limit Error Interrupt Priority Level (ADCA_ZC IPL)—Bits 7–6 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.10.6 Reserved—Bits 5–4 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.10.7 ADC A Conversion Complete Interrupt Priority Level (ADCA_CC IPL)—Bits 3–2 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.10.8 Reserved—Bits 1–0 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.11 Vector Base Address Register (VBA) Base + $A 15 14 13 Read 0 0 0 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 VECTOR BASE ADDRESS Write RESET 0 0 0 0 0 0 0 0 0 0 0 Figure 5-13 Vector Base Address Register (VBA) 5.6.11.1 Reserved—Bits 15–13 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 75 5.6.11.2 Interrupt Vector Base Address (VECTOR BASE ADDRESS)— Bits 12–0 The contents of this register determine the location of the Vector Address Table. The value in this register is used as the upper 13 bits of the interrupt vector address. The lower eight bits of the ISR address are determined based upon the highest-priority interrupt; see Part 5.3.1 for details. 5.6.12 Fast Interrupt 0 Match Register (FIM0) Base + $B 15 14 13 12 11 10 9 8 7 Read 0 0 0 0 0 0 0 0 0 6 5 4 3 2 1 0 0 0 FAST INTERRUPT 0 Write RESET 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 5-14 Fast Interrupt 0 Match Register (FIM0) 5.6.12.1 Reserved—Bits 15–7 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.12.2 Fast Interrupt 0 Vector Number (FAST INTERRUPT 0)—Bits 6–0 This value determines which IRQ will be a Fast Interrupt 0. Fast interrupts vector directly to a service routine based on values in the Fast Interrupt Vector Address registers without having to go to a jump table first; for details, see Part 5.3.3. IRQs used as fast interrupts must be set to priority level 2. Unexpected results will occur if a fast interrupt vector is set to any other priority. Fast interrupts automatically become the highest-priority level 2 interrupt, regardless of their location in the interrupt table, prior to being declared as fast interrupt. Fast Interrupt 0 has priority over Fast Interrupt 1. To determine the vector number of each IRQ, refer to Table 4-3. 5.6.13 Fast Interrupt 0 Vector Address Low Register (FIVAL0) Base + $C 15 14 13 12 11 10 Read 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 FAST INTERRUPT 0 VECTOR ADDRESS LOW Write RESET 0 0 0 0 0 0 0 0 0 0 Figure 5-15 Fast Interrupt 0 Vector Address Low Register (FIVAL0) 5.6.13.1 Fast Interrupt 0 Vector Address Low (FIVAL0)—Bits 15–0 The lower 16 bits of the vector address used for Fast Interrupt 0. This register is combined with FIVAH0 to form the 21-bit vector address for Fast Interrupt 0 defined in the FIM0 register. 56F8323 Technical Data, Rev. 17 76 Freescale Semiconductor Preliminary Register Descriptions 5.6.14 Fast Interrupt 0 Vector Address High Register (FIVAH0) Base + $D 15 14 13 12 11 10 9 8 7 6 5 Read 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 4 2 1 0 FAST INTERRUPT 0 VECTOR ADDRESS HIGH Write RESET 3 0 0 0 0 0 Figure 5-16 Fast Interrupt 0 Vector Address High Register (FIVAH0) 5.6.14.1 Reserved—Bits 15–5 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.14.2 Fast Interrupt 0 Vector Address High (FIVAH0)—Bits 4–0 The upper five bits of the vector address used for Fast Interrupt 0. This register is combined with FIVAL0 to form the 21-bit vector address for Fast Interrupt 0 defined in the FIM0 register. 5.6.15 Fast Interrupt 1 Match Register (FIM1) Base + $E 15 14 13 12 11 10 9 8 7 Read 0 0 0 0 0 0 0 0 0 6 5 4 3 2 1 0 0 0 FAST INTERRUPT 1 Write RESET 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 5-17 Fast Interrupt 1 Match Register (FIM1) 5.6.15.1 Reserved—Bits 15–7 This bit field is reserved or not implemented. It is read as 0, but cannot be modified by writing. 5.6.15.2 Fast Interrupt 1 Vector Number (FAST INTERRUPT 1)—Bits 6–0 This value determines which IRQ will be a Fast Interrupt 1. Fast interrupts vector directly to a service routine based on values in the Fast Interrupt Vector Address registers without having to go to a jump table first; for details, see Part 5.3.3. IRQs used as fast interrupts must be set to priority level 2. Unexpected results will occur if a fast interrupt vector is set to any other priority. Fast interrupts automatically become the highest-priority level 2 interrupt, regardless of their location in the interrupt table, prior to being declared as fast interrupt. Fast Interrupt 0 has priority over Fast Interrupt 1. To determine the vector number of each IRQ, refer to Table 4-3. 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 77 5.6.16 Fast Interrupt 1 Vector Address Low Register (FIVAL1) Base + $F 15 14 13 12 11 10 Read 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 FAST INTERRUPT 1 VECTOR ADDRESS LOW Write RESET 0 0 0 0 0 0 0 0 0 0 Figure 5-18 Fast Interrupt 1 Vector Address Low Register (FIVAL1) 5.6.16.1 Fast Interrupt 1 Vector Address Low (FIVAL1)—Bits 15–0 The lower 16 bits of the vector address used for Fast Interrupt 1. This register is combined with FIVAH1 to form the 21-bit vector address for Fast Interrupt 1 defined in the FIM1 register. 5.6.17 Fast Interrupt 1 Vector Address High Register (FIVAH1) Base + $10 15 14 13 12 11 10 9 8 7 6 5 Read 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 4 2 1 0 FAST INTERRUPT 1 VECTOR ADDRESS HIGH Write RESET 3 0 0 0 0 0 Figure 5-19 Fast Interrupt 1 Vector Address High Register (FIVAH1) 5.6.17.1 Reserved—Bits 15–5 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.17.2 Fast Interrupt 1 Vector Address High (FIVAH1)—Bits 4–0 The upper five bits of the vector address are used for Fast Interrupt 1. This register is combined with FIVAL1 to form the 21-bit vector address for Fast Interrupt 1 defined in the FIM1 register. 5.6.18 IRQ Pending 0 Register (IRQP0) Base + $11 15 14 13 12 11 10 Read 9 8 7 6 5 4 3 2 1 PENDING [16:2] 0 1 Write RESET 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Figure 5-20 IRQ Pending 0 Register (IRQP0) 5.6.18.1 IRQ Pending (PENDING)—Bits 16–2 This register combines with the other five to represent the pending IRQs for interrupt vector numbers 2 through 81. • • 0 = IRQ pending for this vector number 1 = No IRQ pending for this vector number 56F8323 Technical Data, Rev. 17 78 Freescale Semiconductor Preliminary Register Descriptions 5.6.18.2 Reserved—Bit 0 This bit is reserved or not implemented. It is read as 1 and cannot be modified by writing. 5.6.19 IRQ Pending 1 Register (IRQP1) $Base + $12 15 14 13 12 11 10 9 Read 8 7 6 5 4 3 2 1 0 1 1 1 1 1 1 1 PENDING [32:17] Write RESET 1 1 1 1 1 1 1 1 1 Figure 5-21 IRQ Pending 1 Register (IRQP1) 5.6.19.1 IRQ Pending (PENDING)—Bits 32–17 This register combines with the other five to represent the pending IRQs for interrupt vector numbers 2 through 81. • • 0 = IRQ pending for this vector number 1 = No IRQ pending for this vector number 5.6.20 IRQ Pending 2 Register (IRQP2) Base + $13 15 14 13 12 11 10 9 Read 8 7 6 5 4 3 2 1 0 1 1 1 1 1 1 1 PENDING [48:33] Write RESET 1 1 1 1 1 1 1 1 1 Figure 5-22 IRQ Pending 2 Register (IRQP2) 5.6.20.1 IRQ Pending (PENDING)—Bits 48–33 This register combines with the other five to represent the pending IRQs for interrupt vector numbers 2 through 81. • • 0 = IRQ pending for this vector number 1 = No IRQ pending for this vector number 5.6.21 IRQ Pending 3 Register (IRQP3) Base + $14 15 14 13 12 11 10 9 Read 8 7 6 5 4 3 2 1 0 1 1 1 1 1 1 1 PENDING [64:49] Write RESET 1 1 1 1 1 1 1 1 1 Figure 5-23 IRQ Pending 3 Register (IRQP3) 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 79 5.6.21.1 IRQ Pending (PENDING)—Bits 64–49 This register combines with the other five to represent the pending IRQs for interrupt vector numbers two through 81. • • 0 = IRQ pending for this vector number 1 = No IRQ pending for this vector number 5.6.22 IRQ Pending 4 Register (IRQP4) Base + $15 15 14 13 12 11 10 9 Read 8 7 6 5 4 3 2 1 0 1 1 1 1 1 1 1 PENDING [80:65] Write RESET 1 1 1 1 1 1 1 1 1 Figure 5-24 IRQ Pending 4 Register (IRQP4) 5.6.22.1 IRQ Pending (PENDING)—Bits 80–65 This register combines with the other five to represent the pending IRQs for interrupt vector numbers 2 through 81. • • 0 = IRQ pending for this vector number 1 = No IRQ pending for this vector number 5.6.23 IRQ Pending 5 Register (IRQP5) Base + $16 Read 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 PENDING [81] 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Write RESET Figure 5-25 IRQ Pending Register 5 (IRQP5) 5.6.23.1 Reserved—Bits 96–82 This bit field is reserved or not implemented. The bits are read as 1 and cannot be modified by writing. 5.6.23.2 IRQ Pending (PENDING)—Bit 81 This register combines with the other five to represent the pending IRQs for interrupt vector numbers 2 through 81. • • 0 = IRQ pending for this vector number 1 = No IRQ pending for this vector number 56F8323 Technical Data, Rev. 17 80 Freescale Semiconductor Preliminary Register Descriptions 5.6.24 Reserved—Base + 17 5.6.25 Reserved—Base + 18 5.6.26 Reserved—Base + 19 5.6.27 Reserved—Base + 1A 5.6.28 Reserved—Base + 1B 5.6.29 Reserved—Base + 1C 5.6.30 ITCN Control Register (ICTL) Base + $1D 15 Read INT 14 13 12 11 10 IPIC 9 8 7 6 5 VAB 4 3 2 1 0 1 0 IRQA STATE 0 IRQA EDG 1 1 1 0 0 INT_DIS Write RESET 0 0 0 1 0 0 0 0 0 0 0 Figure 5-26 ITCN Control Register (ICTL) 5.6.30.1 Interrupt (INT)—Bit 15 This read-only bit reflects the state of the interrupt to the 56800E core. • • 0 = No interrupt is being sent to the 56800E core 1 = An interrupt is being sent to the 56800E core 5.6.30.2 Interrupt Priority Level (IPIC)—Bits 14–13 These read-only bits reflect the state of the new interrupt priority level bits being presented to the 56800E core at the time the last IRQ was taken. This field is only updated when the 56800E core jumps to a new interrupt service routine. Note: • • • • Nested interrupts may cause this field to be updated before the original interrupt service routine can read it. 00 = Required nested exception priority levels are 0, 1, 2, or 3 01 = Required nested exception priority levels are 1, 2, or 3 10 = Required nested exception priority levels are 2 or 3 11 = Required nested exception priority level is 3 5.6.30.3 Vector Number - Vector Address Bus (VAB)—Bits 12–6 This read-only field shows the vector number (VAB[7:1]) used at the time the last IRQ was taken. This field is only updated when the 56800E core jumps to a new interrupt service routine. Note: Nested interrupts may cause this field to be updated before the original interrupt service routine can read it. 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 81 5.6.30.4 Interrupt Disable (INT_DIS)—Bit 5 This bit allows all interrupts to be disabled. • • 0 = Normal operation (default) 1 = All interrupts disabled 5.6.30.5 Reserved—Bit 4 This bit field is reserved or not implemented. It is read as 1 and cannot be modified by writing. 5.6.30.6 Reserved—Bit 3 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.30.7 IRQA State Pin (IRQA STATE)—Bit 2 This read-only bit reflects the state of the external IRQA pin. 5.6.30.8 Reserved—Bit 1 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.30.9 IRQA Edge Pin (IRQA Edg)—Bit 0 This bit controls whether the external IRQA interrupt is edge- or level-sensitive. During Stop and Wait modes, it is automatically level-sensitive. • • 0 = IRQA interrupt is a low-level sensitive (default) 1 = IRQA interrupt is falling-edge sensitive 5.7 Resets 5.7.1 Reset Handshake Timing The ITCN provides the 56800E core with a reset vector address whenever RESET is asserted. The reset vector will be presented until the second rising clock edge after RESET is released. 5.7.2 ITCN After Reset After reset, all of the ITCN registers are in their default states. This means all interrupts are disabled except the core IRQs with fixed priorities • • • • • • • • Illegal Instruction SW Interrupt 3 HW Stack Overflow Misaligned Long Word Access SW Interrupt 2 SW Interrupt 1 SW Interrupt 0 SW Interrupt LP These interrupts are enabled at their fixed priority levels. 