TI1 DS90CF388VJDX/NOPB Dual pixel lvds display interface (ldi)-svga/qxga Datasheet

DS90C387, DS90CF388
www.ti.com
SNLS012H – MAY 2000 – REVISED APRIL 2013
DS90C387, DS90CF388 Dual Pixel LVDS Display Interface (LDI)-SVGA/QXGA
Check for Samples: DS90C387, DS90CF388
FEATURES
DESCRIPTION
•
The DS90C387/DS90CF388 transmitter/receiver pair
is designed to support dual pixel data transmission
between Host and Flat Panel Display up to QXGA
resolutions. The transmitter converts 48 bits (Dual
Pixel 24-bit color) of CMOS/TTL data into 8 LVDS
(Low Voltage Differential Signalling) data streams.
Control signals (VSYNC, HSYNC, DE and two userdefined signals) are sent during blanking intervals. At
a maximum dual pixel rate of 112MHz, LVDS data
line speed is 672Mbps, providing a total throughput of
5.38Gbps (672 Megabytes per second). Two other
modes are also supported. 24-bit color data (single
pixel) can be clocked into the transmitter at a
maximum rate of 170MHz. In this mode, the
transmitter provides single-to-dual pixel conversion,
and the output LVDS clock rate is 85MHz maximum.
The third mode provides inter-operability with FPDLink devices.
1
2
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Complies with OpenLDI Specification for
Digital Display Interfaces
32.5 to 112/170MHz Clock Support for
DS90C387, 40 to 112MHz Clock Support for
DS90CF388
Supports SVGA through QXGA Panel
Resolutions
Drives Long, Low Cost Cables
Up to 5.38Gbps Bandwidth
Pre-Emphasis Reduces Cable Loading Effects
DC Balance Data Transmission Provided by
Transmitter Reduces ISI Distortion
Cable Deskew of +/−1 LVDS Data Bit Time (up
to 80 MHz Clock Rate) of Pair-to-Pair Skew at
Receiver Inputs; Intra-Pair Skew Tolerance of
300ps
Dual Pixel Architecture Supports Interface to
GUI and Timing Controller; Optional Single
Pixel Transmitter Inputs Support Single Pixel
GUI Interface
Transmitter Rejects Cycle-to-Cycle Jitter
5V Tolerant on Data and Control Input Pins
Programmable Transmitter Data and Control
Strobe Select (Rising or Falling Edge Strobe)
Backward Compatible Configuration Select
with FPD-Link
Optional Second LVDS Clock for Backward
Compatibility w/ FPD-Link
Support for Two Additional User-Defined
Control Signals in DC Balanced Mode
Compatible with ANSI/TIA/EIA-644-1995 LVDS
Standard
The LDI chipset is improved over prior generations of
FPD-Link devices and offers higher bandwidth
support and longer cable drive with three areas of
enhancement. To increase bandwidth, the maximum
pixel clock rate is increased to 112 (170) MHz and 8
serialized LVDS outputs are provided. Cable drive is
enhanced with a user selectable pre-emphasis
feature that provides additional output current during
transitions to counteract cable loading effects. DC
balancing on a cycle-to-cycle basis, is also provided
to reduce ISI (Inter-Symbol Interference). With preemphasis and DC balancing, a low distortion eyepattern is provided at the receiver end of the cable. A
cable deskew capability has been added to deskew
long cables of pair-to-pair skew of up to +/−1 LVDS
data bit time (up to 80 MHz Clock Rate). These three
enhancements allow cables 5+ meters in length to be
driven. This chipset is an ideal means to solve EMI
and cable size problems for high-resolution flat panel
applications. It provides a reliable interface based on
LVDS technology that delivers the bandwidth needed
for high-resolution panels while maximizing bit times,
and keeping clock rates low to reduce EMI and
shielding requirements. For more details, please refer
to Applications Information.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2013, Texas Instruments Incorporated
DS90C387, DS90CF388
SNLS012H – MAY 2000 – REVISED APRIL 2013
www.ti.com
Transmitter Block Diagram
Receiver Block Diagram
CMOS/TTL OUTPUTS
8
A1
8
DESKEW
A3
A4
A5
A6
8
TTL OUTPUT LATCH
A2
DATA DE-SERIALIZER/DC BALANCE
A0
8
8
8
RED1
GRN1
BLU1
RED2
GRN2
BLU2
FPLINE (HSYNC)
FPFRAME (VSYNC)
A7
DRDY (Data Enable)
POWER DOWN
CLK
SHFCLKOUT
(40 to 112 MHz)
PLL
Generalized Block Diagram
DATA (LVDS)
CMOS/TTL INPUTS
BLU1
RED2
GRN2
BLU2
8
8
8
8
8
8
8
FPLINE (HSYNC)
(280 to 672 Mbit/s
On Each LVDS
Channel)
LVDS-TO-TTL PARALLEL
GRN1
CMOS/TTL OUTPUTS
8
TTL PARALLEL-TO-LVDS
RED1
8
8
8
8
GRN1
BLU1
RED2
GRN2
BLU2
FPLINE (HSYNC)
CLOCK (LVDS)
(40 to 112 MHz)
FPFRAME (VSYNC)
FPFRAME (VSYNC)
DRDY (Data Enable)
DRDY (Data Enable)
FPSHIFT IN
(TRANSMIT CLOCK IN)
(40 to 112 MHz)
PLL
FPSHIFT OUT
(40 to 112 MHz)
PLL
POWER DOWN
POWER DOWN
DS90C387VJD
2
RED1
Submit Documentation Feedback
DS90CF388VJD
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90C387 DS90CF388
DS90C387, DS90CF388
www.ti.com
SNLS012H – MAY 2000 – REVISED APRIL 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1) (2)
−0.3V to +4V
Supply Voltage (VCC)
−0.3V to +5.5V
CMOS/TTL Input Voltage
−0.3V to (VCC + 0.3V)
CMOS/TTL Output Voltage
LVDS Receiver Input Voltage
−0.3V to +3.6V
LVDS Driver Output Voltage
−0.3V to +3.6V
LVDS Output Short Circuit Duration
Continuous
Junction Temperature
+150°C
Storage Temperature
−65°C to +150°C
Lead Temperature (Soldering, 4 seconds)
+260°C
Maximum Package Power Dissipation Capacity at 25°C, 100 TQFP
Package
Package Derating
2.8W
DS90C387
18.2mW/°C above +25°C
DS90CF388
18.2mW/°C above +25°C
> 6 kV
EIAJ, 0Ω, 200pF
ESD Rating
> 300 V
HBM, 1.5kΩ, 100pF
DS90CF388
(2)
2.8W
DS90CF388
HBM, 1.5kΩ, 100pF
DS90C387
(1)
DS90C387
> 2 kV
EIAJ, 0Ω, 200pF
> 200 V
“Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be ensured. They are not meant to imply
that the device should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
Recommended Operating Conditions
Min
Nom
Max
Supply Voltage (VCC)
3.0
3.3
3.6
V
Operating Free Air Temperature (TA)
−10
+25
+70
°C
2.4
V
100
mVp-p
Receiver Input Range
0
Supply Noise Voltage (VCC)
Unit
Electrical Characteristics (1)
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
CMOS/TTL DC SPECIFICATIONS (Tx inputs, Rx outputs, control inputs and outputs)
VIH
High Level Input Voltage
2.0
5.0
V
VIL
Low Level Input Voltage
GND
0.8
V
VOH
High Level Output Voltage
IOH = −0.4 mA
2.7
2.9
IOH = −2 mA
2.7
2.85
VOL
Low Level Output Voltage
IOL = 2 mA
VCL
Input Clamp Voltage
ICL = −18 mA
IIN
Input Current
VIN = 0.4V, 2.5V or VCC
VIN = GND
IOS
(1)
Output Short Circuit Current
VOUT = 0V
−15
V
V
0.1
0.3
V
−0.79
−1.5
V
+1.8
+15
µA
−120
mA
0
µA
Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground
unless otherwise specified (except VOD and ΔVOD).
