PHILIPS LPC2460FBD208 Flashless 16-bit/32-bit micro; ethernet, can, isp/iap, usb 2.0 device/host/otg, external memory interface Datasheet

LPC2460
Flashless 16-bit/32-bit micro; Ethernet, CAN, ISP/IAP, USB 2.0
device/host/OTG, external memory interface
Rev. 02 — 1 February 2008
Preliminary data sheet
1. General description
NXP Semiconductors designed the LPC2460 microcontroller around a 16-bit/32-bit
ARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG and
embedded trace. The LPC2460 is flashless. The LPC2460 can execute both 32-bit ARM
and 16-bit Thumb instructions. Support for the two instruction sets means engineers can
choose to optimize their application for either performance or code size at the sub-routine
level. When the core executes instructions in Thumb state it can reduce code size by more
than 30 % with only a small loss in performance while executing instructions in ARM state
maximizes core performance.
The LPC2460 microcontroller is ideal for multi-purpose communication applications. It
incorporates a 10/100 Ethernet Media Access Controller (MAC), a USB full-speed
Device/Host/OTG Controller with 4 kB of endpoint RAM, four UARTs, two Controller Area
Network (CAN) channels, an SPI interface, two Synchronous Serial Ports (SSP), three I2C
interfaces, and an I2S interface. Supporting this collection of serial communications
interfaces are the following feature components; an on-chip 4 MHz internal precision
oscillator, 98 kB of total RAM consisting of 64 kB of local SRAM, 16 kB SRAM for
Ethernet, 16 kB SRAM for general purpose DMA, 2 kB of battery powered SRAM, and an
External Memory Controller (EMC). These features make this device optimally suited for
communication gateways and protocol converters. Complementing the many serial
communication controllers, versatile clocking capabilities, and memory features are
various 32-bit timers, an improved 10-bit ADC, 10-bit DAC, two PWM units, four external
interrupt pins, and up to 160 fast GPIO lines. The LPC2460 connects 64 of the GPIO pins
to the hardware based Vector Interrupt Controller (VIC) that means these external inputs
can generate edge-triggered interrupts. All of these features make the LPC2460
particularly suitable for industrial control and medical systems.
2. Features
n ARM7TDMI-S processor, running at up to 72 MHz.
n 98 kB on-chip SRAM includes:
u 64 kB of SRAM on the ARM local bus for high performance CPU access.
u 16 kB SRAM for Ethernet interface. Can also be used as general purpose SRAM.
u 16 kB SRAM for general purpose DMA use also accessible by the USB.
u 2 kB SRAM data storage powered from the Real-Time Clock (RTC) power domain.
n Dual Advanced High-performance Bus (AHB) system allows simultaneous Ethernet
DMA, and USB DMA with no contention.
n EMC provides support for asynchronous static memory devices such as RAM, ROM
and flash, as well as dynamic memories such as Single Data Rate SDRAM.
n Advanced Vectored Interrupt Controller (VIC), supporting up to 32 vectored interrupts.
LPC2460
NXP Semiconductors
Fast communication chip
n General Purpose DMA controller (GPDMA) on AHB that can be used with the SSP,
I2S, and SD/MMC interface as well as for memory-to-memory transfers.
n Serial Interfaces:
u Ethernet MAC with MII/RMII interface and associated DMA controller. These
functions reside on an independent AHB.
u USB 2.0 full-speed dual port Device/Host/OTG Controller with on-chip PHY and
associated DMA controller.
u Four UARTs with fractional baud rate generation, one with modem control I/O, one
with IrDA support, all with FIFO.
u CAN controller with two channels.
u SPI controller.
u Two SSP controllers, with FIFO and multi-protocol capabilities. One is an alternate
for the SPI port, sharing its interrupt. SSPs can be used with the GPDMA
controller.
u Three I2C-bus interfaces (one with open-drain and two with standard port pins).
u I2S (Inter-IC Sound) interface for digital audio input or output. It can be used with
the GPDMA.
n Other peripherals:
u SD/MMC memory card interface.
u 160 General purpose I/O pins with configurable pull-up/down resistors.
u 10-bit ADC with input multiplexing among 8 pins.
u 10-bit DAC.
u Four general purpose timers/counters with 8 capture inputs and 10 compare
outputs. Each timer block has an external count input.
u Two PWM/timer blocks with support for three-phase motor control. Each PWM has
an external count inputs.
u RTC with separate power domain, clock source can be the RTC oscillator or the
APB clock.
u 2 kB SRAM powered from the RTC power pin, allowing data to be stored when the
rest of the chip is powered off.
u WatchDog Timer (WDT). The WDT can be clocked from the internal RC oscillator,
the RTC oscillator, or the APB clock.
n Standard ARM test/debug interface for compatibility with existing tools.
n Emulation trace module supports real-time trace.
n Single 3.3 V power supply (3.0 V to 3.6 V).
n Three reduced power modes: idle, sleep, and power-down.
n Four external interrupt inputs configurable as edge/level sensitive. All pins on port 0
and port 2 can be used as edge sensitive interrupt sources.
n Processor wake-up from Power-down mode via any interrupt able to operate during
Power-down mode (includes external interrupts, RTC interrupt, USB activity, Ethernet
wake-up interrupt, CAN bus activity, port 0/2 pin interrupt).
n Two independent power domains allow fine tuning of power consumption based on
needed features.
n Each peripheral has its own clock divider for further power saving. These dividers help
reducing active power by 20 % to 30 %.
n Brownout detect with separate thresholds for interrupt and forced reset.
n On-chip power-on reset.
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
2 of 68
LPC2460
NXP Semiconductors
Fast communication chip
n On-chip crystal oscillator with an operating range of 1 MHz to 24 MHz.
n 4 MHz internal RC oscillator trimmed to 1 % accuracy that can optionally be used as
the system clock. When used as the CPU clock, does not allow CAN and USB to run.
n On-chip PLL allows CPU operation up to the maximum CPU rate without the need for
a high frequency crystal. May be run from the main oscillator, the internal RC
oscillator, or the RTC oscillator.
n Boundary scan for simplified board testing.
n Versatile pin function selections allow more possibilities for using on-chip peripheral
functions.
3. Applications
n
n
n
n
Industrial control
Medical systems
Protocol converter
Communications
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
LPC2460FBD208 LQFP208
Description
Version
plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm
SOT459-1
LPC2460FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15 × 15 × 0.7 mm SOT950-1
4.1 Ordering options
LPC2460FET208
N/A
64 16 16 2
Ethernet
USB
OTG/
OHCI/
DEV
+ 4 kB
FIFO
DAC channels
64 16 16 2
External
bus
98 Full 32-bit
MII/RMII
yes
2
yes
yes
8
1
−40 °C to
+85 °C
98 Full 32-bit
MII/RMII
yes
2
yes
yes
8
1
−40 °C to
+85 °C
LPC2460_2
Preliminary data sheet
SD/ GP
MMC DMA
CAN channels
N/A
RTC
LPC2460FBD208
GP/USB
SRAM (kB)
Ethernet buffer
Flash
(kB)
Local bus
Type number
ADC channels
Ordering options
Total
Table 2.
Temp
range
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
3 of 68
LPC2460
NXP Semiconductors
Fast communication chip
5. Block diagram
TMS TDI
XTAL1
VDD(3V3)
XTAL2
VDDA
trace signals
P0, P1, P2,
P3, P4
LPC2460
HIGH-SPEED
GPI/O
160 PINS
TOTAL
64 kB
SRAM
TEST/DEBUG
INTERFACE
INTERNAL
SRAM
CONTROLLER
ARM7TDMI-S
EMULATION
TRACE MODULE
TRST TCK TDO
EXTIN0 DBGEN
PLL
SYSTEM
FUNCTIONS
system
clock
INTERNAL RC
OSCILLATOR
VIC
MII/RMII
EINT3 to EINT0
P0, P2
2 × CAP0/CAP1/
CAP2/CAP3
4 × MAT2/MAT3,
2 × MAT0,
3 × MAT1
6 × PWM0/PWM1
1 × PCAP0,
2 × PCAP1
AHB
BRIDGE
16 kB
SRAM
EXTERNAL
MEMORY
CONTROLLER
AHB TO
APB BRIDGE
USB DEVICE/
HOST/OTG WITH
4 kB RAM AND DMA
I2SRX_CLK
I2STX_CLK
I2SRX_WS
I2STX_WS
I2SRX_SDA
I2STX_SDA
I2S INTERFACE
CAPTURE/COMPARE
TIMER0/TIMER1/
TIMER2/TIMER3
SPI, SSP0 INTERFACE
PWM0, PWM1
8 × AD0
A/D CONVERTER
SSP1 INTERFACE
SCK, SCK0
MOSI, MOSI0
MISO, MISO0
SSEL, SSEL0
SCK1
MOSI1
MISO1
SSEL1
MCICLK, MCIPWR
SD/MMC CARD
INTERFACE
MCICMD,
MCIDAT[3:0]
D/A CONVERTER
UART0, UART2, UART3
TXD0, TXD2, TXD3
RXD0, RXD2, RXD3
2 kB BATTERY RAM
TXD1
RXD1
DTR1, RTS1
power domain 2
RTCX1
RTCX2
VBUS
port1
port2
GP DMA
CONTROLLER
EXTERNAL INTERRUPTS
LEGACY GPI/O
64 PINS TOTAL
VBAT
D[31:0]
A[23:0]
control lines
AHB
BRIDGE
MASTER AHB TO SLAVE
PORT AHB BRIDGE PORT
P0, P1
AOUT
16 kB
SRAM
VREF
VSSA, VSSCORE, VSSIO
VDD(DCDC)(3V3)
AHB1
AHB2
ETHERNET
MAC WITH
DMA
RESET
RTC
OSCILLATOR
REALTIME
CLOCK
UART1
DSR1, CTS1, DCD1,
RI1
ALARM
RD1, RD2
TD1, TD2
CAN1, CAN2
WATCHDOG TIMER
SCL0, SCL1, SCL2
SDA0, SDA1, SDA2
I2C0, I2C1, I2C2
SYSTEM CONTROL
002aad313
Fig 1. LPC2460 block diagram
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
4 of 68
LPC2460
NXP Semiconductors
Fast communication chip
6. Pinning information
157
208
6.1 Pinning
1
156
LPC2460FBD208
105
53
104
52
002aad314
Fig 2. LPC2460 pinning LQFP208 package
ball A1
index area
2
1
4
3
6
5
8
7
9
10 12 14 16
11 13 15 17
A
B
C
D
E
F
G
H
LPC2460FET208
J
K
L
M
N
P
R
T
U
002aad315
Transparent top view
Fig 3. LPC2460 pinning TFBGA208 package
Table 3.
Pin allocation table
Pin Symbol
Pin Symbol
Pin Symbol
Pin Symbol
Row A
1
P3[27]/D27/
CAP1[0]/PWM1[4]
2
VSSIO
3
P1[0]/ENET_TXD0
4
P4[31]/CS1
5
P1[4]/ENET_TX_EN
6
P1[9]/ENET_RXD0
7
P1[14]/ENET_RX_ER
8
P1[15]/
ENET_REF_CLK/
ENET_RX_CLK
9
P1[17]/ENET_MDIO
10
P1[3]/ENET_TXD3/
MCICMD/PWM0[2]
11
P4[15]/A15
12
VSSIO
13
P3[20]/D20/
PWM0[5]/DSR1
14
P1[11]/ENET_RXD2/
MCIDAT2/PWM0[6]
15
P0[8]/I2STX_WS/
MISO1/MAT2[2]
16
P1[12]/ENET_RXD3/
MCIDAT3/PCAP0[0]
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
5 of 68
LPC2460
NXP Semiconductors
Fast communication chip
Table 3.
Pin allocation table …continued
Pin Symbol
17
Pin Symbol
P1[5]/ENET_TX_ER/
MCIPWR/PWM0[3]
Pin Symbol
-
Pin Symbol
-
-
Row B
1
P3[2]/D2
2
P3[10]/D10
3
P3[1]/D1
4
P3[0]/D0
5
P1[1]/ENET_TXD1
6
VSSIO
7
P4[30]/CS0
8
P4[24]/OE
9
P4[25]/WE
10
P4[29]/BLS3/
MAT2[1]/RXD3
11
P1[6]/ENET_TX_CLK/
MCIDAT0/PWM0[4]
12
P0[4]/I2SRX_CLK/RD2/
CAP2[0]
13
VDD(3V3)
14
P3[19]/D19/
PWM0[4]/DCD1
15
P4[14]/A14
16
P4[13]/A13
17
P2[0]/PWM1[1]/TXD1/
TRACECLK
-
-
-
Row C
1
P3[13]/D13
2
TDI
3
RTCK
4
5
P3[9]/D9
6
P3[22]/D22/
PCAP0[0]/RI1
7
P1[8]/ENET_CRS_DV/E 8
NET_CRS
P1[10]/ENET_RXD1
9
VDD(3V3)
10
P3[21]/D21/
PWM0[6]/DTR1
11
P4[28]/BLS2/
MAT2[0]/TXD3
12
P0[5]/I2SRX_WS/TD2/
CAP2[1]
13
P0[7]/I2STX_CLK/SCK1 14
/MAT2[1]
P0[9]/I2STX_SDA/
MOSI1/MAT2[3]
15
P3[18]/D18/
PWM0[3]/CTS1
16
P4[12]/A12
17
VDD(3V3)
-
-
P0[2]/TXD0
-
Row D
1
TRST
2
P3[28]/D28/
CAP1[1]/PWM1[5]
3
TDO
4
P3[12]/D12
5
P3[11]/D11
6
P0[3]/RXD0
7
VDD(3V3)
8
P3[8]/D8
9
P1[2]/ENET_TXD2/
MCICLK/PWM0[1]
10
P1[16]/ENET_MDC
11
VDD(DCDC)(3V3)
12
VSSCORE
13
P0[6]/I2SRX_SDA/
SSEL1/MAT2[0]
14
P1[7]/ENET_COL/
MCIDAT1/PWM0[5]
15
P2[2]/PWM1[3]/
CTS1/PIPESTAT1
16
P1[13]/ENET_RX_DV
17
P2[4]/PWM1[5]/
DSR1/TRACESYNC
-
-
-
Row E
1
P0[26]/AD0[3]/
AOUT/RXD3
2
TCK
3
TMS
4
P3[3]/D3
14
P2[1]/PWM1[2]/RXD1/
PIPESTAT0
15
VSSIO
16
P2[3]/PWM1[4]/
DCD1/PIPESTAT2
17
P2[6]/PCAP1[0]/
RI1/TRACEPKT1
Row F
1
P0[25]/AD0[2]/
I2SRX_SDA/TXD3
2
P3[4]/D4
3
P3[29]/D29/
MAT1[0]/PWM1[6]
4
DBGEN
14
P4[11]/A11
15
P3[17]/D17/
PWM0[2]/RXD1
16
P2[5]/PWM1[6]/
DTR1/TRACEPKT0
17
P3[16]/D16/
PWM0[1]/TXD1
Row G
1
P3[5]/D5
2
P0[24]/AD0[1]/
I2SRX_WS/CAP3[1]
3
VDD(3V3)
4
VDDA
14
n.c.
15
P4[27]/BLS1
16
P2[7]/RD2/
RTS1/TRACEPKT2
17
P4[10]/A10
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
6 of 68
LPC2460
NXP Semiconductors
Fast communication chip
Table 3.
Pin allocation table …continued
Pin Symbol
Pin Symbol
Pin Symbol
Pin Symbol
Row H
1
P0[23]/AD0[0]/
I2SRX_CLK/CAP3[0]
2
P3[14]/D14
3
P3[30]/D30/
MAT1[1]/RTS1
4
VDD(DCDC)(3V3)
14
VSSIO
15
P2[8]/TD2/
TXD2/TRACEPKT3
16
P2[9]/
USB_CONNECT1/
RXD2/EXTIN0
17
P4[9]/A9
Row J
1
P3[6]/D6
2
VSSA
3
P3[31]/D31/MAT1[2]
4
n.c.
14
P0[16]/RXD1/
SSEL0/SSEL
15
P4[23]/A23/
RXD2/MOSI1
16
P0[15]/TXD1/
SCK0/SCK
17
P4[8]/A8
Row K
1
VREF
2
RTCX1
3
RSTOUT
4
VSSCORE
14
P4[22]/A22/
TXD2/MISO1
15
P0[18]/DCD1/
MOSI0/MOSI
16
VDD(3V3)
17
P0[17]/CTS1/
MISO0/MISO
Row L
1
P3[7]/D7
2
RTCX2
3
VSSIO
4
P2[30]/DQMOUT2/
MAT3[2]/SDA2
14
n.c.
15
P4[26]/BLS0
16
P4[7]/A7
17
P0[19]/DSR1/
MCICLK/SDA1
Row M
1
P3[15]/D15
2
RESET
3
VBAT
4
XTAL1
14
P4[6]/A6
15
P4[21]/A21/
SCL2/SSEL1
16
P0[21]/RI1/
MCIPWR/RD1
17
P0[20]/DTR1/
MCICMD/SCL1
Row N
1
ALARM
2
P2[31]/DQMOUT3/
MAT3[3]/SCL2
3
P2[29]/DQMOUT1
4
XTAL2
14
P2[12]/EINT2/
MCIDAT2/I2STX_WS
15
P2[10]/EINT0
16
VSSIO
17
P0[22]/RTS1/
MCIDAT0/TD1
4
P2[28]/DQMOUT0
Row P
1
P1[31]/USB_OVRCR2/
SCK1/AD0[5]
2
P1[30]/USB_PWRD2/
VBUS/AD0[4]
3
P2[27]/CKEOUT3/
MAT3[1]/MOSI0
5
P2[24]/CKEOUT0
6
VDD(3V3)
7
P1[18]/USB_UP_LED1/ 8
PWM1[1]/CAP1[0]
VDD(3V3)
9
P1[23]/USB_RX_DP1/
PWM1[4]/MISO0
10
VSSCORE
11
VDD(DCDC)(3V3)
12
VSSIO
13
P2[15]/CS3/
CAP2[1]/SCL1
14
P4[17]/A17
15
P4[18]/A18
16
P4[19]/A19
17
VDD(3V3)
-
-
-
Row R
1
P0[12]/USB_PPWR2/
MISO1/AD0[6]
2
P0[13]/USB_UP_LED2/ 3
MOSI1/AD0[7]
P0[28]/SCL0
4
P2[25]/CKEOUT1
5
P3[24]/D24/
CAP0[1]/PWM1[1]
6
P0[30]/USB_D−1
7
P2[19]/CLKOUT1
8
P1[21]/USB_TX_DM1/
PWM1[3]/SSEL0
9
VSSIO
10
P1[26]/USB_SSPND1/
PWM1[6]/CAP0[0]
11
P2[16]/CAS
12
P2[14]/CS2/
CAP2[0]/SDA1
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
7 of 68
LPC2460
NXP Semiconductors
Fast communication chip
Table 3.
