Freescale MPC8540VT833LC Integrated processor hardware specification Datasheet

Freescale Semiconductor
MPC8540EC
Rev. 4, 12/2006
Technical Data
MPC8540
Integrated Processor
Hardware Specifications
The MPC8540 integrates a PowerPC™ processor core built
on Power Architecture™ technology with system logic
required for networking, telecommunications, and wireless
infrastructure applications. The MPC8540 is a member of
the PowerQUICC™ III family of devices that combine
system-level support for industry-standard interfaces with
processors that implement the embedded category of the
Power Architecture technology. For functional
characteristics of the processor, refer to the MPC8540
PowerQUICC™ III Integrated Host Processor Reference
Manual.
To locate any published errata or updates for this document,
contact your Freescale sales office.
© Freescale Semiconductor, Inc., 2004, 2006. All rights reserved.
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Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 7
Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 11
Clock Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 15
DDR SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Ethernet: Three-Speed,10/100, MII Management . . 22
Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
PCI/PCI-X . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
RapidIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . 66
Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
System Design Information . . . . . . . . . . . . . . . . . . . 89
Document Revision History . . . . . . . . . . . . . . . . . . . 96
Device Nomenclature . . . . . . . . . . . . . . . . . . . . . . . 101
Overview
1 Overview
The following section provides a high-level overview of the MPC8540 features. Figure 1 shows the major
functional units within the MPC8540.
DDR
SDRAM
ROM,
SDRAM,
GPIO
256KB
L2-Cache/
SRAM
DDR SDRAM Controller
Local Bus Controller
e500
Coherency
Module
32 KB L1
I Cache
Programmable
Interrupt Controller
IRQs
e500 Core
Core Complex Bus
RapidIO Controller
RapidIO-8
16 Gb/s
PCI/PCI-X Controller
PCI-X 64b
133 MHz
OCeaN
10/100
ENET
MII
32 KB L1
D Cache
4ch DMA Controller
Serial
DUART
TSEC
10/100/1G
I2C
I2C
MII, GMII,TBI,
RTBI, RGMII
Controller
TSEC
10/100/1G
MII, GMII,TBI,
RTBI, RGMII
Figure 1. MPC8540 Block Diagram
1.1 Key Features
The following lists an overview of the MPC8540 feature set.
• High-performance, 32-bit Book E–enhanced core that implements the Power Architecture
— 32-Kbyte L1 instruction cache and 32-Kbyte L1 data cache with parity protection. Caches can
be locked entirely or on a per-line basis. Separate locking for instructions and data
— Memory management unit (MMU) especially designed for embedded applications
— Enhanced hardware and software debug support
— Performance monitor facility (similar to but different from the MPC8540 performance monitor
described in Chapter 18, “Performance Monitor.”
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
2
Freescale Semiconductor
Overview
•
•
•
256 Kbyte L2 cache/SRAM
— Can be configured as follows
– Full cache mode (256-Kbyte cache).
– Full memory-mapped SRAM mode (256-Kbyte SRAM mapped as a single 256-Kbyte
block or two 128-Kbyte blocks)
– Half SRAM and half cache mode (128-Kbyte cache and 128-Kbyte memory-mapped
SRAM)
— Full ECC support on 64-bit boundary in both cache and SRAM modes
— Cache mode supports instruction caching, data caching, or both
— External masters can force data to be allocated into the cache through programmed memory
ranges or special transaction types (stashing)
— Eight-way set-associative cache organization (1024 sets of 32-byte cache lines)
— Supports locking the entire cache or selected lines. Individual line locks are set and cleared
through Book E instructions or by externally mastered transactions
— Global locking and flash clearing done through writes to L2 configuration registers
— Instruction and data locks can be flash cleared separately
— Read and write buffering for internal bus accesses
— SRAM features include the following:
– I/O devices access SRAM regions by marking transactions as snoopable (global)
– Regions can reside at any aligned location in the memory map
– Byte accessible ECC is protected using read-modify-write transactions accesses for smaller
than cache-line accesses.
Address translation and mapping unit (ATMU)
— Eight local access windows define mapping within local 32-bit address space
— Inbound and outbound ATMUs map to larger external address spaces
– Three inbound windows plus a configuration window on PCI/PCI-X
– Four inbound windows plus a default and configuration window on RapidIO
– Four outbound windows plus default translation for PCI
– Eight outbound windows plus default translation for RapidIO
DDR memory controller
— Programmable timing supporting DDR-1 SDRAM
— 64-bit data interface, up to 333-MHz data rate
— Four banks of memory supported, each up to 1 Gbyte
— DRAM chip configurations from 64 Mbits to 1 Gbit with x8/x16 data ports
— Full ECC support
— Page mode support (up to 16 simultaneous open pages)
— Contiguous or discontiguous memory mapping
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
3
Overview
•
•
•
— Read-modify-write support for RapidIO atomic increment, decrement, set, and clear
transactions
— Sleep mode support for self refresh SDRAM
— Supports auto refreshing
— On-the-fly power management using CKE signal
— Registered DIMM support
— Fast memory access via JTAG port
— 2.5-V SSTL2 compatible I/O
RapidIO interface unit
— 8-bit RapidIO I/O and messaging protocols
— Source-synchronous double data rate (DDR) interfaces
— Supports small type systems (small domain, 8-bit device ID)
— Supports four priority levels (ordering within a level)
— Reordering across priority levels
— Maximum data payload of 256 bytes per packet
— Packet pacing support at the physical layer
— CRC protection for packets
— Supports atomic operations increment, decrement, set, and clear
— LVDS signaling
RapidIO–compliant message unit
— One inbound data message structure (inbox)
— One outbound data message structure (outbox)
— Supports chaining and direct modes in the outbox
— Support of up to 16 packets per message
— Support of up to 256 bytes per packet and up to 4 Kbytes of data per message
— Supports one inbound doorbell message structure
Programmable interrupt controller (PIC)
— Programming model is compliant with the OpenPIC architecture
— Supports 16 programmable interrupt and processor task priority levels
— Supports 12 discrete external interrupts
— Supports 4 message interrupts with 32-bit messages
— Supports connection of an external interrupt controller such as the 8259 programmable
interrupt controller
— Four global high resolution timers/counters that can generate interrupts
— Supports 22 other internal interrupt sources
— Supports fully nested interrupt delivery
— Interrupts can be routed to external pin for external processing
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
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Freescale Semiconductor
Overview
•
•
•
•
•
•
— Interrupts can be routed to the e500 core’s standard or critical interrupt inputs
— Interrupt summary registers allow fast identification of interrupt source
I2C controller
— Two-wire interface
— Multiple master support
— Master or slave I2C mode support
— On-chip digital filtering rejects spikes on the bus
Boot sequencer
— Optionally loads configuration data from serial ROM at reset via the I2C interface
— Can be used to initialize configuration registers and/or memory
— Supports extended I2C addressing mode
— Data integrity checked with preamble signature and CRC
DUART
— Two 4-wire interfaces (SIN, SOUT, RTS, CTS)
— Programming model compatible with the original 16450 UART and the PC16550D
10/100 fast Ethernet controller (FEC)
— Operates at 10 to 100 megabits per second (Mbps) as a device debug and maintenance port
Local bus controller (LBC)
— Multiplexed 32-bit address and data operating at up to 166 MHz
— Eight chip selects support eight external slaves
— Up to eight-beat burst transfers
— The 32-, 16-, and 8-bit port sizes are controlled by an on-chip memory controller
— Three protocol engines available on a per chip select basis:
– General purpose chip select machine (GPCM)
– Three user programmable machines (UPMs)
– Dedicated single data rate SDRAM controller
— Parity support
— Default boot ROM chip select with configurable bus width (8-,16-, or 32-bit)
Two three-speed (10/100/1Gb) Ethernet controllers (TSECs)
— Dual IEEE 802.3, 802.3u, 802.3x, 802.3z, 802.3ac, 802.3ab compliant controllers
— Support for different Ethernet physical interfaces:
– 10/100/1Gb Mbps IEEE 802.3 GMII
– 10/100 Mbps IEEE 802.3 MII
– 10 Mbps IEEE 802.3 MII
– 1000 Mbps IEEE 802.3z TBI
– 10/100/1Gb Mbps RGMII/RTBI
— Full- and half-duplex support
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
5
Overview
•
•
•
— Buffer descriptors are backward compatible with MPC8260 and MPC860T 10/100
programming models
— 9.6-Kbyte jumbo frame support
— RMON statistics support
— 2-Kbyte internal transmit and receive FIFOs
— MII management interface for control and status
— Programmable CRC generation and checking
— Ability to force allocation of header information and buffer descriptors into L2 cache.
OCeaN switch fabric
— Four-port crossbar packet switch
— Reorders packets from a source based on priorities
— Reorders packets to bypass blocked packets
— Implements starvation avoidance algorithms
— Supports packets with payloads of up to 256 bytes
Integrated DMA controller
— Four-channel controller
— All channels accessible by both the local and remote masters
— Extended DMA functions (advanced chaining and striding capability)
— Support for scatter and gather transfers
— Misaligned transfer capability
— Interrupt on completed segment, link, list, and error
— Supports transfers to or from any local memory or I/O port
— Selectable hardware-enforced coherency (snoop/no-snoop)
— Ability to start and flow control each DMA channel from external 3-pin interface
— Ability to launch DMA from single write transaction
PCI/PCI-X controller
— PCI 2.2 and PCI-X 1.0 compatible
— 64- or 32-bit PCI port supports at 16 to 66 MHz
— 64-bit PCI-X support up to 133 MHz
— Host and agent mode support
— 64-bit dual address cycle (DAC) support
— PCI-X supports multiple split transactions
— Supports PCI-to-memory and memory-to-PCI streaming
— Memory prefetching of PCI read accesses
— Supports posting of processor-to-PCI and PCI-to-memory writes
— PCI 3.3-V compatible
— Selectable hardware-enforced coherency
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
6
Freescale Semiconductor
Electrical Characteristics
•
•
•
•
•
Power management
— Fully static 1.2-V CMOS design with 3.3- and 2.5-V I/O
— Supports power saving modes: doze, nap, and sleep
— Employs dynamic power management, which automatically minimizes power consumption of
blocks when they are idle.
System performance monitor
— Supports eight 32-bit counters that count the occurrence of selected events
— Ability to count up to 512 counter-specific events
— Supports 64 reference events that can be counted on any of the 8 counters
— Supports duration and quantity threshold counting
— Burstiness feature that permits counting of burst events with a programmable time between
bursts
— Triggering and chaining capability
— Ability to generate an interrupt on overflow
System access port
— Uses JTAG interface and a TAP controller to access entire system memory map
— Supports 32-bit accesses to configuration registers
— Supports cache-line burst accesses to main memory
— Supports large block (4-Kbyte) uploads and downloads
— Supports continuous bit streaming of entire block for fast upload and download
IEEE 1149.1-compliant, JTAG boundary scan
783 FC-PBGA package
2 Electrical Characteristics
This section provides the electrical specifications and thermal characteristics for the MPC8540. The
MPC8540 is currently targeted to these specifications. Some of these specifications are independent of the
I/O cell, but are included for a more complete reference. These are not purely I/O buffer design
specifications.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
7
Electrical Characteristics
2.1 Overall DC Electrical Characteristics
This section covers the ratings, conditions, and other characteristics.
2.1.1 Absolute Maximum Ratings
Table 1 provides the absolute maximum ratings.
Table 1. Absolute Maximum Ratings 1
Characteristic
Symbol
Core supply voltage
For devices rated at 667 and 833 MHz
For devices rated at 1 GHz
VDD
PLL supply voltage
For devices rated at 667 and 833 MHz
For devices rated at 1 GHz
AVDD
DDR DRAM I/O voltage
GVDD
–0.3 to 3.63
V
Three-speed Ethernet I/O voltage
LVDD
–0.3 to 3.63
–0.3 to 2.75
V
PCI/PCI-X, local bus, RapidIO, 10/100 Ethernet, MII
management, DUART, system control and power
management, I2C, and JTAG I/O voltage
OVDD
–0.3 to 3.63
V
3
Input voltage
MVIN
–0.3 to (GVDD + 0.3)
V
2, 5
MVREF
–0.3 to (GVDD + 0.3)
V
2, 5
Three-speed Ethernet signals
LVIN
–0.3 to (LVDD + 0.3)
V
4, 5
PCI/PCI-X, Local bus, RapidIO,
10/100 Ethernet, DUART,
SYSCLK, system control and
power management, I2C, and
JTAG signals
OVIN
–0.3 to (OVDD + 0.3)
V
5
TSTG
–55 to 150
•C
DDR DRAM signals
DDR DRAM reference
Storage temperature range
Max Value
Unit
Notes
V
–0.3 to 1.32
–0.3 to 1.43
V
–0.3 to 1.32
–0.3 to 1.43
Notes:
1.Functional and tested operating conditions are given in Table 2. Absolute maximum ratings are stress
ratings only, and functional operation at the maximums is not guaranteed. Stresses beyond those listed
may affect device reliability or cause permanent damage to the device.
2.Caution: MVIN must not exceed GVDD by more than 0.3 V. This limit may be exceeded for a maximum of
20 ms during power-on reset and power-down sequences.
3.Caution: OVIN must not exceed OVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20
ms during power-on reset and power-down sequences.
4.Caution: LVIN must not exceed LVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20
ms during power-on reset and power-down sequences.
5.(M,L,O)VIN and MVREF may overshoot/undershoot to a voltage and for a maximum duration as shown in
Figure 2.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
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Freescale Semiconductor
Electrical Characteristics
2.1.2 Power Sequencing
The MPC8540 requires its power rails to be applied in a specific sequence in order to ensure proper device
operation. These requirements are as follows for power up:
1. VDD, AVDD
2. GVDD, LVDD, OVDD (I/O supplies)
Items on the same line have no ordering requirement with respect to one another. Items on separate lines
must be ordered sequentially such that voltage rails on a previous step must reach 90 percent of their value
before the voltage rails on the current step reach 10 percent of theirs.
NOTE
If the items on line 2 must precede items on line 1, please ensure that the
delay will not exceed 500 ms and the power sequence is not done greater
than once per day in production environment.
NOTE
From a system standpoint, if the I/O power supplies ramp prior to the VDD
core supply, the I/Os on the MPC8540 may drive a logic one or zero during
power-up.
2.1.3 Recommended Operating Conditions
Table 2 provides the recommended operating conditions for the MPC8540. Note that the values in Table 2
are the recommended and tested operating conditions. Proper device operation outside of these conditions
is not guaranteed.
Table 2. Recommended Operating Conditions
Characteristic
Core supply voltage
Symbol
Recommended
Value
V
VDD
1.2 V ± 60 mV
1.3 V ± 50 mV
For devices rated at 667 and 833 MHz
For devices rated at 1 GHz
PLL supply voltage
Unit
AVDD
V
1.2 V ± 60 mV
1.3 V ± 50 mV
For devices rated at 667 and 833 MHz
For devices rated at 1 GHz
DDR DRAM I/O voltage
GVDD
2.5 V ± 125 mV
V
Three-speed Ethernet I/O voltage
LVDD
3.3 V ± 165 mV
2.5 V ± 125 mV
V
PCI/PCI-X, local bus, RapidIO, 10/100 Ethernet, MII
management, DUART, system control and power management,
I2C, and JTAG I/O voltage
OVDD
3.3 V ± 165 mV
V
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
9
Electrical Characteristics
Table 2. Recommended Operating Conditions (continued)
Symbol
Recommended
Value
Unit
MVIN
GND to GVDD
V
MVREF
GND to GVDD/2
V
Three-speed Ethernet signals
LVIN
GND to LVDD
V
PCI/PCI-X, local bus, RapidIO,
10/100 Ethernet, MII
management, DUART,
SYSCLK, system control and
power management, I2C, and
JTAG signals
OVIN
GND to OVDD
V
Tj
0 to 105
•C
Characteristic
Input voltage
DDR DRAM signals
DDR DRAM reference
Die-junction temperature
Figure 2 shows the undershoot and overshoot voltages at the interfaces of the MPC8540.
G/L/OVDD + 20%
G/L/OVDD + 5%
VIH
G/L/OVDD
GND
GND – 0.3 V
VIL
GND – 0.7 V
Not to Exceed 10%
of tSYS1
Note:
tSYS refers to the clock period associated with the SYSCLK signal.
Figure 2. Overshoot/Undershoot Voltage for GVDD/OVDD/LVDD
The MPC8540 core voltage must always be provided at nominal 1.2 V (see Table 2 for actual
recommended core voltage). Voltage to the processor interface I/Os are provided through separate sets of
supply pins and must be provided at the voltages shown in Table 2. The input voltage threshold scales with
respect to the associated I/O supply voltage. OVDD and LVDD based receivers are simple CMOS I/O
circuits and satisfy appropriate LVCMOS type specifications. The DDR SDRAM interface uses a
single-ended differential receiver referenced the externally supplied MVREF signal (nominally set to
GVDD/2) as is appropriate for the SSTL2 electrical signaling standard.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
10
Freescale Semiconductor
Power Characteristics
2.1.4 Output Driver Characteristics
Table 3 provides information on the characteristics of the output driver strengths. The values are
preliminary estimates.
Table 3. Output Drive Capability
Driver Type
Programmable
Output Impedance
(Ω)
Supply
Voltage
Notes
25
OVDD = 3.3 V
1
Local bus interface utilities signals
42 (default)
PCI signals
25
2
42 (default)
DDR signal
20
GVDD = 2.5 V
TSEC/10/100 signals
42
LVDD = 2.5/3.3 V
DUART, system control, I2C, JTAG
42
OVDD = 3.3 V
RapidIO N/A (LVDS signaling)
N/A
Notes:
1. The drive strength of the local bus interface is determined by the configuration of the appropriate bits in
PORIMPSCR.
2. The drive strength of the PCI interface is determined by the setting of the PCI_GNT1 signal at reset.
3 Power Characteristics
The estimated power dissipation on the VDD supply for the MPC8540 is shown in Table 4.
Table 4. MPC8540 VDD Power Dissipation 1,2
CCB Frequency
(MHz)
200
267
Core
Typical Power3,4
Frequency (MHz)
Maximum
Power5
Unit
W
400
4.6
7.2
500
4.9
7.5
600
5.3
7.9
533
5.5
8.2
667
5.9
8.7
800
6.4
10.2
W
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
11
Power Characteristics
Table 4. MPC8540 VDD Power Dissipation 1,2
CCB Frequency
(MHz)
Core
Typical Power3,4
Frequency (MHz)
333
667
833
1000
6
Maximum
Power5
Unit
6.3
9.3
W
6.9
10.9
11.3
15.9
Notes:
1. The values do not include I/O supply power (OVDD, LVDD, GVDD) or AVDD.
2. Junction temperature is a function of die size, on-chip power dissipation, package thermal
resistance, mounting site (board) temperature, air flow, power dissipation of other
components on the board, and board thermal resistance. Any customer design must take
these considerations into account to ensure the maximum 105 °C junction temperature is
not exceeded on this device.
3. Typical Power is based on a nominal voltage of VDD = 1.2 V, a nominal process, a junction
temperature of Tj = 105 °C, and a Dhrystone 2.1 benchmark application.
4. Thermal solutions will likely need to design to a number higher than Typical Power based on
the end application, TA target, and I/O power.
5. Maximum power is based on a nominal voltage of VDD = 1.2 V, worst case process, a junction
temperature of Tj = 105 °C, and an artificial smoke test.
6. The nominal recommended VDD is 1.3 V for this speed grade.
The estimated power dissipation on the AVDD supplies for the MPC8540 PLLs is shown in Table 5.
Table 5. MPC8540 AVDD Power Dissipation
AVDDn
Typical1
Unit
AVDD1
0.007
W
AVDD2
0.014
W
Notes:
1. VDD = 1.2 V (1.3 V for 1.0 GHz device), TJ = 105°C
Table 6 provides estimated I/O power numbers for each block: DDR, PCI, Local Bus, RapidIO, TSEC, and
FEC.
Table 6. Estimated Typical I/O Power Consumption
Interface
Parameter
GVDD (2.5
V)
DDR I/O
CCB = 200 MHz
0.46
CCB = 266 MHz
0.59
CCB = 300 MHz
0.66
CCB = 333 MHz
0.73
OVDD (3.3
V)
LVDD (3.3
V)
LVDD (2.5
V)
Units
Notes
W
1
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
12
Freescale Semiconductor
Power Characteristics
Table 6. Estimated Typical I/O Power Consumption (continued)
GVDD (2.5
V)
OVDD (3.3
V)
Interface
Parameter
PCI/PCI-X I/O
32-bit, 33 MHz
0.04
32-bit 66 MHz
0.07
64-bit, 66 MHz
0.14
64-bit, 133 MHz
0.25
32-bit, 33 MHz
0.07
32-bit, 66 MHz
0.13
32-bit, 133 MHz
0.24
32-bit, 167 MHz
0.30
RapidIO I/O
500 MHz data rate
0.96
TSEC I/O
MII
Local Bus I/O
LVDD (3.3
V)
10
GMII, TBI (2.5 V)
Notes
W
2
W
3
W
4
mW
5, 6
mW
7
70
RGMII, RTBI
MII
Units
40
GMII, TBI (3.3 V)
FEC I/O
LVDD (2.5
V)
40
10
Notes:
1. GVDD=2.5, ECC enabled, 66% bus utilization, 33% write cycles, 10pF load on data, 10pF load on address/command, 10pF
load on clock
2. OVDD=3.3, 30pF load per pin, 54% bus utilization, 33% write cycles
3. OVDD=3.3, 25pF load per pin, 5pF load on clock, 40% bus utilization, 33% write cycles
4. VDD=1.2, OVDD=3.3
5. LVDD=2.5/3.3, 15pF load per pin, 25% bus utilization
6. Power dissipation for one TSEC only
7. OVDD=3.3, 20pF load per pin, 25% bus utilization
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
13
Clock Timing
4 Clock Timing
4.1 System Clock Timing
Table 7 provides the system clock (SYSCLK) AC timing specifications for the MPC8540.
