ON MC14503B Hex non-inverting 3-state buffer Datasheet

MC14503B
Hex Non-Inverting 3-State
Buffer
The MC14503B is a hex non−inverting buffer with 3−state outputs,
and a high current source and sink capability. The 3−state outputs
make it useful in common bussing applications. Two disable controls
are provided. A high level on the Disable A input causes the outputs of
buffers 1 through 4 to go into a high impedance state and a high level
on the Disable B input causes the outputs of buffers 5 and 6 to go into a
high impedance state.
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MARKING
DIAGRAMS
Features
PDIP−16
P SUFFIX
CASE 648
• 3−State Outputs
• TTL Compatible — Will Drive One TTL Load Over Full
•
•
•
•
Temperature Range
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Two Disable Controls for Added Versatility
Pin for Pin Replacement for MM80C97 and 340097
These Devices are Pb−Free and are RoHS Compliant
1
Symbol
Value
Unit
VDD
−0.5 to +18.0
V
Vin, Vout
−0.5 to VDD
+ 0.5
V
Input Current (DC or Transient) per Pin
Iin
± 10
mA
Output Current (DC or Transient) per Pin
Iout
± 25
mA
Power Dissipation, per Package (Note 2)
PD
500
mW
Ambient Temperature Range
TA
−55 to +125
°C
−65 to +150
°C
260
°C
DC Supply Voltage Range
Input or Output Voltage Range
(DC or Transient)
Storage Temperature Range
Lead Temperature (8−Second Soldering)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Maximum Ratings are those values beyond which damage to the device may
occur.
2. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high−impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS v (Vin or Vout) v VDD.
Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either VSS or VDD). Unused outputs must be left open.
© Semiconductor Components Industries, LLC, 2011
June, 2011 − Rev. 8
MC14503BCP
AWLYYWWG
1
1
SOIC−16
D SUFFIX
CASE 751B
MAXIMUM RATINGS (Voltages Referenced to VSS) (Note 1)
Parameter
16
1
SOEIAJ−16
F SUFFIX
CASE 966
1
A
WL, L
YY, Y
WW, W
G
16
14503BG
AWLYWW
1
16
MC14503B
ALYWG
1
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Publication Order Number:
MC14503B/D
MC14503B
PIN ASSIGNMENT
TRUTH TABLE
DIS A
1
16
VDD
IN 1
2
15
DIS B
OUT 1
3
14
IN 6
IN 2
4
13
OUT 6
OUT 2
5
12
IN 5
IN 3
6
11
OUT 5
OUT 3
7
10
IN 4
VSS
8
9
Inn
Appropriate
Disable
Input
Outn
0
0
0
1
0
1
X
1
High
Impedance
X = Don’t Care
OUT 4
LOGIC DIAGRAM
DISABLE B
IN 5
IN 6
IN 1
IN 2
IN 3
IN 4
DISABLE A
CIRCUIT DIAGRAM
15
ONE OF TWO/FOUR BUFFERS
12
11
14
13
2
3
4
5
6
7
10
9
1
VDD
OUT 5
OUT 6
OUT 1
*INn