Pin allocation table …continued
Pin Symbol
Pin Symbol
Pin Symbol
Pin Symbol
13
P2[17]/RAS
14
15
16
17
P4[20]/A20/
SDA2/SCK1
P0[11]/RXD2/SCL2/
MAT3[1]
-
P4[4]/A4
-
P4[5]/A5
-
Row T
1
P0[27]/SDA0
2
P0[31]/USB_D+2
3
P3[26]/D26/
MAT0[1]/PWM1[3]
4
P2[26]/CKEOUT2/
MAT3[0]/MISO0
5
VSSIO
6
P3[23]/D23/
CAP0[0]/PCAP1[0]
7
P0[14]/USB_HSTEN2/
USB_CONNECT2/
SSEL1
8
P2[20]/DYCS0
9
P1[24]/USB_RX_DM1/
PWM1[5]/MOSI0
10
P1[25]/USB_LS1/
11
USB_HSTEN1/MAT1[1]
P4[2]/A2
12
P1[27]/USB_INT1/
USB_OVRCR1/CAP0[1]
13
P1[28]/USB_SCL1/
PCAP1[0]/MAT0[0]
14
P0[1]/TD1/RXD3/SCL1
P0[10]/TXD2/SDA2/
MAT3[0]
16
P2[13]/EINT3/
MCIDAT3/I2STX_SDA
17
P2[11]/EINT1/
MCIDAT1/I2STX_CLK
15
-
-
-
Row U
1
USB_D−2
2
P3[25]/D25/
MAT0[0]/PWM1[2]
3
P2[18]/CLKOUT0
4
P0[29]/USB_D+1
5
P2[23]/DYCS3/
CAP3[1]/SSEL0
6
P1[19]/USB_TX_E1/
USB_PPWR1/CAP1[1]
7
P1[20]/USB_TX_DP1/
PWM1[2]/SCK0
8
P1[22]/USB_RCV1/
USB_PWRD1/MAT1[0]
9
P4[0]/A0
10
P4[1]/A1
11
P2[21]/DYCS1
12
P2[22]/DYCS2/
CAP3[0]/SCK0
13
VDD(3V3)
14
P1[29]/USB_SDA1/
PCAP1[1]/MAT0[1]
15
P0[0]/RD1/TXD3/SDA1
16
P4[3]/A3
17
P4[16]/A16
-
-
-
6.2 Pin description
Table 4.
Pin description
Symbol
Pin
Ball
P0[0] to P0[31]
P0[0]/RD1/
TXD3/SDA1
P0[1]/TD1/RXD3/
SCL1
P0[2]/TXD0
94[1]
96[1]
202[1]
U15[1]
T14[1]
C4[1]
Type
Description
I/O
Port 0: Port 0 is a 32-bit I/O port with individual direction controls for each
bit. The operation of port 0 pins depends upon the pin function selected
via the Pin Connect block.
I/O
P0[0] — General purpose digital input/output pin.
I
RD1 — CAN1 receiver input.
O
TXD3 — Transmitter output for UART3.
I/O
SDA1 — I2C1 data input/output (this is not an open-drain pin).
I/O
P0[1] — General purpose digital input/output pin.
O
TD1 — CAN1 transmitter output.
I
RXD3 — Receiver input for UART3.
I/O
SCL1 — I2C1 clock input/output (this is not an open-drain pin).
I/O
P0[2] — General purpose digital input/output pin.
O
TXD0 — Transmitter output for UART0.
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
8 of 68
LPC2460
NXP Semiconductors
Fast communication chip
Table 4.
Pin description …continued
Symbol
Pin
Ball
Type
Description
P0[3]/RXD0
204[1]
D6[1]
I/O
P0[3] — General purpose digital input/output pin.
I
RXD0 — Receiver input for UART0.
P0[4]/
I2SRX_CLK/
RD2/CAP2[0]
168[1]
B12[1]
I/O
P0[4] — General purpose digital input/output pin.
I/O
I2SRX_CLK — Receive Clock. It is driven by the master and received by
the slave. Corresponds to the signal SCK in the I2S-bus specification.
I
RD2 — CAN2 receiver input.
I
CAP2[0] — Capture input for Timer 2, channel 0.
I/O
P0[5] — General purpose digital input/output pin.
I/O
I2SRX_WS — Receive Word Select. It is driven by the master and
received by the slave. Corresponds to the signal WS in the I2S-bus
specification.
O
TD2 — CAN2 transmitter output.
I
CAP2[1] — Capture input for Timer 2, channel 1.
I/O
P0[6] — General purpose digital input/output pin.
I/O
I2SRX_SDA — Receive data. It is driven by the transmitter and read by
the receiver. Corresponds to the signal SD in the I2S-bus specification.
I/O
SSEL1 — Slave Select for SSP1.
O
MAT2[0] — Match output for Timer 2, channel 0.
I/O
P0[7] — General purpose digital input/output pin.
I/O
I2STX_CLK — Transmit Clock. It is driven by the master and received by
the slave. Corresponds to the signal SCK in the I2S-bus specification.
I/O
SCK1 — Serial Clock for SSP1.
O
MAT2[1] — Match output for Timer 2, channel 1.
I/O
P0[8] — General purpose digital input/output pin.
I/O
I2STX_WS — Transmit Word Select. It is driven by the master and
received by the slave. Corresponds to the signal WS in the I2S-bus
specification.
P0[5]/
I2SRX_WS/
TD2/CAP2[1]
P0[6]/
I2SRX_SDA/
SSEL1/MAT2[0]
P0[7]/
I2STX_CLK/
SCK1/MAT2[1]
P0[8]/
I2STX_WS/
MISO1/MAT2[2]
P0[9]/
I2STX_SDA/
MOSI1/MAT2[3]
P0[10]/TXD2/
SDA2/MAT3[0]
P0[11]/RXD2/
SCL2/MAT3[1]
166[1]
164[1]
162[1]
160[1]
158[1]
98[1]
100[1]
C12[1]
D13[1]
C13[1]
A15[1]
C14[1]
T15[1]
R14[1]
I/O
MISO1 — Master In Slave Out for SSP1.
O
MAT2[2] — Match output for Timer 2, channel 2.
I/O
P0[9] — General purpose digital input/output pin.
I/O
I2STX_SDA — Transmit data. It is driven by the transmitter and read by
the receiver. Corresponds to the signal SD in the I2S-bus specification.
I/O
MOSI1 — Master Out Slave In for SSP1.
O
MAT2[3] — Match output for Timer 2, channel 3.
I/O
P0[10] — General purpose digital input/output pin.
O
TXD2 — Transmitter output for UART2.
I/O
SDA2 — I2C2 data input/output (this is not an open-drain pin).
O
MAT3[0] — Match output for Timer 3, channel 0.
I/O
P0[11] — General purpose digital input/output pin.
I
RXD2 — Receiver input for UART2.
I/O
SCL2 — I2C2 clock input/output (this is not an open-drain pin).
O
MAT3[1] — Match output for Timer 3, channel 1.
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
9 of 68
LPC2460
NXP Semiconductors
Fast communication chip
Table 4.
Pin description …continued
Symbol
Pin
Ball
Type
Description
P0[12]/
USB_PPWR2/
MISO1/AD0[6]
41[2]
R1[2]
I/O
P0[12] — General purpose digital input/output pin.
O
USB_PPWR2 — Port Power enable signal for USB port 2.
I/O
MISO1 — Master In Slave Out for SSP1.
I
AD0[6] — A/D converter 0, input 6.
P0[13]/
USB_UP_LED2/
MOSI1/AD0[7]
45[2]
I/O
P0[13] — General purpose digital input/output pin.
O
USB_UP_LED2 — USB port 2 GoodLink LED indicator. It is LOW when
device is configured (non-control endpoints enabled). It is HIGH when the
device is not configured or during global suspend.
I/O
MOSI1 — Master Out Slave In for SSP1.
I
AD0[7] — A/D converter 0, input 7.
I/O
P0[14] — General purpose digital input/output pin.
P0[14]/
USB_HSTEN2/
USB_CONNECT2/
SSEL1
69[1]
P0[15]/TXD1/
SCK0/SCK
128[1]
P0[16]/RXD1/
SSEL0/SSEL
P0[17]/CTS1/
MISO0/MISO
P0[18]/DCD1/
MOSI0/MOSI
P0[19]/DSR1/
MCICLK/SDA1
P0[20]/DTR1/
MCICMD/SCL1
130[1]
126[1]
124[1]
122[1]
120[1]
R2[2]
T7[1]
J16[1]
J14[1]
K17[1]
K15[1]
L17[1]
M17[1]
O
USB_HSTEN2 — Host Enabled status for USB port 2.
O
USB_CONNECT2 — SoftConnect control for USB port 2. Signal used to
switch an external 1.5 kΩ resistor under software control. Used with the
SoftConnect USB feature.
I/O
SSEL1 — Slave Select for SSP1.
I/O
P0[15] — General purpose digital input/output pin.
O
TXD1 — Transmitter output for UART1.
I/O
SCK0 — Serial clock for SSP0.
I/O
SCK — Serial clock for SPI.
I/O
P0 [16] — General purpose digital input/output pin.
I
RXD1 — Receiver input for UART1.
I/O
SSEL0 — Slave Select for SSP0.
I/O
SSEL — Slave Select for SPI.
I/O
P0[17] — General purpose digital input/output pin.
I
CTS1 — Clear to Send input for UART1.
I/O
MISO0 — Master In Slave Out for SSP0.
I/O
MISO — Master In Slave Out for SPI.
I/O
P0[18] — General purpose digital input/output pin.
I
DCD1 — Data Carrier Detect input for UART1.
I/O
MOSI0 — Master Out Slave In for SSP0.
I/O
MOSI — Master Out Slave In for SPI.
I/O
P0[19] — General purpose digital input/output pin.
I
DSR1 — Data Set Ready input for UART1.
O
MCICLK — Clock output line for SD/MMC interface.
I/O
SDA1 — I2C1 data input/output (this is not an open-drain pin).
I/O
P0[20] — General purpose digital input/output pin.
O
DTR1 — Data Terminal Ready output for UART1.
I/O
MCICMD — Command line for SD/MMC interface.
I/O
SCL1 — I2C1 clock input/output (this is not an open-drain pin).
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
10 of 68
LPC2460
NXP Semiconductors
Fast communication chip
Table 4.
Pin description …continued
Symbol
Pin
Ball
Type
Description
P0[21]/RI1/
MCIPWR/RD1
118[1]
M16[1]
I/O
P0[21] — General purpose digital input/output pin.
I
RI1 — Ring Indicator input for UART1.
O
MCIPWR — Power Supply Enable for external SD/MMC power supply.
P0[22]/RTS1/
MCIDAT0/TD1
116[1]
P0[23]/AD0[0]/
I2SRX_CLK/
CAP3[0]
18[2]
P0[24]/AD0[1]/
I2SRX_WS/
CAP3[1]
16[2]
P0[25]/AD0[2]/
I2SRX_SDA/
TXD3
14[2]
P0[26]/AD0[3]/
AOUT/RXD3
12[2][3]
P0[27]/SDA0
P0[28]/SCL0
50[4]
48[4]
N17[1]
H1[2]
G2[2]
F1[2]
E1[2][3]
T1[4]
R3[4]
I
RD1 — CAN1 receiver input.
I/O
P0[22] — General purpose digital input/output pin.
O
RTS1 — Request to Send output for UART1.
I/O
MCIDAT0 — Data line 0 for SD/MMC interface.
O
TD1 — CAN1 transmitter output.
I/O
P0[23] — General purpose digital input/output pin.
I
AD0[0] — A/D converter 0, input 0.
I/O
I2SRX_CLK — Receive Clock. It is driven by the master and received by
the slave. Corresponds to the signal SCK in the I2S-bus specification.
I
CAP3[0] — Capture input for Timer 3, channel 0.
I/O
P0[24] — General purpose digital input/output pin.
I
AD0[1] — A/D converter 0, input 1.
I/O
I2SRX_WS — Receive Word Select. It is driven by the master and
received by the slave. Corresponds to the signal WS in the I2S-bus
specification.
I
CAP3[1] — Capture input for Timer 3, channel 1.
I/O
P0[25] — General purpose digital input/output pin.
I
AD0[2] — A/D converter 0, input 2.
I/O
I2SRX_SDA — Receive data. It is driven by the transmitter and read by
the receiver. Corresponds to the signal SD in the I2S-bus specification.
O
TXD3 — Transmitter output for UART3.
I/O
P0[26] — General purpose digital input/output pin.
I
AD0[3] — A/D converter 0, input 3.
O
AOUT — D/A converter output.
I
RXD3 — Receiver input for UART3.
I/O
P0[27] — General purpose digital input/output pin.
I/O
SDA0 — I2C0 data input/output. Open-drain output (for I2C-bus
compliance).
I/O
P0[28] — General purpose digital input/output pin.
I/O
SCL0 — I2C0 clock input/output. Open-drain output (for I2C-bus
compliance).
P0[29] — General purpose digital input/output pin.
P0[29]/USB_D+1
61[5]
U4[5]
I/O
I/O
USB_D+1 — USB port 1 bidirectional D+ line.
P0[30]/USB_D−1
62[5]
R6[5]
I/O
P0[30] — General purpose digital input/output pin.
I/O
USB_D−1 — USB port 1 bidirectional D− line.
P0[31]/USB_D+2
51[5]
T2[5]
I/O
P0[31] — General purpose digital input/output pin.
I/O
USB_D+2 — USB port 2 bidirectional D+ line.
I/O
Port 1: Port 1 is a 32 bit I/O port with individual direction controls for each
bit. The operation of port 1 pins depends upon the pin function selected
via the Pin Connect block.
P1[0] to P1[31]
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
11 of 68
LPC2460
NXP Semiconductors
Fast communication chip
Table 4.
Pin description …continued
Symbol
Pin
Ball
Type
Description
P1[0]/
ENET_TXD0
196[1]
A3[1]
I/O
P1[0] — General purpose digital input/output pin.
O
ENET_TXD0 — Ethernet transmit data 0 (RMII/MII interface).
P1[1]/
ENET_TXD1
194[1]
B5[1]
I/O
P1[1] — General purpose digital input/output pin.
O
ENET_TXD1 — Ethernet transmit data 1 (RMII/MII interface).
P1[2]/
ENET_TXD2/
MCICLK/
PWM0[1]
185[1]
D9[1]
I/O
P1[2] — General purpose digital input/output pin.
O
ENET_TXD2 — Ethernet transmit data 2 (MII interface).
O
MCICLK — Clock output line for SD/MMC interface.
P1[3]/
ENET_TXD3/
MCICMD/
PWM0[2]
177[1]
P1[4]/
ENET_TX_EN
192[1]
A5[1]
P1[5]/
ENET_TX_ER/
MCIPWR/
PWM0[3]
156[1]
A17[1]
P1[6]/
ENET_TX_CLK/
MCIDAT0/
PWM0[4]
171[1]
P1[7]/
ENET_COL/
MCIDAT1/
PWM0[5]
153[1]
P1[8]/
ENET_CRS_DV/
ENET_CRS
190[1]
P1[9]/
ENET_RXD0
188[1]
A6[1]
P1[10]/
ENET_RXD1
186[1]
C8[1]
P1[11]/
ENET_RXD2/
MCIDAT2/
PWM0[6]
163[1]
P1[12]/
ENET_RXD3/
MCIDAT3/
PCAP0[0]
157[1]
A10[1]
B11[1]
D14[1]
C7[1]
A14[1]
A16[1]
O
PWM0[1] — Pulse Width Modulator 0, output 1.
I/O
P1[3] — General purpose digital input/output pin.
O
ENET_TXD3 — Ethernet transmit data 3 (MII interface).
I/O
MCICMD — Command line for SD/MMC interface.
O
PWM0[2] — Pulse Width Modulator 0, output 2.
I/O
P1[4] — General purpose digital input/output pin.
O
ENET_TX_EN — Ethernet transmit data enable (RMII/MII interface).
I/O
P1[5] — General purpose digital input/output pin.
O
ENET_TX_ER — Ethernet Transmit Error (MII interface).
O
MCIPWR — Power Supply Enable for external SD/MMC power supply.
O
PWM0[3] — Pulse Width Modulator 0, output 3.
I/O
P1[6] — General purpose digital input/output pin.
I
ENET_TX_CLK — Ethernet Transmit Clock (MII interface).
I/O
MCIDAT0 — Data line 0 for SD/MMC interface.
O
PWM0[4] — Pulse Width Modulator 0, output 4.
I/O
P1[7] — General purpose digital input/output pin.
I
ENET_COL — Ethernet Collision detect (MII interface).
I/O
MCIDAT1 — Data line 1 for SD/MMC interface.
O
PWM0[5] — Pulse Width Modulator 0, output 5.
I/O
P1[8] — General purpose digital input/output pin.
I
ENET_CRS_DV/ENET_CRS — Ethernet Carrier Sense/Data Valid (RMII
interface)/ Ethernet Carrier Sense (MII interface).
I/O
P1[9] — General purpose digital input/output pin.
I
ENET_RXD0 — Ethernet receive data 0 (RMII/MII interface).
I/O
P1[10] — General purpose digital input/output pin.
I
ENET_RXD1 — Ethernet receive data 1 (RMII/MII interface).
I/O
P1[11] — General purpose digital input/output pin.
I
ENET_RXD2 — Ethernet Receive Data 2 (MII interface).
I/O
MCIDAT2 — Data line 2 for SD/MMC interface.
O
PWM0[6] — Pulse Width Modulator 0, output 6.