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90C387 DS90CF388
Submit Documentation Feedback
3
DS90C387, DS90CF388
SNLS012H – MAY 2000 – REVISED APRIL 2013
www.ti.com
Electrical Characteristics(1) (continued)
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
250
345
450
mV
35
mV
LVDS DRIVER DC SPECIFICATIONS
VOD
Differential Output Voltage
ΔVOD
Change in VOD between
Complimentary Output
States
RL = 100Ω
VOS
Offset Voltage
ΔVOS
Change in VOS between
Complimentary Output
States
IOS
Output Short Circuit Current
VOUT = 0V, RL = 100Ω
IOZ
Output TRI-STATE Current
PD = 0V, VOUT = 0V or VCC
1.125
1.25
1.375
V
35
mV
−3.5
−10
mA
±1
±10
µA
+100
mV
LVDS RECEIVER DC SPECIFICATIONS
VTH
Differential Input High
Threshold
VTL
Differential Input Low
Threshold
IIN
Input Current
VCM = +1.2V
−100
mV
VIN = +2.4V, VCC = 3.6V
±10
µA
VIN = 0V, VCC = 3.6V
±10
µA
TRANSMITTER SUPPLY CURRENT
ICCTW
ICCTG
ICCTZ
4
Transmitter Supply Current,
Worst Case
Transmitter Supply Current,
16 Grayscale
Transmitter Supply Current,
Power Down
Submit Documentation Feedback
RL = 100Ω, CL = 5 pF,
Worst Case Pattern
(Figure 1 and Figure 3),
DUAL=High (48-bit RGB),
BAL=High (enabled)
f = 32.5 MHz
91.4
140
mA
f = 65 MHz
106
160
mA
f = 85 MHz
135
183
mA
f = 112 MHz
155
210
mA
RL = 100Ω, CL = 5 pF,
16 Grayscale Pattern
(Figure 2 and Figure 3),
DUAL=High (48-bit RGB),
BAL=High (enabled)
f = 32.5 MHz
62.6
120
mA
f = 65 MHz
84.4
130
mA
f = 85 MHz
89.0
145
mA
f = 112 MHz
94.5
155
mA
4.8
50
µA
PD = Low
Driver Outputs in TRI-STATE under Powerdown
Mode
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90C387 DS90CF388
DS90C387, DS90CF388
www.ti.com
SNLS012H – MAY 2000 – REVISED APRIL 2013
Electrical Characteristics(1) (continued)
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
RECEIVER SUPPLY CURRENT
ICCRW
ICCRG
ICCRZ
Receiver Supply Current,
Worst Case
Receiver Support Current,
16 Grayscale
Receiver Supply Current,
Power Down
CL = 8 pF,
Worst Case Pattern
(Figure 1 and Figure 4),
DUAL (48-bit RGB),
BAL=High (enabled)
f = 40MHz
125
160
mA
f = 65 MHz
200
250
mA
f = 85 MHz
240
275
mA
f = 112 MHz
250
300
mA
CL = 8 pF,
16 Grayscale Pattern
(Figure 2 and Figure 4),
DUAL (48-bit RGB),
BAL=High (enabled)
f = 40MHz
60
95
mA
f = 65 MHz
95
125
mA
f = 85 MHz
115
150
mA
f = 112 MHz
150
270
mA
255
300
µA
PD = Low
Receiver Outputs stay low during Powerdown
mode
Recommended Transmitter Input Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
TCIT
Parameter
TxCLK IN Transition Time (Figure 5)
Min
Typ
Max
Unit
DUAL=Gnd or Vcc
1.0
2.0
3.0
ns
DUAL=1/2Vcc
1.0
1.5
1.7
ns
8.928
T
30.77
ns
TCIP
TxCLK IN Period (Figure 6)
DUAL=Gnd or Vcc
15.38
ns
TCIH
TxCLK in High Time (Figure 6)
0.35T
0.5T
0.65T
ns
TCIL
TxCLK in Low Time (Figure 6)
0.35T
0.5T
0.65T
ns
TXIT
TxIN Transition Time
6.0
ns
DUAL=1/2Vcc
5.88
1.5
Transmitter Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
LLHT
LHLT
TBIT
TPPOS
Typ
Max
Unit
LVDS Low-to-High Transition Time (Figure 3), PRE = 0.75V (disabled)
Parameter
0.14
0.7
ns
LVDS Low-to-High Transition Time (Figure 3), PRE = Vcc (max)
0.11
0.6
ns
LVDS High-to-Low Transition Time (Figure 3), PRE = 0.75V (disabled)
0.16
0.8
ns
LVDS High-to-Low Transition Time (Figure 3), PRE = Vcc (max)
0.11
0.7
ns
Transmitter Output Bit Width
Transmitter Pulse Positions - Normalized
Min
DUAL=Gnd or Vcc
1/7 TCIP
DUAL=1/2Vcc
2/7 TCIP
ns
ns
f = 33 to 70 MHz
−250
0
+250
ps
f = 70 to 112 MHz
−200
0
+200
ps
TCCS
TxOUT Channel to Channel Skew
TSTC
TxIN Setup to TxCLK IN (Figure 6)
2.7
ns
THTC
TxIN Hold to TxCLK IN (Figure 6)
0
ns
TJCC
Transmitter Jitter Cycle-to-cycle (Figure 14 and
Figure 15) , DUAL=Vcc (1)
TPLLS
(1)
100
ps
f = 112 MHz
85
100
ps
f = 85 MHz
60
75
ps
f = 65 MHz
70
80
ps
f = 56 MHz
100
120
ps
f = 32.5 MHz
75
110
ps
10
ms
Transmitter Phase Lock Loop Set (Figure 8)
The limits are based on bench characterization of the device's jitter response over the power supply voltage range. Output clock jitter is
measured with a cycle-to-cycle jitter of ±3ns applied to the input clock signal while data inputs are switching (see Figure 14 and
Figure 15). A jitter event of 3ns, represents worse case jump in the clock edge from most graphics VGA chips currently available. This
parameter is used when calculating system margin as described in AN-1059 (SNLA050).