OUTn
OUT 2
OUT 3
OUT 4
*DISABLE
*INPUT
VSS
TO OTHER BUFFERS
VDD = PIN 16
VSS = PIN 8
*Diode protection on all inputs (not shown)
ORDERING INFORMATION
Package
Shipping†
MC14503BCPG
PDIP−16
(Pb−Free)
500 / Rail
MC14503BDG
SOIC−16
(Pb−Free)
48 / Rail
MC14503BDR2G
SOIC−16
(Pb−Free)
2500 / Tape & Reel
SOEIAJ−16
(Pb−Free)
2000 / Tape & Reel
Device
MC14503BFELG
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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2
MC14503B
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ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
− 55_C
25_C
VDD
125_C
Symbol
Vdc
Min
Max
Min
Typ
(Note 3)
VOL
5.0
10
15
−
−
−
0.05
0.05
0.05
−
−
−
0
0
0
0.05
0.05
0.05
−
−
−
0.05
0.05
0.05
Vdc
VOH
5.0
10
15
4.95
9.95
14.95
−
−
−
4.95
9.95
14.95
5.0
10
15
−
−
−
4.95
9.95
14.95
−
−
−
Vdc
5.0
10
15
−
−
−
1.5
3.0
4.0
−
−
−
2.25
4.50
6.75
1.5
3.0
4.0
−
−
−
1.5
3.0
4.0
5.0
10
15
3.5
7.0
11
−
−
−
3.5
7.0
11
2.75
5.50
8.25
−
−
−
3.5
7.0
11
−
−
−
4.5
5.0
5.0
10
15
– 4.3
– 5.8
– 1.2
– 3.1
– 8.2
−
−
−
−
−
– 3.6
– 4.8
– 1.02
– 2.6
– 6.8
– 5.0
– 6.1
– 1.4
– 3.7
– 14.1
−
−
−
−
−
– 2.5
– 3.0
– 0.7
– 1.8
– 4.8
−
−
−
−
−
IOL
4.5
5.0
10
15
2.2
2.6
6.5
19.2
−
−
−
−
1.8
2.1
5.5
16.1
2.1
2.3
6.2
25
−
−
−
−
1.2
1.3
3.8
11.2
−
−
−
−
mAdc
Input Current
Iin
15
−
± 0.1
−
± 0.00001
± 0.1
−
± 1.0
mAdc
Input Capacitance, (Vin = 0)
Cin
−
−
−
−
5.0
7.5
−
−
pF
Quiescent Current, (Per Package)
IQ
5.0
10
15
−
−
−
1.0
2.0
4.0
−
−
−
0.002
0.004
0.006
1.0
2.0
4.0
−
−
−
30
60
120
mAdc
Total Supply Current (Note 4, 5)
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs)
(All outputs switching,
50% Duty Cycle)
IT
5.0
10
15
3−State Output Leakage Current
ITL
15
Characteristic
Output Voltage
Vin = 0
Vin = VDD
Input Voltage
(VO = 3.6 or 1.4 Vdc)
(VO = 7.2 or 2.8 Vdc)
(VO = 11.5 or 3.5 Vdc)
(VO = 1.4 or 3.6 Vdc)
(VO = 2.8 or 7.2 Vdc)
(VO = 3.5 or 11.5 Vdc)
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
(VOL = 0.4 Vdc)
“0” Level
“1” Level
“0” Level
VIL
“1” Level
VIH
Source
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Sink
IOH
Max
Min
Max
Unit
IT = (2.5 mA/kHz) f + IDD
IT = (6.0 mA/kHz) f + IDD
IT = (10 mA/kHz) f + IDD
−
± 0.1
−
± 0.0001
± 0.1
Vdc
Vdc
mAdc
mAdc
−
± 3.0
mAdc
3. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
4. The formulas given are for the typical characteristics only at 25_C.
5. To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + (CL – 50) Vfk where: IT is in mA (per package), CL in pF,
V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.006.