I/O
P1[12] — General purpose digital input/output pin.
I
ENET_RXD3 — Ethernet Receive Data (MII interface).
I/O
MCIDAT3 — Data line 3 for SD/MMC interface.
I
PCAP0[0] — Capture input for PWM0, channel 0.
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
12 of 68
LPC2460
NXP Semiconductors
Fast communication chip
Table 4.
Pin description …continued
Symbol
Pin
Ball
Type
Description
P1[13]/
ENET_RX_DV
147[1]
D16[1]
I/O
P1[13] — General purpose digital input/output pin.
I
ENET_RX_DV — Ethernet Receive Data Valid (MII interface).
P1[14]/
ENET_RX_ER
184[1]
A7[1]
I/O
P1[14] — General purpose digital input/output pin.
I
ENET_RX_ER — Ethernet receive error (RMII/MII interface).
P1[15]/
ENET_REF_CLK/
ENET_RX_CLK
182[1]
A8[1]
I/O
P1[15] — General purpose digital input/output pin.
I
ENET_REF_CLK/ENET_RX_CLK — Ethernet Reference Clock (RMII
interface)/ Ethernet Receive Clock (MII interface).
P1[16]/
ENET_MDC
180[1]
I/O
P1[16] — General purpose digital input/output pin.
O
ENET_MDC — Ethernet MIIM clock.
P1[17]/
ENET_MDIO
178[1]
A9[1]
I/O
P1[17] — General purpose digital input/output pin.
I/O
ENET_MDIO — Ethernet MIIM data input and output.
P1[18]/
USB_UP_LED1/
PWM1[1]/
CAP1[0]
66[1]
P7[1]
I/O
P1[18] — General purpose digital input/output pin.
O
USB_UP_LED1 — USB port 1 GoodLink LED indicator. It is LOW when
device is configured (non-control endpoints enabled). It is HIGH when the
device is not configured or during global suspend.
P1[19]/
USB_TX_E1/
USB_PPWR1/
CAP1[1]
P1[20]/
USB_TX_DP1/
PWM1[2]/SCK0
P1[21]/
USB_TX_DM1/
PWM1[3]/SSEL0
P1[22]/
USB_RCV1/
USB_PWRD1/
MAT1[0]
P1[23]/
USB_RX_DP1/
PWM1[4]/MISO0
P1[24]/
USB_RX_DM1/
PWM1[5]/MOSI0
68[1]
70[1]
72[1]
74[1]
76[1]
78[1]
D10[1]
U6[1]
U7[1]
R8[1]
U8[1]
P9[1]
T9[1]
O
PWM1[1] — Pulse Width Modulator 1, channel 1 output.
I
CAP1[0] — Capture input for Timer 1, channel 0.
I/O
P1[19] — General purpose digital input/output pin.
O
USB_TX_E1 — Transmit Enable signal for USB port 1 (OTG transceiver).
O
USB_PPWR1 — Port Power enable signal for USB port 1.
I
CAP1[1] — Capture input for Timer 1, channel 1.
I/O
P1[20] — General purpose digital input/output pin.
O
USB_TX_DP1 — D+ transmit data for USB port 1 (OTG transceiver).
O
PWM1[2] — Pulse Width Modulator 1, channel 2 output.
I/O
SCK0 — Serial clock for SSP0.
I/O
P1[21] — General purpose digital input/output pin.
O
USB_TX_DM1 — D− transmit data for USB port 1 (OTG transceiver).
O
PWM1[3] — Pulse Width Modulator 1, channel 3 output.
I/O
SSEL0 — Slave Select for SSP0.
I/O
P1[22] — General purpose digital input/output pin.
I
USB_RCV1 — Differential receive data for USB port 1 (OTG transceiver).
I
USB_PWRD1 — Power Status for USB port 1 (host power switch).
O
MAT1[0] — Match output for Timer 1, channel 0.
I/O
P1[23] — General purpose digital input/output pin.
I
USB_RX_DP1 — D+ receive data for USB port 1 (OTG transceiver).
O
PWM1[4] — Pulse Width Modulator 1, channel 4 output.
I/O
MISO0 — Master In Slave Out for SSP0.
I/O
P1[24] — General purpose digital input/output pin.
I
USB_RX_DM1 — D− receive data for USB port 1 (OTG transceiver).
O
PWM1[5] — Pulse Width Modulator 1, channel 5 output.
I/O
MOSI0 — Master Out Slave in for SSP0.
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
13 of 68
LPC2460
NXP Semiconductors
Fast communication chip
Table 4.
Pin description …continued
Symbol
Pin
Ball
Type
Description
P1[25]/
USB_LS1/
USB_HSTEN1/
MAT1[1]
80[1]
T10[1]
I/O
P1[25] — General purpose digital input/output pin.
O
USB_LS1 — Low-speed status for USB port 1 (OTG transceiver).
O
USB_HSTEN1 — Host Enabled status for USB port 1.
O
MAT1[1] — Match output for Timer 1, channel 1.
P1[26]/
USB_SSPND1/
PWM1[6]/
CAP0[0]
82[1]
I/O
P1[26] — General purpose digital input/output pin.
O
USB_SSPND1 — USB port 1 Bus Suspend status (OTG transceiver).
O
PWM1[6] — Pulse Width Modulator 1, channel 6 output.
I
CAP0[0] — Capture input for Timer 0, channel 0.
P1[27]/
USB_INT1/
USB_OVRCR1/
CAP0[1]
88[1]
I/O
P1[27] — General purpose digital input/output pin.
I
USB_INT1 — USB port 1 OTG transceiver interrupt (OTG transceiver).
I
USB_OVRCR1 — USB port 1 Over-Current status.
I
CAP0[1] — Capture input for Timer 0, channel 1.
P1[28]/
USB_SCL1/
PCAP1[0]/
MAT0[0]
90[1]
I/O
P1[28] — General purpose digital input/output pin.
I/O
USB_SCL1 — USB port 1 I2C serial clock (OTG transceiver).
I
PCAP1[0] — Capture input for PWM1, channel 0.
P1[29]/
USB_SDA1/
PCAP1[1]/
MAT0[1]
92[1]
P1[30]/
USB_PWRD2/
VBUS/AD0[4]
42[2]
R10[1]
T12[1]
T13[1]
U14[1]
P2[2]
O
MAT0[0] — Match output for Timer 0, channel 0.
I/O
P1[29] — General purpose digital input/output pin.
I/O
USB_SDA1 — USB port 1 I2C serial data (OTG transceiver).
I
PCAP1[1] — Capture input for PWM1, channel 1.
O
MAT0[1] — Match output for Timer 0, channel 0.
I/O
P1[30] — General purpose digital input/output pin.
I
USB_PWRD2 — Power Status for USB port 2.
I
VBUS — Monitors the presence of USB bus power.
Note: This signal must be HIGH for USB reset to occur.
P1[31]/
USB_OVRCR2/
SCK1/AD0[5]
40[2]
P1[2]
P2[0] to P2[31]
P2[0]/PWM1[1]/
TXD1/
TRACECLK
P2[1]/PWM1[2]/
RXD1/
PIPESTAT0
154[1]
152[1]
B17[1]
E14[1]
I
AD0[4] — A/D converter 0, input 4.
I/O
P1[31] — General purpose digital input/output pin.
I
USB_OVRCR2 — Over-Current status for USB port 2.
I/O
SCK1 — Serial Clock for SSP1.
I
AD0[5] — A/D converter 0, input 5.
I/O
Port 2: Port 2 is a 32-bit I/O port with individual direction controls for each
bit. The operation of port 2 pins depends upon the pin function selected
via the Pin Connect block.
I/O
P2[0] — General purpose digital input/output pin.
O
PWM1[1] — Pulse Width Modulator 1, channel 1 output.
O
TXD1 — Transmitter output for UART1.
O
TRACECLK — Trace Clock.
I/O
P2[1] — General purpose digital input/output pin.
O
PWM1[2] — Pulse Width Modulator 1, channel 2 output.
I
RXD1 — Receiver input for UART1.
O
PIPESTAT0 — Pipeline Status, bit 0.
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
14 of 68
LPC2460
NXP Semiconductors
Fast communication chip
Table 4.
Pin description …continued
Symbol
Pin
Ball
Type
Description
P2[2]/PWM1[3]/
CTS1/
PIPESTAT1
150[1]
D15[1]
I/O
P2[2] — General purpose digital input/output pin.
O
PWM1[3] — Pulse Width Modulator 1, channel 3 output.
I
CTS1 — Clear to Send input for UART1.
O
PIPESTAT1 — Pipeline Status, bit 1.
P2[3]/PWM1[4]/
DCD1/
PIPESTAT2
144[1]
I/O
P2[3] — General purpose digital input/output pin.
O
PWM1[4] — Pulse Width Modulator 1, channel 4 output.
I
DCD1 — Data Carrier Detect input for UART1.
O
PIPESTAT2 — Pipeline Status, bit 2.
P2[4]/PWM1[5]/
DSR1/
TRACESYNC
142[1]
I/O
P2[4] — General purpose digital input/output pin.
O
PWM1[5] — Pulse Width Modulator 1, channel 5 output.
I
DSR1 — Data Set Ready input for UART1.
O
TRACESYNC — Trace Synchronization.
P2[5]/PWM1[6]/
DTR1/
TRACEPKT0
140[1]
I/O
P2[5] — General purpose digital input/output pin.
O
PWM1[6] — Pulse Width Modulator 1, channel 6 output.
O
DTR1 — Data Terminal Ready output for UART1.
O
TRACEPKT0 — Trace Packet, bit 0.
P2[6]/PCAP1[0]/
RI1/TRACEPKT1
138[1]
I/O
P2[6] — General purpose digital input/output pin.
I
PCAP1[0] — Capture input for PWM1, channel 0.
I
RI1 — Ring Indicator input for UART1.
O
TRACEPKT1 — Trace Packet, bit 1.
I/O
P2[7] — General purpose digital input/output pin.
I
RD2 — CAN2 receiver input.
O
RTS1 — Request to Send output for UART1.
P2[7]/RD2/
RTS1/
TRACEPKT2
136[1]
P2[8]/TD2/
TXD2/
TRACEPKT3
134[1]
P2[9]/
USB_CONNECT1/
RXD2/
EXTIN0
132[1]
P2[10]/EINT0
110[6]
E16[1]
D17[1]
F16[1]
E17[1]
G16[1]
H15[1]
H16[1]
N15[6]
O
TRACEPKT2 — Trace Packet, bit 2.
I/O
P2[8] — General purpose digital input/output pin.
O
TD2 — CAN2 transmitter output.
O
TXD2 — Transmitter output for UART2.
O
TRACEPKT3 — Trace Packet, bit 3.
I/O
P2[9] — General purpose digital input/output pin.
O
USB_CONNECT1 — USB1 SoftConnect control. Signal used to switch
an external 1.5 kΩ resistor under the software control. Used with the
SoftConnect USB feature.
I
RXD2 — Receiver input for UART2.
I
EXTIN0 — External Trigger Input.
I/O
P2[10] — General purpose digital input/output pin.
Note: LOW on this pin while RESET is LOW forces on-chip bootloader to
take over control of the part after a reset.
I
EINT0 — External interrupt 0 input.
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
15 of 68
LPC2460
NXP Semiconductors
Fast communication chip
Table 4.
Pin description …continued
Symbol
Pin
Ball
Type
Description
P2[11]/EINT1/
MCIDAT1/
I2STX_CLK
108[6]
T17[6]
I/O
P2[11] — General purpose digital input/output pin.
I
EINT1 — External interrupt 1 input.
I/O
MCIDAT1 — Data line 1 for SD/MMC interface.
I/O
I2STX_CLK — Transmit Clock. It is driven by the master and received by
the slave. Corresponds to the signal SCK in the I2S-bus specification.
I/O
P2[12] — General purpose digital input/output pin.
I
EINT2 — External interrupt 2 input.
I/O
MCIDAT2 — Data line 2 for SD/MMC interface.
I/O
I2STX_WS — Transmit Word Select. It is driven by the master and
received by the slave. Corresponds to the signal WS in the I2S-bus
specification.
P2[12]/EINT2/
MCIDAT2/
I2STX_WS
P2[13]/EINT3/
MCIDAT3/
I2STX_SDA
P2[14]/CS2/
CAP2[0]/SDA1
P2[15]/CS3/
CAP2[1]/SCL1
106[6]
102[6]
91[6]
99[6]
N14[6]
T16[6]
R12[6]
P13[6]
I/O
P2[13] — General purpose digital input/output pin.
I
EINT3 — External interrupt 3 input.
I/O
MCIDAT3 — Data line 3 for SD/MMC interface.
I/O
I2STX_SDA — Transmit data. It is driven by the transmitter and read by
the receiver. Corresponds to the signal SD in the I2S-bus specification.
I/O
P2[14] — General purpose digital input/output pin.
O
CS2 — LOW active Chip Select 2 signal.
I
CAP2[0] — Capture input for Timer 2, channel 0.
I/O
SDA1 — I2C1 data input/output (this is not an open-drain pin).
I/O
P2[15] — General purpose digital input/output pin.
O
CS3 — LOW active Chip Select 3 signal.
I
CAP2[1] — Capture input for Timer 2, channel 1.
I/O
SCL1 — I2C1 clock input/output (this is not an open-drain pin).
I/O
P2[16] — General purpose digital input/output pin.
P2[16]/CAS
87[1]
R11[1]
O
CAS — LOW active SDRAM Column Address Strobe.
P2[17]/RAS
95[1]
R13[1]
I/O
P2[17] — General purpose digital input/output pin.
O
RAS — LOW active SDRAM Row Address Strobe.
P2[18]/
CLKOUT0
59[1]
U3[1]
I/O
P2[18] — General purpose digital input/output pin.
O
CLKOUT0 — SDRAM clock 0.
P2[19]/
CLKOUT1
67[1]
R7[1]
I/O
P2[19] — General purpose digital input/output pin.
O
CLKOUT1 — SDRAM clock 1.
P2[20]/DYCS0
73[1]
T8[1]
I/O
P2[20] — General purpose digital input/output pin.
O
DYCS0 — SDRAM chip select 0.
P2[21]/DYCS1
81[1]
U11[1]
I/O
P2[21] — General purpose digital input/output pin.
O
DYCS1 — SDRAM chip select 1.
P2[22]/DYCS2/
CAP3[0]/SCK0
85[1]
U12[1]
I/O
P2[22] — General purpose digital input/output pin.
O
DYCS2 — SDRAM chip select 2.
I
CAP3[0] — Capture input for Timer 3, channel 0.
I/O
SCK0 — Serial clock for SSP0.
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
16 of 68
LPC2460
NXP Semiconductors
Fast communication chip
Table 4.
Pin description …continued
Symbol
Pin
Ball
Type
Description
P2[23]/DYCS3/
CAP3[1]/SSEL0
64[1]
U5[1]
I/O
P2[23] — General purpose digital input/output pin.
O
DYCS3 — SDRAM chip select 3.
I
CAP3[1] — Capture input for Timer 3, channel 1.
I/O
SSEL0 — Slave Select for SSP0.
I/O
P2[24] — General purpose digital input/output pin.
O
CKEOUT0 — SDRAM clock enable 0.
I/O
P2[25] — General purpose digital input/output pin.
P2[24]/
CKEOUT0
53[1]
P5[1]
P2[25]/
CKEOUT1
54[1]
R4[1]
O
CKEOUT1 — SDRAM clock enable 1.
P2[26]/
CKEOUT2/
MAT3[0]/MISO0
57[1]
T4[1]
I/O
P2[26] — General purpose digital input/output pin.
O
CKEOUT2 — SDRAM clock enable 2.
O
MAT3[0] — Match output for Timer 3, channel 0.
P2[27]/
CKEOUT3/
MAT3[1]/MOSI0
47[1]
P2[28]/
DQMOUT0
49[1]
P4[1]
P2[29]/
DQMOUT1
43[1]
N3[1]
O
DQMOUT1 — Data mask 1 used with SDRAM and static devices.
P2[30]/
DQMOUT2/
MAT3[2]/SDA2
31[1]
L4[1]
I/O
P2[30] — General purpose digital input/output pin.
O
DQMOUT2 — Data mask 2 used with SDRAM and static devices.
O
MAT3[2] — Match output for Timer 3, channel 2.
I/O
SDA2 — I2C2 data input/output (this is not an open-drain pin).
I/O
P2[31] — General purpose digital input/output pin.
O
DQMOUT3 — Data mask 3 used with SDRAM and static devices.
O
MAT3[3] — Match output for Timer 3, channel 3.
I/O
SCL2 — I2C2 clock input/output (this is not an open-drain pin).
I/O
Port 3: Port 3 is a 32-bit I/O port with individual direction controls for each
bit. The operation of port 3 pins depends upon the pin function selected
via the Pin Connect block.
I/O
P3[0] — General purpose digital input/output pin.
I/O
D0 — External memory data line 0.
I/O
P3[1] — General purpose digital input/output pin.
I/O
D1 — External memory data line 1.
I/O
P3[2] — General purpose digital input/output pin.
I/O
D2 — External memory data line 2.
I/O
P3[3] — General purpose digital input/output pin.
I/O
D3 — External memory data line 3.
I/O
P3[4] — General purpose digital input/output pin.
I/O
D4 — External memory data line 4.
P2[31]/
DQMOUT3/
MAT3[3]/SCL2
39[1]
P3[1]
N2[1]
P3[0] to P3[31]
P3[0]/D0
197[1]
B4[1]
P3[1]/D1
201[1]
B3[1]
P3[2]/D2
207[1]
B1[1]
P3[3]/D3
3[1]
E4[1]
P3[4]/D4
13[1]
F2[1]
I/O
MISO0 — Master In Slave Out for SSP0.
I/O
P2[27] — General purpose digital input/output pin.
O
CKEOUT3 — SDRAM clock enable 3.
O
MAT3[1] — Match output for Timer 3, channel 1.
I/O
MOSI0 — Master Out Slave In for SSP0.
I/O
P2[28] — General purpose digital input/output pin.
O
DQMOUT0 — Data mask 0 used with SDRAM and static devices.
I/O
P2[29] — General purpose digital input/output pin.
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
17 of 68
LPC2460
NXP Semiconductors
Fast communication chip
Table 4.