56F8323 Technical Data, Rev. 17 82 Freescale Semiconductor Preliminary Introduction Part 6 System Integration Module (SIM) 6.1 Introduction The SIM module is a system catchall for the glue logic that ties together the system-on-chip. It controls distribution of resets and clocks and provides a number of control features. The system integration module is responsible for the following functions: • • • • • • • Reset sequencing Clock control & distribution Stop/Wait control Pull-up enables for selected peripherals System status registers Registers for software access to the JTAG ID of the chip Enforcing Flash security These are discussed in more detail in the sections that follow. 6.2 Features The SIM has the following features: • • • Flash security feature prevents unauthorized access to code/data contained in on-chip flash memory Power-saving clock gating for peripherals Three power modes (Run, Wait, Stop) to control power utilization — Stop mode shuts down the 56800E core, system clock, and peripheral clock — Stop mode entry can optionally disable PLL and Oscillator (low power vs. fast restart) — Wait mode shuts down the 56800E core and unnecessary system clock operation — Run mode supports full part operation • • • • • • Controls to enable/disable the 56800E core WAIT and STOP instructions Controls reset sequencing after reset Software-initiated reset Four 16-bit registers reset only by a Power-On Reset usable for general-purpose software control System Control Register Registers for software access to the JTAG ID of the chip 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 83 6.3 Operating Modes Since the SIM is responsible for distributing clocks and resets across the chip, it must understand the various chip operating modes and take appropriate action. These are: • Reset Mode, which has two submodes: — Total Reset Mode – 56800E Core and all peripherals are reset — Core-Only Reset Mode – 56800E Core in reset, peripherals are active – This mode is required to provide the on-chip Flash interface module time to load data from Flash into FM registers. • • • • Run Mode The primary mode of operation for this device, in which the 56800E controls chip operation Debug Mode 56800E is controlled via JTAG/EOnCE when in debug mode. All peripherals, except the COP and PWMs, continue to run. COP is disabled and PWM outputs are optionally switched off to disable any motor from being driven; see the PWM chapter in the 56F8300 Peripheral User Manual for details. Wait Mode In Wait mode, the core clock and memory clocks are disabled. Optionally, the COP can be stopped. Similarly, it is an option to switch off PWM outputs to disable any motor from being driven. All other peripherals continue to run. Stop Mode 56800E, memory, and most peripheral clocks are shut down. Optionally, the COP and CAN can be stopped. For lowest power consumption in Stop mode, the PLL can be shut down. This must be done explicitly before entering Stop mode, since there is no automatic mechanism for this. The CAN (along with any non-gated interrupt) is capable of waking the chip up from Stop mode, but is not fully functional in Stop mode. 6.4 Operating Mode Register Bit 8 7 6 5 4 3 2 1 0 NL 15 14 CM XP SD R SA EX 0 MB MA Type R/W R/W R/W R/W R/W R/W R/W R/W R/W RESET 0 0 0 0 0 0 0 X 0 0 13 0 12 0 11 0 10 0 9 0 0 Figure 6-1 OMR The reset state for MB will depend on the Flash secured state. See Part 4.2 and Part 7 for detailed information on how the Operating Mode Register (OMR) MA and MB bits operate in this device. The EX bit is not functional in this device since there is no external memory interface. For all other bits, see the 56F8300 Peripheral User Manual. Note: The OMR is not a Memory Map register; it is directly accessible in code through the acronym OMR. 56F8323 Technical Data, Rev. 17 84 Freescale Semiconductor Preliminary Register Descriptions 6.5 Register Descriptions Table 6-1 SIM Registers (SIM_BASE = $00F350) Address Offset Address Acronym Register Name Section Location Base + $0 SIM_CONTROL Control Register 6.5.1 Base + $1 SIM_RSTSTS Reset Status Register 6.5.2 Base + $2 SIM_SCR0 Software Control Register 0 6.5.3 Base + $3 SIM_SCR1 Software Control Register 1 6.5.3 Base + $4 SIM_SCR2 Software Control Register 2 6.5.3 Base + $5 SIM_SCR3 Software Control Register 3 6.5.3 Base + $6 SIM_MSH_ID Most Significant Half of JTAG ID 6.5.4 Base + $7 SIM_LSH_ID Least Significant Half of JTAG ID 6.5.5 Base + $8 SIM_PUDR Pull-up Disable Register 6.5.6 Reserved Base + $A SIM_CLKOSR CLKO Select Register 6.5.7 Base + $B SIM_GPS GPIO Peripheral Select Register 6.5.7 Base + $C SIM_PCE Peripheral Clock Enable Register 6.5.8 Base + $D SIM_ISALH I/O Short Address Location High Register 6.5.9 Base + $E SIM_ISALL I/O Short Address Location Low Register 6.5.10 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 85 Add. Offset Register Name $0 SIM_ CONTROL W $1 SIM_ RSTSTS W $2 SIM_SCR0 $3 SIM_SCR1 $4 SIM_SCR2 $5 SIM_SCR3 $6 SIM_MSH_ID $7 SIM_LSH_ID $8 SIM_PUDR R R 15 14 13 12 11 10 9 8 7 6 5 4 0 0 0 0 0 0 0 0 0 0 ONCE EBL0 SW RST 0 0 0 0 0 0 0 0 0 0 R 2 STOP_ DISABLE COPR EXTR POR 1 0 WAIT_ DISABLE 0 0 FIELD W R FIELD W R FIELD W R FIELD W R SWR 3 0 0 0 0 0 0 0 1 1 1 1 1 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 0 1 0 0 0 0 RESET IRQ 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 A3 A2 1 1 ADCA CAN 1 1 1 1 W R W R W JTAG Reserved $A SIM_ CLKOSR $B SIM_GPS $C SIM_PCE $D SIM_ISALH $E SIM_ISALL R W R 0 0 C6 W R W R 1 1 DEC0 1 CLK DIS PHSA PHSB INDEX HOME 1 1 TMRC 1 1 CLKOSEL C5 B1 B0 A5 A4 TMRA SCI1 SCI0 SPI1 SPI0 1 1 1 1 1 1 W R 1 PWMA ISAL[23:22] ISAL[21:6] W = Reserved Figure 6-2 SIM Register Map Summary 6.5.1 SIM Control Register (SIM_CONTROL) Base + $0 15 14 13 12 11 10 9 8 7 6 5 4 Read 0 0 0 0 0 0 0 0 0 0 ONCE EBL0 SW RST 0 0 0 0 0 0 0 0 0 0 0 0 Write POR 3 2 1 0 STOP_ DISABLE WAIT_ DISABLE 0 0 0 0 Figure 6-3 SIM Control Register (SIM_CONTROL) 6.5.1.1 Reserved—Bits 15–6 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 56F8323 Technical Data, Rev. 17 86 Freescale Semiconductor Preliminary Register Descriptions 6.5.1.2 • • OnCE Enable (ONCE EBL)—Bit 5 0 = OnCE clock to 56800E core enabled when core TAP is enabled 1 = OnCE clock to 56800E core is always enabled 6.5.1.3 Software Reset (SW RST)—Bit 4 Writing 1 to this field will cause the part to reset. 6.5.1.4 • • Stop Disable (STOP_DISABLE)—Bits 3–2 00 = Stop mode will be entered when the 56800E core executes a STOP instruction 01 = The 56800E STOP instruction will not cause entry into Stop mode; STOP_DISABLE can be reprogrammed in the future 10 = The 56800E STOP instruction will not cause entry into Stop mode; STOP_DISABLE can then only be changed by resetting the device 11 = Same operation as 10 • • 6.5.1.5 • • Wait Disable (WAIT_DISABLE)—Bits 1–0 00 = Wait mode will be entered when the 56800E core executes a WAIT instruction 01 = The 56800E WAIT instruction will not cause entry into Wait mode; WAIT_DISABLE can be reprogrammed in the future 10 = The 56800E WAIT instruction will not cause entry into Wait mode; WAIT_DISABLE can then only be changed by resetting the device 11 = Same operation as 10 • • 6.5.2 SIM Reset Status Register (SIM_RSTSTS) Bits in this register are set upon any system reset and are initialized only by a Power-On Reset (POR). A reset (other than POR) will only set bits in the register; bits are not cleared. Only software should clear this register. Base + $1 15 14 13 12 11 10 9 8 7 6 Read 0 0 0 0 0 0 0 0 0 0 5 SWR 4 COPR 3 EXTR 2 1 0 0 0 0 0 POR Write RESET 0 0 0 0 0 0 0 0 0 0 Figure 6-4 SIM Reset Status Register (SIM_RSTSTS) 6.5.2.1 Reserved—Bits 15–6 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 6.5.2.2 Software Reset (SWR)—Bit 5 When 1, this bit indicates that the previous reset occurred as a result of a software reset (write to SW RST bit in the SIM CONTROL register). This bit will be cleared by any hardware reset or by software. Writing a 0 to this bit position will set the bit, while writing a 1 to the bit will clear it. 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 87 6.5.2.3 COP Reset (COPR)—Bit 4 When 1, the COPR bit indicates the Computer Operating Properly (COP) timer-generated reset has occurred. This bit will be cleared by a Power-On Reset or by software. Writing a 0 to this bit position will set the bit, while writing a 1 to the bit will clear it. 6.5.2.4 External Reset (EXTR)—Bit 3 If 1, the EXTR bit indicates an external system reset has occurred. This bit will be cleared by a Power-On Reset or by software. Writing a 0 to this bit position will set the bit while writing a 1 to the bit position will clear it. Basically, when the EXTR bit is 1, the previous system reset was caused by the external RESET pin being asserted low. 6.5.2.5 Power-On Reset (POR)—Bit 2 When 1, the POR bit indicates a Power-On Reset occurred some time in the past. This bit can be cleared only by software or by another type of reset. Writing a 0 to this bit will set the bit, while writing a 1 to the bit position will clear the bit. In summary, if the bit is 1, the previous system reset was due to a Power-On Reset. 6.5.2.6 Reserved—Bits 1–0 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 6.5.3 SIM Software Control Registers (SIM_SCR0, SIM_SCR1, SIM_SCR2, and SIM_SCR3) Only SIM SCR0 is shown in this section. SIM SCR1, SIM SCR2, and SIM SCR3 are identical in functionality. Base + $2 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 Read FIELD Write RESET 0 0 0 0 0 0 0 0 Figure 6-5 SIM Software Control Register 0 (SIM_SCR0) 6.5.3.1 Software Control Data 1 (FIELD)—Bits 15–0 This register is reset only by the Power-On Reset (POR). It has no part-specific functionality and is intended for use by a software developer to contain data that will be unaffected by the other reset sources (RESET pin, software reset, and COP reset). 6.5.4 Most Significant Half of JTAG ID (SIM_MSH_ID) This read-only register displays the most significant half of the JTAG ID for the chip. This register reads $01F4. 56F8323 Technical Data, Rev. 17 88 Freescale Semiconductor Preliminary Register Descriptions Base + $6 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Read 0 0 0 0 0 0 0 1 1 1 1 1 0 1 0 0 0 0 0 0 0 0 0 1 1 1 1 1 0 1 0 0 Write RESET Figure 6-6 Most Significant Half of JTAG ID (SIM_MSH_ID) 6.5.5 Least Significant Half of JTAG ID (SIM_LSH_ID) This read-only register displays the least significant half of the JTAG ID for the chip. This register reads $001D. Base + $7 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Read 0 1 0 0 0 0 0 0 0 0 0 1 1 1 0 1 0 0 0 0 0 0 0 0 0 0 0 1 1 1 0 1 Write RESET Figure 6-7 Least Significant Half of JTAG ID (SIM_LSH_ID) 6.5.6 SIM Pull-up Disable Register (SIM_PUDR) Most of the pins on the chip have on-chip pull-up resistors. Pins which can operate as GPIO can have these resistors disabled via the GPIO function. Non-GPIO pins can have their pull-ups disabled by setting the appropriate bit in this register. Disabling pull-ups is done on a peripheral-by-peripheral basis (for pins not muxed with GPIO). Each bit in the register (see Figure 6-8) corresponds to a functional group of pins. See Table 2-2 to identify which pins can deactivate the internal pull-up resistor. Base + $8 15 14 13 12 Read 0 0 0 0 11 10 RESET IRQ 0 0 9 8 7 6 5 4 0 0 0 0 0 0 3 2 1 0 0 0 0 0 0 0 JTAG Write RESET 0 0 0 0 0 0 0 0 0 0 0 Figure 6-8 SIM Pull-up Disable Register (SIM_PUDR) 6.5.6.1 Reserved—Bits 15–12 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 6.5.6.2 RESET—Bit 11 This bit controls the pull-up resistors on the RESET pin. 