Hynix HY5DU561622DT 256mb ddr sdram Datasheet

256Mb DDR SDRAM
256Mb DDR SDRAM
HY5DU56422D(L)T
HY5DU56822D(L)T
HY5DU561622D(L)T
This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any
responsibility for use of circuits described. No patent licenses are implied.
Rev. 1.0 /Oct. 2004
1
HY5DU56422D(L)T
HY5DU56822D(L)T
HY5DU561622D(L)T
Revision History
Revision No.
1.0
History
First Version ReleaseMerged HY5DU564(8,16)22D(L)T and HY5DU564(8,16)22D(L)T-D into
HY5DU564(8,16)22D(L)T.
Rev. 1.0 /Oct. 2004
Draft Date
Remark
Oct. 2004
2
HY5DU56422D(L)T
HY5DU56822D(L)T
HY5DU561622D(L)T
DESCRIPTION
The HY5DU56422D(L)T, HY5DU56822D(L)T and HY5DU561622D(L)T are a 268,435,456-bit CMOS Double Data
Rate(DDR) Synchronous DRAM, ideally suited for the main memory applications which requires large memory density
and high bandwidth.
This Hynix 256Mb DDR SDRAMs offer fully synchronous operations referenced to both rising and falling edges of the
clock. While all addresses and control inputs are latched on the rising edges of the CK (falling edges of the /CK), Data,
Data strobes and Write data masks inputs are sampled on both rising and falling edges of it. The data paths are internally pipelined and 2-bit prefetched to achieve very high bandwidth. All input and output voltage levels are compatible
with SSTL_2.
FEATURES
•
VDD, VDDQ = 2.5V +/- 0.2V for DDR200, 266, 333
VDD, VDDQ = 2.6V +/- 0.1V for DDR400
•
All inputs and outputs are compatible with SSTL_2
interface
•
All addresses and control inputs except data, data
strobes and data masks latched on the rising edges
of the clock
•
Programmable CAS latency 2/2.5 (DDR200, 266,
333) and 3 (DDR400) supported
•
Programmable burst length 2/4/8 with both sequential and interleave mode
•
Fully differential clock inputs (CK, /CK) operation
•
Double data rate interface
•
Source synchronous - data transaction aligned to
bidirectional data strobe (DQS)
•
Internal four bank operations with single pulsed
/RAS
•
x16 device has two bytewide data strobes (UDQS,
LDQS) per each x8 I/O
•
Auto refresh and self refresh supported
•
Data outputs on DQS edges when read (edged DQ)
Data inputs on DQS centers when write (centered
DQ)
•
tRAS lock out function supported
•
8192 refresh cycles / 64ms
•
JEDEC standard 400mil 66pin TSOP-II with 0.65mm
pin pitch
•
Full and Half strength driver option controlled by
EMRS
•
On chip DLL align DQ and DQS transition with CK
transition
•
DM mask write data-in at the both rising and falling
edges of the data strobe
ORDERING INFORMATION
Part No.
Configuration
HY5DU56422D(L)T-X*
64M x 4
HY5DU56822D(L)T-X*
32M x 8
HY5DU561622D(L)T-X*
16M x 16
* X means speed grade
Rev. 1.0 /Oct. 2004
OPERATING FREQUENCY
Package
Grade
Clock Rate
400mil
66pin
TSOP-II
-D43
200MHz@CL3
Remark
(CL-tRCD-tRP)
DDR400B (3-3-3)
-J
133MHz@CL2 [email protected] DDR333 (2.5-3-3)
-K
133MHz@CL2 [email protected] DDR266A (2-3-3)
-H
100MHz@CL2 [email protected] DDR266B (2.5-3-3)
-L
100MHz@CL2
DDR200 (2-2-2)
3
HY5DU56422D(L)T
HY5DU56822D(L)T
HY5DU561622D(L)T
PIN CONFIGURATION
x4
x8
VDD
NC
VDDQ
NC
DQ0
VSSQ
NC
NC
VDDQ
NC
DQ1
VSSQ
NC
NC
VDDQ
NC
NC
VDD
NC
NC
/WE
/CAS
/RAS
/CS
NC
BA0
BA1
A10/AP
A0
A1
A2
A3
VDD
VDD
DQ0
VDDQ
NC
DQ1
VSSQ
NC
DQ2
VDDQ
NC
DQ3
VSSQ
NC
NC
VDDQ
NC
NC
VDD
NC
NC
/WE
/CAS
/RAS
/CS
NC
BA0
BA1
A10/AP
A0
A1
A2
A3
VDD
x16
VDD
DQ0
VDDQ
DQ1
DQ2
VSSQ
DQ3
DQ4
VDDQ
DQ5
DQ6
VSSQ
DQ7
NC
VDDQ
LDQS
NC
VDD
NC
LDM
/WE
/CAS
/RAS
/CS
NC
BA0
BA1
A10/AP
A0
A1
A2
A3
VDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
400mil X 875mil
66pin TSOP -II
0.65mm pin pitch
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
x16
x8
x4
VSS
DQ15
VSSQ
DQ14
DQ13
VDDQ
DQ12
DQ11
VSSQ
DQ10
DQ9
VDDQ
DQ8
NC
VSSQ
UDQS
NC
VREF
VSS
UDM
/CK
CK
CKE
NC
A12
A11
A9
A8
A7
A6
A5
A4
VSS
VSS
DQ7
VSSQ
NC
DQ6
VDDQ
NC
DQ5
VSSQ
NC
DQ4
VDDQ
NC
NC
VSSQ
DQS
NC
VREF
VSS
DM
/CK
CK
CKE
NC
A12
A11
A9
A8
A7
A6
A5
A4
VSS
VSS
NC
VSSQ
NC
DQ3
VDDQ
NC
NC
VSSQ
NC
DQ2
VDDQ
NC
NC
VSSQ
DQS
NC
VREF
VSS
DM
/CK
CK
CKE
NC
A12
A11
A9
A8
A7
A6
A5
A4
VSS
ROW AND COLUMN ADDRESS TABLE
ITEMS
64Mx4
32Mx8
16Mx16
Organization
16M x 4 x 4banks
8M x 8 x 4banks
4M x 16 x 4banks
Row Address
A0 - A12
A0 - A12
A0 - A12
Column Address
A0-A9, A11
A0-A9
A0-A8
Bank Address
BA0, BA1
BA0, BA1
BA0, BA1
Auto Precharge Flag
A10
A10
A10
Refresh
8K
8K
8K
Rev. 1.0 /Oct. 2004
4
HY5DU56422D(L)T
HY5DU56822D(L)T
HY5DU561622D(L)T
PIN DESCRIPTION
PIN
TYPE
DESCRIPTION
Input
Clock: CK and /CK are differential clock inputs. All address and control input signals are sampled on the crossing of the positive edge of CK and negative edge of
/CK. Output (read) data is referenced to the crossings of CK and /CK (both directions of crossing).