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90C387 DS90CF388
Submit Documentation Feedback
5
DS90C387, DS90CF388
SNLS012H – MAY 2000 – REVISED APRIL 2013
www.ti.com
Transmitter Switching Characteristics (continued)
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
TPDD
Parameter
Min
Typ
Transmitter Powerdown Delay (Figure 10)
Max
Unit
100
ns
Receiver Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
CLHT
CHLT
Typ
Max
Unit
CMOS/TTL Low-to-High Transition Time (Figure 4), Rx data out
Parameter
1.52
2.0
ns
CMOS/TTL Low-to-High Transition Time (Figure 4), Rx clock out
0.5
1.0
ns
CMOS/TTL High-to-Low Transition Time (Figure 4), Rx data out
1.7
2.0
ns
CMOS/TTL High-to-Low Transition Time (Figure 4), Rx clock out
0.5
1.0
ns
T
25
ns
RCOP
RxCLK OUT Period (Figure 7)
RCOH
RxCLK OUT High Time (Figure 7) (1)
RCOL
RxCLK OUT Low Time (Figure 7)
8.928
(1)
RxOUT Setup to RxCLK OUT (Figure 7) (1)
RSRC
RHRC
Min
RxOUT Hold to RxCLK OUT (Figure 7)
(1)
f = 112 MHz
3.5
ns
f = 85 MHz
4.5
ns
f = 112 MHz
3.5
ns
f = 85 MHz
4.5
ns
f = 112 MHz
2.4
ns
f = 85 MHz
3.0
ns
f = 112 MHz
3.4
ns
f = 85 MHz
4.75
ns
RPLLS
Receiver Phase Lock Loop Set (Figure 9)
10
ms
RPDD
Receiver Powerdown Delay (Figure 11)
1
µs
(1)
The Minimum and Maximum Limits are based on statistical analysis of the device performance over voltage and temperature ranges.
This parameter is functionally tested on Automatic Test Equipment (ATE). ATE is limited to 85MHz. A sample of characterization parts
have been bench tested to verify functional performance.
Chipset RSKM Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified. (1)
for more details on this parameter and how to apply it.
Symbol
RSKM
RSKM
(1)
(2)
(3)
6
Parameter
Receiver Skew Margin without Deskew in non-DC Balance
Mode, (Figure 12), (3)
Receiver Skew Margin without Deskew in DC Balance Mode,
(Figure 12) (3)
Min
(2)
. See Applications Information
Typ
Max
Unit
f = 112 MHz
170
f = 100 MHz
170
240
ps
ps
f = 85MHz
300
350
ps
f = 66MHz
300
350
ps
f = 112 MHz
170
f = 100 MHz
170
200
ps
f = 85 MHz
250
300
ps
f = 66 MHz
250
300
ps
f = 50MHz
100
350
ps
f = 40MHz
94
530
ps
ps
The Minimum and Maximum Limits are based on statistical analysis of the device performance over voltage and temperature ranges.
This parameter is functionally tested on Automatic Test Equipment (ATE). ATE is limited to 85MHz. A sample of characterization parts
have been bench tested to verify functional performance.
Typical values for RSKM and RSKMD are applicable for fixed VCC and T A for the Transmitter and Receiver (both are assumed to be at
the same VCC and T A points).
Receiver Skew Margin (RSKM) is defined as the valid data sampling region at the receiver inputs. This margin takes into account
transmitter output pulse positions (min and max) and the receiver input setup and hold time (internal data sampling window - RSPOS).
This margin allows for LVDS interconnect skew, inter-symbol interference (both dependent on type/length of cable) and clock
jitter.RSKM ≥ cable skew (type, length) + source clock jitter (cycle to cycle, TJCC) + ISI (if any). See Applications Information for more
details.
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90C387 DS90CF388
DS90C387, DS90CF388
www.ti.com
SNLS012H – MAY 2000 – REVISED APRIL 2013
Chipset RSKM Characteristics (continued)
Over recommended operating supply and temperature ranges unless otherwise specified.(1) (2). See Applications Information
for more details on this parameter and how to apply it.
Symbol
Parameter
Min
RSKMD
Receiver Skew Margin with Deskew in DC Balance,
(Figure 13) (4)
f = 40 to 80 MHz 0.25TBIT
RDR
Receiver Deskew Range
f = 80 MHz
RDSS
Receiver Deskew Step Size
f = 80 MHz
(4)
Typ
Max
Unit
ps
±1
TBIT
0.3 TBIT
ns
Receiver Skew Margin with Deskew (RSKMD) is defined as the valid data sampling region at the receiver inputs. The DESKEW function
will constrain the receiver’s sampling strobes to the middle half of the LVDS bit and removes (adjusts for) fixed interconnect skew. This
margin (RSKMD) allows for inter-symbol interference (dependent on type/length of cable), Transmitter Pulse Position (TPPOS) variance,
and LVDS clock jitter (TJCC).RSKMD ≥ ISI + TPPOS(variance) + source clock jitter (cycle to cycle). See Applications Information for
more details.
AC Timing Diagrams
A.
The worst case test pattern produces a maximum toggling of digital circuits, LVDS I/O and CMOS/TTL I/O.
B.
Figure 1 and Figure 2 show a falling edge data strobe (TxCLK IN/RxCLK OUT).
Figure 1. “Worst Case” Test Pattern
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90C387 DS90CF388
Submit Documentation Feedback
7
DS90C387, DS90CF388
SNLS012H – MAY 2000 – REVISED APRIL 2013
www.ti.com
A.
The 16 grayscale test pattern tests device power consumption for a “typical” LCD display pattern. The test pattern
approximates signal switching needed to produce groups of 16 vertical stripes across the display.
B.
Figure 1 and Figure 2 show a falling edge data strobe (TxCLK IN/RxCLK OUT).
Figure 2. “16 Grayscale” Test Pattern
Figure 3. DS90C387 (Transmitter) LVDS Output Load and Transition Times
Figure 4. DS90CF388 (Receiver) CMOS/TTL Output Load and Transition Times
8
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90C387 DS90CF388
DS90C387, DS90CF388
www.ti.com
SNLS012H – MAY 2000 – REVISED APRIL 2013
Figure 5. DS90C387 (Transmitter) Input Clock Transition Time
Figure 6. DS90C387 (Transmitter) Setup/Hold and High/Low Times (Falling Edge Strobe)
Figure 7. DS90CF388 (Receiver) Setup/Hold and High/Low Times
Figure 8. DS90C387 (Transmitter) Phase Lock Loop Set Time
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90C387 DS90CF388
Submit Documentation Feedback
9
DS90C387, DS90CF388
SNLS012H – MAY 2000 – REVISED APRIL 2013
www.ti.com
Figure 9. DS90CF388 (Receiver) Phase Lock Loop Set Time
Figure 10. Transmitter Power Down Delay
Figure 11. Receiver Power Down Delay
10
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90C387 DS90CF388
DS90C387, DS90CF388
www.ti.com
SNLS012H – MAY 2000 – REVISED APRIL 2013
C — Setup and Hold Time (Internal data sampling window) defined by RSPOS (receiver input strobe position) min
and max
TPPOS — Transmitter output pulse position (min and max)
RSKM ≥ Cable Skew (type, length) + LVDS Source Clock Jitter (cycle to cycle) + ISI (Inter-symbol interference)
■ Cable Skew—typically 10 ps to 40 ps per foot, media dependent
■ TJCC — Cycle-to-cycle LVDS Output jitter (TJCC) is less than 100 ps (worse case estimate).