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 89 6.5.6.3 IRQ—Bit 10 This bit controls the pull-up resistors on the IRQA pin. 6.5.6.4 Reserved—Bits 9–4 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 6.5.6.5 JTAG—Bit 3 This bit controls the pull-up resistors on the TRST, TMS, and TDI pins. 6.5.6.6 Reserved—Bits 2–0 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 6.5.7 CLKO Select Register (SIM_CLKOSR) The CLKO select register can be used to multiplex out any one of the clocks generated inside the clock generation and SIM modules. The default value is SYS_CLK. All other clocks primarily muxed out are for test purposes only, and are subject to significant unspecified latencies at high frequencies. The upper four bits of the GPIOB register can function as GPIO, Quad Decoder #0 signals, or as additional clock output signals. GPIO has priority and is enabled/disabled via the GPIOB_PER. If GPIOB[7:4] are programmed to operate as peripheral outputs, then the choice between Quad Decoder #0 and additional clock outputs is made here in the CLKOSR. The default state is for the peripheral function of GPIOB[7:4] to be programmed as Quad Decoder #0. This can be changed by altering PHASE0 through INDEX shown in Figure 6-9. The CLKOUT pin is not bonded out in the device. Instead, it is offered only as a pad for die-level testing. Base + $A 15 14 13 12 11 10 Read 0 0 0 0 0 0 9 8 7 PHSA PHSB INDEX 6 5 HOME CLK DIS 0 1 Write RESET 0 0 0 0 0 0 0 0 0 4 3 2 1 0 0 0 CLKOSEL 0 0 0 Figure 6-9 CLKO Select Register (SIM_CLKOSR) 6.5.7.1 Reserved—Bits 15–10 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 6.5.7.2 • • 0 = Peripheral output function of GPIOB[7] is defined to be PHASEA0 1 = Peripheral output function of GPIOB[7] is defined to be the oscillator clock (MSTR_OSC, see Figure 3-4) 6.5.7.3 • • PHASEA0 (PHSA)—Bit 9 PHASEB0 (PHSB)—Bit 8 0 = Peripheral output function of GPIOB[6] is defined to be PHASEB0 1 = Peripheral output function of GPIOB[6] is defined to be SYS_CLK2 56F8323 Technical Data, Rev. 17 90 Freescale Semiconductor Preliminary Register Descriptions 6.5.7.4 • • 0 = Peripheral output function of GPIOB[5] is defined to be INDEX0 1 = Peripheral output function of GPIOB[5] is defined to be SYS_CLK 6.5.7.5 • • HOME0 (HOME)—Bit 6 0 = Peripheral output function of GPIOB[4] is defined to be HOME0 1 = Peripheral output function of GPIOB[4] is defined to be the prescaler clock (FREF, see Figure 3-4) 6.5.7.6 • • INDEX0 (INDEX)—Bit 7 Clockout Disable (CLKDIS)—Bit 5 0 = CLKOUT output is enabled and will output the signal indicated by CLKOSEL 1 = CLKOUT is tri-stated 6.5.7.7 CLockout Select (CLKOSEL)—Bits 4–0 Selects clock to be muxed out on the CLKO pin. • • • • • • • • • 00000 = SYS_CLK (from ROCS - DEFAULT) 00001 = Reserved for factory test—56800E clock 00010 = Reserved for factory test—XRAM clock 00011 = Reserved for factory test—PFLASH odd clock 00100 = Reserved for factory test—PFLASH even clock 00101 = Reserved for factory test—BFLASH clock 00110 = Reserved for factory test—DFLASH clock 00111 = MSTR_OSC Oscillator output 01000 = Fout (from OCCS) • • • • • • • • 01001 = Reserved for factory test—IPB clock 01010 = Reserved for factory test—Feedback (from OCCS, this is path to PLL) 01011 = Reserved for factory test—Prescaler clock (from OCCS) 01100 = Reserved for factory test—Postscaler clock (from OCCS) 01101 = Reserved for factory test—SYS_CLK2 (from OCCS) 01110 = Reserved for factory test—SYS_CLK_DIV2 01111 = Reserved for factory test—SYS_CLK_D 10000 = ADCA clock 6.5.8 SIM GPIO Peripheral Select Register (SIM_GPS) All of the peripheral pins on the 56F8323 and 56F8123 share their I/O with GPIO ports. To select peripheral or GPIO control, program the GPIOx_PER register. When SPI 0 and SCI 1, Quad Timer C and SCI 0, or PWMA and SPI 1 are multiplexed, there are two possible peripherals as well as the GPIO functionality available for control of the I/O. The SIM_GPS register is used to determine which peripheral has control. The default peripherals are SPI 0, Quad Timer C, and PWMA. Note: PWM is NOT available in the 56F8123 device. As shown in Figure 6-10, the GPIO has the final control over the pin function. SIM_GPS simply decides which peripheral will be routed to the I/O. 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 91 GPIOX_PER Register 0 GPIO Controlled I/O Pad Control 1 SIM_GPS Register 0 Quad Timer Controlled 1 SCI Controlled Figure 6-10 Overall Control of Pads Using SIM_GPS Control Base + $B 15 14 13 12 11 10 9 8 Read 0 0 0 0 0 0 0 0 7 6 5 4 3 2 1 0 C6 C5 B1 B0 A5 A4 A3 A2 0 0 0 0 0 0 0 0 Write RESET 0 0 0 0 0 0 0 0 Figure 6-11 GPIO Peripheral Select Register (SIM_GPS) 6.5.8.1 Reserved—Bits 15–8 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 6.5.8.2 GPIOC6 (C6)—Bit 7 This bit selects the alternate function for GPIOC6. • • 0 = TC0 (default) 1 = TXD0 6.5.8.3 GPIOC5 (C5)—Bit 6 This bit selects the alternate function for GPIOC5. • • 0 = TC1 (default) 1 = RXD0 6.5.8.4 GPIOB1 (B1)—Bit 5 This bit selects the alternate function for GPIOB1. • • 0 = MISO0 (default) 1 = RXD1 56F8323 Technical Data, Rev. 17 92 Freescale Semiconductor Preliminary Register Descriptions 6.5.8.5 GPIOB0 (B0)—Bit 4 This bit selects the alternate function for GPIOB0. • • 0 = SS0 (default) 1 = TXD1 6.5.8.6 GPIOA5 (A5)—Bit 3 This bit selects the alternate function for GPIOA5. • • 0 = PWMA5 1 = SCLK1 6.5.8.7 GPIOA4 (A4)—Bit 2 This bit selects the alternate function for GPIOA4. • • 0 = PWMA4 1 = MOS1 6.5.8.8 GPIOA3 (A3)—Bit 1 This bit selects the alternate function for GPIOA3. • • 0 = PWMA3 1 = MISO1 6.5.8.9 GPIOA2 (A2)—Bit 0 This bit selects the alternate function for GPIOA2. • • 0 = PWMA2 1 = SS1 6.5.9 Peripheral Clock Enable Register (SIM_PCE) The Peripheral Clock Enable register is used to enable or disable clocks to the peripherals as a power savings feature. The clocks can be individually controlled for each peripheral on the chip. Base + $C 15 14 Read 1 1 13 12 11 10 1 ADCA CAN 1 1 9 8 1 DEC0 7 6 5 4 3 2 1 TMRC 1 0 1 TMRA SCI 1 SCI 0 SPI1 SPI0 1 1 PWMA Write RESET 1 1 1 1 1 1 1 1 1 1 1 1 Figure 6-12 Peripheral Clock Enable Register (SIM_PCE) 6.5.9.1 Reserved—Bits 15–14 This bit field is reserved or not implemented. It is read as 1 and cannot be modified by writing. 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 93 6.5.9.2 Analog-to-Digital Converter A Enable (ADCA)—Bit 13 Each bit controls clocks to the indicated peripheral. • • 1 = Clocks are enabled 0 = The clock is not provided to the peripheral (the peripheral is disabled) 6.5.9.3 FlexCAN Enable (CAN)—Bit 12 Each bit controls clocks to the indicated peripheral. • • 1 = Clocks are enabled 0 = The clock is not provided to the peripheral (the peripheral is disabled) 6.5.9.4 Reserved—Bit 11 This bit field is reserved or not implemented. It is read as 1 and cannot be modified by writing. 6.5.9.5 Decoder 0 Enable (DEC0)—Bit 10 Each bit controls clocks to the indicated peripheral. • • 1 = Clocks are enabled 0 = The clock is not provided to the peripheral (the peripheral is disabled) 6.5.9.6 Reserved—Bit 9 This bit field is reserved or not implemented. It is read as 1 and cannot be modified by writing. 6.5.9.7 Quad Timer C Enable (TMRC)—Bit 8 Each bit controls clocks to the indicated peripheral. • • 1 = Clocks are enabled 0 = The clock is not provided to the peripheral (the peripheral is disabled) 6.5.9.8 Reserved—Bit 7 This bit field is reserved or not implemented. It is read as 1 and cannot be modified by writing. 6.5.9.9 Quad Timer A Enable (TMRA)—Bit 6 Each bit controls clocks to the indicated peripheral. • • 1 = Clocks are enabled 0 = The clock is not provided to the peripheral (the peripheral is disabled) 6.5.9.10 Serial Communications Interface 1 Enable (SCI1)—Bit 5 Each bit controls clocks to the indicated peripheral. • • 1 = Clocks are enabled 0 = The clock is not provided to the peripheral (the peripheral is disabled) 56F8323 Technical Data, Rev. 17 94 Freescale Semiconductor Preliminary Register Descriptions 6.5.9.11 Serial Communications Interface 0 Enable (SCI0)—Bit 4 Each bit controls clocks to the indicated peripheral. • • 1 = Clocks are enabled 0 = The clock is not provided to the peripheral (the peripheral is disabled) 6.5.9.12 Serial Peripheral Interface 1 Enable (SPI1)—Bit 3 Each bit controls clocks to the indicated peripheral. • • 1 = Clocks are enabled 0 = The clock is not provided to the peripheral (the peripheral is disabled) 6.5.9.13 Serial Peripheral Interface 0 Enable (SPI0)—Bit 2 Each bit controls clocks to the indicated peripheral. • • 1 = Clocks are enabled 0 = The clock is not provided to the peripheral (the peripheral is disabled) 6.5.9.14 Reserved—Bit 1 This bit field is reserved or not implemented. It is read as 1 and cannot be modified by writing. 6.5.9.15 Pulse Width Modulator A Enable (PWMA)—Bit 0 Each bit controls clocks to the indicated peripheral. • • 1 = Clocks are enabled 0 = The clock is not provided to the peripheral (the peripheral is disabled) 6.5.10 I/O Short Address Location Register (SIM_ISALH and SIM_ISALL) The I/O Short Address Location registers are used to specify the memory referenced via the I/O short address mode. The I/O short address mode allows the instruction to specify the lower six bits of address; the upper address bits are not directly controllable. This register set allows limited control of the full address, as shown in Figure 6-13. Note: If this register is set ot something other than the top of memory (EOnCE register space) and the EX bit in the OMR is set to 1, the JTAG port cannot access the on-chip EOnCE registers, and debug functions will be affected. 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 95 “Hard Coded” Address Portion Instruction Portion 6 Bits from I/O Short Address Mode Instruction 16 Bits from SIM_ISALL Register 2 bits from SIM_ISALH Register Full 24-Bit for Short I/O Address Figure 6-13 I/O Short Address Determination With this register set, an interrupt driver can set the SIM_ISALL register pair to point to its peripheral registers and then use the I/O Short addressing mode to reference them. The ISR should restore this register to its previous contents prior to returning from interrupt. Note: The default value of this register set points to the EOnCE registers. Note: The pipeline delay between setting this register set and using short I/O addressing with the new value is five cycles. Base + $D 15 14 13 12 11 10 9 8 7 6 5 4 3 2 Read 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 ISAL[23:22] Write 1 RESET 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Figure 6-14 I/O Short Address Location High Register (SIM_ISALH) 6.5.10.1 Input/Output Short Address Low (ISAL[23:22])—Bit 1–0 This field represents the upper two address bits of the “hard coded” I/O short address. Base + $E 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 1 1 1 1 1 1 1 Read ISAL[21:6] Write RESET 1 1 1 1 1 1 1 1 1 Figure 6-15 I/O Short Address Location Low Register (SIM_ISALL) 56F8323 Technical Data, Rev. 17 96 Freescale Semiconductor Preliminary Clock Generation Overview 6.5.10.2 Input/Output Short Address Low (ISAL[21:6])—Bit 15–0 This field represents the lower 16 address bits of the “hard coded” I/O short address. 6.6 Clock Generation Overview The SIM uses an internal master clock from the OCCS (CLKGEN) module to produce the peripheral and system (core and memory) clocks. The maximum master clock frequency is 120MHz. Peripheral and system clocks are generated at half the master clock frequency and therefore at a maximum 60MHz. The SIM provides power modes (Stop, Wait) and clock enables (SIM_PCE register, CLK_DIS, ONCE_EBL) to control which clocks are in operation. The OCCS, power modes, and clock enables provide a flexible means to manage power consumption. Power utilization can be minimized in several ways. In the OCCS, the relaxation oscillator, crystal oscillator, and PLL may be shut down when not in use. When the PLL is in use, its prescaler and postscaler can be used to limit PLL and master clock frequency. Power modes permit system and/or peripheral clocks to be disabled when unused. Clock enables provide the means to disable individual clocks. Some peripherals provide further controls to disable unused subfunctions. Refer to Part 3 On-Chip Clock Synthesis (OCCS), and the 56F8300 Peripheral User Manual for further details. The memory, peripheral and core clocks all operate at the same frequency (60MHz max). 6.7 Power-Down Modes The 56F8323/56F8123 operate in one of three power-down modes, as shown in Table 6-2. Table 6-2 Clock Operation in Power-Down Modes Mode Core Clocks Peripheral Clocks Description Run Active Active Device is fully functional Wait Core and memory clocks disabled Active Peripherals are active and can produce interrupts if they have not been masked off. Interrupts will cause the core to come out of its suspended state and resume normal operation. Typically used for power-conscious applications. Stop System clocks continue to be generated in the SIM, but most are gated prior to reaching memory, core and peripherals. The only possible recoveries from Stop mode are: 1. CAN traffic (1st message will be lost) 2. Non-clocked interrupts (IRQA) 3. COP reset 4. External reset 5. Power-on reset All peripherals, except the COP/watchdog timer, run off the IPBus clock frequency, which is the same as the main processor frequency in this architecture. The maximum frequency of operation is SYS_CLK = 60MHz. Refer to the PCE register in Part 6.5.9 and ADC power modes. Power is a function of the system frequency, which can be controlled through the OCCS. 