Table 7. SYSCLK AC Timing Specifications
Parameter/Condition
Symbol
Min
Typical
Max
Unit
Notes
SYSCLK frequency
fSYSCLK
—
—
166
MHz
1
SYSCLK cycle time
tSYSCLK
6.0
—
—
ns
SYSCLK rise and fall time
tKH, tKL
0.6
1.0
1.2
ns
2
tKHKL/tSYSCLK
40
—
60
%
3
—
—
—
+/- 150
ps
4, 5
SYSCLK duty cycle
SYSCLK jitter
Notes:
1.Caution: The CCB to SYSCLK ratio and e500 core to CCB ratio settings must be chosen such that the resulting SYSCLK
frequency, e500 (core) frequency, and CCB frequency do not exceed their respective maximum or minimum operating
frequencies. Refer to Section 15.2, “Platform/System PLL Ratio,” and Section 15.3, “e500 Core PLL Ratio,” for ratio
settings.
2. Rise and fall times for SYSCLK are measured at 0.6 V and 2.7 V.
3. Timing is guaranteed by design and characterization.
4. This represents the total input jitter—short term and long term—and is guaranteed by design.
5. For spread spectrum clocking, guidelines are +/-1% of the input frequency with a maximum of 60 kHz of modulation
regardless of the input frequency.
4.2 TSEC Gigabit Reference Clock Timing
Table 7 provides the TSEC gigabit reference clock (EC_GTX_CLK125) AC timing specifications for the
MPC8540.
Table 8. EC_GTX_CLK125 AC Timing Specifications
Parameter/Condition
Symbol
Min
Typical
Max
Unit
EC_GTX_CLK125 frequency
fG125
—
125
—
MHz
EC_GTX_CLK125 cycle time
tG125
—
8
—
ns
tG125R, tG125F
—
—
EC_GTX_CLK125 rise and fall time
tG125H/tG125
GMII, TBI
RGMII, RTBI
ns
2
%
1,3
0.75
1
LVDD=2.5
LVDD=3.3
EC_GTX_CLK125 duty cycle
Notes
—
45
47
55
53
Notes:
1. Timing is guaranteed by design and characterization.
2. Rise and fall times for EC_GTX_CLK125 are measured from 0.5V and 2.0V for LVDD=2.5V, and from 0.6 and 2.7V for
LVDD=3.3V.
3. EC_GTX_CLK125 is used to generate GTX clock for TSEC transmitter with 2% degradation EC_GTX_CLK125 duty cycle
can be loosened from 47/53% as long as PHY device can tolerate the duty cycle generated by GTX_CLK of TSEC.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
14
Freescale Semiconductor
RESET Initialization
4.3 RapidIO Transmit Clock Input Timing
Table 9 provides the RapidIO transmit clock input (RIO_TX_CLK_IN) AC timing specifications for the
MPC8540.
Table 9. RIO_TX_CLK_IN AC Timing Specifications
Parameter/Condition
Symbol
Min
Typical
Max
Unit
RIO_TX_CLK_IN frequency
fRCLK
125
—
—
MHz
RIO_TX_CLK_IN cycle time
tRCLK
—
—
8
ns
RIO_TX_CLK_IN duty cycle
tRCLKH/tRCLK
48
—
52
%
Notes
1
Notes:
1. Requires ±100 ppm long term frequency stability. Timing is guaranteed by design and characterization.
4.4 Real Time Clock Timing
Table 10 provides the real time clock (RTC) AC timing specifications for the MPC8540.
Table 10. RTC AC Timing Specifications
Parameter/Condition
Symbol
Min
Typical
Max
Unit
RTC clock high time
tRTCH
2x
tCCB_CLK
—
—
ns
RTC clock low time
tRTCL
2x
tCCB_CLK
—
—
ns
Notes
5 RESET Initialization
This section describes the AC electrical specifications for the RESET initialization timing requirements of
the MPC8540. Table 7 provides the RESET initialization AC timing specifications for the MPC8540.
Table 11. RESET Initialization Timing Specifications
Parameter/Condition
Min
Max
Unit
Notes
Required assertion time of HRESET
100
—
μs
Minimum assertion time for SRESET
512
—
SYSCLKs
PLL input setup time with stable SYSCLK before
HRESET negation
100
—
μs
Input setup time for POR configs (other than PLL config)
with respect to negation of HRESET
4
—
SYSCLKs
1
Input hold time for POR configs (including PLL config)
with respect to negation of HRESET
2
—
SYSCLKs
1
1
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
15
DDR SDRAM
Table 11. RESET Initialization Timing Specifications (continued)
Parameter/Condition
Min
Max
Unit
Notes
Maximum valid-to-high impedance time for actively
driven POR configs with respect to negation of HRESET
—
5
SYSCLKs
1
Notes:
1.SYSCLK is identical to the PCI_CLK signal and is the primary clock input for the MPC8540. See the MPC8540
Integrated Processor Preliminary Reference Manual for more details.
Table 12 provides the PLL and DLL lock times.
Table 12. PLL and DLL Lock Times
Parameter/Condition
Min
Max
Unit
Notes
PLL lock times
—
100
μs
DLL lock times
7680
122,880
CCB Clocks
1, 2
Notes:
1.DLL lock times are a function of the ratio between the output clock and the platform (or CCB) clock. A 2:1 ratio
results in the minimum and an 8:1 ratio results in the maximum.
2. The CCB clock is determined by the SYSCLK × platform PLL ratio.
6 DDR SDRAM
This section describes the DC and AC electrical specifications for the DDR SDRAM interface of the
MPC8540.
6.1 DDR SDRAM DC Electrical Characteristics
Table 13 provides the recommended operating conditions for the DDR SDRAM component(s) of the
MPC8540.
Table 13. DDR SDRAM DC Electrical Characteristics
Parameter/Condition
Symbol
Min
Max
Unit
Notes
I/O supply voltage
GVDD
2.375
2.625
V
1
I/O reference voltage
MVREF
0.49 × GVDD
0.51 × GVDD
V
2
I/O termination voltage
VTT
MVREF – 0.04
MVREF + 0.04
V
3
Input high voltage
VIH
MVREF + 0.18
GVDD + 0.3
V
4
Input low voltage
VIL
–0.3
MVREF – 0.18
V
4
Output leakage current
IOZ
–10
10
μA
5
Output high current (VOUT = 1.95 V)
IOH
–15.2
—
mA
Output low current (VOUT = 0.35 V)
IOL
15.2
—
mA
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
16
Freescale Semiconductor
DDR SDRAM
Table 13. DDR SDRAM DC Electrical Characteristics
Parameter/Condition
MVREF input leakage current
Symbol
Min
Max
Unit
IVREF
—
100
μA
Notes
Notes:
1.GVDD is expected to be within 50 mV of the DRAM GVDD at all times.
2.MVREF is expected to be equal to 0.5 × GVDD, and to track GVDD DC variations as measured at the receiver.
Peak-to-peak noise on MVREF may not exceed ±2% of the DC value.
3.VTT is not applied directly to the device. It is the supply to which far end signal termination is made and is expected
to be equal to MVREF. This rail should track variations in the DC level of MVREF.
4.VIH can tolerate an overshoot of 1.2V over GVDD for a pulse width of ≤3 ns, and the pulse width cannot be greater
than tMCK. VIL can tolerate an undershoot of 1.2V below GND for a pulse width of ≤3 ns, and the pulse width
cannot be greater than tMCK.
5.Output leakage is measured with all outputs disabled, 0 V ≤ VOUT ≤ GVDD.
Table 14 provides the DDR capacitance.
Table 14. DDR SDRAM Capacitance
Parameter/Condition
Symbol
Min
Max
Unit
Notes
Input/output capacitance: DQ, DQS, MSYNC_IN
CIO
6
8
pF
1
Delta input/output capacitance: DQ, DQS
CDIO
—
0.5
pF
1
Note:
1.This parameter is sampled. GVDD = 2.5 V ± 0.125 V, f = 1 MHz, TA = 25°C, VOUT = GVDD/2, VOUT (peak to peak) = 0.2 V.
6.2 DDR SDRAM AC Electrical Characteristics
This section provides the AC electrical characteristics for the DDR SDRAM interface.
6.2.1 DDR SDRAM Input AC Timing Specifications
Table 15 provides the input AC timing specifications for the DDR SDRAM interface.
Table 15. DDR SDRAM Input AC Timing Specifications
At recommended operating conditions with GVDD of 2.5 V ± 5%.
Parameter
Symbol
Min
Max
Unit
AC input low voltage
VIL
—
MVREF – 0.31
V
AC input high voltage
VIH
MVREF + 0.31
GVDD + 0.3
V
-750
-1125
750
1125
MDQS—MDQ/MECC input skew per byte
For DDR = 333 MHz
For DDR ≤ 266 MHz
tDISKEW
ps
Notes
1, 2
Note:
1.Maximum possible skew between a data strobe (MDQS[n]) and any corresponding bit of data (MDQ[8n + {0...7}] if
0 ≤ n ≤ 7) or ECC (MECC[{0...7}] if n=8).
2.For timing budget analysis, the MPC8540 consumes ±550 ps of the total budget.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
17
DDR SDRAM
MDQS[n]
MDQ[n]
tDISKEW
tDISKEW
Figure 3. DDR SDRAM Interface Input Timing
6.2.2 DDR SDRAM Output AC Timing Specifications
For chip selects MCS1 and MCS2, there will always be at least 200 DDR memory clocks coming out of
self-refresh after an HRESET before a precharge occurs. This will not necessarily be the case for chip
selects MCS0 and MCS3.
6.2.2.1
DLL Enabled Mode
Table 16 and Table 17 provide the output AC timing specifications and measurement conditions for the
DDR SDRAM interface with the DDR DLL enabled.
Table 16. DDR SDRAM Output AC Timing Specifications–DLL Mode
At recommended operating conditions with GVDD of 2.5 V ± 5%.
Symbol 1
Min
Max
Unit
Notes
tMCK
6
10
ns
2
On chip Clock Skew
tMCKSKEW
—
150
ps
3, 8
MCK[n] duty cycle
tMCKH/tMCK
45
55
%
8
ADDR/CMD output valid
tDDKHOV
—
3
ns
4, 9
ADDR/CMD output invalid
tDDKHOX
1
—
ns
4, 9
Write CMD to first MDQS capture edge
tDDSHMH
tMCK + 1.5
tMCK + 4.0
ns
5
MDQ/MECC/MDM output setup with respect to
MDQS
333 MHz
266 MHz
200 MHz
tDDKHDS,
tDDKLDS
—
ps
6, 9
MDQ/MECC/MDM output hold with respect to
MDQS
333 MHz
266 MHz
200 MHz
tDDKHDX,
tDDKLDX
—
ps
6, 9
MDQS preamble start
tDDSHMP
0.75 × tMCK + 4.0
ns
7, 8
Parameter
MCK[n] cycle time, (MCK[n]/MCK[n] crossing)
900
1100
1200
900
1100
1200
0.75 × tMCK + 1.5
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
18
Freescale Semiconductor
DDR SDRAM
Table 16. DDR SDRAM Output AC Timing Specifications–DLL Mode (continued)
At recommended operating conditions with GVDD of 2.5 V ± 5%.
Parameter
MDQS epilogue end
Symbol 1
Min
Max
Unit
Notes
tDDSHME
1.5
4.0
ns
7, 8
Notes:
1.The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. Output hold time can be read as DDR
timing (DD) from the rising or falling edge of the reference clock (KH or KL) until the output went invalid (OX or DX). For
example, tDDKHOV symbolizes DDR timing (DD) for the time tMCK memory clock reference (K) goes from the high (H)
state until outputs (O) are valid (V) or output valid time. Also, tDDKLDX symbolizes DDR timing (DD) for the time tMCK
memory clock reference (K) goes low (L) until data outputs (D) are invalid (X) or data output hold time.
2.All MCK/MCK referenced measurements are made from the crossing of the two signals ±0.1 V.
3.Maximum possible clock skew between a clock MCK[n] and its relative inverse clock MCK[n], or between a clock MCK[n]
and a relative clock MCK[m] or MSYNC_OUT. Skew measured between complementary signals at GVDD/2.
4.ADDR/CMD includes all DDR SDRAM output signals except MCK/MCK and MDQ/MECC/MDM/MDQS.
5.Note that tDDSHMH follows the symbol conventions described in note 1. For example, tDDSHMH describes the DDR timing
(DD) from the rising edge of the MSYNC_IN clock (SH) until the MDQS signal is valid (MH). tDDSHMH can be modified
through control of the DQSS override bits in the TIMING_CFG_2 register. These controls allow the relationship between
the synchronous clock control timing and the source-synchronous DQS domain to be modified by the user. For best
turnaround times, these may need to be set to delay tDDSHMH an additional 0.25tMCK. This will also affect tDDSHMP and
tDDSHME accordingly. See the MPC8540 PowerQUICC III Integrated Host Processor Reference Manual for a description
and understanding of the timing modifications enabled by use of these bits.
6.Determined by maximum possible skew between a data strobe (MDQS) and any corresponding bit of data (MDQ), ECC
(MECC), or data mask (MDM). The data strobe should be centered inside of the data eye at the pins of the MPC8540.
7.All outputs are referenced to the rising edge of MSYNC_IN (S) at the pins of the MPC8540. Note that tDDSHMP follows the
symbol conventions described in note 1. For example, tDDSHMP describes the DDR timing (DD) from the rising edge of
the MSYNC_IN clock (SH) for the duration of the MDQS signal precharge period (MP).
8.Guaranteed by design.
9.Guaranteed by characterization.
Figure 4 provides the AC test load for the DDR bus.
Z0 = 50 Ω
Output
RL = 50 Ω
GVDD/2
Figure 4. DDR AC Test Load
Table 17. DDR SDRAM Measurement Conditions
Symbol
VTH
VOUT
DDR
Unit
Notes
MVREF ± 0.31 V
V
1
0.5 × GVDD
V
2
Notes:
1.Data input threshold measurement point.
2.Data output measurement point.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
19
DDR SDRAM
Figure 5 shows the DDR SDRAM output timing diagram.
MCK[n]
MCK[n]
tMCK
tMCK
tMCKH
MSYNC_OUT
DLL Phase Alignment
MSYNC_IN
tDDKHOV
tDDKHOX
ADDR/CMD
Write A0
NOOP
tDDSHMH
MDQS[n]
tDDSHMP
tDDKHDS
tDDSHME
tDDKLDS
MDQ[x]
D0
D1
tDDKLDX
tDDKHDX
Figure 5. DDR SDRAM Output Timing Diagram
6.2.2.2
Load Effects on Address/Command Bus
Table 18 provides approximate delay information that can be expected for the address and command
signals of the DDR controller for various loadings. These numbers are the result of simulations for one
topology. The delay numbers will strongly depend on the topology used. These delay numbers show the
total delay for the address and command to arrive at the DRAM devices. The actual delay could be
different than the delays seen in simulation, depending on the system topology. If a heavily loaded system
is used, the DLL loop may need to be adjusted to meet setup requirements at the DRAM.
Table 18. Expected Delays for Address/Command
Load
Delay
Unit
4 devices (12 pF)
3.0
ns
9 devices (27 pF)
3.6
ns
36 devices (108 pF) + 40 pF compensation capacitor
5.0
ns
36 devices (108 pF) + 80 pF compensation capacitor
5.2
ns
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
20
Freescale Semiconductor
DUART
7 DUART
This section describes the DC and AC electrical specifications for the DUART interface of the MPC8540.
7.1 DUART DC Electrical Characteristics
Table 19 provides the DC electrical characteristics for the DUART interface of the MPC8540.
Table 19. DUART DC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
High-level input voltage
VIH
2
OVDD + 0.3
V
Low-level input voltage
VIL
–0.3
0.8
V
Input current
(VIN 1 = 0 V or VIN = VDD)
IIN
—
±5
μA
High-level output voltage
(OVDD = min, IOH = –100 μA)
VOH
OVDD – 0.2
—
V
Low-level output voltage
(OVDD = min, IOL = 100 μA)
VOL
—
0.2
V
Note:
1.Note that the symbol VIN, in this case, represents the OVIN symbol referenced in Table 1
and Table 2.
7.2 DUART AC Electrical Specifications
Table 20 provides the AC timing parameters for the DUART interface of the MPC8540.
Table 20. DUART AC Timing Specifications
Parameter
Value
Unit
Notes
Minimum baud rate
fCCB_CLK / 1048576
baud
3
Maximum baud rate
fCCB_CLK / 16
baud
1, 3
16
—
2, 3
Oversample rate
Notes:
1.Actual attainable baud rate will be limited by the latency of interrupt processing.
2.The middle of a start bit is detected as the 8th sampled 0 after the 1-to-0 transition of the start bit. Subsequent bit
values are sampled each 16th sample.
3.Guaranteed by design.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
21
Ethernet: Three-Speed,10/100, MII Management
8 Ethernet: Three-Speed,10/100, MII Management
This section provides the AC and DC electrical characteristics for three-speed, 10/100, and MII
management.
8.1 Three-Speed Ethernet Controller (TSEC)
(10/100/1Gb Mbps)—GMII/MII/TBI/RGMII/RTBI Electrical
Characteristics
The electrical characteristics specified here apply to all GMII (gigabit media independent interface), MII
(media independent interface), TBI (ten-bit interface), RGMII (reduced gigabit media independent
interface), and RTBI (reduced ten-bit interface) signals except MDIO (management data input/output) and
MDC (management data clock). The RGMII and RTBI interfaces are defined for 2.5 V, while the GMII,
MII, and TBI interfaces can be operated at 3.3 or 2.5 V. Whether the GMII, MII, or TBI interface is
operated at 3.3 or 2.5 V, the timing is compliant with the IEEE 802.3 standard. The RGMII and RTBI
interfaces follow the Hewlett-Packard reduced pin-count interface for Gigabit Ethernet Physical Layer
Device Specification Version 1.2a (9/22/2000). The electrical characteristics for MDIO and MDC are
specified in Section 8.4, “Ethernet Management Interface Electrical Characteristics.”
8.1.1 TSEC DC Electrical Characteristics
All GMII, MII, TBI, RGMII, and RTBI drivers and receivers comply with the DC parametric attributes
specified in Table 21 and Table 22. The potential applied to the input of a GMII, MII, TBI, RGMII, or
RTBI receiver may exceed the potential of the receiver’s power supply (i.e., a GMII driver powered from
a 3.6 V supply driving VOH into a GMII receiver powered from a 2.5 V supply). Tolerance for dissimilar
GMII driver and receiver supply potentials is implicit in these specifications. The RGMII and RTBI signals
are based on a 2.5 V CMOS interface voltage as defined by JEDEC EIA/JESD8-5.
Table 21. GMII, MII, and TBI DC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
Supply voltage 3.3 V
LVDD
3.13
3.47
V
Output high voltage
(LVDD = Min, IOH = –4.0 mA)
VOH
2.40
LVDD + 0.3
V
Output low voltage
(LVDD = Min, IOL = 4.0 mA)
VOL
GND
0.50
V
Input high voltage
VIH
1.70
LVDD + 0.3
V
Input low voltage
VIL
–0.3
0.90
V
Input high current
(VIN 1 = LVDD)
IIH
—
40
μA
Input low current
(VIN 1 = GND)
IIL
–600
—
μA
Note:
1.The symbol VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
22
Freescale Semiconductor
Ethernet: Three-Speed,10/100, MII Management
Table 22. GMII, MII, RGMII, RTBI, and TBI DC Electrical Characteristics
Parameters
Symbol
Min
Max
Unit
Supply voltage 2.5 V
LVDD
2.37
2.63
V
Output high voltage
(LVDD = Min, IOH = –1.0 mA)
VOH
2.00
LVDD + 0.3
V
Output low voltage
(LVDD = Min, IOL = 1.0 mA)
VOL
GND – 0.3
0.40
V
Input high voltage
VIH
1.70
LVDD + 0.3
V
Input low voltage
VIL
–0.3
0.70
V
Input high current
(VIN 1 = LVDD)
IIH
—
10
μA
Input low current
(VIN 1 = GND)
IIL
–15
—
μA
Note:
1.Note that the symbol VIN, in this case, represents the LVIN symbol referenced in Table 1and Table 2.
8.2 GMII, MII, TBI, RGMII, and RTBI AC Timing Specifications
The AC timing specifications for GMII, MII, TBI, RGMII, and RTBI are presented in this section.
8.2.1 GMII AC Timing Specifications
This section describes the GMII transmit and receive AC timing specifications.
8.2.1.1
GMII Transmit AC Timing Specifications
Table 23 provides the GMII transmit AC timing specifications.
Table 23. GMII Transmit AC Timing Specifications
At recommended operating conditions with LVDD of 3.3 V ± 5%, or LVDD=2.5V ± 5%.
Symbol 1
Min
Typ
Max
Unit
tGTX
—
8.0
—
ns
tGTXH/tGTX
40
—
60
%
GMII data TXD[7:0], TX_ER, TX_EN setup time
tGTKHDV
2.5
—
—
ns
GTX_CLK to GMII data TXD[7:0], TX_ER, TX_EN delay
tGTKHDX 3
0.5
—
5.0
ns
Parameter/Condition
GTX_CLK clock period
GTX_CLK duty cycle
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
23
Ethernet: Three-Speed,10/100, MII Management
Table 23. GMII Transmit AC Timing Specifications (continued)
At recommended operating conditions with LVDD of 3.3 V ± 5%, or LVDD=2.5V ± 5%.
Parameter/Condition
GTX_CLK data clock rise and fall time
Symbol 1
Min
Typ
Max
Unit
tGTXR, tGTXF 2,4
—
—
1.0
ns
Notes:
1. The symbols used for timing specifications herein follow the pattern t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tGTKHDV
symbolizes GMII transmit timing (GT) with respect to the tGTX clock reference (K) going to the high state (H) relative
to the time date input signals (D) reaching the valid state (V) to state or setup time. Also, tGTKHDX symbolizes GMII
transmit timing (GT) with respect to the tGTX clock reference (K) going to the high state (H) relative to the time date
input signals (D) going invalid (X) or hold time. Note that, in general, the clock reference symbol representation is
based on three letters representing the clock of a particular functional. For example, the subscript of tGTX represents
the GMII(G) transmit (TX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R
(rise) or F (fall).
2.Signal timings are measured at 0.7 V and 1.9 V voltage levels.