■ ISI is dependent on interconnect length; may be zero
See Applications Information for more details.
Figure 12. Receiver Skew Margin
C — Setup and Hold Time (Internal data sampling window) defined by Rspos (receiver input strobe position) min and
max
RSKMD ≥ TPPOSvariance (d) + TJCC (output jitter)(f) + ISI (m)
■ d = Tppos — Transmitter output pulse position (min and max)
■ f = TJCC — Cycle-to-cycle LVDS Output jitter (TJCC) is less than 100 ps (worse case estimate).
■ m = extra margin - assigned to ISI in long cable applications
See Applications Information for more details.
Figure 13. Receiver Skew Margin (RSKMD) with DESKEW
Figure 14. TJCC Test Setup - DS90C387
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90C387 DS90CF388
Submit Documentation Feedback
11
DS90C387, DS90CF388
SNLS012H – MAY 2000 – REVISED APRIL 2013
www.ti.com
Figure 15. Timing Diagram of the Input Cycle-to-Cycle Clock Jitter
12
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90C387 DS90CF388
DS90C387, DS90CF388
www.ti.com
SNLS012H – MAY 2000 – REVISED APRIL 2013
DS90C387 PIN DESCRIPTIONS — FPD LINK TRANSMITTER
Pin Name
I/O
No.
Description
Rn, Gn, Bn, DE,
HSYNC, VSYNC
I
51
TTL level input. This includes: 16 Red, 16 Green, 16 Blue, and 3 control lines HSYNC, VSYNC, DE
(Data Enable). (1)
AnP
O
8
Positive LVDS differential data output.
AnM
O
8
Negative LVDS differential data output.
CLKIN
I
1
TTL level clock input.
R_FB
I
1
Programmable data strobe select. Rising data strobe edge selected when input is high.
R_FDE
I
1
Programmable control (DE) strobe select. Tied high for data active when DE is high.
CLK1P
O
1
Positive LVDS differential clock output.
CLK1M
O
1
Negative LVDS differential clock output.
PD
I
1
TTL level input. Assertion (low input) tri-states the outputs, ensuring low current at power down.
PLLSEL
I
1
PLL range select. This pin must be tied to VCC for auto-range. NC or tied to Ground is reserved for
future use. Typical shift point is between 55 and 68 MHz. (1) (2)
BAL
I
1
Mode select for DC Balanced (new) or non-DC Balanced (backward compatible) interface. DC
Balance is active when input is high. NC or tied to Ground, the DC Balance function is disabled.
(1)
(1)
(1)
(1)
(3) (4)
PRE
I
1
Pre-emphasis level select. Pre-emphasis is active when input is tied to VCC through external pull-up
resistor. Resistor value determines pre-emphasis level (see Pre-Emphasis). For normal LVDS drive
level (No pre-emphasis) leave this pin open (do not tie to ground). (1)
DUAL
I
1
Three-mode select for dual pixel, single pixel, or single pixel input to dual pixel output operation.
Single pixel mode when input is low (only LVDS channels A0 thru A3 and CLK1 are active) for power
savings. Dual mode is active when input is high. Single in - dual out when input is at 1/2 Vcc. (1)
Figure 16
VCC
I
4
Power supply pins for TTL inputs and digital circuitry.
GND
I
5
Ground pins for TTL inputs and digital circuitry.
PLLVCC
I
2
Power supply pin for PLL circuitry.
PLLGND
I
3
Ground pins for PLL circuitry.
LVDSVCC
I
3
Power supply pin for LVDS outputs.
LVDSGND
I
4
Ground pins for LVDS outputs.
CLK2P/NC
O
1
Additional positive LVDS differential clock output. Identical to CLK1P. No connect if not used.
CLK2M/NC
O
1
Additional negative LVDS differential clock output. Identical to CLK1M. No connect if not used.
(1)
(2)
(3)
(4)
Inputs default to “low” when left open due to internal pull-down resistor.
The PLL range shift point is in the 55 - 68 MHz range, typically the shift will occur during the lock time.
DC Balancing is functionally tested on Automatic Test Equipment (ATE) at 85 MHz only. A sample of characterization units have been
bench tested at 112 MHz to verify full speed performance.
The DS90CF388 is designed to automatically detect the DC Balance or non-DC Balance transmitted data from the DS90C387 and
deserialize the LVDS data according to the defined bit mapping.
DS90CF388 PIN DESCRIPTIONS — FPD LINK RECEIVER
Pin Name
AnP
I/O
No.
I
8
Positive LVDS differential data inputs.
Description
AnM
I
8
Negative LVDS differential data inputs.
Rn, Gn, Bn, DE,
HSYNC, VSYNC
O
51
TTL level data outputs. This includes: 16 Red, 16 Green, 16 Blue, and 3 control lines— HSYNC (LP),
VSYNC (FLM), DE (Data Enable).
RxCLK INP
I
1
Positive LVDS differential clock input.
RxCLK INM
I
1
Negative LVDS differential clock input.
RxCLK OUT
O
1
TTL level clock output. The falling edge acts as data strobe.
R_FDE
I
1
Programmable control (DE) strobe select. Tied high for data active when DE is high.
PLLSEL
I
1
PLL range select. This pin must be tied to VCC for auto-range. NC or tied to Ground is reserved for
future use. Typical shift point is between 55 and 68 MHz. (2) (3)
(1)
(2)
(3)
(1)
Inputs default to “low” when left open due to internal pull-down resistor.
DC Balancing is functionally tested on Automatic Test Equipment (ATE) at 85 MHz only. A sample of characterization units have been
bench tested at 112 MHz to verify full speed performance.
The PLL range shift point is in the 55 - 68 MHz range, typically the shift will occur during the lock time.
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90C387 DS90CF388
Submit Documentation Feedback
13
DS90C387, DS90CF388
SNLS012H – MAY 2000 – REVISED APRIL 2013
www.ti.com
DS90CF388 PIN DESCRIPTIONS — FPD LINK RECEIVER (continued)
I/O
No.