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 97 6.8 Stop and Wait Mode Disable Function Permanent Disable D Q D-FLOP C Reprogrammable Disable D 56800E STOP_DIS Q D-FLOP Clock Select C R Reset Note: Wait disable circuit is similar Figure 6-16 Internal Stop Disable Circuit The 56800E core contains both STOP and WAIT instructions. Both put the CPU to sleep. For lowest power consumption in Stop mode, the PLL can be shut down. This must be done explicitly before entering Stop mode, since there is no automatic mechanism for this. When the PLL is shut down, the 56800E system clock must be set equal to the prescaler output. Some applications require the 56800E STOP and WAIT instructions be disabled. To disable those instructions, write to the SIM control register (SIM_CONTROL) described in Part 6.5.1. This procedure can be on either a permanent or temporary basis. Permanently assigned applications last only until their next reset. 6.9 Resets The SIM supports four sources of reset. The two asynchronous sources are the external RESET pin and the Power-On Reset (POR). The two synchronous sources are the software reset, which is generated within the SIM itself, by writing to the SIM_CONTROL register, and the COP reset. Reset begins with the assertion of any of the reset sources. Release of reset to various blocks is sequenced to permit proper operation of the device. A POR reset is declared when reset is removed and any of the three voltage detectors (1.8V POR, 2.2V core voltage, or 2.7V I/O voltage) indicate a low supply voltage condition. POR will continue to be asserted until all voltage detectors indicate a stable supply is available (note that as power is removed POR is not declared until the 1.8V core voltage threshold is reached.) A POR reset is then extended for 64 clock cycles to permit stabilization of the clock source, followed by a 32 clock window in which SIM clocking is initiated. It is then followed by a 32 clock window in which peripherals are released to implement Flash security, and, finally, followed by a 32 clock window in which the core is initialized. After completion of the described reset sequence, application code will begin execution. Resets may be asserted asynchronously, but are always released internally on a rising edge of the system clock. 56F8323 Technical Data, Rev. 17 98 Freescale Semiconductor Preliminary Operation with Security Enabled Part 7 Security Features The 56F8323/56F8123 offer security features intended to prevent unauthorized users from reading the contents of the Flash memory (FM) array. The Flash security consists of several hardware interlocks that block the means by which an unauthorized user could gain access to the Flash array. However, part of the security must lie with the user’s code. An extreme example would be user’s code that dumps the contents of the internal program, as this code would defeat the purpose of security. At the same time, the user may also wish to put a “backdoor” in his program. As an example, the user downloads a security key through the SCI, allowing access to a programming routine that updates parameters stored in another section of the Flash. 7.1 Operation with Security Enabled Once the user has programmed the Flash with his application code, the device can be secured by programming the security bytes located in the FM configuration field, which occupies a portion of the FM array. These non-volatile bytes will keep the part secured through reset and through power-down of the device. Only two bytes within this field are used to enable or disable security. Refer to the Flash Memory section in the 56F8300 Peripheral User Manual for the state of the security bytes and the resulting state of security. When Flash security mode is enabled in accordance with the method described in the Flash Memory module specification, the device will disable the EOnCE interface, preventing access to internal code. Normal program execurtion is otherwise unaffected. 7.2 Flash Access Blocking Mechanisms The 56F8323/56F8123 have several operating functional and test modes. Effective Flash security must address operating mode selection and anticipate modes in which the on-chip Flash can be compromised and read without explicit user permission. Methods to block these are outlined in the next subsections. 7.2.1 Forced Operating Mode Selection At boot time, the SIM determines in which functional modes the device will operate. These are: • • Unsecured Mode Secure Mode (EOnCE disabled) When Flash security is enabled as described in the Flash Memory module specification, the device will disable the EOnCE debug interface. 7.2.2 Disabling EOnCE Access On-chip Flash can be read by issuing commands across the EOnCE port, which is the debug interface for the 56800E core. The TRST, TCLK, TMS, TDO, and TDI pins comprise a JTAG interface onto which the EOnCE port functionality is mapped. When the device boots, the chip-level JTAG TAP (Test Access Port) is active and provides the chip’s boundary scan capability and access to the ID register. Proper implementation of Flash security requires that no access to the EOnCE port is provided when security is enabled. The 56800E core has an input which disables reading of internal memory via the JTAG/EOnCE. The FM sets this input at reset to a value determined by the contents of the FM security bytes. 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 99 7.2.3 Flash Lockout Recovery If a user inadvertently enables Flash security on the device, a built-in lockout recovery mechanism can be used to reenable access to the device. This mechanism completely reases all on-chip Flash, thus disabling Flash security. Access to this recovery mechanism is built into CodeWarrior via an instruction in memory configuration (.cfg) files. Add, or uncomment the following configuration command: unlock_flash_on_connect 1 For more information, please see CodeWarrior MC56F83xx/DSP5685x Family Targeting Manual. The LOCKOUT_RECOVERY instruction has an associated 7-bit Data Register (DR) that is used to control the clock divider circuit within the FM module. This divider, FM_CLKDIV[6:0], is used to control the period of the clock used for timed events in the FM erase algorithm. This register must be set with appropriate values before the lockout sequence can begin. Refer to the 56F8300 Peripheral User Manual for more details on setting this register value. The value of the JTAG FM_CLKDIV[6:0] will replace the value of the FM register FMCLKD that divides down the system clock for timed events, as illustrated in Figure 7-1. FM_CLKDIV[6] will map to the PRDIV8 bit, and FM_CLKDIV[5:0] will map to the DIV[5:0] bits. The combination of PRDIV8 and DIV must divide the FM input clock down to a frequency of 150kHz-200kHz. The “Writing the FMCLKD Register” section in the Flash Memory chapter of the 56F8300 Peripheral User Manual gives specific equations for calculating the correct values. Flash Memory SYS_CLK input 2 clock DIVIDER 7 FMCLKD 7 FMCLKDIV JTAG 7 FMERASE Figure 7-1 JTAG to FM Connection for Lockout Recovery Two examples of FM_CLKDIV calculations follow. 56F8323 Technical Data, Rev. 17 100 Freescale Semiconductor Preliminary Flash Access Blocking Mechanisms EXAMPLE 1: If the system clock is the 8MHz crystal frequency because the PLL has not been set up, the input clock will be below 12.8MHz, so PRDIV8=FM_CLKDIV[6]=0. Using the following equation yields a DIV value of 19 for a clock of 200kHz, and a DIV value of 20 for a clock of 190kHz. This translates into an FM_CLKDIV[6:0] value of $13 or $14, respectively. 150[kHz] ( < SYS_CLK (2) (DIV + 1) )< 200[kHz] EXAMPLE 2: In this example, the system clock has been set up with a value of 32MHz, making the FM input clock 16MHz. Because that is greater than 12.8MHz, PRDIV8=FM_CLKDIV[6]=1. Using the following equation yields a DIV value of 9 for a clock of 200kHz, and a DIV value of 10 for a clock of 181kHz. This translates to an FM_CLKDIV[6:0] value of $49 or $4A, respectively. 150[kHz] ( < SYS_CLK (2)(8) (DIV + 1) )< 200[kHz] Once the LOCKOUT_RECOVERY instruction has been shifted into the instruction register, the clock divider value must be shifted into the corresponding 7-bit data register. After the data register has been updated, the user must transition the TAP controller into the RUN-TEST/IDLE state for the lockout sequence to commence. The controller must remain in this state until the erase sequence has completed. For details, see the JTAG Section in the 56F8300 Peripheral User Manual. Note: Once the lockout recovery sequence has completed, the user must reset both the JTAG TAP controller (by asserting TRST) and the device (by asserting external chip reset) to return to normal unsecured operation. 7.2.4 Product Analysis The recommended method of unsecuring a programmed device for product analysis of field failures is via the backdoor key access. The customer would need to supply Technical Support with the backdoor key and the protocol to access the backdoor routine in the Flash. Additionally, the KEYEN bit that allows backdoor key access must be set. An alternative method for performing analysis on a secured microcontroller would be to mass-erase and reprogram the Flash with the original code, but to modify the security bytes. To insure that a customer does not inadvertently lock himself out of the device during programming, it is recommended that he program the backdoor access key first, his application code second and the security bytes within the FM configuration field last. 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 101 Part 8 General Purpose Input/Output (GPIO) 8.1 Introduction This section is intended to supplement the GPIO information found in the 56F8300 Peripheral User Manual and contains only chip-specific information. This information supercedes the generic information in the 56F8300 Peripheral User Manual. 8.2 Configuration There are three GPIO ports defined on the 56F8323/56F8123. The width of each port and the associated peripheral function is shown in Table 8-1 and Table 8-2. The specific mapping of GPIO port pins is shown in Table 8-3. Table 8-1 56F8323 GPIO Ports Configuration GPIO Port Port Width Available Pins in 56F8323 A 12 12 PWM, SPI 1 PWM B 8 8 SPI 0, DEC 0, TMRA, SCI 1 SPI 0, DEC 0 C 7 7 XTAL, EXTAL, CAN, TMRC, SCI 0 XTAL, EXTAL, CAN, TMRC Peripheral Function Reset Function Table 8-2 56F8123 GPIO Ports Configuration GPIO Port Port Width Available Pins in 56F8123 A 12 12 SPI 1 Must be reconfigured B 8 8 SPI 0, SCI 1, TMRA SPI 0; other pins must be reconfigured C 7 7 XTAL, EXTAL, TMRC, SCI 0 XTAL, EXTAL, TMRC; other pins must be reconfigured Peripheral Function Reset Function Note: Pins in italics are NOT available in the 56F8123 device. 