PulseCore ASM3P2779AG-08TT Low power peak emi reducing solution Datasheet

ASM3P2779A
November 2006
rev 3.2
Low Power Peak EMI Reducing Solution
Features
•
The ASM3P2779A uses the most efficient and optimized
modulation profile approved by the FCC and is
Generates an EMI optimized clock signal at the
implemented by using a proprietary all digital method.
output.
•
Integrated loop filter components.
•
Operates with a 3.3 / 2.5V Supply.
•
Operating current less than 4mA.
•
Low power CMOS design.
•
Input frequency range: 13MHz to 30MHz for 2.5V.
The ASM3P2779A modulates the output of a single PLL
in order to “spread” the bandwidth of a synthesized clock,
and more importantly, decreases the peak amplitudes of
its harmonics. This results in significantly lower system
EMI compared to the typical narrow band signal produced
: 13MHz to 30MHz for 3.3V.
•
by oscillators and most frequency generators. Lowering
Generates a 1X low EMI spread spectrum clock of
EMI by increasing a signal’s bandwidth is called ‘spread
the input frequency.
•
spectrum clock generation’.
Frequency deviation: ±1% (Typ) @16MHz Input
Frequency.
•
Applications
Available in 6-pin TSOT-23, 8-pin SOIC and 8-pin
TSSOP packages.
The ASM3P2779A is targeted towards all portable
devices with very low power requirements like MP3
Product Description
players and digital still cameras.
The ASM3P2779A is a versatile spread spectrum
range of clock frequencies. The ASM3P2779A reduces
Key Specifications
Description
electromagnetic interference (EMI) at the clock source,
Supply voltages
VDD = 3.3V / 2.5V
allowing system wide reduction of EMI of
Cycle-to-Cycle Jitter
200pS (Max)
dependent signals. The ASM3P2779A allows significant
Output Duty Cycle
45/55%
system cost savings by reducing the number of circuit
Modulation Rate Equation
FIN/640
board layers ferrite beads, shielding that are traditionally
Frequency Deviation
±1% (Typ) @ 16MHz
frequency modulator designed specifically for a wide
all clock
Specification
required to pass EMI regulations.
Block Diagram
VDD
PD
PLL
Modulation
XIN/CLKIN
XOUT
Crystal
Oscillator
Frequency
Divider
Feedback
Divider
Phase
Detector
Loop
Filter
VCO
Output
Divider
VSS
PulseCore Semiconductor Corporation
1715 S. Bascom Ave Suite 200, Campbell, CA 95008 • Tel: 408-879-9077 • Fax: 408-879-9018
www.pulsecoresemi.com
Notice: The information in this document is subject to change without notice.
ModOUT
ASM3P2779A
November 2006
rev 3.2
Pin Configuration (6-pin TSOT- 23 Package)
PD 1
XOUT 2
ASM3P2779A
XIN / CLKIN 3
6
VSS
5
ModOUT
4
VDD
Pin Description
Pin#
1
Pin Name
Type
PD
Description
I
Power-down control pin. Pull low to enable power-down mode. Connect to VDD if not
used.
2
XOUT
O
Crystal connection. If using an external reference, this pin must be left unconnected.
3
XIN / CLKIN
I
Crystal connection or external reference frequency input. This pin has dual functions. It
can be connected either to an external crystal or an external reference clock.
4
VDD
P
Power supply for the entire chip.
5
ModOUT
O
Spread spectrum clock output.
6
VSS
P
Ground connection.
Pin Configuration (8-pin SOIC and TSSOP Packages)
XIN / CLKIN 1
8
VDD
7
NC
PD 3
6
ModOUT
NC 4
5
VSS
XOUT 2
ASM3P2779A
Pin Description
Pin#
Pin Name
Type
Description
1
XIN/CLKIN
I
Crystal connection or external reference frequency input. This pin has dual functions. It
can be connected either to an external crystal or an external reference clock.
2
XOUT
O
Crystal connection. If using an external reference, this pin must be left unconnected.
I
Power-down control pin. Pull low to enable power-down mode. Connect to VDD if not
used.
3
PD
4
NC
-
No connect.
5
VSS
P
Ground connection.
6
ModOUT
O
Spread spectrum clock output.
7
NC
-
No connect.
8
VDD
P
Power supply for the entire chip.
Low Power Peak EMI Reducing Solution
Notice: The information in this document is subject to change without notice.
