HP HSMP-381C-TR1 Surface mount pin diodes in sot-323 (sc-70 3-lead) Datasheet

Surface Mount PIN Diodes
in SOT-323 (SC-70 3-Lead)
Technical Data
HSMP-381B/C/E/F
HSMP-386B/C/E/F
HSMP-389B/C/E/F
HSMP-481B, -482B, -489B
Features
• Diodes Optimized for:
Low Current Switching
Low Distortion Attenuating
Ultra-Low Distortion Switching
Microwave Frequency
Operation
• Surface Mount SOT-323
(SC-70)Package
Single and Pair Versions
Tape and Reel Options
Available
• Low Failure in Time (FIT)
Rate*
* For more information see the
Surface Mount PIN Reliability
Data Sheet.
Package Lead Code
Identification
(Top View)
SERIES
SINGLE
B
C
COMMON
ANODE
COMMON
CATHODE
E
F
DUAL ANODE
DUAL CATHODE
482B / 489B
481B
Absolute Maximum Ratings [1], TC = + 25°C
Symbol Parameter
If
Piv
TJ
TSTG
θjc
Unit Absolute Maximum
Forward Current (1 µs Pulse) Amp
Peak Inverse Voltage
V
Junction Temperature
°C
Storage Temperature
°C
[2]
Thermal Resistance
°C/W
1
Same as VBR
150
-65 to 150
300
Notes:
1. Operation in excess of any one of these conditions may result in
permanent damage to the device.
2. TC = 25°C, where TC is defined to be the temperature at the package
pins where contact is made to the circuit board.
Description/Applications
The HSMP-381B/C/E/F series is
specifically designed for low
distortion attenuator applications.
The HSMP-386B/C/E/F series is a
general purpose PIN diode
designed for low current attenuators and low cost switches. The
HSMP-389B/C/E/ F series is
optimized for switching applications where low resistance at low
current, and low capacitance are
required.
The HSMP-48XB series is special
products featuring ultra low
parasitic inductance in the SOT323 package, specifically designed
for use at frequencies which are
much higher than the upper limit
for conventional SOT-323 PIN
diodes. The HSMP-481B diode is a
low distortion attenuating PIN
designed for operation to 3 GHz.
The HSMP-482B diode is ideal for
limiting and low inductance
switching applications up to
1.5 GHz. The HSMP-489B is
optimized for low current switching applications up to 3 GHz.
2
Electrical Specifications, TC = +25°C, each diode
PIN Attenuator Diodes
Part Package
Number Marking Lead
HSMP- Code[1] Code Configuration
381B
381C
381E
381F
E0
E2
E3
E4
B
C
E
F
Single
Series
Common Anode
Common Cathode
Test Conditions
Minimum Maximum Maximum Minimum Maximum
Breakdown
Total
Total
High
Low
Voltage Resistance Capacitance Resistance Resistance
VBR (V)
RT (Ω)
CT (pF)
RH (Ω)
RL (Ω)
100
3.0
0.35
1500
VR = VBR
Measure
IR ≤ 10 µA
IF = 100 mA
f = 100 MHz
VR = 50 V
f = 1 MHz
10
IR = 0.01 mA IF = 20 mA
f = 100 MHz f = 100 MHz
PIN General Purpose Diodes
Part
Number
HSMP-
Package
Marking
Code[1]
Lead
Code
Configuration
386B
386C
386E
386F
L0
L2
L3
L4
B
C
E
F
Single
Series
Common Anode
Common Cathode
Test Conditions
Minimum
Breakdown
Voltage
VBR (V)
50
Typical
Total
Resistance
RT (Ω)
3.0
1.5*
Typical
Total
Capacitance
CT (pF)
0.20
VR = VBR
Measure
IR ≤ 10 µA
IF = 10 mA
f = 100 MHz
IF = 100 mA*
VR = 50 V
f = 1 MHz
Minimum
Breakdown
Voltage
VBR (V)
Maximum
Total
Resistance
RT (Ω)
Maximum
Total
Capacitance
CT (pF)
100
2.5
0.30
VR = VBR
Measure
IR ≤ 10 µA
IF = 5 mA
f = 100 MHz
VR = 5 V
f = 1 MHz
PIN Switching Diodes
Part
Number
HSMP-
Package
Marking
Code[1]
389B
G0
389C
G2
389E
G3
389F
G4
Test Conditions
Lead
Code
Configuration
B
C
E
F
Single
Series
Common Anode
Common Cathode
3
Electrical Specifications, TC = +25°C, each diode, continued
Typical Parameters
Part Number
HSMP-
Total Resistance Carrier Lifetime
RT (Ω)
τ (ns)
Reverse Recovery Time
Trr (ns)
Total Capacitance
(pF)
381A Series
386A Series
389A Series
75
22
3.8
1500
500
200*
300
80
—
0.27
0.20
—
Test Conditions
IF = 1 mA
f = 100 MHz
IF = 50 mA
TR = 250 mA
IF = 10 mA*
IR = 6 mA*
VR = 10 V
IF = 20 mA
90% Recovery
50 V
Note:
1. Package marking code is laser marked.
High Frequency (Low Inductance, 500 MHz – 3 GHz PIN Diodes
Part
Number
HSMP481B
482B
489B
Minimum Maximum
Typical
Maximum
Typical
Package
Breakdown Series
Total
Total
Total
Marking
Voltage Resistance Capacitance Capacitance Inductance
Code Configuration VBR (V)
R S (Ω)
C T (pF)
C T (pF)
L T (nH) Application
EB
FA
GA
Test Conditions
Dual Cathode
Dual Anode
Dual Anode
100
50
100
3.0
0.6*
2.5**
0.35
0.75*
0.33**
0.4
1.0
0.375*
1.0
1.0*
1.0
VR = VBR
Measure
IR ≤ 10 µA
IF = 100 mA
IF = 10 mA*
IF = 5 mA**
VR = 50 V
f = 1 MHz
VR = 20 V*
VR = 5 V**
VR = 50 V
f = 1 MHz
VR = 5 V*
f =500 MHz –
3 GHz
VR = 20 V*
Attenuator
Limiter
Switch
4
Typical Performance, TC = 25°C
0.35
0.40
0.35
1 MHz
0.30
30 MHz
0.20
frequency>100 MHz
0
2
4
6
8
1 MHz
0.25
100 MHz
0.20
1 GHz
0
REVERSE VOLTAGE (V)
100
10
4
6
8
10 12 14 16 18 20
1.2
1
HSMP-482B
0.8
0.6
0.4
0
Diode Mounted as a
115 Series Switch in
a 50Ω Microstrip and
110 Tested at 123 MHz
105
HSMP-3880
HSMP-389B/C/E/F
100
95
90
HSMP-386B/C/E/F
1
10
30
IF – FORWARD BIAS CURRENT (mA)
Figure 7. 2nd Harmonic Input
Intercept Point vs. Forward Bias
Current for Switch Diodes.
10
20
30
40
90
80
70
50
40
1000
50
100
10
DIODE RF RESISTANCE (OHMS)
100
Figure 6. 2nd Harmonic Input
Intercept Point vs. Diode RF
Resistance for Attenuator Diodes.
1000
VR = 2V
VR = 5V
10
VR = 10V
1
10
HSMP-381B/C/E/F
60
Figure 5. Capacitance vs. Reverse
Voltage at 1 MHz.
Trr – REVERSE RECOVERY TIME (ns)
120
0
Diode Mounted as a
110 Series Attenuator in
a 50Ω Microstrip and
100 Tested at 123 MHz
VR – REVERSE VOLTAGE (V)
Figure 4. RF Resistance vs. Forward
Bias Current for HSMP-381B/C/E/F
Series and HSMP-481B.
85
Figure 3. Total RF Resistance at
25° C vs. Forward Bias Current.