56F8323 Technical Data, Rev. 17 102 Freescale Semiconductor Preliminary Configuration Table 8-3 GPIO External Signals Map Peripheral Function GPIO Function Package Pin Notes GPIOA0 PWMA0 3 PWM is NOT available in 56F8123 GPIOA1 PWMA1 4 PWM is NOT available in 56F8123 GPIOA2 PWMA2 / SSI 7 SIM register SIM_GPS is used to select between SPI1 and PWMA on a pin-by-pin basis PWM is NOT available in 56F8123 GPIOA3 PWMA3 / MISO1 8 SIM register SIM_GPS is used to select between SPI1 and PWMA on a pin-by-pin basis PWM is NOT available in 56F8123 GPIOA4 PWMA4 / MOSI1 9 SIM register SIM_GPS is used to select between SPI1 and PWMA on a pin-by-pin basis PWM is NOT available in 56F8123 GPIOA5 PWMA5 / SCLK1 10 SIM register SIM_GPS is used to select between SPI1 and PWMA on a pin-by-pin basis PWM is NOT available in 56F8123 GPIOA6 FAULTA0 13 GPIOA7 FAULTA1 14 GPIOA8 FAULTA2 15 GPIOA9 ISA0 16 GPIOA10 ISA0 18 GPIOA11 ISA2 19 GPIOB0 SS0 / TXD1 21 SIM register SIM_GPS is used to select between SPI1 and PWMA on a pin-by-pin basis GPIOB1 MISO0 / RXD1 22 SIM register SIM_GPS is used to select between SPI1 and PWMA on a pin-by-pin basis GPIOB2 MOSI0 24 GPIOB3 SCLK0 25 GPIOB4 HOME0 / TA3 49 Quad Decoder 0 register DECCR is used to select between Decoder 0 and Timer A Quad Decoder is NOT available in 56F8123 GPIOB5 INDEX0 / TA2 50 Quad Decoder 0 register DECCR is used to select between Decoder 0 and Timer A Quad Decoder is NOT available in 56F8123 GPIOB6 PHASEB0 / TA1 51 Quad Decoder 0 register DECCR is used to select between Decoder 0 and Timer A Quad Decoder is NOT available in 56F8123 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 103 Table 8-3 GPIO External Signals Map (Continued) GPIO Function Peripheral Function Package Pin Notes GPIOB7 PHASEA0 / TA0 52 Quad Decoder 0 register DECCR is used to select between Decoder 0 and Timer A Quad Decoder is NOT available in 56F8123 GPIOC0 EXTAL 46 Pull-ups default to disabled GPIOC1 XTAL 47 Pull-ups default to disabled GPIOC2 CAN_RX 61 CAN is NOT available in 56F8123 GPIOC3 CAN_TX 62 CAN is NOT available in 56F8123 GPIOC4 TC3 63 GPIOC5 TC1 / RXD0 64 SIM register SIM_GPS is used to select between Timer C and SCI0 on a pin-by-pin basis GPIOC6 TC0 / TXD0 1 SIM register SIM_GPS is used to select between Timer C and SCI0 on a pin-by-pin basis 8.3 Memory Maps The width of the GPIO port defines how many bits are implemented in each of the GPIO registers. Based on this and the default function of each of the GPIO pins, the reset values of the GPIOX_PUR and GPIOX_PER registers change from port to port. Tables 4-21 through 4-23 define the actual reset values of these registers. Part 9 Joint Test Action Group (JTAG) 9.1 JTAG Information Please contact your Freescale sales representative or authorized distributor for device/package-specific BSDL information. 56F8323 Technical Data, Rev. 17 104 Freescale Semiconductor Preliminary General Characteristics Part 10 Specifications 10.1 General Characteristics The 56F8323/56F8123 are fabricated in high-density CMOS with 5V-tolerant TTL-compatible digital inputs. The term “5V-tolerant” refers to the capability of an I/O pin, built on a 3.3V-compatible process technology, to withstand a voltage up to 5.5V without damaging the device. Many systems have a mixture of devices designed for 3.3V and 5V power supplies. In such systems, a bus may carry both 3.3V- and 5V-compatible I/O voltage levels (a standard 3.3V I/O is designed to receive a maximum voltage of 3.3V ± 10% during normal operation without causing damage). This 5V-tolerant capability therefore offers the power savings of 3.3V I/O levels combined with the ability to receive 5V levels without damage. Absolute maximum ratings in Table 10-1 are stress ratings only, and functional operation at the maximum is not guaranteed. Stress beyond these ratings may affect device reliability or cause permanent damage to the device. Note: All specifications meet both Automotive and Industrial requirements unless individual specifications are listed. Note: The 56F8123 device is guaranteed to 40MHz and specified to meet Industrial requirements only. CAUTION This device contains protective circuitry to guard against damage due to high static voltage or electrical fields. However, normal precautions are advised to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate voltage level. 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 105 Note: The 56F8123 device is specified to meet Industrial requirements only; PWM, CAN and Quad Decoder are NOT available on the 56F8123 device. Table 10-1 Absolute Maximum Ratings (VSS = VSSA_ADC = 0) Characteristic Supply voltage ADC Supply Voltage Oscillator / PLL Supply Voltage Symbol Notes VDD_IO VDDA_ADC, VREFH VREFH must be less than or equal to VDDA_ADC VDDA_OSC_PLL Min Max Unit - 0.3 4.0 V - 0.3 4.0 V - 0.3 4.0 V VDD_CORE OCR_DIS is High - 0.3 3.0 V Input Voltage (digital) VIN Pin Groups 1, 3, 4, 5 -0.3 6.0 V Input Voltage (analog) VINA Pin Groups 7, 8 -0.3 4.0 V Output Voltage VOUT Pin Groups 1, 2, 3 -0.3 4.0 6.01 V VOUTOD GPIO pins used in open drain mode -0.3 6.0 V Internal Logic Core Supply Voltage Output Voltage (open drain) Ambient Temperature (Automotive) TA -40 125 °C Ambient Temperature (Industrial) TA -40 105 °C Junction Temperature (Automotive) TJ -40 150 °C Junction Temperature (Industrial) TJ -40 125 °C Storage Temperature (Automotive) TSTG -55 150 °C Storage Temperature (Industrial) TSTG -55 150 °C 1. If corresponding GPIO pin is configured as open drain. Note: Pins in italics are NOT available in the 56F8123 device. Pin Group 1: TC0-1, TC3, FAULTA0-2, ISA0-2, SS0, MISO0, MOSI0, SCLK0, HOME0, INDEX0, PHASEA0, PHASEB0, CAN_RX, CAN_TX, GPIOC0-1 Pin Group 2: TDO Pin Group 3: PWMA0-5 Pin Group 4: RESET, TMS, TDI, TRST, IRQA Pin Group 5: TCK Pin Group 6: XTAL, EXTAL Pin Group 7: ANA0-7 Pin Group 8: OCR_DIS 56F8323 Technical Data, Rev. 17 106 Freescale Semiconductor Preliminary General Characteristics Table 10-2 56F8323/56F8123 ElectroStatic Discharge (ESD) Protection Characteristic Min Typ Max Unit ESD for Human Body Model (HBM) 2000 — — V ESD for Machine Model (MM) 200 — — V ESD for Change Device Model (CDM) 500 — — V Table 10-3 Thermal Characteristics6 Value Characteristic Comments Symbol Unit Notes 64-pin LQFP Junction to ambient Natural Convection Junction to ambient (@1m/sec) RθJA 41 °C/W 2 RθJMA 34 °C/W 2 Junction to ambient Natural Convection Four layer board (2s2p) RθJMA (2s2p) 34 °C/W 1,2 Junction to ambient (@1m/sec) Four layer board (2s2p) RθJMA 29 °C/W 1,2 Junction to case RθJC 8 °C/W 3 Junction to center of case ΨJT 2 °C/W 4, 5 I/O pin power dissipation P I/O User-determined W Power dissipation PD P D = (IDD x VDD + P I/O) W PDMAX (TJ - TA) / RθJA7 W Maximum allowed PD 1. Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application. Determined on 2s2p thermal test board. 2. Junction-to-ambient thermal resistance, Theta-JA (RθJA ), was simulated to be equivalent to the JEDEC specification JESD51-2 in a horizontal configuration in natural convection. Theta-JA was also simulated on a thermal test board with two internal planes (2s2p, where “s” is the number of signal layers and “p” is the number of planes) per JESD51-6 and JESD51-7. The correct name for Theta-JA for forced convection or with the non-single layer boards is Theta-JMA. 3. Junction-to-case thermal resistance, Theta-JC (RθJC ), was simulated to be equivalent to the measured values using the cold plate technique with the cold plate temperature used as the "case" temperature. The basic cold plate measurement technique is described by MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when the package is being used with a heat sink. 4. Thermal Characterization Parameter, Psi-JT (ΨJT ), is the "resistance" from junction to reference point thermocouple on top center of case as defined in JESD51-2. ΨJT is a useful value to estimate junction temperature in steady-state customer environments. 5. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. 6. See Part 12.1 for more details on thermal design considerations. 7. TJ = Junction temperature TA = Ambient temperature 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 107 Note: The 56F8123 device is guaranteed to 40MHz and specified to meet Industrial requirements only; PWM, CAN and Quad Decoder are NOT available on the 56F8123 device. Table 10-4 Recommended Operating Conditions (VREFLO = 0V, VSS = VSSA_ADC = 0V, VDDA = VDDA_ADC = VDDA_OSC_PLL ) Characteristic Supply voltage ADC Supply Voltage Symbol Notes VDD_IO VDDA_ADC, VREFH VREFH must be less Min Typ Max Unit 3 3.3 3.6 V 3 3.3 3.6 V 3 3.3 3.6 V 2.25 2.5 2.75 V 0 — 60/40 MHz than or equal to VDDA_ADC Oscillator / PLL Supply Voltage VDDA_OSC_PLL Internal Logic Core Supply Voltage VDD_CORE Device Clock Frequency FSYSCLK OCR_DIS is High Input High Voltage (digital) VIN Pin Groups 1, 3, 4, 5 2 — 5.5 V Input High Voltage (analog) VIHA Pin Group 8 2 — VDDA+0.3 V Input High Voltage (XTAL/EXTAL, VIHC Pin Group 6 VDDA-0.8 — VDDA+0.3 V VIHC Pin Group 6 2 — VDDA+0.3 V Input Low Voltage VIL Pin Groups 1, 3, 4, 5, 6, 8 -0.3 — 0.8 V Output High Source Current VOH = 2.4V (VOH min.) IOH Pin Groups 1, 2 — — -4 mA Pin Group 3 — — -12 Output Low Sink Current VOL = 0.4V (VOL max) IOL Pin Groups 1, 2 — — 4 — — 12 Ambient Operating Temperature (Automotive) TA -40 — 125 °C Ambient Operating Temperature (Industrial) TA -40 — 105 °C Flash Endurance (Automotive) (Program Erase Cycles) NF TA = -40°C to 125°C 10,000 — — Cycles Flash Endurance (Industrial) (Program Erase Cycles) NF TA = -40°C to 105°C 10,000 — — Cycles Flash Data Retention (Automotive and Industrial) TR TJ <= 85°C avg 15 — — Years XTAL is not driven by an external clock) Input high voltage (XTAL/EXTAL, XTAL is driven by an external clock) Pin Group 3 mA Note: Total chip source or sink current cannot exceed 150mA. Note: Pins in italics are NOT available in the 56F8123 device. See Pin Groups in Table 10-1 56F8323 Technical Data, Rev. 17 108 Freescale Semiconductor Preliminary DC Electrical Characteristics 10.2 DC Electrical Characteristics Note: The 56F8123 device is specified to meet Industrial requirements only; PWM, CAN and Quad Decoder are NOT available on the 56F8123 device. Table 10-5 DC Electrical Characteristics At Recommended Operating Conditions; see Table 10-4 Characteristic Symbol Notes Min Typ Max Unit Test Conditions Output High Voltage VOH 2.4 — — V IOH = IOHmax Output Low Voltage VOL — — 0.4 V IOL = IOLmax IIH Pin Groups 1, 3, 4 — 0 +/- 2.5 μA VIN = 3.0V to 5.5V IIH Pin Group 5 40 80 160 μA VIN = 3.0V to 5.5V IIHA Pin Group 8 — 0 +/- 2.5 μA VIN = VDDA ADC Input Current High IIHADC Pin Group 7 — 0 +/- 3.5 μA VIN = VDDA Digital Input Current Low IIL Pin Groups 1, 3, 4 -200 -100 -50 μA VIN = 0V IIL Pin Groups 1, 3, 4 — 0 +/- 2.5 μA VIN = 0V IIL Pin Group 5 — 0 +/- 2.5 μA VIN = 0V IILA Pin Group 8 — 0 +/- 2.5 μA VIN = 0V ADC Input Current Low IILADC Pin Group 7 — 0 +/- 3.5 μA VIN = 0V EXTAL Input Current Low IEXTAL — 0 +/- 2.5 μA VIN = VDDA or 0V CLKMODE = High — 0 +/- 2.5 μA VIN = VDDA or 0V CLKMODE = Low — — 200 μA VIN = VDDA or 0V IOZ Pin Groups 1, 2, 3 — 0 +/- 2.5 μA VOUT = 3.0V to 5.5V or 0V Schmitt Trigger Input Hysteresis VHYS Pin Groups 1, 3, 4, 5 — 0.3 — V Input Capacitance (EXTAL/XTAL) CINC — 4.5 — pF COUTC — 5.5 — pF CIN — 6 — pF COUT — 6 — pF Digital Input Current High pull-up enabled or disabled Digital Input Current High with pull-down Analog Input Current High pull-up enabled Digital Input Current Low pull-up disabled Digital Input Current Low with pull-down Analog Input Current Low clock input XTAL Input Current Low IXTAL clock input Output Current High Impedance State Output Capacitance (EXTAL/XTAL) Input Capacitance Output Capacitance See Pin Groups in Table 10-1 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 109 Table 10-6 Power-On Reset Low Voltage Parameters Characteristic Symbol Min Typ Max Units POR Trip Point Rising1 PORR — — — V POR Trip Point Falling PORF 1.75 1.8 1.9 V LVI, 2.5V Supply, trip point2 VEI2.5 — 2.14 — V LVI, 3.3V supply, trip point3 VEI3.3 — 2.7 — V Bias Current I bias — 110 130 μA 1. Both VEI2.5 and VEI3.3 thresholds must be met for POR to be released on power-up. 2. When VDD_CORE drops below VEI2.5, an interrupt is generated. 