NL17SZ07 Single Non-Inverting Buffer with Open Drain Output The NL17SZ07 is a high performance single non−inverting buffer with open drain outputs operating from a 1.65 to 5.5 V supply. The Output stage is open drain with Over Voltage Tolerance. This allows the NL17SZ07 to be used to interface 5.0 V circuits to circuits of any voltage between 0 and +7.0 V. www.onsemi.com MARKING DIAGRAMS Features • • • • • • Tiny SOT−353, SOT−553 and SOT−953 Packages Extremely High Speed: tPD 2.5 ns (typical) at VCC = 5 V Designed for 1.65 V to 5.5 V VCC Operation, CMOS Compatible Over Voltage Tolerant Inputs VIN may be Between 0 and 7.0 V for VCC Between 0.5 and 5.5 V TTL Compatible − Interface Capability with 5.0 V TTL Logic with VCC = 2.7 V to 3.6 V LVCMOS Compatible 24 mA Output Sink Capability, Pullup may be between 0 and 7.0 V Near Zero Static Supply Current Substantially Reduces System Power Requirements Chip Complexity: FET = 20 These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant VCC NC 5 1 IN A VCC IN A 5 1 OVT 2 OUT Y 3 SC−88A / SOT−353 / SC−70 DF SUFFIX CASE 419A L7 M G G SOT−553 XV5 SUFFIX CASE 463B L7 M G = Device Code = Date Code* = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. GND 2 GND L7 M G G M • • • • SOT−953 CASE 527AE NC 4 6M 1 OUT Y 3 4 6 M = Specific Device Code = Month Code SOT−953 SOT−353 / SOT−553 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. Figure 1. Pinout 1 IN A OUT Y Figure 2. Logic Symbol © Semiconductor Components Industries, LLC, 2015 December, 2015 − Rev. 16 1 Publication Order Number: NL17SZ07/D NL17SZ07 PIN ASSIGNMENT PIN ASSIGNMENT (SOT−953) (SOT−353 / SOT−553) FUNCTION TABLE Pin Function Input Output Pin Function 1 IN A A Y 1 NC 2 GND L L 2 IN A 3 NC H Z 3 GND 4 OUT Y 4 OUT Y 5 VCC 5 VCC MAXIMUM RATINGS Symbol VCC Characteristics Unit −0.5 to +7.0 V −0.5 ≤ VI ≤ +7.0 V (Note 1) −0.5 to VCC + 0.5 V Active Mode, LOW State (Note 1) Tri−State Mode Power−Down Mode (VCC = 0 V) −0.5 to VCC + 0.5 −0.5 to +7.0 −0.5 to +7.0 DC Supply Voltage VI DC Input Voltage VO DC Output Voltage (SOT−953 Package) DC Output Voltage (SOT−353 / SOT−553 Packages) IOK Value DC Output Diode Current (SOT−953 Package) (SOT−353 / SOT−553 Packages) mA VO < GND, VO > VCC VO < GND ±50 −50 VI < GND IIK DC Input Diode Current −50 mA IO DC Output Sink Current ±50 mA ICC DC Supply Current per Supply Pin ±100 mA IGND DC Ground Current per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C PD Power Dissipation in Still Air SOT−353 SOT−553 186 135 mW qJA Thermal Resistance SOT−353 SOT−553 350 496 °C/W TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias +150 °C ±100 mA ILatch−Up Latch−Up Performance MSL Moisture Sensitivity FR Flammability Rating ESD ESD Classification Above VCC and Below GND at 85°C (Note 5) Level 1 Oxygen Index: 28 to 34 Human Body Model (Note 3) Machine Model (Note 4) Charged Device Model (Note 5) UL 94 V−0 @ 0.125 in 2000 200 N/A V V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed. 2. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B. 3. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA/JESD78. www.onsemi.com 2 NL17SZ07 RECOMMENDED OPERATING CONDITIONS Symbol VCC Parameter Supply Voltage Operating Data Retention Only Min Max Unit 1.65 1.5 5.5 5.5 V VI Input Voltage 0 5.5 V VO Output Voltage (SOT−953 Package) 0 VCC V 0 0 0 VCC 5.5 5.5 −55 +125 °C 0 0 0 20 10 5 ns/V Output Voltage (SOT−353 / SOT−553 Packages) TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate Active Mode, LOW State Tri−State Mode Power−Down Mode (VCC = 0 V) VCC = 2.5 V ±0.2 V VCC = 3.0 V ±0.3 V VCC = 5.0 V ±0.5 V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. DC ELECTRICAL CHARACTERISTICS Min 0.75 VCC 0.7 VCC Typ Max Min Max Symbol Parameter VIH High−Level Input Voltage 1.65 to 1.95 2.3 to 5.5 VIL Low−Level Input Voltage 1.65 to 1.95 2.3 to 5.5 0.25 