120
HSMP-381B/C/E/F
HSMP-386B/C/E/F
HSMP-389B/C/E/F
0.2
1.0
0.01
0.1
1
10
100
IF – FORWARD BIAS CURRENT (mA)
INPUT INTERCEPT POINT (dBm)
2
0.1
0.01
0.1
1
10
100
IF – FORWARD BIAS CURRENT (mA)
Figure 2. RF Capacitance vs. Reverse
Bias, HSMP-386B/C/E/F Series.
CT – CAPACITANCE (pF)
TOTAL RF RESISTANCE (OHMS)
1000
HSMP-482B
1
1.4
TA = +85°C
TA = +25°C
TA = –55°C
HSMP386B/C/E/F
10
REVERSE VOLTAGE (V)
Figure 1. RF Capacitance vs. Reverse
Bias, HSMP-381B/C/E/F Series.
10000
100
HSMP-389B/C/E/F, -489B
0.15
10 12 14 16 18 20
1000
INPUT INTERCEPT POINT (dBm)
0.15
HSMP-381B/C/E/F, -481B
0.30
20
30
FORWARD CURRENT (mA)
Figure 8. Reverse Recovery Time vs.
Forward Current for Various Reverse
Voltages. HSMP-482B.
Trr - REVERSE RECOVERY TIME (nS)
0.25
10000
RF RESISTANCE (OHMS)
TOTAL CAPACITANCE (pF)
TOTAL CAPACITANCE (pF)
0.45
VR = 5V
VR = 10V
100
VR = 20V
10
10
20
30
FORWARD CURRENT (mA)
Figure 9. Reverse Recovery Time vs.
Forward Current for Various Reverse
Voltages. HSMP-386B/C/E/F Series.
5
200
100
160
VR = –2V
120
80
VR = –5V
40
VR = –10V
0
10
15
20
25
10
1
0.1
0.01
30
100
IF – FORWARD CURRENT (mA)
IF – FORWARD CURRENT (mA)
Trr – REVERSE RECOVERY TIME (nS)
Typical Performance, TC = 25°C
125°C
0
FORWARD CURRENT (mA)
25°C –50°C
0.6
0.8
1.0
1.2
IF – FORWARD CURRENT (mA)
100
10
1
0.1
125°C
0
0.2
0.4
25°C –50°C
0.6
0.8
1.0
1.2
VF – FORWARD VOLTAGE (V)
Figure 13. Forward Current vs.
Forward Voltage. HSMP-386B/C/E/F
Series.
10
1
0.1
0.01
125°C 25°C –50°C
0
0.2
0.4
0.6
0.8
1.0
1
0.1
125°C 25°C –50°C
0.01
0
0.2
0.4
0.6
0.8
1.0
VF – FORWARD VOLTAGE (mA)
Figure 11. Forward Current vs.
Forward Voltage. HSMP-381B/C/E/F
Series and HSMP-481B.
100
IF – FORWARD CURRENT (mA)
0.4
VF – FORWARD VOLTAGE (mA)
Figure 10. Typical Reverse Recovery
Time vs. Reverse Voltage.
HSMP-389B/C/E/F Series.
0.01
0.2
10
1.2
VF – FORWARD VOLTAGE (V)
Figure 14. Forward Current vs.
Forward Voltage. HSMP-389B/C/E/F
Series and HSMP-489B.
Figure 12. Forward Current vs.
Forward Voltage. HSMP-482B.
1.2
6
Typical Applications for Multiple Diode Products
RF COMMON
RF COMMON
RF 1
RF 2
RF 2
RF 1
BIAS 2
BIAS 1
Figure 15. Simple SPDT Switch, Using Only Positive
Bias Current.
BIAS
BIAS
Figure 16. High Isolation SPDT Switch.
RF COMMON
RF COMMON
BIAS
RF 1
RF 2
RF 2
RF 1
BIAS
Figure 17. SPDT Switch Using Both Positive and
Negative Bias Current.
Figure 18. Very High Isolation SPDT Switch.