3. When VDD_CORE drops below VEI3.3, an interrupt is generated. Table 10-7 Current Consumption per Power Supply Pin (Typical) On-Chip Regulator Enabled (OCR_DIS = Low) Mode RUN1_MAC IDD_IO1 IDD_ADC IDD_OSC_PLL 115mA 25mA 2.5mA Test Conditions • 60MHz Device Clock • All peripheral clocks are enabled • Continuous MAC instructions with fetches from Data RAM • ADC powered on and clocked Wait3 60mA 35μA 2.5mA • 60MHz Device Clock • All peripheral clocks are enabled • ADC powered off Stop1 5.7mA 0μA 360μA • 4MHz Device Clock • All peripheral clocks are off • Relaxation oscillator is on • ADC powered off • PLL powered off Stop2 5mA 0μA 145μA • Relaxation oscillator is off • All peripheral clocks are off • ADC powered off • PLL powered off 1. No Output Switching (Output switching current can be estimated from I = CVf for each output) 2. Includes Processor Core current supplied by internal voltage regulator 56F8323 Technical Data, Rev. 17 110 Freescale Semiconductor Preliminary DC Electrical Characteristics Table 10-8 Current Consumption per Power Supply Pin (Typical) On-Chip Regulator Disabled (OCR_DIS = High) Mode RUN1_MAC IDD_Core IDD_IO1 IDD_ADC IDD_OSC_PLL 110mA 13μA 25mA 2.5mA Test Conditions • 60MHz Device Clock • All peripheral clocks are enabled • Continuous MAC instructions with fetches from Data RAM • ADC powered on and clocked Wait3 55mA 13μA 35μA 2.5mA • 60MHz Device Clock • All peripheral clocks are enabled • ADC powered off Stop1 700μA 13μA 0μA 360μA • 4MHz Device Clock • All peripheral clocks are off • Relaxation oscillator is on • ADC powered off • PLL powered off Stop2 100μA 13μA 0μA 145μA • Relaxation oscillator is off • All peripheral clocks are off • ADC powered off • PLL powered off 1. No Output Switching (Output switching current can be estimated from I = CVf for each output) 10.2.1 Voltage Regulator Specifications The 56F8323/56F8123 have two on-chip regulators. One supplies the PLL and has no external pins; therefore, it has no external characteristics which must be guaranteed (other than proper operation of the device). The second regulator supplies approximately 2.6V to the device’s core logic. This regulator requires two external 2.2μF, or greater, capacitors for proper operation. Ceramic and tantalum capacitors tend to provide better performance tolerances. The output voltage can be measured directly on the VCAP pins. The specifications for this regulator are shown in Table 10-9. Table 10-9. Regulator Parameters Characteristic Symbol Min Typical Max Unit Unloaded Output Voltage (0mA Load) VRNL 2.25 — 2.75 V Loaded Output Voltage (200mA load) VRL 2.25 — 2.75 V Line Regulation @ 250mA load (VDD33 ranges from 3.0V to 3.6V) VR 2.25 — 2.75 V 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 111 Table 10-9. Regulator Parameters (Continued) Characteristic Symbol Min Typical Max Unit Short Circuit Current (output shorted to ground) Iss — — 700 mA Bias Current I bias — 5.8 7 mA Power-down Current Ipd — 0 2 μA Short-Circuit Tolerance (output shorted to ground) TRSC — — 30 minutes Table 10-10. PLL Parameters Characteristics Symbol Min Typical Max Unit PLL Start-up time TPS 0.3 0.5 10 ms Resonator Start-up time TRS 0.1 0.18 1 ms Min-Max Period Variation TPV 120 — 200 ps Peak-to-Peak Jitter TPJ — — 175 ps Bias Current IBIAS — 1.5 2 mA Quiescent Current, power-down mode IPD — 100 150 μA 10.2.2 Temperature Sense Note: Temperature Sensor is NOT available in the 56F8123 device. Table 10-11 Temperature Sense Parametrics Characteristics Symbol Min Typical Max Unit m — 7.762 — mV/°C Room Trim Temp. 1, 2 TRT 24 26 28 °C Hot Trim Temp. (Industrial)1,2 THT 122 125 128 °C Hot Trim Temp. (Automotive)1,2 THT 147 150 153 °C Output Voltage @ VDDA_ADC = 3.3V, TJ =0°C1 VTS0 — 1.370 — V VDDA_ADC 3.0 3.3 3.6 V Slope (Gain)1 Supply Voltage 56F8323 Technical Data, Rev. 17 112 Freescale Semiconductor Preliminary AC Electrical Characteristics Table 10-11 Temperature Sense Parametrics (Continued) Characteristics Symbol Min Typical Max Unit Supply Current - OFF IDD-OFF — — 10 μA Supply Current - ON IDD-ON — — 250 μA Accuracy3,1 from -40°C to 150°C Using VTS = mT + VTS0 TACC -6.7 0 6.7 °C Resolution4, 5,1 RES — 0.104 — °C / bit 1. Includes the ADC conversion of the analog Temperature Sense voltage. 2. The ADC is not calibrated for the conversion of the Temperature Sensor trim value stored in the Flash Memory at FMOPT0 and FMOPT1. 3. See Application Note, AN1980, for methods to increase accuracy. 4. Assuming a 12-bit range from 0V to 3.3V. 5. Typical resolution calculated using equation, RES = (VREFH - VREFLO) X 1 212 m 10.3 AC Electrical Characteristics Tests are conducted using the input levels specified in Table 10-5. Unless otherwise specified, propagation delays are measured from the 50% to the 50% point, and rise and fall times are measured between the 10% and 90% points, as shown in Figure 10-1. Low VIH Input Signal High 90% 50% 10% Midpoint1 VIL Fall Time Rise Time Note: The midpoint is VIL + (VIH – VIL)/2. Figure 10-1 Input Signal Measurement References Figure 10-2 shows the definitions of the following signal states: • • • Active state, when a bus or signal is driven, and enters a low impedance state Tri-stated, when a bus or signal is placed in a high impedance state Data Valid state, when a signal level has reached VOL or VOH • Data Invalid state, when a signal level is in transition between VOL and VOH 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 113 Data2 Valid Data1 Valid Data1 Data3 Valid Data2 Data3 Data Tri-stated Data Invalid State Data Active Data Active Figure 10-2 Signal States 10.4 Flash Memory Characteristics Table 10-12 Flash Timing Parameters Characteristic Symbol Min Typ Max Unit Program time 1 Tprog 20 — — μs Erase time2 Terase 20 — — ms Tme 100 — — ms Mass erase time 1. There is additional overhead which is part of the programming sequence. See the 56F8300 Peripheral User Manual for details. Program time is per 16-bit word in Flash memory. Two words at a time can be programmed within the Program Flash module, as it contains two interleaved memories. 2. Specifies page erase time. There are 512 bytes per page in the Data and Boot Flash memories. The Program Flash module uses two interleaved Flash memories, increasing the effective page size to 1024 bytes. 10.5 External Clock Operation Timing Table 10-13 External Clock Operation Timing Requirements1 Characteristic Symbol Min Typ Max Unit Frequency of operation (external clock driver)2—56F8323 fosc 0 — 120 MHz Frequency of operation (external clock driver)2—56F8123 fosc 0 — 80 MHz Clock Pulse Width3 tPW 3.0 — — ns External clock input rise time4 trise — — 15 ns External clock input fall time5 tfall — — 15 ns 1. 2. 3. 4. 5. Parameters listed are guaranteed by design. See Figure 10-3 for details on using the recommended connection of an external clock driver. The high or low pulse width must be no smaller than 8.0ns or the chip will not function. External clock input rise time is measured from 10% to 90% External clock input fall time is measured from 90% to 10% 56F8323 Technical Data, Rev. 17 114 Freescale Semiconductor Preliminary Phase Locked Loop Timing VIH External Clock 90% 50% 10% 90% 50% 10% tfall tPW tPW VIL trise Note: The midpoint is VIL + (VIH – VIL)/2. Figure 10-3 External Clock Timing 10.6 Phase Locked Loop Timing Table 10-14 PLL Timing Characteristic Symbol Min Typ Max Unit External reference crystal frequency for the PLL1 fosc 4 8 8.4 MHz PLL output frequency2 (fOUT)—56F8323 fop 160 — 260 MHz PLL output frequency2 (fOUT)—56F8123 fop 160 — 160 MHz PLL stabilization time3 -40° to +125°C tplls — 1 10 ms 1. An externally supplied reference clock should be as free as possible from any phase jitter for the PLL to work correctly. The PLL is optimized for 8MHz input crystal. 2. ZCLK may not exceed 60MHz. For additional information on ZCLK and (fOUT/2), please refer to the OCCS chapter in the 56F8300 Peripheral User Manual. 3. This is the minimum time required after the PLL set up is changed to ensure reliable operation. 10.7 Crystal Oscillator Parameters Table 10-15 Crystal Oscillator Parameters Characteristic Symbol Min Typ Max Unit Crystal Start-up time TCS 4 5 10 ms Resonator Start-up time TRS 0.1 0.18 1 ms Crystal ESR RESR — — 120 ohms Crystal Peak-to-Peak Jitter TD 70 — 250 ps Crystal Min-Max Period Variation TPV 0.12 — 1.5 ns Resonator Peak-to-Peak Jitter TRJ — — 300 ps 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 115 Table 10-15 Crystal Oscillator Parameters (Continued) Characteristic Symbol Min Typ Max Unit Resonator Min-Max Period Variation TRP — — 300 ps Bias Current, high-drive mode IBIASH — 250 290 μA Bias Current, low-drive mode IBIASL — 80 110 μA Quiescent Current, power-down mode IPD — 0 1 μA Table 10-16 Relaxation Oscillator Parameters Characteristic Note: Min Typ Max Units Center Frequency — 8 — MHz Minimum Tuning Step Size (See Note) — 82 — ps Maximum Tuning Step Size (See Note) — 41 — ns Frequency Accuracy -50°C to +150°C (See Figure 10-4) — +/- 1.78 +2 /-3 % Maximum Cycle-to-Cycle Jitter — — 500 ps Stabilization Time from Power-up — — 4 μs An LSB change in the tuning code results in an 82ps shift in the frequency period, while an MSB change in the tuning code results in a 41ns shift in the frequency period. 56F8323 Technical Data, Rev. 17 116 Freescale Semiconductor Preliminary Reset, Stop, Wait, Mode Select, and Interrupt Timing 8.2 Typical Response 8.1 Frequency in MHz 8.0 7.9 7.8 7.7 7.6 7.5 - 30 - 50 - 10 + 10 + 30 + 50 + 70 + 90 + 110 + 130 + 150 Temperature Figure 10-4 Frequency versus Temperature 10.8 Reset, Stop, Wait, Mode Select, and Interrupt Timing Note: All address and data buses described here are internal. Table 10-17 Reset, Stop, Wait, Mode Select, and Interrupt Timing1,2 Symbol Typical Min Typical Max Unit See Figure Minimum RESET Assertion Duration tRA 16T — ns 10-5 Edge-sensitive Interrupt Request Width tIRW 1.5T — ns 10-6 ns 10-7 ns 10-8 Characteristic IRQA, IRQB Assertion to General Purpose Output Valid, caused by first instruction execution in the interrupt service routine tIG 18T — tIG - FAST 14T — IRQA Width Assertion to Recover from Stop State3 tIW 1.5T — 1. In the formulas, T = clock cycle. For an operating frequency of 60MHz, T = 16.67ns. At 8MHz (used during Reset and Stop modes), T = 125ns. 2. Parameters listed are guaranteed by design. 3. The interrupt instruction fetch is visible on the pins only in Mode 3. 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 117 RESET tRA tRAZ tRDA PAB PDB First Fetch Figure 10-5 Asynchronous Reset Timing IRQA tIRW Figure 10-6 External Interrupt Timing (Negative Edge-Sensitive) PAB First Interrupt Instruction Execution IRQA tIDM a) First Interrupt Instruction Execution General Purpose I/O Pin IRQA tIG b) General Purpose I/O Figure 10-7 External Level-Sensitive Interrupt Timing IRQA tIW tIF PAB First Instruction Fetch Not IRQA Interrupt Vector Figure 10-8 Recovery from Stop State Using Asynchronous Interrupt Timing 56F8323 Technical Data, Rev. 17 118 Freescale Semiconductor Preliminary Serial Peripheral Interface (SPI) Timing 10.9 Serial Peripheral Interface (SPI) Timing Table 10-18 SPI Timing1 Characteristic Symbol Cycle time Master Slave tC Enable lead time Master Slave tELD Enable lag time Master Slave tELG Clock (SCK) high time Master Slave tCH Clock (SCK) low time Master Slave tCL Data set-up time required for inputs Master Slave tDS Data hold time required for inputs Master Slave tDH Access time (time to data active from high-impedance state) Slave tA Disable time (hold time to high-impedance state) Slave tD Data Valid for outputs Master Slave (after enable edge) tDV Data invalid Master Slave tDI Rise time Master Slave tR Fall time Master Slave tF Min Max Unit 50 50 — — ns ns — 25 — — ns ns — 100 — — ns ns 17.6 25 — — ns ns 24.1 25 — — ns ns 20 0 — — ns ns 0 2 — — ns ns 4.8 15 ns 3.7 15.2 ns — — 4.5 20.4 ns ns 0 0 — — ns ns — — 11.5 10.0 ns ns — — 9.7 9.0 ns ns See Figure(s) 10-9, 10-10, 10-11, 10-12 10-12 10-12 10-9, 10-10, 10-11, 10-12 10-12 10-9, 10-10, 10-11, 10-12 10-9, 10-10, 10-11, 10-12 10-12 10-12 10-9, 10-10, 10-11, 10-12 10-9, 10-10, 10-11, 10-12 10-9, 10-10, 10-11, 10-12 10-9, 10-10, 10-11, 10-12 1. Parameters listed are guaranteed by design. 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 119 1 SS SS is held High on master (Input) tC tR tF tCL SCLK (CPOL = 0) (Output) tCH tF tR tCL SCLK (CPOL = 1) (Output) tDH tCH tDS MISO (Input) MSB in Bits 14–1 tDI MOSI (Output) LSB in tDI(ref) tDV Master MSB out Bits 14–1 Master LSB out tR tF Figure 10-9 SPI Master Timing (CPHA = 0) SS (Input) SS is held High on master tC tF tR tCL SCLK (CPOL = 0) (Output) tCH tF tCL SCLK (CPOL = 1) (Output) tCH tDS tR MISO (Input) MSB in Bits 14–1 tDI tDV(ref) MOSI (Output) tDH Master MSB out tDV Bits 14– 1 tF LSB in tDI(ref) Master LSB out tR Figure 10-10 SPI Master Timing (CPHA = 1) 56F8323 Technical Data, Rev. 17 120 Freescale Semiconductor Preliminary Serial Peripheral Interface (SPI) Timing SS (Input) tC tF tCL SCLK (CPOL = 0) (Input) tELG tR tCH tELD tCL SCLK (CPOL = 1) (Input) tCH tA MISO (Output) Slave MSB out tF tR Bits 14–1 tDS Slave LSB out tDV tDI tDH MOSI (Input) MSB in tD Bits 14–1 tDI LSB in Figure 10-11 SPI Slave Timing (CPHA = 0) SS (Input) tF tC tR tCL SCLK (CPOL = 0) (Input) tCH tELG tELD tCL SCLK (CPOL = 1) (Input) tDV tCH tR tA MISO (Output) tD tF Slave MSB out Bits 14–1 tDS tDV Slave LSB out tDI tDH MOSI (Input) MSB in Bits 14–1 LSB in Figure 10-12 SPI Slave Timing (CPHA = 1) 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 121 10.10 Quad Timer Timing Table 10-19 Timer Timing1, 2 Characteristic Symbol Min Max Unit See Figure PIN 2T + 6 — ns 10-13 Timer input high / low period PINHL 1T + 3 — ns 10-13 Timer output period POUT 1T - 3 — ns 10-13 POUTHL 0.5T - 3 — ns 10-13 Timer input period Timer output high / low period 1. In the formulas listed, T = the clock cycle. For 60MHz operation, T = 16.67ns. 2. Parameters listed are guaranteed by design. Timer Inputs PIN PINHL PINHL POUT POUTHL POUTHL Timer Outputs Figure 10-13 Timer Timing 10.11 Quadrature Decoder Timing Note: The Quadrature Decoder is NOT available in the 56F8123 device. Table 10-20 Quadrature Decoder Timing1, 2 Characteristic Symbol Min Max Unit See Figure Quadrature input period PIN 4T + 12 — ns 10-14 Quadrature input high / low period PHL 2T + 6 — ns 10-14 Quadrature phase period PPH 1T + 3 — ns 10-14 1. In the formulas listed, T = the clock cycle. For 60MHz operation, T=16.67ns. 2. Parameters listed are guaranteed by design. 