Pin description …continued
Symbol
Pin
Ball
Type
Description
P3[5]/D5
17[1]
G1[1]
I/O
P3[5] — General purpose digital input/output pin.
I/O
D5 — External memory data line 5.
P3[6]/D6
23[1]
J1[1]
I/O
P3[6] — General purpose digital input/output pin.
I/O
D6 — External memory data line 6.
P3[7]/D7
27[1]
L1[1]
I/O
P3[7] — General purpose digital input/output pin.
I/O
D7 — External memory data line 7.
P3[8]/D8
191[1]
D8[1]
I/O
P3[8] — General purpose digital input/output pin.
I/O
D8 — External memory data line 8.
P3[9]/D9
199[1]
C5[1]
I/O
P3[9] — General purpose digital input/output pin.
I/O
D9 — External memory data line 9.
P3[10]/D10
205[1]
B2[1]
I/O
P3[10] — General purpose digital input/output pin.
I/O
D10 — External memory data line 10.
P3[11]/D11
208[1]
D5[1]
I/O
P3[11] — General purpose digital input/output pin.
I/O
D11 — External memory data line 11.
P3[12]/D12
1[1]
D4[1]
I/O
P3[12] — General purpose digital input/output pin.
I/O
D12 — External memory data line 12.
P3[13]/D13
7[1]
C1[1]
I/O
P3[13] — General purpose digital input/output pin.
I/O
D13 — External memory data line 13.
P3[14]/D14
21[1]
H2[1]
I/O
P3[14] — General purpose digital input/output pin.
I/O
D14 — External memory data line 14. On POR, this pin serves as the
BOOT0 pin.
I/O
P3[15] — General purpose digital input/output pin.
I/O
D15 — External memory data line 15. On POR, this pin serves as the
BOOT1 pin.
P3[15]/D15
28[1]
M1[1]
BOOT[1:0] = 00 selects 8-bit external memory on CS1.
BOOT[1:0] = 01 is reserved. Do not use.
BOOT[1:0] = 10 selects 32-bit external memory on CS1.
BOOT[1:0] = 11 selects 16-bit external memory on CS1.
P3[16]/D16/
PWM0[1]/TXD1
P3[17]/D17/
PWM0[2]/RXD1
P3[18]/D18/
PWM0[3]/CTS1
137[1]
143[1]
151[1]
F17[1]
F15[1]
C15[1]
I/O
P3[16] — General purpose digital input/output pin.
I/O
D16 — External memory data line 16.
O
PWM0[1] — Pulse Width Modulator 0, output 1.
O
TXD1 — Transmitter output for UART1.
I/O
P3[17] — General purpose digital input/output pin.
I/O
D17 — External memory data line 17.
O
PWM0[2] — Pulse Width Modulator 0, output 2.
I
RXD1 — Receiver input for UART1.
I/O
P3[18] — General purpose digital input/output pin.
I/O
D18 — External memory data line 18.
O
PWM0[3] — Pulse Width Modulator 0, output 3.
I
CTS1 — Clear to Send input for UART1.
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
18 of 68
LPC2460
NXP Semiconductors
Fast communication chip
Table 4.
Pin description …continued
Symbol
Pin
Ball
Type
Description
P3[19]/D19/
PWM0[4]/DCD1
161[1]
B14[1]
I/O
P3[19] — General purpose digital input/output pin.
I/O
D19 — External memory data line 19.
O
PWM0[4] — Pulse Width Modulator 0, output 4.
P3[20]/D20/
PWM0[5]/DSR1
P3[21]/D21/
PWM0[6]/DTR1
P3[22]/D22/
PCAP0[0]/RI1
167[1]
175[1]
195[1]
P3[23]/D23/
CAP0[0]/
PCAP1[0]
65[1]
P3[24]/D24/
CAP0[1]/
PWM1[1]
58[1]
P3[25]/D25/
MAT0[0]/
PWM1[2]
56[1]
P3[26]/D26/
MAT0[1]/
PWM1[3]
55[1]
P3[27]/D27/
CAP1[0]/
PWM1[4]
203[1]
P3[28]/D28/
CAP1[1]/
PWM1[5]
5[1]
A13[1]
C10[1]
C6[1]
T6[1]
R5[1]
U2[1]
T3[1]
A1[1]
D2[1]
I
DCD1 — Data Carrier Detect input for UART1.
I/O
P3[20] — General purpose digital input/output pin.
I/O
D20 — External memory data line 20.
O
PWM0[5] — Pulse Width Modulator 0, output 5.
I
DSR1 — Data Set Ready input for UART1.
I/O
P3[21] — General purpose digital input/output pin.
I/O
D21 — External memory data line 21.
O
PWM0[6] — Pulse Width Modulator 0, output 6.
O
DTR1 — Data Terminal Ready output for UART1.
I/O
P3[22] — General purpose digital input/output pin.
I/O
D22 — External memory data line 22.
I
PCAP0[0] — Capture input for PWM0, channel 0.
I
RI1 — Ring Indicator input for UART1.
I/O
P3[23] — General purpose digital input/output pin.
I/O
D23 — External memory data line 23.
I
CAP0[0] — Capture input for Timer 0, channel 0.
I
PCAP1[0] — Capture input for PWM1, channel 0.
I/O
P3[24] — General purpose digital input/output pin.
I/O
D24 — External memory data line 24.
I
CAP0[1] — Capture input for Timer 0, channel 1.
O
PWM1[1] — Pulse Width Modulator 1, output 1.
I/O
P3[25] — General purpose digital input/output pin.
I/O
D25 — External memory data line 25.
O
MAT0[0] — Match output for Timer 0, channel 0.
O
PWM1[2] — Pulse Width Modulator 1, output 2.
I/O
P3[26] — General purpose digital input/output pin.
I/O
D26 — External memory data line 26.
O
MAT0[1] — Match output for Timer 0, channel 1.
O
PWM1[3] — Pulse Width Modulator 1, output 3.
I/O
P3[27] — General purpose digital input/output pin.
I/O
D27 — External memory data line 27.
I
CAP1[0] — Capture input for Timer 1, channel 0.
O
PWM1[4] — Pulse Width Modulator 1, output 4.
I/O
P3[28] — General purpose digital input/output pin.
I/O
D28 — External memory data line 28.
I
CAP1[1] — Capture input for Timer 1, channel 1.
O
PWM1[5] — Pulse Width Modulator 1, output 5.
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
19 of 68
LPC2460
NXP Semiconductors
Fast communication chip
Table 4.
Pin description …continued
Symbol
Pin
Ball
Type
Description
P3[29]/D29/
MAT1[0]/
PWM1[6]
11[1]
F3[1]
I/O
P3[29] — General purpose digital input/output pin.
I/O
D29 — External memory data line 29.
O
MAT1[0] — Match output for Timer 1, channel 0.
P3[30]/D30/
MAT1[1]/
RTS1
19[1]
P3[31]/D31/
MAT1[2]
25[1]
H3[1]
J3[1]
P4[0] to P4[31]
O
PWM1[6] — Pulse Width Modulator 1, output 6.
I/O
P3[30] — General purpose digital input/output pin.
I/O
D30 — External memory data line 30.
O
MAT1[1] — Match output for Timer 1, channel 1.
O
RTS1 — Request to Send output for UART1.
I/O
P3[31] — General purpose digital input/output pin.
I/O
D31 — External memory data line 31.
O
MAT1[2] — Match output for Timer 1, channel 2.
I/O
Port 4: Port 4 is a 32-bit I/O port with individual direction controls for each
bit. The operation of port 4 pins depends upon the pin function selected
via the Pin Connect block.
I/O
P4[0] — ]General purpose digital input/output pin.
I/O
A0 — External memory address line 0.
I/O
P4[1] — General purpose digital input/output pin.
I/O
A1 — External memory address line 1.
I/O
P4[2] — General purpose digital input/output pin.
I/O
A2 — External memory address line 2.
I/O
P4[3] — General purpose digital input/output pin.
I/O
A3 — External memory address line 3.
I/O
P4[4] — General purpose digital input/output pin.
I/O
A4 — External memory address line 4.
I/O
P4[5] — General purpose digital input/output pin.
I/O
A5 — External memory address line 5.
I/O
P4[6] — General purpose digital input/output pin.
I/O
A6 — External memory address line 6.
I/O
P4[7] — General purpose digital input/output pin.
I/O
A7 — External memory address line 7.
I/O
P4[8] — General purpose digital input/output pin.
I/O
A8 — External memory address line 8.
I/O
P4[9] — General purpose digital input/output pin.
P4[0]/A0
75[1]
U9[1]
P4[1]/A1
79[1]
U10[1]
P4[2]/A2
83[1]
T11[1]
P4[3]/A3
97[1]
U16[1]
P4[4]/A4
103[1]
R15[1]
P4[5]/A5
107[1]
R16[1]
P4[6]/A6
113[1]
M14[1]
P4[7]/A7
121[1]
L16[1]
P4[8]/A8
127[1]
J17[1]
P4[9]/A9
131[1]
H17[1]
I/O
A9 — External memory address line 9.
P4[10]/A10
135[1]
G17[1]
I/O
P4[10] — General purpose digital input/output pin.
I/O
A10 — External memory address line 10.
P4[11]/A11
145[1]
F14[1]
I/O
P4[11] — General purpose digital input/output pin.
I/O
A11 — External memory address line 11.
P4[12]/A12
149[1]
C16[1]
I/O
P4[12] — General purpose digital input/output pin.
I/O
A12 — External memory address line 12.
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
20 of 68
LPC2460
NXP Semiconductors
Fast communication chip
Table 4.
Pin description …continued
Symbol
Pin
Ball
Type
Description
P4[13]/A13
155[1]
B16[1]
I/O
P4[13] — General purpose digital input/output pin.
I/O
A13 — External memory address line 13.
P4[14]/A14
159[1]
B15[1]
I/O
P4[14] — General purpose digital input/output pin.
I/O
A14 — External memory address line 14.
P4[15]/A15
173[1]
A11[1]
I/O
P4[15] — General purpose digital input/output pin.
I/O
A15 — External memory address line 15.
P4[16]/A16
101[1]
U17[1]
I/O
P4[16] — General purpose digital input/output pin.
I/O
A16 — External memory address line 16.
P4[17]/A17
104[1]
P14[1]
I/O
P4[17] — General purpose digital input/output pin.
I/O
A17 — External memory address line 17.
P4[18]/A18
105[1]
P15[1]
I/O
P4[18] — General purpose digital input/output pin.
I/O
A18 — External memory address line 18.
P4[19]/A19
111[1]
P16[1]
I/O
P4[19] — General purpose digital input/output pin.
I/O
A19 — External memory address line 19.
P4[20]/A20/
SDA2/SCK1
109[1]
R17[1]
I/O
P4[20] — General purpose digital input/output pin.
I/O
A20 — External memory address line 20.
I/O
SDA2 — I2C2 data input/output (this is not an open-drain pin).
I/O
SCK1 — Serial Clock for SSP1.
I/O
P4[21] — General purpose digital input/output pin.
I/O
A21 — External memory address line 21.
I/O
SCL2 — I2C2 clock input/output (this is not an open-drain pin).
I/O
SSEL1 — Slave Select for SSP1.
I/O
P4[22] — General purpose digital input/output pin.
I/O
A22 — External memory address line 22.
O
TXD2 — Transmitter output for UART2.
I/O
MISO1 — Master In Slave Out for SSP1.
I/O
P4[23] — General purpose digital input/output pin.
I/O
A23 — External memory address line 23.
I
RXD2 — Receiver input for UART2.
P4[21]/A21/
SCL2/SSEL1
P4[22]/A22/
TXD2/MISO1
P4[23]/A23/
RXD2/MOSI1
115[1]
123[1]
129[1]
M15[1]
K14[1]
J15[1]
I/O
MOSI1 — Master Out Slave In for SSP1.
P4[24]/OE
183[1]
B8[1]
I/O
P4[24] — General purpose digital input/output pin.
O
OE — LOW active Output Enable signal.
P4[25]/WE
179[1]
B9[1]
I/O
P4[25] — General purpose digital input/output pin.
O
WE — LOW active Write Enable signal.
P4[26]/BLS0
119[1]
L15[1]
I/O
P4[26] — General purpose digital input/output pin.
O
BLS0 — LOW active Byte Lane select signal 0.
P4[27]/BLS1
139[1]
G15[1]
I/O
P4[27] — General purpose digital input/output pin.
O
BLS1 — LOW active Byte Lane select signal 1.
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
21 of 68
LPC2460
NXP Semiconductors
Fast communication chip
Table 4.
Pin description …continued
Symbol
Pin
Ball
Type
Description
P4[28]/BLS2/
MAT2[0]/TXD3
170[1]
C11[1]
I/O
P4 [28] — General purpose digital input/output pin.
O
BLS2 — LOW active Byte Lane select signal 2.
O
MAT2[0] — Match output for Timer 2, channel 0.
P4[29]/BLS3/
MAT2[1]/RXD3
176[1]
B10[1]
O
TXD3 — Transmitter output for UART3.
I/O
P4[29] — General purpose digital input/output pin.
O
BLS3 — LOW active Byte Lane select signal 3.
O
MAT2[1] — Match output for Timer 2, channel 1.
I
RXD3 — Receiver input for UART3.
I/O
P4[30] — General purpose digital input/output pin.
O
CS0 — LOW active Chip Select 0 signal.
I/O
P4[31] — General purpose digital input/output pin.
O
CS1 — LOW active Chip Select 1 signal.
O
ALARM — RTC controlled output. This is a 1.8 V pin. It goes HIGH when
a RTC alarm is generated.
P4[30]/CS0
187[1]
B7[1]
P4[31]/CS1
193[1]
A4[1]
ALARM
37[8]
N1[8]
USB_D−2
52
U1
I/O
USB_D−2 — USB port 2 bidirectional D− line.
DBGEN
9[1]
F4[1]
I
DBGEN — JTAG interface control signal. Also used for boundary
scanning.
TDO
2[1]
D3[1]
O
TDO — Test data out for JTAG interface.
TDI
4[1]
C2[1]
I
TDI — Test data in for JTAG interface.
TMS
6[1]
E3[1]
I
TMS — Test Mode Select for JTAG interface.
TRST
8[1]
D1[1]
I
TRST — Test Reset for JTAG interface.
TCK
10[1]
E2[1]
I
TCK — Test Clock for JTAG interface. This clock must be slower than 1⁄6
of the CPU clock (CCLK) for the JTAG interface to operate.
RTCK
206[1]
C3[1]
I/O
RTCK — JTAG interface control signal.
Note: LOW on this pin while RESET is LOW enables ETM pins (P2[9:0])
to operate as Trace port after reset.
RSTOUT
29
K3
O
RSTOUT — This is a 3.3 V pin. LOW on this pin indicates LPC2460 being
in Reset state.
RESET
35[7]
M2[7]
I
external reset input: A LOW on this pin resets the device, causing I/O
ports and peripherals to take on their default states, and processor
execution to begin at address 0. TTL with hysteresis, 5 V tolerant.
XTAL1
44[8]
M4[8]
I
Input to the oscillator circuit and internal clock generator circuits.
XTAL2
46[8]
N4[8]
O
Output from the oscillator amplifier.
RTCX1
34[8]
K2[8]
I
Input to the RTC oscillator circuit.
RTCX2
36[8]
L2[8]
O
VSSIO
33, 63,
77, 93,
114,
133,
148,
169,
189,
200[9]
L3, T5, I
R9,
P12,
N16,
H14,
E15,
A12,
B6, A2[9]
ground: 0 V reference for the digital I/O pins.
VSSCORE
32, 84,
172[9]
K4, P10, I
D12[9]
ground: 0 V reference for the core.
Output from the RTC oscillator circuit.
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Fast communication chip
Table 4.
Pin description …continued
Symbol
Pin
Ball
Type
Description
VSSA
22[10]
J2[10]
I
analog ground: 0 V reference. This should nominally be the same
voltage as VSSIO/VSSCORE, but should be isolated to minimize noise and
error.
VDD(3V3)
15, 60,
71, 89,
112,
125,
146,
165,
181,
198[11]
G3,
P6, P8,
U13,
P17,
K16,
C17,
B13,
C9,
D7[11]
I
3.3 V supply voltage: This is the power supply voltage for the I/O ports.
n.c.
30, 117, J4, L14, I
141[12]
G14[12]
not connected pins: These pins must be left unconnected (floating).
VDD(DCDC)(3V3)
26, 86,
174[13]
H4,
P11,
D11[13]
I
3.3 V DC-to-DC converter supply voltage: This is the power supply for
the on-chip DC-to-DC converter.
VDDA
20[14]
G4[14]
I
analog 3.3 V pad supply voltage: This should be nominally the same
voltage as VDD(3V3) but should be isolated to minimize noise and error.
This voltage is used to power the ADC and DAC.
VREF
24[14]
K1[14]
I
ADC reference: This should be nominally the same voltage as VDD(3V3)
but should be isolated to minimize noise and error. The level on this pin is
used as a reference for ADC and DAC.
VBAT
38[14]
M3[14]
I
RTC power supply: 3.3 V on this pin supplies the power to the RTC.
[1]
5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis.
[2]
5 V tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input. When configured as a ADC input,
digital section of the pad is disabled.
[3]
5 V tolerant pad providing digital I/O with TTL levels and hysteresis and analog output function. When configured as the DAC output,
digital section of the pad is disabled.
[4]
Open-drain 5 V tolerant digital I/O pad, compatible with I2C-bus 400 kHz specification. It requires an external pull-up to provide output
functionality. When power is switched off, this pin connected to the I2C-bus is floating and does not disturb the I2C lines. Open-drain
configuration applies to all functions on this pin.
[5]
Pad provides digital I/O and USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and
Low-speed mode only).
[6]
5 V tolerant pad with 5 ns glitch filter providing digital I/O functions with TTL levels and hysteresis.
[7]
5 V tolerant pad with 20 ns glitch filter providing digital I/O function with TTL levels and hysteresis.
[8]
Pad provides special analog functionality.
[9]
Pad provides special analog functionality.
[10] Pad provides special analog functionality.
[11] Pad provides special analog functionality.
[12] Pad provides special analog functionality.
[13] Pad provides special analog functionality.
[14] Pad provides special analog functionality.