Input
Clock Enable: CKE HIGH activates, and CKE LOW deactivates internal clock signals, and device input buffers and output drivers. Taking CKE LOW provides PRECHARGE POWER DOWN and SELF REFRESH operation (all banks idle), or ACTIVE
POWER DOWN (row ACTIVE in any bank). CKE is synchronous for POWER
DOWN entry and exit, and for SELF REFRESH entry. CKE is asynchronous for
SELF REFRESH exit, and for output disable. CKE must be maintained high
throughout READ and WRITE accesses. Input buffers, excluding CK, /CK and
CKE are disabled during POWER DOWN. Input buffers, excluding CKE are disabled during SELF REFRESH. CKE is an SSTL_2 input, but will detect an LVCMOS
LOW level after VDD is applied.
/CS
Input
Chip Select: Enables or disables all inputs except CK, /CK, CKE, DQS and DM. All
commands are masked when CS is registered high. CS provides for external bank
selection on systems with multiple banks. CS is considered part of the command
code.
BA0, BA1
Input
Bank Address Inputs: BA0 and BA1 define to which bank an ACTIVE, Read, Write
or PRECHARGE command is being applied.
A0 ~ A12
Input
Address Inputs: Provide the row address for ACTIVE commands, and the column
address and AUTO PRECHARGE bit for READ/WRITE commands, to select one
location out of the memory array in the respective bank. A10 is sampled during a
precharge command to determine whether the PRECHARGE applies to one bank
(A10 LOW) or all banks (A10 HIGH). If only one bank is to be precharged, the
bank is selected by BA0, BA1. The address inputs also provide the op code during a MODE REGISTER SET command. BA0 and BA1 define which mode register
is loaded during the MODE REGISTER SET command (MRS or EMRS).
/RAS, /CAS, /
WE
Input
Command Inputs: /RAS, /CAS and /WE (along with /CS) define the command
being entered.
Input
Input Data Mask: DM is an input mask signal for write data. Input data is masked
when DM is sampled HIGH along with that input data during a WRITE access.
DM is sampled on both edges of DQS. Although DM pins are input only, the DM
loading matches the DQ and DQS loading. For the x16, LDM corresponds to the
data on DQ0-Q7; UDM corresponds to the data on DQ8-Q15.
DQS
(LDQS,UDQS)
I/O
Data Strobe: Output with read data, input with write data. Edge aligned with
read data, centered in write data. Used to capture write data. For the x16, LDQS
corresponds to the data on DQ0-Q7; UDQS corresponds to the data on DQ8Q15.
DQ
I/O
Data input / output pin: Data bus
VDD/VSS
Supply
Power supply for internal circuits and input buffers.
VDDQ/VSSQ
Supply
Power supply for output buffers for noise immunity.
VREF
Supply
Reference voltage for inputs for SSTL interface.
NC
NC
CK, /CK
CKE
DM
(LDM,UDM)
Rev. 1.0 /Oct. 2004
No connection.
5
HY5DU56422D(L)T
HY5DU56822D(L)T
HY5DU561622D(L)T
FUNCTIONAL BLOCK DIAGRAM (64Mx4)
4Banks x 16Mbit x 4 I/O Double Data Rate Synchronous DRAM
Input Buffer
4
Write Data Register
2-bit Prefetch Unit
8
16Mx4 / Bank0
16Mx4 / Bank2
8
16Mx4 / Bank3
Mode
Register
4
Output Buffer
16Mx4 / Bank1
Command
Decoder
2-bit Prefetch Unit
Bank
Control
Sense AMP
CLK
/CLK
CKE
/CS
/RAS
/CAS
/WE
DQS
DM
DQ[0:3]
Row
Decoder
Column Decoder
DQS
ADD
BA
Address
Buffer
Column Address
Counter
CLK_DLL
DQS
CLK,
/CLK
Data Strobe
Transmitter
Data Strobe
Receiver
DLL
Block
Mode
Register
Rev. 1.0 /Oct. 2004
6
HY5DU56422D(L)T
HY5DU56822D(L)T
HY5DU561622D(L)T
FUNCTIONAL BLOCK DIAGRAM (32Mx8)
4Banks x 8Mbit x 8 I/O Double Data Rate Synchronous DRAM
Input Buffer
8
Write Data Register
2-bit Prefetch Unit
16
8Mx8 / Bank0
8Mx8 / Bank2
16
8Mx8 / Bank3
Mode
Register
8
Output Buffer
8Mx8 / Bank1
Command
Decoder
2-bit Prefetch Unit
Bank
Control
Sense AMP
CLK
/CLK
CKE
/CS
/RAS
/CAS
/WE
DQS
DM
DQ[0:7]
Row
Decoder
Column Decoder
DQS
ADD
BA
Address
Buffer
Column Address
Counter
CLK_DLL
DQS
CLK,
/CLK
Data Strobe
Transmitter
Data Strobe
Receiver
DLL
Block
Mode
Register
Rev. 1.0 /Oct. 2004
7
HY5DU56422D(L)T
HY5DU56822D(L)T
HY5DU561622D(L)T
FUNCTIONAL BLOCK DIAGRAM (16Mx16)
4Banks x 4Mbit x 16 I/O Double Data Rate Synchronous DRAM
Input Buffer
16
Write Data Register
2-bit Prefetch Unit
32
4Mx16 / Bank0
4Mx16 / Bank2
32
4Mx16 / Bank3
Mode
Register
16
LDM, UDM
Output Buffer
4Mx16 / Bank1
Command
Decoder
2-bit Prefetch Unit
Bank
Control
Sense AMP
CLK
/CLK
CKE
/CS
/RAS
/CAS
/WE
LDQS, UDQS
DQ[0:15]
Row
Decoder
Column Decoder
LDQS, UDQS
ADD
BA
Address
Buffer
Column Address
Counter
CLK_DLL
LDQS
UDQS
CLK,
/CLK
Data Strobe
Transmitter
Data Strobe
Receiver
DLL
Block
Mode
Register
Rev. 1.0 /Oct. 2004
8
HY5DU56422D(L)T
HY5DU56822D(L)T
HY5DU561622D(L)T
SIMPLIFIED COMMAND TRUTH TABLE
A10/
AP
Command
CKEn-1
CKEn
CS
RAS
CAS
WE
Extended Mode Register Set1,2
H
X
L
L
L
L
OP code
Mode Register Set1,2
H
X
L
L
L
L
OP code
H
X
H
X
X
X
L
H
H
H
H
X
L
L
H
H
H
X
L
H
L
H
CA
H
X
L
H
L
L
CA
H
X
L
L
H
L
X
Read Burst Stop1
H
X
L
H
H
L
X
Auto Refresh1
H
H
L
L
L
H
X
Entry
H
L
L
L
L
H
Exit
L
H
Entry
H
L
Device
Deselect1
1
No Operation
Bank Active1
Read1
1,3
Read with Autoprecharge
Write1
Write with Autoprecharge1,4
Precharge All Banks1,5
Precharge selected Bank1
Self Refresh1
Precharge Power
Down Mode1
Active Power Down
Mode1
Exit
L
H
Entry
H
L
Exit
L
H
H
X
X
X
L
H
H
H
H
X
X
X
L
H
H
H
H
X
X
X
L
H
H
H
H
X
X
X
L
V
V
V
ADDR
BA
X
RA
V
L
H
L
H
V
V
H
X
L
V
X
X
X
X
( H=Logic High Level, L=Logic Low Level, X=Don’t Care, V=Valid Data Input, OP Code=Operand Code, NOP=No)
Note:
1. LDM/UDM states are Don’t Care. Refer to below Write Mask Truth Table.
2. OP Code(Operand Code) consists of A0~A12 and BA0~BA1 used for Mode Register setting during Extended MRS or
MRS. Before entering Mode Register Set mode, all banks must be in a precharge state and MRS command can be
issued after tRP period from Precharge command.
