TDK C2012X7R2E223M125AE Multilayer ceramic chip capacitor Datasheet

1 of 3
Creation Date : November 30, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C2012X7R2E223M125AE
TDK item description C2012X7R2E223MT***S
Commercial Grade
Applications
Please refer to Part No. CGA4J3X7R2E223M125AE for Automotive use.
Feature
Mid Mid Voltage (100 to 630V)
Soft Soft Termination
Series
C2012 [EIA 0805]
Status
Production
Size
Length(L)
2.00mm +0.45,-0.20mm
Width(W)
1.25mm +0.25,-0.20mm
Thickness(T)
1.25mm +0.25,-0.20mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
0.50mm Min.
1.00mm to 1.30mm(Flow Soldering)
Recommended Land Pattern (PA)
0.90mm to 1.20mm(Reflow Soldering)
1.00mm to 1.20mm(Flow Soldering)
Recommended Land Pattern (PB)
0.70mm to 0.90mm(Reflow Soldering)
0.80mm to 1.10mm(Flow Soldering)
Recommended Land Pattern (PC)
0.90mm to 1.20mm(Reflow Soldering)
Electrical Characteristics
Capacitance
22nF ±20%
Rated Voltage
250VDC
Temperature Characteristic
X7R(±15%)
Dissipation Factor (Max.)
3%
Insulation Resistance (Min.)
10000MΩ
Other
Soldering Method
Wave (Flow)
Reflow
AEC-Q200
No
Packing
Blister (Plastic)Taping [180mm Reel]
Package Quantity
2000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
2 of 3
Creation Date : November 30, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C2012X7R2E223M125AE
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
C2012X7R2E223M125AE
ESR
C2012X7R2E223M125AE
Capacitance
C2012X7R2E223M125AE
C2012X7R2E223M125AE
Temperature Characteristic
C2012X7R2E223M125AE(No Bias)
DC Bias Characteristic
C2012X7R2E223M125AE(DC Bias =
125V)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
Ripple Temperature Rising
C2012X7R2E223M125AE(100kHz)
C2012X7R2E223M125AE(500kHz)
C2012X7R2E223M125AE(1MHz)
Multilayer Ceramic Chip Capacitors
C2012X7R2E223M125AE
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
3 of 3
Creation Date : November 30, 2017 (GMT)
Similar pages