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7. Functional description
7.1 Architectural overview
The LPC2460 microcontroller consists of an ARM7TDMI-S CPU with emulation support,
the ARM7 local bus for closely coupled, high-speed access to the majority of on-chip
memory, the AMBA AHB interfacing to high-speed on-chip peripherals and external
memory, and the AMBA APB for connection to other on-chip peripheral functions. The
microcontroller permanently configures the ARM7TDMI-S processor for little-endian byte
order.
The LPC2460 implements two AHB in order to allow the Ethernet block to operate without
interference caused by other system activity. The primary AHB, referred to as AHB1,
includes the VIC, GPDMA controller, and EMC.
The second AHB, referred to as AHB2, includes only the Ethernet block and an
associated 16 kB SRAM. In addition, a bus bridge is provided that allows the secondary
AHB to be a bus master on AHB1, allowing expansion of Ethernet buffer space into
off-chip memory or unused space in memory residing on AHB1.
In summary, bus masters with access to AHB1 are the ARM7 itself, the GPDMA function,
and the Ethernet block (via the bus bridge from AHB2). Bus masters with access to AHB2
are the ARM7 and the Ethernet block.
AHB peripherals are allocated a 2 MB range of addresses at the very top of the 4 GB
ARM memory space. Each AHB peripheral is allocated a 16 kB address space within the
AHB address space. Lower speed peripheral functions are connected to the APB. The
AHB to APB bridge interfaces the APB to the AHB. APB peripherals are also allocated a
2 MB range of addresses, beginning at the 3.5 GB address point. Each APB peripheral is
allocated a 16 kB address space within the APB address space.
The ARM7TDMI-S processor is a general purpose 32-bit microprocessor, which offers
high performance and very low power consumption. The ARM architecture is based on
Reduced Instruction Set Computer (RISC) principles, and the instruction set and related
decode mechanism are much simpler than those of microprogrammed complex
instruction set computers. This simplicity results in a high instruction throughput and
impressive real-time interrupt response from a small and cost-effective processor core.
Pipeline techniques are employed so that all parts of the processing and memory systems
can operate continuously. Typically, while one instruction is being executed, its successor
is being decoded, and a third instruction is being fetched from memory.
The ARM7TDMI-S processor also employs a unique architectural strategy known as
Thumb, which makes it ideally suited to high-volume applications with memory
restrictions, or applications where code density is an issue.
The key idea behind Thumb is that of a super-reduced instruction set. Essentially, the
ARM7TDMI-S processor has two instruction sets:
• the standard 32-bit ARM set
• a 16-bit Thumb set
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The Thumb set’s 16-bit instruction length allows it to approach higher density compared to
standard ARM code while retaining most of the ARM’s performance.
7.2 On-chip SRAM
The LPC2460 includes a SRAM memory of 64 kB reserved for the ARM processor
exclusive use. This RAM may be used for code and/or data storage and may be accessed
as 8 bits, 16 bits, and 32 bits.
A 16 kB SRAM block serving as a buffer for the Ethernet controller and a 16 kB SRAM
associated with the second AHB can be used both for data and code storage, too. The
2 kB RTC SRAM can be used for data storage only. The RTC SRAM is battery powered
and retains the content in the absence of the main power supply.
7.3 Memory map
The LPC2460 memory map incorporates several distinct regions as shown in Table 5 and
Figure 4.
In addition, the CPU interrupt vectors may be remapped to allow them to reside in boot
ROM or SRAM (see Section 7.25.6).
Table 5.
LPC2460 memory usage and details
Address range General use
Address range details and description
0x0000 0000 to
0x3FFF FFFF
0x3FFF C000 to 0x3FFF FFFF
fast GPIO registers
0x4000 0000 to 0x4000 FFFF
RAM (64 kB)
0x7FE0 0000 to 0x7FE0 3FFF
ethernet RAM (16 kB)
0x7FD0 0000 to 0x7FD0 3FFF
USB RAM (16 kB)
fast I/O
0x4000 0000 to on-chip RAM
0x7FFF FFFF
0x8000 0000 to off-chip memory
0xDFFF FFFF
Four static memory banks, 16 MB each
0x8000 0000 to 0x80FF FFFF
static memory bank 0
0x8100 0000 to 0x81FF FFFF
static memory bank 1
0x8200 0000 to 0x82FF FFFF
static memory bank 2
0x8300 0000 to 0x83FF FFFF
static memory bank 3
Four dynamic memory banks, 256 MB each
0xE000 0000 to APB peripherals
0xEFFF FFFF
0xA000 0000 to 0xAFFF FFFF
dynamic memory bank 0
0xB000 0000 to 0xBFFF FFFF
dynamic memory bank 1
0xC000 0000 to 0xCFFF FFFF
dynamic memory bank 2
0xD000 0000 to 0xDFFF FFFF
dynamic memory bank 3
36 peripheral blocks, 16 kB each
0xF000 0000 to AHB peripherals
0xFFFF FFFF
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4.0 GB
0xFFFF FFFF
AHB PERIPHERALS
3.75 GB
0xF000 0000
APB PERIPHERALS
3.5 GB
0xE000 0000
EXTERNAL STATIC AND DYNAMIC MEMORY
2.0 GB
0x8000 0000
0x7FFF FFFF
BOOT ROM
RESERVED ADDRESS SPACE
ON-CHIP STATIC RAM
1.0 GB
0x4000 0000
0x3FFF FFFF
SPECIAL REGISTERS
0x3FFF 8000
RESERVED ADDRESS SPACE
0.0 GB
0x0000 0000
002aad316
Fig 4. LPC2460 memory map
7.4 Interrupt controller
The ARM processor core has two interrupt inputs called Interrupt Request (IRQ) and Fast
Interrupt Request (FIQ). The VIC takes 32 interrupt request inputs which can be
programmed as FIQ or vectored IRQ types. The programmable assignment scheme
means that priorities of interrupts from the various peripherals can be dynamically
assigned and adjusted.
FIQs have the highest priority. If more than one request is assigned to FIQ, the VIC ORs
the requests to produce the FIQ signal to the ARM processor. The fastest possible FIQ
latency is achieved when only one request is classified as FIQ, because then the FIQ
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service routine can simply start dealing with that device. But if more than one request is
assigned to the FIQ class, the FIQ service routine can read a word from the VIC that
identifies which FIQ source(s) is (are) requesting an interrupt.
Vectored IRQs, which include all interrupt requests that are not classified as FIQs, have a
programmable interrupt priority. When more than one interrupt is assigned the same
priority and occur simultaneously, the one connected to the lowest numbered VIC channel
will be serviced first.
The VIC ORs the requests from all of the vectored IRQs to produce the IRQ signal to the
ARM processor. The IRQ service routine can start by reading a register from the VIC and
jumping to the address supplied by that register.
7.4.1 Interrupt sources
Each peripheral device has one interrupt line connected to the VIC but may have several
interrupt flags. Individual interrupt flags may also represent more than one interrupt
source.
Any pin on port 0 and port 2 (total of 64 pins) regardless of the selected function, can be
programmed to generate an interrupt on a rising edge, a falling edge, or both. Such
interrupt request coming from port 0 and/or port 2 will be combined with the EINT3
interrupt requests.
7.5 Pin connect block
The pin connect block allows selected pins of the microcontroller to have more than one
function. Configuration registers control the multiplexers to allow connection between the
pin and the on chip peripherals.
Peripherals should be connected to the appropriate pins prior to being activated and prior
to any related interrupt(s) being enabled. Activity of any enabled peripheral function that is
not mapped to a related pin should be considered undefined.
7.6 External memory controller
The LPC2460 EMC is an ARM PrimeCell MultiPort Memory Controller peripheral offering
support for asynchronous static memory devices such as RAM, ROM, and flash. In
addition, it can be used as an interface with off-chip memory-mapped devices and
peripherals. The EMC is an Advanced Microcontroller Bus Architecture (AMBA) compliant
peripheral.
7.6.1 Features
• Dynamic memory interface support including Single Data Rate SDRAM.
• Asynchronous static memory device support including RAM, ROM, and flash, with or
without asynchronous page mode.
•
•
•
•
•
Low transaction latency.
Read and write buffers to reduce latency and to improve performance.
8/16/32 data and 24 address lines wide static memory support.
16 bit and 32 bit wide chip select SDRAM memory support.
Static memory features include:
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– Asynchronous page mode read
– Programmable Wait States
– Bus turnaround delay
– Output enable and write enable delays
– Extended wait
• Four chip selects for synchronous memory and four chip selects for static memory
devices.
• Power-saving modes dynamically control CKE and CLKOUT to SDRAMs.
• Dynamic memory self-refresh mode controlled by software.
• Controller supports 2048, 4096, and 8192 row address synchronous memory parts.
That is typical 512 MB, 256 MB, and 128 MB parts, with 4, 8, 16, or 32 data bits per
device.
• Separate reset domains allow the for auto-refresh through a chip reset if desired.
Note: Synchronous static memory devices (synchronous burst mode) are not supported.
7.7 General purpose DMA controller
The GPDMA is an AMBA AHB compliant peripheral allowing selected LPC2460
peripherals to have DMA support.
The GPDMA enables peripheral-to-memory, memory-to-peripheral,
peripheral-to-peripheral, and memory-to-memory transactions. Each DMA stream
provides unidirectional serial DMA transfers for a single source and destination. For
example, a bidirectional port requires one stream for transmit and one for receive. The
source and destination areas can each be either a memory region or a peripheral, and
can be accessed through the AHB master.
7.7.1 Features
• Two DMA channels. Each channel can support a unidirectional transfer.
• The GPDMA can transfer data between the 16 kB SRAM, external memory, and
peripherals such as the SD/MMC, two SSPs, and the I2S interface.
• Single DMA and burst DMA request signals. Each peripheral connected to the
GPDMA can assert either a burst DMA request or a single DMA request. The DMA
burst size is set by programming the GPDMA.
• Memory-to-memory, memory-to-peripheral, peripheral-to-memory, and
peripheral-to-peripheral transfers.
• Scatter or gather DMA is supported through the use of linked lists. This means that
the source and destination areas do not have to occupy contiguous areas of memory.
• Hardware DMA channel priority. Each DMA channel has a specific hardware priority.
DMA channel 0 has the highest priority and channel 1 has the lowest priority. If
requests from two channels become active at the same time, the channel with the
highest priority is serviced first.
• AHB slave DMA programming interface. The GPDMA is programmed by writing to the
DMA control registers over the AHB slave interface.
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• One AHB master for transferring data. This interface transfers data when a DMA
request goes active.
• 32-bit AHB master bus width.
• Incrementing or non-incrementing addressing for source and destination.
• Programmable DMA burst size. The DMA burst size can be programmed to more
efficiently transfer data. Usually the burst size is set to half the size of the FIFO in the
peripheral.
• Internal four-word FIFO per channel.
• Supports 8-bit, 16-bit, and 32-bit wide transactions.
• An interrupt to the processor can be generated on a DMA completion or when a DMA
error has occurred.
• Interrupt masking. The DMA error and DMA terminal count interrupt requests can be
masked.
• Raw interrupt status. The DMA error and DMA count raw interrupt status can be read
prior to masking.
7.8 Fast general purpose parallel I/O
Device pins that are not connected to a specific peripheral function are controlled by the
GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate
registers allow setting or clearing any number of outputs simultaneously. The value of the
output register may be read back as well as the current state of the port pins.
LPC2460 use accelerated GPIO functions:
• GPIO registers are relocated to the ARM local bus so that the fastest possible I/O
timing can be achieved.
• Mask registers allow treating sets of port bits as a group, leaving other bits
unchanged.
• All GPIO registers are byte and half-word addressable.
• Entire port value can be written in one instruction.
Additionally, any pin on port 0 and port 2 (total of 64 pins) that is not configured as an
analog input/output can be programmed to generate an interrupt on a rising edge, a falling
edge, or both. The edge detection is asynchronous, so it may operate when clocks are not
present such as during Power-down mode. Each enabled interrupt can be used to wake
the chip up from Power-down mode.
7.8.1 Features
• Bit level set and clear registers allow a single instruction to set or clear any number of
bits in one port.
• Direction control of individual bits.
• All I/O default to inputs after reset.
• Backward compatibility with other earlier devices is maintained with legacy port 0 and
port 1 registers appearing at the original addresses on the APB.
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7.9 Ethernet
The Ethernet block contains a full featured 10 Mbit/s or 100 Mbit/s Ethernet MAC
designed to provide optimized performance through the use of DMA hardware
acceleration. Features include a generous suite of control registers, half or full duplex
operation, flow control, control frames, hardware acceleration for transmit retry, receive
packet filtering and wake-up on LAN activity. Automatic frame transmission and reception
with scatter-gather DMA off-loads many operations from the CPU.
The Ethernet block and the CPU share a dedicated AHB subsystem that is used to access
the Ethernet SRAM for Ethernet data, control, and status information. All other AHB traffic
in the LPC2460 takes place on a different AHB subsystem, effectively separating Ethernet
activity from the rest of the system. The Ethernet DMA can also access off-chip memory
via the EMC, as well as the SRAM located on another AHB. However, using memory other
than the Ethernet SRAM, especially off-chip memory, will slow Ethernet access to
memory and increase the loading of its AHB.
The Ethernet block interfaces between an off-chip Ethernet PHY using the Media
Independent Interface (MII) or Reduced MII (RMII) protocol and the on-chip Media
Independent Interface Management (MIIM) serial bus.
7.9.1 Features
• Ethernet standards support:
– Supports 10 Mbit/s or 100 Mbit/s PHY devices including 10 Base-T, 100 Base-TX,
100 Base-FX, and 100 Base-T4.
– Fully compliant with IEEE standard 802.3.
– Fully compliant with 802.3x Full Duplex Flow Control and Half Duplex back
pressure.
– Flexible transmit and receive frame options.
– Virtual Local Area Network (VLAN) frame support.
• Memory management:
– Independent transmit and receive buffers memory mapped to shared SRAM.
– DMA managers with scatter/gather DMA and arrays of frame descriptors.
– Memory traffic optimized by buffering and pre-fetching.
• Enhanced Ethernet features:
– Receive filtering.
– Multicast and broadcast frame support for both transmit and receive.
– Optional automatic Frame Check Sequence (FCS) insertion with Circular
Redundancy Check (CRC) for transmit.
– Selectable automatic transmit frame padding.
– Over-length frame support for both transmit and receive allows any length frames.
– Promiscuous receive mode.
– Automatic collision back-off and frame retransmission.
– Includes power management by clock switching.
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– Wake-on-LAN power management support allows system wake-up: using the
receive filters or a magic frame detection filter.
• Physical interface:
– Attachment of external PHY chip through standard MII or RMII interface.
– PHY register access is available via the MIIM interface.
7.10 USB interface
The Universal Serial Bus (USB) is a 4-wire bus that supports communication between a
host and one or more (up to 127) peripherals. The Host Controller allocates the USB
bandwidth to attached devices through a token-based protocol. The bus supports hot
plugging and dynamic configuration of the devices. All transactions are initiated by the
Host Controller.
The LPC2460 USB interface includes a device, Host, and OTG Controller. Details on
typical USB interfacing solutions can be found in Section 11.1 “Suggested USB interface
solutions” on page 56
7.10.1 USB device controller
The device controller enables 12 Mbit/s data exchange with a USB Host Controller. It
consists of a register interface, serial interface engine, endpoint buffer memory, and a
DMA controller. The serial interface engine decodes the USB data stream and writes data
to the appropriate endpoint buffer. The status of a completed USB transfer or error
condition is indicated via status registers. An interrupt is also generated if enabled. When
enabled, the DMA controller transfers data between the endpoint buffer and the USB
RAM.
7.10.1.1
Features
•
•
•
•
•
Fully compliant with USB 2.0 specification (full speed).
Supports 32 physical (16 logical) endpoints with a 4 kB endpoint buffer RAM.
Supports Control, Bulk, Interrupt and Isochronous endpoints.
Scalable realization of endpoints at run time.
Endpoint Maximum packet size selection (up to USB maximum specification) by
software at run time.
• Supports SoftConnect and GoodLink features.
• While USB is in the Suspend mode, LPC2460 can enter one of the reduced power
modes and wake up on USB activity.
• Supports DMA transfers with the DMA RAM of 16 kB on all non-control endpoints.
• Allows dynamic switching between CPU-controlled and DMA modes.
• Double buffer implementation for Bulk and Isochronous endpoints.
7.10.2 USB Host Controller
The Host Controller enables full- and low-speed data exchange with USB devices
attached to the bus. It consists of register interface, serial interface engine and DMA
controller. The register interface complies with the OHCI specification.
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7.10.2.1
Features
• OHCI compliant.
• Two downstream ports.
• Supports per-port power switching.
7.10.3 USB OTG Controller
USB OTG is a supplement to the USB 2.0 specification that augments the capability of
existing mobile devices and USB peripherals by adding host functionality for connection to
USB peripherals.
The OTG Controller integrates the Host Controller, device controller, and a master-only
I2C interface to implement OTG dual-role device functionality. The dedicated I2C interface
controls an external OTG transceiver.
7.10.3.1
Features
• Fully compliant with On-The-Go supplement to the USB 2.0 Specification, Revision
1.0a.
• Hardware support for Host Negotiation Protocol (HNP).
• Includes a programmable timer required for HNP and Session Request Protocol
(SRP).
• Supports any OTG transceiver compliant with the OTG Transceiver Specification
(CEA-2011), Rev. 1.0.
7.11 CAN controller and acceptance filters
The Controller Area Network (CAN) is a serial communications protocol which efficiently
supports distributed real-time control with a very high level of security. Its domain of
application ranges from high-speed networks to low cost multiplex wiring.
The CAN block is intended to support multiple CAN buses simultaneously, allowing the
device to be used as a gateway, switch, or router between two of CAN buses in industrial
or automotive applications.
Each CAN controller has a register structure similar to the NXP SJA1000 and the PeliCAN
Library block, but the 8-bit registers of those devices have been combined in 32-bit words
to allow simultaneous access in the ARM environment. The main operational difference is
that the recognition of received Identifiers, known in CAN terminology as Acceptance
Filtering, has been removed from the CAN controllers and centralized in a global
Acceptance Filter.
7.11.1 Features
•
•
•
•
•
Two CAN controllers and buses.