Description
BAL
Pin Name
I
1
Mode select for DC Balanced (new) or non-DC Balanced (backward compatible) interface. BAL =
LOW for non-DC Balanced mode. BAL = HIGH for DC Balanced Mode (Auto-detect mode), with this
pin HIGH the received LVDS clock signal is used to determine if the interface is in new or backward
compatible mode. (1) (2) (4)
DESKEW
I
1
Deskew and oversampling “on/off” select. Deskew is active when input is high. Only supported in DC
Balance mode (BAL=High). To complete the deskew operation, a minimum of four clock cycles is
required during blanking time. (1)
PD
I
1
TTL level input. When asserted (low input) the receiver data outputs are low and clock output is high.
STOPCLK
O
1
Indicates receiver clock input signal is not present with a logic high. With a clock input present, a low
logic is indicated.
VCC
I
6
Power supply pins for TTL outputs and digital circuitry.
GND
I
8
Ground pins for TTL outputs and digital circuitry
PLLVCC
I
1
Power supply for PLL circuitry.
PLLGND
I
2
Ground pin for PLL circuitry.
LVDSVCC
I
2
Power supply pin for LVDS inputs.
LVDSGND
I
3
Ground pins for LVDS inputs.
CNTLE, CNTLF
O
2
TTL level data outputs. User-defined control signals - no connect when not used.
(4)
(1)
The DS90CF388 is designed to automatically detect the DC Balance or non-DC Balance transmitted data from the DS90C387 and
deserialize the LVDS data according to the defined bit mapping.
Recommend using R1=R2=10kΩ for single to dual mode
Figure 16. Resistor Network for “DUAL” pin input
LVDS Interface
Table 1. LVDS DATA BIT NAMING CONVENTION
X
Y
Z
Description
X=R
Red
X=G
Green
X=B
Blue
Y=1
Odd (First) Pixel
Y=2
Even (Second) Pixel
Z=0-7
LVDS bit number (not VGA controller LSB to MSB)
Table 2. SINGLE PIXEL PER CLOCK INPUT APPLICATION DATA MAPPING (DUAL=GND)
VGA - TFT Data Signals Color Bits
Transmitter input pin names
Receiver output pin names
24-bit
DS90C387
DS90CF388
R0
R16
R16
R1
R17
R17
R10
R10
LSB
R2
14
18-bit
R0
Submit Documentation Feedback
TFT Panel Data
Signals
18-bit
24-bit
R0
R1
R0
R2
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90C387 DS90CF388
DS90C387, DS90CF388
www.ti.com
SNLS012H – MAY 2000 – REVISED APRIL 2013
Table 2. SINGLE PIXEL PER CLOCK INPUT APPLICATION DATA MAPPING (DUAL=GND) (continued)
VGA - TFT Data Signals Color Bits
Transmitter input pin names
Receiver output pin names
TFT Panel Data
Signals
R3
R1
R11
R11
R1
R3
R4
R2
R12
R12
R2
R4
R5
R3
R13
R13
R3
R5
R6
R6
R4
R14
R14
R4
MSB
R7
R5
R15
R15
R5
LSB
G0
G16
G16
G1
R7
G0
G17
G17
G2
G0
G10
G10
G0
G2
G3
G1
G11
G11
G1
G3
G4
G2
G12
G12
G2
G4
G5
G3
G13
G13
G3
G5
G6
G4
G14
G14
G4
G6
MSB
G7
G5
G15
G15
G5
G7
LSB
B0
B16
B16
B1
B17
B17
MSB
G1
B0
B1
B2
B0
B10
B10
B0
B2
B3
B1
B11
B11
B1
B3
B4
B2
B12
B12
B2
B4
B5
B3
B13
B13
B3
B5
B6
B4
B14
B14
B4
B6
B7
B5
B15
B15
B5
B7
Table 3. DUAL PIXEL PER CLOCK INPUT APPLICATION DATA MAPPING (DUAL=VCC)
VGA - TFT Data Signals Color Bits
Transmitter input pin names
Receiver output pin names
48-bit
LSB
DS90C387
DS90CF388
RO0
36-bit
R16
R16
RO1
R17
R17
TFT Panel Data
Signals
36-bit
48-bit
RO0
RO1
RO2
RO0
R10
R10
RO0
RO2
RO3
RO1
R11
R11
RO1
RO3
RO4
RO2
R12
R12
RO2
RO4
RO5
RO3
R13
R13
RO3
RO5
RO6
RO6
RO4
R14
R14
RO4
MSB
RO7
RO5
R15
R15
RO5
LSB
GO0
G16
G16
GO1
RO7
GO0
G17
G17
GO2
GO0
G10
G10
GO0
GO1
GO2
GO3
GO1
G11
G11
GO1
GO3
GO4
GO2
G12
G12
GO2
GO4
GO5
GO3
G13
G13
GO3
GO5
GO6
GO4
G14
G14
GO4
GO6
MSB
GO7
GO5
G15
G15
GO5
GO7
LSB
BO0
B16
B16
BO1
B17
B17
BO0
BO1
BO2
BO0
B10
B10
BO0
BO2
BO3
BO1
B11
B11
BO1
BO3
BO4
BO2
B12
B12
BO2
BO4
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90C387 DS90CF388
Submit Documentation Feedback
15
DS90C387, DS90CF388
SNLS012H – MAY 2000 – REVISED APRIL 2013
www.ti.com
Table 3. DUAL PIXEL PER CLOCK INPUT APPLICATION DATA MAPPING (DUAL=VCC) (continued)
VGA - TFT Data Signals Color Bits
Transmitter input pin names
Receiver output pin names
TFT Panel Data
Signals
BO5
BO3
B13
B13
BO3
BO5
BO6
BO4
B14
B14
BO4
BO6
MSB
BO7
BO5
B15
B15
BO5
BO7
LSB
RE0
R26
R26
RE1
R27
R27
RE0
RE1
RE2
RE0
R20
R20
RE0
RE2
RE3
RE1
R21
R21
RE1
RE3
RE4
RE2
R22
R22
RE2
RE4
RE5
RE3
R23
R23
RE3
RE5
RE6
RE4
R24
R24
RE4
RE6
MSB
RE7
RE5
R25
R25
RE5
LSB
GE0
G26
G26
GE0
GE1
G27
G27
GE1
RE7
GE2
GE0
G20
G20
GE0
GE2
GE3
GE1
G21
G21
GE1
GE3
GE4
GE2
G22
G22
GE2
GE4
GE5
GE3
G23
G23
GE3
GE5
GE6
GE4
G24
G24
GE4
GE6
MSB
GE7
GE5
G25
G25
GE5
GE7
LSB
BE0
B26
B26
BE1
MSB
BE0
B27
B27
BE2
BE0
B20
B20
BE0
BE1
BE2
BE3
BE1
B21
B21
BE1
BE3
BE4
BE2
B22
B22
BE2
BE4
BE5
BE3
B23
B23
BE3
BE5
BE6
BE4
B24
B24
BE4
BE6
BE7
BE5
B25
B25
BE5
BE7
Table 4. SINGLE PIXEL PER CLOCK INPUT-TO-DUAL PIXEL PER CLOCK OUTPUT DATA MAPPING
(DUAL=1/2VCC)
VGA - TFT Data Signals Color Bits
Transmitter input pin names
Receiver output pin names
24-bit
LSB
16
18-bit
TFT Panel Data
Signals
DS90C387
DS90CF388
R0
R16
R16
36-bit
48-bit
RO0
R1
R17
R17
RO1
R2
R0
R10
R10
RO0
RO2
R3
R1
R11
R11
RO1
RO3
R4
R2
R12
R12
RO2
RO4
R5
R3
R13
R13
RO3
RO5
R6
R4
R14
R14
RO4
RO6
MSB
R7
R5
R15
R15
RO5
RO7
LSB
G0
G16
G16
G1
G17
G17
GO0
GO1
G2
G0
G10
G10
GO0
GO2
G3
G1
G11
G11
GO1
GO3
G4
G2
G12
G12
GO2
GO4
G5
G3
G13
G13
GO3
GO5
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90C387 DS90CF388
DS90C387, DS90CF388
www.ti.com
SNLS012H – MAY 2000 – REVISED APRIL 2013