3. If a Read with Autoprecharge command is detected by memory component in CK(n), then there will be no command presented to activated bank until CK(n+BL/2+tRP).
4. If a Write with Autoprecharge command is detected by memory component in CK(n), then there will be no command presented to activated bank until CK(n+BL/2+1+tWR+tRP). Write Recovery Time (tWR) is needed to
guarantee that the last data has been completely written.
5. If A10/AP is High when Precharge command being issued, BA0/BA1 are ignored and all banks are selected to be
precharged.
*For more information about Truth Table, refer to “Device Operation” section in Hynix website.
Rev. 1.0 /Oct. 2004
9
HY5DU56422D(L)T
HY5DU56822D(L)T
HY5DU561622D(L)T
WRITE MASK TRUTH TABLE
Function
CKEn-1
CKEn
/CS, /RAS,
/CAS, /WE
DM
Data Write1
H
X
X
L
X
Data-In Mask1
H
X
X
H
X
ADDR
A10/
AP
BA
Note:
1. Write Mask command masks burst write data with reference to LDQS/UDQS(Data Strobes) and it is not related with
read data. In case of x16 data I/O, LDM and UDM control lower byte(DQ0~7) and Upper byte(DQ8~15) respectively.
Rev. 1.0 /Oct. 2004
10
HY5DU56422D(L)T
HY5DU56822D(L)T
HY5DU561622D(L)T
SIMPLIFIED STATE DIAGRAM
MRS
MODE
REGISTER
SET
SREF
SELF
REFRESH
IDLE
SREX
PDEN
PDEX
AREF
ACT
POWER
DOWN
POWER
DOWN
AUTO
REFRESH
PDEN
BST
PDEX
BANK
ACTIVE
READ
WRITE
READ
WRITE
WRITEAP
WRITE
WITH
AUTOPRECHARGE
PRE(PALL)
READAP
READ
READAP
WITH
AUTOPRECHARGE WRITEAP
READ
WRITE
PRE(PALL)
PRE(PALL)
PRECHARGE
POWER-UP
Command Input
Automatic Sequence
POWER APPLIED
Rev. 1.0 /Oct. 2004
11
HY5DU56422D(L)T
HY5DU56822D(L)T
HY5DU561622D(L)T
POWER-UP SEQUENCE AND DEVICE INITIALIZATION
DDR SDRAMs must be powered up and initialized in a predefined manner. Operational procedures other than those
specified may result in undefined operation. Power must first be applied to VDD, then to VDDQ, and finally to VREF
(and to the system VTT). VTT must be applied after VDDQ to avoid device latch-up, which may cause permanent damage to the device. VREF can be applied anytime after VDDQ, but is expected to be nominally coincident with VTT.
Except for CKE, inputs are not recognized as valid until after VREF is applied. CKE is an SSTL_2 input, but will detect an
LVCMOS LOW level after VDD is applied. Maintaining an LVCMOS LOW level on CKE during power-up is required to
guarantee that the DQ and DQS outputs will be in the High-Z state, where they will remain until driven in normal operation (by a read access). After all power supply and reference voltages are stable, and the clock is stable, the DDR
SDRAM requires a 200us delay prior to applying an executable command.
Once the 200us delay has been satisfied, a DESELECT or NOP command should be applied, and CKE should be
brought HIGH. Following the NOP command, a PRECHARGE ALL command should be applied. Next a EXTENDED
MODE REGISTER SET command should be issued for the Extended Mode Register, to enable the DLL, then a MODE
REGISTER SET command should be issued for the Mode Register, to reset the DLL, and to program the operating
parameters. After the DLL reset, tXSRD(DLL locking time) should be satisfied for read command. After the Mode Register set command, a PRECHARGE ALL command should be applied, placing the device in the all banks idle state.
Once in the idle state, two AUTO REFRESH cycles must be performed. Additionally, a MODE REGISTER SET command
for the Mode Register, with the reset DLL bit deactivated low (i.e. to program operating parameters without resetting
the DLL) must be performed. Following these cycles, the DDR SDRAM is ready for normal operation.
1.
Apply power - VDD, VDDQ, VTT, VREF in the following power up sequencing and attempt to maintain CKE at LVCMOS low state. (All the other input pins may be undefined.)
• VDD and VDDQ are driven from a single power converter output.
• VTT is limited to 1.44V (reflecting VDDQ(max)/2 + 50mV VREF variation + 40mV VTT variation.
• VREF tracks VDDQ/2.
• A minimum resistance of 42 Ohms (22 ohm series resistor + 22 ohm parallel resistor - 5% tolerance) limits the
input current from the VTT supply into any pin.
• If the above criteria cannot be met by the system design, then the following sequencing and voltage relationship must be adhered to during power up.
Voltage description
Sequencing
Voltage relationship to avoid latch-up
VDDQ
After or with VDD
< VDD + 0.3V
VTT
After or with VDDQ
< VDDQ + 0.3V
VREF
After or with VDDQ
< VDDQ + 0.3V
2.
Start clock and maintain stable clock for a minimum of 200usec.
3.
After stable power and clock, apply NOP condition and take CKE high.
4.
Issue Extended Mode Register Set (EMRS) to enable DLL.
5.
Issue Mode Register Set (MRS) to reset DLL and set device to idle state with bit A8=high. (An additional 200
cycles(tXSRD) of clock are required for locking DLL)
6.
Issue Precharge commands for all banks of the device.
Rev. 1.0 /Oct. 2004
12
HY5DU56422D(L)T
HY5DU56822D(L)T
HY5DU561622D(L)T
7.
Issue 2 or more Auto Refresh commands.
8.
Issue a Mode Register Set command to initialize the mode register with bit A8 = Low
Power-Up Sequence
VDD
VDDQ
tVTD
VTT
VREF
/CLK
CLK
tIS tIH
CKE
LVCMOS Low Level
CMD
NOP
PRE
EMRS
MRS
ADDR
CODE
A10
BA0, BA1
NOP
PRE
MRS
ACT
RD
CODE
CODE
CODE
CODE
CODE
CODE
CODE
CODE
CODE
CODE
CODE
CODE
CODE
CODE
Non-Read
Command
READ
AREF
DM
DQS
DQ'S
T=200usec
tRP
tMRD
tMRD
tRP
tRFC
tMRD
tXSRD*
Power UP
VDD and CK stable
Precharge All
EMRS Set
MRS Set
Reset DLL
(with A8=H)
Precharge All
2 or more
Auto Refresh
MRS Set
(with A8=L)
* 200 cycle(tXSRD) of CK are required (for DLL locking) before Read Command
Rev. 1.0 /Oct. 2004
13
HY5DU56422D(L)T
HY5DU56822D(L)T
HY5DU561622D(L)T
MODE REGISTER SET (MRS)
The mode register is used to store the various operating modes such as /CAS latency, addressing mode, burst length,
burst type, test mode, DLL reset. The mode register is programed via MRS command. This command is issued by the
low signals of /RAS, /CAS, /CS, /WE and BA0. This command can be issued only when all banks are in idle state and
CKE must be high at least one cycle before the Mode Register Set Command can be issued. Two cycles are required to
write the data in mode register. During the MRS cycle, any command cannot be issued. Once mode register field is
determined, the information will be held until reset by another MRS command.