7
Typical Applications for Multiple Diode Products (continued)
VARIABLE BIAS
RF IN/OUT
INPUT
FIXED
BIAS
VOLTAGE
Figure 19. Four Diode π Attenuator.
BIAS
Figure 20. High Isolation SPST Switch
(Repeat Cells as Required).
8
Typical Applications for HSMP-48XX Low Inductance Series
3
3
Microstrip Series
Connection for
HSMP-48XB Series
In order to take full advantage of
the low inductance of the
HSMP-48XB series when using
them in series applications, both
lead 1 and lead 2 should be
connected together, as shown in
Figure 21.
1
2
1
HSMP-481B
2
HSMP-489B
Figure 21. Internal Connections.
Figure 22. Circuit Layout.
Microstrip Shunt
Connections for
HSMP-48XB Series
In Figure 23, the center conductor
of the microstrip line is interrupted and leads 1 and 2 of the
HSMP-48XB series diode are
placed across the resulting gap.
This forces the 0.5 nH lead inductance of leads 1 and 2 to appear as
part of a low pass filter, reducing
the shunt parasitic inductance and
increasing the maximum available
attenuation. The 0.3 nH of shunt
inductance external to the diode is
created by the via holes, and is a
good estimate for 0.032" thick
material.
50 OHM MICROSTRIP LINES
PAD CONNECTED TO
GROUND BY TWO
VIA HOLES
Figure 23. Circuit Layout.
1.5 nH
1.5 nH
0.3 pF*
0.3 nH
0.3 nH
*0.8 pF TYPICAL FOR HSMP-482B
Figure 24. Equivalent Circuit.
9
Typical Applications for HSMP-48XX Low Inductance Series (continued)
Co-Planar Waveguide
Shunt Connection for
HSMP-48XB Series
Co-Planar waveguide, with ground
on the top side of the printed
circuit board, is shown in
Figure 25. Since it eliminates the
need for via holes to ground, it
offers lower shunt parasitic
inductance and higher maximum
attenuation when compared to a
microstrip circuit.
Co-Planar Waveguide
Groundplane
Center Conductor
Groundplane
Figure 25. Circuit Layout.
0.3 pF*
0.75 nH
*0.8 pF TYPICAL FOR HSMP-482B
Figure 26. Equivalent Circuit.
10
SOT-323 PCB Footprint
A recommended PCB pad layout
for the miniature SOT-323 (SC-70)
package is shown in Figure 27
(dimensions are in inches). This
layout provides ample allowance
for package placement by automated assembly equipment
without adding parasitics that
could impair performance.
0.026
0.07
0.035
0.016
Figure 27. PCB Pad Layout
(dimensions in inches).
SMT Assembly
Reliable assembly of surface
mount components is a complex
process that involves many
material, process, and equipment
factors, including: method of
heating (e.g., IR or vapor phase
reflow, wave soldering, etc.)
circuit board material, conductor
thickness and pattern, type of
solder alloy, and the thermal
conductivity and thermal mass of
components. Components with a
low mass, such as the SOT-323
package, will reach solder reflow
temperatures faster than those
with a greater mass.
HP’s SOT-323 diodes have been
qualified to the time-temperature
profile shown in Figure 28. This
profile is representative of an IR
reflow type of surface mount
assembly process.
After ramping up from room
temperature, the circuit board
with components attached to it
(held in place with solder paste)
passes through one or more
preheat zones. The preheat zones
increase the temperature of the
board and components to prevent
thermal shock and begin evaporating solvents from the solder paste.
The reflow zone briefly elevates
the temperature sufficiently to
produce a reflow of the solder.
The rates of change of temperature for the ramp-up and cooldown zones are chosen to be low
enough to not cause deformation
of the board or damage to components due to thermal shock. The
maximum temperature in the
reflow zone (TMAX) should not
exceed 235 °C.
These parameters are typical for a
surface mount assembly process
for HP SOT-323 diodes. As a
general guideline, the circuit
board and components should be
exposed only to the minimum
temperatures and times necessary
to achieve a uniform reflow of
solder.
