S1A/B - S1M/B Green 1.0A SURFACE MOUNT GLASS PASSIVATED RECTIFIER Features Mechanical Data • • • • • • • • Glass Passivated Die Construction for High Reliability Surge Overload Rating to 30A Peak Ideally Suited for Automated Assembly Lead Free Finish/RoHS Compliant (Note 1) Green Molding Compound (No Halogen and Antimony) (Note 2) Qualified to AEC-Q101 Standards for High Reliability • • • • Top View Case: SMA/SMB Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Lead Free Plating (Matte Tin Finish). Solderable per MIL-STD-202, Method 208 Polarity: Cathode Band or Cathode Notch Weight: SMA - 0.064 grams (approximate) SMB - 0.093 grams (approximate) Bottom View Ordering Information (Note 3) Part Number S1x-13-F S1xB-13-F Qualification Commercial Commercial Case SMA SMB Packaging 5000/Tape & Reel 3000/Tape & Reel * x = Device type, e.g. S1A-13-F (SMA package); S1AB-13-F (SMB package). Notes: 1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes. 2. Product manufactured with Data Code 0924 (week 24, 2009) and newer are built with Green Molding Compound. 3. For packaging details, go to our website at http://www.diodes.com. Marking Information YWW xxx(x) S1A/B - S1M/B Document number: DS16003 Rev. 22 - 2 XXX = Product type marking code, ex: S1A (SMA package) XXXX = Product type marking code, ex: S1AB (SMB package) = Manufacturers’ code marking YWW = Date code marking Y = Last digit of year (ex: 2 for 2002) WW = Week code (01 to 53) 1 of 4 www.diodes.com October 2011 © Diodes Incorporated S1A/B - S1M/B Maximum Ratings @TA = 25°C unless otherwise specified Single phase, half wave, 60Hz, resistive or inductive load. For capacitance load, derate current by 20%. Characteristic Symbol Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Average Rectified Output Current @ TT = 100°C Non-Repetitive Peak Forward Surge Current 8.3ms Single half sine-wave superimposed on rated load VRRM VRWM VR VR(RMS) IO S1 A/AB S1 B/BB S1 D/DB S1 G/GB S1 J/JB S1 K/KB S1 M/MB Unit 50 100 200 400 600 800 1000 V 35 70 140 280 1.0 420 560 700 V A 30 IFSM A Thermal Characteristics Characteristic Typical Thermal Resistance, Junction to Terminal (Note 4) Operating and Storage Temperature Range Symbol RθJT TJ, TSTG Value 30 -65 to +150 Unit °C/W °C Electrical Characteristics @TA = 25°C unless otherwise specified Characteristic Forward Voltage Peak Reverse Leakage Current at Rated DC Blocking Voltage Reverse Recovery Time (Note 5) Typical Total Capacitance (Note 6) @ IF = 1.0A @ TA = 25°C @ TA = 125°C Symbol VFM Min - IRM trr CT Typ 1.8 10 Max 1.1 5.0 100 3.0 - Unit V μA μs pF 4. Thermal resistance junction to terminal, unit mounted on PC board with 5.0 mm2 (0.013 mm thick) copper pads as heat sink. 5. Measured with IF = 0.5A, IR = 1.0A, IRR = 0.25A. 6. Measured at 1.0MHz and applied reverse voltage of 4.0V DC. Notes: IF, INSTANTANEOUS FORWARD CURRENT (A) IF, AVERAGE FORWARD CURRENT (A) 1.0 0.8 0.6 0.4 0.2 Resistive or inductive load 0 40 60 80 100 120 140 160 TT, TERMINAL TEMPERATURE (° C) Fig. 1 Forward Current Derating Curve S1A/B - S1M/B Document number: DS16003 Rev. 22 - 2 10 1.0 0.1 0.01 180 2 of 4 www.diodes.com 0 0.4 0.8 1.2 1.6 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 2 Typical Forward Characteristics October 2011 © Diodes Incorporated S1A/B - S1M/B 1,000 IR, INSTANTANEOUS REVERSE CURRENT (µA) IFSM, PEAK FORWARD SURGE CURRENT (A) 30 8.3ms Single half sine-wave 25 20 15 10 5 1 10 NUMBER OF CYCLES @ 60Hz Fig. 3 Typical Forward Characteristics 100 100 T J = 125° C 10 1.0 TJ = 25° C 0.1 0.01 0 40 120 80 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) Fig. 4 Typical Reverse Characteristics Package Outline Dimensions B A C D J SMA Dim Min Max A 2.29 2.92 B 4.00 4.60 C 1.27 1.63 D 0.15 0.31 E 4.80 5.59 G 0.05 0.20 H 0.76 1.52 J 2.01 2.30 All Dimensions in mm SMB Dim Min Max A 3.30 3.94 B 4.06 4.57 C 1.96 2.21 D 0.15 0.31 E 5.00 5.59 G 0.05 0.20 H 0.76 1.52 J 2.00 2.50 All Dimensions in mm G H E Suggested Pad Layout C X Y G SMA Value (in mm) Dimensions Z 6.5 G 1.5 X 1.7 Y 2.5 C 4.0 SMB Value (in mm) Dimensions Z 6.7 G 1.8 X 2.3 Y 2.5 C 4.3 Z S1A/B - S1M/B Document number: DS16003 Rev. 22 - 2 3 of 4 www.diodes.com October 2011 © Diodes Incorporated S1A/B - S1M/B IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2011, Diodes Incorporated www.diodes.com S1A/B - S1M/B Document number: DS16003 Rev. 22 - 2 4 of 4 www.diodes.com October 2011 © Diodes Incorporated