BA1
BA0
0
0
A12
A11
A10
A9
A8
A7
Operating Mode
A6
A5
A4
CAS Latency
A3
A2
BT
A1
Burst Length
BA0
MRS Type
A6
A5
A4
CAS Latency
A3
Burst Type
0
MRS
0
0
0
Reserved
0
Sequential
1
EMRS
0
0
1
Reserved
1
Interleave
0
1
0
2
0
1
1
3
1
0
0
Reserved
1
0
1
1.5
1
1
0
2.5
1
1
1
Reserved
A0
Burst Length
A2
A1
A0
Sequential
Interleave
0
0
0
Reserved
Reserved
0
0
1
2
2
0
1
0
4
4
A12~A9
A8
A7
A6~A0
Operating Mode
0
1
1
8
8
0
0
0
Valid
Normal Operation
1
0
0
Reserved
Reserved
0
1
0
Valid
Normal Operation/ Reset DLL
1
0
1
Reserved
Reserved
0
0
1
VS
Vendor specific Test Mode
1
1
0
Reserved
Reserved
-
-
-
-
All other states reserved
1
1
1
Reserved
Reserved
Rev. 1.0 /Oct. 2004
14
HY5DU56422D(L)T
HY5DU56822D(L)T
HY5DU561622D(L)T
BURST DEFINITION
Burst Length
Starting Address (A2,A1,A0)
Sequential
Interleave
XX0
0, 1
0, 1
XX1
1, 0
1, 0
X00
0, 1, 2, 3
0, 1, 2, 3
X01
1, 2, 3, 0
1, 0, 3, 2
X10
2, 3, 0, 1
2, 3, 0, 1
X11
3, 0, 1, 2
3, 2, 1, 0
000
0, 1, 2, 3, 4, 5, 6, 7
0, 1, 2, 3, 4, 5, 6, 7
001
1, 2, 3, 4, 5, 6, 7, 0
1, 0, 3, 2, 5, 4, 7, 6
010
2, 3, 4, 5, 6, 7, 0, 1
2, 3, 0, 1, 6, 7, 4, 5
011
3, 4, 5, 6, 7, 0, 1, 2
3, 2, 1, 0, 7, 6, 5, 4
100
4, 5, 6, 7, 0, 1, 2, 3
4, 5, 6, 7, 0, 1, 2, 3
101
5, 6, 7, 0, 1, 2, 3, 4
5, 4, 7, 6, 1, 0, 3, 2
110
6, 7, 0, 1, 2, 3, 4, 5
6, 7, 4, 5, 2, 3, 0, 1
111
7, 0, 1, 2, 3, 4, 5, 6
7, 6, 5, 4, 3, 2, 1, 0
2
4
8
BURST LENGTH & TYPE
Read and write accesses to the DDR SDRAM are burst oriented, with the burst length being programmable. The burst
length determines the maximum number of column locations that can be accessed for a given Read or Write command. Burst lengths of 2, 4 or 8 locations are available for both the sequential and the interleaved burst types.
Reserved states should not be used, as unknown operation or incompatibility with future versions may result.
When a Read or Write command is issued, a block of columns equal to the burst length is effectively selected. All
accesses for that burst take place within this block, meaning that the burst wraps within the block if a boundary is
reached. The block is uniquely selected by A1-Ai when the burst length is set to two, by A2 -Ai when the burst length
is set to four and by A3 -Ai when the burst length is set to eight (where Ai is the most significant column address bit
for a given configuration). The remaining (least significant) address bit(s) is (are) used to select the starting location
within the block. The programmed burst length applies to both Read and Write bursts.
Accesses within a given burst may be programmed to be either sequential or interleaved; this is referred to as the
burst type and is selected via bit A3. The ordering of accesses within a burst is determined by the burst length, the
burst type and the starting column address, as shown in Burst Definition Table
Rev. 1.0 /Oct. 2004
15
HY5DU56422D(L)T
HY5DU56822D(L)T
HY5DU561622D(L)T
CAS LATENCY
The Read latency or CAS latency is the delay in clock cycles between the registration of a Read command and the
availability of the first burst of output data. The latency can be programmed 2 or 2.5 clocks for DDR200/266/333 and
3 clocks for DDR400.
If a Read command is registered at clock edge n, and the latency is m clocks, the data is available nominally coincident
with clock edge n + m.
Reserved states should not be used as unknown operation or incompatibility with future versions may result.
DLL RESET
The DLL must be enabled for normal operation. DLL enable is required during power up initialization, and upon returning to normal operation after having disabled the DLL for the purpose of debug or evaluation. The DLL is automatically
disabled when entering self refresh operation and is automatically re-enabled upon exit of self refresh operation. Any
time the DLL is enabled, 200 clock cycles must occur to allow time for the internal clock to lock to the externally
applied clock before an any command can be issued.
OUTPUT DRIVER IMPEDANCE CONTROL
The normal drive strength for all outputs is specified to be SSTL_2, Class II. Hynix also supports a half strength driver
option, intended for lighter load and/or point-to-point environments. Selection of the half strength driver option will
reduce the output drive strength by 50% of that of the full strength driver. I-V curves for both the full strength driver
and the half strength driver are included in this document.
Rev. 1.0 /Oct. 2004
16
HY5DU56422D(L)T
HY5DU56822D(L)T
HY5DU561622D(L)T
EXTENDED MODE REGISTER SET (EMRS)
The Extended Mode Register controls functions beyond those controlled by the Mode Register; these additional functions include DLL enable/disable, output driver strength selection(optional). These functions are controlled via the bits
shown below. The Extended Mode Register is programmed via the Mode Register Set command (BA0=1 and BA1=0)
and will retain the stored information until it is programmed again or the device loses power.
The Extended Mode Register must be loaded when all banks are idle and no bursts are in progress, and the controller
must wait the specified time before initiating any subsequent operation. Violating either of these requirements wil
result in unspecified operation.
BA1
BA0
0
1
A12
A11
A10
A9
A8
A7
A6
A5
A4
Operating Mode
BA0
MRS Type
0
MRS
1
EMRS
An~A3
A2~A0
Operating Mode
0
Valid
Normal Operation
_
_
All other states reserved
A3
A2
A1
A0
0*
DS
DLL
A0
DLL enable
0
Enable
1
Disable
A1
Output Driver
Impedance Control
0
Full Strength Driver
1
Half Strength Driver
* This part do not support/QFC function, A2 must be programmed to Zero.
