FINAL Am27X256 256 Kilobit (32 K x 8-Bit) CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS ■ ±10% power supply tolerance ■ As an OTP EPROM alternative: — Factory optimized programming ■ High noise immunity — Fully tested and guaranteed ■ Low power dissipation — 20 µA maximum CMOS standby current ■ As a Mask ROM alternative: ■ Available in Plastic Dual-In-line Package (PDIP) and Plastic Leaded Chip Carrier (PLCC) — Shorter leadtime — Lower volume per code ■ Latch-up protected to 100 mA from –1 V to VCC + 1 V ■ Fast access time — 55 ns ■ Versatile features for simple interfacing ■ Single +5 V power supply — Both CMOS and TTL input/output compatibility ■ Compatible with JEDEC-approved EPROM pinout — Two line control functions GENERAL DESCRIPTION The Am27X256 is a factory programmed and tested OTP EPROM. It is programmed after packaging prior to final test. Every device is rigorously tested under AC and DC operating conditions to your stable code. It is organized as 32 Kwords by 8 bits per word and is available in plastic dual in-line packages (PDIP), as well as plastic leaded chip carrier (PLCC) packages. ExpressROM devices provide a board-ready memory solution for medium to high volume codes with short leadtimes. This offers manufacturers a cost-effective and flexible alternative to OTP EPROMs and mask programmed ROMs. Data can be accessed as fast as 55 ns, allowing high-performance microprocessors to operate with reduced WAIT states. The device offers separate Output Enable (OE#) and Chip Enable (CE#) controls, thus eliminating bus contention in a multiple bus microprocessor system. AMD’s CMOS process technology provides high speed, low power, and high noise immunity. Typical power consumption is only 80 mW in active mode, and 100 µW in standby mode. BLOCK DIAGRAM VCC Data Outputs DQ0–DQ7 VSS OE# CE# A0–A14 Address Inputs Output Enable Chip Enable and Prog Logic Output Buffers Y Decoder Y Gating X Decoder 262,144 Bit Cell Matrix 12082F-1 Publication# 12082 Rev: F Amendment/0 Issue Date: May 1998 PRODUCT SELECTOR GUIDE Family Part Number Speed Options Am27X256 VCC = 5.0 V ± 5% -255 VCC = 5.0 V ± 10% -55 -70 -90 -120 -150 -200 Max Access Time (ns) 55 70 90 120 150 200 250 CE# (E#) Access (ns) 55 70 90 120 150 200 250 OE# (G#) Access (ns) 35 40 40 50 50 50 50 CONNECTION DIAGRAMS Top View VCC 27 A14 A7 3 26 A13 A6 4 25 A8 A5 5 24 A9 A4 6 23 A3 7 A2 A14 A13 28 2 DU 1 VCC VPP A12 VPP PLCC A7 A12 DIP 4 3 2 1 32 31 30 A6 5 29 A8 A5 6 28 A9 A11 A4 A3 7 8 27 26 A11 NC 22 OE# (G#) A2 9 25 OE# (G#) 8 21 A10 A1 10 24 A10 A1 9 20 CE# (E#) A0 11 23 CE# (E#) A0 10 19 DQ7 NC 12 22 DQ0 13 21 DQ7 DQ6 DQ1 12 17 DQ5 DQ2 13 16 DQ4 VSS 14 15 DQ3 14 15 16 17 18 19 20 DQ4 DQ5 DQ6 DQ3 18 VSS DU 11 DQ1 DQ2 DQ0 12082F-3 12082F-2 Notes: 1. JEDEC nomenclature is in parenthesis. 2. Don’t use (DU) for PLCC. PIN DESIGNATIONS A0–A14 = Address Inputs CE# (E#) = Chip Enable Input DQ0–DQ7 = Data Input/Outputs OE# (G#) = Output Enable Input PGM# (P#) = Program Enable Input VCC = VCC Supply Voltage VPP = Program Voltage Input VSS = Ground NC = No Internal Connection LOGIC SYMBOL 15 8 A0–A14 DQ0–DQ7 CE# (E#) 2 OE# (G#) 12082F-4 Am27X256 ORDERING INFORMATION Standard Products AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed by a combination of the following: AM27X256 -55 J C XXXXX CODE DESIGNATION Assigned by AMD TEMPERATURE RANGE C = Commercial (0°C to +70°C) I = Industrial (–40°C to +85°C) PACKAGE TYPE P = 28-Pin Plastic Dual In-Line Package (PD 028) J = 32-Pin Plastic Leaded Chip Carrier (PL 032) SPEED OPTION See Product Selector Guide and Valid Combinations DEVICE NUMBER/DESCRIPTION Am27X256 256 Kilobit (32 K x 8-Bit) CMOS ExpressROM Device Valid Combinations Valid Combinations AM27X256-55 PC, JC AM27X256-70 Valid Combinations list configurations planned to be supported in volume for this device. Consult the local AMD sales office to confirm availability of specific valid combinations and to check on newly released combinations. AM27X256-90 AM27X256-120 AM27X256-150 PC, JC, PI, JI AM27X256-200 AM27X256-255 VCC = 5.0 V ± 5% Am27X256 3 FUNCTIONAL DESCRIPTION Read Mode To obtain data at the device outputs, Chip Enable (CE#) and Output Enable (OE#) must be driven low. CE# controls the power to the device and is typically used to select the device. OE# enables the device to output data, independent of device selection. Addresses must be stable for at least t ACC –t OE. Refer to the Switching Waveforms section for the timing diagram. CE# should be decoded and used as the primary device-selecting function, while OE# be made a common connection to all devices in the array and connected to the READ line from the system control bus. This assures that all deselected memory devices are in their low-power standby mode and that the output pins are only active when data is desired from a particular memory device. System Applications Standby Mode The device enters the CMOS standby mode when CE# is at VCC ± 0.3 V. Maximum VCC current is reduced to 100 µA. The device enters the TTL-standby mode when CE# is at VIH. Maximum VCC current is reduced to 1.0 mA. When in either standby mode, the device places its outputs in a high-impedance state, independent of the OE# input. Output OR-Tieing To accommodate multiple memory connections, a two-line control function provides: ■ Low memory power dissipation, and ■ Assurance that output bus contention will not occur. During the switch between active and standby conditions, transient current peaks are produced on the rising and falling edges of Chip Enable. The magnitude of these transient current peaks is dependent on the output capacitance loading of the device. At a minimum, a 0.1 µF ceramic capacitor (high frequency, low inherent inductance) should be used on each device between VCC and VSS to minimize transient effects. In addition, to overcome the voltage drop caused by the inductive effects of the printed circuit board traces on ExpressROM device arrays, a 4.7 µF bulk electrolytic capacitor should be used between VCC and VSS for each eight devices. The location of the capacitor should be close to where the power supply is connected to the array. MODE SELECT TABLE Mode CE# OE# VPP Outputs Read VIL VIL X DOUT Output Disable X VIH X High Z Standby (TTL) VIH X X High Z VCC ± 0.3 V X X High Z Standby (CMOS) Note: X = Either VIH or VIL. 4 Am27X256 ABSOLUTE MAXIMUM RATINGS OPERATING RANGES Storage Temperature OTP Products. . . . . . . . . . . . . . . . . . –65°C to +125°C Ambient Temperature with Power Applied. . . . . . . . . . . . . . –55°C to +125°C Commercial (C) Devices Ambient Temperature (TA) . . . . . . . . . . .0°C to +70°C Industrial (I) Devices Voltage with Respect to VSS All pins except VCC . . . . . . . . . –0.6 V to VCC + 0.6 V Ambient Temperature (TA) . . . . . . . . .–40°C to +85°C VCC (Note 1). . . . . . . . . . . . . . . . . . . . . –0.6 V to 7.0 V VCC for ± 5% devices . . . . . . . . . . +4.75 V to +5.25 V VCC for ± 10% devices . . . . . . . . . +4.50 V to +5.50 V Note: 1. Minimum DC voltage on input or I/O pins –0.5 V. During voltage transitions, the input may overshoot VSS to –2.0 V for periods of up to 20 ns. Maximum DC voltage on input and I/O pins is VCC + 5 V. During voltage transitions, input and I/O pins may overshoot to VCC + 2.0 V for periods up to 20ns. Supply Read Voltages Operating ranges define those limits between which the functionality of the device is guaranteed. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure of the device to absolute maximum ratings for extended periods may affect device reliability. Am27X256 5 DC CHARACTERISTICS over operating range (unless otherwise specified) Parameter Symbol Parameter Description Test Conditions VOH Output HIGH Voltage IOH = –400 µA VOL Output LOW Voltage IOL = 2.1 mA VIH Input HIGH Voltage VIL Input LOW Voltage ILI Input Load Current ILO Min Max 2.4 Unit V 0.45 V 2.0 VCC + 0.5 V –0.5 +0.8 V VIN = 0 V to VCC 1.0 µA Output Leakage Current VOUT = 0 V to VCC 1.0 µA ICC1 VCC Active Current (Note 2) CE# = VIL, f = 10 MHz, IOUT = 0 mA 25 mA ICC2 VCC TTL Standby Current CE# = VIH 1.0 mA ICC3 VCC CMOS Standby Current CE# = VCC ± 0.3 V 100 µA Caution: The device must not be removed from (or inserted into) a socket when VCC or VPP is applied. Notes: 1. VCC must be applied simultaneously or before VPP, and removed simultaneously or after VPP.. 30 30 25 25 Supply Current in mA Supply Current in mA 2. ICC1 is tested with OE# = VIH to simulate open outputs. 3. Minimum DC Input Voltage is –0.5 V. During transitions, the inputs may overshoot to –2.0 V for periods less than 20 ns. Maximum DC Voltage on output pins is VCC + 0.5 V, which may overshoot to VCC + 2.0 V for periods less than 20 ns. 20 15 Figure 1. 6 2 3 4 5 6 7 Frequency in MHz 8 9 15 10 –75 –50 –55 0 25 50 75 100 125 150 Temperature in °C 10 1 20 10 12082F-5 12082F-6 Typical Supply Current vs. Frequency VCC = 5.5 V, T = 25°C Figure 2. Typical Supply Current vs. Temperature VCC = 5.5 V, f = 10 MHz Am27X256 TEST CONDITIONS Table 1. 5.0 V Test Condition 2.7 kΩ Device Under Test Test Specifications Output Load CL 30 Input Pulse Levels 12082F-7 Figure 3. 100 pF ≤ 20 Input Rise and Fall Times Note: Diodes are IN3064 or equivalents. Unit 1 TTL gate Output Load Capacitance, CL (including jig capacitance) 6.2 kΩ All others -55, -70 ns 0.0–3.0 0.45–2.4 V Input timing measurement reference levels 1.5 0.8, 2.0 V Output timing measurement reference levels 1.5 0.8, 2.0 V Test Setup SWITCHING TEST WAVEFORM 3V 2.4 V 2.0 V 2.0 V Test Points 1.5 V Test Points 1.5 V 0.8 V 0V 0.8 V 0.45 V Input Output Output Input Note: For CL = 30 pF. Note: For CL = 100 pF. 12082F-8 KEY TO SWITCHING WAVEFORMS WAVEFORM INPUTS OUTPUTS Steady Changing from H to L Changing from L to H Don’t Care, Any Change Permitted Changing, State Unknown Does Not Apply Center Line is High Impedance State (High Z) KS000010-PAL Am27X256 7 AC CHARACTERISTICS Parameter Symbols JEDEC Standard tAVQV tACC tELQV Am27X256 Description Test Setup -55 -70 -90 -120 -150 -200 -255 Unit Address to Output Delay CE#, Max OE# = VIL 55 70 90 120 150 200 250 ns tCE Chip Enable to Output Delay OE# = VIL Max 55 70 90 120 150 200 250 ns tGLQV tOE Output Enable to Output Delay CE# = VIL Max 35 40 40 50 50 50 50 ns tEHQZ tGHQZ tDF (Note 2) Chip Enable High or Output Enable Highto Output High Z, Whichever Occurs First Max 25 25 25 30 30 30 30 ns tAXQX tOH Output Hold Time from Addresses, CE# or OE#, Whichever Occurs First Min 0 0 0 0 0 0 0 ns Caution: Do not remove the device from (or insert it into) a socket or board that has VPP or VCC applied. Notes: 1. VCC must be applied simultaneously or before VPP, and removed simultaneously or after VPP. 2. This parameter is sampled and not 100% tested. 3. Switching characteristics are over operating range, unless otherwise specified. 4. See Figure 3 and Table 1 for test specifications. SWITCHING WAVEFORMS 2.4 Addresses 0.45 2.0 0.8 2.0 0.8 Addresses Valid CE# tCE OE# tDF (Note 2) tOE High Z Output tACC (Note 1) tOH High Z Valid Output 12082F-9 Notes: 1. OE# may be delayed up to tACC – tOE after the falling edge of the addresses without impact on tACC. 2. tDF is specified from OE# or CE#, whichever occurs first. PACKAGE CAPACITANCE Parameter Symbol CIN COUT PD 028 Parameter Description Test Conditions Typ Max Typ Max Unit Input Capacitance VIN = 0 6 10 8 12 pF Output Capacitance VOUT = 0 8 10 8 12 pF Notes: 1. This parameter is only sampled and not 100% tested. 2. TA = +25°C, f = 1 MHz. 8 PL 032 Am27X256 PHYSICAL DIMENSIONS PD 028—28-Pin Plastic Dual In-Line Package (measured in inches) 1.440 1.480 .600 .625 15 28 .530 .580 Pin 1 I.D. .008 .015 .630 .700 14 .045 .065 0° 10° .005 MIN .140 .225 16-038-SB-AG PD 028 DG75 7-13-95 ae SEATING PLANE .120 .160 .014 .022 .090 .110 .015 .060 PL 032—32-Pin Plastic Leaded Chip Carrier (measured in inches) .447 .453 .485 .495 .009 .015 .585 .595 .042 .056 .125 .140 Pin 1 I.D. .080 .095 .547 .553 SEATING PLANE .400 REF. .490 .530 .013 .021 .050 REF. .026 .032 TOP VIEW SIDE VIEW Am27X256 16-038FPO-5 PL 032 DA79 6-28-94 ae 9 REVISION SUMMARY FOR AM27X256 Revision F Global Changed formatting to match current data sheets. Trademarks Copyright © 1998 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are trademarks of Advanced Micro Devices, Inc. Flashrite is a trademark of Advanced Micro Devices, Inc. Product names used in this publication are for identification purposes only and may be trademarks of their respective companies. 10 Am27X256