Data rates to 1 Mbit/s on each bus.
32-bit register and RAM access.
Compatible with CAN specification 2.0B, ISO 11898-1.
Global Acceptance Filter recognizes 11-bit and 29-bit receive identifiers for all CAN
buses.
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• Acceptance Filter can provide FullCAN-style automatic reception for selected
Standard Identifiers.
• Full CAN messages can generate interrupts.
7.12 10-bit ADC
The LPC2460 contains one ADC. It is a single 10-bit successive approximation ADC with
eight channels.
7.12.1 Features
•
•
•
•
•
•
•
•
10-bit successive approximation ADC
Input multiplexing among 8 pins
Power-down mode
Measurement range 0 V to Vi(VREF)
10-bit conversion time ≥ 2.44 µs
Burst conversion mode for single or multiple inputs
Optional conversion on transition of input pin or Timer Match signal
Individual result registers for each ADC channel to reduce interrupt overhead
7.13 10-bit DAC
The DAC allows the LPC2460 to generate a variable analog output. The maximum output
value of the DAC is Vi(VREF).
7.13.1 Features
•
•
•
•
•
10-bit DAC
Resistor string architecture
Buffered output
Power-down mode
Selectable output drive
7.14 UARTs
The LPC2460 contains four UARTs. In addition to standard transmit and receive data
lines, UART1 also provides a full modem control handshake interface.
The UARTs include a fractional baud rate generator. Standard baud rates such as
115200 Bd can be achieved with any crystal frequency above 2 MHz.
7.14.1 Features
•
•
•
•
16 B Receive and Transmit FIFOs.
Register locations conform to 16C550 industry standard.
Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B.
Built-in fractional baud rate generator covering wide range of baud rates without a
need for external crystals of particular values.
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• Fractional divider for baud rate control, auto baud capabilities and FIFO control
mechanism that enables software flow control implementation.
• UART1 equipped with standard modem interface signals. This module also provides
full support for hardware flow control (auto-CTS/RTS).
• UART3 includes an IrDA mode to support infrared communication.
7.15 SPI serial I/O controller
The LPC2460 contains one SPI controller. SPI is a full duplex serial interface designed to
handle multiple masters and slaves connected to a given bus. Only a single master and a
single slave can communicate on the interface during a given data transfer. During a data
transfer the master always sends 8 bits to 16 bits of data to the slave, and the slave
always sends 8 bits to 16 bits of data to the master.
7.15.1 Features
•
•
•
•
•
Compliant with SPI specification
Synchronous, Serial, Full Duplex Communication
Combined SPI master and slave
Maximum data bit rate of one eighth of the input clock rate
8 bits to 16 bits per transfer
7.16 SSP serial I/O controller
The LPC2460 contains two SSP controllers. The SSP controller is capable of operation on
a SPI, 4-wire SSI, or Microwire bus. It can interact with multiple masters and slaves on the
bus. Only a single master and a single slave can communicate on the bus during a given
data transfer. The SSP supports full duplex transfers, with frames of 4 bits to 16 bits of
data flowing from the master to the slave and from the slave to the master. In practice,
often only one of these data flows carries meaningful data.
7.16.1 Features
• Compatible with Motorola SPI, 4-wire TI SSI, and National Semiconductor Microwire
buses
•
•
•
•
•
Synchronous serial communication
Master or slave operation
8-frame FIFOs for both transmit and receive
4-bit to 16-bit frame
Maximum SPI bus data bit rate of one half (Master mode) and one twelfth (Slave
mode) of the input clock rate
• DMA transfers supported by GPDMA
7.17 SD/MMC card interface
The Secure Digital and Multimedia Card Interface (MCI) allows access to external SD
memory cards. The SD card interface conforms to the SD Multimedia Card Specification
Version 2.11.
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7.17.1 Features
• The MCI provides all functions specific to the SD/MMC memory card. These include
the clock generation unit, power management control, and command and data
transfer.
• Conforms to Multimedia Card Specification v2.11.
• Conforms to Secure Digital Memory Card Physical Layer Specification, v0.96.
• Can be used as a multimedia card bus or a secure digital memory card bus host. The
SD/MMC can be connected to several multimedia cards or a single secure digital
memory card.
• DMA supported through the GPDMA controller.
7.18 I2C-bus serial I/O controller
The LPC2460 contains three I2C-bus controllers.
The I2C-bus is bidirectional, for inter-IC control using only two wires: a serial clock line
(SCL), and a serial data line (SDA). Each device is recognized by a unique address and
can operate as either a receiver-only device (e.g., an LCD driver) or a transmitter with the
capability to both receive and send information (such as memory). Transmitters and/or
receivers can operate in either master or slave mode, depending on whether the chip has
to initiate a data transfer or is only addressed. The I2C-bus is a multi-master bus and can
be controlled by more than one bus master connected to it.
The I2C-bus implemented in LPC2460 supports bit rates up to 400 kbit/s (Fast I2C-bus).
7.18.1 Features
• I2C0 is a standard I2C compliant bus interface with open-drain pins.
• I2C1 and I2C2 use standard I/O pins and do not support powering off of individual
devices connected to the same bus lines.
•
•
•
•
•
Easy to configure as master, slave, or master/slave.
Programmable clocks allow versatile rate control.
Bidirectional data transfer between masters and slaves.
Multi-master bus (no central master).
Arbitration between simultaneously transmitting masters without corruption of serial
data on the bus.
• Serial clock synchronization allows devices with different bit rates to communicate via
one serial bus.
• Serial clock synchronization can be used as a handshake mechanism to suspend and
resume serial transfer.
• The I2C-bus can be used for test and diagnostic purposes.
7.19 I2S-bus serial I/O controllers
The I2S-bus provides a standard communication interface for digital audio applications.
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The I2S-bus specification defines a 3-wire serial bus using one data line, one clock line,
and one word select signal. The basic I2S connection has one master, which is always the
master, and one slave. The I2S interface on the LPC2460 provides a separate transmit
and receive channel, each of which can operate as either a master or a slave.
7.19.1 Features
• The interface has separate input/output channels each of which can operate in master
or slave mode.
• Capable of handling 8-bit, 16-bit, and 32-bit word sizes.
• Mono and stereo audio data supported.
• The sampling frequency can range from 16 kHz to 48 kHz (16, 22.05, 32, 44.1,
48) kHz.
•
•
•
•
Configurable word select period in master mode (separately for I2S input and output).
Two 8 word FIFO data buffers are provided, one for transmit and one for receive.
Generates interrupt requests when buffer levels cross a programmable boundary.
Two DMA requests, controlled by programmable buffer levels. These are connected to
the GPDMA block.
• Controls include reset, stop and mute options separately for I2S input and I2S output.
7.20 General purpose 32-bit timers/external event counters
The LPC2460 includes four 32-bit Timer/Counters. The Timer/Counter is designed to
count cycles of the system derived clock or an externally-supplied clock. It can optionally
generate interrupts or perform other actions at specified timer values, based on four
match registers. The Timer/Counter also includes four capture inputs to trap the timer
value when an input signal transitions, optionally generating an interrupt.
7.20.1 Features
• A 32-bit Timer/Counter with a programmable 32-bit prescaler.
• Counter or Timer operation.
• Up to four 32-bit capture channels per timer, that can take a snapshot of the timer
value when an input signal transitions. A capture event may also optionally generate
an interrupt.
• Four 32-bit match registers that allow:
– Continuous operation with optional interrupt generation on match.
– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
• Up to four external outputs corresponding to match registers, with the following
capabilities:
– Set LOW on match.
– Set HIGH on match.
– Toggle on match.
– Do nothing on match.
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7.21 Pulse width modulator
The PWM is based on the standard Timer block and inherits all of its features, although
only the PWM function is pinned out on the LPC2460. The Timer is designed to count
cycles of the system derived clock and optionally switch pins, generate interrupts or
perform other actions when specified timer values occur, based on seven match registers.
The PWM function is in addition to these features and is based on match register events.
The ability to separately control rising and falling edge locations allows the PWM to be
used for more applications. For instance, multi-phase motor control typically requires three
non-overlapping PWM outputs with individual control of all three pulse widths and
positions.
Two match registers can be used to provide a single edge controlled PWM output. A
dedicated match register controls the PWM cycle rate, by resetting the count upon match.
The other match register controls the PWM edge position. Additional single edge
controlled PWM outputs require only one match register each, since the repetition rate is
the same for all PWM outputs. Multiple single edge controlled PWM outputs will all have a
rising edge at the beginning of each PWM cycle, when an PWMMR0 match occurs.
Three match registers can be used to provide a PWM output with both edges controlled.
Again, a dedicated match register controls the PWM cycle rate. The other match registers
control the two PWM edge positions. Additional double edge controlled PWM outputs
require only two match registers each, since the repetition rate is the same for all PWM
outputs.
With double edge controlled PWM outputs, specific match registers control the rising and
falling edge of the output. This allows both positive going PWM pulses (when the rising
edge occurs prior to the falling edge), and negative going PWM pulses (when the falling
edge occurs prior to the rising edge).
7.21.1 Features
• LPC2460 has two PWMs with the same operational features. These may be operated
in a synchronized fashion by setting them both up to run at the same rate, then
enabling both simultaneously. PWM0 acts as the master and PWM1 as the slave for
this use.
• Counter or Timer operation (may use the peripheral clock or one of the capture inputs
as the clock source).
• Seven match registers allow up to 6 single edge controlled or 3 double edge
controlled PWM outputs, or a mix of both types. The match registers also allow:
– Continuous operation with optional interrupt generation on match.
– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
• Supports single edge controlled and/or double edge controlled PWM outputs. Single
edge controlled PWM outputs all go high at the beginning of each cycle unless the
output is a constant low. Double edge controlled PWM outputs can have either edge
occur at any position within a cycle. This allows for both positive going and negative
going pulses.
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• Pulse period and width can be any number of timer counts. This allows complete
flexibility in the trade-off between resolution and repetition rate. All PWM outputs will
occur at the same repetition rate.
• Double edge controlled PWM outputs can be programmed to be either positive going
or negative going pulses.
• Match register updates are synchronized with pulse outputs to prevent generation of
erroneous pulses. Software must ‘release’ new match values before they can become
effective.
• May be used as a standard timer if the PWM mode is not enabled.
• A 32-bit Timer/Counter with a programmable 32-bit Prescaler.
7.22 Watchdog timer (WDT)
The purpose of the watchdog is to reset the microcontroller within a reasonable amount of
time if it enters an erroneous state. When enabled, the watchdog will generate a system
reset if the user program fails to ‘feed’ (or reload) the watchdog within a predetermined
amount of time.
7.22.1 Features
• Internally resets chip if not periodically reloaded.
• Debug mode.
• Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be
disabled.
•
•
•
•
Incorrect/Incomplete feed sequence causes reset/interrupt if enabled.
Flag to indicate watchdog reset.
Programmable 32-bit timer with internal prescaler.
Selectable time period from (Tcy(WDCLK) × 256 × 4) to (Tcy(WDCLK) × 232 × 4) in
multiples of Tcy(WDCLK) × 4.
• The Watchdog Clock (WDCLK) source can be selected from the RTC clock, the
Internal RC oscillator (IRC), or the APB peripheral clock. This gives a wide range of
potential timing choices of Watchdog operation under different power reduction
conditions. It also provides the ability to run the WDT from an entirely internal source
that is not dependent on an external crystal and its associated components and
wiring, for increased reliability.
7.23 RTC and battery RAM
The RTC is a set of counters for measuring time when system power is on, and optionally
when it is off. It uses little power in Power-down mode. On the LPC2460, the RTC can be
clocked by a separate 32.768 kHz oscillator or by a programmable prescale divider based
on the APB clock. Also, the RTC is powered by its own power supply pin, VBAT, which can
be connected to a battery or to the same 3.3 V supply used by the rest of the device.
The VBAT pin supplies power only to the RTC and the Battery RAM. These two functions
require a minimum of power to operate, which can be supplied by an external battery.
When the CPU and the rest of chip functions are stopped and power removed, the RTC
can supply an alarm output that can be used by external hardware to restore chip power
and resume operation.
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7.23.1 Features
• Measures the passage of time to maintain a calendar and clock.
• Ultra low power design to support battery powered systems.
• Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and Day
of Year.
• Dedicated 32 kHz oscillator or programmable prescaler from APB clock.
• Dedicated power supply pin can be connected to a battery or to the main 3.3 V.
• An alarm output pin is included to assist in waking up when the chip has had power
removed to all functions except the RTC and Battery RAM.
• Periodic interrupts can be generated from increments of any field of the time registers,
and selected fractional second values. This enhancement enables the RTC to be
used as a System Timer.
• 2 kB data SRAM powered by VBAT.
• RTC and Battery RAM power supply is isolated from the rest of the chip.
7.24 Clocking and power control
7.24.1 Crystal oscillators
The LPC2460 includes three independent oscillators. These are the Main Oscillator, the
Internal RC oscillator, and the RTC oscillator. Each oscillator can be used for more than
one purpose as required in a particular application. Any of the three clock sources can be
chosen by software to drive the PLL and ultimately the CPU.
Following reset, the LPC2460 will operate from the Internal RC oscillator until switched by
software. This allows systems to operate without any external crystal and the bootloader
code to operate at a known frequency.
7.24.1.1
Internal RC oscillator
The IRC may be used as the clock source for the WDT, and/or as the clock that drives the
PLL and subsequently the CPU. The nominal IRC frequency is 4 MHz. The IRC is
trimmed to 1 % accuracy.
Upon power-up or any chip reset, the LPC2460 uses the IRC as the clock source.
Software may later switch to one of the other available clock sources.
7.24.1.2
Main oscillator
The main oscillator can be used as the clock source for the CPU, with or without using the
PLL. The main oscillator operates at frequencies of 1 MHz to 24 MHz. This frequency can
be boosted to a higher frequency, up to the maximum CPU operating frequency, by the
PLL. The clock selected as the PLL input is PLLCLKIN. The ARM processor clock
frequency is referred to as CCLK elsewhere in this document. The frequencies of
PLLCLKIN and CCLK are the same value unless the PLL is active and connected. The
clock frequency for each peripheral can be selected individually and is referred to as
PCLK. Refer to Section 7.24.2 for additional information.
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7.24.1.3
RTC oscillator
The RTC oscillator can be used as the clock source for the RTC and/or the WDT. Also, the
RTC oscillator can be used to drive the PLL and the CPU.
7.24.2 PLL
The PLL accepts an input clock frequency in the range of 32 kHz to 50 MHz. The input
frequency is multiplied up to a high frequency, then divided down to provide the actual
clock used by the CPU and the USB block.
The PLL input, in the range of 32 kHz to 50 MHz, may initially be divided down by a value
‘N’, which may be in the range of 1 to 256. This input division provides a wide range of
output frequencies from the same input frequency.
Following the PLL input divider is the PLL multiplier. This can multiply the input divider
output through the use of a Current Controlled Oscillator (CCO) by a value ‘M’, in the
range of 1 through 32768. The resulting frequency must be in the range of 275 MHz to
550 MHz. The multiplier works by dividing the CCO output by the value of M, then using a
phase-frequency detector to compare the divided CCO output to the multiplier input. The
error value is used to adjust the CCO frequency.
The PLL is turned off and bypassed following a chip Reset and by entering Power-down
mode. PLL is enabled by software only. The program must configure and activate the PLL,
wait for the PLL to lock, then connect to the PLL as a clock source.
7.24.3 Wake-up timer
The LPC2460 begins operation at power-up and when awakened from Power-down mode
by using the 4 MHz IRC oscillator as the clock source. This allows chip operation to
resume quickly. If the main oscillator or the PLL is needed by the application, software will
need to enable these features and wait for them to stabilize before they are used as a
clock source.
When the main oscillator is initially activated, the wake-up timer allows software to ensure
that the main oscillator is fully functional before the processor uses it as a clock source
and starts to execute instructions. This is important at power on, all types of Reset, and
whenever any of the aforementioned functions are turned off for any reason. Since the
oscillator and other functions are turned off during Power-down mode, any wake-up of the
processor from Power-down mode makes use of the wake-up Timer.
The Wake-up Timer monitors the crystal oscillator to check whether it is safe to begin
code execution. When power is applied to the chip, or when some event caused the chip
to exit Power-down mode, some time is required for the oscillator to produce a signal of
sufficient amplitude to drive the clock logic. The amount of time depends on many factors,
including the rate of VDD(3V3) ramp (in the case of power on), the type of crystal and its
electrical characteristics (if a quartz crystal is used), as well as any other external circuitry
(e.g., capacitors), and the characteristics of the oscillator itself under the existing ambient
conditions.
7.24.4 Power control
The LPC2460 supports a variety of power control features. There are three special modes
of processor power reduction: Idle mode, Sleep mode, and Power-down mode. The CPU
clock rate may also be controlled as needed by changing clock sources, reconfiguring PLL
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values, and/or altering the CPU clock divider value. This allows a trade-off of power versus
processing speed based on application requirements. In addition, Peripheral power
control allows shutting down the clocks to individual on-chip peripherals, allowing fine
tuning of power consumption by eliminating all dynamic power use in any peripherals that
are not required for the application. Each of the peripherals has its own clock divider which
provides even better power control.
The LPC2460 also implements a separate power domain in order to allow turning off
power to the bulk of the device while maintaining operation of the RTC and a small SRAM,
referred to as the Battery RAM.
7.24.4.1
Idle mode
In Idle mode, execution of instructions is suspended until either a Reset or interrupt
occurs. Peripheral functions continue operation during Idle mode and may generate
interrupts to cause the processor to resume execution. Idle mode eliminates dynamic
power used by the processor itself, memory systems and related controllers, and internal
buses.
7.24.4.2
Sleep mode
In Sleep mode, the oscillator is shut down and the chip receives no internal clocks. The
processor state and registers, peripheral registers, and internal SRAM values are
preserved throughout Sleep mode and the logic levels of chip pins remain static. The
output of the IRC is disabled but the IRC is not powered down for a fast wake-up later. The
32 kHz RTC oscillator is not stopped because the RTC interrupts may be used as the
wake-up source. The PLL is automatically turned off and disconnected. The CCLK and
USB clock dividers automatically get reset to zero.