Rev. 1.0 /Oct. 2004
17
HY5DU56422D(L)T
HY5DU56822D(L)T
HY5DU561622D(L)T
ABSOLUTE MAXIMUM RATINGS
Parameter
Operating Temperature (Ambient)
Storage Temperature
Voltage on VDD relative to VSS
Voltage on VDDQ relative to VSS
Voltage on inputs relative to VSS
Voltage on I/O pins relative to VSS
Output Short Circuit Current
Soldering Temperature ⋅ Time
Symbol
Rating
Unit
TA
0 ~ 70
o
TSTG
-55 ~ 150
o
VDD
VDDQ
VINPUT
VIO
IOS
-1.0 ~ 3.6
-1.0 ~ 3.6
-1.0 ~ 3.6
-0.5 ~3.6
50
TSOLDER
260 ⋅ 10
C
C
V
V
V
V
mA
oC
⋅ Sec
Note: Operation at above absolute maximum rating can adversely affect device reliability
DC OPERATING CONDITIONS (TA=0 to 70 oC, Voltage referenced to VSS = 0V)
Parameter
Power Supply Voltage (DDR200, 266, 333)
Power Supply Voltage (DDR200, 266,
Power Supply Voltage (DDR400)
333)1
Power Supply Voltage (DDR400)1
Input High Voltage
Input Low Voltage2
Termination Voltage
3
Symbol
Min
Typ.
Max
Unit
VDD
VDDQ
2.3
2.3
2.5
2.5
2.7
2.7
V
V
VDD
VDDQ
2.5
2.5
2.6
2.6
2.7
2.7
V
V
VIH
VIL
VREF + 0.15
-0.3
-
VDDQ + 0.3
VREF - 0.15
V
V
VTT
VREF
VREF - 0.04
0.49*VDDQ
VREF
0.5*VDDQ
VREF + 0.04
0.51*VDDQ
V
V
Reference Voltage
Input Voltage Level, CK and CK inputs
VIN(DC)
-0.3
-
VDDQ+0.3
V
Input Differential Voltage, CK and CK inputs4
VID(DC)
0.36
-
VDDQ+0.6
V
VI(RATIO)
0.71
-
1.4
-
V-I Matching: Pullup to Pulldown Current Ratio5
Input Leakage Current
6
Output Leakage Current7
Output High Current
Normal Strength
(min VDDQ, min VREF, min VTT)
Output Driver
Output Low Current
(VOUT=VTT ± 0.84)
Half Strength
Output Driver
(VOUT=VTT ± 0.68)
(min VDDQ, max VREF, max VTT)
Output High Current
(min VDDQ, min VREF, min VTT)
Output Low Current
(min VDDQ, max VREF, max VTT)
ILI
-2
-
2
uA
ILO
-5
-
5
uA
IOH
-16.8
-
-
mA
IOL
16.8
-
-
mA
IOH
-13.6
-
-
mA
IOL
13.6
-
-
mA
Note:
1. VDDQ must not exceed the level of VDD.
2. VIL (min) is acceptable -1.5V AC pulse width with < 5ns of duration.
3. VREF is expected to be equal to 0.5*VDDQ of the transmitting device, and to track variations in the dc level of the same.
Peak to peak noise on VREF may not exceed +/- 2% of the DC value.
4. VID is the magnitude of the difference between the input level on CK and the input level on /CK.
5. The ratio of the pullup current to the pulldown current is specified for the same temperature and voltage, over the entire temperature and voltage range, for device drain to source voltages from 0.25V to 1.0V. For a given output, it represents the maximum
difference between pullup and pulldown drivers due to process variation. The full variation in the ratio of the maximum to minimum pullup and pulldown current will not exceed 1/7 for device drain to source voltages from 0.1 to 1.0.
6. VIN=0 to VDD, All other pins are not tested under VIN =0V.
7. DQs are disabled, VOUT=0 to VDDQ
Rev. 1.0 /Oct. 2004
18
HY5DU56422D(L)T
HY5DU56822D(L)T
HY5DU561622D(L)T
IDD SPECIFICATION AND CONDITIONS
(TA=0 to 70 oC, Voltage referenced to VSS = 0V)
Test Conditions
Test Condition
Symbol
Operating Current:
One bank; Active - Precharge; tRC=tRC(min); tCK=tCK(min); DQ,DM and DQS inputs changing twice per clock
cycle; address and control inputs changing once per clock cycle
IDD0
Operating Current:
One bank; Active - Read - Precharge;
Burst Length=2; tRC=tRC(min); tCK=tCK(min); address and control inputs changing once per clock cycle
IDD1
Precharge Power Down Standby Current:
All banks idle; Power down mode; CKE=Low, tCK=tCK(min)
IDD2P
Idle Standby Current:
/CS=High, All banks idle; tCK=tCK(min);
CKE=High; address and control inputs changing once per clock cycle.
VIN=VREF for DQ, DQS and DM
IDD2F
Idle Quiet Standby Current:
/CS>=Vih(min); All banks idle; CKE>=Vih(min); Addresses and other control inputs stable, Vin=Vref for DQ, DQS
and DM
IDD2Q
Active Power Down Standby Current:
One bank active; Power down mode; CKE=Low, tCK=tCK(min)
IDD3P
Active Standby Current:
/CS=HIGH; CKE=HIGH; One bank; Active-Precharge; tRC=tRAS(max); tCK=tCK(min);
DQ, DM and DQS inputs changing twice per clock cycle; Address and other control inputs changing once per clock
cycle
IDD3N
Operating Current:
Burst=2; Reads; Continuous burst; One bank active; Address and control inputs changing once per clock cycle;
tCK=tCK(min); IOUT=0mA
IDD4R
Operating Current:
Burst=2; Writes; Continuous burst; One bank active; Address and control inputs changing once per clock cycle;
tCK=tCK(min); DQ, DM and DQS inputs changing twice per clock cycle
IDD4W
Auto Refresh Current:
tRC=tRFC(min) - 8*tCK for DDR200 at 100Mhz, 10*tCK for DDR266A & DDR266B at 133Mhz; distributed refresh
tRC=tRFC(min) - 14*tCK for DDR400 at 200Mhz
IDD5
Self Refresh Current:
CKE =< 0.2V; External clock on; tCK=tCK(min)
IDD6
Operating Current - Four Bank Operation:
Four bank interleaving with BL=4, Refer to the following page for detailed test condition
IDD7
Rev. 1.0 /Oct. 2004
19
HY5DU56422D(L)T
HY5DU56822D(L)T
HY5DU561622D(L)T
DETAILED TEST CONDITIONS FOR DDR SDRAM IDD1 & IDD7
IDD1: Operating current: One bank operation
1. Typical Case: VDD = 2.5V, T=25 oC for DDR200, 266, 333; VDD = 2.6V, T=25 oC for DDR400
2. Worst Case: VDD = 2.7V, T= 0 oC
3. Only one bank is accessed with tRC(min), Burst Mode, Address and Control inputs on NOP edge are
changing once per clock cycle. lout = 0mA
4. Timing patterns