3.Guaranteed by characterization.
4.Guaranteed by design.
Figure 6 shows the GMII transmit AC timing diagram.
tGTXR
tGTX
GTX_CLK
tGTXH
tGTXF
TXD[7:0]
TX_EN
TX_ER
tGTKHDX
tGTKHDV
Figure 6. GMII Transmit AC Timing Diagram
8.2.1.2
GMII Receive AC Timing Specifications
Table 24 provides the GMII receive AC timing specifications.
Table 24. GMII Receive AC Timing Specifications
At recommended operating conditions with LVDD of 3.3 V ± 5%, or LVDD=2.5V ± 5%.
Symbol 1
Min
Typ
Max
Unit
tGRX
—
8.0
—
ns
tGRXH/tGRX
40
—
60
ns
RXD[7:0], RX_DV, RX_ER setup time to RX_CLK
tGRDVKH
2.0
—
—
ns
RXD[7:0], RX_DV, RX_ER hold time to RX_CLK
tGRDXKH
0.5
—
—
ns
Parameter/Condition
RX_CLK clock period
RX_CLK duty cycle
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
24
Freescale Semiconductor
Ethernet: Three-Speed,10/100, MII Management
Table 24. GMII Receive AC Timing Specifications (continued)
At recommended operating conditions with LVDD of 3.3 V ± 5%, or LVDD=2.5V ± 5%.
Parameter/Condition
RX_CLK clock rise and fall time
Symbol 1
Min
Typ
Max
Unit
tGRXR, tGRXF 2,3
—
—
1.0
ns
Note:
1.The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tGRDVKH
symbolizes GMII receive timing (GR) with respect to the time data input signals (D) reaching the valid state (V) relative
to the tRX clock reference (K) going to the high state (H) or setup time. Also, tGRDXKL symbolizes GMII receive timing
(GR) with respect to the time data input signals (D) went invalid (X) relative to the tGRX clock reference (K) going to
the low (L) state or hold time. Note that, in general, the clock reference symbol representation is based on three letters
representing the clock of a particular functional. For example, the subscript of tGRX represents the GMII (G) receive
(RX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall).
2.Signal timings are measured at 0.7 V and 1.9 V voltage levels.
3.Guaranteed by design.
Figure 7 provides the AC test load for TSEC.
Z0 = 50 Ω
Output
RL = 50 Ω
LVDD/2
Figure 7. TSEC AC Test Load
Figure 8 shows the GMII receive AC timing diagram.
tGRXR
tGRX
RX_CLK
tGRXH
tGRXF
RXD[7:0]
RX_DV
RX_ER
tGRDXKH
tGRDVKH
Figure 8. GMII Receive AC Timing Diagram
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
25
Ethernet: Three-Speed,10/100, MII Management
8.2.2 MII AC Timing Specifications
This section describes the MII transmit and receive AC timing specifications.
8.2.2.1
MII Transmit AC Timing Specifications
Table 25 provides the MII transmit AC timing specifications.
Table 25. MII Transmit AC Timing Specifications
At recommended operating conditions with LVDD of 3.3 V ± 5%, or LVDD=2.5V ± 5%.
Symbol 1
Min
Typ
Max
Unit
TX_CLK clock period 10 Mbps
tMTX 2
—
400
—
ns
TX_CLK clock period 100 Mbps
tMTX
—
40
—
ns
tMTXH/tMTX
35
—
65
%
tMTKHDX
1
5
15
ns
tMTXR, tMTXF 2,3
1.0
—
4.0
ns
Parameter/Condition
TX_CLK duty cycle
TX_CLK to MII data TXD[3:0], TX_ER, TX_EN delay
TX_CLK data clock rise and fall time
Note:
1.The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMTKHDX
symbolizes MII transmit timing (MT) for the time tMTX clock reference (K) going high (H) until data outputs (D) are
invalid (X). Note that, in general, the clock reference symbol representation is based on two to three letters
representing the clock of a particular functional. For example, the subscript of tMTX represents the MII(M) transmit
(TX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall).
2.Signal timings are measured at 0.7 V and 1.9 V voltage levels.
3.Guaranteed by design.
Figure 9 shows the MII transmit AC timing diagram.
tMTXR
tMTX
TX_CLK
tMTXH
tMTXF
TXD[3:0]
TX_EN
TX_ER
tMTKHDX
Figure 9. MII Transmit AC Timing Diagram
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
26
Freescale Semiconductor
Ethernet: Three-Speed,10/100, MII Management
8.2.2.2
MII Receive AC Timing Specifications
Table 26 provides the MII receive AC timing specifications.
Table 26. MII Receive AC Timing Specifications
At recommended operating conditions with LVDD of 3.3 V ± 5%, or LVDD=2.5V ± 5%.
Symbol 1
Min
Typ
Max
Unit
RX_CLK clock period 10 Mbps
tMRX 3
—
400
—
ns
RX_CLK clock period 100 Mbps
tMRX
—
40
—
ns
tMRXH/tMRX
35
—
65
%
RXD[3:0], RX_DV, RX_ER setup time to RX_CLK
tMRDVKH
10.0
—
—
ns
RXD[3:0], RX_DV, RX_ER hold time to RX_CLK
tMRDXKH
10.0
—
—
ns
tMRXR, tMRXF 2,3
1.0
—
4.0
ns
Parameter/Condition
RX_CLK duty cycle
RX_CLK clock rise and fall time
Note:
1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMRDVKH
symbolizes MII receive timing (MR) with respect to the time data input signals (D) reach the valid state (V) relative to
the tMRX clock reference (K) going to the high (H) state or setup time. Also, tMRDXKL symbolizes MII receive timing
(GR) with respect to the time data input signals (D) went invalid (X) relative to the tMRX clock reference (K) going to
the low (L) state or hold time. Note that, in general, the clock reference symbol representation is based on three letters
representing the clock of a particular functional. For example, the subscript of tMRX represents the MII (M) receive
(RX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall).
2.Signal timings are measured at 0.7 V and 1.9 V voltage levels.
3.Guaranteed by design.
Figure 10 shows the MII receive AC timing diagram.
tMRXR
tMRX
RX_CLK
tMRXH
RXD[3:0]
RX_DV
RX_ER
tMRXF
Valid Data
tMRDVKH
tMRDXKH
Figure 10. MII Receive AC Timing Diagram
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
27
Ethernet: Three-Speed,10/100, MII Management
8.2.3 TBI AC Timing Specifications
This section describes the TBI transmit and receive AC timing specifications.
8.2.3.1
TBI Transmit AC Timing Specifications
Table 27 provides the TBI transmit AC timing specifications.
Table 27. TBI Transmit AC Timing Specifications
At recommended operating conditions with LVDD of 3.3 V ± 5%, or LVDD=2.5V ± 5%.
Symbol 1
Min
Typ
Max
Unit
tTTX
—
8.0
—
ns
tTTXH/tTTX
40
—
60
%
TCG[9:0] setup time GTX_CLK going high
tTTKHDV
2.0
—
—
ns
TCG[9:0] hold time from GTX_CLK going high
tTTKHDX
1.0
—
—
ns
—
—
1.0
ns
Parameter/Condition
GTX_CLK clock period
GTX_CLK duty cycle
GTX_CLK clock rise and fall time
tTTXR, tTTXF
2,3
Notes:
1.The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state
)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tTTKHDV
symbolizes the TBI transmit timing (TT) with respect to the time from tTTX (K) going high (H) until the referenced data
signals (D) reach the valid state (V) or setup time. Also, tTTKHDX symbolizes the TBI transmit timing (TT) with respect
to the time from tTTX (K) going high (H) until the referenced data signals (D) reach the invalid state (X) or hold time.
Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a
particular functional. For example, the subscript of tTTX represents the TBI (T) transmit (TX) clock. For rise and fall
times, the latter convention is used with the appropriate letter: R (rise) or F (fall).
2.Signal timings are measured at 0.7 V and 1.9 V voltage levels.
3.Guaranteed by design.
Figure 11 shows the TBI transmit AC timing diagram.
tTTXR
tTTX
GTX_CLK
tTTXH
tTTXF
TCG[9:0]
tTTKHDV
tTTKHDX
Figure 11. TBI Transmit AC Timing Diagram
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
28
Freescale Semiconductor
Ethernet: Three-Speed,10/100, MII Management
8.2.3.2
TBI Receive AC Timing Specifications
Table 28 provides the TBI receive AC timing specifications.
Table 28. TBI Receive AC Timing Specifications
At recommended operating conditions with LVDD of 3.3 V ± 5%, or LVDD=2.5V ± 5%.
Symbol 1
Parameter/Condition
RX_CLK clock period
Min
Max
16.0
tTRX
RX_CLK skew
Typ
Unit
ns
tSKTRX
7.5
—
8.5
ns
tTRXH/tTRX
40
—
60
%
RCG[9:0] setup time to rising RX_CLK
tTRDVKH
2.5
—
—
ns
RCG[9:0] hold time to rising RX_CLK
tTRDXKH
1.5
—
—
ns
RX_CLK clock rise time and fall time
tTRXR, tTRXF 2,3
0.7
—
2.4
ns
RX_CLK duty cycle
Note:
1.The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tTRDVKH
symbolizes TBI receive timing (TR) with respect to the time data input signals (D) reach the valid state (V) relative to
the tTRX clock reference (K) going to the high (H) state or setup time. Also, tTRDXKH symbolizes TBI receive timing
(TR) with respect to the time data input signals (D) went invalid (X) relative to the tTRX clock reference (K) going to
the high (H) state. Note that, in general, the clock reference symbol representation is based on three letters
representing the clock of a particular functional. For example, the subscript of tTRX represents the TBI (T) receive (RX)
clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). For symbols
representing skews, the subscript is skew (SK) followed by the clock that is being skewed (TRX).
2.Signal timings are measured at 0.7 V and 1.9 V voltage levels.
3.Guaranteed by design.
Figure 12 shows the TBI receive AC timing diagram.
tTRXR
tTRX
RX_CLK1
tTRXH
tTRXF
Valid Data
RCG[9:0]
Valid Data
tTRDVKH
tSKTRX
tTRDXKH
RX_CLK0
tTRDXKH
tTRXH
tTRDVKH
Figure 12. TBI Receive AC Timing Diagram
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
29
Ethernet: Three-Speed,10/100, MII Management
8.2.4 RGMII and RTBI AC Timing Specifications
Table 29 presents the RGMII and RTBI AC timing specifications.
Table 29. RGMII and RTBI AC Timing Specifications
At recommended operating conditions with LVDD of 2.5 V ± 5%.
Parameter/Condition
Data to clock output skew (at transmitter)
Data to clock input skew (at receiver)
2
Clock period3
Min
Typ
Max
Unit
tSKRGT 5
–500
0
500
ps
tSKRGT
1.0
—
2.8
ns
tRGT 6
Duty cycle for 1000Base-T
4
Duty cycle for 10BASE-T and 100BASE-TX 3
Rise and fall time
Symbol 1
7.2
8.0
8.8
ns
6
45
50
55
%
tRGTH/tRGT 6
40
50
60
%
—
—
0.75
ns
tRGTH/tRGT
tRGTR, tRGTF
6,7
Notes:
1.Note that, in general, the clock reference symbol representation for this section is based on the symbols RGT to
represent RGMII and RTBI timing. For example, the subscript of tRGT represents the TBI (T) receive (RX) clock. Note
also that the notation for rise (R) and fall (F) times follows the clock symbol that is being represented. For symbols
representing skews, the subscript is skew (SK) followed by the clock that is being skewed (RGT).
2.The RGMII specification requires that PC board designer add 1.5 ns or greater in trace delay to the RX_CLK in order to
meet this specification. However, as stated above, this device will function with only 1.0 ns of delay.
3.For 10 and 100 Mbps, tRGT scales to 400 ns ± 40 ns and 40 ns ± 4 ns, respectively.
4.Duty cycle may be stretched/shrunk during speed changes or while transitioning to a received packet's clock domains
as long as the minimum duty cycle is not violated and stretching occurs for no more than three tRGT of the lowest
speed transitioned between.
5.Guaranteed by characterization.
6.Guaranteed by design.
7.Signal timings are measured at 0.5 V and 2.0 V voltage levels.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
30
Freescale Semiconductor
Ethernet: Three-Speed,10/100, MII Management
Figure 13 shows the RGMII and RTBI AC timing and multiplexing diagrams.
tRGT
tRGTH
GTX_CLK
(At Transmitter)
tSKRGT
TXD[8:5][3:0]
TXD[7:4][3:0]
TX_CTL
TXD[3:0]
TXD[8:5]
TXD[7:4]
TXD[4]
TXEN
TXD[9]
TXERR
tSKRGT
TX_CLK
(At PHY)
RXD[8:5][3:0]
RXD[7:4][3:0]
RXD[8:5]
RXD[3:0] RXD[7:4]
tSKRGT
RX_CTL
RXD[4]
RXDV
RXD[9]
RXERR
tSKRGT
RX_CLK
(At PHY)
Figure 13. RGMII and RTBI AC Timing and Multiplexing Diagrams
8.3 10/100 Ethernet Controller (10/100 Mbps)—MII Electrical
Characteristics
The electrical characteristics specified here apply to the MII (media independent interface) signals except
MDIO (management data input/output) and MDC (management data clock). The MII interface can be
operated at 3.3 or 2.5 V. Whether the MII interface is operated at 3.3 or 2.5 V, the timing is compliant with
the IEEE 802.3 standard. The electrical characteristics for MDIO and MDC are specified in Section 2.1.3,
“Recommended Operating Conditions.”
8.3.1 MII DC Electrical Characteristics
All MII drivers and receivers comply with the DC parametric attributes specified in Table 30. The potential
applied to the input of a MII receiver may exceed the potential of the receiver’s power supply (that is, a
MII driver powered from a 3.6-V supply driving VOH into a MII receiver powered from a 2.5-V supply).
Tolerance for dissimilar MII driver and receiver supply potentials is implicit in these specifications.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
31
Ethernet: Three-Speed,10/100, MII Management
Table 30. MII DC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
OVDD
3.13
3.47
V
Output high voltage
(OVDD = Min, IOH = –4.0 mA)
VOH
2.40
OVDD + 0.3
V
Output low voltage
(OVDD = Min, IOL = 4.0 mA)
VOL
GND
0.50
V
Input high voltage
VIH
1.70
—
V
Input low voltage
VIL
–0.3
0.90
V
Input high current
(VIN= OVDD 1)
IIH
—
40
μA
Input low current
(VIN= GND 1)
IIL
–600
—
μA
Supply voltage 3.3 V
Note:
1.Note that the symbol VIN, in this case, represents the OVIN symbol referenced in Table 1 and Table 2.
8.3.2 MII AC Electrical Specifications
This section describes the MII transmit and receive AC specifications.
8.3.2.1
MII Transmit AC Timing Specifications
Table 31 provides the MII transmit AC timing specifications.
Table 31. MII Transmit AC Timing Specifications
At recommended operating conditions with OVDD of 3.3 V ± 5%.
Symbol 1
Min
Typ
Max
Unit
TX_CLK clock period 10 Mbps
tMTX
—
400
—
ns
TX_CLK clock period 100 Mbps
tMTX
—
40
—
ns
tMTXH/tMTX
35
—
65
%
tMTKHDX
1
5
15
ns
1.0
—
4.0
ns
Parameter/Condition
TX_CLK duty cycle
TX_CLK to MII data TXD[3:0], TX_ER, TX_EN delay
TX_CLK data clock rise and fall time
tMTXR, tMTXF
2,3
Note:
1.The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example,
tMTKHDX symbolizes MII transmit timing (MT) from the time tMTX clock reference (K) going high (H) until data outputs
(D) are invalid (X). Note that, in general, the clock reference symbol representation is based on two to three letters
representing the clock of a particular functional. For example, the subscript of tMTX represents the MII (M) transmit
(TX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall).
2.Signal timings are measured at 0.7 V and 1.9 V voltage levels.
3.Guaranteed by design.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
32
Freescale Semiconductor
Ethernet: Three-Speed,10/100, MII Management
Figure 14 shows the MII transmit AC timing diagram.
tMTXR
tMTX
TX_CLK
tMTXH
tMTXF
TXD[3:0]
TX_EN
TX_ER
tMTKHDX
Figure 14. MII Transmit AC Timing Diagram
8.3.2.2
MII Receive AC Timing Specifications
Table 32 provides the MII receive AC timing specifications.
Table 32. MII Receive AC Timing Specifications
Symbol 1
Min
Typ
Max
Unit
RX_CLK clock period 10 Mbps
tMRX
—
400
—
ns
RX_CLK clock period 100 Mbps
tMRX
—
40
—
ns
tMRXH/tMRX
35
—
65
%
RXD[7:0], TX_DV, TX_ER setup time to RX_CLK
tMRDVKH
10.0
—
—
ns
RXD[7:0], TX_DV, TX_ER hold time to RX_CLK
tMRDXKH
10.0
—
—
ns
tMRXR, tMRXF 2,3
1.0
—
4.0
ns
Parameter/Condition
RX_CLK duty cycle
RX_CLK clock rise and fall time
Note:
1.The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMRDVKH
symbolizes MII receive timing (MR) with respect to the time data input signals (D) reach the valid state (V) relative to
the tMRX clock reference (K) going to the high (H) state or setup time. Also, tMRDXKH symbolizes MII receive timing
(GR) with respect to the time data input signals (D) went invalid (X) relative to the tMRX clock reference (K) going to
the high (H) state or hold time. Note that, in general, the clock reference symbol representation is based on two to
three letters representing the clock of a particular functional. For example, the subscript of tMRX represents the MII
(M) receive (RX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F
(fall).
2.Signal timings are measured at 0.7 V and 1.9 V voltage levels.
3.Guaranteed by design.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
33
Ethernet: Three-Speed,10/100, MII Management
Figure 15 shows the MII receive AC timing diagram.
tMRXR
tMRX
RX_CLK
tMRXF
tMRXH
RXD[3:0]
RX_DV
RX_ER
Valid Data
tMRDVKH
tMRDXKH
Figure 15. MII Receive AC Timing Diagram
8.4 Ethernet Management Interface Electrical Characteristics
The electrical characteristics specified here apply to MII management interface signals MDIO
(management data input/output) and MDC (management data clock). The electrical characteristics for
GMII, RGMII, TBI and RTBI are specified in Section 8.1, “Three-Speed Ethernet Controller (TSEC)
(10/100/1Gb Mbps)—GMII/MII/TBI/RGMII/RTBI Electrical Characteristics.”
8.4.1 MII Management DC Electrical Characteristics
The MDC and MDIO are defined to operate at a supply voltage of 3.3 V. The DC electrical characteristics
for MDIO and MDC are provided in Table 33.
Table 33. MII Management DC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
OVDD
3.13
3.47
V
Output high voltage
(OVDD = Min, IOH = –1.0 mA)
VOH
2.10
OVDD + 0.3
V
Output low voltage
(OVDD = Min, IOL = 1.0 mA)
VOL
GND
0.50
V
Input high voltage
VIH
1.70
—
V
Input low voltage
VIL
—
0.90
V
Input high current
(OVDD = Max, VIN 1 = 2.1 V)
IIH
—
40
μA
Input low current
(OVDD = Max, VIN = 0.5 V)
IIL
–600
—
μA
Supply voltage (3.3 V)
Note:
1.Note that the symbol VIN, in this case, represents the OVIN symbol referenced in Table 1 and Table 2.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
34
Freescale Semiconductor
Ethernet: Three-Speed,10/100, MII Management
8.4.2 MII Management AC Electrical Specifications
Table 34 provides the MII management AC timing specifications.
Table 34. MII Management AC Timing Specifications
At recommended operating conditions with OVDD is 3.3 V ± 5%.
Symbol 1
Min
Typ
Max
Unit
Notes
MDC frequency
fMDC
0.893
—
10.4
MHz
2, 4
MDC period
tMDC
96
—
1120
ns
MDC clock pulse width high
tMDCH
32
—
—
ns
2*[1/(fccb_clk/8)]
ns
3
3
Parameter/Condition
MDC to MDIO valid
tMDKHDV
MDC to MDIO delay
tMDKHDX
10
—
2*[1/(fccb_clk/8)]
ns
MDIO to MDC setup time
tMDDVKH
5
—
—
ns
MDIO to MDC hold time
tMDDXKH
0
—
—
ns
MDC rise time
tMDCR
—
—
10
ns
4
MDC fall time
tMDHF
—
—
10
ns
4
Notes:
1.The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMDKHDX
symbolizes management data timing (MD) for the time tMDC from clock reference (K) high (H) until data outputs (D) are
invalid (X) or data hold time. Also, tMDDVKH symbolizes management data timing (MD) with respect to the time data
input signals (D) reach the valid state (V) relative to the tMDC clock reference (K) going to the high (H) state or setup
time. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall).
2.This parameter is dependent on the CCB clock speed (that is, for a CCB clock of 267 MHz, the maximum frequency is
8.3 MHz and the minimum frequency is 1.2 MHz; for a CCB clock of 333 MHz, the maximum frequency is 10.4 MHz
and the minimum frequency is 1.5 MHz).
3.This parameter is dependent on the CCB clock speed (that is, for a CCB clock of 267 MHz, the delay is 60 ns and for a
CCB clock of 333 MHz, the delay is 48 ns).
4.Guaranteed by design.
Figure 16 shows the MII management AC timing diagram.
tMDCR
tMDC
MDC
tMDCF
tMDCH
MDIO
(Input)
tMDDVKH
tMDKHDV
tMDDXKH
MDIO
(Output)
tMDKHDX
Figure 16. MII Management Interface Timing Diagram
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
35
Local Bus
9 Local Bus
This section describes the DC and AC electrical specifications for the local bus interface of the MPC8540.
9.1 Local Bus DC Electrical Characteristics
Table 35 provides the DC electrical characteristics for the local bus interface.
Table 35. Local Bus DC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
High-level input voltage
VIH
2
OVDD + 0.3
V
Low-level input voltage
VIL
–0.3
0.8
V
Input current
(VIN 1 = 0 V or VIN = VDD)
IIN
—
±5
μA
High-level output voltage
(OVDD = min, IOH = –2 mA)
VOH
OVDD - 0.2
—
V
Low-level output voltage
(OVDD = min, IOL = 2 mA)
VOL
—
0.2
V
Note:
1.Note that the symbol VIN, in this case, represents the OVIN symbol referenced in Table 1 and Table 2.