Table 4. SINGLE PIXEL PER CLOCK INPUT-TO-DUAL PIXEL PER CLOCK OUTPUT DATA MAPPING
(DUAL=1/2VCC) (continued)
VGA - TFT Data Signals Color Bits
Transmitter input pin names
Receiver output pin names
G6
G4
G14
G14
GO4
GO6
MSB
G7
G5
G15
G15
GO5
GO7
LSB
B0
B16
B16
BO0
B1
B17
B17
BO1
MSB
TFT Panel Data
Signals
B2
B0
B10
B10
BO0
BO2
B3
B1
B11
B11
BO1
BO3
B4
B2
B12
B12
BO2
BO4
B5
B3
B13
B13
BO3
BO5
B6
B4
B14
B14
BO4
BO6
B7
B5
B15
B15
BO5
BO7
R16
R26
R17
R27
R10
R20
RE0
EO2
R11
R21
RE1
RE3
R12
R22
RE2
RE4
R13
R23
RE3
RE5
R14
R24
RE4
RE6
RE5
RE0
RE1
R15
R25
G16
G26
G17
G27
G10
G20
GE0
GE2
G11
G21
GE1
GE3
G12
G22
GE2
GE4
G13
G23
GE3
GE5
G14
G24
GE4
GE6
G15
G25
GE5
GE7
B16
B26
B17
B27
B10
B20
BE0
BE2
B11
B21
BE1
BE3
B12
B22
BE2
BE4
B13
B23
BE3
BE5
B14
B24
BE4
BE6
B15
B25
BE5
BE7
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90C387 DS90CF388
RE7
GE0
GE1
BE0
BE1
Submit Documentation Feedback
17
DS90C387, DS90CF388
SNLS012H – MAY 2000 – REVISED APRIL 2013
www.ti.com
NOTE: Redundant copies of certain signals are also sent. These signals are denoted with an * symbol. The DS90CF388
does not sample the bits show with an * symbol. Optional feature supported: Pre-emphasis. See Applications
Information for additional details.
Figure 17. TTL Data Inputs Mapped to LVDS Outputs
Non-DC Balanced Mode (Backward Compatible, BAL=Low)
18
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90C387 DS90CF388
DS90C387, DS90CF388
www.ti.com
SNLS012H – MAY 2000 – REVISED APRIL 2013
NOTE: The LVDS Clock signal is also DC Balanced in this mode. The rising edge location is fixed, but the location of the
falling edge will be in one of two locations as shown above. Optional features supported: Pre-emphasis, and Deskew.
Figure 18. 48 Parallel TTL Data Inputs Mapped to LVDS Outputs
DC Balanced Mode - Data Enabled, BAL=High
Figure 19. Control Signals Transmitted During Blanking
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90C387 DS90CF388
Submit Documentation Feedback
19
DS90C387, DS90CF388
SNLS012H – MAY 2000 – REVISED APRIL 2013
www.ti.com
NOTE: The control signal during blanking shown above is for R_FDE=High, when R_FDE=Low all the low/high patterns are
reversed.
Figure 20. Control Signals Transmitted During Blanking
20
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90C387 DS90CF388
DS90C387, DS90CF388
www.ti.com
SNLS012H – MAY 2000 – REVISED APRIL 2013
APPLICATIONS INFORMATION
HOW TO CONFIGURE THE DS90C387 AND DS90CF388 FOR MOST COMMON APPLICATION
1. To configure for single input pixel-to-dual pixel output application, the DS90C387 “DUAL” pin must be set to
1/2 Vcc=1.65V. This may be implemented using pull-up and pull-down resistors of 10kΩ each as shown in
Figure 16. A capacitor between “DUAL” pin and ground will help to stabilize the DC voltage level in a noisy
environment. In this configuration, the input signals (single pixel) are split into odd and even pixel (dual
pixels) starting with the odd (first) pixel outputs A0-to-A3 the next even (second) pixel outputs to A4-to-A7.
The splitting of the data signal also starts with DE (data enable) transitioning from logic low to high indicating
active data. The "R_FDE" pin must be set high in this case. This is supported in DC Balanced and non-DC
Balanced (BAL=low or high) data transmission. The number of clock cycles during blanking must be an
EVEN number. This configuration will allow the user to interface to an LDI receiver (DS90CF388) or if in the
non-DC Balanced mode (BAL=low) then two FPD-Link 'notebook' receivers (DS90CF384A). The DC Balance
feature is recommended for monitor applications which require >2meters of cable length. Notebook
applications should disable this feature to reduce the current consumption of the chipset. Note that only the
DS90C387/DS90CF388 support the DC Balance data transmission feature.
2. To configure for single pixel or dual pixel application using the DS90C387/DS90CF388, the “DUAL” pin must
be set to Vcc (dual) or Gnd (single). In dual mode, the transmitter-DS90C387 has two LVDS clock outputs
enabling an interface to two FPD-Link 'notebook' receivers (DS90CF384A or DS90CF386). In single mode,
outputs A4-to-A7 and CLK2 are disabled which reduces power dissipation. Both single and dual mode also
support the DC Balance data transmission feature, which should only be used for monitor application.
3. The DS90CF388 is able to support single or dual pixel interface up to 112MHz operating frequency. This
receiver may also be used to interface to a VGA controller with an integrated LVDS transmitter without DC
Balance data transmission. In this case, the receivers “BAL” pin must be tied low (DC Balance disabled).
NEW FEATURES DESCRIPTION
Pre-Emphasis
Adds extra current during LVDS logic transition to reduce the cable loading effects. Pre-emphasis strength is set
via a DC voltage level applied from min to max (0.75V to Vcc) at the “PRE” pin. A higher input voltage on the
”PRE” pin increases the magnitude of dynamic current during data transition. The “PRE” pin requires one pull-up
resistor (Rpre) to Vcc in order to set the DC level. There is an internal resistor network, which cause a voltage
drop. See Table 5 and Table 6 to set the voltage level.