- DDR200(100Mhz, CL=2): tCK = 10ns, CL2, BL=2, tRCD = 2*tCK, tRC = 10*tCK, tRAS = 5*tCK
Read: A0 N R0 N N P0 N A0 N - repeat the same timing with random address changing
50% of data changing at every burst
- DDR266B(133Mhz, CL=2.5): tCK = 7.5ns, CL=2.5, BL=4, tRCD = 3*tCK, tRC = 9*tCK, tRAS = 5*tCK
Read: A0 N N R0 N P0 N N N A0 N - repeat the same timing with random address changing
50% of data changing at every burst
- DDR266A (133Mhz, CL=2): tCK = 7.5ns, CL=2, BL=4, tRCD = 3*tCK, tRC = 9*tCK, tRAS = 5*tCK
Read: A0 N N R0 N P0 N N N A0 N - repeat the same timing with random address changing
50% of data changing at every burst
- DDR333(166Mhz, CL=2.5): tCK = 6ns, CL=2, BL=4, tRCD = 3*tCK, tRC = 10*tCK, tRAS = 7*tCK
Read: A0 N N R0 N N N P0 N N A0 N - repeat the same timing with random address changing
50% of data changing at every burst
- DDR400(200Mhz, CL=3): tCK = 5ns, CL=3, BL=4, tRCD = 3*tCK, tRC = 11*tCK, tRAS = 8*tCK
Read: A0 N N R0 N N N N P0 N N - repeat the same timing with random address changing
50% of data changing at every burst
Legend: A=Activate, R=Read, W=Write, P=Precharge, N=NOP
IDD7: Operating current: Four bank operation
1. Typical Case: VDD = 2.5V, T=25 oC for DDR200, 266, 333; VDD = 2.6V, T=25 oC for DDR400
2. Worst Case: VDD = 2.7V, T= 0 oC
3. Four banks are being interleaved with tRC(min), Burst Mode, Address and Control inputs on NOP edge are not
changing. lout = 0mA
4. Timing patterns
- DDR200(100Mhz, CL=2): tCK = 10ns, CL2, BL=4, tRRD = 2*tCK, tRCD= 3*tCK, Read with Autoprecharge
Read: A0 N A1 R0 A2 R1 A3 R2 A0 R3 A1 R0 - repeat the same timing with random address changing
50% of data changing at every burst
- DDR266B(133Mhz, CL=2.5): tCK = 7.5ns, CL=2.5, BL=4, tRRD = 2*tCK, tRCD = 3*tCK Read with autoprecharge
Read: A0 N A1 R0 A2 R1 A3 R2 N R3 A0 N A1 R0 - repeat the same timing with random address changing
50% of data changing at every burst
- DDR266A (133Mhz, CL=2): tCK = 7.5ns, CL2=2, BL=4, tRRD = 2*tCK, tRCD = 3*tCK
Read: A0 N A1 R0 A2 R1 A3 R2 N R3 A0 N A1 R0 - repeat the same timing with random address changing
50% of data changing at every burst
- DDR333(166Mhz, CL=2.5): tCK = 6ns, CL=2.5, BL=4, tRRD = 2*tCK, tRCD = 3*tCK, Read with autoprecharge
Read: A0 N A1 R0 A2 R1 A3 R2 N R3 A0 N A1 R0 - repeat the same timing with random address changing
50% of data changing at every burst
- DDR400(200Mhz, CL=3): tCK = 5ns, CL = 2, BL = 4, tRRD = 2*tCK, tRCD = 3*tCK, Read with autoprecharge
Read: A0 N A1 R0 A2 R1 A3 R2 N R3 A0 N A1 R0 - repeat the same timing with random address changing
50% of data changing at every burst
Legend: A=Activate, R=Read, W=Write, P=Precharge, N=NOP
Rev. 1.0 /Oct. 2004
20
HY5DU56422D(L)T
HY5DU56822D(L)T
HY5DU561622D(L)T
IDD Specification
64Mx4
Parameter
Symbol
Operating Current
IDD0
Operating Current
IDD1
Precharge Power Down Standby Current
IDD2P
Idle Standby Current
IDD2F
Active Power Down Standby Current
IDD3P
Active Standby Current
IDD3N
Speed
DDR400B
DDR333
90
80
DDR266A
100
DDR266B
DDR200
70
65
90
80
10
60
50
45
30
mA
40
35
mA
mA
IDD4R
160
150
140
120
Operating Current
IDD4W
160
150
140
120
140
130
Self Refresh Current
IDD5
Normal
Low Power
Operating Current - Four Bank Operation
150
3
IDD6
IDD7
240
DDR400B
DDR333
90
80
mA
mA
1.5
250
mA
40
Operating Current
Auto Refresh Current
mA
mA
15
50
Unit
mA
220
200
mA
32Mx8
Parameter
Symbol
Operating Current
IDD0
Operating Current
IDD1
Precharge Power Down Standby Current
IDD2P
Idle Standby Current
IDD2F
Speed
DDR266A
100
DDR266B
DDR200
70
65
mA
90
80
mA
40
30
mA
40
35
mA
130
10
60
50
45
mA
Active Power Down Standby Current
IDD3P
Active Standby Current
IDD3N
50
Operating Current
IDD4R
180
160
150
Operating Current
IDD4W
180
160
150
130
140
130
Auto Refresh Current
Self Refresh Current
Normal
Low Power
Operating Current - Four Bank Operation
Rev. 1.0 /Oct. 2004
15
IDD5
150
IDD7
mA
3
IDD6
220
mA
mA
1.5
230
Unit
mA
200
180
mA
21
HY5DU56422D(L)T
HY5DU56822D(L)T
HY5DU561622D(L)T
16Mx16
Parameter
Symbol
Operating Current
IDD0
Operating Current
IDD1
Precharge Power Down Standby Current
IDD2P
Idle Standby Current
IDD2F
Active Power Down Standby Current
IDD3P
Active Standby Current
IDD3N
Speed
DDR400B
DDR333
90
80
DDR266A
100
DDR266B
DDR200
70
65
90
80
10
60
50
45
30
mA
40
35
mA
mA
IDD4R
200
190
170
150
Operating Current
IDD4W
200
190
170
150
140
130
Self Refresh Current
IDD5
Normal
Low Power
Operating Current - Four Bank Operation
Rev. 1.0 /Oct. 2004
150
3
IDD6
IDD7
240
mA
mA
1.5
250
mA
40
Operating Current
Auto Refresh Current
mA
mA
15
50
Unit
mA
220
200
mA
22
HY5DU56422D(L)T
HY5DU56822D(L)T
HY5DU561622D(L)T
AC OPERATING CONDITIONS (TA=0 to 70 oC, Voltage referenced to VSS = 0V)
Parameter
Symbol
Min
Max
Unit
Input High (Logic 1) Voltage, DQ, DQS and DM signals
VIH(AC)
VREF + 0.31
-
V
Input Low (Logic 0) Voltage, DQ, DQS and DM signals
VIL(AC)
-
VREF - 0.31
V
Input Differential Voltage, CK and /CK inputs1
VID(AC)
0.7
VDDQ + 0.6
V
Input Crossing Point Voltage, CK and /CK inputs2
VIX(AC)
0.5*VDDQ-0.2
0.5*VDDQ+0.2
V
Note:
1. VID is the magnitude of the difference between the input level on CK and the input on /CK.
2. The value of VIX is expected to equal 0.5*V DDQ of the transmitting device and must track variations in the DC level of the same.