The Sleep mode can be terminated and normal operation resumed by either a Reset or
certain specific interrupts that are able to function without clocks. Since all dynamic
operation of the chip is suspended, Sleep mode reduces chip power consumption to a
very low value.
On the wake-up from Sleep mode, if the IRC was used before entering Sleep mode, the
code execution and peripherals activities will resume after 4 cycles expire. If the main
external oscillator was used, the code execution will resume when 4096 cycles expire.
The customers need to reconfigure the PLL and clock dividers accordingly.
7.24.4.3
Power-down mode
Power-down mode does everything that Sleep mode does but also turns off the IRC
oscillator.
On the wake-up from Power-down mode, if the IRC was used before entering Power-down
mode, it will take IRC 60 µs to start-up. After this 4 IRC cycles will expire before the code
execution can then be resumed if the code was running from SRAM. The customers need
to reconfigure the PLL and clock dividers accordingly after a wake-up from Power-down
mode.
7.24.4.4
Power domains
The LPC2460 provides two independent power domains that allow the bulk of the device
to have power removed while maintaining operation of the RTC and the Battery RAM.
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On the LPC2460, I/O pads are powered by the 3.3 V (VDD(3V3)) pins, while the
VDD(DCDC)(3V3) pins power the on-chip DC-to-DC converter which in turn provides power to
the CPU and most of the peripherals.
Although both the I/O pad ring and the core require a 3.3 V supply, different powering
schemes can be used depending on the actual application requirements.
The first option assumes that power consumption is not a concern and the design ties the
VDD(3V3) and VDD(DCDC)(3V3) pins together. This approach requires only one 3.3 V power
supply for both pads, the CPU, and peripherals. While this solution is simple, it does not
support powering down the I/O pad ring “on the fly” while keeping the CPU and
peripherals alive.
The second option uses two power supplies; a 3.3 V supply for the I/O pads (VDD(3V3)) and
a dedicated 3.3 V supply for the CPU (VDD(DCDC)(3V3)). Having the on-chip DC-DC
converter powered independently from the I/O pad ring enables shutting down of the I/O
pad power supply “on the fly”, while the CPU and peripherals stay active.
The VBAT pin supplies power only to the RTC and the Battery RAM. These two functions
require a minimum of power to operate, which can be supplied by an external battery.
When the CPU and the rest of chip functions are stopped and power removed, the RTC
can supply an alarm output that may be used by external hardware to restore chip power
and resume operation.
7.25 System control
7.25.1 Reset
Reset has four sources on the LPC2460: the RESET pin, the Watchdog reset, power-on
reset, and the BrownOut Detection (BOD) circuit. The RESET pin is a Schmitt trigger input
pin. Assertion of chip Reset by any source, once the operating voltage attains a usable
level, starts the Wake-up timer (see description in Section 7.24.3 “Wake-up timer”),
causing reset to remain asserted until the external Reset is de-asserted, the oscillator is
running, and a fixed number of clocks have passed.
Once the internal reset is removed, all of the processor and peripheral registers have
been initialized to predetermined values and the LPC2460 continues with booting from an
external static memory.
7.25.2 Boot process
The processor always boots from the off-chip static memory bank 1, executing code from
address 0x8100 0000 (see Table 5 “LPC2460 memory usage and details”). During the
boot process initiated by POR, the boot pins P3[15]/D15 and P3[14]/D14 are sampled,
and the external memory banks 0 and 1 are configured with the same data bus width. The
data bus width is determined by the setting of the two boot pins. Unused address pins are
configured as GPIO. See Section 11.2 “Suggested boot memory interface solutions” for
an example of address and data bus interfacing.
Remark: After POR, the address ranges of chip select 1 and chip select 0 are swapped.
The user code residing in the external boot memory must be linked to execute from
address location 0x8000 0000.
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When booting from external memory, the interrupt vectors are mapped to the bottom of
the external memory. Once booting is over, the application must map interrupt vectors to
the proper domain.
7.25.3 Brownout detection
The LPC2460 includes 2-stage monitoring of the voltage on the VDD(3V3) pins. If this
voltage falls below 2.95 V, the BOD asserts an interrupt signal to the Vectored Interrupt
Controller. This signal can be enabled for interrupt in the Interrupt Enable Register in the
VIC in order to cause a CPU interrupt; if not, software can monitor the signal by reading a
dedicated status register.
The second stage of low-voltage detection asserts a BOD Reset and generates a Reset
(if this reset source is enabled in software) to inactivate the LPC2460 when the voltage on
the VDD(3V3) pins falls below 2.65 V. The BOD circuit maintains this reset down below 1 V,
at which point the power-on reset circuitry maintains the overall Reset.
Both the 2.95 V and 2.65 V thresholds include some hysteresis. In normal operation, this
hysteresis allows the 2.95 V detection to reliably interrupt, or a regularly-executed event
loop to sense the condition.
7.25.4 AHB
The LPC2460 implements two AHB in order to allow the Ethernet block to operate without
interference caused by other system activity. The primary AHB, referred to as AHB1,
includes the Vectored Interrupt Controller, GPDMA controller, USB interface, and 16 kB
SRAM.
The second AHB, referred to as AHB2, includes only the Ethernet block and an
associated 16 kB SRAM. In addition, a bus bridge is provided that allows the secondary
AHB to be a bus master on AHB1, allowing expansion of Ethernet buffer space into
off-chip memory or unused space in memory residing on AHB1.
In summary, bus masters with access to AHB1 are the ARM7 itself, the USB block, the
GPDMA function, and the Ethernet block (via the bus bridge from AHB2). Bus masters
with access to AHB2 are the ARM7 and the Ethernet block.
7.25.5 External interrupt inputs
The LPC2460 includes up to 68 edge sensitive interrupt inputs combined with up to four
level sensitive external interrupt inputs as selectable pin functions. The external interrupt
inputs can optionally be used to wake up the processor from Power-down mode.
7.25.6 Memory mapping control
The memory mapping control alters the mapping of the interrupt vectors that appear at the
beginning at address 0x0000 0000. Vectors may be mapped to the bottom of the Boot
ROM, the SRAM, or external memory. This allows code running in different memory
spaces to have control of the interrupts.
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7.26 Emulation and debugging
The LPC2460 support emulation and debugging via a JTAG serial port. A trace port
allows tracing program execution. Debugging and trace functions are multiplexed only with
GPIOs on P2[0] to P2[9]. This means that all communication, timer, and interface
peripherals residing on other pins are available during the development and debugging
phase as they are when the application is run in the embedded system itself.
7.26.1 EmbeddedICE
The EmbeddedICE logic provides on-chip debug support. The debugging of the target
system requires a host computer running the debugger software and an EmbeddedICE
protocol convertor. The EmbeddedICE protocol convertor converts the Remote Debug
Protocol commands to the JTAG data needed to access the ARM7TDMI-S core present
on the target system.
The ARM core has a Debug Communication Channel (DCC) function built-in. The DCC
allows a program running on the target to communicate with the host debugger or another
separate host without stopping the program flow or even entering the debug state. The
DCC is accessed as a coprocessor 14 by the program running on the ARM7TDMI-S core.
The DCC allows the JTAG port to be used for sending and receiving data without affecting
the normal program flow. The DCC data and control registers are mapped in to addresses
in the EmbeddedICE logic.
The JTAG clock (TCK) must be slower than 1⁄6 of the CPU clock (CCLK) for the JTAG
interface to operate.
7.26.2 Embedded trace
Since the LPC2460 have significant amounts of on-chip memories, it is not possible to
determine how the processor core is operating simply by observing the external pins. The
ETM provides real-time trace capability for deeply embedded processor cores. It outputs
information about processor execution to a trace port. A software debugger allows
configuration of the ETM using a JTAG interface and displays the trace information that
has been captured.
The ETM is connected directly to the ARM core and not to the main AMBA system bus. It
compresses the trace information and exports it through a narrow trace port. An external
Trace Port Analyzer captures the trace information under software debugger control. The
trace port can broadcast the Instruction trace information. Instruction trace (or PC trace)
shows the flow of execution of the processor and provides a list of all the instructions that
were executed. Instruction trace is significantly compressed by only broadcasting branch
addresses as well as a set of status signals that indicate the pipeline status on a cycle by
cycle basis. Trace information generation can be controlled by selecting the trigger
resource. Trigger resources include address comparators, counters and sequencers.
Since trace information is compressed the software debugger requires a static image of
the code being executed. Self-modifying code can not be traced because of this
restriction.
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
44 of 68
LPC2460
NXP Semiconductors
Fast communication chip
7.26.3 RealMonitor
RealMonitor is a configurable software module, developed by ARM Inc., which enables
real-time debug. It is a lightweight debug monitor that runs in the background while users
debug their foreground application. It communicates with the host using the DCC, which is
present in the EmbeddedICE logic. The LPC2460 contain a specific configuration of
RealMonitor software programmed into the on-chip ROM memory.
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
45 of 68
LPC2460
NXP Semiconductors
Fast communication chip
8. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol
Parameter
Conditions
Min
Max
Unit
VDD(3V3)
supply voltage (3.3 V)
core and external
rail
3.0
3.6
V
3.0
3.6
V
−0.5
+4.6
V
−0.5
+4.6
V
−0.5
+4.6
V
−0.5
+5.1
V
[2]
−0.5
+6.0
V
other I/O pins
[2][3]
−0.5
VDD(3V3) +
0.5
V
per supply pin
[4]
-
100
mA
per ground pin
[4]
-
100
mA
[5]
−65
+150
°C
-
1.5
W
−2000
+2000
V
VDD(DCDC)(3V3) DC-to-DC converter supply voltage
(3.3 V)
VDDA
analog 3.3 V pad supply voltage
Vi(VBAT)
input voltage on pin VBAT
Vi(VREF)
input voltage on pin VREF
VIA
analog input voltage
on ADC related
pins
VI
input voltage
5 V tolerant I/O
pins; only valid
when the VDD(3V3)
supply voltage is
present
for the RTC
supply current
IDD
ISS
ground current
Tstg
storage temperature
Ptot(pack)
total power dissipation (per package)
based on package
heat transfer, not
device power
consumption
Vesd
electrostatic discharge voltage
human body
model; all pins
[6]
[1]
The following applies to the limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSSIO/VSSCORE
unless otherwise noted.
[2]
Including voltage on outputs in 3-state mode.
[3]
Not to exceed 4.6 V.
[4]
The peak current is limited to 25 times the corresponding maximum current.
[5]
Dependent on package type.
[6]
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
46 of 68
LPC2460
NXP Semiconductors
Fast communication chip
9. Static characteristics
Table 7.
Static characteristics
Tamb = −40 °C to +85 °C for commercial applications, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
VDD(3V3)
supply voltage (3.3 V)
core and external rail
3.0
3.3
3.6
V
VDD(DCDC)(3V3)
DC-to-DC converter
supply voltage (3.3 V)
3.0
3.3
3.6
V
VDDA
analog 3.3 V pad
supply voltage
3.0
3.3
3.6
V
Vi(VBAT)
input voltage on pin
VBAT
2.0
3.3
3.6
V
Vi(VREF)
input voltage on pin
VREF
2.5
3.3
VDDA
V
[2]
Standard port pins, RESET, RTCK
IIL
LOW-level input
current
VI = 0 V; no pull-up
-
-
3
µA
IIH
HIGH-level input
current
VI = VDD(3V3); no pull-down
-
-
3
µA
IOZ
OFF-state output
current
VO = 0 V; VO = VDD(3V3);
no pull-up/down
-
-
3
µA
Ilatch
I/O latch-up current
−(0.5VDD(3V3)) < VI <
(1.5VDD(3V3));
-
-
100
mA
0
-
5.5
V
0
-
VDD(3V3)
V
Tj < 125 °C
[3][4][5]
VI
input voltage
pin configured to provide a
digital function
VO
output voltage
output active
VIH
HIGH-level input
voltage
2.0
-
-
V
VIL
LOW-level input
voltage
-
-
0.8
V
Vhys
hysteresis voltage
-
0.4
-
V
VDD(3V3) −
0.4
-
-
V
VOH
HIGH-level output
voltage
IOH = −4 mA
[6]
VOL
LOW-level output
voltage
IOL = −4 mA
[6]
-
-
0.4
V
IOH
HIGH-level output
current
VOH = VDD(3V3) − 0.4 V
[6]
−4
-
-
mA
IOL
LOW-level output
current
VOL = 0.4 V
[6]
4
-
-
mA
IOHS
HIGH-level
short-circuit output
current
VOH = 0 V
[7]
-
-
−45
mA
IOLS
LOW-level short-circuit VOL = VDDA
output current
[7]
-
-
50
mA
Ipd
pull-down current
VI = 5 V
[8]
Ipu
pull-up current
VI = 0 V
VDD(3V3) < VI < 5 V
LPC2460_2
Preliminary data sheet
[8]
10
50
150
µA
−15
−50
−85
µA
0
0
0
µA
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
47 of 68
LPC2460
NXP Semiconductors
Fast communication chip
Table 7.
Static characteristics …continued
Tamb = −40 °C to +85 °C for commercial applications, unless otherwise specified.
Symbol
Parameter
Min
Typ[1]
Max
Unit
CCLK = 10 MHz
-
<tbd>
-
mA
CCLK = 72 MHz
-
<tbd>
-
mA
CCLK = 10 MHz
-
<tbd>
-
mA
CCLK = 72 MHz
-
<tbd>
-
mA
CCLK = 10 MHz
-
<tbd>
-
mA
CCLK = 72 MHz
-
<tbd>
-
mA
Conditions
IDD(DCDC)act(3V3) active mode DC-to-DC VDD(DCDC)(3V3) = 3.3 V;
converter supply
Tamb = 25 °C; code
current (3.3 V)
while(1){}
executed from the on-chip
SRAM; no peripherals
enabled; PCLK = CCLK
all peripherals enabled;
PCLK = CCLK / 8
all peripherals enabled;
PCLK = CCLK
IDD(DCDC)pd(3V3)
active mode battery
supply current
IBATact
I2C-bus
power-down mode
DC-to-DC converter
supply current (3.3 V)
VDD(DCDC)(3V3) = 3.3 V;
Tamb = 25 °C
-
150
-
µA
DC-to-DC converter on
[9]
-
20
-
µA
DC-to-DC converter off
[9]
-
28
-
µA
V
pins (P0[27] and P0[28])
VIH
HIGH-level input
voltage
0.7VDD(3V3) -
-
VIL
LOW-level input
voltage
-
-
0.3VDD(3V3) V
Vhys
hysteresis voltage
-
0.5VDD(3V3) -
V
-
-
V
VOL
LOW-level output
voltage
IOLS = 3 mA
[6]
ILI
input leakage current
VI = VDD(3V3)
[10]
VI = 5 V
0.4
-
2
4
µA
-
10
22
µA
Oscillator pins
Vi(XTAL1)
input voltage on pin
XTAL1
0
-
1.8
V
Vo(XTAL2)
output voltage on pin
XTAL2
0
-
1.8
V
Vi(RTCX1)
input voltage on pin
RTCX1
0
-
1.8
V
Vo(RTCX2)
output voltage on pin
RTCX2
0
-
1.8
V
-
-
±10
µA
-
-
5.25
V
USB pins
IOZ
OFF-state output
current
VBUS
bus supply voltage
0 V < VI < 3.3 V
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
48 of 68
LPC2460
NXP Semiconductors
Fast communication chip
Table 7.
Static characteristics …continued
Tamb = −40 °C to +85 °C for commercial applications, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
VDI
differential input
sensitivity
|(D+) − (D−)|
0.2
-
-
V
VCM
differential common
mode voltage range
includes VDI range
0.8
-
2.5
V
Vth(rs)se
single-ended receiver
switching threshold
voltage
0.8
-
2.0
V
VOL
LOW-level output
voltage for
low-/full-speed
RL of 1.5 kΩ to 3.6 V
-
-
0.18
V
VOH
HIGH-level output
voltage (driven) for
low-/full-speed
RL of 15 kΩ to GND
2.8
-
3.5
V
Ctrans
transceiver
capacitance
pin to GND
-
-
20
pF
ZDRV
driver output
impedance for driver
which is not
high-speed capable
with 33 Ω series resistor;
steady state drive
36
-
44.1
Ω
Rpu
pull-up resistance
SoftConnect = ON
1.1
-
1.9
kΩ
[1]
[11]
Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages
[2]
The RTC typically fails when Vi(VBAT) drops below 1.6 V.
[3]
Including voltage on outputs in 3-state mode.
[4]
VDD(3V3) supply voltages must be present.
[5]
3-state outputs go into 3-state mode when VDD(3V3) is grounded.
[6]
Accounts for 100 mV voltage drop in all supply lines.
[7]
Only allowed for a short time period.
[8]
Minimum condition for VI = 4.5 V, maximum condition for VI = 5.5 V.
[9]
On pin VBAT.
[10] To VSSIO/VSSCORE
[11] Includes external resistors of 18 Ω ± 1 % on D+ and D−.
Table 8.
ADC static characteristics
VDDA = 2.5 V to 3.6 V; Tamb = −40 °C to +85 °C unless otherwise specified; ADC frequency 4.5 MHz.
Symbol
Parameter
VIA
analog input voltage
Cia
analog input capacitance
ED
differential linearity error
EL(adj)
Conditions
Min
Typ
Max
Unit
0
-
VDDA
V
-
-
1
pF
[1][2][3]
-
-
±1
LSB
integral non-linearity
[1][4]
-
-
±2
LSB
offset error
[1][5]
-
-
±3
LSB
EG
gain error
[1][6]
-
-
±0.5
%
ET
absolute error
[1][7]
-
-
±4
LSB
[8]
-
-
40
kΩ
EO
Rvsi
voltage source interface
resistance
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
49 of 68
LPC2460
NXP Semiconductors
Fast communication chip
[1]
Conditions: VSSA = 0 V, VDDA = 3.3 V.
[2]
The ADC is monotonic, there are no missing codes.
[3]
The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 5.
[4]
The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after
appropriate adjustment of gain and offset errors. See Figure 5.
[5]
The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the
ideal curve. See Figure 5.
[6]
The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset
error, and the straight line which fits the ideal transfer curve. See Figure 5.
[7]
The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated ADC
and the ideal transfer curve. See Figure 5.
[8]
See Figure 6.