9.2 Local Bus AC Electrical Specifications
Table 36 describes the general timing parameters of the local bus interface of the MPC8540 with the DLL
enabled.
Table 36. Local Bus General Timing Parameters - DLL Enabled
Symbol 1
Min
Max
Unit
Notes
tLBK
6.0
—
ns
2
LCLK[n] skew to LCLK[m] or
LSYNC_OUT
tLBKSKEW
—
150
ps
3, 9
Input setup to local bus clock
(except LUPWAIT)
tLBIVKH1
1.8
—
ns
4, 5, 8
LUPWAIT input setup to local bus
clock
tLBIVKH2
1.7
—
ns
4, 5
Input hold from local bus clock
(except LUPWAIT)
tLBIXKH1
0.5
—
ns
4, 5, 8
LUPWAIT input hold from local bus
clock
tLBIXKH2
1.0
—
ns
4, 5
LALE output transition to LAD/LDP
output transition (LATCH hold time)
tLBOTOT
1.5
—
ns
6
Parameter
POR Configuration
Local bus cycle time
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
36
Freescale Semiconductor
Local Bus
Table 36. Local Bus General Timing Parameters - DLL Enabled (continued)
POR Configuration
Symbol 1
Min
Max
Unit
Notes
Local bus clock to output valid
(except LAD/LDP and LALE)
TSEC2_TXD[6:5] = 00
tLBKHOV1
—
2.0
ns
4, 8
Local bus clock to data valid for
LAD/LDP
TSEC2_TXD[6:5] = 00
ns
4, 8
Local bus clock to address valid for
LAD
TSEC2_TXD[6:5] = 00
ns
4, 8
Parameter
TSEC2_TXD[6:5] = 11
(default)
tLBKHOV2
—
TSEC2_TXD[6:5] = 11
(default)
TSEC2_TXD[6:5] = 00
tLBKHOV3
—
TSEC2_TXD[6:5] = 00
Local bus clock to output high
Impedance (except LAD/LDP and
LALE)
TSEC2_TXD[6:5] = 00
Local bus clock to output high
impedance for LAD/LDP
TSEC2_TXD[6:5] = 00
tLBKHOV4
—
2.3
ns
4, 8
tLBKHOX1
0.7
—
ns
4, 8
—
ns
4, 8
2.5
ns
7, 9
ns
7, 9
1.6
tLBKHOX2
TSEC2_TXD[6:5] = 11
(default)
0.7
1.6
tLBKHOZ1
—
TSEC2_TXD[6:5] = 11
(default)
TSEC2_TXD[6:5] = 11
(default)
2.3
3.8
TSEC2_TXD[6:5] = 11
(default)
Output hold from local bus clock for
LAD/LDP
2.2
3.7
TSEC2_TXD[6:5] = 11
(default)
Local bus clock to LALE assertion
Output hold from local bus clock
(except LAD/LDP and LALE)
3.5
3.8
tLBKHOZ2
—
2.5
3.8
Notes:
1.The symbols used for timing specifications herein follow the pattern of t(First two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(First two letters of functional block)(reference)(state)(signal)(state) for outputs. For example,
tLBIXKH1 symbolizes local bus timing (LB) for the input (I) to go invalid (X) with respect to the time the tLBK clock
reference (K) goes high (H), in this case for clock one(1). Also, tLBKHOX symbolizes local bus timing (LB) for the tLBK
clock reference (K) to go high (H), with respect to the output (O) going invalid (X) or output hold time.
2.All timings are in reference to LSYNC_IN for DLL enabled mode.
3.Maximum possible clock skew between a clock LCLK[m] and a relative clock LCLK[n]. Skew measured between
complementary signals at OVDD/2.
4.All signals are measured from OVDD/2 of the rising edge of LSYNC_IN for DLL enabled to 0.4 × OVDD of the signal in
question for 3.3-V signaling levels.
5.Input timings are measured at the pin.
6.The value of tLBOTOT is defined as the sum of 1/2 or 1 ccb_clk cycle as programmed by LBCR[AHD], and the number
of local bus buffer delays used as programmed at power-on reset with configuration pins TSEC2_TXD[6:5].
7. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current
delivered through the component pin is less than or equal to the leakage current specification.
8.Guaranteed by characterization.
9.Guaranteed by design.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
37
Local Bus
Table 37 describes the general timing parameters of the local bus interface of the MPC8540 with the DLL
bypassed.
Table 37. Local Bus General Timing Parameters—DLL Bypassed
Symbol 1
Min
Max
Unit
Notes
tLBK
6.0
—
ns
2
tLBKHKT
2.3
3.9
ns
8
LCLK[n] skew to LCLK[m] or LSYNC_OUT
tLBKSKEW
—
150
ps
3, 9
Input setup to local bus clock (except
LUPWAIT)
tLBIVKH1
5.7
—
ns
4, 5
LUPWAIT input setup to local bus clock
tLBIVKH2
5.6
—
ns
4, 5
Input hold from local bus clock (except
LUPWAIT)
tLBIXKH1
-1.8
—
ns
4, 5
LUPWAIT input hold from local bus clock
tLBIXKH2
-1.3
—
ns
4, 5
LALE output transition to LAD/LDP output
transition (LATCH hold time)
tLBOTOT
1.5
—
ns
6
tLBKLOV1
—
-0.3
ns
4
ns
4
ns
4
Parameter
POR Configuration
Local bus cycle time
Internal launch/capture clock to LCLK
delay
Local bus clock to output valid (except
LAD/LDP and LALE)
TSEC2_TXD[6:5] = 00
TSEC2_TXD[6:5] = 11
(default)
Local bus clock to data valid for LAD/LDP
TSEC2_TXD[6:5] = 00
1.2
tLBKLOV2
—
TSEC2_TXD[6:5] = 11
(default)
Local bus clock to address valid for LAD
TSEC2_TXD[6:5] = 00
1.4
tLBKLOV3
—
TSEC2_TXD[6:5] = 11
(default)
Local bus clock to LALE assertion
Output hold from local bus clock (except
LAD/LDP and LALE)
Output hold from local bus clock for
LAD/LDP
Local bus clock to output high Impedance
(except LAD/LDP and LALE)
TSEC2_TXD[6:5] = 00
tLBKHOV4
—
0
ns
4
tLBKLOX1
-3.2
—
ns
4
—
ns
4
0.2
ns
7
-2.3
tLBKLOX2
TSEC2_TXD[6:5] = 11
(default)
TSEC2_TXD[6:5] = 00
TSEC2_TXD[6:5] = 11
(default)
0
1.5
TSEC2_TXD[6:5] = 11
(default)
TSEC2_TXD[6:5] = 00
-0.1
-3.2
-2.3
tLBKLOZ1
—
1.5
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
38
Freescale Semiconductor
Local Bus
Table 37. Local Bus General Timing Parameters—DLL Bypassed (continued)
Parameter
POR Configuration
Symbol 1
Min
Max
Unit
Notes
Local bus clock to output high impedance
for LAD/LDP
TSEC2_TXD[6:5] = 00
tLBKLOZ2
—
0.2
ns
7
TSEC2_TXD[6:5] = 11
(default)
1.5
Notes:
1.The symbols used for timing specifications herein follow the pattern of t(First two letters of functional block)(signal)(state) (reference)(state)
for inputs and t(First two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tLBIXKH1 symbolizes local
bus timing (LB) for the input (I) to go invalid (X) with respect to the time the tLBK clock reference (K) goes high (H), in this
case for clock one(1). Also, tLBKHOX symbolizes local bus timing (LB) for the tLBK clock reference (K) to go high (H), with
respect to the output (O) going invalid (X) or output hold time.
2.All timings are in reference to local bus clock for DLL bypass mode. Timings may be negative with respect to the local bus
clock because the actual launch and capture of signals is done with the internal launch/capture clock, which precedes
LCLK by tLBKHKT.
3.Maximum possible clock skew between a clock LCLK[m] and a relative clock LCLK[n]. Skew measured between
complementary signals at OVDD/2.
4.All signals are measured from OVDD/2 of the rising edge of local bus clock for DLL bypass mode to 0.4 × OVDD of the signal
in question for 3.3-V signaling levels.
5.Input timings are measured at the pin.
6.The value of tLBOTOT is defined as the sum of 1/2 or 1 ccb_clk cycle as programmed by LBCR[AHD], and the number of local
bus buffer delays used as programmed at power-on reset with configuration pins TSEC2_TXD[6:5].
7.For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered
through the component pin is less than or equal to the leakage current specification.
8.Guaranteed by characterization.
9.Guaranteed by design.
Figure 17 provides the AC test load for the local bus.
Output
Z0 = 50 Ω
RL = 50 Ω
OVDD/2
Figure 17. Local Bus AC Test Load
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
39
Local Bus
Figure 18 through Figure 23 show the local bus signals.
LSYNC_IN
tLBIXKH1
tLBIVKH1
Input Signals:
LAD[0:31]/LDP[0:3]
tLBIXKH2
tLBIVKH2
Input Signal:
LGTA
Output Signals:
LA[27:31]/LBCTL/LBCKE/LOE/
LSDA10/LSDWE/LSDRAS/
LSDCAS/LSDDQM[0:3]
tLBKHOV1
tLBKHOZ1
tLBKHOX1
tLBKHOV2
tLBKHOZ2
tLBKHOX2
Output (Data) Signals:
LAD[0:31]/LDP[0:3]
tLBKHOV3
tLBKHOZ2
tLBKHOX2
Output (Address) Signal:
LAD[0:31]
tLBOTOT
tLBKHOV4
LALE
Figure 18. Local Bus Signals, Nonspecial Signals Only (DLL Enabled)
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
40
Freescale Semiconductor
Local Bus
Internal launch/capture clock
tLBKHKT
LCLK[n]
tLBIVKH1
tLBIXKH1
Input Signals:
LAD[0:31]/LDP[0:3]
tLBIVKH2
Input Signal:
LGTA
tLBIXKH2
tLBKLOV1
tLBKLOX1
Output Signals:
LA[27:31]/LBCTL/LBCKE/LOE/
LSDA10/LSDWE/LSDRAS/
LSDCAS/LSDDQM[0:3]
tLBKLOZ1
tLBKLOZ2
tLBKLOV2
Output (Data) Signals:
LAD[0:31]/LDP[0:3]
tLBKLOX2
tLBKLOV3
Output (Address) Signal:
LAD[0:31]
tLBKLOV4
tLBOTOT
LALE
Figure 19. Local Bus Signals (DLL Bypass Mode)
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
41
Local Bus
LSYNC_IN
T1
T3
tLBKHOV1
tLBKHOZ1
GPCM Mode Output Signals:
LCS[0:7]/LWE
tLBIVKH2
tLBIXKH2
UPM Mode Input Signal:
LUPWAIT
tLBIVKH1
tLBIXKH1
Input Signals:
LAD[0:31]/LDP[0:3]
tLBKHOV1
tLBKHOZ1
UPM Mode Output Signals:
LCS[0:7]/LBS[0:3]/LGPL[0:5]
Figure 20. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 2 (DLL Enabled)
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
42
Freescale Semiconductor
Local Bus
Internal launch/capture clock
tLBKHKT
T1
T3
LCLK
tLBKLOX1
tLBKLOV1
GPCM Mode Output Signals:
LCS[0:7]/LWE
tLBIVKH2
UPM Mode Input Signal:
LUPWAIT
tLBKLOZ1
tLBIXKH2
tLBIVKH1
Input Signals:
LAD[0:31]/LDP[0:3]
(DLL Bypass Mode)
tLBIXKH1
UPM Mode Output Signals:
LCS[0:7]/LBS[0:3]/LGPL[0:5]
Figure 21. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 2 (DLL Bypass Mode)
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
43
Local Bus
LSYNC_IN
T1
T2
T3
T4
tLBKHOV1
tLBKHOZ1
GPCM Mode Output Signals:
LCS[0:7]/LWE
tLBIVKH2
tLBIXKH2
UPM Mode Input Signal:
LUPWAIT
tLBIVKH1
Input Signals:
LAD[0:31]/LDP[0:3]
(DLL Bypass Mode)
tLBKHOV1
tLBIXKH1
tLBKHOZ1
UPM Mode Output Signals:
LCS[0:7]/LBS[0:3]/LGPL[0:5]
Figure 22. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 4 or 8 (DLL Enabled)
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
44
Freescale Semiconductor
Local Bus
Internal launch/capture clock
tLBKHKT
T1
T2
T3
T4
LCLK
tLBKLOX1
tLBKLOV1
GPCM Mode Output Signals:
LCS[0:7]/LWE
tLBIVKH2
UPM Mode Input Signal:
LUPWAIT
tLBKLOZ1
tLBIXKH2
tLBIVKH1
Input Signals:
LAD[0:31]/LDP[0:3]
(DLL Bypass Mode)
tLBIXKH1
UPM Mode Output Signals:
LCS[0:7]/LBS[0:3]/LGPL[0:5]
Figure 23. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 4 or 8 (DLL Bypass Mode)
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
45
JTAG
10 JTAG
This section describes the AC electrical specifications for the IEEE 1149.1 (JTAG) interface of the
MPC8540.
Table 38 provides the JTAG AC timing specifications as defined in Figure 25 through Figure 28.
Table 38. JTAG AC Timing Specifications (Independent of SYSCLK) 1
At recommended operating conditions (see Table 2).
Symbol 2
Min
Max
Unit
JTAG external clock frequency of operation
fJTG
0
33.3
MHz
JTAG external clock cycle time
t JTG
30
—
ns
tJTKHKL
15
—
ns
tJTGR & tJTGF
0
2
ns
6
tTRST
25
—
ns
3
Boundary-scan data
TMS, TDI
tJTDVKH
tJTIVKH
4
0
—
—
Boundary-scan data
TMS, TDI
tJTDXKH
tJTIXKH
20
25
—
—
Boundary-scan data
TDO
tJTKLDV
tJTKLOV
4
4
20
25
Boundary-scan data
TDO
tJTKLDX
tJTKLOX
JTAG external clock to output high impedance:
Boundary-scan data
TDO
tJTKLDZ
tJTKLOZ
Parameter
JTAG external clock pulse width measured at 1.4 V
JTAG external clock rise and fall times
TRST assert time
Input setup times:
Notes
ns
Input hold times:
4
ns
4
ns
Valid times:
Output hold times:
5
ns
5
ns
3
3
19
9
5, 6
Notes:
1.All outputs are measured from the midpoint voltage of the falling/rising edge of tTCLK to the midpoint of the signal in
question. The output timings are measured at the pins. All output timings assume a purely resistive 50-Ω load
(see Figure 24). Time-of-flight delays must be added for trace lengths, vias, and connectors in the system.
2.The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example,
tJTDVKH symbolizes JTAG device timing (JT) with respect to the time data input signals (D) reaching the valid state
(V) relative to the tJTG clock reference (K) going to the high (H) state or setup time. Also, tJTDXKH symbolizes JTAG
timing (JT) with respect to the time data input signals (D) went invalid (X) relative to the tJTG clock reference (K)
going to the high (H) state. Note that, in general, the clock reference symbol representation is based on three
letters representing the clock of a particular functional. For rise and fall times, the latter convention is used with
the appropriate letter: R (rise) or F (fall).
3.TRST is an asynchronous level sensitive signal. The setup time is for test purposes only.
4.Non-JTAG signal input timing with respect to tTCLK.
5.Non-JTAG signal output timing with respect to tTCLK.
6.Guaranteed by design.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
46
Freescale Semiconductor
JTAG
Figure 24 provides the AC test load for TDO and the boundary-scan outputs of the MPC8540.
Z0 = 50 Ω
Output
RL = 50 Ω
OVDD/2
Figure 24. AC Test Load for the JTAG Interface
Figure 25 provides the JTAG clock input timing diagram.
JTAG
External Clock
VM
VM
VM
tJTGR
tJTKHKL
tJTGF
tJTG
VM = Midpoint Voltage (OVDD/2)
Figure 25. JTAG Clock Input Timing Diagram
Figure 26 provides the TRST timing diagram.
VM
TRST
VM
tTRST
VM = Midpoint Voltage (OVDD/2)
Figure 26. TRST Timing Diagram
Figure 27 provides the boundary-scan timing diagram.
JTAG
External Clock
VM
VM
tJTDVKH
tJTDXKH
Boundary
Data Inputs
Input
Data Valid
tJTKLDV
tJTKLDX
Boundary
Data Outputs
Output Data Valid
tJTKLDZ
Boundary
Data Outputs
Output Data Valid
VM = Midpoint Voltage (OVDD/2)
Figure 27. Boundary-Scan Timing Diagram
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
47
I2C
Figure 28 provides the test access port timing diagram.
JTAG
External Clock
VM
VM
tJTIVKH
tJTIXKH
Input
Data Valid
TDI, TMS
tJTKLOV
tJTKLOX
TDO
Output Data Valid
tJTKLOZ
TDO
Output Data Valid
VM = Midpoint Voltage (OVDD/2)
Figure 28. Test Access Port Timing Diagram
11 I2C
This section describes the DC and AC electrical characteristics for the I2C interface of the MPC8540.
11.1 I2C DC Electrical Characteristics
Table 39 provides the DC electrical characteristics for the I2C interface of the MPC8540.
Table 39. I2C DC Electrical Characteristics
At recommended operating conditions with OVDD of 3.3 V ± 5%.
Parameter
Symbol
Min
Max
Unit
Input high voltage level
VIH
0.7 × OVDD
OVDD+ 0.3
V
Input low voltage level
VIL
–0.3
0.3 × OVDD
V
Low level output voltage
VOL
0
0.2 × OVDD
V
1
tI2KHKL
0
50
ns
2
Input current each I/O pin (input voltage is
between 0.1 × OVDD and 0.9 × OVDD(max)
II
–10
10
μA
3
Capacitance for each I/O pin
CI
—
10
pF
Pulse width of spikes which must be suppressed
by the input filter
Notes
Notes:
1.Output voltage (open drain or open collector) condition = 3 mA sink current.
2.Refer to the MPC8540 Integrated Processor Preliminary Reference Manual for information on the digital filter used.
3.I/O pins will obstruct the SDA and SCL lines if OVDD is switched off.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
48
Freescale Semiconductor
I2C
11.2 I2C AC Electrical Specifications
Table 40 provides the AC timing parameters for the I2C interface of the MPC8540.
Table 40. I2C AC Electrical Specifications
All values refer to VIH (min) and VIL (max) levels (see Table 39).
Symbol 1
Min
Max
Unit
fI2C
0
400
kHz
Low period of the SCL clock
tI2CL 6
1.3
—
μs
High period of the SCL clock
tI2CH 6
0.6
—
μs
Setup time for a repeated START condition
tI2SVKH 6
0.6
—
μs
Hold time (repeated) START condition (after this period, the
first clock pulse is generated)
tI2SXKL 6
0.6
—
μs
Data setup time
tI2DVKH 6
100
—
ns
—
02
—
0.9 3
Parameter
SCL clock frequency
μs
tI2DXKL
Data hold time:
CBUS compatible masters
I2C bus devices
Set-up time for STOP condition
tI2PVKH
0.6
—
μs
Bus free time between a STOP and START condition
tI2KHDX
1.3
—
μs
Noise margin at the LOW level for each connected device
(including hysteresis)
VNL
0.1 × OVDD
—
V
Noise margin at the HIGH level for each connected device
(including hysteresis)
VNH
0.2 × OVDD
—
V
Notes:
1.The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tI2DVKH
symbolizes I2C timing (I2) with respect to the time data input signals (D) reach the valid state (V) relative to the tI2C
clock reference (K) going to the high (H) state or setup time. Also, tI2SXKL symbolizes I2C timing (I2) for the time that
the data with respect to the start condition (S) went invalid (X) relative to the tI2C clock reference (K) going to the low
(L) state or hold time. Also, tI2PVKH symbolizes I2C timing (I2) for the time that the data with respect to the stop
condition (P) reaching the valid state (V) relative to the tI2C clock reference (K) going to the high (H) state or setup
time. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall).
2.MPC8540 provides a hold time of at least 300 ns for the SDA signal (referred to the VIHmin of the SCL signal) to bridge
the undefined region of the falling edge of SCL.
3.The maximum tI2DVKH has only to be met if the device does not stretch the LOW period (tI2CL) of the SCL signal.
4.CB = capacitance of one bus line in pF.
6.Guaranteed by design.
Figure 17 provides the AC test load for the I2C.
Output
Z0 = 50 Ω
RL = 50 Ω
OVDD/2
Figure 29. I2C AC Test Load
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
49
PCI/PCI-X
Figure 30 shows the AC timing diagram for the I2C bus.
SDA
tI2CF
tI2DVKH
tI2CL
tI2KHKL
tI2CF
tI2SXKL
tI2CR
SCL
tI2SXKL
tI2CH
tI2DXKL
S
tI2SVKH
tI2PVKH
Sr
P
S
Figure 30. I2C Bus AC Timing Diagram
12 PCI/PCI-X
This section describes the DC and AC electrical specifications for the PCI/PCI-X bus of the MPC8540.
12.1 PCI/PCI-X DC Electrical Characteristics
Table 41 provides the DC electrical characteristics for the PCI/PCI-X interface of the MPC8540.
Table 41. PCI/PCI-X DC Electrical Characteristics 1
Parameter
Symbol
Min
Max
Unit
High-level input voltage
VIH
2
OVDD + 0.3
V
Low-level input voltage
VIL
–0.3
0.8
V
Input current
(VIN 2 = 0 V or VIN = VDD)
IIN
—
±5
μA
High-level output voltage
(OVDD = min, IOH = –100 μA)
VOH
OVDD – 0.2
—
V
Low-level output voltage
(OVDD = min, IOL = 100 μA)
VOL
—
0.2
V
Notes:
1.Ranges listed do not meet the full range of the DC specifications of the PCI 2.2 Local Bus Specifications.
