Material Content Data Sheet Sales Product Name IPD50R399CP Issued MA# MA001145778 Package PG-TO252-3-313 29. August 2013 Weight* 319.90 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal inorganic material non noble metal noble metal non noble metal non noble metal non noble metal inorganic material non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin phosphorus nickel silver tin lead iron phosphorus copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7723-14-0 7440-02-0 7440-22-4 7440-31-5 7439-92-1 7439-89-6 7723-14-0 7440-50-8 4.846 1.51 0.147 0.05 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.51 15148 15148 460 0.044 0.01 147.096 46.00 46.06 459812 138 460410 0.534 0.17 0.17 1669 1669 1.390 0.43 4344 24.322 7.60 113.270 35.41 43.44 354075 76028 434447 3.740 1.17 1.17 11691 11691 0.003 0.00 1.421 0.44 0.097 0.03 0.078 0.02 3.714 1.16 0.019 0.01 0.006 0.00 19.177 5.99 11 0.44 4440 243 1.21 11611 2. 3. 18 6.00 59948 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 12158 60 Important Remarks: 1. 4451 304 60026 1000000