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
50 of 68
LPC2460
NXP Semiconductors
Fast communication chip
offset
error
EO
gain
error
EG
1023
1022
1021
1020
1019
1018
(2)
7
code
out
(1)
6
5
(5)
4
(4)
3
(3)
2
1 LSB
(ideal)
1
0
1
2
3
4
5
offset error
EO
6
7
1018
1019
1020
1021
1022
1023
1024
VIA (LSBideal)
1 LSB =
VDDA − VSSA
1024
002aac046
(1) Example of an actual transfer curve.
(2) The ideal transfer curve.
(3) Differential linearity error (ED).
(4) Integral non-linearity (EL(adj)).
(5) Center of a step of the actual transfer curve.
Fig 5. ADC characteristics
LPC2460_2
Preliminary data sheet
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Rev. 02 — 1 February 2008
51 of 68
LPC2460
NXP Semiconductors
Fast communication chip
LPC2XXX
20 kΩ
AD0[y]
AD0[y]SAMPLE
3 pF
Rvsi
5 pF
VEXT
VSSIO, VSSCORE
002aad586
Fig 6. Suggested ADC interface - LPC2460 AD0[y] pin
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
52 of 68
LPC2460
NXP Semiconductors
Fast communication chip
10. Dynamic characteristics
Table 9.
Dynamic characteristics of USB pins (full-speed)
CL = 50 pF; Rpu = 1.5 kΩ on D+ to VDD(3V3),unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tr
rise time
10 % to 90 %
8.5
-
13.8
ns
tf
fall time
10 % to 90 %
7.7
-
13.7
ns
tFRFM
differential rise and fall time
matching
tr / tf
-
-
109
%
VCRS
output signal crossover voltage
1.3
-
2.0
V
tFEOPT
source SE0 interval of EOP
see Figure 8
160
-
175
ns
tFDEOP
source jitter for differential transition
to SE0 transition
see Figure 8
−2
-
+5
ns
tJR1
receiver jitter to next transition
−18.5
-
+18.5
ns
tJR2
receiver jitter for paired transitions
10 % to 90 %
−9
-
+9
ns
tEOPR1
EOP width at receiver
must reject as
EOP; see
Figure 8
[1]
40
-
-
ns
tEOPR2
EOP width at receiver
must accept as
EOP; see
Figure 8
[1]
82
-
-
ns
[1]
Characterized but not implemented as production test. Guaranteed by design.
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
53 of 68
LPC2460
NXP Semiconductors
Fast communication chip
Table 10. Dynamic characteristics
Tamb = −40 °C to +85 °C for commercial applications; VDD(3V3) over specified ranges.[1]
Symbol
Parameter
Conditions
Min
Typ[2]
Max
Unit
External clock
fosc
oscillator frequency
1
-
24
MHz
Tcy(clk)
clock cycle time
42
-
1000
ns
tCHCX
clock HIGH time
Tcy(clk) × 0.4
-
-
ns
tCLCX
clock LOW time
Tcy(clk) × 0.4
-
-
ns
tCLCH
clock rise time
-
-
5
ns
tCHCL
clock fall time
-
-
5
ns
I2C-bus
pins (P0[27] and P0[28])
tf(o)
output fall time
VIH to VIL
20 + 0.1 × Cb[3]
-
-
ns
SPI_MISO set-up time
Tamb = 25 °C;
measured in
SPI Master
mode; see
Figure 9
-
11
-
ns
SSP interface
tsu(SPI_MISO)
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages.
[3]
Bus capacitance Cb in pF, from 10 pF to 400 pF.
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
54 of 68
LPC2460
NXP Semiconductors
Fast communication chip
10.1 Timing
VDD − 0.5 V
0.45 V
0.2VDD + 0.9 V
0.2VDD − 0.1 V
tCHCL
tCHCX
tCLCH
tCLCX
Tcy(clk)
002aaa907
VDD = 1.8 V.
Fig 7. External clock timing
tPERIOD
crossover point
extended
crossover point
differential
data lines
source EOP width: tFEOPT
differential data to
SE0/EOP skew
n × tPERIOD + tFDEOP
receiver EOP width: tEOPR1, tEOPR2
002aab561
Fig 8. Differential data-to-EOP transition skew and EOP width
shifting edges
SCK
sampling edges
MOSI
MISO
tsu(SPI_MISO)
002aad326
Fig 9. MISO line set-up time in SSP Master mode
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
55 of 68
LPC2460
NXP Semiconductors
Fast communication chip
11. Application information
11.1 Suggested USB interface solutions
VDD(3V3)
USB_UP_LED
USB_CONNECT
LPC24XX
soft-connect switch
R1
1.5 kΩ
VBUS
USB_D+ RS = 33 Ω
USB_D−
USB-B
connector
RS = 33 Ω
VSSIO, VSSCORE
002aad587
Fig 10. LPC2460 USB interface on a self-powered device
VDD(3V3)
R2
LPC24XX
USB_UP_LED
R1
1.5 kΩ
VBUS
USB_D+ RS = 33 Ω
USB-B
connector
USB_D− RS = 33 Ω
VSSIO, VSSCORE
002aad588
Fig 11. LPC2460 USB interface on a bus-powered device
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
56 of 68
LPC2460
NXP Semiconductors
Fast communication chip
VDD
R1
R2
R3
R4
RSTOUT
RESET_N
VBUS
ADR/PSW
ID
OE_N/INT_N
VDD
SPEED
SUSPEND
R4
R5
DP
33 Ω
DM
33 Ω
ISP1301
R6
VSSIO,
VSSCORE
SCL
USB_SCL1
Mini-AB
connector
SDA
USB_SDA1
INT_N
USB_INT1
USB_D+1
USB_D−1
VDD
USB_UP_LED1
LPC24XX
R7
5V
VDD
IN
USB_PPWR2
ENA
LM3526-L
OUTA
FLAGA
USB_OVRCR2
VBUS
USB_PWRD2
USB_D+2
33 Ω
D+
USB_D−2
33 Ω
D−
15 kΩ
15 kΩ
USB-A
connector
VSSIO,
VSSCORE
VDD
USB_UP_LED2
R8
002aad589
Fig 12. LPC2460 USB OTG port configuration: USB port 1 OTG dual-role device, USB port 2 host
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
57 of 68
LPC2460
NXP Semiconductors
Fast communication chip
VDD
RSTOUT
RESET_N
OE_N/INT_N
USB_TX_E1
USB_TX_DP1
DAT_VP
USB_TX_DM1
SE0_VM
RCV
USB_RCV1
USB_RX_DP1
VP
VBUS
USB_RX_DM1
VM
ID
VDD
ISP1301
LPC24XX
ADR/PSW
SPEED
DP
33 Ω
DM
33 Ω
USB MINI-AB
connector
VSSIO,
VSSCORE
SUSPEND
USB_SCL1
SCL
USB_SDA1
SDA
INT_N
USB_INT1
VDD
USB_UP_LED1
002aad590
Fig 13. LPC2460 USB OTG port configuration: VP_VM mode
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
58 of 68
LPC2460
NXP Semiconductors
Fast communication chip
VDD
USB_UP_LED1
VSSIO,
VSSCORE
USB_D+1
33 Ω
D+
USB_D−1
33 Ω
D−
15 kΩ
USB-A
connector
15 kΩ
VDD
VBUS
USB_PWRD1
USB_OVRCR1
USB_PPWR1
FLAGA
ENA
5V
IN
LM3526-L
OUTA
LPC24XX
VDD
USB_UP_LED2
VDD
USB_CONNECT2
VSSIO,
VSSCORE
USB_D+2
33 Ω
D+
USB_D−2
33 Ω
D−
VBUS
USB-B
connector
VBUS
002aad595
Fig 14. LPC2460 USB OTG port configuration: USB port 2 device, USB port 1 host
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
59 of 68
LPC2460
NXP Semiconductors
Fast communication chip
VDD
USB_UP_LED1
USB_D+1
33 Ω
USB_D−1
33 Ω
VSSIO,
VSSCORE
D+
D−
15 kΩ
USB-A
connector
15 kΩ
VDD
VBUS
USB_PWRD1
USB_OVRCR1
USB_PPWR1
FLAGA
ENA
OUTA
5V
IN
LPC24XX
USB_PPWR2
LM3526-L
VDD
OUTB
ENB
FLAGB
USB_OVRCR2
VBUS
USB_PWRD2
USB_D+2
33 Ω
D+
USB_D−2
33 Ω
D−
15 kΩ
USB-A
connector
VSSIO,
VSSCORE
15 kΩ
VDD
USB_UP_LED2
002aad596
Fig 15. LPC2460 USB OTG port configuration: USB port 1 host, USB port 2 host
11.2 Suggested boot memory interface solutions
‘a_m’ and ‘a_b’ in the following figures refer to the highest order address line of the
memory chip and the highest order microcontroller’s address line used respectively.
CS1
OE
BLS[1]
D[15:8]
CE
CE
OE
OE
WE
8-bit
MEMORY
IO[7:0]
BLS[0]
D[7:0]
A[a_m:0]
WE
8-bit
MEMORY
IO[7:0]
A[a_m:0]
A[a_b:1]
002aad322
Fig 16. Booting from two 8-bit memory chips
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
60 of 68
LPC2460
NXP Semiconductors
Fast communication chip
CS1
OE
WE
CE
OE
WE
BLS[1]
BLS[0]
UB
LB
16-bit
MEMORY
IO[15:0]
D[15:0]
A[a_b:1]
A[a_m:0]
002aad323
Fig 17. Booting from a single 16-bit memory chip
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
61 of 68
LPC2460
NXP Semiconductors
Fast communication chip
12. Package outline
LQFP208; plastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mm
SOT459-1
c
y
X
A
105
156
157
104
ZE
e
E HE
(A 3)
A A2 A1
wM
θ
Lp
bp
L
detail X
pin 1 index
208
53
1
52
v M A
ZD
wM
bp
e
D
B
HD
v M B
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
mm
1.6
0.15
0.05
1.45
1.35
0.25
0.27
0.17
0.20
0.09
28.1
27.9
28.1
27.9
0.5
HD
HE
30.15 30.15
29.85 29.85
L
Lp
v
w
y
ZD
ZE
θ
1
0.75
0.45
0.12
0.08
0.08
1.43
1.08
1.43
1.08
7o
o
0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT459-1
136E30
MS-026
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
00-02-06
03-02-20
Fig 18. Package outline SOT459-1 (LQFP208)
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
62 of 68
LPC2460
NXP Semiconductors
Fast communication chip
TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.7 mm
B
D
SOT950-1
A
ball A1
index area
A
E
A2
A1
detail X
e1
∅v
∅w
b
e
M
M
C
C A B
C
y
y1 C
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
e
e2
ball A1
index area
1
3
2
4
5
6
7
8
9
10
11
12
13
14
15
16
17
X
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max
A1
A2
b
D
E
e
e1
e2
v
w
y
y1
mm
1.2
0.4
0.3
0.8
0.6
0.5
0.4
15.1
14.9
15.1
14.9
0.8
12.8
12.8
0.15
0.08
0.12
0.1
OUTLINE
VERSION
SOT950-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
06-06-01
06-06-14
---
Fig 19. Package outline SOT950-1 (TFBGA208)
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
63 of 68
LPC2460
NXP Semiconductors
Fast communication chip
13. Abbreviations
Table 11.
Acronym list
Acronym
Description
ADC
Analog-to-Digital Converter
AHB
Advanced High-performance Bus
AMBA
Advanced Microcontroller Bus Architecture
APB
Advanced Peripheral Bus
BOD
BrownOut Detection
CAN
Controller Area Network
DAC
Digital-to-Analog Converter
DCC
Debug Communication Channel
DMA
Direct Memory Access
EOP
End Of Packet
ETM
Embedded Trace Macrocell
GPIO
General Purpose Input/Output
IrDA
Infrared Data Association
JTAG
Joint Test Action Group
MII
Media Independent Interface
MIIM
Media Independent Interface Management
OHCI
Open Host Controller Interface
OTG
On-The-Go
PHY
Physical Layer
PLL
Phase-Locked Loop
POR
Power-On Reset
PWM
Pulse Width Modulator
RMII
Reduced Media Independent Interface
SD/MMC
Secure Digital/MultiMediaCard
SE0
Single Ended Zero
SPI
Serial Peripheral Interface
SSI
Synchronous Serial Interface
SSP
Synchronous Serial Port
TTL
Transistor-Transistor Logic
UART
Universal Asynchronous Receiver/Transmitter
USB
Universal Serial Bus
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
64 of 68
LPC2460
NXP Semiconductors
Fast communication chip
14. Revision history
Table 12.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
LPC2460_2
20080201
Preliminary data sheet
-
LPC2460_1
Modifications:
LPC2460_1
•
•
Table 4 “Pin description”: pin RSTOUT changed from 1.8 V to 3.3 V
Section 7.6.1 “Features”: ’Controller supports’ changed from ’2 kbit, 4 kbit, and 8 kbit’ to
’2048, 4096, and 8192’.
20080123
Preliminary data sheet
LPC2460_2
Preliminary data sheet
-
-
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
65 of 68
LPC2460
NXP Semiconductors
Fast communication chip
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
15.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
15.4 Trademarks
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
SoftConnect — is a trademark of NXP B.V.
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
GoodLink — is a trademark of NXP B.V.
16. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: [email protected]
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
66 of 68
LPC2460
NXP Semiconductors
Fast communication chip
17. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
4
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
4.1
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3
5
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
6.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
6.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 8
7
Functional description . . . . . . . . . . . . . . . . . . 24
7.1
Architectural overview. . . . . . . . . . . . . . . . . . . 24
7.2
On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 25
7.3
Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 25
7.4
Interrupt controller . . . . . . . . . . . . . . . . . . . . . 26
7.4.1
Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 27
7.5
Pin connect block . . . . . . . . . . . . . . . . . . . . . . 27
7.6
External memory controller. . . . . . . . . . . . . . . 27
7.6.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
7.7
General purpose DMA controller . . . . . . . . . . 28
7.7.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
7.8
Fast general purpose parallel I/O . . . . . . . . . . 29
7.8.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
7.9
Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
7.9.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
7.10
USB interface . . . . . . . . . . . . . . . . . . . . . . . . . 31
7.10.1
USB device controller . . . . . . . . . . . . . . . . . . . 31
7.10.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
7.10.2
USB Host Controller . . . . . . . . . . . . . . . . . . . . 31
7.10.2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
7.10.3
USB OTG Controller . . . . . . . . . . . . . . . . . . . . 32
7.10.3.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
7.11
CAN controller and acceptance filters . . . . . . 32
7.11.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
7.12
10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
7.12.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
7.13
10-bit DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
7.13.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
7.14
UARTs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
7.14.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
7.15
SPI serial I/O controller. . . . . . . . . . . . . . . . . . 34
7.15.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
7.16
SSP serial I/O controller . . . . . . . . . . . . . . . . . 34
7.16.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
7.17
SD/MMC card interface . . . . . . . . . . . . . . . . . 34
7.17.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
7.18
I2C-bus serial I/O controller . . . . . . . . . . . . . . 35
7.18.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
I2S-bus serial I/O controllers . . . . . . . . . . . . .
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
General purpose 32-bit timers/external
event counters . . . . . . . . . . . . . . . . . . . . . . . .
7.20.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.21
Pulse width modulator . . . . . . . . . . . . . . . . . .
7.21.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.22
Watchdog timer (WDT). . . . . . . . . . . . . . . . . .
7.22.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.23
RTC and battery RAM . . . . . . . . . . . . . . . . . .
7.23.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.24
Clocking and power control . . . . . . . . . . . . . .
7.24.1
Crystal oscillators . . . . . . . . . . . . . . . . . . . . . .
7.24.1.1 Internal RC oscillator . . . . . . . . . . . . . . . . . . .
7.24.1.2 Main oscillator . . . . . . . . . . . . . . . . . . . . . . . .
7.24.1.3 RTC oscillator. . . . . . . . . . . . . . . . . . . . . . . . .
7.24.2
PLL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.24.3
Wake-up timer . . . . . . . . . . . . . . . . . . . . . . . .
7.24.4
Power control . . . . . . . . . . . . . . . . . . . . . . . . .
7.24.4.1 Idle mode . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.24.4.2 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . .
7.24.4.3 Power-down mode . . . . . . . . . . . . . . . . . . . . .
7.24.4.4 Power domains. . . . . . . . . . . . . . . . . . . . . . . .
7.25
System control . . . . . . . . . . . . . . . . . . . . . . . .
7.25.1
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.25.2
Boot process . . . . . . . . . . . . . . . . . . . . . . . . .
7.25.3
Brownout detection . . . . . . . . . . . . . . . . . . . .
7.25.4
AHB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.25.5
External interrupt inputs . . . . . . . . . . . . . . . . .
7.25.6
Memory mapping control . . . . . . . . . . . . . . . .
7.26
Emulation and debugging. . . . . . . . . . . . . . . .
7.26.1
EmbeddedICE . . . . . . . . . . . . . . . . . . . . . . . .
7.26.2
Embedded trace. . . . . . . . . . . . . . . . . . . . . . .
7.26.3
RealMonitor . . . . . . . . . . . . . . . . . . . . . . . . . .
8
Limiting values . . . . . . . . . . . . . . . . . . . . . . . .
9
Static characteristics . . . . . . . . . . . . . . . . . . .
10
Dynamic characteristics . . . . . . . . . . . . . . . . .
10.1
Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11
Application information . . . . . . . . . . . . . . . . .
11.1
Suggested USB interface solutions . . . . . . . .
11.2
Suggested boot memory interface solutions .
12
Package outline . . . . . . . . . . . . . . . . . . . . . . . .
13
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . .
14
Revision history . . . . . . . . . . . . . . . . . . . . . . .
15
Legal information . . . . . . . . . . . . . . . . . . . . . .
15.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
7.19
7.19.1
7.20
35
36
36
36
37
37
38
38
38
39
39
39
39
39
40
40
40
40
41
41
41
41
42
42
42
43
43
43
43
44
44
44
45
46
47
53
55
56
56
60
62
64
65
66
66
continued >>
LPC2460_2
Preliminary data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 1 February 2008
67 of 68
LPC2460
NXP Semiconductors
Fast communication chip
15.2
15.3
15.4
16
17
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
66
66
66
66
67
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 1 February 2008
Document identifier: LPC2460_2