2.Note that the symbol VIN, in this case, represents the OVIN symbol referenced in Table 1 and Table 2.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
50
Freescale Semiconductor
PCI/PCI-X
12.2 PCI/PCI-X AC Electrical Specifications
This section describes the general AC timing parameters of the PCI/PCI-X bus of the MPC8540. Note that
the SYSCLK signal is used as the PCI input clock. Table 42 provides the PCI AC timing specifications at
66 MHz.
Table 42. PCI AC Timing Specifications at 66 MHz
Symbol 1
Min
Max
Unit
Notes
SYSCLK to output valid
tPCKHOV
—
6.0
ns
2
Output hold from SYSCLK
tPCKHOX
2.0
—
ns
2, 9
SYSCLK to output high impedance
tPCKHOZ
—
14
ns
2, 3, 10
Input setup to SYSCLK
tPCIVKH
3.0
—
ns
2, 4, 9
Input hold from SYSCLK
tPCIXKH
0
—
ns
2, 4, 9
tPCRVRH
10 × tSYS
—
clocks
5, 6, 10
HRESET to REQ64 hold time
tPCRHRX
0
50
ns
6, 10
HRESET high to first FRAME assertion
tPCRHFV
10
—
clocks
7, 10
Parameter
REQ64 to HRESET
9 setup
time
Notes:
1.Note that the symbols used for timing specifications herein follow the pattern of t(first two letters of functional
block)(signal)(state) (reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs.
For example, tPCIVKH symbolizes PCI/PCI-X timing (PC) with respect to the time the input signals (I) reach the
valid state (V) relative to the SYSCLK clock, tSYS, reference (K) going to the high (H) state or setup time. Also,
tPCRHFV symbolizes PCI/PCI-X timing (PC) with respect to the time hard reset (R) went high (H) relative to the
frame signal (F) going to the valid (V) state.
2.See the timing measurement conditions in the PCI 2.2 Local Bus Specifications.
3.For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current
delivered through the component pin is less than or equal to the leakage current specification.
4.Input timings are measured at the pin.
5.The timing parameter tSYS indicates the minimum and maximum CLK cycle times for the various specified
frequencies. The system clock period must be kept within the minimum and maximum defined ranges. For values
see Section 15, “Clocking.”
6.The setup and hold time is with respect to the rising edge of HRESET.
7.The timing parameter tPCRHFV is a minimum of 10 clocks rather than the minimum of 5 clocks in the PCI 2.2 Local
Bus Specifications.
8.The reset assertion timing requirement for HRESET is 100 μs.
9.Guaranteed by characterization.
10.Guaranteed by design.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
51
PCI/PCI-X
Figure 17 provides the AC test load for PCI and PCI-X.
Z0 = 50 Ω
Output
RL = 50 Ω
OVDD/2
Figure 31. PCI/PCI-X AC Test Load
Figure 32 shows the PCI/PCI-X input AC timing conditions.
CLK
tPCIVKH
tPCIXKH
Input
Figure 32. PCI-PCI-X Input AC Timing Measurement Conditions
Figure 33 shows the PCI/PCI-X output AC timing conditions.
CLK
tPCKHOV
Output Delay
tPCKHOZ
High-Impedance
Output
Figure 33. PCI-PCI-X Output AC Timing Measurement Condition
Table 43 provides the PCI-X AC timing specifications at 66 MHz.
Table 43. PCI-X AC Timing Specifications at 66 MHz
Parameter
Symbol
Min
Max
Unit
Notes
SYSCLK to signal valid delay
tPCKHOV
—
3.8
ns
1, 2, 3,
7, 8
Output hold from SYSCLK
tPCKHOX
0.7
—
ns
1, 10
SYSCLK to output high impedance
tPCKHOZ
—
7
ns
1, 4, 8, 11
Input setup time to SYSCLK
tPCIVKH
1.7
—
ns
3, 5
Input hold time from SYSCLK
tPCIXKH
0.5
—
ns
10
REQ64 to HRESET setup time
tPCRVRH
10
—
clocks
11
HRESET to REQ64 hold time
tPCRHRX
0
50
ns
11
HRESET high to first FRAME assertion
tPCRHFV
10
—
clocks
9, 11
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
52
Freescale Semiconductor
PCI/PCI-X
Table 43. PCI-X AC Timing Specifications at 66 MHz (continued)
Parameter
Symbol
Min
Max
Unit
Notes
PCI-X initialization pattern to HRESET setup time
tPCIVRH
10
—
clocks
11
HRESET to PCI-X initialization pattern hold time
tPCRHIX
0
50
ns
6, 11
Notes:
1.See the timing measurement conditions in the PCI-X 1.0a Specification.
2.Minimum times are measured at the package pin (not the test point). Maximum times are measured with the test point and
load circuit.
3.Setup time for point-to-point signals applies to REQ and GNT only. All other signals are bused.
4.For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered
through the component pin is less than or equal to the leakage current specification.
5.Setup time applies only when the device is not driving the pin. Devices cannot drive and receive signals at the same time.
6.Maximum value is also limited by delay to the first transaction (time for HRESET high to first configuration access, tPCRHFV).
The PCI-X initialization pattern control signals after the rising edge of HRESET must be negated no later than two clocks
before the first FRAME and must be floated no later than one clock before FRAME is asserted.
7.A PCI-X device is permitted to have the minimum values shown for tPCKHOV and tCYC only in PCI-X mode. In conventional
mode, the device must meet the requirements specified in PCI 2.2 for the appropriate clock frequency.
8.Device must meet this specification independent of how many outputs switch simultaneously.
9.The timing parameter tPCRHFV is a minimum of 10 clocks rather than the minimum of 5 clocks in the PCI-X 1.0a Specification.
10.Guaranteed by characterization.
11.Guaranteed by design.
Table 44 provides the PCI-X AC timing specifications at 133 MHz.
Table 44. PCI-X AC Timing Specifications at 133 MHz
Parameter
Symbol
Min
Max
Unit
Notes
SYSCLK to signal valid delay
tPCKHOV
—
3.8
ns
1, 2, 3,
7, 8
Output hold from SYSCLK
tPCKHOX
0.7
—
ns
1, 11
SYSCLK to output high impedance
tPCKHOZ
—
7
ns
1, 4, 8,
12
Input setup time to SYSCLK
tPCIVKH
1.4
—
ns
3, 5, 9,
11
Input hold time from SYSCLK
tPCIXKH
0.5
—
ns
11
REQ64 to HRESET setup time
tPCRVRH
10
—
clocks
12
HRESET to REQ64 hold time
tPCRHRX
0
50
ns
12
HRESET high to first FRAME assertion
tPCRHFV
10
—
clocks
10, 12
PCI-X initialization pattern to HRESET setup time
tPCIVRH
10
—
clocks
12
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
53
RapidIO
Table 44. PCI-X AC Timing Specifications at 133 MHz (continued)
Parameter
HRESET to PCI-X initialization pattern hold time
Symbol
Min
Max
Unit
Notes
tPCRHIX
0
50
ns
6, 12
Notes:
1.See the timing measurement conditions in the PCI-X 1.0a Specification.
2.Minimum times are measured at the package pin (not the test point). Maximum times are measured with the test
point and load circuit.
3.Setup time for point-to-point signals applies to REQ and GNT only. All other signals are bused.
4.For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current
delivered through the component pin is less than or equal to the leakage current specification.
5.Setup time applies only when the device is not driving the pin. Devices cannot drive and receive signals at the same
time.
6.Maximum value is also limited by delay to the first transaction (time for HRESET high to first configuration access,
tPCRHFV). The PCI-X initialization pattern control signals after the rising edge of HRESET must be negated no
later than two clocks before the first FRAME and must be floated no later than one clock before FRAME is
asserted.
7.A PCI-X device is permitted to have the minimum values shown for tPCKHOV and tCYC only in PCI-X mode. In
conventional mode, the device must meet the requirements specified in PCI 2.2 for the appropriate clock
frequency.
8.Device must meet this specification independent of how many outputs switch simultaneously.
9.The timing parameter tPCIVKH is a minimum of 1.4 ns rather than the minimum of 1.2 ns in the PCI-X 1.0a
Specification.
10.The timing parameter tPCRHFV is a minimum of 10 clocks rather than the minimum of 5 clocks in the PCI-X 1.0a
Specification.
11.Guaranteed by characterization.
12.Guaranteed by design.
13 RapidIO
This section describes the DC and AC electrical specifications for the RapidIO interface of the MPC8540.
13.1 RapidIO DC Electrical Characteristics
RapidIO driver and receiver DC electrical characteristics are provided in Table 45 and Table 46,
respectively.
Table 45. RapidIO 8/16 LP-LVDS Driver DC Electrical Characteristics
At recommended operating conditions with OVDD of 3.3 V ± 5%.
Characteristic
Symbol
Min
Max
Unit
Notes
Differential output high voltage
VOHD
247
454
mV
1, 2
Differential output low voltage
VOLD
–454
–247
mV
1, 2
Differential offset voltage
ΔVOSD
—
50
mV
1,3
Output high common mode voltage
VOHCM
1.125
1.375
V
1, 4
Output low common mode voltage
VOLCM
1.125
1.375
V
1, 5
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
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Freescale Semiconductor
RapidIO
Table 45. RapidIO 8/16 LP-LVDS Driver DC Electrical Characteristics
At recommended operating conditions with OVDD of 3.3 V ± 5%.
Characteristic
Symbol
Min
Max
Unit
Notes
ΔVOSCM
—
50
mV
1, 6
RTERM
90
220
W
Short circuit current (either output)
|ISS|
—
24
mA
7
Bridged short circuit current
|ISB|
—
12
mA
8
Common mode offset voltage
Differential termination
Notes:
1.Bridged 100-Ω load.
2.See Figure 34(a).
3.Differential offset voltage = |VOHD+VOLD|. See Figure 34(b).
4.VOHCM = (VOA + VOB)/2 when measuring VOHD.
5.VOLCM = (VOA + VOB)/2 when measuring VOLD.
6.Common mode offset ΔVOSCM = |VOHCM – VOLCM|. See Figure 34(c).
7.Outputs shorted to VDD or GND.
8.Outputs shorted together.
Table 46. RapidIO 8/16 LP-LVDS Receiver DC Electrical Characteristics
Characteristic
Symbol
Min
Max
Unit
VI
0
2.4
V
Differential input high voltage
VIHD
100
600
mV
1
Differential input low voltage
VILD
–600
–100
mV
1
Common mode input range (referenced to receiver
ground)
VICM
0.050
2.350
V
2
RIN
90
110
W
Voltage at either input
Input differential resistance
Notes
Notes:
1.Over the common mode range.
2.Limited by VI. See Figure 41.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
55
RapidIO
Figure 34 shows the DC driver signal levels.
VOA
RTERM
100 Ω
(no m)
VOB
V
(a)
VOD = VOA – VOB
VOSCM = (VOA + VOB)/2
454 mV
V
VOD = VOA – VOB
1.375 V
VOHCM
ΔVOS
247 mV VOHD
VOLCM
–V + ΔVOD
–V
–247 mV
–V – ΔVOD
–454 mV
VOLD
1.125 V
0
Differential Specifications
Common-Mode Specifications
(b)
Note: VOA refers to voltage at output A; VOB refers to voltage at output B.
(c)
Figure 34. DC Driver Signal Levels
13.2 RapidIO AC Electrical Specifications
This section contains the AC electrical specifications for a RapidIO 8/16 LP-LVDS device. The interface
defined is a parallel differential low-power high-speed signal interface. Note that the source of the transmit
clock on the RapidIO interface is dependent on the settings of the LGPL[0:1] signals at reset. Note that the
default setting makes the core complex bus (CCB) clock the source of the transmit clock. See Chapter 4
of the Reference Manual for more details on reset configuration settings.
13.3 RapidIO Concepts and Definitions
This section specifies signals using differential voltages. Figure 35 shows how the signals are defined. The
figure shows waveforms for either a transmitter output (TD and TD) or a receiver input (RD and RD). Each
signal swings between A volts and B volts where A > B. Using these waveforms, the definitions are as
follows:
• The transmitter output and receiver input signals TD, TD, RD, and RD each have a peak-to-peak
swing of A-B volts.
• The differential output signal of the transmitter, VOD, is defined as VTD – VTD.
• The differential input signal of the receiver, VID, is defined as VRD – VRD.
• The differential output signal of the transmitter or input signal of the receiver, ranges from
A – B volts to – (A – B) volts.
• The peak differential signal of the transmitter output or receiver input, is A – B volts.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
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Freescale Semiconductor
RapidIO
•
The peak-to-peak differential signal of the transmitter output or receiver input, is 2 × (A – B) volts.
AV
BV
TD or RD
TD or RD
Figure 35. Differential Peak-to-Peak Voltage of Transmitter or Receiver
To illustrate these definitions using numerical values, consider the case where a LVDS transmitter has a
common mode voltage of 1.2 V and each signal has a swing that goes between 1.4 and 1.0 V. Using these
values, the peak-to-peak voltage swing of the signals TD, TD, RD, and RD is 400 mV. The differential
signal ranges between 400 and –400 mV. The peak differential signal is 400 mV, and the peak-to-peak
differential signal is 800 mV.
A timing edge is the zero-crossing of a differential signal. Each skew timing parameter on a parallel bus
is synchronously measured on two signals relative to each other in the same cycle, such as data to data,
data to clock, or clock to clock. A skew timing parameter may be relative to the edge of a signal or to the
middle of two sequential edges.
Static skew represents the timing difference between signals that does not vary over time regardless of
system activity or data pattern. Path length differences are a primary source of static skew.
Dynamic skew represents the amount of timing difference between signals that is dependent on the activity
of other signals and varies over time. Crosstalk between signals is a source of dynamic skew.
Eye diagrams and compliance masks are a useful way to visualize and specify driver and receiver
performance. This technique is used in several serial bus specifications. An example compliance mask is
shown in Figure 36. The key difference in the application of this technique for a parallel bus is that the data
is source synchronous to its bus clock while serial data is referenced to its embedded clock. Eye diagrams
reveal the quality (cleanness, openness, goodness) of a driver output or receiver input. An advantage of
using an eye diagram and a compliance mask is that it allows specifying the quality of a signal without
requiring separate specifications for effects such as rise time, duty cycle distortion, data dependent
dynamic skew, random dynamic skew, etc. This allows the individual semiconductor manufacturer
maximum flexibility to trade off various performance criteria while keeping the system performance
constant.
In using the eye pattern and compliance mask approach, the quality of the signal is specified by the
compliance mask. The mask specifies the maximum permissible magnitude of the signal and the minimum
permissible eye opening. The eye diagram for the signal under test is generated according to the
specification. Compliance is determined by whether the compliance mask can be positioned over the eye
diagram such that the eye pattern falls entirely within the unshaded portion of the mask.
Serial specifications have clock encoded with the data, but the LP-LVDS physical layer defined by
RapidIO is a source synchronous parallel port so additional specifications to include effects that are not
found in serial links are required. Specifications for the effect of bit to bit timing differences caused by
static skew have been added and the eye diagrams specified are measured relative to the associated clock
in order to include clock to data effects. With the transmit output (or receiver input) eye diagram, the user
can determine if the transmitter output (or receiver input) is compliant with an oscilloscope with the
appropriate software.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
57
RapidIO
Differential (V)
Z
Y
0
–Y
DV
–Z
0
X1 X2
Time (UI)
1–X2 1–X1
1
Figure 36. Example Compliance Mask
Y = minimum data valid amplitude
Z = maximum amplitude
1 UI = 1 unit interval = 1/baud rate
X1 = end of zero crossing region
X2 = beginning of data valid window
DV = data valid window = 1 – 2 × X2
The waveform of the signal under test must fall within the unshaded area of the mask to be compliant.
Different masks are used for the driver output and the receiver input allowing each to be separately
specified.
13.3.1 RapidIO Driver AC Timing Specifications
Driver AC timing specifications are provided in Table 47, Table 48, and Table 49. A driver shall comply
with the specifications for each data rate/frequency for which operation of the driver is specified. Unless
otherwise specified, these specifications are subject to the following conditions.
• The specifications apply over the supply voltage and ambient temperature ranges specified by the
device vendor.
• The specifications apply for any combination of data patterns on the data signals.
• The output of a driver shall be connected to a 100 Ω, ±1%, differential (bridged) resistive load.
• Clock specifications apply only to clock signals.
• Data specifications apply only to data signals (FRAME, D[0:7]).
Table 47. RapidIO Driver AC Timing Specifications—500 Mbps Data Rate
Range
Characteristic
Symbol
Min
Max
Unit
Notes
Differential output high voltage
VOHD
200
540
mV
1
Differential output low voltage
VOLD
–540
–200
mV
1
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
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RapidIO
Table 47. RapidIO Driver AC Timing Specifications—500 Mbps Data Rate (continued)
Range
Characteristic
Symbol
Unit
Notes
52
%
2, 6
200
—
ps
3, 6
tRISE
200
—
ps
6
DV
1260
—
ps
tDPAIR
—
180
ps
4, 6
tSKEW,PAIR
–180
180
ps
5, 6
Min
Max
DC
48
VOD rise time, 20%–80% of peak-to-peak
differential signal swing
tFALL
VOD fall time, 20%–80% of peak-to-peak
differential signal swing
Duty cycle
Data valid
Skew of any two data outputs
Skew of single data outputs to associated clock
Notes:
1.See Figure 37.
2.Requires ±100 ppm long term frequency stability.
3.Measured at VOD = 0 V.
4.Measured using the RapidIO transmit mask shown in Figure 37.
5.See Figure 42.
6.Guaranteed by design.
Table 48. RapidIO Driver AC Timing Specifications—750 Mbps Data Rate
Range
Characteristic
Symbol
Min
Max
Unit
Notes
Differential output high voltage
VOHD
200
540
mV
1
Differential output low voltage
VOLD
–540
–200
mV
1
DC
48
52
%
2, 6
VOD rise time, 20%–80% of peak-to-peak
differential signal swing
tFALL
133
—
ps
3, 6
VOD fall time, 20%–80% of peak-to-peak
differential signal swing
tRISE
133
—
ps
6
DV
800
—
ps
6
tDPAIR
—
133
ps
4, 6
tSKEW,PAIR
–133
133
ps
5, 6
Duty cycle
Data valid
Skew of any two data outputs
Skew of single data outputs to associated clock
Notes:
1.See Figure 37.
2.Requires ±100 ppm long term frequency stability.
3.Measured at VOD = 0 V.
4.Measured using the RapidIO transmit mask shown in Figure 37.
5.See Figure 42.
6.Guaranteed by design.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
59
RapidIO
Table 49. RapidIO Driver AC Timing Specifications—1 Gbps Data Rate
Range
Characteristic
Symbol
Min
Max
Unit
Notes
Differential output high voltage
VOHD
200
540
mV
1
Differential output low voltage
VOLD
–540
–200
mV
1
DC
48
52
%
2, 6
VOD rise time, 20%–80% of peak to peak
differential signal swing
tFALL
100
—
ps
3, 6
VOD fall time, 20%–80% of peak to peak
differential signal swing
tRISE
100
—
ps
6
DV
575
—
ps
6
tDPAIR
—
100
ps
4, 6
tSKEW,PAIR
–100
100
ps
5, 6
Duty cycle
Data valid
Skew of any two data outputs
Skew of single data outputs to associated clock
Notes:
1.See Figure 37.
2.Requires ±100 ppm long term frequency stability.
3.Measured at VOD = 0 V.
4.Measured using the RapidIO transmit mask shown in Figure 37.
5.See Figure 42.
6.Guaranteed by design.
The compliance of driver output signals TD[0:15] and TFRAME with their minimum data valid window
(DV) specification shall be determined by generating an eye pattern for each of the data signals and
comparing the eye pattern of each data signal with the RapidIO transmit mask shown in Figure 37. The
value of X2 used to construct the mask shall be (1 – DVmin)/2. A signal is compliant with the data valid
window specification if the transmit mask can be positioned on the signal’s eye pattern such that the eye
pattern falls entirely within the unshaded portion of the mask.
VOHDmax
VOD (mV)
VOHDmin
0
VOLDmax
DV
VOLDmin
0
X2
Time (UI)
1–X2
1
Figure 37. RapidIO Transmit Mask
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
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Freescale Semiconductor
RapidIO
The eye pattern for a data signal is generated by making a large number of recordings of the signal and
then overlaying the recordings. The number of recordings used to generate the eye shall be large enough
that further increasing the number of recordings used does not cause the resulting eye pattern to change
from one that complies with the RapidIO transmit mask to one that does not. Each data signal in the
interface shall be carrying random or pseudo-random data when the recordings are made. If
pseudo-random data is used, the length of the pseudo-random sequence (repeat length) shall be long
enough that increasing the length of the sequence does not cause the resulting eye pattern to change from
one that complies with the RapidIO transmit mask to one that does not comply with the mask. The data
carried by any given data signal in the interface may not be correlated with the data carried by any other
data signal in the interface. The zero-crossings of the clock associated with a data signal shall be used as
the timing reference for aligning the multiple recordings of the data signal when the recordings are
overlaid.
While the method used to make the recordings and overlay them to form the eye pattern is not specified,
the method used shall be demonstrably equivalent to the following method. The signal under test is
repeatedly recorded with a digital oscilloscope in infinite persistence mode. Each recording is triggered by
a zero-crossing of the clock associated with the data signal under test. Roughly half of the recordings are
triggered by positive-going clock zero-crossings and roughly half are triggered by negative-going clock
zero-crossings. Each recording is at least 1.9 UI in length (to ensure that at least one complete eye is
formed) and begins 0.5 UI before the trigger point (0.5 UI before the associated clock zero-crossing).
Depending on the length of the individual recordings used to generate the eye pattern, one or more
complete eyes will be formed. Regardless of the number of eyes, the eye whose center is immediately to
the right of the trigger point is the eye used for compliance testing.
An example of an eye pattern generated using the above method with recordings 3 UI in length is shown
in Figure 38. In this example, there is no skew between the signal under test and the associated clock used
to trigger the recordings. If skew was present, the eye pattern would be shifted to the left or right relative
to the oscilloscope trigger point.
.