56F8323 Technical Data, Rev. 17 122 Freescale Semiconductor Preliminary Serial Communication Interface (SCI) Timing PPH PPH PPH PPH Phase A (Input) PHL PIN PHL Phase B PHL (Input) PIN PHL Figure 10-14 Quadrature Decoder Timing 10.12 Serial Communication Interface (SCI) Timing Table 10-21 SCI Timing1 Characteristic Symbol Min Max Unit See Figure BR — (fMAX/16) Mbps — RXD3 Pulse Width RXDPW 0.965/BR 1.04/BR ns 10-15 TXD4 Pulse Width TXDPW 0.965/BR 1.04/BR ns 10-16 Baud Rate2 1. Parameters listed are guaranteed by design. 2. fMAX is the frequency of operation of the system clock in MHz, which is 60MHz for the 56F8323 device and 40MHz for the 56F8123 device. 3. The RXD pin in SCI0 is named RXD0 and the RXD pin in SCI1 is named RXD1. 4. The TXD pin in SCI0 is named TXD0 and the TXD pin in SCI1 is named TXD1. RXD SCI receive data pin (Input) RXDPW Figure 10-15 RXD Pulse Width TXD SCI receive data pin (Input) TXDPW Figure 10-16 TXD Pulse Width 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 123 10.13 Controller Area Network (CAN) Timing Note: The CAN is NOT available in the 56F8123 device. Table 10-22 CAN Timing1 Characteristic Baud Rate Bus Wake-up detection Symbol Min Max Unit See Figure BRCAN — 1 Mbps — TWAKEUP TIPBUS — μs 10-17 1. Parameters listed are guaranteed by design MSCAN_RX CAN receive data pin (Input) T WAKEUP Figure 10-17 Bus Wakeup Detection 10.14 JTAG Timing Table 10-23 JTAG Timing Characteristic Symbol Min Max Unit See Figure TCK frequency of operation using EOnce1 fOP DC SYS_CLK/8 MHz 10-18 TCK frequency of operation not using EOnce1 fOP DC SYS_CLK/4 MHz 10-18 TCK clock pulse width tPW 50 — ns 10-18 TMS, TDI data set up time tDS 5 — ns 10-19 TMS, TDI data hold time tDH 5 — ns 10-19 TCK low to TDO data valid tDV — 30 ns 10-19 TCK low to TDO tri-state tTS — 30 ns 10-19 tTRST 2T2 — ns 10-20 TRST assertion time 1. TCK frequency of operation must be less than 1/8 the processor rate. 2. T = processor clock period (nominally 1/60MHz) 56F8323 Technical Data, Rev. 17 124 Freescale Semiconductor Preliminary JTAG Timing 1/fOP tPW tPW VM VM VIH TCK (Input) VIL VM = VIL + (VIH – VIL)/2 Figure 10-18 Test Clock Input Timing Diagram TCK (Input) tDS TDI TMS (Input) tDH Input Data Valid tDV TDO (Output) Output Data Valid tTS TDO (Output) tDV TDO (Output) Output Data Valid Figure 10-19 Test Access Port Timing Diagram TRST (Input) tTRST Figure 10-20 TRST Timing Diagram 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 125 10.15 Analog-to-Digital Converter (ADC) Parameters Table 10-24 ADC Parameters Characteristic Symbol Min Typ Max Unit VADIN VREFL — VREFH V Resolution RES 12 — 12 Bits Integral Non-Linearity1 INL — +/- 2.4 +/- 3.2 LSB2 Differential Non-Linearity DNL — +/- 0.7 < +1 LSB2 Input voltages Monotonicity GUARANTEED ADC internal clock fADIC 0.5 — 5 MHz Conversion range RAD VREFL — VREFH V ADC channel power-up time tADPU 5 6 16 tAIC cycles3 ADC reference circuit power-up time4 tVREF — — 25 ms Conversion time tADC — 6 — tAIC cycles3 Sample time tADS — 1 — tAIC cycles3 Input capacitance CADI — 5 — pF Input injection current5, per pin IADI — — 3 mA Input injection current, total IADIT — — 20 mA VREFH current IVREFH — 1.2 3 mA ADC A current IADCA — 25 — mA ADC B current IADCB — 25 — mA Quiescent current IADCQ — 0 10 μA Uncalibrated Gain Error (ideal = 1) EGAIN — +/- .004 +/- .01 — Uncalibrated Offset Voltage VOFFSET — +/- 26 +/- 32 mV Calibrated Absolute Error6 AECAL — See Figure 10-21 — LSBs Calibration Factor 17 CF1 — 0.008597 — — Calibration Factor 27 CF2 — -2.8 — — — — -60 — dB Vcommon — (VREFH - VREFLO) / 2 — V SNR — 64.6 — db Crosstalk between channels Common Mode Voltage Signal-to-noise ratio 56F8323 Technical Data, Rev. 17 126 Freescale Semiconductor Preliminary Analog-to-Digital Converter (ADC) Parameters Table 10-24 ADC Parameters (Continued) Characteristic Symbol Min Typ Max Unit SINAD — 59.1 — db THD — 60.6 — db Spurious Free Dynamic Range SFDR — 61.1 — db Effective Number Of Bits8 ENOB — 9.6 — Bits Signal-to-noise plus distortion ratio Total Harmonic Distortion 1. INL measured from Vin = .1VREFH to Vin = .9VREFH 10% to 90% Input Signal Range 2. LSB = Least Significant Bit 3. ADC clock cycles 4. Assumes each voltage reference pin is bypassed with 0.1μF ceramic capacitors to ground 5. The current that can be injected or sourced from an unselected ADC signal input without impacting the performance of the ADC. This allows the ADC to operate in noisy industrial environments where inductive flyback is possible. 6. Absolute error includes the effects of both gain error and offset error. 7. Please see the 56F8300 Peripheral User’s Manual for additional information on ADC calibration. 8. ENOB = (SINAD - 1.76)/6.02 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 127 Figure 10-21 ADC Absolute Error Over Processing and Temperature Extremes Before and After Calibration for VDCin = 0.60V and 2.70V Note: The absolute error data shown in the graphs above reflects the effects of both gain error and offset error. The data was taken on 15 parts: three each from four processing corner lots as well as three from one nominally processed lot, each at three temperatures: -40°C, 27°C, and 150°C (giving the 45 data points shown above), for two input DC voltages: 0.60V and 2.70V. The data indicates that for the given population of parts, calibration significantly reduced (by as much as 34%) the collective variation (spread) of the absolute error of the population. It also significantly reduced (by as much as 80% when VDCin was 0.6V) the mean (average) of the absolute error and thereby brought it significantly closer to the ideal value of zero. Although not guaranteed, it is believed that calibration will produce results similar to those shown above for any population of parts, including those which represent processing and temperature extremes. 56F8323 Technical Data, Rev. 17 128 Freescale Semiconductor Preliminary Equivalent Circuit for ADC Inputs 10.16 Equivalent Circuit for ADC Inputs Figure 10-22 illustrates the ADC input circuit during sample and hold. S1 and S2 are always open/closed at the same time that S3 is closed/open. When S1/S2 are closed & S3 is open, one input of the sample and hold circuit moves to (VREFH-VREFLO)/2, while the other charges to the analog input voltage. When the switches are flipped, the charge on C1 and C2 are averaged via S3, with the result that a single-ended analog input is switched to a differential voltage centered about (VREFH-VREFLO)/2. The switches switch on every cycle of the ADC clock (open one-half ADC clock, closed one-half ADC clock). Note that there are additional capacitances associated with the analog input pad, routing, etc., but these do not filter into the S/H output voltage, as S1 provides isolation during the charge-sharing phase. One aspect of this circuit is that there is an on-going input current, which is a function of the analog input voltage, VREF and the ADC clock frequency. Analog Input 3 S1 4 C1 S/H S3 1 1. 2. 3. 4. (VREFH - VREFLO)/2 S2 2 C2 C1 = C2 = 1pF Parasitic capacitance due to package, pin-to-pin and pin-to-package base coupling; 1.8pf Parasitic capacitance due to the chip bond pad, ESD protection devices and signal routing; 2.04pf Equivalent resistance for the ESD isolation resistor and the channel select mux; 500 ohms Sampling capacitor at the sample and hold circuit. Capacitor C1 is normally disconnected from the input and is only connected to it at sampling time; 1pf Figure 10-22 Equivalent Circuit for A/D Loading 10.17 Power Consumption See Part 10 for a list of IDD requirements for the 56F8323. This section provides additional detail which can be used to optimize power consumption for a given application. Power consumption is given by the following equation: Total power = A: +B: +C: +D: +E: internal [static component] internal [state-dependent component] internal [dynamic component] external [dynamic component] external [static] A, the internal [static component], is comprised of the DC bias currents for the oscillator, current, PLL, and voltage references. These sources operate independently of processor state or operating frequency. B, the internal [state-dependent component], reflects the supply current required by certain on-chip resources only when those resources are in use. These include RAM, Flash memory and the ADCs. 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 129 C, the internal [dynamic component], is classic C*V2*F CMOS power dissipation corresponding to the 56800E core and standard cell logic. D, the external [dynamic component], reflects power dissipated on-chip as a result of capacitive loading on the external pins of the chip. This is also commonly described as C*V2*F, although simulations on two of the IO cell types used on the 56800E reveal that the power-versus-load curve does have a non-zero Y-intercept. Table 10-25 IO Loading Coefficients at 10MHz Intercept Slope 8mA CMOS 3-State Output Pad with Input-Enabled Pull-Up 1.3 0.11mW / pF 4mA CMOS 3-State Output Pad with Input-Enabled Pull-Up 1.15mW 0.11mW / pF Power due to capacitive loading on output pins is (first order) a function of the capacitive load and frequency at which the outputs change. Table 10-25 provides coefficients for calculating power dissipated in the IO cells as a function of capacitive load. In these cases: TotalPower = Σ((Intercept + Slope*Cload)*frequency/10MHz) where: • • • Summation is performed over all output pins with capacitive loads TotalPower is expressed in mW Cload is expressed in pF Because of the low duty cycle on most device pins, power dissipation due to capacitive loads was found to be fairly low when averaged over a period of time. E, the external [static component], reflects the effects of placing resistive loads on the outputs of the device. Sum the total of all V2/R or IV to arrive at the resistive load contribution to power. Assume V = 0.5 for the purposes of these rough calculations. For instance, if there is a total of eight PWM outputs driving 10mA into LEDs, then P = 8*.5*.01 = 40mW. In previous discussions, power consumption due to parasitics associated with pure input pins is ignored, as it is assumed to be negligible. 