SLVS063E − NOVEMBER 1988 − REVISED OCTOBER 2003 D Low Temperature Coefficient D Wide Operating Current . . . 400 µA D D D D D D PACKAGE (TOP VIEW) to 10 mA 0.27-Ω Dynamic Impedance ±1% Tolerance Available Specified Temperature Stability Easily Trimmed for Minimum Temperature Drift Fast Turnon NC NC NC ANODE 1 8 2 7 3 6 4 5 CATHODE NC NC ADJ NC − No internal connection LM336-2.5, LM336B-2.5 . . . LP PACKAGE (TOP VIEW) description/ordering information ANODE The LM236-2.5, LM336-2.5, and LM336B-2.5 integrated circuits are precision 2.5-V shunt regulator diodes. These reference circuits operate as low-temperature-coefficient 2.5-V Zener diodes with a 0.2-Ω dynamic impedance. A third terminal provided on the circuit allows the reference voltage and temperature coefficient to be trimmed easily. CATHODE ADJ The series is useful as precision 2.5-V low-voltage references (VZ) for digital voltmeters, power supplies, or operational-amplifier circuitry. The 2.5-V voltage reference makes it convenient to obtain a stable reference from 5-V logic supplies. Devices in this series operate as shunt regulators, and can be used as either positive or negative voltage references. The LM236-2.5 is characterized for operation from −25°C to 85°C. The LM336-2.5 and LM336B-2.5 are characterized for operation from 0°C to 70°C. ORDERING INFORMATION SOIC (D) 0°C to 70°C TO-226 / TO-92 (LP) −25°C to 85°C ORDERABLE PART NUMBER PACKAGE† TA SOIC (D) Tube of 75 LM336D-2-5 Reel of 2500 LM336DR-2-5 Tube of 75 LM336BD-2-5 Reel of 2500 LM336BDR−2-5 Bulk of 1000 LM336LP-2-5 Reel of 2000 LM336LPR-2-5 Bulk of 1000 LM336BLP-2-5 Reel of 2000 LM336BLPR-2-5 Tube of 75 LM236D-2-5 Reel of 2500 LM236DR-2-5 TOP-SIDE MARKING 336-25 336B25 336-25 336B25 236-25 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated !" # $%&" !# '%()$!" *!"& *%$"# $ " #'&$$!"# '& "+& "&# &,!# #"%&"# #"!*!* -!!". *%$" '$&##/ *&# " &$&##!). $)%*& "&#"/ !)) '!!&"&# POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SLVS063E − NOVEMBER 1988 − REVISED OCTOBER 2003 symbol ANODE CATHODE ADJ schematic diagram CATHODE Q14 Q11 24 kΩ 24 kΩ 6.6 kΩ Q8 Q7 20 pF 10 kΩ Q2 30 pF Q10 Q1 Q4 500 Ω Q9 Q3 30 kΩ Q6 ADJ 6.6 kΩ Q12 Q5 Q13 720 Ω ANODE NOTE A: All component values are nominal. absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Reverse current, IR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Forward current, IF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 mA Package thermal impedance, θJA (see Notes 1 and 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W LP package . . . . . . . . . . . . . . . . . . . . . . . . . . 140°C/W Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can impact reliability. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions TA 2 LM236-2.5 Operating free-air temperature LM336-2.5, LM336B-2.5 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MIN MAX −25 85 0 70 UNIT °C SLVS063E − NOVEMBER 1988 − REVISED OCTOBER 2003 electrical characteristics at specified free-air temperature (unless otherwise noted) PARAMETER TA† TEST CONDITIONS LM236, LM336 VZ Reference voltage IZ = 1 mA ∆VZ(∆T) Change in reference voltage with temperature VZ adjusted to 2.490 V, IZ = 1 mA ∆VZ(∆I) Z( I) Change in reference voltage with current IZ = 400 µA A to 10 mA ∆VZ(∆t) Long-term change in reference voltage IZ = 1 mA zz Reference impedance IZ = 1 mA, LM336-2.5 MIN TYP MAX MIN TYP MAX 2.44 2.49 2.54 2.39 2.49 2.59 2.44 2.49 2.54 9 1.8 6 25°C LM336B f = 1 kHz LM236-2.5 Full range 3.5 25°C 2.6 6 2.6 10 Full range 3 10 3 12 25°C 20 25°C 0.2 0.6 0.2 1 Full range 0.4 1 0.4 1.4 20 UNIT V mV mV ppm/khr W † Full range is −25°C to 85°C for the LM236-2.5 and 0°C to 70°C for the LM336-2.5 and LM336B-2.5. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SLVS063E − NOVEMBER 1988 − REVISED OCTOBER 2003 TYPICAL CHARACTERISTICS CHANGE IN REFERENCE VOLTAGE vs REFERENCE CURRENT NOISE VOLTAGE vs FREQUENCY 250 IZ = 1 mA TA = 25°C TA = 25°C 2 Vn − Noise Voltage − nV/ Hz ∆V Z − Change in Reference Voltage − mV 2.5 1.5 1 0.5 0 200 150 100 50 0 2 8 4 6 IZ − Reference Current − mA 10 10 100 Figure 1 Figure 2 REFERENCE IMPEDANCE vs FREQUENCY 100 z z − Reference Impedance − Ω IZ = 1 mA TA = −55°C to 125°C 10 1 0.1 0.01 0.1 1 10 f − Frequency − kHz Figure 3 4 1k f − Frequency − Hz POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 100 10 k 100 k SLVS063E − NOVEMBER 1988 − REVISED OCTOBER 2003 APPLICATION INFORMATION 5V 2.49 kΩ 2.5 V IN457 † LM236-2.5 LM336-2.5 LM336B-2.5 5V 2.49 kΩ 10 kΩ‡ IN457 † 2.5 V LM236-2.5 LM336-2.5 LM336B-2.5 NC † Any silicon signal diode ‡ Adjust to 2.49 V Figure 5. 2.5-V Reference With Minimum Temperature Coefficient Figure 4. 2.5-V Reference 3.5 V to 40 V V+ R LM334 V− 68.1 Ω VO = 2.5 V LM336-2.5 LM336-2.5 LM336B-2.5 NC Figure 6. Wide-Input-Range Reference POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 27-Jul-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM236D-2-5 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 236-25 LM236DE4-2-5 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 236-25 LM236DG4-2-5 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 236-25 LM236DR-2-5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 236-25 LM236LP-2-5 OBSOLETE TO-92 LP 3 TBD Call TI Call TI -25 to 85 LM336-2.5 MDC ACTIVE DIESALE Y 0 400 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -40 to 85 LM336BD-2-5 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 336B25 LM336BDG4-2-5 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 336B25 LM336BDR-2-5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 336B25 LM336BLP-2-5 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 70 336B25 LM336BLPE3-2-5 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 70 336B25 LM336BLPR-2-5 ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 70 336B25 LM336D-2-5 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 336-25 LM336DG4-2-5 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 336-25 LM336DR-2-5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 336-25 LM336LP-2-5 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 70 336-25 LM336LPE3-2-5 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 70 336-25 Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 27-Jul-2016 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM336LPR-2-5 ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 70 336-25 LM336LPRE3-2-5 ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 70 336-25 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 27-Jul-2016 Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM236DR-2-5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM336BDR-2-5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM336DR-2-5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM236DR-2-5 SOIC D 8 2500 340.5 338.1 20.6 LM336BDR-2-5 SOIC D 8 2500 340.5 338.1 20.6 LM336DR-2-5 SOIC D 8 2500 340.5 338.1 20.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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