2 of 12
ASM3P2779A
November 2006
rev 3.2
Modulation Profile
Specifications
Description
Frequency Range
Specification
For 2.5V Supply
For 3.3V Supply
13MHz < CLKIN < 30MHz
13MHz < CLKIN < 30MHz
Modulation Equation
FIN/640
Frequency Deviation
±1% (Typ) @ 16MHz
Absolute Maximum Ratings
Symbol
VDD, VIN
Parameter
Rating
Unit
Voltage on any pin with respect to Ground
-0.5 to +4.6
V
Storage temperature
-65 to +125
°C
TA
Operating temperature
-40 to +85
°C
Ts
Max. Soldering Temperature (10 sec)
260
°C
TJ
Junction Temperature
150
°C
2
KV
TSTG
TDV
Static Discharge Voltage
(As per JEDEC STD22- A114-B)
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect
device reliability.
Low Power Peak EMI Reducing Solution
Notice: The information in this document is subject to change without notice.
3 of 12
ASM3P2779A
November 2006
rev 3.2
DC Electrical Characteristics for 2.5V Supply
(Test condition: All parameters are measured at room temperature (+25°C) unless otherwise stated)
Symbol
Min
Typ
Max
Unit
VIL
Input low voltage
VSS - 0.3
-
0.8
V
VIH
Input high voltage
2.0
-
VDD + 0.3
V
IIL
Input low current
-
-
-35
µA
IIH
Parameter
Input high current
-
-
35
µA
IXOL
XOUT output low current (@0.5V, VDD=2.5V)
-
3
-
mA
IXOH
XOUT output high current (@1.8V, VDD=2.5V)
-
3
-
mA
VOL
Output low voltage (VDD = 2.5 V, IOL = 8mA)
-
-
0.6
V
VOH
Output high voltage (VDD = 2.5 V, IOH = 8mA)
1.8
-
-
V
IDD
Static supply current*
-
-
2.0
uA
ICC
Dynamic supply current (2.5V, 16MHz and no load)
-
3.0
-
mA
2.375
2.5
2.625
V
Power-up time (first locked cycle after power-up)**
-
-
5
mS
Output impedance
-
50
-
Ω
VDD
Operating Voltage
tON
ZOUT
* XIN /CLKIN pin and PD pin are pulled low
** VDD and XIN/CLKIN input are stable, PD pin is made high from low.
AC Electrical Characteristics for 2.5V Supply
Symbol
CLKIN
ModOUT
fd
Parameter
Min
Typ
Max
Unit
Input frequency
13
-
30
MHz
Output frequency
13
-
30
MHz
-
± 1.15
± 0.6
-
%
Frequency Deviation
Input Frequency = 13MHz
Input Frequency = 30MHz
tLH*
Output rise time (measured from 0.7V to 1.7V)
0.7
1.4
1.8
nS
tHL*
Output fall time (measured from 1.7V to 0.7V)
0.4
0.9
1.1
nS
tJC
Jitter (cycle to cycle)
-
-
200
pS
tD
Output duty cycle
45
50
55
%
* tLH and tHL are measured into a capacitive load of 15pF
Low Power Peak EMI Reducing Solution
Notice: The information in this document is subject to change without notice.
4 of 12
ASM3P2779A
November 2006
rev 3.2
DC Electrical Characteristics for 3.3V Supply
(Test condition: All parameters are measured at room temperature (+ 25°C) unless otherwise stated)
Symbol
Min
Typ
Max
Unit
VIL
Input low voltage
Parameter
VSS - 0.3
-
0.8
V
VIH
Input high voltage
2.0
-
VDD + 0.3
V
IIL
Input low current
-
-
-35
µA
IIH
Input high current
-
-
35
µA
IXOL
XOUT output low current (@0.4V, VDD=3.3V)
-
3
-
mA
IXOH
XOUT output high current (@2.5V, VDD=3.3V)
-
3
-
mA
VOL
Output low voltage (VDD = 3.3 V, IOL = 8mA)
-
-
0.4
V
VOH
Output high voltage (VDD = 3.3 V, IOH = 8mA)
2.5
-
-
V
IDD
Static supply current*
-
-
2.0
uA
ICC
Dynamic supply current (3.3V, 16MHz and no load)