56F8323 Technical Data, Rev. 17 130 Freescale Semiconductor Preliminary 56F8323 Package and Pin-Out Information Part 11 Packaging 11.1 56F8323 Package and Pin-Out Information HOME0 INDEX0 PHASEB0 PHASEA0 TCK TMS TDI TDO VCAP1 TRST VDD_IO VSS CAN_RX CAN_TX TC3 TC1 This section contains package and pin-out information for the 56F8323. This device comes in a 64-pin Low-profile Quad Flat Pack (LQFP). Figure 11-1 shows the package outline for the 64-pin LQFP, Figure 11-3 shows the mechanical parameters for this package, and Table 11-1 lists the pin-out for the 64-pin LQFP case. ORIENTATION MARK TC0 VDD_IO 49 XTAL RESET PWMA0 EXTAL PIN 1 OCR_DIS PWMA1 VCAP3 VSS VDD_IO VCAP4 PWMA2 VDDA_OSC_PLL PWMA3 VDDA_ADC PWMA4 VREFH PWMA5 VSSA_ADC VREFLO VSS VREFP IRQA VREFMID FAULTA0 VREFN FAULTA1 33 FAULTA2 TEMP_SENSE 17 ANA7 ANA6 ANA5 ANA4 ANA3 ANA2 ANA1 ANA0 SCLK0 MOSI0 VCAP2 MISO0 SS0 ISA2 VDD_IO ISA1 VSS ISA0 Figure 11-1 Top View, 56F8323 64-Pin LQFP Package 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 131 Table 11-1 56F8323 64-Pin LQFP Package Identification by Pin Number Pin No. Signal Name Pin No. Signal Name Pin No. Signal Name Pin No. Signal Name 1 TC0 17 VSS 33 ANA7 49 HOME0 2 RESET 18 ISA1 34 TEMP_SENSE 50 INDEX0 3 PWMA0 19 ISA2 35 VREFN 51 PHASEB0 4 PWMA1 20 VDD_IO 36 VREFMID 52 PHASEA0 5 VCAP3 21 SS0 37 VREFP 53 TCK 6 VDD_IO 22 MISO0 38 VREFLO 54 TMS 7 PWMA2 23 VCAP2 39 VSSA_ADC 55 TDI 8 PWMA3 24 MOSI0 40 VREFH 56 TDO 9 PWMA4 25 SCLK0 41 VDDA_ADC 57 VCAP1 10 PWMA5 26 ANA0 42 VDDA_OSC_PLL 58 TRST 11 VSS 27 ANA1 43 VCAP4 59 VDD_IO 12 IRQA 28 ANA2 44 VSS 60 VSS 13 FAULTA0 29 ANA3 45 OCR_DIS 61 CAN_RX 14 FAULTA1 30 ANA4 46 EXTAL 62 CAN_TX 15 FAULTA2 31 ANA5 47 XTAL 63 TC3 16 ISA0 32 ANA6 48 VDD_IO 64 TC1 56F8323 Technical Data, Rev. 17 132 Freescale Semiconductor Preliminary 56F8123 Package and Pin-Out Information 11.2 56F8123 Package and Pin-Out Information TA3 TA2 TA1 TA0 TCK TMS TDI TDO VCAP1 TRST VDD_IO VSS GPIOC2 GPIOC3 TC3 TC1 This section contains package and pin-out information for the 56F8123. This device comes in a 64-pin Low-profile Quad Flat Pack (LQFP). Figure 11-1 shows the package outline for the 64-pin LQFP, Figure 11-3 shows the mechanical parameters for this package, and Table 11-1 lists the pin-out for the 64-pin LQFP case. ORIENTATION MARK TC0 VDD_IO 49 XTAL RESET GPIOA0 EXTAL PIN 1 OCR_DIS GPIOA1 VCAP3 VSS VDD_IO VCAP4 VDDA_OSC_PLL SS1 MISO1 VDDA_ADC MOSI1 VREFH SCLK1 VSSA_ADC VREFLO VSS VREFP IRQA VREFMID GPIOA6 VREFN GPIOA7 33 GPIOA8 NC 17 ANA7 ANA6 ANA5 ANA4 ANA3 ANA2 ANA1 ANA0 SCLK0 MOSI0 VCAP2 MISO0 SS0 VDD_IO GPIOA11 GPIOA10 VSS GPIOA9 Figure 11-2 Top View, 56F8123 64-Pin LQFP Package 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 133 Table 11-2 56F8123 64-Pin LQFP Package Identification by Pin Number Pin No. Signal Name Pin No. Signal Name Pin No. Signal Name Pin No. Signal Name 1 TC0 17 VSS 33 ANA7 49 TA3 2 RESET 18 GPIOA10 34 NC 50 TA2 3 GPIOA0 19 GPIOA11 35 VREFN 51 TA1 4 GPIOA1 20 VDD_IO 36 VREFMID 52 TA0 5 VCAP3 21 SS0 37 VREFP 53 TCK 6 VDD_IO 22 MISO0 38 VREFLO 54 TMS 7 SS1 23 VCAP2 39 VSSA_ADC 55 TDI 8 MISO1 24 MOSI0 40 VREFH 56 TDO 9 MOSI1 25 SCLK0 41 VDDA_ADC 57 VCAP1 10 SCLK1 26 ANA0 42 VDDA_OSC_PLL 58 TRST 11 VSS 27 ANA1 43 VCAP4 59 VDD_IO 12 IRQA 28 ANA2 44 VSS 60 VSS 13 GPIOA6 29 ANA3 45 OCR_DIS 61 GPIOC2 14 GPIOA7 30 ANA4 46 EXTAL 62 GPIOC3 15 GPIOA8 31 ANA5 47 XTAL 63 TC3 16 GPIOA9 32 ANA6 48 VDD_IO 64 TC1 56F8323 Technical Data, Rev. 17 134 Freescale Semiconductor Preliminary 56F8123 Package and Pin-Out Information 4X 4X 16 TIPS 0.2 H A-B D 0.2 C A-B D 64 A2 0.05 49 1 S (S) 48 2X R R1 q1 A 0.25 B q E E1 (L2) A1 3X E1/2 VIEW Y 16 E/2 VIEW AA 32 NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE DATUM H IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE DATUM C. 5. DIMENSIONS D AND E TO BE DETERMINED AT SEATING PLANE DATUM C. 6. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 PER SIDE. 7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE b DIMENSION TO EXCEED 0.35. MINIMUM SPACE BETWEEN PROTRUSION AND ADJACENT LEAD OR PROTRUSION 0.07. D D1/2 D/2 D1 D 4X A ( q 2) 0.08 C C L (L1) 33 17 H GAGE PLANE 4X SEATING PLANE ( q 3) VIEW AA BASE METAL b1 X X=A, B OR D c1 c CL AB e/2 AB 60X VIEW Y e PLATING b 0.08 M C A-B D DIM A A1 A2 b b1 c c1 D D1 e E E1 L L1 L2 R1 S q q1 q2 q3 MILLIMETERS MIN MAX --1.60 0.05 0.15 1.35 1.45 0.17 0.27 0.17 0.23 0.09 0.20 0.09 0.16 12.00 BSC 10.00 BSC 0.50 BSC 12.00 BSC 10.00 BSC 0.45 0.75 1.00 REF 0.50 REF 0.10 0.20 0.20 REF 0° 7° 0° --12° REF 12° REF SECTION AB-AB ROTATED 90 ° CLOCKWISE Figure 11-3 64-pin LQFP Mechanical Information Please see www.freescale.com for the most current case outline. 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 135 Part 12 Design Considerations 12.1 Thermal Design Considerations An estimation of the chip junction temperature, TJ, can be obtained from the equation: TJ = TA + (RθJΑ x PD) where: TA = Ambient temperature for the package (oC) RθJΑ = Junction-to-ambient thermal resistance (oC/W) PD = Power dissipation in the package (W) The junction-to-ambient thermal resistance is an industry-standard value that provides a quick and easy estimation of thermal performance. Unfortunately, there are two values in common usage: the value determined on a single-layer board and the value obtained on a board with two planes. For packages such as the PBGA, these values can be different by a factor of two. Which value is closer to the application depends on the power dissipated by other components on the board. The value obtained on a single layer board is appropriate for the tightly packed printed circuit board. The value obtained on the board with the internal planes is usually appropriate if the board has low-power dissipation and the components are well separated. When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case thermal resistance and a case-to-ambient thermal resistance: RθJA = RθJC + RθCA where: RθJA RθJC RθCA = Package junction-to-ambient thermal resistance °C/W = Package junction-to-case thermal resistance °C/W = Package case-to-ambient thermal resistance °C/W RθJC is device related and cannot be influenced by the user. The user controls the thermal environment to change the case-to-ambient thermal resistance, RθCA. For instance, the user can change the size of the heat sink, the air flow around the device, the interface material, the mounting arrangement on printed circuit board, or change the thermal dissipation on the printed circuit board surrounding the device. To determine the junction temperature of the device in the application when heat sinks are not used, the Thermal Characterization Parameter (ΨJT) can be used to determine the junction temperature with a measurement of the temperature at the top center of the package case using the following equation: TJ = TT + (ΨJT x PD) where: TT = Thermocouple temperature on top of package (oC) ΨJT = Thermal characterization parameter (oC)/W PD = Power dissipation in package (W) 56F8323 Technical Data, Rev. 17 136 Freescale Semiconductor Preliminary Electrical Design Considerations The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests on the package. A small amount of epoxy is placed over the thermocouple junction and over about 1mm of wire extending from the junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling effects of the thermocouple wire. When heat sink is used, the junction temperature is determined from a thermocouple inserted at the interface between the case of the package and the interface material. A clearance slot or hole is normally required in the heat sink. Minimizing the size of the clearance is important to minimize the change in thermal performance caused by removing part of the thermal interface to the heat sink. Because of the experimental difficulties with this technique, many engineers measure the heat sink temperature and then back-calculate the case temperature using a separate measurement of the thermal resistance of the interface. From this case temperature, the junction temperature is determined from the junction-to-case thermal resistance. 12.2 Electrical Design Considerations CAUTION This device contains protective circuitry to guard against damage due to high static voltage or electrical fields. However, normal precautions are advised to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate voltage level. Use the following list of considerations to assure correct operation of the 56F8323/56F8123: • Provide a low-impedance path from the board power supply to each VDD pin on the device, and from the board ground to each VSS (GND) pin • The minimum bypass requirement is to place six 0.01–0.1μF capacitors positioned as close as possible to the package supply pins. The recommended bypass configuration is to place one bypass capacitor on each of the VDD/VSS pairs, including VDDA/VSSA. Ceramic and tantalum capacitors tend to provide better performance tolerances. Ensure that capacitor leads and associated printed circuit traces that connect to the chip VDD and VSS (GND) pins are less than 0.5 inch per capacitor lead Use at least a four-layer Printed Circuit Board (PCB) with two inner layers for VDD and VSS • • • Bypass the VDD and VSS layers of the PCB with approximately 100μF, preferably with a high-grade capacitor such as a tantalum capacitor 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 137 • • Because the device’s output signals have fast rise and fall times, PCB trace lengths should be minimal Consider all device loads as well as parasitic capacitance due to PCB traces when calculating capacitance. This is especially critical in systems with higher capacitive loads that could create higher transient currents in the VDD and VSS circuits. • Take special care to minimize noise levels on the VREF, VDDA and VSSA pins • Designs that utilize the TRST pin for JTAG port or EOnCE module functionality (such as development or debugging systems) should allow a means to assert TRST whenever RESET is asserted, as well as a means to assert TRST independently of RESET. Designs that do not require debugging functionality, such as consumer products, should tie these pins together. Because the Flash memory is programmed through the JTAG/EOnCE port, the designer should provide an interface to this port to allow in-circuit Flash programming • 12.3 Power Distribution and I/O Ring Implementation Figure 12-1 illustrates the general power control incorporated in the 56F8323/56F8123. This chip contains two internal power regulators. One of them is powered from the VDDA_OSC_PLL pin and cannot be turned off. This regulator controls power to the internal clock generation circuitry. The other regulator is powered from the VDD_IO pins and provides power to all of the internal digital logic of the core, all peripherals and the internal memories. This regulator can be turned off, if an external VDD_CORE voltage is externally applied to the VCAP pins. In summary, the entire chip can be supplied from a single 3.3 volt supply if the large core regulator is enabled. If the regulator is not enabled, a dual supply 3.3V/2.5V configuration can also be used. Notes: • • Flash, RAM and internal logic are powered from the core regulator output VPP1 and VPP2 are not connected in the customer system • All circuitry, analog and digital, shares a common VSS bus VDDA_OSC_PLL OCS VDDA_ADC VDD REG VCAP REG I/O ADC CORE ROSC VSS VREFH VREFP VREFMID VREFN VREFLO VSSA_ADC Figure 12-1 Power Management 56F8323 Technical Data, Rev. 17 138 Freescale Semiconductor Preliminary Power Distribution and I/O Ring Implementation Part 13 Ordering Information Table 13-1 lists the pertinent information needed to place an order. Consult a Freescale Semiconductor sales office or authorized distributor to determine availability and to order parts. Table 13-1 Ordering Information Part Supply Voltage Pin Count Frequency (MHz) Temperature Range Order Number MC56F8323 3.0–3.6 V Low-Profile Quad Flat Pack (LQFP) 64 60 -40° to + 105° C MC56F8323VFB60 MC56F8323 3.0–3.6 V Low-Profile Quad Flat Pack (LQFP) 64 60 -40° to + 125° C MC56F8323MFB60 MC56F8123 3.0–3.6 V Low-Profile Quad Flat Pack (LQFP) 64 40 -40° to + 105° C MC56F8123VFB MC56F8323 3.0–3.6 V Low-Profile Quad Flat Pack (LQFP) 64 60 -40° to + 105° C MC56F8323VFBE* MC56F8323 3.0–3.6 V Low-Profile Quad Flat Pack (LQFP) 64 60 -40° to + 125° C MC56F8323MFBE* MC56F8123 3.0–3.6 V Low-Profile Quad Flat Pack (LQFP) 64 40 -40° to + 105° C MC56F8123VFBE* Package Type *This package is RoHS compliant. 56F8323 Technical Data, Rev. 17 Freescale Semiconductor Preliminary 139 How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 [email protected] Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) [email protected] Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064, Japan 0120 191014 or +81 3 5437 9125 [email protected] Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 [email protected] For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 [email protected] RoHS-compliant and/or Pb-free versions of Freescale products have the functionality and electrical characteristics of their non-RoHS-compliant and/or non-Pb-free counterparts. For further information, see http://www.freescale.com or contact your Freescale sales representative. For information on Freescale’s Environmental Products program, go to http://www.freescale.com/epp. Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. 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Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. This product incorporates SuperFlash® technology licensed from SST. © Freescale Semiconductor, Inc. 2005, 2006, 2007. All rights reserved. MC56F8323 Rev. 17 04/2007