DIODES B140HW_08

B140HW
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
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Features
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Mechanical Data
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Guard Ring Die Construction for Transient Protection
Low Leakage Current
Low Forward Voltage Drop
Lead Free By Design/RoHS Compliant (Note 3)
"Green Device" (Note 4)
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Case: SOD-123
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Finish ⎯ Matte Tin Finish annealed over Alloy 42
leadframe. Solderable per MIL-STD-202, Method 208
Polarity: Cathode Band
Marking Information: See Page 3
Ordering Information: See Page 3
Weight: 0.01 grams (approximate)
Top View
Maximum Ratings
@TA = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Forward Current (See Figure 1)
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
Repetitive Peak Reverse Current
tp = 2μs square wave, f = 1KHz
Non-Repetitive Peak Reverse Current
tp = 100μs square wave
Symbol
VRRM
VRWM
VR
VR(RMS)
IF(AV)
Value
Unit
40
V
28
1.0
V
A
IFSM
16
A
IRRM
0.5
A
IRSM
1.0
A
Symbol
Value
350
410
304
251
-65 to +125
Unit
Thermal Characteristics
Characteristic
Power Dissipation
Typical Thermal Resistance Junction to Ambient
(Note 2)
(Note 5)
(Note 2)
(Note 5)
PD
RθJA
Operating and Storage Temperature Range
Electrical Characteristics
Characteristic
Reverse Breakdown Voltage (Note 1)
TJ, TSTG
Symbol
V(BR)R
VF
Leakage Current (Note 1)
IR
1.
2.
3.
4.
5.
6.
°C/W
°C
@TA = 25°C unless otherwise specified
Forward Voltage
Notes:
mW
Min
40
⎯
⎯
⎯
⎯
⎯
Typ
⎯
0.52
0.48
Max
⎯
0.55
0.51
Unit
V
⎯
⎯
0.2
10
40
5
μA
μA
mA
V
Test Condition
IR = 40μA
IF = 1A, TJ = 25°C
IF = 1A, TJ = 100°C
VR = 5V, TJ = 25°C
VR = 40V, TJ = 25°C
VR = 40V, TA = 100°C
Short duration pulse test used to minimize self-heating effect.
Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
No purposefully added lead.
Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
Part mounted on polymide board with pad sizes 0.24" x 0.16".
Part mounting such that RθJA = 175°C/W.
B140HW
Document number: DS30670 Rev. 8 - 2
1 of 3
www.diodes.com
May 2008
© Diodes Incorporated
PD, POWER DISSIPATION (W)
IF, INSTANTANEOUS FORWARD CURRENT (A)
B140HW
Tj = 125ºC
T j = 100ºC
Tj = 75ºC
Tj = 25ºC
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics
1,000
CT, TOTAL CAPACITANCE (pF)
Tj = 125°C
T j = 100°C
Tj = 75°C
Tj = 25°C
100
10
0.1
10,000
1.4
IF(AV), AVERAGE FORWARD CURRENT (A)
1.0
10
100
VR, DC REVERSE VOLTAGE (V)
Fig. 4 Total Capacitance vs. Reverse Voltage
1.2
1,000
1.0
100
0.8
0.6
10
0.4
1
0.2
0
0
100
125
25
50
75
TA, AMBIENT TEMPERATURE (°C)
Fig. 5 Forward Current Derating Curve
B140HW
Document number: DS30670 Rev. 8 - 2
150
2 of 3
www.diodes.com
0.1
0
75
50
100
150
25
125
TJ, JUNCTION TEMPERATURE (°C)
Fig. 6 Typical Reverse Current vs. Junction Temperature
May 2008
© Diodes Incorporated
B140HW
Ordering Information
(Note 7)
Part Number
B140HW-7
Notes:
Case
SOD-123
Packaging
3000/Tape & Reel
7. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
Date Code Key
Year
Code
Month
Code
2005
S
Jan
1
2006
T
Feb
2
Mar
3
LO = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: S = 2005)
M = Month (ex: 9 = September)
YM
LO
2007
U
2008
V
Apr
4
May
5
Jun
6
2009
W
Jul
7
2010
X
Aug
8
Sep
9
2011
Y
Oct
O
2012
Z
Nov
N
Dec
D
Package Outline Dimensions
C
H
A
B
K
M
L
SOD-123
Dim
Min
Max
A
0.55 Typ
B
1.40
1.70
C
3.55
3.85
H
2.55
2.85
J
0.00
0.10
K
1.00
1.35
L
0.25
0.40
M
0.10
0.15
0
8°
α
All Dimensions in mm
Suggested Pad Layout
C
Dimensions Value (in mm)
Z
4.9
G
2.5
X
0.7
Y
1.2
C
3.7
X
Y
G
Z
IMPORTANT NOTICE
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product
described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall
assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website,
harmless against all damages.
LIFE SUPPORT
Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written
approval of the President of Diodes Incorporated.
B140HW
Document number: DS30670 Rev. 8 - 2
3 of 3
www.diodes.com
May 2008
© Diodes Incorporated