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3
MC14503B
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SWITCHING CHARACTERISTICS (Note 6) (CL = 50 pF, TA = 25_C)
All Types
Characteristic
Symbol
VDD
VCC
Typ
(Note 7)
Max
5.0
10
15
45
23
18
90
45
35
5.0
10
15
45
23
18
90
45
35
5.0
10
15
75
35
25
150
70
50
5.0
10
15
75
35
25
150
70
50
Unit
Output Rise Time
tTLH = (0.5 ns/pF) CL + 20 ns
tTLH = (0.3 ns/pF) CL + 8.0 ns
tTLH = (0.2 ns/pF) CL + 8.0 ns
tTLH
ns
Output Fall Time
tTHL = (0.5 ns/pF) CL + 20 ns
tTHL = (0.3 ns/pF) CL + 8.0 ns
tTHL = (0.2 ns/pF) CL + 8.0 ns
tTHL
Turn−Off Delay Time, all Outputs
tPLH = (0.3 ns/pF) CL + 60 ns
tPLH = (0.15 ns/pF) CL + 27 ns
tPLH = (0.1 ns/pF) CL + 20 ns
tPLH
Turn−On Delay Time, all Outputs
tPHL = (0.3 ns/pF) CL + 60 ns
tPHL = (0.15 ns/pF) CL + 27 ns
tPHL = (0.1 ns/pF) CL + 20 ns
tPHL
3−State Propagation Delay Time
Output “1” to High Impedance
tPHZ
5.0
10
15
75
40
35
150
80
70
ns
Output “0” to High Impedance
tPLZ
5.0
10
15
80
40
35
160
80
70
ns
High Impedance to “1” Level
tPZH
5.0
10
15
65
25
20
130
50
40
ns
High Impedance to “0” Level
tPZL
5.0
10
15
100
35
25
200
70
50
ns
ns
ns
ns
6. The formulas given are for the typical characteristics only at 25_C.
7. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
DISABLE
INPUT
20 ns
20 ns
VDD
90%
VDD
16
50%
INPUT
INPUT
OUTPUT
VSS
90%
OUTPUT
CL
tTLH
tPLH
Figure 1. Switching Time Test Circuit and Waveforms
(tTLH, tTHL, tPHL, and tPLH)
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4
VSS
tPHL
tPLH
PULSE
GENERATOR
10%
VOH
50%
10%
VOL
tTHL
tPHL
MC14503B
DISABLE INPUT
DISABLE INPUT
PULSE
GENERATOR
VDD
tPHZ, tPZH CIRCUIT
tPLZ, tPZL CIRCUIT
PULSE
GENERATOR
VDD
16
16
INPUT
OUTPUT
1k
8
VSS
INPUT
CL
OUTPUT
8
20 ns
VSS
20 ns
VDD
90%
50%
DISABLE INPUT
1k
10%
tPZL
tPLZ
VOH
90%
10%
OUTPUT FOR tPZH, tPZL CIRCUIT
VSS
≈ VOL + 0.05 V
tPHZ
tPZH
OUTPUT FOR tPHZ, tPLZ CIRCUIT
≈ VOH - 0.15 V
90%
10%
Figure 2. 3−State AC Test Circuit and Waveforms
(tPLZ, tPHZ, tPZH, tPZL)
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5
VOL
CL
MC14503B
PACKAGE DIMENSIONS
PDIP−16
CASE 648−08
ISSUE T
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
−A−
16
9
1
8
B
F
C
L
DIM
A
B
C
D
F
G
H
J
K
L
M
S
S
−T−
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
T A
M
INCHES
MIN
MAX
0.740 0.770
0.250 0.270
0.145 0.175
0.015 0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008 0.015
0.110 0.130
0.295 0.305
0_
10 _
0.020 0.040
MILLIMETERS
MIN
MAX
18.80 19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
SOEIAJ−16
CASE 966−01
ISSUE A
16
LE
9
Q1
E HE
1
M_
L
8
Z
DETAIL P
D
e
VIEW P
A
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
A1
b
0.13 (0.005)
c
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
0.10 (0.004)
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6
MILLIMETERS
MIN
MAX
--2.05
0.05
0.20
0.35
0.50
0.10
0.20
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
--0.78
INCHES
MIN
MAX
--0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
--0.031
MC14503B
PACKAGE DIMENSIONS
SOIC−16
CASE 751B−05
ISSUE K
−A−
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
9
−B−
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
−T−
SEATING
PLANE
J
M
D
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
16 PL
0.25 (0.010)
M
T B
S
A
S
SOLDERING FOOTPRINT
8X
6.40
16X
1
1.12
16
16X
0.58
1.27
PITCH
8
9
DIMENSIONS: MILLIMETERS
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MC14503B/D