VDD
tON
ZOUT
-
3.5
-
mA
2.7
3.3
3.6
V
Power-up time (first locked cycle after power-up)**
-
-
5
mS
Output impedance
-
45
-
Ω
Operating Voltage
* XIN /CLKIN pin and PD pin are pulled low
** VDD and XIN/CLKIN input are stable, PD pin is made high from low.
AC Electrical Characteristics for 3.3V Supply
Symbol
CLKIN
ModOUT
fd
Parameter
Input frequency
Output frequency
Frequency Deviation
Input Frequency = 13MHz
Input Frequency = 30MHz
Min
Typ
Max
Unit
13
-
30
MHz
13
v
30
MHz
-
±1.15
± 0.6
-
%
tLH*
Output rise time (measured from 0.8 to 2.0V)
0.5
1.1
1.3
nS
tHL *
Output fall time (measured at 2.0V to 0.8V)
0.3
0.8
0.9
nS
-
-
200
pS
45
50
55
%
tJC
Jitter (cycle to cycle)
tD
Output duty cycle
*tLH and tHL are measured into a capacitive load of 15pF
Low Power Peak EMI Reducing Solution
Notice: The information in this document is subject to change without notice.
5 of 12
ASM3P2779A
November 2006
rev 3.2
Typical Crystal Oscillator Circuit
Crystal
R1 = 510Ω
C1 = 27 pF
C2 = 27 pF
Typical Crystal Specifications
Fundamental AT cut parallel resonant crystal
Nominal frequency
14.31818MHz
Frequency tolerance
± 50 ppm or better at 25°C
Operating temperature range
-25°C to +85°C
Storage temperature
-40°C to +85°C
Load capacitance
18pF
Shunt capacitance
7pF maximum
ESR
25Ω
Low Power Peak EMI Reducing Solution
Notice: The information in this document is subject to change without notice.
6 of 12
ASM3P2779A
November 2006
rev 3.2
Package Information
6-pin TSOT-23 Package
Dimensions
Symbol
Inches
Min
A
Max
Millimeters
Min
Max
0.04
1.00
A1
0.00
0.004
0.00
0.10
A2
0.033
0.036
0.84
0.90
b
0.012
0.02
0.30
0.50
H
0.005 BSC
0.127 BSC
D
0.114 BSC
2.90 BSC
B
0.06 BSC
1.60 BSC
e
0.0374 BSC
0.950 BSC
C
0.11 BSC
2.80 BSC
L
0.0118
0.02
0.30
0.50
θ
0°
4°
0°
4°
Low Power Peak EMI Reducing Solution
Notice: The information in this document is subject to change without notice.
7 of 12
ASM3P2779A
November 2006
rev 3.2
8-Pin SOIC Package
H
E
D
A2
A
C
A1
D
θ
e
L
B
Dimensions
Symbol
Inches
Millimeters
Min
Max
Min
Max
A1
0.004
0.010
0.10
0.25
A
0.053
0.069
1.35
1.75
A2
0.049
0.059
1.25
1.50
B
0.012
0.020
0.31
0.51
C
0.007
0.010
0.18
0.25
D
0.193 BSC
4.90 BSC
E
0.154 BSC
3.91 BSC
e
0.050 BSC
1.27 BSC
H
0.236 BSC
6.00 BSC
L
0.016
0.050
0.41
1.27
θ
0°
8°
0°
8°
Low Power Peak EMI Reducing Solution
Notice: The information in this document is subject to change without notice.
8 of 12
ASM3P2779A
November 2006
rev 3.2
8-Pin TSSOP Package
H
E
D
A2
A
C
θ
e
A1
L
B
Dimensions
Symbol
Inches
Min
Millimeters
Max
A
Min
Max
0.043
1.10
A1
0.002
0.006
0.05
0.15
A2
0.033
0.037
0.85
0.95
B
0.008
0.012
0.19
0.30
c
0.004
0.008
0.09
0.20
D
0.114
0.122
2.90
3.10
E
0.169
0.177
4.30
4.50
e
0.026 BSC
0.65 BSC
H
0.252 BSC
6.40 BSC
L
0.020
0.028
0.50
0.70
θ
0°
8°
0°
8°
Low Power Peak EMI Reducing Solution
Notice: The information in this document is subject to change without notice.