0.5 UI
1.0 UI
1.0 UI
VOD
+
0
–
Oscilloscope
(Recording)
Trigger Point
Eye Used for
Compliance
Testing
Eye Pattern
Figure 38. Example Driver Output Eye Pattern
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
61
RapidIO
13.3.2 RapidIO Receiver AC Timing Specifications
The RapidIO receiver AC timing specifications are provided in Table 50. A receiver shall comply with the
specifications for each data rate/frequency for which operation of the receiver is specified. Unless
otherwise specified, these specifications are subject to the following conditions.
• The specifications apply over the supply voltage and ambient temperature ranges specified by the
device vendor.
• The specifications apply for any combination of data patterns on the data signals.
• The specifications apply over the receiver common mode and differential input voltage ranges.
• Clock specifications apply only to clock signals.
• Data specifications apply only to data signals (FRAME, D[0:7])
Table 50. RapidIO Receiver AC Timing Specifications—500 Mbps Data Rate
Range
Characteristic
Symbol
Min
Max
53
Unit
Notes
%
1, 5
ps
2
Duty cycle of the clock input
DC
47
Data valid
DV
1080
tDPAIR
—
380
ps
3
tSKEW,PAIR
–300
300
ps
4
Allowable static skew between any two data inputs
within a 8-/9-bit group
Allowable static skew of data inputs to associated clock
Notes:
1.Measured at VID = 0 V.
2.Measured using the RapidIO receive mask shown in Figure 39.
3.See Figure 42.
4.See Figure 41 and Figure 42.
5.Guaranteed by design.
Table 51. RapidIO Receiver AC Timing Specifications—750 Mbps Data Rate
Range
Characteristic
Symbol
Min
Max
Unit
Notes
Duty cycle of the clock input
DC
47
53
%
1, 5
Data valid
DV
600
—
ps
2
tDPAIR
—
400
ps
3
tSKEW,PAIR
–267
267
ps
4
Allowable static skew between any two data inputs
within a 8-/9-bit group
Allowable static skew of data inputs to associated clock
Notes:
1.Measured at VID = 0 V.
2.Measured using the RapidIO receive mask shown in Figure 39.
3.See Figure 42.
4.See Figure 41 and Figure 42.
5.Guaranteed by design.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
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RapidIO
Table 52. RapidIO Receiver AC Timing Specifications—1 Gbps Data Rate
Range
Characteristic
Symbol
Min
Max
Unit
Notes
Duty cycle of the clock input
DC
47
53
%
1, 5
Data valid
DV
425
—
ps
2
tDPAIR
—
300
ps
3
tSKEW,PAIR
–200
200
ps
4
Allowable static skew between any two data inputs
within a 8-/9-bit group
Allowable static skew of data inputs to associated clock
Notes:
1.Measured at VID = 0 V.
2.Measured using the RapidIO receive mask shown in Figure 39.
3.See Figure 42.
4.See Figure 41 and Figure 42.
5.Guaranteed by design.
The compliance of receiver input signals RD[0:15] and RFRAME with their minimum data valid window
(DV) specification shall be determined by generating an eye pattern for each of the data signals and
comparing the eye pattern of each data signal with the RapidIO receive mask shown in Figure 39. The
value of X2 used to construct the mask shall be (1 – DVmin)/2. The ±100 mV minimum data valid and
±600 mV maximum input voltage values are from the DC specification. A signal is compliant with the data
valid window specification if and only if the receive mask can be positioned on the signal’s eye pattern
such that the eye pattern falls entirely within the unshaded portion of the mask.
600
VID (mV)
100
0
–100
DV
–600
0
X2
Time (UI)
1–X2
1
Figure 39. RapidIO Receive Mask
The eye pattern for a data signal is generated by making a large number of recordings of the signal and
then overlaying the recordings. The number of recordings used to generate the eye shall be large enough
that further increasing the number of recordings used does not cause the resulting eye pattern to change
from one that complies with the RapidIO receive mask to one that does not. Each data signal in the
interface shall be carrying random or pseudo-random data when the recordings are made. If
pseudo-random data is used, the length of the pseudo-random sequence (repeat length) shall be long
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
63
RapidIO
enough that increasing the length of the sequence does not cause the resulting eye pattern to change from
one that complies with the RapidIO receive mask to one that does not comply with the mask. The data
carried by any given data signal in the interface may not be correlated with the data carried by any other
data signal in the interface. The zero-crossings of the clock associated with a data signal shall be used as
the timing reference for aligning the multiple recordings of the data signal when the recordings are
overlaid.
While the method used to make the recordings and overlay them to form the eye pattern is not specified,
the method used shall be demonstrably equivalent to the following method. The signal under test is
repeatedly recorded with a digital oscilloscope in infinite persistence mode. Each recording is triggered by
a zero-crossing of the clock associated with the data signal under test. Roughly half of the recordings are
triggered by positive-going clock zero-crossings and roughly half are triggered by negative-going clock
zero-crossings. Each recording is at least 1.9 UI in length (to ensure that at least one complete eye is
formed) and begins 0.5 UI before the trigger point (0.5 UI before the associated clock zero-crossing).
Depending on the length of the individual recordings used to generate the eye pattern, one or more
complete eyes will be formed. Regardless of the number of eyes, the eye whose center is immediately to
the right of the trigger point is the eye used for compliance testing.
An example of an eye pattern generated using the above method with recordings 3 UI in length is shown
in Figure 40. In this example, there is no skew between the signal under test and the associated clock used
to trigger the recordings. If skew was present, the eye pattern would be shifted to the left or right relative
to the oscilloscope trigger point.
0.5 UI
1.0 UI
1.0 UI
VID
+
0
–
Oscilloscope
(Recording)
Trigger Point
Eye Used for
Compliance
Testing
Eye Pattern
Figure 40. Example Receiver Input Eye Pattern
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
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RapidIO
Figure 41 shows the definitions of the data to clock static skew parameter tSKEW,PAIR and the data valid
window parameter DV. The data and frame bits are those that are associated with the clock. The figure
applies for all zero-crossings of the clock. All of the signals are differential signals. VD represents VOD for
the transmitter and VID for the receiver. The center of the eye is defined as the midpoint of the region in
which the magnitude of the signal voltage is greater than or equal to the minimum DV voltage.
VD = 0 V
VD Clock x
1.0 UI Nominal
0.5 UI
VD Clock x
VD = 0 V
tSKEW,PAIR
0.5 DV
D[0:7]/D[8:15], FRAME
0.5 DV
VHDmim
Eye Opening
VHDmim
DV
Figure 41. Data to Clock Skew
Figure 42 shows the definition of the data to data static skew parameter tDPAIR and how the skew
parameters are applied.
Center Point for Clock
1.0 UI Nominal
0.5 UI
CLK0 (CLK1)
Center point of the
data valid window of
the earliest allowed data
bit for data grouped
late with respect
to clock
Center point of the
data valid window of
the latest allowed data
bit for data grouped
late with respect
to clock
D[0:7]/D[8:15], FRAME
tDPAIR
tSKEW,PAIR
Figure 42. Static Skew Diagram
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
65
Package and Pin Listings
14 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions.
14.1 Package Parameters for the MPC8540 FC-PBGA
The package parameters are as provided in the following list. The package type is 29 mm × 29 mm, 783
flip chip plastic ball grid array (FC-PBGA).
Die size
12.2 mm × 9.5 mm
Package outline
29 mm × 29 mm
Interconnects
783
Pitch
1 mm
Minimum module height
3.07 mm
Maximum module height
3.75 mm
Solder Balls
62 Sn/36 Pb/2 Ag
Ball diameter (typical)
0.5 mm
14.2 Mechanical Dimensions of the MPC8540 FC-PBGA
Figure 43 the mechanical dimensions and bottom surface nomenclature of the MPC8540, 783 FC-PBGA
package.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
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Package and Pin Listings
Figure 43. Mechanical Dimensions and Bottom Surface Nomenclature of the MPC8540 FC-PBGA
NOTES
1.
2.
3.
4.
5.
All dimensions are in millimeters.
Dimensions and tolerances per ASME Y14.5M-1994.
Maximum solder ball diameter measured parallel to datum A.
Datum A, the seating plane, is defined by the spherical crowns of the solder balls.
Capacitors may not be present on all devices.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
67
Package and Pin Listings
6. Caution must be taken not to short capacitors or exposed metal capacitor pads on package top.
7. The socket lid must always be oriented to A1.
14.3 Pinout Listings
Table 53 provides the pin-out listing for the MPC8540, 783 FC-PBGA package.
Table 53. MPC8540 Pinout Listing
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
PCI/PCI-X
PCI_AD[63:0]
AA14, AB14, AC14, AD14, AE14, AF14, AG14,
AH14, V15, W15, Y15, AA15, AB15, AC15, AD15,
AG15, AH15, V16, W16, AB16, AC16, AD16, AE16,
AF16, V17, W17, Y17, AA17, AB17, AE17, AF17,
AF18, AH6, AD7, AE7, AH7, AB8, AC8, AF8, AG8,
AD9, AE9, AF9, AG9, AH9, W10, Y10, AA10, AE11,
AF11, AG11, AH11, V12, W12, Y12, AB12, AD12,
AE12, AG12, AH12, V13, Y13, AB13, AC13
I/O
OVDD
17
PCI_C_BE[7:0]
AG13, AH13, V14, W14, AH8, AB10, AD11, AC12
I/O
OVDD
17
PCI_PAR
AA11
I/O
OVDD
PCI_PAR64
Y14
I/O
OVDD
PCI_FRAME
AC10
I/O
OVDD
2
PCI_TRDY
AG10
I/O
OVDD
2
PCI_IRDY
AD10
I/O
OVDD
2
PCI_STOP
V11
I/O
OVDD
2
PCI_DEVSEL
AH10
I/O
OVDD
2
PCI_IDSEL
AA9
I
OVDD
PCI_REQ64
AE13
I/O
OVDD
5, 10
PCI_ACK64
AD13
I/O
OVDD
2
PCI_PERR
W11
I/O
OVDD
2
PCI_SERR
Y11
I/O
OVDD
2, 4
PCI_REQ0
AF5
I/O
OVDD
PCI_REQ[1:4]
AF3, AE4, AG4, AE5
I
OVDD
PCI_GNT[0]
AE6
I/O
OVDD
PCI_GNT[1:4]
AG5, AH5, AF6, AG6
O
OVDD
5, 9
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
68
Freescale Semiconductor
Package and Pin Listings
Table 53. MPC8540 Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
DDR SDRAM Memory Interface
MDQ[0:63]
M26, L27, L22, K24, M24, M23, K27, K26, K22, J28,
F26, E27, J26, J23, H26, G26, C26, E25, C24, E23,
D26, C25, A24, D23, B23, F22, J21, G21, G22, D22,
H21, E21, N18, J18, D18, L17, M18, L18, C18, A18,
K17, K16, C16, B16, G17, L16, A16, L15, G15, E15,
C14, K13, C15, D15, E14, D14, D13, E13, D12,
A11, F13, H13, A13, B12
I/O
GVDD
MECC[0:7]
N20, M20, L19, E19, C21, A21, G19, A19
I/O
GVDD
MDM[0:8]
L24, H28, F24, L21, E18, E16, G14, B13, M19
O
GVDD
MDQS[0:8]
L26, J25, D25, A22, H18, F16, F14, C13, C20
I/O
GVDD
MBA[0:1]
B18, B19
O
GVDD
MA[0:14]
N19, B21, F21, K21, M21, C23, A23, B24, H23,
G24, K19, B25, D27, J14, J13
O
GVDD
MWE
D17
O
GVDD
MRAS
F17
O
GVDD
MCAS
J16
O
GVDD
MCS[0:3]
H16, G16, J15, H15
O
GVDD
MCKE[0:1]
E26, E28
O
GVDD
MCK[0:5]
J20, H25, A15, D20, F28, K14
O
GVDD
MCK[0:5]
F20, G27, B15, E20, F27, L14
O
GVDD
MSYNC_IN
M28
I
GVDD
MSYNC_OUT
N28
O
GVDD
11
Local Bus Controller Interface
LA[27]
U18
O
OVDD
5, 9
LA[28:31]
T18, T19, T20, T21
O
OVDD
7, 9
LAD[0:31]
AD26, AD27, AD28, AC26, AC27, AC28, AA22,
AA23, AA26, Y21, Y22, Y26, W20, W22, W26, V19,
T22, R24, R23, R22, R21, R18, P26, P25, P20, P19,
P18, N22, N23, N24, N25, N26
I/O
OVDD
LALE
V21
O
OVDD
8, 9
LBCTL
V20
O
OVDD
9
LCKE
U23
O
OVDD
LCLK[0:2]
U27, U28, V18
O
OVDD
LCS[0:4]
Y27, Y28, W27, W28, R27
O
OVDD
18
LCS5/DMA_DREQ2
R28
I/O
OVDD
1
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
69
Package and Pin Listings
Table 53. MPC8540 Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
LCS6/DMA_DACK2
P27
O
OVDD
1
LCS7/DMA_DDONE2
P28
O
OVDD
1
LDP[0:3]
AA27, AA28, T26, P21
I/O
OVDD
LGPL0/LSDA10
U19
O
OVDD
5, 9
LGPL1/LSDWE
U22
O
OVDD
5, 9
LGPL2/LOE/LSDRAS
V28
O
OVDD
8, 9
LGPL3/LSDCAS
V27
O
OVDD
5, 9
LGPL4/LGTA/LUPWAIT/
LPBSE
V23
I/O
OVDD
22
LGPL5
V22
O
OVDD
5, 9
LSYNC_IN
T27
I
OVDD
LSYNC_OUT
T28
O
OVDD
LWE[0:1]/LSDDQM[0:1]/LBS AB28, AB27
[0:1]
O
OVDD
1, 5, 9
LWE[2:3]/LSDDQM[2:3]/LBS T23, P24
[2:3]
O
OVDD
1, 5, 9
DMA
DMA_DREQ[0:1]
H5, G4
I
OVDD
DMA_DACK[0:1]
H6, G5
O
OVDD
DMA_DDONE[0:1]
H7, G6
O
OVDD
DUART
UART_SIN[0:1]
AE2, AD5
I
OVDD
UART_SOUT[0:1]
AE3, AD2
O
OVDD
UART_CTS[0:1]
U9, U7
I
OVDD
UART_RTS[0:1]
AD6, AD1
O
OVDD
Programmable Interrupt Controller
MCP
AG17
I
OVDD
UDE
AG16
I
OVDD
IRQ[0:7]
AA18, Y18, AB18, AG24, AA21, Y19, AA19, AG25
I
OVDD
IRQ8
AB20
I
OVDD
9
IRQ9/DMA_DREQ3
Y20
I
OVDD
1
IRQ10/DMA_DACK3
AF26
I/O
OVDD
1
IRQ11/DMA_DDONE3
AH24
I/O
OVDD
1
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
70
Freescale Semiconductor
Package and Pin Listings
Table 53. MPC8540 Pinout Listing (continued)
Signal
IRQ_OUT
Package Pin Number
Pin Type
Power
Supply
Notes
O
OVDD
2, 4
5, 9
AB21
Ethernet Management Interface
EC_MDC
F1
O
OVDD
EC_MDIO
E1
I/O
OVDD
I
LVDD
Gigabit Reference Clock
EC_GTX_CLK125
E2
Three-Speed Ethernet Controller (Gigabit Ethernet 1)
TSEC1_TXD[7:4]
A6, F7, D7, C7
O
LVDD
5, 9
TSEC1_TXD[3:0]
B7, A7, G8, E8
O
LVDD
9, 19
TSEC1_TX_EN
C8
O
LVDD
11
TSEC1_TX_ER
B8
O
LVDD
TSEC1_TX_CLK
C6
I
LVDD
TSEC1_GTX_CLK
B6
O
LVDD
TSEC1_CRS
C3
I
LVDD
TSEC1_COL
G7
I
LVDD
TSEC1_RXD[7:0]
D4, B4, D3, D5, B5, A5, F6, E6
I
LVDD
TSEC1_RX_DV
D2
I
LVDD
TSEC1_RX_ER
E5
I
LVDD
TSEC1_RX_CLK
D6
I
LVDD
18
Three-Speed Ethernet Controller (Gigabit Ethernet 2)
TSEC2_TXD[7:2]
B10, A10, J10, K11,J11, H11
O
LVDD
TSEC2_TXD[1:0]
G11, E11
O
LVDD
TSEC2_TX_EN
B11
O
LVDD
TSEC2_TX_ER
D11
O
LVDD
TSEC2_TX_CLK
D10
I
LVDD
TSEC2_GTX_CLK
C10
O
LVDD
TSEC2_CRS
D9
I
LVDD
TSEC2_COL
F8
I
LVDD
TSEC2_RXD[7:0]
F9, E9, C9, B9, A9, H9, G10, F10
I
LVDD
TSEC2_RX_DV
H8
I
LVDD
TSEC2_RX_ER
A8
I
LVDD
5, 9
11
18
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
71
Package and Pin Listings
Table 53. MPC8540 Pinout Listing (continued)
Signal
TSEC2_RX_CLK
Package Pin Number
E10
Pin Type
Power
Supply
I
LVDD
Notes
10/100 Ethernet (MII) Interface
FEC_TXD[3:0]
M1, N1, N4, N5
O
OVDD
FEC_TX_EN
P11
O
OVDD
FEC_TX_ER
P10
O
OVDD
FEC_TX_CLK
V6
I
OVDD
FEC_CRS
N10
I
OVDD
FEC_COL
N11
I
OVDD
FEC_RXD[3:0]
N9, N8, N7, N6
I
OVDD
FEC_RX_DV
P8
I
OVDD
FEC_RX_ER
P9
I
OVDD
FEC_RX_CLK
V9
I
OVDD
RapidIO Interface
RIO_RCLK
Y25
I
OVDD
RIO_RCLK
Y24
I
OVDD
RIO_RD[0:7]
T25, U25, V25, W25, AA25, AB25, AC25, AD25
I
OVDD
RIO_RD[0:7]
T24, U24, V24, W24, AA24, AB24, AC24, AD24
I
OVDD
RIO_RFRAME
AE27
I
OVDD
RIO_RFRAME
AE26
I
OVDD
RIO_TCLK
AC20
O
OVDD
11
RIO_TCLK
AE21
O
OVDD
11
RIO_TD[0:7]
AE18, AC18, AD19, AE20, AD21, AE22, AC22,
AD23
O
OVDD
RIO_TD[0:7]
AD18, AE19, AC19, AD20, AC21, AD22, AE23,
AC23
O
OVDD
RIO_TFRAME
AE24
O
OVDD
RIO_TFRAME
AE25
O
OVDD
RIO_TX_CLK_IN
AF24
I
OVDD
RIO_TX_CLK_IN
AF25
I
OVDD
I2C interface
IIC_SDA
AH22
I/O
OVDD
4, 20
IIC_SCL
AH23
I/O
OVDD
4, 20
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
72
Freescale Semiconductor
Package and Pin Listings
Table 53. MPC8540 Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
System Control
HRESET
AH16
I
OVDD
HRESET_REQ
AG20
O
OVDD
SRESET
AF20
I
OVDD
CKSTP_IN
M11
I
OVDD
CKSTP_OUT
G1
O
OVDD
2, 4
Debug
TRIG_IN
N12
I
OVDD
TRIG_OUT/READY
G2
O
OVDD
6, 9, 19
MSRCID[0:1]
J9, G3
O
OVDD
5, 6, 9
MSRCID[2:4]
F3, F5, F2
O
OVDD
6
MDVAL
F4
O
OVDD
6
Clock
SYSCLK
AH21
I
OVDD
RTC
AB23
I
OVDD
CLK_OUT
AF22
O
OVDD
11
JTAG
TCK
AF21
I
OVDD
TDI
AG21
I
OVDD
12
TDO
AF19
O
OVDD
11
TMS
AF23
I
OVDD
12
TRST
AG23
I
OVDD
12
DFT
LSSD_MODE
AG19
I
OVDD
21
L1_TSTCLK
AB22
I
OVDD
21
L2_TSTCLK
AG22
I
OVDD
21
TEST_SEL
AH20
I
OVDD
3
Thermal Management
THERM0
AG2
I
—
14
THERM1
AH3
I
—
14
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
73
Package and Pin Listings
Table 53. MPC8540 Pinout Listing (continued)
Signal
Package Pin Number
Power
Supply
Pin Type
Notes
Power Management
ASLEEP
AG18
I/O
9, 19
Power and Ground Signals
AVDD1
AH19
Power for e500 PLL
(1.2 V)
AVDD1
AVDD2
AH18
Power for CCB PLL
(1.2 V)
AVDD2
GND
A12, A17, B3, B14, B20, B26, B27, C2, C4,
C11,C17, C19, C22, C27, D8, E3, E12, E24, F11,
F18, F23, G9, G12, G25, H4, H12, H14, H17, H20,
H22, H27, J19, J24, K5, K9, K18, K23, K28, L6, L20,
L25, M4, M12, M14, M16, M22, M27, N2, N13, N15,
N17, P12, P14, P16, P23, R13, R15, R17, R20,
R26, T3, T8, T10, T12, T14, T16, U6, U13, U15,
U16, U17, U21, V7, V10, V26, W5, W18, W23, Y8,
Y16, AA6, AA13, AB4, AB11, AB19, AC6, AC9,
AD3, AD8, AD17, AF2, AF4, AF10, AF13, AF15,
AF27, AG3, AG7, AG26
—
—
GVDD
A14, A20, A25, A26, A27, A28, B17, B22, B28, C12,
C28, D16, D19, D21, D24, D28, E17, E22, F12, F15,
F19, F25, G13, G18, G20, G23, G28, H19, H24,
J12, J17, J22, J27, K15, K20, K25, L13, L23, L28,
M25, N21
Power for DDR
DRAM I/O Voltage
(2.5 V)
GVDD
LVDD
A4, C5, E7, H10
Reference Voltage;
Three-Speed
Ethernet I/O (2.5 V,
3.3 V)
LVDD
MVREF
N27
Reference Voltage
Signal; DDR
MVREF
No Connects
AH26, AH27, AH28, AG28, AF28, AE28,
AH1, AG1, AH2, B1, B2, A2, A3, AH25, H1, H2, J1,
J2, J3, J4, J5, J6, J7, J8, K8, K7, K6, K3, K2, K1, L1,
L2, L3, L4, L5, L8, L9, L10, L11, M10, M9, M8, M7,
M6, M3, M2, P7, P6, P5, P4, P3, P2, P1, R1, R2, R3,
R4, R5, R6, R7, R8, R9, R10, R11, T9, T6, T5, T4,
T1, U1, U2, U3, U4, U8, U10, V5, V4, V3, V2, V1,
W1, W2, W3, W6, W7, W8, W9, Y1, Y2, Y3, Y4, Y5,
Y6, Y9, AA8, AA7, AA4, AA3, AA2, AA1, AB1, AB2,
AB3, AB5, AB6, AC7, AC4, AC3, AC2, AC1
—
—
OVDD
D1, E4, H3, K4, K10, L7, M5, N3, P22, R19, R25,
PCI/PCI-X,
T2, T7, U5, U20, U26, V8, W4, W13, W19, W21, Y7,
RapidIO, 10/100
Y23, AA5, AA12, AA16, AA20, AB7, AB9, AB26,
Ethernet, and other
AC5, AC11, AC17, AD4, AE1, AE8, AE10, AE15,
Standard
AF7, AF12, AG27, AH4
(3.3 V)
16
OVDD
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
74
Freescale Semiconductor
Package and Pin Listings
Table 53. MPC8540 Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
—
—
15
RESERVED
C1, T11, U11, AF1
SENSEVDD
L12
Power for Core
(1.2 V)
VDD
13
SENSEVSS
K12
—
—
13
VDD
M13, M15, M17, N14, N16, P13, P15, P17, R12,
R14, R16, T13, T15, T17, U12, U14, AH17
Power for Core
(1.2 V)
VDD
Notes:
1.All multiplexed signals are listed only once and do not re-occur. For example, LCS5/DMA_REQ2 is listed only once in the
Local Bus Controller Interface section, and is not mentioned in the DMA section even though the pin also functions as
DMA_REQ2.