Table 5. PRE-EMPHASIS DC VOLTAGE LEVEL WITH
(RPRE) (1)
(1)
Rpre
Resulting PRE
Voltage
Effects
1MΩ or NC
0.75V
Standard LVDS
50kΩ
1.0V
9kΩ
1.5V
3kΩ
2.0V
1kΩ
2.6V
100Ω
Vcc
50% pre-emphasis
100% pre-emphasis
This is based on testing with standard shield twisted pair cable. The
amount of pre-emphasis will vary depending on the type of cable,
length and operating frequency.
Table 6. PRE-EMPHASIS NEEDED PER CABLE
LENGTH
Frequency
PRE Voltage
Typical cable length
112MHz
1.0V
2 meters
112MHz
1.5V
5 meters
80MHz
1.0V
2 meters
80MHz
1.2V
7 meters
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90C387 DS90CF388
Submit Documentation Feedback
21
DS90C387, DS90CF388
SNLS012H – MAY 2000 – REVISED APRIL 2013
www.ti.com
Table 6. PRE-EMPHASIS NEEDED PER CABLE
LENGTH (continued)
Frequency
PRE Voltage
Typical cable length
65MHz
1.5V
10 meters
56MHz
1.0V
10 meters
DC Balance
In the Balanced operating modes, in addition to pixel and control information an additional bit is transmitted on
every LVDS data signal line during each cycle of active data as shown in Figure 18. This bit is the DC Balance
bit (DCBAL). The purpose of the DC Balance bit is to minimize the short- and long-term DC bias on the signal
lines. This is achieved by selectively sending the pixel data either unmodified or inverted.
The value of the DC Balance bit is calculated from the running word disparity and the data disparity of the current
word to be sent. The data disparity of the current word shall be calculated by subtracting the number of bits of
value 0 from the number of bits value 1 in the current word. Initially, the running word disparity may be any value
between +7 and −6. The running word disparity shall be calculated as a continuous sum of all the modified data
disparity values, where the unmodified data disparity value is the calculated data disparity minus 1 if the data is
sent unmodified and 1 plus the inverse of the calculated data disparity if the data is sent inverted. The value of
the running word disparity shall saturate at +7 and −6.
The value of the DC Balance bit (DCBAL) shall be 0 when the data is sent unmodified and 1 when the data is
sent inverted. To determine whether to send pixel data unmodified or inverted, the running word disparity and the
current data disparity are used. If the running word disparity is positive and the current data disparity is positive,
the pixel data shall be sent inverted. If the running word disparity is positive and the current data disparity is zero
or negative, the pixel data shall be sent unmodified. If the running word disparity is negative and the current data
disparity is positive, the pixel data shall be sent unmodified. If the running word disparity is negative and the
current data disparity is zero or negative, the pixel data shall be sent inverted. If the running word disparity is
zero, the pixel data shall be sent inverted.
Cable drive is enhanced with a user selectable pre-emphasis feature that provides additional output current
during transitions to counteract cable loading effects. DC balancing on a cycle-to-cycle basis, is also provided to
reduce ISI (Inter-Symbol Interference). With pre-emphasis and DC balancing, a low distortion eye-pattern is
provided at the receiver end of the cable. These enhancements allow cables 5 to 10+ meters in length to be
driven.
CONTROL SIGNAL SENT DURING BLANKING (DC BALANCE MODE)
The data enable control signal (DE) is used in the DC Balanced mode to distinguish between pixel data and
control information being sent. It must be continuously available to the device in order to correctly separate pixel
data from control information. For this reason, DE shall be sent on the clock signals, LVDS CLK1 and CLK2,
when operating in the DC Balanced mode. If the value of the control to be sent is 1 (active display), the value of
the control word sent on the clock signals shall be 1111000 or 1110000. If the value of the control to be sent is 0
(blanking time), the value of the control word sent on the clock signals shall be 1111100 or 1100000. This is true
when R_FDE=High. See Transmitter Pin Descriptions and Receiver Pin Descriptions.
The control information, such as HSYNC and VSYNC, is always sent unmodified. The value of the control word
to send is determined by the running word disparity and the value of the control to be sent. If the running word
disparity is positive and the value of the control to be sent is 0, the control word sent shall be 1110000. If the
running word disparity is zero or negative and the control word to be sent is 0, the control word sent shall be
1111000. If the running word disparity is positive and the value of the control to be sent is 1, the control word
sent shall be 1100000. If the running word disparity is zero or negative and the value of the control to be sent is
1, the control word sent shall be 1111100. The DC Balance bit shall be sent as 0 when sending control
information during blanking time. See Figure 19.
RGB outputs on the DS90CF388 are forced LOW during the blanking time.
Note that in the backward compatible mode (BAL=low) control and data is sent as regular LVDS data. See
Figure 17.
22
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90C387 DS90CF388
DS90C387, DS90CF388
www.ti.com
SNLS012H – MAY 2000 – REVISED APRIL 2013
SUPPORT OF CNTLE, CNTLF
The 387/388 will also support the transmission of one or two additional user-defined control signals in the 'dual
pixel' DC Balanced output mode which are active during blanking while VSYNC is low. The additional control
signals, referred to as CNTLE and CNTLF, should be multiplexed with data signals and provided to the
transmitter inputs. Inputs B26 - CNTLF and B27 - CNTLE are designated for this purpose. When operating in 'DC
Balanced' mode, controls (CNTLE, CNTLF) are transmitted on LVDS channels A4 and A5 during the blanking
interval when VSYNC is low. CNTLE and CNTLF are sampled ONE (1) clock cycle after VSYNC transitions from
a HIGH to a LOW state. CNTLE and CNTLF are sampled on each cycle until VSYNC transitions from a LOW to
a HIGH, and they are then latched until the next VSYNC LOW cycle. Refer to Figure 20 for details. These signals
may be active only during blanking while VSYNC is low. Control signal levels are latched and held in the last
valid state when VSYNC transitions from low to high. These control signals are available as TTL outputs on the
receiver. CNTLE and CNTLF outputs on the DS90CF388 should be left as a no connect (NC) when not used.
Deskew
The OpenLDI receiver (DS90CF388) is able to tolerate a minimum of 300ps skew between the signals arriving
on a single differential pair (intra-pair) and a minimum of ±1 LVDS data bit time skew between signals arriving on
dependent differential pair (pair-to-pair). This is supported in the DC Balance data transmission mode only. Each
data channel is deskewed independently and is tuned with a step size of 1/3 of a bit time over a range of +/−1
TBIT. The Deskew feature operates up to clock rates of 80 MHz only. When using the DESKEW feature, the
sampling strobe will remain within the middle third of the LVDS sub symbol.To complete the deskew operation, a
minimum of four clock cycles is required during blanking time. This allows the chipset to support reduced
blanking applications.
Backwards Compatible Mode with FPD-Link
The transmitter provides a second LVDS output clock. Both LVDS clocks will be identical in 'Dual pixel mode'.