9 of 12
ASM3P2779A
November 2006
rev 3.2
Ordering Information
Part Number
Marking
Package Type
Temperature
ASM3P2779AF-06OR
A4LL
6-Pin TSOT-23, TAPE & REEL, Pb Free
Commercial
ASM3P2779AF-08TT
3P2779AF
8-Pin TSSOP, TUBE, Pb Free
Commercial
ASM3P2779AF-08TR
3P2779AF
8-Pin TSSOP, TAPE & REEL, Pb Free
Commercial
ASM3P2779AF-08ST
3P2779AF
8-Pin SOIC, TUBE, Pb Free
Commercial
ASM3P2779AF-08SR
3P2779AF
8-Pin SOIC, TAPE & REEL, Pb Free
Commercial
ASM3P2779AG-06OR
A3LL
6-Pin TSOT-23, TAPE & REEL, Green
Commercial
ASM3P2779AG-08TT
3P2779AG
8-Pin TSSOP, TUBE, Green
Commercial
ASM3P2779AG-08TR
3P2779AG
8-Pin TSSOP, TAPE & REEL, Green
Commercial
ASM3P2779AG-08ST
3P2779AG
8-Pin SOIC, TUBE, Green
Commercial
ASM3P2779AG-08SR
3P2779AG
8-Pin SOIC, TAPE & REEL, Green
Commercial
ASM3I2779AF-06OR
A5LL
ASM3I2779AF-08TT
6-Pin TSOT-23, TAPE & REEL, Pb Free
Industrial
3I2779AF
8-Pin TSSOP, TUBE, Pb Free
Industrial
ASM3I2779AF-08TR
3I2779AF
8-Pin TSSOP, TAPE & REEL, Pb Free
Industrial
ASM3I2779AF-08ST
3I2779AF
8-Pin SOIC, TUBE, Pb Free
Industrial
ASM3I2779AF-08SR
3I2779AF
8-Pin SOIC, TAPE & REEL, Pb Free
Industrial
ASM3I2779AG-06OR
A6LL
6-Pin TSOT-23, TAPE & REEL, Green
Industrial
ASM3I2779AG-08TT
3I2779AG
8-Pin TSSOP, TUBE, Green
Industrial
ASM3I2779AG-08TR
3I2779AG
8-Pin TSSOP, TAPE & REEL, Green
Industrial
ASM3I2779AG-08ST
3I2779AG
8-Pin SOIC, TUBE, Green
Industrial
ASM3I2779AG-08SR
3I2779AG
8-Pin SOIC, TAPE & REEL, Green
Industrial
Low Power Peak EMI Reducing Solution
Notice: The information in this document is subject to change without notice.
10 of 12
ASM3P2779A
November 2006
rev 3.2
Device Ordering Information
A S M 3 P 2 7 7 9 A F - 0 8 T R
R = Tape & Reel, T = Tube or Tray
O = TSOT23
S = SOIC
T = TSSOP
A = SSOP
V = TVSOP
B = BGA
Q = QFN
U = MSOP
E = TQFP
L = LQFP
U = MSOP
P = PDIP
D = QSOP
X = SC-70
J=TSOT26
DEVICE PIN COUNT
F = LEAD FREE AND RoHS COMPLIANT PART
G = GREEN PACKAGE, LEAD FREE, and RoHS
PART NUMBER
X= Automotive
I= Industrial
P or n/c = Commercial
(-40C to +125C) (-40C to +85C)
(0C to +70C)
1 = Reserved
2 = Non PLL based
3 = EMI Reduction
4 = DDR support products
5 = STD Zero Delay Buffer
6 = Power Management
7 = Power Management
8 = Power Management
9 = Hi Performance
0 = Reserved
PulseCore Semiconductor Mixed Signal Product
Licensed under U.S Patent Nos 5,488,627 and 5,631,921
Low Power Peak EMI Reducing Solution
Notice: The information in this document is subject to change without notice.
11 of 12
ASM3P2779A
November 2006
rev 3.2
PulseCore Semiconductor Corporation
1715 S. Bascom Ave Suite 200
Campbell, CA 95008
Tel: 408-879-9077
Fax: 408-879-9018
www.pulsecoresemi.com
Copyright © PulseCore Semiconductor
All Rights Reserved
Part Number: ASM3P2779A
Document Version: 3.2
Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003
© Copyright 2006 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or
registered trademarks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their
respective companies. PulseCore reserves the right to make changes to this document and its products at any time without
notice. PulseCore assumes no responsibility for any errors that may appear in this document. The data contained herein
represents PulseCore’s best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct
this data at any time, without notice. If the product described herein is under development, significant changes to these
specifications are possible. The information in this product data sheet is intended to be general descriptive information for
potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or
customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product
described herein, and disclaims any express or implied warranties related to the sale and/or use of PulseCore products
including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual
property rights, except as express agreed to in PulseCore’s Terms and Conditions of Sale (which are available from
PulseCore). All sales of PulseCore products are made exclusively according to PulseCore’s Terms and Conditions of Sale.
The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights,
trademarks, or any other intellectual property rights of PulseCore or third parties. PulseCore does not authorize its products
for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result
in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems implies that the
manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use.
Low Power Peak EMI Reducing Solution
Notice: The information in this document is subject to change without notice.
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