VCC 0.3 VCC 0.25 VCC 0.3 VCC V ILKG Z−State Output Leakage Current VIN = VIH VOUT = VCC or GND 2.3 to 5.5 ±5.0 ±10.0 mA VOL Low−Level Output Voltage VIN = VIL IOL = 100 mA 1.65 to 5.5 0.0 0.1 0.1 V IOL = 4 mA 1.65 0.08 0.24 0.24 IOL = 8 mA 2.3 0.20 0.3 0.3 IOL = 12 mA 2.7 0.22 0.4 0.4 IOL = 16 mA 3.0 0.28 0.4 0.4 IOL = 24 mA 3.0 0.38 0.55 0.55 IOL = 32 mA 4.5 0.42 0.55 0.55 VIN = 5.5 V or GND 0 to 5.5 ±0.1 ±1.0 mA IIN Input Leakage Current Condition −55°C ≤TA ≤ 125°C TA = 25°C VCC (V) 0.75 VCC 0.7 VCC Unit V IOFF Power Off Leakage Current (SOT−353/ SOT−553 Packages) VIN = 5.5 V or VOUT = 5.5 V 0 1 10 mA ICC Quiescent Supply Current VIN = 5.5 V or GND 5.5 1 10 mA ICCT Quiescent Supply Current VIN = 3.0 V 3.6 10 100 mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 3 NL17SZ07 AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W −55°C ≤TA ≤ 125°C TA = 25°C Symbol tPZL tPLZ Condition VCC (V) Min Typ Max Min Max Unit RL = R1= 500 W, CL = 50 pF 1.8 ± 0.15 0.8 5.3 11.6 0.8 12.0 ns 2.5 ± 0.2 1.2 3.7 5.8 1.2 6.4 3.3 ± 0.3 0.8 2.9 4.4 0.8 4.8 5.0 ± 0.5 0.5 2.3 3.5 0.5 3.9 1.8 ± 0.15 0.8 5.3 11.6 0.8 1.20 2.5 ± 0.2 1.2 2.8 5.8 1.2 6.4 3.3 ± 0.3 0.8 2.1 4.4 0.8 4.8 5.0 ± 0.5 0.5 1.4 3.5 0.5 3.9 Parameter Propagation Delay (Figure 3 and 4) Propagation Delay (Figure 3 and 4) RL = R1= 500 W, CL = 50 pF ns CAPACITIVE CHARACTERISTICS Symbol Condition Typical Unit Input Capacitance VCC = 5.5 V, VI = 0 V or VCC u2.5 pF COUT Output Capacitance VCC = 5.5 V, VI = 0 V or VCC 4.0 pF CPD Power Dissipation Capacitance (Note 6) 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 4.0 pF CIN Parameter 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin ) ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin ) ICC VCC. VCC A 50% GND tPZL Y tPLZ 50% VCC HIGH IMPEDANCE VOL )0.3 V Figure 3. Switching Waveforms VCC R1 PULSE GENERATOR DUT RT CL RT = ZOUT of pulse generator (typically 50 Ω) Figure 4. Test Circuit www.onsemi.com 4 RL VCC 2 NL17SZ07 DEVICE ORDERING INFORMATION Package Shipping† NL17SZ07DFT2G SOT−353/SC70−5/SC−88A (Pb−Free) 3000 / Tape & Reel NL17SZ07XV5T2G SOT−553 (Pb−Free) 4000 / Tape & Reel NL17SZ07P5T5G SOT−953 (Pb−Free) 8000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 5 NL17SZ07 PACKAGE DIMENSIONS SC−88A (SC−70−5/SOT−353) CASE 419A−02 ISSUE L A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. G 5 4 −B− S 1 2 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) M B M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 J C K H SOLDER FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 6 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 NL17SZ07 PACKAGE DIMENSIONS SOT−553 XV5 SUFFIX CASE 463B ISSUE C D −X− 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. A L 4 1 2 E −Y− 3 b e HE c 5 PL 0.08 (0.003) DIM A b c D E e L HE M X Y MILLIMETERS NOM MAX 0.55 0.60 0.22 0.27 0.13 0.18 1.60 1.65 1.20 1.25 0.50 BSC 0.10 0.20 0.30 1.55 1.60 1.65 MIN 0.50 0.17 0.08 1.55 1.15 SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.35 0.0531 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 7 INCHES NOM 0.022 0.009 0.005 0.063 0.047 0.020 BSC 0.004 0.008 0.061 0.063 MIN 0.020 0.007 0.003 0.061 0.045 MAX 0.024 0.011 0.007 0.065 0.049 0.012 0.065 NL17SZ07 PACKAGE DIMENSIONS SOT−953 CASE 527AE ISSUE E X D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF THE BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. A Y 5 4 PIN ONE INDICATOR HE E 1 2 3 DIM A b C D E e HE L L2 L3 C TOP VIEW SIDE VIEW e L 5X 5X L3 MILLIMETERS MIN NOM MAX 0.34 0.37 0.40 0.10 0.15 0.20 0.07 0.12 0.17 0.95 1.00 1.05 0.75 0.80 0.85 0.35 BSC 0.95 1.00 1.05 0.175 REF 0.05 0.10 0.15 −−− −−− 0.15 SOLDERING FOOTPRINT* 5X 0.35 5X 0.20 5X L2 5X BOTTOM VIEW b PACKAGE OUTLINE 0.08 X Y 1.20 1 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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