250
TMAX
200
TEMPERATURE (°C)
Assembly Information
150
Reflow
Zone
100
Preheat
Zone
Cool Down
Zone
50
0
0
60
120
180
TIME (seconds)
Figure 28. Surface Mount Assembly Profile.
240
300
11
Device Orientation
REEL
TOP VIEW
END VIEW
4 mm
8 mm
CARRIER
TAPE
USER
FEED
DIRECTION
##
##
##
##
Note: “##” represents Package Marking Code.
COVER TAPE
Tape Dimensions
For Outline SOT-323 (SC-70 3 Lead)
P
P2
D
P0
E
F
W
C
D1
t1 (CARRIER TAPE THICKNESS)
Tt (COVER TAPE THICKNESS)
K0
8° MAX.
A0
DESCRIPTION
5° MAX.
B0
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
A0
B0
K0
P
D1
2.24 ± 0.10
2.34 ± 0.10
1.22 ± 0.10
4.00 ± 0.10
1.00 + 0.25
0.088 ± 0.004
0.092 ± 0.004
0.048 ± 0.004
0.157 ± 0.004
0.039 + 0.010
PERFORATION
DIAMETER
PITCH
POSITION
D
P0
E
1.55 ± 0.05
4.00 ± 0.10
1.75 ± 0.10
0.061 ± 0.002
0.157 ± 0.004
0.069 ± 0.004
CARRIER TAPE
WIDTH
THICKNESS
W
t1
8.00 ± 0.30
0.255 ± 0.013
0.315 ± 0.012
0.010 ± 0.0005
COVER TAPE
WIDTH
TAPE THICKNESS
C
Tt
5.4 ± 0.10
0.062 ± 0.001
0.205 ± 0.004
0.0025 ± 0.00004
DISTANCE
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
3.50 ± 0.05
0.138 ± 0.002
CAVITY TO PERFORATION
(LENGTH DIRECTION)
P2
2.00 ± 0.05
0.079 ± 0.002
Package Dimensions
Outline SOT-323 (SC-70)
1.30 (0.051)
REF.
2.20 (0.087)
2.00 (0.079)
1.35 (0.053)
1.15 (0.045)
0.650 BSC (0.025)
0.425 (0.017)
TYP.
2.20 (0.087)
1.80 (0.071)
0.10 (0.004)
0.00 (0.00)
0.30 REF.
0.25 (0.010)
0.15 (0.006)
1.00 (0.039)
0.80 (0.031)
10°
0.30 (0.012)
0.10 (0.004)
0.20 (0.008)
0.10 (0.004)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
Package Characteristics
Lead Material ........................................................................................ Copper
Lead Finish............................................................................. Tin-Lead 85/15%
Maximum Soldering Temperature ............................... 260°C for 5 seconds
Minimum Lead Strength ........................................................... 2 pounds pull
Typical Package Inductance ................................................................... 2 nH
Typical Package Capacitance .............................. 0.08 pF (opposite leads)
Ordering Information
Specify part number followed by option. For example:
HSMP- 38XA – XXX
www.hp.com/go/rf
Bulk or Tape and Reel Option
For technical assistance or the location of
your nearest Hewlett-Packard sales office,
distributor or representative call:
Part Number
Surface Mount PIN
Hewlett-Packard
Americas/Canada: 1-800-235-0312 or
408-654-8675
Far East/Australasia: Call your local HP
sales office.
Option – BLK = Bulk, 100 pcs. per antistatic bag
Option – TR1 = Tape and Reel, 3000 devices per 7" reel
Japan: (81 3) 3335-8152
Conforms to Electronic Industries RS-481, “Taping of Surface Mounted
Components for Automated Placement.” Standard Quantity is
3,000 Devices per Reel.
Data subject to change.
Copyright © 1998 Hewlett-Packard Co.
Europe: Call your local HP sales office.
Obsoletes 5966-2323E
Printed in U.S.A.
5967-6070E (5/98)
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