2.Recommend a weak pull-up resistor (2–10 kΩ) be placed on this pin to OVDD.
3.This pin must always be tied to GND. .
4.This pin is an open drain signal.
5.This pin is a reset configuration pin. It has a weak internal pull-up P-FET which is enabled only when the MPC8540 is in
the reset state. This pull-up is designed such that it can be overpowered by an external 4.7-kΩ pull-down resistor. If an
external device connected to this pin might pull it down during reset, then a pull-up or active driver is needed if the signal
is intended to be high during reset.
6.Treat these pins as no connects (NC) unless using debug address functionality.
7.The value of LA[28:31] during reset sets the CCB clock to SYSCLK PLL ratio. These pins require 4.7-kΩ pull-up or
pull-down resistors. See Section 15.2, “Platform/System PLL Ratio.”
8.The value of LALE and LGPL2 at reset set the e500 core clock to CCB Clock PLL ratio. These pins require 4.7-kΩ pull-up
or pull-down resistors. See the Section 15.3, “e500 Core PLL Ratio.”
9.Functionally, this pin is an output, but structurally it is an I/O because it either samples configuration input during reset or
because it has other manufacturing test functions. This pin will therefore be described as an I/O for boundary scan.
10.This pin functionally requires a pull-up resistor, but during reset it is a configuration input that controls 32- vs. 64-bit PCI
operation. Therefore, it must be actively driven low during reset by reset logic if the device is to be configured to be a
64-bit PCI device. Refer to the PCI Specification.
11.This output is actively driven during reset rather than being three-stated during reset.
12.These JTAG pins have weak internal pull-up P-FETs that are always enabled.
13.These pins are connected to the VDD/GND planes internally and may be used by the core power supply to improve
tracking and regulation.
14.Internal thermally sensitive resistor.
15.No connections should be made to these pins.
16.These pins are not connected for any functional use.
17.PCI specifications recommend that a weak pull-up resistor (2–10 kΩ) be placed on the higher order pins to OVDD when
using 64-bit buffer mode (pins PCI_AD[63:32] and PCI_C_BE[7:4]).
18.Note that these signals are POR configurations for Rev. 1.x and notes 5 and 9 apply to these signals in Rev. 1.x but not
in later revisions.
19 If this pin is connected to a device that pulls down during reset, an external pull-up is required to drive this pin to a logic
–1 state during reset.
20.Recommend a pull-up resistor (~1 KΩ) b placed on this pin to OVDD.
21.These are test signals for factory use only and must be pulled up (100 Ω - 1 kΩ) to OVDD for normal machine operation.
22.If this signal is used as both an input and an output, a weak pull-up (~10 kΩ) is required on this pin.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
75
Clocking
15 Clocking
This section describes the PLL configuration of the MPC8540. Note that the platform clock is identical to
the CCB clock.
15.1 Clock Ranges
Table 54 provides the clocking specifications for the processor core and Table 55 provides the clocking
specifications for the memory bus.
Table 54. Processor Core Clocking Specifications
Maximum Processor Core Frequency
Characteristic
667 MHz
e500 core processor frequency
833 MHz
1 GHz
Min
Max
Min
Max
Min
Max
400
667
400
833
400
1000
Unit
Notes
MHz
1, 2, 3
Notes:
1.Caution: The CCB to SYSCLK ratio and e500 core to CCB ratio settings must be chosen such that the resulting SYSCLK
frequency, e500 (core) frequency, and CCB frequency do not exceed their respective maximum or minimum operating
frequencies. Refer to Section 15.2, “Platform/System PLL Ratio,” and Section 15.3, “e500 Core PLL Ratio,” for ratio
settings.
2.)The minimum e500 core frequency is based on the minimum platform frequency of 200 MHz.
3.)The 1.0 GHz core frequency is based on a 1.3 V VDD supply voltage.
Table 55. Memory Bus Clocking Specifications
Maximum Processor Core Frequency
Characteristic
Memory bus frequency
667 MHz
833 MHz
1 GHz
Min
Max
Min
Max
Min
Max
100
166
100
166
100
166
Unit
Notes
MHz
1, 2, 3
Notes:
1.Caution: The CCB to SYSCLK ratio and e500 core to CCB ratio settings must be chosen such that the resulting SYSCLK
frequency, e500 (core) frequency, and CCB frequency do not exceed their respective maximum or minimum operating
frequencies. Refer to Section 15.2, “Platform/System PLL Ratio,” and Section 15.3, “e500 Core PLL Ratio,” for ratio
settings.
2.The memory bus speed is half of the DDR data rate, hence, half of the platform clock frequency.
3.)The 1.0 GHz core frequency is based on a 1.3 V VDD supply voltage.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
76
Freescale Semiconductor
Clocking
15.2 Platform/System PLL Ratio
The platform clock is the clock that drives the L2 cache, the DDR SDRAM data rate, and the e500 core
complex bus (CCB), and is also called the CCB clock. The values are determined by the binary value on
LA[28:31] at power up, as shown in Table 56.
There is no default for this PLL ratio; these signals must be pulled to the desired values.
Table 56. CCB Clock Ratio
Binary Value of
LA[28:31] Signals
Ratio Description
0000
16:1 ratio CCB clock: SYSCLK (PCI bus)
0001
Reserved
0010
2:1 ratio CCB clock: SYSCLK (PCI bus)
0011
3:1 ratio CCB clock: SYSCLK (PCI bus)
0100
4:1 ratio CCB clock: SYSCLK (PCI bus)
0101
5:1 ratio CCB clock: SYSCLK (PCI bus)
0110
6:1 ratio CCB clock: SYSCLK (PCI bus)
0111
Reserved
1000
8:1 ratio CCB clock: SYSCLK (PCI bus)
1001
9:1 ratio CCB clock: SYSCLK (PCI bus)
1010
10:1 ratio CCB clock: SYSCLK (PCI bus)
1011
Reserved
1100
12:1 ratio CCB clock: SYSCLK (PCI bus)
1101
Reserved
1110
Reserved
1111
Reserved
15.3 e500 Core PLL Ratio
Table 57 describes the clock ratio between the e500 core complex bus (CCB) and the e500 core clock. This
ratio is determined by the binary value of LALE and LGPL2 at power up, as shown in Table 57.
Table 57. e500 Core to CCB Ratio
Binary Value of
LALE, LGPL2 Signals
Ratio Description
00
2:1 e500 core:CCB
01
5:2 e500 core:CCB
10
3:1 e500 core:CCB
11
7:2 e500 core:CCB
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
77
Clocking
15.4 Frequency Options
Table 58 shows the expected frequency values for the platform frequency when using a CCB to SYSCLK
ratio in comparison to the memory bus speed.
Table 58. Frequency Options with Respect to Memory Bus Speeds
CCB to
SYSCLK
Ratio
SYSCLK (MHz)
16.67
25
33.33
41.63
66.67
83
100
111
133.33
200
222
267
300
333
Platform/CCB Frequency (MHz)
2
3
200
250
4
267
333
5
208
6
200
250
333
8
200
267
9
225
300
10
250
333
12
200
16
267
333
300
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
78
Freescale Semiconductor
Thermal
16 Thermal
This section describes the thermal specifications of the MPC8540.
16.1 Thermal Characteristics
Table 59 provides the package thermal characteristics for the MPC8540.
Table 59. Package Thermal Characteristics
Characteristic
Symbol
Value
Unit
Notes
Junction-to-ambient Natural Convection on four layer board (2s2p)
RθJMA
16
°C/W
1, 2
Junction-to-ambient (@100 ft/min or 0.5 m/s) on four layer board (2s2p)
RθJMA
14
°C/W
1, 2
Junction-to-ambient (@200 ft/min or 1 m/s) on four layer board (2s2p)
RθJMA
12
•C/W
1, 2
Junction-to-board thermal
RθJB
7.5
•C/W
3
Junction-to-case thermal
RθJC
0.8
•C/W
4
Notes
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and
board thermal resistance
2. Per JEDEC JESD51-6 with the board horizontal.
3. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
4. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1). Cold plate temperature is used for case temperature; measured value includes the thermal
resistance of the interface layer.
16.2 Thermal Management Information
This section provides thermal management information for the flip chip plastic ball grid array (FC-PBGA)
package for air-cooled applications. Proper thermal control design is primarily dependent on the
system-level design—the heat sink, airflow, and thermal interface material. The recommended attachment
method to the heat sink is illustrated in Figure 44. The heat sink should be attached to the printed-circuit
board with the spring force centered over the die. This spring force should not exceed 10 pounds force.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
79
Thermal
FC-PBGA Package
Heat Sink
Heat Sink
Clip
Adhesive or
Thermal Interface Material
Lid
Die
Printed-Circuit Board
Figure 44. Package Exploded Cross-Sectional View with Several Heat Sink Options
The system board designer can choose between several types of heat sinks to place on the MPC8540. There
are several commercially-available heat sinks from the following vendors:
Aavid Thermalloy
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
603-224-9988
Alpha Novatech
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
408-749-7601
International Electronic Research Corporation (IERC)
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
818-842-7277
Millennium Electronics (MEI)
Loroco Sites
671 East Brokaw Road
San Jose, CA 95112
Internet: www.mei-millennium.com
408-436-8770
Tyco Electronics
Chip Coolers™
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
800-522-6752
Wakefield Engineering
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
603-635-5102
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
80
Freescale Semiconductor
Thermal
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost. Several
heat sinks offered by Aavid Thermalloy, Alpha Novatech, IERC, Chip Coolers, Millennium Electronics,
and Wakefield Engineering offer different heat sink-to-ambient thermal resistances, that will allow the
MPC8540 to function in various environments.
16.2.1 Recommended Thermal Model
For system thermal modeling, the MPC8540 thermal model is shown in Figure 45. Five cuboids are used
to represent this device. To simplify the model, the solder balls and substrate are modeled as a single block
29x29x1.47 mm with the conductivity adjusted accordingly. For modeling, the planar dimensions of the
die are rounded to the nearest mm, so the die is modeled as 10x12 mm at a thickness of 0.76 mm. The
bump/underfill layer is modeled as a collapsed resistance between the die and substrate assuming a
conductivity of 0.6 in-plane and 1.9 W/m•K in the thickness dimension of 0.76 mm. The lid attach
adhesive is also modeled as a collapsed resistance with dimensions of 10x12x0.050 mm and the
conductivity of 1 W/m•K. The nickel plated copper lid is modeled as 12x14x1 mm. Note that the die and
lid are not centered on the substrate; there is a 1.5 mm offset documented in the case outline drawing in
Figure 43.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
81
Thermal
Conductivity
Value
Unit
Lid
(12 × 14 × 1 mm)
kx
360
ky
360
kz
360
W/(m × K)
1
ky
1
kz
1
Bump/underfill
Die
z
Substrate and solder balls
Lid Adhesive—Collapsed resistance
(10 × 12 × 0.050 mm)
kx
Adhesive
Lid
Side View of Model (Not to Scale)
x
Die
(10 × 12 × 0.76 mm)
Substrate
Bump/Underfill—Collapsed resistance
(10 × 12 × 0.070 mm)
kx
0.6
ky
0.6
kz
1.9
Heat Source
Substrate and Solder Balls
(29 × 29 × 1.47 mm)
kx
10.2
ky
10.2
kz
1.6
y
Top View of Model (Not to Scale)
Figure 45. MPC8540 Thermal Model
16.2.2 Internal Package Conduction Resistance
For the packaging technology, shown in Table 59, the intrinsic internal conduction thermal resistance paths
are as follows:
• The die junction-to-case thermal resistance
• The die junction-to-board thermal resistance
Figure 46 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
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Freescale Semiconductor
Thermal
External Resistance
Radiation
Convection
Heat Sink
Thermal Interface Material
Die/Package
Die Junction
Package/Leads
Internal Resistance
Printed-Circuit Board
External Resistance
Radiation
Convection
(Note the internal versus external package resistance)
Figure 46. Package with Heat Sink Mounted to a Printed-Circuit Board
The heat sink removes most of the heat from the device. Heat generated on the active side of the chip is
conducted through the silicon and through the lid, then through the heat sink attach material (or thermal
interface material), and finally to the heat sink. The junction-to-case thermal resistance is low enough that
the heat sink attach material and heat sink thermal resistance are the dominant terms.
16.2.3 Thermal Interface Materials
A thermal interface material is required at the package-to-heat sink interface to minimize the thermal
contact resistance. For those applications where the heat sink is attached by spring clip mechanism,
Figure 47 shows the thermal performance of three thin-sheet thermal-interface materials (silicone,
graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact pressure.
As shown, the performance of these thermal interface materials improves with increasing contact pressure.
The use of thermal grease significantly reduces the interface thermal resistance. The bare joint results in a
thermal resistance approximately six times greater than the thermal grease joint.
Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see
Figure 44). Therefore, the synthetic grease offers the best thermal performance, especially at the low
interface pressure.
When removing the heat sink for re-work, it is preferable to slide the heat sink off slowly until the thermal
interface material loses its grip. If the support fixture around the package prevents sliding off the heat sink,
the heat sink should be slowly removed. Heating the heat sink to 40-50•C with an air gun can soften the
interface material and make the removal easier. The use of an adhesive for heat sink attach is not
recommended.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
83
Thermal
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Specific Thermal Resistance (K-in.2/W)
2
1.5
1
0.5
0
0
10
20
30
40
50
60
70
80
Contact Pressure (psi)
Figure 47. Thermal Performance of Select Thermal Interface Materials
The system board designer can choose between several types of thermal interface. There are several
commercially-available thermal interfaces provided by the following vendors:
Chomerics, Inc.
77 Dragon Ct.
Woburn, MA 01888-4014
Internet: www.chomerics.com
781-935-4850
Dow-Corning Corporation
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dowcorning.com
800-248-2481
Shin-Etsu MicroSi, Inc.
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
888-642-7674
The Bergquist Company
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
800-347-4572
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
84
Freescale Semiconductor
Thermal
Thermagon Inc.
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
888-246-9050
16.2.4 Heat Sink Selection Examples
The following section provides a heat sink selection example using one of the commercially available heat
sinks.
16.2.4.1 Case 1
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
TJ = TI + TR + (θJC + θINT + θSA) × PD
where
TJ is the die-junction temperature
TI is the inlet cabinet ambient temperature
TR is the air temperature rise within the computer cabinet
θJC is the junction-to-case thermal resistance
θINT is the adhesive or interface material thermal resistance
θSA is the heat sink base-to-ambient thermal resistance
PD is the power dissipated by the device
During operation the die-junction temperatures (TJ) should be maintained within the range specified in
Table 2. The temperature of air cooling the component greatly depends on the ambient inlet air temperature
and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (TA)
may range from 30° to 40°C. The air temperature rise within a cabinet (TR) may be in the range of 5° to
10°C. The thermal resistance of some thermal interface material (θINT) may be about 1°C/W. Assuming a
TI of 30 C, a TR of 5 C, a FC-PBGA package θJC = 0.8, and a power consumption (PD) of 7.0 W, the
following expression for TJ is obtained:
Die-junction temperature: TJ = 30°C + 5°C + (0.8°C/W + 1.0°C/W + θSA) × 7.0 W
The heat sink-to-ambient thermal resistance (θSA) versus airflow velocity for a Thermalloy heat sink
#2328B is shown in Figure 48.
Assuming an air velocity of 2 m/s, we have an effective θSA+ of about 3.3 C/W, thus
TJ = 30 C + 5 C + (0.8 C/W +1.0 C/W + 3.3 C/W) × 7.0 W,
resulting in a die-junction temperature of approximately 71 C which is well within the maximum
operating temperature of the component.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
85
Thermal
8
Thermalloy #2328B Pin-fin Heat Sink
(25 × 28 × 15 mm)
Heat Sink Thermal Resistance (°C/W)
7
6
5
4
3
2
1
0
0.5
1
1.5
2
2.5
3
3.5
Approach Air Velocity (m/s)
Figure 48. Thermalloy #2328B Heat Sink-to-Ambient Thermal Resistance Versus Airflow Velocity
16.2.4.2 Case 2
Every system application has different conditions that the thermal management solution must solve. As an
alternate example, assume that the air reaching the component is 85 C with an approach velocity of 1
m/sec. For a maximum junction temperature of 105 C at 7 W, the total thermal resistance of junction to
case thermal resistance plus thermal interface material plus heat sink thermal resistance must be less than
2.8 C/W. The value of the junction to case thermal resistance in Table 59 includes the thermal interface
resistance of a thin layer of thermal grease as documented in footnote 4 of the table. Assuming that the
heat sink is flat enough to allow a thin layer of grease or phase change material, then the heat sink must be
less than 2 C/W.
Millennium Electronics (MEI) has tooled a heat sink MTHERM-1051 for this requirement assuming a
compactPCI environment at 1 m/sec and a heat sink height of 12 mm. The MEI solution is illustrated in
Figure 49 and Figure 50. This design has several significant advantages:
• The heat sink is clipped to a plastic frame attached to the application board with screws or plastic
inserts at the corners away from the primary signal routing areas.
• The heat sink clip is designed to apply the force holding the heat sink in place directly above the
die at a maximum force of less than 10 lbs.
• For applications with significant vibration requirements, silicone damping material can be applied
between the heat sink and plastic frame.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
86
Freescale Semiconductor
Thermal
The spring mounting should be designed to apply the force only directly above the die. By localizing the
force, rocking of the heat sink is minimized. One suggested mounting method attaches a plastic fence to
the board to provide the structure on which the heat sink spring clips. The plastic fence also provides the
opportunity to minimize the holes in the printed-circuit board and to locate them at the corners of the
package. Figure 49 and Figure 50 provide exploded views of the plastic fence, heat sink, and spring clip.
Figure 49. Exploded Views (1) of a Heat Sink Attachment using a Plastic Force
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
87
Thermal
Figure 50. Exploded Views (2) of a Heat Sink Attachment using a Plastic Fence
The die junction-to-ambient and the heat sink-to-ambient thermal resistances are common figure-of-merits
used for comparing the thermal performance of various microelectronic packaging technologies, one
should exercise caution when only using this metric in determining thermal management because no single
parameter can adequately describe three-dimensional heat flow. The final die-junction operating
temperature is not only a function of the component-level thermal resistance, but the system level design
and its operating conditions. In addition to the component’s power consumption, a number of factors affect
the final operating die-junction temperature: airflow, board population (local heat flux of adjacent
components), system air temperature rise, altitude, etc.
Due to the complexity and the many variations of system-level boundary conditions for today’s
microelectronic equipment, the combined effects of the heat transfer mechanisms (radiation convection
and conduction) may vary widely. For these reasons, we recommend using conjugate heat transfer models
for the boards, as well as, system-level designs.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
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Freescale Semiconductor
System Design Information
17 System Design Information
This section provides electrical and thermal design recommendations for successful application of the
MPC8540.
17.1 System Clocking
The MPC8540includes two PLLs.
1. The platform PLL generates the platform clock from the externally supplied SYSCLK input. The
frequency ratio between the platform and SYSCLK is selected using the platform PLL ratio
configuration bits as described in Section 15.2, “Platform/System PLL Ratio.”
2. The e500 Core PLL generates the core clock as a slave to the platform clock. The frequency ratio
between the e500 core clock and the platform clock is selected using the e500 PLL ratio
configuration bits as described in Section 15.3, “e500 Core PLL Ratio.”
17.2 PLL Power Supply Filtering
Each of the PLLs listed above is provided with power through independent power supply pins (AVDD1 and
AVDD2, respectively). The AVDD level should always be equivalent to VDD, and preferably these voltages
will be derived directly from VDD through a low frequency filter scheme such as the following.
There are a number of ways to reliably provide power to the PLLs, but the recommended solution is to
provide three independent filter circuits as illustrated in Figure 51, one to each of the three AVDD pins. By
providing independent filters to each PLL the opportunity to cause noise injection from one PLL to the
other is reduced.
This circuit is intended to filter noise in the PLLs resonant frequency range from a 500 kHz to 10 MHz
range. It should be built with surface mount capacitors with minimum Effective Series Inductance (ESL).
Consistent with the recommendations of Dr. Howard Johnson in High Speed Digital Design: A Handbook
of Black Magic (Prentice Hall, 1993), multiple small capacitors of equal value are recommended over a
single large value capacitor.
Each circuit should be placed as close as possible to the specific AVDD pin being supplied to minimize
noise coupled from nearby circuits. It should be possible to route directly from the capacitors to the AVDD
pin, which is on the periphery of the 783 FC-PBGA footprint, without the inductance of vias.
