1 of 3 Creation Date : May 15, 2017 (GMT) Multilayer Ceramic Chip Capacitors C2012JB1E335M085AC TDK item description C2012JB1E335MT**** Applications Commercial Grade Feature General General (Up to 50V) Series C2012 [EIA 0805] Status Production Size Length(L) 2.00mm ±0.20mm Width(W) 1.25mm ±0.20mm Thickness(T) 0.85mm ±0.15mm Terminal Width(B) 0.20mm Min. Terminal Spacing(G) 0.50mm Min. 1.00mm to 1.30mm(Flow Soldering) Recommended Land Pattern (PA) 0.90mm to 1.20mm(Reflow Soldering) 1.00mm to 1.20mm(Flow Soldering) Recommended Land Pattern (PB) 0.70mm to 0.90mm(Reflow Soldering) 0.80mm to 1.10mm(Flow Soldering) Recommended Land Pattern (PC) 0.90mm to 1.20mm(Reflow Soldering) Electrical Characteristics Capacitance 3.3μF ±20% Rated Voltage 25VDC Temperature Characteristic JB(±10%) Dissipation Factor (Max.) 7.5% Insulation Resistance (Min.) 30MΩ Other Soldering Method Wave (Flow) Reflow AEC-Q200 No Packing Punched (Paper)Taping [180mm Reel] Package Quantity 4000pcs ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 2 of 3 Creation Date : May 15, 2017 (GMT) Multilayer Ceramic Chip Capacitors C2012JB1E335M085AC Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.) Impedance C2012JB1E335M085AC ESR C2012JB1E335M085AC Capacitance C2012JB1E335M085AC C2012JB1E335M085AC Temperature Characteristic C2012JB1E335M085AC(No Bias) DC Bias Characteristic C2012JB1E335M085AC(DC Bias = 12.5V ) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Ripple Temperature Rising C2012JB1E335M085AC(100kHz) C2012JB1E335M085AC(500kHz) C2012JB1E335M085AC(1MHz) Multilayer Ceramic Chip Capacitors C2012JB1E335M085AC Associated Images Land Pattern (Terminal Connection) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 3 of 3 Creation Date : May 15, 2017 (GMT)