Order Now Product Folder Support & Community Tools & Software Technical Documents ADS1287 SBAS866 – JUNE 2017 ADS1287 Low-Power, 1000-SPS, Wide-Bandwidth, Analog-to-Digital Converter With Programmable Gain Amplifier 1 Features 3 Description • • The ADS1287 device is a low-power, analog-to-digital converter (ADC), with an integrated programmable gain amplifier (PGA) and finite-impulse-response (FIR) digital filter. The ADC is suitable for the demanding needs of seismic equipment requiring precision digitizing with low power consumption. 1 • • • • • • • • • • • Selectable Operating Modes High-Resolution Mode: – SNR: 113 dB (1000 SPS, Gain = 1) – Power: 4.5 mW Low-Power Mode: – SNR: 110 dB (1000 SPS, Gain = 1) – Power: 2.4 mW THD: –115 dB CMRR: 115 dB High-Impedance CMOS PGA – Gains 1, 2, 4, 8, and 16 Data Rates: 62.5 SPS to 1000 SPS Flexible Digital Filter: – Sinc + FIR + IIR (Selectable) – Linear and Minimum Phase Response – Programmable High-Pass Filter Offset and Gain Calibration Synchronization Control SPI-Compatible Interface Analog Power Supply: 5 V or ±2.5 V Digital Power Supply: 2.5 V to 3.3 V The ADC features a programmable-gain, highimpedance complementary metal oxide semiconductor (CMOS) amplifier, suitable for direct connection of geophone and hydrophone sensors to the ADC over a wide range of input signals (±2.5 V to ±0.156 V). The ADC incorporates a fourth-order, inherently stable, delta-sigma (ΔΣ) modulator. The modulator digital output is filtered and decimated by the internal FIR digital filter to yield the ADC conversion result. The FIR digital filter provides data rates up to 1000 samples per second (SPS). The high-pass filter (HPF) removes DC and low frequency components from the conversion result. On-chip gain and offset scaling registers support system calibration. Together, the amplifier, modulator, and digital filter dissipate 4.5 mW in high-resolution mode (2.4 mW in low-power mode). The ADC is packaged in a compact 5-mm × 4-mm VQFN package. The ADC is fully specified over the –40°C to +85°C temperature range. 2 Applications • • • Energy Exploration Passive Seismic Monitoring Portable Instrumentation Device Information(1) PART NUMBER ADS1287 PACKAGE VQFN (24) BODY SIZE (NOM) 5.00 mm × 4.00 mm (1) For all available packages, see the package option addendum at the end of the data sheet. SPACE Functional Block Diagram AVDD REFP REFN CLK SYNC RESET DVDD ADS1287 PWDN Control MUX AINP AINN PGA û ADC Digital Filter DRDY Serial Interface VCOM AVSS CS DIN DOUT SCLK DGND Copyright © 2017, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. ADS1287 SBAS866 – JUNE 2017 www.ti.com 4 Device and Documentation Support 4.1 Trademarks 4.2 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 4.3 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 5 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 2 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: ADS1287 PACKAGE OPTION ADDENDUM www.ti.com 7-Jul-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) ADS1287IRHFR ACTIVE VQFN RHF 24 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 ADS1287 ADS1287IRHFT ACTIVE VQFN RHF 24 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 ADS1287 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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