Figure 51 shows the PLL power supply filter circuit.
10 Ω
VDD
AVDD (or L2AVDD)
2.2 µF
2.2 µF
GND
Low ESL Surface Mount Capacitors
Figure 51. PLL Power Supply Filter Circuit
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
89
System Design Information
17.3 Decoupling Recommendations
Due to large address and data buses, and high operating frequencies, the MPC8540 can generate transient
power surges and high frequency noise in its power supply, especially while driving large capacitive loads.
This noise must be prevented from reaching other components in the MPC8540 system, and the MPC8540
itself requires a clean, tightly regulated source of power. Therefore, it is recommended that the system
designer place at least one decoupling capacitor at each VDD, OVDD, GVDD, and LVDD pins of the
MPC8540. These decoupling capacitors should receive their power from separate VDD, OVDD, GVDD,
LVDD, and GND power planes in the PCB, utilizing short traces to minimize inductance. Capacitors may
be placed directly under the device using a standard escape pattern. Others may surround the part.
These capacitors should have a value of 0.01 or 0.1 µF. Only ceramic SMT (surface mount technology)
capacitors should be used to minimize lead inductance, preferably 0402 or 0603 sizes.
In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB,
feeding the VDD, OVDD, GVDD, and LVDD planes, to enable quick recharging of the smaller chip
capacitors. These bulk capacitors should have a low ESR (equivalent series resistance) rating to ensure the
quick response time necessary. They should also be connected to the power and ground planes through two
vias to minimize inductance. Suggested bulk capacitors—100–330 µF (AVX TPS tantalum or Sanyo
OSCON).
17.4 Connection Recommendations
To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal
level. Unused active low inputs should be tied to OVDD, GVDD, or LVDD as required. Unused active high
inputs should be connected to GND. All NC (no-connect) signals must remain unconnected.
Power and ground connections must be made to all external VDD, GVDD, LVDD, OVDD, and GND pins of
the MPC8540.
17.5 Output Buffer DC Impedance
The MPC8540 drivers are characterized over process, voltage, and temperature. There are two driver
types: a push-pull single-ended driver (open drain for I2C) for all buses except RapidIO, and a
current-steering differential driver for the RapidIO port.
To measure Z0 for the single-ended drivers, an external resistor is connected from the chip pad to OVDD
or GND. Then, the value of each resistor is varied until the pad voltage is OVDD/2 (see Figure 52). The
output impedance is the average of two components, the resistances of the pull-up and pull-down devices.
When data is held high, SW1 is closed (SW2 is open) and RP is trimmed until the voltage at the pad equals
OVDD/2. RP then becomes the resistance of the pull-up devices. RP and RN are designed to be close to each
other in value. Then, Z0 = (RP + RN)/2.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
90
Freescale Semiconductor
System Design Information
OVDD
RN
SW2
Pad
Data
SW1
RP
OGND
Figure 52. Driver Impedance Measurement
The output impedance of the RapidIO port drivers targets 200-Ω differential resistance. The value of this
resistance and the strength of the driver’s current source can be found by making two measurements. First,
the output voltage is measured while driving logic 1 without an external differential termination resistor.
The measured voltage is V1 = Rsource × Isource. Second, the output voltage is measured while driving logic
1 with an external precision differential termination resistor of value Rterm. The measured voltage is
V2 = 1/(1/R1 + 1/R2)) × Isource. Solving for the output impedance gives Rsource = Rterm × (V1/V2 – 1). The
drive current is then Isource = V1/Rsource.
Table 60 summarizes the signal impedance targets. The driver impedance are targeted at minimum VDD,
nominal OVDD, 105°C.
Table 60. Impedance Characteristics
Impedance
Local Bus, Ethernet,
DUART, Control,
Configuration, Power
Management
PCI/PCI-X
DDR DRAM
RapidIO
Symbol
Unit
RN
43 Target
25 Target
20 Target
NA
Z0
W
RP
43 Target
25 Target
20 Target
NA
Z0
W
Differential
NA
NA
NA
200 Target
ZDIFF
W
Note: Nominal supply voltages. See Table 1, Tj = 105°C.
17.6 Configuration Pin Muxing
The MPC8540 provides the user with power-on configuration options which can be set through the use of
external pull-up or pull-down resistors of 4.7 kΩ on certain output pins (see customer visible configuration
pins). These pins are generally used as output only pins in normal operation.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
91
System Design Information
While HRESET is asserted however, these pins are treated as inputs. The value presented on these pins
while HRESET is asserted, is latched when HRESET deasserts, at which time the input receiver is disabled
and the I/O circuit takes on its normal function. Most of these sampled configuration pins are equipped
with an on-chip gated resistor of approximately 20 kΩ. This value should permit the 4.7-kΩ resistor to pull
the configuration pin to a valid logic low level. The pull-up resistor is enabled only during HRESET (and
for platform/system clocks after HRESET deassertion to ensure capture of the reset value). When the input
receiver is disabled the pull-up is also, thus allowing functional operation of the pin as an output with
minimal signal quality or delay disruption. The default value for all configuration bits treated this way has
been encoded such that a high voltage level puts the device into the default state and external resistors are
needed only when non-default settings are required by the user.
Careful board layout with stubless connections to these pull-down resistors coupled with the large value
of the pull-down resistor should minimize the disruption of signal quality or speed for output pins thus
configured.
The platform PLL ratio and e500 PLL ratio configuration pins are not equipped with these default pull-up
devices.
17.7 Pull-Up Resistor Requirements
The MPC8540 requires high resistance pull-up resistors (10 kΩ is recommended) on open drain type pins
including EPIC interrupt pins. I2C open drain type pins should be pulled up with ~1 kΩ resistors.
Correct operation of the JTAG interface requires configuration of a group of system control pins as
demonstrated in Figure 54. Care must be taken to ensure that these pins are maintained at a valid deasserted
state under normal operating conditions as most have asynchronous behavior and spurious assertion will
give unpredictable results.
TSEC1_TXD[3:0] must not be pulled low during reset. Some PHY chips have internal pulldowns that
could cause this to happen. If such PHY chips are used, then a pullup must be placed on these signals strong
enough to restore these signals to a logical 1 during reset.
Three test pins also require pull-up resistors (100 Ω - 1 kΩ). These pins are L1_TSTCLK, L2_TSTCLK,
and LSSD_MODE. These signals are for factory use only and must be pulled up to OVDD for normal
machine operation.
Refer to the PCI 2.2 specification for all pull-ups required for PCI.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
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System Design Information
17.8 JTAG Configuration Signals
Boundary-scan testing is enabled through the JTAG interface signals. The TRST signal is optional in the
IEEE Std 1149.1 specification, but is provided on all processors that implement the Power Architecture.
The device requires TRST to be asserted during reset conditions to ensure the JTAG boundary logic does
not interfere with normal chip operation. While it is possible to force the TAP controller to the reset state
using only the TCK and TMS signals, generally systems will assert TRST during the power-on reset flow.
Simply tying TRST to HRESET is not practical because the JTAG interface is also used for accessing the
common on-chip processor (COP) function.
The COP function of these processors allow a remote computer system (typically, a PC with dedicated
hardware and debugging software) to access and control the internal operations of the processor. The COP
interface connects primarily through the JTAG port of the processor, with some additional status
monitoring signals. The COP port requires the ability to independently assert HRESET or TRST in order
to fully control the processor. If the target system has independent reset sources, such as voltage monitors,
watchdog timers, power supply failures, or push-button switches, then the COP reset signals must be
merged into these signals with logic.
The arrangement shown in Figure 53 allows the COP port to independently assert HRESET or TRST,
while ensuring that the target can drive HRESET as well.
The COP interface has a standard header, shown in Figure 53, for connection to the target system, and is
based on the 0.025" square-post, 0.100" centered header assembly (often called a Berg header). The
connector typically has pin 14 removed as a connector key.
The COP header adds many benefits such as breakpoints, watchpoints, register and memory
examination/modification, and other standard debugger features. An inexpensive option can be to leave
the COP header unpopulated until needed.
There is no standardized way to number the COP header; consequently, many different pin numbers have
been observed from emulator vendors. Some are numbered top-to-bottom then left-to-right, while others
use left-to-right then top-to-bottom, while still others number the pins counter clockwise from pin 1 (as
with an IC). Regardless of the numbering, the signal placement recommended in Figure 53 is common to
all known emulators.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
93
System Design Information
COP_TDO
1
2
NC
COP_TDI
3
4
COP_TRST
NC
5
6
COP_VDD_SENSE
COP_TCK
7
8
COP_CHKSTP_IN
COP_TMS
9
10
NC
COP_SRESET
11
12
NC
COP_HRESET
13
KEY
No pin
COP_CHKSTP_OUT
15
16
GND
Figure 53. COP Connector Physical Pinout
17.8.1 Termination of Unused Signals
If the JTAG interface and COP header will not be used, Freescale recommends the following connections:
• TRST should be tied to HRESET through a 0 kΩ isolation resistor so that it is asserted when the
system reset signal (HRESET) is asserted, ensuring that the JTAG scan chain is initialized during
the power-on reset flow. Freescale recommends that the COP header be designed into the system
as shown in Figure 54. If this is not possible, the isolation resistor will allow future access to TRST
in case a JTAG interface may need to be wired onto the system in future debug situations.
• Tie TCK to OVDD through a 10 kΩ resistor. This will prevent TCK from changing state and
reading incorrect data into the device.
• No connection is required for TDI, TMS, or TDO.
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System Design Information
OVDD
SRESET
From Target
Board Sources
(if any)
HRESET
13
11
10 kΩ
SRESET 6
10 kΩ
HRESET1
COP_HRESET
10 kΩ
COP_SRESET
10 kΩ
5
10 kΩ
10 kΩ
2
3
4
5
6
7
8
9
10
11
12
KEY
13 No
pin
15
6
5
COP Header
1
4
15
COP_TRST
COP_VDD_SENSE2
10 Ω
NC
COP_CHKSTP_OUT
CKSTP_OUT
10 kΩ
14 3
10 kΩ
COP_CHKSTP_IN
CKSTP_IN
8
COP_TMS
16
9
COP Connector
Physical Pinout
TRST1
1
3
TMS
COP_TDO
TDO
COP_TDI
TDI
COP_TCK
7
TCK
2
NC
10
NC
12
4
10 kΩ
16
Notes:
1. The COP port and target board should be able to independently assert HRESET and TRST to the processor
in order to fully control the processor as shown here.
2. Populate this with a 10 Ω resistor for short-circuit/current-limiting protection.
3. The KEY location (pin 14) is not physically present on the COP header.
4. Although pin 12 is defined as a No-Connect, some debug tools may use pin 12 as an additional GND pin for
improved signal integrity.
5. This switch is included as a precaution for BSDL testing. The switch should be open during BSDL testing to avoid
accidentally asserting the TRST line. If BSDL testing is not being performed, this switch should be closed or removed.
6. Asserting SRESET causes a machine check interrupt to the e500 core.
Figure 54. JTAG Interface Connection
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
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Document Revision History
18 Document Revision History
Table 61 provides a revision history for this hardware specification.
Table 61. Document Revision History
Rev. No.
Substantive Change(s)
4
Updated Note in Section 2.1.2, “Power Sequencing.”
Updated back page information.
3.5
Updated Section 2.1.2, “Power Sequencing.”
Replaced Section 17.8, “JTAG Configuration Signals.”
3.4
Corrected MVREF Max Value in Table 1.
Corrected MVREF Max Value in Table 2.
Added new revision level information to Table 62
3.3
Updated MVREF Max Value in Table 1.
Removed Figure 3.
In Table 4, replaced TBD with power numbers and added footnote.
Updated specs and footnotes in Table 8.
Corrected max number for MVREF in Table 13.
Changed parameter “Clock cycle duration” to “Clock period” in Table 29.
Added note 4 to tLBKHOV1 and removed LALE reference from tLBKHOV3 in Table 36 and Table 37.
Updated LALE signal in Figure 18 and Figure 19.
Modified Figure 22.
Modified Figure 54.
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Document Revision History
Table 61. Document Revision History (continued)
Rev. No.
Substantive Change(s)
3.2
Updated Table 1 and Table 2 with 1.0 GHz device parameter requirements.
Added Section 2.1.2, “Power Sequencing”.
Updated Table 4 with Maximum power data.
Updated Table 4 and Table 5 with 1 GHz speed grade information.
Updated Table 6 with corrected typical I/O power numbers.
Updated Table 7 Note 2 lower voltage measurement point.
Replaced Table 7 Note 5 with spread spectrum clocking guidelines.
Added to Table 8 rise and fall time information.
Added Section 4.4, “Real Time Clock Timing”.
Added precharge information to Section 6.2.2, “DDR SDRAM Output AC Timing Specifications”.
Updated Table 20 minimum and maximum baud rates.
Removed VIL and VIH references from Table 23, Table 24, Table 25, and Table 26.
Added reference level note to Table 23, Table 24, Table 25, Table 26, Table 27, Table 28, and Table 29.
Updated TXD references to TCG in Section 8.2.3.1, “TBI Transmit AC Timing Specifications”.
Updated PMA_RX_CLK references to RX_CLK in Section 8.2.3.2, “TBI Receive AC Timing Specifications”.
Updated tTTKHDX value in Table 27.
Updated RXD references to RCG in Section 8.2.3.2, “TBI Receive AC Timing Specifications”.
Updated Table 29 Note 2.
Removed VIL and VIH references from Table 31, and Table 32.
Added reference level note to Table 31, and Table 32.
Corrected Figure 14 and Figure 15.
Corrected Table 34 fMDC and tMDC to reflect the correct minimum operating frequency.
Updated Table 34 tMDKHDV and tMDKHDX values for clarification.
Added tLBKHKT and updated Note 2 in Table 37.
Corrected LGTA timing references in Figure 18.
Updated Figure 19, Figure 21, and Figure 23.
Updated Figure 43.
Clarified Table 53 Note 5.
Updated Table 54 and Table 55 with 1 GHz information.
Added heat sink removal discussion to Section 16.2.3, “Thermal Interface Materials”.
Corrected and added 1 GHz part number to Table 62.
3.1
Updated Table 4 and Table 5.
Added Table 6.
Added MCK duty cycle to Table 16.
Updated fMDC, tMDC, tMDKHDV, and tMDKHDX parameters in Table 34.
Added LALE to tLBKHOV3 parameter in Table 36 and Table 37, and updated Figure 18 and Figure 19.
Corrected active level designations of some of the pins in Table 53.
Updated Table 62.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
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Document Revision History
Table 61. Document Revision History (continued)
Rev. No.
3.0
Substantive Change(s)
Table 1—Corrected MII management voltage reference
Section 2.1.3—New
Table 2—Corrected MII management voltage reference
Table 4—Added VDD power table
Table 5—Added AVDD power table
Table 7—New
Table 8—New
Table 9—New
Table 13—Added overshoot/undershoot note.
Figure 3—New
Table 16—Restated tMCKSKEW1 as tMCKSKEW, removed tMCKSKEW2; added speed-specific minimum values for
333, 266, and 200 MHz; updated tDDSHME values.
Updated chapter to reflect that GMII, MII and TBI can be run with 2.5V signalling.
Table 34—Added MDIO output valid timing
Table 36—Updated tLBIVKH1, tLBIXKH1, and tLBOTOT.
Table 37—New
Table 19, Table 21, Table 23—Updated clock reference
Table 44—Updated tPCIVKH
Section 14.1— Changed minimum height from 2.22 to 3.07 and maximum from 2.76 to 3.75
Table 53.—Updated MII management voltage reference and added note 20.
Section 16.2.4.1—Changed θJC from 0.3 to 0.8; changed die-junction temperature from 67 to 71
Section 17.7—Added paragraph that begins “TSEC1_TXD[3:0]...”
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Document Revision History
Table 61. Document Revision History (continued)
Rev. No.
2.0
Substantive Change(s)
Section 1.1—Updated features list to coincide with latest version of the reference manual
Table 1 and Table 2—Addition of SYSCLK to OVIN
Table 2—Addition of notes 1 and 2
Table 3—Addition of note 1
Table 5—New
Section 4—New
Table 13—Addition of IVREF
Removed Figure 4 DDR SRAM Input TIming Diagram
Table 15—Modified maximum values for tDISKEW
Table 16—Added MSYNC_OUT to tMCKSKEW2
Figure 4—New
Section 6.2.1—Removed Figure 4, “DDR SDRAM Input Timing Diagram”
Section 8.1—Removed references to 2.5 V from first paragraph
Figure 7—New
Table 21 and Table 22—Modified “conditions” for IIH and I IL
Table 23—Addition of min and max for GTX_CLK125 reference clock duty cycle
Table 27 —Addition of min and max for GTX_CLK125 reference clock duty cycle
Table 29—Addition of min and max for GTX_CLK125 reference clock duty cycle
Table 30—VOH min and conditions; IIH and I IL conditions
Table 31—Min and max for tMTXR and tMTXF
Table 32—Min and max for tMRXR and tMRXF
Figure 22 and Figure 23—Changed LSYNC_IN to Internal clock at top of each figure
Figure 17—New
Figure 17—New
Table 36—Removed row for tLBKHOX3
Table 43—New (AC timing of PCI-X at 66 MHz)
Table 53—Addition of note 19
Figure 54—Addition of jumper and note at top of diagram
Table 55: Changed max bus freq for 667 core to 166
Section 16.2.1—Modified first paragraph
Figure 45—Modified
Figure 46—New
Table 59—Modified thermal resistance data
Section 16.2.4.2—Modified first and second paragraphs
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
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Document Revision History
Table 61. Document Revision History (continued)
Rev. No.
Substantive Change(s)
1.2
Section 1.1.1—Updated feature list.
Section 1.2.1.1—Updated notes for Table 1.
Section 1.2.1.2—Removed 5-V PCI interface overshoot and undershoot figure.
Section 1.2.1.3—Added this section to summarize impedance driver settings for various interfaces.
Section 1.4—Updated rows in Reset Initialization timing specifications table. Added a table with DLL and PLL
timing specifications.
Section 1.5.2.2—Updated note 6 of DDR SDRAM Output AC Timing Specifications table.
Section 1.7—Changed the minimum input low current from -600 to -15 μA for the RGMII DC electrical
characteristics.
Section 1.8.2—Changed LCS[3:4] to TSEC1_TXD[6:5] in. Updated notes regarding LCS[3:4].
Section 1.13.2—Updated the mechanical dimensions diagram for the package.
Section 1.13.3—Updated the notes for LBCTL, TRIG_OUT, and ASLEEP. Corrected pin assignments for
IIC_SDA and IIC_SCL. Corrected reserved pin assignment of V11 to U11. V11 is actually PCI_STOP.
Section 1.14.1—Updated the table for frequency options with respect to platform/CCB frequencies.
Section 1.14.4—Edited Frequency options with respect to memory bus speeds.
1.1
Section 1.6.1—Added symbols and note for the GTX_CLK125 timing parameters.
Section 1.11.3—Updated pin list table: LGPL5/LSDAMUX to LGPL5, LA[27:29] and LA[30:31] to LA[27:31],
FEC_TXD[0:3] to FEC_TXD[3:0], FEC_RXD[0:3] to FEC_RXD[3:0], TRST to TRST, added GBE Clocking
section and EC_GTX_CLK125 signal.
Updated thermal model information to match current offering.
1
Original Customer Version.
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Device Nomenclature
19 Device Nomenclature
Ordering information for the parts fully covered by this specification document is provided in
Section 19.1, “Nomenclature of Parts Fully Addressed by this Document.”
19.1 Nomenclature of Parts Fully Addressed by this Document
Table 62 provides the Freescale part numbering nomenclature for the MPC8540. Note that the individual
part numbers correspond to a maximum processor core frequency. For available frequencies, contact your
local Freescale sales office. In addition to the processor frequency, the part numbering scheme also
includes an application modifier which may specify special application conditions. Each part number also
contains a revision code which refers to the die mask revision number.
Table 62. Part Numbering Nomenclature
MPC
nnnn
t
pp
ff(f)
c
r
Product
Code
Part
Identifier
Temperature
Range1
Package 2
Processor
Frequency 3, 4
Platform
Frequency
Revision Level
MPC
8540
Blank = 0 to 105°C
C = –40 to 105°C
PX = FC-PBGA 833 = 833 MHz
VT = FC-PBGA 667 = 667 MHz
(Pb-free)
L = 333 MHz
J = 266 MHz
B = Rev. 2.0
(SVR = 0x80300020)
C = Rev. 2.1
(SVR = 0x80300021)
MPC
8540
Blank = 0 to 105°C
C = –40 to 105°C
PX = FC-PBGA AQ = 1.0 GHz
VT = FC-PBGA
(Pb-free)
F = 333 MHz
B = Rev. 2.0
(SVR = 0x80300020)
C = Rev. 2.1
(SVR = 0x80300021)
Notes:
1.For Temperature Range=C, Processor Frequency is limited to 667 MHz.
2.See Section 14, “Package and Pin Listings,” for more information on available package types.
3.Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this
specification support all core frequencies. The core must be clocked at a minimum frequency of 400MHz. A device must
not be used beyond the core frequency or platform frequency indicated on the device.
4.Designers should use the maximum power value corresponding to the core and platform frequency grades indicated on the
device. A lower maximum power value should not be assumed for design purposes even when running at a lower
frequency.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
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101
Device Nomenclature
19.2 Part Marking
Parts are marked as the example shown in Figure 55.
MPCnnnntppfffcr
MPC85nn
ATWLYYWWA
xPXxxxn
MMMMM
ATWLYYWWA
MMMMM CCCCC
CCCCC
YWWLAZ
85xx
FC-PBGA
Notes:
MMMMM is the 5-digit mask number.
ATWLYYWWA is the traceability code.
CCCCC is the country of assembly. This space is left blank if parts are assembled in the United States.
YWWLAZ is the assembly traceability code.
Figure 55. Part Marking for FC-PBGA Device
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
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Device Nomenclature
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MPC8540 Integrated Processor Hardware Specifications, Rev. 4
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103
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Document Number: MPC8540EC
Rev. 4
12/2006
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