*For more information about AC Overshoot/Undershoot Specifications, refer to “Device Operation” section in hynix website.
AC OPERATING TEST CONDITIONS (TA=0 to 70oC, Voltage referenced to VSS = 0V)
Parameter
Value
Unit
Reference Voltage
VDDQ x 0.5
V
Termination Voltage
VDDQ x 0.5
V
AC Input High Level Voltage (VIH, min)
VREF + 0.31
V
AC Input Low Level Voltage (VIL, max)
VREF - 0.31
V
Input Timing Measurement Reference Level Voltage
VREF
V
Output Timing Measurement Reference Level Voltage
VTT
V
Input Signal maximum peak swing
1.5
V
Input minimum Signal Slew Rate
1
V/ns
Termination Resistor (RT)
50
Ω
Series Resistor (RS)
25
W
Output Load Capacitance for Access Time Measurement (CL)
30
pF
Rev. 1.0 /Oct. 2004
23
HY5DU56422D(L)T
HY5DU56822D(L)T
HY5DU561622D(L)T
AC CHARACTERISTICS (AC operating conditions unless otherwise noted)
Parameter
Symbol
DDR400B
DDR333
DDR266A
DDR266B
DDR200
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
UNIT
Row Cycle Time
tRC
55
-
60
-
65
-
65
-
70
-
ns
Auto Refresh Row
Cycle Time
tRFC
70
-
72
-
75
-
75
-
80
-
ns
Row Active Time
tRAS
40
70K
42
70K
45
120K
45
120K
50
120K
ns
Active to Read with
Auto Precharge
tRAP
tRCD or
tRASmin
-
tRCD or
tRASmin
-
tRCD or
tRASmin
-
tRCD or
tRASmin
-
tRCD or
tRASmin
-
ns
Row Address to
Column Address Delay
tRCD
15
-
18
-
20
-
20
-
20
-
ns
Row Active to Row
Active Delay
tRRD
10
-
12
-
15
-
15
-
15
-
ns
Column Address to
Column Address Delay
tCCD
1
-
1
-
1
-
1
-
1
-
tCK
Row Precharge Time
tRP
15
-
18
-
20
-
20
-
20
-
ns
Write Recovery Time
tWR
15
-
15
-
15
-
15
-
15
-
ns
Internal Write to Read
Command Delay
tWTR
2
-
1
-
1
-
1
-
1
-
tCK
tDAL
(tWR/
tCK)
+
(tRP/tCK)
-
(tWR/
tCK)
+
(tRP/tCK)
-
(tWR/
tCK)
+
(tRP/tCK)
-
(tWR/
tCK)
+
(tRP/tCK)
-
(tWR/
tCK)
+
(tRP/tCK)
-
tCK
5
10
-
-
-
-
-
-
-
-
-
-
6
12
7.5
12
7.5
12
8.0
12
ns
-
-
7.5
12
7.5
12
10
12
10
12
ns
Delay16
Auto Precharge Write
Recovery + Precharge
Time15
CL = 3
System
Clock Cycle CL = 2.5
Time
CL = 2
tCK
Clock High Level Width
tCH
0.45
0.55
0.45
0.55
0.45
0.55
0.45
0.55
0.45
0.55
tCK
Clock Low Level Width
tCL
0.45
0.55
0.45
0.55
0.45
0.55
0.45
0.55
0.45
0.55
tCK
Data-Out edge to Clock
edge Skew
tAC
-0.7
0.7
-0.7
0.7
-0.75
0.75
-0.75
0.75
-0.75
0.75
ns
DQS-Out edge to Clock
tDQSCK
edge Skew
-0.55
0.55
-0.6
0.6
-0.75
0.75
-0.75
0.75
-0.75
0.75
ns
DQS-Out edge to DatatDQSQ
Out edge Skew
-
0.4
-
0.45
-
0.5
-
0.5
-
0.6
ns
tQH
tHP
-tQHS
-
tHP
-tQHS
-
tHP
-tQHS
-
tHP
-tQHS
-
tHP
-tQHS
-
ns
tHP
min
(tCL,tCH)
-
min
(tCL,tCH)
-
min
(tCL,tCH)
-
min
(tCL,tCH)
-
min
(tCL,tCH)
-
ns
tQHS
-
0.5
-
0.55
-
0.75
-
0.75
-
0.75
ns
Data-Out hold time
from DQS1,10
Clock Half Period1,9
Data Hold Skew
Factor10
Valid Data Output
Window
Rev. 1.0 /Oct. 2004
tDV
tQH-tDQSQ
tQH-tDQSQ
tQH-tDQSQ
tQH-tDQSQ
tQH-tDQSQ
ns
24
HY5DU56422D(L)T
HY5DU56822D(L)T
HY5DU561622D(L)T
- Continue
Parameter
Symbol
DDR400B
DDR333
DDR266A
DDR266B
DDR200
UNIT
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
tHZ
-0.7
0.7
-0.7
0.7
-0.75
0.75
-0.75
0.75
-0.8
0.8
ns
tLZ
-0.7
0.7
-0.7
0.7
-0.75
0.75
-0.75
0.75
-0.8
0.8
ns
tIS
0.6
-
0.75
-
0.9
-
0.9
-
1.1
-
ns
tIH
0.6
-
0.75
-
0.9
-
0.9
-
1.1
-
ns
tIS
0.7
-
0.8
-
1.0
-
1.0
-
1.1
-
ns
tIH
0.7
-
0.8
-
1.0
-
1.0
-
1.1
-
ns
tIPW
2.2
-
2.2
-
2.2
-
2.2
-
2.5
-
ns
Write DQS High Level Width
tDQSH
0.35
-
0.35
-
0.35
-
0.35
-
0.35
-
tCK
Write DQS Low Level Width
tDQSL
0.35
-
0.35
-
0.35
-
0.35
-
0.35
-
tCK
Clock to First Rising edge of DQSIn
tDQSS
0.72
1.25
0.75
1.25
0.75
1.25
0.75
1.25
0.75
1.25
tCK
DQS falling edge to CK setup time
tDSS
0.2
-
0.2
-
0.2
-
0.2
-
0.2
-
tCK
DQS falling edge hold time from
CK
tDSH
0.2
-
0.2
-
0.2
-
0.2
-
0.2
-
tCK
tDS
0.4
-
0.45
-
0.5
-
0.5
-
0.6
-
ns
tDH
0.4
-
0.45
-
0.5
-
0.5
-
0.6
-
ns
DQ & DM Input Pulse Width
tDIPW
1.75
-
1.75
-
1.75
-
1.75
-
2
-
ns
Read DQS Preamble Time
tRPRE
0.9
1.1
0.9
1.1
0.9
1.1
0.9
1.1
0.9
1.1
tCK
Read DQS Postamble Time
tRPST
0.4
0.6
0.4
0.6
0.4
0.6
0.4
0.6
0.4
0.6
tCK
Write DQS Preamble Setup Time
tWPRES
0
-
0
-
0
-
0
-
0
-
tCK
Write DQS Preamble Hold Time
tWPREH 0.25
-
0.25
-
0.25
-
0.25
-
0.25
-
tCK
Data-out high-impedance window
from CK,/CK17
Data-out low-impedance window
from CK, /CK17
Input Setup Time (fast slew
rate)2,3,5,6
Input Hold Time (fast slew
rate)2,3,5,6
Input Setup Time (slow slew
rate)2,4,5,6
Input Hold Time (slow slew
rate)2,4,5,6
Input Pulse Width6
Data-in Setup Time to DQS-In (DQ
& DM)6,7,11,12,13
Data-in Hold Time to DQS-In (DQ
& DM)6,7,11,12,13
Write DQS Postamble Time
tWPST
0.4
0.6
0.4
0.6
0.4
0.6
0.4
0.6
0.4
0.6
tCK
Mode Register Set Delay
tMRD
2
-
2
-
2
-
2
-
2
-
tCK
Exit Self Refresh to non-Read
command
tXSNR
75
-
75
-
75
-
75
-
80
-
ns
tXSRD
200
-
200
-
200
-
200
-
200
-
tCK
tREFI
-
7.8
-
7.8
-
7.8
-
7.8
-
7.8
us
Exit Self Refresh to Read
command8
Average Periodic Refresh Interval
Rev. 1.0 /Oct. 2004
25
HY5DU56422D(L)T
HY5DU56822D(L)T
HY5DU561622D(L)T
Note:
1. This calculation accounts for tDQSQ(max), the pulse width distortion of on-chip circuit and jitter.
2. Data sampled at the rising edges of the clock: A0~A12, BA0~BA1, CKE, /CS, /RAS, /CAS, /WE.
3. For command/address input slew rate >=1.0V/ns
4. For command/address input slew rate >=0.5V/ns and <1.0V/ns
This Derating Table is used to increase tIS/tIH in case where the input slew-rate is below 0.5V/ns.
Input Setup / Hold Slew-rate Derating Table.
Input Setup / Hold Slew-rate
Delta tIS
Delta tIH
V/ns
ps
ps
0.5
0
0
0.4
+50
0
0.3
+100
0
5. CK, /CK slew rates are >=1.0V/ns
6. These parameters guarantee device timing, but they are not necessarily tested on each device, and they may be guaranteed by
design or tester correlation.
7. Data latched at both rising and falling edges of Data Strobes(LDQS/UDQS): DQ, LDM/UDM.
8. Minimum of 200 cycles of stable input clocks after Self Refresh Exit command, where CKE is held high, is required to complete
Self Refresh Exit and lock the internal DLL circuit of DDR SDRAM.
9. Min (tCL, tCH) refers to the smaller of the actual clock low time and the actual clock high time as provided to the device (i.e. this
value can be greater than the minimum specification limits for tCL and tCH).
10. tHP = minimum half clock period for any given cycle and is defined by clock high or clock low (tCH, tCL). tQHS consists of tDQSQmax, the pulse width distortion of on-chip clock circuits, data pin to pin skew and output pattern effects and p-channel to n-channel variation of the output drivers.
11. This Derating Table is used to increase tDS/tDH in case where the input slew-rate is below 0.5V/ns.
Input Setup / Hold Slew-rate Derating Table.
Input Setup / Hold Slew-rate
Delta tDS
Delta tDH
V/ns
ps
ps
0.5
0
0
0.4
+75
+75
0.3
+150
+150
12. I/O Setup/Hold Plateau Derating. This Derating Table is used to increase tDS/tDH in case where the input level is flat below VREF
+/-310mV for a duration of up to 2ns.
I/O Input Level
Rev. 1.0 /Oct. 2004
Delta tDS
Delta tDH
mV
ps
ps
+280
+50
+50
26
HY5DU56422D(L)T
HY5DU56822D(L)T
HY5DU561622D(L)T
13. I/O Setup/Hold Delta Inverse Slew Rate Derating. This Derating Table is used to increase tDS/tDH in case where the DQ and DQS
slew rates differ. The Delta Inverse Slew Rate is calculated as (1/SlewRate1)-(1/SlewRate2). For example, if slew rate 1 = 0.5V/ns
and Slew Rate2 = 0.4V/n then the Delta Inverse Slew Rate = -0.5ns/V.
(1/SlewRate1)-(1/SlewRate2)
Delta tDS
Delta tDH
ns/V
ps
ps
0
0
0
+/-0.25
+50
+50
+/- 0.5
+100
+100
14. DQS, DM and DQ input slew rate is specified to prevent double clocking of data and preserve setup and hold times. Signal transitions through the DC region must be monotonic.
15. tDAL = (tWR/tCK) + (tRP / tCK). For each of the terms above, if not already an integer, round to the next highest integer.
tCK is equal to the actual system clock cycle time.
Example: For DDR266B at CL=2.5 and tCK = 7.5 ns,
tDAL = (15 ns / 7.5 ns) + (20 ns / 7.5 ns) = (2.00) + (2.67)
Round up each non-integer to the next highest integer: = (2) + (3), tDAL = 5 clocks
16. For the parts which do not has internal RAS lockout circuit, Active to Read with Auto precharge delay should be tRAS - BL/2 x tCK.
17. tHZ and tLZ transitions occur in the same access time windows as valid data transitions. These parameters are not referenced to
a specific voltage level but specify when the device output is no longer driving (HZ), or begins driving (LZ).
Rev. 1.0 /Oct. 2004
27
HY5DU56422D(L)T
HY5DU56822D(L)T
HY5DU561622D(L)T
CAPACITANCE (TA=25oC, f=100MHz)
Parameter
Pin
Symbol
Min
Max
Unit
Input Clock Capacitance
CK, /CK
CI1
2.0
3.0
pF
Delta Input Clock Capacitance
CK, /CK
Delta CI1
-
0.25
pF
Input Capacitance
All other input-only pins
CI1
2.0
3.0
pF
Delta Input Capacitance
All other input-only pins
Delta CI2
-
0.5
pF
Input / Output Capacitance
DQ, DQS, DM
CIO
4.0
5.0
pF
Delta Input / Output Capacitance
DQ, DQS, DM
Delta CIO
-
0.5
pF
Note:
1. VDD = min. to max., VDDQ = 2.3V to 2.7V, VODC = VDDQ/2, VOpeak-to-peak = 0.2V
2. Pins not under test are tied to GND.
3. These values are guaranteed by design and are tested on a sample basis only.
OUTPUT LOAD CIRCUIT
V TT
R T =50Ω
Output
Zo=50Ω
V REF
C L =30pF
Rev. 1.0 /Oct. 2004
28
HY5DU56422D(L)T
HY5DU56822D(L)T
HY5DU561622D(L)T
PACKAGE INFORMATION
400mil 66pin Thin Small Outline Package
Unit : mm(Inch),
max
min
11.94 (0.470)
11.79 (0.462)
10.26 (0.404)
10.05 (0.396)
BASE PLANE
22.33 (0.879)
22.12 (0.871)
0.65 (0.0256) BSC
1.194 (0.0470)
0.991 (0.0390)
Rev. 1.0 /Oct. 2004
0.35 (0.0138)
0.25 (0.0098)
0 ~ 5 Deg.
SEATING PLANE
0.15 (0.0059)
0.05 (0.0020)
0.597 (0.0235)
0.406 (0.0160)
0.210 (0.0083)
0.120 (0.0047)
29