This feature supports backward compatibility with the previous generation of devices - the second clock allows
the transmitter to interface to panels using a 'dual pixel' configuration of two 24-bit or 18-bit 'notebook' receivers.
Note that redundant copies of certain signals are also sent. These signals are denoted with an * symbol, and are
shown in Figure 17. The DS90CF388 does not sample the bits show with an * symbol. If interfaceing with FPDLink Receivers, these signals may be recovered if desired.
Pre-emphasis feature is available for use in both the DC Balanced and non-DC Balanced (backwards
compatible) modes.
Transmitter Features
The transmitter is designed to reject cycle-to-cycle jitter which may be seen at the transmitter input clock. Very
low cycle-to-cycle jitter is passed on to the transmitter outputs. Cycle-to-cycle jitter has been measured over
frequency to be less than 100 ps with input step function jitter applied. This should be subtracted from the
RSKM/RSKMD budget as shown and described in Figure 12 and Figure 13. This rejection capability significantly
reduces the impact of jitter at the TXinput clock pin, and improves the accuracy of data sampling in the receiver.
Transmitter output jitter is effected by PLLVCC noise and input clock jitter - minimize supply noise and use a low
jitter clock source to limit output jitter. Timing and control signals (VSYNC, HSYNC, DE and two user-defined
signals) are sent during blanking intervals to ensure correct reception of these critical signals.
The transmitter is offered with programmable edge data strobes for convenient interface with a variety of
graphics controllers. The transmitter can be programmed for rising edge strobe or falling edge strobe through a
dedicated pin. A rising edge transmitter will inter-operate with a falling edge receiver without any translation logic.
RSKM - Receiver Skew Margin
RSKM is a chipset parameter and is explained in AN-1059 (SNLA050) in detail. It is the difference between the
transmitter’s pulse position and the receiver’s strobe window. RSKM must be greater than the summation of:
Interconnect skew, LVDS Source Clock Jitter (TJCC), and ISI (if any). See Figure 12. Interconnect skew includes
PCB traces differences, connector skew and cable skew for a cable application. PCB trace and connector skew
can be compensated for in the design of the system. Cable skew is media type and length dependant.
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90C387 DS90CF388
Submit Documentation Feedback
23
DS90C387, DS90CF388
SNLS012H – MAY 2000 – REVISED APRIL 2013
www.ti.com
RSKMD - Receiver Skew Margin with DESKEW
RSKMD is a chipset parameter and is applicable when the DESKEW feature of the DS90CF388 is employed. It
is the difference between the receiver’s strobe window and the ideal pulse locations. The DESKEW feature
adjusts for skew between each data channel and the clock channel. This feature is supported up to 80 MHz clock
rate. RSKMD must be greater than the summation of: Transmitter’s Pulse Position variance, LVDS Source Clock
Jitter (TJCC), and ISI (if any). See Figure 12. With Deskew, RSKMD is ≥ 25% of TBIT. Deskew compensates for
interconnect skew which includes PCB traces differences, connector skew and cable skew (for a cable
application). PCB trace and connector skew can be compensated for in the design of the system. Note, cable
skew is media type and length dependant. Cable length may be limited by the RSKMD parameter prior to the
interconnect skew reaching 1 TBIT in length due to ISI effects.
POWER DOWN
Both transmitter and receiver provide a power down feature. When asserted current draw through the supply pins
is minimized and the PLLs are shut down. The transmitter outputs are in TRI-STATE when in power down mode.
The receiver outputs are forced to a active LOW state when in the power down mode. (See Transmitter Pin
Descriptions and Receiver Pin Descriptions). The PD pin should be driven HIGH to enable the device once VCC
is stable.
DS90C387A/DS90CF388A
The DS90C387/CF388 chipset is electrically similar to the DS90C387A/CF388A. The DS90C387A/CF388A is
recommended if support of longer cable drive is not required. DC Balance data transmission and cable deskew
features are disabled to minimize overall power dissipation. The devices will also directly inter-operate with
existing FPD-Link devices for backward compatibility.
Configuration Table
Table 7. TRANSMITTER / RECEIVER CONFIGURATION TABLE
Pin
R_FB (Tx only)
R_FDE (both Tx and Rx)
BAL (both Tx and Rx)
DUAL (Tx only)
24
Condition
Configuration
R_FB = VCC
Rising Edge Data Strobe
R_FB = GND
Falling Edge Data Strobe
R_FDE = VCC
Active data DE = High
R_FDE = GND
Active data DE = Low
BAL=VCC
DC Balanced enabled
BAL=Gnd
DC Balanced disabled (backward compatible to FPD-Link)
DUAL=VCC
48-bit color (dual pixel) support
DUAL=1/2VCC
Single-to-dual support
DUAL=Gnd
24-bit color (single pixel) support
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90C387 DS90CF388
DS90C387, DS90CF388
www.ti.com
SNLS012H – MAY 2000 – REVISED APRIL 2013
Pin Diagrams
Figure 21. Transmitter-DS90C387
See Package Number NEZ0100A
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90C387 DS90CF388
Submit Documentation Feedback
25
DS90C387, DS90CF388
SNLS012H – MAY 2000 – REVISED APRIL 2013
www.ti.com
Figure 22. Receiver-DS90CF388
See Package Number NEZ0100A
26
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90C387 DS90CF388
DS90C387, DS90CF388
www.ti.com
SNLS012H – MAY 2000 – REVISED APRIL 2013
REVISION HISTORY
Changes from Revision G (April 2013) to Revision H
•
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 26
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS90C387 DS90CF388
Submit Documentation Feedback
27
PACKAGE OPTION ADDENDUM
www.ti.com
13-Aug-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DS90C387VJD
NRND
TQFP
NEZ
100
90
TBD
Call TI
Call TI
-10 to 70
DS90C387VJD
>B
DS90C387VJD/NOPB
ACTIVE
TQFP
NEZ
100
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-10 to 70
DS90C387VJD
>B
DS90C387VJDX/NOPB
ACTIVE
TQFP
NEZ
100
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-10 to 70
DS90C387VJD
>B
DS90CF388VJD/NOPB
ACTIVE
TQFP
NEZ
100
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-10 to 70
DS90CF388VJD
>B
DS90CF388VJDX/NOPB
ACTIVE
TQFP
NEZ
100
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-10 to 70
DS90CF388VJD
>B
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
13-Aug-2015
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Oct-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DS90C387VJDX/NOPB
TQFP
NEZ
100
1000
330.0
32.4
18.0
18.0
1.6
24.0
32.0
Q2
DS90CF388VJDX/NOPB
TQFP
NEZ
100
1000
330.0
32.4
18.0
18.0
1.6
24.0
32.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Oct-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DS90C387VJDX/NOPB
TQFP
NEZ
100
1000
367.0
367.0
55.0
DS90CF388VJDX/NOPB
TQFP
NEZ
100
1000
367.0
367.0
55.0
Pack Materials-Page 2
MECHANICAL DATA
NEZ0100A
PFD0100A
TYPICAL
VJD100A (Rev C)
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated